Display device having touch sensing function

Abstract

The present invention relates to a display device having a touch sensing function. The display device according to an embodiment may include: a display panel in which multiple pixels are arranged in a display area; a touch sensing unit in which multiple touch electrodes are arranged on the front surface of the display panel; a touch driving circuit which supplies driving signals to the multiple touch electrodes through multiple touch wires and senses a change in a voltage magnitude of the driving signals so as to detect touch position coordinates, wherein the multiple touch wires are formed and disposed in a rear surface direction of at least one touch electrode to overlap the at least one touch electrode among the multiple touch electrodes.

Description

Display device with touch sensing function

[0001] The present invention relates to a display device having a touch sensing function.

[0002] As the information society develops, the demand for display devices for displaying images is increasing in various forms. For example, display devices are being used in various electronic devices such as smartphones, digital cameras, laptop computers, navigation systems, and smart televisions.

[0003] The display device may be a flat panel display device such as a liquid crystal display device, a field emission display device, or an organic light emitting display device. Among these flat panel display devices, a light emitting display device includes a light emitting element in which each pixel of the display panel can emit light on its own, thereby displaying an image without a backlight unit that provides light to the display panel.

[0004] Recently, display devices include a touch sensing module for sensing a user's touch as one of the interface means. The touch sensing module includes a touch sensing unit in which touch sensing electrodes are arranged, and a touch driving circuit for detecting changes in electrostatic capacity between the touch sensing electrodes. The touch sensing electrodes of the touch sensing unit are arranged in a touch sensing area corresponding to the image display area, and wires for transmitting driving signals or detection signals of the touch sensing electrodes are arranged in an outer area defined as a bezel area. At this time, the area of ​​the outer area inevitably increases due to the wires connected to the touch sensing electrodes.

[0005] The problem to be solved by the present invention is to provide a display device capable of minimizing or zeroing the area of ​​peripheral regions by changing the arrangement position of touch signal wires that supply driving signals to touch sensing electrodes or transmit touch detection signals.

[0006] Another problem to be solved by the present invention is to provide a touch sensing module and display device that can reduce the bezel formation area while maintaining image display efficiency by improving the formation location and arrangement structure of touch signal wires electrically connected to touch sensing electrodes.

[0007] The tasks of the present invention are not limited to the tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0008] According to one embodiment of the present invention for solving the above problem, a display device includes a display panel having a plurality of pixels arranged in a display area, a touch sensing unit having a plurality of touch electrodes arranged on the front surface of the display panel, and a touch driving circuit that supplies driving signals to the plurality of touch electrodes through a plurality of touch wires and detects touch position coordinates by sensing a change in voltage magnitude of the driving signals, wherein the plurality of touch wires can be formed and arranged in a rear direction of at least one touch electrode so as to overlap with at least one of the plurality of touch electrodes.

[0009] The plurality of touch electrodes are arranged in a planar matrix structure on the entire surface of the display area, the plurality of touch wires extend from the display area to the non-display area, and one end of each of the plurality of touch wires is electrically connected to at least one touch electrode among the plurality of touch electrodes through at least one touch contact hole, and the other end can be electrically connected to the touch driving circuit.

[0010] The plurality of touch electrodes include drive electrodes and detection electrodes that are alternately arranged in a planar matrix structure on the entire surface of the display area, and the plurality of touch wires extend from the display area to the non-display area, and one end of each of the plurality of first touch wires among the plurality of touch wires is electrically connected to at least one of the drive electrodes through at least one touch contact hole, and the other end is electrically connected to the touch driving circuit, and one end of each of the plurality of second touch wires among the plurality of touch wires is electrically connected to at least one of the detection electrodes through at least one touch contact hole, and the other end can be electrically connected to the touch driving circuit.

[0011] In addition, a display device according to one embodiment for solving the above problem includes a display panel having a plurality of pixels arranged in a display area, a touch sensing unit having a plurality of touch electrodes arranged on the front surface of the display panel, a display driving circuit for driving the plurality of pixels, and a touch driving circuit for supplying driving signals to the plurality of touch electrodes through a plurality of touch wires and detecting touch position coordinates by sensing a change in voltage magnitude of the driving signals, wherein the plurality of touch wires are formed and arranged in the display area of ​​the display panel so as to overlap with at least one touch electrode among the plurality of touch electrodes.

[0012] A display device having a touch sensing function according to one embodiment can minimize or zero the area of ​​the outer region of a touch sensing area by improving the arrangement position of touch signal wires that supply driving signals to touch sensing electrodes or transmit touch sensing signals.

[0013] Additionally, by overlapping the touch sensing electrodes and touch signal wires in the touch sensing area, the bezel formation area can be reduced while maintaining image display efficiency.

[0014] The effects according to the embodiments are not limited to those exemplified above, and more diverse effects are included in this specification.

[0015] Figure 1 is a plan view showing the configuration of a display device according to one embodiment of the present invention.

[0016] Fig. 2 is a cross-sectional view specifically showing the display device of Fig. 1.

[0017] FIG. 3 is a layout diagram schematically showing an example of a display panel according to one embodiment.

[0018] FIG. 4 is a layout diagram schematically showing the arrangement structure of touch sensing electrodes and touch signal wires according to the first embodiment of the present invention.

[0019] FIG. 5 is a cross-sectional view according to a first embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0020] Fig. 6 is a cross-sectional view for explaining the formation process of pixel electrodes and touch signal wires of the pixels illustrated in Fig. 5.

[0021] Fig. 7 is a plan view showing the planar arrangement structure of the pixel electrodes and touch signal wires illustrated in Fig. 6.

[0022] Fig. 8 is a cross-sectional view specifically showing the vertical light-emitting element illustrated in Fig. 5.

[0023] FIGS. 9A to 9F are plan views sequentially showing the formation process of some pixels, touch contact holes, and light-emitting openings illustrated in FIG. 5.

[0024] FIG. 10 is a cross-sectional view according to a second embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0025] FIG. 11 is a cross-sectional view according to a third embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0026] Fig. 12 is a cross-sectional view for explaining the formation process of pixel electrodes, common electrodes, and touch signal wires of the pixels illustrated in Fig. 11.

[0027] FIG. 13 is a plan view showing the planar arrangement structure of the first and second pixel electrodes, touch signal wires, and horizontal light-emitting elements illustrated in FIG. 12.

[0028] Fig. 14 is a cross-sectional view specifically showing the horizontal light-emitting element illustrated in Fig. 13.

[0029] Figures 15a to 15d are plan views sequentially showing the formation process of some pixels and touch contact holes and light-emitting openings illustrated in Figure 11.

[0030] FIG. 16 is a cross-sectional view according to a fourth embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0031] Fig. 17 is a layout diagram schematically showing the arrangement structure of touch sensing electrodes and touch signal wires according to the second embodiment of the present invention.

[0032] FIG. 18 is a cross-sectional view according to a fifth embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIG. 17.

[0033] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided solely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined solely by the scope of the claims.

[0034] When elements or layers are referred to as being "on" another element or layer, this includes both cases where the other element or layer is directly on top of the other element or layer, or where the other layer or layer is interposed therebetween. Like reference numerals refer to like elements throughout the specification. The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments are exemplary, and the present invention is not limited to the matters illustrated.

[0035] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it should be understood that a "first" component referred to below may also be a "second" component within the technical scope of the present invention.

[0036] The features of each of the various embodiments of the present invention can be partially or wholly combined or combined with each other, and various technical connections and operations are possible, and each embodiment can be implemented independently of each other or implemented together in a related relationship.

[0037] Specific embodiments are described below with reference to the attached drawings.

[0038] Fig. 1 is a plan view showing the configuration of a display device according to one embodiment of the present invention. Fig. 2 is a cross-sectional view showing one side of the display device of Fig. 1 in detail.

[0039] Referring to FIGS. 1 and 2, a display device (10) according to one embodiment can be applied to portable electronic devices such as a mobile phone, a smart phone, a tablet personal computer (PC), a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation device, an ultra mobile PC (UMPC), etc. For example, the display device (10) can be applied as a display unit of a television, a laptop, a monitor, a billboard, or the Internet of Things (IOT). As another example, the display device (10) can also be applied to a wearable device such as a smart watch, a watch phone, a glasses-type display, and a head mounted display (HMD).

[0040] The display device (10) according to one embodiment may be classified in various ways according to the display method. For example, the display device (10) may be classified and configured as an organic light emitting display (OLED), an inorganic EL, a quantum dot emitting display (QED), a micro LED display (micro-LED), a nano LED display (nano-LED), a plasma display (PDP), a field emission display (FED), a liquid crystal display (LCD), an electrophoretic display (EPD), etc. Hereinafter, the display device (10) according to one embodiment will be described as an organic light emitting display (OLED), and unless a special distinction is required, the organic light emitting display (OLED) applied to the embodiment will be abbreviated as the display device (10). The display device (10) according to the embodiment is not limited to the organic light emitting display (OLED), and other display devices listed above or known in the art may be applied within the scope of sharing the technical idea.

[0041] The display device (10) according to one embodiment may have a rectangular shape, a square shape, a circular shape, an oval shape, or a square shape in a plan view. For example, if the display device (10) is a mobile device such as a tablet PC, it may have a rectangular shape with the long side positioned in the horizontal direction. However, the display device (10) is not limited thereto, and the long side may be positioned in the vertical direction, and may be installed so as to be rotatable so that the long side may be variably positioned in the horizontal or vertical direction.

