Camera module comprising baffle and electronic device comprising same

Abstract

This camera module may comprise: a housing; a lens carrier configured to carry a lens along the optical axis of the lens; an image sensor configured to receive light passing through the lens; a first baffle arranged on one portion of the lens carrier; and a second baffle arranged parallel to the first baffle and arranged in an inner portion of the housing between the lens and the image sensor.

Description

Camera module including a baffle and electronic device including the same

[0001] The disclosure generally relates to a camera module, for example, a camera module including a baffle. The disclosure also relates to an electronic device including a camera module.

[0002] Technologies are being developed to reduce phenomena such as ghosting, flare, or glare within camera modules that can affect image quality.

[0003] The related art mentioned above is possessed or acquired during the process of deriving the present disclosure and cannot necessarily be said to be prior art disclosed to the general public prior to the filing of the present disclosure.

[0004] The camera module may include a housing, a lens carrier configured to carry the lens along an optical axis of the lens, an image sensor configured to receive light passing through the lens, a first baffle disposed on a portion of the lens carrier, and a second baffle disposed parallel to the first baffle and disposed on an inner portion of the housing between the lens and the image sensor.

[0005] An electronic device may include a camera module. The camera module may include a housing, a lens carrier configured to carry the lens along an optical axis of the lens, an image sensor configured to receive light passing through the lens, a first baffle disposed on a portion of the lens carrier, and a second baffle disposed parallel to the first baffle and disposed on an inner portion of the housing between the lens and the image sensor.

[0006] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become apparent from the following detailed description with reference to the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0008] FIG. 2 is a block diagram illustrating a camera module according to one embodiment.

[0009] FIG. 3 is a perspective view of a one-way electronic device according to one embodiment.

[0010] FIG. 4 is a perspective view of an electronic device in another direction according to one embodiment.

[0011] Figure 5 is a perspective view of a camera module according to one embodiment.

[0012] Figure 6 is a plan view of a camera module according to one embodiment.

[0013] Figure 7 is an exploded perspective view according to one embodiment.

[0014] FIG. 8A is a plan view of a camera module including an AF carrier in a first position with the camera cover removed according to one embodiment.

[0015] A plan view of a camera module including an AF carrier in a second position with the camera cover removed according to an embodiment of FIG. 8b.

[0016] FIG. 9a is a cross-sectional view of a camera module according to one embodiment taken along line 9-9 of FIG. 6.

[0017] FIG. 9B is a drawing of a first wall according to one embodiment, which is an enlarged view of part 9B of FIG. 9A.

[0018] FIG. 9C is a drawing of a second wall according to one embodiment, which is an enlarged view of part 9C of FIG. 9A.

[0019] FIG. 10A is a plan view of a camera module according to one embodiment.

[0020] Figure 10b is a bottom view of a baffle according to one embodiment.

[0021] FIG. 10C is an enlarged view of a portion 10C of the baffle of FIG. 10B according to one embodiment.

[0022] Fig. 11 is a cross-sectional view of a camera module according to one embodiment.

[0023] Figure 12 is a cross-sectional view of a camera module according to one embodiment.

[0024] FIG. 13 is a perspective view of a carrier in a camera module according to one embodiment.

[0025] FIG. 14 is a perspective view of a carrier in a camera module according to one embodiment.

[0026] FIG. 15 is a perspective view of a carrier in a camera module according to one embodiment.

[0027] Fig. 16 is a cross-sectional view of a camera module according to one embodiment.

[0028] Figure 17 is a cross-sectional view of a camera module according to one embodiment.

[0029] Figure 18 is a cross-sectional view of a baffle according to one embodiment.

[0030] Figure 19 is a cross-sectional view of a baffle according to one embodiment.

[0031] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0055] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0056] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0057] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0058] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0059] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0060] FIG. 2 is a block diagram illustrating a camera module according to one embodiment.

[0061] Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0062] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as, for example, an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0063] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) by using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). In one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) may be configured as at least a portion of the memory (130), or as a separate memory that operates independently therefrom.

[0064] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0065] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0066] Figure 3 is a perspective view of an electronic device in one direction according to one embodiment. Figure 4 is a perspective view of an electronic device in another direction according to one embodiment.

[0067] Referring to FIGS. 3 and 4, an electronic device (301) (e.g., the electronic device (101) of FIG. 1) may include a housing (310) having a first side (310A) (e.g., a front side), a second side (310B) (e.g., a back side), and a third side (310C) (e.g., a side side) surrounding a space between the first side (310A) and the second side (310B). The first side (310A) may be formed by a first plate (311A) that is at least partially transparent. For example, the first plate (311A) may include a glass plate or a polymer plate that includes at least one coating layer. The second side (310B) may be formed by a second plate (311B) that is substantially opaque. For example, the second plate (311B) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination thereof. The third surface (310C) may be formed by a frame (311C) that is joined to the first plate (311A) and the second plate (311B) and includes a metal and / or polymer. The second plate (311B) and the frame (311C) may be seamlessly formed as one piece. The second plate (311B) and the frame (311C) may be formed of substantially the same material (e.g., aluminum).

[0068] The electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may be disposed on the third surface (310C). The input module (350) may include at least one key input device. For example, the key input device may include one or more mechanical actuators (e.g., buttons), one or more capacitors, and / or one or more inductors.

[0069] The electronic device (301) may include an audio output module (355) (e.g., the audio output module (155) of FIG. 1). The audio output module (355) may be disposed on the third surface (310C). The audio output module (355) may include one or more holes.

[0070] The electronic device (301) may include a display module (361) (e.g., the display module (160) of FIG. 1). The display module (361) may be disposed on the first surface (310A). The display module (361) may be visible through at least a portion of the first plate (311A). The display module (361) may have a shape substantially the same as the shape of the outer edge of the first plate (311A). The edge of the display module (361) may substantially coincide with the outer edge of the first plate (311A). The display module (361) may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. The display module (361) may include a screen display area (361A) that is visually exposed and displays content through pixels. The display area (361A) may include a sensing area (361A-1). The sensing area (361A-1) may overlap with at least a portion of the display area (361A). The sensing area (361A-1) may allow transmission of an input signal related to the sensor module (376) (e.g., the sensor module (176) of FIG. 1 ). The sensing area (361A-1) may display content similarly to the display area (361A) that does not overlap with the sensing area (361A-1). For example, the sensing area (361A-1) may display content while the sensor module (376) is not operating. At least a portion of the camera area (361A-2) may overlap with the display area (361A). The display area (361A) may include the camera area (361A-2). The camera area (361A-2) may allow transmission of an optical signal associated with a first camera module (380A) (e.g., camera module (180) of FIG. 1 and / or camera module (180) of FIG. 2).At least a portion of the camera area (361A-2) overlapping the screen display area (361A) may display content similarly to the screen display area (361A) that does not overlap the camera area (361A-2). For example, the camera area (361A-2) may display content while the first camera module (380A) is not operating.

[0071] The electronic device (301) may include an audio module (370) (e.g., the audio module (170) of FIG. 1). The audio module (370) may be positioned on the third surface (310C). The audio module (370) may obtain sound through at least one hole.

