Implantable sensor device

Abstract

A method includes making an incision (e.g., postauricular incision) of an ear of a recipient to reveal cartilage in a pinna of the ear, forming a cutout in the cartilage in the pinna, and positioning a diaphragm of a microphone device in the cutout to implant the microphone device in the pinna.

Description

IMPLANTABLE SENSOR DEVICEBACKGROUNDField of the Disclosure[oooi] The present disclosure relates generally to implanting a sensor device in a recipient.Related Art

[0002] Medical devices have provided a wide range of therapeutic benefits to recipients over recent decades. Medical devices can include internal or implantable components / devices, external or wearable components / devices, or combinations thereof (e.g., a device having an external component communicating with an implantable component). Medical devices, such as traditional hearing aids, partially or fully-implantable hearing prostheses (e.g., bone conduction devices, mechanical stimulators, cochlear implants, etc.), pacemakers, defibrillators, functional electrical stimulation devices, and other medical devices, have been successful in performing lifesaving and / or lifestyle enhancement functions and / or recipient monitoring for a number of years.

[0003] The types of medical devices and the ranges of functions performed thereby have increased over the years. For example, many medical devices, sometimes referred to as “implantable medical devices,” now often include one or more instruments, apparatus, sensors, processors, controllers or other functional mechanical or electrical components that are permanently or temporarily implanted in a recipient. These functional devices are typically used to diagnose, prevent, monitor, treat, or manage a disease / injury or symptom thereof, or to investigate, replace or modify the anatomy or a physiological process. Many of these functional devices utilize power and / or data received from external devices that are part of, or operate in conjunction with, implantable components.SUMMARY

[0004] In one aspect, a method is provided. The method comprises: making an incision of an ear of a recipient to reveal cartilage in a pinna of the ear; forming a cutout in the cartilage; and positioning a diaphragm of a microphone device in the cutout to implant the microphone device in the pinna.

[0005] In another aspect, an implantable medical device is provided. The implantable medical device comprises: a sensor device comprising a sound sensor configured to be implanted in a concha of an ear of a recipient to detect sound signals through skin of the concha; and a soundprocessing module configured to: receive signals from the sound sensor, wherein the signals represent the sound signals; process the signals without a body noise reference signal to generate output signals; and provide the output signals to the recipient.

[0006] In yet another aspect, a method is provided. The method comprises: opening an incision at a posterior area of an ear of a recipient to expose cartilage in a pinna of the ear; removing a portion of the cartilage to form an opening adjacent to skin at an anterior portion of a concha of the pinna; and positioning a sound sensor in the opening adjacent to the skin at the anterior portion of the concha.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the present disclosure are described herein in conjunction with the accompanying drawings, in which:

[0008] FIG. 1A is a schematic diagram illustrating a cochlear implant system with which aspects of the techniques presented herein can be implemented;

[0009] FIG. IB is a side view of a recipient wearing a sound processing unit of the cochlear implant system of FIG. 1A;[ooio] FIG. 1C is a schematic view of components of the cochlear implant system of FIG. 1 A;[ooii] FIG. ID is a block diagram of the cochlear implant system of FIG. 1A;

[0012] FIG. 2 is a side view of an ear of a recipient showing locations in which a sensor device can be implanted in a pinna of an ear, in accordance with embodiments of the present disclosure;

[0013] FIG. 3 is a rear view of an ear of a recipient showing a location in which a sensor device can be implanted in a pinna of the ear, in accordance with embodiments of the present disclosure;

[0014] FIG. 4 is a rear view of an ear of a recipient with a sensor device being implanted in a pinna of the ear, in accordance with embodiments of the present disclosure;

[0015] FIG. 5 is a schematic diagram of a sensor device implanted in a pinna of an ear of a recipient, in accordance with embodiments of the present disclosure;

[0016] FIG. 6 is a schematic diagram of another sensor device implanted in a pinna of an ear of a recipient, in accordance with embodiments of the present disclosure;

[0017] FIG. 7 is a schematic diagram of yet another sensor device implanted in a pinna of an ear of a recipient, in accordance with embodiments of the present disclosure;

[0018] FIG. 8 is a schematic diagram of still another sensor device implanted in a pinna of an ear of a recipient, in accordance with embodiments of the present disclosure;

[0019] FIG. 9 is a graph illustrating acoustic sensitivity of sensor devices implanted at different locations in a recipient;

[0020] FIG. 10 is a graph illustrating vibrational sensitivity of sensor devices implanted at different locations in a recipient;

[0021] FIG. 11 is a flowchart of a method for implanting a sensor device in a pinna of an ear of a recipient, in accordance with embodiments of the present disclosure; and

[0022] FIG. 12 is a flowchart of a method for operating a sensor device implanted in a pinna of an ear of a recipient, in accordance with embodiments of the present disclosure.DETAILED DESCRIPTION

[0023] Presented herein are techniques for implanting a sensor device in a recipient. The sensor device is configured to detect input signals, such as sound signals and / or vibrations, and can be part of, or be communicatively coupled to, a module configured to process the input signals to deliver stimulation signals (e.g., electrical stimulation signals, mechanical stimulation signals, acoustic stimulation signals, or combinations thereof) based on the sound signals. For example, a sensor device can operate to capture / detect sound signals (e.g., environmental noises, words spoken by another person, etc.), which in turn are used to deliver stimulation signals that enable the recipient to properly perceive those sounds. As such, positioning of the sensor device in the recipient is important to enable the ability of the recipient to hear.

[0024] However, sensor devices can also capture body noises that distort the integrity of input signals. Consequently, unwanted body noises can be included in the sound processing for output to the recipient and / or need to be removed through sound processing. Additionally or alternatively, a surgical process to implant a sensor device in a location that reduces the capture of body noise can be complex and / or time consuming to perform. Therefore, it may not be desirable to perform such implantation processes.

[0025] Accordingly, embodiments of the present disclosure relate to implanting a sensor device in a pinna of an ear of a recipient. The positioning of a sensor device in the pinna canreduce capture of body noise as compared to the positioning of the sensor device at another location in the recipient, such as subcutaneously within the skull. Additionally, the sensor device can be implanted in the pinna using a surgical process that is relatively easily performed. For this reason, the sensor device can be more easily implemented and operated.

