Photosensitive composition, cured product, electronic component, and method for producing cured product

Abstract

The purpose of the present invention is to provide a cured product provided in an electronic component that suppresses residue at the bottom of a pattern, has excellent halftone characteristics, excellent mechanical properties, and excellent migration resistance, and to provide an electronic component having excellent migration resistance. The present invention is a photosensitive composition containing (A) a binder resin and (C1-1) an oxime ester-based compound, and further containing either or both of (B) a radically polymerizable compound and (F) a crosslinking agent, wherein the (C1-1) oxime ester-based compound has: a structure (Ia), which is a condensed polycyclic heterocyclic structure composed of two rings, or a condensed polycyclic heterocyclic structure composed of three rings including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure, or a dihydropyrrole structure; a structure (Ib), which is an oxime ester carbonyl structure; and a structure (Ic), which is an aromatic structure.

Description

Photosensitive composition, cured product, electronic component, and method for producing the cured product

[0001] The present invention relates to a photosensitive composition, a cured product, an electronic component, and a method for producing the cured product.

[0002] In recent years, efforts have been made to reduce costs and increase integration by improving the efficiency of semiconductor manufacturing processes, and semiconductor devices that form multilayer metal rewiring have attracted attention. Materials used for interlayer insulating layers in such multilayer metal rewiring are required to have high mechanical properties to withstand the stress associated with multilayering. Furthermore, they must also be able to suppress development residues during positive or negative pattern formation by photolithography. In addition, as wiring becomes finer with the increasing integration of semiconductor devices, reliability in terms of electrical insulation is also required, so high migration resistance is also required.

[0003] Furthermore, in the manufacture of organic electroluminescence (hereinafter "organic EL") displays, a process is also applied in which a step shape in a pixel dividing layer having a thick region (hereinafter "thick film portion") that serves as a support base for a vapor deposition mask when forming a film of a light-emitting material and a thin film portion (hereinafter "thin film portion") that is thinner than the thick film portion is formed all at once using a half-tone photomask. Therefore, materials used for pixel dividing layers and the like are required to have excellent half-tone characteristics in order to reduce process time and improve yield.

[0004] An example of the photosensitive composition is a negative photosensitive composition containing polyimide and a photopolymerization initiator having a specific structure (see, for example, Patent Document 1).

[0005] WO 2018 / 173840

[0006] However, the composition described in Patent Document 1 does not combine suppression of residue at the bottom of a pattern, halftone properties, mechanical properties, and migration resistance, and further improvement in properties is desired. An object of the present invention is to provide a cured product for use in electronic components that combines suppression of residue at the bottom of a pattern and excellent halftone properties, while also having excellent mechanical properties and excellent migration resistance. Another object of the present invention is to provide an electronic component that has excellent migration resistance.

[0007] In order to solve the above-mentioned problems, the photosensitive composition and electronic device of the present invention have the following structures [1] to

[20] . [1] A photosensitive composition containing (A) a binder resin and (C1-1) an oxime ester compound, and further containing either or both of (B) a radically polymerizable compound and (F) a crosslinking agent, wherein the (C1-1) oxime ester compound has all of the following structures (Ia), (Ib), and (Ic) in its molecular structure: Structure (Ia): a fused polycyclic heterocyclic structure composed of two rings, or a fused polycyclic heterocyclic structure composed of three rings including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure, or a dihydropyrrole structure; Structure (Ib): an oxime ester carbonyl structure; Structure (Ic): an aromatic structure. [2] The photosensitive composition according to [1] above, wherein all or a part of the binder resin (A) is a resin having the following weakly acidic group (WA) in its structure (hereinafter referred to as "resin (A1)"). (WA) weakly acidic group: one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group. [3] The photosensitive composition according to [1] or [2] above, further containing one or more groups selected from the group consisting of benzene, toluene, xylene, and naphthalene, and satisfying the following condition (1): Condition (1): The total content of benzene, toluene, xylene, and naphthalene in the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less. [4] The photosensitive composition according to any one of [1] to [3] above, wherein the structure (Ia) is an indole structure, a benzoindole structure, an indoline structure, a benzoindoline structure, a benzofuran structure, a naphthofuran structure, a benzothiophene structure, a naphthothiophene structure, a benzodihydrofuran structure, a naphthodihydrofuran structure, a benzodihydrothiophene structure, or a naphthodihydrothiophene structure, and the structure (Ic) is an aromatic structure to which an arylcarbonyl group, an alkylcarbonyl group, a nitro group, a cyano group, a halogen atom, or a heterocyclic group is bonded.[5] The photosensitive composition according to any one of [1] to [4] above, wherein the (C1-1) oxime ester compound further has the following structure (Id) in its molecular structure: Structure (Id): either or both of an aliphatic group having 1 to 20 carbon atoms and an alicyclic group having 4 to 20 carbon atoms. [6] The photosensitive composition according to [2] to [5] above, wherein the (A1) resin includes the following resin (A1x): Resin (A1x): a resin having one or more structures selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure in its structural unit. [7] The photosensitive composition according to [6], wherein all or a part of the (A1x) resin is one or more selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof, all of which have a weakly acidic group in their structure, and the (A1x) resin has either or both of the (WA) amine residue having a weakly acidic group and the (WA) carboxylic acid residue having a weakly acidic group. [8] The photosensitive composition according to any one of [2] to [7], wherein the (A) binder resin contains an (A1) resin, which contains the following (A1y) resin, and all or a part of the (A1y) resin is one or more selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins. (A1y) resin: a resin having a phenolic hydroxyl group in its structural unit. [9] The photosensitive composition according to any one of [1] to [8] above, wherein the binder resin (A) contains an (A1) resin and a (WA) resin not having a weakly acidic group in its structure (hereinafter referred to as "(A2) resin"), the (A1) resin contains either or both of the following (A1x) resin and (A1y) resin, and the (A2) resin contains either or both of the following (A2x) resin and (A2y) resin. (A1x) resin: a resin having, in its structural unit, one or more structures selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure. (A1y) resin: a resin having, in its structural unit, a phenolic hydroxyl group. (A2x) resin: a resin having, in its structure, a radically polymerizable group.(A2y) resin: a resin having no radical polymerizable group in its structure.

[10] The photosensitive composition according to any one of [1] to [9] above, wherein the (A) binder resin satisfies the following condition (P1α): Condition (P1α): The fluorine content in the structure of the (A) binder resin is 10,000 mass ppm or less.

[11] The photosensitive composition according to any one of items [1] to

[10] above, further comprising an organic black pigment, wherein all or part of the organic black pigment is one or more selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, and azomethine-based black pigments; all or part of the benzofuranone-based black pigments is a compound having at least two benzofuran-2(3H)-one structures which may share a benzene ring or at least two benzofuran-3(2H)-one structures which may share a benzene ring, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof; all or part of the perylene-based black pigments is a compound having a 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole structure, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof; and all or part of the azomethine-based black pigments is a compound having an azomethine structure and a carbazole structure or a salt thereof.

[12] The photosensitive composition according to any one of [1] to

[11] above, further comprising an inorganic black pigment, wherein all or part of the inorganic black pigment is one or more selected from the group consisting of nitrides containing a metal element, carbides containing a metal element, and oxynitrides containing a metal element, and the metal element is one or more selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum.

[13] The photosensitive composition according to any one of [1] to

[12] above, which satisfies the following condition (1α): the fluorine content of the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

[14] The photosensitive composition according to any one of [1] to

[13] above, which further satisfies either or both of the following conditions (2) and (3):Condition (2): The photosensitive composition further contains one or more selected from the group consisting of acetic acid, propionic acid, cyclopentanecarboxylic acid, cyclohexanecarboxylic acid, benzoic acid, methylbenzoic acid, and trimethylbenzoic acid, and the content of these compounds relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less. Condition (3): The photosensitive composition further contains one or both of an aldoxime compound and a ketoxime compound, and the content of these compounds relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less.

[15] The photosensitive composition according to any one of items [1] to

[14] above, which satisfies the following condition (4): Condition (4): The photosensitive composition further contains water, and the content of water in the photosensitive composition is 0.010% by mass or more and 3.0% by mass or less.

[16] The photosensitive composition according to any one of [1] to

[15] , wherein some of the (C1-1) oxime ester compounds are compounds (cis isomers) in which, in the (Ib) structure, the group containing a carbonyl structure and the group containing an oxygen atom of the oxime structure have a cis structure relative to the C=N bond of the oxime structure, and others are compounds (trans isomers) in which, in the (Ib) structure, the group containing a carbonyl structure and the group containing an oxygen atom of the oxime structure have a trans structure relative to the C=N bond of the oxime structure, and the content of the cis isomer or trans isomer is 90.0 to 99.9 mass% when the total of the cis isomer and the trans isomer is 100 mass%.

[17] A cured product obtained by curing the photosensitive composition according to any one of [1] to

[16] .

[18] An electronic component comprising the cured product according to

[17] .

[19] A method for producing a cured product, comprising: (1) a step of forming a coating film of the photosensitive composition according to any one of [1] to

[16] above on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) a step of developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition.

[20] An electronic component having a cured product, wherein the cured product comprises a carbonyl group-containing compound ((C1x-DL) carbonyl group-containing compound) having the following structures (XIa) and (XIc):Structure (XIa): A structure in which a carbonyl group is bonded to a fused polycyclic heterocyclic structure composed of two rings, or a structure in which a carbonyl group is bonded to a fused polycyclic heterocyclic structure composed of three rings, including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure, or a dihydropyrrole structure. Structure (XIc): An aromatic structure.

[0008] The photosensitive composition of the present invention can suppress residue at the bottom of a pattern and provide excellent halftone characteristics, and can provide a cured product with excellent mechanical properties. In addition, it can provide a cured product that is used in electronic components with excellent migration resistance. Furthermore, the electronic components of the present invention can provide electronic components with excellent migration resistance.

[0009] FIG. 2 is a schematic diagram illustrating the arrangement and dimensions of a light-transmitting portion, a light-shielding portion, and a semi-light-transmitting portion in a half-tone photomask used for evaluating half-tone characteristics.

[0010] The photosensitive composition of the present invention will be described below. However, the present invention is not limited to the following embodiments, and various modifications are naturally possible as long as the object of the invention can be achieved and the gist of the invention is not deviated from. The term "main chain" of a resin refers to the longest chain among the chains constituting the resin containing structural units. The term "side chain" of a resin refers to a chain branched from or attached to the main chain among the chains constituting the resin containing structural units, which is shorter than the main chain. The term "terminal end" of a resin refers to a structure that caps the main chain, such as a structure derived from a terminal capping agent. The term "structural unit" of a resin refers to a unit that constitutes a repeating structure in the main chain of a resin. The term "hydrocarbon group or alkylene group" including an "XX bond" or an "XX group" refers to a hydrocarbon group or alkylene group to which an "XX bond" or an "XX group" is attached, or at least two hydrocarbon groups or at least two alkylene groups linked by an "XX bond" or an "XX group." A ZZ group containing an "XX structure" or an "XX atom" refers to a ZZ group to which an "XX structure" or an "XX atom" is bonded, or a ZZ group containing an "XX structure" or an "XX atom" anywhere in the structure.

[0011] In the following description, the meanings of the (Ia) structure, the (Ib) structure, the (Ic) structure, and the (Id) structure, as well as the conditions (1), (2), (3), (P1α), (p2α), (1α), (2α), (X1α), and (X2α), the (A1) resin, the (A2) resin, the (A1x) resin, the (A1y) resin, the (A2x) resin, and the (A2y) resin, and the (WA) weakly acidic group are as follows: (Ia) structure: a fused polycyclic heterocyclic structure composed of two rings, or a fused polycyclic heterocyclic structure composed of three rings including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure, or a dihydropyrrole structure; (Ib) structure: an oxime ester carbonyl structure; (Ic) structure: an aromatic structure. (Id) Structure: either or both of an aliphatic group having 1 to 20 carbon atoms and an alicyclic group having 4 to 20 carbon atoms. Condition (1): The total content of benzene, toluene, xylene, and naphthalene in the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less. Condition (2): The photosensitive composition further contains one or more selected from the group consisting of acetic acid, propionic acid, cyclopentanecarboxylic acid, cyclohexanecarboxylic acid, benzoic acid, methylbenzoic acid, and trimethylbenzoic acid, and the proportion of these compounds relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less. Condition (3): The photosensitive composition further contains either or both of an aldoxime compound and a ketoxime compound, and the proportion of these compounds relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less. Condition (4): The photosensitive composition further contains water, and the content of water in the photosensitive composition is 0.010 mass % or more and 3.0 mass % or less. Condition (P1α): The fluorine content in the structure of the binder resin (A) is 10,000 mass ppm or less. Here, the fluorine content is the sum of the amount when present in an ionic state and the amount when present in a non-ionic state (the same applies to condition (1α) and condition (X1α)). Condition (P2α): The fluoride ion content in the structure of the binder resin (A) is 10,000 mass ppm or less.Condition (1α): The fluorine content of the photosensitive composition is 1,000 ppm by mass or less based on the total solid content. Condition (2α): The fluoride ion content of the photosensitive composition is 1,000 ppm by mass or less based on the total solid content. Condition (X1α): The fluorine content in the cured product is 1,000 ppm by mass or less. Condition (X2α): The fluoride ion content in the cured product is 1,000 ppm by mass or less. (A1) resin: A resin containing a weakly acidic group (WA) in its structure. (A2) resin: A resin not containing a weakly acidic group (WA) in its structure. (A1x) resin: A resin having one or more structures selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure in its structural unit. (A1y) resin: A resin having a phenolic hydroxyl group in its structural unit. (A2x) resin: A resin having a radically polymerizable group in its structure. (A2y) Resin: A resin that does not have a radically polymerizable group in its structure. (WA) Weakly acidic group: One or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group.

[0012] <Photosensitive Composition> The photosensitive composition of the present invention has the configuration [1] above. By adopting the above configuration, the photosensitive composition of the present invention can suppress residues at the bottom of a pattern and provide a cured product with excellent halftone properties, and can provide a cured product with excellent mechanical properties. In addition, it is possible to provide a cured product with excellent migration resistance that can be used in electronic components. This is presumably because the inclusion of a (C1-1) oxime ester compound having the specific structure described above in the photosensitive composition not only makes the compound compatible with the entire film, but also allows UV curing to proceed deep into the film with a relatively small amount of exposure due to the ultraviolet (UV) transmittance and photobleaching properties of the compound. As a result, the amount of radicals generated deep into the film is controlled, and excessive radical polymerization is suppressed by reducing the reflection of UV light by the underlying substrate, which is thought to effectively suppress residues at the bottom of a pattern. In addition, it is presumed that the progression of UV curing deep into the film contributes to excellent halftone properties. Furthermore, the π electrons in the carbonyl structure in the (Ib) structure and the π electrons in the (Ic) structure, as well as the hydrophobic structure in the (Ic) structure, interact with organic residue components in the openings (unexposed areas in the case of negative-type photosensitivity, and exposed areas in the case of positive-type photosensitivity), promoting dissolution in a developer, and are thought to be effective in suppressing residues at the bottom of the pattern.

[0013] It is presumed that the (C1-1) oxime ester compound having the above-mentioned specific structure allows efficient UV curing from the surface of the film to its depths. As a result, in addition to improving the degree of crosslinking of the film, the gradient of the degree of crosslinking within the film becomes uniform, which is believed to contribute to the effect of excellent mechanical properties. Furthermore, it is presumed that the (C1-1) oxime ester compound having the above-mentioned specific structure not only generates radicals upon exposure to light or thermal curing, but also forms a crosslinked structure with a resin or the like as a crosslinking agent after bond cleavage upon exposure to light or thermal curing. Therefore, it is presumed that the above-mentioned (Ia) structure contributes to controlling the polarization structure and charge balance in the cured product. As a result, it is presumed that excellent migration resistance is achieved by suppressing ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect electrical insulation. It is also presumed that the suppression of metal migration and aggregation in wiring also contributes to the effect of high reliability in electronic components, semiconductor devices, display devices, and metal-clad laminates.

[0014] <(A) Binder Resin> The photosensitive composition of the present invention contains (A) binder resin. The (A) binder resin is a heat-resistant resin, at least a portion of which remains in a cured product obtained by curing the composition. The (A) binder resin is preferably a resin that cures by forming a crosslinked structure through a reaction. The reaction is not particularly limited and may be caused by heating, irradiation with energy rays, or the like, and a crosslinked structure may also be formed by a (F) crosslinking agent described below. The (A) binder resin is preferably a thermosetting resin.

[0015] The binder resin (A) is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. Here, the acidic group is a group having an acid dissociation constant of 23.0 or less in dimethyl sulfoxide, and the organic solvent-soluble structure is a structural unit in the resin having an organic group with one or more carbon atoms. The acid dissociation constant of the acidic group in dimethyl sulfoxide is preferably 21.0 or less, more preferably 20.0 or less, and even more preferably 19.0 or less. On the other hand, the acid dissociation constant of the acidic group in dimethyl sulfoxide is preferably 0.1 or more, more preferably 5.0 or more, and even more preferably 10.0 or more. The structural unit in the resin in the organic solvent-soluble structure is preferably a structural unit having an organic group with 3 or more carbon atoms, more preferably a structural unit having an organic group with 6 or more carbon atoms.

[0016] The (A) binder resin is preferably a resin that has solubility capable of forming a positive or negative pattern by imparting positive or negative photosensitivity to the composition with the (C) photosensitizer described below. The (A) binder resin more preferably has an acidic group in its structural unit. From the viewpoint of pattern processability in an alkaline developer, the acidic group is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, a mercapto group, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group. Furthermore, from the viewpoint of improving sensitivity during exposure and suppressing residues at the bottom of the pattern, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group is more preferred.

[0017] As the binder resin (A), it is preferable to use a resin having a radical polymerizable group, and more preferably the resin has a radical polymerizable group in its structural unit. The radical polymerizable group preferably has an ethylenically unsaturated double bond group, and more preferably a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, or an alkynyl group having 2 to 5 carbon atoms. The photoreactive group is preferably a styryl group, a cinnamoyl group, a maleimide group, a nadimide group, or a (meth)acryloyl group, and from the viewpoints of improving sensitivity during exposure and improving mechanical properties, a (meth)acryloyl group is more preferable. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, a 2-methyl-2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group, and from the viewpoints of improving sensitivity during exposure and improving mechanical properties, a vinyl group or an allyl group is more preferable.

[0018] <(A1) Resin, (A2) Resin> From the viewpoint of improving halftone properties, it is preferable to use (A1) resin as the binder resin (A). Furthermore, it is more preferable that the (A1) resin has a weakly acidic group (WA) in its structural unit. From the viewpoint of suppressing residue at the bottom of the pattern and improving halftone properties, the weakly acidic group (WA) is preferably a phenolic hydroxyl group, a silanol group, or a 1,1-bis(trifluoromethyl)methylol group, and more preferably a phenolic hydroxyl group. When the binder resin (A) satisfies the condition (P1α) or the condition (P2α), or when the photosensitive composition of the present invention satisfies the condition (1α) or the condition (2α), the acidic group contained in the binder resin (A) is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a mercapto group, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group, and the weakly acidic group (WA) is preferably one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, and a mercapto group.

[0019] The (A1) resin exhibits moderate acidity due to the weak acidic group (WA), resulting in gradual film loss in the halftone-exposed areas during development, and the controlled solubility significantly improves halftone properties. The phenolic hydroxyl group in the weak acidic group (WA) promotes alkali dissolution, significantly reducing residue at the bottom of the pattern. Furthermore, when the composition has negative photosensitivity, the phenolic hydroxyl group in the weak acidic group (WA) controls excessive UV curing in the exposed areas and can also provide a gentle gradient in the degree of UV curing versus exposure dose, significantly reducing residue at the bottom of the pattern and improving halftone properties.

