Display panel and display device

Abstract

Provided in the present disclosure are a display panel and a display device. The display panel comprises a substrate, and an isolation structure, a first packaging layer and a plurality of light-emitting units, which are arranged on the substrate. The isolation structure is provided with a plurality of isolation openings respectively defining the light-emitting units, and the first packaging layer covers the isolation openings and the light-emitting units. The density of the first packaging layer is gradually reduced from the side of the first packaging layer facing the substrate to the side of the first packaging layer facing away from the substrate. The solution can improve the flatness of an etched surface of the first packaging layer, such that the first packaging layer can be more effectively protected during a preparation process of the display panel.

Description

Display panel and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202410364382.X, filed on March 27, 2024, entitled “Display Panel and Display Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of display technology, and in particular, to a display panel and a display device. Background Art

[0004] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent unit. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0005] However, current electronic display products are limited by their own structural designs, making it difficult to further improve the display effect of the display panel.

[0006] Summary of the Invention

[0007] In a first aspect, the present disclosure provides a display panel comprising a substrate, an isolation structure located on the substrate, a first encapsulation layer, and a plurality of light-emitting units. The isolation structure has a plurality of isolation openings that define the light-emitting units, respectively, and the first encapsulation layer covers the isolation openings and the light-emitting units. The density of the first encapsulation layer decreases gradually from the side facing the substrate to the side facing away from the substrate.

[0008] In the above scheme, by controlling the density distribution of the first encapsulation layer, a relatively inclined surface can be formed at the side surface of the first encapsulation layer, so as to facilitate the deposition of a protective layer in a subsequent process; in addition, this scheme can also improve the flatness of the etched surface of the first encapsulation layer, so that the first encapsulation layer can be more effectively protected in the preparation process of the display panel.

[0009] In a specific embodiment of the first aspect of the present disclosure, the first encapsulation layer includes a plurality of encapsulation units corresponding to the light-emitting units respectively.

[0010] Optionally, the first encapsulation layer is an inorganic film layer.

[0011] Optionally, an edge of the packaging unit extends to a side of the isolation structure away from the substrate, and a portion of the packaging unit located on the side of the isolation structure away from the substrate is spaced from the isolation structure to form a suspended portion.

[0012] Optionally, the light-emitting units correspond to the encapsulation units one to one.

[0013] In a specific embodiment of the first aspect of the present disclosure, the packaging unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface, and the side surface of the packaging unit is a smooth surface.

[0014] In a specific embodiment of the first aspect of the present disclosure, the side surface of the packaging unit is a plane, and the surface where the side surface of the packaging unit is located intersects with and is non-perpendicular to the surface where the substrate is located.

[0015] In a specific embodiment of the first aspect of the present disclosure, the display panel also includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer defines a plurality of pixel openings corresponding to the isolation openings respectively, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, and the light-emitting functional layer and the second electrode fill the pixel opening and extend to the surface of the pixel defining layer facing away from the substrate.

[0016] Optionally, the pixel defining layer may be an inorganic film layer.

[0017] In one embodiment of the first aspect of the present disclosure, the density of the pixel defining layer gradually decreases from the side facing the substrate to the side facing away from the substrate. This improves the flatness of the side surface of the pixel opening to ensure the continuity of the second electrode on this side surface.

[0018] Optionally, the second side surface of the pixel defining layer is a smooth surface.

[0019] Optionally, the second side surface of the pixel defining layer is a plane, and a plane where the second side surface of the pixel defining layer is located intersects and is non-perpendicular to a plane where the substrate is located.

[0020] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion located on the side of the support portion facing away from the substrate, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the edge of the orthographic projection of the crown portion on the substrate is the edge of the orthographic projection of the isolation structure on the substrate.

[0021] In a specific embodiment of the first aspect of the present disclosure, the light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on a substrate, and the light-emitting functional layer and the second electrode of each light-emitting unit are located in corresponding isolation openings.

[0022] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer defines a plurality of pixel openings, and the pixel openings are arranged corresponding to the isolation openings.

[0023] Optionally, the light-emitting functional layer and the second electrode fill the pixel opening and extend to a surface of the pixel defining layer facing away from the substrate.

[0024] Optionally, the support portion is a conductive structure, and the second electrode of the light-emitting unit is electrically connected to the support portion.

[0025] In a specific embodiment of the first aspect of the present disclosure, the isolation structure may further include an auxiliary support portion located between the support portion and the pixel defining layer. The orthographic projection of the auxiliary support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the auxiliary support portion on the substrate.

[0026] Optionally, the auxiliary support portion is a conductive structure, and the second electrode of the light emitting unit is electrically connected to the auxiliary support portion.

[0027] Optionally, the display panel further includes a second encapsulation layer and a third encapsulation layer covering the first encapsulation layer, the isolation structure and the light-transmitting shielding layer, and the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer.

[0028] Optionally, the second encapsulation layer is an organic layer, and the third encapsulation layer is an inorganic layer.

[0029] Optionally, the second encapsulation layer is a planarization layer.

[0030] In a specific embodiment of the first aspect of the present disclosure, the packaging unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface. Along the direction from the first main surface to the second main surface, the side surface includes a plurality of sub-side surfaces connected in sequence. The angle between the plane determined by the intersection of the side surface and the first main surface and the intersection of the side surface and the second main surface and each sub-side surface is not greater than 45 degrees, and the orthographic projection of the second main surface on the substrate is within the orthographic projection of the first main surface on the substrate.

[0031] In a specific embodiment of the first aspect of the present disclosure, the refractive index of the first encapsulation layer gradually decreases from a side of the first encapsulation layer facing the substrate to a side away from the substrate.

[0032] In a specific embodiment of the first aspect of the present disclosure, the oxygen content of the first encapsulation layer gradually increases from a side of the first encapsulation layer facing the substrate to a side away from the substrate.

[0033] According to a second aspect of the present disclosure, there is provided a display panel, which includes a substrate and an isolation structure located on the substrate, a first encapsulation layer and a plurality of light-emitting units. The isolation structure has a plurality of isolation openings that respectively define the light-emitting units, the first encapsulation layer covers the isolation openings and the light-emitting units, and includes a plurality of encapsulation units corresponding to the light-emitting units, the encapsulation units including a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface. Along the direction from the first main surface to the second main surface, the side surface includes a plurality of sub-side surfaces connected in sequence, the plane defined by the intersection of the side surface and the first main surface and the intersection of the side surface and the second main surface has an angle of no more than 45 degrees with each sub-side surface, and the orthographic projection of the second main surface on the substrate is located within the orthographic projection of the first main surface on the substrate.

