LED display screen and manufacturing method therefor

Abstract

An LED display screen, comprising a substrate, an encapsulation layer, and a non-light-transmitting layer. The encapsulation layer covers multiple light-emitting elements on the substrate, and multiple first grooves are formed on the top surface of the encapsulation layer; the non-light-transmitting layer is formed in the multiple first grooves, and second grooves are formed in the first grooves, so that the non-light-transmitting layer is blocked between the multiple light-emitting elements. The contrast of an encapsulation product is increased, color cast generated by side viewing is reduced, light reflection is effectively reduced, and the graininess on the surface of the LED display screen can also be improved.

Description

LED display screen and manufacturing method thereof

[0001] Cross-references

[0002] This application claims priority to Chinese patent application filed on November 24, 2023, with application number 202311583239.1, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of LED packaging technology, and in particular to an LED display screen and a manufacturing method thereof. Background Art

[0004] With the rapid development of LED display technology, LED packaging technology is also constantly improving and evolving to meet diverse applications and market demands. Existing LED display packaging typically involves encapsulating the PCB with AB adhesive, then directly applying a black film over the adhesive to reduce light reflection. However, LED displays have a glossy display surface that is highly reflective, and simply applying a black film is insufficient to address this reflection issue. Furthermore, issues such as low contrast and color shift when viewed from a wide viewing angle can result.

[0005] Application Contents

[0006] Multiple aspects of the present application provide an LED display screen and a manufacturing method thereof, wherein a plurality of light-emitting elements are separated by a non-light-transmitting layer, and a second groove is provided on the non-light-transmitting layer, thereby forming a double isolation effect between the plurality of light-emitting elements to solve one or more of the above-mentioned problems.

[0007] An embodiment of the present application provides an LED display screen, comprising a substrate, an encapsulation layer, and a non-light-transmitting layer. The substrate is electrically provided with a plurality of light-emitting elements. The encapsulation layer has a bottom and a top surface relative to each other, the bottom surface being formed on the substrate and covering the light-emitting elements, and the top surface being provided with a plurality of first grooves to separate the plurality of light-emitting elements. The non-light-transmitting layer is formed in the first grooves, and the side and bottom of the non-light-transmitting layer are respectively in contact with the encapsulation layer, and a second groove extending toward the bottom is formed on the top of the non-light-transmitting layer.

[0008] In some embodiments, the non-transparent layer is made of epoxy black glue, and / or the encapsulation layer is made of an encapsulation material mixed with melanin, which is a transparent or translucent AB glue mixed with a diffusing agent and melanin.

[0009] In some embodiments, the top surface has a predetermined texture consisting of a plurality of granular structures.

[0010] In some embodiments, the first groove has a width of 0.4 mm and a depth of 0.24 mm.

[0011] In some embodiments, the LED display screen further includes a light-shielding layer disposed on the top surface to improve the blackness of the top surface; and / or the LED display screen further includes a protective layer disposed on the top surface to improve the wear resistance of the top surface.

[0012] In some embodiments, the plurality of first grooves include a plurality of transverse grooves and a plurality of longitudinal grooves that are arranged at intervals, and the plurality of transverse grooves and the plurality of longitudinal grooves are arranged in a staggered manner.

[0013] In some embodiments, the LED display screen further includes a mask having a plurality of shielding portions, each of which corresponds to the first grooves and is embedded in the corresponding first grooves.

[0014] An embodiment of the present application also provides a method for manufacturing an LED display screen, comprising providing a substrate on which light-emitting elements are electrically disposed; forming an encapsulation layer on the substrate, with the bottom surface of the encapsulation layer covering a plurality of the light-emitting elements; forming a plurality of first grooves on the top surface of the encapsulation layer; filling the plurality of first grooves with non-light-transmitting material to form a non-light-transmitting layer; and grooving the non-light-transmitting layer to form a second groove, with the side and bottom of the non-light-transmitting layer located between the first groove and the second groove.

