Display panel and display device

Abstract

The present application discloses a display panel and a display device. The display panel comprises a substrate, a first conductive layer, and a second conductive layer. The second conductive layer is located on the side of the first conductive layer facing away from the substrate, and the second conductive layer is at least partially in contact with the first conductive layer, so that the second conductive layer and the first conductive layer are at least partially electrically conductive. By means of the embodiments of the present application, the thickness of the second conductive layer is set to be greater than the thickness of the first conductive layer, so that the conductive structure has the advantages of different thicknesses.

Description

Display panel and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese Patent Application No. 202410383350.4, filed on March 29, 2024, entitled “Display Panel and Display Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of display, and in particular to a display panel and a display device. Background Art

[0004] In recent years, organic light-emitting diode (OLED) displays have attracted increasing attention from the industry due to their superior performance. Compared to liquid crystal displays (LCDs), which currently dominate the market, OLED displays offer a range of advantages, including light weight, reduced thickness, low power consumption, vivid colors, fast response times, wide viewing angles, and the ability to create flexible displays.

[0005] Due to the influence of ambient temperature, the film layers inside the display panel expand. However, the expansion amounts of the film layers vary, causing the film layers inside the display panel to bend, thereby reducing the service life of the display panel.

[0006] Summary of the Invention

[0007] Embodiments of the present application provide a display panel and a display device, which are intended to reduce the thermal expansion of a film layer inside the display panel.

[0008] In a first aspect, an embodiment of the present application provides a display panel, which further includes a substrate, a first conductive layer, and a second conductive layer; the first conductive layer is located on the substrate; the second conductive layer is located on a side of the first conductive layer facing away from the substrate, wherein the first conductive layer and the second conductive layer are at least partially in contact, and the thickness of the second conductive layer is greater than the thickness of the first conductive layer.

[0009] An embodiment of the second aspect of the present application provides a display device, which includes the display panel of any of the above embodiments.

[0010] According to an embodiment of the present application, the display panel includes a substrate, a first conductive layer, and a second conductive layer. The second conductive layer is located on a side of the first conductive layer facing away from the substrate, and the second conductive layer and the first conductive layer are at least partially in contact, so that the second conductive layer and the first conductive layer are at least partially electrically conductive. According to the embodiment of the present application, the thickness of the second conductive layer is set to be greater than the thickness of the first conductive layer, so that the conductive structure can have the advantages of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0012] FIG1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0013] FIG2 is a schematic top view of a display panel provided in an embodiment of the present application;

[0014] FIG3 is a partial cross-sectional view of a display panel provided in another embodiment;

[0015] FIG4 is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0016] FIG5 is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0017] FIG6 is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0018] FIG7 is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0019] FIG8 is a partial enlarged view of the pad;

[0020] FIG9 is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0021] FIG10 is a partial top view of a display panel provided in another embodiment;

[0022] FIG11 is a partial cross-sectional view of the first binding area in FIG10;

[0023] FIG12 is a partial cross-sectional view of the first binding area in FIG10 provided by another embodiment;

[0024] FIG13 is a partial top view of a display panel provided in yet another embodiment;

[0025] FIG14 is a partial enlarged view of FIG13;

[0026] FIG15 is a cross-sectional view taken along line AA in FIG13 ;

[0027] FIG16 is a cross-sectional view taken along line BB in FIG13 ;

[0028] FIG17 is a cross-sectional view taken along line CC in FIG13 ;

[0029] FIG18 is a partial top view of a display panel provided in yet another embodiment;

[0030] FIG19 is a partial enlarged view of FIG18;

[0031] FIG20 is a cross-sectional view of PP in FIG19;

[0032] FIG21 is a partial top view of a display panel provided in yet another embodiment;

[0033] FIG22 is a cross-sectional view taken along line DD in FIG21 ;

[0034] FIG23 is a cross-sectional view taken along line DD in FIG21 provided by another embodiment;

[0035] FIG24 is a partial top view of a display panel provided in yet another embodiment;

[0036] FIG25 is a partial cross-sectional view of the first binding area in FIG24;

[0037] FIG26 is a partial cross-sectional view of the first binding area in FIG24 provided by another embodiment;

[0038] FIG27 is a cross-sectional view taken along line A'-A' in FIG24;

[0039] FIG28 is a cross-sectional view taken along line B'-B' in FIG24;

[0040] FIG29 is a cross-sectional view taken along line C'-C' in FIG24;

[0041] FIG30 is a partial enlarged view of FIG24;

[0042] FIG31 is a partial top view of a display panel provided in yet another embodiment;

[0043] FIG32 is a cross-sectional view taken along line D'-D' in FIG31;

[0044] FIG. 33 is a partial cross-sectional view of a first binding region provided in another embodiment.

[0045] Explanation of Reference Numerals: 10, display panel; 20, first binding area; 30, first routing area; 31, first wiring area; 32, second routing area; 33, third wiring area; 40, second binding area; 50, second routing area; 60, third binding area; AA, display area; NA, non-display area; 100, substrate; 200, first conductive layer; 210, conductive trace; 211, first trace; 212, second trace; 220, third opening; 300, second conductive layer; 310, pad; 311, top surface; 312, first pad; 313, second pad; 314, third pad; 315, gap; 320, first recessed portion; 400, covering layer; 410, covering portion; 420, first opening; 500, insulating layer; 510, insulating portion; 520, second opening; 530, hollow portion; 600, chemically plated metal layer; 610, chemically plated metal portion. DETAILED DESCRIPTION

[0046] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0047] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0048] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0049] Embodiments of the present application provide a display panel and a display device. Embodiments of the display panel and the display device will be described below with reference to the accompanying drawings.

[0050] Please refer to FIG. 1 , which is a partial cross-sectional view of a display panel provided in an embodiment of the present application.

[0051] As shown in Figure 1, the first embodiment of the present application provides a display panel 10, which also includes: a substrate 100; a first conductive layer 200, located on the substrate 100; and a second conductive layer 300, located on the side of the first conductive layer 200 facing away from the substrate 100, wherein the first conductive layer 200 and the second conductive layer 300 are at least partially in contact, and the thickness of the second conductive layer 300 is greater than the thickness of the first conductive layer 200.

[0052] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, a first conductive layer 200, and a second conductive layer 300. The second conductive layer 300 is located on the side of the first conductive layer 200 facing away from the substrate 100, and the second conductive layer 300 and the first conductive layer 200 are at least partially in contact, so that the second conductive layer 300 and the first conductive layer 200 are at least partially electrically conductive. The thickness of the second conductive layer 300 is greater than that of the first conductive layer 200. In order to make the insulating material film layers corresponding to the first conductive layer 200 and the second conductive layer 300 flatter, the insulating material corresponding to the second conductive layer 300 should be thicker than the insulating material corresponding to the first conductive layer 200. Due to the difference in thickness and fixed expansion coefficient of the insulating materials corresponding to the first conductive layer 200 and the second conductive layer 300, the difference in thermal expansion occurs when the corresponding insulating materials expand due to temperature changes, thereby causing the display panel 10 to bend.

