Optical sensor package structure for enabling sensing through light reception of ultraviolet wavelength band and converting ultraviolet signal into digital signal, and manufacturing method therefor

Abstract

The present invention relates to an optical sensor package structure for enabling sensing through light reception of an ultraviolet wavelength band and converting an ultraviolet signal into a digital signal, and a manufacturing method therefor, the package structure comprising: a light-blocking agent, which is provided on a PCB on which an element unit for sensing light is mounted, is shaped to encompass the element unit and exposes a light-receiving portion for receiving light in the element unit, and is made of a material that can block visible light introduced to the side surface of the element unit that excludes the light-receiving portion; and a diffusing agent, which is provided in the light-receiving portion of the element unit, can diffuse the light while allowing the light to pass therethrough, and is made of a material including silicon dioxide.

Description

A package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts ultraviolet signals into digital signals, and a manufacturing method thereof

[0001] The present invention relates to a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, and a method for manufacturing the same, and more particularly, to a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, and a method for manufacturing the same, which has an improved structure so as to reduce measurement deviation according to the angle of incidence of ultraviolet light incident on the optical sensor and minimize changes in sensing sensitivity according to changes in the angle of incidence.

[0002] COB (chip on board) type optical sensor chip mounted on the upper surface of the printed circuit board

[0003] The sensor generally has electrode pads formed on the lower surface to be electrically connected to the main board, and the printed circuit on the upper surface and the electrode pad on the lower surface are electrically connected through through holes. The electrical connection through the through hole is achieved by a hole penetrating the printed circuit on the upper surface and the electrode pad on the lower surface, and the inside of the hole is plated to electrically connect the printed circuit on the upper surface and the electrode pad on the lower surface.

[0004] These optical sensors are configured with a package to ensure light blocking from the outside and reliability of semiconductor characteristics. Conventional optical sensors have problems such as measurement deviation depending on the incident angle of light, sensing sensitivity changing with changes in the incident angle, a decrease in the absolute amount of light incident on the optical sensor due to increased reflectivity on the lens surface provided on the optical sensor, and noise generation due to external light and external moisture.

[0005] As for prior art, there is Patent Publication No. 10-2016-0073451.

[0006] The present invention has been made to solve the above problems, and the purpose of the present invention is to provide a package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, and a method for manufacturing the same, which reduces measurement deviation according to the angle of incidence of ultraviolet light incident on an optical sensor, minimizes changes in sensing sensitivity according to changes in the angle of incidence, prevents a decrease in the absolute amount of light incident on an optical sensor, and enables blocking of external light and moisture.

[0007] The problems solved by the present invention are not limited to those mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the description below.

[0008] In order to achieve the above object, the present invention provides a package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, which is provided on a PCB substrate on which a light-sensing element is mounted, and includes: a light-shielding material that surrounds the element while exposing a light-receiving portion that receives light from the element, and is made of a material that enables light-shielding of visible light entering through a side of the element except for the light-receiving portion; and a diffusion material that is provided on the light-receiving portion of the element, allows the light to be transmitted and diffused, and is made of a material including silicon dioxide (SiO2).

[0009] The present invention preferably further comprises a filter unit comprising a filter portion formed in a form laminated on the diffusion agent and made of a material that transmits light of a specific wavelength, and a pad portion provided on the filter portion and positioned at a portion facing the light-receiving portion of the element portion, the pad portion relatively reducing the amount of direct light incident on the light-receiving portion.

[0010] The pad portion of the above filter unit faces the center of the light-receiving portion, has an area narrower than the area of ​​the light-receiving portion, and may be made of a material capable of blocking light.

[0011] The present invention preferably further includes a package dam portion, which is provided between the filter portion of the filter unit and the PCB substrate, and has a structure that surrounds the side surfaces of the light-blocking agent and the diffuser, and blocks light entering the side surface of the diffuser.