[0015] In some embodiments, the step of forming the non-light-transmitting layer further includes: filling the non-light-transmitting material in the first groove and curing the non-light-transmitting material to form the non-light-transmitting layer; and removing the non-light-transmitting material overflowing from the top surface.

[0016] In some embodiments, the manufacturing method further includes: forming a light shielding layer on the top surface to improve the blackness of the top surface; or forming a protective layer on the top surface to improve the wear resistance of the top surface.

[0017] In the embodiments of the present application, a plurality of first grooves are provided in the encapsulation layer, which correspondingly separate the multiple light-emitting elements on the substrate. This can convert the mixed light problem that is easily formed when multiple light-emitting elements emit light into a point light source, thereby achieving the point light source effect of an SMD (Surface Mount Device). At the same time, a non-light-transmitting layer is filled in the first groove, and a second groove is formed in the non-light-transmitting layer, so that the non-light-transmitting layer provides a double isolation effect between the various light-emitting elements. In addition to improving contrast and reducing or eliminating color shift, in some embodiments where the surface of the first encapsulation layer has a granular structure, it can also enhance the granular effect.

[0018] Among them, the first encapsulation layer and the non-light-transmitting layer can be, but are not limited to, composed of an encapsulation material mixed with melanin, and the depth of the appearance color of the encapsulation material can be adjusted to reduce reflection. At the same time, the top surface of the encapsulation layer is provided with a plurality of grooves, which not only can make the multiple light-emitting elements have non-reflective characteristics, but also a plurality of shielding parts are attached to the multiple grooves, thereby increasing the contrast of the LED display, reducing the color deviation when viewed from the side, and effectively protecting the light-emitting elements. In addition, in some embodiments, the LED display further includes a release film, which is provided on the top surface of the encapsulation material, and the surface of the release film has a plurality of particles. Therefore, when the encapsulation material is cured to form an encapsulation layer, the plurality of particles can form predetermined patterns on the top surface of the encapsulation layer. At the same time, the provision of the light-shielding layer can increase the appearance blackness of the encapsulation layer and reduce light reflection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] FIG1 is a top view of an LED display screen according to an embodiment of the present application.

[0021] FIG2 is a cross-sectional view taken along the AA section line in FIG1 .

[0022] FIG3 is a cross-sectional view of an LED display screen according to another embodiment of the present application.

[0023] FIG4 is a flow chart of a method for manufacturing an LED display screen according to an embodiment of the present application.

[0024] FIG5 is a schematic diagram of process 1 of the method for manufacturing an LED display screen according to an embodiment of the present application.

[0025] FIG6 is a schematic diagram of process 2 of the method for manufacturing an LED display screen according to an embodiment of the present application.

[0026] FIG. 7 is a schematic diagram of process three of the method for manufacturing an LED display screen according to an embodiment of the present application.

[0027] FIG8 is a schematic diagram of process 4 of the method for manufacturing an LED display screen according to an embodiment of the present application. DETAILED DESCRIPTION

[0028] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0029] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0030] 1 and 2 , an embodiment of the present application provides an LED display screen 1 , including a substrate 10 , an encapsulation layer 20 , and a non-light-transmitting layer 30 .

[0031] The substrate 10 may be, but is not limited to, a PCB (printed circuit board), and a plurality of light-emitting elements 11 , such as light-emitting diodes (LEDs), are electrically disposed on the substrate 10 .

[0032] The encapsulation layer 20 is composed of an encapsulation material, and the non-light-transmitting layer 30 is composed of a non-light-transmitting material. The encapsulation layer 20 is used to protect and fix the electronic components and light-emitting elements 11 on the substrate 10. For example, the encapsulation layer 20 can be but is not limited to a thermosetting encapsulation glue, and is formed on the substrate 10 in a direct encapsulation (Chip on board, COB) manner, providing dustproof, moisture-proof, insulating and shock-resistant effects to the electronic components and light-emitting elements 11 on the substrate 10. The non-light-transmitting layer 30 is used to prevent the light of two adjacent light-emitting elements from mixing. Therefore, in some embodiments of the present application, the encapsulation layer 20 is composed of an encapsulation material mixed with melanin, such as a transparent or translucent black encapsulation glue, and the non-light-transmitting layer 30 is composed of a completely black, opaque non-light-transmitting material (such as epoxy black glue, but not limited to this), which can reduce light reflection and light mixing and improve optical performance.

