Display panel and manufacturing method therefor, and display device

Abstract

Disclosed are a display panel and a manufacturing method therefor, and a display device. The display panel has a display region and a peripheral region surrounding the display region. The display panel comprises: a base substrate; a light-emitting layer located on one side of the base substrate, the light-emitting layer extending from the display region to the peripheral region; an intermediate layer located between the base substrate and the light-emitting layer; and a first crack arresting structure located at the edge of the peripheral region away from the display region, wherein the first crack arresting structure comprises: a first opening that divides the intermediate layer into a first isolation dam and a second isolation dam; and a crack arresting pattern at least filling the first opening. The first crack arresting structure is located on the side of the light-emitting layer away from the display region.

Description

Display panel and manufacturing method thereof, and display device Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Compared to liquid crystal displays (LCDs), organic light-emitting diode (OLED) displays are self-luminous and do not require a separate light source. Furthermore, OLED displays are gaining increasing attention due to their low power consumption, high brightness, and fast response times.

[0003] However, many problems with GDSH have arisen in related OLED display devices. GDSH is a defective black spot in the OLED screen. GDSH abnormality is caused by a combination of factors, such as electrical corrosion, packaging failure, organic material (IJP) overflow, or cracks. Usually, GDSH first appears at the opening (AA hole) or edge of the display area, where water vapor invades and eventually spreads to the display area (AA), causing the display panel to fail.

[0004] Summary of the Invention

[0005] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provides a display panel and a manufacturing method thereof, and a display device.

[0006] In a first aspect, a display panel is provided, comprising a display area and a peripheral area surrounding the display area. The display panel includes: a base substrate; a light-emitting layer located on one side of the base substrate, the light-emitting layer extending from the display area to the peripheral area; an intermediate layer located between the base substrate and the light-emitting layer; and a first crack-blocking structure located at an edge of the peripheral area away from the display area, the first crack-blocking structure comprising: a first opening that divides the intermediate layer into a first isolation dam and a second isolation dam; and a crack-blocking pattern that fills at least the first opening. The first crack-blocking structure is located on a side of the light-emitting layer away from the display area.

[0007] In some embodiments, the display panel further includes: an electrode layer located on the side of the light-emitting layer away from the base substrate, the electrode layer extending from the display area to the peripheral area, wherein the first crack blocking structure is located on the side of the electrode layer away from the display area.

[0008] In some embodiments, a plurality of isolation grooves and a plurality of isolation dams separated by the plurality of isolation grooves are formed in the first isolation dam, a light-emitting layer and an electrode layer are provided at the bottom of each isolation groove, a light-emitting layer and an electrode layer are not provided on the sidewalls of each isolation groove, and a light-emitting layer and an electrode layer are provided on the surface of each isolation dam away from the base substrate, the first crack blocking structure is located on a side away from the display area of ​​the isolation groove farthest from the display area among the plurality of isolation grooves, and the first opening of the first crack blocking structure shares an isolation dam with the isolation groove farthest from the display area.

[0009] In some embodiments, the edge of the light-emitting layer farthest from the display area is located between the isolation groove farthest from the display area and the first crack blocking structure; the edge of the electrode layer farthest from the display area is located between the isolation groove farthest from the display area and the first crack blocking structure.

[0010] In some embodiments, the display panel further includes: an encapsulation layer located on a side of the electrode layer away from the base substrate, the encapsulation layer extending from the display area to the peripheral area, wherein the first crack blocking structure is located on a side of the encapsulation layer away from the display area.

[0011] In some embodiments, the display panel further includes: an isolation column located in the peripheral area, the isolation column being located between the isolation dam and the light-emitting layer, the orthographic projection of the isolation column on the base substrate overlapping with the orthographic projection of the isolation dam on the base substrate, the encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer arranged in sequence along a direction away from the base substrate; the organic encapsulation layer extends from the display area to the peripheral area, the isolation column being located on the side of the organic encapsulation layer away from the display area, the distance from the surface of the isolation column away from the base substrate to the base substrate is greater than the distance from the organic encapsulation layer of the encapsulation layer to the base substrate, the first inorganic encapsulation layer and the second inorganic encapsulation layer both extend from the display area to the peripheral area, and the edges of the first inorganic encapsulation layer and the second inorganic encapsulation layer are both located between the isolation groove farthest from the display area and the first crack blocking structure.

[0012] In some embodiments, a first protective layer and a second protective layer are provided in the isolation groove, the second protective layer covers the bottom of the isolation groove, the light-emitting layer and the electrode layer at the bottom of the isolation groove are located on the side of the second protective layer away from the base substrate, the first protective layer covers at least part of the side wall of the isolation groove, and the first protective layer contacts the second protective layer near the end of the base substrate.

[0013] In some embodiments, the display panel further includes an isolation pad, wherein the isolation pad is located between the isolation dam and the light-emitting layer on the isolation dam, the first protective layer covers part of the side wall of the isolation groove, and the end of the first protective layer away from the base substrate is spaced apart from the surface of the intermediate layer facing away from the base substrate; the end of the isolation pad falling into the isolation groove is in contact with the end of the first protective layer facing away from the base substrate.

[0014] In some embodiments, the first opening has a stepped shape and includes a first stepped portion and a second stepped portion located on a side of the first stepped portion away from the base substrate, and the orthographic projection of the first stepped portion on the base substrate is located inside the orthographic projection of the second stepped portion on the base substrate.

[0015] In some embodiments, the crack barrier pattern fills the first step-shaped opening and protrudes from the first opening to cover the upper surface of the intermediate layer away from the base substrate.

[0016] In some embodiments, the display panel further includes: a metal trace located between the upper surface and sidewall of the intermediate layer and the crack blocking pattern; and a light-shielding layer located on a side of the metal trace close to the substrate, and the orthographic projection of the light-shielding layer on the substrate overlaps with the orthographic projection of the first crack blocking structure on the substrate; wherein the light-shielding layer contacts the metal trace at the bottom of the first opening.

[0017] In some embodiments, the material of the intermediate layer is an inorganic material, the material of the crack blocking pattern is an organic material, and the material of the light shielding layer is molybdenum.

[0018] In some embodiments, the display panel further includes: a first touch layer, a touch insulation layer, and a second touch layer, which are sequentially arranged on the encapsulation layer in a direction away from the base substrate; the first touch layer, the touch insulation layer, and the second touch layer jointly cover the first crack blocking structure.

[0019] In some embodiments, the display panel further includes: a third protection layer covering at least a sidewall of the second isolation dam away from the display area.

[0020] In some embodiments, the third protective layer has an L-shape and includes an organic material, and includes a first protective portion and a second protective portion that are orthogonal to each other, wherein the first protective portion covers the side wall of the second isolation dam away from the display area, and the second protective portion covers the surface of the second isolation dam away from the base substrate.

[0021] In some embodiments, the display panel further has an opening area and a transition area surrounding the opening area, and the transition area is located between the opening area and the display area; the display panel also includes a second crack blocking structure located in the transition area; the light-emitting layer extends from the display area to the transition area, and the second crack blocking structure is located on the side of the light-emitting layer away from the display area.

