Plasma processing container and plasma processing apparatus

Abstract

The present invention provides a plasma processing container and a plasma processing apparatus. The plasma processing container may include: a first body capable of being coupled to one side of an object storage container; a second body capable of being coupled to the other side of the object storage container; a connection electrode arranged on at least one of the first body and the second body and connected to an external power source through one end thereof; and a magnetic field forming unit arranged on at least one of the first body and the second body to form a magnetic field in the object storage container.

Description

Plasma treatment vessel and plasma treatment device

[0001] The present invention relates to a plasma processing vessel and a plasma processing device.

[0002] Plasma treatment is commonly used for a variety of purposes in various industries, including semiconductors, displays, agriculture, and medical care. Plasma treatment can produce a variety of effects on the surface of the object being treated.

[0003] In the medical industry, plasma surface treatment is being used on biomaterials for skin grafts, used to replace, repair, and reconstruct human tissues and organs, including dermal and cutaneous tissue. In particular, surface treatment of bone grafts enhances bone cell adhesion and transplantation characteristics on the graft surface, thereby enhancing the biocompatibility of the graft.

[0004] Furthermore, surface-treating plant seeds can have beneficial effects, such as improved germination rates or germination speeds. As plasma surface treatment of diverse materials becomes increasingly necessary, the need for technologies capable of effectively performing surface treatment regardless of the type of material being treated is growing.

[0005] Conventional plasma treatment often results in localized plasma generation near the target object, making it difficult to treat the surface uniformly. Furthermore, high energy is transmitted to certain areas, potentially damaging the target object and degrading its performance. Furthermore, plasma generation occurs in areas with low electrical resistance, making surface treatment difficult for non-conductive materials such as bone grafts or food seeds.

[0006] The purpose of the present invention is to provide a plasma treatment vessel and a plasma treatment device capable of uniformly plasma-treating a subject to be treated, including a magnetic field forming unit capable of rotating plasma.

[0007] In order to achieve the above object, one aspect of the present invention provides a plasma treatment vessel including a first body that can be coupled to one side of a treatment object storage vessel, a second body that can be coupled to the other side of the treatment object storage vessel, a connection electrode that is disposed on at least one of the first body and the second body and is connected to an external power source through one end, and a magnetic field forming unit that is disposed on at least one of the first body and the second body and forms a magnetic field inside the treatment object storage vessel.

[0008] The plasma treatment vessel according to the present invention includes a magnetic field forming unit, so that plasma formed in the vessel for receiving the object to be treated and an area adjacent thereto rotates, thereby uniformly performing plasma surface treatment on the object to be treated.

[0009] The plasma treatment vessel according to the present invention can uniformly perform plasma surface treatment while minimizing damage to the object to be treated by controlling the density of plasma using an auxiliary electrode.

[0010] The plasma treatment vessel according to the present invention can generate and rotate plasma in an area adjacent to the object to be treated by protruding a portion of the connection electrode toward the object to be treated, so that plasma surface treatment can be performed efficiently even if the object to be treated is a non-conductor.

[0011] FIG. 1 is a perspective view of a plasma processing vessel according to one embodiment of the present invention.

[0012] Figure 2 is a cross-sectional view of the plasma treatment vessel of Figure 1.

[0013] Figure 3 is a cross-sectional view taken along line Ⅲ-Ⅲ' of Figure 1.

[0014] FIG. 4 is a drawing of another embodiment of the plasma processing vessel of FIG. 1.

[0015] Figure 5 is a perspective view of a plasma processing device according to one embodiment of the present invention.

[0016] Figure 6 is a conceptual drawing illustrating a state in which the plasma treatment device of Figure 5 performs plasma surface treatment on a subject to be treated.

[0017] Figures 7 to 10 are conceptual drawings illustrating a state in which plasma processing vessels of various modifications are mounted on a plasma processing device.

[0018] FIG. 11 is a conceptual diagram illustrating a state in which a plasma processing device according to another embodiment of the present invention performs plasma surface treatment on a processing object.

[0019] Figures 12 and 13 are drawings of modified examples of the plasma processing device of Figure 11.

[0020] One aspect of the present invention provides a plasma treatment vessel including a first body that can be coupled to one side of a treatment object storage vessel, a second body that can be coupled to the other side of the treatment object storage vessel, a connection electrode that is disposed on at least one of the first body and the second body and is connected to an external power source through one end, and a magnetic field forming unit that is disposed on at least one of the first body and the second body and forms a magnetic field inside the treatment object storage vessel.

[0021] In addition, the first body includes a mounting portion capable of mounting one side of the processing material storage container, and the magnetic field forming portion can be arranged symmetrically with respect to the mounting portion.