[0053] Through the embodiments of the present application, the conductive structure can have the advantages of different thicknesses. Furthermore, by setting the thickness of the second conductive layer 300 to be greater than that of the first conductive layer 200, on the one hand, the second conductive layer 300 can have a lower resistance. Furthermore, since the second conductive layer 300 is located on the first conductive layer 200, it can be preferentially reused as an auxiliary conductive structure, such as the pads described below. On the other hand, the thicker second conductive layer 300 can be utilized to slot the second conductive layer 300 to ensure the stability of the connection between the second conductive layer 300 and other structures.

[0054] The thickness of the first conductive layer 200 or the second conductive layer 300 refers to the maximum dimension of the first conductive layer 200 or the second conductive layer 300 in a direction perpendicular to the substrate 100. The thermal expansion of the insulating material refers to the total length of the film multiplied by a fixed coefficient. Reducing the overall area of ​​the insulating material is equivalent to reducing the total length of the insulating material, thereby achieving the purpose of reducing the thermal expansion of the insulating material.

[0055] Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a schematic top view of a display panel provided in an embodiment of the present application.

[0056] In some optional embodiments, the display panel 10 includes a display area AA and a non-display area NA located on one side of the display area AA, and the second conductive layer 300 includes a pad 310 located in the non-display area NA.

[0057] In these optional embodiments, the pads 310 located in the non-display area NA are used to connect to signal traces, or integrated circuits (ICs), or flexible printed circuits (FPCs) located in the display area AA.

[0058] As shown in FIG. 1 , in some optional embodiments, the display panel 10 further includes a covering layer 400 , which is located on a side of the second conductive layer 300 facing away from the substrate 100 . The covering layer 400 includes a covering portion 410 , which includes an insulating material and covers at least a portion of the sidewall of the pad 310 .

[0059] In these optional embodiments, the covering layer 400 is located on a side of the second conductive layer 300 facing away from the substrate 100, and the covering layer 400 includes a covering portion 410 that covers the second conductive layer 300. The covering portion 410 includes an insulating material and covers at least a portion of the sidewall of each pad 310, so that the covering portion 410 can insulate and encapsulate the pad 310, thereby isolating the pad 310 from other film layers, reducing corrosion of the pad 310 by water and oxygen, and improving the service life of the pad 310, thereby ensuring the normal function of the pad 310.

[0060] Optionally, the maximum dimension of the pad 310 in the thickness direction of the display panel 10 is greater than or equal to 1.15 μm, that is, the thickness of the pad 310 is greater than or equal to 1.15 μm, so as to avoid the problem that the thickness of the pad 310 is too thin, resulting in a large resistance of the pad 310, and it is difficult to groove the pad 310 to ensure the stability of the alignment with other structures. Once the pad 310 is processed by a chemical plating process, since the material of part of the pad 310 will undergo chemical replacement during the plating process, when the thickness of the pad 310 is too small, the pad 310 may be completely damaged, thereby affecting the reliability of the binding connection of the pad 310. By setting the maximum dimension of the pad 310 in the thickness direction of the display panel 10 to be greater than or equal to 1.15 μm in this embodiment, the problem that the pad 310 is completely damaged after chemical replacement due to the pad 310 being too thin during the plating process can be improved.

[0061] Optionally, each covering portion 410 covers at least part of the side wall of each pad 310, that is, the covering portions 410 are disconnected from each other and independent of each other, thereby reducing the mutual influence between the pads 310 covered by each covering portion 410 and improving the insulation performance or packaging performance of the covering portion 410 and the performance of the pad 310.

[0062] Please refer to FIG. 3 , which is a partial cross-sectional view of a display panel provided in another embodiment.

[0063] As shown in FIG. 3 , in some optional embodiments, the covering portion 410 defines a first opening 420 , and the pad 310 has a top surface 311 facing away from the substrate 100 , with at least a portion of the top surface 311 exposed by the first opening 420 .

[0064] In these optional embodiments, when the covering portion 410 comprises an insulating material, the pad 310 is insulated from other film layers by the covering portion 410 to ensure the service life of the pad 310. The first opening 420 defined in the covering portion 410 allows the top surface 311 of the pad 310 to be exposed through the first opening 420, thereby electrically connecting to a pin of another structure and achieving a signal transmission function between the pad 310 and the pin. For example, the pad 310 is electrically connected to a pin of an integrated circuit through the first opening 420, or the pad 310 is electrically connected to a pin of a flexible printed circuit board through the first opening 420.

[0065] Optionally, the covering portion 410 covers the side wall of the pad 310, and adjacent covering portions 410 are arranged at intervals, that is, the covering portion 410 only covers the area where the pad 310 is located, and the covering portion 410 is hollowed out between adjacent pads 310. In other words, the covering portion 410 is not arranged between adjacent pads 310, thereby reducing the distribution area of ​​the covering portion 410, so as to reduce the overall thermal expansion of the covering portion 410 and the difference in thermal expansion between the covering portion 410 and the insulating portion described below, thereby improving the problem of bending and deformation of the display panel 10 caused by the large difference in thermal expansion between the covering portion 410 and the insulating portion, and improving the service life of the display panel 10.

[0066] Please refer to FIG. 4 , which is a partial cross-sectional view of a display panel provided in yet another embodiment.

[0067] As shown in FIG. 4 , in some optional embodiments, the display panel 10 further includes a chemically plated metal layer 600 , and the chemically plated metal layer 600 covers the surface of the pad facing away from the substrate.

[0068] In these optional embodiments, the display panel 10 further includes a chemically plated metal layer 600, which is a metal material. When the ambient temperature changes, the thermal expansion of the chemically plated metal layer 600 is low, making it difficult to bend and deform, thereby improving the durability of the display panel 10. After the chemically plated metal layer 600 covers the pad 310, the pad 310 is isolated from the outside world by the chemically plated metal layer 600, which can reduce the possibility of corrosion of the pad 310. When the chemically plated metal layer 600 covers the surface of the pad 310, there is no need to open the chemically plated metal layer 600. The pad 310 can be directly electrically connected to the pins of other structures through the chemically plated metal layer 600. After the pad 310 is connected to the pins through the chemically plated metal layer 600, the chemically plated metal layer 600 and the pins are sealed with a sealant, such as a photosensitive adhesive (UV adhesive).