[0012] In addition, a method for manufacturing a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to the present invention comprises: a dam forming step in which a mold unit forms a package dam portion on a border portion of a PCB substrate having a light-sensing element portion mounted thereon through a molding process, thereby forming a placement space on the PCB substrate in which the element portion can be placed and has one open side; a light-shielding material forming step in which a mask unit is seated on the package dam portion in a form that covers the placement space, and a light-blocking material is introduced into the placement space through an inlet slit formed in the mask unit to form a light-shielding material in a form that surrounds a side surface of the element portion; a coating step in which the mask unit is separated from the package dam portion, and a light-transmitting material is introduced into the placement space, thereby causing a diffusion material to be laminated on a light-receiving portion of the element portion; And, it can be achieved by including a filter mounting step of installing a filter unit that transmits light of a specific wavelength and reduces the amount of direct light incident on the light-receiving portion in the package dam portion, thereby laminating the filter unit on the diffusion agent.

[0013] The package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal and the manufacturing method thereof according to the present invention having the configuration described above are structured such that a light-blocking material surrounds the side of an element portion mounted on a PCB substrate to block light and moisture from entering the side of the element portion, and a diffusion material is provided on a light-receiving portion of the element portion and is made of a material that transmits ultraviolet light, so that ultraviolet light incident on the light-receiving portion passes through and diffuses it, thereby reducing measurement deviation according to the incident angle of ultraviolet light incident on the optical sensor, minimizing changes in sensing sensitivity according to changes in the incident angle, and preventing a decrease in the absolute amount of light incident on the optical sensor, as well as enabling blocking of external light and moisture entering from the outside.

[0014] The effects of the present invention are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below.

[0015] FIG. 1 is a cross-sectional view illustrating a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention.

[0016] Figure 2 is a plan view of one embodiment of the present invention.

[0017] FIG. 3 is a block diagram illustrating a method for manufacturing a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention.

[0018] Figure 4 is a conceptual diagram for explaining a manufacturing method of one embodiment of the present invention.

[0019] FIG. 5 and FIG. 6 are drawings for explaining a mask unit for forming a light-blocking agent in a manufacturing method of one embodiment of the present invention.

[0020] FIG. 7 is a drawing for explaining an extension rib employed in a mask unit used for forming a shade in a manufacturing method of one embodiment of the present invention.

[0021] To ensure a clear understanding of the present invention, descriptions of known techniques related to the features of the present invention will be omitted in the following description. The following examples are provided as detailed descriptions to aid understanding of the present invention and should not be construed as limiting the scope of the invention. Therefore, equivalent inventions that perform the same functions as the present invention will also fall within the scope of the invention.

[0022] In the following description, identical identifiers denote identical configurations, and unnecessary redundant descriptions and descriptions of known technologies will be omitted. Furthermore, descriptions of each embodiment of the present invention below that overlap with the description of the technology underlying the invention will also be omitted.

[0023] Hereinafter, a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention will be described in detail with reference to the attached drawings.

[0024] FIG. 1 is a cross-sectional view illustrating a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention, and FIG. 2 is a plan view of one embodiment of the present invention.

[0025] As shown in FIGS. 1 and 2, a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention comprises a light-blocking agent (100) and a diffusion agent (200).

[0026] The above-mentioned shading agent (100) is provided on a PCB substrate on which a light-sensing element is mounted, and is formed in a form that surrounds the element (10), but exposes the light-receiving portion (11) that receives light from the element (10). The shading agent (100) is formed of a material that blocks visible light, and is capable of blocking light entering the side of the element (10) except for the light-receiving portion (11).

[0027] The above-mentioned light-blocking agent (100) is made of a material such as an opaque liquid resin having a property of blocking visible light, and is applied to the upper surface by a diffusion agent provided on the light-receiving portion (11) of the element so as to cover the light-receiving portion. The light-blocking agent (100) prevents visible light and moisture from entering the outside of the element (10), thereby preventing the sensing sensitivity of the element from being lowered and errors in light sensing. Here, the light sensed by the element refers to ultraviolet rays.

[0028] The above-mentioned diffuser (200), as illustrated in FIG. 1, is provided with a structure laminated on the light-receiving portion (11) of the element portion (10) that receives ultraviolet rays, and can be made of a material including silicon dioxide (SiO2) that allows ultraviolet rays to be transmitted while allowing them to be diffused, and that allows light including ultraviolet rays to be transmitted. The above-mentioned diffuser (200) can reduce measurement deviation according to the incident angle of ultraviolet rays incident on the optical sensor, and minimize changes in sensing sensitivity according to changes in the incident angle, by diffusing light including ultraviolet rays when the light is incident and allowing the light to be transmitted to the light-receiving portion.

