Electrically Debondable Bio-Based Adhesive Composition

Abstract

The invention relates to an electrically debondable adhesive composition derived from renewable bio-based materials. The composition comprises a polyurethane polymer synthesized from hydroxylated sesame seed oil (HSSO) as a bio-based matrix, iron (III) chloride hexahydrate (FeC13 . 6H2 O) as an electro-responsive component, and sodium lauryl ether sulfate (SLES) as a compatibilizing surfactant for uniform dispersion of the electrolyte within the polymeric network. Optionally, Bisphenol A, orcein, and dimethyl glyoxime are incorporated to enhance cohesive strength and film uniformity. The adhesive forms robust bonds under ambient conditions and cures below 80 °C while exhibiting a shear strength exceeding 2000 N.m-2 . Upon application of a low electrical potential, localized ionic conduction and controlled thermal generation occur within the adhesive layer, leading to simultaneous debonding from both substrate interfaces without surface damage. This sustainable, reconfigurable adhesive system enables reversible adhesion for applications in electronics, medical devices, packaging, and wearable technologies, offering an environmentally friendly alternative to conventional synthetic electrically debondable adhesives.