[0020] From the viewpoint of suppressing residues at the bottom of the pattern, the binder resin (A) preferably contains a resin (A2). The resin (A2) may have an acidic group different from the weakly acidic group (WA), and more preferably has an acidic group different from the weakly acidic group (WA) in its structural unit. From the viewpoint of improving sensitivity during exposure and suppressing residues at the bottom of the pattern, the acidic group different from the weakly acidic group (WA) is more preferably a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group.

[0021] From the viewpoint of improving sensitivity during exposure and mechanical properties, the binder resin (A) preferably contains an (A1) resin, and the (A1) resin preferably has a radical polymerizable group in its structure. Examples and preferred descriptions of the radical polymerizable group are as described above for the binder resin (A).

[0022] The (A1) resin preferably includes either or both of an (A1x) resin and an (A1y) resin, and the (A2) resin preferably includes either or both of an (A2x) resin and an (A2y) resin.

[0023] From the viewpoint of improving halftone characteristics and suppressing residues at the bottom of the pattern, it is preferred that the (A) binder resin contains an (A1) resin and an (A2) resin, the (A1) resin contains either or both of an (A1x) resin and an (A1y) resin, and the (A2) resin contains either or both of an (A2x) resin and an (A2y) resin.

[0024] In addition, when the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin each have a structure or group that constitutes a different resin, they are classified into one of the classification methods shown in Table 1-1 below. When a certain resin can fall into two or more of the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin, the resin to which it falls is determined by the classification method.

[0025]

[0026] In Table 1-1, the term "imide structure, etc." is a general term for imide structures, amide structures, oxazole structures, and siloxane structures.

[0027] The (A) binder resin preferably contains either or both of an (A1x) resin and an (A1y) resin, more preferably an (A1x) resin, and even more preferably both an (A1x) resin and an (A1y) resin. The (A) binder resin preferably contains either or both of an (A1x) resin and an (A1y) resin, and further contains an (A2x) resin, more preferably an (A1x) resin, an (A1y) resin, and an (A2x) resin. The (A) binder resin also preferably contains an (A1x) resin, an (A1y) resin, and an (A2x) resin, and further contains an (A2y) resin. From the viewpoint of improving the properties of each resin, the (A) binder resin also preferably contains two or more resins selected from the group consisting of an (A1x) resin, an (A1y) resin, an (A2x) resin, and an (A2y) resin.

[0028] <Resin (A1x)> From the viewpoints of improving halftone characteristics, improving mechanical properties, and improving migration resistance, the resin (A1) preferably contains a resin (A1x). From the viewpoint of improving halftone characteristics, mechanical properties, and migration resistance, the (A1x) resin preferably contains one or more resins selected from the group consisting of polyimide (hereinafter sometimes referred to as "(A1x-1) resin"), polyimide precursor (hereinafter sometimes referred to as "(A1x-2) resin"), polybenzoxazole (hereinafter sometimes referred to as "(A1x-3) resin"), polybenzoxazole precursor (hereinafter sometimes referred to as "(A1x-4) resin"), polyamideimide (hereinafter sometimes referred to as "(A1x-5) resin"), polyamideimide precursor (hereinafter sometimes referred to as "(A1x-6) resin"), polyamide (hereinafter sometimes referred to as "(A1x-7) resin"), polysiloxane (hereinafter sometimes referred to as "(A1x-8) resin"), maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof, all of which have a weak acidic group in their structure. In particular, it is more preferable to use one or more resins selected from the group consisting of (A1x-1) resin, (A1x-2) resin, (A1x-3) resin, (A1x-4) resin, (A1x-5) resin, (A1x-6) resin, (A1x-7) resin, and copolymers thereof (hereinafter, these may be collectively referred to as "polyimide resins having a weakly acidic group"). From the viewpoint of improving mechanical properties, it is more preferable to use one or more resins (A1x-1), (A1x-3), and copolymers thereof as the (A1x) resin. From the viewpoint of improving sensitivity during exposure, it is more preferable to use one or more resins (A1x-2), (A1x-4), and copolymers thereof as the (A1x) resin. The (A1x) resin may be either a single resin or a copolymer thereof.

[0029] The (A1x) resin has an imide structure, an amide structure, an oxazole structure, or a siloxane structure in its structural unit, which improves mechanical properties. Furthermore, these structures capture metal impurities and ionic impurities that adversely affect electrical insulation, which is thought to suppress ion migration and electromigration and improve migration resistance.

[0030] On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residues at the bottom of the pattern, improving halftone characteristics, and improving mechanical properties, it is preferable that the (A2x) resin and the (A2y) resin contain at least one resin selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof, none of which has a weakly acidic group in its structure. In particular, it is more preferable that the (A2x) resin and the (A2y) resin contain at least one resin selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof (hereinafter, these may be collectively referred to as "polyimide resins not having weakly acidic groups").

[0031] From the viewpoints of suppressing residues at the bottom of the pattern, improving halftone characteristics, improving mechanical properties, and improving migration resistance, the (A1x) resin preferably contains one or more resins selected from the group consisting of (A1x-1) resin, (A1x-2) resin, (A1x-3) resin, (A1x-4) resin, (A1x-5) resin, (A1x-6) resin, and copolymers thereof, and the (A1x) resin preferably contains either or both of (WA) an amine residue containing a weakly acidic group and (WA) a carboxylic acid residue containing a weakly acidic group.

[0032] It is more preferable that one or more resins selected from the group consisting of (A1x-1) resin, (A1x-2) resin, (A1x-3) resin, (A1x-4) resin, (A1x-5) resin, (A1x-6) resin, and copolymers thereof have one or more resins selected from the group consisting of amine residues represented by general formula (11) and amine residues represented by general formula (13), and one or more resins selected from the group consisting of carboxylic acid residues represented by general formulas (11), (12), and (14).

[0033]

[0034] In the general formulas (11) to (14), R ３１ ~R ３８ R each independently represents a 1,1-bis(trifluoromethyl)methylol group or a mercapto group. ３９ ~R ４２ R each independently represents a halogen atom, an alkyl group having 1 to 6 carbon atoms, or a halogenated alkyl group having 1 to 6 carbon atoms. ６１ ~R ６８ each independently represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogenated alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms. X １１ , X １２ , and X １６ X each independently represents a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, or an amide group to which a hydrocarbon group is bonded. １３ ~X １５ each independently represents a hydrocarbon group, a hydrocarbon group containing an ether bond, or an amide group to which a hydrocarbon group is bonded. １１ ~Y １４each independently represent a direct bond, an oxygen atom, a sulfur atom, a sulfonyl group, a hydrocarbon group, a hydrocarbon group containing an ether bond, a fused polycyclic structure, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. a, b, c, d, e, and f each independently represent an integer of 0 to 4. g, h, i, j, m, and n each independently represent an integer of 0 to 4. k and l each independently represent an integer of 0 to 3. o, p, q, r, s, t, u, and v each independently represent an integer of 0 to 3. w, x, y, and z each independently represent an integer of 0 to 6. Note that 1≦a+g≦4 and 1≦b+h≦4 are satisfied. 1≦c+i≦4 and 1≦d+j≦4 are satisfied. 1≦e+m≦4 and 1≦f+n≦4 are satisfied. * １ ~* １３ represents a bonding point in the resin. In the resin molecule, the structures of general formulas (11) to (14) may be present at any position without limitation.

[0035] In the general formulas (11) to (14), the halogen atom is preferably a fluorine atom, and the halogenated alkyl group is preferably a fluorinated alkyl group. １１ ~X １６ In the formula (I), the hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group in the amide group to which the hydrocarbon group is bonded are preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an arylalkylene group having 10 to 20 carbon atoms. １１ ~Y １４ In the above, the hydrocarbon group in the hydrocarbon group and the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. １１ ~Y １４In the above formula (1), the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group preferably have 1 to 15 carbon atoms, and the hydrocarbon group preferably has an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. The above-mentioned substituents and structures may have heteroatoms and may be unsubstituted or substituted. The amine residue represented by general formula (13) is preferably capable of forming a benzoxazole ring. That is, in a resin having a benzoxazole ring in its structural unit, the benzoxazole ring preferably has an amine residue represented by general formula (13). It is also preferable that the phenolic hydroxyl group in the amine residue represented by general formula (11) reacts with either or both of a structure in the resin and a group in the resin to form a benzoxazole ring.

[0036] From the viewpoint of improving the above-mentioned properties, either or both of the total content ratio of amine residues represented by general formula (11) and general formula (13) to all amine residues and the total content ratio of carboxylic acid residues represented by general formula (11), general formula (12), and general formula (14) to all carboxylic acid residues in each resin are preferably 10 mol% or more, more preferably 30 mol% or more, and even more preferably 50 mol% or more. On the other hand, from the viewpoint of improving the above-mentioned properties, either or both of the total content ratio of amine residues represented by general formula (11) and general formula (13) and the total content ratio of carboxylic acid residues represented by general formula (11), general formula (12), and general formula (14) are preferably 100 mol% or less, more preferably 90 mol% or less, and even more preferably 70 mol% or less.

[0037] From the viewpoint of improving sensitivity during exposure and improving mechanical properties, the resin (A1x) preferably has a radical polymerizable group. Examples and preferred descriptions of the radical polymerizable group are as described above for the binder resin (A). The radical polymerizable group is preferably one or more types selected from the group consisting of general formulas (51) to (55). The radical polymerizable group is preferably one obtained by reacting a portion of either or both of the phenolic hydroxyl groups and carboxyl groups contained in the resin with a compound having a radical polymerizable group.

[0038]

[0039] In the general formulae (51) to (55), X ２１ ~X ２４ each independently represents an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. ２５ represents a divalent to hexavalent organic group. ２６ represents a direct bond or a divalent to hexavalent organic group. １８１ ~R ２０２ each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. a, b, c, d, and e each independently represent 0 or 1. f and g each independently represent an integer of 1 to 5.

[0040] In the general formulae (51) to (55), X ２５ is preferably a divalent to hexavalent aliphatic group, more preferably a divalent to hexavalent hydrocarbon group having 1 to 10 carbon atoms. ２６ is preferably a direct bond or a divalent to hexavalent aliphatic group, more preferably a divalent to hexavalent hydrocarbon group having 1 to 10 carbon atoms. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0041] From the viewpoints of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, improving mechanical properties, and improving migration resistance, the (A1x) resin preferably contains an (A1x) resin that does not have a radical polymerizable group and an (A1x) resin that has a radical polymerizable group. By adopting the above-mentioned configuration, the (A1x) resin that does not have a radical polymerizable group is thought to suppress residue at the bottom of the pattern due to its acidic group or organic solvent-soluble structure and to have the ability to capture metal impurities, ionic impurities, etc., while the (A1x) resin that has a radical polymerizable group is thought to improve sensitivity during exposure and improve the degree of crosslinking of the film by promoting radical polymerization. Such functional separation in the (A1x) resin significantly improves multiple properties.

[0042] The acid equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of improving sensitivity during exposure. On the other hand, the acid equivalent of the (A1x) resin is preferably 600 g / mol or less from the viewpoint of suppressing residues at the bottom of the pattern. The exposure referred to here refers to irradiation with active actinic rays (radiation), and examples thereof include irradiation with visible light, ultraviolet light, electron beams, or X-rays. Hereinafter, exposure refers to irradiation with active actinic rays (radiation). The double bond equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of suppressing residues at the bottom of the pattern. On the other hand, the double bond equivalent of the (A1x) resin is preferably 3,000 g / mol or less from the viewpoint of improving sensitivity during exposure.

[0043] <Polyimide Resins Having Weakly Acidic Groups, and Polyimide Resins Without Weakly Acidic Groups> Hereinafter, polyimide resins having weakly acidic groups, which are (A1x) resins, and polyimide resins not having weakly acidic groups, which are (A2x) resins or (A2y) resins, will be collectively described. Hereinafter, these resins may be collectively referred to as polyimide resins. Examples of polyimide precursors include polyamic acid, polyamic acid ester, polyamic acid amide, and polyisoimide. Examples of polyimides include resins obtained by dehydrating and cyclizing a polyimide precursor. Examples of polybenzoxazole precursors include polyhydroxyamides. Examples of polybenzoxazoles include resins obtained by dehydrating and cyclizing a polybenzoxazole precursor. Examples of polyamideimide precursors include resins obtained by reacting, for example, tricarboxylic acid anhydrides with diamines. Examples of polyamideimides include resins obtained by dehydrating and cyclizing a polyamideimide precursor. Examples of polyamides include resins obtained by reacting, for example, dicarboxylic acid chlorides with diamines.

[0044] From the viewpoint of improving mechanical properties, the polyimide precursor preferably has either or both of an amic acid ester structural unit and an amic acid amide structural unit. The polyimide precursor may also have an imide ring-closed structural unit in which a portion of the amic acid structural unit, the amic acid ester structural unit, or the amic acid amide structural unit is ring-closed into an imide ring. The above-mentioned polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, polyamideimides, and polyamideimide precursors may be copolymers with polyamides.

[0045] From the viewpoint of improving sensitivity during exposure, the polyimide resin preferably has either or both of a carboxylic acid residue having a fluorine atom and an amine residue having a fluorine atom. The total content of the carboxylic acid residues having a fluorine atom and the amine residues having a fluorine atom relative to the total carboxylic acid residues and the total amine residues of each resin is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and even more preferably 50 to 100 mol%. The preferred ranges for the total content of the amine residues having a fluorine atom relative to the total amine residues and the total content of the carboxylic acid residues having a fluorine atom relative to the total carboxylic acid residues are the same as those described above.

[0046] From the viewpoint of improving storage stability, the polyimide resin preferably has a structure in which the terminal of the resin is blocked with a monoamine, a dicarboxylic acid anhydride, or a monocarboxylic acid derivative. From the viewpoint of improving sensitivity during exposure and improving mechanical properties, the polyimide resin preferably has a radical polymerizable group or a crosslinkable group capable of reacting with resins, etc., at the terminal of the resin, more preferably a maleimide group or a nadimide group. Examples of acid monomers having these groups include maleic anhydride and nadic anhydride.

[0047] <Fluorine content and fluoride ion content in the structure of (A) binder resin> From the viewpoint of suppressing residue at the bottom of the pattern and improving migration resistance, it is also preferable that the (A) binder resin satisfy condition (P1α). It is more preferable that the (A) binder resin further satisfy condition (P2α). Similarly, when the (A) binder resin is a polyimide-based resin, it is also preferable that the (A) binder resin satisfy condition (P1α), and more preferably satisfy condition (P2α), from the viewpoint of suppressing residue at the bottom of the pattern and improving migration resistance.

[0048] From the viewpoint of the effects of the present invention, the fluorine content in the structure of the (A) binder resin is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, even more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more, relative to the mass of the (A) binder resin. On the other hand, from the viewpoint of the effects of the present invention, the fluorine content is preferably 10,000 ppm by mass or less, more preferably 5,000 ppm by mass or less, even more preferably 1,000 ppm by mass or less, even more preferably 500 ppm by mass or less, particularly preferably 300 ppm by mass or less, and most preferably 100 ppm by mass or less, relative to the mass of the (A) binder resin. Furthermore, the fluorine content is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0049] The preferred range of the content of fluoride ions in the structure of the binder resin (A) is the same as the preferred range of the fluorine content in the structure of the binder resin (A) described above.

[0050] The fluorine content in the structure of the (A) binder resin may be 0 ppm by mass, and the fluoride ion content in the structure of the (A) binder resin may also be 0 ppm by mass.

[0051] By incorporating a binder resin (A) having a fluorine content of a specific value or less into the photosensitive composition, the content of nonionic fluorine atoms, fluoride ions, or fluorine-containing anions derived from these resins is reduced to a specific value or less. It is believed that this leads to local activation of protons in the photosensitive composition due to interactions such as hydrogen bonding between the components in the photosensitive composition. Therefore, the effect of promoting dissolution in the developer is thought to be significant in suppressing residue at the bottom of the pattern. Furthermore, intentionally reducing the content of the above components in the resin to a specific value or less is thought to reduce the content of the above components in the cured product of the photosensitive composition, thereby controlling the polarization structure and charge balance in the cured product. As a result, it is believed that ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect electrical insulation are suppressed, thereby improving migration resistance.

[0052] <Polysiloxanes and other resins> Hereinafter, (A1x) resins other than polyimide-based resins having weakly acidic groups, and (A2x) resins or (A2y) resins other than polyimide-based resins having no weakly acidic groups will be collectively described. Note that polysiloxanes have silanol groups and contain siloxane structures in their structural units, and therefore can be said to be resins having weakly acidic groups.

[0053] From the viewpoint of pattern processability in an alkaline developer, the polysiloxane preferably has an organosilane unit containing an acidic group, and from the viewpoint of improving halftone properties, it is more preferable that it has an organosilane unit (WA) containing a weakly acidic group. Examples and preferred descriptions of the acidic group and the weakly acidic group (WA) are as described above for the binder resin (A). From the viewpoint of improving sensitivity during exposure and improving mechanical properties, the polysiloxane preferably has a radically polymerizable group, and it is more preferable that it has an organosilane unit containing a radically polymerizable group. Examples and preferred descriptions of the radically polymerizable group are as described above for the binder resin (A). From the viewpoint of improving halftone properties, mechanical properties, and migration resistance, the polysiloxane preferably has a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, and it is more preferable that it has an organosilane unit containing a naphthyl group, an anthracenyl group, a biphenyl group, a phenyl group, a tolyl group, or a methoxyphenyl group.

[0054] A maleimide resin is a resin having at least two maleimide groups. A maleimide-styrene resin is a resin having a maleimide group and a unit derived from a styrene derivative. A maleimide-triazine resin is a resin having a maleimide group and a unit containing a triazine structure. A maleimide-oxazine resin is a resin having a maleimide group and a unit containing an oxazine structure. These resins are different from polyimide-based resins.

[0055] <Resin (A1y)> From the viewpoints of suppressing residue at the bottom of the pattern, improving halftone characteristics, and improving mechanical properties, the resin (A1) preferably contains a resin (A1y), and all or part of the resin (A1y) is preferably one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins. The resin (A1y) may be either a single resin or a copolymer thereof.

[0056] From the viewpoints of suppressing residue at the bottom of the pattern, improving halftone properties, and improving migration resistance, the (A1y) resin preferably has one or more structural units selected from the group consisting of the following (y1) structural unit and (y2) structural unit, or preferably satisfies the following condition (y3). Furthermore, it is more preferable that the (A1y) resin satisfies the following condition (y3) and has either or both of the (y1) structural unit and the (y2) structural unit. Furthermore, from the viewpoints of suppressing residue at the bottom of the pattern, improving halftone properties, improving mechanical properties, and improving migration resistance, the (A1y) resin preferably has the (y1) structural unit. (y1) structural unit: a structural unit containing at least two phenolic hydroxyl groups. (y2) structural unit: a structural unit containing a phenolic hydroxyl group and an aromatic group. Condition (y3): the resin contains a structural unit containing a phenolic hydroxyl group and a structural unit containing a second aromatic group.

[0057] At least two phenolic hydroxyl groups in the (y1) structural unit are bonded to the same aromatic ring or different aromatic rings, preferably to different aromatic rings, and also preferably to different aromatic rings in a fused polycyclic structure. Here, the aromatic group in the (y2) structural unit is an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded. Furthermore, the second aromatic group in condition (y3) is an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded. The second aromatic group is a term used to distinguish it from the aromatic group in the (y2) structural unit (meaning an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded).

[0058] The phenolic resin is preferably a novolak resin, a resol resin, or a phenol aralkyl resin.The phenolic resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic structure, or a heterocyclic structure.

[0059] The polyhydroxystyrene preferably has a unit derived from a (meth)acrylic acid ester derivative containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative.

[0060] Examples of phenol group-containing epoxy resins include resins obtained by reacting a polyfunctional epoxy compound with a phenol compound having an epoxy-reactive group, and phenol group-containing cardo resins or phenol group-containing epoxy-modified resins are preferred. The phenol group-containing epoxy-modified resin is preferably a phenol group-containing epoxy ester resin. The phenol group-containing cardo resin preferably has a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. The phenol group-containing epoxy resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure.

