Wireless communication system filter

Abstract

The present invention relates to a wireless communication system filter comprising: a housing assembly having an accommodation space therein in the left-right lengthwise direction; and a suspended substrate provided in the accommodation space and spaced apart from the upper and lower surfaces of the housing assembly.

Description

Wireless Communication System Filter

[0001] The present invention relates to a filter for passing a specific frequency band as a wireless communication component, and more specifically, to a wireless communication system filter that can secure excellent band characteristics and tuning structure by applying a suspended substrate structure and forming an empty space in a portion of the interior of a substrate on which a plurality of resonance patterns are formed.

[0002]

[0003] A wireless communication filter is a component that passes only the desired frequency band among the various frequency components of an input wireless signal and attenuates or reflects the remaining frequencies. It is essential for selecting the frequency band used in a wireless communication (RF) system.

[0004] Whether a filter exists as a single component, an accessory, or a matching circuit across passive circuits, active circuits, or systems, the concept of frequency filtering is an indispensable component that is needed in any form or location.

[0005] These filters are required to have electrical characteristics such as low loss, high frequency selectivity, and mechanical characteristics such as small volume and high temperature stability.

[0006] In addition, filters are classified into various types such as cavity type filters, microstrip type filters, waveguide filters, SAW filters, and ceramic filters depending on their application purpose, size, and method.

[0007] Meanwhile, wireless communication systems such as 5G use ultra-high frequency bands, so technologies such as beamforming, massive MIMO, and array antennas are required to mitigate radio wave path loss and increase radio wave transmission distance.

[0008] As transmitting and receiving products equipped with multiple antennas are required to improve wireless communication performance, it is expected that equipment with a large number of antennas will be used.

[0009] As the number of antenna elements in a wireless communication system increases, the number of filters also inevitably increases.

[0010] Meanwhile, during the filter manufacturing process, errors inevitably occur compared to the design results due to manufacturing tolerances in the production of resonators, housing structures, etc.

[0011] In the case of cavity type or waveguide type filters, it is essential to adjust the characteristics due to manufacturing tolerances by using additional structural devices such as tuning screws to finely adjust the frequency band to match the specifications.

[0012] At this time, the process of matching the specifications is a process of finely adjusting the capacitance or inductance by the resonator or finely adjusting the capacitance or inductance between resonators by adjusting the characteristics by a tuning screw device, etc.

[0013] This adjustment process realigns the characteristics that are deviated from the design due to manufacturing tolerances to the original target characteristics, but the adjustment process is a major factor in determining the manufacturing cost and manufacturing time of the filter.

[0014] In particular, the filter of the suspended substrate structure related to the present invention is a structure in which a conductor that acts as a resonator is formed on the upper and lower surfaces of a dielectric substrate and is built into a housing, and an air gap is formed between the substrate on which the conductor is formed and the housing.

[0015] A suspended substrate filter is similar to a stripline type filter formed on a dielectric substrate, but is implemented by floating it in the air with a housing as described above.

[0016] That is, an air layer is located between the suspended substrate and the upper surface of the housing, and an air layer is located between the suspended substrate and the lower surface of the housing.

[0017] In this case, since most of the electromagnetic field is generated primarily through the air layer with low loss rather than the dielectric substrate with relatively high loss, the suspended substrate filter has the advantage of relatively high selectivity and low loss.

[0018] The suspended substrate method has the effect of lowering the effective permittivity due to the air layers above and below the substrate. Therefore, while the conductor acting as the resonator has a wider line width, it offers low loss and excellent insertion loss and reflection coefficient characteristics.

[0019] Therefore, filters with a suspended substrate structure are widely used when excellent insertion loss and reflection coefficient characteristics are required.

[0020] On the other hand, as described above, in a filter with a suspended substrate structure, the resonant patterns that serve as the entire resonator are formed on a dielectric substrate, so there is no space to place additional tuning screws or other devices that can be tuned between the resonant patterns due to the manufacturing tolerance caused by the substrate layer, and thus the capacitance or inductance between the resonant patterns cannot be adjusted.

[0021] Therefore, when there is a change in the manufacturing characteristics compared to the design due to manufacturing tolerance, there is a disadvantage in that fine tuning of the characteristics is very difficult.

[0022] In 5G wireless communication systems, the frequency used is increasing, and the frequency bandwidth that can be used by various applications and operators is limited, so the characteristic specifications of the filter, such as the frequency band, are also required to be at a very high level.

[0023] Accordingly, the margin within which characteristics can change due to manufacturing tolerances is becoming increasingly narrow. Therefore, while the suspended substrate-structured filter has smaller manufacturing tolerances than cavity filters and thus exhibits less characteristic variation, high-frequency wireless communication systems such as 5G still require control over characteristic variations due to manufacturing tolerances.

[0024] Additionally, in filters with suspended substrate structures, it is difficult to implement a structure that enhances cross-coupling between multiple resonators. Typically, in filters with cavity structures, a separate structure is added to enhance cross-coupling between multiple resonators, thereby enhancing the rejection or skirt characteristics of a frequency band.

