Lighting device and emblem of automobile part

Abstract

A lighting device provided according to an embodiment of the present invention may comprise: a substrate; a plurality of light-emitting elements disposed on the substrate; a light transmissive cover disposed on the plurality of light-emitting elements; and a resin layer disposed between the substrate and the light transmissive cover, wherein the resin layer covers the plurality of light-emitting elements, the light transmissive cover includes a plurality of convex parts and a plurality of concave parts, and the resin layer has protrusions respectively disposed inside the plurality of convex parts.

Description

Emblems for lighting devices and automotive parts

[0001] Embodiments of the invention relate to a lighting device and an emblem for an automobile part having the same. Embodiments relate to a method for manufacturing the lighting device or emblem.

[0002] Lighting applications include not only vehicle lighting but also backlighting for displays and signage. Light-emitting diodes (LEDs), for example, offer advantages over conventional light sources such as fluorescent and incandescent lamps, including low power consumption, a near-permanent lifespan, fast response times, safety, and environmental friendliness. These LEDs are used in various lighting devices, including displays, indoor and outdoor lighting. Recently, lamps utilizing LEDs have been proposed as vehicle light sources. Compared to incandescent lamps, LEDs offer the advantage of lower power consumption. However, because the light emitted from LEDs has a small angle of incidence, there is a need to increase the light-emitting area of ​​lamps using LEDs when using them in vehicle lamps. Their small size allows for greater design freedom, and their near-permanent lifespan offers economical advantages. Research and development are currently underway to apply LED modules as lighting devices to various vehicle components.

[0003] An embodiment of the invention provides a lighting device using a decorative film. An embodiment of the invention provides a lighting device using a decorative film having an emblem. An embodiment of the invention provides a lighting device or emblem in which a light-transmitting cover and a resin layer are integrally formed. An embodiment of the invention provides a lighting device that transmits light through a logo design of an emblem on the front, rear, and steering wheel surfaces of a vehicle. An embodiment of the invention provides a lighting device having an emblem that has a sensing element and emits light. An embodiment of the invention provides a lighting device or emblem in which a light-transmitting cover and a light-emitting module are sealed by a molding portion. An embodiment of the invention provides a lighting device that transmits light through a logo design of an emblem on the front, rear, and steering wheel surfaces of a vehicle. An embodiment of the invention may provide a mobile or vehicle having the lighting device or emblem disclosed above.

[0004] A lighting device according to an embodiment of the invention comprises: a substrate; a plurality of light-emitting elements arranged on the substrate; a light-transmitting cover arranged on the plurality of light-emitting elements; and a resin layer arranged between the substrate and the light-transmitting cover, wherein the resin layer covers the plurality of light-emitting elements, the light-transmitting cover includes a plurality of convex portions and a plurality of concave portions, and the resin layer may have protrusion portions arranged within each of the plurality of convex portions.

[0005] According to an embodiment of the invention, the upper surface of the resin layer may have the same shape as the shape of the convex portion and the concave portion of the light-transmitting cover. The light-transmitting cover may be in contact with the upper surface and the side surface of the resin layer. The plurality of light-emitting elements may overlap vertically with at least one of the concave portions of the light-transmitting cover, and the plurality of light-emitting elements may not overlap vertically with the convex portions of the light-transmitting cover.

[0006] According to an embodiment of the invention, a light-shielding film is included between the light-transmitting cover and the plurality of light-emitting elements, and the light-shielding film is arranged on the lower surface of the concave portion of the light-transmitting cover and can face the plurality of light-emitting elements.

[0007] A lighting device according to an embodiment of the invention may include a light emitting module including a circuit board, a plurality of light emitting elements electrically connected to the circuit board, and a resin layer disposed on the circuit board and sealing the plurality of light emitting elements; a light-transmitting cover having a space therein for accommodating the light emitting module; a molding part for sealing a surface of the circuit board of the light emitting module and a side surface of the light emitting module and the light-transmitting cover; and a sealed space sealed between the resin layer of the light emitting module and the light-transmitting cover.

[0008] According to an embodiment of the invention, the light-transmitting cover includes a film cover layer and a light-transmitting layer disposed on the inner side of the film cover layer, the light-transmitting cover includes a transparent portion facing the resin layer of the light-emitting module, and a side wall covering the periphery of the light-emitting module, and the molding portion may include an extension portion extending between the side wall of the light-transmitting cover and the side surface of the light-emitting module.

[0009] According to an embodiment of the invention, the light-transmitting cover includes a module support portion that supports the lower periphery of the light-emitting module, and the molding portion can be in contact with the side surface of the resin layer of the light-emitting module and the upper surface of the module support portion. The side wall of the light-transmitting cover can include a vertical lower inner surface and an upper inner surface that is inclined outward from the lower inner surface.

[0010] According to an embodiment of the invention, the side wall of the light-transmitting cover includes a lower receiving portion to which a lower portion of an extension of the molding portion is fixed, the lower receiving portion includes a groove extending outward from an inclined lower end of the side wall, and the molding portion can be filled in the lower receiving portion. The lower receiving portion can include a groove lower than a lower surface of the light-emitting module. The molding portion can seal a connector or a signal cable connected to the circuit board.

[0011] According to an embodiment of the invention, the light-transmitting cover includes a plurality of convex portions and a plurality of concave portions in an area through which light is emitted, and includes a light-shielding film disposed on an upper surface or a lower surface of the concave portions, and the plurality of light-emitting elements overlap vertically with at least one of the concave portions of the light-transmitting cover, and the plurality of light-emitting elements may not overlap vertically with the convex portions of the light-transmitting cover. According to an embodiment of the invention, the luminous intensity of light emitted through the convex portions is higher than the luminous intensity of light emitted through the concave portions, and the convex portions of the light-transmitting cover may correspond to the shape of a logo design.

[0012] An emblem for an automobile part according to an embodiment of the invention comprises a light-transmitting cover having a convex portion corresponding to the shape of a logo design on the outside; and a lighting device having a light-shielding film disposed on the inside or outside of the light-transmitting cover, wherein the lighting device is a lighting device according to claim 1 or claim 6, wherein the light-transmitting cover has a concave portion lower than the convex portion, and the concave portion may include a black printed layer on the inside.

[0013] According to an embodiment of the invention, the light extraction efficiency through the emblem of an automobile part can be improved. The physical strength of the cover forming the emblem can be improved, and the internal light-emitting module can be protected from the outside. According to an embodiment of the invention, the space between the light-emitting module and the cover can be eliminated, thereby improving the light extraction efficiency.

[0014] According to embodiments of the invention, the number of components constituting the emblem can be reduced, thereby improving the defect rate, enhancing component reliability, reducing component material costs, and shortening the manufacturing process. The cover and light-emitting module can be integrated, thereby reducing the overall thickness of the emblem and improving design freedom.

[0015] According to an embodiment of the invention, a sealed space is provided between a light-emitting module and a light-transmitting cover, thereby improving the diffusion efficiency of light emitted through the light-emitting module. In addition, by reducing the number of components constituting the emblem, the defect rate can be improved, the reliability of the components can be improved, the material cost of the components can be reduced, the manufacturing process can be shortened, and the defect rate due to the assembly of the components can be reduced. According to an embodiment of the invention, the cover and the light-emitting module are integrated by a molding part, thereby providing a waterproof component, reducing the overall thickness of the emblem, and improving the degree of design freedom. According to an embodiment of the invention, the internal sealed space between the cover and the light-emitting module can cushion external impact and prevent damage to the internal module.

[0016] According to an embodiment of the invention, the light uniformity of the emblem can be improved. In addition, the optical reliability of the lighting device and the emblem can be improved.

[0017] Fig. 1 is a perspective view showing a lighting device according to a first embodiment of the invention.

[0018] Figure 2 is a partially enlarged view of Figure 1.

[0019] Fig. 3 is another example of the light-shielding layer of Fig. 2.

[0020] Fig. 4 is another example of the lighting device of Fig. 1.

[0021] FIG. 5 is an example having a radar element within the lighting device of FIG. 1.

[0022] Fig. 6 is another example of the lighting device of Fig. 1.

[0023] Figures 7 and 8 are drawings showing the manufacturing process of the lighting device of Figure 1.

[0024] Figures 9 (a) and (b) are examples of the off / on state of an emblem of a car using a lighting device according to an embodiment.

[0025] Fig. 10 is a perspective view showing a lighting device according to a second embodiment of the invention.

[0026] Figure 11 is a partially enlarged view of Figure 10.

[0027] Fig. 12 is a drawing showing a first example of the transparent cover and light-emitting module of Fig. 10.

[0028] Fig. 13 is a drawing showing a second example of the transparent cover and light-emitting module of Fig. 10.

[0029] Fig. 14 is a drawing showing a third example of the transparent cover and light-emitting module of Fig. 10.

[0030] Figures 15 to 17 are drawings explaining the manufacturing process of the lighting device of Figure 10.

[0031] Fig. 18 is a cross-sectional view showing a first modified example of the lighting device of Fig. 10.

[0032] Fig. 19 is a cross-sectional view showing a second modified example of the lighting device of Fig. 10.

[0033] Fig. 20 is a cross-sectional view showing a third modified example of the lighting device of Fig. 10.

[0034] (a)(b)(c) of Fig. 21 are a front view, a cross-sectional view on the AA side, and enlarged views of areas A1 and A2 of the emblem to which the lighting device of Fig. 10 is applied.

