Display panel and display device

Abstract

The present disclosure provides a display panel and a display device. A base substrate (100) of the display panel comprises a display area (AA) and a first bonding area (11) located on at least one side of the display area (AA), and the first bonding area (11) is configured to bind a driving chip (20). The first bonding area (11) comprises a first bonding sub-area (110), a second bonding sub-area (120), and a third bonding sub-area (130) sequentially arranged in a first direction. The second bonding sub-area (120) is provided with at least one second pad group, the second pad group comprises a plurality of second pads (121) arranged at intervals in a second direction, the second pads (121) have no signal input or output, and at least two second pads (121) have different heights.

Description

Display panel and display device Cross-reference to related applications

[0001] This application claims priority to Chinese patent application No. 202411194795.4, filed on August 28, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0003] Silicon-based organic light-emitting diode (OLED) display panels possess characteristics such as high brightness, high contrast, high resolution, high integration, low response time, and low power consumption, making them widely used in virtual reality and augmented reality fields. The pixel driving circuits and display driver ICs (DDICs) of silicon-based OLED display panels can use the same or different silicon substrates. When using different silicon substrates, the driver chip can be fabricated using high-precision processes, which is beneficial for achieving larger-size, high-refresh-rate silicon-based products. However, a bonding process is required to attach the driver chip to the display panel. Because both the display panel and the driver chip are rigid materials, and there is a gap between the bonding areas, the driver chip is subjected to pressure during bonding and use, making it prone to cracking and chip breakage. Summary of the Invention

[0004] This disclosure provides a display panel and display device with some embodiments that can effectively improve the above-mentioned problems.

[0005] In a first aspect, some embodiments of this disclosure provide a display panel, including: a substrate, the substrate including a display area and a first bonding area located on at least one side of the display area, the first bonding area being configured to bond a driver chip; the first bonding area including: a first sub-bonding area, a second sub-bonding area and a third sub-bonding area arranged sequentially along a first direction; the first sub-bonding area having at least one first pad group, the first pad group including a plurality of first pads spaced apart along a second direction, the second direction intersecting the first direction, the first pads being configured to receive signals output by the driver chip; the second sub-bonding area having at least one second pad group, the second pad group including a plurality of second pads spaced apart along the second direction, the second pads having no signal input or output, at least two second pads having different heights, the height being the distance between the surface of the second pad away from the substrate and the opposite bottom surface of the substrate along a direction perpendicular to the bottom surface of the substrate; and the third sub-bonding area having at least one third pad group, the third pad group including a plurality of third pads spaced apart along the second direction, the third pads being configured to transmit external signals to the driver chip.

[0006] In some exemplary embodiments, along the second direction, the height of each second pad included in the same second pad group changes in the following trend: first increasing and then decreasing.

[0007] In some exemplary embodiments, within the same second pad group, the height of the second pad first increases in a stepwise manner along the second direction, and then decreases in a stepwise manner; wherein, the height of each second pad is a height change step, the heights of adjacent second pads are different, or, every two or more adjacent second pads correspond to a height change step, and the heights of the second pads corresponding to the same height change step are approximately the same.

[0008] In some exemplary embodiments, the second sub-bonding area is provided with a plurality of second pad groups, which are arranged sequentially at intervals along the first direction. The height of the second pads in the same row along the first direction is the same, or the height of the second pads in the same row gradually decreases from the end closer to the display area to the end farther from the display area.

[0009] In some exemplary embodiments, for second pads of different heights, in the direction perpendicular to the bottom surface of the substrate, the distance between the surface of the second pad closest to the substrate and the bottom surface of the substrate facing it is the same, and the thickness of the second pad is different; or, the distance between the surface of the second pad closest to the substrate and the bottom surface of the substrate facing it is different, and the thickness of the second pad is the same; or, the distance between the surface of the second pad closest to the substrate and the bottom surface of the substrate facing it is different, and the thickness of the second pad is different.

[0010] In some exemplary embodiments, in the second sub-binding region, the higher the height of the second pad, the smaller the distance between two adjacent second pads.

[0011] In some exemplary embodiments, for the same second pad group, the height of the second pad changes with a trend of first increasing and then decreasing along the second direction, and the distance between adjacent second pads changes with a trend of first decreasing and then increasing along the second direction.

[0012] In some exemplary embodiments, the second sub-bonding area is provided with a plurality of second pad groups, which are arranged sequentially at intervals along the first direction. From one end closer to the display area to the other end farther from the display area, the height of the second pads in the same row gradually decreases, while the distance between adjacent second pads gradually increases.