[0025] One example of a conventional wireless communication filter proposed a resonant substrate comprising multiple resonators formed in a single layer, suspended in an air layer between a PCB and a housing. The resonant substrate, in this case, is structured such that the regions corresponding to the multiple resonators are occupied by conductors, while the regions outside the multiple resonators are comprised of an empty substrate.

[0026] That is, a plurality of resonators are suspended in the air in a structure formed of conductors, and a suspended air strip structure is proposed that has an empty space as an air region in addition to the resonators.

[0027] These resonators have one side connected to the housing, while the other side is unconnected and suspended in air. Unlike typical suspended substrate filters, which have a conductive pattern formed on a dielectric substrate, the resonators are composed of a single layer of conductors. This allows all electric fields and their coupling to be formed through a low-loss air layer, resulting in extremely low-loss filter characteristics. Furthermore, a strip capable of creating cross-coupling between multiple resonators is proposed.

[0028] However, although the filter with this air strip structure has excellent loss characteristics because the electric field is formed by an air layer with low loss, it has a disadvantage in that the thermal stability of the filter due to the temperature of the installation space is weak. That is, since the resonator structure is a single layer of conductor suspended in the air and one side is not fixed, there is a serious problem that the length and volume, etc. change due to the thermal expansion coefficient of the conductor forming the resonator (mainly 20 to 40 ppm / K) when the temperature in the usage environment is low or high. This causes a change in the resonant frequency of the resonator and changes the characteristics of the filter.

[0029] In addition, in such air strip structure filters, since the resonators are fixed to the housing on only one side and not on the other side, the air strip structure resonators may be deformed by external impact, causing the gap between the upper, lower, or side surfaces to change. This also causes a change in the capacitance component between the resonator and the housing, which changes the characteristics of the filter. For example, the resonator may sag due to gravity, and the resonant frequency may change randomly depending on the installation direction.

[0030] Therefore, the frequency characteristics of the resonator change due to changes in length and volume caused by temperature changes, deformation caused by external impact, or sagging caused by gravity, and this makes it difficult to satisfy the condition that the filter must maintain uniform characteristics within -45 to 90 degrees regardless of the installation space in the installation environment of a typical wireless communication system. Therefore, despite the excellent loss characteristics of the structure, there is a disadvantage that it is difficult to widely use in practice because the characteristics change due to reasons such as thermal stability and structural stability.

[0031] Therefore, a new filter structure must be proposed that maintains excellent insertion loss and reflection coefficient characteristics due to low loss of the suspended substrate filter, does not deteriorate thermal stability and structural stability, and allows easy tuning.

[0032] In addition, a new wireless communication system filter structure must be developed that maintains the excellent characteristics listed above and can create cross-coupling between multiple resonators.

[0033]

[0034] The present invention has been devised to solve the problems described above, and the purpose of the present invention is to provide a wireless communication system filter having a method and structure applied thereto for improving characteristics such as insertion loss, reflection coefficient, deformation due to temperature, deformation due to external impact or gravity, and miniaturization.

[0035] In addition, a wireless communication system filter using a suspended substrate is provided.

[0036] In addition, a wireless communication system filter is provided in which characteristics are improved and characteristic tuning can be easily performed by applying a suspended substrate having an empty space (tuning hole).

[0037] In addition, a wireless communication system filter is provided that can improve characteristics and reduce the range of characteristic changes due to temperature through a filter that applies a suspended substrate having an empty space (tuning hole).

[0038] In addition, a wireless communication system filter is provided that can improve characteristics and eliminate changes in characteristics due to deformation caused by external impact or gravity through a filter that applies a suspended substrate having an empty space (tuning hole).

[0039] In addition, a wireless communication system filter is provided that can improve the characteristics of the filter by adding an upper bridge structure or a lower bridge structure to a structure using a suspended substrate and thereby generating a plurality of cross couplings.

[0040] In addition, a wireless communication system filter is provided in which a plurality of suspended substrates are spaced apart to improve characteristics and facilitate characteristic tuning.

[0041]

[0042] In order to achieve the above-described purpose, the wireless communication system filter of the present invention comprises a housing assembly (100) having a receiving space (S) formed in the left and right longitudinal directions therein; and a suspended substrate (200) provided in the receiving space (S) and spaced apart from the upper and lower surfaces of the housing assembly (100); wherein the suspended substrate (200) is characterized in that a resonance pattern (210) is formed therein.

[0043] In addition, it is characterized by including a signal input unit (300) coupled to the housing assembly (100) or the suspended substrate (200) and receiving an RF signal; and a signal output unit (400) coupled to the housing assembly (100) or the suspended substrate (200) and outputting an RF signal filtered at a set frequency.

[0044] In addition, the housing assembly (100) includes a lower housing (110) having an open upper side; a housing cover (120) coupled to the upper side of the lower housing (110); and the lower housing (110) is characterized in that a support groove (111) is formed on the upper side into which the suspended substrate (200) is fitted.

[0045] In addition, the suspended substrate (200) is characterized by including a tuning hole (220) formed through the thickness direction.