[0035] Fig. 22 is a cross-sectional view showing the detailed configuration of layers of a light-transmitting cover according to the first and second embodiments of the invention.

[0036] Hereinafter, with reference to the attached drawings, preferred embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. However, it should be understood that the embodiments described in this specification and the configurations illustrated in the drawings are only preferred embodiments of the present invention, and that various equivalents and modifications may be substituted for them at the time of filing the present application. In describing the operating principles of preferred embodiments of the present invention in detail, if a specific description of a related known function or configuration is judged to unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. The terms described below are terms defined in consideration of their functions in the present invention, and the meaning of each term should be interpreted based on the contents throughout this specification. The same reference numerals are used throughout the drawings for parts having similar functions and operations.

[0037] The lighting device according to the present invention can be applied to various lamp devices requiring lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it can be applied to an emblem. The emblem is attached to the surface or exterior of a product manufactured by an automobile company to impress upon consumers that it is the company's product. In other words, the emblem is a seal that simply represents a specific company or organization by using a shape, symbol, or combination of these representing a company name, organization, company mark, logo, etc. In the following, embodiments will be clearly revealed through the attached drawings and the description of the embodiments. In the description of the embodiments, when each layer (film), region, pattern, or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad, or pattern, "on" and "under" include both "directly" and "indirectly" formed through another layer. In addition, the criteria for being on or under each layer will be described based on the drawings.

[0038] The lighting device according to the first embodiment of the invention will be described with reference to FIGS. 1 to 9.

[0039] Referring to FIGS. 1 to 6, a lighting device (400) according to a first embodiment of the invention may include a housing (201), a light-emitting module (200), and a light-transmitting cover (230). The lighting device (400) may be a device formed integrally with a logo design of a mobile device such as a drone, an airplane, or an automobile. The logo design may be an emblem provided on the surface or exterior of a product. The logo design may include a lighting area and a non-lighting area. The lighting area may be an area corresponding to a logo or a part of the logo. The non-lighting area may be an area other than the logo.

[0040] The lighting device (400) may be a structure or component that has a transparent cover (230) and a light-emitting module (200) as one body, and does not have an air layer inside. Accordingly, the thickness (T1) of the lighting device (400) is a vertical distance from the bottom of the housing (201) to the top of the transparent cover (230), and may be 10 mm or less. By providing the lighting device with a thickness (T1) of 10 mm or less, a slim emblem can be provided. In addition, since the thickness (T1) of the lighting device (400) is provided thinly, such as 10 mm or less, a flexible emblem can be provided. The thickness (T1) of the lighting device (400) may be 10 mm or less, for example, in the range of 3 mm to 10 mm or 5 mm to 7 mm. If the thickness (T1) of the above lighting device (400) is smaller than the above range, the luminous intensity of the lighting may decrease and the rigidity of the emblem may decrease. If the thickness (T1) is larger than the above range, materials may be wasted, the number of light-emitting elements (212) may increase to prevent luminous intensity decrease, and the emblem may be damaged by external impact due to the increase in size.

[0041] The housing (201) is a part of the emblem assembly and may be a cover for an area of ​​an automobile where the emblem is mounted. The housing (201) may be formed of an insulating material and may provide electrical insulation when the connector (203) is connected to the circuit board (210). The housing (201) may be a transparent material or an opaque material of metal or non-metal. The housing (201) may be formed by a molding process. The housing (201) may be positioned in an area where a logo design of the automobile, for example, an emblem, is formed, and the area may be arranged in at least one of the front of the vehicle, the rear of the vehicle, the side of the vehicle, the interior of the vehicle, or the airbag area. The housing (201) may be a support that supports the emblem, or may be defined as a bottom portion that is the entire bottom of the emblem. An example of the emblem may be implemented as a white area, as shown in FIG. 9.

[0042]

[0043] The light-emitting module (200) may include a circuit board (210) and a plurality of light-emitting elements (212) arranged on the circuit board (210). The light-emitting module (200) may further include a resin layer (220). The circuit board (210) may be arranged on the inner side of the upper surface of the housing (201). The lower surface of the circuit board (210) may be smaller than the upper surface area of ​​the housing (201). The resin layer (220) may extend to the upper surface and side surfaces of the circuit board (210) and may come into contact with the upper surface of the housing (201). Accordingly, the resin layer (220) may seal the upper surface and side surfaces of the circuit board (210).

[0044] The circuit board (210) includes a printed circuit board (PCB), and may include, for example, a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 board. The circuit board (210) may be a board made of a flexible or non-flexible material. A circuit pattern may be arranged on the upper portion of the circuit board (210). The circuit pattern of the circuit board (210) may have a plurality of pads in an area corresponding to the light-emitting element (212). The circuit board (210) may include wiring electrically connected to the connector (203), and the plurality of light-emitting elements (212) and the wiring may be electrically connected.

[0045] The light-emitting element (212) may include an LED chip or a package in which an LED chip is packaged. The light-emitting chip may emit at least one of blue, red, green, and ultraviolet (UV) light. The light-emitting element (212) may emit at least one of white, blue, red, and green light. As another example, the light-emitting element (212) may be implemented as an OLED. The plurality of light-emitting elements (212) may be connected in series or in parallel. The plurality of light-emitting elements (212) may be connected in parallel or in series-parallel so as to be individually driven by region.

[0046] The plurality of light-emitting elements (212) may be arranged one or more in different regions. The plurality of light-emitting elements (212) may be arranged in regions that do not vertically overlap with the logo design. The plurality of light-emitting elements (212) may be spaced apart from each other by region, and may be arranged, for example, in regions between adjacent logo designs or in regions outside of the logo designs. As in Fig. 9, when an emblem, i.e., the logo design, is implemented by a convex portion (231) of the light-transmitting cover (230), the plurality of light-emitting elements (212) may be arranged in a region lower than the convex portion (231) or in a lower portion of an outer region adjacent to the convex portion (231).

[0047] The resin layer (220) is disposed on the circuit board (210) and can seal the plurality of light-emitting elements (212). The resin layer (220) extends to the upper surface and side surfaces of the circuit board (210) and can seal the circuit board (210). The lower surface area of ​​the resin layer (220) may be provided to be larger than the upper surface area of ​​the circuit board (210). In addition, the lower surface length of the resin layer (220) in one direction may be provided to be larger than the length of the circuit board (210) in one direction. Since the resin layer (220) seals the light-emitting elements (212) and the circuit board (210), the moisture-proof characteristics of the plurality of light-emitting elements (212) and their electrical circuits can be improved. The resin layer (220) may be in contact with the inner surface of the light-transmitting cover (230). The resin layer (220) can be in contact with the inner surface of the convex portion (231) and the inner surface of the concave portion (232) of the light-transmitting cover (230). When the light-transmitting cover (230) extends to the side of the resin layer (220), the outer side of the resin layer (220) can be in contact with the inner surface of the outer portion (235) of the light-transmitting cover (230).

[0048] The resin layer (220) includes a light guide part (222) and a diffusion part (221), and the light guide part (222) has a plurality of light emitting elements (212) therein, and guides light emitted from the plurality of light emitting elements (212) to the diffusion part (221). The diffusion part (221) diffuses the light transmitted through the light guide part (222) into a uniform light distribution, and the diffused light is extracted through the light-transmitting cover (230). The light guide part (222) of the resin layer (220) is an area between or outside the logo design, and may be arranged in at least one or a plurality of areas. Each of the plurality of light guide parts (222) may have one or a plurality of light emitting elements (212) therein. That is, each of the light guide parts (222) may overlap with the light emitting elements (212) in a vertical direction.

[0049] The above diffusion portion (221) may be arranged on one side, inside, or between the guide portions (222) of the light guide portion (222), and may be arranged one or more times. The diffusion portion (221) may be an area where the light emitting elements (212) are not arranged inside, or an area spaced apart from an area where the light emitting elements (212) are arranged. The diffusion portion (221) may be arranged so as not to overlap the light emitting elements (212) in the vertical direction. The diffusion portion (221) has a protrusion (P1) that protrudes upward. The protrusion (P1) may have a shape corresponding to the shape of the logo design. The protrusion (P1) may be provided with an outer surface that is inclined, and the upper surface and the inclined surface of the protrusion (P1) are surfaces from which light is extracted, which may enhance the three-dimensional effect of the extracted light.

[0050]

[0051] The protrusion (P1) of the resin layer (220) may protrude toward the convex portion (231) of the light-transmitting cover (230). When viewed from a side cross-section, the number of the protrusions (P1) may be the same as the number of the convex portions (231). When viewed from a cross-section in the longitudinal direction of the emblem, the length of the protrusion (P1) may extend in the inner longitudinal direction of the convex portion (231), and the upper surface length of the protrusion (P1) may be the same as the inner surface length of the convex portion (231). When viewed from a cross-section in the width direction of the emblem, the upper surface width of the protrusion (P1) may be the same as the inner surface width of the convex portion (231). The shape of the protrusion (P1) may be the same as the shape of the convex portion (231). In this way, the surface of the resin layer (220) can be in contact with the entire inner surface of the light-transmitting cover (230). That is, the resin layer (220) can be integrally formed on the inner side of the light-transmitting cover (230).

