Display device and display system

The display device uses a light-blocking layer and aligned reflective openings with a thin transparent substrate to enhance image quality and brightness, addressing light crosstalk issues in dual-function displays.

WO2025159396A1PCT designated stage Publication Date: 2025-07-31SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2025/000252
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-01-24
Filing Date
2025-01-06
Publication Date
2025-07-31

AI Technical Summary

Technical Problem

Display devices incorporating both display and mirror functions face challenges in achieving high display luminance and reflectance while minimizing light crosstalk and image quality deterioration due to the use of compact, high-brightness light-emitting elements like micro LEDs, where light emitted from one element can leak into unintended openings.

Method used

The display device employs a light-blocking layer to absorb light emitted from light-emitting elements, a reflective layer with openings aligned with the elements, and a thin transparent substrate to prevent light from reaching unintended openings, ensuring high-quality image display with high brightness and reflectivity.

Benefits of technology

The solution enables high-quality image display with improved brightness and reflectivity by preventing light crosstalk, maintaining image integrity, and allowing for flexible display system configurations.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a display device capable of displaying a high-quality image while using small-sized and high-brightness light-emitting elements. According to an embodiment of the present disclosure, the display device includes: a plurality of light-emitting elements which are disposed to be spaced apart from each other on a circuit board and which emit light forward; a reflective layer, which is formed on a transparent substrate facing the circuit board, includes openings formed at positions corresponding to the light-emitting elements, causes the light emitted from the light-emitting elements to pass through the opening and be emitted forward, and reflects the light from the front; and a light-blocking layer which is formed between the circuit board and the transparent substrate, and which absorbs some of the light emitted from the light-emitting elements so that the light emitted from the light-emitting elements does not reach the openings disposed at positions not corresponding to the light-emitting elements.
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Description

Display devices and display systems

[0001] The present invention relates to a display device and a display system.

[0002] Mirror displays are known that include both a mirror function that reflects and illuminates surrounding objects.

[0003] A mirror display may be disclosed as an organic light-emitting display device having a first substrate having a plurality of organic light-emitting elements, and a second substrate having a reflective layer in which a plurality of openings are formed at positions corresponding to the plurality of organic light-emitting elements. The organic light-emitting display device can realize a mirror function by having the reflective layer reflect light, and can realize a display function by emitting light emitted from the organic light-emitting elements to the outside through the openings. In addition, a mirror function with a high reflectivity can be realized by the reflective layer, and a display function with a high display brightness can be realized without losing light by the openings.

[0004] Display devices that incorporate both display and mirror functions may require higher display luminance and higher reflectance. Accordingly, the application of compact, high-brightness light-emitting elements such as micro LEDs (Light Emitting Diodes) has recently been considered. Because micro LEDs are inorganic LEDs, they can achieve high display luminance, and their small chip size allows for minimizing the aperture of the reflective layer, thereby achieving high reflectance. Multiple micro LEDs constituting each pixel of the display device can be arranged close to each other.

[0005] However, if the distance between adjacent micro LEDs is close, light emitted from a specific micro LED may be emitted to the outside from an aperture other than the corresponding aperture, causing deterioration of the image quality of the displayed image.

[0006] The present invention has been made in consideration of the above problems. Accordingly, an object of the present invention is to provide a display device having both a display function and a mirror function, capable of displaying high-quality images even when using a small, high-brightness light-emitting element to realize higher display brightness and higher reflectivity.

[0007] In addition, another object of the present invention is to provide a display system having a plurality of the above display devices.

[0008] The above object of the present invention is achieved by the following means.

[0009] According to one aspect of the present disclosure, a display device may be a display device including a plurality of light-emitting elements arranged on a circuit board at regular intervals in a first direction and configured to respectively emit light forward, a reflective layer formed on a transparent substrate facing the circuit board, the reflective layer including an opening formed at a position corresponding to the light-emitting element, the reflective layer configured such that light emitted from the light-emitting element passes through the opening and is emitted forward, and the light-shielding layer formed between the circuit board and the transparent substrate and absorbs a portion of the light emitted from the light-emitting element so that the light emitted from the light-emitting element does not reach an opening arranged at a position not corresponding to the light-emitting element.