[0042] The display device (10) includes a display panel (100), a display driving circuit (200), and a touch detection module including a touch sensing unit (TSU) and a touch driving circuit (400).

[0043] Specifically, the display panel (100) of the display device (10) includes a display unit (DU) that displays an image, and a touch sensing unit (TSU) that detects a touch of a human body part such as a finger and an electronic pen, etc., is arranged on the display panel (100). The display unit (DU) of the display panel (100) includes a plurality of pixels (SP) and can display an image through the plurality of pixels (SP). In addition, the touch sensing unit (TSU) can be mounted on the front surface of the display panel (100) or formed integrally with the display panel (100). The touch sensing unit (TSU) includes a plurality of touch electrodes and can detect a touch and a touch position by using a voltage magnitude change detection method or an electrostatic capacity detection method using the touch electrodes.

[0044] The display driving circuit (200) can output signals and voltages for driving pixels (SP) of the display unit (DU). The display driving circuit (200) can supply data voltages to data lines to which the pixels (SP) are connected. The display driving circuit (200) can supply power voltage to power lines and supply gate control signals to the gate driving unit (210).

[0045] The touch driving circuit (400) can be electrically connected and coupled to a touch sensing unit (TSU). The touch driving circuit (400) can supply touch driving signals to a plurality of touch electrodes arranged in the touch sensing unit (TSU) and sense a change in the voltage magnitude of the driving signals supplied to the touch electrodes to calculate whether a user has touched the touch electrode and the coordinates of the touch location. Alternatively, the touch driving circuit (400) can supply driving signals to a plurality of touch electrodes arranged in the touch sensing unit (TSU) and sense a change in electrostatic capacity between the plurality of touch electrodes. The touch driving circuit (400) can calculate whether a user has touched the touch electrode and the coordinates of the touch based on the change in electrostatic capacity between the plurality of touch electrodes.

[0046] The display driving circuit (200) may operate as a main processor or be formed integrally with the main processor. Accordingly, the display driving circuit (200) may control the overall function of the display device (10). For example, the display driving circuit (200) may receive touch data from the touch driving circuit (400), determine the user's touch coordinates, and then generate digital video data according to the touch coordinates. In addition, the display driving circuit (200) may execute an application indicated by an icon displayed at the user's touch coordinates. As another example, the display driving circuit (200) may receive coordinate data from an electronic pen or the like, determine the touch coordinates of the electronic pen, and then generate digital video data according to the touch coordinates, or execute an application indicated by an icon displayed at the touch coordinates of the electronic pen.

[0047] Referring to FIG. 2 together with FIG. 1, the display panel (100) can be divided into a main area (MA) and a sub area (SBA). The main area (MA) can include a display area (DA) provided with pixels (SP) for displaying an image, and a non-display area (NDA) arranged around the display area (DA). In the display area (DA), an image can be displayed by emitting light from the light-emitting area or aperture area of ​​each pixel (SP). To this end, the pixels (SP) of the display area (DA) can include a pixel circuit including switching elements, a pixel definition film defining the light-emitting area or the aperture area, and a light-emitting element (Light Emitting Element).

[0048] The non-display area (NDA) may be an outer area of ​​the display area (DA). The non-display area (NDA) may be defined as an edge area of ​​the main area (MA) of the display panel (100). The non-display area (NDA) may include a gate driver (210) that supplies gate signals to gate lines connected to pixels (SP) of the display area (DA), and fan-out lines that connect the display driver circuit (200) and the display area (DA).

[0049] The sub-area (SBA) may extend from one side of the main area (MA) or be attached to one side of the main area (MA). The sub-area (SBA) may include a flexible material capable of bending, folding, rolling, etc. For example, when the sub-area (SBA) is bent, the sub-area (SBA) may overlap the main area (MA) in the thickness direction (Z-axis direction). The sub-area (SBA) may include a pad portion electrically connected to the display driving circuit (200) and the circuit board (300). Optionally, the sub-area (SBA) may be omitted, and the display driving circuit (200) and the pad portion may be arranged and attached to the non-display area (NDA).

[0050] At least one display driving circuit (200) may be formed as an integrated circuit (IC) and mounted and arranged on the sub-area (SBA). Alternatively, the display driving circuit (200) may be mounted on the display panel (100) using a COG (Chip on Glass) method, a COP (Chip on Plastic) method, or an ultrasonic bonding method. For example, the display driving circuit (200) may be mounted on the sub-area (SBA) and overlapped in the thickness direction (Z-axis direction) that is the back surface direction on the main area (MA) by bending the sub-area (SBA). As another example, the display driving circuit (200) may be mounted on a circuit board (300).

[0051] The circuit board (300) may be attached to the pad portion of the display panel (100) or the sub-area (SBA) using an anisotropic conductive film (ACF). The lead wires of the circuit board (300) may be electrically connected to the pad portion of the display panel (100) or the sub-area (SBA). The circuit board (300) may be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip on film.

[0052] The touch driving circuit (400) may be mounted on a separate circuit board (300). The touch driving circuit (400) may be formed as an integrated circuit (IC). As described above, the touch driving circuit (400) applies touch driving signals to the touch electrodes of the touch sensing unit (TSU), and senses changes in the voltage magnitude (or current amount) of the touch driving signals applied to the touch electrodes, thereby calculating whether a user has touched the touch electrode and the coordinates of the touch location. More specifically, the touch driving circuit (400) sequentially or simultaneously supplies touch driving signals to the touch electrodes arranged in a matrix form in the touch sensing unit (TSU), and detects changes in the voltage magnitude of the touch driving signals applied to the touch electrodes, thereby extracting whether a user has touched the touch electrode and the coordinates of the touch.

[0053] As another example, the touch driving circuit (400) can apply touch driving signals to the touch electrodes of the touch sensing unit (TSU), and measure the amount of change in the mutual capacitance of each of the plurality of touch nodes formed between the touch electrodes to determine whether the user has touched the touch electrodes and the coordinates of the touch location. Specifically, the touch driving circuit (400) can measure the change in the capacitance of the touch nodes according to the change in the voltage or current of the touch detection signals each received from the touch electrodes. In this way, the touch driving circuit (400) can determine whether the user has touched the touch electrodes or whether the touch electrodes are close to each other according to the amount of change in the mutual capacitance of each of the touch nodes. Here, the touch driving signals supplied to each of the touch electrodes can be pulse signals having a predetermined frequency. Accordingly, the touch driving circuit (400) can detect whether the user has touched the touch electrodes by sequentially or simultaneously supplying touch driving signals to the touch electrodes arranged in a matrix form in the touch sensing unit (TSU), and sequentially measuring the amount of change in the capacitance of each of the touch nodes formed by the touch electrodes.

[0054] Meanwhile, the substrate (SUB) of the display panel (100) illustrated in FIG. 2 may be a base substrate or a base member. The substrate (SUB) may be a flexible substrate capable of bending, folding, rolling, etc. For example, the substrate (SUB) may include a glass material or a metal material, but is not limited thereto. As another example, the substrate (SUB) may include a polymer resin such as polyimide (PI).

[0055] A thin film transistor layer (TFTL) may be disposed on a substrate (SUB). The thin film transistor layer (TFTL) may include a plurality of thin film transistors constituting pixel circuits of pixels (SP). The thin film transistor layer (TFTL) may further include gate lines, data lines, power lines, gate control lines, fan-out lines connecting the display driver circuit (200) and the data lines, and lead lines connecting the display driver circuit (200) and a pad portion. When the gate driver (210) is formed on one side of the non-display area (NDA) of the display panel (100), the gate driver (210) may also include thin film transistors.

[0056] A thin film transistor layer (TFTL) can be arranged in a display area (DA), a non-display area (NDA), and a sub-area (SBA). Thin film transistors, gate lines, data lines, and power lines of each pixel of the thin film transistor layer (TFTL) can be arranged in the display area (DA). Gate control lines and fan-out lines of the thin film transistor layer (TFTL) can be arranged in the non-display area (NDA). Lead lines of the thin film transistor layer (TFTL) can be arranged in the sub-area (SBA).

[0057] An emitting device layer (EDL) may be disposed on a thin film transistor layer (TFTL). The emitting device layer (EDL) may include a plurality of emitting devices that are disposed between pixel electrodes and a common electrode of each pixel (SP) and emit light according to a voltage difference between the pixel electrode and the common electrode, and a pixel defining film that defines each pixel area or pixel (SP). The emitting devices of each pixel (SP) may be disposed in a emitting area of ​​each pixel (SP).

[0058] The encapsulation layer (TFEL) can cover the top and side surfaces of the light-emitting device layer (EDL) and protect the light-emitting device layer (EDL). The encapsulation layer (TFEL) can include at least one inorganic film or at least one organic film for encapsulating the light-emitting device layer (EDL).

[0059] A touch sensing unit (TSU) may be arranged on an encapsulation layer (TFEL). The touch sensing unit (TSU) may include a plurality of touch electrodes arranged in a planar matrix structure, and touch wires electrically connecting the plurality of touch electrodes to a touch driving circuit (400), respectively. Alternatively, the plurality of touch electrodes may be arranged and positioned so as to detect a user's touch in a capacitive manner. In this case, the touch electrodes of the touch sensing unit (TSU) may sense a user's touch in a self-capacitance manner or a mutual capacitance manner.