[0069] In some optional embodiments, the electroless metal layer 600 includes at least one of aluminum, molybdenum, gold, and silver.

[0070] In these optional embodiments, when the electroless-plated metal layer 600 includes an active metal such as aluminum, since the electroless-plated metal layer 600 is in direct contact with the pad 310, a galvanic cell is formed between the electroless-plated metal layer 600 and the pad 310. When electrochemical corrosion occurs, the more active electroless-plated metal layer 600 corrodes while the pad 310 does not, thereby reducing the corrosion of the pad 310. When the electroless-plated metal layer 600 includes a passivating metal such as silver, the electroless-plated metal layer 600 has a high passivation property. When the electroless-plated metal layer 600 covers the surface of the pad 310, the pad 310 is isolated from the outside world, thereby protecting the pad 310 from corrosion.

[0071] In some optional embodiments, the electroless metal layer 600 includes a plurality of electroless metal portions 610 that are spaced apart from each other.

[0072] In these optional embodiments, the electroless plated metal portions 610 are spaced apart from each other, thereby achieving mutual insulation between the electroless plated metal portions 610 , thereby preventing the pads 310 from being electrically connected to each other through the electroless plated metal layer 600 and causing defects such as short circuits.

[0073] Please refer to FIG. 5 and FIG. 6 . FIG. 5 is a partial cross-sectional view of a display panel provided in yet another embodiment; FIG. 6 is a partial cross-sectional view of a display panel provided in yet another embodiment.

[0074] As shown in FIG. 5 , in some optional embodiments, the pad 310 has a first recessed portion 320 recessed from a top surface 311 of the pad 310 facing away from the substrate 100 toward the substrate 100 .

[0075] In these optional embodiments, a first recessed portion 320 is provided on the pad 310. When the pad 310 is connected to a pin of another structure, the pin of the other structure can be stably located in the first recessed portion 320 and is less likely to slip sideways, thereby improving the connection stability between the pin and the pad 310 and facilitating the fixed connection between the pin of the other structure and the pad 310. As shown in FIG6 , when the top surface 311 of the pad 310 is recessed toward the substrate 100, the chemically plated metal layer 600 covering the pad 310 is also recessed, thereby enabling the pad 310 to be stably connected to the pin of the other structure even when covered with the chemically plated metal layer 600.

[0076] As shown in FIG. 1 , in some optional embodiments, the first conductive layer 200 includes a conductive trace 210 , and the conductive trace 210 is electrically connected to the second conductive layer 300 .

[0077] In these optional embodiments, the first conductive layer 200 includes a conductive trace 210. Therefore, the electrical signal of the non-display area NA is transmitted through the conductive trace 210 located in the first conductive layer 200. The conductive trace 210 is electrically connected to the second conductive layer 300, so that the electrical signal of the conductive trace 210 can be transmitted to the integrated circuit or the flexible printed circuit board through the second conductive layer 300.

[0078] In some optional embodiments, the display panel 10 further includes an insulating layer 500 located on a side of the first conductive layer 200 facing away from the substrate 100 . The insulating layer 500 includes an insulating portion 510 located in the non-display area NA. The insulating portion 510 covers at least a portion of the conductive trace 210 .

[0079] It should be noted that in some embodiments of the present application, the covering portion 410 and the insulating layer 500 may be present simultaneously. Optionally, the second conductive layer 300 is located on the side of the insulating layer 500 facing away from the substrate 100, and the covering portion 410 is located on the side of the second conductive layer 300 facing away from the substrate 100. That is, the insulating portion 510 only covers the first conductive layer 200, and the covering portion 410 covers the second conductive layer 300. Optionally, the covering portion 410 covers a portion of the insulating portion 510.

[0080] In these optional embodiments, the insulating layer 500 includes an insulating portion 510 located in the non-display area NA. The insulating portion 510 covers the conductive trace 210 to insulate the conductive trace 210 from other structures and ensure normal signal transmission of the conductive trace 210.

[0081] As shown in FIG. 5 , in some optional embodiments, a plurality of second openings 520 are defined on the insulating portion 510 , and the pads 310 are electrically connected to the conductive traces 210 through the second openings 520 .

[0082] In these optional embodiments, at least a portion of the pad 310 is located within the second opening 520 and is electrically connected to the conductive trace 210 within the second opening 520, thereby achieving electrical conduction between the conductive trace 210 and the pad 310, and the signal of the conductive trace 210 can be transmitted between the pad 310.

[0083] Please refer to Figures 7 to 9. Figure 7 is a partial cross-sectional view of a display panel according to another embodiment; Figure 8 is a partial enlarged view of a bonding pad; and Figure 9 is a partial cross-sectional view of a display panel according to another embodiment. Figure 7 is a cross-sectional view along the direction in which conductive trace 210 extends, and Figure 9 is a cross-sectional view perpendicular to the direction in which conductive trace 210 extends.

[0084] As shown in FIG. 7 to FIG. 9 , in some optional embodiments, the conductive trace 210 has a third opening 220 , and the orthographic projection of the third opening 220 on the substrate 100 is located within the orthographic projection of the second opening 520 on the substrate 100 .

[0085] In these optional embodiments, the orthographic projection of the third opening 220 on the substrate 100 is located within the orthographic projection of the second opening 520 on the substrate 100. When the solder pad 310 is deposited into the second opening 520, the solder pad 310 is also deposited into the third opening 220. On the one hand, the solder pad 310 is deposited into the third opening 220 and connected to the side of the conductive trace 210, thereby increasing the contact area between the solder pad 310 and the conductive trace 210 and improving the contact effect between the solder pad 310 and the conductive trace 210. In addition, the solder pad is deposited into the second opening 520 and the third opening 220, so that the top surface 311 of the solder pad 310 also has a corresponding depression, that is, the solder pad 310 is depressed downward away from the top surface 311 of the substrate 100 to form a first depression 320. Therefore, in this case, the maximum depth of the first recessed portion 320 is equal to the sum of the depths of the second opening 520 and the third opening 220. For example, if the depth of the second opening 520 is 0.6 μm and the depth of the third opening 220 is 0.5 μm, the maximum depth of the first recessed portion 320 is 1.1 μm. Because the orthographic projection of the third opening 220 on the substrate 100 is within the orthographic projection of the second opening 520 on the substrate 100, after the solder pad 310 is deposited onto the second opening 520 and the third opening 220, the top surface 311 of the solder pad 310 exhibits a stepped depression, i.e., a crater morphology.

[0086] Please refer to FIG. 10 to FIG. 12 , FIG. 11 is a partial cross-sectional view of the first binding area in FIG. 10 ; FIG. 12 is a partial cross-sectional view of the first binding area in FIG. 10 provided by another embodiment.