[0010] According to one embodiment of the present disclosure, the display device may be a display device in which the light-blocking layer is formed in an area other than an area in which the light-emitting element is installed on the circuit board.

[0011] According to one embodiment of the present disclosure, the display device may be a display device in which the light-blocking layer is configured to cover a side surface of the light-emitting element and absorbs light emitted from the side surface of the light-emitting element.

[0012] According to one embodiment of the present disclosure, the display device may be a display device, wherein the reflective layer further includes a second light-blocking layer formed on a surface facing the light-blocking layer.

[0013] According to one embodiment of the present disclosure, the display device may further include a transparent adhesive layer formed between the circuit board and the transparent substrate, and bonding the circuit board and the transparent substrate.

[0014] According to one embodiment of the present disclosure, the display device may be a display device, wherein the plurality of light-emitting elements include a blue light-emitting element that emits blue light, a green light-emitting element that emits green light, and a red light-emitting element that emits red light.

[0015] According to one embodiment of the present disclosure, the display device may be a display device in which the plurality of light-emitting elements are light-emitting elements that emit light of a specific wavelength, and the display device further includes a color conversion layer that converts the light of the specific wavelength into light of a different wavelength and emits it.

[0016] According to one embodiment of the present disclosure, the display device may be a display device in which the color conversion layer is formed in the opening.

[0017] According to one embodiment of the present disclosure, the display device may be a display device in which the transparent substrate is configured to have a thickness less than a preset thickness so as to prevent light emitted from the light-emitting element from reaching both ends of the transparent substrate in the direction in which the transparent substrate is extended.

[0018] According to one embodiment of the present disclosure, the display device may be a display device in which the light-emitting element is configured to overlap the opening when viewed from above.

[0019] According to one embodiment of the present disclosure, the display device may be a display device in which the light-emitting element is a micro LED.

[0020] According to one embodiment of the present disclosure, the display device may be a display device in which, when viewed from above, the transparent substrate is larger than the circuit board, and a plurality of the circuit boards are bonded to the transparent substrate.

[0021] According to one embodiment of the present disclosure, there may be provided a display system having a plurality of display devices, wherein the plurality of display devices each having the transparent substrate and the circuit board of the same size are arranged in a tile shape.

[0022] According to the display device of the present invention, high-quality images can be displayed even when small and high-brightness light-emitting elements are used to provide higher display brightness and higher reflectivity.

[0023] In addition, according to the display system of the present invention, the degree of freedom of the shape of the display plane can be improved.

[0024] FIG. 1 is a plan view schematically showing the configuration of a display device according to a first embodiment of the present invention.

[0025] Figure 2 is a cross-sectional view taken along line II-II' of Figure 1.

[0026] Figure 3a is a diagram showing the path of light in a display device.

[0027] Figure 3b is a drawing showing the path of light in a general display device as a comparative example.

[0028] Figure 4a is a diagram showing the path of light when the transparent substrate is thin.

[0029] Figure 4b is a diagram showing the path of light when the transparent substrate is thick.

[0030] Figure 5a is a drawing explaining a method for manufacturing a display device.

[0031] Figure 5b is a drawing subsequent to Figure 5a.

[0032] Figure 5c is a drawing subsequent to Figure 5b.

[0033] Figure 5d is a drawing subsequent to Figure 5c.

[0034] Figure 5e is a drawing subsequent to Figure 5d.

[0035] Figure 5f is a drawing subsequent to Figure 5e.

[0036] Fig. 6 is a cross-sectional view showing a schematic configuration of a display device according to a modified example.

[0037] Fig. 7 is a cross-sectional view showing a schematic configuration of a display device according to the second embodiment.

[0038] Fig. 8 is a drawing showing a schematic configuration of a display device according to the third embodiment.

[0039] Figure 9 is a drawing showing a schematic configuration of the display system.

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, like reference numerals designate like components, and the sizes of each component in the drawings may be exaggerated for clarity and convenience. The embodiments described below are merely exemplary, and various modifications are possible from these embodiments.

[0041] Hereinafter, the terms "upper" or "upper" may include not only things directly above in contact, but also things above in non-contact. Similarly, the terms "lower" or "lower" may include not only things directly below in contact, but also things below in non-contact.

