Part for substrate processing apparatus and substrate processing system

Abstract

[Task] Improve the management of components for substrate processing devices. [Solution] A component for a substrate processing device is provided, the component having a marker formed on the surface and / or interior of the component, wherein the marker is configured to read two-dimensional code information by means of a groove formed on the component by processing and / or two or more colors.

Description

Technology Field

[0001] The present disclosure relates to a component for a substrate processing device and a substrate processing system. Background Technology

[0002] Parts can be managed by attaching tapes marked with their serial numbers to the parts. For example, parts management at the manufacturing site of a substrate processing device is performed by manually entering and recording the serial numbers marked on the tape attached to the parts, and by verifying which parts are installed in the substrate processing device. Prior art literature

[0003] Patent Document 1: Japanese Patent Publication No. Heisei 4-146649 The problem to be solved

[0004] The present disclosure provides a technology that can improve the management of components for a substrate processing device. means of solving the problem

[0005] According to one aspect of the present disclosure, a component for a substrate processing device is provided, the component having a marker formed on the surface and / or inside of the component, wherein the marker is configured to be readable with respect to two-dimensional code information by means of a groove formed in the component by processing and / or two or more colors. Effects of the invention

[0006] According to one aspect, the management of components for substrate processing devices can be improved. Brief explanation of the drawing

[0007] FIG. 1 is a drawing showing an example of a marker engraved on a part according to an embodiment. FIG. 2 is a drawing showing the material and engraved state of a part according to an embodiment. FIG. 3 is a drawing showing a substrate processing system according to an embodiment. FIG. 4 is a cross-sectional schematic diagram showing a substrate processing apparatus according to an embodiment. FIG. 5 is a drawing showing an example of a parts management system according to an embodiment. FIG. 6 is a drawing showing an example of information regarding a part included in two-dimensional code information according to an embodiment. FIG. 7 is a diagram showing an example of available information set for each user according to an embodiment. Specific details for implementing the invention

[0008] Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant descriptions may be omitted.

[0009] [Part Engraving]

[0010] First, the engraving of a marker on a part according to an embodiment will be explained using FIG. 1. FIG. 1 is a drawing showing an example of a marker engraved on a part according to an embodiment. The part of FIG. 1 is an edge ring (25) placed in a substrate processing device and is an example of a part for a substrate processing device.

[0011] A marker (25c) is formed on the surface of the edge ring (25). The marker (25c) is an imprint processed on the surface of a part and has a two-dimensional code that visualizes information about the edge ring (25) through a groove (25a1) formed in the edge ring (25). The code formed on the marker (25c) may be a two-dimensional code such as a QR (Quick Response) code, a Data Matrix, or a barcode, or it may be a three-dimensional code. In an embodiment, two-dimensional code information can be obtained from the marker (25c).

[0012] The marker (25c) is inserted into the edge ring (25) by, for example, directly processing the edge ring (25) with a laser, and is not a seal-type marker attached to the edge ring (25) or drawn directly on the edge ring (25). Because of this, even if the surface of the edge ring (25) is consumed as a process (such as etching the substrate) is repeatedly performed in a substrate processing device, the marker (25c) can be prevented from being lost by creating a groove of a predetermined depth. As a result, the two-dimensional code information inserted into the marker (25c) can be read by a reader, and the two-dimensional code information can be managed as an integral with the edge ring (25). Reading of the two-dimensional code information is possible with a portable type reader or with a reader mounted on the device.

[0013] Additionally, in the case of a seal-type marker attached to the edge ring (25) or a marker drawn directly on the edge ring (25), the marker (25c) may peel off or be lost when the edge ring (25) is worn out. As a result, the substrate processing device may become contaminated, which may have an adverse effect on the process.

[0014] However, in the embodiment, the edge ring (25) is directly processed to create a groove (25a1) in the edge ring (25) itself, thereby forming a marker (25c). The component used in the substrate processing device is composed of a material that does not adversely affect the process performed in the substrate processing device. Therefore, even if the marker (25c) is consumed together with the edge ring (25), it does not adversely affect the process. From the above, by imprinting the marker (25c) on the component for the substrate processing device according to the embodiment, adverse effects on the process can be avoided, and the efficiency of component management and the improvement of management precision can be achieved.