[0061] Examples of phenol group-containing acrylic resins include resins obtained by reacting an acrylic resin described below with a phenol compound having an addition reactive group. Other examples include resins obtained by radical copolymerization of a copolymerization component having a phenolic hydroxyl group with another copolymerization component such as a (meth)acrylic acid derivative. The phenol group-containing acrylic resin is a resin different from polyhydroxystyrene. The phenol group-containing acrylic resin preferably has a unit derived from a (meth)acrylic acid ester derivative having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative.

[0062] The fused polycyclic structure, fused polycyclic heterocyclic structure, aromatic structure, or heterocyclic structure in these resins is a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0] structure, ２，６ ] A decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, a benzene structure, a bisphenol A structure, a bisphenol F structure, a bisphenol AF structure, an isocyanuric acid structure, or a triazine structure is preferred.

[0063] <(A2x) Resin and (A2y) Resin> From the viewpoints of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, and improving mechanical properties, the (A2) resin preferably contains an (A2x) resin. From the viewpoints of suppressing residue at the bottom of the pattern and improving halftone properties, the (A2y) resin preferably further contains an (A2y) resin. From the viewpoints of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, and improving mechanical properties, the (A2x) resin preferably contains one or more resins selected from the group consisting of polycyclic side chain-containing resins, acid-modified epoxy resins, and acrylic resins. The (A2x) resin may be a single resin or a copolymer thereof. On the other hand, from the viewpoints of suppressing residue at the bottom of the pattern and improving halftone properties, the (A2y) resin preferably contains one or more resins selected from the group consisting of polycyclic side chain-containing resins, acid-modified epoxy resins, and acrylic resins. The (A2y) resin may be a single resin or a copolymer thereof.

[0064] When the (A) binder resin contains an (A1) resin and an (A2) resin, the (A1) resin includes either or both of an (A1x) resin and an (A1y) resin, and the (A2) resin includes either or both of an (A2x) resin and an (A2y) resin, the examples and preferred descriptions of the (A2x) resin and the (A2y) resin are also as described above.

[0065] From the viewpoint of improving migration resistance, the polycyclic side chain-containing resin is preferably a cardo resin having a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. From the viewpoint of improving migration resistance, the acid-modified epoxy resin is preferably an epoxy (meth)acrylate resin having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure. From the viewpoint of improving migration resistance, the acrylic resin preferably has a unit derived from a (meth)acrylic acid ester derivative having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative. It is also preferable to have a unit derived from a (meth)acrylic acid ester derivative having an epoxy group. The condensed polycyclic structure, the condensed polycyclic heterocyclic structure, or the aromatic structure in these resins is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0] structure, or a methyl group. ２，６] A decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, or a benzene structure is preferred.

[0066] The total content of the (A1x) resins relative to 100% by mass of the total (A) binder resins is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, and particularly preferably 70% by mass or more, from the viewpoints of improving halftone characteristics, mechanical properties, and migration resistance. On the other hand, the total content of the (A1x) resins is preferably 100% by mass or less, more preferably 90% by mass or less, and even more preferably 80% by mass or less, relative to 100% by mass of the total (A) binder resins, from the viewpoints of suppressing residue at the bottom of the pattern, improving halftone characteristics, and mechanical properties. Furthermore, the total content of the (A1y) resins is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, relative to 100% by mass of the total (A) binder resins, from the viewpoints of suppressing residue at the bottom of the pattern, improving halftone characteristics, and mechanical properties. On the other hand, from the viewpoint of improving mechanical properties, the total content of the (A1y) resins is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, relative to 100% by mass of the total (A) binder resins. Furthermore, from the viewpoints of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, improving halftone characteristics, and improving mechanical properties, the total content of the (A2x) resins and the (A2x) resins is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, relative to 100% by mass of the total (A) binder resins. On the other hand, from the viewpoint of improving mechanical properties, the total content of the (A2x) resins and the (A2y) resins is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, relative to 100% by mass of the total (A) binder resins.

[0067] The content ratio of the (A) binder resin in the total solid content of the photosensitive composition of the present invention is preferably 10% by mass or more from the viewpoint of improving the properties of each resin. On the other hand, the content ratio of the (A) binder resin is preferably 75% by mass or less from the viewpoint of improving the properties of each resin. The total solid content of the composition refers to the sum of the masses of all components in the composition excluding the solvent. The solid content concentration can be calculated by heating 1 g of the composition at 150°C for 30 minutes to evaporate to dryness, measuring the mass remaining after heating, and calculating the solid content concentration from the masses before and after heating.

[0068] <(B) Radically Polymerizable Compound> The photosensitive composition of the present invention contains either or both of a (B) radically polymerizable compound (hereinafter sometimes referred to as "(B) compound") and a (F) crosslinking agent. The (B) compound refers to a compound having a radically polymerizable group. Examples and preferred descriptions regarding the radically polymerizable group are as described above for the (A) binder resin. The radically polymerizable group is preferably a (meth)acryloyl group from the viewpoints of promoting radical polymerization, improving sensitivity during exposure, and improving mechanical properties. The number of radically polymerizable groups contained in the (B) compound is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more per molecule from the viewpoints of improving sensitivity during exposure and improving mechanical properties. On the other hand, the number of radically polymerizable groups is preferably 12 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 6 or less, from the viewpoints of improving mechanical properties and improving migration resistance.

[0069] When the photosensitive composition of the present invention contains an (A) binder resin and a (B) compound, the content of the (A) binder resin, relative to 100 parts by mass of the total of the (A) binder resin and the (B) compound, is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and even more preferably 45 parts by mass or more, from the viewpoints of improving halftone characteristics, improving mechanical properties, and improving migration resistance. On the other hand, the content of the (A) binder resin is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and even more preferably 75 parts by mass or less, from the viewpoints of improving sensitivity during exposure and suppressing residue at the bottom of the pattern. Furthermore, the content of the (B) compound, relative to 100 parts by mass of the total of the (A) binder resin and the (B) compound, is preferably 15 parts by mass or more, from the viewpoint of improving the above-mentioned properties. On the other hand, the content of the (B) compound is preferably 75 parts by mass or less, from the viewpoint of improving the above-mentioned properties.

[0070] <Compounds (B1) to (B5)> From the viewpoint of improving sensitivity during exposure and improving mechanical properties, the photosensitive composition of the present invention preferably satisfies at least one of the following conditions (δ), (ε), and (ζ): Condition (δ): The compound (B) contains the compound (B1) and the compound (B2). Condition (ε): The compound (B) contains the compound (B3) and the compound (B4). Condition (ζ): The compound (B) contains the compound (B1) or the compound (B2), and further contains the compound (B3) or the compound (B4).

[0071] Here, the (B1) compounds to (B4) compounds refer to the compounds below, and the (I-b1) structure, (I-b2) structure, (I-b3) structure, and (I-b4) structure refer to the structures below, respectively. (B1) compound: a compound having the (I-b1) structure and further having at least two radically polymerizable groups. (B2) compound: a compound having the (I-b2) structure and a structure containing an aliphatic structure and further having at least two radically polymerizable groups. (B3) compound: a compound having at least two (meth)acryloyl groups and further having the (I-b3) structure. (B4) compound: a compound having at least two (meth)acryloyl groups and further having the (I-b4) structure. (I-b1) structure: a structure containing a fused polycyclic alicyclic structure, an alicyclic structure, or a heterocyclic structure. (I-b2) Structure: A structure containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure. (I-b3) Structure: A structure in which at least two (meth)acryloyl groups are linked together with a minimum of 4 to 10 atoms and which contains an aliphatic structure. (I-b4) Structure: A structure in which at least two (meth)acryloyl groups are linked together with a minimum of 11 to 45 atoms and which contains an aliphatic structure.

[0072] In the compound (B1), the structure (I-b1) is preferably a fused polycyclic alicyclic structure from the viewpoint of improving mechanical properties, and is preferably a tricyclo[5.2.1.0] ２，６ ] A decane structure or an adamantane structure is more preferred. Furthermore, from the viewpoint of improving mechanical properties and migration resistance, the (I-b1) structure is preferably a heterocyclic structure, more preferably a nitrogen-containing cyclic structure, even more preferably a cyclic structure having at least two nitrogen atoms, and particularly preferably an isocyanuric acid structure or a triazine structure. The number of nitrogen atoms in the heterocyclic structure in the (I-b1) structure is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more. On the other hand, the number of nitrogen atoms is preferably 6 or less, more preferably 4 or less.

[0073] The compound (B1) preferably further has a structure containing an aliphatic structure.

[0074] From the viewpoints of improving sensitivity during exposure and migration resistance, the aliphatic structures that can be contained in compounds (B1) to (B4) are each independently preferably an alkylene group, an oxyalkylene group, an alkylene group containing a hydroxy group, an oxyalkylene group containing a hydroxy group, an alkylenecarbonyl group, an oxyalkylenecarbonyl group, or an aminoalkylenecarbonyl group. These aliphatic structures are preferably structures derived from aliphatic polyfunctional alcohols. Compounds (B3) and (B4) are different from compounds (B1) and (B2) described above, and do not have a structure containing a fused polycyclic alicyclic structure, an alicyclic structure, or a heterocyclic structure, nor a structure containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure.

[0075] The fused polycyclic structure in the (I-b2) structure of the (B2) compound is preferably a fluorene structure, an indane structure, or a naphthalene structure from the viewpoint of improving halftone characteristics and mechanical properties. Furthermore, the fused polycyclic heterocyclic structure in the (I-b2) structure is preferably a xanthene structure, an indolinone structure, or an isoindolinone structure from the viewpoint of improving mechanical properties. Furthermore, the aromatic structure in the (I-b2) structure is preferably a benzene structure or a biphenyl structure from the viewpoint of improving halftone characteristics and mechanical properties.

[0076] When the (B3) compound or the (B4) compound has two (meth)acryloyl groups, the minimum number of atoms in the (I-b3) structure or the (I-b4) structure above refers to the minimum number of atoms, including carbon atoms and heteroatoms, between the carbonyl carbons of the two (meth)acryloyl groups. The atoms bonded to the carbon atoms and heteroatoms between the carbonyl carbons are not included in the calculation of the minimum number of atoms. For example, when an oxygen atom, a propylene group, and an oxygen atom are present between the carbonyl carbons, the minimum number of atoms is five. Furthermore, when the (B3) compound or the (B4) compound has three or more (meth)acryloyl groups, the minimum number of atoms refers to the minimum number of atoms, including carbon atoms and heteroatoms linking the carbonyl carbons of all of the (meth)acryloyl groups. Similarly, the atoms bonded to the carbon atoms and heteroatoms linking the carbonyl carbons are not included in the calculation of the minimum number of atoms.

[0077] It is presumed that by setting the minimum number of atoms in the (I-b3) structure within a specific range in the (B3) compound, the amount of low molecular weight molecules derived from the (B) compound in the cured product can be further reduced, improving migration resistance. The minimum number of atoms in the (I-b3) structure is preferably 5 or more, more preferably 6 or more. Meanwhile, the minimum number of atoms in the (I-b3) structure is preferably 9 or less, more preferably 8 or less. Meanwhile, by setting the minimum number of atoms in the (I-b4) structure within a specific range in the (B4) compound, improved molecular mobility increases the probability of collisions between (meth)acryloyl groups and between (meth)acryloyl groups and other radically polymerizable groups, resulting in a significant effect of improving sensitivity during exposure. The minimum number of atoms in the (I-b4) structure is preferably 13 or more, more preferably 15 or more, even more preferably 17 or more, and particularly preferably 20 or more. On the other hand, the minimum number of atoms in the above (I-b4) structure is preferably 40 or less, more preferably 35 or less, even more preferably 30 or less, and particularly preferably 25 or less.

[0078] The above (B) compound not only has the effect of improving the degree of crosslinking of the cured product by generating radicals during exposure or heating, but also has the effect of improving the degree of crosslinking by reacting with the side chain or terminal radical polymerizable group of the resin, resulting in a significant effect of improving mechanical properties. Furthermore, it is presumed that the above (B) compound having an aliphatic structure reduces the low-molecular-weight components derived from the (B) compound in the cured product, thereby suppressing ion migration and electromigration and improving migration resistance.

[0079] From the viewpoint of improving halftone characteristics and mechanical properties, the (B) compound preferably contains one or more compounds selected from the group consisting of (B1) compound, (B2) compound, (B3) compound, and (B4) compound, and further contains a compound having a fused polycyclic structure or a structure containing a fused polycyclic heterocyclic structure and further having at least two radically polymerizable groups (such a compound is referred to as a "(B5) compound"). The (B5) compound is a compound different from the (B2) compound and does not have a structure containing an aliphatic structure. In the (B5) compound, the fused polycyclic structure is preferably a fluorene structure, an indane structure, or a naphthalene structure. In the (B5) compound, the fused polycyclic heterocyclic structure is preferably a xanthene structure, an indolinone structure, or an isoindolinone structure.

[0080] The (B) compound preferably contains one or more compounds selected from the group consisting of the (B1) compound, the (B2) compound, the (B3) compound, the (B4) compound, and the (B5) compound. The preferred contents of these (B) compounds are also the same as the contents of the (B) compounds when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass.

[0081] <(C) Photosensitizer> The photosensitive composition of the present invention contains an oxime ester compound (C1-1) described below as an essential component, and also contains a photosensitizer (C). The photosensitizer (C) refers to a compound that undergoes bond cleavage, reaction, or structural change upon exposure to generate another compound, thereby imparting positive or negative photosensitivity to the composition. The (C) photosensitizer preferably contains one or more compounds selected from the group consisting of a (C1) photopolymerization initiator (hereinafter, "(C1) compound"), a (C2) naphthoquinone diazide compound (hereinafter, "(C2) compound"), a (C3) photoacid generator (hereinafter, "(C3) compound"), and a (C4) photobase generator (hereinafter, "(C4) compound"). When imparting negative photosensitivity to the composition, it is preferable to contain a (C1) compound. When imparting positive photosensitivity to the composition, it is preferable to contain a (C2) compound. The (C2) compound refers to a compound that undergoes a structural change upon exposure to generate either or both of an indenecarboxylic acid and a sulfoindenecarboxylic acid. The (C3) compound refers to a compound that undergoes either or both of bond cleavage and reaction upon exposure to generate an acid. The (C4) compound refers to a compound that undergoes either or both of bond cleavage and reaction upon exposure to generate a base.

[0082] The content of the (C) photosensitizer is preferably 1.0 part by mass or more, based on 100 parts by mass of the total of the (A) binder resin and the (B) compound, from the viewpoint of improving sensitivity during exposure, while the content of the (C) photosensitizer is preferably 30 parts by mass or less from the viewpoint of suppressing residues at the bottom of the pattern.

[0083] <(C1) Photopolymerization initiator> The (C1) photopolymerization initiator refers to a compound that generates radicals by either bond cleavage or reaction, or both, upon exposure. The inclusion of the (C1) photopolymerization initiator is suitable for negative pattern formation, and the effect of improving sensitivity during exposure is significant.

[0084] The photosensitive composition of the present invention requires the use of (C1-1) an oxime ester compound (hereinafter referred to as "(C1-1) compound"), which is known as a type of photopolymerization initiator (C1). The (C1-1) compound refers to a compound having an oxime ester structure in the molecule, which undergoes bond cleavage and / or reaction upon exposure to generate radicals. The inclusion of the (C1-1) compound significantly improves the sensitivity upon exposure and the mechanical properties.

[0085] The content of the compound (C1-1) is preferably 1.0 part by mass or more, more preferably 3.0 parts by mass or more, and even more preferably 5.0 parts by mass or more, from the viewpoint of improving sensitivity during exposure and improving mechanical properties, where the total amount of the binder resin (A) and the compound (B) is taken as 100 parts by mass. On the other hand, the content of the compound (C1-1) is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and even more preferably 20 parts by mass or less, from the viewpoint of suppressing residues at the bottom of the pattern.

[0086] <(C1-1) Compound: Compound Having a Specific Structure> In the present invention, the (C1-1) compound used in the photosensitive composition has all of the (Ia) structure, the (Ib) structure, and the (Ic) structure within its molecular structure (hereinafter, such a (C1-1) compound may be referred to as a "(C1-1) compound having a specific structure").

[0087] In the (C1-1) compound having a specific structure, the (Ia) structure is preferably an indole structure, a benzoindole structure, an indoline structure, a benzoindoline structure, a benzofuran structure, a naphthofuran structure, a benzothiophene structure, a naphthothiophene structure, a benzodihydrofuran structure, a naphthodihydrofuran structure, a benzodihydrothiophene structure, or a naphthodihydrothiophene structure, from the viewpoints of suppressing residues at the bottom of a pattern, improving halftone characteristics, improving mechanical properties, and improving migration resistance. Furthermore, the fused polycyclic heterocyclic structure formed by two rings in the (Ia) structure is preferably an indole structure, an indoline structure, a benzofuran structure, a benzothiophene structure, a benzodihydrofuran structure, or a benzodihydrothiophene structure. Furthermore, the fused polycyclic heterocyclic structure composed of three rings including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure, or a dihydropyrrole structure in the structure (Ia) is preferably a benzoindole structure, a benzoindoline structure, a naphthofuran structure, a naphthothiophene structure, a naphthodihydrofuran structure, or a naphthodihydrothiophene structure. Note that, in the naphthalene structure, piperidine structure, tetrahydropyridine structure, dihydropyridine structure, pyrrolidine structure, and dihydropyrrole structure contained in the fused polycyclic heterocyclic structure composed of three rings, this means that the structure of the parent skeleton (carbon skeleton) is observed as a partial structure in the fused ring, but does not mean that the number of hydrogen atoms is the same.

[0088] For example, (X-52) is a compound having a fused polycyclic heterocyclic structure composed of three rings including a naphthalene structure, (X-56) is a compound having a fused polycyclic heterocyclic structure composed of three rings including a pyrrolidine structure, and (X-57) is a compound having a fused polycyclic heterocyclic structure composed of three rings including a piperidine structure.

[0089]

[0090] In the (C1-1) compound having a specific structure, the (Ia) structure is preferably an indole structure, a benzoindole structure, an indoline structure, or a benzoindoline structure from the viewpoint of providing photobleaching properties. The (Ib) structure is preferably directly bonded to the (Ia) structure from the viewpoint of providing photobleaching properties. The (C1-1) compound having a specific structure has photobleaching properties, which significantly improves sensitivity during exposure, suppresses residue at the bottom of the pattern, and improves halftone characteristics. It is also believed that the reduction of low-molecular-weight components derived from the (C1-1) compound in the cured product suppresses ion migration and electromigration, improving migration resistance. Note that photobleaching properties refer to a decrease in either or both of the absorbance at wavelengths in the ultraviolet region (e.g., 400 nm or less) and the absorbance at wavelengths of visible light (380 to 780 nm) due to bond cleavage and / or reaction upon exposure.

[0091] In the compound (C1-1) having a specific structure, from the viewpoint of improving sensitivity during exposure and suppressing residues at the bottom of the pattern, it is preferable that the hydrogen in the structure (Ia) is substituted with a nitro group, a cyano group, a halogen atom, a hydroxy group, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 10 carbon atoms, an alkoxyalkoxy group having 1 to 10 carbon atoms, a heterocyclic carbonyl group having 5 to 10 carbon atoms, a heterocyclic group having 4 to 10 carbon atoms, a heterocyclic oxy group having 4 to 10 carbon atoms, or an alkyl group containing a heterocycle having 5 to 20 carbon atoms. Here, the heterocyclic group is preferably a heterocyclic group containing an oxygen atom, a sulfur atom, or a nitrogen atom, and more preferably a furanyl group, a dihydrofuranyl group, a thiophenyl group, a dihydrothiophenyl group, a pyrrolyl group, or a dihydropyrrolyl group.

[0092] In the (C1-1) compound having a specific structure, the oxime ester skeleton in the oxime ester carbonyl structure in the (Ib) structure preferably has an acyl group. From the viewpoint of improving sensitivity during exposure, the acyl group is preferably an acyl group containing an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and more preferably an acetyl group or a propanoyl group. On the other hand, from the viewpoint of suppressing residues at the bottom of the pattern, the acyl group is preferably an acyl group containing an aryl group having 6 to 10 carbon atoms, and more preferably a benzoyl group.

