Shielding structure for mobile electronic devices

Abstract

A system may include a non-conductive substrate, an antenna formed onto at least a portion of the non-conductive substrate, and a shielding element that at least partially encloses the non-conductive substrate and the antenna formed onto the non-conductive substrate. The shielding element may structurally secure the antenna and the non-conductive substrate to a substructure of the system. This system may also include a grounding element to which the shielding element and the antenna are grounded. Various other mobile electronic devices and apparatuses are also disclosed.

Description

SHIELDING STRUCTURE FOR MOBILE ELECTRONIC DEVICESCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims benefit of and priority to U.S. Non-provisional Patent Application Ser. No. 18 / 391,045 filed December 20, 2023.FIELD OF THE DISCLOSURE

[0002] The present disclosure is generally directed to a shielding structure for electronic components implemented within electronic or electrical devices.BACKGROUND OF THE DISCLOSURE

[0003] Mobile electronic devices, such as AR glasses, virtual reality (VR) headsets, smartwatches, or smartphones typically have a very limited amount of space available forthe many different electronic components that are used to perform the devices' various defined functions. Because the electronic components are placed close to each other within the device, these components will often interfere with one another if not properly shielded.SUMMARY OF THE DISCLOSURE

[0004] According to a first aspect of the present disclosure there is provided a system comprising: a non-conductive substrate; an antenna formed onto at least a portion of the non-conductive substrate; a shielding element that at least partially encloses the non- conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the system; and a grounding element to which the shielding element and the antenna are grounded.

[0005] In some embodiments, the antenna and the shielding element may be detachably coupled together.

[0006] In some embodiments, the antenna coupled to the shielding element may comprise a single, combined component that may be installed within the substructure of the system as a single unit.

[0007] In some embodiments, the system may comprise a pair of augmented reality (AR) glasses.

[0008] In some embodiments, the substructure of the system may comprise at least one of: a lens housing, a nose bridge, or a glasses side arm.

[0009] In some embodiments, the antenna, the non-conductive substrate, and the shielding element may be installed as a single unit in a hinged corner of the AR glasses.

[0010] In some embodiments, the grounding element may comprise a grounding screw that may be grounded to the substructure of the system.

[0011] In some embodiments, the shielding element may share the grounding screw with a main logic board of the system.

[0012] In some embodiments, the shielding element may provide electrical shielding for at least one of an inertial measurement unit (IMU), a camera, or a microphone.

[0013] In some embodiments, the shielding element may provide electrical shielding for one or more flex connectors that run between the antenna and an antenna feed.

[0014] In some embodiments, the system may further comprise an antenna grounding clip and a cable grounding clip, wherein the antenna grounding clip may secure the antenna to the grounding element, and wherein the cable grounding clip may secure one or more conductive cables between the antenna and an antenna feed to the grounding element.

[0015] In some embodiments, the non-conductive substrate may include a channel for the antenna.

[0016] In some embodiments, the channel for the antenna may be capped on at least one end of the channel.

[0017] According to a second aspect of the present disclosure there is provided a mobile electronic device comprising: a non-conductive substrate; an antenna formed onto at least a portion of the non-conductive substrate; a shielding element that at least partially encloses the non-conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the mobile electronic device; and a grounding element to which the shielding element and the antenna are grounded.

[0018] In some embodiments, the shielding element may provide additional system grounding for one or more electronic components positioned next to the shielding element.

[0019] In some embodiments, the shielding element may be configured to provide electrical shielding for one or more electronic components that may be positioned next to the antenna.

[0020] In some embodiments, a laser may be implemented to weld one or more antenna grounding clip attachment points to the shielding element.

[0021] In some embodiments, the antenna grounding clip may be electrically connected to a grounded screw, and wherein the grounded screw may form a grounding connection for a plurality of other electronic system components.

[0022] In some embodiments, the antenna may be formed using laser direct structuring.

[0023] According to a third aspect of the present disclosure there is provided an apparatus comprising: a non-conductive substrate; an antenna formed onto at least a portion of the non-conductive substrate; a shielding element that at least partially encloses the non- conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the apparatus; and a grounding element to which the shielding element and the antenna are grounded.

[0024] It will be appreciated that any features described herein as being suitable for incorporation into one or more aspects or embodiments of the present disclosure are intended to be generalizable across any and all aspects and embodiments of the present disclosure. Other aspects of the present disclosure can be understood by those skilled in the art in light of the description, the claims, and the drawings of the present disclosure. The foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the claims.BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings illustrate a number of exemplary embodiments and are a part of the specification. Together with the following description, these drawings demonstrate and explain various principles of the present disclosure.

[0026] FIG. 1 illustrates a non-conductive substrate onto which an antenna may be formed, along with a shielding structure for the antenna, according to one or more embodiments of the present disclosure.

[0027] FIG. 2 illustrates an antenna formed onto a non-conductive substrate is encapsulated within a shielding structure, accordin to one or more embodiments of the present disclosure.

[0028] FIG. 3 illustrates an antenna is formed onto a non-conductive substrate, along with a shielding structure for the antenna, according to one or more embodiments of the present disclosure.

[0029] FIG. 4 illustrates a non-conductive carrier that has closed ends, along with a shielding structure for an antenna that may be formed into the non-conductive carrier, according to one or more embodiments of the present disclosure.

[0030] FIG. 5 illustrates a shielding structure and antenna installed within a left-side portion of a pair of augmented reality (AR) glasses, according to one or more embodiments of thepresent disclosure.

[0031] FIG. 6 illustrates a shielding structure and antenna installed within a right-side portion of a pair of augmented reality (AR) glasses, according to one or more embodiments of the present disclosure.

[0032] FIG. 7 is an illustration of exemplary augmented-reality glasses that may be used in connection with embodiments of this disclosure.

