Fingerprint module and electronic device

Abstract

Provided in the embodiments of the present application are a fingerprint module and an electronic device. The fingerprint module comprises an ultrasonic sensor which comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, a second electrode layer being provided on the substrate, one side of the acoustic layer being electrically connected to the second electrode layer, the other side of the acoustic layer being electrically connected to one side of the first electrode layer, and the protective layer covering the other side of the first electrode layer; a first electric connection area is provided on the substrate, the first electrode layer and the second electrode layer being electrically connected to the first electric connection area separately; a second electric connection area is provided on a circuit board, the first electric connection area being electrically connected to the second electric connection area by means of a conductive bonding layer; the circuit board is electrically connected to a processing unit outside the fingerprint module, the acoustic layer is used for transmitting an ultrasonic signal and receiving an ultrasonic signal reflected by an external structure, and the ultrasonic sensor is used for converting the ultrasonic signal received by the acoustic layer into an electric signal and sending the electric signal to the processing unit by means of the circuit board. The fingerprint module has relatively high applicability.

Description

Fingerprint modules and electronic devices

[0001] This application claims priority to the utility model application with an application date of September 12, 2023, application number "202322483086.5", and patent name "Fingerprint module and electronic device", as well as the utility model application with an application date of September 12, 2023, application number "202322483116.2", and patent name "Fingerprint module and electronic device", and the utility model application with an application date of September 12, 2023, application number "202322492295.6", and patent name "Fingerprint module and electronic device", and all of their contents are hereby incorporated by reference. Technical Field

[0002] The embodiments of the present application relate to the technical field of fingerprint modules, and in particular to a fingerprint module and an electronic device. Background Art

[0003] With the development of the consumer electronics industry, including but not limited to the trend towards full-screen displays in mobile communication devices, consumer demand for under-screen fingerprint recognition technology has continued to increase. There are two main publicly available under-screen fingerprint recognition solutions: the first is optical and the second is ultrasonic. The performance of optical fingerprint modules is significantly affected by the screen's light transmittance. With the increasing complexity of internal display wiring and the development of flexible screen solutions, the screen's optical transmittance has decreased, resulting in the optical fingerprint solution no longer being able to meet application requirements. Ultrasonic fingerprint modules, on the other hand, do not rely on the screen's optical transmittance and are a better alternative.

[0004] The ultrasonic sensor pixel circuit in the existing ultrasonic fingerprint solution is formed on a glass substrate using a thin film transistor process.

[0005] However, due to the low pixel integration, poor stability and poor driving performance of ultrasonic sensors made by thin-film transistor technology, the size of ultrasonic sensors is large, resulting in the ultrasonic fingerprint module occupying a large space and failing to meet the space utilization requirements of mobile terminals. Therefore, a new technical solution for ultrasonic fingerprint modules is needed to meet the current application needs of under-screen fingerprint recognition.

[0006] Summary of the Invention

[0007] In view of this, embodiments of the present application provide a fingerprint module and an electronic device to at least partially solve the above problems.

[0008] According to a first aspect of an embodiment of the present application, a fingerprint module is provided, comprising: an ultrasonic sensor and a circuit board; the ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, a second electrode layer is provided on the substrate, one side of the acoustic layer is electrically connected to the second electrode layer, the other side of the acoustic layer is electrically connected to one side of the first electrode layer, and the protective layer covers the other side of the first electrode layer, wherein the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in the range of [37μm, 43μm], and the thickness range of the substrate is [85μm, 115μm]; a first electrical connection area is provided on the substrate, and the first electrode layer and the protective layer are electrically connected to each other. The second electrode layer is electrically connected to the first electrical connection area respectively, a second electrical connection area is provided on the circuit board, and the first electrical connection area and the second electrical connection area are electrically connected through a conductive adhesive layer; the circuit board is electrically connected to the processing unit outside the fingerprint module, the acoustic layer is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures, the ultrasonic sensor is used to convert the ultrasonic signals received by the acoustic layer into electrical signals, and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signals, wherein the frequency range of the ultrasonic signals emitted by the acoustic layer is [11MHz, 13MHz].

[0009] According to a second aspect of an embodiment of the present application, a fingerprint module is provided, comprising: an ultrasonic sensor and a circuit board; the ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, a second electrode layer is provided on the substrate, one side of the acoustic layer is electrically connected to the second electrode layer, the other side of the acoustic layer is electrically connected to one side of the first electrode layer, and the protective layer covers the other side of the first electrode layer, wherein the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in the range of [48 μm, 60 μm], and the thickness range of the substrate is [125 μm, 155 μm]; a first electrical connection area is provided on the substrate, the first electrode layer and the second electrode layer are electrically connected to the first electrical connection area respectively, a second electrical connection area is provided on the circuit board, and the first electrical connection area and the second electrical connection area are electrically connected through a conductive adhesive layer; the circuit board is electrically connected to the processing unit outside the fingerprint module, the acoustic layer is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures, the ultrasonic sensor is used to convert the ultrasonic signals received by the acoustic layer into electrical signals, and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signals, wherein the frequency range of the ultrasonic signals emitted by the acoustic layer is [7MHz, 9MHz].

[0010] According to a third aspect of an embodiment of the present application, a fingerprint module is provided, comprising: an ultrasonic sensor and a circuit board; the ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, a second electrode layer is provided on the substrate, one side of the acoustic layer is electrically connected to the second electrode layer, the other side of the acoustic layer is electrically connected to one side of the first electrode layer, and the protective layer covers the other side of the first electrode layer, wherein the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in the range of [44 μm, 50 μm], and the thickness range of the substrate is [85 μm, 115 μm]; a first electrical connection area is provided on the substrate, the first electrode layer and The second electrode layer is electrically connected to the first electrical connection area respectively, a second electrical connection area is provided on the circuit board, and the first electrical connection area and the second electrical connection area are electrically connected through a conductive adhesive layer; the circuit board is electrically connected to the processing unit outside the fingerprint module, the acoustic layer is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures, the ultrasonic sensor is used to convert the ultrasonic signals received by the acoustic layer into electrical signals, and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signals, wherein the frequency range of the ultrasonic signals emitted by the acoustic layer is [9MHz, 11MHz].

[0011] According to the fourth aspect of the embodiments of the present application, an electronic device is provided, comprising: a processing unit, a screen, and a fingerprint module as described in the first aspect, second aspect or third aspect of the embodiments of the present application, wherein the fingerprint module is arranged on the back of the screen, and the processing unit is electrically connected to the circuit board in the fingerprint module.

[0012] According to the fingerprint module provided in the embodiment of the present application, the fingerprint module includes an ultrasonic sensor and a circuit board. The ultrasonic sensor includes an acoustic layer, a substrate, a first electrode layer and a protective layer. The acoustic layer can emit and receive reflected ultrasonic signals. The ultrasonic sensor can convert the ultrasonic signals received by the acoustic layer into electrical signals and transmit them to the processing unit outside the fingerprint module through the circuit board, thereby completing ultrasonic fingerprint recognition. Since the present application uses ultrasound for fingerprint recognition, it can be applied to electronic devices with low optical transmittance compared to optical fingerprint recognition. Moreover, since the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer ranges from [37μm, 43μm] and the thickness of the substrate ranges from [85μm, 115μm], the thickness of the entire ultrasonic sensor can be made less than 0.16mm. Compared with ultrasonic sensors made by existing thin-film transistor processes, it can be applied to electronic devices with high space utilization requirements and thin thickness (for example, ultra-thin mobile phones). Therefore, the fingerprint module has high applicability and can meet the application requirements of electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0014] FIG1 is a schematic diagram of a fingerprint module provided in an embodiment of the present application;

[0015] FIG2 is a schematic diagram of a substrate of an ultrasonic sensor provided in an embodiment of the present application;

[0016] FIG3 is a schematic diagram of a first electrical connection area provided in an embodiment of the present application;

[0017] FIG4 is a schematic diagram of an adhesive layer provided in an embodiment of the present application;

[0018] FIG5 is a schematic diagram of a circuit board provided in an embodiment of the present application;

[0019] FIG6 is a schematic diagram of an electronic device provided in an embodiment of the present application;

[0020] FIG7 is a schematic diagram of a specific application scenario of a fingerprint module provided in an embodiment of the present application;

[0021] FIG8 is a front view of the connection relationship between a fingerprint module and a non-folding screen provided in an embodiment of the present application;

[0022] FIG9 is a cross-sectional view of the connection relationship between a fingerprint module and a non-folding screen provided in an embodiment of the present application;

[0023] FIG10 is a front view of another embodiment of the present application showing the connection between a fingerprint module and a non-folding screen;

[0024] FIG11 is a cross-sectional view of another embodiment of the present application showing the connection between a fingerprint module and a non-folding screen;

[0025] FIG12 is a front view of the connection relationship between a fingerprint module and a folding screen provided in an embodiment of the present application;

[0026] FIG13 is a cross-sectional view of the connection relationship between a fingerprint module and a folding screen provided in an embodiment of the present application;

[0027] FIG14 is a front view of another embodiment of the present application showing the connection between the fingerprint module and the folding screen;

[0028] Figure 15 is a cross-sectional view of the connection relationship between another fingerprint module and a folding screen provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field should fall within the scope of protection of the embodiments of the present application.

[0030] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0031] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0032] FIG1 is a schematic diagram of a fingerprint module provided in an embodiment of the present application. As shown in FIG1 , a fingerprint module 100 includes an ultrasonic sensor 101 and a circuit board 102 .

[0033] The ultrasonic sensor 101 includes a substrate 1011, an acoustic layer 1013, a first electrode layer 1014, and a protective layer 1015. A second electrode layer 1012 is provided on the substrate 1011. One side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, and the other side of the acoustic layer 1013 is electrically connected to one side of the first electrode layer 1014. The protective layer 1015 covers the other side of the first electrode layer 1014. The sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014, and the protective layer 1015 is in the range of [37 μm, 43 μm], and the thickness of the substrate 1011 is in the range of [85 μm, 115 μm]. A first electrical connection area 1016 is provided on the substrate 1011, and the first electrode layer 1014 and the second electrode layer 1012 are electrically connected to the first electrical connection area 1016 respectively. A second electrical connection area 1021 is provided on the circuit board 102, and the first electrical connection area 1016 and the second electrical connection area 1021 are electrically connected through the conductive adhesive layer 103.

[0034] The circuit board 102 is electrically connected to the processing unit outside the fingerprint module 100. The acoustic layer 1013 is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures. The ultrasonic sensor 101 is used to convert the ultrasonic signals received by the acoustic layer 1013 into electrical signals, and send the electrical signals to the processing unit through the circuit board 102, so that the processing unit performs fingerprint recognition based on the electrical signals. The frequency range of the ultrasonic signals emitted by the acoustic layer 1013 is [11MHz, 13MHz].