[0046] In addition, the resonance pattern (210) is characterized in that a plurality of resonance patterns (210) are formed spaced apart from each other in the longitudinal direction of the suspended substrate (200), and the tuning hole (220) is formed between the plurality of resonance patterns (210).

[0047] In addition, it is characterized by including a tuning member (500) that is formed protrudingly on at least one of the upper lower surface and the lower upper surface of the housing assembly (100).

[0048] In addition, the resonance pattern (210) is formed on two or more of the upper, lower, and inner sides of the suspended substrate (200), and the suspended substrate (200) is characterized by including a connecting via (230) that connects the resonance patterns (210) formed at different locations.

[0049] In addition, the resonance pattern (210) is characterized in that a plurality of resonance patterns (210) are formed spaced apart from each other in the longitudinal direction of the suspended substrate (200).

[0050] In addition, it is characterized by including a bridge (600) connecting resonance patterns (210) spaced apart from each other.

[0051] In addition, the bridge (600) is characterized by including a first bridge (610) connecting a resonance pattern (210) formed spaced apart on the upper side of the suspended substrate (200); and a second bridge (620) connecting a resonance pattern (210) formed spaced apart on the lower side of the suspended substrate (200).

[0052] In addition, the tuning member (500) is characterized by including a first tuning member (510) that is formed protrudingly on the upper side of the lower housing (110) and fitted into the tuning hole (220); and a second tuning member (520) that is formed protrudingly on the lower side of the housing cover (120) and positioned to face the resonance pattern (210).

[0053] In addition, the suspended substrate (200) is characterized by being a dielectric having a set permittivity.

[0054] In addition, the suspended substrate (200) is characterized by being a ceramic material having a set coefficient of thermal expansion and elasticity.

[0055] In addition, the suspended substrate (200) is characterized by including a plurality of suspended substrate units (200A) spaced apart from each other.

[0056] In addition, the housing assembly (100) is characterized by being made of a metal material or having a surface coated with metal.

[0057] In addition, the housing assembly (100) is characterized in that the upper or lower surface is made of a PCB.

[0058] In addition, the resonance pattern (210) is formed on the upper surface of the suspended substrate (200), a connecting member (202) is formed on the lower surface of the suspended substrate (200), the resonance pattern (210) and the connecting member (202) are connected by a connecting via (230), and the connecting member (202) is connected by a second bridge (620).

[0059] In addition, the resonance pattern (210) is characterized by being formed on the upper side of the suspended substrate (200) with a thickness of 100 micrometers to 10,000 micrometers.

[0060] In addition, the resonance pattern (210) is characterized by having a T-shaped plane shape.

[0061] In addition, the suspended substrate (200) is characterized in that it is formed of a PCB.

[0062] In addition, the suspended substrate (200) is characterized by being formed of a ceramic material.

[0063] In addition, the bridge (600) is characterized by being manufactured by 3D printing.

[0064]

[0065] The wireless communication system filter of the present invention can improve the performance of the filter and make it smaller, since a resonance pattern is formed on a suspended substrate.

[0066] In addition, since a tuning hole is formed in the suspended substrate, not only can the characteristics of the filter be easily tuned using the tuning hole, but there is also an advantage in that the manufacturing cost of the filter can be reduced.

[0067] In addition, since a tuning hole is formed in the suspended substrate, the range of temperature-dependent characteristic changes in the filter can be reduced.

[0068] In addition, since the suspended substrate is formed of a ceramic material with a low coefficient of thermal expansion and high mechanical strength, the range of changes in characteristics due to temperature, weight, external impact, etc. of the filter can be reduced.

[0069] Additionally, the performance of the filter can be improved by generating multiple cross-couplings.

[0070] In addition, since the suspended substrate is formed by assembling a plurality of suspended substrate units spaced apart from each other, there is an advantage in that the filter can be miniaturized and its performance improved.

[0071] In addition, since the suspended substrate is formed by assembling a plurality of suspended substrate units spaced apart from each other, there is an advantage in that the characteristics of the filter can be easily tuned, thereby reducing the manufacturing cost of the filter.

[0072] In addition, since the suspended substrate is formed by assembling a plurality of suspended substrate units spaced apart from each other, the range of change in characteristics due to temperature of the filter can be reduced.

[0073] In addition, the performance of the filter can be improved by generating cross coupling between multiple suspended substrate units spaced apart from each other.

[0074]

[0075] Figures 1 to 4 are cross-sectional views showing a wireless communication system filter according to the present invention.

[0076] Figures 5 to 7 are perspective views showing a wireless communication system filter of the present invention.

[0077] Figures 8 to 10 are cross-sectional views showing a bridge coupled to a wireless communication system filter according to the present invention.

[0078] Figures 11 to 13 are perspective views showing a bridge coupled to a wireless communication system filter of the present invention.

[0079] Figures 14 to 17 are cross-sectional views illustrating structural changes in the wireless communication system filter of the present invention.

