Display module and display device

Abstract

A display module and a display device. A display module (100) comprises a driving structure (10); the driving structure (10) is located on one side of the display module (100); the driving structure (10) comprises a driving carrier (01); the driving carrier (01) comprises a first binding area (101) and a second binding area (102); the first binding area (101) comprises a plurality of first bonding pads (11); the second bonding area (102) comprises a plurality of second bonding pads (12), wherein the size of each second bonding pad (12) is greater than that of each first bonding pad (11), and / or the distance between two adjacent second bonding pads (12) is greater than the distance between two adjacent first bonding pads (11).

Description

Display module and display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 29, 2024, with application number 202410386114.8, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, for example, to a display module and a display device. Background Art

[0003] As the demand for display technology continues to grow, so too do the demands on the process technology for display devices. However, with the increasing diversification of display devices, process production lines cannot meet the process requirements of all display devices. This is especially true for the bonding pad crimping equipment, as different crimping equipment has different requirements and restrictions for bonding pads. Developing new crimping equipment for different display devices will significantly increase costs.

[0004] Summary of the Invention

[0005] The present application provides a display module and a display device, so that the driving carrier in the driving structure of the display module can be bound and connected with other structures through different existing crimping equipment, without the need to develop new crimping equipment, which is conducive to reducing the preparation process cost of the display module.

[0006] An embodiment of the present application provides a display module, comprising: a driving structure, wherein the driving structure is located on one side of the display module;

[0007] The driving structure includes a driving carrier;

[0008] The driving carrier includes a first binding area and a second binding area;

[0009] The first binding area includes a plurality of first binding pads;

[0010] The second binding area includes a plurality of second binding pads;

[0011] The size of the second binding pad is larger than that of the first binding pad, and / or the distance between two adjacent second binding pads is larger than the distance between two adjacent first binding pads.

[0012] An embodiment of the present application provides a display device including the above-mentioned display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG1 is a schematic structural diagram of a display module provided in an embodiment of the present application;

[0014] FIG2 is a schematic structural diagram of a driving carrier provided in an embodiment of the present application;

[0015] FIG3 is a schematic structural diagram of another display module provided in an embodiment of the present application;

[0016] FIG4 is a schematic structural diagram of another driving carrier provided in an embodiment of the present application;

[0017] FIG5 is a schematic diagram of a cross-sectional structure along the A-A1 direction of FIG4;

[0018] FIG6 is another schematic cross-sectional view of FIG4 along the A-A1 direction;

[0019] FIG7 is another schematic cross-sectional view of FIG4 along the A-A1 direction;

[0020] FIG8 is another schematic cross-sectional view of FIG4 along the A-A1 direction;

[0021] FIG9 is a schematic structural diagram of another driving carrier provided in an embodiment of the present application;

[0022] FIG10 is a schematic cross-sectional view of FIG9 along the B-B1 direction;

[0023] FIG11 is another schematic cross-sectional view of FIG9 along the B-B1 direction;

[0024] FIG12 is a schematic diagram of a partially enlarged structure of FIG9;

[0025] FIG13 is another partial enlarged structural schematic diagram of FIG9;

[0026] FIG14 is another partial enlarged structural schematic diagram of FIG9;

[0027] FIG15 is another partial enlarged structural schematic diagram of FIG9;

[0028] FIG16 is another schematic cross-sectional view of FIG4 along the A-A1 direction;

[0029] FIG17 is a schematic structural diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] The following will refer to the drawings in the embodiments of the present application to describe the technical solution of the present application through implementation methods. The described embodiments are part of the embodiments of the present application, but not all of the embodiments.

[0031] FIG1 is a schematic diagram of the structure of a display module provided in an embodiment of the present application, and FIG2 is a schematic diagram of the structure of a driving carrier provided in an embodiment of the present application. Referring to FIG1 and FIG2 , the display module 100 includes: a driving structure 10, the driving structure 10 is located on one side of the display module 100; the driving structure 10 includes a driving carrier 01; the driving carrier 01 includes a first binding area 101 and a second binding area 102; the first binding area 101 includes a plurality of first binding pads 11; the second binding area 102 includes a plurality of second binding pads 12; wherein the size of the second binding pad 12 is larger than the size of the first binding pad 11, and / or the spacing between two adjacent second binding pads 12 is larger than the spacing between two adjacent first binding pads 11.

[0032] The driver structure 10 can be considered the core structure that drives the normal operation of the display module 100 and is configured to provide multiple types of signals, including power signals and display drive signals. To meet the requirements of borderless technology that reduces or eliminates the border area to maximize the display area of ​​the display module, the driver structure 10 can be located on the side of the display module 100 away from the light-emitting surface.

[0033] Referring to Figure 2 , the drive carrier 01 is configured to carry multiple types of drive components in the drive structure 10 and to be bound and connected to other structures. The relative positions of the first binding area 101 and the second binding area 102 can be set according to actual circumstances and are not limited here. Figure 2 is merely an example, but not limiting.

[0034] Continuing to refer to FIG2 , the arrangement of the plurality of first binding pads 11 in the first binding area 101 can be set according to actual conditions, and can be arranged in one direction or in an array. FIG2 is only shown for example. Similarly, the arrangement of the plurality of second binding pads 12 in the second binding area 102 can be set according to actual conditions, and can be arranged in one direction or in an array. This is not limited here. In addition, the arrangement of the first binding pads 11 in the first binding area 101 and the arrangement of the second binding pads 12 in the second binding area 102 can be the same or different, and can be set according to actual conditions.