[0087] The first conductive layer 200 and the pad 310 can be arranged in various ways. Optionally, as shown in FIG11 , at least a portion of the orthographic projection of the first conductive layer 200 on the substrate 100 is located within the orthographic projection of the pad 310 on the substrate 100. For example, within the first binding region 20, the first conductive layer 200 is covered by the pad 310. In this embodiment, the cross-sectional dimensions of the first conductive layer 200 are relatively small, and the pad 310 is arranged to cover the first conductive layer 200 at this location, so that the pad 310 and the surface of the first conductive layer 200 at this location are in contact, which can improve the overlapping performance between the pad 310 and the first conductive layer 200. In addition, the first conductive layer 200 is relatively small in size, which reduces material costs.

[0088] Optionally, as shown in Figure 12, the orthographic projection of the solder pad 310 on the substrate 100 is located within the orthographic projection of the first conductive layer 200 on the substrate 100. For example, in the first binding area 20, the solder pad 310 is completely located on the side of the first conductive layer 200 facing away from the substrate 100. The cross-sectional size of the first conductive layer 200 is large, which can reduce the resistance of the first conductive layer 200 and improve the electrical signal transmission performance of the first conductive layer 200.

[0089] Please refer to Figure 10 and Figures 13 to 17 together. Figure 13 is a partial top view of a display panel provided by another embodiment; Figure 14 is a partial enlarged view of Figure 13; Figure 15 is a cross-sectional view of AA in Figure 13; Figure 16 is a cross-sectional view of BB in Figure 13; and Figure 17 is a cross-sectional view of CC in Figure 13.

[0090] As shown in FIG. 10 and FIG. 13 to FIG. 17 , in some optional embodiments, a hollow portion 530 is formed on the insulating portion 510 , and the hollow portion 530 is located between adjacent conductive traces 210 .

[0091] In these optional embodiments, a hollow portion 530 is provided on the insulating portion 510, thereby reducing the distribution area of ​​the insulating portion 510 and reducing the overall thermal expansion of the insulating portion 510. When both the covering portion 410 and the insulating portion 510 are present, reducing the thermal expansion of the insulating portion 510 can reduce the difference in thermal expansion between the insulating portion 510 and the covering portion 410, thereby alleviating the problem of bending and deformation of the display panel 10 caused by the large difference in thermal expansion between the covering portion 410 and the insulating portion 510, and improving the service life of the display panel 10. The hollow portion 530 is provided between adjacent conductive traces 210 to prevent interference between the hollow portion 530 and the conductive traces 210, thereby ensuring the insulation effect of the conductive traces 210.

[0092] Optionally, the shape of the hollow portion 530 includes rectangle, circle, etc.

[0093] As shown in Figure 10, in some optional embodiments, the non-display area NA includes a first routing area 30 and a second routing area 50 distributed in sequence along a direction away from the display area AA, and the hollow portion 530 is located in at least one of the first routing area 30 and the second routing area 50.

[0094] In these optional embodiments, the hollow portion 530 is distributed in the first routing area 30, or the hollow portion 530 is distributed in the second routing area 50, or the hollow portion 530 is distributed in both the first routing area 30 and the second routing area 50, thereby increasing the distribution area of ​​the hollow portion 530 and reducing the distribution area of ​​the insulating portion 510 to reduce the overall thermal expansion of the insulating portion 510 and improve the service life of the display panel 10.

[0095] In some optional embodiments, the conductive trace 210 includes a first trace 211 and a second trace 212 . The first trace 211 is located in the first trace area 30 , and the second trace 212 is located in the second trace area 50 .

[0096] Optionally, the pad 310 includes a first pad 312, a second pad 313 and a third pad 314, the first pad 312 is located on the side of the first trace 211 close to the display area AA, the second pad 313 is located between the first trace 211 and the second trace 212, and the third pad 314 is located on the side of the second trace 212 away from the display area AA.

[0097] In these optional embodiments, the first trace 211 connects the first pad 312 and the second pad 313, so that the first pad 312 and the second pad 313 can transmit signals through the first trace 211. The second trace 212 connects the second pad 313 and the third pad 314, so that the second pad 313 and the third pad 314 can transmit signals through the second trace 212.

[0098] In some optional embodiments, the first trace 211 and the insulating portion 510 are located on a side of the pad 310 close to the display area AA away from the display area AA. That is, the first trace 211 and the insulating portion 510 are located on a side of the first pad 312 away from the display area AA.

[0099] In these optional embodiments, the first trace 211 is located on a side of the first pad 312 away from the display area AA to connect the first pad 312 to the second pad 313 located on the side of the first pad 312 away from the display area AA. The insulating portion 510 is located on a side of the first pad 312 away from the display area AA, that is, the insulating portion 510 exists only in the non-display area NA, reducing the distribution area of ​​the insulating portion 510 and thereby reducing the overall thermal expansion of the insulating portion 510, thereby improving the service life of the display panel 10.

[0100] Optionally, multiple first lines 211 are arranged side by side to improve wiring space utilization. The first lines 211 are regularly wired to reduce mutual interference between the first lines 211 and ensure normal functions of the first lines 211.

[0101] In some optional embodiments, the minimum distance between the first trace 211 and the hollow portion 530 is 0.5 μm to 5 μm.

[0102] In these optional embodiments, the distance between the first trace 211 and the hollow portion 530 is greater than or equal to 0.5 μm to avoid interference between the hollow portion 530 and the first trace 211 due to a too small distance between the first trace 211 and the hollow portion 530, thereby affecting the insulation performance of the insulating portion 510 with respect to the first trace 211. The distance between the first trace 211 and the hollow portion 530 is less than or equal to 5 μm to avoid a problem in which the distance between the first trace 211 and the hollow portion 530 is too large, resulting in a larger area distribution of the insulating portion 510 and a larger thermal expansion of the insulating layer 500.

[0103] Optionally, the size of the second routing line 212 is larger than the first routing line 211, for example, the cross-sectional area of ​​the second routing line 212 is larger than the cross-sectional area of ​​the first routing line 211, so as to reduce the resistance of the second routing line 212 and improve the signal transmission effect of the second routing line 212, thereby meeting the signal transmission requirements between the second pad 313 and the third pad 314.

[0104] As shown in Figure 13, in some optional embodiments, the first wiring area 30 includes a first wiring area 31, a second wiring area 32 and a third wiring area 33 distributed in sequence along a direction away from the display area AA, the distance between adjacent first wirings 211 in the first wiring area 31 is a first distance, the distance between adjacent first wirings 211 in the second wiring area 32 is a second distance, and the distance between adjacent first wirings 211 in the third wiring area 33 is a third distance, the first distance is greater than the second distance, and the second distance is greater than the third distance.