[0033] After encapsulation, the encapsulation layer 20 has a bottom surface 21 and a top surface 22. The bottom surface 21 of the encapsulation layer 20 covers the plurality of light-emitting elements 11 on the substrate 10, while the top surface of the encapsulation layer 20 defines a plurality of first grooves 23, which are respectively recessed into the top surface 22 of the encapsulation layer 20 and separate the plurality of light-emitting elements 11 on the substrate 10 into a plurality of light-emitting areas.

[0034] The non-light-transmitting layer 30 is formed by directly filling each first groove 23 with a non-light-transmitting material, and a second groove 31 is formed on the non-light-transmitting layer 30. The side and bottom of the non-light-transmitting layer 30 are respectively in contact with the encapsulation layer 20 in the first groove 23, and the second groove 31 is opened at the top of the non-light-transmitting layer 30 and extends toward its bottom, so that the second groove 31 is recessed toward the bottom surface 21 of the encapsulation layer 20 in the first groove 23. Therefore, in the embodiment of the present application, the non-light-transmitting layer 30 with the second groove 31 forms a double isolation structure between the multiple light-emitting elements 11, that is, an air wall structure including a physical encapsulation material structure and an air medium, so that the light emitted by adjacent light-emitting elements 11 can be isolated by the non-light-transmitting layer 30 and the second groove 31, thereby improving the contrast and reducing or eliminating the light mixing problem caused by the interference of different colors of light.

[0035] In some embodiments of the present application, the above-mentioned packaging material refers to a transparent or translucent AB glue mixed with a diffusant and melanin. Among them, the diffusant can be but is not limited to a spherical powder of a polymer resin, which is used to evenly disperse the light from the light source, provide soft lighting, and achieve a mixed light effect. Melanin can be but is not limited to a light-absorbing material such as carbon powder or carbon paste, or a combination of carbon powder or carbon paste, which is used to adjust the depth of the color of the packaging material (that is, to adjust the blackness of the packaging material). AB glue includes component A and component B, component A can be but is not limited to a resin, usually liquid or viscous, and component B is a curing agent. When the diffusant, melanin, resin and curing agent are mixed, the curing agent will react chemically with the resin to solidify the packaging material, thereby forming a transparent or translucent black packaging layer 20. In other embodiments of the present application, during the manufacturing process of the LED display screen 1, a release film 60 is also provided on the top surface 22 of the packaging layer 20. The release film 60 has a plurality of particles 61 on its surface, which are used to form a plurality of predetermined grain patterns 221 on the top surface 22 of the encapsulation layer 20. In FIG. 2 of this embodiment, the release film 60 is shown unpeeled to illustrate the relationship between the top surface 22 of the encapsulation layer 20 and the release film 60.

[0036] In this way, by adding melanin and the predetermined texture 221 on the top surface 22 of the encapsulation layer 20 , the blackness of the appearance of the encapsulation layer 20 can be increased, making the product look darker and reducing light reflection.

[0037] In some embodiments of the present application, the plurality of first grooves 23 further include a plurality of transverse grooves and a plurality of longitudinal grooves arranged at intervals, and the transverse grooves and the longitudinal grooves have the same width W and depth H. Wherein, the groove width W is 0.4 mm, the depth H is 0.24 mm, and the plurality of transverse grooves and the plurality of longitudinal grooves are staggered, for example, the transverse grooves and the longitudinal grooves are perpendicular to each other to form a mesh structure. In this way, by designing the distribution and size of the grooves, the light source generated by the plurality of light-emitting elements 11 can be changed from mixed light to a point light source, and the light source can be made granular, achieving the point light source effect of SMD and producing non-reflective properties. In addition, by filling the transverse grooves and the longitudinal grooves with non-transparent material to form a non-transparent layer 30, and the second grooves 31 provided on the non-transparent layer 30, the effect of the point light source and the granular effect on the surface of the encapsulation layer 20 can be made more obvious.