[0022] In a second aspect, a method for preparing a display panel is provided, wherein the display panel has a display area and a peripheral area surrounding the display area; the method for preparing the display panel comprises: providing a base substrate; arranging a light-emitting layer on one side of the base substrate so that the light-emitting layer extends from the display area to the peripheral area; forming an intermediate layer between the base substrate and the light-emitting layer; and forming a first crack blocking structure at an edge of the peripheral area away from the display area, so that the first crack blocking structure is located on a side of the light-emitting layer away from the display area, wherein the first crack blocking structure comprises: a first opening, dividing the intermediate layer into a first isolation dam and a second isolation dam; and a crack blocking pattern, at least filling the first opening.

[0023] In a third aspect, a display device is provided, which includes the above-mentioned display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of a display panel in the related art that has a GDSH defect;

[0025] FIG2 is a schematic diagram of a light-emitting layer and an encapsulation layer in a display panel of the related art;

[0026] FIG3 is a schematic diagram of a display panel according to an embodiment of the present disclosure;

[0027] FIG4 is a cross-sectional view taken along the line AA′ in FIG3 according to the first embodiment;

[0028] FIG5 is a schematic diagram of an isolation structure;

[0029] FIG6 is a schematic diagram of a first crack barrier structure according to an embodiment of the present disclosure;

[0030] FIG7 is a cross-sectional view taken along the line AA′ in FIG3 according to the second embodiment;

[0031] FIG8 is a cross-sectional view taken along the BB′ direction in FIG3 . DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the disclosure for which protection is sought, but merely represents selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present disclosure.

[0033] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0034] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0035] In related technologies, as shown in Figure 1, microscopic testing has revealed that GDSH defects are prone to occur at the opening (AA hole) or edge of the display area. GDSH is a common defect in flexible OLED products and can be caused by factors such as material problems, process flow problems, or various stress issues. The following describes the mechanisms of GDSH generation: 1) Stress effects: The manufacturing of flexible OLED products may generate thermal stress, mechanical stress, chemical stress, and other stresses. Due to the difference in linear expansion coefficients between materials such as circuit boards and the OLED light-emitting layer materials, stress concentration is prone to occur, leading to GDSH. 2) Oxidation effects: The organic materials in the product (including but not limited to the organic light-emitting layer materials and organic encapsulation materials) are extremely susceptible to oxidation, which can lead to the formation of GDSH. 3) Manufacturing process effects: Impurities or contamination on the surface of flexible OLED products during the production process can also cause GDSH. 4) In operating mode, the cathode in the light-emitting device is energized. Since the cathode layer is laid in a single layer, electrochemical corrosion is prone to occur in a water- and oxygen-corrosive environment.

[0036] In view of this, the embodiments of the present disclosure provide a display panel that substantially blocks the water vapor erosion path and blocks water vapor intrusion from the source of water vapor erosion, thereby improving GDSH defects.

[0037] FIG3 is a schematic diagram of a display panel provided by an embodiment of the present disclosure, and FIG4 is a cross-sectional view taken along the A-A' direction in FIG3 according to the first embodiment. As shown in FIG3 and FIG4, the display panel has a display area AA and a peripheral area BB surrounding the display area AA; wherein the display panel includes: a base substrate 1, and a light-emitting layer EL and an encapsulation layer 2 sequentially arranged in a direction away from the base substrate 1; the display panel also includes: an intermediate layer 6 arranged between the light-emitting layer EL and the base substrate 1. The light-emitting layer EL is used to realize electroluminescence of the light-emitting device (OLED) located in the display area AA. The encapsulation layer 2 is used to encapsulate the light-emitting device to protect the display area AA from water and oxygen corrosion.

[0038] The display panel also includes a first crack-blocking structure 3 located at an edge of the peripheral area BB away from the display area AA. Both the light-emitting layer EL and the encapsulation layer 2 extend from the display area AA toward the peripheral area BB and terminate at the side of the first crack-blocking structure 3 closer to the display area AA. In other words, the edges of the light-emitting layer EL and the encapsulation layer 2 are closer to the display area AA than the edges of the display panel.

[0039] The orthographic projections of the light emitting layer EL and the encapsulation layer 2 on the base substrate 1 do not overlap with the orthographic projections of the first crack blocking structure 3 on the base substrate 1. The first crack blocking structure 3 is located on a side of the light emitting layer EL and the encapsulation layer 2 away from the display area AA.

[0040] The material of the light-emitting layer EL is very susceptible to water corrosion. Compared with the traditional technology of laying the light-emitting layer EL and the encapsulation layer 2 in a whole layer (for example, the edge of the light-emitting layer EL and the encapsulation layer 2 is the edge of the display panel, as shown in Figure 2), the present disclosure shrinks the edge of the light-emitting layer EL and the encapsulation layer 2 to the side of the first crack blocking structure 3 close to the display area AA. The light-emitting layer EL is no longer provided on the side of the first crack blocking structure 3 facing away from the base substrate 1, thereby blocking the path for water vapor to invade the display area AA from the boundary along the light-emitting layer EL, thereby improving GDSH defects.

[0041] It should be noted that in related art, multiple display panels are simultaneously fabricated to form a display motherboard, which is then cut to form multiple display panels simultaneously. The display motherboard cutting area is referred to as the cutting area CC, and the edges of the display panels are also the edges of the cutting area CC. The first crack-stopping structure 3 is located in the peripheral area BB near the edge of the cutting area CC.

[0042] When cutting a display motherboard, cracks are prone to forming at the edges of the display panel. These cracks can spread along the inorganic layer (e.g., the intermediate layer 6) toward the display area AA, causing poor GDSH. In the disclosed embodiment, a first crack barrier structure 3 is provided at the edge of the display panel to absorb energy and prevent cracks from spreading from the edge of the display panel to the display area AA.

[0043] Optionally, the material of the first crack barrier structure 3 is an organic material, which absorbs energy to prevent cracks from spreading from the edge of the display panel to the display area AA.

[0044] In some embodiments, as shown in FIG4 , the display panel further includes an electrode layer 4 disposed on a side of the light-emitting layer EL away from the base substrate 1 ; the electrode layer 4 extends from the display area AA toward the peripheral area BB and terminates at a side of the first crack-blocking structure 3 near the display area AA. The first crack-blocking structure 3 is located on a side of the electrode layer 4 away from the display area AA.

[0045] Illustratively, the electrode layer 4 may be the layer where the cathode of the light-emitting device is located.

[0046] In operating mode, the cathode in the light-emitting device is energized. Because the cathode layer is adjacent to the light-emitting layer EL and laid out as a single layer alongside the light-emitting layer EL, it is susceptible to electrochemical corrosion in water-oxygen corrosive environments. In this embodiment, the edge of the electrode layer 4 is retracted to the side of the first crack-blocking structure 3 closest to the display area AA, eliminating the electrode layer 4 from the side of the first crack-blocking structure 3 facing away from the base substrate 1. In the peripheral area BB, the orthographic projection of the electrode layer 4 on the base substrate 1 does not overlap with the orthographic projection of the first crack-blocking structure 3 on the base substrate 1. When the electrode layer 4 is energized, the first crack-blocking structure 3 acts as a power-off device, making it less susceptible to electrochemical corrosion, thereby improving GDSH performance.