[0042] Singular expressions include plural expressions unless the context clearly indicates otherwise. Furthermore, when a particular part is referred to as "comprises," "includes," or "has" a particular element, this does not exclude other elements, but rather implies the inclusion of other elements, unless otherwise specifically stated.

[0043] Unless the order of steps in a method is explicitly stated or otherwise stated to the contrary, the steps are performed in the appropriate order. The order in which the steps are described is not necessarily limited. Any use of examples or exemplary terms is solely for the purpose of illustrating technical concepts and is not intended to limit the scope of the invention unless otherwise defined by the claims.

[0044] (Example 1)

[0045] Hereinafter, a display device (100) according to a first embodiment of the present disclosure will be described with reference to FIGS. 1 to 5. The display device (100) according to the present embodiment is a mirror display having both a display function for emitting light to display a desired image and a mirror function for reflecting light to illuminate surrounding objects.

[0046] Fig. 1 is a plan view schematically showing the configuration of a display device (100) according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II-II' of Fig. 1.

[0047] As shown in FIGS. 1 and 2, the display device (100) of the present disclosure may include a display substrate (110) in which a plurality of light-emitting elements (112G, 112B, 112R) (hereinafter, also collectively referred to as “light-emitting elements (112)”) are arranged in an array shape, and a reflective substrate (120) in which a plurality of openings (122H) are formed to expose the plurality of light-emitting elements (112G, 112B, 112R) to the outside. The display substrate (110) and the reflective substrate (120) may be bonded to each other via a transparent adhesive layer (130).

[0048] <Display board (110)>

[0049] The display substrate (110) may be configured by mounting a plurality of light-emitting elements (112) on a circuit board (111). In addition, a light-blocking layer (113) may be formed in an area other than the area where the light-emitting elements (112) are placed on the circuit board (111) to absorb a portion of the light emitted from the light-emitting elements (112).

[0050] The circuit board (111) may be a TFT board on which a thin film transistor (TFT), a wiring layer, etc. (not shown) for controlling the operation of a plurality of light-emitting elements (112) are formed.

[0051] The light-emitting element (112) includes a blue light-emitting element (112B) that emits blue light, a green light-emitting element (112G) that emits green light, and a red light-emitting element (112R) that emits red light, and can display a color image. The light-emitting elements (112B, 112G, 112R) may be micro LEDs having a chip size of 100 μm or less. Three light-emitting elements (112B, 112G, 112R) adjacent to each other may constitute one pixel. The three light-emitting elements (112B, 112G, 112R) may be arranged adjacent to each other at a spacing smaller than the pixel size and pixel pitch.

[0052] The light-shielding layer (113) may be composed of a black anisotropic conducting film (ACF). The light-shielding layer (113) may mechanically and electrically connect the circuit board (111) and the light-emitting element (112), while absorbing light emitted from the light-emitting element (112). The light-emitting element (112) may be formed to be embedded in the light-shielding layer (113), and the light-shielding layer (113) may be configured to cover a side surface of the light-emitting element (112).

[0053] <Reflective substrate (120)>

[0054] The reflective substrate (120) may include a transparent substrate (121) and a reflective layer (122). In addition, the reflective layer (122) may be formed on one surface of the transparent substrate (121). The transparent substrate (121) may be a transparent glass substrate, and the reflective layer (122) may be formed of an alloy of aluminum and niobium. The reflective layer (122) may function as a mirror surface that reflects light from the front of the display device (100) to illuminate surrounding objects. Meanwhile, a plurality of openings (122H) may be formed in the reflective layer (122) at positions corresponding to the light-emitting elements (112), and the openings (122H) may be configured to emit light emitted from the light-emitting elements (112) forward. The opening (122H) may have a rectangular shape, and when viewed from above, the size of the opening (122H) may be configured to be slightly larger than the chip size of the light-emitting element (112). In addition, when viewed from above, the light-emitting element (112) may be configured to overlap the opening (122H).

[0055] Additionally, a thin glass substrate having a thickness of about 100 μm can be used as the transparent substrate (121). A detailed description of the thickness of the transparent substrate (121) will be described later.