[0015] The two-dimensional code information possessed by the marker (25c) can be read by the contrast of light generated when light irradiated onto the marker (25c) from a reader is reflected by the groove (25a1) of the marker (25c). In the example of FIG. 1, the position of the marker (25c) is the upper surface of the edge ring (25), but it is not limited thereto. For example, it is preferable that the marker (25c) be a surface (e.g., a side) that is not exposed to plasma when the edge ring (25) is placed within the substrate processing device. This allows for the suppression of the marker (25c) consumption. However, the placement location of the marker (25c) is not limited thereto.

[0016] [Engraving]

[0017] Next, the material of the part and the engraving method will be explained with reference to FIG. 2. FIG. 2 is a drawing showing the material of the part (P) and the engraved state according to an embodiment. In FIG. 2, a portion of the area (Pa) of the area indicated by the marker (25c) in FIG. 1 is simplified and shown.

[0018] The marker (25c) is imprinted on the part (P) by laser thermal processing of the part (P). FIG. 2 (a) shows the state of a portion of the area (Pa) of the marker (25c) imprinted on the part (P) when the part (P) is quartz. The marker (25c) is formed by a groove (Pa1) formed in the part (P) by laser processing.

[0019] When the part (P) is quartz, a laser is directed at the quartz to apply heat to the engraving area including the region (Pa), causing it to melt and create irregularities, thereby engraving a marker (25c) onto the part (P). As a result, the amount of light reflected differs between the melted and smoothed groove (Pa1) and the sand-polished glass part (Pb), creating light contrast.

[0020] As a result, when light output from the reader reaches the marker (25c), the reader reads two-dimensional code information from the contrast between the light incident on the groove (Pa1) formed on the surface of the part (P) and the light incident on the part (Pb) of the surface, from the marker (25c) formed on the part (P). By doing so, information regarding the part (P), such as the part number, serial number, and manufacturing date of the part (P), which is included in the two-dimensional code information, can be obtained.

[0021] FIG. 2(b) shows the state of a portion of the area (Pa) of the marker (25c) imprinted on the part (P) when the part (P) is ceramic. The marker (25c) is composed of a groove (Pa1) formed on the part (P) by laser processing, the color of the part (Pa2) discolored by laser processing, and the color of the part (P) before discoloration.

[0022] When the part (P) is ceramic, a laser is applied to the ceramic to heat and melt the area (Pa), creating irregularities, thereby imprinting a marker (25c) on the part (P). As a result, the amount of light reflected differs between the area of ​​the groove (Pa1) that has been melted and smoothed and the other areas, creating light contrast. Additionally, the heated area (Pa) changes color. Since the area other than the heated area (Pa) retains the color of the ceramic before discoloration, color contrast is created between the color of the discolored part (Pa2) and the other areas.

[0023] As a result, when light output from the reader reaches the marker (25c), the reader reads the contrast between the light incident on the groove (Pa1) formed on the surface of the part (P) and the light incident on other surface parts from the marker (25c) formed on the part (P). At the same time, the reader reads the contrast between the color of the discolored part (Pa2) and the color of other parts from the marker (25c) formed on the part (P). Then, the reader reads two-dimensional code information from the read light contrast and color contrast. By doing so, information regarding the part (P), such as the part number, serial number, and manufacturing date of the part (P), which is included in the two-dimensional code information, can be obtained.

[0024] Figure 2(c) shows the condition of a portion of the area (Pa) of the marker (25c) imprinted on the part (P) when the part (P) is aluminum, stainless steel (SUS), aluminum with an anodized surface, or silicon. The marker (25c) is composed of a groove (Pa1) formed in the part (P) by laser processing and irregularities on the surface of the groove (Pa1).

[0025] When the part (P) is made of aluminum, stainless steel, an anodized surface, or silicon, a laser is irradiated onto the part (P) to finely cut the surface, thereby creating irregularities on the surface of the formed groove (Pa1) to engrave a marker (25c) on the part (P). Since the size of the irregularities on the surface of the groove (Pa1) is finer than the irregularities when the part (P) is made of quartz or ceramic, diffuse reflection of light occurs, and the part of the groove (Pa1) appears white due to the diffuse reflection of light.

