Display module and electronic apparatus

Abstract

Provided is a display module which can be mounted on an electronic apparatus at room temperature.　This display module includes: a display device having a first connection part on a rear surface which is the opposite side to a display surface; a wiring board provided on the rear surface side; and an external connection terminal provided on the wiring board and configured so that an external terminal can be electrically and mechanically connected thereto. The first connection part and the external connection terminal are electrically connected via the wiring board.

Description

Display modules and electronic devices

[0001] The present disclosure relates to a display module and an electronic device including the same.

[0002] In recent years, display modules have been implemented in various electronic devices. A known display module is one in which a flexible printed circuit (FPC) is pressure-bonded to pads of a display device via an anisotropic conductive film (ACF) (see, for example, Patent Document 1). However, in such a display module, the pads required for connection via the ACF are long, making it difficult to narrow the frame of the display device. Furthermore, the signal transmission distance on the FPC is long, making it difficult to increase the signal transmission speed.

[0003] Japanese Patent Application Laid-Open No. 2020-148847

[0004] In the field of semiconductor devices, WL-CSP (Wafer Level Chip Size Package) is known as a technology that enables narrower frame sizes and shorter external wiring. However, when WL-CSP is applied to a display module, a reflow process is required when mounting the display module on an electronic device. A typical reflow process requires heating above the melting point of the solder, which can result in thermal damage to the components of the display module. When a display module includes an organic light-emitting diode (OLED) element, the OLED element is particularly susceptible to thermal damage.

[0005] An object of the present disclosure is to provide a display module that can be mounted in an electronic device at room temperature, and an electronic device including the same.

[0006] In order to solve the above-mentioned problems, the display module according to the present disclosure comprises: a display device having a first connection portion on a back surface opposite to the display surface; a wiring board provided on the back surface; and an external connection terminal provided on the wiring board and configured to be electrically and mechanically connectable to an external terminal, wherein the first connection portion and the external connection terminal are electrically connected via the wiring board.

[0007] FIG. 1 is a perspective view of the display surface side of a display module according to an embodiment of the present disclosure. FIG. 2 is a perspective view of the back side of a display module according to an embodiment of the present disclosure. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1. FIG. 4 is a perspective view of a display module according to Modification 1. FIG. 5 is a cross-sectional view of a display module according to Modification 1. FIG. 6 is a cross-sectional view of a display module according to Modification 2. FIG. 7 is a cross-sectional view of a display module according to Modification 3. FIG. 8 is a cross-sectional view of a display module according to Modification 4. FIG. 9 is a perspective view of the back side of a display module according to Modification 5. FIG. 10 is a perspective view of a head-mounted display. FIG. 11 is a perspective view of a see-through head-mounted display. FIG. 12A is a front view of a digital still camera. FIG. 12B is a rear view of the digital still camera.

[0008] The embodiments of the present disclosure will be described in the following order: 1. General description of a display module and electronic device according to the present disclosure 2. One embodiment (example of a display module) 3. Modification 4. Application example (example of an electronic device)

[0009] The embodiments and the like described below are preferred specific examples of the present disclosure, and the contents of the present disclosure are not limited to these embodiments and the like. In all the drawings of the following embodiments, the same or corresponding parts are denoted by the same reference numerals. To avoid cluttering the illustrations, only some of the components may be denoted by reference numerals, or the illustrations may be simplified, enlarged, or reduced in size.

[0010] <1. General Description of Display Module and Electronic Device According to the Present Disclosure> In the display module according to the present disclosure, external connection terminals configured to be electrically and mechanically connectable to external terminals are provided on the wiring substrate, so that the display module can be mounted on an electronic device at room temperature. The external terminals are, for example, terminals provided on a main substrate or the like of the electronic device.

[0011] Here, "mechanically connected" refers to a state in which the external terminal and the external connection terminal are connected in a mechanical relationship. Specifically, for example, it refers to a state in which the external terminal and the external connection terminal are connected by fitting. Furthermore, "electrically connected" refers to a state in which the external terminal and the external connection terminal are connected so as to be electrically conductive.