[0013] In some exemplary embodiments, for the same second pad group, the distance between adjacent second pads exhibits a trend of first decreasing and then increasing along the second direction.

[0014] In some exemplary embodiments, in the same second pad group, the distance between adjacent second pads decreases stepwise along the second direction and then increases stepwise; wherein, the distance between each pair of adjacent second pads is a distance change step, or, three or more adjacent second pads correspond to a distance change step, and the distance between each pair of adjacent second pads corresponding to the same distance change step is approximately the same.

[0015] In some exemplary embodiments, the spacing between two adjacent second pads is greater than the spacing between two adjacent first pads along the same direction.

[0016] In some exemplary embodiments, along the first direction, the spacing between the second sub-binding area and the first and third sub-binding areas is less than 20% of the width of the first binding area.

[0017] In some exemplary embodiments, along the second direction, the distance between two adjacent first pads is a first distance, the distance between two adjacent second pads is a second distance, and the ratio between the second distance and the first distance is 1.6 to 4.

[0018] In some exemplary embodiments, the second distance is 140–340 μm.

[0019] In some exemplary embodiments, the first sub-bonding area is provided with a plurality of first pad groups arranged at intervals along the first direction, and the second sub-bonding area is provided with a plurality of second pad groups arranged at intervals along the first direction. Along the first direction, the distance between two adjacent first pads is a third distance, and the distance between two adjacent second pads is a fourth distance, wherein the ratio between the fourth distance and the third distance is 1.9 to 3.4.

[0020] In some exemplary embodiments, the fourth distance is 140–240 μm.

[0021] In some exemplary embodiments, the substrate further includes: a second bonding region located on the side of the first bonding region away from the display area, configured to bond a flexible circuit board, the second bonding region having at least one fourth pad group, the fourth pad group including a plurality of fourth pads spaced apart along the second direction, the fourth pads being electrically connected to the third pad.

[0022] Secondly, some embodiments of this disclosure provide a display device, including: a driver chip and the display panel described in the first aspect above, wherein the driver chip is bonded to a first bonding area of ​​the display panel.

[0023] The above description is merely an overview of the technical solutions provided by the embodiments of this disclosure. In order to better understand the technical means of the embodiments of this disclosure and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this disclosure more apparent and understandable, specific implementation methods of the embodiments of this disclosure are described below. Attached Figure Description

[0024] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the embodiments disclosed herein. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0025] Figure 1 shows a schematic diagram of the structure of a display device according to some embodiments of the present disclosure;

[0026] Figure 2 shows a plan view of a display panel according to some embodiments of the present disclosure;

[0027] Figure 3 shows a planar schematic diagram of a driver chip according to some embodiments of the present disclosure;

[0028] Figure 4 shows a schematic diagram of the arrangement of the first sub-binding area according to some embodiments of this disclosure;

[0029] Figure 5 shows a schematic diagram of the arrangement of the second sub-binding area according to some embodiments of this disclosure;

[0030] Figure 6 shows a schematic diagram of the arrangement of the third sub-binding area in some embodiments of this disclosure;

[0031] Figure 7 shows a schematic diagram of the structure of a display panel after warping according to some embodiments of the present disclosure;

[0032] Figure 8A shows a cross-sectional schematic diagram of a display panel according to some embodiments of the present disclosure;

[0033] Figure 8B shows a schematic diagram of the height variation of the second pad in some embodiments of this disclosure;

[0034] Figure 8C shows a schematic diagram of the height variation of the second pad in some other embodiments of this disclosure;

[0035] Figure 9 shows a schematic diagram of the bonding between the display panel in Figure 8B and the driver chip after warping.

[0036] Figure 10 shows a cross-sectional schematic diagram of a display panel according to other embodiments of the present disclosure;

[0037] Figure 11 shows a cross-sectional schematic diagram of a display panel according to some embodiments of the present disclosure;

[0038] Figure 12 shows a schematic diagram of the bonding between the display panel and the driver chip in Figure 7;

[0039] Figure 13A shows a schematic diagram of the arrangement distance of the second pads in some embodiments of this disclosure;

[0040] Figure 13B shows a schematic diagram of the arrangement distance of the second pads in some other embodiments of this disclosure;

[0041] Figure 13C shows a schematic diagram of the arrangement distance of the second pads in some embodiments of this disclosure;

[0042] Figure 14 shows a schematic diagram of the bonding between the display panel and the driver chip after warping in the 13C.