[0072] The electronic device (301) may include a sensor module (376). The sensor module (376) may be disposed on the first surface (310A). The sensor module (376) may form a sensing area (361A-1) in at least a portion of the screen display area (361A). The sensor module (376) may receive an input signal passing through the sensing area (361A-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). The input signal may include a signal related to a user's biometric information (e.g., a fingerprint).

[0073] The electronic device (301) may include a connection terminal (378) (e.g., connection terminal (178) of FIG. 1). The connection terminal (378) may be positioned on the third surface (310C). For example, when the electronic device (301) is viewed in one direction (e.g., -Y direction), the connection terminal (378) may be positioned substantially in the center of the third surface (310C), and the audio output module (355) may be positioned on one side (e.g., right) with respect to the connection terminal (378).

[0074] The electronic device (301) may include a first camera module (380A) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The first camera module (380A) may be disposed on the first surface (310A). At least a portion of the first camera module (380A) may be disposed below the display module (361). The first camera module (380A) may receive an optical signal that passes through the camera area (361A-2).

[0075] The electronic device (301) may include a plurality of second camera modules (380B) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The plurality of second camera modules (380B) may be arranged on the second surface (310B). The plurality of second camera modules (380B) may be arranged in a first row in one direction (e.g., the Y-axis direction) of the second plate (311B). The plurality of second camera modules (380B) may have different fields of view. For example, the plurality of second camera modules (380B) may include an ultra wide-angle camera, a wide-angle camera, and / or a tele camera.

[0076] The electronic device (301) may include an optical module (380C) (e.g., a flash (220) of FIG. 2). The optical module (380C) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B). The optical module (380C) may include one or more light-emitting diodes or xenon lamps. The optical module (380C) may include a sensor configured to detect external light. For example, the sensor may include a flicker sensor.

[0077] The electronic device (301) may include a third camera module (380D). The pixels, magnification, and / or field of view of the third camera module (380D) may be different from the pixels, magnification, and / or field of view of at least one second camera module (380B). The third camera module (380D) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B).

[0078] The electronic device (301) may include a fourth camera module (380E). The fourth camera module (380E), which may also be referred to as a "depth camera" or a "time-of-flight (ToF) camera," may be configured to measure a distance between the fourth camera module (380E) and a subject. For example, the fourth camera module (380E) may be configured to measure the distance using at least one or a combination of ultrasound, infrared, or laser. The fourth camera module (380E) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B).

[0079] Meanwhile, the embodiments disclosed in this document can be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, rollable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 3 and 4.

[0080] In this document, terms such as "substantially," "approximately," "typically," and "about" when referring to a given parameter, property, or condition may include the extent to which a person of ordinary skill in the art would understand the given parameter, property, or condition to be satisfied with a small degree of variance, such as within acceptable manufacturing tolerances. For example, a particular parameter that is substantially satisfied may be satisfied at least about 90% of the time, or at least about 95% of the time, or at least 99% of the time.

[0081] FIG. 5 is a perspective view of a camera module according to an embodiment. FIG. 6 is a plan view of a camera module according to an embodiment. FIG. 7 is an exploded perspective view of an embodiment. FIG. 8A is a plan view of a camera module including an AF carrier in a first position with a camera cover removed according to an embodiment. FIG. 8B is a plan view of a camera module including an AF carrier in a second position with a camera cover removed according to an embodiment. FIG. 9A is a cross-sectional view of a camera module according to an embodiment taken along line 9-9 of FIG. 6. FIG. 9B is an enlarged view of a first wall according to an embodiment, taken along section 9B of FIG. 9A. FIG. 9C is an enlarged view of a second wall according to an embodiment, taken along section 9C of FIG. 9A.

[0082] Referring to FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C, a camera module (400) (e.g., the camera module (180) of FIGS. 1 and 2 , and / or the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4 ) may include a camera housing (410). The camera housing (410) may be configured to accommodate one or more camera-related components. The camera housing (410) may include a base frame (410A) and a plurality of side housing frames (410B) connected to the base frame (410A).

[0083] The camera module (400) may include a camera cover (411). The camera cover (411), which may also be referred to as a “shield can,” may be configured to cover one or more camera-related components housed in the camera housing (410). The camera cover (411) may include a top frame (411A) and a plurality of side cover frames (411B) connected to the top frame (411A).

[0084] The camera module (400) may include a first lens assembly (420A) (e.g., the lens assembly (210) of FIG. 2). The first lens assembly (420A) may include at least one first lens (421A) having a defined optical axis (OA). A portion of the optical axis (OA) may be defined as a line connecting a center of curvature of a first surface of at least one first lens (421A) and a center of curvature of an Nth surface (N is a natural number). The first lens assembly (420A) may include a first lens housing (422A) configured to accommodate at least one first lens (421A). The first lens assembly (420A) may include a lens holder (423A) configured to hold the first lens housing (422A). The lens holder (423A) may be configured to support at least one first lens (421A). The lens holder (423A) may be configured to be coupled to the camera housing (410). In one embodiment, the lens holder (423A) may be detachably coupled to the first lens housing (422A). In an embodiment not shown, the lens holder (423A) may be formed integrally with the first lens housing (422A). The first lens assembly (420A) may include a blocking wall (423B). The blocking wall (423B) may at least partially block light passing through the first lens (421A) and between the second lens (421B) and the reflector (440A). The blocking wall (423B) may be formed integrally and seamlessly with the lens holder (423A).

[0085] In an embodiment not shown, the camera module (400) may not include a first lens assembly (420A).

[0086] The camera module (400) may include a second lens assembly (420B) (e.g., the lens assembly (210) of FIG. 2). The second lens assembly (420B) may include at least one second lens (421B) having a defined optical axis (OA). A portion of the optical axis (OA) may be defined as a line connecting a center of curvature of a first surface of at least one second lens (421B) and a center of curvature of an Nth surface (N is a natural number). The second lens assembly (420B) may include a second lens housing (422B) configured to accommodate at least one second lens (421B).

[0087] The camera module (400) may include a sensor assembly (430). The sensor assembly (430) may include an image sensor (431) configured to convert an optical signal into an electrical signal (e.g., the image sensor (230) of FIG. 2). The sensor assembly (430) may include a connector (432) electrically connected to a processor (not shown) (e.g., the processor (120) of FIG. 1 and / or the image signal processor (260) of FIG. 2). The sensor assembly (430) may include a printed circuit board (433) configured to transmit an electrical signal from the image sensor (431) to the connector (432). The printed circuit board (433) may be electrically connected to the image sensor (431) and / or the connector (432). The printed circuit board (433) may include a flexible printed circuit board.

[0088] The camera module (400) may include a reflector (440) configured to reflect light. The reflector (440) may include an incident surface (440A) through which light is incident. For example, light passing through at least one first lens (421A) may pass through the incident surface (440A). The reflector (440) may include an exit surface (440B) through which light exits. For example, light passing through the exit surface (440B) may be directed toward at least one second lens (421B). The reflector (440) may include at least one reflective surface (440C) configured to reflect light passing through the incident surface (440A) toward the exit surface (440B). The incident surface (440A), the exit surface (440B), and the at least one reflective surface (440C) may substantially define an effective optical path of the reflector (440). In an embodiment not shown, the reflector (440) may include a mirror having a reflective surface (440C).