[0080]

[0081] Advantages and features of embodiments of the present invention, and methods for achieving them, will become clearer with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

[0082]

[0083] In describing embodiments of the present invention, detailed descriptions of resonance functions or configurations will be omitted if they are deemed to unnecessarily obscure the gist of the invention. Furthermore, the terms described below are defined based on their functions in the embodiments of the present invention and may vary depending on the intent or custom of the user or operator. Therefore, their definitions should be based on the overall content of this specification.

[0084]

[0085] Hereinafter, a wireless communication system filter (1000) according to the present invention will be described with reference to the attached drawings.

[0086] FIGS. 1 to 4 are cross-sectional views showing a wireless communication system filter according to the present invention, FIGS. 5 to 7 are perspective views showing a wireless communication system filter according to the present invention, FIGS. 8 to 10 are cross-sectional views showing a bridge coupled to a wireless communication system filter according to the present invention, FIGS. 11 to 13 are perspective views showing a bridge coupled to a wireless communication system filter according to the present invention, and FIGS. 14 to 17 are cross-sectional views for explaining structural changes in a wireless communication system filter according to the present invention.

[0087] Referring to FIGS. 1 to 4, a wireless communication system filter (1000) according to the present invention includes a housing assembly (100) having a receiving space (S) formed in the left and right longitudinal directions therein, and a suspended substrate (200) provided in the receiving space (S) and spaced apart from the upper and lower surfaces of the housing assembly (100), and a resonance pattern (210) can be formed on the suspended substrate (200).

[0088] In addition, the housing assembly (100) may include a lower housing (110) having an open upper side, and a housing cover (120) coupled to the upper side of the lower housing (110).

[0089] To explain in detail, a suspended substrate (200) including a resonance pattern is placed in a space inside a housing assembly (100) between a lower housing (100) and a housing cover (120) so that an air layer is formed on the upper and lower portions of the suspended substrate (200).

[0090] The suspended substrate (200) including the resonance pattern (210) is a substrate of a dielectric material having a predetermined permittivity, and a PCB or ceramic substrate can be used.

[0091] And, as shown in FIG. 5, the lower housing (110) has a support groove (111) formed on the upper side into which the suspended substrate (200) is fitted, and the front and rear ends of the suspended substrate (200) are fitted into the support groove (111) and fixed, so that the lower housing (110) can be joined to the housing assembly (100). The support grooves (111) can be formed in pairs on the front and rear sides, and the suspended substrate (200) can have a ground pattern (201) formed on one end of the front and rear sides that contacts the support groove (111).

[0092] In addition, the resonance pattern (210) may be formed in multiple pieces spaced apart in the longitudinal direction of the suspended substrate (200), and may be selectively formed on one or more of the upper and lower sides.

[0093]

[0094] The lower housing (110) constituting the above housing assembly (100) has a structure in which a side wall is formed at the edge of the lower plate to form a receiving space (S) in the upper central portion, and a housing cover (120) is coupled to the upper portion of the lower housing (110) to close the upper portion of the receiving space (S).

[0095] The above housing assembly (100) can be formed of a conductor, usually a metal material. The upper or lower portion can be formed of a PCB, as needed.

[0096] In addition, it may include a signal input unit (300) coupled to the housing assembly (100) or the suspended substrate (200) and receiving an RF signal, and a signal output unit (400) coupled to the housing assembly (100) or the suspended substrate (200) and outputting an RF signal filtered at a set frequency.

[0097] At this time, the distinction between the signal input unit (300) and the signal output unit (400) is only for convenience, and an input / output unit combining groove (301) in which the signal input unit (300) and the signal output unit (400) are combined may be formed at the left and right ends of the housing assembly (100).

[0098] In addition, the combination of the signal input unit (300) and the signal output unit (400) may be in the form of being pressed and fixed to the input / output unit combination groove (301), but in addition to this, the end may be in the form of being fixed and combined to the suspended substrate (200) and the body fitted into the combination groove (301).

[0099] In addition, the signal input unit (300) and the signal output unit (400) may be positioned at a certain distance from the suspended substrate (200), or may be in direct contact with the suspended substrate (200) to transmit an RF signal. In this case, they may be connected by being in direct contact with the resonance pattern (210) of the suspended substrate.

[0100] Frequency control of the RF signal through the signal input unit (300) and the signal output unit (400) is such that when an RF signal is applied to the signal input unit (300), some frequency components of the RF signal are transmitted to the signal output unit (400) by a resonance pattern. This shape in which the signal is transmitted without loss is called resonance, and by designing the resonance pattern, components of the desired frequency band of the RF signal can be passed, and components of the undesired frequency band can be blocked.

[0101]

[0102] The above suspended substrate (200) includes a resonance pattern (210). Although six resonance patterns are shown in the drawing, the number of resonance patterns (210) may be less or more depending on the desired wireless communication system filter (1000) characteristics.

[0103] The resonance pattern (210) is mainly formed on the upper part of the suspended substrate (200), but the resonance pattern (210) may also be formed including the inside or the lower surface. The resonance pattern (210) is formed of a conductor and may have a T-shaped planar shape. The resonance frequency of the resonance pattern (210) can be determined by a combination of the width and length of the T-shaped planar shape. In addition, when the resonance pattern (210) is formed in a T-shape, the length of the resonance pattern can be reduced, and there is an advantage in that a tuning hole (220) can be effectively formed between the resonance patterns.