[0093] In the (C1-1) compound having a specific structure, the (Ic) structure is preferably an aromatic structure to which an arylcarbonyl group, an alkylcarbonyl group, a nitro group, a cyano group, a halogen atom, or a heterocyclic group is bonded, from the viewpoints of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, and improving halftone characteristics. Furthermore, from the viewpoint of the effects of the invention described above, the (Ic) structure is preferably directly bonded to the (Ia) structure. On the other hand, the (Ic) structure is also preferably bonded to the (Ia) structure via a carbonyl group. The aromatic structure in the (Ic) structure is preferably an aromatic structure having 6 to 15 carbon atoms, more preferably a benzene structure or a naphthalene structure. Here, the arylcarbonyl group is preferably a carbonyl group having an aryl group bonded thereto having 6 to 15 carbon atoms, a carbonyl group having an arylalkyl group bonded thereto having 7 to 20 carbon atoms, a carbonyl group having an alkylaryl group bonded thereto having 7 to 20 carbon atoms, a dialkylaryl group having 8 to 20 carbon atoms, or a carbonyl group having a trialkylaryl group bonded thereto having 9 to 20 carbon atoms, more preferably a carbonyl group having an aryl group bonded thereto having 6 to 10 carbon atoms, a carbonyl group having an arylalkyl group bonded thereto having 7 to 15 carbon atoms, a carbonyl group having an alkylaryl group bonded thereto having 7 to 15 carbon atoms, a carbonyl group having a dialkylaryl group bonded thereto having 8 to 15 carbon atoms, or a carbonyl group having a trialkylaryl group bonded thereto, and among these, a phenylcarbonyl group, a naphthylcarbonyl group, or an anthracenylcarbonyl group is preferred. The alkylcarbonyl group is preferably a carbonyl group having an alkyl group of 1 to 20 carbon atoms bonded thereto or a carbonyl group having a halogenated alkyl group of 1 to 20 carbon atoms bonded thereto, more preferably a carbonyl group having an alkyl group of 1 to 10 carbon atoms bonded thereto or a carbonyl group having a halogenated alkyl group of 1 to 10 carbon atoms bonded thereto, and even more preferably a carbonyl group having an alkyl group of 1 to 6 carbon atoms bonded thereto or a carbonyl group having a halogenated alkyl group of 1 to 6 carbon atoms bonded thereto. The halogen atom is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, more preferably a fluorine atom. The heterocyclic group is preferably a heterocyclic carbonyl group having 5 to 10 carbon atoms, a heterocyclic group having 4 to 10 carbon atoms, a heterocyclic oxy group having 4 to 10 carbon atoms, or an alkyl group containing a heterocycle having 5 to 20 carbon atoms.On the other hand, specific examples of the heterocyclic group include a heterocyclic group containing an oxygen atom, a sulfur atom, or a nitrogen atom in the ring structure, and a furanyl group, a dihydrofuranyl group, a thiophenyl group, a dihydrothiophenyl group, a pyrrolyl group, and a dihydropyrrolyl group are more preferred.

[0094] From the viewpoint of improving sensitivity during exposure and suppressing residues at the bottom of the pattern, the (C1-1) compound preferably further has a (Id) structure. Furthermore, from the viewpoint of the effects of the invention described above, the (Id) structure is preferably directly bonded to the (Ia) structure or the (Ib) structure. The (C1-1) compound having a specific structure also preferably further has a (Id) structure. From the viewpoint of improving sensitivity during exposure and suppressing residues at the bottom of the pattern, the aliphatic group and alicyclic group in the (Id) structure preferably have 4 or more carbon atoms, more preferably 6 or more carbon atoms, and even more preferably 8 or more carbon atoms. On the other hand, from the viewpoint of improving sensitivity during exposure and suppressing residues at the bottom of the pattern, the aliphatic group and alicyclic group in the (Id) structure preferably have 18 or less carbon atoms, more preferably 15 or less carbon atoms, and even more preferably 12 or less carbon atoms. The aliphatic group is preferably a linear or branched alkyl group, alkenyl group, or alkynyl group. The alicyclic group is preferably a linear or branched cycloalkyl group, cycloalkenyl group, or cycloalkynyl group. From the viewpoints of improving sensitivity during exposure, suppressing residues at the bottom of the pattern, and improving halftone characteristics, the aliphatic group and alicyclic group in the structure (Id) preferably have a group substituted with a halogen atom, and more preferably have a group substituted with a fluorine atom. The group substituted with a halogen atom is preferably a trifluoromethyl group, a trifluoropropyl group, a trichloropropyl group, a tetrafluoropropyl group, a fluorocyclopentyl group, a fluorophenyl group, or a pentafluorophenyl group. When the polyimide resin has either or both of a carboxylic acid residue having a fluorine atom and an amine residue having a fluorine atom, the compound (C1-1) preferably has a group substituted with a halogen atom.

[0095] In the (C1-1) compound having a specific structure, the (Ib) structure and the (Ic) structure are preferably directly bonded to the (Ia) structure, from the viewpoint of improving the properties of each structure, and it is more preferable that the (Ib), (Ic), and (Id) structures are directly bonded to the (Ia) structure.

[0096] The compound (C1-1) having a specific structure preferably contains one or more compounds selected from the group consisting of compounds represented by general formula (15), general formula (16), and general formula (17).

[0097]

[0098] In the general formulae (15) to (17), the dashed lines represent a carbon-carbon single bond or a carbon-carbon double bond. １ ~X ３ each independently represents an arylene group having 6 to 15 carbon atoms or a direct bond. ４ ~X ７ each independently represents a direct bond, an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. ８ represents an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. １ ~Y ３ each independently represents a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom. １ , X ２ , or X ３ is an arylene group having 6 to 15 carbon atoms, the corresponding R １０１ , R １０２ , or R １０３are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogenated alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an alkoxyalkyl group having 2 to 20 carbon atoms, an alkoxycarbonylalkyl group having 3 to 20 carbon atoms, a carbonyl group having an aryl group having 6 to 15 carbon atoms bonded thereto, a carbonyl group having an arylalkyl group having 7 to 20 carbon atoms bonded thereto, or an alkylaryl group having 7 to 20 carbon atoms bonded thereto. X represents a carbonyl group having a carbonyl group bonded thereto, a carbonyl group having a dialkylaryl group having 8 to 20 carbon atoms bonded thereto, a carbonyl group having a trialkylaryl group having 9 to 20 carbon atoms bonded thereto, a carbonyl group having an alkyl group having 1 to 20 carbon atoms bonded thereto, a carbonyl group having a halogenated alkyl group having 1 to 20 carbon atoms bonded thereto, a heterocyclic carbonyl group having 5 to 10 carbon atoms, a heterocyclic group having 4 to 10 carbon atoms, a heterocyclic oxy group having 4 to 10 carbon atoms, an alkyl group containing a heterocycle having 5 to 20 carbon atoms, a nitro group, a cyano group, a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom. １ , X ２ , or X ３ When is a direct bond, the corresponding R １０１ , R １０２ , or R １０３ Each of R independently represents a group forming a ring. １０１ When R is a group that forms a ring, １０１ and R １１０ or R １０１ and R １１１ forms a ring. １０１ When R is a group that forms a ring, f or g represents an integer of 1 to 3, and a plurality of R １１０ or multiple R １１１ If there are any, then at least one of them is R １０１ A ring is formed between R １０２ When R is a group that forms a ring, １０２ and R １１２ or R １０２ and R １１３ forms a ring. １０２ When R is a group that forms a ring, h or i represents an integer of 1 to 3, and a plurality of R １１２ or multiple R １１３ If there are any, then at least one of them is R１０２ A ring is formed between R １０３ When R is a group that forms a ring, １０３ and R １１４ or R １０３ and R １１５ forms a ring. １０３ When R is a group that forms a ring, j or k represents an integer of 1 to 3, and a plurality of R １１４ or multiple R １１５ If there are any, then at least one of them is R １０３ The group between R and R represents a group that forms a ring. １０１ and R １１０ or R １０１ and R １１１ The number of atoms in the ring is 4 to 10. １０２ and R １１２ or R １０２ and R １１３ The number of atoms in the ring is 4 to 10. １０３ and R １１４ or R １０３ and R １１５ The number of atoms in the ring is 4 to 10. １０１ , R １０２ , R １０３ , R １１０ , R １１１ , R １１２ , R １１３ , R １１４ , and R １１５ The group forming the ring in R is a group such as an alkylene group or an alkenylene group that constitutes a ring so as to satisfy the number of atoms and degree of unsaturation of the ring to be formed. １０４ ~R １０７ R each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. １０８ and R １０９each independently represents a carbonyl group having an aryl group having 6 to 15 carbon atoms bonded thereto, a carbonyl group having an arylalkyl group having 7 to 20 carbon atoms bonded thereto, a carbonyl group having an alkylaryl group having 7 to 20 carbon atoms bonded thereto, a carbonyl group having a dialkylaryl group having 8 to 20 carbon atoms bonded thereto, a carbonyl group having a trialkylaryl group having 9 to 20 carbon atoms bonded thereto, a carbonyl group having an alkyl group having 1 to 20 carbon atoms bonded thereto, a carbonyl group having a halogenated alkyl group having 1 to 20 carbon atoms bonded thereto, R represents a hydroxyl group, a heterocyclic carbonyl group having 5 to 10 carbon atoms, a heterocyclic group having 4 to 10 carbon atoms, a heterocyclic oxy group having 4 to 10 carbon atoms, an alkyl group containing a heterocycle having 5 to 20 carbon atoms, a nitro group, a cyano group, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 10 carbon atoms, or an alkoxyalkoxy group having 1 to 10 carbon atoms. １１０ ~R １１５ each independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a group that forms a ring. １１０ or multiple R １１１ The number of carbon atoms in the ring formed by R is 4 to 10. １１２ or multiple R １１３ The number of carbon atoms in the ring formed by R is 4 to 10. １１４ or multiple R １１５ The number of carbon atoms in the ring is 4 to 10. １１０ , multiple R １１１ , multiple R １１２ , multiple R １１３ , multiple R １１４ , and a plurality of R １１５ The group forming the ring in R is a group such as an alkylene group or an alkenylene group that constitutes a ring so as to satisfy the number of atoms and degree of unsaturation of the ring to be formed. １１６ ~R １１９each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a (cycloalkyl)alkyl group having 4 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, an alkylaryl group having 7 to 20 carbon atoms, a dialkylaryl group having 8 to 20 carbon atoms, a trialkylaryl group having 9 to 20 carbon atoms, a halogenated alkyl group having 1 to 20 carbon atoms, a halogenated alkoxy group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an alkoxyalkyl group having 2 to 20 carbon atoms, an alkoxycarbonylalkyl group having 3 to 20 carbon atoms, a heterocyclic group having 4 to 10 carbon atoms, a heterocyclic oxy group having 4 to 10 carbon atoms, a carbonyl group having an aryl group having 6 to 15 carbon atoms bonded thereto, a carbonyl group having an alkyl group having 1 to 20 carbon atoms bonded thereto, or a nitro group. Y １ , Y ２ , or Y ３ is a carbon atom, the corresponding a, b, or c is 2. １ , Y ２ , or Y ３ When Y is a nitrogen atom, the corresponding a, b, or c is 1. １ , Y ２ , or Y ３ is an oxygen atom or a sulfur atom, the corresponding a, b, or c is 0. d and e each independently represent an integer of 0 to 4. f, g, h, i, j, and k each independently represent an integer of 0 to 3 (provided that 0<d+f≦4, 0<e+h≦4). l, m, n, and o each independently represent an integer of 1 to 10. t and v each independently represent 0 or 1, and t+v is 0 or 1. When t+v is 0, w is 0. When t+v is 1, w is 1. When t is 0, y is 1. When t is 1, y is 0. When v is 0, b is as described above. When v is 1, b is 0. x represents an integer of 0 to 4. α, β, and γ each independently represent an integer of 0 to 4. １ and * ２ teeth,* ３ Represents the point of attachment to

[0099] In the compounds represented by the general formulas (15), (16), and (17), X １ ~X３ It is particularly preferred that the arylene group having 6 to 15 carbon atoms in the formula (Ic) corresponds to the above-mentioned structure (Ic) in the compound (C1-1) having a specific structure, and R １０８ and R １０９ a carbonyl group having an aryl group having 6 to 15 carbon atoms bonded thereto, a carbonyl group having an arylalkyl group having 7 to 20 carbon atoms bonded thereto, a carbonyl group having an alkylaryl group having 7 to 20 carbon atoms bonded thereto, a carbonyl group having a dialkylaryl group having 8 to 20 carbon atoms bonded thereto, or a carbonyl group having a trialkylaryl group having 9 to 20 carbon atoms bonded thereto; R １１６ ~R １１９ an aryl group having 6 to 15 carbon atoms or a carbonyl group to which an aryl group having 6 to 15 carbon atoms is bonded; or X ４ ~X ７ It is also preferred that the arylene group having 6 to 15 carbon atoms in the formula (Ic) corresponds to the above structure (Ic) in the compound (C1-1) having a specific structure. １１０ Or multiple R １１１ , multiple R １１２ Or multiple R １１３ , or multiple R １１４ Or multiple R １１５ The ring having 4 to 10 carbon atoms formed by R is preferably a benzene ring, a cyclohexane ring, or a cyclopentane ring. １０１ and R １１０ Or R １０１ and R １１１ , R １０２ and R １１２ Or R １０２ and R １１３ , or R １０３ and R １１４ Or R １０３ and R １１５ In the formula (I), the ring having 4 to 10 atoms is preferably a piperidine ring, a tetrahydropyridine ring, a dihydropyridine ring, a pyrrolidine ring, or a dihydropyrrole ring. The above-mentioned substituents and structures may have heteroatoms, and may be either unsubstituted or substituted.

[0100] All or part of the (C1-1) compound is preferably an isomer (cis isomer) in which the group containing a carbonyl structure and the group containing an oxygen atom of an oxime structure in the (Ib) structure have a cis structure relative to the C═N bond of the oxime structure, and / or an isomer (trans isomer) in which the group contains a trans structure. When the total of the cis isomer and the trans isomer is taken as 100 mass%, from the viewpoint of improving the above-mentioned properties, the content of the cis isomer or the trans isomer is preferably 90.0 mass% or more, more preferably 95.0 mass% or more, even more preferably 97.0 mass% or more, and particularly preferably 99.0 mass% or more. On the other hand, from the viewpoint of improving the above-mentioned properties, the content of the cis isomer (Z isomer) or the trans isomer (E isomer) is preferably 100.0 mass% or less, more preferably 99.9 mass% or less, and even more preferably 99.5 mass% or less. The content ratio of the trans isomer is preferably the content ratio in a (C1-1) compound having a specific structure.

[0101] The (C1-1) compound having the above specific structure generates radicals upon heating and interacts with phenolic hydroxyl groups and carboxyl groups in polyimide resins due to the oxime ester carbonyl structure, resulting in improved crosslinking of the cured product and accelerated ring-closing reactions of the resin, resulting in significant improvements in mechanical properties. Furthermore, the π electrons in the carbonyl structures of the above (Ib) and (Ic) structures contribute to controlling the polarization structure and charge balance in the cured product, which is presumed to improve migration resistance.

[0102] <(C1-1) Compounds Other than (C1-1) Compounds Having a Specific Structure> The photosensitive composition of the present invention may use, as the (C1-1) compound, (C1-1) compounds other than (C1-1) compounds having a specific structure (such (C1-1) compounds other than (C1-1) compounds having a specific structure may be referred to hereinafter as "(C1-1) compounds having another structure").

[0103] The (C1-1) compound having another structure preferably has the following structure (Ca) from the viewpoint of improving mechanical properties, and preferably has the following structure (Cb) from the viewpoint of improving sensitivity during exposure. (Ca) structure: a structure in which at least one oxime ester structure or at least one oxime ester carbonyl structure is bonded to a fused polycyclic structure, a fused polycyclic heterocyclic structure, a diaryl sulfide structure, or a benzene structure. (Cb) structure: a nitro group, a group substituted with a halogen atom, a naphthylcarbonyl structure, a trimethylbenzoyl structure, a thiophenylcarbonyl structure, a furylcarbonyl structure, at least two oxime ester structures, or a structure in which at least two oxime ester carbonyl structures are bonded.

[0104] From the viewpoints of improving sensitivity during exposure, improving halftone characteristics, and improving mechanical properties, the (C1-1) compound having another structure more preferably has a (Ca) structure and a (Cb) structure, and it is even more preferable that the (Cb) structure be bonded to a fused polycyclic structure, a fused polycyclic heterocyclic structure, a diaryl sulfide structure, or a benzene structure in the (Ca) structure.

[0105] From the viewpoints of suppressing residue at the bottom of a pattern, improving halftone properties, and improving mechanical properties, the fused polycyclic structure in the (Ca) structure is preferably a fluorene structure, a benzofluorene structure, a dibenzofluorene structure, an indene structure, an indane structure, a benzoindene structure, or a benzoindane structure. From the viewpoints of suppressing residue at the bottom of a pattern, improving halftone properties, improving mechanical properties, and improving migration resistance, the fused polycyclic heterocyclic structure in the (Ca) structure is preferably a carbazole structure, a dibenzofuran structure, a dibenzothiophene structure, a benzocarbazole structure, a phenothiazine structure, or a phenothiazine oxide structure. From the viewpoints of suppressing residue at the bottom of a pattern and improving halftone properties, the diaryl sulfide structure in the (Ca) structure is preferably a diphenyl sulfide structure, a naphthyl phenyl sulfide structure, or a dinaphthyl sulfide structure.

[0106] From the viewpoint of improving sensitivity during exposure and improving mechanical properties, the compound (C1-1) having another structure preferably has a group substituted with a halogen atom, more preferably a group substituted with a fluorine atom. The group substituted with a halogen atom is preferably a trifluoromethyl group, a trifluoropropyl group, a trichloropropyl group, a tetrafluoropropyl group, a fluorocyclopentyl group, a fluorophenyl group, or a pentafluorophenyl group.

[0107] From the viewpoint of photobleaching properties, the compound (C1-1) having a different structure preferably has a fluorene structure, a benzofluorene structure, a dibenzofluorene structure, a phenothiazine structure, a phenothiazine oxide structure, or a diphenyl sulfide structure, and also preferably has a structure in which at least one oxime ester carbonyl structure is bonded to a fused polycyclic structure, a fused polycyclic heterocyclic structure, a diphenyl sulfide structure, or a benzene structure. When the compound (C1-1) having a different structure has photobleaching properties, the effects of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, and improving halftone characteristics become significant.

[0108] The (C1-1) compound having the above-described other structure generates radicals upon heating and interacts with the phenolic hydroxyl group or carboxyl group in the polyimide resin due to the oxime ester structure, thereby improving the degree of crosslinking of the cured product and promoting the ring-closing reaction of the resin, thereby achieving a significant effect in improving mechanical properties.

[0109] The content of the (C1-1) compound having a specific structure is preferably 1.0 part by mass or more, more preferably 3.0 parts by mass or more, and even more preferably 5.0 parts by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, improving halftone properties, improving mechanical properties, and improving migration resistance, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass. On the other hand, the content of the (C1-1) compound having a specific structure is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and even more preferably 20 parts by mass or less, from the viewpoints of suppressing residue at the bottom of the pattern and improving halftone properties.

[0110] The content of the compound (C1-1) having a different structure is preferably 1.0 part by mass or more, more preferably 3.0 parts by mass or more, and even more preferably 5.0 parts by mass or more, from the viewpoints of improving sensitivity during exposure, improving halftone characteristics, and improving mechanical properties, when the total amount of the binder resin (A) and the compound (B) is taken as 100 parts by mass. On the other hand, the content of the compound (C1-1) having a different structure is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and even more preferably 20 parts by mass or less, from the viewpoints of suppressing residue at the bottom of the pattern and improving halftone characteristics.