[0035] When the driver carrier 01 is bonded to other structures via the first bonding pad 11 in the first bonding area 101, and bonded to other structures via the second bonding area 102, the existing crimping equipment is limited by multiple factors, such as the size of the driver carrier 01 itself, the size of the first bonding area 101, the size of the first bonding pad 11, the size of the second bonding area 102, and / or the size of the second bonding pad 12. This affects the ability of existing crimping equipment to achieve precise bonding of the driver carrier 01 to other structures. Existing crimping equipment includes chip on glass (COG) crimping equipment, chip on flexible printed circuit (COF) crimping equipment, flexible printed circuit on glass (FOG) crimping equipment, etc. Among them, COG crimping equipment is generally configured to bond the driver chip to glass, COF crimping equipment is configured to bond the driver chip to a flexible printed circuit board, and FOG crimping equipment is configured to bond the flexible printed circuit board to glass. However, different crimping equipment may have different requirements for bonding pads. Once the design requirements of the bonding pads on the drive carrier 01 do not meet the requirements of any type of crimping equipment, a new crimping equipment needs to be developed, which increases the cost.

[0036] Based on the above problems, in this embodiment, the size of the second binding pad 12 in the second binding area 102 of the driving carrier 01 is set to be larger than the size of the first binding pad 11 in the first binding area 101, so that the first binding area 101 and the second binding area 102 can be bound and connected to different structures through different existing crimping equipment. The size of the first binding pad 11 can be the size in the arrangement direction of multiple first binding pads 11, and the size of the second binding pad 12 can be the size in the arrangement direction of multiple second binding pads 12. The arrangement direction of the first binding pad 11 and the arrangement direction of the second binding pad 12 can be the same or different. Figure 2 only exemplifies a possible embodiment in which the arrangement direction of the second binding pad 12 and the arrangement direction of the first binding pad 11 can be the same direction, but is not limited to this.

[0037] In one or more embodiments, the spacing between two adjacent second binding pads 12 can be set to be greater than the spacing between two adjacent first binding pads 11, and the first binding area 101 and the second binding area 102 can also be bound and connected to different structures through different existing crimping equipment. The spacing between two adjacent second binding pads 12 can be the spacing in the arrangement direction of multiple second binding pads 12, and the spacing between two adjacent first binding pads 11 can be the spacing in the arrangement direction of multiple first binding pads 11. The arrangement direction of the first binding pad 11 and the arrangement direction of the second binding pad 12 can be the same or different. Figure 2 only exemplifies a possible embodiment in which the arrangement direction of the second binding pad 12 and the arrangement direction of the first binding pad 11 can be the same direction, but is not limited to this.

[0038] Thus, in this embodiment, by setting the size of the second binding pad 12 on the driving carrier 01 of the driving structure 10 to be larger than the size of the first binding pad 11, and / or the spacing between two adjacent second binding pads 12 is larger than the spacing between two adjacent first binding pads 11, the first binding area 101 and the second binding area 102 of the driving carrier 01 can be bound and connected to other structures through existing different crimping equipment, without the need to develop new crimping equipment, which is beneficial to reducing the preparation process cost of the display module.

[0039] In an optional embodiment, continuing to refer to Figure 2, multiple first binding pads 11 are arranged along the first direction X, and multiple second binding pads 12 are also arranged along the first direction X. The size of the first binding pad 11 can be the size in the first direction X, and the size of the second binding pad 12 can also be the size in the first direction X. The spacing between two adjacent first binding pads 11 can be the spacing in the first direction X, and the spacing between two adjacent second binding pads 12 can also be the spacing in the first direction X.

[0040] Optionally, with continued reference to FIG. 2 , the size of the second binding pad 12 is greater than 80 μm; and the size of the first binding pad 11 is less than 15 μm.

[0041] In one or more embodiments, the size of the second bonding pad 12 is greater than 80 μm, and a crimping device with low pad precision can be used to bond the second bonding area 102. The size of the first bonding pad 11 is less than 15 μm, and a crimping device with high pad precision can be used to bond the first bonding area 101. In this way, when bonding the first bonding area 101 and the second bonding area 102, both existing crimping devices can be used to bond them, eliminating the need to develop new crimping devices, thereby reducing costs.

[0042] In an optional embodiment, based on the embodiment shown in FIG. 2 , the size of the second binding pad 12 and the size of the first binding pad 11 may both refer to the size in the first direction X.

[0043] Optionally, referring to FIG. 2 , the distance between two adjacent second bonding pads 12 is greater than 40 μm.

[0044] In one or more embodiments, the distance between two adjacent second binding pads 12 is greater than 40 μm, so that the second binding area 102 can be bound and connected using existing crimping equipment with low crimping pad precision. When the spacing between two adjacent second binding pads 12 is greater than the spacing between two adjacent first binding pads 11, the distance between two adjacent first binding pads 11 will be less than 40 μm, which also allows the first binding area 101 to be bound and connected using existing crimping equipment with high crimping pad precision. In this way, when the first binding area 101 and the second binding area 102 are bound and connected, they can both be bound and connected using existing different crimping equipment without the need to develop new crimping equipment, which helps reduce costs.

