Cold-formed OLED displays and methods for fabricating the same

Abstract

Disclosed is a display that includes a cover glass substrate with a second major surface thereof. The display further includes an organic light emitting diode ("OLED") display panel adhered to the second major surface by the optically clear adhesive. A frame is attached to the OLED display panel so as to retain the cover glass substrate and the OLED display panel in an elastically bent state. There are no layers having a thermal conductivity greater than 5 W*m-1*K-1 between the OLED display panel and the frame other than an optional thermally conductive adhesive layer. Moreover, the frame comprises a thermal conductivity greater than or equal to 15 W*m-1*K-1 and is configured to dissipate heat generated by the OLED display panel. When the thermally conductive adhesive layer is present, it is the sole adhesive responsible for retaining the OLED display panel in the elastically bent state.

Description

COLD-FORMED OLED DISPLAYS AND METHODS FOR FABRICATING THE SAMECross-reference to Related Applications

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 63 / 573,886, filed on April 03, 2024, the content of which is relied upon and incorporated herein by reference in its entirety.FIELD

[0002] The disclosure relates to display devices for vehicle interior systems and, more particularly, to organic light emitting diode (OLED) display devices for vehicle interior systems that may be cold-formed in conjunction with a glass substrate to include a desired three-dimensional shape.BACKGROUND

[0003] Vehicle interiors include curved surfaces and can incorporate displays in such curved surfaces. Curved glass substrates are desirable as covers for such displays due to their optical performance and durability. Various techniques are used to fabricate such curved glass substrates, including cold-forming, where a glass substrate is shaped at a relatively low temperature after the glass substrate is fabricated. Such cold-forming techniques advantageously permit glass substrates to remain in a flat (e.g., planar) shape during various fabrication steps (e.g., during post-processing, decoration and transport), thereby reducing production costs. Even greater cost savings may be realized if display panels (e.g., organic light emitting diode (“OLED”) display panels) are also shaped through cold-forming, as display panels that are initially flat can be shaped to possess a desired curvature, permitting flexible designs. OLED display panels can be particularly beneficial because they do not require bulky backlight units that are required with LCD-based displays, thereby allowing for thinner constructions and bending to tighter radii.

[0004] Typical OLED displays are implemented with a flexible heat sink layer (e.g., thin metallic layer) adhered to the back of the display panel. This heat sink layer dissipates heat generated by self-illuminating components of the OLED display, which prevents heat-induced failure of the display. However, implementing such heat sink layers adds cost and complexity to the display manufacturing process.

[0005] Accordingly, a needs exists for an OLED display that can be cold-formed and effectively dissipate heat without a separate, dedicated heat sink layer.SUMMARY

[0006] One embodiment of the present disclosure relates to a display. The display includes a cover glass substrate comprising a first major surface and a second major surface. The display further includes an optically clear adhesive disposed on the second major surface. The display further includes an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive. The display further includes a frame configured to retain the cover glass substrate and the OLED display panel in an elastically bent state. The frame comprises a thermal conductivity greater than or equal to 15 W*m'1*K'1and is configured to dissipate heat generated by the OLED display panel. At least one of: (a) the frame is in direct contact with the OLED display panel; or (b) a thermally conductive adhesive layer is disposed between the OLED display panel and the frame, with the thermally conductive adhesive layer being the only layer between the frame and the OLED display panel having a thermal conductivity greater than 0.05 W*m'1*K'1, wherein the thermally conductive adhesive layer is the sole adhesive layer responsible for retaining the OLED display panel in the elastically bent state.

[0007] Another embodiment of the present disclosure pertains to a display including a cover glass substrate comprising a first major surface and a second major surface. The display also includes an optically clear adhesive disposed on the second major surface. The display also includes an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive. The display also includes a frame comprising a curved support surface. The display also includes a thermally conductive adhesive layer disposed between the OLED display panel and the curved support surface. The thermally conductive adhesive layer retains the OLED display panel and cover glass substrate in an elastically bent state and has a thermal conductivity that is greater than or equal to 0.05 W*m *K-1. Moreover, the thermally conductive adhesive layer has the highest thermal conductivity of any layer disposed between a flexible substrate of the OLED display panel and the curved support surface. The thermally conductive adhesive layer can be the sole adhesive preventing the OLED display panel and the glass cover substrate from returning to an un-bent state.

[0008] Another embodiment of the present disclosure pertains to a display including a cover glass substrate comprising a first major surface and a second major surface. The display also includes an optically clear adhesive disposed on the second major surface. The display also includes an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive. The display also includes a frame comprising a curved support surface. The OLED display panel is retained against the curved support surface of the frame such that the OLED display panel and the cover glass substrate are in an elastically bent state. Moreover, there are no layers having a thermal conductivity greater than 5 W*m'1*K'1between the OLED display panel and the frame.

[0009] Another embodiment pertains to a method of fabricating a display. The method includes adhering an OLED display panel to a cover glass substrate with a layer of optically clear adhesive to form a combined stack, applying a bending force to the combined stack to place the combined stack in an elastically bent state, and, while the combined stack is in an elastically bent state, engaging the combined stack with a frame so that the frame retains the combined stack in the elastically bent state when the bending force is no longer applied to the combined stack. The frame comprises a thermal conductivity greater than or equal to 15 W*m'1*!<■' and is configured to dissipate heat generated by the OLED display panel. After engaging the combined stack with the frame, at least one of: (a) the frame is in direct contact with the OLED display panel; and (b) a thermally conductive adhesive layer is disposed between the OLED display panel and the frame, with the thermally conductive adhesive layer being the only layer between the frame and the OLED display panel having a thermal conductivity greater than 0.05 W*m'1*K'1, such that the thermally conductive adhesive layer is the sole adhesive layer responsible for retaining the OLED display panel in the elastically bent state.

[0010] Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as described herein, including the detailed description which follows, the claims, as well as the appended drawings.

[0011] It is to be understood that both the foregoing general description and the following detailed description are merely exemplary, and are intended to provide an overview or framework to understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification.BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings incorporated in and forming a part of the specification illustrate several aspects of the present invention and, together with the description, serve to explain the principles of the invention. In the drawings:

[0013] FIG. l is a perspective view of a vehicle interior with vehicle interior systems having OLED displays, according to one or more embodiments of the present disclosure;

[0014] FIG. 2 schematically depicts a cross-sectional view of an OLED display of a vehicle interior system through the line II-II depicted in FIG. 1, according to one or more embodiments of the present disclosure;

[0015] FIG. 3 schematically depicts a cross-sectional view of the OLED display through the line III-III depicted in FIG. 2, according to one or more embodiments of the present disclosure;

[0016] FIG. 4 schematically depicts an area of overlap between a thermally conductive adhesive layer and a second major surface of a cover glass substrate of the OLED display depicted in FIGS. 1-3, according to one or more embodiments of the present disclosure;

[0017] FIG. 5A schematically depicts a cross-sectional view of a first step of a process of cold-forming a glass substrate and an OLED display panel, according to one or more embodiments of the present disclosure;

[0018] FIG. 5B schematically depicts a cross-sectional view of a second step of the process of cold-forming the glass substrate and the OLED display panel depicted in FIG. 5A, where the OLED display panel and the cover glass substrate are placed into a curved configuration, according to one or more embodiments of the present disclosure;

[0019] FIG. 5C schematically depicts a cross-sectional view of a third step of the process of cold-forming the glass substrate and the OLED display panel depicted in FIGS. 5A-5B, where a thermally conductive adhesive layer is cured to retain the cover glass substrate and OLED display panel in the curved configuration, according to one or more embodiments of the present disclosure;

[0020] FIG. 5D schematically depicts a combined stack of an OLED display panel and a cover glass substrate with a thermally conductive adhesive layer disposed thereon, according to one or more embodiments of the present disclosure;

[0021] FIG. 5E schematically depicts a cross-sectional view of an air pressure outlet formed in the thermally conductive adhesive layer depicted in FIG. 5D, according to one or more embodiments of the present disclosure;

[0022] FIG. 6 schematically depicts a cross-sectional view of an OLED display in which at least a portion an OLED display panel is in direct physical contact with a frame, according to one or more embodiments of the present disclosure; and

[0023] FIG. 7 schematically depicts a perspective view of a cover glass substrate, according to one or more embodiments of the present disclosure.DETAILED DESCRIPTION

[0024] Referring generally to the figures, described herein are embodiments of vehicle interior displays including cold-formed organic light emitting diode (“OLED”) display panels and methods of fabricating the same. The vehicle interior displays described herein may include a cover glass substrate and an OLED display panel disposed on a major surface of the cover glass substrate. The cover glass substrate and the OLED display panel are cold-formed against a frame that is configured to retain the cover glass substrate and the OLED display panel in an elastically bent state. Embodiments of the present disclosure utilize the frame as a heat sink to dissipate heat generated in the OLED display panel. The vehicle interior displays described herein do not incorporate a flexible heat sink layer that is adhered to the OLED display panel. In embodiments, for example, there are no layers having a thermal conductivity greater than 5 W*m'1*K'1between the OLED display panel and the frame other than an optional thermally conductive adhesive layer. Utilizing the frame as the heat sink for the OLED display panel beneficially eliminates the need for additional thermally conductive layers between the OLED display panel and the frame, thereby reducing overall stack thickness and saving material costs.