[0105] In these optional embodiments, since the second pads 313 are relatively densely distributed relative to the first pads 312, that is, adjacent second pads 313 have a smaller spacing, when the first traces 211 are used to connect the first pads 312 and the second pads 313, the distance between adjacent first traces 211 gradually decreases in the direction from the first pads 312 to the second pads 313, thereby making the first distance greater than the second distance, and the second distance greater than the third distance. From the first wiring area 31 toward the third wiring area 33, the spacing between adjacent first traces 211 gradually decreases, thereby connecting the first traces 211 to the more densely distributed second pads 313.

[0106] In some optional embodiments, the hollow portion 530 is located in the first wiring area 31 and / or the second wiring area 32 .

[0107] In these optional embodiments, since the spacing between adjacent first traces 211 in the first wiring area 31 and the second wiring area 32 is relatively large, which facilitates the setting of the hollow portion 530, the hollow portion 530 is set on the insulating portion 510 in the first wiring area 31 and the second wiring area 32, thereby reducing the distribution area of ​​the insulating portion 510 in the first wiring area 31 and the second wiring area 32, that is, reducing the overall distribution area of ​​the insulating portion 510, so as to reduce the thermal expansion of the insulating portion 510 covering the first conductive layer 200, so as to improve the distribution area of ​​the insulating portion 510 covering the first conductive layer 200, resulting in a large thermal expansion of the insulating portion 510 in a high temperature environment, causing the display panel 10 to bend and deform, thereby improving the service life of the display panel 10.

[0108] As shown in FIG. 13 to FIG. 15 , in some optional embodiments, in the first wiring area 31 , hollow portions 530 are provided between adjacent first traces 211 .

[0109] Optionally, in the first wiring region 31 , at least a portion of the hollow portion 530 extends from the first pad 312 toward the second pad 313 and terminates at the second wiring region 32 .

[0110] In these optional embodiments, since the spacing between adjacent first traces 211 in the first wiring area 31 is the largest, a hollow portion 530 is provided between each first trace 211 in the first wiring area 31 to further increase the distribution area of ​​the hollow portion 530, thereby further reducing the distribution area of ​​the insulating portion 510 in the first wiring area 31, that is, reducing the overall distribution area of ​​the insulating portion 510, so as to reduce the thermal expansion of the insulating portion 510 covering the first conductive layer 200, so as to improve the problem that the distribution area of ​​the insulating portion 510 covering the first conductive layer 200 is large, resulting in a large thermal expansion of the insulating portion 510 in a high temperature environment, causing the display panel 10 to bend and deform, thereby improving the service life of the display panel 10.

[0111] As shown in FIG. 13 , FIG. 14 and FIG. 16 , in some optional embodiments, in the second wiring area 32 , a plurality of first traces 211 form a first group of traces, and the hollow portion 530 is located between two adjacent first group traces.

[0112] Optionally, in the first wiring area 31 and the second wiring area 32 , at least part of the hollow portion 530 extends from the first pad 312 toward the second pad 313 and terminates at the third wiring area 33 .

[0113] In these optional embodiments, because the spacing between adjacent first traces 211 in the second wiring region 32 is smaller than that in the first wiring region 31, hollow portions 530 are provided between adjacent first traces in the second wiring region 32 to further increase the distribution area of ​​the hollow portions 530, thereby reducing the distribution area of ​​the insulating portion 510 in the first wiring region 31. If the spacing between adjacent first traces 211 in the second wiring region 32 is sufficient, hollow portions 530 may also be provided between adjacent first traces 211 in the second wiring region 32 to further increase the distribution area of ​​the hollow portions 530, thereby reducing the distribution area of ​​the insulating layer 500, thereby reducing the overall thermal expansion of the insulating layer 500, specifically reducing the thermal expansion of the insulating portion 510 covering the first conductive layer 200. This improves the problem of the insulating portion 510 covering the first conductive layer 200 having a larger distribution area, which results in greater thermal expansion of the insulating portion 510 in high-temperature environments, and thus causes bending and deformation of the display panel 10, thereby improving the service life of the display panel 10.

[0114] As shown in Figures 13, 14 and 17, optionally, in the third wiring area 33, the first routing line 211 is completely covered by the insulating portion 510. Since the first routing line 211 is relatively dense in the third wiring area 33, it is difficult to pattern the first routing line 211 in this area. Therefore, in the third wiring area 33, the insulating portion 510 covers the entire surface, and there is no need to pattern the insulating portion 510 in the third wiring area 33, thereby reducing the difficulty of preparing the insulating portion 510.

[0115] Optionally, the hollow portions 530 are evenly distributed, that is, the insulating portions 510 are evenly distributed, reducing the difference in thermal expansion at various locations of the insulating portions 510 , thereby reducing the possibility of bending and deformation of the display panel 10 and improving the service life of the display panel 10 .

[0116] As shown in Figure 10, in some optional embodiments, the non-display area NA also includes a first binding area 20, a second binding area 40, and a third binding area 60 distributed in sequence along a direction away from the display area AA, and the hollow portion 530 is located in the second binding area 40.

[0117] In these optional embodiments, the hollow portion 530 is distributed in the second binding area 40 , further increasing the distribution area of ​​the hollow portion 530 , thereby reducing the distribution area of ​​the insulating portion 510 , thereby reducing the overall thermal expansion of the insulating portion 510 and improving the service life of the display panel 10 .

[0118] In some optional embodiments, the pad 310 includes a first pad 312 located in the first binding area 20, a second pad 313 located in the second binding area 40, and a third pad 314 located in the third binding area 60, wherein one end of the first trace 211 is connected to the first pad 312 and the other end is connected to the second pad 313, and one end of the second trace 212 is connected to the second pad 313 and the other end is connected to the third pad 314.

[0119] In these optional embodiments, the first trace 211 connects the first pad 312 and the second pad 313, allowing the first pad 312 and the second pad 313 to transmit signals via the first trace 211. The second trace 212 connects the second pad 313 and the third pad 314, allowing the second pad 313 and the third pad 314 to transmit signals via the second trace 212. The second pad 313 of the second binding area 40 is used to electrically connect to the integrated circuit, and the third pad 314 of the third binding area 60 is used to electrically connect to the flexible printed circuit board.

[0120] Please refer to FIG. 10 , FIG. 18 and FIG. 19 . FIG. 18 is a partial top view of a display panel provided in yet another embodiment; FIG. 19 is a partial enlarged view of FIG. 18 .