[0045] In an optional embodiment, based on the embodiment shown in FIG. 2 , the distance between two adjacent second binding pads 12 may refer to the distance in the first direction X.

[0046] Optionally, Figure 3 is a structural schematic diagram of another display module provided in an embodiment of the present application. Referring to Figure 3, the driving carrier 01 is a flexible structure; the display module 100 also includes a rigid module 02 and a flexible module 03; the driving carrier 01 is connected to the rigid module 02 through a first binding pad 11, and is connected to the flexible module 03 through a second binding pad 12.

[0047] The rigid module 02 may include structures such as a driver chip, and the flexible module 03 may include structures such as a display panel.

[0048] The driving carrier 01 is a flexible structure, which may include a flexible circuit board.

[0049] In one or more embodiments, the rigid module 02 is bound and connected to the driving carrier 01 through the first binding pad 11 of the first binding area 101, and the flexible module 03 is bound and connected to the driving carrier 01 through the second binding pad 12 of the second binding area 102. For example, when the rigid module is a driving chip and the flexible structure is a flexible circuit board, the driving chip is bound to the flexible structure to form a COF structure, that is, the driving structure 10 is a COF structure.

[0050] Since the rigid module 02 is relatively rigid and not resistant to bending, it can be bound and connected to the drive carrier 01 via the first binding area 101. The first binding pads 11 in the first binding area 101 can be smaller in size, or the distance between adjacent first binding pads 11 can be smaller. This can better match the binding of the rigid module 02 and prevent the reliability of the binding connection from being affected by bending of the rigid module 02. At the same time, it can also reduce the space occupied by the first binding pads 11. Since the flexible module 03 is bendable and more flexible, it can be bound and connected to the drive carrier 01 via the second binding area 102. The second binding pads 12 in the second binding area 102 can be larger in size than the first binding pads 11, or the distance between adjacent second binding pads 12 can be larger than the distance between adjacent first binding pads 11. This increases the binding area of ​​the second binding pads 12 and ensures that the reliability of the connection between the flexible module 03 and the second binding pads 12 is not damaged during the bending process of the flexible module 03.

[0051] In addition, continuing to refer to Figures 1 and 3, the display module 100 may also include a driving signal line 04 electrically connected to the flexible module 03, and the driving carrier 01 can be bound and connected to the flexible module 03 through the driving signal line 04. In one or more embodiments, the driving signal line 04 may include a back wiring portion 041 and a side wiring portion 042, and the back wiring portion 041 and the side wiring portion 042 are electrically connected through a binding electrode 05. The other end of the side wiring 042 is bound and connected to the signal wiring located on the light-emitting surface side of the display module 100 (not shown in Figure 3), thereby realizing that the driving structure 10 drives the display module 100 to display images.

[0052] Optionally, Figure 4 is a structural schematic diagram of another driving carrier provided in an embodiment of the present application. In combination with reference to Figures 3 and 4, the display module 100 also includes a display panel 031; the driving structure 10 also includes a driving chip 021; the driving carrier 01 includes a flexible circuit board 011; the second binding area 102 includes a first sub-binding area 1021 and a second sub-binding area 1022, and the first binding area 101 is located between the first sub-binding area 1021 and the second sub-binding area 1022; the display panel 031 is bound and connected to the driving structure 10 through the first sub-binding area 1021; the driving chip 021 is bound and connected to the flexible circuit board 011 through the first binding area 101.

[0053] The arrangement of the second binding pads 12 in the first sub-binding area 1021 and the second sub-binding area 1022 may be the same or different, which is not limited here. FIG. 2 is only an example, but not limited thereto.

[0054] When the driver carrier 01 is made of glass, the driver chip 021 is bound to the glass through the first binding area 101. The driver carrier 01 needs to be bound and connected to the flexible circuit structure through the second binding area 102, and then the flexible circuit structure is bound and connected to the display panel 031. This increases the process steps and thus increases the process cost.

[0055] In this embodiment, the driving carrier 01 includes a flexible circuit board 011, and the driving chip 021 is bound and connected to the flexible circuit board 011 through the first binding area 101 to form a COF structure. Unlike the COG structure, the driving carrier 01 can be directly bound and connected to the display panel 031 through the first sub-binding area 1021, reducing the number of binding times, thereby reducing the process steps, and helping to reduce process costs.

[0056] Continuing with FIG4 , the drive carrier 01 can also be bound and connected to another printed circuit board (PCB) via the second sub-binding area 1022 to form a flexible printed circuit on board (FOB) structure. For example, the circuit board bound and connected to the second sub-binding area 1022 can be a circuit board for providing a quick-connect connector, but is not limited thereto.

[0057] Optionally, Figure 5 is a schematic diagram of a cross-sectional structure along the A-A1 direction of Figure 4. Combined with reference to Figures 4 and 5, the flexible circuit board 011 includes a stacked base substrate 21, a metal routing layer 22, a first insulating layer 23 and a metal connection layer 24; the metal routing layer 22 includes a first connection portion 22a, and the metal connection layer 24 includes a second connection portion 24a; the first insulating layer 23 is provided with a plurality of through holes 230, and the through holes 230 are filled with the second connection portion 24a; any one of the first binding pads 11 and the second binding pad 12 includes a first connection portion 22a and a second connection portion 24a, and the first connection portion 22a is in contact with the second connection portion 24a.