[0111] The content of the (C1-1) compound having a specific structure relative to 100% by mass of the total of the (C1-1) compounds is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, even more preferably 60% by mass or more, and particularly preferably 70% by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue at the bottom of the pattern, improving halftone properties, improving mechanical properties, and improving migration resistance. On the other hand, the content of the (C1-1) compound having a specific structure is preferably 100% by mass or less, more preferably 90% by mass or less, even more preferably 80% by mass or less, and particularly preferably 75% by mass or less, from the viewpoints of improving sensitivity during exposure and halftone properties.

[0112] From the viewpoint of improving the above-mentioned properties, the content of the (C1-1) compound having a different structure relative to the total 100% by mass of the (C1-1) compound is preferably more than 0% by mass, while the content of the (C1-1) compound having a different structure is preferably 90% by mass or less.

[0113] <Other Photopolymerization Initiators> The photosensitive composition of the present invention preferably further contains another photopolymerization initiator. The other photopolymerization initiator is preferably a benzyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, a biimidazole compound, a phosphine oxide compound, an acridine compound, a titanocene compound, a benzophenone compound, an acetophenone compound, an aromatic ketoester compound, or a benzoate ester compound. From the viewpoints of improving sensitivity during exposure and improving mechanical properties, an α-hydroxyketone compound, an α-aminoketone compound, a biimidazole compound, or a phosphine oxide compound is preferred. The preferred content of these other photopolymerization initiators is also the same as the content of the (C1-1) compound having the other structure described above.

[0114] The above-mentioned α-hydroxyketone compounds, α-aminoketone compounds, biimidazole compounds, and phosphine oxide compounds have the effect of improving the degree of crosslinking of the cured product and accelerating the ring-closing reaction of the resin due to the generation of radicals upon heating and the interaction of the hydroxy group, amino group, imidazole structure, or phosphine oxide structure, and therefore have a significant effect of improving mechanical properties.

[0115] <(D) Colorant> The photosensitive composition of the present invention preferably further contains a (D) colorant. The (D) colorant refers to a compound that imparts color by absorbing light of a visible light wavelength. The (D) colorant is preferably a pigment or a dye. From the viewpoint of suppressing external light reflection, it is preferable to use a black agent or a mixture of two or more colorants as the (D) colorant. As the black agent, either or both of an organic black pigment and an inorganic black pigment can be preferably used. The black color in the (D) colorant is as described in paragraphs

[0284] to

[0285] of WO 2019 / 087985.

[0116] The content ratio of the colorant (D) relative to the total solid content of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, and even more preferably 20% by mass or more, from the viewpoints of suppressing external light reflection and improving element reliability. On the other hand, the content ratio of the colorant (D) relative to the total solid content of the photosensitive composition of the present invention is preferably 70% by mass or less, more preferably 50% by mass or less, from the viewpoints of improving sensitivity during exposure and suppressing residues at the bottom of the pattern.

[0117] From the viewpoints of suppressing residue at the bottom of a pattern, improving halftone properties, and migration resistance, the photosensitive composition of the present invention further contains an organic black pigment, and the organic black pigment preferably contains one or more selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, and azomethine-based black pigments. The benzofuranone-based black pigment preferably contains a compound having at least two benzofuran-2(3H)-one structures which may share a benzene ring or at least two benzofuran-3(2H)-one structures which may share a benzene ring, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof. More preferably, the perylene-based black pigment contains a compound having a 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole structure, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof. The azomethine-based black pigment preferably contains a compound having an azomethine structure and a carbazole structure or a salt thereof. The organic black pigments described above have high transmittance in the ultraviolet region, thereby significantly improving sensitivity during exposure.

[0118] The organic black pigment is preferably an anthraquinone-based black pigment, an aniline-based black pigment, an azo-based black pigment, or carbon black. The carbon black is preferably resin-coated, dye-coated, oxidized, surface-modified with an organic group having an ionic group, or surface-treated with a sulfonic acid group.

[0119] From the viewpoints of suppressing residue at the bottom of the pattern and improving halftone characteristics, the photosensitive composition of the present invention preferably further contains either or both of a mixture of two or more color pigments and a mixture of two or more color dyes, and the two or more colors are preferably selected from either or both of blue and purple, and red and orange. Preferred examples of color pigments that can be used include anthraquinone pigments, diketopyrrolopyrrole pigments, perylene pigments, isoindoline pigments, isoindolinone pigments, imidazolone pigments, quinacridone pigments, pyranthrone pigments, phthalocyanine pigments, indanthrone pigments, and dioxazine pigments. Preferred examples of color dyes that can be used include squarylium dyes, xanthene dyes, triarylmethane dyes, and phthalocyanine dyes.

[0120] The average primary particle size of the pigment is preferably 20 nm or more from the viewpoint of improving the reliability of the element, while the average primary particle size of the pigment is preferably 150 nm or less from the viewpoint of suppressing external light reflection and improving the reliability of the element.

[0121] From the viewpoints of suppressing residue at the bottom of the pattern and improving halftone characteristics, the photosensitive composition of the present invention further contains an inorganic black pigment, and it is preferable to use one or more inorganic black pigments selected from the group consisting of nitrides containing metal elements, carbides containing metal elements, and oxynitrides containing metal elements (such inorganic black pigments may be referred to as "specific inorganic black pigments" hereinafter). Here, the metal element contained in the specific inorganic black pigment is preferably one or more selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum. From the viewpoint of improving sensitivity during exposure, it is more preferable to use one or more inorganic black pigments selected from the group consisting of zirconium nitride, zirconium carbide, and zirconium oxynitride. Zirconium nitride, zirconium carbide, and zirconium oxynitride have high transmittance at wavelengths in the ultraviolet region, so the effect of improving sensitivity during exposure is significant.

[0122] The specific inorganic black pigment preferably contains zirconium, vanadium, niobium, hafnium, or tantalum as a main component element. The main component element refers to the element that is contained most abundantly by mass among the constituent elements. The main component element is an element other than H, B, C, N, O, F, P, S, or Cl. From the viewpoint of suppressing external light reflection and improving the reliability of the element, the specific inorganic black pigment preferably contains an element other than the main component element, and more preferably contains B, Al, Si, Mn, Co, Ni, Fe, Cu, Zn, or Ag.

[0123] The crystallite size of each compound particle, such as zirconium nitride particles contained in a specific inorganic black pigment, can be calculated from the half-width of the peak derived from the (111) plane in the X-ray diffraction spectrum using CuKα radiation as the X-ray source. The crystallite size is preferably 5.0 nm or more from the viewpoint of suppressing external light reflection and improving the reliability of the element. On the other hand, the crystallite size is preferably 60 nm or less from the viewpoint of improving sensitivity during exposure and suppressing external light reflection. The crystallite size of the particle powder, the crystallite size of the particles in the dispersion, and the crystallite size of the particles in the film can be determined based on the methods described in paragraphs

[0172] to

[0179] of WO 2021 / 182499.

[0124] In the photosensitive composition of the present invention, it is also preferable that the pigment has a coating layer. The coating layer refers to a layer that coats the pigment surface, and examples thereof include a layer formed by surface treatment with a silane coupling agent or coating treatment with a resin. When the pigment has a coating layer, the effects of suppressing residue at the bottom of the pattern, improving halftone characteristics, and improving migration resistance are significant. The coating layer preferably has one or more types selected from the group consisting of a silica coating layer, a metal oxide coating layer, and a metal hydroxide coating layer.

[0125] <(E) Dispersant> The photosensitive composition of the present invention preferably further contains a (E) dispersant. The (E) dispersant refers to a compound having a structure that interacts with the pigment surface and a structure that inhibits approach of pigments to each other. From the viewpoint of improving the dispersion stability of the pigment, the (E) dispersant preferably has a basic group, an acidic group, or a salt structure thereof, and more preferably has a basic group or a salt structure thereof.

[0126] <(F) Crosslinking Agent> The photosensitive composition of the present invention contains either or both of a (B) compound and a (F) crosslinking agent. The (F) crosslinking agent refers to a compound having a crosslinkable group, a cationically polymerizable group, or an anionically polymerizable group capable of reacting with a resin or the like. From the viewpoint of improving sensitivity during exposure and improving mechanical properties, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group (such groups may be referred to as "specific crosslinkable groups" hereinafter). The alkoxyalkyl group is preferably an alkoxymethyl group or an alkoxyethyl group, more preferably a methoxymethyl group or a methoxyethyl group. The hydroxyalkyl group is preferably a methylol group or an ethylol group. From the viewpoint of improving sensitivity during exposure and improving mechanical properties, the number of specific crosslinkable groups contained in one molecule of the (F) crosslinking agent is preferably two or more, more preferably three or more, even more preferably four or more, and particularly preferably six or more. On the other hand, the number of specific crosslinkable groups is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less, from the viewpoint of improving mechanical properties.

[0127] The content of the (F) crosslinking agent is preferably 1.0 part by mass or more from the viewpoint of improving sensitivity during exposure and improving mechanical properties, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass (note that the (B) compound may not be included in the photosensitive composition), whereas the content of the (F) crosslinking agent is preferably 30 parts by mass or less from the viewpoint of suppressing residue at the bottom of the pattern and improving mechanical properties, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass (same as above).

[0128] From the viewpoints of suppressing residues at the bottom of the pattern and improving mechanical properties, it is preferable that all or part of the (F) crosslinking agent is the following (F1) compound or (F2) compound. Note that the (F1) compound and the (F2) compound can be used in combination. The preferred contents of these (F) crosslinking agents are also the same as above. (F1) compound: a compound having at least two phenolic hydroxyl groups and at least two specific crosslinkable groups. (F2) compound: a compound having a structure containing a heterocyclic structure and at least two specific crosslinkable groups.

[0129] From the viewpoint of improving mechanical properties, the compound (F1) preferably has at least two structures in which a phenolic hydroxyl group and a specific crosslinkable group are bonded to one aromatic structure, and more preferably has at least two structures in which a phenolic hydroxyl group and at least two specific crosslinkable groups are bonded to one aromatic structure. The aromatic structure in the compound (F1) is preferably an aromatic structure having 6 to 15 carbon atoms, and more preferably a benzene structure or a naphthalene structure. From the viewpoint of improving mechanical properties, the heterocyclic structure in the compound (F2) is preferably a nitrogen-containing cyclic structure, more preferably a cyclic structure having at least two nitrogen atoms, and even more preferably an isocyanuric acid structure, a triazine structure, a glycoluril structure, an imidazolidone structure, a pyrazole structure, an imidazole structure, a triazole structure, a tetrazole structure, or a purine structure. The number of nitrogen atoms in the heterocyclic structure in the compound (F2) is preferably one or more, more preferably two or more, and even more preferably three or more per molecule. On the other hand, the number of nitrogen atoms is preferably 6 or less, more preferably 4 or less.

[0130] <(G) Inorganic Particles> From the viewpoint of improving migration resistance, the photosensitive composition of the present invention preferably further contains (G) inorganic particles. The (G) inorganic particles refer to particles containing, as a main component, an element selected from the group consisting of metal elements, metalloid elements, and semiconductor elements. The main component refers to the component that is contained in the largest amount by mass among the constituent components. From the viewpoint of improving migration resistance, the (G) inorganic particles preferably have either or both of hydroxy groups and silanol groups on the particle surface. From the viewpoint of improving migration resistance, the (G) inorganic particles preferably contain one or more particles selected from the group consisting of silica particles, alumina particles, titania particles, vanadium oxide particles, chromium oxide particles, iron oxide particles, cobalt oxide particles, copper oxide particles, zinc oxide particles, zirconium oxide particles, niobium oxide particles, tin oxide particles, and cerium oxide particles. From the viewpoint of further suppressing external light reflection, it is more preferable that the (G) inorganic particles further contain silica particles.

[0131] From the viewpoint of improving halftone characteristics and migration resistance, the silica particles preferably have a radical polymerizable group, a heat-reactive group, a hydroxy group, a silanol group, an alkoxysilyl group, an alkylsilyl group, a dialkylsilyl group, a trialkylsilyl group, a phenylsilyl group, or a diphenylsilyl group on the particle surface, and from the viewpoint of further improving halftone characteristics, it is more preferable that the silica particles have a radical polymerizable group or a heat-reactive group on the particle surface. Examples and preferred descriptions of the radical polymerizable group are as described above in the binder resin (A).

[0132] The average primary particle diameter of the silica particles is preferably 5.0 nm or more from the viewpoint of improving migration resistance. On the other hand, the average primary particle diameter of the silica particles is preferably 200 nm or less from the viewpoint of suppressing residue at the bottom of the pattern and suppressing external light reflection. Furthermore, the average primary particle diameter of the silica particles is preferably more than 0.20 μm from the viewpoint of achieving a high elastic modulus and a low thermal expansion coefficient. On the other hand, the average primary particle diameter of the silica particles is preferably 100 μm or less from the viewpoint of suppressing residue at the bottom of the pattern.

[0133] The primary particle diameter of the pigment and silica particles refers to the major axis diameter of the primary particles. The average primary particle diameter of the pigment and silica particles in the film can be calculated as the average value of 30 primary particles measured by imaging and analyzing the cross section of the film using a transmission electron microscope (hereinafter referred to as "TEM"). The preferred ranges of the average primary particle diameter in the pigment dispersion and the silica particle dispersion are the same as the preferred ranges of the average primary particle diameter in the film. The average primary particle diameter in the pigment dispersion and the silica particle dispersion can be determined by measuring the particle size distribution by dynamic light scattering. Examples of measuring instruments include the SZ-100 manufactured by Horiba, Ltd. for the dynamic light scattering method, and the SLD3100 manufactured by Shimadzu Corporation or the LA-920 manufactured by Horiba, Ltd., or equivalents for the laser diffraction / scattering method.

[0134] The silica particles described above are believed to capture metallic impurities and ionic impurities that adversely affect electrical insulation due to the acidity and negative charge of either or both of the hydroxyl and silanol groups on the particle surface. Furthermore, the robust structure of the particles allows them to retain the captured impurities even after heat treatment or voltage application, which is thought to improve migration resistance. Furthermore, the silica particles unevenly distributed on the surface of the cured product are believed to reduce the reflection and scattering of incident external light.

[0135] The content of sodium element in the silica particles is preferably 1.0 mass ppm or more from the viewpoint of improving migration resistance. On the other hand, the content of sodium element in the silica particles is preferably 1,000 mass ppm or less from the viewpoint of improving migration resistance. The sodium element may exist in the form of, for example, ions (Na ＋ ) or a salt with a silanol group (Si—ONa).

[0136] The content ratio of the (G) inorganic particles relative to the total solid content of the photosensitive composition of the present invention is preferably 5.0 mass% or more from the viewpoint of improving migration resistance, while the content ratio of the (G) inorganic particles is preferably 90 mass% or less from the viewpoint of suppressing residues at the bottom of the pattern.

[0137] <Other Additives and Solvents> The photosensitive composition of the present invention preferably further contains a thermal color former, an oxidative color former, a dissolution promoter, an ink repellent, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, or a surfactant. Known additives may be used as these additives. The photosensitive composition of the present invention preferably further contains a solvent. When the photosensitive composition of the present invention contains a pigment and further contains a dispersant, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond, from the viewpoint of improving the dispersion stability of the pigment.

[0138] <Content of specific aromatic compound> From the viewpoints of suppressing residues at the bottom of a pattern, improving mechanical properties, and improving migration resistance, it is preferred that the photosensitive composition of the present invention further contains one or more aromatic compounds selected from the group consisting of benzene, toluene, xylene, and naphthalene (hereinafter, such aromatic compounds may be referred to as "specific aromatic compounds") and satisfies condition (1).

[0139] The content of the specific aromatic compound in the photosensitive composition is preferably 0.030 mass ppm or more, more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of suppressing residue at the bottom of the pattern, improving mechanical properties, and improving migration resistance. On the other hand, the content of the specific aromatic compound is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less, from the viewpoints of suppressing residue at the bottom of the pattern, improving mechanical properties, and improving migration resistance. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5.0 mass ppm or less, particularly preferably 3.0 mass ppm or less, and most preferably 1.0 mass ppm or less.

[0140] Furthermore, when a (C1-1) compound having a specific structure is used, the content of the specific aromatic compound relative to 10,000 parts by mass of the (C1-1) compound having a specific structure is, from the viewpoints of suppressing residue at the bottom of the pattern, improving mechanical properties, and improving migration resistance, preferably 0.010 parts by mass or more, more preferably 0.030 parts by mass or more, even more preferably 0.050 parts by mass or more, even more preferably 0.070 parts by mass or more, and particularly preferably 0.10 parts by mass or more. On the other hand, the content of the specific aromatic compound relative to 10,000 parts by mass of the (C1-1) compound having a specific structure is, from the viewpoints of suppressing residue at the bottom of the pattern, improving mechanical properties, and improving migration resistance, preferably 1,000 parts by mass or less, more preferably 500 parts by mass or less, even more preferably 300 parts by mass or less, and particularly preferably 100 parts by mass or less. Furthermore, it is preferably 50 parts by mass or less, more preferably 30 parts by mass or less, even more preferably 10 parts by mass or less, even more preferably 5.0 parts by mass or less, particularly preferably 3.0 parts by mass or less, and most preferably 1.0 parts by mass or less.

[0141] By incorporating a trace amount of the above-mentioned specific aromatic compound, the surface of the opening is modified during pattern formation of the photosensitive composition, thereby preventing residue adhesion to the wiring surface and significantly suppressing residue at the bottom of the pattern. Furthermore, due to the π-electron interaction between the specific aromatic compound and resins having aromatic rings such as polyimide, polybenzoxazole, and their precursors, or the π-electron coordinate bond with resins containing silicon atoms having a 3d orbital, which is an empty atomic orbital, such as polysiloxane, these resins are locally oriented, efficiently promoting crosslinking reactions between resins and ring-closing reactions of the resins, resulting in a significant improvement in mechanical properties. Furthermore, it is believed that the specific aromatic compound contributes to the control of the polarization structure and charge balance in the cured product, thereby improving migration resistance.

[0142] When the photosensitive composition of the present invention has negative photosensitivity, it is preferable that the photosensitive composition of the present invention satisfy condition (1) from the viewpoint of suppressing residues at the bottom of the pattern. When the photosensitive composition of the present invention satisfies condition (1), it is more preferable that the photosensitive composition of the present invention contains a (C1) photopolymerization initiator and a (B) compound. The specific aromatic compound stabilizes the pattern bottom by interacting with active radicals and active species in cationic polymerization or anionic polymerization through the π electrons on the aromatic ring, thereby achieving a significant effect of suppressing residues at the bottom of the pattern. In particular, the specific aromatic compound captures active radicals derived from the (C1) photopolymerization initiator and the (B) compound, thereby achieving a significant effect of suppressing residues at the bottom of the pattern by controlling radical polymerization during exposure.

[0143] In addition, if the storage stability of the photosensitive composition is poor, for example, generation of foreign matter after storage at room temperature may become an issue. If foreign matter is generated during storage of the photosensitive composition, when a cured product of the photosensitive composition, such as the cured product in the electronic component of the present invention, is formed, the foreign matter will remain in the cured product or in the pattern opening. Such foreign matter can, for example, cause a decrease in the reliability of light-emitting elements in display devices and a decrease in migration resistance in electronic components. By setting the content of the specific aromatic compound in the photosensitive composition of the present invention within a specific range, generation of foreign matter during storage is suppressed, and the effect of improving storage stability is significantly achieved.

[0144] <Content of specific nitrogen-containing compound> From the viewpoint of improving mechanical properties and migration resistance, the photosensitive composition of the present invention preferably further contains one or more compounds selected from the group consisting of cyclic amide compounds represented by general formula (20), amide compounds represented by general formula (21), cyclic urea compounds represented by general formula (22), urea compounds represented by general formula (23), oxazolidone compounds represented by general formula (24), and isoxazolidone compounds represented by general formula (25) (hereinafter, such compounds may be referred to as "specific nitrogen-containing compounds") and satisfies the following condition (5): Condition (5): When the mass of the total solid content of the photosensitive composition is 100 mass%, the content of the specific nitrogen-containing compound is 0.010 mass% or more and 5.0 mass% or less.

