Lamp bead and LED display unit

Abstract

A lamp bead and an LED display unit. The lamp bead comprises a soldering part, a substrate and two or more LED chips, wherein the soldering part is arranged on the substrate; each LED chip is fixed to the substrate by means of the soldering part; and LED chips of the same type among the LED chips are connected in series or in parallel. By connecting two or more LED chips of the same type in series or in parallel and encapsulating same in a lamp bead, the number of LED chips in a single lamp bead is increased, and the brightness of the lamp bead is thus improved, such that the brightness of an LED display screen composed of an LED display unit can meet brightness requirements of an outdoor scene, thereby improving applicability.

Description

Lamp beads and LED display units

[0001] This application claims priority to the Chinese patent application with application number 2023236709015 filed with the China Patent Office on December 30, 2023, and with the invention name “Lamp Beads and LED Display Units”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a lamp bead and an LED display unit. Background Art

[0003] With the advancement of current technology, the application of LED displays is becoming increasingly widespread, providing greater convenience for people's lives. LED displays typically consist of multiple LEDs, each representing a pixel on the display. Each LED displays a different color, creating the image displayed on the display. Each LED contains an LED chip, which converts electrical energy into light. Each LED contains LED chips of different colors. By switching between different LED chips, the LED displays can display different colors, creating a combination of images on the display.

[0004] Typically, LED chips are packaged within lamp beads, which then function as individual pixels within an LED display. However, the brightness of a single lamp bead is limited by the brightness of the LED chip. In outdoor environments, where brightness requirements are high, current LED displays struggle to meet these requirements, resulting in insufficient applicability. Technical issues

[0005] One of the purposes of the embodiments of the present application is to provide a lamp bead and an LED display unit that can improve applicability. Technical Solutions

[0006] The technical solution adopted in the embodiment of this application is:

[0007] In a first aspect, the present application provides a lamp bead, comprising a welding member, a substrate, and two or more LED chips, wherein the welding member is provided on the substrate, and each LED chip is fixed to the substrate via the welding member;

[0008] Among the LED chips, LED chips of the same type are connected in series or in parallel.

[0009] In one embodiment, the lamp bead includes at least two types of LED chips, with at least two LED chips of each type.

[0010] In one embodiment, the different types of LED chips are LED chips with different luminous colors.

[0011] In one embodiment, when the arrangement of the welding parts is different, the connection methods between the LED chips of the same type are also different.

[0012] In one embodiment, the LED chip includes a first type chip, the first type chip includes an input end and an output end, the input end of one first type chip is connected to the output end of another first type chip, or the input ends of two first type chips are connected, or the output ends of two first type chips are connected.

[0013] In one embodiment, the LED chips include a first type of chip, a second type of chip, and a third type of chip, and the first type of chip, the second type of chip, and the third type of chip are fixed to the substrate by the welding member;

[0014] The number of the first type of chips, the second type of chips and the third type of chips is the same.

[0015] In one embodiment, the LED chips include a first type of chip, a second type of chip and a third type of chip, and the first type of chip, the second type of chip and the third type of chip are fixed to the substrate through the welding part; the number of the first type of chip, the second type of chip and the third type of chip is not exactly the same.

[0016] In one embodiment, the first-type chips are connected in series, the second-type chips are connected in series, and the third-type chips are connected in series.

[0017] In one embodiment, a positive conductive terminal and a negative conductive terminal are provided on the substrate, and the input end of one of the first type of chips, the input end of one of the second type of chips, and the input end of one of the third type of chips are all connected to the same positive conductive terminal of the substrate; the output end of one of the first type of chips, the output end of one of the second type of chips, and the output end of one of the third type of chips are respectively connected to different negative conductive terminals of the substrate.

[0018] In one embodiment, a positive conductive terminal and a negative conductive terminal are provided on the substrate, and the output end of one of the first type of chips, the output end of one of the second type of chips, and the output end of one of the third type of chips are all connected to the same negative conductive terminal of the substrate; the input end of one of the first type of chips, the input end of one of the second type of chips, and the input end of one of the third type of chips are respectively connected to different positive conductive terminals of the substrate.