[0104] The resonance pattern (210) may have a single-width, straight-line planar shape. The T-shaped resonance pattern in the drawing is only an example, and the shape of the resonance pattern is not necessarily limited to the T-shape.

[0105] A plurality of resonance patterns (210) can be spaced apart in the left and right longitudinal direction of the suspended substrate (200), and some of the resonance patterns can be connected to a ground pattern (201). This ground pattern (201) can be connected to the housing assembly (100).

[0106] Inductance and capacitance are determined by the shape and size of the resonance pattern (210), the spacing between the resonance patterns, etc. Accordingly, the resonance frequency is determined, and the characteristics such as the pass and cut-off frequency bands of the wireless communication system filter (1000) are mainly affected.

[0107] The suspended substrate (200) may primarily be a PCB substrate. A single-layer PCB substrate may be used, or a multi-layer PCB substrate may be used to form a multi-layer resonance pattern (210). In addition, a ceramic substrate having a low coefficient of thermal expansion and a high modulus of elasticity (Young's modulus) may be used as the suspended substrate to improve the thermal stability and mechanical rigidity of the filter.

[0108] As a result, the resonance pattern (210) is positioned so as to be included in the suspended substrate (200), such that it may be formed on the suspended substrate (200) or may be formed including the inside or bottom surface thereof. In addition, the resonance pattern (210) is positioned together with the suspended substrate (200) and is fixedly supported by the housing by the suspended substrate.

[0109] In addition, when the resonance pattern (210) is formed on a PCB or ceramic substrate (200), it is composed of a metal layer with a thickness of 20 micrometers to 50 micrometers in a general PCB or ceramic substrate manufacturing process. At this time, by forming the thickness of the resonance pattern (210) to be 100 micrometers to 10,000 micrometers through an additional plating process or a 3D printing process, the power range of the signal transmitted through the filter can be increased. This is a very important characteristic because it can increase the output of the signal allowed when the filter is configured in a wireless communication system. In the case of a filter formed on a dielectric substrate such as a PCB, there is a problem that the output of the signal used is low, which is one of the problems that must be overcome in a wireless communication system of 5G or higher.

[0110]

[0111] The above suspended substrate (200) can have a tuning hole (220) formed penetrating in the thickness direction, and the tuning hole (220) can be formed between a plurality of resonance patterns (210).

[0112] These tuning holes (220) can be filled with an air layer. If the tuning holes (220) are formed in some areas between the resonance patterns (210) of the suspended substrate (200), the main area of ​​the electric field formed between the resonance patterns (210) can be expanded into the air layer, thereby reducing loss.

[0113] In addition, the housing assembly (100) includes a tuning member (500) that is formed protrudingly on at least one of the upper lower surface and the lower upper surface, and the tuning member (500) may include a first tuning member (510) that is formed protrudingly on the upper side of the lower housing (110) and fitted into the tuning hole (220), and a second tuning member (520) that is formed protrudingly on the lower side of the housing cover (120) and is arranged to face the resonance pattern (210).

[0114] By positioning a first tuning member (510) such as a tuning screw in the area of ​​the tuning hole (220), the inductance or capacitance between the resonance patterns can be adjusted, thereby tuning the characteristics that change compared to the design characteristics due to manufacturing tolerances to adjust them to the desired characteristics.

[0115] The first tuning member (510) is connected to the upper surface of the lower housing (110) and can be adjusted in height by adjusting a screw, thereby adjusting the height between the adjacent resonance patterns (210) and adjusting the inductance or capacitance between the corresponding resonance patterns (210).

[0116] The second tuning member (520) can also adjust the capacitance between the corresponding resonance patterns by adjusting the height, thereby adjusting the resonance frequency of the resonance pattern and thus adjusting the characteristics of the filter.

[0117]

[0118] In addition, since the resonance pattern (210) is formed on the suspended substrate (200) and is fixedly arranged with both ends supported by the suspended substrate (200) on the housing assembly (100), the change in the filter characteristics due to the change in temperature can be kept small even in the commonly required -40 to 95 degree usage environment. In addition, for the same reason, the change in characteristics due to external impact or sagging due to gravity can be prevented. Due to these matters, the problem of the suspended air strip structure being greatly deformed due to the change in temperature in the filter of the suspended air strip structure that does not include the suspended substrate, and the problem of the change in the filter characteristics becoming large due to the deformation of the structure by external impact or gravity can be solved.

[0119]

[0120] Fig. 4 illustrates a cross-section of a filter using a suspended substrate according to another embodiment of the present invention. Fig. 4 illustrates an example of application of a suspended substrate including a resonant pattern portion including a multilayer resonant pattern.

[0121] As shown in Fig. 4(a), the resonance pattern (210) is formed on two or more of the upper, lower, and inner sides of the suspended substrate (200), and the suspended substrate (200) may include a connecting via (230) that connects the resonance patterns (210) formed at different locations.