[0035] The ultrasonic sensor 101 comprises a substrate 1011 made of silicon, on which a second electrode layer 1012 is disposed. The second electrode layer 1012 and substrate 1011 may be integrally formed. For example, the second electrode layer 1012 may be a transistor formed on the silicon substrate, or a metal plate disposed on the substrate 1011. One side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, and the other side of the acoustic layer 1013 is electrically connected to the first electrode layer 1014. The first electrode layer 1014 may be a conductive metal layer, such as silver or copper. Alternatively, if the first electrode layer 1014 is a silver layer, one or more layers of silver paste may be applied to the other side of the acoustic layer 1013 to form the first electrode layer 1014.

[0036] The ultrasonic sensor 101 further includes a protective layer 1015, which covers the other side of the first electrode layer 1014. The protective layer 1015 can prevent the first electrode layer 1014 (e.g., a silver layer formed by silver paste) from oxidizing or degrading the acoustic layer 1013. The protective layer 1015 also serves as an insulating layer to prevent short circuits between the first electrode layer 1014 and other structures.

[0037] The acoustic layer 1013 can emit ultrasonic signals and receive ultrasonic signals reflected by external structures. In an example application scenario, the external structure can be a user's finger (referring to the example shown in Figure 7, the finger is represented by reference numeral 300). The fingerprint module 100 can be used for under-screen fingerprint recognition. When the user touches a specific area of ​​the screen with their finger, the acoustic layer 1013 of the ultrasonic sensor 101 in the fingerprint module 100 emits an ultrasonic signal. The user's finger reflects at least a portion of the ultrasonic signal, and the acoustic layer 1013 receives the ultrasonic signal reflected back by the user's finger.

[0038] The ultrasonic sensor 101 can process the ultrasonic signals received by the acoustic layer 1013 into electrical signals. Optionally, an ultrasonic signal processing circuit is formed on the substrate 1011 of the ultrasonic sensor 101, and the ultrasonic signal processing circuit can process the received ultrasonic signals into electrical signals. After the ultrasonic sensor 101 processes the received ultrasonic signals into electrical signals, the electrical signals can be sent to a processing unit outside the fingerprint module 100 via the circuit board 102, so that the processing unit can perform fingerprint recognition based on the electrical signals.

[0039] The conductive adhesive layer 103 can be any conductive adhesive layer 103 structure, for example, it can be a conductive glue. In some optional embodiments, the conductive adhesive layer 103 can be an anisotropic conductive film (ACF). Anisotropic conductive film has the characteristics of vertical conduction and parallel non-conduction. Through the anisotropic conductive film (i.e., the conductive adhesive layer 103), the first electrical connection area 1016 of the ultrasonic sensor 101 can be reliably electrically connected to the second electrical connection area 1021 on the circuit board 102, and the two can be electrically connected by pressing, which simplifies the complexity of the manufacturing process of the fingerprint module 100 and can more easily meet application requirements. Optionally, the thickness of the anisotropic conductive film after being pressed by the first electrical connection area 1016 and the second electrical connection area 1021 is 1-5μm.

[0040] Optionally, as shown in Figure 1, after the first electrical connection area 1016 and the second electrical connection area 1021 are electrically connected through the conductive adhesive layer 103 (for example, anisotropic conductive adhesive film), the side of the conductive adhesive layer 103 extending beyond the substrate is covered with a protective glue (for example, the protective glue 105 shown in Figures 9, 11, 13 and 15), and the protective glue is in contact with at least the substrate 1011, the conductive adhesive layer 103 and the circuit board 102.

[0041] Since the protective glue is provided, the portion of the conductive adhesive layer 103 that extends beyond the substrate 1011 can be protected to prevent damage to the portion of the conductive adhesive layer 103 that extends beyond the substrate 1011. It can also prevent the portion of the conductive adhesive layer 103 from being exposed to the outside and causing a short circuit. Moreover, since the protective glue is in contact with the substrate 1011 and the circuit board 102 (for example, as shown in Figures 9, 11, 13 and 15), it can prevent the circuit board 102 from separating from the ultrasonic sensor 101, thereby improving stability.

[0042] When in use, the fingerprint module 100 can be installed on an electronic device. The embodiments of the present application do not limit the type of electronic device, and the electronic device may include but is not limited to a mobile phone, a tablet computer, etc., or other electronic devices that require fingerprint recognition functions. The processing unit can be any processing unit external to the fingerprint module 100. Alternatively, the processing unit can be a processing unit in the electronic device. The electronic device of the present application will be described in detail below and will not be described here in detail.

[0043] In the embodiment of the present application, the fingerprint module 100 includes an ultrasonic sensor 101 and a circuit board 102. The ultrasonic sensor 101 includes an acoustic layer 1013, a substrate 1011, a first electrode layer 1014 and a protective layer 1015. The reflected ultrasonic signal can be emitted and received through the acoustic layer 1013. The ultrasonic sensor 101 can convert the ultrasonic signal received by the acoustic layer 1013 into an electrical signal, and transmit it to the processing unit outside the fingerprint module 100 by the circuit board 102, thereby completing ultrasonic fingerprint recognition. Since the present application uses ultrasonic waves for fingerprint recognition, it can be compared with optical fingerprint recognition. It is suitable for electronic devices with low optical transmittance. Since the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014 and the protective layer 1015 is in the range of [37μm, 43μm] and the thickness of the substrate 1011 is in the range of [85μm, 115μm], the thickness of the entire ultrasonic sensor 101 can be less than 0.16mm. Compared with the ultrasonic sensor 101 made by the existing thin film transistor process, it can be suitable for electronic devices with high requirements on space utilization and thin thickness (for example: ultra-thin mobile phones). Therefore, the fingerprint module 100 has high applicability and can meet the application requirements of electronic devices.

[0044] In a possible implementation, the total thickness of the acoustic layer 1013 , the first electrode layer 1014 , and the protective layer 1015 is 40 μm, the thickness of the substrate 1011 is 90 μm, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 12 MHz.

[0045] In the embodiment of the present application, the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014 and the protective layer 1015 is 40 μm, and the thickness of the substrate 1011 is 90 μm, thereby achieving a balance between the performance and thickness of the ultrasonic sensor 101, maintaining the minimum thickness with low performance attenuation, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 12 MHz, thereby achieving matching with the thickness, allowing the ultrasonic wave to penetrate the ultrasonic sensor 101 and electronic equipment of this thickness, and can be applied to electronic devices with high requirements on space utilization and thin thickness (for example: ultra-thin mobile phones). Therefore, the fingerprint module 100 has high applicability and can meet the application requirements of electronic devices.

[0046] In a possible implementation, as shown in FIG1 , a fingerprint module 100 includes an ultrasonic sensor 101 and a circuit board 102 .

[0047] The ultrasonic sensor 101 includes a substrate 1011, an acoustic layer 1013, a first electrode layer 1014, and a protective layer 1015. A second electrode layer 1012 is provided on the substrate 1011. One side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, and the other side of the acoustic layer 1013 is electrically connected to one side of the first electrode layer 1014. The protective layer 1015 covers the other side of the first electrode layer 1014. The sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014, and the protective layer 1015 is in the range of [48 μm, 60 μm], and the thickness of the substrate 1011 is in the range of [125 μm, 155 μm]. A first electrical connection area 1016 is provided on the substrate 1011, and the first electrode layer 1014 and the second electrode layer 1012 are electrically connected to the first electrical connection area 1016 respectively. A second electrical connection area 1021 is provided on the circuit board 102, and the first electrical connection area 1016 and the second electrical connection area 1021 are electrically connected through the conductive adhesive layer 103.

[0048] The circuit board 102 is electrically connected to the processing unit outside the fingerprint module 100. The acoustic layer 1013 is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures. The ultrasonic sensor 101 is used to convert the ultrasonic signals received by the acoustic layer 1013 into electrical signals, and send the electrical signals to the processing unit through the circuit board 102, so that the processing unit performs fingerprint recognition based on the electrical signals. The frequency range of the ultrasonic signals emitted by the acoustic layer 1013 is [7MHz, 9MHz].

[0049] The ultrasonic sensor 101 comprises a substrate 1011 made of silicon, on which a second electrode layer 1012 is disposed. The second electrode layer 1012 and substrate 1011 can be integrally formed. For example, the second electrode layer 1012 can be a transistor formed on the silicon substrate, or a metal plate disposed on the substrate 1011. One side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, and the other side of the acoustic layer 1013 is electrically connected to the first electrode layer 1014. The first electrode layer 1014 can be a conductive metal layer, such as silver or copper. Alternatively, if the first electrode layer 1014 is a silver layer, one or more layers of silver paste can be applied to the other side of the acoustic layer 1013 to form the first electrode layer 1014.

[0050] The ultrasonic sensor 101 further includes a protective layer 1015, which covers the other side of the first electrode layer 1014. The protective layer 1015 can prevent the first electrode layer 1014 (e.g., a silver layer formed by silver paste) from oxidizing or degrading the acoustic layer 1013. The protective layer 1015 also serves as an insulating layer to prevent short circuits between the first electrode layer 1014 and other structures.

[0051] The acoustic layer 1013 can emit ultrasonic signals and receive ultrasonic signals reflected by external structures. In an example application scenario, the external structure can be a user's finger (referring to the example shown in Figure 7, the finger is represented by reference numeral 300). The fingerprint module 100 can be used for under-screen fingerprint recognition. When the user touches a specific area of ​​the screen with their finger, the acoustic layer 1013 of the ultrasonic sensor 101 in the fingerprint module 100 emits an ultrasonic signal. The user's finger reflects at least a portion of the ultrasonic signal, and the acoustic layer 1013 receives the ultrasonic signal reflected back by the user's finger.

[0052] The ultrasonic sensor 101 can process the ultrasonic signals received by the acoustic layer 1013 into electrical signals. Optionally, an ultrasonic signal processing circuit is formed on the substrate 1011 of the ultrasonic sensor 101, and the ultrasonic signal processing circuit can process the received ultrasonic signals into electrical signals. After the ultrasonic sensor 101 processes the received ultrasonic signals into electrical signals, the electrical signals can be sent to a processing unit outside the fingerprint module 100 via the circuit board 102, so that the processing unit can perform fingerprint recognition based on the electrical signals.

[0053] The conductive adhesive layer 103 can be any conductive adhesive layer 103 structure, for example, it can be a conductive glue. In some optional embodiments, the conductive adhesive layer 103 can be an anisotropic conductive film (ACF). Anisotropic conductive film has the characteristics of vertical conduction and parallel non-conduction. Through the anisotropic conductive film (i.e., the conductive adhesive layer 103), the first electrical connection area 1016 of the ultrasonic sensor 101 can be reliably electrically connected to the second electrical connection area 1021 on the circuit board 102, and the two can be electrically connected by pressing, which simplifies the complexity of the manufacturing process of the fingerprint module 100 and can more easily meet application requirements. Optionally, the thickness of the anisotropic conductive film after being pressed by the first electrical connection area 1016 and the second electrical connection area 1021 is 1-5μm.