[0121] As shown in FIG. 10 , FIG. 18 and FIG. 19 , in some optional embodiments, at least a portion of the second pad 313 is spaced apart from the insulating portion 510 to form a gap 315 .

[0122] Optionally, the insulating portion 510 is located in the first routing area 30, the second binding area 40, and the second routing area 50. Since the first routing line 211 extends into the second binding area 40 and is electrically connected to the second pad 313, the insulating portion 510 is provided in the second binding area 40 to cover the first routing line 211. The first conductive layer 200 of the first binding area 20 and the third binding area 60 is covered by the second conductive layer 300 or by the second conductive layer 300 and the covering portion 410, and no additional insulating portion 510 is required to reduce the distribution area of ​​the insulating portion 510. Therefore, a gap 315 is provided in the second binding area 40 to reduce the distribution area of ​​the insulating portion 510 in the second binding area 40.

[0123] In these optional embodiments, the first trace 211 is connected to one side of the second pad 313, so the first trace 211 does not exist on the other side of the second pad 313. A gap 315 is set between the second pad 313 and the insulating part 510, which can reduce the distribution area of ​​the insulating part 510, thereby reducing the overall thermal expansion of the insulating part 510, thereby improving the service life of the display panel 10.

[0124] As shown in FIG. 18 , in some optional embodiments, gaps 315 are provided on both sides of the second pad 313 .

[0125] In these optional embodiments, a gap 315 is set between both sides of the second pad 313 and the insulating part 510, which can further reduce the distribution area of ​​the insulating part 510, thereby reducing the overall thermal expansion of the insulating part 510, thereby reducing the overall thermal expansion of the insulating part 510 and improving the service life of the display panel 10.

[0126] Optionally, multiple second pads 313 are distributed in rows, and a row of second pads 313 away from the display area AA forms a second pad row, and the first trace 211 and the insulating portion 510 are both located on the side of the second pad row close to the display area AA. The first trace 211 is used to connect the first pad 312 and the second pad 313, so the first trace 211 only needs to be set on the side of the second pad row close to the display area AA. In this case, since the insulating portion 510 is used to cover the first trace 211 to achieve insulation and sealing of the first trace 211, the insulating portion 510 only needs to be set on the side of the second pad row close to the display area AA, avoiding the provision of more insulating portions 510 that have no practical use, thereby reducing the distribution area of ​​the insulating portion 510 and reducing the overall thermal expansion of the insulating portion 510, thereby improving the service life of the display panel 10.

[0127] As shown in FIG. 7 , in some optional embodiments, the orthographic projection of the second opening 520 on the substrate 100 is located within the orthographic projection of the pad 310 on the substrate 100 .

[0128] In these optional embodiments, the orthographic projection of the second opening 520 on the substrate 100 is located within the orthographic projection of the pad 310 on the substrate 100 , that is, the second opening 520 is completely covered by the pad 310 , and part of the pad 310 is electrically connected to the conductive trace 210 through the second opening 520 .

[0129] Optionally, the insulating portion 510 includes an inorganic material or a photosensitive polyimide material.

[0130] In some optional embodiments, the orthographic projection of the pad 310 on the substrate 100 is located within the orthographic projection of the conductive trace 210 on the substrate 100 , or the orthographic projection of part of the pad 310 on the substrate 100 is located outside the orthographic projection of the conductive trace 210 on the substrate 100 .

[0131] In these optional embodiments, the orthographic projection of the pad 310 on the substrate 100 is located within the orthographic projection of the conductive trace 210 on the substrate 100, that is, the orthographic projection size of the pad 310 is smaller than the orthographic projection size of the conductive trace 210, and the cross-sectional area of ​​the conductive trace 210 is larger, which can reduce the resistance of the conductive trace 210. The orthographic projection of part of the pad 310 on the substrate 100 is located outside the orthographic projection of the conductive trace 210 on the substrate 100, that is, the cross-sectional area of ​​the pad 310 is larger, which can reduce the resistance of the pad 310.

[0132] Optionally, when the chemically plated metal layer 600 covers the surface of the pad 310 facing away from the substrate 100, the insulating portion 510 is arranged to cover the first trace 211 and the second trace 212, and the insulating portion 510 is used to cover the first trace 211 and the second trace 212, and the pad 310 is covered with the chemically plated metal layer 600, and there is no need to set the covering layer 400. Therefore, the first conductive layer 200 and the second conductive layer 300 are not covered with the covering layer 400, but only the insulating layer 500 and the chemically plated metal layer 600 are set to cover them, so as to improve the undesirable phenomenon that the display panel 10 bends and deforms due to the difference in thermal expansion between the insulating layer 500 and the covering layer 400 when the insulating layer 500 and the covering layer 400 exist at the same time.

[0133] Please refer to FIG. 20 , which is a cross-sectional view of PP in FIG. 19 .

[0134] Optionally, a plurality of first traces 211 are provided on at least one side of the pad 310 , and the first traces 211 are routed so as to avoid some pads 310 so as to be electrically connected to other pads 310 .

[0135] Please refer to FIG. 21 , which is a partial top view of a display panel provided in another embodiment.

[0136] As shown in FIG. 21 , in some optional embodiments, at least a portion of the second conductive layer 300 is extended along the first conductive layer 200 and is in contact with and connected to the first conductive layer 200 along its extension path.

[0137] In these optional embodiments, part of the second conductive layer 300 and the first conductive layer 200 are stacked and have the same extension path. On the extension path, the second conductive layer 300 and the first conductive layer 200 are in contact and connected, which can reduce the resistance of the first conductive layer 200 and the second conductive layer 300 on the extension path and improve the signal transmission effect in this area to meet actual needs.

[0138] Optionally, when at least a portion of the second conductive layer 300 extends along the same path as the first conductive layer 200 and is in contact with and connected to the first conductive layer 200 along the extension path, the covering portion 410 covers both the first conductive layer 200 and the second conductive layer 300. Therefore, in this area, there is no need to provide the insulating portion 510 to cover the first conductive layer 200, thereby reducing the distribution area of ​​the insulating portion 510. Furthermore, the covering portion 410 is opened at both ends of the second conductive layer 300 to allow the second conductive layer 300 to be aligned and electrically connected to other structures.

[0139] Please refer to FIG. 21 to FIG. 23 , FIG. 22 is a cross-sectional view of DD in FIG. 21 ; FIG. 23 is a cross-sectional view of DD in FIG. 21 provided by another embodiment.

[0140] There are many ways to set the first conductive layer 200 and the second conductive layer 300. For example, as shown in Figure 22, optionally, at least part of the orthographic projection of the first conductive layer 200 on the substrate 100 is located within the orthographic projection of the second conductive layer 300 on the substrate 100, so that the first conductive layer 200 is covered by the second conductive layer 300, so as to increase the contact area between the first conductive layer 200 and the second conductive layer 300, improve the contact effect between the first conductive layer 200 and the second conductive layer 300, and thus ensure the effect of electrical signal transmission.