[0026] As a result, when light output from the reader reaches the marker (25c), the reader reads the light contrast based on the amount of reflected light from the marker (25c) formed on the part (P) due to the irregularities of the groove (Pa1) formed on the surface of the part (P). Additionally, it reads the color contrast between the white part of the groove (Pa1) and the other part due to diffuse reflection of light. The reader obtains two-dimensional code information based on the read light contrast and / or color contrast. By doing so, information regarding the part (P), such as the part number, serial number, and manufacturing date of the part (P), which is included in the two-dimensional code information, can be obtained.

[0027] Figure 2(d) shows the condition of a portion of the area (Pa) of the marker (25c) imprinted on the part (P) when the part (P) is aluminum or stainless steel. The marker (25c) is composed of the color of the oxide film formed on the part (P) by laser processing and the color of the part (P) before discoloration.

[0028] When a part (P) is made of aluminum or stainless steel, when a laser is irradiated onto the part (P), the focus is shifted to transfer heat such that the part (P) does not melt. As a result, heat is applied without cutting the part (P), causing an oxide film (Pa3) to form on the surface of the part (P), and this oxide film (Pa3) appears black. Consequently, a contrast is created between the black color of the region (Pa) where the oxide film (Pa3) is formed and the color of the aluminum or stainless steel in the other regions.

[0029] As a result, when light emitted from the reader hits the marker (25c), the reader reads the color contrast between the black area (Pa) where the oxide film (Pa3) is formed and the other parts. Then, the reader obtains two-dimensional code information based on the read color contrast. By doing so, information regarding the part (P), such as the part number, serial number, and manufacturing date of the part (P), which is included in the two-dimensional code information, can be obtained.

[0030] However, if the part (P) shown in (d) of FIG. 2 is aluminum or stainless steel, there is a possibility that the imprinted portion including the region (Pa) may swell due to thermal expansion in order to transfer heat to the metal to develop color. In this case, there is a possibility that the two-dimensional code information may be transferred to the swollen convex portion. In that case, it is possible to imprint the code with only the white portion of the region (Pa) without creating a black portion in the region (Pa).

[0031] In the case of any material shown in FIG. 2, the part (P) is directly processed to engrave the marker (25c) on the part (P). By doing so, adverse effects on processes such as etching caused by the marker (25c) can be avoided. Additionally, in the case of a part (P) that is consumed by plasma, such as an edge ring (25), a groove (Pa1) of a certain depth is formed in the part (P), thereby allowing the marker (25c) to be processed on the part (P) so that it is resistant to consumption even if the marker (25c) is exposed to plasma. Furthermore, if the part (P) is prone to consumption, it is preferable to form the marker (25c) on the side or other surface of the part (P) in a location that is difficult to expose to plasma, and in a location where a reader can read the marker (25c).

[0032] In addition, although the marker (25c) is engraved on the surface of the part (P) in the above description, it is not limited thereto, and the marker (25c) may, for example, form a groove (hollow space) inside the part (P). When the marker (25c) is formed inside the part (P), the marker (25c) is recognized by the color contrast caused by the hollow space inside the part (P). However, if the part (P) is transparent, it may also be recognized by the light contrast.

[0033] In this way, a marker (25c) engraved on a part (P) according to the embodiment has two-dimensional code information that can be read by a reader inserted therein. Additionally, the marker (25c) has a function capable of correcting errors in the two-dimensional code information. The size and amount of information of the two-dimensional code information are determined by three factors: cell size (size per dot), number of cells (number of dots constituting the two-dimensional code), and error correction level (data recovery power).

[0034] For example, the larger the cell size, the larger the size of each dot, making it easier to read the information. Also, the larger the number of cells, the greater the number of dots constituting the code, resulting in a larger amount of information. Furthermore, the higher the error correction level, the larger the code size becomes, reducing the amount of information.

[0035] However, the higher the error correction level, the higher the data recovery capability. Therefore, even if part of the marker (25c) is damaged or dirty due to the consumption of the part (P), information regarding the part (P) included in the two-dimensional code information can be obtained through error correction. From the above, the marker (25c) is configured to enable error correction of the two-dimensional code information.