[0060] For another example, the touch sensing unit (TSU) may be placed on a separate substrate placed on the display unit (DU). In this case, the substrate supporting the touch sensing unit (TSU) may be a base member encapsulating the display unit (DU).

[0061] A plurality of touch electrodes included in a touch sensing unit (TSU) may be arranged in a touch sensor area overlapping a display area (DA). In addition, touch wires of the touch sensing unit (TSU) may also be arranged in the touch sensor area to overlap with at least one of the plurality of touch electrodes. The touch wires may be formed and arranged in the back direction of at least one touch electrode so as to overlap with at least one of the plurality of touch electrodes. In addition, each of the touch electrodes is electrically connected and connected to one touch wire through a contact hole. Specifically, the plurality of touch wires extend from the display area (DA) to the non-display area (NDA), and one end of each of the plurality of touch wires is electrically connected to at least one of the plurality of touch electrodes through at least one touch contact hole. On the other hand, the other end of each of the plurality of touch wires is electrically connected to a touch driving circuit (400).

[0062] Fig. 3 is a layout diagram schematically showing an example of a display panel according to one embodiment. Specifically, Fig. 3 is a layout diagram showing a display area (DA) and a non-display area (NDA) of a display unit (DU) before a touch sensing unit (TSU) is formed.

[0063] The display area (DA) is an area where an image is displayed, and may be defined as the central area of ​​the display panel (100). The display area (DA) may include a plurality of pixels (SP), a plurality of gate lines (GL), a plurality of data lines (DL), and a plurality of power lines (VL). Each of the plurality of pixels (SP) may be defined as the smallest unit that outputs light.

[0064] A plurality of gate wirings (GL) can supply gate signals received from a gate driver (210) to a plurality of pixels (SP). The plurality of gate wirings (GL) can extend in the X-axis direction and can be spaced apart from each other in the Y-axis direction intersecting the X-axis direction.

[0065] A plurality of data lines (DL) can supply data voltages received from a display driving circuit (200) to a plurality of pixels (SP). The plurality of data lines (DL) can extend in the Y-axis direction and be spaced apart from each other in the X-axis direction.

[0066] A plurality of power lines (VL) can supply a power voltage received from a display driving circuit (200) to a plurality of pixels (SP). Here, the power voltage can be at least one of a driving voltage, an initialization voltage, and a reference voltage. The plurality of power lines (VL) can extend in the Y-axis direction and be spaced apart from each other in the X-axis direction.

[0067] A non-display area (NDA) may surround a display area (DA). The non-display area (NDA) may include a gate driver (210), fan-out lines (FOL), and gate control lines (GCL). The gate driver (210) may generate a plurality of gate signals based on a gate control signal, and may sequentially supply the plurality of gate signals to a plurality of gate lines (GL) in a set order.

[0068] Fan out wires (FOL) can extend from the display driver circuit (200) to the display area (DA). The fan out wires (FOL) can supply data voltages received from the display driver circuit (200) to a plurality of data wires (DL).

[0069] A gate control line (GCL) can extend from the display driving circuit (200) to the gate driving unit (210). The gate control line (GCL) can supply a gate control signal received from the display driving circuit (200) to the gate driving unit (210).

[0070] The display driving circuit (200) can output signals and voltages for driving the display panel (100) to the fan out lines (FOL). The display driving circuit (200) can supply a data voltage to the data line (DL) through the fan out lines (FOL). The data voltage can be supplied to a plurality of pixels (SP) and can determine the brightness of the plurality of pixels (SP). The display driving circuit (200) can supply a gate control signal to the gate driving unit (210) through the gate control line (GCL).

[0071] FIG. 4 is a layout diagram schematically showing the arrangement structure of touch sensing electrodes and touch signal wires according to the first embodiment of the present invention.

[0072] Referring to FIG. 4, a plurality of touch electrodes (SE) are formed and arranged in a planar matrix structure in a touch detection area (TSA) of a touch sensing unit (TSU). Each of the touch electrodes (SE) is connected one-to-one with each of the touch wires (TLL) formed on the back surface of the touch electrodes (SE) through at least one touch contact hole. In other words, each of the touch electrodes (SE) can be electrically connected to each of the touch wires (TLL) through a plurality of touch contact holes.

[0073] Each touch wire (TLL) may be formed and arranged in the display area (DA) and the non-display area (NDA) of the display panel (100). Each touch wire (TLL) may be formed of the same metal material through the same process on the same process layer as the pixel electrodes of the pixels (SPs) formed in the display area (DA). Alternatively, each touch wire (TLL) may be formed of the same metal material through the same process on the same process layer as the connection electrodes, connection wires, or contact electrodes of the pixels (SPs) in addition to the pixel electrodes of the pixels (SPs) formed in the display area (DA). Each touch wire (TLL) may be formed to have the same length. Each touch wire (TLL) may be formed to have the same width, thickness, or length within a range that can minimize the resistance size and the RC delay phenomenon and improve visibility.

[0074] Each of the touch electrodes (SE) is electrically connected to each of the touch wires (TLL) through at least one touch contact hole formed to penetrate at least one of at least one insulating layer and at least one planarization layer or at least one protective film forming layer.

[0075] The touch driving circuit (400) can apply a touch driving signal to each of the touch electrodes (SE) through each of the touch wires (TLL) simultaneously or sequentially for a first preset period (e.g., at least one frame period). The touch driving circuit (400) can measure the amount of change in the mutual capacitance of each of the plurality of touch nodes formed between the touch electrodes for a second preset period (e.g., at least one frame period) to determine whether a user has touched the touch node and the coordinates of the touch position. Specifically, the touch driving circuit (400) can measure the change in the capacitance of the touch nodes according to the change in the voltage magnitude or current amount of the touch detection signals each received from the touch electrodes.

[0076] For another example, the touch driving circuit (400) supplies a touch driving signal to each of the touch electrodes (SE) through each of the touch wires (TLL) simultaneously or sequentially for a first preset period (e.g., at least one frame period). Each of the touch electrodes (SE) receives the touch driving signal from the touch driving circuit (400) for the first period through each of the touch wires (TLL) that are connected one-to-one. The voltage magnitude of the touch driving signal applied to each of the touch electrodes (SE) varies when a user's touch is detected. Thereafter, the touch driving circuit (400) detects the amount of change in the voltage magnitude of the touch electrodes (SE) through each of the touch wires (TLL) for a second preset period (e.g., at least one frame period). The touch driving circuit (400) can generate a touch position and touch position coordinates according to the amount of change in the voltage magnitude for each touch electrode (SE).

[0077] FIG. 5 is a cross-sectional view according to a first embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0078] Referring to Fig. 5, a barrier film (BR) may be placed on a substrate (SUB) of a display panel (100). The substrate (SUB) includes an insulating material such as a polymer resin, and may be formed of polyimide. Here, the substrate (SUB) may be a flexible substrate capable of bending, folding, rolling, etc.

[0079] The barrier film (BR) is a film to protect the thin film transistors (T1, T2, T3) and the light emitting element portion (LEP) of each pixel (SP) from moisture that penetrates through the substrate (SUB) that is vulnerable to moisture permeation. The barrier film (BR) may be formed of a plurality of inorganic films that are alternately laminated. For example, the barrier film (BR) may be formed as a multi-film in which one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately laminated.

[0080] Transistors (T1, T2, T3) of each pixel (SP) may be arranged on a barrier film (BR). Each thin film transistor (T1, T2, T3) includes an active layer (ACT1), a gate electrode (G1), a source electrode (S1), and a drain electrode (D1). The active layer (ACT1) overlapping the gate electrode (G1) in the third direction (Z-axis direction), which is the thickness direction of the substrate (SUB), may be defined as a channel region.

[0081] A gate insulating layer (130) may be disposed on the active layer (ACT1), source electrode (S1), and drain electrode (D1) of thin film transistors (T1, T2, T3). The gate insulating layer (130) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0082] Gate electrodes (G1) of thin film transistors (T1, T2, T3) may be arranged on the gate insulating layer (130). The gate electrode (G1) may overlap with the active layer (ACT1) in the third direction (Z-axis direction). The gate electrode (G1) may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0083] A first interlayer insulating film (141) may be disposed on the gate electrode (G1) of the thin film transistors (T1, T2, T3). The first interlayer insulating film (141) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating film (141) may be formed of a plurality of inorganic films.

[0084] A capacitor electrode (CAE) may be disposed on the first interlayer insulating film (141). The capacitor electrode (CAE) may overlap the gate electrode (G1) of the thin film transistors (T1, T2, T3) in the third direction (Z-axis direction). Since the first interlayer insulating film (141) has a predetermined dielectric constant, a capacitor may be formed by the capacitor electrode (CAE), the gate electrode (G1), and the first interlayer insulating film (141) disposed therebetween.

[0085] A second interlayer insulating film (142) may be disposed on the capacitor electrode (CAE). The second interlayer insulating film (142) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating film (142) may be formed of a plurality of inorganic films.