[0034] In a specific embodiment of the second aspect of the present disclosure, the side surface of the packaging unit intersects and is non-perpendicular to the surface of the substrate. Optionally, the packaging unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface, and the side surface is a smooth surface. Optionally, the side surface of the packaging unit is planar, and the side surface of the packaging unit intersects and is non-perpendicular to the surface of the substrate.

[0035] In a specific embodiment of the second aspect of the present disclosure, the density of the first packaging layer gradually decreases from the side of the first packaging layer facing the substrate to the side away from the substrate; or, the first packaging layer includes at least two sub-packaging layers stacked on each other, and the refractive index of the sub-packaging layer that is smaller in distance to the substrate is greater.

[0036] In a specific embodiment of the second aspect of the present disclosure, the encapsulation unit includes a first sub-encapsulation layer, a second sub-encapsulation layer and a third sub-encapsulation layer stacked on each other, the first sub-encapsulation layer, the second sub-encapsulation layer and the third sub-encapsulation layer are arranged in sequence in a direction away from the substrate, and the density of the first sub-encapsulation layer, the second sub-encapsulation layer and the third sub-encapsulation layer gradually decreases or the refractive index gradually decreases.

[0037] According to a third aspect of the present disclosure, a display panel is provided, comprising a substrate, an isolation structure located on the substrate, a first encapsulation layer, and a plurality of light-emitting units. The isolation structure has a plurality of isolation openings that define the light-emitting units, respectively. The first encapsulation layer covers the isolation openings and the light-emitting units and includes at least two overlapping sub-encapsulation layers, wherein the sub-encapsulation layer with a smaller distance from the substrate has a greater refractive index.

[0038] In the above scheme, by controlling the refractive index of different sub-packaging layers, the density of different sub-packaging layers can be regulated, thereby improving the flatness of the etched surface (the side surface described below) of the first packaging layer, so that the first packaging layer can be more effectively protected during the preparation process of the display panel.

[0039] In a specific embodiment of the third aspect of the present disclosure, the smaller the distance from the sub-encapsulation layer to the substrate, the greater the density.

[0040] In a specific embodiment of the third aspect of the present disclosure, the smaller the distance from the substrate, the lower the oxygen content of the sub-encapsulation layer.

[0041] In a specific embodiment of the third aspect of the present disclosure, the first encapsulation layer includes a plurality of encapsulation units corresponding to the light-emitting units respectively.

[0042] In a specific embodiment of the third aspect of the present disclosure, the first encapsulation layer is an inorganic film layer.

[0043] In a specific embodiment of the third aspect of the present disclosure, the edge of the packaging unit extends to the side of the isolation structure away from the substrate, and the portion of the packaging unit located on the side of the isolation structure away from the substrate is spaced from the isolation structure to form a suspended portion.

[0044] In a specific embodiment of the third aspect of the present disclosure, the isolation structure includes a support portion and a crown portion located on the side of the support portion facing away from the substrate, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the edge of the orthographic projection of the crown portion on the substrate is the edge of the orthographic projection of the isolation structure on the substrate.

[0045] In a specific embodiment of the third aspect of the present disclosure, the light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on a substrate, and the light-emitting functional layer and the second electrode of each light-emitting unit are located in the corresponding isolation opening.

[0046] In a specific embodiment of the third aspect of the present disclosure, the display panel may further include a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer defines a plurality of pixel openings corresponding to the isolation openings respectively, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, the light-emitting functional layer and the second electrode fill the pixel opening and extend to the surface of the pixel defining layer facing away from the substrate.

[0047] In a specific embodiment of the third aspect of the present disclosure, the pixel defining layer is an inorganic film layer.

[0048] In a specific embodiment of the third aspect of the present disclosure, the pixel defining layer includes at least two sub-defining layers stacked on each other, and the sub-defining layer with a smaller distance to the substrate has a larger refractive index.

[0049] In a specific embodiment of the third aspect of the present disclosure, the smaller the distance from the substrate, the greater the density of the sub-definition layer.

[0050] In a specific embodiment of the third aspect of the present disclosure, the second side surface of the pixel defining layer is a smooth surface.

[0051] In a specific embodiment of the third aspect of the present disclosure, the second side surface of the pixel defining layer is a plane, and the surface where the second side surface of the pixel defining layer is located intersects and is non-perpendicular to the surface where the substrate is located. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] FIG1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure.

[0053] FIG. 2 is an enlarged view of a region S1 of the display panel shown in FIG. 1 .

[0054] FIG3 is a cross-sectional view of the display panel shown in FIG2 along line MN.

[0055] FIG. 4 is an enlarged view of a portion of the display panel shown in FIG. 3 .

[0056] FIG5 is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0057] FIG6 is a cross-sectional view of a display panel provided according to an embodiment of the present disclosure.

[0058] FIG7 is a cross-sectional view of a display panel provided according to an embodiment of the present disclosure.

[0059] 8A to 8D are process diagrams of a method for forming a display panel as shown in FIG. 6 , provided in accordance with an embodiment of the present disclosure.

[0060] FIG9 is a schematic diagram showing the positional relationship between a portion of a film layer of a display panel and an evaporation source during evaporation according to an embodiment of the present disclosure.

[0061] FIG10 is a cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this specification.

[0063] In display products, some functional film layers in the light-emitting units are formed by evaporation. Each light-emitting unit has multiple functional film layers, and some functional film layers (such as the light-emitting layer) in the light-emitting units that emit different light are made of different materials. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by alignment accuracy errors, sufficient space (and a safety margin related to the alignment error) needs to be reserved between different light-emitting units to ensure that the position of the actual light-emitting area of ​​the light-emitting unit can have a certain overlap rate with the designed position (design area). This is equivalent to compressing the designed area of ​​the light-emitting area of ​​the light-emitting unit, which not only limits the light-emitting area of ​​the light-emitting unit, but also prevents the arrangement density of the light-emitting unit from being further increased, making it difficult to further improve the PPI (pixel density) of the display panel.

[0064] In the present disclosure, an isolation structure is provided at the gap between the light-emitting units to separate the functional film layers of adjacent light-emitting units. In this way, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without the use of a mask plate to prepare the functional film layer of each light-emitting unit separately. This process does not need to consider the positioning accuracy problem during evaporation, so that the gap between the light-emitting units can be designed to be smaller to increase the PPI (the principle can be found in the relevant description in the following embodiments related to Figures 8A to 8D).