[0052] As shown in Fig. 2, the thickness (T4) of the resin layer (220) may be 4 mm or less, for example, in the range of 2 mm to 4 mm, or in the range of 2.5 mm to 3.5 mm. The thickness (T4) of the resin layer (220) is the vertical distance from the upper surface of the circuit board (210) to the surface of the protrusion (P1) having the maximum height, and is the maximum thickness. If the maximum thickness (T4) of the resin layer (220) is lower than the above range, the height of the protrusion (P1) is lowered, so that the three-dimensional or negative effect of the emblem may be degraded, and if it is greater than the above range, the improvement in the three-dimensional or negative effect of the emblem may be minimal. The minimum thickness (T3) of the resin layer (220) is the thickness within the concave portion (232) or the vertical distance between the circuit board (210) and the upper surface of the concave portion (232) (see FIG. 2). The minimum thickness (T3) of the resin layer (220) may be 3 mm or less, for example, in the range of 1.5 mm to 2.5 mm. If the minimum thickness (T3) of the resin layer (220) is smaller than the range, the light guide efficiency may be reduced, and if it is larger than the range, the light extraction efficiency may be reduced. The resin layer (220) may be a resin material such as silicone or epoxy, or may include at least one of a plastic resin material, for example, a polyester (PET) film, a PMMA (Poly Methyl Methacrylate) material, or a PC (Poly Carbonate). Preferably, the resin layer (220) may be silicone or PMMA. Here, as shown in FIG. 2, a reflective layer (215) may be placed between the resin layer (220) and the circuit board (210). The reflective layer (215) may have a plurality of holes into which the light-emitting element (212) is inserted, and may be formed on the upper surface of the circuit board (210). The reflective layer (215) may reflect light emitted from the light-emitting element (212).The above reflective layer (215) has an area smaller than the upper surface area of ​​the circuit board (210) and can be in contact with the lower surface of the resin layer (220).

[0053] A light-shielding film (240) may be disposed between the resin layer (220) and a portion of the light-transmitting cover (230). The light-shielding film (240) has an open area (OP1, see FIG. 7) therein, is formed on the lower surface of the light-transmitting cover (230), and may vertically overlap or face the light-emitting elements (212). The light-shielding film (240) may be printed on the lower surface of the light-transmitting cover (230) in a single layer or multiple layers. The light-shielding film (240) includes a reflective material, for example, one of TiO2, Al2O3CaCO3, BaSO4, and Silicon, within the resin material, and may be printed in a single layer or multiple layers. The light-shielding film (240) is a material that does not block 100% of incident light, and may have a transmittance of less than 10% or less than 5% of the reflectance. The above-mentioned light-shielding film (240) may be disposed on the entirety or part of the lower surface of the concave portion (232) of the light-transmitting cover (230). Since the light-shielding film (240) is disposed on the lower surface of the concave portion (232) of the light-transmitting cover (230), a difference in brightness and a three-dimensional effect can be provided between the convex portion (231) and the concave portion (232) of the light-transmitting cover (230). In order to increase the light-shielding effect of the light emitted from the light-emitting element (212), the edge of the light-shielding film (240) may be disposed further outward than the outermost light-emitting element (212) disposed under the concave portion (232). That is, the light emitting element (212) can be spaced apart from the edge of the concave portion (232) by a predetermined distance, and the spaced apart distance can be 1.5 times or more or 2 times or more the pitch of adjacent light emitting elements (212), and can be 1.5 times or more when considering the light directivity angle of the light emitting element (212).

[0054] The thickness of the above-described light-shielding film (240) may be 100 μm or more, for example, in the range of 100 μm to 200 μm. If the thickness of the above-described light-shielding film (240) is smaller than the above-described range, hot spots may occur, and if it is larger than the above-described range, the improvement in light-shielding efficiency may be minimal, and the distance between the light-emitting element (212) and the light-shielding film (240) may be reduced, thereby reducing the light-guiding effect.

[0055]

[0056] The above-described transparent cover (230) may include a resin or plastic material, for example, a decorative film or PMMA. The transparent cover (230) may be molded using a molding device, for example, an in-mold device. As another example, the transparent cover (230) may be molded using a molding device, for example, an out-mold device. The transparent cover (230) may be molded after the light-shielding film (240) is printed. The decorative film can express designs such as pictures, letters, colors, metallicity, matteness, and texture, and can include various functions such as surface performance, electricity, electromagnetic wave, and optical functions. In addition, the decorative film before molding can facilitate printing or deposition of the light-shielding film (240).

[0057] The thickness of the above-mentioned light-transmitting cover (230) may be 1 mm or less, for example, in the range of 0.25 mm to 0.5 mm. If it is smaller than the above-mentioned range, the strength may be reduced and the design shape may not be clear. If it is larger than the above-mentioned range, the material cost may increase, molding may be difficult, and the light transmittance may be reduced. The above-mentioned light-transmitting cover (230) includes a convex portion (231) and a concave portion (232), and the convex portions (231) may be arranged one by one or in a plurality of ways or may be arranged continuously or discontinuously. The concave portions (232) may be arranged on the inside or outside of the convex portions (231) or in the areas (R4, R5, R6) between the convex portions (231), respectively. The above convex portions (231) may be respectively arranged on one side, the other side, or in the area (R1, R2, R3) between the concave portions (232) of the light-transmitting cover (230). The luminous intensity of light emitted through the convex portions (231) may be higher than the luminous intensity of light emitted through the concave portions (232).

[0058] The area of ​​the convex portion (231) is provided as a white or transparent area, and the area of ​​the concave portion (232) is provided as a black or opaque area. This means that when the light-transmitting cover (230) is multi-layered, the area of ​​the convex portion (231) and the area of ​​the concave portion (232) may have different laminated structures. For example, a black ink layer is arranged inside the concave portion (232), so that it is covered in black when viewed from the outside, and the convex portion (231) is provided without a black ink layer inside, so that it may be provided as a white or transparent area. The depth (T2) of the concave portion (232) is the depth from the upper surface of the convex portion (231) toward the circuit board (210), and may be 0.3 mm or more, for example, in the range of 0.3 mm to 0.5 mm. When the depth (T2) of the above concave portion (232) is smaller than the above range, the three-dimensional effect between the concave portion (232) and the convex portion (231) may be minimal and the difference in brightness may be reduced.

[0059]

[0060] The above convex portion (231) may protrude along the outer shape of a logo design such as an emblem, as shown in FIG. 9. The outer shape of the convex portion (231) may correspond to the outer shape of the emblem. At least one of the convex portions (231) may have a convex curved surface between the longitudinal edges. The light-transmitting cover (230) includes an outer portion (235), and the outer portion (235) may extend to the outer side of the resin layer (220). The outer portion (235) may extend to the entire side of the resin layer (220) and may extend to the outer side of the side of the circuit board (210). The outer portion (235) may be in contact with or adhered to the housing (201). The light emitting module (200) and the resin layer (220) may be arranged in the area between the above-described transparent cover (230) and the housing (201). The emblem of such an automobile part can provide a slim thickness, thereby improving design freedom, and since the resin layer (220) is in contact with the circuit board (210) and the transparent cover (230), there is no material with a different refractive index, thereby improving light extraction efficiency. In the past, since the resin layer (220) was formed to be smaller than the upper surface of the circuit board (210), moisture may penetrate through the side of the circuit board (210), and when moisture penetrates the circuit board (210), electrical reliability may be lowered and the lifespan of the emblem may be reduced.

[0061] The invention provides an area between a light-transmitting cover (230) and the resin layer (220) without an air layer. Accordingly, since light traveling through the resin layer (220) is extracted through the light-transmitting cover (230), light extraction efficiency can be improved. In addition, since the light-transmitting cover (230) and the resin layer (220) are formed integrally, a thickness that is 50% or thinner than the thickness of existing emblems can be provided, waterproofing characteristics can be improved, and design freedom can be improved. In addition, since the resin layer (220) covers the side of the circuit board (210), the electrical reliability of the circuit board (210) can be improved, and the lifespan of the emblem can be prevented from deteriorating. In addition, the material of the resin layer (220), such as silicone or PMMA, has a light transmittance of 90% or more, so that light extraction efficiency can be improved.

[0062]

[0063] As shown in Fig. 3, the light-shielding film (240) may be placed within the concave portion (232) of the light-transmitting cover (230). The light-shielding film (240) may be placed on the upper or lower surface of the concave portion (232) of the light-transmitting cover (230) so as to vertically overlap with the light-emitting elements (212). Since the light-shielding film (240) is placed on the concave portion (232) of the light-transmitting cover (230), the contact force between the resin layer (220) and the light-transmitting cover (230) may be improved. As another example, the light-shielding film (240) may be placed so as to vertically overlap with the light-emitting elements (212) in an area spaced apart from the inside of the light-transmitting cover (230) or the surface of the concave portion (232). The above light-shielding film (240) is integrally formed inside the light-transmitting cover (230) and may include black ink or white reflective material.