[0141] Alternatively, as shown in FIG23 , optionally, at least a portion of the orthographic projection of the second conductive layer 300 on the substrate 100 is located within the orthographic projection of the first conductive layer 200 on the substrate 100, so that the second conductive layer 300 is located on the side of the first conductive layer 200 facing away from the substrate 100, and the width of the first conductive layer 200 is set wider, thereby reducing the resistance of the first conductive layer 200 and improving the electrical signal transmission effect of the first conductive layer 200. The width of the first conductive layer 200 is the dimension in a direction perpendicular to its extension direction.

[0142] Please refer to FIG. 24 , which is a partial top view of a display panel provided in another embodiment.

[0143] As shown in FIG24 , the orthographic projection of the conductive trace 210 on the substrate 100 optionally lies within the orthographic projection of the insulating portion 510 on the substrate 100. Once the electroless metal layer 600 is provided on the pad 310, there is no need to provide the cover portion 410. Therefore, there is no difference in expansion between the cover portion 410 and the insulating portion 510, and no patterning of the insulating portion 510 is required. Providing the insulating portion 510 on the entire surface simplifies fabrication and simplifies the manufacturing process of the display panel 10.

[0144] Please refer to Figures 24 to 26 together. Figure 25 is a partial cross-sectional view of the first binding area in Figure 24; Figure 26 is a partial cross-sectional view of the first binding area in Figure 24 provided by another embodiment.

[0145] As shown in Figure 25, optionally, at least part of the pad 310 is located on the side of the insulating portion 510 away from the substrate 100 and is electrically connected to the first conductive layer 200, and at least part of the orthographic projection of the first conductive layer 200 on the substrate 100 is located within the orthographic projection of the pad 310 on the substrate 100. For example, in the first binding area 20, the width of the first conductive layer 200 is smaller, which reduces the usage of the first conductive layer 200 and reduces costs.

[0146] As shown in Figure 26, optionally, at least part of the pad 310 is within the positive projection of the substrate 100. For example, in the first binding area 20, the width of the first conductive layer 200 is larger, which increases the contact area between the first conductive layer 200 and the pad 310 and can reduce the resistance of the first conductive layer 200, thereby improving the transmission effect between the first conductive layer 200 and the pad 310.

[0147] Please refer to FIG. 24 and FIG. 27 to FIG. 29 , FIG. 27 is a cross-sectional view taken along line A′-A′ in FIG. 24 ; FIG. 28 is a cross-sectional view taken along line B′-B′ in FIG. 24 ; and FIG. 29 is a cross-sectional view taken along line C′-C′ in FIG. 24 .

[0148] Optionally, the insulating portion 510 is provided to cover the conductive traces 210. For example, as shown in FIG27 , in the first wiring area 31 , the wiring space is relatively large, the spacing between adjacent conductive traces 210 is relatively large, and the conductive traces 210 are covered by the insulating portion 510. As shown in FIG26 , in the second wiring area 32 , the wiring space is relatively small relative to the first wiring area 31 , and a wiring method is adopted in which multiple conductive traces 210 are adjacent to each other as a group, and there is a large spacing between multiple groups of conductive traces 210. In this area, the conductive traces 210 are covered by the insulating portion 510. As shown in FIG27 , in the third wiring area 33 , the wiring space is the smallest, so the spacing between each conductive trace 210 is relatively small. In this area, the conductive traces 210 are covered by the insulating portion 510. That is, after the electroless metal plated portion 610 is provided on the surface of the pad 310, the insulating portion 510 is provided on the entire surface, reducing the difficulty of preparing the insulating portion 510. Moreover, a full-surface insulating portion 510 is provided in the first wiring area 31, the second wiring area 32 and the third wiring area 33, so that the thermal expansion of the insulating portion 510 around each conductive trace 210 is relatively uniform, and it is difficult for the insulating portion 510 film layer to fall off due to the different thermal expansion amounts at different positions of the insulating portion 510.

[0149] Please refer to FIG30 , which is a partial enlarged view of FIG24 .

[0150] As shown in Figure 30 , the insulating portion 510 is provided across the entire surface of the second binding region 40. This eliminates the need for additional patterning of the insulating portion 510 in the second binding region 40, reducing the difficulty of fabricating the insulating portion 510. Furthermore, the insulating portion 510 of uniform thickness is provided around the pads 310 in the second binding region 40, ensuring uniform thermal expansion of the insulating portion 510 around pads 310 in different rows. This reduces the risk of the insulating portion 510 film peeling due to varying thermal expansion at different locations on the insulating portion 510.

[0151] Please refer to FIG. 31 and FIG. 32 . FIG. 31 is a partial top view of a display panel provided in another embodiment; FIG. 32 is a cross-sectional view taken along line D′-D′ in FIG. 31 .

[0152] As shown in Figures 31 and 32, the orthographic projection of the second conductive layer 300 on the substrate 100 is located within the orthographic projection of the first conductive layer 200 on the substrate 100, and the second conductive layer 300 is provided at both ends of the first conductive layer 200 along its extension path. At positions where the first conductive layer 200 and the second conductive layer 300 do not overlap, the first conductive layer 200 is covered by the insulating portion 510, so that the first conductive layer 200 is insulated from other structures by the insulating portion 510, thereby ensuring the transmission performance of the first conductive layer 200. In addition, the second conductive layer 300 is only provided at both ends of the first conductive layer 200 along its extension path, reducing the amount of the second conductive layer 300 used and lowering costs. Moreover, as the distribution area of ​​the second conductive layer 300 is reduced, the corresponding amount of the electroless metal plated metal portion 610 is reduced, further reducing costs.

[0153] Optionally, the second conductive layer 300 is in contact with the first conductive layer 200 , that is, no insulating portion 510 is provided between the second conductive layer 300 and the first conductive layer 200 , thereby increasing the contact area between the second conductive layer 300 and the first conductive layer 200 , thereby improving the electrical signal transmission effect between the second conductive layer 300 and the first conductive layer 200 .

[0154] Please refer to FIG. 33 , which is a partial cross-sectional view of the first binding region provided in another embodiment.

[0155] As shown in FIG33 , optionally, the thickness d1 of the first conductive layer 200 and the thickness d2 of the second conductive layer 300 satisfy d2>3*d1.