[0012] In the display module according to the present disclosure, the display device may include a plurality of light-emitting elements. The plurality of light-emitting elements may include at least one self-luminous light-emitting element selected from the group consisting of organic light-emitting diodes (OLEDs), light-emitting diodes (LEDs), quantum dot light-emitting diodes (QLEDs), and semiconductor laser elements. The display module according to the present disclosure can be mounted in an electronic device at room temperature, and therefore organic light-emitting diodes, which are susceptible to heat damage, can be used as the light-emitting elements.

[0013] In the display module according to the present disclosure, the external connection terminals are preferably provided on one of the two surfaces of the wiring substrate opposite the surface facing the display device, thereby enabling the external connection terminals to be easily electrically and mechanically connected to external terminals.

[0014] In the display module according to the present disclosure, the external connection terminals are preferably connector terminals. This allows the connector terminals serving as external connection terminals to be fitted with external connector terminals for electrical connection. This allows the display module to be easily mounted in an electronic device at room temperature.

[0015] In the display module according to the present disclosure, the display device includes a drive substrate having a first surface that is the display screen side and a second surface that is the wiring substrate side, and a light-emitting element provided on the first surface, and the drive substrate preferably includes a first connection portion provided on the second surface side, a second connection portion provided on the first surface side, and a connection member provided in a hole that penetrates the first surface and the second surface and connects the first connection portion and the second connection portion. This shortens the connection distance between the first connection portion and the second connection portion. Therefore, when the display module is mounted on an electronic device, the signal transmission distance from the display device to the electronic device can be shortened.

[0016] In the display module according to the present disclosure, the display device includes a drive substrate having a first surface serving as a display screen, a second surface serving as a wiring substrate, and a side surface, and a light-emitting element provided on the first surface. The drive substrate preferably includes a first connection portion provided on the second surface, a second connection portion provided on the first surface, and wiring provided on the side surface that connects the first connection portion and the second connection portion. This allows the first connection portion and the second connection portion to be connected without forming a through-hole such as a contact hole in the drive substrate. Therefore, the first connection portion and the second connection portion can be easily electrically connected.

[0017] In the display module according to the present disclosure, from the viewpoint of freedom of connection and cost reduction of the display device, it is preferable that the wiring board includes a third connection portion provided on the surface opposite to the surface on the display device side, and that the first connection portion and the third connection portion are electrically connected by a wire.

[0018] In the display module according to the present disclosure, it is preferable that the first connection portion is located outside the wiring substrate in a plan view, and the wire extends from the third connection portion to the first connection portion through the outside of the wiring substrate. By extending the wire from the third connection portion to the first connection portion through the outside of the wiring substrate in this manner, the first connection portion and the third connection portion can be electrically connected without providing a through-hole in the wiring substrate. Therefore, the first connection portion and the third connection portion can be easily electrically connected.

[0019] In the display module according to the present disclosure, the wiring substrate preferably has a slit, and the wire extends from the first connection portion through the slit to the third connection portion. By extending the wire from the first connection portion through the slit to the third connection portion in this manner, the length of the wire connecting the first connection portion and the third connection portion can be shortened. Therefore, the signal transmission distance from the first connection portion to the external connection terminal can be shortened.

[0020] In the display module according to the present disclosure, it is preferable that the wiring substrate includes a fourth connection portion on the surface facing the display device, the first connection portion being formed by a protruding electrode, and the protruding electrode being joined to the fourth connection portion. By joining the third connection portion of the wiring substrate to the protruding electrode of the display device, the wiring substrate and the display device can be electrically connected, thereby realizing a display module with a small area.

[0021] In the display module according to the present disclosure, the bonding is preferably solid-state bonding, which can suppress thermal damage to the light-emitting elements.

[0022] The display module according to the present disclosure may be included in an electronic device. For example, the display module according to the present disclosure may be included in an eyewear device such as a virtual reality (VR) device, a mixed reality (MR) device, or an augmented reality (AR) device, or may be included in an electronic viewfinder (EVF) or a small projector. Eyewear devices also include headsets.

[0023] In the present disclosure, "on member A" in a description such as "member B is provided on member A" indicates the relative positional relationship between member A and member B, and includes not only a state in which member B is located directly on member A without any other member therebetween, but also a state in which member B is located on member A with at least one other member therebetween.