[0056] <Transparent adhesive layer (130)>

[0057] A transparent adhesive layer (130) is disposed between a display substrate (110) and a reflective substrate (120), and can bond the display substrate (110) and the reflective substrate (120) to each other. The transparent adhesive layer (130) may be an optical clear resin (OCR: Optical Clear) Resin.

[0058] According to the display device (100) of the present disclosure configured as described above, light emitted from a light-emitting element (112) is emitted forward through an opening (122H), thereby providing a display function for displaying a desired image. Meanwhile, light incident from the front is reflected by a reflective layer (122) of a reflective substrate (120), thereby realizing a mirror function for illuminating surrounding objects.

[0059] More specifically, since the high-brightness light emitted from the light-emitting element (112) is emitted to the outside through the opening (122H), there is no attenuation of the light, and a display function with high display brightness can be provided. Meanwhile, by using a small light-emitting element (112), the size of the opening (122H) is minimized, and the area of ​​the reflective layer (122) is maximized, so that a mirror function with high reflectivity can be provided. In addition, since a light-blocking layer (113) that absorbs a portion of the light emitted from the light-emitting element (112) is formed, a portion of the light emitted from the light-emitting element (112) is prevented from being emitted forward through an opening (122H) other than the corresponding opening (122H), so that the image quality of the displayed image can be improved.

[0060] In addition, the area ratio of the opening (122H) on the surface of the reflective substrate (120) may be 10%, and the area ratio of the reflective layer (122) may be 90%. According to one embodiment, a display device having a mirror performance of 83% or more reflectivity as specified in Japanese Industrial Standards (JIS) can be provided.

[0061] <Display operation of display device (100)>

[0062] Referring to FIGS. 3A and 3B, the display operation of the display device (100) will be described in detail. FIG. 3A is a drawing showing the path of light in the display device (100), and FIG. 3B is a drawing showing the path of light in a display device according to a comparative example that does not have a light-blocking layer.

[0063] As illustrated in FIG. 3B, in the display device according to the comparative example, for example, light (L1) emitted forward from the front surface of the light-emitting element (112B) enters the transparent substrate (121) through a corresponding opening (122H1) located in front of the light-emitting element (112B) and is emitted to the outside. Meanwhile, some light (L2) emitted from the front surface of the light-emitting element (112B) is reflected from the surface of the transparent substrate (121) and then reflected in the display device (100) and emitted to the outside through an opening (122H2) other than the corresponding opening (122H1). In addition, light (L3) emitted from the side surface (112S) of the light-emitting element (112G) is also emitted to the outside through an opening (122H3) other than the corresponding opening (122H2).

[0064] Therefore, in general display devices that do not have a light-blocking layer, light crosstalk may occur, which may result in deterioration of the image quality (change in color, etc.) of the displayed image.

[0065] Meanwhile, as illustrated in FIG. 3A, according to the display device (100) of the present disclosure, since the light (L2) emitted from the light-emitting element (112) and reflected from the surface of the transparent substrate (121) is absorbed by the light-blocking layer (113), the light (L2) may not be emitted to the outside through the other opening (122H). In addition, according to the display device (100) of the present disclosure, since the side surface (112S) of the light-emitting element (112) is covered with the light-blocking layer (113), the light emitted from the side surface (112S) of the light-emitting element (112) may also not be emitted to the outside through the other opening (122H).

[0066] Therefore, according to the display device (100) of the present embodiment, high-quality images can be displayed without light crosstalk occurring.

[0067] <Thickness of transparent substrate (121)>

[0068] Next, with reference to FIGS. 4A and 4B, the thickness of the transparent substrate (121) of the display device (100) will be described in detail. As described above, in the display device (100) of the present embodiment, a thin glass substrate having a thickness of approximately 100 μm is used as the transparent substrate (121).

[0069] Fig. 4a is a drawing showing the path of light when the transparent substrate (121) is thin, and Fig. 4b is a drawing showing the path of light when the transparent substrate (121) is thick.

[0070] As illustrated in FIG. 4B, when the transparent substrate (121) is thick, some of the light (L3) emitted from the light emitting element (112R) installed at the end of the display substrate (110) may pass through the opening (122H) and then reach both ends (121S) of the transparent substrate (121) in the direction in which the transparent substrate is extended. The light (L3) reaching both ends (121S) of the transparent substrate (121) in the direction in which the transparent substrate is extended may generate a line-shaped light (White Seam) at the corner portion of the display device (100), for example, when connecting a plurality of display devices (100), which is not preferable.