[0019] In one embodiment, the LED chip includes a chip with a maximum light-emitting surface size of 50 microns to 200 microns.

[0020] In one embodiment, the LED chip includes a chip with a maximum light-emitting surface size less than or equal to 50 microns.

[0021] In a second aspect, the present application further provides an LED display unit, which includes the lamp beads as described above. Beneficial effects

[0022] The aforementioned lamp beads and LED display unit include a welding component, a substrate, and two or more LED chips. The welding component is disposed on the substrate, and each LED chip is fixed to the substrate via the welding component. Among the LED chips, LED chips of the same type are connected in series or in parallel. By packaging two or more LED chips of the same type in series or in parallel within the lamp bead, the number of LED chips in a single lamp bead is increased, thereby increasing the brightness of the lamp bead. This allows the brightness of the LED display screen composed of the LED display unit to meet the brightness requirements of outdoor scenes, improving its applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] FIG1 is a schematic diagram of a lamp bead frame in one embodiment;

[0025] FIG2 is a schematic diagram of a lamp bead frame in another embodiment;

[0026] FIG3 is a schematic diagram of the structure of a lamp bead in one embodiment;

[0027] FIG4 is a schematic diagram of the structure of a lamp bead in another embodiment;

[0028] FIG5 is a circuit diagram of a lamp bead in one embodiment;

[0029] FIG6 is a schematic diagram of the structure of a lamp bead in another embodiment;

[0030] FIG7 is a circuit diagram of a lamp bead in another embodiment;

[0031] FIG8 is a schematic diagram of the structure of a lamp bead in another embodiment;

[0032] FIG9 is a circuit diagram of a lamp bead in another embodiment;

[0033] FIG10 is a schematic diagram of the structure of a lamp bead in another embodiment;

[0034] FIG11 is a circuit diagram of a lamp bead in yet another embodiment. Modes for Carrying Out the Invention

[0035] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit this application.

[0036] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0037] In order to illustrate the technical solution provided by this application, a detailed description is given below with reference to specific drawings and embodiments.

[0038] The lamp beads provided in the embodiments of the present application are one of the unit components that make up an LED display unit. The LED display unit can be an LED display screen, or it can be a part of an LED display screen, spliced ​​together to form a complete LED display screen. Typically, a lamp bead serves as a pixel point on an LED display screen, used to form the image of the LED display screen. An LED display unit typically includes multiple lamp beads, each of which displays different colors, which are combined to form different images displayed by the LED display unit.

[0039] In one embodiment, as shown in FIG1 , a lamp bead is provided, which includes a welding member 200 , a substrate 400 , and two or more LED chips 600 . The welding member 200 is disposed on the substrate 400 , and each LED chip 600 is fixed to the substrate 400 via the welding member 200 .

[0040] Among them, the welding part serves as a carrier for installing the LED chip, which can fix the LED chip during the installation process of the LED chip and can conduct current and voltage for the LED chip. The welding part can be a soldering pad, which is the pin in the component package. In actual application, solder is used to electrically connect the pins of components such as resistors, capacitors, inductors, and chips to the soldering pad. In this application, solder can be used to electrically connect the pins of the LED chip to the soldering pad. The substrate can be a printed circuit board, which can connect various electronic components through circuits and play a role of conduction and transmission. In this application, it is mainly used to realize the circuit connection of each LED chip. The LED chip, also known as the LED light-emitting chip, is the core component of the lamp bead. It has a PN junction and can convert electrical energy into light energy.

[0041] Specifically, the welding parts are fixedly arranged on the substrate to realize the installation and connection of specific components. The LED chip is soldered to the welding parts by soldering to complete the connection and fixation of the LED chip in the lamp bead. Among them, among the LED chips, the LED chips of the same type are connected in series or in parallel. FIG1 takes the example of 6 LED chips of the same type connected in series to exemplify the connection relationship between LED chips of the same type. Furthermore, the series connection of LED chips of the same type can be realized based on the connection relationship of the welding parts set at the corresponding positions. Relying on the connection relationship between the welding parts to realize the connection between the LED chips, the connection lines outside the substrate are reduced, the space of the lamp beads is saved, and the stability of the connection between the LED lamp beads can be improved, so that the working reliability of the lamp beads is improved.