[0047] The first crack-blocking structure 3 is located at the edge of the peripheral area BB away from the display area AA. The first crack-blocking structure 3 includes a first opening 61 that separates the intermediate layer 6 into a first isolation dam 51 and a second isolation dam 54; and a crack-blocking pattern that fills at least the first opening. The first isolation dam 51 is located on the side of the first opening 61 closest to the display area AA, while the second isolation dam 54 is located on the side of the first opening 61 away from the display area AA.

[0048] In some embodiments, as shown in FIG. 4 , the display panel further includes an isolation structure 5 located in the peripheral area BB, and the isolation structure 5 is closer to the display area AA than the first crack-blocking structure 3 .

[0049] One or more isolation structures 5 may be provided in a direction from the display area AA of the display panel toward the peripheral area BB, all located in the peripheral area BB. In the case where multiple isolation structures 5 are provided, the multiple isolation structures 5 are arranged side by side.

[0050] In some embodiments, as shown in FIG4 , the first isolation dam 51 includes a plurality of isolation grooves 52 formed in the intermediate layer 6 and a plurality of isolation dams 51 (or a plurality of sub-isolation dams 51) separated by the isolation grooves. Two adjacent isolation dams 51 and the isolation groove 52 therebetween constitute the isolation structure 5. Two directly adjacent isolation grooves 52 share a common isolation dam 51.

[0051] The first crack blocking structure 3 is located on a side of the isolation groove 52 farthest from the display area AA among the plurality of isolation grooves 52 , and the first opening 61 of the first crack blocking structure shares an isolation dam 51 with the isolation groove 52 farthest from the display area AA.

[0052] Optionally, the isolation dam 51 is a single inorganic layer or a stacked structure of multiple inorganic layers.

[0053] Optionally, the isolation dam 51 is a multi-layer inorganic layer stacked structure, and the isolation groove 52 is located between two adjacent isolation dams 51 , thereby cutting off the light emitting layer EL and the electrode layer 4 .

[0054] The light-emitting layer EL and the electrode layer 4 are located at the bottom of each isolation groove 52. The light-emitting layer EL and the electrode layer 4 are not provided on the sidewalls of each isolation groove 52. Instead, the light-emitting layer EL and the electrode layer 4 are located on the surface of each isolation dam 51 away from the base substrate 1. In this embodiment, the light-emitting layer EL and the electrode layer 4 extending from the display area AA to the peripheral area BB can be cut by utilizing the step difference between the isolation dam 51 and the adjacent isolation groove 52.

[0055] As shown in FIG4 , the edge of the light-emitting layer EL farthest from the display area AA is located between the isolation groove 51 farthest from the display area AA and the first crack blocking structure 3; the edge of the electrode layer 4 farthest from the display area AA is located between the isolation groove 51 farthest from the display area AA and the first crack blocking structure 3.

[0056] In this embodiment, an isolation structure 5 is provided to separate the light emitting layer EL and the electrode layer 4 , thereby further blocking the path of water vapor invading the display area AA along the light emitting layer EL, thereby improving GDSH defects.

[0057] In some embodiments, as shown in FIG4 , the display panel further includes an isolation column dam located in the peripheral area BB, the isolation column dam being closer to the display area AA than the first crack-stopping structure 3. Optionally, the isolation column dam may be disposed between two adjacent isolation grooves 51. The isolation column dam is located between the isolation dam 51 and the light-emitting layer EL. The orthographic projection of the isolation column dam on the base substrate 1 overlaps with the orthographic projection of the isolation dam 51 on the base substrate 1. Alternatively, the isolation column dam may be disposed on the side of the isolation structure 5 closest to the display area AA. Exemplarily, the isolation column dam is disposed between the isolation groove 51 closest to the display area AA and another isolation groove 51 adjacent to the isolation groove 51 in a direction away from the display area AA. The isolation column dam is located on the side of the isolation dam 51 shared by the two adjacent isolation grooves 51 that is away from the base substrate 1. The orthographic projection of the isolation column dam on the base substrate 1 does not overlap with the orthographic projection of the first crack-stopping structure 3 on the base substrate 1. The orthographic projection of the isolation column dam on the base substrate 1 overlaps with the orthographic projection of the isolation dam 51 shared by the two adjacent isolation grooves 51 on the base substrate 1.

[0058] In some embodiments, the encapsulation layer 2 may be a single-layer structure or a multi-layer stacked structure.

[0059] As shown in Figure 4, the encapsulation layer 2 includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP1, and a second inorganic encapsulation layer CVD2, arranged in sequence away from the base substrate 1. The organic encapsulation layer IJP1 extends from the display area AA toward the peripheral area BB and terminates at the isolation column dam on the side closest to the display area AA. The isolation column dam prevents overflow of the organic encapsulation layer IJP1 material. Both the first and second inorganic encapsulation layers CVD1 and CVD2 extend from the display area AA toward the peripheral area BB, with their edges located between the isolation groove 51, farthest from the display area AA, and the first crack-stop structure 3.

[0060] The orthographic projections of the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 on the base substrate 1 do not overlap with the orthographic projection of the first crack blocking structure 3 on the base substrate 1. The orthographic projections of the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 on the base substrate 1 overlap with the orthographic projections of all isolation grooves 51 on the base substrate 1, including the isolation groove 51 farthest from the display area AA.

[0061] The orthographic projection of the organic encapsulation layer IJP1 on the substrate does not overlap with the orthographic projection of the isolation pillar dam on the substrate. The orthographic projection of the organic encapsulation layer IJP1 on the substrate does not overlap with the orthographic projection of the first crack-blocking structure 3 on the substrate 1. The orthographic projection of the organic encapsulation layer IJP1 on the substrate overlaps with the orthographic projection of the first isolation groove 51 closest to the display area AA on the substrate, and does not overlap with the orthographic projection of another isolation groove 51 adjacent to the first isolation groove 51 in a direction away from the display area AA on the substrate.

[0062] The isolation column dam is located on a side of the organic encapsulation layer IJP1 away from the display area AA. The distance between the isolation column dam and the base substrate 1 is greater than the distance between the organic encapsulation layer IJP1 and the base substrate 1, thereby preventing overflow of the organic encapsulation layer IJP1 material.

[0063] The first inorganic encapsulation layer CVD1 fills the isolation groove 52 and covers the isolation dam 51 and the isolation column dam. Because the light-emitting layer EL and the electrode layer 4 are arranged at the bottom of the isolation groove 52 and on the isolation dam 51, and because there is no light-emitting layer EL and the electrode layer 4 on the side wall, the first inorganic encapsulation layer CVD1 covers the light-emitting layer EL and the electrode layer 4 at the bottom of the isolation groove 52, covers the side wall of the isolation groove 52, covers the light-emitting layer EL and the electrode layer 4 on the isolation dam 51, and covers the light-emitting layer EL and the electrode layer 4 on the upper surface and side wall of the isolation column dam, thereby cutting off the light-emitting layer EL and the electrode layer 4 in the isolation groove 52 from the light-emitting layer EL and the electrode layer 4 on the isolation dam 51.