[0024] 2. An embodiment Fig. 1 is a perspective view of the display surface side of a display module 10 according to an embodiment of the present disclosure. Fig. 2 is a perspective view of the back surface side of the display module 10 according to an embodiment of the present disclosure. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. The display module 10 is configured to be mountable on a main board of an electronic device. The display module 10 includes a display device 11, a wiring board 12, connector terminals 13, a plurality of wires 14, and a potting material 15. Note that the potting material 15 is not shown in Figs. 1 and 2.

[0025] (Display Device 11) The display device 11 displays an image based on a video signal sent from a CPU or the like of an electronic device via a wiring substrate 12. The display device 11 may be a microdisplay. The display device 11 has, in order, a drive substrate 111, a plurality of light-emitting elements (not shown), a protective layer (not shown), a filling resin layer (not shown), and a glass substrate 112.

[0026] The display device 11 has a display surface on the glass substrate 112 side. In this specification, the surface opposite the display surface of the display device 11 is referred to as the back surface. In this specification, of the two surfaces of each layer constituting the display module, the surface facing the display surface of the display device 11 is referred to as the first surface, and the surface opposite the display surface of the display device 11 (bottom side) is sometimes referred to as the second surface.

[0027] (Drive Substrate 111) The drive substrate 111 is a so-called backplane, and is capable of driving a plurality of light-emitting elements. The drive substrate 111 has a plurality of pads 113, a plurality of pads 114, and a plurality of vias 115.

[0028] The pads 113 are an example of first connection portions. The pads 113 are provided on the rear surface of the display device 11, more specifically, on the second surface (the second surface facing the wiring substrate 12) of the drive substrate 111. The pads 113 are arranged in a row along one side of the drive substrate 111 in a plan view.

[0029] The pads 114 are an example of second connection portions. The pads 114 are provided on a first surface (the first surface that is the display surface side) of the drive substrate 111. The pads 114 are located outside the glass substrate 112 in a plan view and are arranged in a row along one side of the drive substrate 111. Each of the pads 114 is provided on the opposite side of the pads 113, with the drive substrate 111 in between. The pads 114 are electrically connected to the light-emitting elements via wiring or the like. Note that, in the embodiment, an example will be described in which the pads 114 are provided outside the area of ​​the glass substrate 112 (outside the pixel area) in a plan view as shown in FIG. 1 . However, the positions of the pads 114 are not limited to this example. The pads 114 may be provided within the area of ​​the glass substrate 112 or directly below the light-emitting elements formed on the first surface of the drive substrate 111.

[0030] Each of the multiple vias 115 is provided in a hole that penetrates the drive substrate 111, and electrically connects the pads 113 and 114. The vias 115 are an example of a connecting member that electrically connects the pads 113 and 114.

[0031] The drive substrate 111 includes, for example, a semiconductor substrate and an insulating layer in this order. A plurality of drive transistors (not shown) and the like are provided on a first surface of the semiconductor substrate. The semiconductor substrate is, for example, a silicon substrate. The silicon substrate is, for example, made of amorphous silicon, polycrystalline silicon, single crystal silicon, or the like.

[0032] The insulating layer is provided on the first surface of the semiconductor substrate and covers the plurality of drive transistors and the like. The insulating layer includes a plurality of wirings and a plurality of vias (neither of which is shown). The plurality of vias electrically connect the light-emitting elements to the wirings, and also electrically connect the wirings to the drive transistors. Note that while FIG. 3 shows an example in which the vias 115 are provided so as to penetrate the drive substrate 111, the semiconductor substrate and the insulating layer may each include vias 115, and these vias 115 may be electrically connected via wiring or the like provided between the semiconductor substrate and the insulating layer.

[0033] The insulating layer may be an organic insulating layer, an inorganic insulating layer, or a laminate thereof. The organic insulating layer contains at least one selected from the group consisting of, for example, polyimide-based resins, acrylic-based resins, and novolac-based resins. The inorganic insulating layer may contain, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ N ｙ ) and the like.