[0022] Additionally, the second body includes a housing capable of accommodating the other side of the treatment material storage container, and the connecting electrode can be disposed in the housing of the second body.

[0023] In addition, the connecting electrode may have one end exposed by one side of the housing and connected to an external power source, and the other end opposite the one end may have a protrusion extending toward the object to be treated stored in the object to be treated storage container.

[0024] Additionally, the length of the protrusion can be determined by at least one of the shape, properties, and use of the object to be treated.

[0025] Additionally, the protrusion may be formed with a pointed end.

[0026] Additionally, the magnetic field forming unit may include a ring-shaped magnet surrounding the treatment material storage container.

[0027] Additionally, the magnetic field forming unit may include a plurality of magnets spaced apart from each other so as to face each other.

[0028] Additionally, the magnetic field forming unit can form a magnetic field in a direction crossing the direction of the electric field formed by the connecting electrode.

[0029] In addition, the apparatus may further include an auxiliary electrode disposed in at least one of the first body and the second body to surround the object-to-be-treated container, and disposed adjacent to the object-to-be-treated container.

[0030] Another aspect of the present invention is a plasma treatment vessel, comprising: a sealed portion that houses a plasma treatment vessel therein and is sealed against an external environment; an exhaust portion that exhausts the internal atmosphere of the sealed portion to form an atmosphere at a low pressure within a preset process pressure range inside the sealed portion; and a treatment portion that forms an electric field inside the sealed portion to discharge the atmosphere at the low pressure, wherein the plasma treatment vessel may include: a first body that can be coupled to one side of a treatment object storage vessel; a second body that can be coupled to the other side of the treatment object storage vessel; a connection electrode that is disposed on at least one of the first body and the second body and is connected to an external power source through one end; and a magnetic field forming portion that is disposed on at least one of the first body and the second body and forms a magnetic field inside the treatment object storage vessel.

[0031] Additionally, the processing unit may include a first electrode electrically connected to the first body and a second electrode disposed spaced apart from the first electrode.

[0032] Additionally, the plasma treatment vessel may further include a coupling magnet that secures the first body to the first electrode.

[0033] In addition, the first body includes a mounting portion capable of mounting one side of the processing material storage container, and the magnetic field forming portion can be arranged symmetrically with respect to the mounting portion.

[0034] Additionally, the second body includes a housing capable of accommodating the other side of the treatment material storage container, and the magnetic field forming unit can be arranged in the housing of the second body.

[0035] In addition, the connecting electrode may have one end exposed by one side of the housing and connected to an external power source, and the other end opposite the one end may have a protrusion extending toward the object to be treated stored in the object to be treated storage container.

[0036] Additionally, the length of the protrusion can be determined by at least one of the shape, properties, and use of the object to be treated.

[0037] Additionally, the protrusion may be formed with a pointed end.

[0038] Additionally, the magnetic field forming unit may include a ring-shaped magnet surrounding the treatment material storage container.

[0039] Additionally, the magnetic field forming unit may include a plurality of magnets spaced apart from each other so as to face each other.

[0040] Additionally, the magnetic field forming unit can form a magnetic field in a direction crossing the direction of the electric field formed by the connecting electrode.

[0041] In addition, the plasma treatment vessel may further include an auxiliary electrode disposed in at least one of the first body and the second body to surround the treatment object storage vessel, and disposed adjacent to the treatment object stored in the treatment object storage vessel.

[0042] The configuration and operation of the present invention will be described in detail with reference to embodiments of the present invention illustrated in the attached drawings below.

[0043] The present invention is capable of various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, as well as the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms.

[0044] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

[0045] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0046] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0047] In some embodiments, where implementations are otherwise feasible, specific process sequences may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the described order.

[0048] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the following embodiments are not necessarily limited to those shown.

[0049] FIG. 1 is a perspective view of a plasma processing vessel (100) according to one embodiment of the present invention, FIG. 2 is a cross-sectional view of the plasma processing vessel (100) of FIG. 1, and FIG. 3 is a cross-sectional view taken along line Ⅲ-Ⅲ' of FIG. 1. In addition, FIG. 4 is a drawing of another embodiment of the plasma processing vessel (100) of FIG. 1.

[0050] Hereinafter, the term "object to be treated (M)" refers to an object on which plasma surface treatment is performed. Any object to which characteristics are imparted according to plasma treatment may be the object, and may be selected from the group including dental implants, orthopedic implants, bone grafts, skin grafts, ophthalmic implants, cardiac implants, cochlear implants, cosmetic implants, neural implants, medical resins, dental prostheses, fibers, seeds, and foods.