[0042] In this embodiment, the lamp bead includes a welding member, a substrate, and two or more LED chips. The welding member is provided on the substrate, and each LED chip is fixed to the substrate via the welding member. Among the LED chips, LED chips of the same type are connected in series or in parallel.

[0043] In one embodiment, the lamp bead includes at least two types of LED chips, with at least two LED chips of each type.

[0044] By packaging two or more LED chips of the same type in series or in parallel in a lamp bead, the number of LED chips in a single lamp bead is increased, thereby increasing the brightness of the lamp bead. This allows the brightness of the LED display unit composed of the lamp beads to meet the brightness requirements of outdoor scenes, thereby improving applicability.

[0045] The type of LED chips within a lamp bead is not limited to one; multiple types can be used, and the connection relationship between multiple types of LED chips within the lamp bead is not limited. In one embodiment, as shown in Figure 2, the LED chips include a first type chip 620, a second type chip 640, and a third type chip 660. The first type chip 620, the second type chip 640, and the third type chip 660 are fixed to the substrate 400 via a soldering member 200. The first type chips 620 are connected in series, the second type chips 640 are connected in series, and the third type chips 660 are connected in series.

[0046] Specifically, the first type of chip, the second type of chip, and the third type of chip are different types of LED chips. Generally, the main difference between different types of LED chips is that the light-emitting colors of different types of LED chips are different. For example, if the lamp bead is an RGB lamp bead, the light-emitting colors of the LED chips in the lamp bead can be red, green, and blue. Optionally, the colors of the first type of chip, the second type of chip, and the third type of chip are different. The light-emitting color of the first type of chip is red, the light-emitting color of the second type of chip is green, and the light-emitting color of the third type of chip is blue. Furthermore, the connection relationship between LED chips of the same type is series, as shown in Figure 2. It should be noted that the number of different types of LED chips can be different.

[0047] Among them, the connection method between LED chips of the same type is different depending on the setting of the welding parts. For example, when the welding parts are shown in Figure 3, each welding part is only set at the welding point of each LED chip, and is divided into two welding areas (areas not covered by the oblique lines) by the substrate (the area covered by the oblique lines). One welding area includes six welding parts, that is, three pairs of welding pads, and each pair of welding pads includes a positive electrode welding pad and a negative electrode welding pad. Therefore, a total of 12 welding pads are included in Figure 3. Figure 3 shows a type of welding pad, a square welding pad. Each pair of square welding pads can be welded to an LED chip, that is, the input end of the LED chip is welded to the positive electrode welding pad, and the output end of the LED chip is welded to the negative electrode welding pad. In Figure 3, the LED chips welded to each pair of interconnected square welding pads are of the same type, that is, LED chips of the same type are connected in series.

[0048] LED chips include input and output terminals. The LED chips in Figure 2, taking the first-class chips as an example, can be connected in three ways: first, the input terminal of one first-class chip is connected to the output terminal of another first-class chip. Second, the input terminals of two first-class chips are connected. Third, the output terminals of two first-class chips are connected. The first connection method is equivalent to connecting LED chips of the same type in series. The second and third connection methods are equivalent to connecting LED chips of the same type in parallel. In the first connection method, when the input terminal of one first-class chip is connected to the output terminal of another first-class chip, the power input terminal connected to the soldering part inputs power from the input terminal of the other first-class chip, causing power to be output from the output terminal of the first first-class chip. In the second connection method, when the input terminals of two first-class chips are connected, the power input terminal connected to the soldering part is connected to the common terminal connected to the two first-class chips, thus powering the two first-class chips. In the third connection method, when the output terminals of two first-class chips are connected, the power input terminal connected to the soldering part is simultaneously connected to the input terminals of both first-class chips. The second and third types of chips also have the same three connection methods as the first type of chip, which will not be described here.