[0029] The above-mentioned diffusion agent (200) can be formed of an epoxy resin or a silicone resin for ultraviolet ray transmission and diffusion, and can be formed of various materials that can transmit light, such as a liquid resin for an optical waveguide, and can prevent a decrease in the absolute amount of ultraviolet ray incident on the light-receiving portion.

[0030] A package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention having such a configuration is configured such that a light-blocking material (100) surrounds the side of an element portion mounted on a PCB board to block light and moisture from entering the side of the element portion (10), and a diffusion material (200) is provided on a light-receiving portion (11) of the element portion (10) and is made of a material that transmits ultraviolet light, thereby passing and diffusing ultraviolet light incident on the light-receiving portion, thereby reducing measurement deviation according to the incident angle of ultraviolet light incident on the optical sensor, minimizing changes in sensing sensitivity according to changes in the incident angle, and preventing a decrease in the absolute amount of light incident on the optical sensor, as well as enabling blocking of external light and moisture.

[0031] Meanwhile, it is preferable that the present embodiment further includes a filter unit (300) and a package dam section (400).

[0032] The above filter unit (300), as illustrated in Fig. 1, can transmit light of a specific wavelength and control the amount of direct light, and can be composed of a filter portion (310) and a pad portion (320). The filter portion (310) of the filter unit (300) is made of a material that can transmit light of a specific wavelength, i.e., ultraviolet rays, and is provided in a form laminated on the upper surface of the diffusion agent (200), allowing only ultraviolet rays to be incident on the diffusion agent (200).

[0033] The filter part (310) is connected to the pad part (320), and allows the pad part (320) to be placed at a portion that comes into contact with the diffuser (200). In addition, the filter part (310) allows the light-receiving part (11) of the element part to receive only ultraviolet rays, and allows ultraviolet rays to be scattered in the diffuser (200). Here, the specific wavelength of light transmitted to the diffuser (200) by the filter part (310) may vary depending on the type of the filter part.

[0034] The pad portion (320) of the above filter unit (300) is provided in the filter portion (310), and is positioned at a portion facing the light-receiving portion of the element portion (10), and relatively reduces the amount of direct light incident on the light-receiving portion, thereby minimizing the measurement deviation of the light sensor, minimizing changes in sensing sensitivity, and preventing errors during sensor operation. The pad portion (320) may be made of various materials capable of blocking light, and may also be made of a material that has been plated to reduce the amount of light.

[0035] The above pad portion (320) is positioned so as to face the center of the light-receiving portion (11) at a position facing the element portion (100), and can be formed with an area narrower than the area of ​​the light-receiving portion, thereby reducing the amount of direct light and maintaining sensing sensitivity.

[0036] The above package dam part (400) is provided between the filter part (310) of the filter unit (300) and the PCB substrate (200), and has a structure that surrounds the side of the light-blocking agent (100) and the diffusion agent (200), thereby blocking light entering through the side of the diffusion agent (200), thereby ensuring the structural stability of the optical sensor, increasing reliability during sensing, and preventing sensing sensitivity and errors due to the inflow of external light and moisture.

[0037] The above package dam part (400) may be configured to support the filter part (310) so that the filter part (310) is placed at the upper end (see (b) of FIG. 1), or may have an insertion opening (401) at the upper end so that the filter part (310) is inserted (see (a) of FIG. 1).

[0038] The shading agent (100) employed in this embodiment is configured to cover the side of the element portion (10) except for the light-receiving portion (11), as described above, but preferably, the height from the PCB substrate is formed to be lower than the height from the PCB substrate (20) to the upper surface of the element portion, and allows ultraviolet rays scattered by the diffusion agent (200) after passing through the filter portion (310) to smoothly be incident only on the light-receiving portion (11) of the element portion.

[0039] Above, the package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength range and converts ultraviolet signals into digital signals according to an embodiment of the present invention has been described. Below, a method for manufacturing the package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength range and converts ultraviolet signals into digital signals according to an embodiment of the present invention will be described.