[0034] (Light-emitting elements) The plurality of light-emitting elements includes, for example, a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements. The first light-emitting elements can emit red light based on control of a drive circuit or the like. The second light-emitting elements can emit green light based on control of a drive circuit or the like. The third light-emitting elements can emit blue light based on control of a drive circuit or the like. In the first embodiment, the light-emitting elements are organic light-emitting diode elements (OLED elements). The plurality of light-emitting elements are two-dimensionally arranged in a predetermined array pattern on the first surface of the drive substrate 111.

[0035] (Protective Layer) The protective layer is provided on the first surface of the drive substrate 111 so as to cover the plurality of light emitting elements. The protective layer is translucent to the light emitted from each of the plurality of light emitting elements. The protective layer contains, for example, at least one of an inorganic material and an organic material with low hygroscopicity. The protective layer may have a single layer structure or a multilayer structure. When the thickness of the protective layer is increased, a multilayer structure is preferable. This is to relieve internal stress in the protective layer. The inorganic material is, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ), silicon oxynitride (SiO ｘ N ｙ ), titanium oxide (TiO ｘ ) and aluminum oxide (AlO ｘThe organic material includes at least one selected from the group consisting of thermosetting resin compositions, photosensitive resin compositions, and the like. The photosensitive resin composition includes, for example, an ultraviolet-curable resin composition. Specific examples of the organic material include at least one selected from the group consisting of acrylic resins, polyimide resins, novolac resins, epoxy resins, norbornene resins, parylene resins, and the like.

[0036] (Filled Resin Layer) The filled resin layer is filled between the protective layer and the glass substrate 112. The filled resin layer is translucent to the light of each color emitted from the plurality of light emitting elements. The filled resin layer functions as an adhesive layer that bonds the protective layer and the glass substrate 112 together.

[0037] The filled resin layer includes, for example, a curable resin. The curable resin includes at least one type selected from the group consisting of a thermosetting resin, an ultraviolet curable resin, etc. Note that the filled resin layer is not limited to a thermosetting resin or an ultraviolet curable resin, and may include a type of curable resin other than a thermosetting resin or an ultraviolet curable resin.

[0038] (Glass substrate 112) The glass substrate 112 is translucent to the light of each color emitted from the plurality of light-emitting elements. The glass substrate 112 covers the first surface side of the drive substrate 111 and seals the first surface of the drive substrate 111 on which each component such as the plurality of light-emitting elements is provided. Note that the glass substrate 112 is not an essential component and may or may not be provided.

[0039] (Wiring Board 12) The wiring board 12 is an interposer that electrically connects the main board of the electronic device to the display device 11 and relays the information between the main board and the display device 11. Specifically, the wiring board 12 electrically connects the pads 113 to the connector terminals 13. The wiring board 12 is provided on the back side of the display device 11. The wiring board 12 is smaller than the display device 11, and is superimposed on the display device 11 so that the pads 113 are exposed from one side of the wiring board 12. The wiring board 12 and the display device 11 are bonded together, for example, with a die bond material.

[0040] The wiring board 12 has a plurality of pads 121 and a plurality of wires 122. The pads 121 are an example of a third connection portion. The plurality of pads 121 and the plurality of wires 122 are provided on a second surface (the surface opposite to the surface on the display device 11 side) of the wiring board 12. The plurality of pads 121 are arranged in a row along one side of the wiring board 12 in a plan view. The row of the plurality of pads 121 and the row of the plurality of pads 113 are arranged side by side with a step formed by the side surface of the wiring board 12 between them in a plan view.

[0041] The plurality of wirings 122 electrically connect the plurality of pads 121 to the connector terminals 13. The plurality of wirings 122 extend from the plurality of pads 121 to the plurality of connection portions (not shown) of the connector terminals 13, respectively.

[0042] (Connector terminal 13) The connector terminal 13 is an external connection terminal for connecting the display module 10 to a main board of an electronic device. The connector terminal 13 is provided on the second surface (the surface opposite to the surface on the display device 11 side) of the wiring board 12. The connector terminal 13 is an example of an external connection terminal configured to be electrically and mechanically connectable to a connector (external terminal) of the main board.

[0043] (Wires 14) Each of the plurality of wires 14 electrically connects the pad 121 to the pad 113. Each wire 14 extends from the pad 121 to the pad 113, passing outside the wiring board 12. That is, each wire 14 is arranged so as to straddle one side of the wiring board 12. A first end of the wire 14 is connected to the pad 121, and a second end of the wire 14 is connected to the pad 113.