[0043] Figure 15 shows a stacked schematic diagram of display panels according to some embodiments of the present disclosure; and

[0044] Figure 16 shows a schematic diagram of the BB section of Figure 13. Detailed Implementation

[0045] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0046] It should be noted that the term "at least one" in this article includes one or more cases, while the terms "at least two" and "multiple" include two or more cases. Words such as "including" or "contains" mean that the element or object preceding the word covers the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "up," "down," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] As used herein, “about,” “approximately,” “basically,” and “approximately” include the values ​​stated and the average values ​​within an acceptable range of deviation from a particular value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0048] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0049] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0050] This disclosure provides a display device through several embodiments. For example, the display device can be a display module, mobile phone, laptop computer, tablet computer, augmented reality (AR) device, virtual reality (VR) device, wearable device, monitor, television set, digital photo frame, or any other product or component with display functionality. Of course, the display device provided in this disclosure is not limited to the types listed above.

[0051] Referring to Figure 1, the display device 1000 described above may include a display panel 10. The display panel 10 may be, for example, an OLED display panel, or a quantum dot organic light-emitting diode (QLED) display panel.

[0052] As shown in Figure 1, the display device 1000 may further include a driver chip 20, which is bonded to the display panel 10 and configured to provide display driving signals to the display panel 10. For example, the display driving signals may include gate driving signals and data signals. The gate driving signals may include clock signals, initialization voltage signals, and reset signals.

[0053] As shown in Figure 1, the display device 1000 may further include a flexible circuit board 30, which is bonded to the display panel 10 and configured to transmit external signals to the driver chip 20. For example, the external signals may include voltage signals and display signals.

[0054] In some embodiments of this disclosure, the display panel 10 includes a substrate 100. For example, the substrate 100 is a rigid substrate, and exemplaryly, it can be a silicon substrate. Referring to FIG2, the substrate 100 includes a display area AA and a first bonding area 11 located on at least one side of the display area AA, the first bonding area 11 being configured to bond a driver chip 20. For example, the distance between the first bonding area 11 and the display area AA can be greater than 500 μm.

[0055] The first binding area 11 includes a first sub-binding area 110, a second sub-binding area 120, and a third sub-binding area 130 arranged sequentially along a first direction. The first sub-binding area 110 is closer to the display area AA than the third sub-binding area 130.

[0056] The first sub-bonding area 110 is provided with at least one first pad group, which includes a plurality of first pads 111 spaced apart along a second direction. The first pads 111 are connected to circuitry in the display panel 10 and configured to receive signals output by the driver chip 20 and transmit them to the circuitry in the display panel 10. The second sub-bonding area 120 is provided with at least one second pad group, which includes a plurality of second pads 121 spaced apart along a second direction. The second pads 121 have no signal input or output; that is, the second pads 121 are dummy pads used to increase support for the driver chip 20. The third sub-bonding area 130 is provided with at least one third pad group, which includes a plurality of third pads 131 spaced apart along a second direction. The third pads 131 are configured to transmit external signals to the driver chip 20.

[0057] The second direction intersects with the first direction. Since the shape of the first bonding area 11 is adapted to the shape of the driver chip 20, and since the driver chip 20 is usually elongated, the first bonding area 11 can also be elongated, including a long side and a short side. Therefore, the first direction can be the direction of the short side extension, and the second direction can be the direction of the long side extension. For example, the first bonding area 11 can be located at the bottom border of the display panel 10 shown in Figure 2, the first direction can be the Y-axis direction in Figure 2, and the second direction can be the X-axis direction in Figure 2.

[0058] It should be noted that the shapes of the first pad 111, the second pad 121, and the third pad 131 in Figure 2 are merely examples. Besides the square shape shown in Figure 2, pads can also be other shapes, such as circles or polygons, and this disclosure does not impose any limitations on this. Furthermore, each sub-binding area in Figure 2 (including the first sub-binding area 110, the second sub-binding area 120, and the third sub-binding area 130) only illustrates one pad group. In actual implementation, the number of pad groups set in each sub-binding area can be determined according to actual needs.