[0145]

[0146] In the general formulas (20) to (25), R ４６ ~R ５６ R each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. １３０ represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, a hydroxy group, an amino group, a monoalkylamino group having 1 to 6 carbon atoms, or a dialkylamino group having 2 to 12 carbon atoms. １３１ ~R １４２ each independently represents an alkyl group having 1 to 6 carbon atoms. α, β, and γ each independently represent an integer of 0 to 6. a, b, c, e, f, g, h, i, j, k, l, and m each independently represent an integer of 0 to 2. When α is 0, a is 0. When β is 0, b is 0. When γ is 0, c is 0. The above-mentioned substituents and structures may have heteroatoms, and may be either unsubstituted or substituted.

[0147] Examples of specific nitrogen-containing compounds include N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-butyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylacetamide, N,N-dimethylpropionamide, N,N-dimethylisobutyramide, N,N-dimethyl-3-methoxypropionamide, N,N-dimethyl-3-butoxypropionamide, 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, N,N'-dimethylpropyleneurea, 1,1,3,3-tetramethylurea, and 1,1,3,3-tetraethylurea.

[0148] When the mass of the total solid content of the photosensitive composition is taken as 100 mass%, from the viewpoint of improving mechanical properties and migration resistance, the content of the specific nitrogen-containing compound is preferably 0.030 mass% or more, more preferably 0.050 mass% or more, even more preferably 0.070 mass% or more, and particularly preferably 0.10 mass% or more. On the other hand, when the mass of the total solid content of the photosensitive composition is taken as 100 mass%, from the viewpoint of improving mechanical properties and migration resistance, the content of the specific nitrogen-containing compound is preferably 4.0 mass% or less, more preferably 3.5 mass% or less, and even more preferably 3.0 mass% or less. Furthermore, it is preferably 2.5 mass% or less, more preferably 2.0 mass% or less, even more preferably 1.5 mass% or less, even more preferably 1.0 mass% or less, particularly preferably 0.70 mass% or less, and most preferably 0.50 mass% or less. The mass of the total solid content of the composition can be calculated, as in the case of the solid content concentration described above, by heating 1 g of the composition at 150°C for 30 minutes to evaporate to dryness, and measuring the mass remaining after heating.

[0149] It is believed that the inclusion of a trace amount of the specific nitrogen-containing compound suppresses ion migration and electromigration and improves migration resistance because the nitrogen-containing structure having an unshared electron pair captures metallic impurities and ionic impurities that adversely affect electrical insulation. Furthermore, the specific nitrogen-containing compound functions as a catalyst to promote crosslinking reactions on aromatic rings in resins having aromatic rings, such as polyimide, polybenzoxazole, and their precursors, and ring-closing reactions of resins, and crosslinking reactions in resins having silanol groups, such as polysiloxane, thereby significantly improving mechanical properties.

[0150] When the photosensitive composition of the present invention contains the above-mentioned polyimide-based resin, from the viewpoint of improving migration resistance, the photosensitive composition of the present invention preferably satisfies condition (5). When the photosensitive composition of the present invention satisfies condition (5), the polyimide-based resin more preferably contains a polyimide-based resin having a weak acidic group.

[0151] <Content of specific carboxylic acid and specific oxime compound> The photosensitive composition of the present invention preferably satisfies either or both of condition (2) and condition (3). Here, either or both of the aldoxime compound and ketoxime compound according to condition (3) (hereinafter, such oxime compounds may be referred to as "specific oxime compounds") more preferably have a fused polycyclic structure, a fused polycyclic heterocyclic structure, a diaryl sulfide structure, or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, a benzofluorene structure, a dibenzofluorene structure, an indene structure, an indane structure, a benzoindene structure, or a benzoindane structure. The fused polycyclic heterocyclic structure is preferably a carbazole structure, a dibenzofuran structure, a dibenzothiophene structure, a benzocarbazole structure, an indole structure, an indoline structure, a benzoindole structure, a benzoindoline structure, a phenothiazine structure, or a phenothiazine oxide structure. The diaryl sulfide structure is preferably a diphenyl sulfide structure, a naphthyl phenyl sulfide structure, or a dinaphthyl sulfide structure.

[0152] Furthermore, the content of one or more carboxylic acids selected from the group consisting of acetic acid, propionic acid, cyclopentanecarboxylic acid, cyclohexanecarboxylic acid, benzoic acid, methylbenzoic acid, and trimethylbenzoic acid (hereinafter, such carboxylic acids may be referred to as "specific carboxylic acids") relative to the total solid content of the photosensitive composition is preferably 0.030 ppm by mass or more, more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more, from the viewpoints of improving sensitivity during exposure and improving migration resistance. On the other hand, the content of the specific carboxylic acid relative to the total solid content of the photosensitive composition is preferably 300 ppm by mass or less, more preferably 200 ppm by mass or less, and even more preferably 100 ppm by mass or less, from the viewpoints of improving sensitivity during exposure and improving migration resistance. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5.0 ppm by mass or less, particularly preferably 3.0 ppm by mass or less, and most preferably 1.0 ppm by mass or less.

[0153] From the viewpoints of improving sensitivity during exposure and improving migration resistance, the content of the specific oxime compound relative to the total solid content of the photosensitive composition is preferably 0.030 ppm by mass or more, more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure and improving migration resistance, the content of the specific oxime compound relative to the total solid content of the photosensitive composition is preferably 300 ppm by mass or less, more preferably 200 ppm by mass or less, and even more preferably 100 ppm by mass or less. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5.0 ppm by mass or less, particularly preferably 3.0 ppm by mass or less, and most preferably 1.0 ppm by mass or less.

[0154] By incorporating a trace amount of the specific carboxylic acid or specific oxime compound, the acidity and negative charge of the carboxyl group and oxime group capture metal impurities and ionic impurities that adversely affect electrical insulation, which is thought to suppress ionic migration and electromigration and improve migration resistance.Furthermore, the specific carboxylic acid and specific oxime compound capture moisture in the cured product, which is thought to suppress ionic migration and electromigration and improve migration resistance.

[0155] When the photosensitive composition of the present invention contains the above-mentioned compound (C1-1), from the viewpoint of improving sensitivity during exposure and improving migration resistance, the photosensitive composition of the present invention preferably satisfies either or both of the above-mentioned conditions (2) and (3). It is believed that the inclusion of a trace amount of the above-mentioned specific carboxylic acid or specific oxime compound extends the life of radicals generated from the compound (C1-1), thereby significantly improving sensitivity during exposure.

[0156] <Contents of Chlorine, Bromine, and Sulfur> From the viewpoint of improving sensitivity during exposure and improving migration resistance, the photosensitive composition of the present invention preferably further contains one or more components selected from the group consisting of a chlorine-containing component, a bromine-containing component, and a sulfur-containing component, and satisfies the following condition (6): Condition (6): The sum of the chlorine content and the bromine content relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less, or the sulfur content relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less.

[0157] The chlorine-containing component and the bromine-containing component are preferably alkyl chloride compounds, cycloalkyl chloride compounds, aryl chloride compounds, alkyl bromide compounds, cycloalkyl bromide compounds, or aryl bromide compounds, and the sulfur-containing component is preferably a thiol compound, sulfide compound, disulfide compound, sulfoxide compound, sulfone compound, sultone compound, or thiophene compound.

[0158] From the viewpoint of improving sensitivity during exposure and migration resistance, the photosensitive composition of the present invention more preferably further satisfies the following condition (6I): Condition (6I): When chlorine, bromine, and sulfur are present in the form of ions in the total solid content of the photosensitive composition, the total content of chlorine present in the form of ions and the content of bromine present in the form of ions relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less, or the content of sulfur present in the form of ions relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less.

[0159] Chlorine present in an ionic form and bromine present in an ionic form are preferably present in the form of chloride ions or bromide ions, and sulfur present in an ionic form is preferably present in the form of sulfide ions, hydrogen sulfide ions, sulfate ions, hydrogen sulfate ions, or sulfite ions.

[0160] The total chlorine content and bromine content and sulfur content relative to the total solid content of the photosensitive composition are preferably 0.030 mass ppm or more, more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoint of improving sensitivity during exposure and migration resistance. On the other hand, the total chlorine content and bromine content and sulfur content are preferably 300 mass ppm or less, more preferably 200 mass ppm or less, and even more preferably 100 mass ppm or less, from the viewpoint of improving sensitivity during exposure and migration resistance. Furthermore, they are preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5.0 mass ppm or less, particularly preferably 3.0 mass ppm or less, and most preferably 1.0 mass ppm or less.

[0161] By incorporating a small amount of the above-mentioned chlorine, bromine, or sulfur, metal impurities and ionic impurities that adversely affect electrical insulation are captured by the unshared electron pairs and the 3d orbitals, which are empty atomic orbitals, and it is presumed that ion migration and electromigration are suppressed and migration resistance is improved.

[0162] When the photosensitive composition of the present invention satisfies either or both of condition (2) and condition (3), from the viewpoint of improving migration resistance, it is preferable that the photosensitive composition of the present invention satisfies either or both of condition (6) and condition (6I). When the photosensitive composition of the present invention satisfies the above condition (6) or condition (6I), the inclusion of a trace amount of the above-mentioned chlorine, bromine, or sulfur element improves the storage stability of the (C1-1) compound, which is advantageous for controlling the content of the specific carboxylic acid and the content of the specific oxime compound, and significantly improves the sensitivity during exposure. Furthermore, the inclusion of a trace amount of the above-mentioned chlorine, bromine, or sulfur element suppresses the generation of foreign matter during storage, and significantly improves storage stability.

[0163] <Water Content> The photosensitive composition of the present invention preferably satisfies the condition (4) from the viewpoint of improving sensitivity during exposure and migration resistance.

[0164] The water content in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, even more preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more, from the viewpoint of improving sensitivity during exposure and migration resistance. On the other hand, the water content is preferably 2.5% by mass or less, more preferably 2.2% by mass or less, and even more preferably 2.0% by mass or less, from the viewpoint of improving sensitivity during exposure and migration resistance. Furthermore, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.2% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0165] It is presumed that the water mentioned above captures metallic impurities and ionic impurities that adversely affect electrical insulation due to interactions such as the dipole moment of water molecules and hydrogen bonds, thereby suppressing ion migration and electromigration and improving migration resistance.

[0166] When the photosensitive composition of the present invention satisfies the above condition (2) or condition (3), it is preferable that the photosensitive composition of the present invention satisfies condition (4) from the viewpoint of improving migration resistance. By setting the water content in the photosensitive composition of the present invention within a specific range, the storage stability of the (C1-1) compound is improved, which is advantageous for controlling the content of the specific carboxylic acid and the content of the specific oxime compound, and the effect of improving sensitivity during exposure is remarkable. Furthermore, by setting the water content in the photosensitive composition of the present invention within a specific range, the generation of foreign matter during storage is suppressed, and the effect of improving storage stability is remarkable.

[0167] <Fluorine Content> From the viewpoint of suppressing residues at the bottom of a pattern and improving migration resistance, the photosensitive composition of the present invention preferably satisfies the condition (1α). The photosensitive composition of the present invention more preferably further satisfies the condition (2α).

[0168] From the viewpoint of the effects of the present invention, the fluorine content relative to the total solid content of the photosensitive composition is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, even more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the present invention, the fluorine content is preferably 1,000 ppm by mass or less, more preferably 500 ppm by mass or less, even more preferably 300 ppm by mass or less, and particularly preferably 100 ppm by mass or less. Furthermore, the fluorine content is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0169] The preferred range of the fluoride ion content in the total solid content of the photosensitive composition is the same as the preferred range of the fluorine content in the total solid content of the photosensitive composition described above.

[0170] The fluorine content relative to the total solid content of the photosensitive composition may be 0 ppm by mass. The fluoride ion content relative to the total solid content of the photosensitive composition may also be 0 ppm by mass. When the fluorine content or fluoride ion content relative to the total solid content of the photosensitive composition exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably contains a (A) binder resin, a (C) photosensitizer, a (B) compound, or a (F) crosslinking agent having a fluorine atom or a fluoride ion in its structure, or further contains either or both of a nonionic fluorine atom-containing component and a fluoride ion-containing component.

[0171] The nonionic fluorine atom-containing component is preferably a phenol compound, a fluorinated alkyl compound, a fluorinated cycloalkyl compound, or a fluorinated aryl compound having a substituent containing a fluorinated alkyl group. The fluoride ion-containing component preferably contains an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cationic species. The quaternary ammonium ion preferably has a linear or branched hydrocarbon group. The hydrocarbon group is preferably an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms.

[0172] By limiting the content of compounds containing nonionic fluorine atoms in their structures or components containing fluoride ions in the photosensitive composition to a specific amount or less, the content of nonionic fluorine atoms, fluoride ions, or fluorine-containing anions derived from these components is reduced to a specific amount or less. It is believed that this leads to localized activation of protons in the photosensitive composition due to interactions such as hydrogen bonding between the components in the photosensitive composition. Therefore, the effect of promoting dissolution in the developer is thought to be significant in suppressing residues at the bottom of the pattern. Furthermore, intentionally limiting the content of the above components to a specific amount or less is thought to control the polarization structure and charge balance in the cured product. As a result, it is believed that ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect electrical insulation are suppressed, thereby improving migration resistance.

[0173] <Content of Carbonyl Group-Containing Compound Having Specific Structure> From the viewpoint of improving mechanical properties and migration resistance, the photosensitive composition of the present invention preferably contains the specific (C1x-DL) compound described below. Examples and preferred descriptions regarding the specific (C1x-DL) compound are as described below for the specific (C1x-DL) compound in the cured product.

[0174] <Photosensitive Composition Coating and Photosensitive Composition Film of the Present Invention> The photosensitive composition coating of the present invention is a film formed from the photosensitive composition of the present invention in a semi-cured state (B-stage). The semi-cured state refers to a state in which a crosslinked structure is not formed, or a state in which a crosslinked structure is formed by partial reaction but the film retains fluidity. For example, after application to a substrate or the like, the coating film is dried under reduced pressure to remove the solvent, or the coating film is dried by heating at 40 to 150°C, and refers to a state in which the coating is soluble in an alkaline solution or an organic solvent. The photosensitive composition film of the present invention preferably has a photosensitive composition coating formed from the photosensitive composition of the present invention and a support. This configuration is suitable from the viewpoint of handleability. The photosensitive composition film has positive or negative photosensitivity. It is also preferable that the photosensitive composition film be capable of forming a free-standing film with a single film. The photosensitive composition film preferably has adhesive properties, and it is also preferable that multiple components are bonded to each other. Being able to form a free-standing film as a single film means being able to form a film having a width of 1.5 cm or more, a length of 5.0 cm or more, and a thickness of 5.0 μm or more without a support. In other words, the photosensitive composition film is preferably a photosensitive composition coating capable of forming a free-standing film as a single film. The support is preferably a flexible substrate, but may also be a rigid substrate. The surface of the support facing the photosensitive film may be surface-treated with a silane coupling agent or the like. The thickness of the support is preferably 10 to 200 μm from the viewpoint of handleability.

[0175] <Cured Product of the Photosensitive Composition of the Present Invention> The cured product of the present invention is obtained by curing the photosensitive composition of the present invention. Curing refers to the formation of a crosslinked structure by a reaction, which causes the film to lose its fluidity, or to the state of being in this state. The curing reaction may be by heating, by irradiation with energy rays, or the like, but is not particularly limited. Heating is preferred. The formation of a crosslinked structure by heating, which causes the film to lose its fluidity, is called thermal curing. Heating conditions include, for example, heating at 150 to 500°C for 5 to 300 minutes. The cured product of the present invention may also be obtained by curing the photosensitive film of the present invention.

[0176] The optical density at the wavelength of visible light per 1 μm of film thickness of the cured product of the present invention is preferably 0.20 or more, more preferably 0.50 or more, and even more preferably 1.0 or more, from the viewpoint of suppressing external light reflection and improving the reliability of elements. On the other hand, from the viewpoint of improving sensitivity during exposure and improving the reliability of elements, the optical density is preferably 3.0 or less, more preferably 2.0 or less, and even more preferably 1.5 or less. The optical density is preferably the optical density of a cured product obtained by heating and curing the composition. When the optical density is within the above range, incident external light can be blocked, thereby achieving a significant effect of suppressing external light reflection. Furthermore, photodegradation of the cured product itself and layers inside it is suppressed, thereby achieving a significant effect of improving the reliability of elements.

[0177] The dielectric loss tangent at a frequency of 1 GHz of the cured product of the present invention is preferably 0.00010 to 0.0100 from the viewpoint of improving the reliability of elements and reducing transmission loss. The dielectric loss tangent is a value measured by a resonator method using a split post dielectric resonator (SPDR). The dielectric constant at a frequency of 1 GHz of the cured product of the present invention is preferably 2.0 to 3.5 from the viewpoint of improving the reliability of elements and reducing transmission loss. The preferred ranges for the dielectric loss tangent and dielectric constant of the cured product of the present invention at frequencies of 10 GHz, 30 GHz, and 70 GHz are also the same as those described above.

[0178] The water absorption of the cured product of the present invention is preferably 0.10% by mass or more, more preferably 0.30% by mass or more, from the viewpoint of improving migration resistance, while the water absorption is preferably 1.5% by mass or less, more preferably 1.0% by mass or less, even more preferably 0.80% by mass or less, even more preferably 0.60% by mass or less, and particularly preferably 0.50% by mass or less, from the viewpoint of improving migration resistance.

[0179] <Elements and Articles Comprising the Cured Product> The element of the present invention comprises the cured product of the present invention. Furthermore, the article of the present invention comprises the cured product of the present invention. Examples of the article include electronic components, electronic devices, mobile objects, buildings, and windows. Examples of electronic components include semiconductor devices, antennas, display devices, metal-clad laminates, wiring boards, semiconductor packages, active components including semiconductor devices, and passive components. The photosensitive composition of the present invention is preferably used to form electronic components. Examples of semiconductor devices include semiconductor devices having a fan-out wafer-level package structure, a fan-out panel-level package structure, or an antenna-in-package structure. Examples of antennas include microstrip line antennas and strip line antennas. Examples of display devices include organic electroluminescence (EL) displays, quantum dot displays, micro light-emitting diode (hereinafter, "LED") displays, mini-LED displays, and liquid crystal displays. Examples of metal-clad laminates include printed circuit boards.

[0180] The electronic component of the present invention comprises the cured product of the present invention. The cured product of the present invention can combine excellent mechanical properties and high migration resistance. Therefore, the photosensitive composition of the present invention is preferably used to form an insulating layer for metal wiring, a protective layer for metal wiring, or an interlayer insulating layer for metal wiring in an electronic component. The photosensitive composition of the present invention is also preferably used to form an interlayer insulating layer for rewiring in a semiconductor device, and is also preferably used to form an insulating layer for metal wiring in an antenna, a protective layer for metal wiring, or an interlayer insulating layer between metal wiring and ground wiring. It is also preferably used to form a pixel dividing layer, a thin film transistor (hereinafter referred to as "TFT") planarization layer, a TFT protective layer, a TFT interlayer insulating layer, or a gate insulating layer in an organic electroluminescence display, a quantum dot display, or a micro LED display. It is also preferably used to form an insulating layer for metal wiring, a protective layer for metal wiring, or a solder resist layer for metal wiring in a metal-clad laminate.

[0181] <Hollow Structure> The cured product of the present invention can be used as a material for a hollow structure, and the electronic component of the present invention preferably has such a hollow structure. The hollow structure has a hollow structure support material and a hollow structure roofing material. From the viewpoint of improving heat resistance and reliability, the hollow structure support material and the hollow structure roofing material preferably contain the above-mentioned polyimide-based resin. The film thickness of the hollow structure support material is preferably 5 to 20 μm. The film thickness of the hollow structure roofing material is preferably 10 to 50 μm. The photosensitive composition of the present invention is preferably used to form a hollow structure. The photosensitive film of the present invention is suitable for forming a hollow structure. Examples of electronic components having hollow structures include MEMS (Micro Electro Mechanical Systems).