[0026] There are a number of different types of devices in / with which embodiments of the present disclosure may be implemented. Merely for ease of description, the techniques presented herein are primarily described with reference to a specific device in the form of a cochlear implant system. However, it is to be appreciated that the techniques presented herein may also be partially or fully implemented by any of a number of different types of devices, including consumer electronic device (e.g., mobile phones), wearable devices (e.g., smartwatches), hearing devices, implantable medical devices, consumer electronic devices, etc. As used herein, the term “hearing device” is to be broadly construed as any device that delivers sound signals to a user in any form, including in the form of acoustical stimulation, mechanical stimulation, electrical stimulation, etc. As such, a hearing device can be a device for use by a hearing-impaired person (e.g., hearing aids, middle ear auditory prostheses, bone conduction devices, direct acoustic stimulators, electro-acoustic hearing prostheses, auditory brainstem stimulators, bimodal hearing prostheses, bilateral hearing prostheses, dedicated tinnitus therapy devices, tinnitus therapy device systems, combinations or variations thereof, etc.) or a device for use by a person with normal hearing (e.g., consumer devices that provide audio streaming, consumer headphones, earphones, and other listening devices). In other examples, the techniques presented herein can be implemented by, or used in conjunction with, various implantable medical devices, such as vestibular devices (e.g., vestibular implants), visual devices (i.e., bionic eyes), sensors, pacemakers, drug delivery systems, defibrillators, functional electrical stimulation devices, catheters, seizure devices (e.g., devices for monitoring and / or treating epileptic events), sleep apnea devices, electroporation devices, etc.

[0027] FIGs. 1A-1D illustrates an example cochlear implant system 102 with which aspects of the techniques presented herein can be implemented. The cochlear implant system 102 comprises an external component 104 that is configured to be directly or indirectly attached to the body of the user, and an intemal / implantable component 112 that is configured to be implanted in or worn on the head of the user. In the examples of FIGs. 1A-1D, the implantable component 112 is sometimes referred to as a “cochlear implant.” FIG. 1A illustrates the cochlear implant 112 implanted in the head 154 of a user, while FIG. IB is a schematic drawing of the external component 104 worn on the head 154 of the user. FIG. 1C is another schematicview of the cochlear implant system 102, while FIG. ID illustrates further details of the cochlear implant system 102. For ease of description, FIGs. 1A-1D will generally be described together.

[0028] In the examples of FIGs. 1A-1D, the external component 104 comprises a sound processing unit 106, an external coil 108, and generally, a magnet fixed relative to the external coil 108. The cochlear implant 112 includes an implantable coil 114, an implant body 134, and an elongate stimulating assembly 116 configured to be implanted in the user’s cochlea. In one example, the sound processing unit 106 is an off-the-ear (OTE) sound processing unit, sometimes referred to herein as an OTE component, which is configured to send data and power to the implantable component 112. In general, an OTE sound processing unit is a component having a generally cylindrically shaped housing 111 and which is configured to be magnetically coupled to the user’s head 154 (e.g., includes an integrated external magnet 150 configured to be magnetically coupled to an intemal / implantable magnet 152 in the implantable component 112). The OTE sound processing unit 106 also includes an integrated external (headpiece) coil 108 (the external coil 108) that is configured to be inductively coupled to the implantable coil 114.

[0029] It is to be appreciated that the OTE sound processing unit 106 is merely illustrative of the external devices that could operate with implantable component 112. For example, in alternative examples, the external component 104 may comprise a behind-the-ear (BTE) sound processing unit configured to be attached to, and worn adjacent to, the recipient’s ear. A BTE sound processing unit comprises a housing that is shaped to be worn on the outer ear of the user. In certain examples, the BTE is connected to a separate external coil assembly via a cable, where the external coil assembly is configured to be magnetically and inductively coupled to the implantable coil 114, while in other embodiments the BTE includes a coil disposed in or on the housing worn on the outer ear of the user. It is also to be appreciated that alternative external components could be located in the user’s ear canal, worn on the body, etc.

[0030] Although the cochlear implant system 102 includes the sound processing unit 106 and the cochlear implant 112, as described below, in additional or alternative embodiments, the cochlear implant 112 can operate independently from the sound processing unit 106 to stimulate the user. For example, in a first mode, the cochlear implant 112, the sound processing unit 106 captures sound signals, which are then used as the basis for delivering stimulation signals to the user. In a second mode, the cochlear implant 112 captures sound signals itself via implantable sound sensors and then uses those sound signals as the basis for deliveringstimulation signals to the user. Further details regarding operation of the cochlear implant 112 in the different modes are provided below. It is to be appreciated that reference to the modes is merely illustrative and that the cochlear implant 112 could also operate in alternative modes.

[0031] In FIGs. 1A and 1C, the cochlear implant system 102 is shown with an external device 110, configured to implement aspects of the techniques presented. The external device 110 is a computing device, such as a personal computer (e.g., laptop, desktop, tablet), a mobile phone (e.g., smartphone), remote control unit, etc. The external device 110 and the cochlear implant system 102 (e.g., sound processing unit 106 or the cochlear implant 112) wirelessly communicate via a bi-directional communication link 126. The bi-directional communication link 126 may comprise, for example, a short-range communication, such as Bluetooth link, Bluetooth Low Energy (BLE) link, a proprietary link, etc.

[0032] Returning to the example of FIGs. 1A-1D, the sound processing unit 106 of the external component 104 also comprises one or more input devices configured to capture and / or receive input signals (e.g., sound or data signals) at the sound processing unit 106. The one or more input devices include, for example, one or more sound input devices 118 (e.g., one or more external microphones, audio input ports, telecoils, etc.), one or more auxiliary input devices 128 (e.g., audio ports, such as a Direct Audio Input (DAI), data ports, such as a Universal Serial Bus (USB) port, cable port, etc.), and a short-range wireless transmitter / receiver (wireless transceiver) 120 (e.g., for communication with the external device 110), each located in, on or near the sound processing unit 106. However, it is to be appreciated that one or more input devices may include additional types of input devices and / or less input devices (e.g., the short- range wireless transceiver 120 and / or one or more auxiliary input devices 128 could be omitted).

[0033] The sound processing unit 106 also comprises the external coil 108, a charging coil 130, a closely-coupled radio frequency transmitter / receiver (RF transceiver) 122, at least one battery (e.g., rechargeable battery) 132, and an external sound processing module 124. The external sound processing module 124 can be configured to perform a number of operations which are represented in FIG. ID by a sound processor 133. The sound processor 133 can be formed by one or more processors (e.g., one or more Digital Signal Processors (DSPs), one or more uC cores, etc.), firmware, software, etc. arranged to perform operations described herein. That is, the sound processor 133 can each be implemented as firmware elements, partially or fully implemented with digital logic gates in one or more application-specific integrated circuits (ASICs), partially or fully in software, etc. Although FIG. ID illustrates the soundprocessor 133 as being implemented / performed at the external sound processing module 124, it is to be appreciated that these elements (e.g., functional operations) could also or alternatively be implemented / performed as part of the implantable sound processing module 158, as part of the external device 110, etc.