[0051] The plasma treatment vessel (100) can accommodate a treatment object storage vessel (200) that accommodates a treatment object (M). The plasma treatment vessel (100) can be formed in the shape of a pair of holders that accommodate at least a portion of the treatment object storage vessel (200), and at this time, a portion of the treatment object storage vessel (200) may be exposed to the outside. In addition, the pair of holders has an opening corresponding to the shape of the treatment object storage vessel (200) and can accommodate the treatment object storage vessel (200) through the opening. The plasma treatment vessel (100) is mounted on a plasma treatment device (10) to be described later, so that plasma surface treatment of the treatment object (M) can be performed therein.

[0052] Referring to FIGS. 1 and 2, a plasma processing vessel (100) according to one embodiment of the present invention may include a first body (110), a second body (120), a connecting electrode (130), and a magnetic field forming unit (140).

[0053] The first body (110) can be coupled to one side of the treatment material storage container (200). For example, as shown in FIG. 1, the first body (110) has a cylindrical structure and can be coupled to the lower end of the treatment material storage container (200).

[0054] The first body (110) may include a mounting portion (111). A portion of the treatment material storage container (200) may be accommodated in the mounting portion (111) and mounted on the first body (110). Accordingly, the cross-section of the mounting portion (111) may correspond to the cross-sectional shape of the treatment material storage container (200).

[0055] The first body (110) may have a connection electrode (130) to be described later arranged thereon. Alternatively, the first body (110) may be formed of a conductive material. The first body (110) may be connected to the first electrode (E1) of the plasma processing device (10) to be described later, thereby generating plasma in the processing object storage container (200) and an area adjacent thereto.

[0056] The second body (120) can be coupled to the other side of the treatment material storage container (200). For example, as shown in FIG. 1, the second body (120) can be coupled to the upper side of the treatment material storage container (200) and can be spaced apart from the first body (110).

[0057] The second body (120) may include a housing (121). The housing (121) may accommodate the other side of the treatment material storage container (200). For example, the housing (121) may have a cylindrical structure as in FIG. 1 and may have an opening into which a portion of the treatment material storage container (200) may be inserted.

[0058] In one embodiment, the housing (121) may be made of a non-conductive material. For example, the housing (121) may be made of a resin such as polypropylene (PP), polycarbonate (PC), polyacetal (POM), polystyrene, polyamide, polyethylene, rigid polyvinyl chloride, or ABS (acrylonitrile-butadiene-styrene copolymer).

[0059] The connecting electrode (130) can be placed on at least one of the first body (110) and the second body (120). The connecting electrode (130) can be connected to an external power source through one end to form an electric field.

[0060] In one embodiment, the connecting electrode (130) may be placed on the first body (110). At this time, the connecting electrode (131) placed on the first body may be electrically connected to the first electrode (E1) of the plasma processing device (10) described later.

[0061] For example, the connecting electrode (131) may be placed in the mounting portion (111) of the first body (110). Alternatively, the connecting electrode (131) may be placed inside the first body (110) and covered by an electrode cover (not shown) made of a non-conductive material. The electrode cover may prevent plasma from being generated near the connecting electrode (131) and control plasma to be generated intensively in the processing material storage container (200). Alternatively, the first body (110) may be made of a material including a conductive material and may be formed integrally with the connecting electrode (131).

[0062] In one embodiment, the connecting electrode (130) may be placed in the housing (121) of the second body (120).

[0063] The connecting electrode (132) disposed on the second body (120) may have an exposed portion (1322) at one end. The connecting electrode (132) may be exposed to the outside of the housing (121) by the exposed portion (1322) and may have an electric potential. For example, the exposed portion (1322) may be exposed to the outside by one side of the housing (121), so that the connecting electrode (132) may be directly connected to an external electrode.

[0064] Alternatively, if the connecting electrode (132) is formed as a floating electrode that does not directly apply an electric potential from the outside, the exposed portion (1322) may be indirectly connected to an external power source by being exposed inside the sealed portion (14) described later. In this case, the connecting electrode (132) formed as a floating electrode may have its electric potential set differently depending on the relative distance from the first electrode (E1) and the second electrode (E2) described later.

[0065] The exposed portion (1322) can be formed into a structure having a concave groove as shown in Fig. 2. The plasma treatment vessel (100) can adjust the exposure area by changing the shape of the exposed portion (1322), and accordingly, the degree of plasma generation can be varied to effectively surface-treat the object to be treated (M).

[0066] The connecting electrode (132) placed on the second body (120) may have a protrusion (1321) extending toward the object to be treated (M) stored in the object to be treated container (200) at the other end opposite to the one end. By the protrusion (1321), plasma can be generated in an area adjacent to the object to be treated (M) stored inside the object to be treated container (200).