[0054] Optionally, as shown in Figure 1, after the first electrical connection area 1016 and the second electrical connection area 1021 are electrically connected through the conductive adhesive layer 103 (for example, anisotropic conductive adhesive film), the side of the conductive adhesive layer 103 extending beyond the substrate is covered with a protective glue (for example, the protective glue 105 shown in Figures 9, 11, 13 and 15), and the protective glue is in contact with at least the substrate 1011, the conductive adhesive layer 103 and the circuit board 102.

[0055] Since the protective glue is provided, the portion of the conductive adhesive layer 103 that extends beyond the substrate 1011 can be protected to prevent damage to the portion of the conductive adhesive layer 103 that extends beyond the substrate 1011. It can also prevent the portion of the conductive adhesive layer 103 from being exposed to the outside and causing a short circuit. Moreover, since the protective glue is in contact with the substrate 1011 and the circuit board 102 (for example, as shown in Figures 9, 11, 13 and 15), it can prevent the circuit board 102 from separating from the ultrasonic sensor 101, thereby improving stability.

[0056] When in use, the fingerprint module 100 can be installed on an electronic device. The embodiments of the present application do not limit the type of electronic device, and the electronic device may include but is not limited to a mobile phone, a tablet computer, etc., or other electronic devices that require fingerprint recognition functions. The processing unit can be any processing unit external to the fingerprint module 100. Alternatively, the processing unit can be a processing unit in the electronic device. The electronic device of the present application will be described in detail below and will not be described here in detail.

[0057] In the embodiment of the present application, the fingerprint module 100 includes an ultrasonic sensor 101 and a circuit board 102. The ultrasonic sensor 101 includes an acoustic layer 1013, a substrate 1011, a first electrode layer 1014 and a protective layer 1015. The reflected ultrasonic signal can be emitted and received through the acoustic layer 1013. The ultrasonic sensor 101 can convert the ultrasonic signal received by the acoustic layer 1013 into an electrical signal, and transmit it to the processing unit outside the fingerprint module 100 by the circuit board 102, thereby completing ultrasonic fingerprint recognition. Since the present application uses ultrasonic wave for fingerprint recognition, it can be applied to optical transmittance fingerprint recognition compared to optical fingerprint recognition. In lower electronic devices, and since the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014 and the protective layer 1015 is in the range of [48μm, 60μm], the thickness range of the substrate 1011 is [125μm, 155μm], the thickness of the entire ultrasonic sensor 101 can be made below 0.22mm. Compared with the ultrasonic sensor 101 made by the existing thin film transistor process, it can be applied to electronic devices with high requirements on space utilization but thicker thickness (for example: the secondary screen of a folding screen mobile phone, a thicker non-folding screen mobile phone, etc.). Therefore, the fingerprint module 100 has high applicability and can meet the application requirements of electronic devices.

[0058] In a possible implementation, the total thickness of the acoustic layer 1013 , the first electrode layer 1014 , and the protective layer 1015 is 54 μm, the thickness of the substrate 1011 is 150 μm, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 8 MHz.

[0059] In the embodiment of the present application, the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014 and the protective layer 1015 is 54 μm, and the thickness of the substrate 1011 is 150 μm, thereby achieving a balance between the performance and thickness of the ultrasonic sensor 101, maintaining the minimum thickness with low performance attenuation, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 8 MHz, thereby achieving matching with the thickness, allowing the ultrasonic wave to penetrate the ultrasonic sensor 101 and electronic equipment of the thickness, and can be applied to electronic devices with high requirements on space utilization but thicker thickness (for example: the secondary screen of a folding screen mobile phone, a thicker non-folding screen mobile phone, etc.). Therefore, the fingerprint module 100 has high applicability and can meet the application requirements of electronic devices.

[0060] In a possible implementation, as shown in FIG1 , a fingerprint module 100 includes an ultrasonic sensor 101 and a circuit board 102 .

[0061] The ultrasonic sensor 101 includes a substrate 1011, an acoustic layer 1013, a first electrode layer 1014, and a protective layer 1015. A second electrode layer 1012 is provided on the substrate 1011. One side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, and the other side of the acoustic layer 1013 is electrically connected to one side of the first electrode layer 1014. The protective layer 1015 covers the other side of the first electrode layer 1014. The sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014, and the protective layer 1015 is in the range of [44 μm, 50 μm], and the thickness of the substrate 1011 is in the range of [85 μm, 115 μm]. A first electrical connection area 1016 is provided on the substrate 1011, and the first electrode layer 1014 and the second electrode layer 1012 are electrically connected to the first electrical connection area 1016 respectively. A second electrical connection area 1021 is provided on the circuit board 102, and the first electrical connection area 1016 and the second electrical connection area 1021 are electrically connected through the conductive adhesive layer 103.

[0062] The circuit board 102 is electrically connected to the processing unit outside the fingerprint module 100. The acoustic layer 1013 is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures. The ultrasonic sensor 101 is used to convert the ultrasonic signals received by the acoustic layer 1013 into electrical signals, and send the electrical signals to the processing unit through the circuit board 102, so that the processing unit performs fingerprint recognition based on the electrical signals. The frequency range of the ultrasonic signals emitted by the acoustic layer 1013 is [9MHz, 11MHz].

[0063] The ultrasonic sensor 101 comprises a substrate 1011 made of silicon, on which a second electrode layer 1012 is disposed. The second electrode layer 1012 and substrate 1011 may be integrally formed. For example, the second electrode layer 1012 may be a transistor formed on the silicon substrate, or a metal plate disposed on the substrate 1011. One side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, and the other side of the acoustic layer 1013 is electrically connected to the first electrode layer 1014. The first electrode layer 1014 may be a conductive metal layer, such as silver or copper. Alternatively, if the first electrode layer 1014 is a silver layer, one or more layers of silver paste may be applied to the other side of the acoustic layer 1013 to form the first electrode layer 1014.

[0064] The ultrasonic sensor 101 further includes a protective layer 1015, which covers the other side of the first electrode layer 1014. The protective layer 1015 can prevent the first electrode layer 1014 (e.g., a silver layer formed by silver paste) from oxidizing or degrading the acoustic layer 1013. The protective layer 1015 also serves as an insulating layer to prevent short circuits between the first electrode layer 1014 and other structures.

[0065] The acoustic layer 1013 can emit ultrasonic signals and receive ultrasonic signals reflected by external structures. In an example application scenario, the external structure can be a user's finger (referring to the example shown in Figure 7, the finger is represented by reference numeral 300). The fingerprint module 100 can be used for under-screen fingerprint recognition. When the user touches a specific area of ​​the screen with their finger, the acoustic layer 1013 of the ultrasonic sensor 101 in the fingerprint module 100 emits an ultrasonic signal. The user's finger reflects at least a portion of the ultrasonic signal, and the acoustic layer 1013 receives the ultrasonic signal reflected back by the user's finger.

[0066] The ultrasonic sensor 101 can process the ultrasonic signals received by the acoustic layer 1013 into electrical signals. Optionally, an ultrasonic signal processing circuit is formed on the substrate 1011 of the ultrasonic sensor 101, and the ultrasonic signal processing circuit can process the received ultrasonic signals into electrical signals. After the ultrasonic sensor 101 processes the received ultrasonic signals into electrical signals, the electrical signals can be sent to a processing unit outside the fingerprint module 100 via the circuit board 102, so that the processing unit can perform fingerprint recognition based on the electrical signals.

[0067] The conductive adhesive layer 103 can be any conductive adhesive layer 103 structure, for example, it can be a conductive glue. In some optional embodiments, the conductive adhesive layer 103 can be an anisotropic conductive film (ACF). Anisotropic conductive film has the characteristics of vertical conduction and parallel non-conduction. Through the anisotropic conductive film (i.e., the conductive adhesive layer 103), the first electrical connection area 1016 of the ultrasonic sensor 101 can be reliably electrically connected to the second electrical connection area 1021 on the circuit board 102, and the two can be electrically connected by pressing, which simplifies the complexity of the manufacturing process of the fingerprint module 100 and can more easily meet application requirements. Optionally, the thickness of the anisotropic conductive film after being pressed by the first electrical connection area 1016 and the second electrical connection area 1021 is 1-5μm.

[0068] Optionally, as shown in Figure 1, after the first electrical connection area 1016 and the second electrical connection area 1021 are electrically connected through the conductive adhesive layer 103 (for example, anisotropic conductive adhesive film), the side of the conductive adhesive layer 103 extending beyond the substrate is covered with a protective glue (for example, the protective glue 105 shown in Figures 9, 11, 13 and 15), and the protective glue is in contact with at least the substrate 1011, the conductive adhesive layer 103 and the circuit board 102.

[0069] Since the protective glue is provided, the portion of the conductive adhesive layer 103 that extends beyond the substrate 1011 can be protected to prevent damage to the portion of the conductive adhesive layer 103 that extends beyond the substrate 1011. It can also prevent the portion of the conductive adhesive layer 103 from being exposed to the outside and causing a short circuit. Moreover, since the protective glue is in contact with the substrate 1011 and the circuit board 102 (for example, as shown in Figures 9, 11, 13 and 15), it can prevent the circuit board 102 from separating from the ultrasonic sensor 101, thereby improving stability.

[0070] When in use, the fingerprint module 100 can be installed on an electronic device. The embodiments of the present application do not limit the type of electronic device, and the electronic device may include but is not limited to a mobile phone, a tablet computer, etc., or other electronic devices that require fingerprint recognition functions. The processing unit can be any processing unit external to the fingerprint module 100. Alternatively, the processing unit can be a processing unit in the electronic device. The electronic device of the present application will be described in detail below and will not be described here in detail.

[0071] In the embodiment of the present application, the fingerprint module 100 includes an ultrasonic sensor 101 and a circuit board 102. The ultrasonic sensor 101 includes an acoustic layer 1013, a substrate 1011, a first electrode layer 1014 and a protective layer 1015. The ultrasonic layer 1013 can transmit and receive reflected ultrasonic signals. The ultrasonic sensor 101 can convert the ultrasonic signals received by the acoustic layer 1013 into electrical signals, and transmit them to the processing unit outside the fingerprint module 100 by the circuit board 102, thereby completing ultrasonic fingerprint recognition. Since the present application uses ultrasonic waves for fingerprint recognition, it can be applied to optical fingerprint recognition compared to optical fingerprint recognition. In electronic devices with low optical transmittance, and since the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014 and the protective layer 1015 is in the range of [44μm, 50μm], and the thickness of the substrate 1011 is in the range of [85μm, 115μm], the thickness of the entire ultrasonic sensor 101 can be made below 0.17mm. Compared with the ultrasonic sensor 101 made by the existing thin film transistor process, it can be applied to electronic devices with higher requirements on space utilization (for example, mobile phones, tablet computers and other devices that require fingerprint recognition). Therefore, the fingerprint module 100 has high applicability and can meet the application requirements of electronic devices.