[0058] The base substrate 21 is provided to support and protect the film layer thereon. The base substrate 21 is a flexible substrate, and its material may include one or more polymer resins selected from the group consisting of polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and cellulose acetate propionate. The material of the base substrate 21 is not limited herein.

[0059] The metal wiring layer 22 may be one or more metal layers. The material of the metal wiring layer 22 may include one or more combinations of aluminum, copper, molybdenum, and titanium.

[0060] The material of the first insulating layer 23 includes photosensitive polyimide, silicon nitride or silicon oxide.

[0061] The metal connection layer 24 is configured to bond the bonding pad to other structures. The material of the metal connection layer 24 can be a chemically plated metal. Optionally, the material of the metal connection layer 24 includes nickel-palladium-gold or nickel-gold. The second connection portion 24a can be deposited on the metal trace layer 22 within the through hole 230 through a chemical plating process. To do this, the thickness of the metal trace layer 22 needs to be slightly larger to ensure that the metal trace layer 22 still has a certain thickness after the chemical plating is completed, thereby ensuring connection reliability.

[0062] Continuing to refer to Figure 5, when the sizes of the first binding pad 11 and the second binding pad 12 are different, the sizes of the corresponding first connection portion 22a of the first binding pad 11 and the first connection portion 22a of the second binding pad 12 may be different, and / or the sizes of the second connection portion 24a of the first binding pad 11 and the second connection portion 24a of the second binding pad 12 may be different.

[0063] Optionally, continuing to refer to Figure 5, the surface of the second connecting portion 24a away from the base substrate 21 is the first surface 241; the surface of the first insulating layer 23 away from the base substrate 21 is the second surface 231; in the direction of the thickness of the flexible circuit board 011 (i.e., the Z direction), the height of the first surface 241 is less than the height of the second surface 231.

[0064] In one or more embodiments, the second connection portion 24a is filled in the through hole 230, and the height of the first surface 241 is smaller than the height of the second surface 231, that is, the upper surface of the second connection portion 24a does not exceed the through hole 230. This can avoid the problem of short circuit between adjacent second connection portions 24a when binding with other structures, thereby improving the reliability of pad binding.

[0065] Optionally, Figure 6 is another cross-sectional structural schematic diagram of Figure 4 along the A-A1 direction. Referring to Figure 6, the metal routing layer 22 includes a first metal routing layer 221 and a second metal routing layer 222; the flexible circuit board 011 also includes a second insulating layer 25 located between the first metal routing layer 221 and the second metal routing layer 222, and the second insulating layer 25 includes a plurality of first vias 250; the first connection portion 22a includes a first sub-connection portion 221a and a second sub-connection portion 222a, the first sub-connection portion 221a is located in the first metal routing layer 221, and the second sub-connection portion 222a is located in the second metal routing layer 222; the first sub-connection portion 221a and the second sub-connection portion 222a are connected through the first via 250; in the thickness direction of the flexible circuit board 011 (i.e., the Z direction), the thickness of the second metal routing layer 222 is greater than the thickness of the first metal routing layer 221.

[0066] The materials of the first metal wiring layer 221 and the second metal wiring layer 222 may be the same or different. The material of the first metal wiring layer 221 includes one or more combinations of aluminum, copper, molybdenum, and titanium.

[0067] Optionally, the material of the second metal wiring layer 222 includes copper.

[0068] In one or more embodiments, when the second connection portion 24a is deposited on the second metal trace layer 222, it can be based on copper, and the thickness of the copper is greater than the thickness of the first metal trace layer 221. This ensures that after the second connection portion 24a is chemically plated, the copper of the second metal trace layer 222 still has a certain thickness, thereby ensuring connection reliability. It should be noted that a greater copper thickness will also result in a larger size of the bonding pad. Therefore, by adjusting the size of the first bonding pad 11 and the second bonding pad 12, existing crimping equipment can ensure that the first bonding pad 11 or the second bonding pad 12 can be bonded and connected, thereby reducing costs.

[0069] In one or more embodiments, by setting the metal routing layer 22 in the flexible circuit board 011 to have the advantages of different thicknesses, that is, the thickness of the second metal routing layer 222 is greater than the thickness of the first metal routing layer 221, on the one hand, the second metal routing layer 222 can have a smaller resistance, and since the second metal routing layer 222 is located on the first metal routing layer 221, it can be used as a limited auxiliary multiplexing for other conductive structures, that is, the second metal routing layer 222 can be directly reused as a binding pad; on the other hand, the thickness of the second metal routing layer 222 can be used to make grooves to ensure the stability of the connection between the second metal routing layer 222 and other structures.

[0070] Optionally, referring to FIG6 , along the thickness direction of the flexible circuit board 011 (ie, the Z direction), the thickness d1 of the first metal trace layer 221 and the thickness d2 of the second metal trace layer 222 satisfy: d2>3*d1.