[0034] Returning to the example of FIGs. 1A-1D, the implantable component 112 comprises an implant body (main module) 134, a lead region 136, and the intra-cochlear stimulating assembly 116, all configured to be implanted under the skin (tissue) 115 of the user. The implant body 134 generally comprises a hermetically-sealed housing 138 that includes, in certain examples, at least one power source 125 (e.g., one or more batteries, one or more capacitors, etc.), in which RF interface circuitry 140 and a stimulator unit 142 are disposed. The implant body 134 also includes the intemal / implantable coil 114 that is generally external to the housing 138, but which is connected to the RF interface circuitry 140 via a hermetic feedthrough (not shown in FIG. ID).

[0035] As noted, stimulating assembly 116 is configured to be at least partially implanted in the user’s cochlea. Stimulating assembly 116 includes a plurality of longitudinally spaced intra-cochlear electrical stimulating contacts (electrodes) 144 that collectively form a contact array (electrode array) 146 for delivery of electrical stimulation (current) to the recipient’s cochlea. Stimulating assembly 116 extends through an opening in the recipient’s cochlea (e.g., cochleostomy, the round window, etc.) and has a proximal end connected to stimulator unit 142 via lead region 136 and a hermetic feedthrough (not shown in FIG. ID). Lead region 136 includes a plurality of conductors (wires) that electrically couple the electrodes 144 to the stimulator unit 142. The implantable component 112 also includes an electrode outside of the cochlea, sometimes referred to as the extra-cochlear electrode (ECE) 139.

[0036] As noted, the cochlear implant system 102 includes the external coil 108 and the implantable coil 114. The external magnet 150 is fixed relative to the external coil 108 and the intemal / implantable magnet 152 is fixed relative to the implantable coil 114. The external magnet 150 and the intemal / implantable magnet 152 fixed relative to the external coil 108 and the intemal / implantable coil 114, respectively, facilitate the operational alignment of the external coil 108 with the implantable coil 114. This operational alignment of the coils enables the external component 104 to transmit data and power to the implantable component 112 via a closely-coupled wireless link 148 formed between the external coil 108 with the implantable coil 114. In certain examples, the closely-coupled wireless link 148 is an RF link. However, various other types of energy transfer, such as infrared (IR), electromagnetic, capacitive, andinductive transfer, may be used to transfer the power and / or data from an external component to an implantable component and, as such, FIG. ID illustrates only one example arrangement.

[0037] As noted above, sound processing unit 106 includes the external sound processing module 124. The external sound processing module 124 is configured to process the received input sound signals (received at one or more of the input devices, such as sound input devices 118 and / or auxiliary input devices 128), and convert the received input sound signals into output control signals for use in stimulating a first ear of a recipient or user (i.e., the external sound processing module 124 is configured to perform sound processing on input signals received at the sound processing unit 106). Stated differently, the one or more processors (e.g., processing element(s) implementing firmware, software, etc.) in the external sound processing module 124 are configured to execute sound processing logic in memory to convert the received input sound signals into output control signals (stimulation signals) that represent electrical stimulation for delivery to the recipient.

[0038] As noted, FIG. ID illustrates an embodiment in which the external sound processing module 124 in the sound processing unit 106 generates the output control signals. In an alternative embodiment, the sound processing unit 106 can send less processed information (e.g., audio data) to the implantable component 112, and the sound processing operations (e.g., conversion of input sounds to output control signals 156) can be performed by a processor within the implantable component 112.

[0039] In FIG. ID, according to an example embodiment, output control signals (stimulation signals) are provided to the RF transceiver 122, which transcutaneously transfers the output control signals (e.g., in an encoded manner) to the implantable component 112 via external coil 108 and implantable coil 114. That is, the output control signals (stimulation signals) are received at the RF interface circuitry 140 via implantable coil 114 and provided to the stimulator unit 142. The stimulator unit 142 is configured to utilize the output control signals to generate electrical stimulation signals (e.g., current signals) for delivery to the user’s cochlea via one or more of the stimulating contacts (electrodes) 144. In this way, cochlear implant system 102 electrically stimulates the user’s auditory nerve cells, bypassing absent or defective hair cells that normally transduce acoustic vibrations into neural activity, in a manner that causes the recipient to perceive one or more components of the input signals (the received sound signals).

[0040] As detailed above, in the first mode, the cochlear implant 112 receives processed sound signals from the sound processing unit 106. However, in the second mode, the cochlear implant 112 is configured to capture and process sound signals for use in electrically stimulating the user’s auditory nerve cells. In particular, as shown in FIG. ID, an example embodiment of the cochlear implant 112 can include a plurality of sensors 165(1), 165(2) that collectively form a sensor array (sensor device) 160, as well as an implantable sound processing module 158. Similar to the external sound processing module 124, the implantable sound processing module 158 may comprise, for example, one or more processors and a memory device (memory) that includes sound processing logic. The memory device may comprise any one or more of: Non-Volatile Memory (NVM), Ferroelectric Random Access Memory (FRAM), read only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical, or other physical / tangible memory storage devices. The one or more processors are, for example, microprocessors or microcontrollers that execute instructions for the sound processing logic stored in memory device.

[0041] In the second mode, the sensors 165(1), 165(2) of the sensor array 160 are configured to detect / capture input sound signals 166 (e.g., acoustic sound signals, vibrations, etc.), which are provided to the implantable sound processing module 158. As described further below, the sensor array 160 is implanted in the pinna of the recipient. The implantable sound processing module 158 is configured to convert received input sound signals 166 (received at one or more of the sensors 165(1), 165(2)) into output control signals 156 for use in stimulating the first ear of a recipient or user (i.e., the implantable sound processing module 158 is configured to perform sound processing operations). Stated differently, the one or more processors (e.g., processing element(s) implementing firmware, software, etc.) in implantable sound processing module 158 are configured to execute sound processing logic in memory to convert the received input sound signals 166 into output control signals 156 that are provided to the stimulator unit 142. The stimulator unit 142 is configured to utilize the output control signals 156 to generate electrical stimulation signals (e.g., current signals) for delivery to the user’s cochlea, thereby bypassing the absent or defective hair cells that normally transduce acoustic vibrations into neural activity.