[0072] In a possible implementation, the total thickness of the acoustic layer 1013 , the first electrode layer 1014 , and the protective layer 1015 is 47 μm, the thickness of the substrate 1011 is 90 μm, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 10 MHz.

[0073] In an embodiment of the present application, the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014 and the protective layer 1015 is 40 μm, and the thickness of the substrate 1011 is 90 μm, thereby achieving a balance between the performance and thickness of the ultrasonic sensor 101, maintaining the minimum thickness with low performance attenuation, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 10 MHz, thereby achieving matching with the thickness, allowing the ultrasonic wave to penetrate the ultrasonic sensor 101 and electronic equipment of this thickness, and can be applied to electronic devices with high requirements for space utilization (for example: mobile phones, tablet computers, etc.) that require fingerprint recognition. Therefore, the fingerprint module 100 has high applicability and can meet the application requirements of electronic devices.

[0074] The structure of the fingerprint module is described below. It should be noted that the following description of the fingerprint module structure is applicable to the fingerprint module 100 in any of the aforementioned embodiments.

[0075] FIG2 is a schematic diagram of a substrate for an ultrasonic sensor provided in an embodiment of the present application. As shown in FIG2 , the second electrode layer 1012 includes a plurality of complementary metal oxide semiconductors 10111 formed on a substrate 1011. At least some of the plurality of complementary metal oxide semiconductors 10111 are electrically connected to one side of an acoustic layer 1013. The first electrode layer 1014 and the second electrode layer 1012 can provide the acoustic layer 1013 with the voltage required to transmit and receive ultrasonic signals.

[0076] The substrate 1011 includes multiple complementary metal oxide semiconductors (CMOS) 10111. At least some of the multiple CMOS are distributed in a matrix to form a second electrode layer 1012. A voltage difference can be formed between the second electrode layer 1012 and the first electrode layer 1014, thereby powering the acoustic layer 1013. When performing fingerprint recognition, each CMOS is equivalent to a "pixel". After the acoustic layer 1013 receives the ultrasonic signal reflected by the external structure (such as a finger), the voltage signal converted on each CMOS will be different depending on the intensity of the ultrasonic signal. The ultrasonic signal processing circuit of the ultrasonic sensor 101 calculates the voltage signal of each CMOS through an algorithm and sends each voltage signal to the processing unit. The processing unit then processes each voltage signal and outputs a fingerprint image for fingerprint recognition.

[0077] In one example, as shown in FIG2 , the substrate 1011 has an identification area AA and a non-identification area NAA. The identification area AA is the area on the ultrasonic sensor 101 that can be used for fingerprint recognition. At least a portion of the acoustic layer 1013 is located within the identification area AA. The second electrode layer 1012 is formed by at least a portion of the CMOS transistors located in the identification area AA. The non-identification area NAA is the area on the ultrasonic sensor 101 that cannot be used for fingerprint recognition. It includes areas other than the identification area AA. The non-identification area NAA can be used to support other components of the ultrasonic sensor 101, such as the first electrical connection area 1016. This application does not specifically limit the size of the identification area AA; it is sufficient to meet the needs.

[0078] Optionally, the first electrode layer 1014 can be electrically connected to the ground line on the circuit board 102 through the first electrical connection area 1016, so that the first electrode layer 1014 can be grounded as a cathode layer, and the second electrode layer 1012 can be used as an anode layer. When receiving external pressure (for example, being pressed by a finger during fingerprint recognition), a voltage difference can be formed between the second electrode layer 1012 and the first electrode layer 1014. At this time, power can be supplied to the acoustic layer 1013 to provide the acoustic layer 1013 with the voltage required to transmit and receive ultrasonic signals.

[0079] In one example, the acoustic layer 1013 in the present application may include a piezoelectric material. Voltage can be provided to the piezoelectric material of the acoustic layer 1013 through the first electrode layer 1014 and the second electrode layer 1012. Based on the piezoelectric effect of the piezoelectric material, the acoustic layer 1013 can emit ultrasonic signals and receive ultrasonic signals reflected back by external structures. Optionally, the piezoelectric material of the acoustic layer 1013 may be a film layer, and the film layer may be made using a coating process. The present application does not limit the piezoelectric material. For example, the piezoelectric material may be a polyvinylidene fluoride (PVDF) material, and the PVDF material includes but is not limited to PVDF and its copolymers. Based on this, the acoustic layer 1013 in the present application includes a PVDF material layer, which can effectively meet the needs of emitting ultrasonic signals and receiving ultrasonic signals reflected back by external structures.

[0080] In the embodiment of the present application, the second electrode layer 1012 includes multiple CMOS sensors formed on the substrate 1011, so that the acoustic layer 1013 can be powered by the second electrode layer 1012 and the first electrode layer 1014. Moreover, since the ultrasonic sensor 101 is a CMOS ultrasonic sensor 101, compared with the ultrasonic sensor 101 manufactured using a thin-film transistor process, the CMOS ultrasonic sensor 101 has a higher pixel integration, higher stability, and better driving performance. Moreover, the CMOS ultrasonic sensor 101 is manufactured based on a CMOS process and is smaller in size. Furthermore, since the second electrode layer 1012 is multiple CMOS sensors formed on the substrate 1011, there is no need to provide a separate second electrode layer 1012, so the thickness is relatively thin, thereby being able to simultaneously meet the application requirements of electronic devices for both performance and space.

[0081] In a possible implementation, as shown in FIG. 1 and FIG. 2 , the first electrical connection region 1016 and the second electrode layer 1012 are located on the same side of the substrate 1011 .

[0082] In an embodiment of the present application, the first electrical connection area 1016 and the second electrode layer 1012 are located on the same side of the substrate 1011. Thus, the second electrode layer 1012 formed on the substrate 1011 can be electrically connected to the first electrical connection area without the need for complex wiring, and the first electrical connection area 1016 and the first electrode layer 1014 can be electrically connected. Since complex wiring is not required, the process of forming the ultrasonic sensor 101 can be simplified.

[0083] Figure 3 is a schematic diagram of a first electrical connection area provided in an embodiment of the present application. As shown in Figure 3, the first electrical connection area 1016 includes a plurality of pins 10161 arranged side by side, the width W of each pin 10161 in the plurality of pins 10161 is 0.09 mm, the length L of the pin 10161 ranges from [0.3 mm, 0.385 mm], the distance N between two adjacent pins 10161 is 0.07 mm, and at least part of the plurality of pins 10161 is electrically connected to the second electrical connection area 1021.

[0084] Optionally, a passivation layer may be formed on the substrate 1011 of the ultrasonic sensor 101. In this application, the first electrical connection region 1016 may be fabricated using the following method 1 or method 2:

[0085] Method 1: A redistribution layer (RDL) circuit can be fabricated on the passivation layer surface of the substrate 1011 of the ultrasonic sensor 101 through a redistribution layer (RDL) process. One end of the RDL circuit is electrically connected to a line output position of the ultrasonic sensor 101 where a line is required to be output. The RDL circuit can form a pin 10161 of the first electrical connection area 1016 .

[0086] Method 2: When designing the chip of the ultrasonic sensor 101, an area for forming multiple pins 10161 of the first electrical connection area 1016 can be pre-added below the position where the ultrasonic sensor 101 appears, and a window can be opened on the surface of the passivation layer of the substrate 1011 of the ultrasonic sensor 101 to expose the area. Thereafter, a conductive layer of appropriate thickness is provided on the area (the method of providing the conductive layer is not limited here, for example, it can be achieved by Au plating, etc.) to form the pins 10161 of the first electrical connection area 1016.

[0087] Both methods can produce the first electrical connection area 1016 including multiple pins 10161. The method can be selected according to needs and is not limited in this application. Of course, other methods can also be used to produce the first electrical connection area 1016 including multiple pins 10161, which is not limited in this application.

[0088] Optionally, the surface of pin 10161, i.e., the connection side between pin 10161 and the conductive adhesive layer 103, may be provided with a conductive coating, which may be formed into a conductive film. Because pin 10161 may be concave to a certain extent (e.g., 1 μm to 2 μm) due to certain manufacturing processes during its manufacture, the present application provides an additional conductive coating on pin 10161, which is beneficial for protecting pin 10161 and can elevate the concave portion of pin 10161, thereby better accommodating the need for electrical connection of pin 10161 via conductive adhesive layer 103 (e.g., ACF conductive film).

[0089] The present application does not limit the material of the conductive coating, as long as it can meet the requirements. Optionally, the conductive coating includes at least one of an ITO (Indium Tin Oxides) coating, a Ti coating (i.e., a titanium coating), a Ni coating (i.e., a nickel coating), an Ag coating (i.e., a silver coating), and an Au coating (i.e., a gold coating).

[0090] In an embodiment of the present application, the first electrical connection area 1016 includes a plurality of pins 10161, the width W of each pin 10161 is 0.09 mm, the length L of the pin 10161 ranges from [0.3 mm, 0.385 mm], and the distance N between two adjacent pins 10161 is 0.07 mm, thereby enabling the first electrical connection area 1016 and the second electrical connection area 1021 to be electrically connected, and there is a certain distance N between adjacent pins 10161 in the embodiment of the present application, which can improve the heat dissipation function of the pin 10161 and avoid overheating of the first electrical connection area 1016.

[0091] In one possible implementation, the fingerprint module 100 further includes an adhesive layer 104. FIG4 is a schematic diagram of an adhesive layer provided in an embodiment of the present application. As shown in FIG4 , the adhesive layer 104 includes a first double-sided adhesive tape 1041, a first copper foil layer 1042, and a second double-sided adhesive tape 1043. One side of the first copper foil layer 1042 is bonded to one side of the first double-sided adhesive tape 1041, the other side of the first copper foil layer 1042 is bonded to one side of the second double-sided adhesive tape 1043, and the other side of the second double-sided adhesive tape 1043 is bonded to the substrate 1011. The second double-sided adhesive tape 1043 and the acoustic layer 1013 are respectively located on both sides of the substrate 1011. The other side of the first double-sided adhesive tape 1041 can be bonded to an electronic device outside the fingerprint module 100.

[0092] In the embodiment of the present application, the fingerprint module 100 also includes an adhesive layer 104, which can adhere the fingerprint module 100 to the electronic device. Since the adhesive layer 104 includes a first double-sided tape 1041, a first copper foil layer 1042 and a second double-sided tape 1043, the adhesive layer 104 has a high strength and can play a role in buffering and insulating between the fingerprint module 100 and the external electronic device.