[0025] Utilizing a frame configured to retain the cover glass and the OLED display panel in the elastically bent state as the heat sink can also structurally simplify the display. For example, in embodiments, the OLED display panel is adhered to the frame via a thermally conductive adhesive layer having a thermal conductivity greater than 0.05 W*m'1*K'1and the thermally conductive adhesive layer is configured to retain the OLED display panel and the cover glass substrate in the elastically bent state on the frame. In such a configuration, the thermally conductive adhesive layer can be beneficially positioned completely behind an emissive layerof the OLED display panel and not obstruct images generated by the OLED display panel. When so situated, the thermally conductive adhesive layer can cover a relatively large percentage (e.g., at least 50%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, or even 100%) of the surface area of a bonding surface of the OLED display panel (and overlap a corresponding portion of a major surface of the cover glass substrate). Such a dispersal of adhesive used to retain the OLED display panel and cover glass substrate in a coldbent state beneficially prevents localized peaks of bending-induced stress in the thermally conductive adhesive layer, thereby rendering the displays described herein less susceptible to delamination than certain existing displays relying on frames circumferentially surrounding the OLED display panel to provide a bonding area for structural adhesives used for retaining cold- formed parts. In embodiments, no adhesive comprising stresses from the cold-bent OLED display panel and cover glass substrate is disposed radially outward of a peripheral edge of the OLED display panel. Such implementations enable designs with very limited or no bezel, as there is no need for the frame to extend outward of the display panel.

[0026] In embodiments, at least a portion of the OLED display panel may lie in direct physical contact with the frame so that heat generated by the display panel dissipates into the frame. The portion of the OLED display panel directly contacting the frame may not be adhered to the frame (i.e., devoid of any adhesives). Such a configuration beneficially reduces detrimental effects of thermally-induced stresses from the heat-sink expanding upon being heated by the OLED display panel.

[0027] FIG. 1 shows an exemplary vehicle interior 1000 that includes three different embodiments of a vehicle interior system 100, 200, 300. Vehicle interior system 100 includes a center console base 110, with a curved surface 120 including an OLED display 130. Vehicle interior system 200 includes a dashboard base 210, with a curved surface 220 including an OLED display 230. The dashboard base 210 typically includes an instrument panel 215 which may also include an OLED display. Vehicle interior system 300 includes a steering wheel base 310, with a curved surface 320 and an OLED display 330. It should be understood that vehicle interior systems other than the vehicle interior systems 100, 200, 300 depicted in FIG. 1 may incorporate OLED displays as described herein. OLED displays other than the OLED displays 130, 230, 330 are contemplated and within the scope of the present disclosure. For example, in embodiments, a vehicle interior system may include a frame for attachment of an OLED display panel, and the frame may be incorporated into any portion of an interior of a vehiclethat includes a curved surface, such as, but not limited to, an arm rest, a pillar, a roof, a seat back, a floor board, a headrest, a door panel, or any portion of the interior of a vehicle that includes a curved surface. In embodiments, the OLED displays described herein may be incorporated into a free-standing display (i.e., a display that is not permanently connected to a portion of the vehicle).

[0028] The OLED displays of the present disclosure may have a variety of sizes and shapes. Additionally, the OLED displays 130, 230, 330 depicted in FIG. 1 as being separate from one another may also be integrated into a single OLED display. For example, in embodiments, the OLED displays 130, 230, 330 may be integrated into a single OLED display that extends over the dashboard base 210 from the instrument panel 215 to the location of the OLED display 230 depicted in FIG. 1. In embodiments, the OLED display devices described herein may include glass substrates that also cover non-display surfaces for the dashboard, center console, door panel, etc. In such embodiments, glass material may be selected based on its weight, aesthetic appearance, etc. and may be provided with a coating (e.g., an ink or pigment coating) with a pattern (e.g., a brushed metal appearance, a wood grain appearance, a leather appearance, a colored appearance, etc.) to visually match the glass components with adjacent non-glass components. In embodiments, such ink or pigment coating may have a transparency level that provides for deadfront or color matching functionality when the OLED display is inactive.

[0029] In embodiments, each of the OLED displays 130, 230, 330 includes a glass substrate and an OLED display panel disposed on the glass substrate. For example, FIG. 2 depicts a cross sectional view of the OLED display 230 through the line II-II of FIG. 1, according to an example embodiment. The OLED display 230 is depicted to include a cover glass substrate 232 including a first major surface 234, a second major surface 236, and minor surfaces 238 extending between the first major surface 234 and the second major surface 236. An OLED display panel 240 is disposed on the second major surface 236 and attached to the second major surface 236 via an optically clear adhesive 242. The OLED display panel 240 includes a front surface 244 that is covered by the cover glass substrate 232 such that the cover glass substrate 232 functions as a cover lens for the OLED display panel 240. In embodiments, a dimension W represents a dimension of the cover glass substrate 232 prior to cold-forming (e.g., representing a length or width of the cover glass substrate 232 prior to cold-forming), corresponding to the width W1 described herein (see FIG. 7). In embodiments, the dimension W is greater than or equal to 100 mm (e.g., greater than or equal to 200 mm, greater than orequal to 300 mm, greater than or equal to 400 mm, greater than or equal to 500 mm, greater than or equal to 1000 mm, greater than or equal to 1500 mm, and any and all ranges between and including the aforementioned ranges).

[0030] Referring to FIGS. 1-2, in embodiments, components of the OLED displays 130, 230, and 330 are curved to match or substantially match a curvature of one of the curved surfaces 120, 220, 320. As shown in FIG 2, for example, the cover glass substrate 232 is curved such that at least a portion of the first major surface 234 includes a radius of curvature R. The radius of curvature R may correspond to a radius of curvature of the curved surface 220 (see FIG. 1) of the vehicle interior system 200.

[0031] In embodiments, the radius of curvature R is a minimum radius of curvature of the first major surface 234 along the depicted direction of curvature. In embodiments, R greater than or equal to 0.5 mm (e.g., greater than or equal to 1.0 mm, greater than or equal to 5 mm, greater than or equal to 10 mm, greater than or equal to 20 mm, greater than or equal to 30 mm, greater than or equal to 40 mm, greater than or equal to 50 mm, greater than or equal to 60 mm, greater than or equal to 70 mm, greater than or equal to 80 mm, greater than or equal to 90 mm, greater than or equal to 100 mm, greater than or equal to 110 mm, greater than or equal to 120 mm, greater than or equal to 130 mm, greater than or equal to 140 mm, greater than or equal to 150 mm). In embodiments, the radius of curvature R varies depending on a thickness (T1 - see FIG. 7) of the cover glass substrate 232. In embodiments where cover glass substrate 232 has a relatively large thickness (e.g., greater than or equal to 0.7 mm, for example), the radius of curvature R may be greater than or equal to 150 mm (e.g., greater than or equal to 200 mm, greater than or equal to 300 mm, greater than or equal to 400 mm) to prevent defects (e.g., propagating cracks, from forming in the cover glass substrate 232 as a result of cold-forming.

[0032] As shown in FIG. 2, the OLED display panel 240 is also curved such that the front surface 244 extends parallel (or within 10° of parallel) to the first major surface 234. The cover glass substrate 232 and the OLED display panel 240 are depicted to be curved along a widthwise direction (e.g., a first direction) of the cover glass substrate 232. It should be appreciated that a variety of curved configurations for the cover glass substrate 232 and the OLED display panel 240 are contemplated and within the scope of the present disclosure. In embodiments, for example, the cover glass substrate 232 and the OLED display panel 240 are curved along a lengthwise direction of the cover glass substrate 232 (e.g., a second direction perpendicular to the first direction). The cover glass substrate 232 and the OLED display panel240 may be curved along various combinations of directions to form a variety of geometric profiles. In the embodiment depicted in FIGS. 1-2, entireties of the cover glass substrate 232 and the OLED display panel 240 are curved with uniform radii of curvature. Embodiments where the cover glass substrate 232 and the OLED display panel 240 include non-uniform distributions of curvature (or where portions of the cover glass substrate 232 and the OLED display panel 240 are not curved) are also contemplated and within the scope of the present disclosure.

[0033] As used herein, the phrase “curved along,” when used to describe a particular direction of curvature of a surface, refers to a direction of a line tangent to the surface that the referenced curvature causes the surface to deviate from. As a result of the curvature, the surface may include a radius of curvature that is measured from a point on a line extending perpendicular to the direction along which the surface is curved. In an example, a surface that is curved along the X-direction may possess a radius of curvature measured from a line extending in the Y-direction.

[0034] In embodiments, the OLED display panel 240 is constructed of relatively flexible components such that the OLED display panel 240 can be manipulated in shape via application of external forces thereto to facilitate cold-forming. For example, referring now to FIG. 3, the OLED display panel 240 can comprise a plurality of functional layers 246 disposed on a flexible substrate 248. The flexible substrate 248 can be a relatively thin layer (e.g., having a thickness of less than 0.8 mm) of a suitable glass or polymeric material. The particular stack structure of the OLED display panel 240 is not particularly limiting and can take the form of any currently available or future OLED display panel. Generally, the plurality of functional layers 246 include, among other layers, an organic emission layer 246a disposed between two electrodes 246b and 246c. Additional functional layers (e.g., hole and electronic transport layers, passivation layers, etc.) can be included, but the discussion thereof is not included herein.