[0064] A first region (R1) of the convex portions (231) of the light-transmitting cover (230) may be provided with a light-shielding pattern (237). As shown in FIG. 4, the light-shielding pattern (237) may be formed on the surface of the convex portion (231) of the light-transmitting cover (230). The light-shielding pattern (237) may be arranged on the upper surface of the convex portion (231) of the light-transmitting cover (230). The light-shielding pattern (237) may include a light-shielding structure such as a matrix-shaped, mesh-shaped, or mesh-shaped pattern. The pattern may include shapes in which the upper surface or side cross-section is polygonal, circular, or a portion of the pattern has a curve. Light may be extracted through the open region (238) where the light-shielding pattern is not present, and when viewed from the outside, the design of the main logo portion may be diversified with a different pattern. In addition, the shading pattern (237) can expose letters, logos, or symbols in the emblem through the open area (238) on the first area (R1), as shown in FIG. 9. The shading pattern (237) can be printed on the first area (R1). Here, the shading pattern (237) can be printed on an adhesive layer (236) on the light-transmitting cover (230). The adhesive layer (236) can be made of a resin material or an adhesive material and can be removed. The shading pattern (237) can be implemented as a single layer or multiple layers. As another example, the shading pattern (237) can be disposed on the lower or upper surface of a convex portion (231) disposed on the first area (R1) of the light-transmitting cover (230). The shading pattern (237) has an open area on the lower or upper surface of the convex portion (231) and can be printed together with the shading film (240) or printed separately.

[0065]

[0066] The emblem may have a sensing element (260) therein. As shown in FIG. 5, the sensing element (260) may be arranged on the upper portion of the circuit board (210) with an electrode pattern (not shown). As another example, when the electrode pattern is made of a transparent material, the sensing element (260) may be a radar element arranged on the inside of the light-transmitting cover (230). When an emblem having the radar element is provided, the radar element transmits a signal using a predetermined wavelength, that is, a wavelength of 10 mm or less or 1 mm or less, through the light-transmitting cover (230). That is, the radar element can sense an external object at the front or rear of the vehicle and provide it to a user or a vehicle control system. Since the sensing element (260) transmits an electromagnetic wave with a frequency band of 30 to 300 GHz and a wavelength of 10 mm or less, it can accurately sense complex road conditions.

[0067] As shown in Fig. 6, since the transparent cover (230) is provided as a decorative film, it may have an electrode pattern on the inside or the lower surface. When the transparent electrode pattern is arranged on the lower surface of the transparent cover (230), the light-emitting element (212) may be mounted on the electrode pattern on the lower surface of the concave portion (232) of the transparent cover (230). Since the light-emitting element (212) is mounted on the lower surface of the concave portion (232), the resin layer (220) seals the side and lower surface of the light-emitting element (212). In addition, the reflective layer (215) may be formed on the surface of the housing (201), and a separate substrate may not be additionally arranged. Accordingly, the thickness of the emblem can be further reduced. The light-shielding film (240) may have a plurality of holes (242) through which the light-emitting elements (212) respectively pass. After an electrode pattern is formed on the lower surface of the concave portion (232) of the above-described light-transmitting cover (230), a light-shielding film (240) may be printed, the light-emitting element (212) may be mounted on the electrode pattern, and then covered with a resin layer (220). The electrode pattern may be made of a transparent or opaque material, and may be formed in a single layer or multiple layers. When a black ink layer is disposed inside the light-transmitting cover (230), the electrode pattern may be formed of an opaque material. In this way, the light-transmitting cover (230) is provided as an emblem having a structure that integrally includes the light-shielding film (240), the resin layer (220), and the light-emitting element (212), and therefore, it may have flexibility due to a slimmer thickness, and the bonding strength to the housing (201) or automobile parts may be improved.

[0068] The method for manufacturing a lighting device or emblem according to the first embodiment is as follows.

[0069] Referring to FIGS. 7 and 8, a light-shielding film (240) is printed on the surface of the light-transmitting cover (230) as shown in FIGS. 7(a)(b). The light-shielding film (240) may include an open area (OP1) corresponding to the convex portion (231 of FIG. 1). Thereafter, as shown in FIG. 7(b), the light-transmitting cover (230) is thermally compressed by in-mold molding using in-mold equipment to form the convex portion (231). The convex portion (231) of the light-transmitting cover (230) may be provided as an area without the light-shielding film (240). The inclined surface connected to the convex portion (231) of the light-transmitting cover (230) may be an area without the light-shielding film (240) or an area in which the light-shielding film (240) is formed. Additionally, the outer part (235) of the above-mentioned light-transmitting cover (230) protrudes in the opposite direction of the above-mentioned convex part (231) to form an internal space (SP1).

[0070] As shown in Fig. 7(b)(c), the material of the liquid resin layer (220) is dispensed into the internal space (SP1) of the light-transmitting cover (230). The material of the liquid resin layer (220) is filled into the internal space of the light-transmitting cover (230) and can be formed to a thickness up to the height of the outer portion (235). Accordingly, the space (SP1) between the light-transmitting cover (230) and the resin layer (220) can be filled without an air layer, thereby preventing a decrease in light extraction efficiency.

[0071] As shown in FIG. 8(a) and FIG. 8(b), a circuit board (210) having a plurality of light-emitting elements (212) mounted on the lower portion is combined with a housing (201), and then pressed against the material of the resin layer (220) before curing. The positions of the plurality of light-emitting elements (212) may be aligned to correspond to the concave portion of the light-transmitting cover (230), and then the circuit board (210) and the housing (201) may be pressed against the resin layer (220) within the light-transmitting cover (230). The plurality of light-emitting elements (212) may be buried lower than the upper surface of the resin layer (220), and the circuit board (210) may be buried lower than the upper surface of the resin layer (220). Thereafter, when the resin layer (220) is cured, the circuit board (210) can be combined within the resin layer (220), and the housing (201) can be brought into contact with the resin layer (220) and the outer side (235) of the light-transmitting cover (230). Accordingly, since the housing (201) and the outer side (235) of the light-transmitting cover (230) are brought into contact, the inner space (SP1) of the light-transmitting cover (230) is sealed. Accordingly, the waterproofing characteristics of the components between the light-transmitting cover (230) and the housing (201) can be improved. Accordingly, since the light-emitting module (200) is integrally embedded in the light-transmitting cover (230) having the resin layer (220), the waterproofing efficiency of the electrical pattern of the light-emitting element (212) and the circuit board (210) can be improved, the electrical reliability of the emblem can be improved, and the reduction in the life of the components can be prevented.

[0072]

[0073] As shown in Fig. 22, the light-transmitting cover (230) may include a support layer (31), a light-transmitting layer (32), an adhesive layer (33, 34), a printing layer (36, 37), and a protective layer (35). The light-transmitting cover (230) will be described as an example of a decorative film. The support layer (31) is for support and mechanical properties, and a substrate sheet selected from synthetic resin, fiber, paper, etc. may be used. The support layer (31) is not particularly limited, but may be a thermoplastic substrate sheet including at least one selected from the group consisting of, for example, acrylic butadiene styrene (ABS) resin, polycarbonate (PC), polyvinyl chloride (PVC), polyurethane (PU, TPU, etc.), and polyolefin such as polyethylene (PE) and polypropylene (PP). The support layer (31) is used as a molding binder and may be removed after film manufacturing.

[0074] The above-mentioned transparent layer (32) is a layer of a plastic material with high transmittance, and may include at least one of a polyester (PET) film, a PMMA (Poly Methyl Methacrylate) material, or a PC (Poly Carbonate). The thickness of the above-mentioned transparent layer (32) may be formed to be 50 ㎛ or more, for example, in the range of 50 ㎛ to 100 ㎛, for support.

[0075] The above adhesive layer (33, 34) can be bonded between the light-transmitting layer (32) and the protective layer (35). The adhesive layer (33, 34) can include a first adhesive layer (33) on the light-transmitting layer (32), and a second adhesive layer (34) between the protective layer (35) and the first adhesive layer (33). The first adhesive layer (33) and the second adhesive layer (34) can be bonded to each other and bond the light-transmitting layer (32) and the protective layer (35), and can be formed of a light-transmitting material.

[0076] The above printing layers (36, 37) include a first printing layer (36) and a second printing layer (37), and are formed on the adhesive layers (33, 34). The first and second printing layers (36, 37) play a role in determining the appearance of the product, and may be formed of layers including patterns, letters, embossing, metal, etc. depending on the use of the cover. For example, gravure printing, rotary screen printing, etc. may be applied as a printing method. The printing layer may be manufactured using a paste ink composition (e.g., colored or black ink) including a binder resin, organic or inorganic pigments, solvents, additives, etc. The method for forming the printing layer having a metallic texture is also not particularly limited, and for example, printing, sputtering, or coating using ink such as pearl ink may be applied. As a metal used to impart a metallic texture to the light-transmitting cover (230), one or more of aluminum, copper, silver, platinum, tin, chromium, and nickel may be used. The above inorganic pigments include rutile type titanium dioxide, zinc oxide, iron oxide, chromium oxide, etc., and may further include alumina, zinc sulfide, etc. The above organic pigments may include both natural pigments and synthetic pigments, and have the advantages of a wide range of colors, vividness, and excellent coloring power. In addition, the above organic or inorganic pigments may additionally include other pigments within a range that does not affect the reaction or processability of the foaming agent and foaming agent.