[0089] The camera module (400) may include an auto-focus (AF) actuator (450). The AF actuator (450) may implement an AF operation (e.g., movement in the X-axis direction) of the second lens assembly (420B). The AF actuator (450) may include an AF carrier (451) configured to carry a second lens housing (422B). In this document, the AF carrier (451) may also be referred to as a “lens carrier.” The AF carrier (451) may be sized and shaped to accommodate the second lens housing (422B). The AF carrier (451) may be disposed on the base frame (410A).

[0090] The AF actuator (450) may include at least one AF magnet (452), which may also be referred to as an “electromagnetic element.” The at least one AF magnet (452) may be disposed in an area of ​​the AF carrier (451), such as a + / -Y-direction side area or a recess thereof. The AF actuator (450) may include at least one AF coil (453), which may also be referred to as an “electromagnetic element.” The at least one AF coil (453) may be configured to electromagnetically couple with the at least one AF magnet (452). The at least one AF coil (453) may be disposed in an area of ​​the side housing frame (410B), such as a + / -Y-direction area. The at least one AF coil (453) may be disposed in an area of ​​the printed circuit board (480), such as a + / -Y-direction area.

[0091] The camera module (400) may include an optical image stabilization (OIS) actuator (460) (e.g., the image stabilizer (240) of FIG. 2). The OIS actuator (460) may rotate or tilt the reflector (440) about a pitch axis (e.g., the Y axis) and / or a yaw axis (e.g., the Z axis). The OIS actuator (460) may include an OIS carrier (461) configured to carry the reflector (440). The OIS carrier (461) may be sized and shaped to accommodate the reflector (440). The OIS carrier (461) may be disposed on the base frame (410A).

[0092] The OIS actuator (460) may include at least one first OIS magnet (462), which may also be referred to as an “electromagnetic element.” The at least one first OIS magnet (462) may be disposed in a first region of the OIS carrier (461), such as a substantially + / -Y-direction side region or a recess thereof. The OIS actuator (460) may include at least one first OIS coil (463), which may also be referred to as an “electromagnetic element.” The at least one first OIS coil (463) may be configured to electromagnetically couple with the at least one first OIS magnet (462). At least one first OIS coil (463) may be spaced apart in one direction (e.g., in the X-axis direction) from at least one AF coil (453) so as not to overlap with at least one AF magnet (452) and may be disposed in one area (e.g., in the + / -Y-axis area) of the side housing frame (410B). At least one first OIS coil (463) may be spaced apart in one direction (e.g., in the X-axis direction) from at least one AF coil (453) and may be disposed in one area (e.g., in the + / -Y-axis area) of the printed circuit board (480). The electromagnetic coupling between the first OIS magnet (462) and the first OIS coil (463) may implement rotation of the OIS carrier (461) about its yaw axis (e.g., in the Z-axis).

[0093] The OIS actuator (460) may include at least one second OIS magnet (464), which may also be referred to as an “electromagnetic element.” The OIS actuator (460) may include at least one second OIS coil (465), which may also be referred to as an “electromagnetic element.” The at least one second OIS coil (465) may be configured to electromagnetically couple with the at least one second OIS magnet (464). The at least one second OIS coil (465) may be disposed in an area (e.g., a +X-direction area) of the side housing frame (410B). The at least one second OIS coil (465) may be spaced apart in an area (e.g., in an X-axis direction) from the at least one AF coil (453) and disposed in an area (e.g., a +X-direction area) of the printed circuit board (480).

[0094] The camera module (400) may include a first guide (470). The first guide (470) may include a guide body (471) and at least one first guide ball (472). The first guide body (471) may include at least one first inner groove configured to at least partially receive the at least one first guide ball (472). For example, the first inner groove may extend along an inner surface of the first guide body (471) in a rotational direction about the Z-axis. The OIS carrier (461) may include at least one outer groove configured to at least partially receive the at least one first guide ball (472). The at least one outer groove of the OIS carrier (461) may extend along an outer surface of the OIS carrier (461) in a rotational direction about the Z-axis. The OIS carrier (461) may be configured to be in cloud contact with at least one first guide ball (472) and to rotate about the Z-axis by the first guide body (471).

[0095] The camera module (400) may include a second guide (473). It may include a second guide body (474) and at least one second guide ball (475). The first guide body (471) may include at least one first outer groove configured to receive at least one second guide ball (475), and the second guide body (474) may include at least one second inner groove configured to receive at least one second guide ball (475). For example, the at least one first outer groove may extend along an outer surface of the first guide body (471) in a rotational direction about the Y-axis, and the at least one second inner groove may extend along an inner surface of the second guide body (474) in a rotational direction about the Y-axis. The first guide body (471) is disposed between the OIS carrier (461) and the second guide body (474), and the second guide body (474) can be disposed in an area (e.g., a +X direction area) of the side housing frame (410B). The first guide body (471) can be configured to be in cloud contact with at least one second guide ball (475) and to rotate about the Y axis. The second guide body (474) can be fixed to the side housing frame (410B).

[0096] The camera module (400) may include a printed circuit board (480). The printed circuit board (480) may provide electrical connections to at least one AF coil (453), at least one first OIS coil (463), and at least one second OIS coil (465). The coils may be disposed on the printed circuit board (480). The printed circuit board (480) may include a flexible printed circuit board. The printed circuit board (480) may surround the side housing frames (410B).

[0097] The camera module (400) may include at least one stopper (485). The stopper (485) may reduce or prevent the second lens assembly (420B) from moving beyond a predetermined range of movement in the Z-axis direction due to external impact. The stopper (485) may be positioned between the camera cover (411) and the second lens housing (422B).

[0098] The camera module (400) may include a first baffle (490A). The first baffle (490A), which may also be referred to as a "light blocking member," may be configured to control the flow of light. The first baffle (490A) may reduce or suppress optical system disturbances caused by stray light in the camera module (400).

[0099] The first baffle (490A) may include a base (491A) and a plurality of first walls (W1) disposed on the base (491A). The plurality of first walls (W1) may be disposed on one surface (e.g., the -Z direction surface) of the base (491A). The plurality of first walls (W1) may have a first wall surface (T11) forming a first angle (a11) with respect to the one surface (e.g., the -Z direction surface) of the base (491A), and a second wall surface (T12) forming a second angle (a12) with respect to the one surface (e.g., the -Z direction surface) of the base (491A). A size of the first angle (a11) may be greater than a size of the second angle (a12). For example, the first angle (a11) may be substantially about 90 degrees, and the second angle (a12) may be an angle greater than 0 and less than about 90 degrees. Each second wall surface (T12) of the plurality of first walls (W1) may be oriented in a direction toward the image sensor (431). The plurality of first walls (W1) may be arranged on the base (491A) between one edge (e.g., an edge proximal to the second lens (421B)) and an opposite edge (e.g., an edge distal to the second lens (421B)).

[0100] At least a portion of the second wall surface (T12) may include a corrosion region. For example, the corrosion region may be formed by a laser. At least a portion of the second wall surface (T12) may include a substantially matte region. The second wall surface (T12) may induce scattering of light reflected by the second wall surface (T12).

[0101] The first baffle (490A) may include at least one engagement tab (492A) configured to engage with the AF carrier (451). The engagement tab (492A) may protrude in a specific direction (e.g., the -Z direction) from a side edge of the base (491A).