[0067] The length of the protrusion (1321) may be determined by at least one of the shape, properties, and purpose of the object to be treated (M). In addition, the protrusion (1321) may be formed with a pointed end. The shape of the protrusion (1321) may be set in various ways, thereby minimizing damage to the object to be treated (M) and enabling uniform plasma surface treatment.

[0068] The protrusion (1321) may be formed by being connected to the exposed portion (1322). Alternatively, the protrusion (1321) and the exposed portion (1322) may be formed integrally. The connecting electrode (132) is exposed to an external power source by the exposed portion (1322) and has a potential, and can effectively form plasma in an area adjacent to the object to be treated (M) by the protrusion (1321).

[0069] Meanwhile, FIGS. 1 and 2 illustrate an embodiment in which a first body (110) is made of a material (131) including a conductive material, and a connecting electrode (132) having a protrusion (1321) is arranged on a second body (120). However, as described above, the configuration and arrangement of the connecting electrode (130) are not limited thereto, and may be set in various ways depending on the connection relationship with an external power source, etc.

[0070] The magnetic field forming unit (140) can form a magnetic field inside the object-to-be-treated container (200). When forming plasma inside the object-to-be-treated container (200) by the connection electrode (130), there may be cases where the plasma is formed unintentionally and unevenly. The present invention can form a magnetic field by providing the magnetic field forming unit (140) to rotate the plasma formed inside the object-to-be-treated container (200). That is, the magnetic field forming unit (140) can provide a magnetic field that causes the rotation of the plasma formed in the internal space (SP), and the plasma (or plasma constituent particles) rotate (spiral) around the object-to-be-treated container (M) due to the magnetic field generated by the magnetic field forming unit (140), thereby having the effect of uniformly plasma-treating the surface of the object-to-be-treated container (M).

[0071] Specifically, the magnetic field forming unit (140) can form a magnetic field in a direction crossing the direction of the electric field formed by the connecting electrode (130). For example, the magnetic field forming unit (140) can form a magnetic field in a direction perpendicular to the direction of the electric field formed inside the object-to-be-treated container (200). Here, not all of the magnetic fields formed by the magnetic field forming unit (140) need to be formed in a direction perpendicular to the direction of the electric field, and at least some of the magnetic fields can be formed in a direction perpendicular to the direction of the electric field. Therefore, the magnetic field forming unit (140) can rotate the plasma formed inside the object-to-be-treated container (200).

[0072] In one embodiment, the magnetic field forming unit (140) may include a permanent magnet. Alternatively, the magnetic field forming unit (140) may include an electromagnet connected to an external power source.

[0073] The magnetic field forming unit (140) may be placed in at least one of the first body (110) and the second body (120). At this time, the magnetic field forming unit (140) may be placed to surround the treatment material storage container (200).

[0074] In one embodiment, the magnetic field forming unit (140) may be symmetrically arranged with respect to the mounting unit (111) on the first body (110). In another embodiment, the magnetic field forming unit (140) may be arranged in the housing (121) of the second body (120), but may be symmetrically arranged with respect to the internal space of the housing (121). In this case, the magnetic field forming unit (140) may be arranged adjacent to the protrusion (1321).

[0075] In one embodiment, the magnetic field forming unit (140) may be a single magnet surrounding the treatment material storage container (200). FIG. 3 illustrates an embodiment in which the magnetic field forming unit (140) is a ring-shaped magnet surrounding the treatment material storage container (200).

[0076] In another embodiment, the magnetic field forming unit (140) may include a plurality of magnets spaced apart from each other so as to face each other based on the internal space. FIG. 4 illustrates an embodiment including four magnets (1411) spaced apart from each other so as to face each other based on the processing material storage container (200).

[0077] In one embodiment, the magnetic field forming unit (140) may include two or more magnetic field forming units. The magnetic field forming units may include the ring magnet described above or a plurality of magnets.

[0078] For example, the magnetic field forming unit (140) may be provided with a pair of magnetic field forming units (141, 142) arranged respectively in the first body (110) and the second body (120). Alternatively, it may be provided with two or more magnetic field forming units stacked on the inside of the first body (110).

[0079] However, for the convenience of explanation, the following description will focus on an embodiment in which the magnetic field forming unit (140) has a single ring-shaped permanent magnet.

[0080] A plasma processing vessel (100) according to one embodiment of the present invention may further include an auxiliary electrode (150) and a coupling magnet (160).

[0081] Referring to FIG. 9 described below, the auxiliary electrode (150) may be placed in at least one of the first body (110) and the second body (120) to surround the object-to-be-treated container (200). The auxiliary electrode (150) may control the electric field placed inside the object-to-be-treated container (200) and the density of plasma generated accordingly. Through this, plasma may be intensively generated and rotated in an area adjacent to the object-to-be-treated (M), and the plasma treatment container (100) may increase the efficiency of plasma surface treatment.