[0033] FIG. 8 is an illustration of an exemplary virtual-reality headset that may be used in connection with one or more embodiments of the present disclosure.

[0034] Throughout the drawings, identical reference characters and descriptions indicate similar, but not necessarily identical, elements. While the exemplary embodiments described herein are susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in detail herein. However, the exemplary embodiments described herein are not intended to be limited to the particular forms disclosed. Rather, the present disclosure covers all modifications, equivalents, and alternatives falling within the scope of the appended claims.DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0035] The present disclosure is generally directed to a shielding structure for electronic components implemented within electronic or electrical devices. In some cases, the shielding structure described herein may be implemented in conjunction with a pair of augmented reality (AR) glasses or with other mobile devices that implement electronic components. Mobile electronic devices, such as AR glasses, virtual reality (VR) headsets, smartwatches, or smartphones typically have a very limited amount of space available for the many different electronic components that are used to perform the devices' various defined functions. Because the electronic components are placed close to each other within the device, these components will often interfere with one another if not properly shielded.

[0036] The embodiments described herein may provide an integrated shielding structure that additionally provides grounding for internal antennas, as well as grounding for surrounding electronic components. In some embodiments, as will be explained further below, laser welds may be implemented to form a stiffer enclosure. This enclosure may include the antenna, the shielding structure, and a non-conductive substrate, along with grounding clips or other associated components. Laser welds may also be used to weld various clip or screw attachment points to provide both grounding and structural mounting points. Still further,laser welds may be used to fasten RF cable grounding clips to the frame of the AR glasses, VR headsets, or other mobile electronic devices. These welds may provide a higher level of system integration by allowing grounding screws to be shared by multiple different electronic components.

[0037] Still further, in at least some cases, certain types of metals may be used to manufacture the shielding structure. For instance, in some embodiments, sheet metal may be used to form the shielding structure. The sheet metal may provide an integrated design that provides shielding for an antenna from nearby components that may cause noise or electromagnetic interference. The sheet metal shielding structure may also provide system grounding for electronic components that are placed nearby. These embodiments will be explained in greater detail below with regard to FIGS. 1-8.

[0038] Features from any of the embodiments described herein may be used in combination with one another in accordance with the general principles described herein. These and other embodiments, features, and advantages will be more fully understood upon reading the following detailed description in conjunction with the accompanying drawings and claims.

[0039] FIG. 1 illustrates an embodiment of a system 100 that includes a shielding structure 102 configured to provide electromagnetic shielding for an antenna and to further provide grounding for nearby electronic components. The system 100 may include a non-conductive substrate 106. The non-conductive substrate 106 may be made of plastic, ceramic, foam, or substantially any type of insulative and / or dielectric material. The non-conductive substrate 106 may be formed into substantially any shape, including the U-shaped form illustrated in FIG. 1. In the embodiment of FIG. 1, the non-conductive substrate 106 may be formed into a U-shape with a channel 107 running down the middle. In some cases, the channel 107 may run the entire length of the non-conductive substrate 106, while in other cases, the channel may run only a part of the length of the non-conductive substrate.

[0040] In some embodiments, an antenna may be formed within or on the channel 107 (as generally shown in FIG. 3). Like the non-conductive substrate 106, the antenna may also be formed into substantially any shape or size. In some examples, the antenna may be applied within the channel 107 of the non-conductive substrate 106 using laser direct structuring (LDS). The process of laser direct structuring may include various steps where some of the doping material on the non-conductive substrate may be metallized or otherwise made conductive by the laser in the LDS process. This metallized layer formed on the non-conductive substrate 106 may then conduct electricity and may be used as a radiating element of an antenna. Other manufacturing methods may additionally or alternatively be used to deposit or form an antenna onto the non-conductive substrate 106.

[0041] In cases where an antenna is formed in the channel 107 of the non-conductive substrate 106, the antenna may be connected to an antenna feed. The antenna feed may include an impedance matching circuit, a tuner, a signal processor, an amplifier, an RF source, and other associated electronic components. In some cases, these electronic components may be located immediately next to the antenna, while in other cases, the electronic components may be placed further away from the antenna. The electronic components may be linked to the antenna using cables, flex connectors, or other electrical connecting elements. These cables and / or flexes may be routed using cable clips 105, screws, or other fasteners. The shielding structure 102 may include end portions (e.g., 103), cutouts, or various extended portions (e.g., 101) for mounting. In some cases, the shielding structure 102 may be mounted to a subframe or substructure of a mobile electronic device using clips with screw holes (e.g., 104) or other fasteners. These embodiments will be explained further below with specific regard to FIGS. 2-6.

[0042] FIG. 2 illustrates an embodiment 200 similar to that of FIG. 1, but in this case, the shielding structure 202 has been attached to the non-conductive substrate 203. In this embodiment 200, the shielding structure and the non-conductive substrate 203 form a single, encapsulated unit. This unit can be installed into AR glasses, VR headsets, smartwatches, or other mobile electronic devices as a single, combined component. The component may be installed using brackets 201 and screws 204, or via clips, adhesives, or other fasteners. The single, combined component may be installed in substantially any orientation.

[0043] In at least some cases, the combined component is installed in a particular direction or orientation. As noted above, the shielding structure 202 may block radiation in certain directions (and may allow radiation in other directions). Thus, depending on which way the antenna within the combined component is supposed to radiate (or depending on which other mobile device components are to radiate or are to be shielded), the single unit shown in FIG. 2 may be installed in a specific orientation to apply shielding where needed and to also allow radiation where intended.