[0086] A first anode connection electrode (ADNE1) may be disposed on the second interlayer insulating film (142). The first anode connection electrode (ADNE1) may be connected to the drain electrode (D1) of the thin film transistor (ST1) through a first connection contact hole (ANCT1) penetrating the gate insulating layer (130), the first interlayer insulating film (141), and the second interlayer insulating film (142). The first anode connection electrode (ADNE1) may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0087] A first planarization film (160) may be disposed on the first anode connection electrode (ADNE1) to planarize the steps caused by the thin film transistors (T1, T2, T3). The first planarization film (160) may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0088] A second anode connection electrode (ADNE2) may be disposed on the first planarization film (160). The second anode connection electrode (ADNE2) may be connected to the first anode connection electrode (ADNE1) through a second connection contact hole (ANCT2) penetrating the first planarization film (160). The second anode connection electrode (ADNE2) may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0089] A second planarization film (180) may be disposed on the second anode connection electrode (ADNE2). The second planarization film (180) may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0090] A light emitting element portion (LEP) may be formed on the second planarization film (180). The light emitting element portion (LEP) may include a plurality of pixel electrodes (PE1, PE2, PE3), a plurality of light emitting elements (LE), a common electrode (CE), and a plurality of touch wires (TLL) formed on the same process layer as the plurality of pixel electrodes (PE1, PE2, PE3).

[0091] Each touch wire (TLL) is formed of the same metal material through the same process on the same process layer as the plurality of pixel electrodes (PE1, PE2, PE3).

[0092] The plurality of pixel electrodes (PE1, PE2, PE3) may include a first pixel electrode (PE1), a second pixel electrode (PE2), and a third pixel electrode (PE3). The first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3) may function as a first electrode of a light-emitting element (LE), and may be an anode electrode or a cathode electrode. Each pixel electrode (PE1, PE2, PE3) is formed in a light-emitting area of ​​each pixel (SP). In addition, touch wires (TLL) may be formed and arranged along areas between adjacent pixel electrodes among the plurality of pixel electrodes (PE1, PE2, PE3).

[0093] The plurality of pixel electrodes (PE1, PE2, PE3) and touch wiring (TLL) may be reflective alloy electrodes such as Ti (Titanium), copper (Cu), or Ti (Titanium) and copper (Cu). In addition, they may be formed as a laminated film structure of Ti (Titanium) and copper (Cu). Here, the plurality of pixel electrodes (PE1, PE2, PE3) and touch wiring (TLL) may have a laminated film structure in which a high work function material layer such as TiO2 (titanium oxide), ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), or MgO (magnesium oxide) is laminated with a reflective material layer such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), Ti (titanium), copper (Cu), or a mixture thereof is laminated.

[0094] The plurality of pixel electrodes (PE1, PE2, PE3) may be arranged close to the light emitting element (LED) by arranging a material layer with a high work function above a reflective material layer. The plurality of pixel electrodes (PE1, PE2, PE3) and touch wiring (TLL) may have a multilayer structure of ITO / Mg, ITO / MgF, ITO / Ag, ITO / Ag / ITO, but are not limited thereto.

[0095] A bank (BNL) may be positioned on a plurality of pixel electrodes (PE1, PE2, PE3) and touch wires (TLL). The bank (BNL) includes openings that expose the first pixel electrode (PE1), the second pixel electrode (PE2), the third pixel electrode (PE3) and the touch wires (TLL), respectively. The bank (BNL) defines a non-emission region, which is an area between the emission regions of each pixel (SP) and the emission regions. In addition, a touch contact hole (TCO) formation region that connects the touch electrodes (SE) of each of the touch wires (TLL) one-to-one with the respective touch wires (TLL) is defined in the bank (BNL).

[0096] The bank (BNL) may include an organic insulating material, for example, polyacrylates resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, unsaturated polyesters resin, polyphenyleneethers resin, polyphenylenesulfides resin, or benzocyclobutene (BCB). A black matrix layer for light blocking may be further formed on the front surface of the bank (BNL), i.e., the front surface of the bank (BNL) overlapping with the bank (BNL).

[0097] A plurality of light-emitting elements (LEDs) may be arranged on the first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3). Each light-emitting element (LED) is arranged in a light-emitting area where a pixel electrode is formed for each pixel (SP).

[0098] Each light emitting element (LED) may be a vertical light emitting diode element that extends in a third direction (Z-axis direction). That is, the length of the light emitting element (LED) in the third direction (Z-axis direction) may be longer than the length in the horizontal direction. The length of the light emitting element (LED) in the third direction (Z-axis direction) may be approximately 1 to 5 μm.

[0099] The light emitting diode (LED) may have a cylindrical, disk, or rod shape with a width greater than its height. However, the LED is not limited thereto, and may have various shapes, such as a rod, wire, tube, etc., a polygonal column shape such as a cube, rectangular parallelepiped, or hexagonal column, or a shape that extends in one direction but has a partially inclined outer surface.

[0100] A common electrode (CE) is formed on the front surface of a light emitting diode (LEP) including light emitting diodes (LEDs) to electrically connect all of the light emitting diodes (LEDs). The common electrode (CE) is in common contact with one electrode of all of the light emitting diodes (LEDs) and applies a common voltage of a preset voltage level to the light emitting diodes (LEDs). The common electrode (CE) is not limited thereto, and may be a Schottky connection electrode. The common electrode (CE) may be formed in a flat plate shape including a plurality of openings on a plane or may be formed in a mesh structure. The common electrode (CE) may be formed by including TiO2 (titanium oxide), ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), or MgO (magnesium oxide).

[0101] A planarization layer (240) may be disposed on the front surface of the light emitting element portion (LEP) including the common electrode (CE). The planarization layer (240) may planarize the upper and lower steps so that a touch electrode (SE) described later may be formed. The planarization layer (240) may include polyacrylates resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, unsaturated polyesters resin, polyphenylene resin, polyphenylenesulfides resin, or benzocyclobutene (BCB).

[0102] At least one touch contact hole (TCO) is formed in the flattening layer (240) so that each touch electrode (SE) is connected one-to-one with each touch wire (TLL) formed on the back surface of the touch electrodes (SE).

[0103] A plurality of touch electrodes (SE) are formed in a planar matrix structure on the entire surface of the planarization layer (240). At this time, each of the touch electrodes (SE) can be electrically connected to each of the touch wires (TLL) through at least one touch contact hole (TCO) formed to penetrate at least one layer or electrode among at least one interlayer insulating film or insulating layer, planarization layer, protective film, at least one metal electrode, and at least one bank (BNL). Specifically, each of the touch electrodes (SE) is electrically connected to each of the touch wires (TLL) through at least one touch contact hole (TCO) formed to penetrate at least one planarization layer (240), the common electrode (CE), and the bank (BNL). Here, the plurality of touch electrodes (SE) are formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. Touch electrodes (SE) may be formed in multiple layers.

[0104] The touch driving circuit (400) supplies a touch driving signal to each of the touch electrodes (SE) through the touch wires (TLL) during a first period, and detects the amount of change in the voltage magnitude of the touch electrodes (SE) through the touch wires (TLL) during a second period, thereby generating a touch position and touch position coordinates according to the amount of change in the voltage magnitude of each touch electrode (SE).

[0105] Fig. 6 is a cross-sectional view illustrating the formation process of pixel electrodes and touch signal wires of the pixels illustrated in Fig. 5. And Fig. 7 is a plan view showing the planar arrangement structure of the pixel electrodes and touch signal wires illustrated in Fig. 6.

[0106] Referring to FIGS. 6 and 7, a second planarization film (180) is formed on the entire surface of the first planarization film (160) so as to cover the entire first planarization film (160) including the second anode connection electrode (ADNE2).

[0107] In the second planarization film (180), connection contact holes are formed so that the second anode connection electrodes (ADNE2) are each exposed, and pixel electrodes (PE1, PE2, PE3) are patterned in the light-emitting area of ​​each pixel (SP), including the connection contact holes exposing the second anode connection electrodes (ADNE2).

[0108] In particular, when forming a plurality of pixel electrodes (PE1, PE2, PE3), each touch wire (TLL) is formed with the same metal material through the same photolithography process, etc. on the same process layer as the plurality of pixel electrodes (PE1, PE2, PE3). As shown in Fig. 7, each touch wire (TLL) can be formed and arranged in non-light-emitting areas along the area between adjacent pixel electrodes among the plurality of pixel electrodes (PE1, PE2, PE3).

[0109] After this, at least one light emitting element (LED) may be placed on each of the first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3). Each light emitting element (LED) is placed in a light emitting area where a pixel electrode is formed for each pixel (SP).

[0110] Fig. 8 is a cross-sectional view specifically showing the vertical light-emitting element illustrated in Fig. 5.

[0111] Referring to FIG. 8, each light emitting element (LED) may be a vertical light emitting diode element that extends in a third direction (Z-axis direction) that is the thickness direction of the display panel (100).

[0112] Each light emitting element (LED) may include a first semiconductor layer (SEM1), an electron blocking layer (EBL), an active layer (MQW), a superlattice layer (SLT), a second semiconductor layer (SEM2), and a third semiconductor layer (SEM3).

[0113] The first pixel electrode (PE1) can be formed by including TiO2 (titanium oxide), ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), or MgO (magnesium oxide).

[0114] The first semiconductor layer (SEM1) may be disposed on the first pixel electrode (PE1). The first semiconductor layer (SEM1) may be a p-type semiconductor and may include a semiconductor material having a chemical formula of AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, it may be at least one of p-doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The first semiconductor layer (SEM1) may be doped with a p-type dopant, and the p-type dopant may be Mg, Zn, Ca, Se, Ba, or the like. For example, the first semiconductor layer (SEM1) may be p-GaN doped with p-type Mg.