[0059] When the substrate 100 is a silicon substrate, the bonding between the driver chip 20 and the first bonding area 11 of the display panel 10 is a wafer-to-wafer bonding. The driver chip 20 is generally wider than 2 mm and longer than 21–35 mm. For such a wide, elongated driver chip 20, mechanical stress exists during bonding with the rigid display panel 10, which can easily lead to the driver chip 20 being crushed. Therefore, by adding a second sub-bonding area 120 for mechanical support and connection, and setting dummy pads in the second sub-bonding area 120, the contact area between the driver chip 20 and the display panel 10 can be increased. Increased contact area between the driver chip 20 and the display panel 10 reduces the gap in the middle, thereby improving the problem of uneven stress and enhancing the mechanical characteristics of the silicon-based display module.

[0060] To further ensure that the second pad 121 of the second sub-bonding area 120 can provide better support, some embodiments of this disclosure have designed the size and spacing of the second pad 121. These embodiments are described below.

[0061] It is understood that the driver chip 20 typically includes an input region and an output region located near the chip edge. The input region includes multiple input bumps, and the output region includes multiple output bumps. The first sub-binding region 110 is correspondingly configured with respect to the output region, and the third sub-binding region 130 is correspondingly configured with respect to the input region. To minimize the gap in the middle region, the distance between the second sub-binding region 120 and the first sub-binding region 110 and the third sub-binding region 130 should not be too large.

[0062] In some embodiments, the width of the driver chip 20 is greater than 2 mm, and the pads (including the first pad 111, the second pad 121, and the third pad 131) on the display panel 10 are slightly larger than the bumps on the driver chip 20 used for bonding with the pads, to ensure good electrical contact and reduce impedance, which is beneficial for transmitting high-speed signals. In this case, along the first direction, the width of the first bonding area 11 is also slightly larger than the width of the driver chip 20, for example, it can be greater than 2.5 mm. Experimental verification shows that a spacing of less than 500 μm between adjacent pads can achieve a good support effect. Based on this, in some embodiments, along the first direction, the spacing between the second sub-bonding area 120 and the first sub-bonding area 110 and the third sub-bonding area 130 can be less than 20% of the width of the first bonding area 11, to ensure that the gap between adjacent second pads 121 and the first pad 111 and the gap between adjacent second pads 121 and the third pad 131 in the first direction are not too wide, which is beneficial for improving the stress uniformity of the driver chip 20 in the first direction.

[0063] It should be noted that the distance between the second sub-binding area 120 and the first sub-binding area 110 in the first direction is the distance between the first boundary line of the second sub-binding area 120 and the second boundary line of the first sub-binding area 110. The distance between the second sub-binding area 120 and the third sub-binding area 130 in the first direction can be the distance between the second boundary line of the second sub-binding area 120 and the first boundary line of the third sub-binding area 130. Specifically, the second boundary line of the first sub-binding area 110 can be the lower boundary line of the first pad group closest to the second sub-binding area 120. The first boundary line of the second sub-binding area 120 can be the upper boundary line of the second pad group closest to the first sub-binding area 110. The second boundary line of the second sub-binding area 120 can be the lower boundary line of the second pad group closest to the third sub-binding area 130. The first boundary line of the third sub-binding area 130 can be the upper boundary line of the third pad group closest to the second sub-binding area 120. Here, the boundary line of the pad group (including the first pad group, the second pad group, and the third pad group) on the side closer to the display area AA is called the upper boundary line, and the boundary line on the side farther away from the display area AA is called the lower boundary line.

[0064] Considering that the second pad 121 does not transmit signals, there is no strict requirement for its number of arrangements compared to the first pad 111 and the third pad 131; it only needs to provide support for the driver chip 20. In some embodiments, along the same direction, the spacing between two adjacent second pads 121 can be greater than the spacing between two adjacent first pads 111 to reduce process complexity. Correspondingly, the pitch between two adjacent second pads 121 is also greater than the pitch between two adjacent first pads 111. It should be noted that the spacing between two adjacent pads refers to the distance between the interval regions of the two adjacent pads, while the pitch between two adjacent pads is the distance between the center points of the two adjacent pads, or the distance between the same side of the two adjacent pads.

[0065] To distinguish them, along the second direction, the distance between two adjacent first pads 111 can be referred to as the first distance, and the distance between two adjacent second pads 121 can be referred to as the second distance. In some embodiments, the ratio between the second distance and the first distance can be 1.6 to 4, for example, 1.6, 2.8, or 4. For example, when the first distance is 87 μm, the second distance can be 140 to 340 μm. This ensures the support performance of the second pads 121 in the second direction while reducing the risk of short circuits.