[0044] FIG. 3 illustrates an embodiment 300 of a shielding structure 302 and an antenna 304. The antenna 304 may be formed onto at least a portion of a non-conductive substrate 305.As in the embodiment of FIG. 1, the non-conductive substrate 305 may be formed in the shape of a U and may have a channel 307 into which the antenna 304 is formed. The antenna 304 may include a single radiating portion or multiple different radiating portions. In some cases, the antenna 304 may be designed to operate at both 2.4GHz and 5GHz. The shielding element 302 may be dimensioned to at least partially enclose the non-conductive substrate 305 and the antenna 304 that is formed onto the non-conductive substrate 305. In this manner, the shielding element 302 may include various strategically positioned extended portions (e.g., 303) to provide shielding where needed to provide directionality to radiating elements (e.g., antenna 304) or to provide shielding from other radiating elements.

[0045] As illustrated, the shielding element 302 is positioned over the antenna 304. However, when implemented in a mobile electronic device, the shielding element 302 may be positioned directly on top of the combined antenna and non-conductive substrate 305. The mounting holes 301 may allow the combined unit to be fastened to a grounded frame or subframe of the mobile electronic device. As such, the antenna 304 may be grounded along with other electronic components that are connected to the shielding element or to the screws that mount the shielding element 302 to the mobile device's frame. Additionally or alternatively, the combined unit to be mounted to the grounded frame using laser welding, compressive springs, conductive foam, gaskets, or other means of mounting the combined unit to the grounded frame.

[0046] In some embodiments, the shielding element 302 may structurally secure the antenna 304 and the non-conductive substrate 305 to a substructure of the mobile electronic device into which the combined component (including the antenna 304, the non-conductive substrate 305, and the shielding element 302) is installed. For instance, if the mobile electronic device into which the combined component is installed is a pair of AR glasses, the combined component (300, generally) may be fastened to one of the glasses' side arms or to the nose bridge or to the lens frames. Each of these points may be part of a grounded subframe within the AR glasses. The subframe of the AR glasses may then act as a grounding element for the shielding element 302, the antenna 304, and any other components that are electrically connected to the shielding element 302 (e.g., attached to the screw holes 301 via screws).

[0047] In some embodiments, the antenna 304 and the shielding element 302 may be detachably coupled together. Thus, the antenna 304 may couple to the shielding element 302(or vice versa), such that the antenna and the shielding element are effectively a single, combined component. In such cases, the shielding element 302 may be decoupled or detached from the antenna 304 and non-conductive substrate 305 and may be implemented with a different antenna or component. In cases where the shielding element 302 is coupled to the antenna 304 and non-conductive substrate 305 as a combined unit, the combined unit (e.g., 300) may be installed within the substructure of the AR glasses or VR headset as a single component. At least in some cases, the combined unit may be affixed to the substructure of the AR glasses or VR headset. The substructure may be a lens housing, a nose bridge, a glasses side arm, or other portion of the AR glasses or VR headset.

[0048] In cases where the combined unit (e.g., 300) is installed within a pair of AR glasses, the antenna 304, the non-conductive substrate 305, and the shielding element 302 may be installed as a single unit in a hinged corner of the AR glasses. In some examples, for instance, the combined unit may be positioned on the sidearm of the glasses near the hinged corner of the AR glasses. In other cases, the combined unit may be positioned to be part of a hinged corner of the AR glasses or positioned on the lens frame near the hinged corner. The shielding element may provide shielding for the antenna and may provide grounding for any electronic components that are near the hinged corners of the AR glasses (e.g., cameras, depth sensors, speakers, inertial measurement unit (IMUs), microphones, or other components).

[0049] In some embodiments, the shielding element 302 may be electrically connected to a main logic board (MLB). The MLB may include electronic components, including processors, memory, batteries, RF feeds, or other electronic components. The MLB may be grounded to the shielding element 302, which itself may be grounded to a substructure of a mobile device via a connecting bracket 301 and / or screw (e.g., 204 of FIG. 2). The screw may comprise a grounding screw that that is grounded to the substructure of the mobile device. In such cases, the shielding element may share the grounding screw with the main logic board. Other components, as well, may share the grounding screw. As such, the shielding structure 302 may provide grounding for an increased number of components, thereby reducing the number of separate grounding elements that need to be provided.

[0050] FIG. 4 illustrates an embodiment of a system 400 that includes a shielding element 402 and a non-conductive substrate 404 that may include a channel 406 for an antenna (formed at the base of the channel 406, not shown in FIG. 4). In the embodiment 100 of FIG. 1, the channel 107 was open on both ends. In the embodiment of FIG. 4, however, the channel406 may be capped on at least one end (e.g., cap 405). The cap 405 may include additional non-conductive material that may shape or add directionality to the radiation that is emitted by the antenna formed at the base of the channel 406.

[0051] In some cases, the shielding element 402 may be dimensioned to fit over the non- conductive substrate 404. The shielding element 402 may include extended portions 401 that allow for mounting to a substructure of the mobile device in which the antenna is implemented. These extended portions 401 may include screw holes, clips, mounting brackets, or other components that allow the shielding element to be securely fastened to the mobile device's subframe or substructure. Moreover, the shielding element 402 may include additional extended portions that are shaped, sized, bent, or otherwise placed in specific positions relative to the non-conductive substrate 404.

[0052] For example, extended portion 403 may extend down over at least a portion of one of the capped ends of the non-conductive substrate 404. Having this extended portion 403 over the cap 405 may affect how electromagnetic radiation is emitted from the antenna. As such, the shielding element 402 may include cut extended portions (e.g., 401, 403), cut out portions, or specifically shaped portions that affect the radiation pattern created by the antenna. Designers may thus create shielding elements with different numbers, shapes, and sizes of extended portions to carefully control how RF emissions are emitted from the antenna. This may be useful in mobile devices that are placed near a user's head, which need to conform to specific absorption rate (SAR) requirements. The shielding element 402 may be designed to ensure that radiation directed toward the user's head is limited to amounts that meet or are below SAR requirements for electronic devices.