[0036] By the above engraving method, a component (P) for a substrate processing device is processed and a marker (25c) is directly engraved on the component (P), so that the marker (25c) is formed as part of the component (P). Accordingly, even if the component (P) for the substrate processing device is consumed, the process is not adversely affected by the marker (25c).

[0037] Additionally, the marker (25c) is configured to be readable of two-dimensional code information by means of a groove formed in the part (P) by descent and / or two or more types of colors. By doing so, information regarding the part (P) included in the two-dimensional code information can be obtained by reading the marker (25c) with a reader. Additionally, the marker (25c) has a function for correcting errors in the two-dimensional code information, so that even if a part of the marker (25c) is worn down due to wear of the part (P), the two-dimensional code information can be restored using the error correction function.

[0038] In addition, when the 2D code marker (25c) according to the embodiment is engraved, the required engraving range can be reduced to about 1 / 13 compared to the case where the serial number of the part is engraved directly on the part. This makes it easier to process the marker (25c) in a position that is not exposed to the plasma of the part (P). Also, since the 2D code information inserted in the marker (25c) can be acquired using a reader, information regarding the part (P) cannot be acquired visually without using a reader. This allows for the protection of information regarding the part (P). Furthermore, by acquiring and recording the 2D code information inserted in the marker (25c) using a reader, it can contribute to shortening the recording time and reducing recording errors.

[0039] [Substrate Processing System and Substrate Processing Device]

[0040] A substrate processing system having a substrate processing device having a component with a marker engraved thereon as described above and a return chamber for returning a substrate to the substrate processing device will be described with reference to FIG. 3. Additionally, a substrate processing device will be described with reference to FIG. 4. FIG. 3 is a drawing showing a substrate processing system (1) according to an embodiment. FIG. 4 is a cross-sectional schematic diagram showing a substrate processing device (11) according to an embodiment. FIG. 3 and FIG. 4 are embodiments equipped with a reader, but it is also possible to use a portable type reader without mounting it on the substrate processing system and the substrate processing device.

[0041] The substrate processing system (1) has processing rooms (111 to 114), a vacuum transfer room (120), a load lock room (131, 132), an air transfer room (140), load ports (151 to 153), gate valves (161 to 168), and a computer (81). The vacuum transfer room (120) and the air transfer room (140) are examples of transfer rooms. The processing rooms (111 to 114) are examples of processing rooms of a substrate processing device.

[0042] The processing chambers (111 to 114) have stages (111a to 114a) for placing wafers (W) and are connected to the vacuum transport chamber (120) through gate valves (161 to 164). The processing chambers (111 to 114) are depressurized to a predetermined vacuum atmosphere, and a desired processing is performed on the wafer (W) inside.

[0043] The vacuum transfer chamber (120) is depressurized to a predetermined vacuum atmosphere. A transfer mechanism (121) is provided in the vacuum transfer chamber (120), and the wafer (W) is transferred between the processing chambers (111 to 114) and the load lock chambers (131, 132) by the transfer mechanism (121).

[0044] The load lock chamber (131, 132) has a stage (131a, 132a) for placing a wafer (W), is connected to a vacuum transport chamber (120) through a gate valve (165, 166), and is connected to an air transport chamber (140) through a gate valve (167, 168). The load lock chamber (131, 132) has the function of switching between an air atmosphere and a vacuum atmosphere.

[0045] The inside of the air return room (140) is made into an air atmosphere, and a return mechanism (141) is provided. A wafer (W) is returned between the carrier (C) of the load lock room (131, 132) and the load port (151 to 153) by the return mechanism (141).

[0046] The computer (81) controls the entire substrate processing system (1). For example, the computer (81) performs the operation of the processing chambers (111 to 114), the operation of the return mechanism (121, 141), the opening and closing of the gate valves (161 to 168), and the switching of the vacuum atmosphere or atmospheric atmosphere within the load lock chambers (131, 132). The computer (81) is an example of a control unit that controls the substrate processing system (1).