[0082] Referring again to FIG. 2, the coupling magnet (160) can couple the first body (110) to the lower block (12) of the plasma processing device (10). The coupling magnet (160) comes into contact with the fixed magnet of the lower block (12), so that the plasma processing vessel (100) can be stably fixed to the plasma processing device (10) by magnetic force.

[0083] The coupling magnet (160) can be placed at various locations where the plasma processing vessel (100) comes into contact with the plasma processing device (10). In one embodiment, the coupling magnet (160) can be placed in the lower central region of the first body (110) as shown in FIG. 2.

[0084] FIG. 5 is a perspective view of a plasma processing device (10) according to one embodiment of the present invention, and FIG. 6 is a diagram conceptually illustrating a state in which the plasma processing device (10) of FIG. 5 performs plasma surface treatment on a processing object (M).

[0085] Referring to FIGS. 5 and 6, the plasma processing device (10) may include a main body (11), a lower block (12), an upper block (13), a sealing portion (14), an exhaust portion (15), and a processing portion (16). The plasma processing device (10) may accommodate a plasma processing vessel (100) and may perform plasma surface treatment on a processing object (M) placed inside the plasma processing vessel (100).

[0086] The main body (11) can form the exterior of the plasma processing device (10). A lower block (12) and an upper block (13) can be placed on one side of the main body (11).

[0087] The lower block (12) may be positioned so as to be located in front of the main body (11). The lower block (12) may be positioned so as to be located below the upper block (13). A first electrode (E1) for applying power to the plasma processing device (10) may be positioned on the upper surface of the lower block (12).

[0088] A mounting portion (111) for accommodating a plasma processing vessel (100) may be formed in the lower block (12). As described above, various embodiments of the plasma processing vessel (100) may be accommodated in the lower block (12).

[0089] In one embodiment, the lower block (12) may be equipped with a fixed magnet. The fixed magnet may be in contact with the coupling magnet (160) of the plasma processing vessel (100) to stably fix the plasma processing vessel (100) to the plasma processing device (10) by magnetic force.

[0090] The upper block (13) can be positioned so as to be located in front of the main body (11) and above the lower block (12). The upper block (13) can be equipped with a lifting / lowering part (not shown) that raises / lowers the sealing part (14).

[0091] The sealing member (14) can be moved relative to the lower block (12) to seal the plasma treatment vessel (100) from the external environment. For example, the sealing member (14) can be raised and lowered so that the lower portion of the sealing member (14) comes into contact with the upper surface of the lower block (12), thereby forming a sealed space inside the sealing member (14).

[0092] The exhaust section (15) can exhaust the air inside the sealed section (14) from the external environment, thereby forming an atmosphere in a low-pressure state within a preset process pressure range.

[0093] In one embodiment, an exhaust hole connecting the sealing portion (14) and the exhaust portion (15) may be formed in the lower block (12). Air inside the sealing portion (14) may be exhausted through the exhaust hole.

[0094] The treatment unit (16) generates plasma by discharging low-pressure air into the hollow interior of the sealed unit (14) in which a sealed space is formed, and can treat the object to be treated (M) with plasma.

[0095] The processing unit (16) may be equipped with a first electrode (E1), a second electrode (E2), and a power supply unit (AC).

[0096] The first electrode (E1) can be placed in the lower block (12) so as to be electrically connected to the first body (110) of the plasma processing vessel (100).

[0097] The second electrode (E2) can be placed on the upper part of the sealing member (14) or the upper block (13) so as to be placed on the upper part of the plasma treatment vessel (100).

[0098] The power supply (AC) can apply power to the first electrode (E1) and the second electrode (E2). The second electrode (E2) is positioned apart from the first electrode (E1), so that an electric field is formed inside the sealed portion (14) by the power supply (AC), and the low-pressure atmosphere is discharged, thereby generating plasma.

[0099] Below, the principle of plasma surface treatment of a workpiece (M) by a plasma treatment device (10) is explained, focusing on the relationship between the configuration of a plasma treatment vessel (100) and a plasma treatment device (10).

[0100] The object to be treated (M) may be stored inside a object to be treated storage container (200). At this time, the object to be treated storage container (200) may be formed with an open top as shown in Fig. 2, and the object to be treated (M) may be placed on the bottom surface of the object to be treated storage container (200). The object to be treated storage container (200) may be a transparent vial container that allows the plasma treatment process of the object to be treated (M) to be visually observed.

[0101] The treatment material storage container (200) can be accommodated in the plasma treatment container (100). As described above, the first body (110) of the plasma treatment container (100) is coupled to one end of the treatment material storage container (200), and the second body (120) is coupled to the other end so that the treatment material storage container (200) can be accommodated.