[0035] In embodiments, the cover glass substrate 232 and the OLED display panel 240 are placed into the curved configuration depicted in FIG. 2 using cold-forming or cold-bending techniques. By “cold-forming” or “cold-bending,” it is meant that at least portions of the cover glass substrate 232 and the OLED display panel 240 are manipulated in shape via application of an external force thereto when the cover glass substrate 232 and the OLED display panel 240 are at a temperature beneath a softening temperature of the cover glass substrate 232. For example, in embodiments, cold-forming of the cover glass substrate 232 and the OLED displaypanel 240 takes place at below 200°C, below 100°C, at room temperature, or even lower temperatures. In embodiments, during cold-forming, pressure is applied to the cover glass substrate 232 and / or OLED display panel 240 to bring the cover glass substrate 232 and / or OLED display panel 240 into conformity with a chuck, mold, or other support structure configured to support the cover glass substrate 232 and / or OLED display panel 240 in a desired curved configuration (e.g., via a curved surface), such as the shape depicted in FIGS. 1-2. The pressure may be applied in a variety of different ways, such as via suction or vacuum, a mechanical press, rollers, etc.

[0036] Once placed into a curved configuration, the cover glass substrate 232 and OLED display panel 240 may be held in the curved configuration via attachment to a frame 245 that serves as a heat sink for the OLED display panel 240. The frame 245 is mechanically coupled to at least one of the cover glass substrate 232 and the OLED display panel 240 so as retain the cover glass substrate 232 and OLED display panel 240 in an elastically bent state, such that the cover glass substrate 232 and OLED display panel 240 have a curved configuration originating from the bending force applied thereto during cold-forming. That is, the frame 245 is configured to retain the cover glass substrate 232 and OLED display panel 240 in the elastically bent state. For example, the frame 245 can have a flexural rigidity that is greater than that of a combined stack of the cover glass substrate 232, the OLED display panel 240, and the optically clear adhesive 242, such that, upon attachment of the combined stack to the frame 245, the frame 245 resists the tendency of the combined stack to revert back to its original shape (e.g., where each component has a flat, planar shape) prior to cold-forming.

[0037] The frame 245 is constructed of a material having a higher thermal conductivity than the cover glass substrate 232 and the flexible substrate 248 of the OLED display panel 240. In embodiments, the frame 245 is constructed of a material having a thermal conductivity greater than or equal to 15 W*m'1*K'1, and, as a result, is configured to dissipate heat generated by the plurality of functional layers 246 of the OLED display panel 140. Suitable materials for the frame 245 include, but are not limited to, aluminum, magnesium, stainless steel, alloys, and composite materials. Such material properties of the frame 245 enable the frame 245 to act as a heat sink layer for the OLED display panel 240, eliminating the need for additional thermally conductive layers between the OLED display panel 240 and the frame 245. In embodiments, there are no layers having a thermal conductivity greater than 5 W*m-1*K-1between the OLED display panel 240 and the frame 246 other than the thermally conductive adhesive layer 250,when such an adhesive layer is included. Embodiments of the present disclosure may not include any layers having a thermal conductivity greater than 5 W*m'1*K'1and a flexural rigidity less than the combined stack of the OLED display panel 240, optically clear adhesive 242, and cover glass substrate 232, other than certain implementations of the thermally conductive adhesive layer 250, when included.

[0038] In embodiments, such as the embodiment depicted in FIGS. 2-3, the frame 245 is adhered directly to the OLED display panel 240 via a thermally conductive adhesive layer 250. The thermally conductive adhesive layer 250 may be formed of a suitable adhesive material having a thermal conductivity greater than or equal to 0.05 W*m'1*K'1(preferably greater than or equal to 0.1 W*m'1*K'1, more preferably greater than or equal to 0.2 W*m'1*K'1, and even more preferably 0.5 W*m'1*K'1). The minimum thermal conductivity of the thermally conductive adhesive layer 250 may vary depending on various characteristics of the OLED panel 240. For example, in embodiments, the minimum value of the thermal conductivity may be calculated aswhere & is the minimum thermal conductivity, Q is a maximum heat generated by OLED display panel, Ax is the thickness of the thermally conductive adhesive layer 250, A is the surface area of the interface of the OLED display panel 240 and the thermally conductive adhesive layer 250, and AT a difference between a maximum operating temperature of the OLED display panel 240 and an environmental temperature encountered (e.g., a maximum temperature in a vehicle interior). In an example where Q = 61.8 W, Ax = 0.5 mm, AT = 20°C, and A=0.14 m2, the minimum thermal conductivity k is 0.011 W / mK. As can be appreciated from Equation 1, the minimum value increases with decreasing area of the OLED display panel 240 and increasing amounts of heat generated by the OLED display panel 240. When the thermally conductive adhesive layer 250 is formed of multiple different adhesives, each one of those adhesives can comprise a thermal conductivity that greater than or equal to 0.05 W*m'1*!<■' (preferably greater than or equal to 0.1 W*m'1*K'1, more preferably greater than or equal to 0.2 W*m'1*K'1, and even more preferably 0.5 W*m'1*K'1)

[0039] In embodiments, in addition to thermal conductivity, the material of the thermally conductive adhesive layer 250 is selected based on the radius of curvature R and / or material properties of the OLED display panel 240 and the frame 245. For example, in embodiments,the material of the thermally conductive adhesive layer 250 may be selected to have a relatively low Young’s modulus (measured at room temperature and 1 Hz) to reduce stresses therein that are present therein from the OLED display panel 240 and cover glass substrate 232 being retained in the elastically deformed state. In such embodiments, the thermally conductive adhesive layer 250 can have a Young's Modulus in a range of from about 0.01 MPa to about 20 MPa, about 0.5 MPa to about 10 MPa, less than, equal to, or greater than about 0.01 MPa, 0.1 MPa, 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, 10, 10.5, 11, 11.5, 12, 12.5, 13, 13.5, 14, 14.5, 15, 15.5, 16, 16.5, 17, 17.5, 18, 18.5, 19, 19.5, or about 20 MPa. In some such embodiments, the thermally conductive adhesive layer 250 can include matrix formed of a polymer or combination of polymers in addition to a thermally conductive additive (e.g., carbon). For example, the thermally conductive adhesive layer 250 can include a styrenic block copolymer, a thermoplastic polyolefin elastomer, a thermoplastic vulcanizate, a thermoplastic polyurethane, a thermoplastic copolyester, a thermoplastic polyamide, a silicone rubber, an ethylene propylene diene monomer rubber, copolymers thereof, or mixtures thereof. A thickness of the thermally conductive adhesive layer 250 can be in a range of from about 0.1 mm to about 5 mm, about 0.5 mm to about 2 mm, less than, equal to, or greater than about 0.1 mm, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, 4, 4.1, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9, or about 5 mm.

[0040] In embodiments, the material of the thermally conductive adhesive layer 250 is chosen to provide sufficient bonding strength to retain the OLED display panel 240 and the cover glass substrate 232 in the elastically bent state against the frame 245. As will be understood, the OLED display panel 240 and the cover glass substrate 232 will apply a force to the thermally conductive adhesive layer 250, resulting in bending-induced stresses being present in the thermally conductive adhesive layer 250. The material of the thermally conductive adhesive layer 250 may be selected to have a bonding strength (e.g., measured via ASTM D1876) that is greater than the bending-induced stresses. Alternatively or additionally, the material of the thermally conductive adhesive layer 250 may be selected to provide a bonding strength that is sufficient so that the display withstands overlap shear failure as determined by modified test method ASTM DI 002- 10 (where one metal layer in the stack is replaced with the cover glass substrate 232) and tensile failure as determined by ASTM D897 at both interfaces (e.g., with both the frame 245 and the flexible substrate 248 of the OLED display panel 240) over an operating temperature range (e.g., from 0°C to 65°C).

[0041] In embodiments, the thermally conductive adhesive layer 250 is formed of a pressure sensitive thermal interface tape comprising a foam central layer with adhesive layers on both surfaces of the foam. Suitable example thermally conductive interface tape include, but are not limited to 3M™ Thermally Conductive Interface Tape 8926-05, 3M™ Thermally Conductive Adhesive Transfer Tape 8810, and 3M™ Thermally Conductive Adhesive Transfer Tape 8820. In embodiments, the thermally conductive adhesive layer 250 is initially applied to one of the frame 250 and the OLED display panel 240 as a liquid and subsequently cured using any suitable method (e.g., radiation exposure, drying). Suitable liquid adhesives that may be used for the thermally conductive adhesive layer 250 include 3M™ Thermally Conductive Epoxy Adhesive TC-2810, Loctite® SI 5404, Masterbond® EP5TC-80.