[0065] It should be noted that when preparing the light-emitting units through the isolation structure, because the light-emitting units are prepared in batches according to different light-emitting colors, after the preparation of the previous batch of light-emitting units is completed, a packaging structure (the first packaging layer below) will be formed thereon for protection, so as to reduce the damage to the previous batch of light-emitting units caused by the preparation process when preparing the next batch of light-emitting units. Accordingly, the packaging structure is also formed multiple times, and the packaging effect of the packaging structure will directly affect the preparation yield of the light-emitting units. In the process of forming the packaging structure, when preparing the next batch of light-emitting units, part of the film layer (such as the second electrode below) will cover the previous batch of light-emitting units and the packaging structure thereon (the packaging unit below) to protect the packaging structure. If the surface flatness of the packaging structure is not high, the quality of these film layers will deteriorate and the packaging structure underneath will not be effectively protected, thereby causing the packaging structure to be damaged in subsequent preparation processes such as etching processes, and even resulting in poor packaging of the display panel.

[0066] Some embodiments of the present disclosure provide a display panel to at least solve the above-mentioned technical problems. The display panel includes a substrate and an isolation structure, a first encapsulation layer and a plurality of light-emitting units located on the substrate. The isolation structure has a plurality of isolation openings that respectively define the light-emitting units, and the first encapsulation layer covers the isolation openings and the light-emitting units. The density of the first encapsulation layer gradually decreases from the side of the first encapsulation layer facing the substrate to the side away from the substrate. In this way, by controlling the density distribution of the first encapsulation layer, a relatively inclined surface can be formed at the side surface of the first encapsulation layer to facilitate the deposition of a protective layer in subsequent processes; in addition, the scheme can also improve the flatness of the etched surface of the first encapsulation layer, so that in the preparation process of the display panel, the film forming quality of the protective layer covering the first encapsulation layer can be improved, so that the first encapsulation layer can be more effectively protected in the preparation process of the display panel.

[0067] Patents PCT / CN2023 / 134518, CN116583155B, 202310759370.2, 202311117143.6, 202310771071.0, 202310771124.9, 202311499823.9, 202310771124.9, 202311451935.7, and 202311124845.7 record relevant contents of the isolation structure for reference.

[0068] In the embodiments of the present disclosure, the density of the film layer can be the degree of compactness of the internal molecules or atoms of the corresponding prepared material. Density is an important performance indicator for measuring materials, which directly affects the mechanical properties, thermal properties, electrical properties, etc. of the material. Generally speaking, the greater the density, the fewer internal voids and defects in the film layer made of the material, and the tighter the bonding between atoms or molecules. Therefore, the tensile strength, compression strength, bending strength, and corrosion resistance of the film layer will be enhanced. For structures of the same material, higher density has fewer internal voids or less low-density materials than lower density.

[0069] It should be noted that the compactness of the molecules or atoms inside the film layer will also be reflected in the refractive index of the film layer, that is, the greater the compactness of the molecules or atoms, the greater the refractive index of the film layer. In the embodiments of the present disclosure, the refractive index of the film layer can be measured by a device such as an ellipsometer. For example, the measurement principle of the ellipsometer is roughly as follows: the ellipsometry method uses elliptically polarized light to be incident on the sample surface, observes the changes in the polarization state (amplitude and phase) of the reflected light, and then derives the thickness and refractive index of the sample surface film.

[0070] The measurement steps of the ellipsometer are roughly as follows: Steps S1 to S6:

[0071] S1. Calibrate the ellipsometer: Before taking any measurements, the ellipsometer must be calibrated to ensure it can accurately measure the refractive index of the sample. Calibration generally involves two steps: zero bias adjustment and scale adjustment.

[0072] S2. Prepare the sample: Place the sample to be tested on the sample stage of the ellipsometer.

[0073] S3. Measure phase difference: Adjust the parameters on the instrument so that the ellipsometer outputs the minimum signal. The ellipsometer will measure the phase difference of the sample, which is proportional to the refractive index of the sample.

[0074] S4. Calculate the refractive index: According to the working principle of the ellipsometer, the refractive index of the sample is calculated by measuring the phase difference.

[0075] S5. Take the average value of multiple measurements: In order to improve the accuracy of the measurement results, it is generally necessary to take multiple measurements and take the average value. When taking multiple measurements, it is necessary to pay attention to maintaining the stability of the sample and avoiding interference from external factors.

[0076] S6. Control environmental conditions: Temperature and humidity have a certain impact on the refractive index of the sample. Therefore, it is necessary to control the environmental conditions during measurement to keep them stable.

[0077] The structure of the display panel according to at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the surface of the substrate, and the Z-axis is perpendicular to the surface of the substrate.

[0078] As shown in Figures 1 to 4, the planar area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which can be called sub-pixels, etc.) can be arranged in the display area 11, such as R, G, and B sub-pixels. The physical structure of the sub-pixel can be a light-emitting unit. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which can be called a pixel unit, a large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, some of the wiring in the border area 12 can be arranged in the display area 11, so that the border area 12 can be designed as a single-sided border.

[0079] The physical structure of the display panel 10 may include a substrate 100 and a display function layer, an isolation structure 300 and a first encapsulation layer 410 located on the substrate 100 . The display function layer includes a plurality of light-emitting units 200 .

[0080] The isolation structure 300 is located on the substrate 100 and defines a plurality of isolation openings 301. That is, the isolation structure 300 has a planar shape that presents a grid pattern, and the isolation openings 301 are meshes of the grid pattern. In some embodiments of the present application, the isolation openings 300 correspond one-to-one to the light-emitting units 200.

[0081] The first encapsulation layer 410 covers the isolation opening 301 and the light-emitting unit 200. The density of the first encapsulation layer 410 gradually decreases from the side of the first encapsulation layer 410 facing the substrate 100 to the side away from the substrate 100. It should be noted that the side of the first encapsulation layer 410 facing the substrate 100 to the side away from the substrate 100 can be understood as the surface from the initial deposition of the first encapsulation layer 410 to its final surface.

[0082] The gradual decrease in density of the first encapsulation layer can be understood as meaning that the density of the first encapsulation layer exhibits a continuous change, at least on a macroscopic level. For example, in one embodiment, the density of the first encapsulation layer varies continuously throughout; or, in another embodiment, the first encapsulation layer is divided into a plurality of alternating first and second intervals along the thickness direction, the density in each first interval varies continuously, the density in each second interval remains constant, and the number of first and second intervals is sufficient to ensure that the density of the first encapsulation layer exhibits a continuous change on a macroscopic level.