[0064] The first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 are easily cut to produce cracks. Compared with the traditional technology of laying the encapsulation layer 2 in a whole layer, this embodiment shrinks the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 so that the first crack blocking structure 3 is close to the side of the display area AA. The first crack blocking structure 3 is no longer provided with the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 on the side away from the base substrate 1, thereby blocking the cracks from spreading along the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 to the display area AA, thereby improving GDSH defects.

[0065] In some embodiments, as shown in Figure 4, a first protective layer 7 and a second protective layer 8 are provided in the isolation groove 52, the first protective layer 7 covers at least a portion of the side wall of the isolation groove 52 or at least a portion of the side wall of the isolation dam 15, and the second protective layer 8 covers the bottom of the isolation groove 52.

[0066] The orthographic projection of the second protective layer 8 on the base substrate 1 overlaps with the orthographic projection of the isolation groove 52 on the base substrate 1 , and the orthographic projection of the isolation groove 52 on the base substrate 1 is inside the orthographic projection of the second protective layer 8 on the base substrate 1 .

[0067] In this embodiment, the first protective layer 7 is used to encapsulate the sidewalls of the isolation groove 52 or the isolation dam 51, absorbing energy to prevent external impacts from causing cracks in the isolation dam 51 (the stacked inorganic layers). The second protective layer 8 is used to encapsulate the film layer on the side of the isolation groove 52 close to the substrate 1, preventing overetching during the etching process of the isolation groove 52 from affecting the film layer on the lower side of the isolation groove 52.

[0068] The light emitting layer and the electrode layer at the bottom of the isolation groove 52 are located on the side of the second protective layer 8 away from the base substrate 1 , and the first protective layer 7 is in direct contact with the second protective layer 8 near the surface of the base substrate 1 .

[0069] Optionally, the material of the first protective layer 7 is insulating, and may include but is not limited to organic materials. The organic materials absorb energy to prevent cracks from occurring at the edges of the isolation dam 51 (stacked inorganic layers).

[0070] Optionally, the material of the second protection layer 8 may include but is not limited to polysilicon (P-Si), and the polysilicon is used to prevent the isolation groove 52 from being over-etched and affecting the film layer under the isolation groove 52 .

[0071] In some embodiments, as shown in FIG4 , the isolation structure 5 further includes an isolation pad 53 disposed on the side of the isolation dam 51 facing away from the substrate 1 ; the isolation pad 53 is disposed corresponding to the isolation dam 51 , and is located between the isolation dam 51 and the light-emitting layer EL on the isolation dam 51 .

[0072] Isolation pads 53 and isolation columns dam are provided on an isolation dam 51. As shown in FIG4 , the isolation pads 53 are located on both sides of the isolation column dam. The orthographic projections of the two isolation pads 53 on the isolation dam 51 do not overlap with the orthographic projections of the isolation column dam on the isolation dam 51.

[0073] The first protective layer 7 covers a portion of the sidewalls of the isolation groove 52, and the isolation pad 53 covers the remaining sidewalls of the isolation groove 52, so that both the first protective layer 7 and the isolation pad 53 cover the entire sidewalls of the isolation groove 52. The end of the first protective layer 7 away from the base substrate 1 is spaced apart from the surface of the isolation dam 51 facing away from the base substrate 1. The end of the isolation pad 53 that falls into the isolation groove 52 contacts the end of the first protective layer 7 facing away from the base substrate 1. The isolation pad 53 protrudes from the isolation groove 52 in the direction in which the first protective layer 7 faces away from the base substrate 1, covering the surface of the isolation dam 51 facing away from the base substrate 1.

[0074] Here, the first protective layer 7 plays a role in supporting the isolation pad 53, so that the isolation pad 53 is supported so that its end protrudes from the first protective layer 7. The orthographic projection of the isolation pad 53 on the base substrate 1 overlaps with the orthographic projection of the first protective layer 7 on the base substrate 1 and the orthographic projection of the isolation dam 51 on the base substrate 1.

[0075] In this embodiment, an isolation pad 53 is further provided on the premise of ensuring the step difference between the isolation dam 51 and the adjacent isolation groove 52. The end of the isolation pad 53 protrudes from the first protective layer 7, so that the light-emitting layer EL and the electrode layer 4 falling into the isolation groove 52 are completely separated from the light-emitting layer EL and the electrode layer 4 outside the isolation groove 52, thereby blocking the path of water vapor invading the display area AA along the light-emitting layer EL, thereby improving GDSH defects.

[0076] Exemplarily, the shortest distance between two adjacent isolation pads 53 is approximately equal to the narrowest width of the isolation groove 52 .

[0077] Optionally, the first protective layer 7 covers part of the side wall of the isolation groove 52, and the end of the isolation pad 53 close to the isolation groove 52 is in direct contact with the surface of the first protective layer 7 facing away from the base substrate 1. The isolation pad 53 falls into the isolation groove 52 and contacts the first protective layer 7, so that the isolation pad 5 and the first protective layer 7 jointly encapsulate the side wall of the isolation groove 52.

[0078] In some embodiments, Figure 5 is a schematic diagram of an isolation structure according to another embodiment. As shown in Figure 5, in addition to the method of forming an isolation groove 52 in the concave intermediate layer 6 to cut off the light-emitting layer EL and the electrode layer 4 as shown in Figure 4, an isolation structure 5 can also be provided on the side of the intermediate layer 6 away from the base substrate 1. The isolation structure 5 includes a first conductive portion 5a, a second conductive portion 5b and a third conductive portion 5c arranged in sequence along a direction away from the base substrate 1; both ends of the first conductive portion 5a and the third conductive portion 5c cover and protrude from the second conductive portion 5b, that is, the cross-section of the first conductive portion 5a, the second conductive portion 5b and the third conductive portion 5c are in the shape of an "I" to form an isolation structure 5 for cutting off the light-emitting layer EL and the electrode layer 4.

[0079] Optionally, the intermediate layer 6 is a multi-layer inorganic layer stacking structure, and the first opening 61 can penetrate or semi-penetrate the intermediate layer 6. Specifically, the filling depth of the first crack blocking structure 3 (that is, the depth of the first opening 61) can be set according to the actual situation of whether the first crack blocking structure 3 can block cracks.

[0080] Exemplarily, the first opening 61 is a through hole penetrating the intermediate layer 6, which is an inorganic layer. By interrupting the inorganic layer, the crack propagation path is broken; further, a crack blocking pattern is filled in the first opening 61, and the crack blocking pattern is used to absorb energy to prevent the crack from extending to the display area AA.

[0081] Exemplarily, the intermediate layer 6 includes at least a pixel defining layer. The pixel defining layer located in the display area has a plurality of pixel openings, and different pixel openings are used to define light-emitting layers of different light-emitting devices.

[0082] In some embodiments, the material of the intermediate layer 6 is an inorganic material, and the material of the crack blocking pattern is an organic material. The organic material is used to absorb energy to prevent the crack from extending toward the display area AA.

[0083] As shown in FIG4 , the first opening 61 has a stepped shape, including a first stepped portion 611 and a second stepped portion 612 located on a side of the first opening 611 away from the base substrate 1. The orthographic projection of the first stepped portion 611 on the base substrate 1 is located inside the orthographic projection of the second stepped portion 612 on the base substrate 1.