[0066] In some embodiments, the first sub-bonding area 110 is provided with a plurality of first pad groups arranged at intervals along a first direction, and the second sub-bonding area 120 is provided with a plurality of second pad groups arranged at intervals along the first direction. Along the first direction, the distance between two adjacent first pads 111 can be referred to as the third distance, and the distance between two adjacent second pads 121 can be referred to as the fourth distance.

[0067] In some embodiments, the ratio between the fourth distance and the third distance is 1.9 to 3.4, for example, it can be 1.9, 2.6, or 3.4. For example, when the third distance is 72 μm, the fourth distance can be 140 to 240 μm. This ensures the support performance of the second pad 121 in the first direction while reducing the risk of short circuits.

[0068] In some embodiments, the size of the second pad 121 may be approximately the same as the size of the first pad 111 and the third pad 131. If the size of the first pad 111 differs from the size of the third pad 131, the size of the second pad 121 may be the same as the larger of the three. For example, if the first pad 111, second pad 121, and third pad 131 are all square, and the size of the first pad 111 is smaller than the size of the third pad 131 to allow for more first pads 111 to be placed to meet signal transmission requirements, then the size of the second pad 121 may be the same as the size of the third pad 131.

[0069] In some embodiments, several dummy pads may also be provided on the two side edge areas of the first sub-binding area 110 and the third sub-binding area 130 to serve as mechanical connections without signal transmission, thereby reducing the risk that the bonding process will affect the effective signal transmission.

[0070] The driver chip 20 is bonded to the first bonding area 11. Referring to FIG3, in some embodiments of this disclosure, the driver chip 20 includes a first sub-connection area 210, a second sub-connection area 220, and a third sub-connection area 230. For example, the driver chip 20 is elongated, including a long side and a short side, and the first sub-connection area 210, the second sub-connection area 220, and the third sub-connection area 230 are sequentially spaced along the extension direction of the short side of the driver chip 20. The first sub-connection area 210 includes a first bump 211 corresponding to a first pad 111, the second sub-connection area 220 includes a second bump 221 corresponding to a second pad 121, and the third sub-connection area 230 includes a third bump 231 corresponding to a third pad 131. The second bump 221 is a dummy bump, which serves a mechanical support function and has no electrical connection with the circuitry arranged within the driver chip 20.

[0071] It should be noted that the arrangement of the first bump 211 in the driver chip 20 corresponds to the arrangement of the first pad 111 in the display panel 10, the arrangement of the second bump 221 in the driver chip 20 corresponds to the arrangement of the second pad 121 in the display panel 10, and the arrangement of the third bump 231 in the driver chip 20 corresponds to the arrangement of the third pad 131 in the display panel 10.

[0072] In some embodiments, when the bump size on the driver chip 20 is slightly smaller than the size of the corresponding pad, corresponding to the arrangement of the second sub-bonding area 120, along the extension direction of the short side of the driver chip 20, the spacing between the second sub-connection area 220 and the first sub-connection area 210 and the third sub-connection area 230 can be less than 25% of the width of the driver chip 20. This ensures that the gap between the added second bump 221 and the adjacent first bump 211 and third bump 231 is small, which is beneficial to improving the support performance of the added second sub-connection area 220.

[0073] In some embodiments, when the center of the bump on the driver chip 20 is aligned with the center of the corresponding pad, the orthographic projection of the bump on the silicon substrate is within the orthographic projection range of the corresponding pad on the silicon substrate. For example, the distance between the orthographic projection boundary of the bump and the orthographic projection boundary of the corresponding pad can be 5 to 10 μm.

[0074] The exemplary arrangement of the first sub-binding area 110, the second sub-binding area 120, and the third sub-binding area 130 of the display panel 10, and the first sub-connection area 210, the second sub-connection area 220, and the third sub-connection area 230 of the driver chip 20 will be described below.

[0075] In some embodiments, the first sub-binding area 110 may be provided with 1 to 15 first pad groups, for example, 1, 10 or 15. Each first pad group includes about 300 to 500 first pads 111, for example, it may include 300, 400 or 500.

[0076] For example, when multiple first pad groups are provided in the first sub-binding area 110, the multiple first pad groups can be arranged at an inclined and equal interval. The spacing between adjacent first pad groups can be the same, and the spacing between the first pads 111 in each first pad group in the second direction can be the same. Referring to Figure 4, the first sub-binding area 110 may include a first first pad group F1, a second first pad group F2, ..., an nth first pad group Fn arranged sequentially along the first direction Y. The (i+1)th first pad group is offset to the right compared to the ith first pad group, where i ranges from 1 to n-1. For example, the second first pad group F2 in Figure 4 is offset to the right by d1_1 compared to the first first pad group F1.