[0049] In one embodiment, the input and output ends of each first type chip are connected alternately, the input and output ends of each second type chip are connected alternately, and the input and output ends of each third type chip are connected alternately.

[0050] Specifically, this connection method is the first connection method mentioned above, that is, LED chips of the same type are connected in series, and the input and output ends of the same type of LED chips are connected alternately. Take the connection relationship of the first type of chips as an example to illustrate: the first type of chips are marked as chip No. 1 and chip No. 2, then the output end of chip No. 1 is connected to the input end of chip No. 2. If the number of the first type of chips is three, including chip No. 3, then the input end of chip No. 3 is connected to the output end of chip No. 2. As the number of the first type of chips increases, the input and output ends of the first type of chips are connected alternately. The connection between the second type of chips and the third type of chips is the same as that of the first type of chips, and will not be repeated here.

[0051] When setting the first, second, and third types of chips, the number of each type of LED chip can be arbitrarily selected according to actual needs. The LED chips in the lamp beads are set accordingly according to the application requirements of different usage environments. As shown in Figure 4, in one embodiment, the number of first-type chips 620, second-type chips 640, and third-type chips 660 is the same. In this embodiment, among the LED chips set in the lamp beads, the number of each type of LED chips is the same, and the number of first-type chips, second-type chips, and third-type chips are all the same. In this way, when different types of LED chips in the lamp beads are working, the same number of LED chips of each color can be in working state. When the LED displays different colors, the display of each color is uniform in brightness while having sufficient brightness.

[0052] For example, the equivalent circuit diagram of FIG4 is shown in FIG5, where "R", "B" and "G" represent different types of LED chips, respectively, "R" represents the first type of chip, "G" represents the second type of chip, and "B" represents the third type of chip.

[0053] Optionally, the number of first-category chips, second-category chips, and third-category chips is not exactly the same. As shown in FIG6 , in one embodiment, the number of first-category chips 620, second-category chips 640, and third-category chips 660 is not exactly the same. The term "not exactly the same" here includes: the number of first-category chips, the number of second-category chips, and the number of third-category chips are different, and also includes: the number of first-category chips, the number of second-category chips, and the number of third-category chips are partially the same. The number of each type of LED chip can be determined according to actual needs and is not limited. As shown in FIG6 , the number of first-category chips 620 is two, and they are connected in parallel. The number of second-category chips 640 and the number of third-category chips 660 are both one. For example, the equivalent circuit diagram of FIG6 is shown in FIG7 , where "R", "B", and "G" represent different types of LED chips, respectively. "R" represents the first-category chip, "G" represents the second-category chip, and "B" represents the third-category chip.

[0054] In one embodiment, the first type chips are connected in series, the second type chips are connected in series, and the third type chips are connected in series.

[0055] In one embodiment, as shown in FIG. 3 , FIG. 4 and FIG. 6 , a positive conductive terminal 820 and a negative conductive terminal 840 are disposed on the substrate 400 .

[0056] Specifically, the positive conductive terminal is connected to the power supply as the power input terminal to transmit power to the LED chip in the lamp bead, and the power flows out of the lamp bead through the negative conductive terminal. The positive conductive terminal is connected to the welding part, which can be connected to each welding part to respectively supply power to the LED chip welded on each welding part. When the LED chip is connected as shown in Figure 4: the input and output ends of the same type of LED chips are alternately connected, the positive conductive terminal can also be connected to the input end of each type of LED chip through the welding part, specifically, the input end of the LED chip is connected through the positive soldering pad. In the series circuit of LED chips of the same type, the positive conductive terminal is connected to the input end of the LED chip at the head end of the series circuit. The negative conductive terminal is connected to the welding part, as shown in Figure 3, and the negative conductive terminal is connected to the negative soldering pad of each pair of soldering pads to respectively receive the power flowing out of the LED chip welded on each soldering part. When the LED chips are connected in the manner shown in FIG4 : the input and output ends of the same type of LED chips are connected alternately, the negative conductive terminal can also be connected to the output end of each type of LED chip. Specifically, in a series circuit of LED chips of the same type, the negative conductive terminal is connected to the output end of the LED chip at the tail end of the series circuit.