[0083] In an embodiment of the present disclosure, in a process for depositing the first encapsulation layer (e.g., a CVD process), the input power of the device can be controlled to control the generation rate of the first encapsulation layer. When the input power is large, the density of the first encapsulation layer will be high. Correspondingly, when the input power is small, the density of the first encapsulation layer will be low. In this way, the density change of each part of the first encapsulation layer can be controlled by controlling the input power. In an embodiment of the present disclosure, when the density is large, the first encapsulation layer can appear to have a smaller refractive index. Correspondingly, when the density is small, the first encapsulation layer can appear to have a larger refractive index, that is, the refractive index of the first encapsulation layer gradually decreases from the side of the first encapsulation layer facing the isolation structure and / or substrate to the side away from the isolation structure and / or substrate.

[0084] In at least one embodiment of the present disclosure, as shown in FIG3 , the display panel may further include a first encapsulation layer 410. The first encapsulation layer 410 includes a plurality of encapsulation units 411 corresponding one-to-one with the isolation openings 301. The encapsulation units 411 cover the corresponding isolation openings 301. Accordingly, the encapsulation units 411 correspond one-to-one with the light-emitting units 200. The reason why the first encapsulation layer 410 is composed of a plurality of encapsulation units 411 is related to the principle of fabricating the light-emitting units 200 based on the isolation structure 300. For details, please refer to the relevant description of the embodiments shown in FIG8A to FIG8D below, and will not be repeated here.

[0085] In at least one embodiment of the present disclosure, as shown in Figures 3 and 4 , at least to improve the packaging effect, the packaging unit 411 can extend to the side of the isolation structure 300 that faces away from the substrate 100. The principle behind this can be seen in the following description of the embodiments shown in Figures 8A to 8D . In this case, the portion of the packaging unit 411 that overlaps with the upper surface of the isolation structure 300 (the side of the crown portion described below that faces away from the substrate) forms an overhanging portion 411a to separate it from the crown portion 320.

[0086] In some embodiments of the present disclosure, as shown in FIG3 and FIG4 , the package unit 411 includes a first main surface 4111 facing the substrate 100 and / or the isolation structure 300, a second main surface 4112 facing away from the substrate 100 and / or the isolation structure 300, and a side surface 4113 connecting the first main surface 4111 and the second main surface 4112. The side surface 4113 of the package unit 411 is, at least macroscopically, a smooth surface. The first main surface 4111 is the lower surface of the package unit 411, i.e., the starting surface when the first package layer 410 is formed. The second main surface 4112 is the upper surface of the package unit 411, i.e., the ending surface when the first package layer 410 is formed. The side surface 4113 of the package unit 411 is actually also the side surface 4113 of the overhang 411a. In the case of a density gradient of the film layer of the first encapsulation layer 410, the side surface 4113 of the encapsulation unit 411 will be etched during the preparation of the encapsulation unit 411. During the etching process, the side surface 4113 of the encapsulation unit 411 will not cause a sudden change in etching difference due to the density gradient difference, thereby making the side surface 4113 obtained by etching smooth.

[0087] In the embodiments of the present disclosure, “smooth surface” means that in a direction perpendicular to the substrate, the slope of each point on the line intercepted by the surface changes continuously (without sudden changes, that is, differentiable in a mathematical sense).

[0088] In at least one embodiment of the present disclosure, as shown in Figures 3 and 4, the side surface of the encapsulation unit 411 is flat, and the surface of the side surface of the encapsulation unit 411 intersects and is not perpendicular to the surface of the substrate 100. As a result, the sidewalls of the encapsulation unit 411 have a certain slope, which can facilitate the deposition of a protective layer (for example, formed on the same layer as the light-emitting functional layer and the second electrode described below) on the side surface during the subsequent preparation of the light-emitting unit 200 (not covered by the encapsulation unit 411 in subsequent batches).

[0089] In other embodiments of the present disclosure, a display panel is provided, which includes a substrate and an isolation structure, a first encapsulation layer and a plurality of light-emitting units located on the substrate. The isolation structure has a plurality of isolation openings that respectively define the light-emitting units, and the first encapsulation layer covers the isolation openings and the light-emitting units. For other structures other than the first encapsulation layer, reference can be made to the relevant descriptions in the aforementioned embodiments. In the embodiment here, the first encapsulation layer can be designed as a multi-layer structure, and its principle is roughly the same as the scheme mentioned in the above embodiment (density gradient). The first encapsulation layer may include at least two sub-encapsulation layers stacked on each other, and the sub-encapsulation layer with a smaller distance to the substrate has a larger refractive index. For example, as shown in FIG5 , encapsulation unit 411 (or first encapsulation layer 410 ) includes a first sub-encapsulation layer T1, a second sub-encapsulation layer T2, and a third sub-encapsulation layer T3 stacked one on top of the other. The first, second, and third sub-encapsulation layers T1, T2, and T3 are sequentially arranged in a direction away from the substrate. During the formation of encapsulation unit 411 , to form an inclined side surface, different process conditions are used to cause the refractive index of the first, second, and third sub-encapsulation layers T1, T2, and T3 to decrease sequentially (or their density to decrease sequentially). It should be noted that the refractive index of each of the first, second, and third sub-encapsulation layers T1, T2, and T3 can be constant or gradient. In the latter case, the refractive index of each sub-encapsulation layer closer to the substrate increases. It should be noted that for these sub-encapsulation layers, the higher the refractive index, the greater the density. In this way, by controlling the refractive index of different sub-encapsulation layers, the density of different sub-encapsulation layers can be regulated, thereby improving the flatness of the etched surface of the first encapsulation layer 410, so that the first encapsulation layer 410 can be more effectively protected during the preparation process of the display panel.

[0090] In at least one embodiment of the present disclosure, the oxygen content of the sub-encapsulation layer decreases as the distance from the substrate decreases.

[0091] In the embodiments of the present disclosure, there is no limitation on the specific structural design of the isolation structure, the light emitting unit, etc., which can be designed according to the actual process requirements. The following describes the configuration of these structures through several specific embodiments.