[0077] It is understandable that the arrangement of the first sub-connection area 210 can refer to the arrangement of the first sub-binding area 110. Each first bump 211 in the first sub-connection area 210 corresponds to a first pad 111 in the first sub-binding area 110, which will not be elaborated here.

[0078] As shown in Figure 4, in the second direction X, the length of the first pad 111 is denoted as x1, the spacing between adjacent first pads 111 is denoted as s_x1, and the pitch between adjacent first pads 111 is denoted as p_x1; in the first direction Y, the width of the first pad 111 is denoted as y1, the spacing between adjacent first pads 111 is denoted as s_y1, and the pitch between adjacent first pads 111 is denoted as p_y1.

[0079] Taking the example that the orthographic projection shape of the first bump 211 and the first pad 111 is square, along the long side extension direction of the driver chip 20, the length of the first bump 211 is 36μm, the spacing between adjacent first bumps 211 is 51μm, and the distance between adjacent first bumps 211 is 87μm. Along the short side extension direction of the driver chip 20, the width of the first bump 211 is 36μm, the spacing between adjacent first bumps 211 is 36μm, and the distance between adjacent first bumps 211 is 72μm. In this case, x1 in Figure 3 can be 46~56μm, y1 can be 46~56μm, p_x1 can be 87μm, s_x1 can be 32~41μm, p_y1 can be 72μm, and s_y1 can be 16~26μm.

[0080] Referring to Figure 5, in some embodiments, when multiple second pad groups are provided in the second sub-bonding area 120, the left edges of each second pad group can be flush in the second direction X. It should be noted that the three second pad groups S1, S2 and S3 shown in Figure 5 are only illustrative and do not limit the number of second pad groups. The number of second pad groups can be set according to the actual product requirements.

[0081] It is understandable that the arrangement of the second sub-connection area 220 can refer to the arrangement of the second sub-bonding area 120. Each second bump 221 in the second sub-connection area 220 corresponds to a second pad 121 in the second sub-bonding area 120, which will not be elaborated here.

[0082] As shown in Figure 5, in the second direction X, the length of the second pad 121 is represented by x2, the width by y2, the spacing between adjacent second pads 121 is represented by s_x2, and the pitch between adjacent second pads 121 is represented by p_x2; in the first direction Y, the spacing between adjacent second pads 121 is represented by s_y2, and the pitch between adjacent second pads 121 is represented by p_y2.

[0083] Taking a square shape as an example where the orthographic projection of the second bump 221 and the second pad 121 are both square, along the long side of the driver chip 20, the length of the second bump 221 is 40 μm, the spacing between adjacent second bumps 221 is 100–300 μm, and the distance between adjacent second bumps 221 is 140–340 μm. Along the short side of the driver chip 20, the width of the second bump 221 is 40 μm, the spacing between adjacent second bumps 221 is 100–200 μm, and the distance between adjacent second bumps 221 is 140–240 μm. In this case, x2 in Figure 5 can be 50–60 μm, y2 can be 50–60 μm, p_x2 can be 140–340 μm, p_y2 can be 140–240 μm, and s_x2 can be determined based on the values ​​of x2 and p_x2, and s_y2 can be determined based on the values ​​of y2 and p_y2.

[0084] In some embodiments, the third sub-binding area 130 is provided with a plurality of third pad groups. The spacing between adjacent third pad groups can be the same, and the spacing between the third pads 131 in each third pad group in the second direction can be the same. Referring to FIG6, the third sub-binding area 130 may include a first third pad group T1, a second third pad group T2, ..., a m-th first pad group Tm arranged sequentially along the first direction Y. The two side edges of the (j+1)-th third pad group extend beyond the two side edges of the j-th third pad group in the second direction X, where j is 1 to m-1, so that the third pads 131 located at the two side edges of the aforementioned m third pad groups are arranged in a figure-eight shape. For example, the distance by which the edge of the second third pad group T2 extends beyond the edge of the first third pad group T1 in FIG6 is denoted as d3_1.

[0085] It is understandable that the arrangement of the third sub-connection area 230 can refer to the arrangement of the third sub-binding area 130. Each third bump 231 in the third sub-connection area 230 corresponds to a third pad 131 in the third sub-binding area 130, which will not be elaborated here.