[0077] As shown in FIG. 1 and FIG. 22, the printing layers (36, 37) include a first printing layer (36) on the second adhesive layer (34) and a second printing layer (37) on the first printing layer (36). Each of the first printing layer (36) and the second printing layer (37) may be formed as different layers using a paste ink composition including a binder resin, an organic or inorganic pigment, a solvent, an additive, etc. The area of ​​the light-transmitting cover (230) where the printing layers (36, 37) are formed may be the area of ​​the concave portion (232). That is, the outer or peripheral area of ​​the logo design can be covered with the printing layers (36, 37), thereby providing a three-dimensional effect by the convex portion (231) and the concave portion (232) where the printing layers (36, 37) are formed. A protective layer (35) is formed on the adhesive layer (34) and the printing layers (36, 37). The protective layer (35) may be made of a transparent resin or plastic material, and may be made of a soft acrylic material. The protective layer (35) may be provided in a thickness of 200 µm or more, for example, in a range of 200 µm to 400 µm, for surface protection. The light-transmitting cover (230) has areas (R4, R5, R6) of concave portions (232) having the printing layers (36, 37) and areas (R1, R2, R3) of convex portions (231) without the printing layers (36, 37), and may have a resin layer (220) integrally formed on one surface. Accordingly, since the light-transmitting cover (230) and the light-emitting module (200) are formed integrally, the waterproofing characteristics of the emblem can be improved, the electrical reliability can be enhanced, and a slim thickness can be provided. Accordingly, the freedom of logo design of illuminated emblems can be improved.

[0078] As shown in Fig. 9(a), when the emblem is in an off state, and as shown in Fig. 9(b), when the emblem is in an illuminated state, the light-emitting element can be turned off / on depending on whether the emblem is in operation. The emblem can be provided as a concave portion of a black area (R4, R5) and a convex portion of a white area (R1, R2, R3) on the outside. Here, the first area (R1) can include a black area within the convex portion, and can be formed as the printed layer or as a light-blocking pattern.

[0079]

[0080] A lighting device according to a second embodiment of the invention will be described with reference to FIGS. 10 to 20. The configuration of the second embodiment of the invention refers to the configuration and description of the first embodiment, and configurations and descriptions that overlap with those of the first embodiment can be applied to the second embodiment.

[0081] Referring to FIGS. 10 and 11, a lighting device (100) according to a second embodiment of the invention may include a light-emitting module (110), a light-transmitting cover (120), and a molding part (150). The lighting device (100) may be a structure or component that integrally includes the light-transmitting cover (120) and the light-emitting module (110), and has an airtight space (125) therein. The airtight space (125) may be defined as a diffusion region or a layer filled with air (hereinafter, an air layer). The airtight space (125) may have a refractive index lower than the refractive index of the resin layer (113).

[0082] The thickness (T1) of the lighting device (100) is a vertical distance from the upper surface of the molding part (150) to the lower end of the light-transmitting cover (120), and may be 10 mm or less, for example, in the range of 5 mm to 10 mm or in the range of 7 mm to 8.5 mm. By providing the lighting device (100) with a thickness (T1) of 10 mm or less, a slim emblem having a thickness of 1 / 3 or less than a conventional emblem can be provided. In addition, since the thickness (T1) of the lighting device (100) is provided thinly at 10 mm or less, a flexible emblem can be provided. If the thickness (T1) of the above lighting device (100) is smaller than the above range, the brightness of the lighting may decrease and the rigidity of the emblem may decrease. If it is larger than the above range, in addition to wasting material, the number of light-emitting elements (112) for preventing brightness decrease may increase or the size of the emblem may increase, resulting in damage from external impact.

[0083]

[0084] The light-emitting module (110) may include a circuit board (111), a plurality of light-emitting elements (112) disposed on the circuit board (111), and a resin layer (113) disposed on the circuit board (111) and sealing the plurality of light-emitting elements (112). The circuit board (111) may include the configuration and description of the first embodiment. The light-emitting element (112) may include an LED chip or a package in which an LED chip is packaged. The light-emitting chip may emit at least one of blue, red, green, and ultraviolet (UV) light. This light-emitting element (112) may include the configuration and description of the light-emitting element of the first embodiment.

[0085] When the lighting device is implemented by the transparent area (R1, R2) of the light-transmitting cover (120) such as the emblem as in Fig. 21, i.e., for example, the logo design, the plurality of light-emitting elements (112) can be arranged in a non-transparent area (R4) or an outer area that does not vertically overlap with the transparent area (R1, R2). Here, the vertical direction is the thickness direction of the lighting device (100) or the direction from the lower surface of the light-transmitting cover (120) toward the upper surface of the molding part (150).

[0086] The resin layer (113) is disposed on the circuit board (111) and can seal the plurality of light-emitting elements (112). The resin layer (113) is disposed on the lower surface of the circuit board (111) and can seal the lower surface of the circuit board (111). The lower surface area of ​​the resin layer (113) may be provided to be equal to or greater than the upper surface area of ​​the circuit board (111). In addition, the length of the lower surface of the resin layer (113) in one direction may be provided to be equal to or greater than the length of the circuit board (111) in one direction. Since the resin layer (113) seals the lower surface of the light-emitting elements (112) and the circuit board (111), the moisture-proof characteristics of the plurality of light-emitting elements (112) and their electrical circuits can be improved. The material of the resin layer (113) is a light-transmitting material, and the description of the resin layer in the first embodiment will be referred to. A separate dispersing agent may be additionally included in the above resin layer (113).

[0087] The resin layer (113) may have a thickness of 3 mm or less to diffuse the light emitted from the light emitting element (112), and may be, for example, in the range of 0.8 mm to 3 mm. If it is smaller than the range, the sealing effect of the light emitting element (112) is reduced, and if it is larger than the range, there is a problem that the thickness of the light emitting module (110) increases. A light diffusion structure (not shown) or a light extraction structure may be further formed on the lower surface or surface of the resin layer (113) to diffuse the light emitted from the light emitting element (112). The light diffusion structure or the light extraction structure may include a prism-like uneven pattern in an area vertically overlapping with the light emitting element (112). The lower surface of the resin layer (113) may be a horizontal plane or may have a concave and convex pattern. A reflective layer (115 in FIG. 12) may be disposed between the resin layer (113) and the circuit board (111). The above reflective layer (115) has a plurality of holes into which the light-emitting element (112) is inserted, and can be formed on the lower surface of the circuit board (111). The reflective layer can reflect light emitted from the light-emitting element (112). The reflective layer has an area smaller than or equal to the area of ​​the lower surface of the circuit board (111), and can be in contact with the upper surface of the resin layer (113).

[0088]

[0089] The above-described light-transmitting cover (120) may include a film cover layer (121) and a light-transmitting layer (122). The film cover layer (121) may be the surface of the lighting device (100) or the emblem. The film cover layer (121) may include a resin or plastic material, for example, a decorative film or PMMA. The light-transmitting layer (122) may include a resin material, such as silicone or epoxy, or at least one of a plastic resin material, for example, a polyester (PET) film, PMMA (Poly Methyl Methacrylate) material, or PC (Poly Carbonate). Preferably, the light-transmitting layer (122) may be silicone or PMMA.

[0090] The film cover layer (121) can be formed together with the light-transmitting layer (122) using a molding device, such as an in-mold device. As another example, the film cover layer (121) can be formed together with the light-transmitting layer (122) using a molding device, such as an out-mold device. The film cover layer (121) can be formed after a light-shielding film (140) as shown in FIGS. 12 and 13 is printed. The decorative film can express designs such as pictures, letters, colors, metallicity, matteness, and texture, and can include various functions such as surface performance, electricity, electromagnetic wave, and optical functions. In addition, the decorative film before forming can facilitate printing or deposition of the light-shielding film (140).

[0091]

[0092] The thickness of the region of the light-transmitting cover (120) that vertically overlaps with the circuit board (11) or vertically overlaps with the light-emitting module (110) is the thickness of the inner region, and may be the vertical distance from the lower surface of the film cover layer (121) to the lower surface of the module support (22), or the vertical distance to the lower surface of the sealed space (125). The thickness of the light-transmitting cover (120) may be 4 mm or less, for example, in the range of 1 mm to 4 mm or 1 mm to 3 mm. If it is smaller than the above range, the strength may be reduced and the design shape may not be clear, and if it is larger than the above range, the material cost may increase, molding may be difficult, and the light transmittance may be reduced. The thickness of the inner region of the light-transmitting cover (120) is the thickness of the region that vertically overlaps with the sealed space (125).

[0093] The above-described light-transmitting cover (120) includes a transparent portion (21) and a side wall (23), and the transparent portion (21) can emit light emitted from the light-emitting module (110). The transparent portion (21) can face an emission surface of the light-emitting module (110), for example, a resin layer (113). The transparent portion (21) can overlap the light-emitting module (110) in a vertical direction.

[0094] The above-mentioned light-transmitting cover (120) has a module receiving space therein, and the light-emitting module (110) is received inside the module receiving space. The side wall (23) of the light-transmitting cover (120) covers the outside of the light-emitting module (110). The side wall (23) covers the entire side of the light-emitting module (110). Here, the transmitting portion (21) of the light-transmitting cover (120) is an area corresponding to the emission-side area of ​​the light-emitting module (110), and may include a center or lower area of ​​the film cover layer (121) and a center or lower area of ​​the light-transmitting layer (122), or may include a center or lower area of ​​the light-transmitting layer (122). Here, the side wall (23) of the light-transmitting cover (120) corresponds to the outer area of ​​the light-emitting module (110), and may include the side wall area of ​​the film cover layer (121) and the side wall area of ​​the light-transmitting layer (122), or may include the side wall area of ​​the light-transmitting layer (122).