[0093] In one possible implementation, the thickness of the first double-sided tape 1041 in the adhesive layer 104 is 6 μm, the thickness of the first copper foil layer 1042 is 6 μm, and the thickness of the second double-sided tape 1043 is 3 μm; or, the thickness of the first double-sided tape 1041 is 6 μm, the thickness of the first copper foil layer 1042 is 35 μm, and the thickness of the second double-sided tape 1043 is 6 μm; or, the thickness of the first double-sided tape 1041 is 6 μm, the thickness of the first copper foil layer 1042 is 16 μm, and the thickness of the second double-sided tape 1043 is 6 μm.

[0094] In the embodiment of the present application, the adhesive layer 104 can use double-sided tapes of different thicknesses according to different electronic devices. For example, for ultra-thin electronic devices, a first double-sided tape 1041 with a thickness of 6 μm, a first copper foil layer 1042 with a thickness of 6 μm, and a second double-sided tape 1043 with a thickness of 3 μm can be selected. In this way, the fingerprint module 100 can be bonded to different electronic devices and can be applied to requirements of different bonding thicknesses and different bonding strengths, so it has high applicability.

[0095] FIG5 is a schematic diagram of a circuit board provided in an embodiment of the present application. As shown in FIG5 , the circuit board 102 includes a flexible circuit board, which includes a first cover film 1022, a first copper layer 1023, a second copper foil layer 1024, a base material layer 1025, a third copper foil layer 1026, a second copper layer 1027, and a second cover film 1028. One side of the first cover film 1022 is laminated to one side of the first copper layer 1023, the other side of the first copper layer 1023 is laminated to one side of the second copper foil layer 1024, the other side of the second copper foil layer 1024 is laminated to one side of the base material layer 1025, the other side of the base material layer 1025 is laminated to one side of the third copper foil layer 1026, the other side of the third copper foil layer 1026 is laminated to one side of the second copper layer 1027, and the other side of the second copper layer 1027 is laminated to one side of the second cover film 1028.

[0096] At one end of the circuit board 102, the first covering film 1022, the first copper plated layer 1023 and the second copper foil layer 1024 are indented by a first distance h1 relative to the base material layer 1025, the third copper foil layer 1026 and the second copper plated layer 1027 are indented by a second distance h2 relative to the base material layer 1025, and the second covering film 1028 is indented by a third distance h3 relative to the base material layer 1025. The first distance h1 is greater than the second distance h2, and the third distance h3 is greater than the second distance h2. The second covering film 1028 is indented relative to the third copper foil layer 1026 and the second copper plated layer 1027 to form a second electrical connection area 1021.

[0097] Optionally, as shown in Figure 5, a chemical nickel-gold process can be performed on the second electrical connection area 1021 formed by the second covering film 1028 being indented relative to the third copper foil layer 1026 and the second copper layer 1027 to form an electroplating layer 1029 on the exposed second copper layer 1027 to prevent the exposed second copper layer 1027 from rusting and corroding.

[0098] In an embodiment of the present application, the circuit board 102 may include a flexible circuit board 102, so that the circuit board 102 can be bent during connection to ensure the space requirements of the electronic device, and the first covering film 1022, the first copper plated layer 1023 and the second copper foil layer 1024 are indented by a first distance h1 relative to the base material layer 1025, which can improve the reliability of the flexible circuit board 102, and the third copper foil layer 1026 and the second copper plated layer 1027 are indented by a second distance h2 relative to the base material layer 1025, thereby ensuring that the edge of the circuit board 102 is smooth when the circuit board 102 is cut, and the second covering film 1028 is indented relative to the third copper foil layer 1026 and the second copper plated layer 1027 to form a second electrical connection area 1021, thereby enabling the circuit board 102 to be electrically connected to the first electrical connection area 1016 through the conductive adhesive layer 103, thereby improving the conductivity.

[0099] FIG6 is a schematic diagram of an electronic device provided in an embodiment of the present application. As shown in FIG6 , the electronic device 200 includes: a processing unit 210, and the fingerprint module 100 in any of the above embodiments. Specifically, the processing unit 210 can be the "processing unit outside the fingerprint module 100" in the aforementioned fingerprint module 100 embodiment. The processing unit 210 is electrically connected to the circuit board in the fingerprint module 100. The processing unit 210 can receive the electrical signal sent by the ultrasonic sensor in the fingerprint module 100 through the circuit board and perform fingerprint recognition based on the electrical signal. The processing unit 210 may include at least one chip capable of data processing, such as a CPU, GPU, MCU, DSP, FPGA, etc.

[0100] Optionally, when performing fingerprint recognition based on an electrical signal, the processing unit 210 in the present application can process the electrical signal through an image processing circuit and / or an image processing algorithm to generate a fingerprint image, and compare the fingerprint image with a pre-stored fingerprint image to realize the fingerprint recognition function.

[0101] This application does not limit the type of electronic device 200. The electronic device 200 may include but is not limited to a mobile phone, a tablet computer, etc., or may also be other electronic devices that require a fingerprint recognition function, such as a fingerprint lock.

[0102] In the embodiment of the present application, the setting position of the fingerprint module 100 on the electronic device 200 is not limited, and it can be set at any suitable position as needed. Optionally, the electronic device 200 may include a screen 220, and the fingerprint module 100 can be set on the back of the screen 220. The present application can realize the under-screen fingerprint recognition function by setting the fingerprint module 100 on the back of the screen 220. For example, the under-screen fingerprint recognition function can be used for the under-screen fingerprint unlocking function and the under-screen fingerprint payment function of the electronic device 200 (including but not limited to mobile phones). The screen 220 in the present application can be any kind of screen, including but not limited to LCD screens, LED screens, OLED screens, etc. The screen 220 can be a non-folding screen or a non-folding screen, and the present application does not limit it here.

[0103] FIG7 is a schematic diagram of a specific application scenario of a fingerprint module provided by an embodiment of the present application. As shown in FIG7 , a user can use a finger 300 to record a fingerprint in a specific area on the front of the screen 220 .

[0104] The present application does not limit the installation method of the fingerprint module 100 below the screen 220. For example, as shown in FIG7 , the fingerprint module 100 can be bonded to the back of the screen 220 via an adhesive layer 104. In the present application, the adhesive layer 104 can ensure that the fingerprint module 100 is bonded to the back of the screen 220, maintain the installation stability of the fingerprint module 100 on the electronic device 200, and facilitate the electronic device 200 to utilize the functions of the fingerprint module 100.

[0105] In one possible implementation, referring to Figures 8 and 9, 10 and 11, for the screen 220 of the electronic device 200 being a non-folding screen, the screen 220 includes a screen substrate 221 and a buffer layer 222, the buffer layer 222 being installed on the screen substrate 221, and the buffer layer 222 being used to buffer the screen 220; the buffer layer 222 is provided with a first through hole 2221, the substrate of the ultrasonic sensor passes through the first through hole 2221 and is bonded to the screen substrate 221, and the fingerprint module 100 is bonded to the screen substrate 221 through the adhesive layer 104.

[0106] Specifically, the buffer layer 222 and the screen substrate 221 may form the back side of the screen 220. The buffer layer 222 provides cushioning for the screen 220 (non-folding screen). Due to the characteristics of a non-folding screen, the screen 220 requires the buffer layer 222 to cushion the impact on the screen 220. The buffer layer 222 may generally be made of an elastic structure. It should be understood that the buffer layer 222 may have different structures for different screens 220, and this application is not limited thereto. For example, in some embodiments, the buffer layer 222 may include foam, etc.

[0107] Optionally, the buffer layer 222 can be the same color as or similar to the first double-sided tape 1041 of the adhesive layer 104, thereby improving the appearance and overall aesthetics of the electronic device 200 when the first through hole 2221 is provided in the buffer layer 222. Furthermore, the first double-sided tape 1041 (i.e., the screen-facing double-sided tape) can optionally be black, allowing the adhesive layer 104 to provide light shielding, which can effectively improve the problem of poor screen display caused by the first through hole 2221 in the buffer layer 222.

[0108] In an embodiment of the present application, a first through hole 2221 is opened on the buffer layer 222 for buffering the screen 220, and a portion of the screen substrate 221 is exposed from the first through hole 2221. The adhesive layer 104 bonds the substrate of the ultrasonic sensor to the screen substrate 221 exposed from the first through hole 2221. This can reduce the obstruction and absorption effect of the buffer layer 222 on the ultrasonic signals sent and received by the ultrasonic sensor 101 of the fingerprint module 100, thereby improving the use effect of the fingerprint module 100 and meeting the application requirements of the fingerprint module 100 in the electronic device 200 with a non-folding screen.

[0109] Optionally, for non-folding screen electronic devices, the adhesive layer 104 can be selected from a first double-sided adhesive with a thickness of 6 μm, a first copper foil layer with a thickness of 6 μm, and a second double-sided adhesive with a thickness of 3 μm.

[0110] Figures 8 to 11 are schematic diagrams of the connection relationship between a fingerprint module and a non-folding screen provided in an embodiment of the present application.

[0111] The size and shape of the first through hole 2221 can be as required, and this application does not impose any restrictions on this. Referring to Figures 8 and 9, Figures 10 and 11, the outer contour of the first through hole 2221 is larger than the outer contour of the adhesive layer 104 and also larger than the outer contour of the ultrasonic sensor 101 of the fingerprint module 100. In the examples shown in Figures 8 and 10, the shape of the first through hole 2221 is a rounded rectangle, but this is only an example. It can also be made into a regular shape such as a rectangle, circle, regular polygon, or an irregular shape.

[0112] In one possible implementation, in the electronic device 200, the screen 220 is a non-folding screen, and the electronic device 200 also includes a first shading structure 230 and a first fixing structure 241, wherein the first shading structure 230 is used to cover the gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221, and the first fixing structure 241 is used to fix the edge of the ultrasonic sensor 101 on the adhesive layer 104. For example, in some exemplary embodiments, referring to Figures 8 and 9, in the electronic device 200, the screen 220 is a non-folding screen, the gap B between the edge of the adhesive layer 104 and the edge of the first through hole 2221 is ≥0.1 mm, and along the thickness direction of the acoustic layer 1013, the first vertical projection of the ultrasonic sensor 101 toward the adhesive layer 104 is located within the adhesive layer 104, and the gap C between the edge of the first vertical projection and the edge of the adhesive layer 104 is ≥0.5 mm. The electronic device 200 also includes a first shading structure 230 and a first fixing structure 241, wherein the first shading structure 230 is used to cover the gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221, and the first fixing structure 241 is used to fix the edge of the ultrasonic sensor 101 on the adhesive layer 104.