[0102] The camera module (400) may include a second baffle (490B). The second baffle (490B), which may also be referred to as a "light blocking member," may be configured to control the flow of light. The second baffle (490B) may reduce or suppress optical system disturbances caused by stray light in the camera module (400).

[0103] The second baffle (490B) may include a plurality of second walls (W2). The plurality of second walls (W2) may be arranged on the base frame (410A) between the second lens (421B) and the image sensor (431). The plurality of second walls (W2) may have a third wall surface (T21) forming a third angle (a21) with respect to one side (e.g., a +Z direction surface) of the base frame (410A), and a fourth wall surface (T22) forming a fourth angle (a22) with respect to one side (e.g., a +Z direction surface) of the base frame (410A). The size of the third angle (a21) may be greater than the size of the fourth angle (a22). For example, the third angle (a21) may be substantially about 90 degrees, and the fourth angle (a22) may be an angle greater than 0 and less than about 90 degrees. Each fourth wall surface (T22) of the plurality of second walls (W2) may be oriented in a direction toward the image sensor (431).

[0104] At least a portion of the fourth wall surface (T22) may include a corrosion region. For example, the corrosion region may be formed by a laser. At least a portion of the fourth wall surface (T22) may include a substantially matte region. The fourth wall surface (T22) may induce scattering of light reflected by the fourth wall surface (T22).

[0105] The second baffle (490B) can be seamlessly formed as an integral part with the base frame (410A). For example, the second baffle (490B) and the base frame (410A) can be manufactured as a single component by insert injection molding.

[0106] The second baffle (490B) may be placed between the second lens (421B) and the image sensor (431). A flare phenomenon that may occur due to stray light between the image sensor (431) placed in the camera housing (410) at a fixed position and the second lens (421B) moving in a specific direction (e.g., in the X-axis direction) with respect to the camera housing (410) may be suppressed.

[0107] The first baffle (490A) and the second baffle (490B) may be arranged substantially parallel to each other. The first baffle (490A) and the second baffle (490B) may be arranged opposite to each other with respect to the optical axis (OA). For example, the first baffle (490A) may be positioned on a first side (e.g., the +Z direction side) with respect to the second lens (421B), and the second baffle (490B) may be positioned on a second side (e.g., the -Z direction side) opposite to the first side with respect to the second lens (421B). The first baffle (490A) may be oriented in a first direction (e.g., the -Z direction), and the second baffle (490B) may be oriented in a second direction (e.g., the +Z direction) opposite to the first direction. This arrangement of the first baffle (490A) and the second baffle (490B) can effectively prevent the flare phenomenon by substantially suppressing stray light in both directions.

[0108] The first baffle (490A) and the second baffle (490B) can be separated from each other. The separation structure of the baffles can be advantageous in manufacturing the component compared to a structure (e.g., a frame structure) in which only one of the first baffle (490A) and the second baffle (490B) is applied.

[0109] The first baffle (490A) and the second baffle (490B) may at least partially overlap each other. For example, as illustrated in FIG. 8A, when the distance between the second lens assembly (420B) and the image sensor (431) is a first distance (e.g., during macro photography), the first baffle (490A) and the second baffle (490B) may have an overlapping area having a first size when viewed in a direction substantially orthogonal to the optical axis (OA) (e.g., in the Z-axis direction). As illustrated in FIG. 8B, when the distance between the second lens assembly (420B) and the image sensor (431) is a second distance smaller than the first distance (e.g., during infinity shooting), the first baffle (490A) and the second baffle (490B) may have an overlapping area having a second size larger than the first size when viewed in a direction substantially orthogonal to the optical axis (OA) (e.g., in the Z-axis direction). The size of the overlapping area between the first baffle (490A) and the second baffle (490B) may vary depending on the movement of the AF carrier (451) in the AF stroke direction (e.g., in the X-axis direction). At a specific stroke position of the AF carrier (451), the size of the overlap area between the first baffle (490A) and the second baffle (490B) may be substantially close to 0, or no overlap may occur between the first baffle (490A) and the second baffle (490B). The overlap structure of the baffles (490A, 490B) may reduce or suppress flare that may occur on both sides (e.g., the first side (or +Z direction side) and the second side (or -Z direction side)) with respect to the image sensor (431).

[0110] The size of at least one first wall (W1) among the plurality of first walls (W1) may be smaller than the size of at least one second wall (W2) among the plurality of second walls (W2). For example, the height of the first wall (W1) with respect to one side (e.g., the -Z direction side) of the base (491A) may be smaller than the height of the second wall (W2) with respect to one side (e.g., the +Z direction side) of the base frame (410A).

[0111] The surface area occupied by the first baffle (490A) on the base (491A) may be smaller than the surface area occupied by the second baffle (490B) on the base frame (410A). By utilizing the available space between the second lens (421B) and the image sensor (431) as much as possible, the flare phenomenon that may occur between them due to stray light can be effectively suppressed.

[0112] The angle of each inclined surface of the plurality of first walls (W1) may be substantially the same as the angle of each inclined surface of the plurality of second walls (W2). The angle of at least some of the inclined surfaces of the plurality of first walls (W1) may be different (e.g., may be smaller or larger) from the angle of at least some of the inclined surfaces of the plurality of second walls (W2).

[0113] The size of at least one first wall (W1) may be smaller than the size of at least one second wall (W2). For example, the area of ​​the first wall surface (T11) may be smaller than the area of ​​the third wall surface (T21), and the area of ​​the second wall surface (T12) may be smaller than the area of ​​the fourth wall surface (T22).

[0114] A first distance between adjacent first walls (W1) among a plurality of first walls (W1) may be smaller than a second distance between adjacent second walls (W2) among a plurality of second walls (W2).

[0115] In an embodiment not shown, at least one first wall (W1) and / or at least one second wall (W2) may have a cross-section that is substantially trapezoidal in shape. This allows the molded resin to be smoothly extracted from the mold without substantial damage to the first wall (W1) and the second wall (W2) during the manufacturing (e.g., injection molding) of the first baffle (490A) and the second baffle (490B).

[0116] In an embodiment not shown, the camera module (400) may include a plurality of first baffles (490A). In an embodiment not shown, the camera module (400) may include a plurality of second baffles (490B).

[0117] In an embodiment not shown, the camera module (400) may include one or more baffles and / or blocking walls (e.g., blocking walls (423B)) positioned between the first lens assembly (420A) and the second lens assembly (420B).

[0118] FIG. 10A is a plan view of a camera module according to one embodiment. FIG. 10B is a bottom view of a baffle according to one embodiment. FIG. 10C is an enlarged view of a portion 10C of the baffle of FIG. 10B according to one embodiment.

[0119] Referring to FIGS. 10A to 10C, a camera module (400-1) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, and / or the camera module (400) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C) may include a second lens assembly (420B), an AF carrier (451), a first baffle (490A-1) (e.g., the first baffle (490A) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C), and a second baffle (490B). The first baffle (490A-1) may include a base (491A-1) (e.g., the base (491A) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C). The first baffle (490A-1) may include a plurality of interlocking tabs (492A) (e.g., the interlocking tabs (492A) of FIG. 7). The first baffle (490A-1) may include a plurality of first walls (W1).

[0120] The AF carrier (451) may include a first region (A1) and a second region (A2) that are separated from each other. The first region (A1) and the second region (A2) may be at least partially defined by a base surface (e.g., a base surface (451A) of FIG. 13) and side walls (e.g., a side wall (451B) of FIG. 13) of the AF carrier (451).