[0122] That is, the resonance patterns (210) located on the upper and lower sides are connected through the connecting via (230) to form one resonance pattern section.

[0123] By applying a resonance pattern section formed by combining multi-layer resonance patterns (210) in this way, the coupling between the signal input section, the signal output section, and the resonance pattern (210) can be strengthened, and not only can the length, width, and height of the resonance pattern section be used as variables to adjust the frequency, but also the bridge described below can be applied very easily to the multi-layer resonance pattern section. In addition, the range of signal power that the filter can transmit can be increased through the multi-layer resonance pattern (210).

[0124] As shown in Fig. 4(b), a resonance pattern (210) can be formed on the upper surface and inside of the suspended substrate, and a resonance pattern located on the upper side and a resonance pattern located inside can be connected through one or more connecting vias (230) to form a resonance pattern portion formed by assembling multiple resonance patterns (210).

[0125] That is, as shown in (a) and (b) of FIG. 4, the resonance pattern (210) can be formed on two or more of the upper, lower, and inner portions of the suspended substrate (200), and two or more resonance patterns (210) are connected by a connecting via (230) to form a resonance pattern portion, thereby enabling more precise frequency control.

[0126]

[0127] Figures 5 to 7 are exploded perspective views of the wireless communication system filter (1000) of the present invention.

[0128] FIG. 5 is a basic form of a wireless communication system filter (1000) according to the present invention, which includes a housing assembly (100) having a receiving space (S) formed in the left and right longitudinal direction therein, and a suspended substrate (200) provided in the receiving space (S) and spaced apart from the upper and lower surfaces of the housing assembly (100), and a plurality of resonance patterns (210) may be formed in the left and right longitudinal direction on the suspended substrate, and a tuning hole (220) may be formed between the resonance patterns (210).

[0129] FIG. 6 and FIG. 7 are perspective views showing an example in which a tuning member (500) is formed on a housing assembly (100). As shown in FIG. 6, a first tuning member (510) is formed to protrude on the upper side of the lower housing (110) and can be fitted into a tuning hole (220), and as shown in FIG. 7, a second tuning member (520) facing the resonance pattern (210) can be formed on the lower side of the housing cover (120).

[0130]

[0131] Figures 8 to 10 are cross-sectional views showing a bridge (600) coupled to a wireless communication system filter (1000) of the present invention.

[0132] The wireless communication system filter (1000) of the present invention has an advantage in that an electric field is formed through an air layer, and cross-coupling occurs between multiple resonance patterns (210) as well as coupling between resonance patterns (210) located right next to each other.

[0133] However, in wireless communication systems that use ultra-high frequencies such as 5G, adjacent frequency bands are often used, so high rejection or skirt characteristics of the frequency band are required.

[0134] Therefore, there is a growing demand for a structure that can create a transmission zero by forming cross-coupling between multiple resonators.

[0135] A transmission zero, also known as a notch, refers to a state where very little signal passes through at a given frequency. Designing a transmission zero, with a very low signal pass coefficient and a significant signal blockage, at the boundary of the frequency passband can achieve high rejection or skirt characteristics.

[0136] Referring to Fig. 8, the wireless communication system filter (1000) of the present invention can have a resonance pattern (210) cross-coupled through a bridge (600). At this time, the bridge (600) may not connect a pair of resonance patterns arranged facing each other, but may connect resonance patterns that are spaced apart from each other with another resonance pattern in between.

[0137] More specifically, when multiple resonance patterns (210) are defined from the 1st resonance pattern to the 6th resonance pattern from the left to the right, coupling can be generated by connecting the 1st resonance pattern and the 3rd resonance pattern, or the 4th resonance pattern and the 6th resonance pattern, with a bridge (600).

[0138] Additionally, coupling can be generated by connecting the 1st and 4th resonance patterns by crossing the 2nd and 3rd resonance patterns, and in this way, depending on the area in which you want to design the transmission zero or notch, you can decide how many resonance patterns to skip and implement a bridge structure that is connected.

[0139] These bridge structures can be implemented using 3D printing, as they usually require some of the connections to be raised above the substrate surface.

[0140]

[0141] Meanwhile, in ultra-high frequency wireless communication systems of 5G and higher, as multiple antennas and filters are implemented and bands are segmented, very high rejection characteristics are required and multiple notches must be implemented.

[0142] Therefore, even if a suspended substrate is applied to the filter, multiple cross-couplings are required, and multiple bridge structures are required. Here, the bridge structure may be a structure in which multiple resonance patterns (210) are connected with each other through a bridge (600) with the resonance pattern (210) in between.

[0143] In addition, the bridge (600) may include a first bridge (610) that connects a resonant pattern (210) formed spaced apart on the upper side of the suspended substrate (200), and a second bridge (620) that connects a resonant pattern (210) formed spaced apart on the lower side of the suspended substrate (200).

[0144] To elaborate, implementing bridge structures only on the upper or lower surface of the substrate makes it extremely difficult to implement multiple bridges. For example, when bridge structures are required between resonant patterns 1 and 3, and between resonant patterns 1 and 4, the bridge structures are often placed too close together, resulting in undesirable characteristic changes due to coupling between the bridge structures.