[0053] In at least some cases, portions of the shielding element, including the extended portions, may be formed using sheet metal. The sheet metal may be implemented using a variety of different manufacturing processes. For instance, in some cases, the sheet metal may be mechanically cut using a die to a desired shape. In other cases, the sheet metal may be laser cut. The edges may then be trimmed and shaped as desired. Still further, in some cases, a mechanical deep draw may be implemented to form various 3D shapes, which may be simple or complex. For instance, a mechanical deep draw may be implemented to create 3D shapes for the shielding and grounding element, such as a continuous bath tub shape, a rectangular pan shape, or other shapes as desired for a specific design.

[0054] FIG. 5 illustrates an embodiment 500 in which a shielding element 507 may beimplemented within a mobile electronic device, including grounding a shielded antenna to the mobile device's substructure. In embodiment 500, the shielding element 507 may at least partially surround an antenna (not shown). The antenna may be formed in a channel of a non- conductive substrate 508 (similar to that shown in FIG. 2). The antenna may be electrically connected to a cable 505 via a connector 506. The cable 505 may, in turn, be electrically connected to the shielding element 507 via a different connector 504. Other electronic components (not shown) may also be connected to the shielding element 507 via connector 503.

[0055] In some cases, the shielding element 507 may include an upper portion 502 that is part of the shielding element. The upper portion may be affixed to a mobile device grounded substructure via a screw 501 or other fastener. Likewise, the lower portion of the shielding element 507 may also be attached to the mobile device's grounded substructure via a screw 509 or other fastening mechanism. In this manner, the shielding element 507 may provide electrical shielding for electronic components including the antenna formed in the non- conductive substrate 508. The shielding element 507 may also provide electrical shielding for various cables and flex connectors that run between the antenna and an antenna feed that may reside on an MLB of the mobile device.

[0056] Thus, at least in some embodiments, the system 500 of FIG. 5 may include a multitiered shielding element 502 / 507, a non-conductive substrate 508 with an antenna formed therein (e.g., using laser direct structuring), an antenna grounding clip 506 that connects to the antenna, a cable grounding clip 504 that grounds the cable 505 to the shielding element 507, and potentially other electronic components that are connected to the upper tier of the shielding element (502) via grounding clips 503. The shielding element may be fastened to the substructure of a mobile electronic device via mounting screws 501 and / or 509. In some cases, the antenna grounding clip 506 may secure the antenna to the shielding / grounding element, and the cable grounding clip 504 may secure the conductive cable(s) 505 between the antenna and an antenna feed to the shielding / grounding element.

[0057] In some cases, the shielding element may provide additional system grounding for electronic components that are positioned next to or near the shielding element 507. Still further, in at least some cases, the shielding element 507 may be configured to provide electrical shielding for electronic components that are positioned next to or near the antenna. Thus, the shielding element 507 may provide both electromagnetic shielding as well asgrounding for nearby components. This may prevent system designers from having to run long cables or flexes from electronic components that need grounding but aren't close to a ground or from electronic components that need electromagnetic shielding from other components (e.g., antennas). The system 500 may be installed as a single unit or module substantially anywhere within an AR or VR device to provide shielding and / or grounding where needed within the mobile device.

[0058] In some cases, the antenna grounding clip 506 may be laser welded to the shielding element 507. The laser welding may provide a robust and secure connection between the antenna grounding clip 506 and the shielding element 507. Laser welding may also be used to attach the cable grounding clip 504 and / or the grounding clips 503 for other electronic components. The laser welds may also improve the longevity and robustness of these electrical connections and protect against disconnections that may occur during accidental drops of the mobile device. Still further, in some cases, the antenna grounding clip 506 may be resistance welded or welded in some other manner to the shielding element 507 or to grounding features of the shielding element. In some examples, these grounding features and other sheet metal portions may include existing stamped features from the existing sheet metal material and other structures. In this manner, the shielding element 507 may include features from different previously formed sheet metal portions.

[0059] Still further, in at least some embodiments, as generally shown in embodiment 600 of FIG. 6, the antenna grounding clip 606 (which may be electrically attached to an antenna within the non-conductive substrate 605) may be electrically connected to a grounded screw (e.g., 601 or 604). The grounded screw(s) may form a grounding connection not just for the antenna, but also for other electronic system components including sensors, cameras, speakers, microphones, batteries, processors, MLBs, or other components. In some cases, the antenna grounding cable 607 may run directly to the grounding screw 601, as shown, and may be held in place using clips 608 or other fasteners.

[0060] In some embodiments, the shielding element 603 may include a lower tier (603) and an upper tier 602. In some cases, an MLB may be positioned between the upper tier and the lower tier. In such cases, the entire system 600 may be installed into position and may provide grounding and / or shielding for a variety of different components. Moreover, the shielding may provide directionality to radiating components such as antennas, while absorbing potentially interfering radiation from other components. The system may thus function indual roles, providing operational benefits to multiple different electronic components simultaneously.

[0061] In addition to the system described above, a mobile electronic device may also be provided that includes: a non-conductive substrate, an antenna formed onto at least a portion of the non-conductive substrate, a shielding element that at least partially encloses the non- conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the system, and a grounding element to which the shielding element and the antenna are grounded.

[0062] Still further, in addition to the system described above, an apparatus may be provided that includes: a non-conductive substrate, an antenna formed onto at least a portion of the non-conductive substrate, a shielding element that at least partially encloses the non- conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the system, and a grounding element to which the shielding element and the antenna are grounded.