[0047] In FIG. 3, the reader (R) is positioned in the vacuum transfer chamber (120), but is not limited thereto and may be positioned at any location in the transfer path through which the substrate (W) is transferred to the processing chambers (111 to 114) of the substrate processing device via the vacuum transfer chamber (120) and the atmospheric transfer chamber (140). For example, the reader (R) may be positioned in the processing chambers (111 to 114), the load lock chambers (131, 132), the atmospheric transfer chamber (140), the load ports (151 to 153), and the gate valves (161 to 168). Additionally, the reader (R) may not be limited to one but may be positioned in multiple locations. As described above, it is also possible to use a portable type reader without mounting it on the substrate processing system and the substrate processing device.

[0048] The reader (R) reads two-dimensional code information from a marker imprinted on a part (P) placed in a processing room (111 to 114), a part (P) being returned, or a part (P) placed in another room. The reader (R) transmits the read two-dimensional code information to a computer (81). The computer (81) obtains the part number, serial number, manufacturing date, etc. of the part (P) from the received two-dimensional code information.

[0049] For example, when a marker (25c) is engraved on the edge ring (25), the edge ring (25) is returned along a path that returns the substrate (W). In this case, when the edge ring (25) is returned, the marker (25c) can be read by a reader (R) to obtain two-dimensional code information. By doing so, the parts of the exchanged edge ring (25) can be easily managed. In addition, by reading the marker (25c) by the reader (R), it is possible to accurately manage whether the parts placed in the substrate processing device are the company's own products or third-party products.

[0050] (Substrate processing device)

[0051] Next, the configuration of the substrate processing device (11) will be described with reference to FIG. 4. The substrate processing device (11) has a chamber (10) having an internal space (10s), thereby forming processing chambers (111 to 114) as shown in FIG. 3, for example. The chamber (10) has a chamber body (12) that is approximately cylindrical in shape. A passage (12p) is formed in the side wall of the chamber body (12). A substrate (W) passes through the passage (12p) when being transported between the internal space (10s) and the outside of the chamber (10). The passage (12p) is openable and closable by a gate valve (12g). The gate valve (12g) is provided along the side wall of the chamber body (12). The passage (12p) is a passage through which the substrate (W) or edge ring (25) is transported, and a reader (R) is arranged therein. The leader (R) may be placed in the gate valve (12g).

[0052] A support member (13) is provided on the bottom portion of the chamber body (12). The support member (13) has a roughly cylindrical shape and is formed of an insulating material. On the support member (13), an edge ring (25) (also called a focus ring) and a placement plate (14) are provided to surround the substrate. The edge ring (25) has a roughly cylindrical shape and may be formed of silicon or the like. A marker (25c) is engraved on the upper surface of the edge ring (25). However, the position of the marker (25c) is not limited to the upper surface of the edge ring (25) as long as it is a position that can be read by a reader (R) or a reader other than the substrate processing device (11), but may be on the side or back surface of the edge ring (25), or may be formed inside the edge ring (25).

[0053] The substrate processing device (11) is provided with a placement platform (14) in an internal space (10s). The placement platform (14) supports a substrate (W). The placement platform (14) has an electrostatic chuck (20), a lower electrode (18), and an electrode plate (16). The electrode plate (16) and the lower electrode (18) are formed of a conductor, such as aluminum, and have a roughly disc shape.

[0054] The electrostatic chuck (20) is provided on the lower electrode (18). The electrode of the electrostatic chuck (20) is connected to a DC power source. When voltage from the DC power source is applied to the electrode, the substrate (W) is held to the electrostatic chuck (20) by electrostatic attraction. The electrostatic chuck (20) supports the substrate (W) and the edge ring (25). A marker (14c) is engraved on the side of the placement table (14). However, the position of the marker (14c) is not limited to the side of the placement table (14) as long as it is a position that can be read by a reader other than the reader (R) or the substrate processing device (11), but may be on the upper surface of the placement table (14) or formed inside the placement table (14).

[0055] An upper electrode (30) is provided above the placement plate (14). The upper electrode (30) is supported on the upper part of the chamber body (12) through an insulating member (32). The upper electrode (30) may include a ceiling plate (34) and a support (36). The ceiling plate (34) may be formed of a low-resistance conductor or semiconductor with low Joule heat. A plurality of gas discharge holes (34a) are formed in the ceiling plate (34). The plurality of gas discharge holes (34a) penetrate the ceiling plate (34) in the direction of the plate thickness.