[0121] The AF carrier (451) may include a partition (P) separating the first area (A1) and the second area (A2). The partition (P) may function as a bridge connecting the side walls of the AF carrier (451). The partition (P) may be spaced apart from the base surface of the AF carrier (451).

[0122] The second lens assembly (420B) may be disposed in the first area (A1). The second lens housing (422B) may be disposed close to the partition (P) to define a reduced first gap (G1) between the second lens housing (422B) and the partition (P). In an embodiment not shown, the second lens housing (422B) may at least partially contact the partition (P) such that no gap is formed between the second lens housing (422B) and the partition (P). A narrower gap between the second lens housing (422B) and the partition (P) may reduce unwanted light propagation therebetween.

[0123] The first baffle (490A-1) may be positioned in the second region (A2). The base (491A-1) may be positioned close to the partition (P) to define a reduced second gap (G2) between the base (491A-1) and the partition (P). In an embodiment not shown, the base (491A-1) may at least partially contact the partition (P) such that no gap is formed between the base (491A-1) and the partition (P). A narrower gap between the base (491A-1) and the partition (P) may reduce unwanted light propagation therebetween.

[0124] The base (491A-1) may include a first portion (B1) connected to side walls of the AF carrier (451). The first portion (B1) may have a first width (e.g., a dimension in the Y-axis direction) and a first length (e.g., a dimension in the X-axis direction). The base (491A-1) may include a second portion (B2) seamlessly and integrally connected to the first portion (B1). The second portion (B2) may have a shape corresponding to a shape of the partition (P). The second portion (B2) may have a second width (e.g., a dimension in the Y-axis direction) that is smaller than the first width and a second length (e.g., a dimension in the X-axis direction) that is smaller than the first length. The second portion (B2) may have a second width that is variable (e.g., decreasing) along the second length. The second gap (G2) can be defined as the distance between the second portion (B2) and the partition (P).

[0125] The plurality of first walls (W1) may include a plurality of first wall elements (W11). The plurality of first wall elements (W11) may be arranged in a specific direction (e.g., in the X-axis direction) on one side (e.g., in the -Z-direction side) of the first portion (B1). The plurality of first wall elements (W11) may have substantially the same length (e.g., in the Y-axis direction). The spacing between adjacent pairs of first wall elements (W11) may be substantially the same as the spacing between adjacent pairs of first wall elements (W11).

[0126] The plurality of first walls (W1) may include at least one second wall element (W12). The at least one second wall element (W12) may be arranged on one side (e.g., the -Z-direction side) of the second portion (B2). The at least one second wall element (W12) may be arranged close to any one of the first wall elements (W11). The length (e.g., the Y-direction dimension) of the at least one second wall element (W12) may be less than the length (e.g., the Y-direction dimension) of any one of the first wall elements (W11).

[0127] The plurality of first walls (W1) may include at least one third wall element (W13). The at least one third wall element (W13) may be disposed on one side (e.g., the -Z-direction side) of the second portion (B2). The at least one third wall element (W13) may be disposed close to at least one second wall element (W12). The at least one second wall element (W12) may be disposed between the first wall element (W11) and the third wall element (W13). The distance between the first wall element (W11) and the second wall element (W12) may be substantially equal to the distance between the second wall element (W12) and the third wall element (W13). The length (e.g., the Y-direction dimension) of the at least one third wall element (W13) may be less than the length (e.g., the Y-direction dimension) of any one of the first wall elements (W11). The length (e.g., the Y-direction dimension) of at least one third wall element (W13) may be greater than the length (e.g., the Y-direction dimension) of at least one second wall element (W12).

[0128] The first baffle (490A-1) may include a plurality of protrusions (PT). The first wall element (W11), the second wall element (W12), and the third wall element (W13) may be implemented as protrusions (PT). The protrusions (PT) may protrude in one direction (e.g., in the -Z direction) of the first baffle (490A-1). The protrusions (PT) may have an apex having a substantially curved surface. The protrusions (PT) may have a width that decreases toward the apex in one direction (e.g., in the -Z direction) of the first baffle (490A-1). At least one of the first wall element (W11), the second wall element (W12), or the third wall element (W13) may have a designated shape (e.g., a sawtooth shape) at its distal end.

[0129] The first baffle (490A-1) may include a plurality of recesses (R). The recesses (R) may be recessed into the first baffle (490A-1) in a direction (e.g., +Z direction) opposite to the protrusion direction (e.g., -Z direction) of the protrusions (PT). One recess (R) may be formed between a pair of adjacent protrusions (PT).

[0130] Fig. 11 is a cross-sectional view of a camera module according to one embodiment.

[0131] Referring to FIG. 11, a camera module (400-2) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 7, FIGS. 8A, 8B, 9A, 9B, and 9C, and / or the camera module (400-1) of FIGS. 10A to 10C) may include a camera housing (410), a camera cover (411), a first lens assembly (420A), a second lens assembly (420B), an image sensor (431), and an AF carrier (451).

[0132] The camera module (400-2) may include a first reflector (440A) configured to reflect light passing through the first lens assembly (420A) to the second lens assembly (420B) (e.g., the reflector (440) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C). The first reflector (440A) may be disposed between the first lens assembly (420A) and the second lens assembly (420B).

[0133] The camera module (400-2) may include a second reflector (440B) configured to reflect light passing through the second lens assembly (420B) to the image sensor (431) (e.g., the reflector (440) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C). The second reflector (440B) may be disposed between the second lens assembly (420B) and the image sensor (431).

[0134] The optical axis (OA) may be defined as an optical path leading to the first lens assembly (420A), the first reflector (440A), the second lens assembly (420B), the second reflector (440B), and the image sensor (431).

[0135] The camera module (400-2) may include a first baffle (490A) disposed between the second lens assembly (420B) and the second reflector (440B) and disposed on the AF carrier (451). The camera module (400-2) may include a second baffle (490B) disposed between the second lens assembly (420B) and the second reflector (440B) and disposed on the camera housing (410). The first baffle (490A) and the second baffle (490B) may be disposed substantially parallel to each other on an optical path defined by an optical axis (OA). The first baffle (490A) and the second baffle (490B) may reduce or prevent flare that may occur in an image by substantially blocking an unwanted optical path between the second lens assembly (420B) and the second reflector (440B).

[0136] Figure 12 is a cross-sectional view of a camera module according to one embodiment.

[0137] Referring to FIG. 12, a camera module (400-3) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, the camera modules (400) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C, the camera modules (400-1) of FIGS. 10A to 10C, and / or the camera module (400-2) of FIG. 11) may include a camera housing (410), a camera cover (411), a first lens assembly (420A), a second lens assembly (420B), an image sensor (431), a reflector (440), and an AF carrier (451). The optical axis (OA) can be defined as the optical path leading to the first lens assembly (420A), the reflector (440), the second lens assembly (420B), and the image sensor (431).

[0138] The camera module (400-3) may include a first baffle (490A) including a plurality of first walls (W1). The first baffle (490A) may be disposed on the AF carrier (451).

[0139] The camera module (400-3) may include a second baffle (490B) including a plurality of second walls (W2). The second baffle (490B) may be arranged on a camera cover (411) (e.g., a shield can). The plurality of second walls (W2) may be arranged on one surface (e.g., a -Z-direction surface) of the top frame (411A).