[0057] As shown in Figure 4, in one embodiment, the lamp bead can adopt common cathode technology, and the output end of one of the chips in the first type 620, the output end of one of the chips in the second type 640, and the output end of one of the chips in the third type 660 are all connected to the same negative conductive terminal 840 of the substrate 400.

[0058] Specifically, three positive conductive terminals are provided on the substrate, which are respectively connected to the first type of chip, the second type of chip, and the third type of chip. Specifically, in a series circuit of LED chips of the same type, the first positive conductive terminal is connected to the input terminal of the LED chip located at the head end of the series circuit of the first type of chip. The second positive conductive terminal is connected to the input terminal of the LED chip located at the head end of the series circuit of the second type of chip. The third positive conductive terminal is connected to the input terminal of the LED chip located at the head end of the series circuit of the third type of chip. A negative conductive terminal is provided on the substrate, which is simultaneously connected to the first type of chip, the second type of chip, and the third type of chip. Specifically, in a series circuit of LED chips of the same type, the negative conductive terminal is connected to the output terminal of the LED chip located at the tail end of each series circuit. Each series circuit includes a series circuit of the first type of chip, a series circuit of the second type of chip, and a series circuit of the third type of chip.

[0059] For example, the lamp beads shown in FIG6 also adopt common cathode technology.

[0060] In this embodiment, common cathode technology, which incorporates precise power supply control technology, allocates different voltages to different LED chip types (red, green, and blue primary colors) based on their distinct optoelectronic properties. This precise power supply reduces power loss in the LED display unit. Furthermore, due to its low heat and low temperature rise characteristics, the LED display unit, comprised of lamp beads, offers low temperature rise, uniform screen heating, constant color temperature, and the absence of color patches over long periods of use, resulting in excellent display quality. This ensures reliable and stable operation of the LED chips, enhancing their operational stability.

[0061] In one embodiment, the lamp beads can also adopt common anode technology, as shown in Figure 8, the input end of one of the chips in the first type 620, the input end of one of the chips in the second type 640, and the input end of one of the chips in the third type 660 are all connected to the same positive conductive terminal 820 of the substrate 400.

[0062] Specifically, a positive conductive terminal is provided on the substrate, which is connected to the first, second, and third types of chips. Specifically, in a series circuit of LED chips of the same type, the positive conductive terminal is connected to the input terminal of the LED chip at the head end of each series circuit. Each series circuit includes a series circuit of chips of the first type, a series circuit of chips of the second type, and a series circuit of chips of the third type.

[0063] Furthermore, as shown in FIG8 , the output end of one of the first type chips 620 , the output end of one of the second type chips 640 , and the output end of one of the third type chips 660 are respectively connected to different negative conductive terminals 840 of the substrate 400 .

[0064] Specifically, the substrate is provided with three negative conductive terminals, one for connecting to the first, one for connecting to the second, and one for connecting to the third type of chip. Specifically, in a series circuit of LED chips of the same type, the first negative conductive terminal is connected to the output terminal of the LED chip at the end of the series circuit of the first type of chip. The second negative conductive terminal is connected to the output terminal of the LED chip at the end of the series circuit of the second type of chip. The third negative conductive terminal is connected to the output terminal of the LED chip at the end of the series circuit of the third type of chip.

[0065] For example, the equivalent circuit diagram of FIG8 is shown in FIG9 , where “R”, “B” and “G” represent different types of LED chips, respectively, “R” represents the first type of chip, “G” represents the second type of chip, and “B” represents the third type of chip.

[0066] Optionally, as shown in Figure 10, in one embodiment, the number of the first type of chips, the number of the second type of chips, and the number of the third type of chips may be different, and the lamp bead adopts common anode technology. As shown in Figure 10, the number of the first type of chips 620 is two, and they are connected in parallel. The number of the second type of chips 640 and the third type of chips 660 are both one. For example, the equivalent circuit diagram of Figure 10 is shown in Figure 11, where "R", "B" and "G" represent different types of LED chips, respectively, "R" represents the first type of chip, "G" represents the second type of chip, and "B" represents the third type of chip.