[0071] In one or more embodiments, the specific values ​​of the thickness d1 of the first metal trace layer 221 and the thickness d2 of the second metal trace layer 222 can be set according to actual conditions and are not limited here. They only need to satisfy d2>3*d1. Considering that the second sub-connection portion 222a of the second metal trace layer 222 needs to be in direct contact with the second connection portion 24a of the metal connection layer 24, in order to ensure the connection reliability of the binding pad, the thickness of the second metal trace layer 222 needs to be set to be larger, while the thickness of the first metal trace layer 221 can be less than the thickness of the second metal trace layer 222. This helps reduce the overall film thickness of the flexible circuit board 011, thereby facilitating a lightweight and thin design of the display module 100.

[0072] Optionally, with continued reference to FIG6 , the thickness d2 of the second metal wiring layer 222 satisfies: d2>5000i.

[0073] In one or more embodiments, 1i=10 -10 m, when the thickness d2 of the second metal wiring layer 222 is set to be less than or equal to 5000i, once the second connection portion 24a is prepared by a chemical plating process, part of the copper will undergo chemical replacement during the plating process. When the thickness of the copper is too small, the entire copper may be damaged, thereby affecting the reliability of the binding connection of the second sub-connection portion 222a.

[0074] Optionally, with continued reference to FIG. 6 , the line width of at least a portion of the first metal wiring layer 221 is smaller than the line width of the second metal wiring layer 222 .

[0075] In one or more embodiments, in the production line process for preparing the flexible circuit board 011, especially for the low-temperature multi-silicon production line process, it is required that the ratio of the metal pattern area of ​​the first metal layer closer to the base substrate 021 to the total area of ​​the flexible circuit board 011 cannot be too high, that is, the transmittance of the first metal layer needs to meet certain requirements. In this way, considering that the first metal wiring layer 221 is located on the side of the second metal wiring layer 222 close to the base substrate 21, the line width of at least part of the first metal wiring layer 221 can be set to be smaller than the line width of the second metal wiring layer 222 to ensure that the film layer where the first metal wiring layer 221 is located has a higher transmittance.

[0076] Optionally, FIG7 is another schematic diagram of a cross-sectional structure along the A-A1 direction of FIG4 . Referring to FIG7 , an inorganic insulating layer 26 is further provided between the base substrate 21 and the first metal wiring layer 221 , and the inorganic insulating layer 26 includes silicon nitride or silicon oxide.

[0077] In one or more embodiments, if the material of the base substrate 21 contains moisture, or if moisture penetrates upward from the film layer of the base substrate 21 during the manufacturing process of the flexible circuit board 011, it will cause corrosion to the metal film layer. Therefore, by providing an inorganic insulating layer 26 between the base substrate 21 and the first metal trace layer 221, it can help reduce or prevent the penetration of foreign matter, moisture, or external air from below the base substrate 21, and provide a flat surface on the base substrate 21.

[0078] Optionally, FIG8 is another schematic cross-sectional structure diagram along the A-A1 direction of FIG4 . Referring to FIG8 , for the same binding pad, the first sub-connection portion 221 a and the second sub-connection portion 222 a are connected through a plurality of first vias 250 .

[0079] For the same bonding pad, the number of first vias 250 between the first sub-connection portion 221a and the second sub-connection portion 222a can be set according to actual conditions and is not limited here. Furthermore, the number of first vias 250 provided in the first bonding pad 11 and the number of first vias 250 provided in the second bonding pad 12 can be the same or different, and is not limited here. FIG. 8 is merely an example and is not intended to be limiting.

[0080] In one or more embodiments, by setting the first sub-connection portion 221a and the second sub-connection portion 222a in the same binding pad and connecting them through multiple first vias 250, when one of the first vias 250 is damaged or fails, it will not affect the reliability of the connection between the first sub-connection portion 221a and the second sub-connection portion 222a, thereby reducing the probability of damage to the flexible circuit board 011.

[0081] Unless otherwise specified, in order to facilitate understanding of the solution, the following embodiments are exemplified by taking the first sub-connection portion 221 a and the second sub-connection portion 222 a as connected by a first via 250 .

[0082] Optionally, FIG9 is a schematic structural diagram of another driving carrier provided in an embodiment of the present application. Referring to FIG9, FIG10 is a schematic cross-sectional structural diagram of FIG9 along the B-B1 direction. As shown in FIG9 and FIG10, the flexible circuit board 011 includes a first routing area 103 and a second routing area 104. The first routing area 103 is located between the first binding area 101 and the first sub-binding area 1021, and the second routing area 104 is located between the first binding area 101 and the second sub-binding area 1022; the first binding pad 11 includes a first sub-binding pad 111 and a second sub-binding pad 112; the first routing area 103 includes a plurality of first routing lines 1030, and the second routing area 103 includes a plurality of first routing lines 1030 and a plurality of second routing lines 1031. 04 includes multiple second routes 1040; the first route 1030 includes a first sub-route 1031 and a second sub-route 1032, one end of the first sub-route 1031 is electrically connected to the second binding pad 12 of the first sub-binding area 1021, the other end of the first sub-route 1031 is electrically connected to one end of the second sub-route 1032, and the other end of the second sub-route 1032 is electrically connected to the first sub-binding pad 111; one end of the second route 1040 is electrically connected to the second sub-binding pad 112, and the other end of the second route 1040 is electrically connected to the second binding pad 12 of the second sub-binding area 1022; the second sub-route 1032 is located in the first metal routing layer 221.