[0042] In the illustrated embodiment, the sensor array 160 is separate from the implant body 134. Thus, the sensor array 160 can be implemented at a different location than that of the implant body 134. By way of example, the implant body 134 may be positioned at or adjacentto an inner ear of the recipient (e.g., near or within a mastoid) to enable implantation of the stimulating assembly 116 into a cochlea. However, implantation of the sensor array 160 at or adjacent to the inner ear may not be desirable. Instead, the sensor array 160 can be positioned elsewhere and communicatively coupled to the implantable sound processing module 158, such as via a wired or wireless connection. For instance, in the embodiments disclosed herein, the sensor array 160 is implemented in a part of an outer ear or pinna of the recipient.

[0043] According to the techniques of the present disclosure, external sound processing module 124 may also include an inertial measurement unit (IMU) 170. The inertial measurement unit 170 is configured to measure the inertia of the user's head, that is, motion of the user's head. As such, IMU 170 comprises one or more sensors 175 each configured to sense one or more of rectilinear or rotatory motion in the same or different axes. Examples of sensors 175 that may be used as part of IMU 170 include accelerometers, gyroscopes, inclinometers, compasses, and the like. Such sensors may be implemented in, for example, micro electromechanical systems (MEMS) or with other technology suitable for the particular application.

[0044] As also illustrated in FIG. ID, in certain examples, a second IMU 180 including one or more sensors 185 is incorporated into implantable sound processing module 158 of implant body 134. Second IMU 180 may serve as an additional or alternative inertial measurement unit to inertial measurement unit 170 of external sound processing module 124. Like sensors 175, sensors 185 may each be configured to sense one or more of rectilinear or rotatory motion in the same or different axes. Examples of sensors 185 that may be used as part of IMU 180 include accelerometers, gyroscopes, inclinometers, compasses, and the like. Such sensors may be implemented in, for example, MEMS or with other technology suitable for the particular application. Although the IMU 180 is positioned in the implantable sound processing module 158 in the illustrated embodiment, the IMU 180 may be positioned elsewhere in the recipient, such as with the sensor array 160. For hearing devices that include an IMU, such as IMU 180, implanted in the recipient, the techniques presented herein may be implemented without an external processor. Accordingly, a hearing device that includes an implant body 134 and lacks an external component 104 may be configured to implement the techniques presented herein.

[0045] As noted, the sensor array 160 which in this example includes the sensors 165(1) and 165(2), can be implanted in a pinna of a recipient. The positioning of the sensor array 160 in the pinna can reduce capture of unwanted body noise that otherwise distorts desirable soundsignals. As noted, the use of sensors 165(1) and 165(2) is merely illustrative and other embodiments presented herein can include one sensor, or more than two sensors.

[0046] FIG. 2 is a side view of an ear 200 of a recipient 202 in which a sensor device (such as sensor array 160 of FIGs. 1A-1D), could be implanted in accordance with certain embodiments presented herein. For ease of illustration, the sensor device has been omitted from FIG. 2.

[0047] As shown in FIG. 2, the ear 200 includes a pinna or outer ear 204 in which the sensor device (e.g., a sound sensor) can be implanted. For example, the sensor device can be implanted in a concha 206 of the pinna 204. In some embodiments, the sensor device is implanted in a cymba 208 of the concha 206. In additional or alternative embodiments, the sensor device is implanted in a cavum 210 of the concha 206. In further embodiments, the sensor device is implanted in a different portion of the pinna 204, such as a lobe 212.

[0048] Implantation of the sensor device in the cymba 208 can enhance detection / capture of sound signals from certain directions through the skin of the ear 200. For instance, positioning of the sensor device in the cymba 208 increases exposure of the sensor device along a first axis 214 (e.g., a horizontal axis) extending perpendicular to a surface of the cymba 208 and / or along a second axis 216 (e.g., a vertical axis) extending perpendicular to the first axis 214 and along a coronal / frontal plane of the recipient. Implantation of the sensor device in the cavum 210 can help block certain unwanted external noise. By way of example, an antitragus 218 may cover at least a portion of the sensor device implanted in the cavum 210 to reduce exposure of the sensor device along the first axis 214 and / or along the second axis 216. Coverage of the sensor device via the antitragus 218 can block capture of certain unwanted noise, such as wind, thereby suppressing such noise prior to a processing operation. In certain embodiments, the sensor device can also be positioned at a certain location at the cymba 208 to reduce coverage of the sensor device. For example, the sensor device can be positioned more anteriorly such that a crus helix 220 and / or an inferior crus 222 partially covers the sensor device to block capture of certain unwanted noise by the sensor device.

[0049] In either location at the cymba 208 or at the cavum 210, the sensor device can sufficiently capture sound signals without usage of directional devices (e.g., directional microphones) dedicated to capturing sound signals transmitted in a specific direction and not in other directions. By way of example, implantation of the sensor device in the concha 206 enables the sensor device to leverage anatomical features of the ear 200 (e.g., the antitragus 218, the crus helix 220, the inferior crus 222) that guide sound toward the concha 206 tofacilitate receipt at the sensor device. Additionally, the surgical processes used for implanting the sensor device in either location may be similar to one another. However, in some embodiments, an embodiment or specification of the sensor device can be provided to facilitate implantation at a particular location in the ear 200. By way of example, a sensor device having a reduced thickness may be more feasibly implanted in the cavum 210 and / or at a more anterior position in the cymba 208.

[0050] In some embodiments, multiple sensor devices are implanted in the ear 200, such as separate sensor devices implanted in the cymba 208 and in the cavum 210. In additional or alternative embodiments, sensor devices can be implanted bilaterally at both ears 200 of the recipient 202, such as at the same corresponding location (e.g., at a respective cymba 208, at a respective cavum 210) or at different locations (e.g., at a cymba 208 of one ear 200, at a cavum 210 of another ear 200). The sensor devices can capture different signals based on their positionings, and the different signals can be combined for processing. For example, capture of different signals at different locations can be used to provide a beamforming technique that enhances the signal captured in a target direction. During beamforming, signals are collectively captured from different directions (e.g., via respective sensor devices dedicated to capturing signals from specific directions), and a subset of signals captured from certain directions are used as reference signals to be removed from signals captured from other directions. As an example, one of the sensor devices is configured to capture a mixture of a desired signal received from the target direction and also an unwanted signal received from another direction. Another sensor device is configured to capture the unwanted signal more clearly from the other direction. During processing, the unwanted signal captured by the other sensor device is used to process the mixture of signals to remove the unwanted signal from the mixture of signals, thereby retaining the desired signal without the unwanted signal. As a result, the recipient 202 can perceive sound more desirably (e.g., from the target direction).