[0140] In one embodiment, the second baffle (490B) may be seamlessly formed as one piece with the top frame (411A). For example, the second baffle (490B) and the top frame (411A) may be manufactured as a single component by insert molding.

[0141] In one embodiment, the second baffle (490B) may be bonded to the top frame (411A) as a separate component. For example, the second baffle (490B) may be manufactured separately from the top frame (411A) and bonded to the top frame (411A).

[0142] FIG. 13 is a perspective view of a carrier in a camera module according to one embodiment.

[0143] Referring to FIG. 13, a camera module (400-4) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C, the camera module (400-1) of FIGS. 10A to 10C, the camera module (400-2) of FIG. 11, and / or the camera module (400-3) of FIG. 12) may include an AF carrier (451). The AF carrier (451) may include a base surface (451A) and a plurality of side walls (451B). The AF carrier (451) may include a partition (P) separating a first area (A1) and a second area (A2).

[0144] The camera module (400-4) may include a first baffle (490A-4) (e.g., the first baffle (490A) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C, the first baffle (490A-1) of FIGS. 10A to 10C, the first baffle (490A) of FIG. 11, and / or the first baffle (490A) of FIG. 12). The first baffle (490A-4) may include a base (491A-4) (e.g., base (491A) of FIGS. 5-7, 8A, 8B, 9A, 9B, and 9C) and a plurality of interlocking tabs (492A-4) (e.g., interlocking tabs (492A) of FIGS. 5-7, 8A, 8B, 9A, 9B, and 9C). The plurality of interlocking tabs (492A-4) may be coupled to the side walls (451B). The first baffle (490A-4) may be positioned in the second region (A2).

[0145] The camera module (400-4) may include a second baffle (490B-4) (e.g., the second baffle (490B) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C, the second baffle (490B) of FIGS. 10A to 10C, the second baffle (490B) of FIG. 11, and / or the second baffle (490B) of FIG. 12). The second baffle (490B-4) may be disposed on the base surface (451A). The second baffle (490B-4) may be seamlessly formed integrally with the base surface (451A). The second baffle (490B-4) may be located in the second area (A2).

[0146] FIG. 14 is a perspective view of a carrier in a camera module according to one embodiment.

[0147] Referring to FIG. 14, a camera module (400-5) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C, the camera module (400-1) of FIGS. 10A to 10C, the camera module (400-2) of FIG. 11, the camera module (400-3) of FIG. 12, and / or the camera module (400-4) of FIG. 13) may include an AF carrier (451-5). The AF carrier (451-5) may include a base surface (451A-5) (e.g., the base surface (451A) of FIG. 13) and a plurality of side walls (451B). The AF carrier (451-5) may include a partition (P) separating a first area (A1) and a second area (A2). The base surface (451A-5) may be formed at least partially in the first area (A1).

[0148] The camera module (400-5) may include a plurality of baffles (490-5) (e.g., the first baffle (490A) of FIGS. 5 to 7, 8a, 8b, 9a, 9b, and 9c, the first baffle (490A-1) of FIGS. 10a to 10c, the first baffle (490A) of FIG. 11, the first baffle (490A) of FIG. 12, and / or the first baffle (490A-4) of FIG. 13). Each baffle (490-5) may include a base (491-5) (e.g., base (491A) of FIGS. 5-7, 8a, 8b, 9a, 9b, and 9c, and / or base (491A-4) of FIG. 13) and a plurality of interlocking tabs (492-5) (e.g., interlocking tabs (492A) of FIGS. 5-7, 8a, 8b, 9a, 9b, and 9c, and / or interlocking tabs (492A-4) of FIG. 13).

[0149] The plurality of baffles (490-5) may be arranged substantially parallel to each other. For example, the direction in which the plurality of walls (W) of one baffle (490-5) (e.g., the first wall (W1) of FIGS. 5 to 7, 8a, 8b, 9a, 9b, and 9c) face may be opposite to the direction in which the plurality of walls (W) of another baffle (490-5) face (e.g., the first wall (W1) of FIGS. 5 to 7, 8a, 8b, 9a, 9b, and 9c).

[0150] A plurality of baffles (490-5) may be positioned in the second region (A2). In one example, the base surface (451A-5) may not be formed in the second region (A2), but the plurality of baffles (490-5) positioned in the second region (A2) may block stray light that may occur in the second region (A2). The plurality of interlocking tabs (492-5) of one baffle (490-5) may be coupled to a first side (e.g., a +Z direction side) of the side walls (451B), and the plurality of interlocking tabs (492-5) of another baffle (490-5) may be coupled to a second side (e.g., a -Z direction side) of the side walls (451B) opposite to the first side.

[0151] The plurality of baffles (490-5) may have substantially the same shape, size, and / or material. For example, the plurality of baffles (490-5) may include a base (491-5) and a plurality of interlocking tabs (492-5) of the same shape, size, and / or material. The walls (W) of each of the plurality of baffles (490-5) may have the same shape, size, material, and / or arrangement spacing.

[0152] FIG. 15 is a perspective view of a carrier in a camera module according to one embodiment.

[0153] Referring to FIG. 15, a camera module (400-6) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 7, FIGS. 8A, 8B, 9A, 9B, and 9C, the camera module (400-1) of FIGS. 10A to 10C, the camera module (400-2) of FIG. 11, the camera module (400-3) of FIG. 12, the camera module (400-4) of FIG. 13, and / or the camera module (400-5) of FIG. 14) may include an AF carrier (451). The AF carrier (451) may include a base surface (451A-6) (e.g., the base surface (451A) of FIG. 13 and / or the base surface (451A-5) of FIG. 14) and a plurality of side walls (451B). The AF carrier (451) may include a partition (P) separating a first area (A1) and a second area (A2). The base surface (451A-6) may be formed at least partially in the first area (A1).

[0154] The camera module (400-6) may include a single baffle structure (490-6) in which a plurality of baffles (e.g., the first baffle (490A) of FIGS. 5 to 7, 8a, 8b, 9a, 9b, and 9c, the first baffle (490A-1) of FIGS. 10a to 10c, the first baffle (490A) of FIG. 11, the first baffle (490A) of FIG. 12, the first baffle (490A-4) of FIG. 13, and / or the baffle (490-5) of FIG. 14) are seamlessly formed integrally with each other. A single baffle structure (490-6) may include a plurality of bases (491-6) arranged opposite each other (e.g., bases (491A) of FIGS. 5 to 7, 8A, 8B, 9A, 9B, and 9C, bases (491A-4) of FIG. 13, and / or bases (491-5) of FIG. 14), and a plurality of interlocking sides (493-6) connecting the plurality of bases (491-6). The plurality of interlocking sides (493-6) may each be coupled to a corresponding plurality of side walls (451B). A plurality of walls (W) (e.g., the first wall (W1) of FIGS. 5-7, 8A, 8B, 9A, 9B, and 9C, and / or the wall (W) of FIG. 14) may be formed on each base (491-6). In one embodiment, the plurality of walls (W) may not be formed on the engaging sides (493-6). In one embodiment, the plurality of walls (W) may be formed on the engaging sides (493-6). In one embodiment, the base face (451A-6) may not be formed on the second region (A2), but a single baffle structure (490-6) positioned in the second region (A2) may block stray light that may occur in the second region (A2).