[0084] In some embodiments, as shown in Figure 4, the crack blocking pattern includes a first blocking portion 31 and a second blocking portion 32 on the first blocking portion 31 and in direct contact with the first blocking portion 31, the first blocking portion 31 is filled into the first step portion 611 and the second step portion 612 of the first opening 61, and the second blocking portion 32 is arranged on the side of the first blocking portion 31 away from the substrate 1.

[0085] The second barrier portion 32 protrudes from the first opening 61 and covers the isolation dam 51 or the upper surface of the intermediate layer 5 away from the base substrate. The orthographic projection of the second barrier portion 32 on the base substrate 1 covers and exceeds the orthographic projection of the first barrier portion 31 on the base substrate 1 .

[0086] Optionally, the first barrier portion 31 and the second barrier portion 32 are connected to form an integral structure having a mushroom head shape. The setting of the second barrier portion 32 further encapsulates the contact position between the first barrier portion 31 and the intermediate layer 6, thereby improving the connection strength. At the same time, the second barrier portion 32 protrudes from the intermediate layer 6 compared to the first barrier portion 31, which is conducive to further absorbing energy and reducing the risk of crack propagation.

[0087] In some embodiments, FIG6 is a schematic diagram of a first crack blocking structure according to an embodiment of the present disclosure. As shown in FIG6 , the difference from the first crack blocking structure 3 in FIG4 is that the crack blocking pattern is only filled in the first opening 61 and does not protrude from the first opening 61.

[0088] In some embodiments, the crack blocking pattern is only provided on the side of the intermediate layer 6 facing away from the base substrate 1. The difference from Figures 4 and 6 is that the crack blocking pattern protrudes from the intermediate layer 6 instead of being located inside any opening of the intermediate layer 6 (refer to the position of the second blocking portion 32, which is no longer illustrated in the drawings).

[0089] In some embodiments, as shown in FIG4 , the display panel further includes: a first touch layer TMA, a touch insulating layer TLD, and a second touch layer TMB, which are sequentially arranged on the encapsulation layer 2 in a direction away from the base substrate 1 ; at least one of the first touch layer TMA, the touch insulating layer TLD, and the second touch layer TMB covers the first crack blocking structure 3 .

[0090] Optionally, only the first touch layer TMA covers the first crack barrier structure 3, and the touch insulation layer TLD and the second touch layer TMB do not cover the first crack barrier structure 3, or the touch insulation layer TLD and the second touch layer TMB only cover a portion of the first crack barrier structure 3. In this case, the second touch layer TMB is farther from the edge of the display area AA, and the touch insulation layer TLD is farther from the edge of the display area AA, and is closer to the display area AA than the first touch layer TMA is farther from the edge of the display area AA.

[0091] Optionally, only the touch insulation layer TLD covers the first crack barrier structure 3, and the first touch layer TMA and the second touch layer TMB do not cover the first crack barrier structure 3, or the first touch layer TMA and the second touch layer TMB only cover a portion of the first crack barrier structure 3. In this case, the second touch layer TMB is farther from the edge of the display area AA and the first touch layer TMA is farther from the edge of the display area AA, and is closer to the display area AA than the touch insulation layer TLD is farther from the edge of the display area AA.

[0092] Optionally, only the second touch layer TMB covers the first crack barrier structure 3, and the first touch layer TMA and the touch insulating layer TLD do not cover the first crack barrier structure 3, or the first touch layer TMA and the touch insulating layer TLD only cover a portion of the first crack barrier structure 3. In this case, the first touch layer TMA is farther from the edge of the display area AA, and the touch insulating layer TLD is farther from the edge of the display area AA, but is closer to the display area AA than the second touch layer TMB is farther from the edge of the display area AA.

[0093] Optionally, the first touch layer TMA, the touch insulation layer TLD, and the second touch layer TMB all cover the first crack-blocking structure 3. The second touch layer TMB covers the edge of the touch insulation layer TLD away from the display area AA, and the touch insulation layer TLD covers the edge of the first touch layer TMA away from the display area AA. The orthographic projection of each of the first touch layer TMA, the touch insulation layer TLD, and the second touch layer TMB on the base substrate 1 overlaps with the orthographic projection of the first crack-blocking structure 3 on the base substrate 1.

[0094] In this embodiment, at least one of the first touch layer TMA, the touch insulation layer TLD, and the second touch layer TMB is used to cover the first crack barrier structure 3 to encapsulate and protect the first crack barrier structure 3 and ensure the film bonding strength between the first crack barrier structure 3 and the intermediate layer 6.

[0095] In some embodiments, Figure 7 is a cross-sectional view along the AA' direction in Figure 3 according to the second embodiment. As shown in Figure 7, the display panel further includes: a third protective layer 9 arranged on the side of the second isolation dam 54 away from the display area AA, and the third protective layer 9 at least covers the side wall of the second isolation dam 54 of the intermediate layer 6 away from the display area AA.

[0096] The present disclosure provides a third protective layer 9 at the edge of the display panel to protect the outermost side wall of the intermediate layer 6 , thereby preventing cracks from occurring at the edge of the display panel.

[0097] Optionally, the third protective layer 9 is made of an organic material, which absorbs energy to prevent cracks from occurring on the edge of the display panel.

[0098] Optionally, as shown in FIG7 , the third protective layer 9 is L-shaped and includes a first protective portion 91 and a second protective portion 92 that are orthogonal to each other. The first protective portion 91 covers the sidewall of the second isolation dam 54 away from the display area AA. The second protective portion 92 is disposed on the upper surface of the second isolation dam 54 facing away from the base substrate 1 and abuts against the touch insulation layer TLD, further protecting the end of the intermediate layer 6 away from the display area AA and preventing cracks from forming at the edge of the intermediate layer 6. The orthographic projection of the second protective portion 92 on the base substrate 1 directly contacts and does not overlap with the orthographic projection of the touch insulation layer TLD on the base substrate 1.

[0099] The second touch layer TMB is located on a side of the second protection portion 92 away from the base substrate 1 . The orthographic projection of the second touch layer TMB on the base substrate 1 overlaps with the orthographic projection of the second protection portion 92 on the base substrate 1 .

[0100] Optionally, as shown in FIG7 , the first protection portion 91 and the second protection portion 92 are an integrally formed structure.

[0101] In some embodiments, FIG8 is a cross-sectional view taken along the BB' line in FIG3 . As shown in FIG8 , the display panel further comprises an aperture area EE and a transition area DD surrounding the aperture area EE. The transition area DD is located between the aperture area EE and the display area AA. The display panel further comprises a second crack-blocking structure 10 located in the transition area DD. The light-emitting layer EL and the encapsulation layer 2 both extend from the display area AA toward the transition area DD and terminate at a side of the second crack-blocking structure 10 proximal to the display area AA. The second crack-blocking structure 10 is located on a side of the light-emitting layer EL and the encapsulation layer 2 away from the display area AA.

[0102] The opening area EE is provided with openings for accommodating devices such as cameras and sensors.