[0051] FIG. 3 is a rear view of the ear 200 illustrating part of a surgical process for implanting a sensor device in the pinna 204. Again, for ease of illustration, the sensor device is not shown in FIG. 3.

[0052] In accordance with the embodiment of FIG. 3, an incision (e.g., a postauricular incision of the ear 200) is made to an area (e.g., posterior area 248) of the ear 200 to expose or reveal cartilage in the interior of the pinna 204. A cutout or opening 250 is then be formed in the exposed cartilage for positioning of the sensor device therein. In certain examples, the cutout 250 is sized to block movement of the sensor device in the cutout 250, thereby securing thesensor device to the pinna 204. The cutout 250 can be formed near the concha 206 (e.g., an anterior portion of the concha 206) at the cymba 208 and / or at the cavum 210.

[0053] FIG. 4 is a rear view of the ear 200 illustrating insertion / implantable of a sensor device 300 into the pinna 204. Specifically, a main body or diaphragm 302 of the sensor device 300 is positioned in the cutout 250, and a wall of cartilage 304 surrounding the cutout 250 can press against the main body 302 to secure the sensor device 300 in the cutout 250. In some embodiments, formation of the cutout 250 provides a cartilage flap 306, and the cartilage flap 306 can be placed over the main body 302 and provide further securement of the sensor device 300 in the cutout 250. Additionally, the illustrated sensor device 300 includes wires 308 extending from the main body 302. The wires 308 extend out of the cutout 250 in which the main body 302 is positioned, such as for routing to connect to the implantable sound processing module 158 positioned away from the pinna 204 (e.g., in the mastoid).

[0054] In certain embodiments, the sensor device 300 (e.g., a microphone device) is configured to receive acoustic waves (e.g., sound signals) through the skin of the ear 200. In additional or alternative embodiments, the sensor device 300 (e.g., a piezoelectric sensor, an accelerometer, or other movement sensor) is configured to detect movement representing sound signals. In such embodiments, the main body 302 can be flexible to increase sensitivity to movement for increased detection capabilities. In any of these embodiments, the sensor device 300 implanted in the pinna 204 may be less susceptible to receiving unwanted noise, such as body noise, to enable the recipient 202 to perceive desirable sound. Moreover, positioning of the sensor device 300 away from other implantable electrical components (e.g., an electrode of the stimulating assembly 116 near the inner ear) can reduce electrical interference that otherwise can occur as a result of close proximity of the sensor device 300 to the other implantable electrical components. Further still, the cartilage 304 and other tissue of the pinna 204 can insulate the sensor device 300 and block potentially interfering electrical activity. Thus, operation of the sensor device 300 can further be improved via implantation in the pinna 204.

[0055] FIG. 5 is a schematic diagram of a sensor device 400 implanted in the pinna 204 of the ear 200, such as within the cutout 250. Thus, the sensor device 400 is positioned within the cartilage 304 between front ear tissue 350 (e.g., skin) and rear ear tissue 352 (e.g., skin). Although the cartilage flap 306 covers the sensor device 400 in the illustrated embodiment, at the rear side, in additional or alternative embodiments, the cartilage flap 306 may be removed. In such embodiments, the rear ear tissue 352 can directly contact and cover the sensor device 400. Moreover, in certain embodiments, at least a portion of the cartilage 304 can be positionedbetween the sensor device 400 and the front ear tissue 350 (e.g., in contact with the sensor device 400 near the front of the ear 200).

[0056] The illustrated sensor device 400 includes a main body 402, a wire 408 extending from the main body 402, and a flange 410 extending from the main body 402. The wire 408 extends out of the cutout 250, such as through an opening 412 between the cartilage 304 and the cartilage flap 306 for routing ofthe wire 408. However, in alternative embodiments, the sensor device 400 may not include the wire 408 and, instead, is communicatively coupled to another component via a wireless connection. By way of example, an RF coil 413 configured to receive / transmit RF signals (e.g., power signals, communication signals) is disposed in the main body 402, and the main body 402 is RF transparent to enable RF signals into and out of the main body 402, thereby enabling the RF coil 413 to communicate via the RF signals.

[0057] Additionally, the flange 410 extends beyond (e.g., laterally beyond, radially beyond) the main body 402 to abut the cartilage 304 while the sensor device 400 is positioned in the cutout 250. For instance, the flange 410 engages with the cartilage 304 to provide an interference fit that secures the sensor device 400 within the cutout 250. Thus, the flange 410 is manufactured (e.g., to extend a particular distance beyond the main body 402) based on a specification of the cartilage 304, such as a thickness, to enable desirable securement of the sensor device 400 in the cutout 250. In some embodiments, overgrowth of tissue of the ear 200 is stimulated (e.g., using a particular scaffold) for further securement of the sensor device 400 in the cutout 250. As an example, the overgrowth of tissue can cause the cartilage 304 to grow and push against the flange 410, thereby increasing contact with and capture of the sensor device 400 within the cartilage 304.

[0058] The sensor device 400 includes a sensor 414 positioned on or in the main body 402. The sensor 414 is configured to capture signals, such as sound signals and / or movement signals, to be processed (e.g., by outputting the captured signals to the implantable sound processing module 158 via the wires 408). In certain embodiments, a single sensor 414 is implemented in the sensor device 400. As an example, because the sensor 414 may not capture significant amounts of body noise, an additional sensor (e.g., a vibration sensor) that otherwise operates to capture body noise to provide reference noise signals to be removed from captured sound signals may not be needed to process the captured sound signals for desirable sound output. Thus, a cost associated with manufacture of the sensor device 400 can be reduced. Additionally, a total physical footprint of components to be implanted in the recipient can be reduced to facilitate an implantation process.

[0059] FIG. 6 is a schematic diagram of a sensor device 500 implanted in the pinna 204 of the ear 200, such as in the cutout 250 to be positioned within the cartilage 304 between the front ear tissue 350 and the rear ear tissue 352. The sensor device 500 includes a main body 502 and a sensor 514 positioned on or in the main body 502. Additionally, fasteners 516 (e.g., screws, bolts, clips, an adhesive) are used to secure the sensor device 500 in the cutout 250. As an example, the fasteners 516 are inserted through the cartilage flap 306 (e.g., at the rear ear tissue 352) and into the main body 502 to compress the cartilage flap 306 and the main body 502 against one another, thereby securing the main body 502 to the cartilage flap 306 within the cutout 250. As another example, the fasteners 516 are inserted through the cartilage 304, such as at the front ear tissue 350 and / or between the front ear tissue 350 and the rear ear tissue 352, to compress the main body 502 and the cartilage 304 against one another. Indeed, fasteners can be inserted through the cartilage 304 and / or through the cartilage flap 306 at opposite sides of the sensor device 500 to provide sufficient securement of the sensor device 500 in the cutout 250.