[0063] E mbodiments of the present disclosure may include or be implemented in conjunction with various types of artificial-reality systems. Artificial reality is a form of reality that has been adjusted in some manner before presentation to a user, which may include, for example, a virtual reality, an augmented reality, a mixed reality, a hybrid reality, or some combination and / or derivative thereof. Artificial-reality content may include completely computergenerated content or computer-generated content combined with captured (e.g., real-world) content. The artificial-reality content may include video, audio, haptic feedback, or some combination thereof, any of which may be presented in a single channel or in multiple channels (such as stereo video that produces a three-dimensional (3D) effect to the viewer). Additionally, in some embodiments, artificial reality may also be associated with applications, products, accessories, services, or some combination thereof, that are used to, for example, create content in an artificial reality and / or are otherwise used in (e.g., to perform activities in) an artificial reality.

[0064] Artificial-reality systems may be implemented in a variety of different form factors and configurations. Some artificial-reality systems may be designed to work without near-eye displays (NEDs). Other artificial-reality systems may include an NED that also provides visibilityinto the real world (such as, e.g., augmented-reality system 700 in FIG. 7) or that visually immerses a user in an artificial reality (such as, e.g., virtual-reality system 800 in FIG. 8). While some artificial-reality devices may be self-contained systems, other artificial-reality devices may communicate and / or coordinate with external devices to provide an artificial-reality experience to a user. Examples of such external devices include handheld controllers, mobile devices, desktop computers, devices worn by a user, devices worn by one or more other users, and / or any other suitable external system.

[0065] Turning to FIG. 7, augmented-reality system 700 may include an eyewear device 702 with a frame 710 configured to hold a left display device 715(A) and a right display device 715(B) in front of a user's eyes. Display devices 715(A) and 715(B) may act together or independently to present an image or series of images to a user. While augmented-reality system 700 includes two displays, embodiments of this disclosure may be implemented in augmented-reality systems with a single NED or more than two NEDs.

[0066] In some embodiments, augmented-reality system 700 may include one or more sensors, such as sensor 740. Sensor 740 may generate measurement signals in response to motion of augmented-reality system 700 and may be located on substantially any portion of frame 710. Sensor 740 may represent one or more of a variety of different sensing mechanisms, such as a position sensor, an inertial measurement unit (IMU), a depth camera assembly, a structured light emitter and / or detector, or any combination thereof. In some embodiments, augmented-reality system 700 may or may not include sensor 740 or may include more than one sensor. In embodiments in which sensor 740 includes an IMU, the IMU may generate calibration data based on measurement signals from sensor 740. Examples of sensor 740 may include, without limitation, accelerometers, gyroscopes, magnetometers, other suitable types of sensors that detect motion, sensors used for error correction of the IMU, or some combination thereof.

[0067] In some examples, augmented-reality system 700 may also include a microphone array with a plurality of acoustic transducers 720(A)-720(J), referred to collectively as acoustic transducers 720. Acoustic transducers 720 may represent transducers that detect air pressure variations induced by sound waves. Each acoustic transducer 720 may be configured to detect sound and convert the detected sound into an electronic format (e.g., an analog or digital format). The microphone array in FIG. 7 may include, for example, ten acoustic transducers: 720(A) and 720(B), which may be designed to be placed inside a corresponding ear of theuser, acoustic transducers 720(C), 720(D), 720(E), 720(F), 720(G), and 720(H), which may be positioned at various locations on frame 710, and / or acoustic transducers 720(1) and 720(J), which may be positioned on a corresponding neckband 705.

[0068] In some embodiments, one or more of acoustic transducers 720(A)-(J) may be used as output transducers (e.g., speakers). For example, acoustic transducers 720(A) and / or 720(B) may be earbuds or any other suitable type of headphone or speaker.

[0069] The configuration of acoustic transducers 720 of the microphone array may vary. While augmented-reality system 700 is shown in FIG. 7 as having ten acoustic transducers 720, the number of acoustic transducers 720 may be greater or less than ten. In some embodiments, using higher numbers of acoustic transducers 720 may increase the amount of audio information collected and / or the sensitivity and accuracy of the audio information. In contrast, using a lower number of acoustic transducers 720 may decrease the computing power required by an associated controller 750 to process the collected audio information. In addition, the position of each acoustic transducer 720 of the microphone array may vary. For example, the position of an acoustic transducer 720 may include a defined position on the user, a defined coordinate on frame 710, an orientation associated with each acoustic transducer 720, or some combination thereof.

[0070] Acoustic transducers 720(A) and 720(B) may be positioned on different parts of the user's ear, such as behind the pinna, behind the tragus, and / or within the auricle or fossa. Or, there may be additional acoustic transducers 720 on or surrounding the ear in addition to acoustic transducers 720 inside the ear canal. Having an acoustic transducer 720 positioned next to an ear canal of a user may enable the microphone array to collect information on how sounds arrive at the ear canal. By positioning at least two of acoustic transducers 720 on either side of a user's head (e.g., as binaural microphones), augmented-reality system 700 may simulate binaural hearing and capture a 3D stereo sound field around about a user's head. In some embodiments, acoustic transducers 720(A) and 720(B) may be connected to augmented-reality system 700 via a wired connection 730, and in other embodiments acoustic transducers 720(A) and 720(B) may be connected to augmented-reality system 700 via a wireless connection (e.g., a BLUETOOTH connection). In still other embodiments, acoustic transducers 720(A) and 720(B) may not be used at all in conjunction with augmented- reality system 700.

[0071] Acoustic transducers 720 on frame 710 may be positioned in a variety of differentways, including along the length of the temples, across the bridge, above or below display devices 715(A) and 715(B), or some combination thereof. Acoustic transducers 720 may also be oriented such that the microphone array is able to detect sounds in a wide range of directions surrounding the user wearing the augmented-reality system 700. In some embodiments, an optimization process may be performed during manufacturing of augmented-reality system 700 to determine relative positioning of each acoustic transducer 720 in the microphone array.