[0095] In the above light-transmitting cover (120), a light-transmitting layer (122) is arranged on the inner side of the transmission portion (21), and a film cover layer (121) is arranged on the lower side. A light-transmitting layer (122) is arranged on the inner side of the side wall (23), and a film cover layer (121) is arranged on the outer side. The light-transmitting layer (122) is arranged on the outer upper end of the side wall (23), and the film cover layer (121) may be arranged at the same level as or lower than the outer upper end of the side wall (23) to prevent the upper end of the film cover layer (121) from being peeled off.

[0096]

[0097] The above-described light-transmitting layer cover (120) includes a module support (22), and the module support (22) may be formed by a stepped structure on the inner side of the light-transmitting layer (122). The module support (22) may be arranged around the lower surface of the light-emitting module (110) and may support the lower surface of the light-emitting module (110). The module support (22) may have a continuous frame shape or a discontinuous frame shape. The module support (22) may be arranged around the lower surface of the resin layer (113). The upper surface (22A) of the module support (22) may be arranged along the lower surface of the resin layer (113) in a concavo-convex shape.

[0098] The minimum distance (D2) between the side walls (23) of the light-transmitting layer cover (120) or the distance between the side walls in one direction is the length of the area where the light-emitting module (110) is mounted, and may be greater than the length (D1) of the light-emitting module (110). The minimum length (D3) of the module support portion (22) of the light-transmitting layer cover (120) in one direction may be the length of the sealed space (125). The minimum length (D3) of the module support portion (22) may be the length of an area that does not affect the light emission of the light-emitting module (110). Alternatively, the sealed space (125) disposed between the light-emitting module (110) and the light-transmitting cover (120) may be disposed one or more times. When the above-mentioned sealed spaces (125) are arranged in multiple numbers, the multiple sealed spaces (125) may be arranged in an area that vertically overlaps with the light-emitting element (112), or may be arranged in an area that vertically overlaps with the transparent areas (R1, R2) as shown in FIGS. 12 to 14. Here, in the area between the multiple sealed spaces (125), a part of the light-transmitting layer (122) may protrude to the lower surface of the resin layer (113).

[0099]

[0100] The upper surface (22A) of the module support member (22) may vertically overlap with the lower periphery of the light-emitting module (110). Here, the vertical direction is a direction from the lower surface of the light-transmitting cover (120) toward the upper surface of the molding member (150). The width ((D1-D3) / 2) of the region of the upper surface (22A) of the module support member (22) that vertically overlaps with the lower periphery of the light-emitting module (110) may be 2 mm or less, for example, in the range of 0.5 mm to 2 mm or 0.8 mm to 1.5 mm. If it is smaller than the above range, when the light-emitting module (110) forms the molding member (150), a problem of the light-emitting module (110) flowing or warping may occur.

[0101] The sealed space (125) may be an area between the light-emitting module (110) and the light-transmitting cover (120). The sealed space (125) may be a spaced area between the resin layer (113) and the light-transmitting layer (122). The lower periphery of the resin layer (113) may be in contact with the upper surface (22A) of the module support portion (22) of the light-transmitting layer (122). The height (H1) of the sealed space (125) may be 2 mm or less, for example, in the range of 0.1 mm to 2 mm or in the range of 0.5 mm to 1.5 mm. When the height of the sealed space (125) is smaller than the range, the light diffusion effect is reduced, and when it is larger than the range, the thickness (T1) of the lighting device is increased.

[0102] The side wall (23) of the light-transmitting layer cover (120) may be spaced apart from the side surface of the light-emitting module (110). The side wall (23) may be spaced apart in the horizontal direction from the resin layer (113) of the light-emitting module (110). Accordingly, the minimum distance (D2) between the two side walls (23) or the minimum distance between the side walls (23) in the first direction may be greater than the length (D1) of the light-emitting module (110) in the first direction. The length (D1) of the light-emitting module (110) in the first direction may be greater than the length (D3) of the sealed space (125) in the first direction. The first direction may be the long side length or the short side length of the light-transmitting cover (120). The lower inner surface (23A) of the side wall (23) may be spaced apart from the resin layer (113), and the upper surface (22A) of the module support portion (22) may be positioned higher than the upper surface of the transmission portion (21) and may be bent inward from the lower inner surface (23A) of the side wall (23). The height (T8) of the lower inner surface (23A) may be smaller than the thickness (T5) of the light-emitting module (110), and may be 0.5 mm or more, for example, in the range of 0.5 mm to 2 mm.

[0103] The upper inner surface (23B) of the side wall (23) of the light-transmitting layer cover (120) may provide an inclined surface to facilitate insertion of the light-emitting module (110). On the inner side of the side wall (23), the width between the upper inner surfaces (23B) facing each other may be wider than the width between the lower inner surfaces (23A) facing each other. As shown in Fig. 11, the upper end portion (23C) of the inner surface of the side wall (23) may extend vertically from the upper end portion of the upper inner surface (23B) toward the upper surface of the molding part (150) or may extend in an inclined structure. The boundary point (K1) between the upper end portion (23C) of the inner surface of the side wall (23) and the upper inner surface (23B) may be positioned higher than the upper surface or the upper end portion of the light-emitting module (110). That is, since the upper position of the inclined surface (23B) is positioned higher than the upper side of the light-emitting module (110), the insertion of the light-emitting module (110) can be facilitated, and the filling of the molding part (150) can be guided. In addition, the height (T7) from the module support part (22) to the upper end of the side wall (23) can be greater than the thickness (T5) of the light-emitting module (110). Accordingly, the side wall (23) enables the insertion of the light-emitting module (110) into the internal space, and the dispensing process for the liquid resin can be facilitated during injection of the molding part (150).

[0104]

[0105] The molding part (150) can cover the surface of the light-emitting module (110). The molding part (150) can seal the upper surface and side surfaces of the light-emitting module (110). The molding part (150) can seal the upper surface and side surfaces of the circuit board (111) and the side surfaces of the resin layer (113). The extension part (151) of the molding part (150) extends to the side surfaces of the light-emitting module (110) and can come into contact with the inner surfaces of the side wall (23) and the side surfaces of the resin layer (113). The lower end of the extension part (151) of the molding part (150) can come into contact with the outer side of the upper surface (22A) of the module support part (22). Accordingly, the molding part (150) can cover the entire upper portion of the light-emitting module (110) and seal the entire side surfaces.

[0106] The thickness (T6) of the molding part (150) is the thickness between the upper surface of the light emitting module (110) and the uppermost surface of the molding part (150), or is the vertical distance between the upper surface of the circuit board (111) and the upper surface of the molding part (150). The thickness (T6) of the molding part (150) is a thickness for sealing the light emitting module (110) and moisture-proofing, and may be 2 mm or more, for example, in the range of 2 mm to 5 mm or in the range of 2.5 mm to 3.5 mm. When the thickness (T6) of the molding part (150) is smaller than the range, the moisture-proofing effect is lowered, and when it is larger than the range, the thickness of the lighting device (100) may increase. The molding part (150) may include a resin material, for example, silicone or epoxy.

[0107]

[0108] The connector (160) can be connected to the upper or lower surface of the circuit board (111) of the light-emitting module (110). The boundary portion between the connector (160) and the circuit board (111), the surface of the connector (160), can be molded with a part (154) of the molding part (150). The part (154) of the molding part (150) can extend to the side of the connector (160), thereby improving the problem of moisture penetration into the boundary portion between the connector (160) and the circuit board (111).

[0109] The outer portion (152) of the molding portion (150) may extend to the upper surface of the side wall (23) of the light-transmitting cover (120). For example, the outer portion (152) of the molding portion (150) may extend to the upper surface of the side wall (23) of the light-transmitting layer (122), thereby preventing moisture penetration through the boundary portion between the molding portion (150) and the light-transmitting layer (122). The outer portion (152) of the molding portion (150) may be in contact with the upper outer surface of the film cover layer (121). Here, the upper surface of the side wall (23) may include a concave groove (not shown) on the upper surface, and the groove may be arranged one or more times along the perimeter of the side wall (23). When the side wall (23) has a groove, a portion of the molding portion (150) may be filled in the groove. When a portion of the molding part (150) is filled in the groove of the side wall (23), the adhesive strength between the molding part (150) and the upper end of the side wall (23) can be increased, and moisture can be prevented from penetrating between the molding part (150) and the upper surface of the side wall (23) or a path for moisture penetration can be provided. The shape of the groove part can be an inverted triangle, a polygon, or a hemispherical shape. The circuit board (111) can be arranged on the inner side of the molding part (150). The upper surface of the circuit board (111) can be smaller than the upper surface area of ​​the molding part (150). In addition, since the lighting device (100) integrally seals the light emitting module (110) with the molding part (150), the influence of the external environment or external impact can be reduced, electrical reliability can be improved, and problems caused by defective assembly of components can be prevented.

[0110] The lighting device (100) can seal the entire surface of the light-emitting module (110) using the molding part (150), seal the boundary between the light-emitting module (110) and the connector (160), and seal the portion between the light-emitting module (110) and the light-transmitting cover (120). Accordingly, the molding part (150) and the light-transmitting cover (120) have the light-emitting module (110) inside and are formed as one body, thereby providing a lighting device (100) in which the light-emitting module (110) is waterproof. In addition, the number of parts constituting the lighting device (100) can be reduced, and material costs and manufacturing costs can be saved. In addition, the thickness (T1) of the lighting device (100) can be reduced.