[0182] <Electronic Component> The electronic component of the present invention will be described below. However, the present invention is not limited to the following embodiments, and various modifications are possible as long as the object of the invention can be achieved and the gist of the invention is not deviated from.

[0183] The electronic component of the present invention has the configuration described in

[20] above. By adopting the above configuration, the electronic component of the present invention can provide an electronic component with excellent migration resistance. It is believed that the (XIa) structure contributes to controlling the polarization structure and charge balance in the cured product. It is also believed that the π electrons in the aromatic structure of the (XIc) structure capture metal impurities, ionic impurities, and the like that adversely affect electrical insulation. Furthermore, it is believed that the hydrophobic structure in the (XIc) structure inhibits moisture penetration into the cured product. As a result of these actions, it is believed that excellent migration resistance is achieved by suppressing ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect electrical insulation. It is also believed that the suppression of metal migration and aggregation in wiring also contributes to high reliability in electronic components, semiconductor devices, display devices, and metal-clad laminates.

[0184] In the electronic device of the present invention, the (C1x-DL) carbonyl group-containing compound in the cured product is a compound having the following structure (XIa) and the following structure (XIc) in its molecular structure (such a (C1x-DL) carbonyl group-containing compound may be referred to as a "specific (C1x-DL) compound" hereinafter). Structure (XIa): A structure in which a carbonyl group is bonded to a fused polycyclic heterocyclic structure composed of two rings, or a structure in which a carbonyl group is bonded to a fused polycyclic heterocyclic structure composed of three rings, including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure, or a dihydropyrrole structure. Structure (XIc): An aromatic structure.

[0185] From the viewpoint of improving migration resistance, when the (XIc) structure has a carbonyl group, the specific (C1x-DL) compound preferably has a carbonyl group in the (XIa) structure in addition to the carbonyl group. The carbonyl group in the (XIa) structure is preferably a carbonyl group in a ketone structure, aldehyde structure, carboxylic acid structure, carboxylic acid ester structure, or carboxylic acid amide structure. The specific (C1x-DL) compound in the cured product is preferably a compound having a structure derived from the specific (C1x-DL) compound in the photosensitive composition, or a (C1-1) compound having a specific structure. Examples and preferred descriptions regarding the (XIa) structure and (XIc) structure in the specific (C1x-DL) compound in the cured product are the same as the examples and preferred descriptions regarding the (Ia) structure and (Ic) structure in the (C1-1) compound having the specific structure.

[0186] From the viewpoint of improving migration resistance, the cured product in the electronic component of the present invention preferably satisfies the following condition (Xπ): Condition (Xπ): The content of the specific (C1x-DL) compound in the cured product is 0.0010 mass% or more and 5.0 mass% or less.

[0187] From the viewpoint of improving migration resistance, the content of the specific (C1x-DL) compound in the cured product is preferably 0.0050% by mass or more, more preferably 0.010% by mass or more, even more preferably 0.050% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoint of improving migration resistance, the content of the specific (C1x-DL) compound is preferably 4.0% by mass or less, more preferably 3.5% by mass or less, and even more preferably 3.0% by mass or less. Furthermore, it is preferably 2.5% by mass or less, more preferably 2.0% by mass or less, even more preferably 1.5% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0188] <Resins and Compounds in the Cured Product> The electronic component of the present invention includes a cured product. The cured product in the electronic component of the present invention is preferably a cured product of a photosensitive composition, and more preferably contains a resin. The resin in the cured product preferably contains either or both of a (XA1) weakly acidic group-containing resin and a (XA2) resin not having a weakly acidic group. The (XA1) weakly acidic group-containing resin in the cured product is preferably the above-mentioned (A1) resin or a resin having a structure derived from said resin. The (XA2) resin not having a weakly acidic group is preferably the above-mentioned (A2) resin or a resin having a structure derived from said resin. Examples and preferred descriptions of the resin in the cured product are the same as the examples and preferred descriptions of the (A) binder resin above. The resin in the cured product may be either the (A) binder resin in the composition or a resin having a structure derived from said resin.

[0189] <Content of specific nitrogen-containing compound in cured product> From the viewpoint of improving migration resistance, the cured product of the electronic component of the present invention preferably further contains one or more compounds selected from the group consisting of the specific nitrogen-containing compounds described above and satisfies the following condition (X5). Examples and preferred descriptions of the specific nitrogen-containing compound are as described above for the specific nitrogen-containing compound in the photosensitive composition. Condition (X5): When the mass of the cured product is taken as 100 mass%, the content of the specific nitrogen-containing compound in the cured product is 0.010 mass% or more and 5.0 mass% or less.

[0190] <Fluorine Content in Cured Product> From the viewpoint of improving migration resistance, the cured product of the electronic component of the present invention preferably satisfies the condition (X1α). It is more preferable that the cured product of the electronic component of the present invention further satisfies the condition (X2α).

[0191] From the viewpoint of the effects of the present invention, the fluorine content in the cured product is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, even more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the present invention, the fluorine content is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. Furthermore, the fluorine content is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0192] The preferred range of the fluoride ion content in the cured product is the same as the preferred range of the fluorine content in the cured product described above.

[0193] The fluorine content in the cured product may be 0 ppm by mass. The fluoride ion content in the cured product may also be 0 ppm by mass. When either or both of the fluorine content and the fluoride ion content in the cured product exceed 0 ppm by mass, the cured product in the electronic component of the present invention preferably contains a resin having a fluorine atom or a fluoride ion in its structure, or further contains either or both of a component containing a nonionic fluorine atom and a component containing a fluoride ion.

[0194] Examples and preferred descriptions of the component containing a nonionic fluorine atom and the component containing a fluoride ion in the cured product are the same as those described above for each component in the photosensitive composition.

[0195] It is believed that intentionally setting the fluorine content and fluoride ion content in the cured product below a specific value can control the polarization structure and charge balance in the cured product, thereby suppressing ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect electrical insulation, thereby improving migration resistance.

[0196] <Method for producing a cured product> The method for producing a cured product of the present invention includes: (1) a step of forming a coating film of the photosensitive composition of the present invention on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) a step of developing using a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition. Note that in these steps, the methods described in paragraphs

[0453] to

[0481] of WO 2019 / 087985 may also be applied. The step of forming a coating film preferably involves applying a coating and then pre-baking to form a film. The step of obtaining a cured pattern preferably involves heating the pattern to thermally cure it.

[0197] The present invention will be described in more detail below with reference to Examples, Reference Examples, and Comparative Examples, but the present invention is not limited to these examples. For compounds used in the following explanations or tables that use abbreviations, the names corresponding to the abbreviations are listed in Table 1-2.

[0198]

[0199] <Synthesis Examples of Each Resin> The compositions of the resins obtained in Synthesis Examples 1 to 25 as (A) binder resin are summarized in Tables 1-3 to 1-5. Each resin was synthesized by a known method based on a method described in a known literature, with the monomer compounds to be used as monomers and the copolymerization ratios appropriately changed. The copolymerization ratios of the monomers are as shown in Tables 1-3 to 1-5.

[0200] The hydroxyl group-containing diamine (HA) having the following structure used in Synthesis Example 8 was synthesized by a known method based on the synthesis method described in Synthesis Example 1 in paragraphs

[0374] to

[0376] of WO 2016 / 056451. The resin obtained in Synthesis Example 5 using the hydroxyl group-containing diamine (HA) having the following structure is a polyimide precursor having an amic acid ester structural unit, an amic acid structural unit, and an imide ring-closed structure.

[0201]

[0202] In Synthesis Example 19, based on the synthesis methods described in Synthesis Examples 3 and 5 in paragraphs

[0109] to

[0122] of WO 2012 / 141165, a phenol compound having the following structure was synthesized as a condensation product of XLN and SAD instead of the condensation product of XLN and 4-hydroxybenzaldehyde, and the obtained phenol compound was used in a condensation reaction with an aldehyde compound.

[0203]

[0204] In Synthesis Example 8, the amic acid structural units in the resin were reacted with DFA as an esterifying agent to convert the structure to an amic acid ester structural unit having a methyl group. In Synthesis Examples 9 and 10, the tetracarboxylic dianhydride ODPA was reacted with HEMA or GDMA to perform ring-opening addition of all the acid anhydride groups of the ODPA, and then the carboxyl groups derived from the ODPA were reacted with BAHF as a bisaminophenol compound and EtOH as an end-capping agent.

[0205] In Synthesis Example 18, GMA having an epoxy group was reacted with the carboxy group derived from MAA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0206] In Synthesis Example 24, DHBA having a carboxy group was reacted with the epoxy groups derived from GMA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0207] In Synthesis Example 25, GMA having an epoxy group was reacted with the phenolic hydroxyl group derived from HPMA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0208]

[0209]

[0210]

[0211] The structural units and structures of the resins obtained in each Synthesis Example, as well as the resins used in each Example, Reference Example, and Comparative Example, are summarized in Table 2-1. The fluorine content in the resin structure of polyimides (PI-1) to (PI-4), polyimide precursors (PIP-1) to (PIP-3), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamideimide (PAI-1) exceeded 10,000 ppm by mass. The fluorine content in the resin structure of polyimides (PI-5) to (PI-7), polyimide precursor (PIP-4), and the other Synthesis Examples was 0 ppm by mass.

[0212]

[0213] Table 2-2 shows a list and description of the (D) colorant and (E) dispersant used in each example, reference example, and comparative example. Note that "A.R.52-B.B.7" shown in Table 3-8 is a dye obtained by mixing A.R.52 and B.B.7 at a 1 / 1 (molar ratio) and stirring, filtering the precipitated salt, washing it three times with water, and then drying it.

[0214]

[0215] <Preparation Examples of Each Pigment Dispersion> The compositions of the pigment dispersions obtained in Preparation Examples Bk-1 to Bk-7 are summarized in Table 2-3. In Preparation Examples Bk-1 to Bk-7, each pigment dispersion was prepared by the following method.

[0216] Preparation Examples Bk-1 to Bk-7 Preparation of Pigment Dispersions (Bk-1) to (Bk-7) Based on the method described in paragraphs

[0138] to

[0140] of International Publication No. 2022 / 196261 and Preparation Example 1, a colorant described in Table 2-3 and ADP, a polyalkyleneamine-polyoxyalkylene ether dispersant, were used as the dispersant, and a wet media dispersion treatment was carried out using a circulation system so that the average primary particle diameter of the pigment was the value described in Table 2-3. The mixture was then filtered through a 0.80 μmφ filter to obtain pigment dispersions (Bk-1) to (Bk-7) with a solids concentration of 15% by mass and a colorant / dispersant ratio of 100 / 35 (by mass). The average primary particle diameter of the pigment in the obtained pigment dispersions is shown in Table 2-3. The average primary particle diameter of the pigment in the cured film, the crystallite size of the pigment in the pigment dispersion, and the crystallite size of the pigment in the cured film are also shown in Table 2-3.

[0217]

[0218] <Synthesis Example of Silica Particle Dispersion> Table 2-4 shows a list and description of the silica particles, which are inorganic particles, used in each of the Examples, Reference Examples, and Comparative Examples.

[0219] Synthesis Examples 26 to 28 Synthesis of Dispersions of Silica Particles (SP-1) to (SP-3) Based on the method described in paragraphs

[0132] to

[0134] of WO 2022 / 196261 and Synthesis Example 3, dispersions of silica particles (SP-1) to (SP-3) were obtained using silica particle dispersions, surface modifiers, and polymerization inhibitors described in Tables 2-4.

[0220]

[0221] <Evaluation Methods in Each Example, Reference Example, and Comparative Example> The evaluation methods in each Example, Reference Example, and Comparative Example are as follows. A glass substrate (manufactured by Geomatec Co., Ltd.; hereinafter, "ITO / Ag substrate") was prepared by sputtering a 100 nm film of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) on glass, and then sputtering a 10 nm film of ITO on top of the APC layer. The glass substrate was then irradiated with UV-O for 100 seconds using a tabletop optical surface treatment device (PL16-110; manufactured by Sen Special Light Sources Co., Ltd.). ３The substrates were washed before use. Tempax glass substrates (manufactured by AGC Technoglass Co., Ltd.) and other substrates were used without pretreatment. The film thickness was measured using a surface roughness and contour shape measuring instrument (SURFCOM 1400D; manufactured by Tokyo Seimitsu Co., Ltd.) at a magnification of 10,000x, a measurement length of 1.0 mm, and a measurement speed of 0.30 mm / s.

[0222] (1) Weight average molecular weight of resin The above polyimides (PI-1) to (PI-7), polyimide precursors (PIP-1) to (PIP-4), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamideimide (PAI-1) were prepared by preparing a 0.10 mass% N-methyl-2-pyrrolidone solution of each resin. Using a gel permeation chromatography (hereinafter "GPC") analyzer (Waters 2690; manufactured by Waters), the weight average molecular weight in terms of polystyrene was measured using N-methyl-2-pyrrolidone in which lithium chloride and phosphoric acid were dissolved at 0.050 mol / L as the fluidized bed. For other resins, the weight average molecular weight in terms of polystyrene was measured at around room temperature using a GPC analyzer (HLC-8220; manufactured by Tosoh Corporation) and tetrahydrofuran or N-methyl-2-pyrrolidone as the fluidized bed in accordance with JIS K7252-3 (2008).

[0223] (2) Contents of specific aromatic compounds, specific nitrogen-containing compounds, specific carboxylic acids, specific oxime compounds, and specific (C1x-DL) compounds in the composition or cured film The contents of specific aromatic compounds, specific nitrogen-containing compounds, specific carboxylic acids, specific oxime compounds, and specific (C1x-DL) compounds in the composition or cured film were measured by gas chromatography mass spectrometry and liquid chromatography mass spectrometry using calibration curves based on standard substances. The contents relative to the total solid content of the composition were calculated from the obtained measured values ​​and the following formula: (Content of target compound relative to the total solid content of the composition) = (Content of target compound in the composition) × 100 / (Solid content concentration of the composition [mass %]).

[0224] (3) Content of Specific Elements in Resins, Compositions, or Cured Films The fluorine, chlorine, bromine, and sulfur contents (represented as "fluorine content," "chlorine content," "bromine content," and "sulfur content" in the tables) in resins, compositions, or cured films were measured by combustion ion chromatography under the following measurement conditions. Each of the above resins was separated by GPC fractionation before use. Even when the resins were composed of resins with different structural units, they were also separated by GPC fractionation before use. Regarding the resins in the compositions, whether they contained a single resin or resins with different structural units, the compositions were extracted with dichloromethane, ultracentrifuged, and then separated from the dichloromethane-insoluble matter by GPC fractionation before use. The resins, compositions, or cured films were combusted and decomposed in the combustion tube of an analyzer. The generated gas was absorbed in an absorption liquid, and a portion of the absorption liquid was analyzed by ion chromatography. The absence of an elemental content indicates that the element was not detected. The content of the compound relative to the total solid content of the composition was calculated from the obtained measured value and the following formula: (Content of the compound of interest relative to the total solid content of the composition) = (Content of the compound of interest in the composition) x 100 / (Solid content concentration of the composition [mass %]) <Combustion and absorption conditions> System: AQF-2100H, GA-210 (manufactured by Mitsubishi Chemical Corporation) Electric furnace temperature: Inlet 900°C, Outlet 1000°C Gas: Ar / O ２ 200mL / min, O ２ 400 mL / min Absorption liquid: H ２ O ２ 0.1 mass% Absorption solution volume: 5 mL <Conditions for ion chromatography and anion analysis> System: ICS1600 (manufactured by DIONEX) Mobile phase: 2.7 mmol / L Na ２ CO ３ , 0.3 mmol / L NaHCO ３ Flow rate: 1.50 mL / min Detector: electrical conductivity detector Injection volume: 100 μL.

[0225] (4) Fluoride ion content in the composition or cured film The fluoride ion content in the composition or cured film was measured by ion chromatography under the following measurement conditions. The composition or cured film was added to ultrapure water and shaken at room temperature to extract ionic components. The extract was treated with a solid-phase extraction cartridge, and then anionic components were analyzed by ion chromatography. When anionic components could not be measured under the following ion chromatography analysis condition 1, they were measured under the following ion chromatography analysis condition 2. In the table, if the ion content is not listed, it means that the ion in question was not detected. The content relative to the total solid content of the composition was calculated from the obtained measurement value and the following formula. (Content relative to total solid content of composition) = (Content in composition) × 100 / (Solids concentration [mass %] of composition) <Ion chromatography analysis condition 1 (anionic component)> Apparatus: IC-2010 (manufactured by Tosoh Corporation) Separation column: 4.6 mmφ × 100 mm, TSKgel Super IC-Anion HS Eluent: sodium bicarbonate Column temperature: 40°C Detector: electrical conductivity meter Sample injection volume: 250 μL <Ion chromatography analysis condition 2 (anionic component)> Apparatus: IC-2010 (manufactured by Tosoh Corporation) Separation column: 4.6 mmφ × 100 mm, TSKgel Super IC-Anion HS Eluent: sodium carbonate / sodium bicarbonate Column temperature: 40°C Detector: electrical conductivity meter Sample injection volume: 250 μL.

[0226] (5) Water Content in Composition The water content in the composition was measured by volumetric titration in accordance with JIS K0113 (2005) using a Karl Fischer moisture meter (MKS-520; manufactured by Kyoto Electronics Manufacturing Co., Ltd.) and a Karl Fischer reagent as a titration reagent.

[0227] (6) Sensitivity The resolution pattern of the developed film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation). As an index of sensitivity, the exposure dose (value of an i-line illuminometer) at which a space pattern corresponding to an opening in a 20 μm line and space pattern can be formed with a dimensional width of 18 μm was used. The sensitivity was judged as follows, and a sensitivity of 90 mJ / cm was determined.２ The following grades were evaluated as passing: A+, A, B+, B, C+, and C. A+: Sensitivity is 30 mJ / cm ２ A: Sensitivity is 30 mJ / cm or less ２ and more than 40 mJ / cm ２ Below B+: Sensitivity is 40 mJ / cm ２ and more than 50 mJ / cm ２ B: Sensitivity is 50 mJ / cm or less ２ and more than 60 mJ / cm ２ Below C+: Sensitivity is 60 mJ / cm ２ and more than 75 mJ / cm ２ C: Sensitivity is 75 mJ / cm or less ２ and more than 90 mJ / cm ２ D: Sensitivity is 90 mJ / cm or less ２ and more than 150 mJ / cm ２ E: Sensitivity is 150 mJ / cm or less ２ Exceeded.

[0228] (7) Development Residues at Pattern Bottoms The resolution pattern of the prepared developed film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation). As an index of development residues at the pattern bottoms, the presence or absence of residues at the pattern bottoms of a 20 μm opening pattern was observed, and the ratio of the periphery of the openings with residues at the pattern bottoms to the total periphery of the openings was calculated. The evaluation was carried out as follows, and A+, A, B+, B, C+, and C, which indicate that the ratio of the periphery of the openings with residues was 20% or less, were deemed to be acceptable. A+: No residue at the bottom of the pattern A: The ratio of the outer periphery of the opening with residue is 3% or less B+: The ratio of the outer periphery of the opening with residue is more than 3% but not more than 6% B: The ratio of the outer periphery of the opening with residue is more than 6% but not more than 10% C+: The ratio of the outer periphery of the opening with residue is more than 10% but not more than 15% C: The ratio of the outer periphery of the opening with residue is more than 15% but not more than 20% D: The ratio of the outer periphery of the opening with residue is more than 20% but not more than 50% E: The ratio of the outer periphery of the opening with residue is more than 50% but not more than 100%.