[0086] As shown in Figure 6, in the second direction X, the length of the third pad 131 is represented by x3, the width by y3, the spacing between adjacent third pads 131 is represented by s_x3, and the pitch between adjacent third pads 131 is represented by p_x3; in the first direction Y, the spacing between adjacent third pads 131 is represented by s_y3, and the pitch between adjacent third pads 131 is represented by p_y3.

[0087] Taking the example that the orthographic projection shape of the third bump 231 and the third pad 131 is square, along the long side extension direction of the driver chip 20, the length of the third bump 231 is 40μm, the spacing between adjacent third bumps 231 is 44-60μm, and the distance between adjacent third bumps 231 is 84-100μm. Along the short side extension direction of the driver chip 20, the width of the third bump 231 is 40μm, the spacing between adjacent third bumps 231 is 36-60μm, and the distance between adjacent third bumps 231 is 76-100μm. In this case, x3 in Figure 6 can be 50-60μm, y3 can be 50-60μm, p_x3 can be 84-100μm, p_y3 can be 76-100μm, and s_x3 can be determined based on the values ​​of x3 and p_x3, and s_y3 can be determined based on the values ​​of y3 and p_y3.

[0088] Based on the addition of the second sub-bonding area 120 to the display panel 10 and the addition of the second sub-connection area 220 corresponding to the second sub-bonding area 120 in the driver chip 20, the inventors discovered in the actual research process that due to the warping problem of the wafer, for example, the warping of the silicon-based display panel can reach about 180μm, and the arrangement spacing of the pads in the second sub-bonding area 120 is slightly larger than that of the first sub-bonding area 110 and the third bonding area, the bonding interface between the second sub-bonding area 120 and the second sub-connection area 220 has a significant height difference, as shown in Figure 7. This is not conducive to ensuring the support performance of the second sub-bonding area 120.

[0089] Therefore, in order to improve the aforementioned height difference, in some embodiments of this disclosure, the height of the second pad 121 in the display panel 10 has been adjusted, and these embodiments will be described below. Of course, in other embodiments, the height of the second bump 221 in the driver chip 20 can also be adjusted to improve the height uniformity of the bonding interface between the second sub-bonding area 120 and the second sub-connection area 220.

[0090] In some embodiments, at least two second pads 121 of the second sub-bonding region 120 have different heights. Referring to FIG8A, the height h of the second pad 121 refers to the distance between the surface of the second pad 121 away from the substrate 100 and the opposite bottom surface of the substrate 100 in a direction perpendicular to the bottom surface of the substrate 100. FIG8A illustrates the shape of the display panel 10 before warping, and only the height h of the second pad 121 located in the middle is marked in FIG8A as a schematic diagram of the height of the second pad 121. It should be noted that the heights of all the second pads 121 in FIG7 are approximately the same. For ease of distinction, the height of each second pad 121 in FIG7 is represented as h0.

[0091] It should also be noted that the height arrangement of the second pad 121 can be determined based on the warping of the display panel 10 in the actual application scenario and the position of the second sub-bonding area 120 on the display panel 10. This can compensate for the height difference caused by the warping of the display panel 10 to a certain extent, which helps to improve the height uniformity of the bonding interface between the second sub-bonding area 120 and the second sub-connection area 220, thereby improving the support performance of the second sub-bonding area 120.

[0092] Taking the warped shape shown in Figure 7 as an example, along the second direction X, the two ends of the display panel 10 are curved upwards relative to the middle. The second sub-bonding area 120 is located near the middle of the lower edge of the display panel 10. Some of the second pads 121 in the same second pad group are located in the left curved area of ​​Figure 7, some of the second pads 121 are located in the middle recessed area of ​​Figure 7, and some of the second pads 121 are located in the right curved area of ​​Figure 7. Accordingly, in some embodiments, along the second direction X, the height variation trend of each second pad 121 included in the same second pad group can be first increased and then decreased, as shown in Figure 8A. This is beneficial to improving the height uniformity of the bonding interface of the second sub-bonding area 120 after the display panel 10 warps as shown in Figure 7.