[0044] (Potting Material 15) The potting material 15 covers and protects the wires 14, the pads 113, and the pads 121. The potting material 15 includes at least one resin selected from the group consisting of urethane-based resins, epoxy-based resins, silicone-based resins, and the like.

[0045] [Method for Manufacturing Display Module 10] Hereinafter, an example of a method for manufacturing the display module 10 according to an embodiment will be described.

[0046] First, a drive substrate 111 is formed, which has a plurality of pads 113, a plurality of pads 114, a plurality of vias 115, a plurality of wirings, a plurality of drive transistors, etc. Methods for forming the vias 115 include, for example, via first, in which a plug is embedded to a predetermined depth in the semiconductor substrate from the transistor formation surface side (first surface side) before the transistor formation process, and the back surface (second surface) is ground to expose the plug, via middle, in which a plug is embedded between after the transistor formation process and before the wiring process or during the wiring process, and the back surface (second surface) is ground to expose the plug, and via last, in which the back surface of the drive substrate 111 is ground after the drive substrate 111 is formed, and a plug is formed from the back surface side.

[0047] Next, after forming a plurality of light-emitting elements on the first surface of the drive substrate 111, a protective layer is formed on the first surface of the drive substrate 111 so as to cover the plurality of light-emitting elements. Next, the drive substrate 111 and the plurality of glass substrates 112 are bonded together with a filling resin interposed therebetween.

[0048] Next, a plurality of wiring substrates 12, each provided with connector terminals 13, are attached to the back surface of the drive substrate 111 using, for example, a die bond material. Next, the pads 113 of the drive substrate 111 are electrically connected to the pads 121 of each wiring substrate 12 using wire bonding. Next, potting material 15 is applied to the wires 14 and cured. After that, the drive substrate 111 is cut out and separated into individual pieces. This results in a display module 10 according to one embodiment.

[0049] [Effects] As described above, the display module 10 according to one embodiment includes the display device 11 having a plurality of pads 113 on the back surface opposite the display surface, the wiring board 12 provided on the back surface of the display device 11, and the connector terminals 13 provided on the second surface (the surface opposite the display device 11) of the wiring board 12 and configured to be electrically and mechanically connectable to a main board (external terminals) of an electronic device. The display device 11 and the connector terminals 13 are electrically connected via the wiring board 12. Therefore, there is no need to use solder when mounting the display module 10 on the main board of the electronic device, and the display module 10 can be mounted on the main board of the electronic device at room temperature.

[0050] The display module 10 according to one embodiment is connected to the main board of the electronic device by connector terminals 13 provided on the rear surface of the display module 10. Therefore, in the display module 10 according to one embodiment, the signal transmission distance between the display device 11 and the main board of the electronic device can be made shorter than in a display module in which the main board of the electronic device and the display device are connected by an FPC. This enables high-speed signal transmission between the display device 11 and the main board of the electronic device.

[0051] In the display module 10 according to the embodiment, the size of the pads 114 can be made smaller than in a display module in which an FPC is connected to the pads of the display device via an ACF, and therefore the frame of the display device 11 can be made narrower.

[0052] <3 Modifications> [Modification 1] Fig. 4 is a perspective view of a display module 10A according to Modification 1. Fig. 5 is a cross-sectional view of the display module 10A according to Modification 1. Note that the potting material 15 is not shown in Fig. 4. The wiring substrate 12 has a slit 123. The slit 123 is a small hole that penetrates the wiring substrate 12 and extends along one side of the wiring substrate 12. A plurality of pads 121 are arranged in a line along the slit 123. A plurality of pads 113 of the display device 11 are provided at positions that overlap the slits 123 in a plan view, and the plurality of pads 113 are exposed through the slits 123. A plurality of wires 14 extend from the pads 121 to the pads 113 through the slits 123.

[0053] In the display module 10A according to the first modification, the wires 14 electrically connect the pads 121 and the pads 113 via the slits 123, thereby shortening the length of the wires 14. This shortens the signal transmission distance from the display device 11 to the electronic device.