[0042] A benefit of the thermally conductive adhesive layer 250 being selected to be able to retain the combined stack of the OLED display panel 240 and cover glass substrate 232 in the elastically bent state is that the need for additional adhesives can be reduced or eliminated. In the embodiment shown in FIGS. 2-3, for example, the thermally conductive adhesive layer 250 is the sole adhesive responsible for retaining the OLED display panel 240 in the elastically bent state. Put differently, the thermally conductive adhesive layer 250 is the sole adhesive (other than the optically clear adhesive 242) containing stresses therein from the OLED display panel 240 and the cover glass substrate 232 being in the elastically bent state. In embodiments, thermally conductive adhesive layer 250 can be the only adhesive present between the frame 245 and the OLED display panel 240 (without any intervening layers) containing stresses induced from the bending of the OLED display panel 240 and cover glass substrate 232 in the cold-forming process.

[0043] Certain existing implementations of cold-formed displays rely on structural adhesives directly adhered to the cover glass substrate 232 outside of a peripheral edge 241 of the OLED display panel 240. Such designs suffer from drawbacks in that they limit the area over which the structural adhesive can be applied (e.g., at a peripheral portion of the second major surface 236), resulting in relatively high stresses therein from the cold-formed cover glass. In the embodiment depicted in FIGS. 2-3, the thermally conductive adhesive layer 250 can be located completely rearward of the OLED display panel 240, and therefore not obstruct any image from being viewed through the cover glass substrate 232. As a result, the thermally conductive adhesive layer 250 can be deposited over a relatively large portion of the surface area of a bonding surface (or “rear surface”) 243 of the OLED display panel 240. Inembodiments, the thermally conductive adhesive layer 250 can be disposed on at least 50%, at least 60%, at least 70%, at least 80%, at least 90%, or even 100% of the bonding surface 243. Such dispersal of the thermally conductive adhesive layer 250 can lower the amount of stress that the adhesive is exposed to from the cold-forming and provide flexibility in terms of the materials that can be used for the thermally conductive adhesive layer 250.

[0044] FIG. 4 schematically depicts an overlap between the thermally conductive adhesive layer 250 and the second major surface 236 of the cover glass substrate 232. The overlap can occur in a direction perpendicular to the second major surface 236. FIG. 4 represents a projection of a front surface of the thermally conductive adhesive layer 250 depicted in FIGS. 2-3 onto the second major surface 236 (i.e., points in the thermally conductive adhesive layer 250 intersecting normal vectors of the second major surface 236 were translated on such normal vectors until reaching the second major surface 236). In embodiments, the minor surfaces 238 of the cover glass substrate 232 are coincident with the outer peripheral edge 241 of the OLED display panel 240 (see FIG. 2). Such a construction enables the thermally conductive adhesive layer 250 to completely overlap the second major surface 236, such that a gap G between an outer edge 254 of the thermally conductive adhesive layer 205 is minimal or 0 mm, such that the thermally conductive adhesive layer 250 overlaps at least 80% of a surface area of the second major surface 236 in a direction perpendicular to the second major surface 236. In some embodiments, the thermally conductive adhesive layer 250 overlaps 100% of a surface area of the second major surface 236. This maximal overlap minimizes cold-bent portions of the cover glass substrate 232 that are unsupported by the thermally conductive adhesive layer 250, reducing the chance of delamination. In embodiments, the gap G can be non-zero to aid in assembly, but can be less than 5 mm, less than 4 mm, less than 3 mm, less than 2 mm, or even less than 1 mm. In embodiments, despite not including any adhesives disposed radially outward of the peripheral edge 241 bonded directly to the cover glass substrate 232, the frame 250 may extend outward of the minor surfaces 238 to provide protection for the edges of the cover glass substrate 232 from impacts.

[0045] In embodiments, the thermally conductive adhesive layer 250 can have a non- uniform composition. Referring still to FIG. 4, in embodiments, the thermally conductive adhesive layer 250 can include first portion 256 and a second portion 258. The first portion 256 can be formed of a first thermally conductive adhesive and the second portion 258 can be formed of a second thermally conductive adhesive that is different from the first thermallyconductive adhesive. The first and second thermally conductive adhesives can be different types of thermally conductive adhesive. For example, in embodiments, the first thermally conductive adhesive forming the first portion 256 can be a pressure sensitive thermal interface tape while the second thermally conductive adhesive forming the second portion 258 can be a thermally conductive adhesive that is initially deposited as a liquid and cured around the first thermally conductive adhesive.

[0046] In the example shown in FIG. 4, the second portion 258 at least partially surrounds (or completely surrounds) the first portion 256. Such a construction can beneficially facilitate fabricating the display 230 efficiently, because the pressure sensitive thermally conductive interface tape making up the first portion 256 can be used to provide an initial tack strength to retain the OLED display panel 240 and cover glass substrate 232 in the elastically bent state with minimal curing time. The liquid adhesive making up the second portion 258 can then be applied around the first portion 256 and be cured while the OLED display panel 240 and the cover substrate 232 are held in the bent state by the adhesive of the first portion 256. Such a process allows external forces applied to the cover glass substrate 232 and OLED display panel 240 (e.g., applied via a vacuum chuck) to be removed prior to the second thermally conductive adhesive completely curing, which frees up production line resources and improves process efficiency. The thermally conductive adhesive of the second portion 258, once cured, can provide a bond of improved durability over the lifetime of the display 230 than the pressure sensitive adhesive of the first portion 256 (e.g., the bonding strength of the second portion 258 can degrade at a smaller rate than the first portion 256). Use of a combination of types of adhesives can thus provide both a durable long-term bond while also streamlining the manufacturing process.

[0047] FIGS. 5A-5C schematically depict cross-sectional views of the OLED display 230 during various stages of a cold-forming process, according to an example embodiment. At a step 500, the OLED display panel 240 is adhered to the cover glass substrate 232 via the optically clear adhesive 242 to form a combined stack 502 (the optically clear adhesive 242 may be cured while the cover glass substrate 232 and OLED display panel 240 are in a noncurved state). As depicted in FIG. 5 A, the combined stack 502 may be aligned with a forming structure 504 (e.g., a vacuum chuck, mold, or other suitable structure) including a curved surface 506. In embodiments, the curved surface 506 includes a geometry desired of the first major surface 234 (see FIG. 2) of the cover glass substrate 232 after cold-forming.

[0048] As shown in FIG. 5B, at a step 508, after alignment with the forming structure 504, a bending force is applied to one or more of the cover glass substrate 232 and the OLED display panel 240 along a direction of the arrow 510 to bring at least a portion of the first major surface 234 into contact with the curved surface 506 (or any intermediate layers disposed thereon), thereby bending the cover glass substrate 232 and the OLED display panel 240. The bending force may be applied using any suitable technique (e.g., a clamp, a vacuum, mold, distribution of actuators). As shown in FIG. 5C, after the combined stack 502 is placed into an elastically bent state, at a step 512, the thermally conductive adhesive layer 250 is deposited on one of the OLED display panel 240 and a curved support surface 247 of the frame 245. The thermally conductive adhesive layer 250 may be applied by a suitable means given the material chosen (e.g., a pressure sensitive tape can be pressed onto the OLED display panel 240 or frame 245 after being cut to a desired size, a liquid adhesive can be applied via a suitable dispenser). After the thermally conductive adhesive layer 250 is applied to one of the OLED display panel 240 and the frame 245, the frame 245 can be aligned with the combined stack 502 and pressed against the OLED display panel 240 so that the thermally conductive adhesive layer 250 is disposed between the frame 245 and the OLED display panel 240. The force in the direction of the arrow 210 (see FIG. 5B) can be applied until the thermally conductive adhesive layer 250 is cured via a suitable technique (e.g., application of pressure, exposure to radiation, heated, dried at room temperature). As described herein, after the thermally conductive adhesive layer 250 is cured, the rigidity of the frame 245, in conjunction with the bonding strength of the thermally conductive adhesive layer 250, is able to retain the combined stack 502 in the elastically bent state without the application of any external force.

[0049] In embodiments where the thermally conductive adhesive layer 250 includes a pressure sensitive adhesive (e.g., a suitable thermal interface tape), it is contemplated that it may be necessary to form air pressure outlets in the thermally conductive adhesive layer 250 prior to bonding the combined stack 502 to the frame 245. For example, FIG. 5D schematically depicts the combined stack 502 from the perspective of the bonding surface 243 (see FIG. 3) of the OLED display panel 240, according to an example embodiment. In FIG. 5D, the bonding surface 243 is completely covered by the thermally conductive adhesive layer 250, so only the thermally conductive adhesive layer 250 is visible. The thermally conductive adhesive layer 250 is a film of thermal interface tape that is adhered to the bonding surface 243 (see FIG. 3) prior to being adhered to the frame 245. As shown, the thermally conductive adhesive layer 250 includes a plurality of air pressure outlets 270 formed therein. Each of the plurality of airpressure outlets 270 can be a localized area where a thickness of the thermally conductive adhesive layer 250 is reduced as compared to adjacent areas of the thermally conductive adhesive layer 250. For example, each of the plurality of air pressure outlets 270 can be a groove, channel, or conduit formed in a side of the thermally conductive adhesive layer 250 that is eventually adhered to the frame 245. Each of the plurality of air pressure outlets 270 can be a localized depression of reduced thickness of the thermally conductive adhesive layer 250. It is believed that such areas of reduced thickness provide airgaps when the pressure sensitive adhesive layer 250 is pressed against the frame 245, and that such airgaps allow air bubbles to be dissipated as the combined stack 502 is pressed against the frame 245 and the adhesive cures. Reducing air bubbles in the thermally conductive adhesive layer 250 beneficially maximizes contact between he frame 245 and the material of the thermally conductive adhesive 250, which maximizes heat transfer to the frame 245. Including the plurality of air pressure outlets 270 can therefore facilitate the frame 245 effectively serving as a heat sink in some implementations.