[0060] FIG. 7 is a schematic diagram of a sensor device 600 implanted in the pinna 204 of the ear 200, such as in the cutout 250. The sensor device 600 includes a main body 602 and a sensor 614 positioned on or in the main body 602. Moreover, the main body 602 includes a ring 616 extending from the main body 602. The ring 616 provides an opening 618 that can help secure the sensor device 600 in the cutout 250. By way of example, a suture 620 can be inserted through the opening 618 and looped about the ear 200 (e.g., through the cartilage 304, through the cartilage flap 306, through the front ear tissue 350, through the rear ear tissue 352) to secure the sensor device 600 in the ear 200 (e.g., to secure the main body 602 to the cartilage 304). In additional or alternative embodiments, a hole is formed through the main body 602, and the suture 620 is looped through the hole of the main body 602 to secure the sensor device 600 in the cutout 250.

[0061] FIG. 8 is a schematic diagram of a sensor device 700 implanted in the pinna 204 of the ear 200, such as in the cutout 250. The sensor device 700 includes a main body 702 with a recess 704 (e.g., an annular recess). Positioning of the sensor device 700 in the cutout 250 can cause parts of the cartilage 304 surrounding the cutout 250 to extend into the recess 704 to mate with the recess 704. Extension of the cartilage 304 into the recess 704 provides an interference fit between the main body 702 and the cartilage 304 to block movement of the sensor device 700 relative to the cartilage 304, thereby securing the sensor device 700 to the cartilage 304 within the cutout 250. In such embodiments, overgrowth of tissue of the ear 200 can also bestimulated to increase extension of the cartilage 304 into the recess 704 (e.g., increase pressing of the cartilage 304 against the main body 702), thereby increasing securement of the sensor device 700 in the cutout 250.

[0062] Although the discussed embodiments are primarily directed to implanting a sensor device in the concha 206 of the ear 200, in additional or alternative embodiments, the sensor device can be implanted in a different part of the pinna 204, such as using a different technique. For example, a sensor device can be implanted in the lobe 212, such as within a hole formed through the lobe 212 (e.g., the sensor device can fit into the hole similar to an ear-piercing or an ear stretcher). Positioning of the sensor device at such a location can enable the sensor device to capture sound signals through the skin of the ear 200 while limiting capture of body noise. In some embodiments, the sensor device implanted in the lobe 212 supplements another sensor device implanted in the concha 206 to help with beamforming. In further embodiments, the sensor device can be applied externally to the ear 200, such as using an adhesive (e.g., a sticker). In any of such embodiments, the sensor device can communicate wirelessly to avoid having to route wires through the recipient, thereby facilitating ease of implementation of the sensor device.

[0063] FIG. 9 shows a graph 750 illustrating acoustic sensitivity (in decibel equivalent sound pressure level) of sensor devices implanted at different locations in a recipient. A first line 752 depicts acoustic sensitivity at different frequencies of a first sensor device implanted in a cymba of a recipient, a second line 754 depicts acoustic sensitivity at different frequencies of a second sensor device implanted in a cavum of a recipient, and a third line 756 depicts acoustic sensitivity at different frequencies of a third sensor device implanted in skin separate from a pinna of an ear, such as in skin covering a skull of a recipient. As shown in the graph 750, the first line 752, the second line 754, and the third line 756 are generally fairly similar to one another, especially for relatively lower frequencies. In other words, the first sensor device, the second sensor device, and the third sensor device have similar acoustic sensitivities and therefore have similar capabilities of capturing sound signals (e.g., an acoustic wave, movement) representing sound. Thus, a sensor device implanted in a pinna operates desirably to capture sound signals.

[0064] FIG. 10 shows a graph 800 illustrating vibrational sensitivity of sensor devices implanted at different locations in a recipient. The vibrational sensitivity indicates susceptibility to capture body noise. A first line 802 depicts vibrational sensitivity at different frequencies of a first sensor device implanted in a cymba of a recipient, a second line 804depicts vibrational sensitivity at different frequencies of a second device implanted in a cavum of a recipient, and a third line 806 depicts vibrational sensitivity at different frequencies of a third sensor device implanted in skin separate from a pinna of an ear. As shown in the graph 800, each of the first line 802 and the second line 804 are significantly lower than the third line 806, especially for relatively higher frequencies. In other words, the first sensor device and the second sensor device are less susceptible to capturing body noise as compared to the third sensor device. Thus, the sound signals captured by the first sensor device and by the second sensor device may not be as distorted as compared to the sound signals captured by the third sensor device. Therefore, the integrity of sound signals captured by the first sensor device and by the second sensor device may be greater than that of sound signals captured by the third sensor device. That is, the first sensor device and the second sensor device, each of which is implanted in a pinna of an ear, has similar acoustic sensitivities relative to that of the third sensor device, but has significantly lower vibrational sensitivities relative to that of the third sensor device. Thus, implantation of a sensor device in a pinna of an ear can reduce capture of body noise without reducing capture of sound signals. For this reason, operation of such a sensor device can improve processing of sound signals to enable a recipient to perceive sound more desirably.

[0065] Each of FIGs. 11 and 12 discussed below illustrates a respective method related to a sensor device, such as any of the sensor devices 300, 400, 500, 600, 700 discussed herein. As an example, an operation of any of the methods can be performed using a memory and processor. It should be noted that the methods can be performed differently than depicted. For example, an additional operation can be performed, and / or any of the depicted operations can be performed differently, performed in a different order, or not performed. Moreover, the respective operations of the methods can be performed in different manners relative to one another, such as in response to one another and / or in parallel with one another.

[0066] FIG. 11 is a flowchart of a method 850 for implanting a sensor device in a pinna of an ear of a recipient. At block 852, an incision (e.g., postauricular incision) of an ear is made to expose or reveal tissue (e.g., subcutaneous tissue) within a pinna of the ear. For example, a postauricular incision exposes tissue within the eminence of concha, such as underneath the cymba and / or the cavum.