[0071] Meanwhile, as illustrated in FIG. 4A, when the transparent substrate (121) is thin, light (L1, L2, L3) emitted from the light emitting element (112R) installed at the end of the display substrate (110) passes through the opening (122H) and then is emitted to the outside from the front surface (121A) of the transparent substrate (121) without reaching the two ends (121S) in the direction in which the transparent substrate (121) is extended. Therefore, according to the display device (100) using a thin glass substrate, when a plurality of display devices (100) are connected, line-shaped light is not generated at the corner portions of the display devices (100), and the image quality of the displayed image is improved.

[0072] As described above, in the display device (100) of the present embodiment, the thickness of the transparent substrate (121) is preset so that light emitted from the light emitting element (112) located at the end of the circuit board (111) does not reach both ends (121S) of the transparent substrate (121) in the direction in which the transparent substrate is extended.

[0073] <Method for manufacturing display device (100)>

[0074] Next, a method for manufacturing a display device (100) will be described with reference to FIGS. 5a to 5f.

[0075] First, a metal film (122L) made of an alloy of aluminum and niobium is formed on a transparent substrate (121), and a photoresist (150) is applied on the metal film (122L) (see Fig. 5a). Next, an opening (112H) is formed in the metal film (122L) using a photolithography process (see Fig. 5b). Thereafter, the photoresist (150) is removed, thereby completing the reflective substrate (120) (see Fig. 5c).

[0076] Subsequently, a black anisotropic conductive film, a light-shielding layer (113), is formed on the circuit board (111), and a light-emitting element (112) is embedded in the anisotropic conductive film, thereby completing a display substrate (110) having a light-emitting element (112) and a light-shielding layer (113) (see FIG. 5d).

[0077] Next, a transparent adhesive layer (130) is applied to the upper portion of the display substrate (110) (see FIG. 5e). Then, the reflective substrate (120) is bonded to the transparent adhesive layer (130) on the display substrate (110) so that the reflective layer (122) of the transparent substrate (121) faces the display substrate (110), thereby completing the display device (100) (see FIG. 5f).

[0078] In addition, the material of each member of the display device (100) is not limited to the above materials, and various materials can be used. For example, the transparent substrate (121) can be a transparent resin substrate, and the reflective layer (122) can be composed of any metal such as silver, aluminum, a silver alloy, and an aluminum alloy. In addition, the light-shielding layer (113) is not limited to a black anisotropic conductive film, and may be composed of a black matrix material, etc. When the light-shielding layer is a black matrix material, the light-emitting element (112) can be mounted on the circuit board (111) by a bonding technique such as soldering. In addition, the color of the light-shielding layer (113) is not limited to black, and any color capable of absorbing light can be used.

[0079] (variant example)

[0080] Next, with reference to FIG. 6, a modified example of the display device (100) according to the present embodiment will be described.

[0081] Fig. 6 is a cross-sectional view schematically illustrating the configuration of a display device (100) according to a modified example. The display device according to the modified example differs from the display device according to the first embodiment in that it uses a color conversion layer to realize color display. In addition, the same reference numerals are assigned to the same configuration as the first embodiment, and a description thereof is omitted.

[0082] A display device (100) according to a modified example may include a display substrate (110) in which a plurality of light-emitting elements (112B) are arranged in an array shape and a reflective substrate (120) in which a plurality of openings (122H) corresponding to the plurality of light-emitting elements (112B) are formed. The display substrate (110) and the reflective substrate (120) may be bonded to each other through a transparent adhesive layer (130).

[0083] A display substrate (110) may have a plurality of blue light-emitting elements (112B) mounted on a circuit board (111). A light-blocking layer (113) may be formed in an area other than the area where the blue light-emitting elements (112B) are installed on the display substrate (110).