[0054] [Variation 2] Figure 6 is a cross-sectional view of a display module 10B according to Variation 2. The display device 11 has a plurality of bumps 116 on the rear surface side. Each of the plurality of bumps 116 is electrically connected to a pad 114 via a via 115. A plurality of wirings 124 is provided on the first surface (the surface facing the display device 11) of the wiring substrate 12. The wirings 124 are an example of fourth connecting portions. One end of each of the plurality of wirings 124 is connected to a pad 121 via a via 125. The other end of each of the plurality of wirings 124 is bonded to the bump 116. The bonding is preferably solid-state bonding such as ultrasonic bonding. Solid-state bonding can suppress thermal damage to the light-emitting elements.

[0055] In order to solid-state bond the bump 116 and the wiring 124, it is preferable that the bump 116 and the wiring 124 each independently contain at least one metal selected from the group consisting of gold (Au), copper (Cu), silver (Ag), aluminum (Al), etc., and it is particularly preferable that they contain gold (Au) among these metals.

[0056] A metal layer (e.g., a plating layer) containing at least one of the above metals may be formed on the surfaces of the bumps 116 and the wiring 124. In this case, the main bodies of the bumps 116 and the wiring 124 may be formed of a metal other than the at least one of the above metals.

[0057] The underfill material 16 is provided between the display device 11 and the wiring board 12, and the display device 11 and the wiring board 12 are bonded together. The underfill material 16 covers the periphery of each bump 116.

[0058] 7 is a cross-sectional view of a display module 10C according to Modification 3. The connector terminals 13 are provided on the side surfaces of the wiring substrate 12. A plurality of wiring lines 126 are provided on a first surface (the surface on the display device 11 side) of the wiring substrate 12. One end of each of the plurality of wiring lines 126 is connected to the connector terminals 13. The other end of each of the plurality of wiring lines 126 is bonded to the bumps 116. The bonding is preferably solid-state bonding such as ultrasonic bonding.

[0059] In the display module 10C according to the third modification, the connector terminals 13 are provided on the side surface of the wiring board 12, so that the plurality of wires 14 (see FIGS. 2 and 3) can be omitted.

[0060] 8 is a cross-sectional view of a display module 10D according to Modification 4. A plurality of wirings 117 are provided on the side surface of the drive substrate 111. The side surface is preferably an inclined surface in which the periphery of the first surface (the surface on which the light-emitting elements are formed) of the drive substrate 111 protrudes relative to the periphery of the second surface (the surface on the wiring substrate 12 side). Each of the plurality of wirings 117 connects a pad 113 to a pad 114.

[0061] In the display module 10D according to the fourth modification, the pads 113 and 114 can be electrically connected to each other without forming a plurality of vias 115 (see FIG. 3 ) in the drive substrate 111. Therefore, the pads 113 and 114 can be easily electrically connected to each other.

[0062] 9 is a perspective view of the rear surface side of a display module 10E according to Modification 5. In a plan view, a plurality of pads 113 are arranged along both sides of the second surface (the surface on the wiring substrate 12 side) of the drive substrate 111. In a plan view, a plurality of pads 114 are arranged along both sides of the first surface (the surface on which light-emitting elements are formed) of the drive substrate 111. The wiring substrate 12 is smaller than the display device 11, and is attached to the rear surface side of the display device 11 so that the plurality of pads 113 are exposed from both sides of the wiring substrate 12. A plurality of wires 14 are arranged so as to straddle both sides of the wiring substrate 12, and electrically connect the pads 121 and the pads 113.

[0063] [Variation 6] In the method for manufacturing the display module 10 according to one embodiment, an example of a manufacturing method has been described in which the wiring substrate 12 and the driving substrate 111 are bonded together before singulating the driving substrate 111. However, the manufacturing method for the display module 10 is not limited to this example, and the wiring substrate 12 and the driving substrate 111 may be bonded together after singulating the driving substrate 111.

[0064] [Variation 7] In the embodiment, an example has been described in which the display device 11 includes a plurality of light-emitting elements capable of emitting light of each color, but this is not a limitation on the colorization method of the display device 1. For example, the display device 11 may include a plurality of light-emitting elements capable of emitting white light and color filters, and a color image may be displayed by combining these.