[0102] As described above, the treatment material storage container (200) may include a connection electrode (130) disposed on at least one of the first body (110) and the second body (120). However, the following description will focus on an embodiment in which the first body (110) itself is formed of a material (131) including a conductive material, and the connection electrode (132) has a protrusion (1321) on the second body (120) and is formed as a floating electrode.

[0103] When voltage is applied to the first electrode (E1) and the second electrode (E2) from the power supply (AC), a potential can be formed in the first body (110) connected to the first electrode (E1). Through this, an electric field can be formed inside the sealed portion (14) including the inside of the treatment material storage container (200).

[0104] When the air inside the sealed portion (14) is exhausted from the exhaust portion (15) to form an atmosphere with a low pressure within a preset process pressure range, the atmosphere can be discharged by an electric field to generate plasma (P).

[0105] Meanwhile, when voltage is applied to the first electrode (E1) and the second electrode (E2) from the power supply (AC), a potential can also be formed at the connection electrode (132) of the second body (120).

[0106] At this time, the connecting electrode (132) has an exposed portion (1322) partially exposed within the sealed portion (14) and a protrusion (1321) connected to the exposed portion (1322) and extending toward the object to be treated (M) stored in the object to be treated storage container (200), thereby stably generating plasma (P) even in the vicinity of the object to be treated (M). In addition, the density of the plasma (P) within the sealed portion (14) can be controlled by an auxiliary electrode (150) placed adjacent to the object to be treated (M).

[0107] The plasma inside the sealed portion (14) can be rotated by the magnetic field forming portion (140) of the plasma treatment vessel (100). The magnetic field forming portion (140) forms a magnetic field in a direction crossing the direction of the electric field, so that the plasma (P) can be rotated inside the sealed portion (14). By the rotation of the plasma (P), the plasma surface treatment can be uniformly performed on the surface of the object to be treated (M).

[0108] Figures 7 to 10 are conceptual drawings illustrating a state in which a plasma processing vessel (100) of various modified examples is mounted on a plasma processing device (10).

[0109] Referring to Fig. 7, the length of the protrusion (1321) of the connecting electrode (132) can be adjusted. If the object to be treated (M) can be easily damaged by the plasma (P) or indirect surface treatment is required, the length of the protrusion (1321) can be formed short as in Fig. 7 to minimize exposure of the object to be treated (M) to the plasma (P).

[0110] Referring to FIG. 8, the magnetic field forming unit (140) can be arranged in both the first body (110) and the second body (120). As described above, the magnetic field forming unit (140) can have two or more magnetic field forming units (141, 142), each of which can be matched to the first body (110) and the second body (120). At this time, in order to surface treat the object (M) disposed at the bottom of the object-to-be-treated container (200), the plasma (P) can be uniformly rotated at the bottom of the object-to-be-treated container (200) by the magnetic field forming unit (141) disposed at the first body (110), and through this, the object (M) disposed at the bottom of the object-to-be-treated container (200) can be surface treated efficiently.

[0111] Referring to FIG. 9, the plasma processing vessel (100) may further include an auxiliary electrode (150). FIG. 9 illustrates an embodiment in which the auxiliary electrode (150) is positioned to protrude from the first body (110) toward the second body (120). The density of the plasma (P) formed between the first body (110) and the second body (120) can be controlled by the auxiliary electrode (150).

[0112] Referring to Fig. 10, the first body (110a) has an electrode cover (112a) made of a non-conductive material, and a connection electrode (131a) and a magnetic field forming part (141a) can be arranged inside the electrode cover. At this time, the connection electrode (131a) can be electrically connected to the first electrode (E1). The electrode cover can be formed so that the thickness of both sides is thicker than the thickness of the upper part adjacent to the object-to-be-processed storage container (200a), and through this, the plasma (P) can be controlled to be intensively generated inside the object-to-be-processed storage container (200a).

[0113] FIG. 11 is a conceptual drawing illustrating a state in which a workpiece (M) is subjected to plasma surface treatment in a plasma treatment device (20) according to another embodiment of the present invention, and FIGS. 12 and 13 are drawings of modified examples of the plasma treatment device (20) of FIG. 11.

[0114] Referring to FIGS. 11 to 13, a plasma processing device (20) according to another embodiment of the present invention may include a sealing unit (24), an exhaust unit (25), a processing unit (26), and a magnetic field forming unit (27).

[0115] According to another embodiment of the present invention, a sealed portion (24) of a plasma processing device (20) may directly accommodate a processing object storage container (200). At this time, the processing object storage container (200) may be electrically connected to a first electrode (E1).