[0155] Fig. 16 is a cross-sectional view of a camera module according to one embodiment.

[0156] Referring to FIG. 16, a camera module (400-7) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 7, FIGS. 8A, 8B, 9A, 9B, and 9C, the camera module (400-1) of FIGS. 10A to 10C, the camera module (400-2) of FIG. 11, the camera module (400-3) of FIG. 12, the camera module (400-4) of FIG. 13, the camera module (400-5) of FIG. 14, and / or the camera module (400-6) of FIG. 15) comprises a camera housing (410), a camera cover (411), a first lens assembly (420A), a second lens assembly (420B), an image The camera module (400-7) may include a sensor (431), a reflector (440), an AF carrier (451), a first baffle (490A), and a second baffle (490B). An optical axis (OA) may be defined as an optical path leading to the first lens assembly (420A), the reflector (440), the second lens assembly (420B), and the image sensor (431). The first baffle (490A) may be disposed on a top frame (411A) of the camera cover (411). The second baffle (490B) may be disposed on a base frame (410A) of the camera housing (410) substantially parallel to the first baffle (490A). In an embodiment not shown, the camera module (400-7) may include at least one baffle or a single baffle structure disposed on the AF carrier (451).

[0157] Fig. 17 is a cross-sectional view of a camera module according to one embodiment. Fig. 18 is a cross-sectional view of a baffle according to one embodiment. Fig. 19 is a cross-sectional view of a baffle according to one embodiment.

[0158] Referring to FIGS. 17 to 19, a camera module (400-8) (e.g., the camera module (180) of FIGS. 1 and 2, the second camera module (380B) and / or the third camera module (380D) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 7, 8a, 8b, 9a, 9b, and 9c, the camera module (400-1) of FIGS. 10a to 10c, the camera module (400-2) of FIG. 11, the camera module (400-3) of FIG. 12, the camera module (400-4) of FIG. 13, the camera module (400-5) of FIG. 14, the camera module (400-6) of FIG. 15, and / or the camera module (400-7) of FIG. 16) comprises a camera housing (410), a camera cover (411), and a first lens. It may include an assembly (420A), a second lens assembly (420B), an image sensor (431), a reflector (440), an AF carrier (451), a first baffle (490A), and a second baffle (490B). The optical axis (OA) may be defined as an optical path leading to the first lens assembly (420A), the reflector (440), the second lens assembly (420B), and the image sensor (431).

[0159] The first baffle (490A) may include a plurality of first walls (W1). The second baffle (490B) may include a plurality of second walls (W2).

[0160] The first baffle (490A) may be disposed on the AF carrier (451). The first baffle (490A) may be positioned outside the effective optical path of the second lens assembly (420B) and outside the effective optical path area of ​​the image sensor (431). The second baffle (490B) may be disposed on the base frame (410A) of the camera housing (410) substantially parallel to the first baffle (490A).

[0161] As illustrated in FIG. 18, when the walls (W) (e.g., the first wall (W1) and / or the second wall (W2)) of the baffles (490) (e.g., the first baffle (490A) and / or the second baffle (490B)) have a relatively large height, the spacing between adjacent walls (W) may increase compared to the case where the walls (W) have a relatively small height (e.g., see FIG. 19). On the other hand, as illustrated in FIG. 19, when the walls (W) have a relatively small height, the number of walls (W) may increase and the spacing between adjacent walls (W) may decrease compared to the case where the walls (W) have a relatively large height (e.g., see FIG. 18). In this way, the height of the walls (W) may be inversely proportional to the number of walls (W).

[0162] Referring again to FIG. 17, the height of the camera module (400-8) may be defined by the sum of the distance (H1) between the optical axis (OA) and the top frame (411A) and the distance (H2) between the optical axis (OA) and the base frame (410A). The height of the effective optical path area of ​​the lens of the second lens assembly (420B) (e.g., Z-direction dimension) and the height of the effective optical path area of ​​the image sensor (431) (e.g., Z-direction dimension) may be substantially symmetrical with respect to the optical axis (OA).

[0163] Meanwhile, in the camera module (400-8), the portion corresponding to the distance (H1) and the portion corresponding to the distance (H2) may not be symmetrical with respect to the optical axis (OA). In an embodiment where the distance (H1) is smaller than the distance (H2), the first baffle (490A) is arranged in a relatively small space and the second baffle (490B) is arranged in a relatively large space. Therefore, in order to block an optical path that may cause a flare phenomenon, the height of the first wall (W1) may be smaller than the height of the second wall (W2), the distance between adjacent first walls (W1) may be smaller than the distance between adjacent second walls (W2), and the number of first walls (W1) may be greater than the number of second walls (W2). However, without being limited to the illustrated embodiment, depending on the arrangement structure of the camera module (400-8), the height of the first wall (W1) may be substantially equal to or greater than the height of the second wall (W2), the spacing between adjacent first walls (W1) may be substantially equal to or greater than the spacing between adjacent second walls (W2), and the number of first walls (W1) may be equal to or less than the number of second walls (W2).

[0164] In the embodiments illustrated in FIGS. 18 and 19, the height of at least one first wall (W1) among the plurality of first walls (W1) may be different from the height of at least one other first wall (W1). The height of at least one second wall (W2) among the plurality of second walls (W2) may be different from the height of at least one other second wall (W2). In embodiments not illustrated, the plurality of first walls (W1) may have substantially the same height. The plurality of second walls (W2) may have substantially the same height.

[0165] Meanwhile, any embodiment of a baffle described in this document may be combined with any embodiment of another baffle described in this document. For example, an embodiment of an AF carrier (451) including a plurality of baffles (490A-4, 490B-4; 490-5; 490-6) illustrated in FIGS. 13 to 15 and a camera module including a plurality of baffles (490A, 490B) illustrated in FIG. 16 are possible.

[0166] One aspect of the disclosure may provide a camera module and an electronic device including the same that reduces or suppresses flare.

[0167] A camera module (400) may include a housing (410), a lens carrier (451) configured to carry the lens (421B) along an optical axis (OA) of the lens (421B), and an image sensor (431) configured to receive light passing through the lens (421B). The camera module (400) may include a first baffle (490A) disposed on a portion of the lens carrier (451). The camera module (400) may include a second baffle (490B). The second baffle (490B) may be disposed parallel to the first baffle (490A). The second baffle (490B) may be disposed on an inner portion of the housing (410) between the lens (421B) and the image sensor (431).

[0168] The first baffle (490A) may be positioned on the portion of the lens carrier (451). The first baffle (490A) may face the second baffle (490B).

[0169] The first baffle (490A) may include a plurality of first walls (W1). The second baffle (490B) may include a plurality of second walls (W2).

[0170] The size of at least one first wall (W1) among the plurality of first walls (W1) may be smaller than the size of at least one second wall (W2) among the plurality of second walls (W2).

[0171] A first distance between adjacent first walls (W1) among the plurality of first walls (W1) may be smaller than a second distance between adjacent second walls (W2) among the plurality of second walls (W2).

[0172] One of the plurality of first walls (W1) may be longer than another one of the plurality of first walls (W1).

[0173] At least one of the first walls (W1) or the second walls (W2) may include a plurality of protrusions (PT) on the top side of the first walls (W1) or the second walls (W2).