[0065] A quantum dot layer may be provided instead of a color filter, or a quantum dot layer may be provided together with a color filter. The quantum dot layer is a color conversion layer that contains quantum dots (semiconductor particles) and can convert the color of light emitted from a plurality of light-emitting elements. In this case, the plurality of light-emitting elements may be configured to emit blue light.

[0066] [Other Modifications] Although one embodiment of the present disclosure and its modifications (hereinafter referred to as "one embodiment, etc.") have been specifically described above, the present disclosure is not limited to one embodiment, etc., and various modifications based on the technical concept of the present disclosure are possible.

[0067] For example, the configurations, methods, steps, shapes, materials, etc. described in the embodiments are merely examples, and different configurations, methods, steps, shapes, materials, etc. may be used as needed. The configurations, methods, steps, shapes, materials, etc. of the embodiments can be combined with each other without departing from the spirit of the present disclosure.

[0068] The present disclosure may also employ the following configurations. (1) A display module comprising: a display device having a first connection portion on a back surface opposite to a display surface; a wiring board provided on the back surface; and an external connection terminal provided on the wiring board and configured to be electrically and mechanically connectable to an external terminal, wherein the first connection portion and the external connection terminal are electrically connected via the wiring board. (2) The display module described in (1), wherein the display device includes an organic light-emitting diode element. (3) The display module described in (1) or (2), wherein the external connection terminal is provided on one of both surfaces of the wiring board opposite to the surface facing the display device. (4) The display module described in any one of (1) to (3), wherein the external connection terminal is a connector terminal. (5) The display module according to any one of (1) to (4), wherein the display device includes: a drive substrate having a first surface that is the display surface side and a second surface that is the wiring substrate side, and a light-emitting element provided on the first surface, wherein the drive substrate includes the first connection portion provided on the second surface side, a second connection portion provided on the first surface side, and a connection member provided in a hole that penetrates the first surface and the second surface and connects the first connection portion and the second connection portion. (6) The display module according to any one of (1) to (4), wherein the display device includes: a drive substrate having a first surface that is the display surface side, a second surface that is the wiring substrate side, and a side surface, and a light-emitting element provided on the first surface, wherein the drive substrate includes the first connection portion provided on the second surface side, a second connection portion provided on the first surface side, and wiring that is provided on the side surface and connects the first connection portion and the second connection portion. (7) The display module according to any one of (1) to (6), wherein the wiring substrate includes a third connection portion provided on a surface opposite to the surface on the display device side, and the first connection portion and the third connection portion are electrically connected by a wire. (8) The display module according to (7), wherein the first connection portion is located outside the wiring substrate in a plan view, and the wire extends from the third connection portion to the first connection portion through the outside of the wiring substrate.(9) The display module according to (7), wherein the wiring substrate has a slit, and the wire extends from the first connection portion through the slit to the third connection portion. (10) The display module according to any one of (1) to (9), wherein the wiring substrate includes a fourth connection portion on a surface facing the display device, and the first connection portion is formed by a protruding electrode, and the protruding electrode and the fourth connection portion are joined. (11) The display module according to (10), wherein the joining is solid-state welding. (12) An electronic device including the display module according to any one of (1) to (11).

[0069] <4 Application Examples> (Electronic Devices) The display module 10 according to one embodiment and display modules 10A to 10E according to their modifications (hereinafter referred to as "the display module 10 according to one embodiment, etc.") may be provided in various electronic devices. The display module 10 according to one embodiment is particularly suitable for eyewear devices such as head-mounted displays, or electronic viewfinders for video cameras or single-lens reflex cameras that require high resolution and are used with magnification near the eyes.

[0070] 10 shows an example of the appearance of a head-mounted display 320. The head-mounted display 320 is an example of an eyewear device. The head-mounted display 320 has, for example, ear hooks 322 on both sides of a glasses-shaped display unit 321 for wearing on the user's head. The display unit 321 includes any one of the display modules 10 according to an embodiment.

[0071] 11 shows an example of the appearance of a see-through head mounted display 340. The see-through head mounted display 340 is an example of an eyewear device. The see-through head mounted display 340 includes a main body 341, an arm 342, and a lens barrel 343.