[0113] Specifically, when the gap B between the edge of the adhesive layer 104 and the edge of the first through hole 2221 is ≥0.1mm, the outer contour of the adhesive layer 104 does not exceed the outer contour of the first through hole 2221 as shown in Figures 8 and 9. A portion of the screen substrate 221 of the screen 220 (non-folding screen) may be exposed from the gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221. The screen 220 may leak light. Therefore, the present application is based on this structure. On the one hand, the gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221 can be covered by the first shading structure 230, thereby improving the adverse effects of light leakage from the screen 220 on the display effect of the screen 220 and the appearance of the electronic device 200; along the thickness direction of the acoustic layer 1013, the ultrasonic sensor 101 is directed toward The first vertical projection to the adhesive layer 104 is located inside the adhesive layer 104. When the gap C between the edge of the first vertical projection and the edge of the adhesive layer 104 is ≥0.5 mm, the outer contour of the adhesive layer 104 exceeds the outer contour of the ultrasonic sensor 101 too much. Therefore, the present application is based on this structure. On the other hand, the edge of the ultrasonic sensor 101 can be fixed to the adhesive layer 104 by the first fixing structure 241, thereby improving the stability of the fingerprint module 100 installed on the electronic device 200; on the other hand, since in this structure of the present application, the edge of the ultrasonic sensor 101 is fixed to the adhesive layer 104 by the first fixing structure 241, it is convenient to remove the fingerprint module 100 from the electronic device 200, and it is less likely to damage the screen 220, which is also beneficial to the rework and installation of the fingerprint module 100 of the electronic device 200.

[0114] Optionally, the first light-shielding structure 230 may adopt any suitable light-shielding structure, whichever is more suitable to meet the needs. For example, the first light-shielding structure 230 may include a light-shielding glue, which can be applied to the gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221, so that the cured light-shielding glue covers the gap to achieve the light-shielding function. Optionally, the curing shrinkage rate of the light-shielding glue is less than 3%. When the curing shrinkage rate of the light-shielding glue is too large, it is easy to form a pulling force on the screen 220, resulting in poor display effect of the screen 220. In this application, a light-shielding glue with a curing shrinkage rate of less than 3% is selected as the first light-shielding structure 230, which can better avoid the problem of poor display effect of the screen 220 caused by the light-shielding glue pulling the screen 220. This application does not impose any restrictions on the type of light-shielding glue, as long as it meets the needs. For example, the light-shielding glue can be made of at least one of UV-curing adhesives (such as UV glue, i.e., shadowless glue, which needs to be cured by ultraviolet light), adhesives that cure by UV and moisture, and adhesives that cure at low temperatures (for example, low temperature means less than 100°C).

[0115] Optionally, the first fixing structure 241 can adopt any suitable fixing structure to meet the needs. For example, the first fixing structure 241 can include fixing glue, and the fixing glue can be applied at the edge of the ultrasonic sensor 101 and the adhesive layer 104 to achieve the function of fixing the edge of the ultrasonic sensor 101 to the adhesive layer 104. Optionally, the curing shrinkage rate of the fixing glue is less than 3%. When the curing shrinkage rate of the fixing glue is too large, it is easy to form a pulling force on the screen 220, resulting in poor display effect of the screen 220. In this application, a fixing glue with a curing shrinkage rate of less than 3% is selected as the first fixing structure 241, which can better avoid the problem of poor display effect of the screen 220 caused by the fixing glue pulling the screen 220. This application does not impose any restrictions on the type of fixing glue, as long as it meets the needs. For example, the fixing glue can adopt at least one of UV-curing adhesives (such as UV glue, i.e., shadowless glue, which needs to be cured by ultraviolet light irradiation), adhesives cured by UV and moisture, and low-temperature curing adhesives (for example, low temperature means less than 100°C).

[0116] Therefore, in some embodiments of the present application, the fingerprint module 100 can be installed between the screen 220 (non-folding screen) by applying glue twice (i.e., the aforementioned light-shielding glue (i.e., the first light-shielding structure 230) and the fixing glue (i.e., the first fixing structure 241)), taking into account the needs of light-shielding and module fixing.

[0117] Alternatively, in other optional embodiments, in the electronic device 200 , the screen 220 is a non-folding screen, and the electronic device 200 further includes a second fixing structure 242 , which is used to fix the edge of the ultrasonic sensor 101 on the screen substrate 221 .

[0118] For example, in some exemplary embodiments, referring to Figures 10 and 11, in the electronic device 200, the screen 220 is a non-folding screen, and along the thickness direction of the acoustic layer 1013, the second vertical projection of the ultrasonic sensor 101 toward the screen substrate 221 is located in the first through hole 2221, and the gap D between the edge of the second vertical projection and the edge of the first through hole 2221 is ≥0.5mm, and the edge of the adhesive layer 104 does not exceed the edge of the bonding surface on the fingerprint module 100 that forms a bond with the adhesive layer 104. The electronic device 200 also includes a second fixing structure 242, which is used to fix the edge of the ultrasonic sensor 101 on the screen substrate 221.

[0119] Specifically, along the thickness direction of the acoustic layer 1013, the second vertical projection of the ultrasonic sensor 101 toward the screen substrate 221 is located within the first through hole 2221, and the gap D between the edge of the second vertical projection and the edge of the first through hole 2221 is ≥0.5 mm. The edge of the adhesive layer 104 does not extend beyond the edge of the bonding surface on the fingerprint module 100 that forms a bond with the adhesive layer 104. In this case, no separate light-shielding structure is provided in the present application. Instead, the edge of the ultrasonic sensor 101 is directly fixed to the screen substrate 221 using the second fixing structure 242. Based on this structure, on the one hand, the edge of the ultrasonic sensor 101 can be fixed to the screen substrate 221 by the second fixing structure 242, thereby improving the stability of the fingerprint module 100 when installed on the electronic device 200; on the other hand, the second fixing structure 242 can also improve screen light leakage to a certain extent, achieving a light-shielding effect, thereby improving the adverse effects of light leakage from the screen 220 on the display effect of the screen 220 and the appearance of the electronic device 200; on the other hand, since a separate light-shielding structure is not required, the manufacturing process of the electronic device 200 is simplified.

[0120] Optionally, the second fixing structure 242 can adopt any suitable fixing structure, which is subject to being able to meet the needs. For example, the second fixing structure 242 can include fixing glue, which can be applied to the edge of the ultrasonic sensor 101 and the screen substrate 221 (for example, the fixing glue can be applied to the edge of the first through hole 2221), thereby achieving the function of fixing the edge of the ultrasonic sensor 101 on the screen substrate 221. Optionally, the curing shrinkage rate of the fixing glue is less than 3%. When the curing shrinkage rate of the fixing glue is too large, it is easy to form a pulling force on the screen 220, resulting in poor display effect of the screen 220. In this application, a fixing glue with a curing shrinkage rate of less than 3% is selected as the second fixing structure 242, which can better avoid the problem of poor display effect of the screen 220 caused by the fixing glue pulling the screen 220. This application does not impose any restrictions on the type of fixing glue, as long as it meets the needs. For example, the fixing glue can be at least one of a UV-curing adhesive (e.g., UV glue, i.e., shadowless glue, which requires ultraviolet light irradiation for curing), an adhesive that cures by UV and moisture, and an adhesive that cures at low temperatures (e.g., low temperature refers to less than 100°C). Therefore, in some embodiments of the present application, the fingerprint module 100 can be installed between the screen 220 (non-folding screen) by applying glue once (i.e., the aforementioned fixing glue (i.e., the second fixing structure 242)), taking into account the needs of both light shielding and module fixation.

[0121] Figures 12 through 15 are schematic diagrams illustrating the connection between a fingerprint module and a foldable screen according to an embodiment of the present application. In some optional embodiments, referring to Figures 12 through 15 , if the screen 220 of the electronic device 200 is a foldable screen, the screen 220 includes a support sheet 223 for supporting the screen 220; the fingerprint module 100 is bonded to the support sheet 223 via an adhesive layer 104.

[0122] Specifically, the support sheet 223 can form the back of the screen 220. The support sheet 223 supports the screen 220 (folding screen). The characteristics of the folding screen make the screen 220 need the support of the support sheet 223 to improve stability. Folding screens generally do not need to have a separate buffer layer, so there is no problem of the buffer layer affecting the ultrasonic signals sent and received by the ultrasonic sensor 101 of the fingerprint module 100. The support sheet 223 can generally be made of a material that is plastic and has a certain strength, such as a metal material. For example, in some optional embodiments, the support sheet 223 can be a supporting steel sheet, or in other embodiments it can be a supporting copper sheet, etc. This application does not make specific restrictions here. Of course, if the needs are met, the support sheet 223 can also be made of other suitable materials.

[0123] Optionally, for electronic devices with foldable screens, when the support sheet 223 is made of titanium alloy or other metal, the adhesive layer 104 uses a first double-sided tape with a thickness of 6 μm, a first copper foil layer with a thickness of 35 μm, and a second double-sided tape with a thickness of 6 μm. When the support sheet 223 is made of carbon fiber, the adhesive layer 104 uses a first double-sided tape with a thickness of 6 μm, a first copper foil layer with a thickness of 16 μm, and a second double-sided tape with a thickness of 6 μm.

[0124] In this application, by bonding the fingerprint module 100 to the support sheet 223 for supporting the screen 220 through the adhesive layer 104, the fingerprint module 100 can be bonded to the back of the screen 220 without affecting the function of sending and receiving ultrasonic signals of the fingerprint module 100, thereby improving the use effect of the fingerprint module 100 and meeting the application requirements of the fingerprint module 100 in the electronic device 200 with a folding screen.

[0125] In some optional embodiments, the screen 220 of the electronic device 200 is a foldable screen, and the electronic device 200 further includes a third fixing structure 243, which is used to fix the edge of the ultrasonic sensor 101 to the adhesive layer 104. For example, in some exemplary embodiments, as shown in Figures 12 and 13, the screen 220 of the electronic device 200 is a foldable screen, and along the thickness direction of the acoustic layer 1013, the first perpendicular projection of the ultrasonic sensor 101 toward the adhesive layer 104 is located within the adhesive layer 104, and the gap C between the edge of the first perpendicular projection and the edge of the adhesive layer 104 is ≥ 0.5 mm. The electronic device 200 further includes a third fixing structure 243, which is used to fix the edge of the ultrasonic sensor 101 to the adhesive layer 104.

[0126] Specifically, along the thickness direction of the acoustic layer 1013, the first vertical projection of the ultrasonic sensor 101 toward the adhesive layer 104 is located inside the adhesive layer 104, and the gap C between the edge of the first vertical projection and the edge of the adhesive layer 104 is ≥0.5 mm. At this time, the outer contour of the adhesive layer 104 exceeds the outer contour of the ultrasonic sensor 101 too much. Therefore, based on this structure, the present application can, on the one hand, fix the edge of the ultrasonic sensor 101 on the adhesive layer 104 through the third fixing structure 243, thereby improving the stability of the fingerprint module 100 installed on the electronic device 200; on the other hand, since in this structure of the present application, the edge of the ultrasonic sensor 101 is fixed to the adhesive layer 104 through the third fixing structure 243, it is convenient to remove the fingerprint module 100 from the electronic device 200, and it is less likely to damage the screen 220, which is also beneficial to the rework and installation of the fingerprint module 100 of the electronic device 200.