[0174] At least a section of the first wall (W1) of the first walls may be substantially triangular, having a first side facing the lens (421B), a second side facing the image sensor (431), and a bottom side. A first angle between the first side and the bottom side may be greater than a second angle between the second side and the bottom side.

[0175] The surface area of ​​the first baffle (490A) may be smaller than the surface area of ​​the second baffle (490B).

[0176] The first baffle (490A) may at least partially overlap the second baffle (490B) when viewed in a direction substantially orthogonal to the optical axis (OA) of the lens (421B).

[0177] The camera module (400) may include an additional lens (421A). The camera module (400) may include a third baffle positioned between the lens (421B) and the additional lens (421A).

[0178] The camera module (400) may include a first reflector (440A) disposed between the additional lens (421A) and the lens (421B). The additional lens (421A) may be disposed on an outer portion of the housing (410). A portion of the optical axis (OA) of the additional lens (421A) may be substantially orthogonal to a portion of the optical axis (OA) of the lens (421B).

[0179] The camera module (400) may include a second reflector (440B) disposed between the lens (421B) and the image sensor (431). The image sensor (431) and the second baffle (490B) may be disposed on the same side of the housing (410). A portion of the optical axis (OA) of the lens (421B) may be parallel to the image sensor (431).

[0180] The lens carrier (451) may include a first area (A1) in which the lens (421B) is placed. The lens carrier (451) may include a second area (A2) in which the first baffle (490A-1) is placed. The lens carrier (451) may include a partition (P) that separates the first area (A1) and the second area (A2).

[0181] The first baffle (490A-1) may extend toward the partition (P). The first baffle (490A-1) may form a reduced gap (G2) between the first baffle (490A-1) and the partition (P). The first baffle (490A-1) may not form substantially any gap between the first baffle (490A-1) and the partition (P).

[0182] The above housing (410) may include a shield can. The second baffle (490B) may be disposed on an inner portion of the shield can.

[0183] The above camera module (400-4) may include a fourth baffle (490B-4) arranged on another portion of the lens carrier (451) opposite to the first baffle (490A-4).

[0184] The first baffle (490A-4) and the fourth baffle (490B-4) may be substantially the same in shape, size and / or material.

[0185] The camera module (400) may include a fifth baffle (490A) positioned on another inner portion of the housing (410) opposite to the second baffle (490B).

[0186] The camera module (400) may include an additional lens (421A), a reflector (440) configured to reflect light passing through the additional lens (421A) toward the lens (421B), and a blocking wall (423B) configured to block light passing through the additional lens (421A) from passing between the reflector (440) and the lens (421B).

[0187] The electronic device (301) may include a camera module (400).

[0188] According to one embodiment, flare can be reduced or suppressed without increasing the size of the camera module. The effects of the camera module and the electronic device including the same according to the embodiments are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description herein.

[0189] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications may be made to the details of the disclosure, including those included within the scope of the appended claims and their equivalents. Any of the embodiments described herein may be used in combination with any of the embodiments described herein.

Claims

1. Housing (410), A lens carrier (451) configured to transport the lens (421B) along the optical axis (OA) of the lens (421B); An image sensor (431) configured to receive light passing through the above lens (421B), A first baffle (490A) arranged on a part of the above lens carrier (451), and A second baffle (490B) arranged parallel to the first baffle (490A) and arranged on the inner part of the housing (410) between the lens (421B) and the image sensor (431). A camera module (400) including:

2. In paragraph 1, A camera module in which the first baffle (490A) is positioned on the portion of the lens carrier (451) so that the first baffle (490A) faces the second baffle (490B).

3. In paragraph 1 or 2, A camera module wherein the first baffle (490A) includes a plurality of first walls (W1), and the second baffle (490B) includes a plurality of second walls (W2).

4. In paragraph 3, The size of at least one first wall (W1) among the plurality of first walls (W1) is smaller than the size of at least one second wall (W2) among the plurality of second walls (W2), Preferably, the first distance between adjacent first walls (W1) among the plurality of first walls (W1) is smaller than the second distance between adjacent second walls (W2) among the plurality of second walls (W2), Preferably, a camera module wherein one of the plurality of first walls (W1) is longer than another one of the plurality of first walls (W1).

5. In paragraph 3 or 4, A camera module, wherein at least one of the first walls (W1) or the second walls (W2) comprises a plurality of protrusions (PT) on a top side of the first walls (W1) or the second walls (W2).

6. In any one of paragraphs 3 to 5, A camera module wherein at least a section of a first wall of the first walls (W1) is substantially triangular, having a first side facing the lens (421B), a second side facing the image sensor (431), and a bottom side, and a first angle between the first side and the bottom side is greater than a second angle between the second side and the bottom side.

7. In any one of paragraphs 1 to 6, A camera module wherein the surface area of ​​the first baffle (490A) is smaller than the surface area of ​​the second baffle (490B).

8. In any one of paragraphs 1 to 7, A camera module in which the first baffle (490A) at least partially overlaps the second baffle (490B) when viewed in a direction substantially orthogonal to the optical axis (OA) of the lens (421B).

9. In any one of paragraphs 1 to 8, Additional lens (421A), and A third baffle positioned between the above lens (421B) and the additional lens (421A) Including, Preferably, the additional lens (421A) and the lens (421B) further include a first reflector (440A) disposed between the additional lens (421A) and the lens (421B), wherein the additional lens (421A) is disposed on an outer portion of the housing (410), and a portion of the optical axis (OA) of the additional lens (421A) is substantially orthogonal to a portion of the optical axis (OA) of the lens (421B), Preferably, the camera module further includes a second reflector (440B) disposed between the lens (421B) and the image sensor (431), wherein the image sensor (431) and the second baffle (490B) are disposed on the same side of the housing (410) such that a portion of the optical axis (OA) of the lens (421B) is parallel to the image sensor (431).

10. In any one of paragraphs 1 to 9, The above lens carrier (451) is The first area (A1) where the above lens (421B) is placed; A second area (A2) in which the first baffle (490A-1) is arranged, and A partition (P) separating the first area (A1) and the second area (A2) Including, Preferably, the first baffle (490A-1) extends toward the partition (P) to form a reduced gap (G2) between the first baffle (490A-1) and the partition (P), or the camera module forms substantially no gap between the first baffle (490A-1) and the partition (P).

11. In any one of paragraphs 1 to 10, The above housing (410) includes a shield can, and the second baffle (490B) is a camera module arranged on the inner part of the shield can.

12. In any one of paragraphs 1 to 11, Further comprising a fourth baffle (490B-4) arranged on another part of the lens carrier (451) opposite to the first baffle (490A-4), Preferably, the first baffle (490A-4) and the fourth baffle (490B-4) are a camera module having substantially the same shape, size and / or material.

13. In any one of paragraphs 1 to 12, A camera module further comprising a fifth baffle (490A) disposed on another inner portion of the housing (410) opposite to the second baffle (490B).

14. In any one of paragraphs 1 to 13, Additional lens (421A), A reflector (440) configured to reflect light passing through the additional lens (421A) toward the lens (421B), and A blocking wall (423B) configured to block light passing through the additional lens (421A) from passing between the reflector (440) and the lens (421B). A camera module further comprising:

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