[0050] The plurality of air pressure outlets 270 can take a variety of forms. FIG. 5E depicts a cross-sectional view of an example one of the plurality of air pressure outlets 270. As shown, the air pressure outlet 270 is a channel comprising side walls 272 and a bottom surface 274. The bottom surface 274 is disposed a depth 278 from an adhering surface 276 of the thermally conductive adhesive layer 250. The adhering surface 276 may initially contact the frame 245 when the combined stack 502 is pressed against the frame 245 after the thermally conductive adhesive layer 250 is applied thereto. In embodiments, the depth 278 is greater than or equal to 1 pm and less than or equal to 50 pm, greater than or equal to 1 pm and less than or equal to 25 pm, greater than or equal to 1 pm and less than or equal to 20 pm, greater than or equal to 1 pm and less than or equal to 15 pm, or even greater than or equal to 1 pm and less than or equal to 10 pm. In such embodiments, the depth 272 can be generally less than 10% of a maximum thickness of the thermally conductive adhesive layer 250 (in film form prior to adhesion), and more preferably less than 5% of the maximum thickness. Providing a depth 278 of such values facilitates providing space for air bubble dissipation, yet maintains properties of the thermally conductive adhesive layer 250 to facilitate handling during production processes. While the example shown in FIG. 5E has a parallelepiped-shaped cross- sectional area, it should be understood that the plurality of air pressure outlets 270 can have a variety of forms and that the geometry need not be uniform over the entirety of the feature.

[0051] Referring again to FIG. 5D, in embodiments, adjacent ones of the plurality air pressure outlets 270 can be separated by a minimum separation distance 280. The minimum separation distance 280 can represent a minimum linear distance (parallel to the adhering surface 276) separating distinct ones of the plurality of air pressure outlets 270. The minimum separation distance 280 should generally be less than a size of anticipated air bubbles that may be generated in the thermally conductive adhesive layer 250 when the combined stack 502 is pressed against the frame 245. It is believed that maintaining the minimum separation distance 280 to less than 10 mm, more preferably less than 8 mm, more preferably less than 5 mm, and even more preferably less 2.5 mm should provide sufficient coverage to allow dissipation of any air bubble throughout the adhering surface 276. In embodiments, the minimum separation distance 280 can range from .01 mm to 8 mm. As a result of the plurality of air pressure outlets 270, when a portion of the thermally conductive adhesive layer 250 includes a pressure sensitive thermal interface tape, that portion may include no air bubbles having a maximum linear dimension greater than 5 mm formed therein.

[0052] The plurality of air pressure outlets 270 can be arranged in any suitable pattern. In the example shown in FIG. 5D, the plurality of air pressure outlets 270 is a uniform distribution of parallel linear channels formed in the adhering surface 276. The linear channels can extend parallel to a bending axis around which the curved surface 506 (see FIG. 5 A) is bent, when the combined stack 502 is aligned with the forming structure 204. Alternatively, the linear channels can extend perpendicular to the bending axis. In embodiments, a grid of plurality of air pressure outlets 270 can be included, with individual outlets extending in different directions. In embodiments, the air pressure outlets 270 may not extend in straight lines and / or may not be uniformly distributed over the adhering surface. The plurality of air pressure outlets 270 can be formed in the thermally conductive adhesive layer 250 using any suitable technique (e.g., die cutting, laser ablation).

[0053] In embodiments, rather than incorporating the plurality of air pressure outlets 270 as distinct channels in the thermally conductive adhesive layer 250, the adhering surface 276 can be roughened to have a relatively high surface roughness as compared to un-roughened versions of the thermal interface tape. Such high surface roughness can provide pathways to suitably dissipate air bubbles. The term “air pressure outlets” herein includes any surface of sufficient roughness to eliminate the formation of air bubbles when an OLED display panel is adhered to a frame.

[0054] While the preceding example includes the thermally conductive adhesive layer 250, embodiments are also envisioned where the thermally conductive adhesive layer 250 is omitted, so that there are no layers having a thermal conductivity greater than 5 W*m'1*K'1between the OLED display panel and the frame. FIG. 6 schematically depicts the OLED display 230 in accordance with such an embodiment. Like reference numerals with FIGS. 2-3 are used in FIG. 6 to signify the incorporation of like components. As shown, at least a portion of the rear surface 243 of the OLED display panel 240 is in direct physical contact with the curved support surface 247 of the frame 245. Such direct contact facilitates the OLED display panel 240 transferring heat to the frame 245 and the frame 245 dissipating the heat. The embodiment depicted in FIG. 6 incorporates a support structure 600 other than the frame 245. The support structure 600 mechanically couples the frame 245 to at least one of the cover glass substrate 232 and the OLED display panel 240 to retain the OLED display panel 240 and cover glass substrate 232 in the elastically bent state. In embodiments, the support structure 600 is adhered to one the first and second major surfaces 234 and 236 of the cover glass substrate 232 to retain the OLED display panel 240 and cover glass substrate 232 in the elastically bent state (e.g., the support structure 600 can be a rigid frame that circumferentially surrounds the OLED display panel 240 and is secured to the frame 245). In embodiments, the support structure 600 circumferentially surrounds at least a portion of the OLED display panel 240 and / or the cover glass substrate 232 and comprises a retention feature (e.g., notch, groove, or the like) that engages with a peripheral edge of at least one of the cover glass substrate 232 and the OLED display panel 240 to retain them in a curved shape.

[0055] In embodiments without the thermally conductive adhesive layer 250 (such as the embodiment depicted in FIG. 6), the frame 245 may not be directly adhered to the OLED display panel 240. A benefit of such an arrangement is that thermally-induced stresses can be avoided. When the frame 245 receives heat generated by the OLED display panel 240, the frame 245 may be heated, which may lead to thermal expansion that can cause stress in any adhesives between the frame 245 and the OLED display panel 240. Preventing such heating- induced stresses can improve the longevity of the OLED display 230.Cover Glass Substrate Properties

[0056] In the following paragraphs, various geometrical, mechanical, and strengthening properties of the cover glass substrate 232 as well as compositions of the cover glass substrate 232 are provided. Referring to FIG. 7, the cover glass substrate 232 has a thickness T1 that issubstantially constant over the width and length of the cover glass substrate 232 (e.g., excluding curved comers or variations from other surface treatments) and is defined as a distance between the first major surface 234 and the second major surface 236. In various embodiments, T1 may refer to a maximum thickness of the cover glass substrate 232. In addition, the cover glass substrate 232 includes a width W1 defined as a first maximum dimension of one of the first or second major surfaces 234, 236 orthogonal to the thickness Tl, and a length LI defined as a second maximum dimension of one of the first or second major surfaces 234, 236 orthogonal to both the thickness and the width. In other embodiments, W1 and LI may be the average width and the average length of the cover glass substrate 232, respectively, and in other embodiments, W1 and LI may be the maximum width and the maximum length of the cover glass substrate 232, respectively (e.g., for glass substrates 232 having a variable width or length).

[0057] In various embodiments, thickness Tl is 2 mm or less. In particular, the thickness Tl is from 0.30 mm to 2.0 mm. For example, thickness Tl may be in a range from about 0.05 mm to about 2.0 mm, from about 0.10 mm to about 2.0 mm, from about 0.20 mm to about 2.0 mm, from about 0.40 mm to about 2.0 mm, from about 0.50 mm to about 2.0 mm, from about 0.60 mm to about 2.0 mm, from about 0.70 mm to about 2.0 mm, from about 0.80 mm to about 2.0 mm, from about 0.90 mm to about 2.0 mm, from about 1.0 mm to about 2.0 mm, from about 1.1 mm to about 2.0 mm, from about 1.2 mm to about 2.0 mm, from about 1.3 mm to about 2.0 mm, from about 1.4 mm to about 2.0 mm, from about 1.5 mm to about 2.0 mm, from about 0.30 mm to about 1.9 mm, from about 0.30 mm to about 1.8 mm, from about 0.30 mm to about 1.7 mm, from about 0.30 mm to about 1.6 mm, from about 0.30 mm to about 1.5 mm, from about 0.30 mm to about 1.4 mm, from about 0.30 mm to about 1.4 mm, from about 0.30 mm to about 1.3 mm, from about 0.30 mm to about 1.2 mm, from about 0.30 mm to about 1.1 mm, from about 0.30 mm to about 1.0 mm, from about 0.30 mm to about 0.90 mm, from about 0.30 mm to about 0.80 mm, from about 0.30 mm to about 0.70 mm, from about 0.30 mm to about 0.60 mm, or from about 0.30 mm to about 0.40 mm. In other embodiments, the Tl falls within any one of the exact numerical ranges set forth in this paragraph.