[0092] In at least one embodiment of the present disclosure, along the direction from the first major surface to the second major surface, the side surface includes a plurality of sequentially connected sub-side surfaces. The plane defined by the intersection of the side surface with the first major surface and the intersection of the side surface with the second major surface forms an angle of no greater than 45 degrees with each sub-side surface. The orthographic projection of the second major surface on the substrate lies within the orthographic projection of the first major surface on the substrate. For example, as shown in FIG5 , the side surfaces of the first sub-encapsulation layer T1, the second sub-encapsulation layer T2, and the third sub-encapsulation layer T3 correspond to the aforementioned sub-side surfaces.

[0093] In at least one embodiment of the present disclosure, referring again to FIG. 4 , the isolation structure 300 may include a support portion 310 facing the substrate 100 and a crown portion 320 facing away from the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, that is, the isolation structure 300 as a whole will appear to be wide at the top and narrow at the bottom, so that when a part of the film layer in the light-emitting unit 200 (such as the light-emitting functional layer described below) is evaporated, it is disconnected at the edge of the isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting units.

[0094] Due to the design of the isolation structure 300 being wide at the top and narrow at the bottom, the first encapsulation layer 410 forms a space 401 on one side of the isolation structure 300. In addition, as shown in FIG3 , through parameters such as thickness of the first encapsulation layer 410, the portion of the first encapsulation layer 410 covering the crown 320 and the portion covering the light-emitting unit 200 can be closed (the position of the contact surface 402, it should be noted that the contact surface 402 is not a dividing interface), so that the space 401 is a closed space 401. In this way, in the process of preparing different types of light-emitting units 200, no corrosive liquid or etching gas or other harmful materials will flow into the closed space 401, so as to avoid the encapsulation unit 411 being etched and damaged. It should be noted that the contact surface 402 is a virtual interface that only marks the closed position.

[0095] It should be noted that the first encapsulation layer 410 is not limited to forming a closed space as shown in FIG. 3 , but may also be formed as an open space as shown in FIG. 6 . The specific selection may be made according to actual process requirements and will not be elaborated herein.

[0096] In at least one embodiment of the present disclosure, as shown in FIG6 , the light-emitting unit 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 sequentially stacked on a substrate 100. The light-emitting functional layer 220 and the second electrode 230 of each light-emitting unit 200 are located in a corresponding isolation opening 301. During the preparation process of the light-emitting functional layer 220, the isolation structure 300 (including the crown 320) limits the diffusion range of the evaporated material, so that the orthographic projection of the edge of the crown 320 on the substrate 100 is located within the orthographic projection of the light-emitting functional layer 220 and the second electrode 230 on the substrate 100. For details, please refer to the relevant description in the embodiment of the method for preparing a display panel below, which is not repeated here.

[0097] For example, the light-emitting functional layer may further include a light-emitting layer 222 and a second functional layer 223, and the first functional layer 221, the light-emitting layer 222, and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that since carriers (holes, electrons) mainly crosstalk between adjacent light-emitting units 200 through the first functional layer 221, the setting of the isolation structure 300 needs to make the first functional layers 221 of each light-emitting unit 200 electrically disconnected from each other.

[0098] For example, in at least one embodiment of the present disclosure, the first electrode may be configured as an anode, and the second electrode may be configured as a cathode.

[0099] Because the isolation structure 300 is wide at the top and narrow at the bottom, the first functional layer 221 will be disconnected at the edge of the crown 320 during the evaporation process. That is, the first functional layer 221 will not be connected to the conductive part of the isolation structure 300 (such as the support part 310), resulting in crosstalk between adjacent light-emitting units 200.

[0100] In an embodiment of the present disclosure, the isolation structure is used to connect the second electrode. To avoid connection between the isolation structure and the first electrode, the size of the first electrode can be reduced to be spaced from the isolation structure, or an insulating layer can be provided between the first electrode and the isolation structure.

[0101] It should be noted that after preparing a batch of light-emitting units 200 and the packaging units 411 thereon, when preparing the next batch of light-emitting units 200, the film layer used to form the light-emitting functional layer 220 and the second electrode 230 by evaporation will cover the surface (including the side surface) of the packaging unit 411. These film layers constitute a protective layer. The second electrode 230 needs to take into account both conductivity and transmittance, so as to have a thinner thickness. In this way, if the flatness of the side surface of the packaging unit 411 is poor, the film layer used to form the second electrode 230 is difficult to have good continuity on the side surface, resulting in low film quality. In this way, in the process of preparing the next batch of packaging units 411, the protective layer is difficult to protect the packaging units 411 that have been prepared in the previous batch, thereby resulting in the risk of poor packaging of the display panel.

[0102] For example, in at least one embodiment of the present disclosure, as shown in FIG6 , the display panel may further include a pixel defining layer 330 located between the substrate 100 and the isolation structure 300. The pixel defining layer 330 defines a plurality of pixel openings 302 corresponding to the isolation openings 301, respectively. The orthographic projections of the pixel openings 302 on the substrate 100 are located within the orthographic projections of the corresponding isolation openings 301 on the substrate 100. The light-emitting functional layer 220 and the second electrode 230 fill the pixel openings 302 and extend to the surface of the pixel defining layer 330 facing away from the substrate 100. In each isolation opening 301, the orthographic projection of the pixel opening 302 on the substrate 100 coincides with the light-emitting region of the light-emitting unit 200. That is, the pixel defining layer 330 defines the light-emitting region of the light-emitting unit 200.

[0103] In at least one embodiment of the present disclosure, the pixel defining layer 330 may be an inorganic film layer. Inorganic layers have high density and strong electrical resistance, which can reduce the design thickness of the display panel. Furthermore, a thinner pixel defining layer 330 facilitates the continuity of the second electrode 230.

[0104] In the embodiment of the present disclosure, the flatness of the side surface of the pixel opening 302 surrounded by the pixel defining layer 330 will also affect the continuity of the second electrode 230. Therefore, the pixel defining layer 330 can also be designed with reference to the first encapsulation layer mentioned in the above embodiment.

[0105] In some embodiments of the present disclosure, the density of the pixel defining layer 330 gradually decreases from the side of the pixel defining layer 330 facing the substrate 100 to the side away from the substrate 100. This improves the flatness of the side surface of the pixel opening 302 to ensure the continuity of the second electrode 230 on this side surface.

[0106] It should be noted that, for the method of controlling the density distribution during the preparation of the pixel defining layer 330 , reference may be made to the relevant description of the method of preparing the first encapsulation layer in the aforementioned embodiment, which will not be elaborated here.

[0107] In the embodiments of the present disclosure, the pixel defining layer may have a smaller refractive index when the density is high, and correspondingly, the pixel defining layer may have a larger refractive index when the density is low, that is, the refractive index of the pixel defining layer gradually decreases from the side of the pixel defining layer facing the substrate to the side away from the substrate.