[0103] The material of the light-emitting layer EL is very susceptible to water corrosion. Compared with the traditional technology of laying the light-emitting layer EL and the encapsulation layer 2 in a whole layer, for example, the light-emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the transition area DD until they extend to the edge of the opening area EE, the present disclosure retracts the edges of the light-emitting layer EL and the encapsulation layer 2 to the side of the second crack barrier structure 10 close to the display area AA. The light-emitting layer EL is no longer provided on the side of the second crack barrier structure 10 facing away from the base substrate 1, thereby blocking the path for water vapor to invade the display area AA from the via along the light-emitting layer EL, thereby improving GDSH defects.

[0104] Furthermore, during the drilling process in the opening area EE, cracks are easily generated at the opening boundary. These cracks can spread along inorganic layers such as the intermediate layer 6 to the display area AA, causing poor GDSH. The disclosed embodiment provides a second crack barrier structure 10 adjacent to the edge of the opening area EE. This second crack barrier structure 10 absorbs energy and prevents cracks from spreading from the opening boundary to the display area AA.

[0105] Optionally, the second crack barrier structure 10 is made of an organic material, which absorbs energy to prevent cracks from spreading from the opening boundary to the display area AA.

[0106] Here, the design principle of the second crack barrier structure 10 located in the transition area DD is the same as that of the first crack barrier structure 3 located in the peripheral area BB. For details, please refer to the detailed description of the first crack barrier structure 3 in the above embodiment, and the repeated parts will be omitted.

[0107] In some embodiments, as shown in FIG8 , the display panel further includes an electrode layer 4 disposed on a side of the light-emitting layer EL away from the base substrate 1 ; the electrode layer 4 extends from the display area AA to the transition area DD and terminates at a side of the second crack-blocking structure 10 near the display area AA. The second crack-blocking structure 10 is located on a side of the electrode layer 4 away from the display area.

[0108] Here, the structure of the electrode layer 4 located in the transition area DD is the same as that of the electrode layer 4 located in the peripheral area BB. For details, please refer to the relevant description of the electrode layer 4 in the above embodiment, and the repeated parts will not be repeated.

[0109] In some embodiments, as shown in FIG. 8 , the display panel further includes an isolation structure 5 located in the transition region DD, and the isolation structure 5 is closer to the display region AA than the second crack-blocking structure 10 .

[0110] Here, the design principle of the isolation structure 5 located in the transition area DD is the same as that of the isolation structure 5 located in the peripheral area BB. For details, please refer to the relevant description of the isolation structure 5 in the above embodiment, and the repeated parts will not be repeated.

[0111] In some embodiments, as shown in FIG. 8 , the display panel further includes an isolation column dam located in the transition region DD. The isolation column dam is closer to the display region AA than the second crack barrier structure 10 .

[0112] Here, the design principle of the isolation column dam located in the transition area DD is the same as that of the isolation column dam located in the peripheral area BB. For details, please refer to the relevant description of the isolation column dam in the above embodiment, and the repeated parts will not be repeated.

[0113] As shown in Figure 8, the encapsulation layer 2 includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP1, and a second inorganic encapsulation layer CVD2, arranged in sequence away from the base substrate 1. The organic encapsulation layer IJP1 extends from the display area AA to the transition area DD and terminates at the isolation column dam on the side closest to the display area AA. The isolation column dam is used to prevent overflow of the organic encapsulation layer IJP1 material. Both the first and second inorganic encapsulation layers CVD1 and CVD2 extend from the display area AA to the transition area DD. The edges of the first and second inorganic encapsulation layers CVD1 and CVD2 are located between the isolation structure 5 and the second crack-blocking structure 10, which are farthest from the display area AA.

[0114] Here, the design principle of the encapsulation layer 2 located in the transition area DD is the same as that of the encapsulation layer 2 located in the peripheral area BB. For details, please refer to the relevant description of the encapsulation layer 2 in the above embodiment, and the repeated parts will not be repeated.

[0115] In some embodiments, as shown in FIG4 or FIG8 , the display panel further includes a light shielding layer (BSM) disposed on a side of the intermediate layer 6 close to the base substrate 1. The light shielding layer (BSM) is at least partially located in the peripheral area (BB), and its orthographic projection on the base substrate 1 overlaps with the orthographic projection of the first crack-blocking structure 3 on the base substrate 1. Optionally, the material of the light shielding layer (BSM) may include, but is not limited to, molybdenum (Mo). The light shielding layer (BSM) is located on a side of the first crack-blocking structure 3 close to the base substrate 1 to shield the first crack-blocking structure 3.

[0116] In some embodiments, as shown in FIG. 4 or FIG. 8 , the display panel further includes a metal trace 11 passing through the intermediate layer 6 . The metal trace 11 can be reused as a source / drain electrode line of a thin film transistor or a touch lead.

[0117] The metal trace 11 is located in the first opening 61 and covers the sidewalls of the first step portion 611 and the sidewalls of the second step portion 612 of the first opening 61. The first crack barrier structure 3 is filled in the first opening 61 completely covered by the metal trace 11. The metal trace 11 at the bottom of the first opening 61 is in direct contact with the light shielding layer BSM, thereby conducting electricity together with the light shielding layer BSM.

[0118] 4 or 8 , since both the light shielding layer BSM and the metal trace 11 are conductive, the metal trace 11 can be electrically connected to other structures (such as a driver chip or a sensor driver device, etc.) across layers through the first opening 61 for signal transmission.

[0119] In some embodiments, as shown in FIG. 4 or FIG. 8 , the display panel further includes a touch protection layer TOC and a fourth protection layer IJP2 disposed on a side of the second touch layer TMB facing away from the touch insulation layer TLD. The touch protection layer TOC covers the film structure on the side of the second touch layer TMB closer to the base substrate 1, such as the first touch layer TMA, the touch insulation layer TLD, and the second touch layer TMB. The fourth protection layer IJP2 covers the touch protection layer TOC.

[0120] The orthographic projection of the touch protection layer TOC on the base substrate 1 overlaps with the orthographic projection of each of the first touch layer TMA, the touch insulation layer TLD, and the second touch layer TMB on the base substrate 1. The orthographic projection of the fourth protection layer IJP2 on the base substrate 1 overlaps with the orthographic projection of the touch protection layer TOC on the base substrate 1.

[0121] Optionally, the material of the touch protection layer TOC is an inorganic material, and the material of the fourth protection layer IJP2 is an organic material.

[0122] In some embodiments, the display panel may be a flexible display panel.

[0123] In some embodiments, the display panel further includes a driving circuit layer (not shown) disposed on a side of the light-emitting layer EL close to the base substrate 1. The driving circuit layer includes a pixel driving circuit for driving the light-emitting device. The light-emitting device of the present disclosure is, for example, an OLED light-emitting device.

[0124] In addition, the embodiment of the present disclosure further provides a method for manufacturing a display panel, including steps S11 to S12, wherein: S11, providing a base substrate 1; the base substrate 1 has a display area AA and a peripheral area BB surrounding the display area AA.