[0115] An electron blocking layer (EBL) may be disposed on the first semiconductor layer (SEM1). The electron blocking layer (EBL) may be a layer that suppresses or prevents excessive electrons from flowing into the active layer (MQW). For example, the electron blocking layer (EBL) may be p-AlGaN doped with p-type magnesium. Here, the electron blocking layer (EBL) may be omitted.

[0116] The active layer (MQW) can be disposed on the electron blocking layer (EBL). The active layer (MQW) can emit light by the combination of electron-hole pairs in response to an electric signal applied through the first semiconductor layer (SEM1) and the second semiconductor layer (SEM2).

[0117] The active layer (MQW) may include a material having a single or multiple quantum well structure. When the active layer (MQW) includes a material having a multiple quantum well structure, it may have a structure in which multiple well layers and barrier layers are alternately laminated. In this case, the well layers may be formed of InGaN, and the barrier layers may be formed of GaN or AlGaN, but are not limited thereto.

[0118] The active layer (MQW) may have a structure in which semiconductor materials with large band gap energy and semiconductor materials with small band gap energy are alternately laminated, or may include other group III to group V semiconductor materials depending on the wavelength of the light emitted. The light emitted by the active layer (MQW) is not limited to the first light, and may also emit the second light (light in the green wavelength band) or the third light (light in the red wavelength band) depending on the case.

[0119] A superlattice layer (SLT) may be disposed on the active layer (MQW). The superlattice layer (SLT) may be a layer for relieving stress between the second semiconductor layer (SEM2) and the active layer (MQW). For example, the superlattice layer (SLT) may be formed of InGaN or GaN. Alternatively, the superlattice layer (SLT) may be omitted.

[0120] The second semiconductor layer (SEM2) may be disposed on the superlattice layer (SLT). The second semiconductor layer (SEM2) may be an n-type semiconductor. The second semiconductor layer (SEM2) may include a semiconductor material having a chemical formula of AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, it may be at least one of n-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The second semiconductor layer (SEM2) may be doped with an n-type dopant, and the n-type dopant may be Si, Ge, Sn, or the like. For example, the second semiconductor layer (SEM2) may be n-GaN doped with n-type Si.

[0121] The third semiconductor layer (SEM3) may be disposed on the second semiconductor layer (SEM2). The third semiconductor layer (SEM3) may be disposed between the second semiconductor layer (SEM2) and the common electrode (CE). The third semiconductor layer (SEM3) may be an undoped semiconductor. The third semiconductor layer (SEM3) may include the same material as the second semiconductor (SEM2), but may be a material that is not doped with an n-type or p-type dopant. In an exemplary embodiment, the third semiconductor layer (SEM3) may be at least one of undoped InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, but is not limited thereto.

[0122] At least one electrode or bump (BMP) may optionally be further formed on the third semiconductor layer (SEM3). The thickness of the bump (BMP) may be preset or changed depending on the height difference between the third semiconductor layer (SEM3) and the common electrode (CE). The bump (BMP) may be formed of a material such as titanium (Ti), copper (Cu), or an alloy of titanium (Ti) and copper (Cu).

[0123] FIGS. 9A to 9F are plan views sequentially showing the formation process of some pixels, touch contact holes, and light-emitting openings illustrated in FIG. 5.

[0124] Referring sequentially to FIGS. 9A to 9F along with FIG. 5, pixel electrodes (PE1, PE2, PE3) are patterned and formed on the second planarization film (180) to correspond to the light-emitting area of ​​each pixel (SP). And, as shown in FIG. 9A, touch wires (TLL) are patterned in the non-light-emitting areas along the areas between the pixel electrodes (PE1, PE2, PE3).

[0125] As shown in FIG. 9b, a bank (BNL) is formed to cover all of the plurality of pixel electrodes (PE1, PE2, PE3) and touch wires (TLL). And, as shown in FIG. 9c, light-emitting openings (OPN) exposing the first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3) and touch contact holes (TCO) exposing a portion of the touch wires (TLL) are additionally formed in the bank (BNL). The light-emitting openings (OPN) define light-emitting areas for each pixel (SP). Accordingly, the bank (BNL) defines a non-light-emitting area, which is an area between the light-emitting areas of each pixel (SP). In particular, a touch contact hole (TCO) formation area is defined in the bank (BNL) to connect the touch electrodes (SE) of each of the touch wires (TLL) one-to-one with the respective touch wires (TLL).

[0126] As shown in Fig. 9c, a plurality of light emitting elements (LEDs) may be arranged on the first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3) exposed by the light emitting openings (OPNs). Each light emitting element (LED) is arranged in a light emitting area, i.e., the light emitting openings (OPNs), where the pixel electrodes for each pixel (SP) are formed. In addition, a common electrode (CE) that electrically connects all the light emitting elements (LEDs) is formed on the front side of the light emitting element portion (LEP) including the light emitting elements (LEDs) through a patterning process. At this time, the common electrode (CE) may be formed in a flat shape including the planar light emitting openings (OPNs) and touch contact holes (TCOs), or may be formed in a mesh structure through a photolithography process, etc.

[0127] As shown in Fig. 9d, a planarization layer (240) is formed on the front surface of the light emitting element portion (LEP) including the common electrode (CE). And, as shown in Fig. 9e, at least one touch contact hole (TCO) is formed in the planarization layer (240) so that each touch electrode (SE) is connected one-to-one with each touch wiring (TLL) formed on the back surface of the touch electrodes (SE).

[0128] Referring to FIG. 9f, a plurality of touch electrodes (SE) are formed in a planar matrix structure on the front surface of the planarization layer (240). At this time, each of the touch electrodes (SE) is electrically connected to each of the touch wirings (TLL) through at least one touch contact hole (TCO) formed to penetrate at least one planarization layer (240), a common electrode (CE), and a bank (BNL).

[0129] FIG. 10 is a cross-sectional view according to a second embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0130] Referring to FIG. 10, a first planarization film (160) is formed on the first anode connection electrode (ADNE1) including the thin film transistors (T1, T2, T3) to planarize the steps caused by the thin film transistors (T1, T2, T3). In addition, a plurality of second connection contact holes (ANCT2) that expose the first anode connection electrodes (ADNE1) are additionally patterned and formed on the first planarization film (160).

[0131] A plurality of second anode connection electrodes (ADNE2) are formed on the first planarization film (160) on which a plurality of second connection contact holes (ANCT2) are formed.

[0132] In particular, when forming a plurality of second anode connection electrodes (ADNE2), each touch wire (TLL) can be formed of the same metal material through the same photolithography process or the like on the same process layer as the plurality of second anode connection electrodes (ADNE2). As shown in Fig. 10, each touch wire (TLL) can be formed and arranged in non-light-emitting regions along the region between adjacent second anode connection electrodes (ADNE2) among the plurality of second anode connection electrodes (ADNE2).

[0133] Thereafter, a second planarization film (180) is formed on the entire surface of the first planarization film (160) so as to cover the first planarization film (160) including the second anode connection electrode (ADNE2) along with each of the touch wirings (TLL).

[0134] In the second planarization film (180), touch contact holes (TCO) are formed so that each touch wire (TLL) is partially exposed, and connection contact holes are formed so that each second anode connection electrode (ADNE2) is exposed. In addition, pixel electrodes (PE1, PE2, PE3) are patterned and formed on the second planarization film (180) so as to correspond to the light-emitting area of ​​each pixel (SP).

[0135] A bank (BNL) is formed on a second planarization film (180) including a plurality of pixel electrodes (PE1, PE2, PE3) and touch contact holes (TCOs). In the bank (BNL), light-emitting openings (OPNs) exposing the first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3) and touch contact holes (TCOs) exposing a portion of the touch wires (TLLs) are additionally formed. In the bank (BNL), a touch contact hole (TCO) formation area is defined that connects the touch electrodes (SE) of each of the touch wires (TLLs) one-to-one with the respective touch wires (TLLs).

[0136] A plurality of light emitting elements (LEDs) are arranged on a first pixel electrode (PE1), a second pixel electrode (PE2), and a third pixel electrode (PE3) exposed by light emitting openings (OPNs). A common electrode (CE) electrically connecting the light emitting elements (LEDs) is formed on the front side of a light emitting element portion (LEP) including the light emitting elements (LEDs). At this time, the common electrode (CE) may be formed in a flat plate shape including planar light emitting openings (OPNs) and touch contact holes (TCOs), or may be formed in a mesh structure through a photolithography process, etc.

[0137] A planarization layer (240) is formed on the front surface of the light emitting element portion (LEP) including the common electrode (CE). In addition, at least one touch contact hole (TCO) is formed in the planarization layer (240) so that each touch electrode (SE) is connected one-to-one with each touch wire (TLL) formed on the back surface of the touch electrodes (SE).

[0138] A plurality of touch electrodes (SE) are formed in a planar matrix structure on the entire surface of the planarization layer (240). At this time, each of the touch electrodes (SE) is electrically connected to each of the touch wires (TLL) through at least one touch contact hole (TCO) formed to penetrate at least one planarization layer (240), a common electrode (CE), and a bank (BNL).

[0139] Meanwhile, a color filter layer (CFL) may be arranged on the front side of the planarization layer (240) including a plurality of touch electrodes (SE). The color filter layer (CFL) may be formed on the front side of the planarization layer (240) including a plurality of touch electrodes (SE) by including a color filter (CF) such as red, green, and blue and a black matrix (BM). The color filters (CF) such as red, green, and blue may be arranged to correspond to the light-emitting area defined by the bank (BNL) and the front side direction of the light-emitting elements (LEDs). In addition, the black matrix (BM) may be formed in non-light-emitting areas between the light-emitting areas.

