Photosensitive resin composition, cured resin film, and image display element

A photosensitive resin composition with a copolymer and specific monomers enables low-temperature curing and solvent-resistant, hard cured resin films for color filters, addressing the challenges of organic substrates and dye use in image display devices.

WO2025163995A1 Publication Date: 2025-08-07RESONAC CORP
3 Cites 2 Cited by

Patent Information

Application Number
PCT/JP2024/037618
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-06-20
Filing Date
2024-10-22
Publication Date
2025-08-07

AI Technical Summary

Technical Problem

Existing resin compositions used in color filters for image display devices face challenges in achieving low-temperature curing while maintaining sufficient solvent resistance and hardness, particularly when using organic substrates and dyes as colorants, due to issues with thermal crosslinking mechanisms and glass transition temperatures.

Method used

A photosensitive resin composition comprising a copolymer with specific structural units, a reactive diluent, a photopolymerization initiator, and a solvent, which allows for low-temperature curing and forms a cured resin film with excellent solvent resistance and hardness through transesterification of alkoxycarbonyl groups and hydroxy groups, using monomers like 2-isocyanatoethyl (meth)acrylate and acrylic acid to enhance crosslinking.

Benefits of technology

The composition achieves a cured resin film with improved solvent resistance and hardness, suitable for use in color filters, even at low temperatures of 50°C to 150°C, reducing equipment contamination and enhancing process efficiency.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

Provided is a photosensitive resin composition having excellent low-temperature curability and capable of providing a cured resin film having sufficient solvent resistance or sufficient hardness. Also, provided are a color filter having excellent solvent resistance or excellent hardness, and an image display element having same. A photosensitive resin composition according to the present invention contains a copolymer (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D).　The copolymer (A) contains a structural unit (a), a structural unit (b), and a structural unit (c). The structural unit (a) has at least one selected from among an active methylene group having an alkoxycarbonyl group attached thereto, and an active methine group having an alkoxycarbonyl group attached thereto. The structural unit (c) has an acid group.
Need to check novelty before this filing date? Find Prior Art