[0125] For example, the material of the base substrate 1 may include but is not limited to polyimide (PI), polyethylene naphthalene-2,6-dicarboxylate (PEN), polyethylene terephthalate (PET), flexible plastic colorless polyimide (CPI), thermoplastic urethane (TUP) or ultra-thin glass (UTG). The base substrate 1 may also be made of rigid and transparent materials such as glass, which can effectively support other film layers thereon. In practical applications, appropriate materials can be selected according to actual needs. For example, the base substrate 1 may be a single-layer structure or a multi-layer structure. The base substrate 1 with a multi-layer structure may add an inorganic thin film between the layers to act as a buffer layer. The material of the buffer layer may be a layer or a combination of multiple layers of amorphous silicon (a-Si), silicon nitride (SiNx), and silicon oxide (SiOx).

[0126] S12 , forming a first crack barrier structure 3 , a light emitting layer EL and an encapsulation layer 2 on the base substrate 1 .

[0127] The first crack barrier structure 3 is located in the peripheral area BB; the light emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the peripheral area BB and terminate at a side of the first crack barrier structure 3 close to the display area AA.

[0128] Optionally, a second crack-blocking structure 10 is formed in the transition region DD while forming the first crack-blocking structure 3. The first crack-blocking structure 3 and the second crack-blocking structure 10 are made of the same material and can be fabricated through a single patterning process.

[0129] In some embodiments, before forming the first crack barrier structure 3 , the light emitting layer EL and the encapsulation layer 2 , an intermediate layer 6 material is formed on the base substrate 1 , and a pattern including the intermediate layer 6 is formed through a patterning process.

[0130] Optionally, the image of the intermediate layer 6 located in the peripheral area BB includes a plurality of isolation grooves 52 and a plurality of isolation dams 51 separated by the isolation grooves 52 , wherein adjacent isolation dams 51 and the isolation grooves 52 therebetween constitute an isolation structure 5 .

[0131] Optionally, a first opening 61 is formed in the intermediate layer 6 located in the peripheral area BB, and the opening direction of the first opening 61 is away from the substrate 1 .

[0132] In some embodiments, before forming the intermediate layer 6, the process further includes forming a pattern including a second protective layer 8 on the base substrate 1 through a single patterning process. The second protective layer 8 is disposed corresponding to the isolation groove 52 and is located at the bottom of the isolation groove 52.

[0133] In some embodiments, after forming the intermediate layer 6 , the method further includes: forming a pattern including the first protective layer 7 and the first crack blocking structure 3 on the side of the intermediate layer 6 facing away from the substrate 1 through a single patterning process.

[0134] The material of the first protection layer 7 is the same as that of the first crack blocking structure 3 and can be simultaneously prepared and formed through a single patterning process.

[0135] The first crack blocking structure 3 at least fills the first opening 61 . The first protection layer 7 covers at least a portion of the sidewall of the isolation groove 52 .

[0136] In some embodiments, after forming the intermediate layer 6 , the method further includes forming a pattern including the first protective layer 7 , the first crack blocking structure 3 and the third protective layer 9 on the side of the intermediate layer 6 facing away from the substrate 1 through a single patterning process.

[0137] The material of the first protection layer 7 , the material of the first crack blocking structure 3 and the material of the third protection layer 9 are the same and can be simultaneously prepared and formed through a single patterning process.

[0138] In some embodiments, after forming the first protective layer 7, the first crack-stop structure 3, and the third protective layer 9, the process further includes: forming a pattern comprising a plurality of isolation pads 53 on the side of the isolation dam 51 facing away from the base substrate 1 through a patterning process. The isolation pads 53 are disposed corresponding to the isolation dam 51; the ends of the isolation pads 53 adjacent to the isolation grooves 52 are disposed on the surface of the first protective layer 7 facing away from the base substrate 1, and protrude from the first protective layer 7 in a direction of the first protective layer 7 facing away from the isolation dam 51.

[0139] In some embodiments, after forming the plurality of isolation pads 53 , the method further includes forming a pattern including the light emitting layer EL on a side of the isolation pad 53 facing away from the intermediate layer 6 through a patterning process.

[0140] For example, the light emitting layer EL material may be deposited as a whole layer, and then the light emitting layer EL located on the side of the first crack barrier structure 3 and the second crack barrier structure 10 facing away from the substrate 1 is etched away by an etching process to form the light emitting layer EL.

[0141] In some embodiments, after forming the light emitting layer EL, the method further includes: forming a pattern of the encapsulation layer 2 on the side of the light emitting layer EL facing away from the base substrate 1 through a patterning process.

[0142] Exemplarily, the encapsulation layer 2 includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP1, and a second inorganic encapsulation layer CVD2, which are sequentially arranged in a direction away from the base substrate 1. The first inorganic encapsulation layer CVD1 material can be deposited as a whole layer, and then an etching process is used to etch away the first inorganic encapsulation layer CVD1 material located on the side of the first crack-blocking structure 3 and the second crack-blocking structure 10 facing away from the base substrate 1, leaving only the first inorganic encapsulation layer CVD1 material on the isolation dam 51, the isolation groove 52, and the isolation column dam, thereby forming the first inorganic encapsulation layer CVD1. Next, an organic encapsulation layer (IJP1) material can be deposited as a whole layer. An etching process is then used to remove the organic encapsulation layer (IJP1) material located on the side of the isolation column dam away from the base substrate 1. The organic encapsulation layer (IJP1) material located on the side of the isolation column dam away from the display area AA is also etched away. This includes the organic encapsulation layer (IJP1) material located on the side of the first crack barrier structure 3 and the second crack barrier structure 10 away from the base substrate 1. Only the organic encapsulation layer (IJP1) material located on the side of the isolation column dam near the display area AA remains, thereby forming the organic encapsulation layer (IJP1). Next, a second inorganic encapsulation layer (CVD2) material can be deposited as a whole layer. An etching process is then used to remove the second inorganic encapsulation layer (CVD2) material located on the side of the first crack barrier structure 3 and the second crack barrier structure 10 away from the base substrate 1. Only the second inorganic encapsulation layer (CVD2) material located on the isolation dam 51, the isolation groove 52, and the isolation column dam remains, thereby forming the second inorganic encapsulation layer (CVD2).

[0143] In some embodiments, after forming the encapsulation layer 2 , the method further includes: sequentially forming a first touch layer TMA, a touch insulating layer TLD, and a second touch layer TMB on a side of the encapsulation layer 2 facing away from the base substrate 1 .

[0144] Optionally, at least one of the first touch layer TMA, the touch insulating layer TLD, and the second touch layer TMB covers the first crack blocking structure 3. For example, the orthographic projections of the first touch layer TMA, the touch insulating layer TLD, and the second touch layer TMB on the base substrate 1 overlap with the orthographic projection of the first crack blocking structure 3 on the base substrate 1.

[0145] Optionally, at least one of the first touch layer TMA, the touch insulation layer TLD, and the second touch layer TMB covers the second crack blocking structure 10. For example, the orthographic projections of the first touch layer TMA, the touch insulation layer TLD, and the second touch layer TMB on the base substrate 1 overlap with the orthographic projection of the second crack blocking structure 10 on the base substrate 1.

[0146] In addition, embodiments of the present disclosure provide another method for manufacturing a display panel, including steps S21 to S22, wherein: S21: a base substrate 1, a first crack-blocking structure 3, a light-emitting layer EL, and an encapsulation layer 2 are sequentially formed on a supporting substrate to form a display motherboard including multiple display panels. The display motherboard includes a display panel region and a cutting region CC surrounding the display panel region. A touch protection layer TOC and a fourth protection layer IJP2 extend from the display panel region to the cutting region CC.