[0140] FIG. 11 is a cross-sectional view according to a third embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0141] Referring to FIG. 11, a plurality of horizontal light-emitting elements (LEDs) can be arranged on the first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3) exposed by the light-emitting apertures (OPN).

[0142] In order to supply a common voltage to a plurality of horizontal light emitting diodes (LEDs), a common voltage line (112) may first be formed on a barrier film (BR) of a substrate (SUB). Then, a protective film (114) for planarization may be formed on the barrier film (BR) including the common voltage line (112).

[0143] When forming a first connection contact hole (ANCT1) penetrating the gate insulating layer (130), the first interlayer insulating film (141), and the second interlayer insulating film (142) in the second interlayer insulating film (142), a common wiring connection contact hole is also formed simultaneously so that the common voltage wiring (112) is exposed. The first interlayer insulating film (141), the second interlayer insulating film (142), and the protective film (114) are patterned so that the common voltage wiring (112) is exposed.

[0144] In the process of forming the first anode connection electrode (ADNE1) on the second interlayer insulating film (142), the first common connection electrode (SNE1) is formed using the same material through the same process process in the same process layer as the first anode connection electrode (ADNE1).

[0145] A first planarization film (160) is formed on the second interlayer insulating film (142), and a first common connection electrode (SNE1) connection contact hole is simultaneously formed so that the first common connection electrode (SNE1) is exposed together with a second connection contact hole (ANCT2) penetrating the first planarization film (160).

[0146] A second anode connection electrode (ADNE2) is formed on the first planarization film (160), and a second planarization film (180) is formed on the first planarization film (160) on which the second anode connection electrode (ADNE2) is formed. In the patterning process for forming connection contact holes so that the second anode connection electrodes (ADNE2) are each exposed, a first common connection electrode (SNE1) connection contact hole is additionally formed.

[0147] In the second planarization film (180), connection contact holes are formed so that the second anode connection electrodes (ADNE2) are each exposed, and pixel electrodes (PE1, PE2, PE3) are patterned in the light-emitting area of ​​each pixel (SP), including the connection contact holes exposing the second anode connection electrodes (ADNE2).

[0148] In particular, when forming a plurality of pixel electrodes (PE1, PE2, PE3), a plurality of common connection electrodes (EE1, EE2, EE3) and respective touch wires (TLL) are formed with the same metal material through the same photolithography process, etc. on the same process layer as the plurality of pixel electrodes (PE1, PE2, PE3). As shown in Fig. 12, the respective touch wires (TLL) can be formed and arranged in non-light-emitting regions along the regions between adjacent pixel electrodes among the plurality of pixel electrodes (PE1, PE2, PE3). The plurality of common connection electrodes (EE1, EE2, EE3) are connected one-to-one with the first common connection electrodes (SNE1) through the first common connection electrode (SNE1) connection contact holes.

[0149] After this, at least one light emitting element (LED) may be arranged on each of the first pixel electrode (PE1) and the first common connection electrode (EE1), the second pixel electrode (PE2) and the second common connection electrode (EE2), and the third pixel electrode (PE3) and the third common connection electrode (EE3).

[0150] A planarization layer (240) may be placed on the front surface of the light emitting element (LEP). The planarization layer (240) may planarize the upper and lower steps so that a touch electrode (SE) described later may be formed.

[0151] At least one touch contact hole (TCO) is formed in the flattening layer (240) so that each touch electrode (SE) is connected one-to-one with each touch wire (TLL) formed on the back surface of the touch electrodes (SE).

[0152] A plurality of touch electrodes (SE) are formed in a planar matrix structure on the entire surface of the planarization layer (240). At this time, each of the touch electrodes (SE) is electrically connected to each of the touch wires (TLL) through at least one touch contact hole (TCO) formed to penetrate at least one planarization layer (240), a common electrode (CE), and a bank (BNL).

[0153] Fig. 12 is a cross-sectional view illustrating the formation process of the first and second pixel electrodes and touch signal wires of the pixels illustrated in Fig. 11. And Fig. 13 is a plan view showing the planar arrangement structure of the first and second pixel electrodes, touch signal wires, and horizontal light-emitting elements illustrated in Fig. 12.

[0154] Referring to FIGS. 12 and 13, a second anode connection electrode (ADNE2) is formed on a first planarization film (160), and a second planarization film (180) is formed on the first planarization film (160) on which the second anode connection electrode (ADNE2) is formed. Connection contact holes are formed in the second planarization film (180) so that the second anode connection electrodes (ADNE2) are respectively exposed, and in the patterning process of forming the connection contact holes so that the second anode connection electrodes (ADNE2) are respectively exposed, a first common connection electrode (SNE1) connection contact hole is additionally formed.

[0155] Each pixel electrode (PE1, PE2, PE3) is patterned in the light-emitting area of ​​each pixel (SP), including the connection contact holes that expose the second anode connection electrode (ADNE2). In particular, when forming a plurality of pixel electrodes (PE1, PE2, PE3), a plurality of common connection electrodes (EE1, EE2, EE3) and respective touch wires (TLL) are formed with the same metal material through the same photolithography process on the same process layer as the plurality of pixel electrodes (PE1, PE2, PE3).

[0156] As shown in Fig. 13, each touch wire (TLL) can be formed and arranged in non-light-emitting areas along the area between adjacent pixel electrodes among a plurality of pixel electrodes (PE1, PE2, PE3).

[0157] After this, at least one light emitting element (LED) may be arranged on each of the first pixel electrode (PE1) and the first common connection electrode (EE1), the second pixel electrode (PE2) and the second common connection electrode (EE2), and the third pixel electrode (PE3) and the third common connection electrode (EE3). Alternatively, when at least one light emitting element (LED) is arranged in an upward direction (e.g., in the front direction where an image is displayed), the first to third pixel electrodes (PE1, PE2, PE3) and the first to third common connection electrodes (EE1, EE2, EE3) may be arranged and connected in an upward direction of each light emitting element (LED), respectively.

[0158] Fig. 14 is a cross-sectional view specifically showing the horizontal light-emitting element illustrated in Fig. 13.

[0159] Referring to FIG. 14, a horizontal light emitting element (LED) is arranged so that the first and second bumps (BMP1, BMP2) are in electrical contact with the first pixel electrode (PE1) and the first common connection electrode (EE1), the second pixel electrode (PE2) and the second common connection electrode (EE2), or the third pixel electrode (PE3) and the third common connection electrode (EE3).

[0160] Each light emitting element (LED) may include a first semiconductor layer (SEM1), an electron blocking layer (EBL), an active layer (MQW), a superlattice layer (SLT), a second semiconductor layer (SEM2), and a third semiconductor layer (SEM3).

[0161] The first semiconductor layer (SEM1) may be a p-type semiconductor and may include a semiconductor material having a chemical formula of AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, it may be at least one of p-doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The first semiconductor layer (SEM1) may be doped with a p-type dopant, and the p-type dopant may be Mg, Zn, Ca, Se, Ba, or the like. For example, the first semiconductor layer (SEM1) may be p-GaN doped with p-type Mg.

[0162] An electron blocking layer (EBL) may be disposed on the back surface of the first semiconductor layer (SEM1). The electron blocking layer (EBL) may be p-AlGaN doped with p-type Mg. Here, the electron blocking layer (EBL) may be omitted.

[0163] The active layer (MQW) may be arranged on the back surface of the electron blocking layer (EBL). The active layer (MQW) may emit light by the combination of electron-hole pairs according to an electric signal applied through the first semiconductor layer (SEM1) and the second semiconductor layer (SEM2). The active layer (MQW) may include a material having a single or multiple quantum well structure. When the active layer (MQW) includes a material having a multiple quantum well structure, it may have a structure in which a plurality of well layers and barrier layers are alternately stacked. In this case, the well layer may be formed of InGaN, and the barrier layer may be formed of GaN or AlGaN, but is not limited thereto.

[0164] The active layer (MQW) may have a structure in which semiconductor materials with large band gap energy and semiconductor materials with small band gap energy are alternately laminated, or may include other group III to group V semiconductor materials depending on the wavelength of the light emitted. The light emitted by the active layer (MQW) is not limited to the first light, and may also emit the second light (light in the green wavelength band) or the third light (light in the red wavelength band) depending on the case.

[0165] A superlattice layer (SLT) may be arranged on the back surface of the active layer (MQW). The superlattice layer (SLT) may be a layer for relieving stress between the second semiconductor layer (SEM2) and the active layer (MQW). The superlattice layer (SLT) may be formed of InGaN or GaN.

[0166] A second bump (BMP2) is arranged on one surface of the superlattice layer (SLT), and the second bump (BMP2) can be in electrical contact with one common connection electrode (EE1, EE2, EE3). The thickness or width of the second bump (BMP2) is formed to correspond to the gap between the superlattice layer (SLT) and one common connection electrode (EE1, EE2, EE3). The second bump (BMP2) can be formed of a material such as titanium (Ti), copper (Cu), or an alloy of titanium (Ti) and copper (Cu).

[0167] A second semiconductor layer (SEM2) is formed and arranged on another side of the superlattice layer (SLT) without the second bump (BMP2). The second semiconductor layer (SEM2) may be an n-type semiconductor. The second semiconductor layer (SEM2) may be a semiconductor material having a chemical formula of AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), for example, at least one of n-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The second semiconductor layer (SEM2) may be doped with an n-type dopant, and the n-type dopant may be Si, Ge, Sn, or the like. For example, the second semiconductor layer (SEM2) may be n-GaN doped with n-type Si.