[0072] The main body 341 is connected to the arm 342 and the glasses 350. Specifically, an end of the long side of the main body 341 is joined to the arm 342, and one side of the main body 341 is connected to the glasses 350 via a connecting member. The main body 341 may also be worn directly on the head of the human body.

[0073] The main body 341 incorporates a control board for controlling the operation of the see-through head mounted display 340 and a display unit. The arm 342 connects the main body 341 to the lens barrel 343 and supports the lens barrel 343. Specifically, the arm 342 is coupled to an end of the main body 341 and an end of the lens barrel 343, respectively, and fixes the lens barrel 343. The arm 342 also incorporates a signal line for communicating data related to images provided from the main body 341 to the lens barrel 343.

[0074] The lens barrel 343 projects image light provided from the main body 341 via the arm 342, through the eyepiece 351, toward the eyes of the user wearing the see-through head mounted display 340. In this see-through head mounted display 340, the display unit of the main body 341 includes any one of the display modules 10 according to an embodiment.

[0075] 12A and 12B show an example of the appearance of a digital still camera 310. This digital still camera 310 is an interchangeable lens single-lens reflex type, and has an interchangeable taking lens unit (interchangeable lens) 312 located approximately in the center of the front of a camera main body 311, and a grip part 313 for the photographer to hold on the left side of the front.

[0076] A monitor 314 is provided at a position shifted to the left from the center on the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking through the electronic viewfinder 315, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 312 and determine the composition of the shot. The electronic viewfinder 315 includes any one of the display modules 10 according to an embodiment.

[0077] 10, 10A, 10B, 10C, 10D, 10E Display module 11 Display device 111 Drive substrate 112 Glass substrate 113 Pad (first connection portion) 114 Pad (second connection portion) 115 Via 116 Bump 117 Wiring 12 Wiring substrate 121 Pad (third connection portion) 122 Wiring 123 Slit 124 Wiring (fourth connection portion) 125 Via 126 Wiring 13 Connector terminal 14 Wire 15 Potting material 16 Underfill material 310 Digital still camera 320 Head mounted display 340 See-through head mounted display

Claims

1. A display module comprising: a display device having a first connection portion on a back surface opposite to a display surface; a wiring board provided on the back surface; and an external connection terminal provided on the wiring board and configured to be able to electrically and mechanically connect to an external terminal, wherein the first connection portion and the external connection terminal are electrically connected via the wiring board.

2. The display module according to claim 1, wherein the display device includes an organic light-emitting diode element.

3. The display module according to claim 1, wherein the external connection terminals are provided on one of the two surfaces of the wiring board opposite to the surface facing the display device.

4. The display module according to claim 1, wherein the external connection terminal is a connector terminal.

5. The display module described in claim 1, wherein the display device includes a drive substrate having a first surface on the display surface side and a second surface on the wiring substrate side, and a light-emitting element provided on the first surface, and the drive substrate includes the first connection portion provided on the second surface side, a second connection portion provided on the first surface side, and a connection member provided in a hole portion that penetrates the first surface and the second surface, connecting the first connection portion and the second connection portion.

6. The display module according to claim 1, wherein the display device includes: a drive substrate having a first surface on the display surface side, a second surface on the wiring substrate side, and a side surface; and a light-emitting element provided on the first surface; and the drive substrate includes the first connection portion provided on the second surface side, a second connection portion provided on the first surface side, and wiring provided on the side surface that connects the first connection portion and the second connection portion.

7. The display module according to claim 1, wherein the wiring board includes a third connection portion provided on a surface opposite to the surface on the display device side, and the first connection portion and the third connection portion are electrically connected by a wire.

8. A display module as described in claim 7, wherein the first connection portion is located outside the wiring board in a plan view, and the wire extends from the third connection portion to the first connection portion, passing outside the wiring board.

9. The display module according to claim 7, wherein the wiring substrate has a slit, and the wire extends from the first connection portion through the slit to the third connection portion.

10. A display module as described in claim 1, wherein the wiring substrate includes a fourth connection portion on the surface facing the display device, the first connection portion is formed by a protruding electrode, and the protruding electrode and the fourth connection portion are joined.

11. The display module according to claim 10, wherein the bonding is solid-state bonding.

12. An electronic device comprising the display module according to claim 1.

Images