[0156] Specifically, the specific values ​​of the thickness d1 of the first conductive layer 200 and the thickness d2 of the second conductive layer 300 can be set according to actual conditions and are not specifically limited here. They only need to satisfy d2>3*d1. Considering that the second conductive layer 300 is in direct contact with other structures, to ensure the reliability of the connection between the second conductive layer 300 and other structures, the thickness of the second conductive layer 300 needs to be set to be larger, while the thickness of the first conductive layer 200 can be smaller than the thickness of the second conductive layer 300. This helps reduce the overall film thickness of the display panel 10, thereby facilitating a lightweight and thin design of the display panel 10.

[0157] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made based on actual conditions. This application does not impose any specific restrictions on it.

[0158] The embodiment of the second aspect of the present application further provides a display device, comprising the display panel 10 of any of the above-mentioned embodiments of the first aspect. Since the display device provided by the embodiment of the second aspect of the present application comprises the display panel 10 of any of the above-mentioned embodiments of the first aspect, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned embodiments of the first aspect, which will not be further elaborated here.

[0159] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0160] Those skilled in the art should understand that the above embodiments are exemplary rather than restrictive. Different technical features appearing in different embodiments can be combined to achieve beneficial effects. Based on a study of the drawings, specifications and claims, those skilled in the art should be able to understand and implement other variations of the disclosed embodiments. In the claims, the term "comprising" does not exclude other devices or steps; when an item is not modified by a quantifier, it is intended to include one / kind or more / kinds of items and can be used interchangeably with "one / kind or more / kinds of items"; the terms "first" and "second" are used to identify names rather than to indicate any specific order. Any figure marks in the claims should not be understood as limiting the scope of protection. The functions of multiple parts appearing in the claims can be implemented by a separate hardware or software module. The fact that certain technical features appear in different dependent claims does not mean that these technical features cannot be combined to achieve beneficial effects.

Claims

1. A display panel, wherein: The display panel further includes: substrate; a first conductive layer, located on the substrate; The second conductive layer is located on the side of the first conductive layer facing away from the substrate. wherein the first conductive layer and the second conductive layer are at least partially in contact with each other, The thickness of the second conductive layer is greater than that of the first conductive layer.

2. The display panel according to claim 1, wherein The display panel includes a display area and a non-display area located on one side of the display area, and the second conductive layer includes a pad located in the non-display area.

3. The display panel according to claim 2, wherein: The display panel further includes: The covering layer is located on a side of the second conductive layer facing away from the substrate, and the covering layer includes a covering portion. The covering portion includes an insulating material and covers at least a portion of a side wall of the pad.

4. The display panel according to claim 3, wherein: The covering portion is provided with a first opening, and the pad has a top surface away from the substrate, at least a portion of the top surface is exposed by the first opening.

5. The display panel according to claim 2, wherein: The display panel further includes: A chemically plated metal layer covers a surface of the pad that is away from the substrate. The display panel according to claim 5 , wherein: The chemically plated metal layer includes at least one of aluminum, molybdenum, gold, and silver.

7. The display panel according to claim 5, wherein: The chemically plated metal layer includes a plurality of chemically plated metal portions arranged at intervals.

8. The display panel according to claim 2, wherein: The pad has a first recessed portion recessed from a top surface of the pad facing away from the substrate toward the substrate.

9. The display panel according to claim 2, wherein: The first conductive layer includes a conductive trace electrically connected to the second conductive layer.

10. The display panel according to claim 9, wherein: The display panel further includes an insulating layer located on a side of the first conductive layer facing away from the substrate. The insulating layer includes an insulating portion located in the non-display area. The insulating portion covers at least a portion of the conductive traces.

11. The display panel according to claim 10, wherein: The insulating portion is provided with a plurality of second openings, and the pads are electrically connected to the conductive traces through the second openings.

12. The display panel according to claim 11, wherein: The orthographic projection of the second opening on the substrate is located within the orthographic projection of the pad on the substrate.

13. The display panel according to claim 12, wherein: The conductive trace has a third opening, and an orthographic projection of the third opening on the substrate is located within an orthographic projection of the second opening on the substrate.

14. The display panel according to claim 10, wherein: A hollow portion is formed on the insulating portion, and the hollow portion is located between adjacent conductive traces.

15. The display panel according to claim 14, wherein: The non-display area includes a first routing area and a second routing area sequentially distributed in a direction away from the display area, and the hollow portion is located in at least one of the first routing area and the second routing area.

16. The display panel according to claim 15, wherein: The conductive trace includes a first trace and a second trace, the first trace is located in the first trace area, and the second trace is located in the second trace area.

17. The display panel according to claim 16, wherein: The first wiring and the insulating portion are located on a side of the pad close to the display area and away from the display area.

18. The display panel according to claim 16, wherein: The minimum distance between the first trace and the hollow portion is 0.5 μm to 5 μm.

19. The display panel according to claim 16, wherein: The second trace is larger than the first trace.

20. The display panel according to claim 16, wherein The first wiring area includes a first wiring area, a second wiring area and a third wiring area distributed in sequence along a direction away from the display area. The distance between adjacent first wirings in the first wiring area is a first distance, the distance between adjacent first wirings in the second wiring area is a second distance, and the distance between adjacent first wirings in the third wiring area is a third distance. The first distance is greater than the second distance, and the second distance is greater than the third distance.

21. The display panel according to claim 20, wherein: The hollow portion is located in the first wiring area and the second wiring area.

22. The display panel according to claim 20, wherein: In the first wiring area, the hollow portion is provided between adjacent first traces.

23. The display panel according to claim 20, wherein: In the second wiring area, a plurality of the first routing lines form a first group of routing lines, and the hollow portion is located between two adjacent first group of routing lines.

24. The display panel according to any one of claims 14 to 23, wherein: The hollow parts are evenly distributed.

25. The display panel according to claim 16, wherein: The non-display area also includes a first binding area, a second binding area and a third binding area. The first binding area is located on a side of the first routing area close to the display area, the second binding area is located between the first routing area and the second routing area, the three binding areas are located on a side of the second routing area away from the display area, and the hollow portion is located in the second binding area.

26. The display panel according to claim 25, wherein: The pads include a first pad located in the first binding area, a second pad located in the second binding area, and a third pad located in the third binding area. One end of the first trace is connected to the first pad, and the other end is connected to the second pad; one end of the second trace is connected to the second pad, and the other end is connected to the third pad.

27. The display panel according to claim 26, wherein: A plurality of second pads are distributed in rows, a row of second pads away from the display area forms a second pad row, and the first trace and the insulating portion are located on a side of the second pad row close to the display area.

28. The display panel according to claim 1, wherein At least a portion of the second conductive layer extends along the first conductive layer and is in contact with and connected to the first conductive layer along its extension path.

29. A display device comprising the display panel according to any one of claims 1 to 28.

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