[0168] The third semiconductor layer (SEM3) may be disposed on the back surface of the second semiconductor layer (SEM2). The third semiconductor layer (SEM3) may be disposed between the second semiconductor layer (SEM2) and the common electrode (CE). The third semiconductor layer (SEM3) may be an undoped semiconductor. The third semiconductor layer (SEM3) may include the same material as the second semiconductor (SEM2), but may be a material that is not doped with an n-type or p-type dopant.

[0169] At least one electrode or a first bump (BMP1) is optionally formed on the third semiconductor layer (SEM3). The thickness or width of the first bump (BMP1) may be preset or changed depending on the gap between the third semiconductor layer (SEM3) and one of the pixel electrodes (PE1, PE2, PE3). The first bump (BMP1) may be formed of a material such as titanium (Ti), copper (Cu), or an alloy of titanium (Ti) and copper (Cu).

[0170] Figures 15a to 15d are plan views sequentially showing the formation process of some pixels and touch contact holes and light-emitting openings illustrated in Figure 11.

[0171] Referring sequentially to FIGS. 15a to 15d together with FIGS. 11 and 13, first, as shown in FIG. 13, pixel electrodes (PE1, PE2, PE3) and common connection electrodes (EE1, EE2, EE3) are patterned and formed on the second planarization film (180) to correspond to the light-emitting area of ​​each pixel (SP), and touch wirings (TLL) are patterned in the non-light-emitting areas between the light-emitting areas.

[0172] Next, as shown in FIGS. 11 and 15a, a bank (BNL) is formed to cover all of the pixel electrodes (PE1, PE2, PE3), the common connection electrodes (EE1, EE2, EE3), and the touch wires (TLL), and light-emitting openings (OPN) exposing the pixel electrodes (PE1, PE2, PE3) and the common connection electrodes (EE1, EE2, EE3) and touch contact holes (TCO) exposing a portion of the touch wires (TLL) are additionally formed in the bank (BNL). In particular, a touch contact hole (TCO) formation area that connects the touch electrodes (SE) of each of the touch wires (TLL) one-to-one with the touch wires (TLL) is defined in the bank (BNL).

[0173] As shown in Fig. 15b, at least one light emitting element (LED) is disposed on each of the first pixel electrode (PE1) and the first common connection electrode (EE1), the second pixel electrode (PE2) and the second common connection electrode (EE2), and the third pixel electrode (PE3) and the third common connection electrode (EE3). That is, each light emitting element (LED) is disposed in each light emitting region, i.e., light emitting opening (OPN), where pixel electrodes (PE1, PE2, PE3) and common connection electrodes (EE1, EE2, EE3) for each pixel (SP) are formed.

[0174] As shown in Fig. 15c, a planarization layer (240) is formed on the front surface of the bank (BNL) including each light-emitting element (LED), and as shown in Fig. 15d, a plurality of touch electrodes (SE) are formed in a planar matrix structure on the front surface of the planarization layer (240). At this time, each of the touch electrodes (SE) is electrically connected to each of the touch wirings (TLL) through at least one touch contact hole (TCO) formed to penetrate at least one planarization layer (240) and the bank (BNL).

[0175] FIG. 16 is a cross-sectional view according to a fourth embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIGS. 1 and 2.

[0176] As illustrated in FIG. 16, a color filter layer (CFL) may be arranged on the front side of the planarization layer (240) including a plurality of touch electrodes (SE). The color filter layer (CFL) may be formed on the front side of the planarization layer (240) including a plurality of touch electrodes (SE) by including a color filter (CF) of red, green, blue, etc. and a black matrix (BM). The color filters (CF) of red, green, blue, etc. may be arranged to correspond to the light-emitting area defined by the bank (BNL) and the front side direction of the light-emitting elements (LEDs). In addition, the black matrix (BM) may be formed in non-light-emitting areas, which are areas between the light-emitting areas.

[0177] Fig. 17 is a layout diagram schematically showing the arrangement structure of touch sensing electrodes and touch signal wires according to the second embodiment of the present invention.

[0178] Through Fig. 17, an example is described in which the touch electrodes (SE) of the main area (MA) are configured and arranged to include two types of electrodes, for example, drive electrodes (TE) and sense electrodes (RE). In the case of touch electrodes (SE) in which the drive electrodes (TE) and sense electrodes (RE) are separated, a touch is detected by a mutual capacitance method in which a touch driving signal is applied to the drive electrodes (TE) and then the change in charge of the mutual capacitance of each of a plurality of touch nodes is detected through the sense electrodes (RE).

[0179] In Fig. 17, for convenience of explanation, only some of the touch electrodes (SE), dummy patterns (DME), and touch wiring (TLL) composed of driving electrodes (TE) and sensing electrodes (RE) are illustrated.

[0180] The main area (MA) of the touch sensing unit (TSU) includes a touch detection area (TSA) for detecting a user's touch and a touch peripheral area (TPA) arranged around the touch detection area (TSA). The touch detection area (TSA) may overlap the display area (DA), and the touch peripheral area (TPA) may overlap the non-display area (NDA).

[0181] Drive electrodes (TEs), sense electrodes (REs), and dummy patterns (DMEs) are arranged in a touch sensing area (TSA). The drive electrodes (TEs) and sense electrodes (REs) may be electrodes that form mutual capacitance to detect the touch of an object or a person.

[0182] The sensing electrodes (RE) can be arranged in parallel in a first direction (X-axis direction) and a second direction (Y-axis direction). The sensing electrodes (RE) can be electrically connected in the first direction (X-axis direction). The sensing electrodes (RE) that are adjacent in the first direction (X-axis direction) can be connected to each other. The sensing electrodes (RE) that are adjacent in the second direction (Y-axis direction) can be electrically isolated from each other. Accordingly, a touch node that forms a mutual capacitance can be arranged at each of the intersections of the driving electrodes (TE) and the sensing electrodes (RE). A plurality of touch nodes can correspond to the intersections of the driving electrodes (TE) and the sensing electrodes (RE).

[0183] The driving electrodes (TE) can be arranged in parallel in a first direction (X-axis direction) and a second direction (Y-axis direction). The driving electrodes (TE) adjacent in the first direction (X-axis direction) can be electrically separated from each other. The driving electrodes (TE) can be electrically connected in the second direction (Y-axis direction). The driving electrodes (TE) adjacent in the second direction (Y-axis direction) can also be connected to each other through a separate connecting electrode.

[0184] Each of the dummy patterns (DME) may be arranged in a form surrounded by a driving electrode (TE) or a sensing electrode (RE). Each of the dummy patterns (DME) may be electrically separated from the driving electrode (TE) or the sensing electrode (RE). Each of the dummy patterns (DME) may be arranged apart from the driving electrode (TE) or the sensing electrode (RE). Each of the dummy patterns (DME) may be electrically floated.

[0185] In Fig. 17, it is exemplified that each of the driving electrodes (TE), the sensing electrodes (RE), and the dummy patterns (DME) has a planar shape of a rhombus, but this is not limited thereto. For example, each of the driving electrodes (TE), the sensing electrodes (RE), and the dummy patterns (DME) may have a planar shape of a square other than a rhombus, a polygon other than a square, a circle, or an ellipse.

[0186] First touch wires (TLLs) electrically connected to the driving electrodes (TEs), and second touch wires (TLLs) electrically connected to the sensing electrodes (REs), can be formed and arranged in the display area (DA) and the non-display area (NDA) of the display panel (100).

[0187] The first and second touch wires (TLL1, TLL2) may be formed of the same metal material through the same process on the same process layer as the pixel electrodes of the pixels (SPs) formed in the display area (DA). Alternatively, each touch wire (TLL) may be formed of the same metal material through the same process on the same process layer as the connection electrodes, connection wires, or contact electrodes of the pixels (SPs) formed in the display area (DA), in addition to the pixel electrodes of the pixels (SPs).

[0188] Each of the driving electrodes (TE) and the sensing electrodes (RE) is connected one-to-one to each of the first and second touch wires (TLL1, TLL2) through at least one touch contact hole penetrating at least one layer or film among at least one insulating layer, at least one planarization layer (240), at least one bank (BNL), and at least one planarization film (180).

[0189] The touch driving circuit (400) supplies driving signals to the driving electrodes (TE) through the first touch wires (TLL1) and receives detection signals from the detection electrodes (RE) through the second touch wires (TLL2), thereby sensing the amount of change in electrostatic capacity between the driving electrodes (TE) and the detection electrodes (RE). The touch driving circuit (400) can determine whether a user's touch input has occurred and calculate touch coordinates based on the amount of change in electrostatic capacity between the driving electrodes (TE) and the detection electrodes (RE).

[0190] FIG. 18 is a cross-sectional view according to a fifth embodiment showing a part of the cross-sectional arrangement structure of pixels, touch sensing electrodes, and touch signal wiring of the display panel illustrated in FIG. 17.

[0191] Referring to FIG. 18, on the second planarization film (180), pixel electrodes (PE1, PE2, PE3) are patterned and formed to correspond to the light-emitting area of ​​each pixel (SP), and touch wires (TLL) are patterned in the non-light-emitting areas along the areas between the pixel electrodes (PE1, PE2, PE3).