[0108] In other embodiments of the present disclosure, pixel-defining layer 330 includes at least two overlapping sub-defining layers, with the sub-defining layer with a smaller distance from substrate 100 having a greater refractive index. In this case, the sub-defining layer with a smaller distance from substrate 100 has a greater density. Thus, by controlling the refractive index of different sub-defining layers, the density of the sub-defining layers can be controlled, thereby improving the flatness of the side surface of the pixel opening and ensuring the continuity of the second electrode on this side surface.

[0109] In at least one embodiment of the present disclosure, the side surface of the pixel defining layer 330 is a smooth surface. For example, the side surface of the pixel defining layer 330 is planar, and the side surface of the pixel defining layer 330 intersects and is non-perpendicular to the side surface of the substrate 100. This arrangement can facilitate ensuring the continuity of the second electrode 230 on the side surface of the pixel defining layer 330.

[0110] In at least one embodiment of the present disclosure, as shown in Figure 7, the isolation structure 300 may further include an auxiliary support portion 340, which is located on the side of the support portion 310 facing away from the crown portion 320, the orthographic projection of the auxiliary support portion 340 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the auxiliary support portion 340 on the substrate 100.

[0111] For example, the auxiliary support portion 340 is a conductive structure, and the portion of the surface of the auxiliary support portion 340 that is away from the substrate 100 and is not covered by the support portion 310 can be used to contact the second electrode 230. Relative to the side wall of the support portion 310, the deposition thickness of the second electrode 230 on the surface of the auxiliary support portion 340 will be larger. In this way, the auxiliary support portion 340 and the second electrode 230 have a larger contact area and bonding strength, thereby reducing the impedance between the second electrode 230 and the isolation structure 300.

[0112] For example, the crown 320 , the support portion 310 and the auxiliary support portion 340 may be made of titanium, aluminum and molybdenum in sequence, where the corrosion resistance of titanium, molybdenum and aluminum decreases in sequence, thereby forming the isolation structure 300 shown in FIG. 7 .

[0113] For example, in some embodiments of the present disclosure, the support portion 310 and the crown portion 320 can be an integrated structure, the isolation structure 300 is a conductive structure, and the second electrode 230 of the light-emitting unit 200 is electrically connected to the support portion 310. This integrated structure can be an independent film layer, and there is no physical interface in the film layer. The support portion 310 and the crown portion 320 are two parts of the integrated structure. For example, further, along a direction perpendicular to the substrate 100, the cross-sectional shape of the crown portion 320 is an inverted trapezoid, with the top edge of the inverted trapezoid facing the substrate 100, that is, the top edge of the inverted trapezoid is located between the substrate 100 and the bottom edge of the inverted trapezoid.

[0114] For example, in other embodiments of the present disclosure, the support portion 310 and the crown portion 320 are two independent film layers, the support portion 310 is a conductive structure, and the second electrode 230 of the light-emitting unit 200 is electrically connected to the support portion. For example, further, along a direction perpendicular to the substrate 100, the cross-sectional shape of the support portion 310 is a regular trapezoid, and the crown portion is located at the top edge of the support portion 310. In this case, the evaporated material of the second electrode 230 can be easily deposited on the sidewalls of the support portion 310, thereby improving the overlap yield of the second electrode 230 and the support portion 310.

[0115] At least one embodiment of the present disclosure provides a method for preparing a display panel, the method comprising: providing a substrate; forming an isolation structure and a plurality of light-emitting units on the substrate, wherein a plurality of isolation openings are formed in the isolation structure, and the isolation openings limit the light-emitting units; forming at least one first film layer on the substrate, wherein the input power during the generation of the first film layer is gradually reduced so that the density of the first film layer gradually decreases in a direction away from the substrate. The specific structure of the display panel prepared in this manner can be found in the relevant description in the aforementioned embodiments and will not be elaborated here. It should be noted that the first film layer may include at least one of the first encapsulation layer and the pixel definition layer mentioned in the aforementioned embodiments.

[0116] For example, in the display panel manufacturing method described in at least one embodiment of the present disclosure, the first film layer includes at least two stacked sub-encapsulation layers. The step of forming the first film layer on the substrate includes regulating input power to gradually reduce the density of the at least two sub-encapsulation layers. The specific process can be found in the description of the aforementioned embodiments and is not further elaborated here.

[0117] For example, in the method for preparing a display panel mentioned in at least one embodiment of the present disclosure, the first film layer includes a first encapsulation layer, and the first encapsulation layer is formed on the side of the isolation structure facing away from the substrate and covers the isolation opening and the light-emitting unit. For example, the first encapsulation layer includes a plurality of encapsulation units corresponding to the light-emitting units. For example, the encapsulation unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface, and the side surface of the encapsulation unit is a smooth surface. For example, the side surface of the encapsulation unit is a plane, and the surface where the side surface of the encapsulation unit is located intersects with the surface where the substrate is located and is not perpendicular. For the specific structure of the first encapsulation layer in the display panel, please refer to the relevant description in the aforementioned embodiments, which will not be repeated here.

[0118] For example, in the method for preparing a display panel mentioned in at least one embodiment of the present disclosure, the first film layer includes a pixel defining layer, the pixel defining layer is located between the substrate and the isolation structure and is formed with a plurality of pixel openings, the pixel openings are arranged corresponding to the isolation openings, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate. For example, the second side surface of the pixel defining layer is a smooth surface. For example, the second side surface of the pixel defining layer is a plane, and the surface where the second side surface of the pixel defining layer is located intersects and is not perpendicular to the surface where the substrate is located. For the specific structure of the pixel defining layer in the display panel, please refer to the relevant description in the aforementioned embodiments, which will not be repeated here.

[0119] It should be noted that in the embodiment of the present disclosure, when the light-emitting units 200 are divided into multiple types that emit light of different colors, the light-emitting units 200 that emit different light are manufactured independently, but the film layer (evaporated film layer such as the light-emitting functional layer) in each light-emitting unit 200 is evaporated on the entire surface of the display panel during the evaporation. For example, the light-emitting unit 200 is classified into light-emitting units that emit red light (R), green light (G) and blue light (B), respectively. During the preparation process, the light-emitting units R, G, and B are prepared in sequence. When preparing the light-emitting unit R, a light-emitting unit R is formed in each isolation opening 301. A first encapsulation layer 410 is prepared on the display panel to cover the light-emitting unit G. Then, the first encapsulation layer 410 in part of the isolation openings 301 (used to form the light-emitting units G and B in the final product) and the second electrode and the light-emitting functional layer of the light-emitting unit R are removed to obtain the encapsulation unit 411. During this process, the first encapsulation layer 410 is used to protect the light-emitting units R in other isolation openings 301. Based on this method, the light-emitting units G and B are prepared in sequence to finally form the first encapsulation layer 410 as shown in Figure 8. That is, the first encapsulation layer 410 on the entire display panel is prepared in multiple processes.