[0058] In various embodiments, width W1 is in a range from 5 cm to 250 cm, from about 10 cm to about 250 cm, from about 15 cm to about 250 cm, from about 20 cm to about 250 cm, from about 25 cm to about 250 cm, from about 30 cm to about 250 cm, from about 35 cm to about 250 cm, from about 40 cm to about 250 cm, from about 45 cm to about 250 cm, fromabout 50 cm to about 250 cm, from about 55 cm to about 250 cm, from about 60 cm to about 250 cm, from about 65 cm to about 250 cm, from about 70 cm to about 250 cm, from about 75 cm to about 250 cm, from about 80 cm to about 250 cm, from about 85 cm to about 250 cm, from about 90 cm to about 250 cm, from about 95 cm to about 250 cm, from about 100 cm to about 250 cm, from about 110 cm to about 250 cm, from about 120 cm to about 250 cm, from about 130 cm to about 250 cm, from about 140 cm to about 250 cm, from about 150 cm to about 250 cm, from about 5 cm to about 240 cm, from about 5 cm to about 230 cm, from about 5 cm to about 220 cm, from about 5 cm to about 210 cm, from about 5 cm to about 200 cm, from about 5 cm to about 190 cm, from about 5 cm to about 180 cm, from about 5 cm to about 170 cm, from about 5 cm to about 160 cm, from about 5 cm to about 150 cm, from about 5 cm to about 140 cm, from about 5 cm to about 130 cm, from about 5 cm to about 120 cm, from about 5 cm to about 110 cm, from about 5 cm to about 110 cm, from about 5 cm to about 100 cm, from about 5 cm to about 90 cm, from about 5 cm to about 80 cm, or from about 5 cm to about 75 cm. In other embodiments, W1 falls within any one of the exact numerical ranges set forth in this paragraph.

[0059] In various embodiments, length LI is in a range from about 5 cm to about 2500 cm, from about 5 cm to about 2000 cm, from about 4 to about 1500 cm, from about 50 cm to about 1500 cm, from about 100 cm to about 1500 cm, from about 150 cm to about 1500 cm, from about 200 cm to about 1500 cm, from about 250 cm to about 1500 cm, from about 300 cm to about 1500 cm, from about 350 cm to about 1500 cm, from about 400 cm to about 1500 cm, from about 450 cm to about 1500 cm, from about 500 cm to about 1500 cm, from about 550 cm to about 1500 cm, from about 600 cm to about 1500 cm, from about 650 cm to about 1500 cm, from about 650 cm to about 1500 cm, from about 700 cm to about 1500 cm, from about 750 cm to about 1500 cm, from about 800 cm to about 1500 cm, from about 850 cm to about 1500 cm, from about 900 cm to about 1500 cm, from about 950 cm to about 1500 cm, from about 1000 cm to about 1500 cm, from about 1050 cm to about 1500 cm, from about 1100 cm to about 1500 cm, from about 1150 cm to about 1500 cm, from about 1200 cm to about 1500 cm, from about 1250 cm to about 1500 cm, from about 1300 cm to about 1500 cm, from about 1350 cm to about 1500 cm, from about 1400 cm to about 1500 cm, or from about 1450 cm to about 1500 cm. In other embodiments, LI falls within any one of the exact numerical ranges set forth in this paragraph.

[0060] In various embodiments, one or more radius of curvature (e.g., R shown in FIG. 2) of cover glass substrate 232 is about 50 mm or greater. For example, R may be in a range from about 50 mm to about 10,000 mm, from about 60 mm to about 10,000 mm, from about 70 mm to about 10,000 mm, from about 80 mm to about 10,000 mm, from about 90 mm to about 10,000 mm, from about 100 mm to about 10,000 mm, from about 120 mm to about 10,000 mm, from about 140 mm to about 10,000 mm, from about 150 mm to about 10,000 mm, from about 160 mm to about 10,000 mm, from about 180 mm to about 10,000 mm, from about 200 mm to about 10,000 mm, from about 220 mm to about 10,000 mm, from about 240 mm to about 10,000 mm, from about 250 mm to about 10,000 mm, from about 260 mm to about 10,000 mm, from about 270 mm to about 10,000 mm, from about 280 mm to about 10,000 mm, from about 290 mm to about 10,000 mm, from about 300 mm to about 10,000 mm, from about 350 mm to about 10,000 mm, from about 400 mm to about 10,000 mm, from about 450 mm to about 10,000 mm, from about 500 mm to about 10,000 mm, from about 550 mm to about 10,000 mm, from about 600 mm to about 10,000 mm, from about 650 mm to about 10,000 mm, from about 700 mm to about 10,000 mm, from about 750 mm to about 10,000 mm, from about 800 mm to about 10,000 mm, from about 900 mm to about 10,000 mm, from about 950 mm to about 10,000 mm, from about 1000 mm to about 10,000 mm, from about 1250 mm to about 10,000 mm, from about 50 mm to about 1400 mm, from about 50 mm to about 1300 mm, from about 50 mm to about 1200 mm, from about 50 mm to about 1100 mm, from about 50 mm to about 1000 mm, from about 50 mm to about 950 mm, from about 50 mm to about 900 mm, from about 50 mm to about 850 mm, from about 50 mm to about 800 mm, from about 50 mm to about 750 mm, from about 50 mm to about 700 mm, from about 50 mm to about 650 mm, from about 50 mm to about 600 mm, from about 50 mm to about 550 mm, from about 50 mm to about 500 mm, from about 50 mm to about 450 mm, from about 50 mm to about 400 mm, from about 50 mm to about 350 mm, from about 50 mm to about 300 mm, or from about 50 mm to about 250 mm. In other embodiments, R falls within any one of the exact numerical ranges set forth in this paragraph.

[0061] The various embodiments of the vehicle interior system may be incorporated into vehicles such as trains, automobiles (e.g., cars, trucks, buses and the like), sea craft (boats, ships, submarines, and the like), and aircraft (e.g., drones, airplanes, jets, helicopters and the like).Strengthened Glass Properties

[0062] The cover glass substrate 232 used in the OLED display 230 may be strengthened. In one or more embodiments, cover glass substrate 232 may be strengthened to include compressive stress (CS) that extends from a surface to a depth of compression (DOC). The compressive stress regions are balanced by a central portion exhibiting a tensile stress. At the DOC, the stress crosses from a positive (compressive) stress (CS) to a negative (tensile) stress.

[0063] In various embodiments, cover glass substrate 232 may be strengthened mechanically by utilizing a mismatch of the coefficient of thermal expansion between portions of the article to create a compressive stress region and a central region exhibiting a tensile stress. In some embodiments, the cover glass substrate 232 may be strengthened thermally by heating the glass to a temperature above the glass transition point and then rapidly quenching.

[0064] In various embodiments, cover glass substrate 232 may be chemically strengthened by ion exchange. In the ion exchange process, ions at or near the surface of the cover glass substrate 232 are replaced by - or exchanged with - larger ions having the same valence or oxidation state. In those embodiments in which the cover glass substrate 232 comprises an alkali aluminosilicate glass, ions in the surface layer of the article and the larger ions are monovalent alkali metal cations, such as Li+, Na+, K+, Rb+, and Cs+. Alternatively, monovalent cations in the surface layer may be replaced with monovalent cations other than alkali metal cations, such as Ag+or the like. In such embodiments, the monovalent ions (or cations) exchanged into the glass substrate generate a stress.

[0065] CS is measured using those means known in the art, such as by surface stress meter (FSM) using commercially available instruments such as the FSM-6000, manufactured by Orihara Industrial Co., Ltd. (Japan). Surface stress measurements rely upon the accurate measurement of the stress optical coefficient (SOC), which is related to the birefringence of the glass. SOC in turn is measured by those methods that are known in the art, such as fiber and four point bend methods, both of which are described in ASTM standard C770-98 (2013), entitled “Standard Test Method for Measurement of Glass Stress-Optical Coefficient,” the contents of which are incorporated herein by reference in their entirety, and a bulk cylinder method. As used herein CS may be the “maximum compressive stress” which is the highest compressive stress value measured within the compressive stress layer. In some embodiments, the maximum compressive stress is located at the surface of the cover glass substrate 232. Inother embodiments, the maximum compressive stress may occur at a depth below the surface, giving the compressive profile the appearance of a “buried peak.”

[0066] DOC may be measured by FSM or by a scattered light polariscope (SCALP) (such as the SCALP-04 scattered light polariscope available from Glasstress Ltd., located in Tallinn Estonia), depending on the strengthening method and conditions. When the cover glass substrate 232 is chemically strengthened by an ion exchange treatment, FSM or SCALP may be used depending on which ion is exchanged into the cover glass substrate 232. Where the stress in the cover glass substrate 232 is generated by exchanging potassium ions into the glass substrate, FSM is used to measure DOC. Where the stress is generated by exchanging sodium ions into the cover glass substrate 232, SCALP is used to measure DOC. Where the stress in the cover glass substrate 232 is generated by exchanging both potassium and sodium ions into the glass, the DOC is measured by SCALP, since it is believed the exchange depth of sodium indicates the DOC and the exchange depth of potassium ions indicates a change in the magnitude of the compressive stress (but not the change in stress from compressive to tensile); the exchange depth of potassium ions in such glass substrates is measured by FSM. Central tension or CT is the maximum tensile stress and is measured by SCALP.