[0056] A marker (34c) is engraved on the lower surface of the ceiling plate (34). However, the position of the marker (34c) is not limited to the lower surface of the ceiling plate (34) as long as it is a position that can be read by a reader other than the reader (R) or the substrate processing device (11), but may be on the side of the ceiling plate (34) or formed inside the ceiling plate (34). Hereinafter, a reader other than the reader (R) or the substrate processing device (11) is also referred to as "reader (R), etc."

[0057] The support body (36) detachably supports the ceiling plate (34). The support body (36) is formed from a conductive material called aluminum. A gas diffusion chamber (36a) is provided inside the support body (36). A plurality of gas holes (36b) are formed in the support body (36). The plurality of gas holes (36b) extend downward from the gas diffusion chamber (36a). The plurality of gas holes (36b) are each connected to a plurality of gas discharge holes (34a). A gas inlet port (36c) is formed in the support body (36). The gas inlet port (36c) is connected to the gas diffusion chamber (36a). A gas supply pipe (38) is connected to the gas inlet port (36c), and a gas source (40) is connected to the gas supply pipe (38). Gas from the gas source (40) passes through the gas supply pipe (38), passes through a plurality of gas holes (36b) through the gas diffusion chamber (36a) from the gas inlet port (36c), and is introduced from the gas discharge port (34a).

[0058] In the substrate processing device (11), a shield (46) is detachably provided along the inner wall surface of the chamber body (12). The shield (46) is also provided on the outer circumference of the support member (13). The shield (46) prevents reaction products, such as etching byproducts, from adhering to the chamber body (12).

[0059] A baffle plate (48) is provided between the support member (13) and the side wall of the chamber body (12). The baffle plate (48) is formed by forming a corrosion-resistant film on the surface of a member, for example, made of aluminum. A plurality of through holes are formed in the baffle plate (48). An exhaust port (12e) is provided below the baffle plate (48) and also at the bottom of the chamber body (12). An exhaust device (50) is connected to the exhaust port (12e) through an exhaust pipe (52).

[0060] The substrate processing device (11) is equipped with a high-frequency power supply (62) that applies high-frequency (RF) power. The high-frequency power supply (62) is connected to an electrode plate (16) through a matching device (66) and is configured to generate high-frequency (RF) power to generate plasma from gas within the chamber (10). The frequency of the high-frequency RF is, for example, a frequency within the range of 27 MHz to 100 MHz.

[0061] The substrate processing device (11) may further be equipped with a computer (80). The computer (80) is an example of a control unit that controls each part of the substrate processing device (11). By executing a control program and controlling each part of the substrate processing device (11) according to recipe data, the computer (80) enables various processes to be executed in the substrate processing device (11).

[0062] In the substrate processing device (11) of this configuration, a ceiling plate (34) with a marker engraved thereon, an edge ring (25), and a placement plate (14) are given as examples of parts for the substrate processing device (11), but are not limited thereto. For example, other examples of parts for the substrate processing device (11) may include a baffle plate (48), a shield (46), etc., and a marker may be engraved on these members.

[0063] [Parts Management System]

[0064] Next, an example of a component management system in which a computer (80) controlling a substrate processing device (11) and a computer (81) controlling a substrate processing system (1) are connected will be described with reference to FIG. 5. FIG. 5 is a drawing showing an example of a component management system according to an embodiment.

[0065] There are components (P) placed in the substrate processing device (11) and components (P) placed in the substrate processing system (1) that have markers (34c, 14c, 25c, etc.) imprinted on them. A reader (R), etc. reads the two-dimensional code information of the marker imprinted on the component (P) and transmits it to a computer (80) that controls the substrate processing device (11) or a computer (81) that controls the substrate processing system (1).

[0066] Computers (80) and (81) record information regarding a component (P) included in two-dimensional code information on a recording medium. FIG. 6 is a drawing showing an example of information regarding a component (P) included in two-dimensional code information according to an embodiment.

[0067] Computers (80) and (81) record information regarding a part (P), such as part number “ER11,” part name “Edge Ring,” serial number “123456,” and manufacturing date “20190101,” on a recording medium. Additionally, they record the installation time “20200315 / 15:38” and removal time “20210915 / 12:21” on the recording medium. Each piece of information, particularly the part number, serial number, and manufacturing date, is necessarily inserted into the marker. By doing so, computers (80) and (81) can identify the part (P) by obtaining the part number, serial number, and manufacturing date.