[0038] Furthermore, in certain embodiments of the present application, a mask 40 is further provided on the encapsulation layer 20. The mask 40 is composed of a plurality of connected shielding portions 41 arranged in a direction corresponding to the second grooves 31 and staggered to form a mesh structure, so that the shielding portions 41 of the mask 40 can be embedded in the corresponding second grooves 31.

[0039] It is worth mentioning that the mask 40 can be made of, but not limited to, a metal material, and has an exterior color of black, or other colors that can reduce reflections. The shielding portion 41 is attached to the groove through a bonding process, and the width and thickness of the plurality of shielding portions 41 correspond to the width W and depth H of the groove, respectively, so that the plurality of shielding portions 41 can completely correspond to and fill the second groove 31. In some embodiments of the present application, the thickness of the shielding portion 41 is greater than the depth H of the second groove 31, so that after the mask 40 is arranged in the second groove 31, it has a predetermined height on the encapsulation layer 20. This predetermined height is higher than the height of the light-emitting element 11, and the light-emitting element 11 is enclosed in the mesh structure of the mask 40, which can better increase the contrast of the product and reduce color deviation at a wide viewing angle, while also protecting the light-emitting element 11.

[0040] As shown in Figure 3, the LED display screen 1 provided in another embodiment of the present application is substantially the same as the LED display screen 1 of the above embodiment. The difference between the two is that the LED display screen 1 of this embodiment further includes a light-shielding layer 51 to further improve the light-shielding effect on the surface of the encapsulation layer 20. The light-shielding layer 51 is arranged on the top surface 22 of the encapsulation layer 20 to improve the blackness of the top surface 22. For example, the light-shielding layer 51 can be, but is not limited to, a colored coating applied to the top surface 22 of the encapsulation layer 20 by spraying to increase the blackness of the top surface 22 and reduce or prevent light from passing through. In the figure of this embodiment, the release film 60 has been peeled off from the top surface 22 of the encapsulation layer 20, so that the light-shielding layer 51 can cover the top surface 22 of the encapsulation layer 20 and the predetermined pattern 221 after spraying.

[0041] Similarly, to enhance the wear resistance of the encapsulation layer 20, the LED display 1 further includes a protective layer 52. The protective layer 52 is disposed on the top surface 22 of the encapsulation layer 20 to enhance the wear resistance of the top surface 22. For example, the protective layer 52 may be, but is not limited to, a protective coating sprayed onto the top surface 22 of the encapsulation layer 20 to protect the top surface 22 and enhance wear resistance.

[0042] As shown in FIG3 , in this embodiment, a protective layer 52 is stacked on a light-shielding layer 51 as an example. The light-shielding layer 51 and the protective layer 52 are formed both on the top surface 22 and within the second groove 31 , such that the light-shielding layer 51 and the protective layer 52 are located between the second groove 31 and the shielding portion 41 of the mask 40 . However, this is not limiting. For example, in some embodiments, the light-shielding layer 51 may be stacked on the protective layer 52 , or the light-shielding layer 51 or the protective layer 52 may be formed only on the top surface 22 and the second groove 31 . The above is merely an example and is not limiting.

[0043] As shown in FIG4 , an embodiment of the present application further provides a method for manufacturing an LED display screen, which includes the following steps.

[0044] In step S101 , a substrate 10 is provided. A plurality of light-emitting elements 11 are electrically disposed on the substrate 10 (as shown in FIG. 5 ).

[0045] Step S102 : forming an encapsulation layer 20 on the substrate 10 . In some embodiments, the encapsulation layer 20 is composed of an encapsulation material mixed with melanin, and the bottom surface of the encapsulation layer 20 covers the plurality of light-emitting elements 11 .

[0046] In step S103, a plurality of first grooves 23 are formed on the top surface 22 of the encapsulation layer 20. The plurality of first grooves 23 may be formed by, but are not limited to, mechanical cutting, laser cutting, heat cutting, or chemical cutting (etching). In this embodiment, the first grooves 23 are formed by cutting the grooves using a slide machine.