[0040] FIG. 3 is a block diagram for explaining a method for manufacturing a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention, FIG. 4 is a conceptual diagram for explaining a method for manufacturing an embodiment of the present invention, FIGS. 5 and 6 are drawings for explaining a mask unit for forming a light-blocking agent in a method for manufacturing an embodiment of the present invention, and FIG. 7 is a drawing for explaining an extension rib employed in a mask unit used for forming a light-blocking agent in a method for manufacturing an embodiment of the present invention.

[0041] As illustrated in FIG. 3, a method for manufacturing a package structure for an optical sensor that enables sensing through light reception in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention includes a dam forming step (S100), a light-blocking agent forming step (S200), a coating step (S300), and a filter mounting step (S400).

[0042] The above dam forming step (S100) enables the formation of a package dam portion (400) through a molding process using a mold unit. The above dam forming step (S100) forms a package dam portion (400) through a molding process on the edge portion of a PCB substrate (20) on which a light-sensing element portion (10) is mounted, thereby forming a placement space on the PCB substrate where the element portion (10) can be placed and where one side is open. The above dam forming step (S100) enables the implementation of the package dam portion (400) using an epoxy resin or the like. Here, in the placement space, a circuit pattern that is electrically connected to the element portion and provided on the PCB substrate is placed together with the element portion.

[0043] The above-mentioned shading agent forming step (S200) allows the mask unit (500) to be mounted on the package dam portion (400) in a form that covers the arrangement space, and allows a light-blocking material to be introduced into the arrangement space through an inlet slit (501) formed in the mask unit (500) to form a shading agent (100) that wraps around the side surface of the element portion.

[0044] As illustrated in FIG. 4, the above-described light-blocking agent forming step (S200) uses the mask unit (500) to prevent the light-blocking agent (100) from invading the wire connecting the upper surface of the element portion (100) and the circuit pattern, and causes the light-blocking agent (200) to be introduced into the filling space so that the height of the light-blocking agent (200) from the PCB substrate (20) is formed lower than the height to the upper surface of the element portion. In addition, the light-blocking agent forming step (S200) may further include a curing step of curing the light-blocking agent (100) made of the light-blocking agent for a preset time at a preset temperature so that the light-blocking agent (100) can be stably formed on the PCB substrate while wrapping the side surface of the element portion.

[0045] The above-described application step (S300) separates the mask unit (500) from the package dam portion (400), and introduces a light-transmitting material into the arrangement space so that a diffusion agent (200) is laminated on the light-receiving portion (11) of the element portion (10). In the above-described application step (S300), a light-transmitting material is introduced into the arrangement space to form the diffusion agent (200), and the diffusion agent is formed to have a height equal to or lower than the height of the package dam portion (400), so that ultraviolet rays are scattered while passing through the diffusion agent and are transmitted to the light-receiving portion of the element portion. The light-transmitting material introduced into the arrangement space in the above-described application step (S300) may be formed of a liquid resin for an optical waveguide, and a resin curing step of curing the liquid resin for an optical waveguide introduced into the arrangement space to form the diffusion agent may be further included.

[0046] The above filter mounting step (S400) installs a filter unit (300) that transmits light of a specific wavelength and reduces the amount of direct light incident on the light-receiving portion, in the package dam portion (400), so that the filter portion (310) is laminated on the diffusion agent, thereby enabling the element portion to sense only the ultraviolet rays scattered by the diffusion agent after passing through the filter portion.

[0047] Meanwhile, in the above-described shading agent forming step (S200), it is preferable that the mask unit (500) for forming the shading agent includes a base plate portion (510), a cover portion (520), and a connecting rib (530) as illustrated in FIGS. 5 and 6. The base plate portion (510) is secured to the package dam portion (400) by a device that enables traction, and has a through hole to enable the introduction of a light-blocking material toward the arrangement space where the shading agent is formed.

[0048] The above cover part (520) is formed with an area corresponding to the light-receiving part (11) of the element part, is arranged in the through hole of the base plate part (510), forms an inlet slit (501) between it and the base plate part (510), and is formed to protrude toward the light-receiving part (11) to cover the light-receiving part (11), thereby allowing a light-blocking material to enter the arrangement space in a form that wraps around the outside of the element part (10) via the inlet slit (501), while preventing a light-blocking agent from being applied to the light-receiving part (11).