[0068] Computers (80) and (81) are connected to a host computer (100) via a network (N). The number of computers (80) and (81) is not limited to two and may be any number. The host computer (100) may be a computer in the cloud.

[0069] Computers (80) and (81) may transmit information regarding a component (P) to a host computer (100). The host computer (100) may accumulate information regarding a component (P) received from computers (80) and (81) on a recording medium and use it for component management as historical information.

[0070] The timing of collecting information regarding the component (P) is explained. The supplier of the component or the manufacturer of the substrate processing device directly imprints a marker of a two-dimensional code containing information such as a serial number on the component (P) to be shipped to the customer. Then, in order to know which component (P) has been shipped, the two-dimensional code information inserted in the imprinted marker is read using a reader (R) or similar device before shipment to the customer, and the information regarding the read component (P) is recorded on a recording medium such as a host computer (100). When manufacturing the substrate processing device (11), information regarding the component (P), such as a serial number, is also recorded so that it is possible to know which component (P) is inserted into which substrate processing device (11). When inserting a new component (P) into the substrate processing device (11) or removing a consumed component (P), the two-dimensional code information inserted in the marker is read using a reader (R) or similar device, and the read information is recorded on a recording medium such as a host computer (100). By doing so, based on information regarding the recorded part (P), it is possible to manage which part was attached or detached from which device and when.

[0071] For example, by comparing the two-dimensional code information read at the time of shipment with the two-dimensional code information read at the time of attachment and detachment of the component (P), the presence or absence of a component manufactured by a third party can be confirmed. In addition, by recording the operation information of the substrate processing device (11) on a recording medium such as a host computer (100), the operation time for each component (P) can be calculated, making it easier to confirm the correlation with process characteristics.

[0072] Next, an example of the use of information regarding a component (P) will be described. When a problem occurs in each substrate processing device (11), the host computer (100) and the computer (80, 81) can extract information regarding the accumulated component (P) and use it to investigate the problem. In addition, based on the information regarding the accumulated component (P), it is possible to verify the correlation with the results of processes such as etching, and this can be used when performing more fine and complex processes.

[0073] For example, when installing a substrate processing device (11), by reading a marker engraved on a component (P) with a reader (R) or the like, it is possible to quickly identify which component (P) is being used in the installed substrate processing device (11), thereby enabling efficient management and analysis of the component.

[0074] In addition, when removing a component (P) from the substrate processing device (11), by reading the marker formed on the removed component (P), it is possible to quickly determine when and where the manufactured component (P) was removed from the substrate processing device (11), thereby enabling efficient component management and analysis.

[0075] In addition, for example, the cumulative usage time of each component (P) can be managed from the history information of the installation time of the substrate processing device (11) and the history information of the time when the component was removed from the substrate processing device (11). In addition, from these history information, if a problem such as damage or malfunction occurs in the component (P), an investigation of the component (P) that caused the damage or malfunction can be performed quickly.

[0076] The host computer (100) and the computer (80, 81) may limit the information available for use among the history information accumulated by the user. FIG. 7 is a diagram showing an example of available information set for each user according to an embodiment.

[0077] In the example of FIG. 7, user “A” can use the part number, serial number, and manufacturing date among the recorded history information. For example, when a host computer (100) or a computer (80, 81) displays history information regarding a part (P) on a display unit of a terminal device owned by user “A”, the information of the part number, serial number, and manufacturing date is displayed on the display unit, and other information is not displayed.

[0078] Meanwhile, User "B" can use the part number, part name, serial number, manufacturing date, installation time, and removal time among the recorded history information. That is, the history information regarding the part (P) displayed on the terminal device owned by User "A" is different from the history information regarding the part (P) displayed on the terminal device owned by User "B". By doing so, the scope of disclosure of history information regarding the part (P) can be managed for each user.