[0083] The arrangement of the first sub-binding pads 111 in the first binding region 101 can be configured based on actual conditions and is not limited here. Similarly, the arrangement of the second sub-binding pads 112 can also be configured based on actual conditions and is not limited here. FIG. 9 is merely an example and is not intended to be limiting.

[0084] In one or more embodiments, since the size of the second binding pad 12 is larger than the size of the first binding pad 11, and / or the spacing between two adjacent second binding pads 12 is larger than the spacing between two adjacent first binding pads 11, the first routing 1030 located in the first routing area 103 includes a first sub-routing 1031 and a second sub-routing 1032, which can ensure that the first routing 1030 can reliably connect the second binding pad 12 of the first sub-binding area 1021 with the first sub-binding pad 111, avoiding problems such as virtual connection that may cause failure of the driving structure 10.

[0085] Continuing to refer to Figure 10, the size of the first binding pad 11 is small, and / or the spacing between two adjacent first binding pads 11 is small. The second sub-route 1032 can be set to be located in the first metal routing layer 221 to connect the first sub-route 1031 with the first sub-binding pad 111, and the thickness of the first metal routing layer 221 is small, which is conducive to the dense distribution of the second sub-route 1032 and the use of a smaller driver chip. In this way, even if the size of the first sub-binding pad 111 is very small and the spacing between adjacent first sub-binding pads 111 is also small, it can still be ensured that the second sub-route 1032 reliably connects the first sub-route 1031 with the first sub-binding pad 111, thereby improving the electrical connection reliability of the first route 1030.

[0086] In one or more embodiments, the first sub-routing 1031 can be set in the first metal routing layer 221, or in the second metal routing layer 222, or in both the first metal routing layer 221 and the second metal routing layer 222, which is not limited in this embodiment.

[0087] In addition, the second routing line 1040 may be located in the first metal routing layer 221 and / or the second metal routing layer 222 . This embodiment does not limit this and may be configured according to specific circumstances. FIG. 10 is merely an example and is not limited thereto.

[0088] Optionally, with continued reference to FIG. 10 , the first sub-routing 1031 is located in the second metal routing layer 222 , and the connection between the first sub-routing 1031 and the second sub-routing 1032 is connected through a second via 10310 .

[0089] In one or more embodiments, at the second via 10310, the first metal routing layer 211 and the second metal routing layer 222 are electrically connected through the second via 10310, so that the first metal routing layer 221 and the second metal routing layer 222 at the second via 10310 overlap in the direction Z perpendicular to the flexible circuit board 011.

[0090] 9 , the plurality of second binding pads 12 are arranged along the first direction X; the second sub-routing 1032 extends along the second direction Y, which is perpendicular to the first direction X; and the extension direction of the first sub-routing 1031 intersects both the first direction X and the second direction Y.

[0091] In one or more embodiments, since the size of the second binding pad 12 is larger than the size of the first binding pad 11, and / or the spacing between two adjacent second binding pads 12 is larger than the spacing between two adjacent first binding pads 11, the first trace 1030 electrically connecting the second binding pad 12 in the first sub-binding area 1021 to the first sub-binding pad 111 cannot be guaranteed to extend along the second direction Y. In this way, the second sub-trace 1032 extends along the second direction Y to avoid contact between the second sub-trace 1032 and the adjacent first sub-binding pad 111 and cause a short circuit, and the extension direction of the first sub-trace 1031 is set to intersect with the first direction X and the second direction Y at the same time, that is, the first sub-trace 1031 is set at an angle, and multiple first sub-traces 1031 are arranged in a fan shape, thereby ensuring the reliability of the electrical connection of the first trace 1030 and reducing the chance of damage to the flexible circuit board 011.

[0092] The number of second bonding pads 12 shown in FIG9 is limited, and only a portion of the bonding pads. The arrangement of all first bonding pads 11 in the first sub-bonding area 1021 can be any arrangement, such as an array arrangement. This embodiment only illustrates that a plurality of second bonding pads 12 are arranged along the first direction X, and does not mean that all second bonding pads 12 are arranged along the first direction X.

[0093] Optionally, Figure 11 is another cross-sectional structural schematic diagram of Figure 9 along the B-B1 direction. Referring to Figure 11, the first sub-route 1031 includes a first division 10311 and a second division 10312 arranged in parallel, the first division 10311 is located in the first metal routing layer 221, and the second division 10312 is located in the second metal routing layer 222; the connection between the first sub-route 1031 and the second sub-route 1032 is connected through a second via 10310.

[0094] In one or more embodiments, setting the first sub-route 1031 to include a first section 10311 and a second section 10312 set in parallel can reduce the line impedance of the first sub-route 1031, thereby reducing the signal loss of the signal transmitted by the first sub-route 1031 and improving the display quality of the display module 100.

[0095] Optionally, FIG12 is a schematic diagram of a partially enlarged structure of FIG9 . Referring to FIG12 , the area of ​​the second section 10312 is larger than the area of ​​the first section 10311 .

[0096] The shape of the first section 10311 and the shape of the second section 10312 can be any shape, and are not limited here. The first section 10311 can be arranged with equal widths or with unequal widths. Similarly, the second section 10312 can be arranged with equal widths or with unequal widths. FIG12 is merely an example, and is not intended to limit the present invention.