[0047] In step S104, a non-light-transmitting material is filled into the first grooves 23 to form a non-light-transmitting layer 30. The non-light-transmitting layer 30 is made of a completely black, opaque non-light-transmitting material, such as epoxy black glue.

[0048] In step S105, a second groove 31 is formed in the non-light-transmitting layer 30, with the side and bottom of the non-light-transmitting layer 30 located between the first groove 23 and the second groove 31. The non-light-transmitting layer 30 is composed of a completely black, opaque non-light-transmitting material, such as epoxy vinyl, and the second groove 31 can be formed in the non-light-transmitting layer 30 using the same method as described above for forming the first groove. The non-light-transmitting layer 30 and the second groove 31 provided therein separate the multiple light-emitting elements 11 into multiple light-emitting zones, thereby preventing interference between light emitted by light-emitting elements 11 of different colors. This has the beneficial effects of eliminating light mixing, improving contrast, and reducing color shift when viewed from the side.

[0049] In some embodiments of the present application, the steps of forming the encapsulation layer 20 further include:

[0050] Prepare the encapsulation material, which is a transparent or translucent AB glue mixed with a diffusant and melanin, wherein the components A and B of the AB glue, as well as the diffusant and melanin, are mixed in appropriate proportions. In this step, first adjust the molding thickness and the molding parameters such as the heating temperature and time according to the required thickness of the encapsulation layer 20, and prepare the amount of components A and B of the AB glue. Next, prepare the amount of diffusant and melanin based on the amount of AB glue and the above ratio. Finally, after the four materials, including AB glue, diffusant and melanin, are mixed into the encapsulation material, select an encapsulation mold of the default specifications, and inject the encapsulation material into the molded rubber tube of the encapsulation mold.

[0051] Next, the encapsulating material is applied to the substrate 10. In this step, the encapsulating material is introduced into the encapsulating mold via a molded hose, and the encapsulating material is applied to the substrate 10. Furthermore, a release film 60 is placed over the encapsulating material. The surface of the release film 60 has a plurality of particles 61, which are used to form a predetermined pattern on the top surface 22 of the encapsulating layer 20.

[0052] Afterwards, the encapsulation material is cured to form the encapsulation layer 20. The encapsulation material is molded by the encapsulation mold and baked in a high-temperature box. After being cured to form the encapsulation layer 20, the top surface 22 of the encapsulation layer 20 forms a predetermined pattern with multiple granular structures. For example, the release film 60 has a plurality of regularly or irregularly arranged raised particles distributed on the surface facing the encapsulation layer 20. After the encapsulation material is coated on the substrate 10, the release film 60 is attached to the top surface of the encapsulation material so that the plurality of particles 61 produce a plurality of recesses on the top surface of the encapsulation material. After the encapsulation material is cured to form the encapsulation layer 20, the plurality of recesses form corresponding predetermined patterns 221 on the top surface 22 of the encapsulation layer 20. In addition, the release film 60 can be selected according to actual needs, with different thicknesses and granularities, so as to control the predetermined patterns 221 on the top surface 22 of the encapsulation layer 20 (as shown in FIG. 6 ).

[0053] Then, the release film 60 is peeled off. After the encapsulation material is cured to form the encapsulation layer 20, the encapsulation mold can be demoulded and the release film 60 can be peeled off.

[0054] In some embodiments of the present application, the step of forming a plurality of first trenches 23 on the top surface 22 of the encapsulation layer 20 further includes:

[0055] A plurality of transverse grooves and a plurality of longitudinal grooves are formed on the top surface 22 of the encapsulation layer 20 at intervals (as shown in Figures 1 and 7), and the plurality of transverse grooves and the plurality of longitudinal grooves are staggered, for example, perpendicular to each other to form a mesh structure. It is understood that in the embodiment provided with the mask 40, the plurality of shielding portions 41 on the mask 40 structure also correspond to the arrangement of the first grooves 23, and are staggered to form a mesh structure. The width and thickness of the plurality of shielding portions 41 correspond to the width W and depth H of the second grooves 31, respectively, so that the plurality of shielding portions 41 can be completely and correspondingly embedded in the second grooves 31.