[0079] As described above, in the component (P) for a substrate processing device according to the embodiment, a marker coded with a serial number by laser processing is formed directly on the component (P). A reader (R), etc. acquires two-dimensional code information inserted into the marker and records it on a recording medium such as a host computer (100). By doing so, it can contribute to shortening the recording time and reducing recording errors. In addition, by recording the read two-dimensional code information on a recording medium such as a host computer (100), historical information of components within one or more substrate processing devices (11) can be accumulated. By doing so, based on the accumulated historical information of components, management, investigation, and analysis of components can be performed quickly.

[0080] In addition, by bringing a marker engraved on a part into the viewfinder screen of a reader or camera, the function of Augmented Reality (AR) can be realized by superimposing virtual content corresponding to the marker onto a display in a real environment. In this case, content information corresponding to the marker is stored in advance in a host computer (100), etc. Then, when the reader or camera reads the marker, content information associated with the marker is transmitted from the host computer (100), etc. to the reader or camera. By doing so, the desired content can be displayed on the display of the reader or camera.

[0081] The components for a substrate processing device and the substrate processing system according to the embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The above embodiments may be modified and improved in various forms without departing from the appended claims and their common knowledge. The details described in the plurality of embodiments may also take other configurations and may be combined within a non-contradictory scope.

[0082] The substrate processing apparatus of the present disclosure is applicable to any type of apparatus among an atomic layer deposition (ALD) apparatus, capacitively coupled plasma (CCP), inductively coupled plasma (ICP), radial line slot antenna (RLSA), electron cyclotron resonance plasma (ECR), and helicon wave plasma (HWP).

Claims

Claim 1 A substrate processing system comprising at least one substrate processing device including a processing chamber, a return chamber for returning a substrate within the processing chamber, and a reader disposed in a return path through which the substrate is returned to the processing chamber, wherein the reader is configured to read a marker having a groove of a depth that is not lost by a process by the substrate processing device on the surface and / or inside of a consumable part disposed within the processing chamber. Claim 2 A substrate processing system according to claim 1, wherein the reader is disposed in at least one of the processing chamber, the vacuum return chamber and / or atmospheric return chamber, the load lock chamber, the load port, and the gate valve. Claim 3 A substrate processing system according to claim 1, wherein the above-mentioned consumable part is a part that is consumed by plasma treatment. Claim 4 A substrate processing system according to claim 1, wherein the marker is configured to be readable by the contrast of light incident on a groove formed on the surface and / or inside the consumable part. Claim 5 A substrate processing system according to claim 1, wherein the marker is configured to make code information readable by the contrast of two or more types of colors formed on the surface and / or inside the consumable part. Claim 6 A substrate processing system according to any one of claims 1 to 5, wherein the marker is configured to enable error correction of code information. Claim 7 A substrate processing system according to any one of claims 1 to 5, wherein the marker is a two-dimensional code. Claim 8 A substrate processing system according to any one of claims 1 to 5, wherein the consumable part is at least one of an upper electrode, a placement base, an edge ring, a baffle plate, and a shield. Claim 9 A consumable part disposed within a processing chamber, comprising a marker configured to be readable by a reader disposed in a transport path through which a substrate is transported to the processing chamber, and comprising a groove of a depth that is not lost by a process by a substrate processing device on the surface and / or inside. Claim 10 In claim 9, the marker is a consumable part that is read by the reader placed in at least one of a vacuum conveying chamber and / or an atmospheric conveying chamber, a load lock chamber, a load port, and a gate valve. Claim 11 In paragraph 9, the above process is a plasma treatment, a consumable part. Claim 12 In claim 9, the above-mentioned consumable part is a consumable part that is consumed by plasma treatment. Claim 13 In claim 9, the consumable part is configured such that code information is readable by the contrast of light incident on a groove formed on the surface and / or inside the consumable part. Claim 14 In claim 9, the consumable part is configured such that code information is readable by the contrast of two or more colors formed on the surface and / or inside the consumable part. Claim 15 A consumable part, wherein, in any one of paragraphs 9 to 14, the marker is configured to enable error correction of code information. Claim 16 A consumable part, wherein, in any one of paragraphs 9 to 14, the marker is a two-dimensional code. Claim 17 A consumable part according to any one of claims 9 to 14, wherein the consumable part is at least one of an upper electrode, a placement base, an edge ring, a baffle plate, and a shield. Claim 18 delete

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