[0067] In one or more embodiments, the cover glass substrate 232 may be strengthened to exhibit a DOC that is described as a fraction of the thickness T1 of the cover glass substrate 232 (as described herein). For example, in one or more embodiments, the DOC may be equal to or greater than about 0.05T1, equal to or greater than about 0.2T1, or equal to or greater than about 0.3 Tl. In one or more embodiments, the DOC may be about 40 pm or greater (e.g., from about 30 pm to about 300 pm, from about 50 pm to about 300 pm, from about 40 pm to about 220 pm, or from about 40 pm to about 100 pm). In other embodiments, DOC falls within any one of the exact numerical ranges set forth in this paragraph. In one or more embodiments, the strengthened cover glass substrate 232 may have a CS (which may be found at the surface or a depth within the cover glass substrate 232) of about 200 MPa or greater, 300 MPa or greater, 400 MPa or greater, about 500 MPa or greater, about 600 MPa or greater, about 700 MPa or greater, about 800 MPa or greater, about 900 MPa or greater, about 930 MPa or greater, about 1000 MPa or greater, or about 1050 MPa or greater.

[0068] In one or more embodiments, the strengthened cover glass substrate 232 may have a maximum tensile stress or central tension (CT) of about 20 MPa or greater, about 30 MPa or greater, about 40 MPa or greater, about 45 MPa or greater, about 50 MPa or greater, about 60MPa or greater, about 70 MPa or greater, about 75 MPa or greater, about 80 MPa or greater, or about 85 MPa or greater. In some embodiments, the maximum tensile stress or central tension (CT) may be in a range from about 40 MPa to about 100 MPa.

[0069] Suitable glass compositions for use in cover glass substrate 232 include soda lime glass, aluminosilicate glass, borosilicate glass, boroaluminosilicate glass, alkali-containing aluminosilicate glass, alkali-containing borosilicate glass, and alkali-containing boroaluminosilicate glass.

[0070] Embodiments of the present disclosure can be further understood in view of the following aspects:

[0071] An aspect (1) of the present disclosure pertains to a display. The display includes a cover glass substrate comprising a first major surface and a second major surface. The display further includes an optically clear adhesive disposed on the second major surface. The display further includes an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive. The display further includes a frame configured to retain the cover glass substrate and the OLED display panel in an elastically bent state. The frame comprises a thermal conductivity greater than or equal to 15 W*m'1*K'1and is configured to dissipate heat generated by the OLED display panel. At least one of: (a) the frame is in direct contact with the OLED display panel; or (b) a thermally conductive adhesive layer is disposed between the OLED display panel and the frame, with the thermally conductive adhesive layer being the only layer between the frame and the OLED display panel having a thermal conductivity greater than 0.05 W*m'1*K'1, wherein the thermally conductive adhesive layer is the sole adhesive layer responsible for retaining the OLED display panel in the elastically bent state.

[0072] An aspect (2) of the present disclosure pertains to a display according to the aspect (1), wherein the frame comprises a curved support surface against which the OLED display panel is retained so that cover glass substrate and the OLED display panel are in the elastically bent state.

[0073] An aspect (3) of the present disclosure pertains to a display according to the aspect (2), wherein the OLED display panel is in direct physical contact with the curved support surface to transfer heat to the frame.

[0074] An aspect (4) of the present disclosure pertains to a display according to the aspect (1), wherein: the display comprises the thermally conductive adhesive layer between the frame and the OLED display panel, and the thermally conductive adhesive layer comprises stresses therein from retaining the OLED display panel and the cover glass substrate in the elastically bent state.

[0075] An aspect (5) of the present disclosure pertains to a display according to the aspect(4), wherein the thermally conductive adhesive layer comprises a first portion formed of a thermal interface tape and a second portion at least partially surrounding the first portion, wherein the second portion is formed of a thermally conductive adhesive that is not a thermal interface tape.

[0076] An aspect (6) of the present disclosure pertains to a display according to the aspect(5), wherein the thermally conductive adhesive layer is the only adhesive outside of the OLED display panel containing stresses therein from the OLED display panel and the cover glass substrate being in the elastically bent state other than the optically clear adhesive.

[0077] An aspect (7) of the present disclosure pertains to a display according to any of the aspects (4)-(6), wherein the cover glass substrate is not adhered to the frame at any location disposed outward of a peripheral edge of the OLED display panel.

[0078] An aspect (8) of the present disclosure pertains to a display according to the aspect (7), wherein the frame does not extend outward of the peripheral edge.

[0079] An aspect (9) of the present disclosure pertains to a display according to any of the aspects (4)-(8), wherein the thermally conductive adhesive layer overlaps at least 80% of a surface area of the second major surface in a direction perpendicular to the second major surface.

[0080] An aspect (10) of the present disclosure pertains to a display according to any of the aspects (1 )-(9), wherein: the cover glass substrate comprises a thickness that is greater than or equal to 0.4 mm and less than or equal to 1.1 mm, and the cover glass substrate is retained in the elastically bent state such that the first major surface exhibits a minimum radius of curvature that is greater than or equal to 100 mm and less than or equal to 10,000 mm.

[0081] An aspect (11) of the present disclosure pertains to a display comprising: a cover glass substrate comprising a first major surface and a second major surface; an optically clearadhesive disposed on the second major surface; an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive; a frame comprising a curved support surface; and a thermally conductive adhesive layer disposed between the OLED display panel and the curved support surface, wherein: the thermally conductive adhesive layer and the frame retain the OLED display panel and cover glass substrate in an elastically bent state, the thermally conductive adhesive layer comprises a thermal conductivity that is greater than or equal to 0.05 W*m'1*K'1, and the thermally conductive adhesive layer has the highest thermal conductivity of any layer disposed between a flexible substrate of the OLED display panel and the curved support surface.

[0082] An aspect (12) of the present disclosure pertains to a display according to the aspect (10), wherein the thermally conductive adhesive layer is the sole adhesive contacting the frame that prevents the OLED display panel and the glass cover substrate from returning to an unbent state.

[0083] An aspect (13) of the present disclosure pertains to a display according to any of the aspects ( 10)-(l 2), wherein the cover glass substrate is not adhered to the frame at any location disposed outward of a peripheral edge of the OLED display panel.

[0084] An aspect (14) of the present disclosure pertains to a display according to the aspect (13), wherein the frame does not extend outward of the peripheral edge.

[0085] An aspect (15) of the present disclosure pertains to a display according to any of the aspects (10)-(14), wherein the thermally conductive adhesive layer overlaps at least 80% of a surface area of the second major surface in a direction perpendicular to the second major surface.

[0086] An aspect (16) of the present disclosure pertains to a display according to any of the aspects (10)-(l 5), wherein: the cover glass substrate comprises a thickness that is greater than or equal to 0.4 mm and less than or equal to 1.1 mm, and the cover glass substrate is retained in the elastically bent state such that the first major surface exhibits a minimum radius of curvature that is greater than or equal to 100 mm and less than or equal to 10,000 mm.

[0087] An aspect (17) of the present disclosure pertains to a display according to any of the aspects ( 10)-(l 6), wherein the frame comprises a thermal conductivity greater than or equal to 15 W*m'1*K'1and is configured to dissipate heat generated by the OLED display panel.

[0088] An aspect (18) of the present disclosure pertains to a display according to any of the aspects (10)-(17), wherein the thermally conductive adhesive layer comprises a first portion formed of a thermal interface tape and a second portion at least partially surrounding the first portion, wherein the second portion is formed of a thermally conductive adhesive that is not a thermal interface tape.

[0089] An aspect (19) of the present disclosure pertains to a display comprising: a cover glass substrate comprising a first major surface and a second major surface; an optically clear adhesive disposed on the second major surface; an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive; and a frame comprising a curved support surface, wherein: the OLED display panel is retained against the curved support surface of the frame such that the OLED display panel and the cover glass substrate are in an elastically bent state, and there are no layers having a thermal conductivity greater than 5 W*m'1*K'1between the OLED display panel and the frame.

[0090] An aspect (20) of the present disclosure pertains to a display according to the aspect(17), wherein at least a portion of the OLED display panel is in direct physical contact with the curved support surface.

[0091] An aspect (21) of the present disclosure pertains to a display according to the aspect(18), wherein an entirety of a rear surface of the OLED display panel is in direct physical contact with the curved support surface.

[0092] An aspect (22) of the present disclosure pertains to a display according to any of the aspects ( 17)-(l 9), wherein the frame comprises a thermal conductivity greater than or equal to 15 W*m'1*K'1and is configured to dissipate heat generated by the OLED display panel.

[0093] An aspect (23) of the present disclosure pertains to a method of fabricating a display comprising: adhering an OLED display panel to a cover glass substrate with a layer of optically clear adhesive to form a combined stack; applying a bending force to the combined stack to place the combined stack in an elastically bent state; and while the combined stack is in an elastically bent state, engaging the combined stack with a frame so that the frame retains the combined stack in the elastically bent state when the bending force is no longer applied to the combined stack, wherein: the frame comprises a thermal conductivity greater than or equal to 15 W*m'1*K'1and is configured to dissipate heat generated by the OLED display panel, and after engaging the combined stack with the frame, at least one of: (a) the frame is in directcontact with the OLED display panel; and (b) a thermally conductive adhesive layer is disposed between the OLED display panel and the frame, with the thermally conductive adhesive layer being the only layer between the frame and the OLED display panel having a thermal conductivity greater than 0.05 W*m'1*K'1, such that the thermally conductive adhesive layer is the sole adhesive layer responsible for retaining the OLED display panel in the elastically bent state.