[0072] In some examples, augmented-reality system 700 may include or be connected to an external device (e.g., a paired device), such as neckband 705. Neckband 705 generally represents any type or form of paired device. Thus, the following discussion of neckband 705 may also apply to various other paired devices, such as charging cases, smart watches, smart phones, wrist bands, other wearable devices, hand-held controllers, tablet computers, laptop computers, other external compute devices, etc.

[0073] As shown, neckband 705 may be coupled to eyewear device 702 via one or more connectors. The connectors may be wired or wireless and may include electrical and / or nonelectrical (e.g., structural) components. In some cases, eyewear device 702 and neckband 705 may operate independently without any wired or wireless connection between them. While FIG. 7 illustrates the components of eyewear device 702 and neckband 705 in example locations on eyewear device 702 and neckband 705, the components may be located elsewhere and / or distributed differently on eyewear device 702 and / or neckband 705. In some embodiments, the components of eyewear device 702 and neckband 705 may be located on one or more additional peripheral devices paired with eyewear device 702, neckband 705, or some combination thereof.

[0074] Pairing external devices, such as neckband 705, with augmented-reality eyewear devices may enable the eyewear devices to achieve the form factor of a pair of glasses while still providing sufficient battery and computation power for expanded capabilities. Some or all of the battery power, computational resources, and / or additional features of augmented- reality system 700 may be provided by a paired device or shared between a paired device and an eyewear device, thus reducing the weight, heat profile, and form factor of the eyewear device overall while still retaining desired functionality. For example, neckband 705 may allow components that would otherwise be included on an eyewear device to be included in neckband 705 since users may tolerate a heavier weight load on their shoulders than theywould tolerate on their heads. Neckband 705 may also have a larger surface area over which to diffuse and disperse heat to the ambient environment. Thus, neckband 705 may allow for greater battery and computation capacity than might otherwise have been possible on a stand-alone eyewear device. Since weight carried in neckband 705 may be less invasive to a user than weight carried in eyewear device 702, a user may tolerate wearing a lighter eyewear device and carrying or wearing the paired device for greater lengths of time than a user would tolerate wearing a heavy standalone eyewear device, thereby enabling users to more fully incorporate artificial-reality environments into their day-to-day activities.

[0075] Neckband 705 may be communicatively coupled with eyewear device 702 and / or to other devices. These other devices may provide certain functions (e.g., tracking, localizing, depth mapping, processing, storage, etc.) to augmented-reality system 700. In the embodiment of FIG. 7, neckband 705 may include two acoustic transducers (e.g., 720(1) and 720(J)) that are part of the microphone array (or potentially form their own microphone subarray). Neckband 705 may also include a controller 725 and a power source 735.

[0076] Acoustic transducers 720(1) and 720(J) of neckband 705 may be configured to detect sound and convert the detected sound into an electronic format (analog or digital). In the embodiment of FIG. 7, acoustic transducers 720(1) and 720(J) may be positioned on neckband 705, thereby increasing the distance between the neckband acoustic transducers 720(1) and 720(1) and other acoustic transducers 720 positioned on eyewear device 702. In some cases, increasing the distance between acoustic transducers 720 of the microphone array may improve the accuracy of beamforming performed via the microphone array. For example, if a sound is detected by acoustic transducers 720(C) and 720(D) and the distance between acoustic transducers 720(C) and 720(D) is greater than, e.g., the distance between acoustic transducers 720(D) and 720(E), the determined source location of the detected sound may be more accurate than if the sound had been detected by acoustic transducers 720(D) and 720(E).

[0077] Controller 725 of neckband 705 may process information generated by the sensors on neckband 705 and / or augmented-reality system 700. For example, controller 725 may process information from the microphone array that describes sounds detected by the microphone array. Foreach detected sound, controller 725 may perform a direction-of-arrival (DOA) estimation to estimate a direction from which the detected sound arrived at the microphone array. As the microphone array detects sounds, controller 725 may populate anaudio data set with the information. In embodiments in which augmented-reality system 700 includes an inertial measurement unit, controller 725 may compute all inertial and spatial calculations from the IMU located on eyewear device 702. A connector may convey information between augmented-reality system 700 and neckband 705 and between augmented-reality system 700 and controller 725. The information may be in the form of optical data, electrical data, wireless data, or any other transmittable data form. Moving the processing of information generated by augmented-reality system 700 to neckband 705 may reduce weight and heat in eyewear device 702, making it more comfortable to the user.

[0078] Power source 735 in neckband 705 may provide power to eyewear device 702 and / or to neckband 705. Power source 735 may include, without limitation, lithium-ion batteries, lithium-polymer batteries, primary lithium batteries, alkaline batteries, or any other form of power storage. In some cases, power source 735 may be a wired power source. Including power source 735 on neckband 705 instead of on eyewear device 702 may help better distribute the weight and heat generated by power source 735.

[0079] As noted, some artificial-reality systems may, instead of blending an artificial reality with actual reality, substantially replace one or more of a user's sensory perceptions of the real world with a virtual experience. One example of this type of system is a head-worn display system, such as virtual-reality system 800 in FIG. 8, that mostly or completely covers a user's field of view. Virtual-reality system 800 may include a front rigid body 802 and a band 804 shaped to fit around a user's head. Virtual-reality system 800 may also include output audio transducers 806(A) and 806(B). Furthermore, while not shown in FIG. 8, front rigid body 802 may include one or more electronic elements, including one or more electronic displays, one or more inertial measurement units (IMUs), one or more tracking emitters or detectors, and / or any other suitable device or system for creating an artificial-reality experience.