[0145] Therefore, when multiple bridge structures are required to allow interference to occur, bridge structure 1 can be placed on the top and bridge structure 2 can be placed on the bottom.

[0146]

[0147] Referring to FIG. 9 or FIG. 10, the resonance pattern (210) is formed on the upper surface of the suspended substrate (200), a connecting member (202) is formed on the lower surface of the suspended substrate (200), the resonance pattern (210) and the connecting member (202) are connected by a connecting via (230), and the connecting member (202) can be connected by a second bridge (620).

[0148] To explain in detail, the second bridge (620) structure implemented on the lower surface is configured with a conductive connecting member on the lower surface of the substrate surface, and can electrically connect the resonance pattern (210) on the upper surface of the suspended substrate (200) and the connecting member (202) on the lower surface using one or more connecting vias (230).

[0149] Here, the second bridge structure means a structure in which a connecting member (202) is connected through a second bridge (620), and the second bridge structure may be implemented such that the central region of the second bridge (620) is spaced apart from the suspended substrate (200) as shown in (a) of FIG. 9, or may be implemented in close contact with the lower surface of the suspended substrate (200) as shown in (a) of FIG. 10.

[0150] In addition, as shown in (a) of FIG. 10, the connection member (202) on the lower surface of the suspended substrate (200) and the resonance pattern (210) on the upper surface of the suspended substrate (200) can be directly electrically connected through a connection via (230), and as shown in (b) of FIG. 10, they can also be implemented only by coupling the connection member (202) without the connection via (230).

[0151]

[0152] Figures 11 to 13 are exploded perspective views showing a wireless communication system filter combined with a bridge.

[0153] FIG. 11 shows a wireless communication system filter (1000) according to the present invention, which includes a housing assembly (100) having a receiving space (S) formed therein in a left-right longitudinal direction, and a suspended substrate (200) provided in the receiving space (S) and spaced apart from the upper and lower surfaces of the housing assembly (100), and a plurality of resonance patterns (210) may be formed in the left-right longitudinal direction on the suspended substrate, a tuning hole (220) may be formed between the resonance patterns (210), and the resonance patterns (210) formed on the suspended substrate (200) and the connecting member (202) may be connected by a bridge (600).

[0154] FIG. 12 and FIG. 13 are perspective views showing an example in which a tuning member (500) is formed on a housing assembly (100). As shown in FIG. 12, a first tuning member (510) is formed to protrude on the upper side of the lower housing (110) and can be fitted into a tuning hole (220), and as shown in FIG. 13, a second tuning member (520) facing a resonance pattern (210) can be formed on the lower side of the housing cover (120).

[0155]

[0156] FIG. 14 and FIG. 15 are cross-sectional views illustrating another embodiment of the wireless communication system filter (1000) of the present invention.

[0157] Referring to FIG. 14, the tuning hole (220) formed on the suspended substrate (200) may have a front-back length corresponding to the front-back length of the T-shaped resonance pattern (210).

[0158] To explain in detail, since the tuning hole (220) described above is limited to the vicinity of the area where the first tuning member (510) is located between the resonance patterns (210), the tuning hole (220) is expanded to be larger than the area where the first tuning member (510) is located, as shown in FIG. 14.

[0159] In this case, since the area where the electromagnetic field between the resonance patterns (210) is mainly formed is applied mostly to the air layer rather than the suspended substrate (200), the loss can be further reduced and the pass coefficient within the frequency band can be improved.

[0160]

[0161] FIG. 15 is a cross-sectional view showing the wireless communication system filter (1000) illustrated in FIG. 14 in which the first tuning member (510) and the second tuning member (520) are combined.

[0162] In this way, the first tuning member (510) can be positioned in a relatively wide empty space between the thin pattern areas of the T-shaped resonance pattern (210), and a relatively narrow empty space can be applied between the wide pattern areas of the T-shaped resonance pattern to induce a resonance phenomenon through coupling between the resonance patterns.

[0163] At this time, for the above structural spherical shape, the tuning hole (220) should have the same T shape as the resonance pattern (210), but should be arranged in the opposite direction to the resonance pattern (210).

[0164] In this embodiment as well, by applying a tuning member to the tuning hole (220), the characteristics of the filter, such as the frequency band, can be adjusted, and since the resonance pattern is formed on the suspended substrate and the front and rear ends of the suspended substrate are fixedly arranged on the housing assembly, the change in characteristics due to the thermal expansion coefficient, etc. can be kept small even in an environment of a usage temperature of -40 to 95 degrees. In addition, physical deformation of the resonance pattern and the suspended substrate due to external impact or gravity can be eliminated, so that the pre-designed characteristics can be maintained.

[0165]

[0166] Figures 16 and 17 are cross-sectional views showing an embodiment in which the suspended substrate (200) is formed by assembling a plurality of suspended substrate units (200A) spaced apart from each other.

[0167] Referring to FIG. 16, a plurality of suspended substrate units (200A) are spaced apart from each other in the longitudinal direction of the housing assembly (100), and the space between the suspended substrate units (200A) can be filled with an air layer.