[0229] (8) Halftone Properties Samples were prepared by forming a prebaked film of the composition on an ITO / Ag substrate in a thickness of 5 μm in the same manner as in Example 1 (however, the compositions used in each Example or Comparative Example were used). The samples were exposed to patterning with the i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultra-high pressure mercury lamp through a halftone photomask for evaluating halftone properties, with varying exposure doses, and then developed to prepare developed films of the composition. The halftone photomask was used to measure the transmittance (%T ＨＴ ) are the transmittance of the transparent part (%T ＦＴ ) are 20%, 25%, 30%, 35%, 40%, or 50% of the thickness of the thick film portion after development. ＦＴ The thin film portion formed from the semi-transparent portion, which is the halftone exposed portion, was measured for the thickness (T ＨＴ ) μm, and the minimum film thickness (T ＨＴ／ｍｉｎ The maximum step thickness ((T ＦＴ )-(T ＨＴ／ｍｉｎ )) μm was calculated. The evaluation was made as follows, and A+, A, B+, B, C+, and C, which indicate a maximum step film thickness of 0.4 μm or more, were evaluated as passing. A+: Maximum step film thickness is 2.5 μm or more A: Maximum step film thickness is 2.0 μm or more and less than 2.5 μm B+: Maximum step film thickness is 1.5 μm or more and less than 2.0 μm B: Maximum step film thickness is 1.0 μm or more and less than 1.5 μm C+: Maximum step film thickness is 0.7 μm or more and less than 1.0 μm C: Maximum step film thickness is 0.4 μm or more and less than 0.7 μm D: Maximum step film thickness is 0.1 μm or more and less than 0.4 μm E: Maximum step film thickness is less than 0.1 μm, or no film remains after development, making it impossible to measure.

[0230] (9) Light-shielding property (optical density value (hereinafter, "OD value")) A sample was obtained in which a cured film was formed by the method described in Example 1, except that a Tempax glass substrate (manufactured by AGC Technoglass Co., Ltd.) was used as the substrate (however, the composition used in each Example or Comparative Example was the same as that used in the previous Example and Comparative Example, and exposure and development were not performed). The incident light intensity (I ) at three points on the surface of the prepared cured film was measured using a transmission densitometer (X-Rite 361T(V); manufactured by X-Rite Co., Ltd.). ０ The optical density (OD) per 1 μm of film thickness was calculated as an index of light-shielding ability using the following formula, and the average value of the OD values ​​at three points on the surface was calculated. OD value=log １０ (I ０ / I).

[0231] (10) Mechanical properties (elongation at break) A 6-inch diameter SiO ２ A sample on which a cured film was formed was obtained in the same manner as in Example 1, except that a SiO / Si wafer was used (however, the composition used in each Example or Comparative Example was the same as in Example 1, and exposure and development were not carried out). ２ The cured film was peeled off from the / Si wafer. The peeled cured film was cut into strips measuring 1.5 cm wide x 9.0 cm long. A tensile test was performed using a Tensilon (RTM-100; manufactured by Orientec Co., Ltd.) at a room temperature of 23.0°C and a humidity of 45.0% RH at a tensile speed of 50 mm / min to measure the elongation at break. Ten strips were measured per specimen. The average of the top five results was calculated as an index of mechanical properties. The test was judged as follows, with A+, A, B+, B, C+, and C being graded as passing, with elongation at break of 5.0% or more. A+: Elongation at break is 30% or more. A: Elongation at break is 20% or more and less than 30%. B+: Elongation at break is 15% or more and less than 20%. B: Elongation at break is 10% or more and less than 15%. C+: Elongation at break is 7.5% or more and less than 10%. C: Elongation at break is 5.0% or more and less than 7.5%. D: Elongation at break is 1.0% or more and less than 5.0%. E: Elongation at break is less than 1.0% or cannot be measured.

[0232] (11) Migration Resistance (Insulation Reliability) A migration evaluation substrate (WALTS-TEG ME0102JY; manufactured by Waltz Corporation) was used as the substrate, and a sample on which a cured film was formed was obtained by the method described in Example 1, except that the film thickness of the cured film was 1.5 μm (however, the composition used in each Example or Comparative Example was used. Furthermore, exposure and development were not performed). Next, an evaluation element was prepared by soldering a conductor to the measurement terminals with 15 μm lines and 10 μm spaces in a line-and-space pattern of copper wiring on the comb teeth. The insulation reliability of the prepared evaluation element under high temperature and high humidity conditions was evaluated using an insulation degradation characteristic evaluation system (ETAC SIR13; manufactured by Kusumoto Chemicals Co., Ltd.). The evaluation element was placed in a high-temperature, high-humidity chamber set at a temperature of 85°C and a humidity of 85% RH. A voltage of 5.0 V was applied, and the change in resistance over time was measured at 5-minute intervals. Resistance is 1.0 x 10 ６ When the resistance reached Ω or less, it was judged to be insulation failure, and the test time at that point was measured as an index of migration resistance. The evaluation was made as follows, and A+, A, B+, B, C+, and C, which were test times of 200 hours or more, were judged to be pass. A+: Test time was 1,000 hours or more A: Test time was 800 hours or more but less than 1,000 hours B+: Test time was 600 hours or more but less than 800 hours B: Test time was 400 hours or more but less than 600 hours C+: Test time was 300 hours or more but less than 400 hours C: Test time was 200 hours or more but less than 300 hours D: Test time was 50 hours or more but less than 200 hours E: Test time was less than 50 hours or measurement was impossible.

[0233] <Compounds used in each Example, Reference Example, and Comparative Example> The structures of the compounds used in each Example, Reference Example, and Comparative Example are shown below. The minimum number of atoms between the two (meth)acryloyl groups in the (I-b3) structure is 4 for (b-5). The minimum number of atoms between the two (meth)acryloyl groups in the above (I-b4) structure is 13 for (b-6), 23 for (b-7), 31 for (b-8), and 17 for (b-9). (Cb-1) to (Cb-3) correspond to the above specific (C1x-DL) compounds. These compounds were synthesized by known methods.

[0234]

[0235] In the table, "x-1a" has an E / Z ratio of 99 / 1 (mass ratio). "x-1b" has an E / Z ratio of 90 / 10 (mass ratio). "x-1c" has an E / Z ratio of 1 / 99 (mass ratio), and "x-1(E)" and "x-1(Z)" indicate that the E and Z isomers are 100%, respectively. These are obtained by synthesizing the cis isomer (Z isomer) and trans isomer (E isomer), isolating each isomer by either or both of recrystallization and column chromatography fractionation, and then mixing the isomers in the above-mentioned mass ratio.

[0236]

[0237]

[0238]

[0239]

[0240]

[0241]

[0242]

[0243]

[0244] Furthermore, specific aromatic compounds; specific nitrogen-containing compounds; specific carboxylic acids; specific oxime compounds; and compounds containing fluorine, chlorine, bromine, or sulfur (hereinafter, "compounds containing specific elements") used in each of the Examples, Reference Examples, and Comparative Examples are collectively shown in Tables 2-5.

[0245]

[0246] <Preparation of Photosensitive Compositions> Compositions 1 to 166 were prepared according to the formulations shown in Tables 3-1 to 3-10. In Tables 3-1 to 3-10, the values ​​in parentheses indicate the parts by mass of the solid content of each component. When a composition contained a pigment, a preparation not containing a pigment dispersion was first prepared, and then the pigment dispersion was mixed with the preparation to prepare the composition. A PGMEA / EL / GBL mixture in a mass ratio of 50 / 40 / 10 was used as the solvent, and the composition was prepared so that the solid content concentration was 20% by mass. The resulting composition solution was filtered through a 0.45 μmφ filter before use.

[0247] Example 1 Composition 1 was applied to an ITO / Ag substrate using a spin coater (MS-A100; manufactured by Mikasa Corporation), and then prebaked for 120 seconds at 120°C using a buzzer hot plate (HPD-3000BZN; manufactured by AS ONE Corporation) to produce a prebaked film with a film thickness of approximately 1.8 μm. The prebaked film thus produced was spray-developed with a 2.38% by mass aqueous solution of TMAH or cyclopentanone using a compact photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.), and the time required for the prebaked film (unexposed areas) to completely dissolve (Breaking Point; hereinafter, "BP") was measured.

[0248] A prebaked film was prepared in the same manner, and the prepared prebaked film was subjected to patterning exposure using a double-sided alignment single-sided exposure device (Mask Aligner PEM-6M; manufactured by Union Optical Co., Ltd.) through a grayscale mask for sensitivity measurement (MDRM MODEL 4000-5-FS; manufactured by Opto-Line International Co., Ltd.) with the i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultra-high pressure mercury lamp. After exposure, the film was developed with a 2.38% by mass TMAH aqueous solution using a compact photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) and rinsed with water for 30 seconds to prepare a developed film. The development time was 1.3 times the measured BP. In cases where a pattern could not be formed after development with a 2.38% by weight TMAH aqueous solution, an exposed film was prepared in the same manner as above. After exposure, the film was developed with cyclopentanone using a small photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) and rinsed with water for 30 seconds to prepare a developed film. The development time was 1.3 times the measured BP. The developed pattern was observed, and the optimal exposure dose (value measured with an i-line illuminometer) capable of forming a space pattern with a dimensional width of 18 μm corresponding to the openings in a 20 μm line-and-space pattern was determined. After exposure at the optimal exposure dose, the developed pattern was thermally cured at 220°C for 60 minutes using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) to prepare a cured film with a film thickness of approximately 1.2 μm. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 220°C at a rate of 3.5°C / min, heat treatment was carried out at 220°C for 60 minutes, and then cooling to 50°C.

[0249] The cured film was analyzed by methods such as nuclear magnetic resonance spectroscopy, infrared spectroscopy, gas chromatography mass spectrometry, liquid chromatography mass spectrometry, and time-of-flight secondary ion mass spectrometry to analyze the structural units of the resin contained in the cured film and the structures of the compounds contained in the cured film.

[0250] The cured film of Composition 1 contains the following resins and compounds, and contains a resin having a structure derived from the resin contained in Composition 1, and a compound having a structure derived from the compound contained in Composition 1. (XA1x) resin: a resin having a phenolic hydroxyl group and having an imide structure in the structural unit; a resin having a phenolic hydroxyl group and having an amic acid ester structure, an amic acid structure, and an imide structure in the structural unit. Specific (C1x-DL) compound: a compound having an indole structure, a structure in which a carbonyl group is bonded to the 3-position of indole, and a structure in which a phenyl group having a benzoyl group bonded to the 4-position is bonded to the 1-position of indole.

[0251] Examples 2 to 158 and Comparative Examples 1 to 8 The same operations and evaluations as in Example 1 were carried out using each of the compositions shown in Tables 3-1 to 3-10. The evaluation results are summarized in Tables 3-1 to 3-10. In Examples 1 to 150 and Comparative Examples 1 to 8, the fluorine content relative to the total solid content of the composition and the fluorine content in the cured product exceeded 1,000 ppm by mass. In Examples 151 to 153, the fluorine content relative to the total solid content of the composition and the fluorine content in the cured product were 0 ppm by mass. In Examples 154 to 158, the fluorine content relative to the total solid content of the composition is as shown in Table 3-9, and the fluorine content in the cured product was the same as the fluorine content relative to the total solid content of the composition. The thermal curing conditions for Example 148 were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 ppm by mass or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, and the composition was heated at 200°C for 60 minutes, followed by cooling to 50°C. Furthermore, in each example, when a positive-type photosensitive composition was used, a photomask in which the light-transmitting and light-shielding portions were inverted was used. The development time was 60 seconds, 90 seconds, or 120 seconds, and a grayscale mask (MDRM MODEL 4000-5-FS; manufactured by Opto-Line International) for sensitivity measurement was used to determine the optimal exposure dose (value measured with an i-line illuminometer) for forming a space pattern corresponding to the openings with a dimensional width of 20 μm in a 20 μm line-and-space pattern. From these results, the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure dose for that development time were determined. After exposure at the optimum exposure dose and development for the optimum development time, the pattern was thermally cured for 60 minutes at 200° C. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200° C. at a temperature increase rate of 3.5° C. / min, heat treatment was carried out at 200° C. for 60 minutes, and then cooling to 50° C.

[0252]

[0253]

[0254]

[0255]

[0256]

[0257]

[0258]

[0259]

[0260]

[0261]

[0262] Comparative Examples 1 to 8 are inferior in various properties because they do not contain a (C1-1) compound having a specific structure. Furthermore, in Comparative Example 6, the content of the specific aromatic compound in the composition exceeds the preferred range. In Comparative Example 7, the content of the sulfur-containing compound is excessive, so the content of the sulfur element in the sulfur-containing ions relative to the total solid content of the composition is outside the preferred range. In Comparative Example 8, the content of water in the composition exceeds the preferred range. As a result, the sensitivity, mechanical properties, and migration resistance are reduced.

[0263] <Storage Stability of Photosensitive Composition> Each of the compositions prepared in Examples 1 to 158 was stored at 25°C for one week. After storage, the compositions were formed into films on substrates in the same manner as in Example 1. As a result, no foreign matter was generated, and the storage stability was good. Meanwhile, Compositions 164 to 166 prepared in Comparative Examples 6 to 8, in which the content of the specific aromatic compound, the content of the sulfur element in the sulfur-containing ions, or the water content were outside the preferred ranges, were similarly stored at 25°C for one week. After storage, the compositions were similarly formed into films on substrates. As a result, a large amount of foreign matter was generated, and the storage stability was poor.

[0264] 41 Translucent part 42 Light shielding part 43 Semi-transparent part

Claims

1. A photosensitive composition comprising (A) a binder resin and (C1-1) an oxime ester compound, and further comprising either or both of (B) a radical polymerizable compound and (F) a crosslinking agent, wherein the (C1-1) oxime ester compound has all of the following (Ia), (Ib) and (Ic) structures in its molecular structure: Structure (Ia): a condensed polycyclic heterocyclic structure composed of two rings, or a condensed polycyclic heterocyclic structure composed of three rings including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure or a dihydropyrrole structure; Structure (Ib): an oxime ester carbonyl structure; Structure (Ic): an aromatic structure.

2. The photosensitive composition according to claim 1, wherein all or a part of the binder resin (A) is a resin having the following weakly acidic group (WA) in its structure (hereinafter referred to as "resin (A1)"): (WA) Weakly acidic group: one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group.

3. The photosensitive composition according to claim 1, further comprising one or more selected from the group consisting of benzene, toluene, xylene, and naphthalene, and satisfying the following condition (1): the total content of benzene, toluene, xylene, and naphthalene in the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

4. The photosensitive composition according to claim 1, wherein the (Ia) structure is an indole structure, a benzoindole structure, an indoline structure, a benzoindoline structure, a benzofuran structure, a naphthofuran structure, a benzothiophene structure, a naphthothiophene structure, a benzodihydrofuran structure, a naphthodihydrofuran structure, a benzodihydrothiophene structure, or a naphthodihydrothiophene structure, and the (Ic) structure is an aromatic structure to which an arylcarbonyl group, an alkylcarbonyl group, a nitro group, a cyano group, a halogen atom, or a heterocyclic group is bonded.

5. The photosensitive composition according to claim 1, wherein the (C1-1) oxime ester compound further has the following structure (Id) in its molecular structure: Structure (Id): either or both of an aliphatic group having 1 to 20 carbon atoms and an alicyclic group having 4 to 20 carbon atoms.

6. The photosensitive composition according to claim 2, wherein the (A1) resin comprises the following (A1x) resin: (A1x) resin: a resin having one or more structures selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure in its structural unit.

7. The photosensitive composition according to claim 6, wherein all or a part of the resin (A1x) is one or more selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof, all of which have a weak acidic group in their structure, and the resin (A1x) has either or both of the amine residue (WA) containing a weak acidic group and the carboxylic acid residue (WA) containing a weak acidic group.

8. The photosensitive composition according to any one of claims 2 to 7, wherein the binder resin (A) comprises an (A1) resin, which in turn comprises the following (A1y) resin, all or a part of the (A1y) resin being one or more types selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins: (A1y) resin: a resin having a phenolic hydroxyl group in its structural unit.

9. The photosensitive composition according to any one of claims 1 to 7, wherein the binder resin (A) contains an (A1) resin and a (WA) resin not having a weak acidic group in its structure (hereinafter referred to as "(A2) resin"), the (A1) resin contains either or both of the following (A1x) resin and (A1y) resin, and the (A2) resin contains either or both of the following (A2x) resin and (A2y) resin. (A1x) resin: a resin having, in its structural unit, one or more structures selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure. (A1y) resin: a resin having, in its structural unit, a phenolic hydroxyl group. (A2x) resin: a resin having, in its structure, a radically polymerizable group. (A2y) resin: a resin not having a radically polymerizable group in its structure.

10. The photosensitive composition according to any one of claims 1 to 7, wherein the binder resin (A) satisfies the following condition (P1α): the fluorine content in the structure of the binder resin (A) is 10,000 ppm by mass or less.

11. The photosensitive composition according to any one of claims 1 to 7, further comprising an organic black pigment, all or a part of which is one or more types selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, and azomethine-based black pigments, all or a part of which is a compound having at least two benzofuran-2(3H)-one structures which may share a benzene ring or at least two benzofuran-3(2H)-one structures which may share a benzene ring, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof, all or a part of which is a compound having a 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole structure, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof, and all or a part of which is azomethine-based black pigment is a compound having an azomethine structure and a carbazole structure or a salt thereof.

12. The photosensitive composition according to any one of claims 1 to 7, further comprising an inorganic black pigment, all or a part of the inorganic black pigment being one or more types selected from the group consisting of nitrides containing a metal element, carbides containing a metal element, and oxynitrides containing a metal element, and the metal element being one or more types selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum.

13. The photosensitive composition according to any one of claims 1 to 7, which satisfies the following condition (1α): the fluorine content in the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

14. The photosensitive composition according to any one of claims 1 to 7, further satisfying either or both of the following condition (2) and condition (3): Condition (2): The photosensitive composition further contains one or more selected from the group consisting of acetic acid, propionic acid, cyclopentanecarboxylic acid, cyclohexanecarboxylic acid, benzoic acid, methylbenzoic acid, and trimethylbenzoic acid, and the proportion of these compounds in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less. Condition (3): The photosensitive composition further contains either or both of an aldoxime compound and a ketoxime compound, and the proportion of these compounds in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 500 ppm by mass or less.

15. The photosensitive composition according to any one of claims 1 to 7, which satisfies the following condition (4): Condition (4): The photosensitive composition further contains water, and the content of water in the photosensitive composition is 0.010 mass % or more and 3.0 mass % or less.

16. The photosensitive composition according to any one of claims 1 to 7, wherein some of the (C1-1) oxime ester compounds are compounds (cis isomers) in which, in the (Ib) structure, the group containing a carbonyl structure and the group containing an oxygen atom of the oxime structure have a cis structure relative to the C=N bond of the oxime structure, and another part is a compound (trans isomer) in which, in the (Ib) structure, the group containing a carbonyl structure and the group containing an oxygen atom of the oxime structure have a trans structure relative to the C=N bond of the oxime structure, and the content of the cis isomer or trans isomer is 90.0 to 99.9 mass% when the total of the cis isomer and the trans isomer is 100 mass%.

17. A cured product obtained by curing the photosensitive composition according to any one of claims 1 to 7.

18. An electronic part comprising the cured product according to claim 17.

19. A method for producing a cured product, comprising the steps of: (1) forming a coating film of the photosensitive composition according to any one of claims 1 to 7 on a substrate; (2) irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) heating the pattern to obtain a cured pattern of the photosensitive composition.

20. An electronic component having a cured product, the cured product comprising a carbonyl group-containing compound ((C1x-DL) carbonyl group-containing compound) having the following structures (XIa) and (XIc). Structure (XIa): a structure in which a carbonyl group is bonded to a fused polycyclic heterocyclic structure composed of two rings, or a structure in which a carbonyl group is bonded to a fused polycyclic heterocyclic structure composed of three rings including a naphthalene structure, a piperidine structure, a tetrahydropyridine structure, a dihydropyridine structure, a pyrrolidine structure, or a dihydropyrrole structure. Structure (XIc): an aromatic structure.

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