[0067] In this embodiment, the LED chips are connected using common anode technology. Since common anode technology has been maturely applied for many years and has a complete industrial chain, the lamp beads have lower production and maintenance costs.

[0068] In this application, in order to effectively control the size of the lamp beads, in one embodiment, the LED chip 600 is a Micro LED chip. Micro LED, or LED miniaturization technology, refers to miniaturizing, arraying, and thin-filming traditional LED crystal films using miniaturization process technology, and then transferring the crystal films to the circuit board in batches through mass transfer technology, using physical deposition to manufacture a protective layer, and finally completing the packaging. This forms an ultra-small pitch LED, further miniaturizing the millimeter-level LED length to the micron level to achieve ultra-high pixels and ultra-high resolution. Micro LED chips do not require a backlight source, can emit light on their own, can be more easily and accurately debugged, and have a longer luminous life and higher brightness.

[0069] The LED chips in this application can also be Mini LED chips. Mini LEDs are generally considered to be a transitional chip between traditional LEDs and Micro LEDs. Mini LED chips are also smaller in size, allowing multiple to be installed within a given unit size. This can improve the unit brightness of the lamp compared to ordinary LED chips.

[0070] In fact, Micro LED chips and Mini LED chips can be used in combination. That is, among the first, second, and third types of chips, at least one is a Mini LED chip and at least one is a Micro LED chip. For example, in one embodiment, the LED chips include the first, second, and third types of chips, wherein the first and second types of chips are Mini LED chips, and the third type of chip is a Micro LED chip.

[0071] Specifically, the very small size of Mini LED and Micro LED chips allows for a larger number of them to be placed within a lamp bead, boosting its brightness. For example, the maximum size of the light-emitting surface of a Mini LED chip is 50 to 200 microns, while the maximum size of the light-emitting surface of a Micro LED chip is less than or equal to 50 microns.

[0072] Based on the same technical concept, an embodiment of the present application further provides an LED display unit, which includes the lamp beads described in the above embodiments.

[0073] Specifically, the connection relationship between the individual lamp beads can be varied according to the requirements of the LED display unit. For example, the lamp beads can be connected in series, i.e., in a single-line series connection. Alternatively, an array series connection can be used, where the lamp beads are grouped, the lamp beads within each group are connected in series, and then the lamp beads within each group are connected in parallel. Alternatively, in a single-line series connection, a Zener diode can be connected in parallel to each lamp bead. There are many different connection methods and they can be changed according to actual usage requirements, so they will not be listed here one by one.

[0074] Furthermore, when the substrate of the lamp beads is a printed circuit board (PCB), the color of the PCB can be darkened before the die bonding step during packaging to enhance the contrast of the lamp beads during illumination, serving as an auxiliary method for improving display brightness. Optionally, the PCB color can be darkened by spraying, applying black glue, or laminating. During the laminating process, the light transmittance of the laminating film can be adjusted according to actual needs.

[0075] In order to better understand the above solution, in combination with the lamp bead shown in FIG4 , a detailed explanation is given below in combination with a specific embodiment.

[0076] In one embodiment, the LED display unit is an LED display screen packaged using MiP (Micro LED in Package) technology. MiP is a relatively novel packaging architecture based on Micro LEDs. By rewiring the Micro LED chip substrate and fanning out the pins, previously difficult-to-test electrodes are now routed through wiring, increasing the distance between the pins and reducing the difficulty of testing and mounting. The LED display screen includes multiple lamp beads, each comprising a soldering element, a substrate, a positive conductive terminal, a negative conductive terminal, and an LED chip. Each LED chip is a Micro LED chip. The LED chips include first, second, and third types of chips, which are secured to the substrate via soldering elements. The first type of chip is a red chip, the second type is a green chip, and the third type is a blue chip. When the LED chips include red, green, and blue colors and are packaged using MiP (Micro LED in Package) technology, the lamp bead can be referred to as a single-pixel RGB single-Micro chip. The packaged lamp bead is capable of displaying the different colors in the LED display screen. Since the number of luminous LED chips per unit area is twice as much as before, the brightness can also be increased from the original 2000 to 3000 nits to 4000 to 6000 nits, which is more suitable for outdoor scenes that require high brightness.