[0056] In addition, after forming the first groove 23, the edge of the substrate 10 needs to be cut again to remove unnecessary edges of the substrate 10 so that the LED display can meet the default size requirements. It should be noted that after the encapsulation layer 20 is completely cured, a vacuum suction cup fixture can be used to completely fix the substrate 10 and the encapsulation layer 20, and the parameters of the dicing machine can be adjusted. Next, the encapsulation layer 20 is cut to a predetermined groove width and depth to form the above-mentioned first groove 23.

[0057] In some embodiments of the present application, after the plurality of first grooves 23 are formed, the step of filling the first grooves 23 with a non-light-transmitting material may be to fill the first grooves 23 with the non-light-transmitting material, and then solidify the non-light-transmitting material in the first grooves 23 through a curing process identical or similar to that described above to form a non-light-transmitting layer 30. In some embodiments, the non-light-transmitting material is filled in the first grooves 23. After the first grooves 23 are fully filled, the non-light-transmitting material overflows onto the top surface 22 around the first grooves 23. Through a curing process identical or similar to that described above, the non-light-transmitting material is solidified on the top surface 22 of the encapsulation layer 20 and in the first grooves 23 to form the non-light-transmitting layer 30. The non-light-transmitting layer 30 located on the top surface 22 of the encapsulation layer 20 is then removed or thinned by grinding or other appropriate methods.

[0058] Next, using the above-mentioned method for forming the first groove 23, a groove is cut in the non-light-transmitting layer 30 to form a second groove 31 that penetrates deep into the non-light-transmitting layer 30, so that the side and bottom of the non-light-transmitting layer are located between the first groove and the second groove. That is, when the second groove 31 is formed, the non-light-transmitting layer 30 is retained on the bottom and side surfaces of the second groove 31. Compared to spraying the non-light-transmitting layer 30 in the first groove 23, the embodiment of the present application adopts a method of filling the first groove 23 with a non-light-transmitting material and then cutting a groove in the non-light-transmitting layer 30 to form the second groove 31. The thickness of the non-light-transmitting layer 30 is controllable and uniform, and the side of the light-emitting element 11 will not leak light due to the thinness or absence of the non-light-transmitting layer 30, thereby effectively avoiding the phenomenon of light mixing between the light-emitting elements 11.

[0059] In other embodiments of the present application, after the non-light-transmitting layer 30 and the second groove 31 are formed, a light-shielding layer 51 is further formed on the top surface 22 of the encapsulation layer 20 to improve the blackness of the top surface 22, and / or a protective layer 52 is formed on the top surface 22 of the encapsulation layer 20 to improve the wear resistance of the top surface 22. Among them, after the edge of the substrate 10 is cut, the surface of the substrate 10 and the encapsulation layer 20 needs to be cleaned, and then a colored coating is applied to the top surface 22 of the encapsulation layer 20 by spraying to reduce or prevent light from passing through, and then the protective layer 52 is applied to the top surface 22 of the encapsulation layer 20 by spraying to improve the wear resistance. It is worth mentioning that after spraying, the substrate 10 and the encapsulation layer 20 are baked at a high temperature to cause the sprayed material to produce a glue chain reaction with the encapsulation layer 20 to achieve a more stable adhesion.

[0060] In addition, the spraying of the light-shielding layer 51 and the protective layer 52 can also be adjusted according to actual needs. For example, the light-shielding layer 51 is first sprayed on the top surface 22, and then the protective layer 52 is sprayed, so that the protective layer 52 is stacked on the light-shielding layer 51. Or the protective layer 52 is first sprayed on the top surface 22, and then the light-shielding layer 51 is sprayed, so that the light-shielding layer 51 is stacked on the protective layer 52. Alternatively, only the light-shielding layer 51 or the protective layer 52 is sprayed on the top surface 22. As shown in Figure 2, in this embodiment, the light-shielding layer 51 is first formed on the top surface 22, and then the protective layer 52 is formed, so that the light-shielding layer 51 and the protective layer 52 cover the top surface 22 of the encapsulation layer 20 and the first groove 23 (as shown in Figure 8).