[0067] At block 854, an incision is made in the tissue to create a cutout or opening in cartilage within the pinna. To this end, the incision cuts through perichondrium and postauricular muscle covering the cartilage. The incision is made such that the cutout is positioned adjacentto skin of the concha, such as at an anterior portion near the cymba and / or near the cavum. In some embodiments, the cutout provides a cartilage flap that remains attached after the cutout is formed. In other words, the cartilage that has been incised to create the cutout is not removed. In additional or alternative embodiments, the cartilage that has been incised is removed to avoid providing a cartilage flap.

[0068] At block 856, a main body of a sensor device is positioned in the cutout. In certain embodiments, the main body includes a feature to help securement within the cutout. As an example, the main body includes a flange that abuts a wall of the cartilage surrounding the cutout to enable the cartilage to capture the main body via an interference fit. As another example, the main body includes a recess in which the cartilage may extend to mate with and capture the main body via an interference fit. In some implementations, overgrowth of the cartilage or other tissue is stimulated to increase a force imparted onto the main body to increase securement of the main body in the cutout. Additionally or alternatively, a supplemental component is used to secure the main body in the cutout. For instance, a fastener is inserted through the tissue (e.g., the cartilage) and into the main body to couple the main body to the tissue. A suture can also be inserted through the sensor device (e.g., through a ring extending from the main body) and looped through the tissue to sew the sensor device in securement with the tissue. Further still, an adhesive can be applied to the sensor device. By way of example, the main body can be sticker that adheres to the cartilage. For any of these techniques, movement of the sensor device relative to the cartilage is restricted to secure the sensor device in the cutout.

[0069] For a sensor device that includes wires for connecting to another component, additional cuts can be made to the ear, such as at the middle ear and / or at the inner ear, to enable routing of the wires. The wires can then extend out of the cutout, but remain hidden under the tissue (e.g., near muscle). For a sensor device that is configured to wirelessly connect to another component, no additional cuts may be made. In either configuration of the sensor device, the sensor device implanted in the pinna is configured to communicate with another component positioned away from the sensor device. By way of example, the sensor device is configured to communicate with an implantable sound processing module positioned within a mastoid of the recipient.

[0070] At block 858, the ear is rejoined (e.g., sutured) to cover the sensor device. That is, the tissue is folded back to capture the sensor device, and skin of the ear is rejoined to cover the sensor device. Thus, the postauricular incision is closed to cover the sensor device. Inembodiments in which a cartilage flap is provided, the cartilage flap is positioned over the sensor device (e.g., the main body) to further secure the sensor device in the cutout.

[0071] Although the method 850 depicts implantation of a single sensor device in the ear, similar techniques can be performed to implant multiple sensor devices in the ear, such as for beamforming. For example, an incision or multiple incisions is made to create multiple cutouts, and a respective sensor device is positioned in each cutout before the ear is rejoined to cover the sensor devices. Thus, a single surgical process can be performed to implant multiple sensor devices in the ear.

[0072] It should be noted that the operations of the method 850 are relatively less invasive, such as in comparison to a method in which a sensor device is positioned in the inner ear. Indeed, the postauricular incision and the incision in the tissue of the ear are relatively superficial. Thus, the complexity and difficulty of performing the method 850 are limited. Moreover, there may be limited visibility of scar tissue or other indications of surgical procedures after performing the method 850. For example, the postauricular incision is made at a location of the ear that is covered upon rejoining the ear. Additionally, a visible, external shape of the pinna is not significantly modified using the method 850. Therefore, the aesthetic of the ear is generally preserved after completion of the method 850.

[0073] FIG. 12 is a flowchart of a method 900 for operating a sensor device implanted in a pinna of an ear of a recipient. At block 902, sound signals are detected by a sensor device through skin of the pinna. In some embodiments, the sound signals are detected by receipt of acoustic waves (e.g., for a microphone). In additional or alternative embodiments, the sound signals are detected via movement (e.g., for a movement sensor).

[0074] At block 904, the sound signals are processed, such as at an implantable sound processing module using signals representing the sound signals received from the sensor device, without a body noise reference signal to generate output signals. In particular, the sensor device implanted in the pinna is less susceptible to capturing body noise. Thus, the sound signals captured by the sensor device likely includes limited amounts of body noise signals. For this reason, the sound signals do not have to be processed using a body noise reference signal to remove body noise signals from the captured sound signals. In other words, the sound signals captured by the sensor device implanted in the pinna have desirable integrity to be directly processed to generate the output signals.

[0075] At block 906, the output signals are provided to enable a recipient to perceive sound. In some embodiments, the output signals include an amplified sound signal that the recipient is able to perceive, such as for a hearing aid configuration. In additional or alternative embodiments, the output signal includes a stimulation signal that electrically stimulates the cochlea of the recipient to enable the recipient to hear, such as for a cochlear implant configuration. In either embodiment, the output signals correspond to the sound signals detected by the sensor device to enable the recipient to perceive the sound signals.

[0076] Because the method 900 is performed without usage of a body noise reference signal, desirable output signals can be provided without implementation of a supplemental sensor dedicated to providing a body noise reference signal (e.g., based on capture of a vibration signal conducted through the body of the recipient). Thus, a cost and / or a difficult associated with implantation of components can be reduced to enable the recipient to perceive sound. However, although a sensor device dedicated to providing a body noise reference signal may not be implemented, an additional sensor device configured to detect sound signals can be implemented to increase desirable processing of sound signals. For example, the additional sensor device can be used to enable a beamforming technique that enhances sound signals captured from a target direction.

[0077] As should be appreciated, while particular uses of the technology have been illustrated and discussed above, the disclosed technology can be used with a variety of devices in accordance with many examples of the technology. The above discussion is not meant to suggest that the disclosed technology is only suitable for implementation within systems akin to that illustrated in the figures. In general, additional configurations can be used to practice the processes and systems herein and / or some aspects described can be excluded without departing from the processes and systems disclosed herein.

[0078] This disclosure described some aspects of the present technology with reference to the accompanying drawings, in which only some of the possible aspects were shown. Other aspects can, however, be embodied in many different forms and should not be construed as limited to the aspects set forth herein. Rather, these aspects were provided so that this disclosure was thorough and complete and fully conveyed the scope of the possible aspects to those skilled in the art.

[0079] As should be appreciated, the various aspects (e.g., portions, components, etc.) described with respect to the figures herein are not intended to limit the systems and processesto the particular aspects described. Accordingly, additional configurations can be used to practice the methods and systems herein and / or some aspects described can be excluded without departing from the methods and systems disclosed herein.

[0080] According to certain aspects, systems and non-transitory computer readable storage media are provided. The systems are configured with hardware configured to execute operations analogous to the methods of the present disclosure. The one or more non-transitory computer readable storage media comprise instructions that, when executed by one or more processors, cause the one or more processors to execute operations analogous to the methods of the present disclosure.