[0127] Optionally, the third fixing structure 243 can adopt any suitable fixing structure to meet the needs. For example, the third fixing structure 243 can include fixing glue, and the fixing glue can be applied at the edge of the ultrasonic sensor 101 and the adhesive layer 104 to achieve the function of fixing the edge of the ultrasonic sensor 101 to the adhesive layer 104. Optionally, the curing shrinkage rate of the fixing glue is less than 3%. When the curing shrinkage rate of the fixing glue is too large, it is easy to form a pulling force on the screen 220, resulting in poor display effect of the screen 220. In this application, a fixing glue with a curing shrinkage rate of less than 3% is selected as the third fixing structure 243, which can better avoid the problem of poor display effect of the screen 220 caused by the fixing glue pulling the screen 220. This application does not impose any restrictions on the type of fixing glue, as long as it meets the needs. For example, the fixing glue can adopt at least one of UV-curing adhesives (such as UV glue, i.e., shadowless glue, which needs to be cured by ultraviolet light irradiation), adhesives cured by UV and moisture, and low-temperature curing adhesives (for example, low temperature means less than 100°C).

[0128] Therefore, in some embodiments of the present application, the fingerprint module 100 can be installed between the screen 220 (folding screen) by applying glue once (i.e., the aforementioned fixing glue (i.e., the third fixing structure 243)), taking into account the needs of light shielding and module fixation. Alternatively, in other optional embodiments, in the electronic device 200, the screen 220 is a folding screen, and the electronic device 200 further includes a fourth fixing structure 244, which is used to fix the edge of the ultrasonic sensor 101 on the support sheet 223. For example, in some exemplary embodiments, referring to Figures 14 and 15, in the electronic device 200, the screen 220 is a folding screen, the edge of the adhesive layer 104 does not exceed the edge of the bonding surface on the fingerprint module 100 that forms a bond with the adhesive layer 104, that is, the edge of the adhesive layer 104 does not exceed the edge of the ultrasonic sensor 101, and the electronic device 200 further includes a fourth fixing structure 244, which is used to fix the edge of the ultrasonic sensor 101 on the support sheet 223.

[0129] Specifically, the edge of the adhesive layer 104 does not extend beyond the edge of the bonding surface on the fingerprint module 100 that forms a bond with the adhesive layer 104. In this application, the edge of the ultrasonic sensor 101 can be fixed to the support sheet 223 through the fourth fixing structure 244 to improve the stability of the fingerprint module 100 installed on the electronic device 200.

[0130] Optionally, the fourth fixing structure 244 can adopt any suitable fixing structure to meet the needs. For example, the fourth fixing structure 244 can include fixing glue, and the fixing glue can be applied at the edge of the ultrasonic sensor 101 and the support sheet 223 to achieve the function of fixing the edge of the ultrasonic sensor 101 to the support sheet 223. Optionally, the curing shrinkage rate of the fixing glue is less than 3%. When the curing shrinkage rate of the fixing glue is too large, it is easy to form a pulling force on the screen 220, resulting in poor display effect of the screen 220. In this application, a fixing glue with a curing shrinkage rate of less than 3% is selected as the fourth fixing structure 244, which can better avoid the problem of poor display effect of the screen 220 caused by the fixing glue pulling the screen 220. This application does not impose any restrictions on the type of fixing glue, as long as it meets the needs. For example, the fixing glue can adopt at least one of UV-curing adhesives (such as UV glue, i.e., shadowless glue, which needs to be cured by ultraviolet light), UV and moisture-curing adhesives, and low-temperature curing adhesives (for example, low temperature means less than 100°C). Therefore, in some embodiments of the present application, the fingerprint module 100 can be installed between the screen 220 (folding screen) by applying glue once (i.e., the aforementioned fixing glue (i.e., the fourth fixing structure 244)), taking into account the needs of light shielding and module fixation. Optionally, as shown in Figures 9, 11, 13, and 15, after the first electrical connection area 1016 and the second electrical connection area 1021 are electrically connected through the conductive adhesive layer 103 (e.g., ACF conductive adhesive film), a protective glue 105 can be added to the outside of the conductive adhesive layer 103 to protect the conductive adhesive layer 103.

[0131] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0132] Those skilled in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of this application.

[0133] The above implementation methods are only used to illustrate the embodiments of the present application, and are not intended to limit the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims.

Claims

1. A fingerprint module, characterized in that: include: Ultrasonic sensor and circuit board; The ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, wherein a second electrode layer is arranged on the substrate, one side of the acoustic layer is electrically connected to the second electrode layer, the other side of the acoustic layer is electrically connected to one side of the first electrode layer, and the protective layer covers the other side of the first electrode layer, wherein the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in a range of [37 μm, 43 μm], and the thickness of the substrate is in a range of [85 μm, 115 μm]; The substrate is provided with a first electrical connection area, the first electrode layer and the second electrode layer are electrically connected to the first electrical connection area respectively, the circuit board is provided with a second electrical connection area, and the first electrical connection area is electrically connected to the second electrical connection area through a conductive adhesive layer; The circuit board is electrically connected to the processing unit outside the fingerprint module, the acoustic layer is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures, the ultrasonic sensor is used to convert the ultrasonic signals received by the acoustic layer into electrical signals, and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signals, wherein the frequency range of the ultrasonic signals emitted by the acoustic layer is [11MHz, 13MHz].

2. The fingerprint module according to claim 1, characterized in that: The sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is 40 μm, the thickness of the substrate is 90 μm, and the frequency of the ultrasonic signal emitted by the acoustic layer is 12 MHz.

3. The fingerprint module according to claim 1, characterized in that: The second electrode layer includes a plurality of complementary metal oxide semiconductors formed on the substrate, at least some of the complementary metal oxide semiconductors being electrically connected to one side of the acoustic layer; The first electrode layer and the second electrode layer are used to provide the acoustic layer with voltage required for transmitting and receiving ultrasonic signals.

4. The fingerprint module according to claim 1, characterized in that: The first electrical connection region and the second electrode layer are located on the same side of the substrate.

5. The fingerprint module according to claim 1, characterized in that: The first electrical connection area includes a plurality of pins arranged side by side, the width of each pin of the plurality of pins is 0.09 mm, the length of the pins ranges from [0.3 mm to 0.385 mm], and the distance between two adjacent pins is 0.07 mm; At least part of the plurality of pins are electrically connected to the second electrical connection area.

6. The fingerprint module according to claim 5, characterized in that: A conductive plating layer is disposed on the pin, wherein the conductive plating layer is disposed on a connection side between the pin and the conductive adhesive layer.

7. The fingerprint module according to claim 1, characterized in that: The fingerprint module further comprises: an adhesive layer; The adhesive layer includes a first double-sided adhesive tape, a first copper foil layer, and a second double-sided adhesive tape, one side of the first copper foil layer is bonded to one side of the first double-sided adhesive tape, the other side of the first copper foil layer is bonded to one side of the second double-sided adhesive tape, the other side of the second double-sided adhesive tape is bonded to the substrate, and the second double-sided adhesive tape and the acoustic layer are respectively located on both sides of the substrate; The other side of the first double-sided adhesive is bonded to the electronic device outside the fingerprint module.

8. The fingerprint module according to claim 7, characterized in that: The thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 6 μm, and the thickness of the second double-sided adhesive tape is 3 μm; Alternatively, the thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 35 μm, and the thickness of the second double-sided adhesive tape is 6 μm; Alternatively, the thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 16 μm, and the thickness of the second double-sided adhesive tape is 16 μm. The thickness of the surface adhesive is 6 μm.

9. The fingerprint module according to claim 1, characterized in that: The conductive adhesive layer includes anisotropic conductive adhesive, and the thickness of the anisotropic conductive adhesive is 3 μm.

10. The fingerprint module according to claim 1, characterized in that: A protective adhesive is covered on a side of the conductive adhesive layer that exceeds the substrate, and the protective adhesive is in contact with at least the substrate, the conductive adhesive layer and the circuit board.

11. The fingerprint module according to any one of claims 1 to 10, characterized in that: The circuit board comprises a flexible circuit board, and the flexible circuit board comprises a first covering film, a first copper deposition layer, a second copper foil layer, a substrate layer, a third copper foil layer, a second copper deposition layer, and a second covering film; One side of the first covering film is bonded to one side of the first copper deposition layer, the other side of the first copper deposition layer is bonded to one side of the second copper foil layer, the other side of the second copper foil layer is bonded to one side of the base layer, the other side of the base layer is bonded to one side of the third copper foil layer, the other side of the third copper foil layer is bonded to one side of the second copper deposition layer, and the other side of the second copper deposition layer is bonded to one side of the second covering film; At one end of the flexible circuit board, the first covering film, the first copper foil layer and the second copper foil layer are indented by a first distance relative to the substrate layer, the third copper foil layer and the second copper foil layer are indented by a second distance relative to the substrate layer, and the second covering film is indented by a third distance relative to the substrate layer, the first distance is greater than the second distance, and the third distance is greater than the second distance, wherein the second covering film is indented relative to the third copper foil layer and the second copper foil layer to form the second electrical connection area.

12. A fingerprint module, characterized in that: include: Ultrasonic sensor and circuit board; The ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, wherein a second electrode layer is arranged on the substrate, one side of the acoustic layer is electrically connected to the second electrode layer, the other side of the acoustic layer is electrically connected to one side of the first electrode layer, and the protective layer covers the other side of the first electrode layer, wherein the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in a range of [48 μm, 60 μm], and the thickness of the substrate is in a range of [125 μm, 155 μm]; The substrate is provided with a first electrical connection area, the first electrode layer and the second electrode layer are electrically connected to the first electrical connection area respectively, the circuit board is provided with a second electrical connection area, and the first electrical connection area is electrically connected to the second electrical connection area through a conductive adhesive layer; The circuit board is electrically connected to the processing unit outside the fingerprint module, the acoustic layer is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures, the ultrasonic sensor is used to convert the ultrasonic signals received by the acoustic layer into electrical signals, and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signals, wherein the frequency range of the ultrasonic signals emitted by the acoustic layer is [7MHz, 9MHz].

13. The fingerprint module according to claim 12, characterized in that: The total thickness of the acoustic layer, the first electrode layer and the protective layer is 54 μm, the thickness of the substrate is 150 μm, and the frequency of the ultrasonic signal emitted by the acoustic layer is 8 MHz.