[0192] A bank (BNL) is formed to cover all of a plurality of pixel electrodes (PE1, PE2, PE3) and touch wires (TLL), and light-emitting openings (OPN) exposing a first pixel electrode (PE1), a second pixel electrode (PE2), and a third pixel electrode (PE3) and touch contact holes (TCO) exposing a portion of the touch wires (TLL) are additionally formed in the bank (BNL). The light-emitting openings (OPN) define light-emitting areas for each pixel (SP). Accordingly, the bank (BNL) defines a non-light-emitting area, which is an area between the light-emitting areas of each pixel (SP). In particular, a touch contact hole (TCO) formation area is defined in the bank (BNL) for connecting the touch electrodes (SE) of each of the touch wires (TLL) one-to-one with the respective touch wires (TLL).

[0193] A plurality of light-emitting elements (LEDs) can be arranged on the first pixel electrode (PE1), the second pixel electrode (PE2), and the third pixel electrode (PE3) exposed by the light-emitting apertures (OPNs).

[0194] A common electrode (CE) that electrically connects all the light emitting elements (LEDs) is formed on the front surface of a light emitting diode (LEP) including light emitting diodes (LEDs) through a patterning process. At this time, the common electrode (CE) may be formed in a flat shape including planar light emitting openings (OPNs) and touch contact holes (TCOs), or may be formed in a mesh structure through a photolithography process, etc.

[0195] A planarization layer (240) is formed on the front surface of the light emitting element portion (LEP) including the common electrode (CE). Connection electrodes are formed and arranged on the planarization layer (240). The connection electrodes are formed by first forming a second conductive metal layer for forming connection electrodes on the planarization layer (240), applying a photoresist layer on the second conductive metal layer, and then performing a patterning process.

[0196] Depending on the depth of the touch contact hole (TCO), it may be difficult to electrically connect each touch wire (TLL). In this case, in order to electrically connect each touch wire (TLL) through the touch contact hole (TCO), when forming the connection electrode, the same electrode material as the connection electrode may be first connected to the touch contact hole (TCO). Then, a touch insulating film (242) is formed on the planarization layer (240) including the connection electrodes. The touch insulating film (242) is formed by applying an insulating material layer for forming the touch insulating film (242) to the entire surface of the planarization layer (240) including the connection electrodes.

[0197] Touch contact holes are formed in the touch insulating film (242) so that a portion of the front surface of the connection electrodes is exposed, and driving electrodes (TE) and sensing electrodes (RE) are formed on the touch insulating film (242) on which the touch contact holes are formed.

[0198] Although embodiments of the present invention have been described with reference to the attached drawings, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical spirit or essential characteristics of the present invention. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.

Claims

1. A display panel having multiple pixels arranged in a display area; A touch sensing unit having a plurality of touch electrodes arranged on the front of the above display panel; It includes a touch driving circuit that supplies driving signals to the plurality of touch electrodes through a plurality of touch wires and detects the touch position coordinates of the touch sensing unit, The plurality of touch wires are formed and arranged in the back direction of at least one touch electrode so as to overlap with at least one touch electrode among the plurality of touch electrodes, The plurality of touch electrodes are connected one-to-one with the plurality of touch wires through at least one touch contact hole, A display device in which the plurality of touch wires are formed of the same metal material in the same process layer as at least one electrode included in the plurality of pixels formed in the display area.

2. In paragraph 1, The above plurality of touch electrodes are arranged in a planar matrix structure on the entire surface of the display area, The above plurality of touch wires extend from the display area to the non-display area, A display device in which one end of each of the plurality of touch wires is electrically connected to at least one touch electrode among the plurality of touch electrodes through at least one touch contact hole, and the other end is electrically connected to the touch driving circuit.

3. In paragraph 2, The above plurality of touch electrodes It includes drive electrodes and sensing electrodes arranged alternately in a planar matrix structure on the front surface of the above display area, The above plurality of touch wires extend from the display area to the non-display area, Among the plurality of touch wires, one end of each of the plurality of first touch wires is electrically connected to at least one of the drive electrodes through at least one touch contact hole, and the other end is electrically connected to the touch drive circuit. A display device in which one end of each of the plurality of second touch wires among the plurality of touch wires is electrically connected to at least one of the sensing electrodes through at least one touch contact hole, and the other end is electrically connected to the touch driving circuit.

4. In paragraph 2, The above multiple touch wires are A display device formed of the same metal material through the same process on the same process layer as the connecting electrode of the thin film transistor formed in the above display area or at least one of the wirings.

5. In paragraph 4, At least one touch contact hole is A display device formed to expose at least one touch wire among the plurality of touch wires by penetrating at least one layer among at least one planarization layer, at least one organic or inorganic insulating layer, and at least one organic or inorganic protective layer.

6. In paragraph 5, At least one touch contact hole is A display device formed to expose at least one touch wire among the plurality of touch wires by penetrating at least one of the at least one planarization layer, the at least one organic or inorganic insulating layer, the at least one organic or inorganic protective layer, and at least one metal electrode.

7. In paragraph 2, The above plurality of pixels At least one first organic or inorganic insulating layer, a first anode electrode, a second organic or inorganic insulating layer, a second anode electrode, a planarization layer, a pixel electrode, a bank, and a common electrode sequentially laminated on the front surface of at least one plurality of thin film transistors, The above multiple touch wires are Formed with the same metal material through the same process on the same process layer as the above pixel electrode, or A display device formed of the same metal material through the same process on the same process layer as the first anode electrode or the second anode electrode.

8. In paragraph 7, The plurality of touch electrodes are connected one-to-one with the plurality of touch wires through at least one of the touch contact holes, At least one touch contact hole is A display device formed so as to expose at least one touch wire among the plurality of touch wires by penetrating at least one layer of the at least one first organic or inorganic insulating layer, the second organic or inorganic insulating layer, the planarization layer, and the bank.

9. In paragraph 8, At least one touch contact hole is A display device formed to expose at least one touch wire among the plurality of touch wires by penetrating at least one layer or film of the at least one first organic or inorganic insulating layer, the second organic or inorganic insulating layer, the planarization layer, the bank, and the common electrode.

10. In paragraph 2, A display device in which a color filter layer is further formed in the front direction of the touch sensing unit in which the plurality of touch electrodes are arranged.

11. A display panel having multiple pixels arranged in a display area; A touch sensing unit having a plurality of touch electrodes arranged on the front of the above display panel; A display driving circuit for driving the plurality of pixels; It includes a touch driving circuit that detects the touch position coordinates of the above touch sensing unit, The plurality of touch wires are formed and arranged in the display area of ​​the display panel so as to overlap with at least one touch electrode among the plurality of touch electrodes, The plurality of touch electrodes are connected one-to-one with the plurality of touch wires through at least one touch contact hole, A display device in which the at least one touch contact hole is formed to expose the plurality of touch wires by penetrating at least one of a planarization layer of the display area, at least one organic or inorganic insulating layer, and at least one organic or inorganic protective layer.

12. In paragraph 11, The above plurality of touch electrodes are arranged in a planar matrix structure on the entire surface of the display area, The above plurality of touch wires extend from the display area to the non-display area, A display device in which one end of each of the plurality of touch wires is electrically connected to at least one touch electrode among the plurality of touch electrodes through at least one touch contact hole, and the other end is electrically connected to the touch driving circuit.

13. In paragraph 12, The above plurality of touch electrodes It includes drive electrodes and sensing electrodes arranged alternately in a planar matrix structure on the front surface of the above display area, The above plurality of touch wires extend from the display area to the non-display area, Among the plurality of touch wires, one end of each of the plurality of first touch wires is electrically connected to at least one of the drive electrodes through at least one touch contact hole, and the other end is electrically connected to the touch drive circuit. A display device in which one end of each of the plurality of second touch wires among the plurality of touch wires is electrically connected to at least one of the sensing electrodes through at least one touch contact hole, and the other end is electrically connected to the touch driving circuit.

14. In paragraph 12, The above multiple touch wires are The pixel electrodes included in the plurality of pixels formed in the display area are formed with the same metal material through the same process in the same process layer, or A display device formed of the same metal material through the same process on the same process layer as the connecting electrode of the thin film transistor formed in the above display area or at least one of the wirings.

15. In paragraph 14, The plurality of touch electrodes are connected one-to-one with the plurality of touch wires through at least one of the touch contact holes, A display device in which at least one touch contact hole is formed to penetrate at least one layer and expose at least one touch wire among the plurality of touch wires.

16. In paragraph 15, At least one touch contact hole is A display device formed to expose at least one touch wire among the plurality of touch wires by penetrating at least one layer and at least one metal electrode.

17. In paragraph 12, The above plurality of pixels At least one first organic or inorganic insulating layer, a first anode electrode, a second organic or inorganic insulating layer, a second anode electrode, a planarization layer, a pixel electrode, a bank, and a common electrode sequentially laminated on the front surface of at least one plurality of thin film transistors, The above multiple touch wires are Formed with the same metal material through the same process on the same process layer as the above pixel electrode, or A display device formed of the same metal material through the same process on the same process layer as the first anode electrode or the second anode electrode.

18. In paragraph 17, The plurality of touch electrodes are connected one-to-one with the plurality of touch wires through at least one of the touch contact holes, At least one touch contact hole is A display device formed to expose at least one touch wire among the plurality of touch wires by penetrating at least one layer or film among the at least one first organic or inorganic insulating layer, the second organic or inorganic insulating layer, the planarizing layer, and the bank.

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