[0116] The treatment material storage container (200) accommodated in the sealed portion (24) may have a partially open area (A). FIGS. 11 to 13 illustrate an embodiment in which the upper surface of the treatment material storage container (200) has an open area (A). Through the open area (A) of the treatment material storage container, plasma (P) may be directly generated within the container or may be transmitted from the outside to the inside of the container.

[0117] The magnetic field forming unit (27) is arranged in the sealed unit (24) and can form a magnetic field inside the sealed unit (24). Through this, the magnetic field forming unit (27) can rotate the atmosphere discharged inside the sealed unit (24) by the processing unit (26).

[0118] The magnetic field forming unit (27) can be arranged symmetrically based on the interior of the sealing unit (24). For the detailed configuration and shape of the magnetic field forming unit (27), reference will be made to the description made above regarding the magnetic field forming unit (140) of the plasma processing vessel (100).

[0119] In one embodiment, the magnetic field forming unit (27) may be placed adjacent to either the first electrode (E1) or the second electrode (E2). Additionally, the magnetic field forming unit (27) may be placed between the auxiliary electrode (28) described below and the second electrode (E2).

[0120] In one embodiment, the magnetic field forming unit (27) may be placed adjacent to the object to be treated (M) stored in the object to be treated storage container (200).

[0121] In one embodiment, the magnetic field forming part (27) may be placed inside the sealing part (24). Alternatively, as in FIG. 12, the magnetic field forming part (27') may be placed on the outer surface of the sealing part (24').

[0122] In another embodiment, the magnetic field forming unit (27) may have two or more magnetic field forming units. Referring to FIG. 13, the magnetic field forming units (27a'', 27b'') may be arranged on the side of the sealing unit (24'') and the upper side of the first electrode (E1), respectively. The magnetic field forming unit (27'') may control the density of the plasma (P) inside the sealing unit (24'') by varying the arrangement of the magnetic field forming units.

[0123] A plasma processing device (20) according to another embodiment of the present invention may further include an auxiliary electrode (28).

[0124] The auxiliary electrode (28) can be placed inside the sealing portion (24) to surround the treatment material storage container (200). The auxiliary electrode (28) is placed between the first electrode (E1) and the second electrode (E2), so as to control the electric field formed inside the sealing portion (24) and the density of the plasma (P) generated accordingly.

[0125] In one embodiment, as shown in FIGS. 11 to 13, the auxiliary electrode (28) may be arranged to extend from the first electrode (E1) toward the second electrode (E2). At this time, the auxiliary electrode (28) may have a potential substantially corresponding to that of the first electrode (E1).

[0126] In one embodiment, the auxiliary electrode (28) may be a floating electrode to which no external potential is directly applied. In this case, the potential of the auxiliary electrode may be set differently depending on the relative distance from the first electrode (E1) and the second electrode (E2).

[0127] In one embodiment, the auxiliary electrode (28) may be placed adjacent to the object to be treated (M) stored in the object to be treated storage container (200). Plasma (P) may be intensively generated in an area adjacent to the object to be treated (M) by the auxiliary electrode (28). Through this, the plasma treatment device (20) may increase the efficiency of plasma surface treatment.

[0128] Other configurations and functions of the plasma processing device (20) will be described with reference to the above.

[0129] The plasma treatment vessel and plasma treatment device of the present invention can uniformly perform plasma surface treatment on an object to be treated by rotating plasma formed in an internal space by a magnetic field. At this time, by considering the physical properties and arrangement of the object to be treated, the type of object to be treated, the arrangement of the object to be treated, the type of container to be treated, etc., and adjusting the shape of the connecting electrode, the configuration and arrangement of the magnetic field forming unit and the auxiliary electrode, it is possible to minimize damage to the object to be treated while increasing the efficiency of the plasma surface treatment.

[0130] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

[0131] The specific implementations described in the examples are exemplary and do not limit the scope of the examples in any way. Furthermore, unless specifically stated as "essential," "important," or the like, an element may not be absolutely necessary for the application of the present invention.

[0132] The use of the term "above" and similar referential terms in the specification of embodiments (especially the claims) may refer to both singular and plural. Furthermore, if a range is described in the embodiments, it is intended that the invention includes individual values ​​within the range (unless otherwise stated), and is equivalent to describing each individual value constituting the range in the detailed description. Finally, unless the order of steps constituting a method according to an embodiment is explicitly stated or otherwise stated to the contrary, the steps may be performed in any suitable order. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., "etc.") in the embodiments is merely intended to describe the embodiments in detail, and the scope of the embodiments is not limited by the examples or exemplary terms, unless otherwise defined by the claims. Furthermore, those skilled in the art will recognize that various modifications, combinations, and variations may be made within the scope of the appended claims or their equivalents, depending on design conditions and factors.