[0061] Of course, in some embodiments, the spraying process of the light-shielding layer 51 and the protective layer 52 can also be performed after the non-light-transmitting layer 30 and the second groove 31 are formed, so that the light-shielding layer 51 and the protective layer 52 cover the top surface 22 of the packaging layer 20, the top of the non-light-transmitting layer 30 and the second groove 31.

[0062] It is understandable that in other embodiments of the present application, the mask can also be set by directly embedding the multiple shielding parts 41 of the mask 40 into the corresponding second grooves 31 respectively, while omitting the setting of the light-shielding layer 51 and the protective layer 52.

[0063] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. An LED display screen, characterized in that: include: A substrate electrically provided with a plurality of light emitting elements; An encapsulation layer having a bottom surface and a top surface opposite to each other, wherein the bottom surface is formed on the substrate and covers the light emitting element, and the top surface is provided with a plurality of first grooves to separate the plurality of light emitting elements; as well as A non-light-transmitting layer is formed in the first groove, and the side surface and the bottom of the non-light-transmitting layer are respectively in contact with the encapsulation layer, and a second groove extending toward the bottom is formed on the top of the non-light-transmitting layer.

2. The LED display screen according to claim 1, characterized in that: The non-light-transmitting layer is composed of epoxy black glue; And / or the encapsulation layer is composed of an encapsulation material mixed with melanin, and the encapsulation material is a transparent or translucent AB glue mixed with a diffusing agent and melanin.

3. The LED display screen according to claim 1, characterized in that: The top surface has a predetermined texture composed of a plurality of granular structures.

4. The LED display screen according to claim 1, characterized in that: The first groove has a width of 0.4 mm and a depth of 0.24 mm.

5. The LED display screen according to claim 1, characterized in that: It also includes a shading layer, which is arranged on the top surface of the packaging layer to improve the blackness of the top surface; and / or the LED display screen also includes a protective layer, which is arranged on the top surface of the packaging layer to improve the wear resistance of the top surface.

6. The LED display screen according to claim 1, characterized in that: The plurality of first grooves include a plurality of transverse grooves and a plurality of longitudinal grooves arranged at intervals, and the plurality of transverse grooves and the plurality of longitudinal grooves are arranged in a staggered manner.

7. The LED display screen according to claim 6, characterized in that: It also includes a mask having a plurality of shielding parts, wherein the shielding parts correspond to the first grooves and are embedded in the corresponding first grooves.

8. A method for manufacturing an LED display screen, characterized in that: include: Providing a substrate, on which a plurality of light-emitting elements are electrically disposed; Forming a packaging layer on the substrate, wherein the bottom surface of the packaging layer covers the plurality of light-emitting elements; forming a plurality of first grooves on a top surface of the packaging layer; Filling a non-light-transmitting material into the first plurality of grooves to form a non-light-transmitting layer; as well as A second groove is formed on the non-light-transmitting layer, and the side surface and the bottom of the non-light-transmitting layer are located between the first groove and the second groove.

9. The manufacturing method according to claim 8, characterized in that: The step of forming the non-light-transmitting layer further includes: The first groove is filled with the non-light-transmitting material, and the non-light-transmitting material is cured to form the non-light-transmitting layer; and the non-light-transmitting material overflowing from the top surface is removed.

10. The manufacturing method according to claim 9, characterized in that: The step of forming a plurality of the first grooves on the top surface includes: forming a plurality of transverse grooves and a plurality of longitudinal grooves arranged at intervals on the top surface, and the plurality of the transverse grooves and the plurality of the longitudinal grooves are arranged in a staggered manner.

11. The manufacturing method according to claim 9, characterized in that: Also includes: forming a light shielding layer on the top surface to improve the blackness of the top surface; Or a protective layer is formed on the top surface to improve the wear resistance of the top surface.

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