[0077] In this embodiment, Mini LED / Micro LED chips are connected in series or in parallel, replacing traditional large-size LED chips. This effectively increases the lumen output of a single lamp bead, resulting in a brighter lamp. By connecting multiple single-color LED chips in series within a single-pixel RGB single-Micro chip, for example, by switching from an RGB (one LED chip for each of the three colors) to an RR-GG-BB (two LED chips for each of the three colors) design, brightness is increased and brightness uniformity is improved, meeting the brightness requirements of outdoor scenes.

[0078] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and such modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A lamp bead, characterized in that: The lamp bead comprises a welding piece, a substrate and more than two LED chips, the welding piece is arranged on the substrate, and each LED chip is fixed to the substrate through the welding piece; Among the LED chips, LED chips of the same type are connected in series or in parallel.

2. The lamp bead according to claim 1, characterized in that: The lamp bead includes at least two types of LED chips, and each type of LED chips includes at least two.

3. The lamp bead according to claim 1 or 2, characterized in that: The different types of LED chips are LED chips with different luminous colors.

4. The lamp bead according to claim 1, characterized in that: When the arrangement of the welding parts is different, the connection modes between the LED chips of the same type are also different.

5. The lamp bead according to claim 1, characterized in that: The LED chip includes a first type of chip, which includes an input end and an output end. The input end of one first type of chip is connected to the output end of another first type of chip, or the input ends of two first type of chips are connected, or the output ends of two first type of chips are connected.

6. The lamp bead according to claim 1 or 2, characterized in that: The LED chips include a first type of chip, a second type of chip and a third type of chip, and the first type of chip, the second type of chip and the third type of chip are fixed to the substrate through the welding member; The number of the first type of chips, the second type of chips and the third type of chips is the same.

7. The lamp bead according to claim 1 or 2, characterized in that: The LED chips include a first type of chip, a second type of chip and a third type of chip, and the first type of chip, the second type of chip and the third type of chip are fixed to the substrate through the welding member; The number of the first type of chips, the second type of chips and the third type of chips are not exactly the same.

8. The lamp bead according to claim 6 or 7, characterized in that: The first-type chips are connected in series, the second-type chips are connected in series, and the third-type chips are connected in series.

9. The lamp bead according to any one of claims 6 to 8, characterized in that: A positive conductive terminal and a negative conductive terminal are provided on the substrate, and an input end of one of the first type of chips, an input end of one of the second type of chips, and an input end of one of the third type of chips are all connected to the same positive conductive terminal of the substrate; an output end of one of the first type of chips, an output end of one of the second type of chips, and an output end of one of the third type of chips are respectively connected to different negative conductive terminals of the substrate.

10. The lamp bead according to any one of claims 6 to 8, characterized in that: A positive conductive terminal and a negative conductive terminal are provided on the substrate, and the output end of one of the first type of chips, the output end of one of the second type of chips and the output end of one of the third type of chips are all connected to the same negative conductive terminal of the substrate; the input end of one of the first type of chips, the input end of one of the second type of chips and the input end of one of the third type of chips are respectively connected to different positive conductive terminals of the substrate.

11. The lamp bead according to any one of claims 1 to 10, characterized in that: The LED chip includes a chip whose maximum size of the light-emitting surface is 50 microns to 200 microns.

12. The lamp bead according to any one of claims 1 to 10, characterized in that: The LED chip includes a chip whose maximum size of the light-emitting surface is less than or equal to 50 microns.

13. An LED display unit, characterized in that: The LED display unit comprises the lamp bead as described in any one of claims 1-12.

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