[0084] A reflective layer (122) having openings (122H1, 122H2, 122H3) formed at positions corresponding to blue light-emitting elements (112B) may be formed on a reflective substrate (120). Color conversion layers (125G, 125R) may be formed in two of the three openings (122H1, 122H2, 122H3) corresponding to three blue light-emitting elements (112B) constituting one pixel. The color conversion layers (125G, 125R) may include a green conversion layer (125G) made of a color conversion material that converts blue light into green light, and a red conversion layer (125R) made of a color conversion material that converts blue light into red light. The color conversion material includes a phosphor or a quantum dot.

[0085] According to the display device (100) configured as described above, a color image can be realized using only the blue light-emitting element (112B). In addition, since the light-blocking layer (113) is formed on the circuit board (111), some of the light emitted from a specific light-emitting element (112B) may not reach other openings (122H) other than the corresponding opening (122H). More specifically, for example, the light emitted from the blue light-emitting element (112B) corresponding to the opening (122H1) in which the color conversion layer is not formed may be configured to be reflected from the surface of the transparent substrate (121), etc., and not to enter the color conversion layers (125G, 125R) formed in other openings (122H2, 122H3).

[0086] Accordingly, according to the display device (100) according to the modified example, for example, when only a blue image is displayed, a high-quality blue image can be displayed because green light or red light is not mixed with the blue light and emitted to the outside.

[0087] In addition, the light-emitting element according to the modified example is not limited to a blue light-emitting element, and a light-emitting element that emits light of a specific wavelength, such as white light or ultraviolet light, may be used. The color conversion material constituting the color conversion layer may be changed depending on the light emitted by the light-emitting element.

[0088] (Example 2)

[0089] Next, a display device (100) according to a second embodiment of the present invention will be described with reference to FIG. 7. The display device according to the second embodiment may differ from the display device according to the first embodiment in that a light-blocking layer is additionally formed on the reflective substrate. Furthermore, the same reference numerals are assigned to the same components as those of the first embodiment, and their descriptions are omitted.

[0090] A display device (100) according to the present embodiment may include a display substrate (110) in which a plurality of light-emitting elements (112B, 112G, 112R) are arranged in an array shape, and a reflective substrate (120) in which a plurality of openings (122H) corresponding to the plurality of light-emitting elements (112B, 112G, 112R) are formed. The display substrate (110) and the reflective substrate (120) may be bonded to each other through a transparent adhesive layer (130).

[0091] The display substrate (110) may be configured such that a plurality of light-emitting elements (112B, 112G, 112R) are mounted on the circuit board (111). The light-emitting elements (112) may be mounted on the circuit board (111) by a bonding technique such as soldering.

[0092] According to one embodiment, the reflective substrate (120) may further include a second light-shielding layer (128).

[0093] A reflective layer (122) having an opening (122H) formed at a position corresponding to the light-emitting element (112) is formed on the reflective substrate (120), and a second light-shielding layer (128) may be further formed on the reflective layer (122). Like the reflective layer (122), the second light-shielding layer (128) also has an opening (128H) formed at a position corresponding to the light-emitting element (112), and light emitted from the light-emitting element (112) may be emitted to the outside through the openings (122H, 128H). The light-shielding layer (128) is made of, for example, a black matrix material, and may absorb a portion of the light emitted from the light-emitting element (112).

[0094] According to the display device (100) configured as described above, a portion of the light emitted from the light emitting element (112) may be absorbed by the second light-blocking layer (128) formed on the transparent substrate (121), and the portion of the light may not be emitted to the outside from another opening (122H). Therefore, according to the display device (100) of the present embodiment, high-quality images can be displayed without crosstalk of light occurring.

[0095] <Example 3>

[0096] In the first and second embodiments described above, the case where the display substrate (110) and the reflective substrate (120) are of the same size was described as an example. However, the sizes of the display substrate (110) and the reflective substrate (120) may be different.

[0097] As illustrated in FIG. 8, in the display device (100) according to the third embodiment of the present invention, when viewed from above, the size of the reflective substrate (120) may be formed to be larger than the size of the display substrate (110). In addition, when viewed from above, the display substrate (110) may be configured to overlap the reflective substrate (120). In addition, a plurality of small display substrates (110) are bonded to a large reflective substrate (120).

[0098] According to this configuration, it is possible to enlarge the display device (100) without increasing the size of the display substrate (110).