[0080] Artificial-reality systems may include a variety of types of visual feedback mechanisms. For example, display devices in augmented-reality system 700 and / or virtual-reality system 800 may include one or more liquid crystal displays (LCDs), light emitting diode (LED) displays, microLED displays, organic LED (OLED) displays, digital light projector (DLP) micro-displays, liquid crystal on silicon (LCoS) micro-displays, and / or any other suitable type of display screen. These artificial-reality systems may include a single display screen for both eyes or may provide a display screen for each eye, which may allow for additional flexibility for varifocal adjustments or for correcting a user's refractive error. Some of these artificial-reality systemsmay also include optical subsystems having one or more lenses (e.g., concave or convex lenses, Fresnel lenses, adjustable liquid lenses, etc.) through which a user may view a display screen. These optical subsystems may serve a variety of purposes, including to collimate (e.g., make an object appear at a greater distance than its physical distance), to magnify (e.g., make an object appear larger than its actual size), and / or to relay (to, e.g., the viewer's eyes) light. These optical subsystems may be used in a non-pupil-forming architecture (such as a single lens configuration that directly collimates light but results in so-called pincushion distortion) and / or a pupil-forming architecture (such as a multi-lens configuration that produces so- called barrel distortion to nullify pincushion distortion).

[0081] In addition to or instead of using display screens, some of the artificial-reality systems described herein may include one or more projection systems. For example, display devices in augmented-reality system 700 and / or virtual-reality system 800 may include micro-LED projectors that project light (using, e.g., a waveguide) into display devices, such as clear combiner lenses that allow ambient light to pass through. The display devices may refract the projected light toward a user's pupil and may enable a user to simultaneously view both artificial-reality content and the real world. The display devices may accomplish this using any of a variety of different optical components, including waveguide components (e.g., holographic, planar, diffractive, polarized, and / or reflective waveguide elements), lightmanipulation surfaces and elements (such as diffractive, reflective, and refractive elements and gratings), coupling elements, etc. Artificial-reality systems may also be configured with any other suitable type or form of image projection system, such as retinal projectors used in virtual retina displays.

[0082] The artificial-reality systems described herein may also include various types of computer vision components and subsystems. For example, augmented-reality system 700 and / or virtual-reality system 800 may include one or more optical sensors, such as two- dimensional (2D) or 3D cameras, structured light transmitters and detectors, time-of-flight depth sensors, single-beam or sweeping laser rangefinders, 3D LiDAR sensors, and / or any other suitable type or form of optical sensor. An artificial-reality system may process data from one or more of these sensors to identify a location of a user, to map the real world, to provide a user with context about real-world surroundings, and / or to perform a variety of other functions.

[0083] The artificial-reality systems described herein may also include one or more inputand / or output audio transducers. Output audio transducers may include voice coil speakers, ribbon speakers, electrostatic speakers, piezoelectric speakers, bone conduction transducers, cartilage conduction transducers, tragus-vibration transducers, and / or any other suitable type or form of audio transducer. Similarly, input audio transducers may include condenser microphones, dynamic microphones, ribbon microphones, and / or any other type or form of input transducer. In some embodiments, a single transducer may be used for both audio input and audio output.

[0084] In some embodiments, the artificial-reality systems described herein may also include tactile (i.e., haptic) feedback systems, which may be incorporated into headwear, gloves, bodysuits, handheld controllers, environmental devices (e.g., chairs, floor mats, etc.), and / or any other type of device or system. Haptic feedback systems may provide various types of cutaneous feedback, including vibration, force, traction, texture, and / or temperature. Haptic feedback systems may also provide various types of kinesthetic feedback, such as motion and compliance. Haptic feedback may be implemented using motors, piezoelectric actuators, fluidic systems, and / or a variety of other types of feedback mechanisms. Haptic feedback systems may be implemented independent of other artificial-reality devices, within other artificial-reality devices, and / or in conjunction with other artificial-reality devices.

[0085] By providing haptic sensations, audible content, and / or visual content, artificial-reality systems may create an entire virtual experience or enhance a user's real-world experience in a variety of contexts and environments. For instance, artificial-reality systems may assist or extend a user's perception, memory, or cognition within a particular environment. Some systems may enhance a user's interactions with other people in the real world or may enable more immersive interactions with other people in a virtual world. Artificial-reality systems may also be used for educational purposes (e.g., for teaching or training in schools, hospitals, government organizations, military organizations, business enterprises, etc.), entertainment purposes (e.g., for playing video games, listening to music, watching video content, etc.), and / or for accessibility purposes (e.g., as hearing aids, visual aids, etc.). The embodiments disclosed herein may enable or enhance a user's artificial-reality experience in one or more of these contexts and environments and / or in other contexts and environments.

[0086] As detailed above, the computing devices and systems described and / or illustrated herein broadly represent any type or form of computing device or system capable of executing computer-readable instructions, such as those contained within the modulesdescribed herein. In their most basic configuration, these computing device(s) may each include at least one memory device and at least one physical processor.

[0087] In some examples, the term "memory device" generally refers to any type or form of volatile or non-volatile storage device or medium capable of storing data and / or computer- readable instructions. In one example, a memory device may store, load, and / or maintain one or more of the modules described herein. Examples of memory devices include, without limitation, Random Access Memory (RAM), Read Only Memory (ROM), flash memory, Hard Disk Drives (HDDs), Solid-State Drives (SSDs), optical disk drives, caches, variations or combinations of one or more of the same, or any other suitable storage memory.

[0088] In some examples, the term "physical processor" generally refers to any type or form of hardware-implemented processing unit capable of interpreting and / or executing computer-readable instructions. In one example, a physical processor may access and / or modify one or more modules stored in the above-described memory device. Examples of physical processors include, without limitation, microprocessors, microcontrollers, Central Processing Units (CPUs), Field-Programmable Gate Arrays (FPGAs) that implement softcore processors, Application-Specific Integrated Circuits (ASICs), portions of one or more of the same, variations or combinations of one or more of the same, or any other suitable physical processor.