[0120] It should be noted that in the embodiments of the present disclosure, there is no restriction on the preparation order of the three types of light-emitting units R, G, and B, and it can be designed according to the actual process requirements. For example, the preparation process can also be implemented based on the order of the light-emitting units B, G, and R.

[0121] The following describes the manufacturing process of the display panel shown in FIG8 in conjunction with FIG8A to FIG8D to intuitively demonstrate the principle that the isolation structure can increase the pixel arrangement density PPI.

[0122] As shown in FIG8A , a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100; an insulating material film layer (e.g., an inorganic material film layer) is deposited on the substrate 100 on which the first electrodes 210 are formed; a support portion 310 and a crown portion 320 are formed on the display panel; and a patterning process is performed on the insulating material film layer to form a pixel defining layer 330 (the planar shape of which is a grid), wherein the pixel defining layer 330 covers the gaps between adjacent first electrodes 210, so that the planar shape of the pixel defining layer 330 is a grid.

[0123] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structural layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern 500 described below) includes photoresist, the structural layer may be directly exposed through a mask to form the desired pattern.

[0124] As shown in FIG8B , a light-emitting functional layer 220 and a second electrode 230 are evaporated on the substrate 100 to form a light-emitting unit 200 in each isolation opening 301 of the isolation structure 300. No mask is used in this evaporation process, so the evaporated material is also deposited on the crown 320. A first encapsulation film layer 410a is then deposited to cover the light-emitting unit 200. For example, the light-emitting layer in the evaporated light-emitting functional layer 220 can emit red light. That is, at this stage, a light-emitting unit 200 emitting red light is formed in each isolation opening 301 of the isolation structure 300.

[0125] As shown in FIG. 8C , a photoresist is formed (eg, coated) on the substrate 100 with the first packaging film layer 410 a formed thereon, and then patterned to form a photoresist pattern 500 . The photoresist pattern 500 only covers a portion of the isolation opening 301 of the isolation structure 300 .

[0126] As shown in FIG8D , the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the first packaging film layer 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 500, wherein the remaining portion of the first packaging film layer 410a forms the packaging unit 411 as shown in FIG8 ; and then the remaining photoresist pattern 500 is removed.

[0127] During this process, an etching solution (or etching gas) is used to remove the remaining photoresist pattern 500 . The etching solution may enter the space at the sidewall of the support portion 310 and damage the first encapsulation layer 410 .

[0128] Repeat the steps of FIG. 8A to FIG. 8D to form a light emitting unit 200 emitting green light and a light emitting unit 200 emitting blue light in other isolation openings 301 , respectively, and form the display panel shown in FIG. 8 .

[0129] As shown in Figure 9, when evaporating a light-emitting functional layer (e.g., the first functional layer), if the evaporation source P is moved to face the isolation structure 300, the boundaries of its evaporation angle correspond to lines L1 and L2 on the display panel. In this case, the area before lines L1 and L2 will not be evaporated. However, the area on the side of lines L1 and L2 facing away from the isolation structure 300 will be evaporated regardless of the position of the evaporation source P. In other words, starting from line L1 or line L2, the thickness of the light-emitting functional layer decreases as it approaches the isolation structure 300.

[0130] In at least one embodiment of the present disclosure, as shown in FIG10 , the first encapsulation layer 410 forms a space on one side of the isolation structure 300. Furthermore, the portion of the first encapsulation layer 410 covering the crown 320 is closed (in contact) with the portion covering the light-emitting unit 200, thereby forming a closed space. Thus, during the manufacturing process of different types of light-emitting units, harmful materials such as corrosive liquids or etching gases will not flow into the closed space.

[0131] In at least one embodiment of the present disclosure, as shown in FIG10 , the display panel further includes a second encapsulation layer 420 and a third encapsulation layer 430 covering the first encapsulation layer 410, the isolation structure, and the light-transmitting shielding layer, with the second encapsulation layer 420 being located between the first encapsulation layer 410 and the third encapsulation layer 430. The first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 constitute the encapsulation layer 400.

[0132] In at least one embodiment of the present disclosure, as shown in FIG10 , first encapsulation layer 410 and third encapsulation layer 430 are inorganic layers, while second encapsulation layer 420 is an organic layer. For example, second encapsulation layer 420 can be a planarization layer. Inorganic layers have high density to isolate water and oxygen, while second encapsulation layer 420 is an organic layer, thus having a relatively large thickness to planarize the surface of the display panel.

[0133] In at least one embodiment of the present disclosure, as shown in FIG10 , the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer including a plurality of pixel driving circuits located in the display area, and the display function layer being located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFT, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (TFT) and 1 capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting unit 200 to control the switching state and the light-emitting brightness of the light-emitting unit 200.

[0134] At least one embodiment of the present disclosure provides a display panel, which includes a substrate and an isolation structure located on the substrate, a first encapsulation layer and a plurality of light-emitting units. The isolation structure has a plurality of isolation openings that respectively define the light-emitting units, the first encapsulation layer covers the isolation openings and the light-emitting units, and includes a plurality of encapsulation units corresponding to the light-emitting units, the encapsulation unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface, and the side surface of the encapsulation unit is a smooth surface. In this way, by forming the side surface of the encapsulation unit into a smooth surface, the first encapsulation layer can be more effectively protected in the preparation process of the display panel. The structure of the display panel under this scheme and the further design of the display panel can be referred to the relevant description in the aforementioned embodiment, and will not be repeated here.

[0135] At least one embodiment of the present disclosure provides a display device, which can be the display panel of the above embodiment. For example, the display device may include a touch structure, an optical film (such as a micro lens, a polarizer), a cover plate, etc., which are arranged on the light-emitting side of the display panel.

[0136] For example, the display device may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, or a navigator.