[0081] Similarly, where steps of a process are disclosed, those steps are described for purposes of illustrating the present methods and systems and are not intended to limit the disclosure to a particular sequence of steps. For example, the steps can be performed in differing order, two or more steps can be performed concurrently, additional steps can be performed, and disclosed steps can be excluded without departing from the present disclosure. Further, the disclosed processes can be repeated.

[0082] Although specific aspects were described herein, the scope of the technology is not limited to those specific aspects. One skilled in the art will recognize other aspects or improvements that are within the scope of the present technology. Therefore, the specific structure, acts, or media are disclosed only as illustrative aspects. The scope of the technology is defined by the following claims and any equivalents therein.

[0083] It is also to be appreciated that the embodiments presented herein are not mutually exclusive and that the various embodiments may be combined with another in any of a number of different manners.

Claims

CLAIMSWhat is claimed is:

1. A method, comprising: making an incision of an ear of a recipient to reveal cartilage in a pinna of the ear; forming a cutout in the cartilage; and positioning a diaphragm of a microphone device in the cutout to implant the microphone device in the pinna.

2. The method of claim 1, wherein making an incision of an ear of a recipient to reveal cartilage in a pinna of the ear comprises: making a postauricular incision of the ear of the recipient to reveal cartilage in the pinna of the ear.

3. The method of claims 1, further comprising: closing the incision to cover the microphone device.

4. The method of claim 1, wherein forming the cutout in the cartilage provides a flap of the cartilage, and wherein the method comprises: after positioning the diaphragm of the microphone device in the cutout, placing the flap of the cartilage over the microphone device.

5. The method of claim 1, 2, 3, or 4, wherein making the incision in the cartilage comprises: forming the cutout at a concha of the ear.

6. The method of claim 5, wherein forming the cutout at the concha of the ear comprises: forming the cutout at a cymba of the concha.

7. The method of claim 5, wherein forming the cutout at the concha of the ear comprises: forming the cutout at a cavum of the concha.

8. The method of claim 1, 2, 3, or 4, wherein the microphone device comprises a flange, and wherein positioning the diaphragm of the microphone device in the cutout comprises:abutting the flange against a wall of the cartilage surrounding the cutout to provide an interference fit between the diaphragm of the microphone device and the wall.

9. The method of claim 1, 2, 3, or 4, wherein the diaphragm of the microphone device comprises an annular recess, and wherein positioning the diaphragm of the microphone device in the cutout comprises: mating cartilage surrounding the cutout with the annular recess to provide an interference fit between the diaphragm of the microphone device and the cartilage.

10. An implantable medical device, comprising: a sensor device comprising a sound sensor configured to be implanted in a concha of an ear of a recipient to detect sound signals through skin of the concha; and a sound processing module configured to: receive signals from the sound sensor, wherein the signals represent the sound signals; process the signals without a body noise reference signal to generate output signals; and output the output signals to the recipient.

11. The implantable medical device of claim 10, wherein the sound processing module is configured to be implanted in or on a mastoid of the recipient.

12. The implantable medical device of claim 10, wherein the sound sensor of the sensor device comprises a microphone.

13. The implantable medical device of claim 10, wherein the sound sensor of the sensor device comprises a movement sensor.

14. The implantable medical device of claim 10, 11, 12, or 13, wherein the sound processing module is configured to receive the signals from the sound sensor of the sensor device via a wire communicatively coupling the sensor device and the sound processing module to one another.

15. The implantable medical device of claim 10, 11, 12, or 13, wherein the sound processing module is configured to wirelessly receive the signals from the sound sensor of the sensor device.

16. The implantable medical device of claim 10, 11, 12, or 13, wherein the sensor device comprises a flange configured to abut against cartilage within the ear to provide an interference fit between the sensor device and the cartilage.

17. The implantable medical device of claim 10, 11, 12, or 13, wherein the sensor device comprises a recess configured to mate with cartilage within the ear to provide an interference fit between the sensor device and the cartilage.

18. The implantable medical device of claim 10, 11, 12, or 13, comprising a fastener configured to couple the sensor device to cartilage within the ear.

19. The implantable medical device of claim 10, 11, 12, or 13, wherein the sensor device comprises an opening, and wherein the implantable medical device comprises a suture extending through the opening and through cartilage within the ear to couple the sensor device to the cartilage.

20. The implantable medical device of claim 10, 11, 12, or 13, comprising an additional sensor device comprising an additional sound sensor configured to detect additional sound signals, wherein the sound processing module is configured to: receive additional signals from the additional sound sensor, wherein the additional signals represent the additional sound signals; and process the signals received from the sound sensor by removing the additional signals from the signals to generate the output signals.

21. The implantable medical device of claim 20, wherein the signals detected by the sound sensor are received from a first direction, and wherein the additional signals detected by the additional sound sensor are captured from a second direction, different from the first direction.

22. A method, comprising:opening an incision at a posterior area of an ear of a recipient to expose cartilage in a pinna of the ear; removing a portion of the cartilage to form an opening adjacent to skin at an anterior portion of a concha of the pinna; and positioning a sound sensor in the opening adjacent to the skin at the anterior portion of the concha.

23. The method of claim 22, wherein the anterior portion of the concha comprises a cavum or a cymba.

24. The method of claim 22, comprising inserting a fastener through the cartilage and the sound sensor to couple the sound sensor to the cartilage.

25. The method of claim 22, comprising extending a suture through the cartilage and an opening formed in the sound sensor to couple the sound sensor to the cartilage.

26. The method of claim 22, 23, 24, or 25, comprising implanting a sound processing module within the recipient and communicatively coupling the sound sensor and the sound processing module to one another.

27. The method of claim 26, comprising implanting the sound processing module at an inner ear of the recipient.

28. The method of claim 26, comprising communicatively coupling the sound sensor and the sound processing module to one another using a wire.

29. The method of claim 28, comprising: forming a cut through the ear; and routing the wire through the cut to connect the wire to the sound processing module and the sound sensor.

30. The method of claim 22, 23, 24, or 25, comprising stimulating overgrowth of the ear to cause the cartilage to capture the sound sensor via an interference fit.

31. The method of claim 22, 23, 24, or 25, comprising positioning an additional sound sensor at a lobe of the ear.

32. The method of claim 31, comprising: forming an additional opening through the lobe; and inserting the additional sound sensor through the additional opening to position the additional sound sensor at the lobe.

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