[0111] Referring to FIGS. 12 and 13, the lower region of the light-transmitting cover (120) may include one or more convex portions (121A) and one or more concave portions (121B) for the shape of the emblem. Preferably, the convex portions (121A) and the concave portions (121B) may be arranged in multiple numbers, and may be adjacent to each other or arranged alternately. The plurality of convex portions (121A) may be arranged continuously or discontinuously. The luminous intensity of light emitted through the convex portions (121A) in the light-transmitting cover (120) may be higher than the luminous intensity of light emitted through the concave portions (121B). The region of the convex portions (121A) is provided as a white or transparent region, and the region of the concave portions (121B) is provided as a black or opaque region. In the case where the light-transmitting cover (120) is multi-layered, the area of ​​the convex portion (121A) and the area of ​​the concave portion (121B) may have different laminated structures. For example, a black ink layer may be arranged inside the concave portion (121B), so that it is covered in black when viewed from the outside, and the convex portion (121A) may be provided without a black ink layer inside, so that it may be provided as a white or transparent area. The plurality of light-emitting elements (112) may overlap with at least one of the concave portions (121B) of the light-transmitting cover (120) in the vertical direction, and the plurality of light-emitting elements (112) may not overlap with the convex portions (121A) of the light-transmitting cover (120) in the vertical direction. At this time, the luminous intensity of the light emitted through the convex portions (121A) may be higher than the luminous intensity of the light emitted through the concave portions (121B).

[0112] In the above-described light-transmitting cover (120), the boundary portion (121C) between the convex portion (121A) and the concave portion (121B) may be provided with an inclined structure. The convex portion (121A) may be defined as a transmissive region (R1, R2) through which light is transmitted, and the concave portion (121B) may be defined as a non-transmissive region (R2) through which light is not transmitted. In the concave portion (121B), a light-shielding film (140) may be placed on the inner surface (upper surface) or outer surface (lower surface) of the film cover layer (121) for light shielding. As shown in Fig. 12, when the light-shielding film (140) is disposed on the inner side or upper surface of the concave portion (121B), it is adhered or printed in the area between the film cover layer (121) and the light-transmitting layer (122) corresponding to the area of ​​the concave portion (121), and the area of ​​the concave portion (121) can be formed as a non-transparent area (R2). As shown in Fig. 13, when the light-shielding film (140) is disposed on the outer side or lower surface of the concave portion (121B), it is adhered or printed in the area of ​​the lower surface of the film cover layer (121) corresponding to the area of ​​the concave portion (121), and the area of ​​the concave portion (121) can be formed as a non-transparent area (R2). The light-shielding film (140) can be spaced apart from the light-transmitting area (R1, R2) or the convex portion (121A). The above-described light-shielding film (140) may be printed on the upper or lower surface of the film cover layer (121) and then molded together with the light-transmitting cover (120). The convex portion (121A) and the transparent areas (R1, R2) may protrude along the outer shape of a logo design, such as an emblem, as shown in FIGS. 21(A)(B). The outer shape of the convex portion (121A) may correspond to the outer shape of the emblem. At least one of the convex portions (121A) may be arranged between the concave portions or may have a convex curved surface on the inner or outer side of the concave portion. The light-transmitting cover (120) may include the configuration of FIG. 22 or the configuration of the first embodiment.

[0113] As shown in Fig. 14, for the non-transparent region (R2), a light-shielding film (141) may be printed on the lower surface area of ​​the resin layer (113) of the light-emitting module (110) corresponding to the concave portion (121B). The light-shielding film (141) may be exposed to the sealed space (125). In Figs. 12 to 14, the light-shielding films (140, 141) include a reflective material, for example, one of TiO2, Al2O3CaCO3, BaSO4, and Silicon, within the resin material, and may be printed in a single layer or multiple layers. The light-shielding films (140, 141) are materials that do not block 100% of incident light, and may have a transmittance of less than 10% or less than 5% of the reflectance.

[0114] Since the above-mentioned light-shielding film (140, 141) is arranged in an area corresponding to the concave portion (121B) of the light-transmitting cover (120), the areas of the convex portion (121A) and the concave portion (121B) of the light-transmitting cover (120) can provide a difference in brightness and a three-dimensional effect. The depth of the concave portion (121B) may be 0.3 mm or more, for example, in the range of 0.3 mm to 0.5 mm from the lower surface of the convex portion (121A). If the depth of the concave portion (121B) is smaller than the above-mentioned range, the three-dimensional effect between the concave portion (121B) and the convex portion (121A) may be minimal and the difference in brightness may be reduced.

[0115]

[0116] In order to increase the light-shielding effect of the light emitted from the light-emitting element (112), the edge of the light-shielding film (140, 141) may be disposed further outward than the outermost light-emitting element (112) disposed on the concave portion (121B). The edge of the light-shielding film (140, 141) may be disposed further outward than the outermost light-emitting element (112). That is, the area of ​​the light-shielding film (140, 141) may be disposed in a size that covers an area where the light-emitting elements (112) are arranged and vertically overlap with the light-shielding film (140, 141), for example, in a range of 101% to 120% of the size of an area where the light-emitting elements (112) are arranged. The thickness of the light-shielding film (140, 141) may be 100 ㎛ or more, for example, in a range of 100 ㎛ to 200 ㎛. If the thickness of the above-mentioned shading film (140, 141) is smaller than the above range, a hot spot may occur, and if it is larger than the above range, the improvement in shading efficiency may be minimal.

[0117] FIGS. 15 to 17 are drawings explaining a manufacturing process of a lighting device according to a second embodiment of the invention. Referring to FIGS. 15(A)(B), the light-transmitting cover (120) may be thermally compressed by in-mold molding using in-mold equipment to press a film cover layer (121) onto the surface of the light-transmitting layer (122). At this time, a convex portion (see FIGS. 4 and 12) corresponding to the shape of the emblem may be formed on the lower portion of the light-transmitting cover (121A). After the light-transmitting cover (120) is injection-molded, a pre-manufactured light-emitting module (110) is coupled to the internal space (125A). A connector (160) may be connected to the circuit board (111) of the light-emitting module (110). The lower periphery of the light emitting module (110) is mounted on the module support (22) of the light-transmitting cover (120), and this combination can provide a lighting assembly (100M). The side surfaces of the light emitting module (110) can have a filling space (125B) from the side wall (23) of the light emitting cover (120). This filling space (125B) is a space filled with a molding part to be described later. The space (125) between the light emitting module (110) and the light emitting cover (120) can become a sealed space when the molding part to be described later is filled. The light emitting module (110) is manufactured by mounting a plurality of light emitting elements (112) on a circuit board (111), dispensing a liquid resin layer (113), and then curing the same.

[0118] Fig. 16 shows a method for joining the lighting assembly (100M) to the inner space (305) of the lower mold (301). The side wall (303) of the lower mold (301) may protrude to a level equal to or higher than the upper surface of the lighting assembly (100M). The bottom shape of the inner space (305) may correspond to the lower surface shape of the light-transmitting cover (120). As another example, after the light-transmitting cover (120) is placed within the lower mold (301), the light-emitting module (110) may be joined thereon. At this time, the inner lower surface of the resin layer (113) is separated from the upper surface of the light-transmitting layer (122) by a sealed space (125) except for the area in contact with the module support member (22). Referring to Fig. 17(A)(B), the lighting assembly (100M) is combined into the lower mold (301), and then the upper mold (310) is combined onto the lower mold (301). The lower space (211) of the upper mold (310) may be spaced apart from the upper surface of the light-emitting module (110) by about the thickness of the molding part (150) (T6 in Fig. 11). At this time, a liquid resin is injected into the upper mold (310) through one or more injection holes (212), and then the entire upper surface of the light-emitting module (110) and the entire side surface of the light-emitting module (110) are sealed. At this time, the molding part (150) may seal the space (125) between the light-transmitting cover (120) and the light-emitting module (110), and the space (125) may be a sealed space, a diffusion region, or an air layer. The above liquid resin may be a resin having low pressure and low curing temperature to protect and prevent damage to the light-emitting module (110). Thereafter, when the molding resin is cured, the upper mold (310) is separated and the lower mold (301) is separated, thereby completing the lighting device (100). Here, the molding resin remaining in the injection hole (212) can be removed by cutting.

[0119]

[0120] Figures 18 to 20 are modified examples of the lighting device of Figure 10.

[0121] According to the lighting device (100A) of Fig. 18, the lower part of the side wall (23) of the light-transmitting cover (120) may extend further outward than the lower end (23P) of the inclined upper inner surface (23B) and may have a lower receiving portion (23D). The lower receiving portion (23D) may include a groove in which a fixed end (151A) of an extension portion (151) of the molding portion (150) is formed. The fixed end (151A) may be continuously arranged along the inner perimeter of the side wall (23) along the lower receiving portion (23D), or may be arranged discontinuously in multiple numbers. Accordingly, the molding part (150) can be formed integrally with the light-transmitting cover (120) and the light-emitting module (110) and can be joined to the inner lower part of the light-transmitting cover (120) with a hook structure, thereby preventing the problem of the molding part (150) being separated from the light-transmitting cover (120).