[0168] In this case, since the area where the electromagnetic field between the resonance patterns is mainly formed is applied mostly to the air layer rather than the suspended substrate (200), signal loss can be further reduced and the pass coefficient within the frequency band can be improved.

[0169] In addition, in this case, unlike when the resonance pattern is used as a single layer, the front and rear ends of the suspended substrate (200) are supported and placed by the housing assembly (100), so that the physical deformation of the resonance pattern or resonator due to temperature changes in the filter use environment, external impact, gravity, etc. is reduced. In other words, there is an advantage in that the change in characteristics due to temperature changes, external impact, gravity, etc. is reduced.

[0170]

[0171] Fig. 17 is a cross-sectional view showing the first tuning member (510) and the second tuning member (520) combined in the embodiment of Fig. 16.

[0172] In this way, the first tuning member (510) can be positioned in a relatively wide empty space between the thin pattern areas of the T-shaped resonance pattern (210), and a relatively narrow empty space can be applied between the wide pattern areas of the T-shaped resonance pattern to induce a resonance phenomenon through coupling between the resonance patterns.

[0173] At this time, for the above structural spherical shape, the tuning hole (220) should have the same T shape as the resonance pattern (210), but should be arranged in the opposite direction to the resonance pattern (210).

[0174] In this embodiment as well, by applying a tuning member to the tuning hole (220), the characteristics of the filter, such as the frequency band, can be adjusted, and the resonance pattern is formed on the suspended substrate, and the front and rear ends of the suspended substrate are fixedly arranged on the housing assembly, so that changes in the characteristics due to the thermal expansion coefficient, etc. can be kept small even in an environment of a usage temperature of -40 to 95 degrees.

[0175]

[0176] In this embodiment as well, there is an advantage in that the filter structure using a plurality of suspended substrates can adjust the characteristics of the filter, such as the frequency band, by applying a tuning member.

[0177]

[0178] The present invention is not limited to the above-described embodiments, and the scope of application is diverse. It goes without saying that anyone with ordinary skill in the art can make various modifications without departing from the gist of the present invention as claimed in the claims.

Claims

1. A housing assembly (100) in which a receiving space (S) is formed in the left and right longitudinal directions inside; and It includes a suspended substrate (200) provided in the above-mentioned receiving space (S) and spaced apart from the upper and lower surfaces of the housing assembly (100); A wireless communication system filter characterized in that the above suspended substrate (200) is formed with a resonance pattern (210) and a tuning hole (220).

2. In paragraph 1, A signal input unit (300) coupled to the housing assembly (100) or the suspended substrate (200) and receiving an RF signal; A wireless communication system filter, comprising a signal output unit (400) coupled to the housing assembly (100) or the suspended substrate (200) and outputting an RF signal filtered at a set frequency.

3. In paragraph 1, The above housing assembly (100) comprises a lower housing (110) formed with an open upper side; It includes a housing cover (120) coupled to the upper side of the lower housing (110); A wireless communication system filter characterized in that the lower housing (110) has a support groove (111) formed on the upper side into which the suspended substrate (200) is fitted.

4. In paragraph 1, A wireless communication system filter characterized in that the resonance pattern (210) is formed in multiple numbers spaced apart from each other in the longitudinal direction of the suspended substrate (200), and the tuning hole (220) is formed between the multiple resonance patterns (210).

5. In paragraph 1, A wireless communication system filter, comprising a tuning member (500) formed protrudingly on at least one of the upper lower surface and the lower upper surface of the housing assembly (100).

6. In paragraph 1, The above resonance pattern (210) is formed on two or more of the upper, lower, and inner sides of the suspended substrate (200), A wireless communication system filter, wherein the suspended substrate (200) includes a connecting via (230) connecting resonant patterns (210) formed at different locations.

7. In paragraph 1, A wireless communication system filter comprising a bridge (600) connecting resonance patterns (210) spaced apart from each other.

8. In paragraph 7, The above bridge (600) is a first bridge (610) that connects the spaced-formed resonance pattern (210) on the upper side of the suspended substrate (200); A wireless communication system filter, comprising a second bridge (620) connecting a spaced-formed resonance pattern (210) to the lower side of a suspended substrate (200).

9. In paragraph 1, A wireless communication system filter, wherein the suspended substrate (200) comprises a plurality of suspended substrate units (200A) spaced apart from each other.

10. In paragraph 1, A wireless communication system filter characterized in that the resonance pattern (210) is formed on the upper side of the suspended substrate (200) with a thickness of 100 micrometers to 10,000 micrometers.

11. In paragraph 1, A wireless communication system filter characterized in that the above resonance pattern (210) has a T-shaped plane shape.

12. In paragraph 1, A wireless communication system filter characterized in that the above suspended substrate (200) is formed of a PCB.

13. In paragraph 1, A wireless communication system filter characterized in that the above suspended substrate (200) is formed of a ceramic material.

14. In paragraph 7, A wireless communication system filter characterized in that the above bridge (600) is manufactured by 3D printing.

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