[0089] Although illustrated as separate elements, the modules described and / or illustrated herein may represent portions of a single module or application. In addition, in certain embodiments one or more of these modules may represent one or more software applications or programs that, when executed by a computing device, may cause the computing device to perform one or more tasks. For example, one or more of the modules described and / or illustrated herein may represent modules stored and configured to run on one or more of the computing devices or systems described and / or illustrated herein. One or more of these modules may also represent all or portions of one or more special-purpose computers configured to perform one or more tasks.

[0090] In addition, one or more of the modules described herein may transform data, physical devices, and / or representations of physical devices from one form to another. Additionally or alternatively, one or more of the modules recited herein may transform a processor, volatile memory, non-volatile memory, and / or any other portion of a physical computing device from one form to another by executing on the computing device, storing data on the computingdevice, and / or otherwise interacting with the computing device.

[0091] In some embodiments, the term "computer-readable medium" generally refers to any form of device, carrier, or medium capable of storing or carrying computer-readable instructions. Examples of computer-readable media include, without limitation, transmissiontype media, such as carrier waves, and non-transitory-type media, such as magnetic-storage media (e.g., hard disk drives, tape drives, and floppy disks), optical-storage media (e.g., Compact Disks (CDs), Digital Video Disks (DVDs), and BLU-RAY disks), electronic-storage media (e.g., solid-state drives and flash media), and other distribution systems.

[0092] The process parameters and sequence of the steps described and / or illustrated herein are given by way of example only and can be varied as desired. For example, while the steps illustrated and / or described herein may be shown or discussed in a particular order, these steps do not necessarily need to be performed in the order illustrated or discussed. The various exemplary methods described and / or illustrated herein may also omit one or more of the steps described or illustrated herein or include additional steps in addition to those disclosed.

[0093] The preceding description has been provided to enable others skilled in the art to best utilize various aspects of the exemplary embodiments disclosed herein. This exemplary description is not intended to be exhaustive or to be limited to any precise form disclosed. Many modifications and variations are possible without departing from the scope of the present disclosure. The embodiments disclosed herein should be considered in all respects illustrative and not restrictive. Reference should be made to the appended claims and their equivalents in determining the scope of the present disclosure.

[0094] Unless otherwise noted, the terms "connected to" and "coupled to" (and their derivatives), as used in the specification and claims, are to be construed as permitting both direct and indirect (i.e., via other elements or components) connection. In addition, the terms "a" or "an," as used in the specification and claims, are to be construed as meaning "at least one of." Finally, for ease of use, the terms "including" and "having" (and their derivatives), as used in the specification and claims, are interchangeable with and have the same meaning as the word "comprising."

Claims

WHAT IS CLAIMED IS:

1. A system comprising: a non-conductive substrate; an antenna formed onto at least a portion of the non-conductive substrate; a shielding element that at least partially encloses the non-conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the system; and a grounding element to which the shielding element and the antenna are grounded.

2. The system of claim 1, wherein the antenna and the shielding element are detachably coupled together; preferably wherein the antenna coupled to the shielding element comprises a single, combined component that is installed within the substructure of the system as a single unit.

3. The system of claim 1 or 2, wherein the system comprises a pair of augmented reality (AR) glasses; preferably wherein the substructure of the system comprises at least one of: a lens housing, a nose bridge, or a glasses side arm.

4. The system of claim 3, wherein the antenna, the non-conductive substrate, and the shielding element are installed as a single unit in a hinged corner of the AR glasses.

5. The system of any one of the preceding claims, wherein the grounding element comprises a grounding screw that is grounded to the substructure of the system; preferably wherein the shielding element shares the grounding screw with a main logic board of the system.

6. The system of any one of the preceding claims, wherein the shielding element provides electrical shielding for at least one of an inertial measurement unit (IMU), a camera, or a microphone; and / or wherein the shielding element provides electrical shielding for one or more flex connectors that run between the antenna and an antenna feed.

7. The system of any one of the preceding claims, further comprising an antenna grounding clip and a cable grounding clip, wherein the antenna grounding clip secures the antenna to the grounding element, and wherein the cable grounding clip secures one or more conductive cables between the antenna and an antenna feed to the grounding element.

8. The system of any one of the preceding claims, wherein the non-conductive substrate includes a channel for the antenna; preferably wherein the channel for the antennais capped on at least one end of the channel.

9. A mobile electronic device comprising: a non-conductive substrate; an antenna formed onto at least a portion of the non-conductive substrate; a shielding element that at least partially encloses the non-conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the mobile electronic device; and a grounding element to which the shielding element and the antenna are grounded.

10. The mobile electronic device of claim 9, wherein the shielding element provides additional system groundingfor one or more electronic components positioned next to the shielding element.

11. The mobile electronic device of claim 9 or 10, wherein the shielding element is configured to provide electrical shielding for one or more electronic components that are positioned next to the antenna.

12. The mobile electronic device of any one of claims 9 to 11, wherein a laser is implemented to weld one or more antenna grounding clip attachment points to the shielding element.

13. The mobile electronic device of claim 12, wherein the antenna grounding clip is electrically connected to a grounded screw, and wherein the grounded screw forms a grounding connection for a plurality of other electronic system components.

14. The mobile electronic device of any one of claims 9 to 13, wherein the antenna is formed using laser direct structuring.

15. An apparatus comprising: a non-conductive substrate; an antenna formed onto at least a portion of the non-conductive substrate; a shielding element that at least partially encloses the non-conductive substrate and the antenna formed onto the non-conductive substrate, wherein the shielding element structurally secures the antenna and the non-conductive substrate to a substructure of the apparatus; and a grounding element to which the shielding element and the antenna are grounded.

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