[0147] S22 , cutting the display motherboard in the cutting area CC to form a plurality of display panels.

[0148] The first crack barrier structure 3 is located in the peripheral area BB; the light emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the peripheral area BB and terminate at a side of the first crack barrier structure 3 close to the display area AA.

[0149] In addition, an embodiment of the present disclosure further provides a display device, which includes the display panel of any one of the above embodiments.

[0150] In some embodiments, the display device may be a flexible display device. For example, the display device may be any product with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or vehicle-mounted device. Other essential components of the display device are well understood by those skilled in the art and are not detailed here, nor should they be construed as limitations of the present disclosure.

[0151] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display panel comprising a display area and a peripheral area surrounding the display area; wherein: The display panel includes: a substrate; and a light-emitting layer, located on one side of the base substrate, and extending from the display area to the peripheral area; an intermediate layer located between the base substrate and the light-emitting layer; and a first crack barrier structure located at an edge of the peripheral area away from the display area, the first crack barrier structure comprising: a first opening dividing the intermediate layer into a first isolation dam and a second isolation dam; and a crack barrier pattern at least filling the first opening; The first crack blocking structure is located on a side of the light emitting layer away from the display area.

2. The display panel according to claim 1, further comprising: The electrode layer is located on the side of the light emitting layer away from the base substrate, and the electrode layer extends from the display area to the peripheral area, wherein The first crack blocking structure is located on a side of the electrode layer away from the display area.

3. The display panel according to claim 2, wherein The first isolation dam is formed with a plurality of isolation grooves and a plurality of isolation dams separated by the plurality of isolation grooves. A light-emitting layer and an electrode layer are provided at the bottom of each isolation groove, no light-emitting layer and electrode layer are provided on the sidewall of each isolation groove, and a light-emitting layer and an electrode layer are provided on the surface of each isolation dam away from the base substrate. The first crack blocking structure is located on a side of an isolation groove farthest from the display region among the plurality of isolation grooves, and the first opening of the first crack blocking structure shares an isolation dam with the isolation groove farthest from the display region.

4. The display panel according to claim 3, wherein An edge of the light-emitting layer farthest from the display area is located between the isolation groove farthest from the display area and the first crack blocking structure; An edge of the electrode layer farthest from the display area is located between the isolation groove farthest from the display area and the first crack blocking structure.

5. The display panel according to claim 3, further comprising: The encapsulation layer is located on a side of the electrode layer away from the base substrate, and the encapsulation layer extends from the display area to the peripheral area, wherein The first crack blocking structure is located on a side of the encapsulation layer away from the display area.

6. The display panel according to claim 5, further comprising: An isolation column located in the peripheral area, the isolation column is located between the isolation dam and the light-emitting layer, and the orthographic projection of the isolation column on the base substrate overlaps with the orthographic projection of the isolation dam on the base substrate. The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are sequentially arranged in a direction away from the substrate; The organic encapsulation layer extends from the display area to the peripheral area, the isolation column is located on a side of the organic encapsulation layer away from the display area, and the distance from the surface of the isolation column away from the base substrate to the base substrate is greater than the distance from the organic encapsulation layer to the base substrate. The first inorganic encapsulation layer and the second inorganic encapsulation layer both extend from the display area to the peripheral area, and edges of the first inorganic encapsulation layer and the second inorganic encapsulation layer are both located between the isolation groove farthest from the display area and the first crack blocking structure.

7. The display panel according to any one of claims 3 to 6, wherein: A first protective layer and a second protective layer are provided in the isolation groove. The second protective layer covers the bottom of the isolation groove, and the light-emitting layer and the electrode layer at the bottom of the isolation groove are located on a side of the second protective layer away from the base substrate. The first protection layer covers at least a portion of a sidewall of the isolation groove, and an end portion of the first protection layer close to the base substrate contacts the second protection layer.

8. The display panel according to claim 7, further comprising an isolation pad, wherein The isolation pad is located between the isolation dam and the light-emitting layer on the isolation dam. The first protection layer covers a portion of the sidewall of the isolation groove, and an end of the first protection layer away from the base substrate is spaced apart from a surface of the intermediate layer away from the base substrate; The end portion of the isolation pad that falls into the isolation groove contacts the end portion of the first protection layer that faces away from the base substrate.

9. The display panel according to claim 1, wherein: The first opening has a stepped shape and includes a first stepped portion and a second stepped portion located on a side of the first stepped portion away from the base substrate, wherein an orthographic projection of the first stepped portion on the base substrate is located inside an orthographic projection of the second stepped portion on the base substrate.

10. The display panel according to claim 1, wherein The crack barrier pattern is filled in the first step-shaped opening and protrudes from the first opening to cover the upper surface of the intermediate layer away from the base substrate.

11. The display panel according to claim 10, further comprising: a metal trace located between the upper surface and sidewalls of the intermediate layer and the crack barrier pattern; as well as a light shielding layer, which is located on a side of the metal trace close to the base substrate, and an orthographic projection of the light shielding layer on the base substrate overlaps with an orthographic projection of the first crack blocking structure on the base substrate; in The light shielding layer contacts the metal wiring at the bottom of the first opening.

12. The display panel according to claim 11, wherein: The material of the intermediate layer is an inorganic material. The material of the crack barrier pattern is an organic material. The material of the light shielding layer is molybdenum.

13. The display panel according to claim 5, further comprising: A first touch layer, a touch insulating layer, and a second touch layer are sequentially arranged on the encapsulation layer in a direction away from the base substrate; The first touch layer, the touch insulating layer and the second touch layer jointly cover the first crack blocking structure.

14. The display panel according to claim 1, further comprising: A third protection layer covers at least a side wall of the second isolation dam away from the display area.

15. The display panel according to claim 14, wherein The third protective layer has an L-shape and includes an organic material, and includes a first protective portion and a second protective portion that are orthogonal to each other, The first protection portion covers the side wall of the second isolation dam away from the display area, The second protection portion covers a surface of the second isolation dam facing away from the base substrate.

16. The display panel according to claim 1, wherein The display panel further comprises an opening area and a transition area surrounding the opening area, wherein the transition area is located between the opening area and the display area; The display panel further includes a second crack blocking structure located in the transition region; the light-emitting layer extends from the display region to the transition region, and the second crack blocking structure is located on a side of the light-emitting layer away from the display region.

17. A method for preparing a display panel, wherein: The display panel has a display area and a peripheral area surrounding the display area; The method for preparing the display panel includes: providing a substrate; Disposing a light-emitting layer on one side of the base substrate so that the light-emitting layer extends from the display area to the peripheral area; forming an intermediate layer between the base substrate and the light emitting layer; and A first crack blocking structure is formed at an edge of the peripheral area away from the display area, so that the first crack blocking structure is located on a side of the light-emitting layer away from the display area, wherein the first crack blocking structure includes: a first opening, dividing the intermediate layer into a first isolation dam and a second isolation dam; and a crack blocking pattern, at least filling the first opening.

18. A display device comprising the display panel according to any one of claims 1 to 16.

Images