[0097] In one or more embodiments, the area of ​​the second division 10312 is set to be larger than the area of ​​the first division 10311. On the one hand, this can ensure that the parallel impedance of the first division 10311 and the second division 10312 is small, which is beneficial to reducing the line impedance of the first sub-routing 1031; on the other hand, it can ensure that the film layer where the first metal routing layer 221 is located has a higher transmittance.

[0098] Optionally, FIG13 is another partially enlarged structural schematic diagram of FIG9 . Referring to FIG13 , the line width of the first section 10311 is the same as the line width of the second section 10312 .

[0099] In one or more embodiments, it can be considered that at the same position, the line width of the first division 10311 is the same as the line width of the second division 10312, that is, the shape and size of the first division 10311 and the second division 10312 are exactly the same, which can ensure that the line impedance after the first division 10311 and the second division 10312 are connected in parallel is minimized, which is beneficial to reducing the loss of the transmission signal.

[0100] Optionally, continuing to refer to Figure 12 or 13, on this basis, the line width of the second sub-routing 1032 can be set to be smaller than the line width of the first division 10311, so as to help improve the transmittance of the film layer where the first metal routing layer 221 is located, and at the same time help to facilitate the dense arrangement of multiple second sub-routings 1032, which can in turn help to design a smaller and more integrated driver chip.

[0101] Optionally, based on the above embodiment, for the same first routing line 1030 , the connection between the first sub-routing line 1031 and the second sub-routing line 1032 includes a plurality of second vias 10310 .

[0102] Among them, the number of the second vias 10310 can be set according to actual conditions and is not limited here.

[0103] Exemplarily, Figure 14 is another partially enlarged structural schematic diagram of Figure 9. Referring to Figure 14, taking the first sub-route 1031 shown in Figure 10 as an example, located in the second metal routing layer 222, the connection between the first sub-route 1031 and the second sub-route 1032 shown in Figure 14 includes multiple second vias 10310. In this way, when one of the second vias 10310 is damaged or fails, it will not affect the reliability of the connection between the first sub-route 1031 and the second sub-route 1032, thereby reducing the probability of damage to the flexible circuit board 011.

[0104] In other embodiments, Figure 15 is another partially enlarged structural schematic diagram of Figure 9. Referring to Figure 15, taking the first sub-route 1031 shown in Figure 11 as an example, which includes a first branch 10311 and a second branch 10312 arranged in parallel, the connection between the first sub-route 1031 and the second sub-route 1032 includes a plurality of second vias 10310, which can also ensure the reliability of the connection between the first sub-route 1031 and the second sub-route 1032, thereby reducing the probability of damage to the flexible circuit board 011.

[0105] Optionally, continuing to refer to Figure 10 or Figure 11, the second routing 1040 includes a third sub-routing 1041 and a fourth sub-routing 1042 arranged in parallel, the third sub-routing 1041 is located in the first metal routing layer 221, and the fourth sub-routing 1042 is located in the second metal routing layer 222.

[0106] In one or more embodiments, the third sub-routing 1041 and the fourth sub-routing 1042 form a parallel structure, which can reduce the line impedance of the second routing 1040 and thereby reduce the loss of the signal transmitted by the second routing 1040 .

[0107] Optionally, based on any of the above embodiments, Figure 16 is another cross-sectional structural schematic diagram of Figure 4 along the A-A1 direction. In combination with reference to Figure 4 and Figure 16, the binding pad also includes a third connection portion 27a located on the side of the second connection portion 24a away from the first connection portion 22a; for the third connection portion 27a of the first binding pad 11, the third connection portion 27a includes anisotropic conductive film (ACF) glue; for the third connection portion 27a of the second binding pad 12, the third connection portion 27a includes ACF glue or welding metal.

[0108] ACF refers to anisotropic conductive film. The third connecting portion 27a can also be made of a solder film layer containing ACF particles. The soldering metal, such as tin or gold, is used to bond the bonding pad to other structures through a reflow process. The third connecting portion 27a can be made of any of the aforementioned materials, as long as the conductive adhesive structure can achieve a reliable connection to the bonding pad. The design can be tailored to the specific situation.

[0109] Based on the same application concept, an embodiment of the present application further provides a display device. FIG17 is a structural schematic diagram of a display device provided in an embodiment of the present application. As shown in FIG17 , the display device 200 includes the display module 100 provided in any embodiment of the present application. The display device 200 provided in an embodiment of the present application can be a mobile phone or any electronic product with a display function, including the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present application does not make any special limitations on this.

Claims

1. A display module, comprising: A driving structure, the driving structure being located on one side of the display module; The driving structure includes a driving carrier; The driving carrier includes a first binding area and a second binding area; The first binding area includes a plurality of first binding pads; The second binding area includes a plurality of second binding pads; In which, the size of the second binding pad is larger than the size of the first binding pad, or the spacing between two adjacent second binding pads is larger than the spacing between two adjacent first binding pads, or the size of the second binding pad is larger than the size of the first binding pad and the spacing between two adjacent second binding pads is larger than the spacing between two adjacent first binding pads.

2. The display module according to claim 1, wherein: The size of the second bonding pad is greater than 80 μm; The size of the first bonding pad is less than 15 μm.

3. The display module according to claim 1, wherein: The distance between two adjacent second bonding pads is greater than 40 μm.