[0094] An aspect (24) of the present disclosure pertains to a method according to the aspect(23), wherein the engaging the combined stack with the frame comprises: disposing the thermally conductive adhesive layer on the OLED display panel so that an adhering surface of the thermally conductive adhesive layer is exposed; and pressing the adhering surface against a curved surface of the frame so that the frame is adhered to the curved surface and the thermally conductive adhesive layer retains the combined stack in the elastically bent state.

[0095] An aspect (25) of the present disclosure pertains to a method according to the aspect(24), wherein, prior to being pressed against the curved surface, the adhering surface comprises a plurality of air pressure outlets formed therein.

[0096] An aspect (26) of the present disclosure pertains to a method according to the aspect(25), wherein each of the plurality of air pressure outlets is a channel having a maximum depth that is greater than or equal to 1 pm and less than or equal to 25 pm.

[0097] An aspect (27) of the present disclosure pertains to a method according to any of the aspects (25)-(26), wherein adjacent ones of the plurality of air pressure outlets are separated from one another by a minimum separation distance that is less than 5 mm.

[0098] Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order. Accordingly, where a method claim does not actually recite an order to be followed by its steps or it is not otherwise specifically stated in the claims or descriptions that the steps are to be limited to a specific order, it is in no way intended that any particular order be inferred. In addition, as used herein, the article "a" is intended to include one or more than one component or element, and is not intended to be construed as meaning only one.

[0099] It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit or scope of the disclosed embodiments. Sincemodifications, combinations, sub-combinations and variations of the disclosed embodiments incorporating the spirit and substance of the embodiments may occur to persons skilled in the art, the disclosed embodiments should be construed to include everything within the scope of the appended claims and their equivalents.

Claims

What is claimed is:

1. A display comprising: a cover glass substrate comprising a first major surface and a second major surface; an optically clear adhesive disposed on the second major surface; an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive; and a frame configured to retain the cover glass substrate and an OLED display panel in an elastically bent state, wherein: the frame comprises a thermal conductivity greater than or equal to 15 W*m' 1 *!<■' and is configured to dissipate heat generated by the OLED display panel, and at least one of:(a) the frame is in direct contact with the OLED display panel; and(b) a thermally conductive adhesive layer is disposed between the OLED display panel and the frame, with the thermally conductive adhesive layer being the only layer between the frame and the OLED display panel having a thermal conductivity greater than 0.05 W*m'1*K'1, wherein the thermally conductive adhesive layer is the sole adhesive layer responsible for retaining the OLED display panel in the elastically bent state.

2. The display of claim 1, wherein the frame comprises a curved support surface against which the OLED display panel is retained so that the cover glass substrate and the OLED display panel are in the elastically bent state.

3. The display of claim 2, wherein the OLED display panel is in direct physical contact with the curved support surface to transfer heat to the frame.

4. The display of claim 1, wherein: the display comprises the thermally conductive adhesive layer between the frame and the OLED display panel, and the thermally conductive adhesive layer comprises stresses therein from retaining the OLED display panel and the cover glass substrate in the elastically bent state.

5. The display of claim 4, wherein the thermally conductive adhesive layer comprises a first portion formed of a thermal interface tape and a second portion at least partially surrounding the first portion, wherein the second portion is formed of a thermally conductive adhesive that is not a thermal interface tape.

6. The display of any of claims 4-5, wherein the thermally conductive adhesive layer is the only adhesive layer outside of the OLED display panel containing stresses therein from the OLED display panel and the cover glass substrate being in the elastically bent state, other than the optically clear adhesive.

7. The display of any of claims 4-6, wherein the cover glass substrate is not adhered to the frame at any location disposed outward of a peripheral edge of the OLED display panel.

8. The display of claim 7, wherein the frame does not extend outward of the peripheral edge.

9. The display of any of claims 4-8, wherein the thermally conductive adhesive layer overlaps at least 80% of a surface area of the second major surface in a direction perpendicular to the second major surface.

10. The display of any of claims 1-9, wherein: the cover glass substrate comprises a thickness that is greater than or equal to 0.4 mm and less than or equal to 1.1 mm, and the cover glass substrate is retained in the elastically bent state such that the first major surface exhibits a minimum radius of curvature that is greater than or equal to 100 mm and less than or equal to 10,000 mm.

11. A display comprising: a cover glass substrate comprising a first major surface and a second major surface; an optically clear adhesive disposed on the second major surface; an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive; a frame comprising a curved support surface; and a thermally conductive adhesive layer disposed between the OLED display panel and the curved support surface, wherein: the thermally conductive adhesive layer and the frame retain the OLED display panel and cover glass substrate in an elastically bent state, the thermally conductive adhesive layer comprises a thermal conductivity that is greater than or equal to 0.05 W*m'1*K'1, and the thermally conductive adhesive layer has the highest thermal conductivity of any layer disposed between a flexible substrate of the OLED display panel and the curved support surface.

12. The display of claim 11, wherein the thermally conductive adhesive layer is the sole adhesive layer contacting the frame that prevents the OLED display panel and the glass cover substrate from returning to an un-bent state.

13. The display of any of claims 11-12, wherein the cover glass substrate is not adhered to the frame at any location disposed outward of a peripheral edge of the OLED display panel.

14. The display of claim 13, wherein the frame does not extend outward of the peripheral edge.

15. The display of any of claims 11-14, wherein the thermally conductive adhesive layer overlaps at least 80% of a surface area of the second major surface in a direction perpendicular to the second major surface.

16. The display of any of claims 11-15, wherein: the cover glass substrate comprises a thickness that is greater than or equal to 0.4 mm and less than or equal to 1.1 mm, andthe cover glass substrate is retained in the elastically bent state such that the first major surface exhibits a minimum radius of curvature that is greater than or equal to 100 mm and less than or equal to 10,000 mm.

17. The display of any of claims 11-16, wherein the frame comprises a thermal conductivity greater than or equal to 15 W*m'1*K'1and is configured to dissipate heat generated by the OLED display panel.

18. The display of any of claims 11-17, wherein the thermally conductive adhesive layer comprises a first portion formed of a thermal interface tape and a second portion at least partially surrounding the first portion, wherein the second portion is formed of a thermally conductive adhesive that is not a thermal interface tape.

19. A display comprising: a cover glass substrate comprising a first major surface and a second major surface; an optically clear adhesive disposed on the second major surface; an organic light emitting diode (“OLED”) display panel adhered to the second major surface by the optically clear adhesive; and a frame comprising a curved support surface, wherein: the OLED display panel is retained against the curved support surface of the frame such that the OLED display panel and the cover glass substrate are in an elastically bent state, and there are no layers having a thermal conductivity greater than 5 W*m'1*K'1between the OLED display panel and the frame.

20. The display of claim 19, wherein at least a portion of the OLED display panel is in direct physical contact with the curved support surface.

21. The display of claim 20, wherein an entirety of a rear surface of the OLED display panel is in direct physical contact with the curved support surface.

22. The display of any of claims 19-21, wherein the frame comprises a thermal conductivity greater than or equal to 15 W*m'1*K'1and is configured to dissipate heat generated by the OLED display panel.

23. A method of fabricating a display comprising adhering an OLED display panel to a cover glass substrate with a layer of optically clear adhesive to form a combined stack; applying a bending force to the combined stack to place the combined stack in an elastically bent state; and while the combined stack is in an elastically bent state, engaging the combined stack with a frame so that the frame retains the combined stack in the elastically bent state when the bending force is no longer applied to the combined stack, wherein: the frame comprises a thermal conductivity greater than or equal to 15 W*m' 1 *!<■' and is configured to dissipate heat generated by the OLED display panel, and after engaging the combined stack with the frame, at least one of:(a) the frame is in direct contact with the OLED display panel; and(b) a thermally conductive adhesive layer is disposed between the OLED display panel and the frame, with the thermally conductive adhesive layer being the only layer between the frame and the OLED display panel having a thermal conductivity greater than 0.05 W*m'1*K'1, such that the thermally conductive adhesive layer is the sole adhesive layer responsible for retaining the OLED display panel in the elastically bent state.

24. The method of claim 23, wherein the engaging the combined stack with the frame comprises: disposing the thermally conductive adhesive layer on the OLED display panel so that an adhering surface of the thermally conductive adhesive layer is exposed; and pressing the adhering surface against a curved surface of the frame so that the frame is adhered to the curved surface and the thermally conductive adhesive layer retains the combined stack in the elastically bent state.

25. The method of claim 24, wherein, prior to being pressed against the curved surface, the adhering surface comprises a plurality of air pressure outlets formed therein.

26. The method of claim 25, wherein each of the plurality of air pressure outlets is a channel having a maximum depth that is greater than or equal to 1 pm and less than or equal to 25 pm.

27. The method of claim 25, wherein adjacent ones of the plurality of air pressure outlets are separated from one another by a minimum separation distance that is less than 5 mm.

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