14. The fingerprint module according to claim 12, characterized in that: The second electrode layer includes a plurality of complementary metal oxide semiconductors formed on the substrate, at least some of the complementary metal oxide semiconductors being electrically connected to one side of the acoustic layer; The first electrode layer and the second electrode layer are used to provide the acoustic layer with voltage required for transmitting and receiving ultrasonic signals.

15. The fingerprint module according to claim 12, characterized in that: The first electrical connection region and the second electrode layer are located on the same side of the substrate.

16. The fingerprint module according to claim 12, characterized in that: The first electrical connection area includes a plurality of pins arranged side by side, the width of each pin of the plurality of pins is 0.09 mm, the length of the pins ranges from [0.3 mm to 0.385 mm], and the distance between two adjacent pins is 0.07 mm; At least part of the plurality of pins are electrically connected to the second electrical connection area.

17. The fingerprint module according to claim 16, characterized in that: A conductive plating layer is disposed on the pin, wherein the conductive plating layer is disposed on a connection side between the pin and the conductive adhesive layer.

18. The fingerprint module according to claim 12, characterized in that: The fingerprint module further comprises: an adhesive layer; The adhesive layer includes a first double-sided adhesive tape, a first copper foil layer, and a second double-sided adhesive tape, one side of the first copper foil layer is bonded to one side of the first double-sided adhesive tape, the other side of the first copper foil layer is bonded to one side of the second double-sided adhesive tape, the other side of the second double-sided adhesive tape is bonded to the substrate, and the second double-sided adhesive tape and the acoustic layer are respectively located on both sides of the substrate; The other side of the first double-sided adhesive is bonded to the electronic device outside the fingerprint module.

19. The fingerprint module according to claim 18, characterized in that: The thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 6 μm, and the thickness of the second double-sided adhesive tape is 3 μm; Alternatively, the thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 35 μm, and the thickness of the second double-sided adhesive tape is 6 μm; Alternatively, the thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 16 μm, and the thickness of the second double-sided adhesive tape is 6 μm.

20. The fingerprint module according to claim 12, characterized in that: The conductive adhesive layer includes anisotropic conductive adhesive, and the thickness of the anisotropic conductive adhesive is 3 μm.

21. The fingerprint module according to claim 12, characterized in that: A protective adhesive is covered on a side of the conductive adhesive layer that exceeds the substrate, and the protective adhesive is in contact with at least the substrate, the conductive adhesive layer and the circuit board.

22. The fingerprint module according to any one of claims 12 to 21, characterized in that: The circuit board comprises a flexible circuit board, and the flexible circuit board comprises a first covering film, a first copper deposition layer, a second copper foil layer, a substrate layer, a third copper foil layer, a second copper deposition layer, and a second covering film; One side of the first covering film is bonded to one side of the first copper deposition layer, the other side of the first copper deposition layer is bonded to one side of the second copper foil layer, the other side of the second copper foil layer is bonded to one side of the base layer, the other side of the base layer is bonded to one side of the third copper foil layer, the other side of the third copper foil layer is bonded to one side of the second copper deposition layer, and the other side of the second copper deposition layer is bonded to one side of the second covering film; At one end of the flexible circuit board, the first covering film, the first copper foil layer and the second copper foil layer are indented by a first distance relative to the substrate layer, the third copper foil layer and the second copper foil layer are indented by a second distance relative to the substrate layer, and the second covering film is indented by a third distance relative to the substrate layer, the first distance is greater than the second distance, and the third distance is greater than the second distance, wherein the second covering film is indented relative to the third copper foil layer and the second copper foil layer to form the second electrical connection area.

23. A fingerprint module, characterized in that: include: Ultrasonic sensor and circuit board; The ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, wherein a second electrode layer is arranged on the substrate, one side of the acoustic layer is electrically connected to the second electrode layer, the other side of the acoustic layer is electrically connected to one side of the first electrode layer, and the protective layer covers the other side of the first electrode layer, wherein the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in a range of [44 μm, 50 μm], and the thickness of the substrate is in a range of [85 μm, 115 μm]; The substrate is provided with a first electrical connection area, the first electrode layer and the second electrode layer are electrically connected to the first electrical connection area respectively, the circuit board is provided with a second electrical connection area, and the first electrical connection area is electrically connected to the second electrical connection area through a conductive adhesive layer; The circuit board is electrically connected to the processing unit outside the fingerprint module, the acoustic layer is used to transmit ultrasonic signals and receive ultrasonic signals reflected by the external structure, and the ultrasonic sensor is used to transmit the ultrasonic signals received by the acoustic layer. The wave signal is converted into an electrical signal, and the electrical signal is sent to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signal, wherein the frequency range of the ultrasonic signal emitted by the acoustic layer is [9MHz, 11MHz].

24. The fingerprint module according to claim 23, characterized in that: The sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is 47 μm, the thickness of the substrate is 90 μm, and the frequency of the ultrasonic signal emitted by the acoustic layer is 10 MHz.

25. The fingerprint module according to claim 23, characterized in that: The second electrode layer includes a plurality of complementary metal oxide semiconductors formed on the substrate, at least some of the complementary metal oxide semiconductors being electrically connected to one side of the acoustic layer; The first electrode layer and the second electrode layer are used to provide the acoustic layer with voltage required for transmitting and receiving ultrasonic signals.

26. The fingerprint module according to claim 23, characterized in that: The first electrical connection region and the second electrode layer are located on the same side of the substrate.

27. The fingerprint module according to claim 23, characterized in that: The first electrical connection area includes a plurality of pins arranged side by side, the width of each pin of the plurality of pins is 0.09 mm, the length of the pins ranges from [0.3 mm to 0.385 mm], and the distance between two adjacent pins is 0.07 mm; At least part of the plurality of pins are electrically connected to the second electrical connection area.

28. The fingerprint module according to claim 27, characterized in that: A conductive plating layer is disposed on the pin, wherein the conductive plating layer is disposed on a connection side between the pin and the conductive adhesive layer.

29. The fingerprint module according to claim 23, characterized in that: The fingerprint module further comprises: an adhesive layer; The adhesive layer includes a first double-sided adhesive tape, a first copper foil layer, and a second double-sided adhesive tape, one side of the first copper foil layer is bonded to one side of the first double-sided adhesive tape, the other side of the first copper foil layer is bonded to one side of the second double-sided adhesive tape, the other side of the second double-sided adhesive tape is bonded to the substrate, and the second double-sided adhesive tape and the acoustic layer are respectively located on both sides of the substrate; The other side of the first double-sided adhesive is bonded to the electronic device outside the fingerprint module.

30. The fingerprint module according to claim 29, characterized in that: The thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 6 μm, and the thickness of the second double-sided adhesive tape is 3 μm; Alternatively, the thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 35 μm, and the thickness of the second double-sided adhesive tape is 6 μm; Alternatively, the thickness of the first double-sided adhesive tape is 6 μm, the thickness of the first copper foil layer is 16 μm, and the thickness of the second double-sided adhesive tape is 6 μm.

31. The fingerprint module according to claim 23, characterized in that: The conductive adhesive layer includes anisotropic conductive adhesive, and the thickness of the anisotropic conductive adhesive is 3 μm.

32. The fingerprint module according to claim 23, characterized in that: A protective adhesive is covered on a side of the conductive adhesive layer that exceeds the substrate, and the protective adhesive is in contact with at least the substrate, the conductive adhesive layer and the circuit board.

33. The fingerprint module according to any one of claims 23 to 32, characterized in that: The circuit board comprises a flexible circuit board, and the flexible circuit board comprises a first covering film, a first copper deposition layer, a second copper foil layer, a substrate layer, a third copper foil layer, a second copper deposition layer, and a second covering film; One side of the first covering film is bonded to one side of the first copper deposition layer, the other side of the first copper deposition layer is bonded to one side of the second copper foil layer, the other side of the second copper foil layer is bonded to one side of the base layer, the other side of the base layer is bonded to one side of the third copper foil layer, the other side of the third copper foil layer is bonded to one side of the second copper deposition layer, and the other side of the second copper deposition layer is bonded to one side of the second covering film; At one end of the flexible circuit board, the first covering film, the first copper foil layer and the second copper foil layer are indented by a first distance relative to the substrate layer, the third copper foil layer and the second copper foil layer are indented by a second distance relative to the substrate layer, and the second covering film is indented by a third distance relative to the substrate layer, the first distance is greater than the second distance, and the third distance is greater than the second distance, wherein the second covering film is indented relative to the third copper foil layer and the second copper foil layer to form the second electrical connection area.

34. An electronic device, characterized in that: include: A processing unit, a screen, and a fingerprint module as described in any one of claims 1 to 33; The fingerprint module is arranged on the back of the screen, and the processing unit is electrically connected to a circuit board in the fingerprint module.

35. The electronic device according to claim 34, characterized in that The screen is a non-folding screen, and comprises a screen substrate and a buffer layer that are bonded to each other, and the buffer layer is used to buffer the screen; The buffer layer is provided with a first through hole, and the ultrasonic sensor included in the fingerprint module passes through the first through hole and is bonded to the screen substrate through an adhesive layer.

36. The electronic device according to claim 35, characterized in that: The buffer layer has the same color as the first double-sided tape included in the adhesive layer.

37. The electronic device according to claim 35, characterized in that: The electronic device further comprises a first shading structure and a first fixing structure, wherein the first shading structure is used to cover the gap formed between the edge of the adhesive layer and the edge of the first through hole, and the first fixing structure is used to fix the edge of the ultrasonic sensor on the adhesive layer.

38. The electronic device according to claim 37, characterized in that: The first light-shielding structure includes light-shielding glue, and the curing shrinkage rate of the light-shielding glue is less than 3%.

39. The electronic device according to claim 37, characterized in that: The first fixing structure includes fixing glue, and the curing shrinkage rate of the fixing glue is less than 3%.

40. The electronic device according to claim 35, characterized in that The electronic device further comprises a second fixing structure, and the second fixing structure is used to fix the edge of the ultrasonic sensor on the screen substrate.

41. The electronic device according to claim 34, characterized in that The screen is a folding screen, and the screen includes a supporting sheet, and the supporting sheet is used to support the screen; The ultrasonic sensor included in the fingerprint module is bonded to the supporting sheet through an adhesive layer.

42. The electronic device according to claim 41, characterized in that The electronic device further includes a third fixing structure, and the third fixing structure is used to fix the edge of the ultrasonic sensor on the adhesive layer.

43. The electronic device according to claim 41, characterized in that The electronic device further includes a fourth fixing structure, and the fourth fixing structure is used to fix the edge of the ultrasonic sensor on the supporting sheet.

44. The electronic device according to claim 43, characterized in that The edge of the adhesive layer does not exceed the edge of the ultrasonic sensor.

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