[0122] According to the lighting device (100B) of FIG. 19, the lower receiving portion (23D) of the side wall (23) of the light-transmitting cover (120) may include a groove that extends further outward than the lower end (23P) of the inclined upper inner surface (23B) and further downward than the outer lower surface of the light-emitting module (110). The lower receiving portion (23D) may extend to the outer periphery of the module support portion (22). The module support portion (22) is arranged further inward than the lower edge of the lower surface of the light-emitting module (110), and the inner space of the lower receiving portion (23D) may vertically overlap with the lower periphery of the light-emitting module (110). The module support portion (22) is arranged in an area that does not affect the light emission area of ​​the light-emitting module (110), and one or two or more may be provided in a continuous frame shape or a discontinuous frame shape.

[0123] The extension portion (151) of the molding portion (150) has fixed ends (151A, 151B) at the bottom, and the fixed ends (151A, 151B) may include a first fixed end (151A) arranged on the outside of the light-emitting module (110), and a second fixed end (151B) arranged on the lower periphery of the light-emitting module (110). The first and second fixed ends (151A, 151B) may extend from or be connected to the extension portion (151). The first and second fixed ends (151A, 151B) may be arranged continuously along the inner periphery of the side wall (23) along the lower receiving portion (23D), or may be arranged discontinuously in multiple numbers. The width of the region (22S) vertically overlapping with the light-emitting module (110) within the second fixed end (151B) may be smaller than the width of the module support (22). The bottom (22C) of the lower receiving portion (23D) may be positioned at a position equal to or higher than the bottom of the sealed space (125). Accordingly, the molding portion (150) may be integrally formed with the light-transmitting cover (120) and the light-emitting module (110) and may be coupled to the inner lower portion of the light-transmitting cover (120) with a hook structure, thereby preventing the molding portion (150) from being separated from the light-transmitting cover (120).

[0124]

[0125] As shown in Fig. 20, the circuit board (111) of the light-emitting module (110) can be connected with a signal cable (160A) without a connector, and the joint portion between the signal cable (160A) and the circuit board (111) can be sealed by a molding part (150). In this case, an increase in the thickness of the lighting device due to the height of the connector can be prevented.

[0126] As shown in (A)(B)(C) of FIG. 21, a lighting device (100) having an emblem according to an embodiment of the invention provides a sealed space (125) between a light-transmitting cover (120) and the light-emitting module (110), and since light emitted through the light-emitting module (110) is diffused by the sealed space (125) and extracted through the light-transmitting cover (120), light distribution can be improved. In addition, since the light-transmitting cover (120) and the molding part (150) are formed integrally, a thinner thickness can be provided compared to the thickness of existing emblems, waterproofing characteristics can be improved, and design freedom can be improved. Since the molding part (150) covers the upper surface and side surfaces of the circuit board (111 of FIG. 11), the electrical reliability of the circuit board (111) can be improved, and the lifespan of the emblem can be prevented from being reduced. The molding portion (150) may be formed of an insulating material such as silicone or epoxy. The molding portion (150) may include particles that reflect or absorb light within it.

[0127] As shown in Fig. 21, a light-blocking pattern (not shown) may be provided in the character area or convex area of ​​the light-transmitting cover (120). The light-blocking pattern may be formed on the surface of the convex area of ​​the light-transmitting cover (120). The light-blocking pattern may be arranged on the lower surface of the convex area of ​​the light-transmitting cover (120). The light-blocking pattern may include a light-blocking structure such as a matrix-shaped, mesh-shaped, or mesh-shaped pattern. Light may be extracted through the open area where the light-blocking pattern is not present, and when viewed from the outside, the design of the main logo portion may be diversified with a different pattern. In addition, the light-blocking pattern may expose characters, logos, or symbols within the emblem on the convex area, as shown in Fig. 21 (A)-(C). The light-blocking pattern may be printed on the convex area.

[0128] In the second embodiment, since the transparent cover (120) and the light-emitting module (110) are integrally formed by the molding part (150), the waterproofing characteristics of the emblem having the sealed space (125) and the light-emitting module (110) sealed inside can be improved, the electrical reliability can be improved, and the emblem can be provided with a slim thickness. Accordingly, the freedom of logo design of the illuminated emblem can be improved. The emblem can have a sensing element (not shown) or a radar element inside. The sensing element or radar element can be arranged with an electrode pattern (not shown) on the upper part of the circuit board (111). The radar element can sense an external object at the front or rear of the vehicle and provide it to a user or a vehicle control system. The sensing element transmits electromagnetic waves with a frequency band of 30 to 300 GHz and a wavelength of 10 mm or less, so that complex road conditions can be accurately sensed.

[0129] A lighting device having the above emblem may include at least one of a mobile vehicle such as an automobile, a mobile vehicle such as a drone, a maritime vehicle such as a ship, a mobility device connecting land and sea, and an aerial vehicle such as an airplane. Furthermore, the lighting device having the above emblem may be applied to a fixed lighting device rather than a mobile vehicle.

[0130] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person having ordinary skill in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention. In addition, although the embodiments have been described above, these are merely examples and do not limit the present invention. Those having ordinary skill in the art to which the present invention pertains will appreciate that various modifications and applications not illustrated above are possible without departing from the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, the differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. Substrate; A plurality of light emitting elements arranged on the substrate; a light-transmitting cover disposed on the plurality of light-emitting elements; and A resin layer disposed between the substrate and the light-transmitting cover, The above resin layer covers a plurality of light-emitting elements, The above-mentioned light-transmitting cover includes a plurality of convex portions and a plurality of concave portions, A lighting device in which the resin layer has protrusions each arranged within the plurality of convex portions.

2. A lighting device in accordance with paragraph 1, wherein the upper surface of the resin layer has the same shape as the shape having the convex and concave portions of the light-transmitting cover.

3. In the first paragraph, the light-transmitting cover is a lighting device that comes into contact with the upper surface and side surface of the resin layer.

4. In any one of the first to third paragraphs, the plurality of light-emitting elements overlap vertically with at least one of the concave portions of the light-transmitting cover, A lighting device in which the plurality of light-emitting elements do not overlap in the vertical direction with the convex portions of the light-transmitting cover.

5. In any one of the first to third paragraphs, a light-blocking film is included between the light-transmitting cover and the plurality of light-emitting elements, The above-mentioned light-blocking film is placed on the lower surface of the concave portion of the above-mentioned light-transmitting cover, and is a lighting device facing the plurality of light-emitting elements.

6. A light-emitting module comprising a circuit board, a plurality of light-emitting elements electrically connected to the circuit board, and a resin layer disposed on the circuit board and sealing the plurality of light-emitting elements; A light-transmitting cover having a space therein for accommodating the light-emitting module; A molding part that seals the surface of the circuit board of the light-emitting module and between the side of the light-emitting module and the light-transmitting cover; and A lighting device comprising a sealed space between the resin layer of the light-emitting module and the light-transmitting cover.

7. In the 6th paragraph, the light-transmitting cover includes a film cover layer and a light-transmitting layer disposed on the inner side of the film cover layer, The above-mentioned light-transmitting cover includes a transparent portion facing the resin layer of the light-emitting module, and a side wall covering the periphery of the light-emitting module. A lighting device wherein the molding portion includes an extension portion extending between a side wall of the light-transmitting cover and a side surface of the light-emitting module.

8. In paragraph 7, The above-mentioned light-transmitting cover includes a module support member that supports the lower periphery of the above-mentioned light-emitting module, The above molding part is a lighting device that comes into contact with the side surface of the resin layer of the light-emitting module and the upper surface of the module support part.

9. In paragraph 7, A lighting device in which the side walls of the above-mentioned light-transmitting cover include a vertical lower inner surface and an upper inner surface inclined outward from the lower inner surface.

10. In any one of paragraphs 7 to 9, The side wall of the above-mentioned light-transmitting cover includes a lower receiving portion to which the lower portion of the extension of the above-mentioned molding portion is fixed, The lower receiving portion includes a groove extending outward from the inclined lower end of the side wall, A lighting device in which the molding part is filled in the lower receiving part.

11. In paragraph 10, A lighting device wherein the lower receiving portion includes a groove lower than the lower position of the light emitting module.

12. In any one of paragraphs 6 to 9, The above molding part is a lighting device that seals a connector or signal cable connected to the circuit board.

13. In any one of paragraphs 6 to 9, The above light-transmitting cover includes a plurality of convex portions and a plurality of concave portions in the area from which light is emitted, It includes a light-blocking film arranged on the upper or lower surface of the above concave portion, The plurality of light-emitting elements overlap vertically with at least one of the recessed portions of the light-transmitting cover, A lighting device in which the plurality of light-emitting elements do not overlap in the vertical direction with the convex portions of the light-transmitting cover.

14. In paragraph 13, The brightness of the light emitted through the convex portions is higher than the brightness of the light emitted through the concave portions, The convex portions of the above-mentioned light-transmitting cover are lighting devices corresponding to the shape of the logo design.

15. A light-transmitting cover having a convex portion corresponding to the shape of the logo design on the outside; and a lighting device having a light-shielding film arranged on the inside or outside of the light-transmitting cover, The above lighting device is a lighting device according to claim 1 or claim 6, The above-mentioned transparent cover has a concave portion lower than the convex portion, and the emblem of the automobile part includes a black printed layer inside the concave portion.

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