[0099] <Display System>

[0100] Finally, a display system (200) according to one embodiment of the present invention will be described with reference to FIG. 9. The display system (200) according to the present embodiment includes a plurality of display devices (100).

[0101] As illustrated in Fig. 9, the display system (200) is configured by arranging a plurality of display devices (100) in a tile shape. The display substrate (110) and the reflective substrate (120) of the display device (100) have approximately the same size.

[0102] According to this configuration, the degree of freedom in the shape of the display plane is improved, and for example, a large mirror display having an L-shaped display plane can be easily provided.

[0103] The present invention is not limited to the above-described embodiments, and can be modified in various ways within the scope of the claims.

[0104] For example, in the above-described embodiment, the case in which the size of the opening formed in the reflective layer is larger than the size of the front surface of the light-emitting element has been described as an example. However, the size of the opening is not limited to being larger than the size of the front surface of the light-emitting element. The size of the opening may be equal to the size of the front surface of the light-emitting element, or may be smaller than the size of the front surface of the light-emitting element. In addition, the shape of the opening is not particularly limited, and may be appropriately changed depending on the shape of the front surface of the light-emitting element.

[0105] In addition, in the above embodiment, the case where the light-emitting element is an inorganic light-emitting element (micro LED) is described as an example. However, the light-emitting element is not limited to an inorganic light-emitting element, and various light-emitting elements such as an organic light-emitting element are applicable.

[0106] Additionally, in the above-described embodiment, the reflective layer was formed on the surface (rear surface) of the transparent substrate facing the display substrate. However, the reflective layer may also be formed on the surface (front surface) of the transparent substrate opposite the display substrate. In this case, it is preferable to form an anti-oxidation film on the reflective layer.

Claims

1. A plurality of light-emitting elements spaced apart from each other on a circuit board and configured to each emit light forward; A reflective layer formed on a transparent substrate facing the circuit board, the reflective layer including an opening formed at a position corresponding to the light-emitting element, configured such that light emitted from the light-emitting element passes through the opening and is emitted forward, and reflects light from the front; and A display device comprising a light-blocking layer formed between the circuit board and the transparent substrate, and absorbing a portion of light emitted from the light-emitting element, thereby preventing light emitted from the light-emitting element from reaching an opening positioned at a location that does not correspond to the light-emitting element.

2. In paragraph 1, A display device in which the above-mentioned light-blocking layer is formed in an area other than an area on the circuit board in which the light-emitting element is installed.

3. In paragraph 2, A display device in which the above light-blocking layer is configured to cover a side surface of the light-emitting element and absorbs light emitted from the side surface of the light-emitting element.

4. In paragraph 1 or 2, A display device, wherein the reflective layer further includes a second light-blocking layer formed on a surface facing the light-blocking layer.

5. In paragraph 1 or 2, A display device further comprising a transparent adhesive layer formed between the circuit board and the transparent substrate and bonding the circuit board and the transparent substrate.

6. In paragraph 1 or 2, A display device, wherein the plurality of light-emitting elements include a blue light-emitting element that emits blue light, a green light-emitting element that emits green light, and a red light-emitting element that emits red light.

7. In paragraph 1 or 2, The above plurality of light-emitting elements are light-emitting elements that emit light of a specific wavelength, A display device, wherein the display device further includes a color conversion layer that converts light of the specific wavelength into light of a different wavelength and emits the converted light.

8. In paragraph 7, A display device, wherein the color conversion layer is formed in the opening.

9. In paragraph 1 or 2, A display device in which the transparent substrate is configured to have a thickness less than a preset thickness so that light emitted from the light-emitting element does not reach both ends of the transparent substrate in the direction in which the transparent substrate is extended.

10. In paragraph 1 or 2, A display device, wherein the light emitting element is configured to overlap the opening when viewed from above.

11. In paragraph 1 or 2, A display device in which the above light-emitting element is a micro LED.

12. In paragraph 1 or 2, When viewed from above, the transparent substrate is larger than the circuit board, A display device in which a plurality of circuit boards are bonded to the above transparent substrate.

13. A display system having multiple display devices according to paragraph 1 or 2, A display system in which a plurality of display devices each having the transparent substrate and the circuit board of the same size are arranged in a tile shape.

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