[0137] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A display panel, comprising: substrate; A plurality of light-emitting units are located on the substrate; an isolation structure, located on the substrate and having a plurality of isolation openings respectively defining the light-emitting units; A first encapsulation layer covers the isolation opening and the light-emitting unit, wherein the density of the first encapsulation layer gradually decreases from a side of the first encapsulation layer facing the substrate to a side away from the substrate.

2. The display panel according to claim 1, wherein: The first encapsulation layer includes a plurality of encapsulation units corresponding to the light-emitting units respectively, and The first encapsulation layer is an inorganic film layer.

3. The display panel according to claim 2, wherein: The packaging unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface, and the first side surface of the packaging unit is a smooth surface.

4. The display panel according to claim 3, wherein: The first side surface of the packaging unit is a plane, and the surface where the first side surface of the packaging unit is located intersects with the surface where the substrate is located and is not perpendicular.

5. The display panel according to any one of claims 1 to 4, characterized in that: It also includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer defines a plurality of pixel openings, the pixel openings are arranged corresponding to the isolation openings, the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate, and the pixel defining layer is an inorganic film layer. The display panel according to claim 5 , wherein: The density of the pixel defining layer gradually decreases from the side of the pixel defining layer facing the substrate to the side away from the substrate. The second side surface of the pixel defining layer is a plane, and the surface where the second side surface of the pixel defining layer is located intersects with and is not perpendicular to the surface where the substrate is located.

7. The display panel according to any one of claims 1 to 4, wherein: The isolation structure includes a support portion and a crown portion located on a side of the support portion facing away from the substrate, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and The edge of the orthographic projection of the crown on the substrate is the edge of the orthographic projection of the isolation structure on the substrate.

8. The display panel according to claim 7, wherein: The light emitting unit includes a first electrode, a light emitting functional layer, and a second electrode sequentially stacked on the substrate, and The light-emitting functional layer and the second electrode of each light-emitting unit are located in the corresponding isolation opening, the support portion is a conductive structure, and the second electrode of the light-emitting unit is electrically connected to the support portion.

9. The display panel according to claim 7, further comprising a pixel defining layer located between the substrate and the isolation structure, wherein: The pixel defining layer defines a plurality of pixel openings, and the pixel openings are arranged corresponding to the isolation openings; The isolation structure further includes an auxiliary support portion located between the support portion and the pixel definition layer, and The orthographic projection of the auxiliary support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the auxiliary support portion on the substrate, the auxiliary support portion is a conductive structure, and the second electrode of the light-emitting unit is electrically connected to the auxiliary support portion.

10. The display panel according to claim 9, wherein: The density of the pixel defining layer gradually decreases from a side of the pixel defining layer facing the substrate to a side away from the substrate.

11. The display panel according to claim 2, wherein: The packaging unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface, and Along the direction from the first main surface to the second main surface, the side surface includes a plurality of sub-side surfaces connected in sequence, and the angle between the plane determined by the intersection of the side surface and the first main surface and the intersection of the side surface and the second main surface and each of the sub-side surfaces is not greater than 45 degrees, and the orthographic projection of the second main surface on the substrate is within the orthographic projection of the first main surface on the substrate.

12. The display panel according to any one of claims 1 to 11, wherein: The refractive index of the first encapsulation layer gradually decreases from a side of the first encapsulation layer facing the substrate to a side away from the substrate.

13. The display panel according to any one of claims 1 to 11, wherein: The oxygen content of the first encapsulation layer gradually increases from a side of the first encapsulation layer facing the substrate to a side of the first encapsulation layer away from the substrate.

14. A display panel, characterized in that: include: substrate; A plurality of light-emitting units are located on the substrate; an isolation structure, located on the substrate and having a plurality of isolation openings respectively defining the light-emitting units; a first encapsulation layer, covering the isolation opening and the light-emitting unit, and comprising a plurality of encapsulation units corresponding to the light-emitting units, wherein the encapsulation unit comprises a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface; In which, along the direction from the first main surface to the second main surface, the side surface includes a plurality of sub-side surfaces connected in sequence, and the angle between the plane determined by the intersection of the side surface and the first main surface and the intersection of the side surface and the second main surface and each of the sub-side surfaces is not greater than 45 degrees, and the orthographic projection of the second main surface on the substrate is within the orthographic projection of the first main surface on the substrate.

15. The display panel according to claim 14, wherein: The packaging unit includes a first main surface facing the substrate and / or the isolation structure, a second main surface facing away from the substrate and / or the isolation structure, and a side surface connecting the first main surface and the second main surface. The first side surface of the packaging unit is a plane, and the surface on which the first side surface of the packaging unit is located intersects with the surface on which the substrate is located and is not perpendicular.

16. The display panel according to claim 14 or 15, wherein: The density of the first encapsulation layer gradually decreases from a side of the first encapsulation layer facing the substrate to a side away from the substrate; or The first encapsulation layer includes at least two sub-encapsulation layers stacked on each other, and the sub-encapsulation layer with a smaller distance from the substrate has a larger refractive index.

17. The display panel according to claim 16, wherein: The encapsulation unit includes a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer stacked on each other, wherein the first sub-encapsulation layer, the second sub-encapsulation layer, and the third sub-encapsulation layer are sequentially arranged in a direction away from the substrate, and The first sub-encapsulation layer, the second sub-encapsulation layer, and the third sub-encapsulation layer have densities that gradually decrease or refractive indices that gradually decrease.

18. A display panel, characterized in that: include: substrate; A plurality of light-emitting units are located on the substrate; an isolation structure, located on the substrate and having a plurality of isolation openings respectively defining the light-emitting units; The first encapsulation layer covers the isolation opening and the light-emitting unit and includes at least two sub-encapsulation layers stacked on each other, wherein the sub-encapsulation layer with a smaller distance from the substrate has a larger refractive index.

19. The display panel according to claim 18, wherein: The smaller the distance from the substrate, the greater the density of the sub-encapsulation layer; and / or the smaller the distance from the substrate, the lower the oxygen content of the sub-encapsulation layer.

20. The display panel according to claim 18 or 19, wherein: The light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate, the light-emitting functional layer and the second electrode of each light-emitting unit are located in the corresponding isolation opening, the display panel may further include a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer defines a plurality of pixel openings corresponding to the isolation openings, the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate, the light-emitting functional layer and the second electrode fill the pixel openings and extend to a surface of the pixel defining layer facing away from the substrate, and the pixel defining layer is an inorganic film layer; The pixel defining layer includes at least two sub-defining layers stacked on each other, wherein the sub-defining layer with a smaller distance to the substrate has a smaller distance to the substrate. The greater the refractive index.

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