Thermosetting resin compositions and their uses

Abstract

The object of the present invention is to provide a thermosetting resin composition whose cured product has high heat resistance and excellent tracking resistance. The solution is a thermosetting resin composition comprising: (A) an aliphatic bismaleimine compound of formula (1) below (in formula (1), A is a divalent aliphatic hydrocarbon group having 5 to 12 carbon atoms); and (B) an epoxy resin having 2 or more epoxy groups in one molecule, wherein component (A) is 20 to 95% by mass relative to the total of components (A) and (B).