[0133] According to one embodiment of the present invention, a plasma treatment vessel and a plasma treatment device are provided. Furthermore, embodiments of the present invention can be applied to techniques for sterilizing a subject to be treated or treating the surface of a subject to be treated using plasma.

Claims

1. A first body that can be connected to one side of a container for storing a processed material; A second body that can be connected to the other side of the above-mentioned treatment material storage container; A connecting electrode disposed on at least one of the first body and the second body and connected to an external power source through one end; and A plasma processing vessel, comprising: a magnetic field forming unit disposed in at least one of the first body and the second body to form a magnetic field inside the processing material storage vessel.

2. In paragraph 1, The first body includes a mounting portion capable of mounting one side of the treatment material storage container; A plasma processing vessel in which the magnetic field forming unit is arranged symmetrically with respect to the mounting unit.

3. In paragraph 1, The second body includes a housing capable of accommodating the other side of the treatment material storage container; A plasma processing vessel, wherein the above connecting electrode is disposed in the housing of the second body.

4. In paragraph 3, A plasma treatment vessel, wherein the above connecting electrode has one end exposed by one side of the housing and connected to an external power source, and the other end opposite the one end has a protrusion extending toward the object to be treated stored in the object to be treated storage container.

5. In paragraph 4, A plasma treatment vessel, wherein the length of the protrusion is determined by at least one of the shape, properties, and use of the object to be treated.

6. In paragraph 4, A plasma treatment vessel in which the above protrusion is formed with a pointed end.

7. In paragraph 1, A plasma treatment vessel, wherein the magnetic field forming unit includes a ring-shaped magnet surrounding the treatment material storage container.

8. In paragraph 1, A plasma processing vessel, wherein the magnetic field forming unit includes a plurality of magnets spaced apart from each other so as to face each other.

9. In paragraph 1, A plasma processing vessel in which the magnetic field forming unit forms a magnetic field in a direction crossing the direction of the electric field formed by the connecting electrode.

10. In paragraph 1, A plasma treatment vessel further comprising an auxiliary electrode disposed in at least one of the first body and the second body, surrounding the treatment object storage container, and disposed adjacent to the treatment object stored in the treatment object storage container.

11. A sealed portion that houses a plasma treatment vessel inside and is sealed against the external environment; An exhaust section that exhausts the internal atmosphere of the sealed section to form an atmosphere at a low pressure within a preset process pressure range inside the sealed section; and It includes a processing unit that forms an electric field inside the sealed portion to discharge the low-pressure atmosphere; The above plasma treatment vessel, A first body connectable to one side of a treatment material storage container; A second body that can be connected to the other side of the above-mentioned treatment material storage container; A connecting electrode disposed on at least one of the first body and the second body and connected to an external power source through one end; and A plasma processing device comprising a magnetic field forming unit disposed in at least one of the first body and the second body and forming a magnetic field inside the processing material storage container.

12. In paragraph 11, The above processing unit, a first electrode electrically connected to the first body; and A plasma processing device comprising a second electrode disposed spaced apart from the first electrode.

13. In paragraph 12, A plasma processing device, wherein the plasma processing vessel further includes a coupling magnet that secures the first body to the first electrode.

14. In paragraph 11, The first body includes a mounting portion capable of mounting one side of the treatment material storage container; A plasma processing device in which the magnetic field forming unit is arranged symmetrically with respect to the mounting unit.

15. In paragraph 11, The second body includes a housing capable of accommodating the other side of the treatment material storage container; A plasma processing device, wherein the magnetic field forming unit is disposed in the housing of the second body.

16. In paragraph 15, A plasma treatment device, wherein the above-mentioned connecting electrode has one end exposed by one side of the housing and connected to an external power source, and the other end opposite the one end has a protrusion extending toward the object to be treated stored in the object to be treated storage container.

17. In paragraph 16, A plasma processing device, wherein the length of the protrusion is determined by at least one of the shape, properties, and use of the object to be processed.

18. In paragraph 16, A plasma processing device in which the above protrusion is formed with a sharp end.

19. In paragraph 11, A plasma processing device, wherein the magnetic field forming unit includes a ring-shaped magnet surrounding the processing material storage container.

20. In paragraph 11, A plasma processing device, wherein the magnetic field forming unit includes a plurality of magnets spaced apart from each other so as to face each other.

21. In paragraph 11, A plasma processing device in which the magnetic field forming unit forms a magnetic field in a direction crossing the direction of the electric field formed by the connecting electrode.

22. In paragraph 11, A plasma processing vessel, wherein the plasma processing vessel further includes an auxiliary electrode disposed in at least one of the first body and the second body to surround the processing object storage vessel, and disposed adjacent to the processing object stored in the processing object storage vessel.

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