[0049] The above connecting rib (530) connects the base plate portion (510) and the cover portion (520), and maintains the shape of the inlet slit (501) for introducing the light blocking material into the arrangement space, thereby enabling smooth introduction of the light blocking material into the arrangement space and stably fixing the cover portion (520) to the upper side of the element portion (10).

[0050] Meanwhile, the cover part (520) may be provided with a cover groove (521) that prevents the exposure of the wire (30) so as to prevent the wire from being coated by the light-blocking material when the light-blocking material is introduced. The cover groove (521) is preferably provided at a portion facing the wire and is formed in a groove shape.

[0051] As illustrated in FIG. 7, the cover portion (520) may be provided with an extension rib (522) that extends toward the PCB substrate (20) to define the cover groove along with the formation of the cover groove. The extension rib (522) is provided on the outside of the cover portion, and prevents the wire from being exposed to the arrangement space while inserted into the cover groove (521). The extension rib (522) may be formed to be inclined toward the inside of the package dam portion, so that when a light-blocking material is introduced toward the arrangement space to form the light-blocking agent, the light-blocking material is not applied to the wire, but is introduced only toward the side of the element portion.

[0052] The above-described dam formation step (S100), shade formation step (S200), application step (S300), and filter mounting step (S400) can be performed by a mold unit, a traction device, a device for injecting liquid materials, and a molding device for performing each step, and can be performed by a controller (not shown) having a built-in program for driving each device. In addition, the controller can be implemented by a computer or a dedicated terminal having a built-in program.

[0053] Although various embodiments of the present invention have been described above, the embodiments and the drawings attached to the present specification only clearly show a part of the technical idea included in the present invention, and it will be obvious that all modified examples and specific embodiments that can be easily inferred by a person skilled in the art within the scope of the technical idea included in the specification and drawings of the present invention are included in the scope of the rights of the present invention.

Claims

1. A light-shielding material provided on a PCB substrate equipped with a light-sensing element, configured to surround the element, while exposing a light-receiving portion that receives light from the element, and capable of blocking visible light entering the side of the element excluding the light-receiving portion; and A package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts ultraviolet signals into digital signals, comprising a diffuser provided in the light-receiving portion of the above-mentioned element, allowing the light to be transmitted and diffused, and made of a material including silicon dioxide.

2. In paragraph 1, A package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, characterized in that it further comprises a filter unit having a filter section that is provided in a form laminated on the above-mentioned diffuser and made of a material that transmits light of a specific wavelength, and a pad section that is provided on the filter section and is positioned at a portion facing the light-receiving portion of the element section and relatively reduces the amount of direct light incident on the light-receiving portion.

3. In paragraph 2, The pad portion of the above filter unit is A package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts ultraviolet signals into digital signals, characterized in that it faces the center of the light-receiving portion, has a narrower area than the area of ​​the light-receiving portion, and is made of a material capable of blocking light.

4. In paragraph 2, A package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, characterized in that it further comprises a package dam portion that is provided between the filter portion of the filter unit and the PCB substrate, and has a structure that surrounds the side surfaces of the light-blocking agent and the diffuser and blocks light entering through the side surface of the diffuser.

5. A dam forming step in which a mold unit forms a package dam portion by a molding process on the edge portion of a PCB substrate on which a light-sensing element is mounted, thereby forming a placement space on which an element portion can be placed on the PCB substrate and having one side open; A light-blocking material forming step in which a mask unit is placed on the package dam portion in a form that covers the arrangement space, and a light-blocking material is introduced into the arrangement space through an inlet slit formed in the mask unit to form a light-blocking material that wraps around the side of the element portion; A coating step of separating the mask unit from the above package dam section and introducing a light-transmitting material into the arrangement space so that a diffusion agent is deposited on the light-receiving section of the element section; and A method for manufacturing a package structure for an optical sensor that enables sensing through light reception in the ultraviolet wavelength band and converts ultraviolet signals into digital signals, comprising: a filter mounting step of installing a filter unit that transmits light of a specific wavelength and reduces the amount of direct light incident on the light-receiving portion in the package dam portion, thereby laminating the filter unit on a diffusion agent;

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