Switch device
The switch device with a glass-resin composite of specific thickness and support structure addresses thermal deformation issues, ensuring reliable operation by minimizing unevenness and maintaining functionality under heat.
WO2025069528A1 Publication Date: 2025-04-03NITTO DENKO CORP
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Patent Information
- Application Number
- PCT/JP2024/015329
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-28
- Filing Date
- 2024-04-17
- Publication Date
- 2025-04-03
AI Technical Summary
Technical Problem
Existing switch devices with a composite of glass and resin layers experience unevenness due to differential thermal expansion, leading to deformation and functional issues when heated.
Method used
A switch device design comprising a first glass layer, a resin layer, and a second glass layer, with a total thickness of 230 μm or less, supported by a structure that allows elastic deformation to switch between conductive and non-conductive states, minimizing thermal deformation.
Benefits of technology
The design effectively reduces thermal unevenness and maintains functional integrity by ensuring the composite remains flat and functional under heat, enabling reliable operation of the switch.
✦ Generated by Eureka AI based on patent content.
Abstract
A switch device (1) comprises: a composite body (10) including a first glass layer (11), a resin layer (12) laminated on the bottom surface side of the first glass layer, and a second glass layer (13) laminated on the bottom surface side of the resin layer; a support unit (30) that is disposed on the bottom surface side of the second glass layer of the composite body, has an opening (30x), and supports the composite body at the outside of the opening; and a switch (40), at least a portion of which is disposed inside the opening. The total thickness of the composite body is 230 μm or less. When the composite body is pressed, the composite body is elastically deformed, such that the switch is switched between conduction and non-conduction.
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