4. The display module according to claim 1, wherein: The driving carrier is a flexible structure; The display module also includes a rigid module and a flexible module; The driving carrier is connected to the rigid module via the first binding pad, and is connected to the flexible module via the second binding pad.

5. The display module according to claim 1, wherein: The display module also includes a display panel; The driving structure further includes a driving chip; The driving carrier includes a flexible circuit board; The second binding area includes a first sub-binding area and a second sub-binding area, and the first binding area is located between the first sub-binding area and the second sub-binding area; The display panel is bound and connected to the driving structure via the first sub-binding area; The driving chip is bound and connected to the flexible circuit board through the first binding area.

6. The display module according to claim 5, wherein: The flexible circuit board comprises a base substrate, a metal wiring layer, a first insulating layer and a metal connection layer which are stacked; The metal wiring layer includes a first connection portion, and the metal connection layer includes a second connection portion; The first insulating layer is provided with a plurality of through holes, and the through holes are filled with the second connecting parts; Either the first bonding pad or the second bonding pad includes the first connection portion and the second connection portion, and the first connection portion is in contact with the second connection portion.

7. The display module according to claim 6, wherein: The material of the metal connection layer includes nickel palladium gold or nickel gold.

8. The display module according to claim 6, wherein: The surface of the second connecting portion away from the base substrate is a first surface; The surface of the first insulating layer away from the base substrate is the second surface; In a thickness direction of the flexible circuit board, a height of the first surface is smaller than a height of the second surface.

9. The display module according to claim 6, wherein: The metal wiring layer includes a first metal wiring layer and a second metal wiring layer; The flexible circuit board further includes a second insulating layer located between the first metal trace layer and the second metal trace layer, the second insulating layer including a plurality of first vias; The first connection portion includes a first sub-connection portion and a second sub-connection portion, the first sub-connection portion is located in the first metal wiring layer, and the second sub-connection portion is located in the second metal wiring layer; the first sub-connection portion and the second sub-connection portion are connected through the first via; In a thickness direction of the flexible circuit board, the thickness of the second metal wiring layer is greater than the thickness of the first metal wiring layer.

10. The display module according to claim 9, wherein: Along the thickness direction of the flexible circuit board, the thickness d1 of the first metal wiring layer and the thickness d2 of the second metal wiring layer satisfy: d2>3*d1.

11. The display module according to claim 9, wherein: The thickness d2 of the second metal wiring layer satisfies: d2>5000i.

12. The display module according to claim 9, wherein: The second metal wiring layer is made of copper.

13. The display module according to claim 9, wherein: The line width of at least part of the first metal wiring layer is smaller than the line width of the second metal wiring layer.

14. The display module according to claim 9, wherein: An inorganic insulating layer is further provided between the base substrate and the first metal wiring layer, and the inorganic insulating layer includes silicon nitride or silicon oxide.

15. The display module according to claim 9, wherein: For the same binding pad, the first sub-connection portion and the second sub-connection portion are connected through a plurality of the first vias.

16. The display module according to claim 9, wherein: The flexible circuit board includes a first routing area and a second routing area, the first routing area is located between the first binding area and the first sub-binding area, and the second routing area is located between the first binding area and the second sub-binding area; The first bonding pad includes a first sub-bonding pad and a second sub-bonding pad; The first routing area includes a plurality of first routing lines, and the second routing area includes a plurality of second routing lines; The first routing line includes a first sub-routing line and a second sub-routing line, one end of the first sub-routing line is electrically connected to the second binding pad of the first sub-binding area, the other end of the first sub-routing line is electrically connected to one end of the second sub-routing line, and the other end of the second sub-routing line is electrically connected to the first sub-binding pad; One end of the second trace is electrically connected to the second sub-binding pad, and the other end of the second trace is electrically connected to the second binding pad of the second sub-binding area; The second sub-routing is located in the first metal routing layer.

17. The display module according to claim 16, wherein: A plurality of the second binding pads are arranged along a first direction; The second sub-line extends along a second direction, and the second direction is perpendicular to the first direction; An extension direction of the first sub-route intersects both the first direction and the second direction.

18. The display module according to claim 16, wherein: The first sub-line includes a first sub-section and a second sub-section arranged in parallel, the first sub-section is located in the first metal routing layer, and the second sub-section is located in the second metal routing layer; The connection between the first sub-routing and the second sub-routing is connected through a second via.

19. The display module according to claim 18, wherein: The area of ​​the second section is greater than that of the first section.

20. The display module according to claim 18, wherein: The line width of the first section is the same as the line width of the second section.

21. The display module according to claim 16, wherein: The first sub-routing is located in the second metal routing layer, and the connection between the first sub-routing and the second sub-routing is connected through a second via.

22. The display module according to claim 18 or 21, wherein: For the same first routing line, a connection between the first sub-routing line and the second sub-routing line includes a plurality of second vias.

23. The display module according to claim 16, wherein: The second routing includes a third sub-routing and a fourth sub-routing arranged in parallel, the third sub-routing is located in the first metal routing layer, and the fourth sub-routing is located in the second metal routing layer.

24. The display module according to claim 6, wherein: The first binding pad and the second binding pad each further include a third connection portion located on a side of the second connection portion away from the first connection portion; The third connection portion includes anisotropic conductive film (ACF) or welding metal.

25. A display device comprising the display module according to any one of claims 1 to 24.

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