[0093] In some embodiments, the height of the second pads 121 in the same second pad group can first increase in a stepwise manner and then decrease in a stepwise manner. In one optional embodiment, the height of each second pad 121 can be a height variation step, with adjacent second pads 121 having different heights. In another optional embodiment, every two or more adjacent second pads 121 can correspond to a height variation step, and the heights of the second pads 121 corresponding to the same height variation step are approximately the same, to reduce process complexity. In yet another optional embodiment, a portion of the area can be configured with each second pad 121 having a height variation step, while another portion of the area can be configured with every two or more adjacent second pads 121 corresponding to a height variation step. In actual implementation, the height arrangement of the second pads 121 in the same second pad group can be designed according to the needs of the actual application scenario.

[0094] Referring to Figure 8B, taking nine second pads 121 located in the same second pad group as an example, the nine second pads 121 are represented from left to right as P1 to P9, with heights h1 to h9 respectively. The height of each second pad is a height variation step. From P1 to P5, the height increases stepwise, that is, h1 to h5 are five different height variation steps, and they increase sequentially. From P5 to P9, the height decreases stepwise, that is, h5 to h9 are five different height variation steps, and they decrease sequentially. Overall, the height shows a trend of first increasing stepwise and then decreasing stepwise. It should be noted that h1 to h4 and h6 to h9 can have the same height (for example, h4 and h6 can be the same, h3 and h7 can be the same), or they can not have the same height.

[0095] Referring to Figure 8C, taking 10 second pads 121 located in the same second pad group as an example, the 10 second pads 121 are represented from left to right as P1' to P10', with heights of h1' to h5' respectively. Each pair of adjacent second pads corresponds to a height change step, specifically: P1' and P2' correspond to a height change step, with P1' and P2' having the same height, represented as h1'; P3' and P4' correspond to a height change step, with P3' and P4' having the same height, represented as h2'; P5' and P6' correspond to a height change step, with P5' and P6' having the same height, represented as h3'; P7' and P8' correspond to a height change step, with P7' and P8' having the same height, represented as h4'; P9' and P10' correspond to a height change step, with P9' and P10' having the same height, represented as h5'. h1' to h3' represent three distinct height variation steps, increasing sequentially, while h3' to h5' represent three distinct height variation steps, decreasing sequentially. Overall, the height exhibits a trend of first increasing in a stepwise manner and then decreasing in a stepwise manner. It should be noted that h1' to h2' and h4' to h5' can have the same height (e.g., h2' and h4' can be the same, and h1' and h5' can be the same), or they may not have the same height.

[0096] Referring to Figure 9, the left and right sides of the display panel 10 curve upwards relative to the center. The height of the second pads 121 arranged in the edge areas on the left and right sides (h1 in Figure 9) is smaller than the height of the second pads 121 arranged in the center area (h2 in Figure 9), and the height of the second pads 121 gradually increases from the left and right edges to the center. This allows the bonding interface between each second pad 121 and the driver chip 20 to be approximately flush, which is beneficial to improving the support performance of the second sub-bonding area 120.

[0097] Of course, in other application scenarios, if the second sub-bonding area 120 is located near the left edge of the lower border of the display panel 10, and the second pads 121 included in the second pad group are all located to the left of the lowest recessed position of the display panel 10 in the second direction X, then along the second direction X (from left to right), the height variation trend of each second pad 121 included in the same second pad group can gradually increase, that is, the height of the second pad 121 closer to the lowest recessed position of the display panel 10 is higher, as shown in Figure 10. Conversely, if the second sub-bonding area 120 is located near the right edge of the lower border of the display panel 10, along the second direction X (from left to right), the height variation trend of each second pad 121 in the same second pad group can gradually decrease, that is, the height of the second pad 121 farther away from the lowest recessed position of the display panel 10 is lower, as shown in Figure 11.

[0098] Referring to Figures 10 and 11, taking nine second pads 121 located in the same second pad group as an example, the height of the nine second pads 121 gradually increases from left to right in Figure 10. From left to right in Figure 11, the height of the nine second pads 121 gradually decreases. It should be noted that Figures 10 and 11 illustrate the shape of the display panel 10 before warping.

[0099] In other words, the higher the display panel 10 is tilted upwards, the lower the height of the second pad 121 is set, in order to compensate for the height difference in the second direction caused by the warping of the display panel 10 to the bonding interface of each second pad 121.

[0100] When the second sub-bonding area 120 is provided with a plurality of second pad groups arranged sequentially at intervals along the first direction, the second pads 121 of the second sub-bonding area 120 are arranged in an array in the first and second directions. Based on this, in some embodiments, the height of the second pads 121 in the same row can gradually decrease from the end closer to the display area AA to the end farther away from the display area AA. Considering that the warping of the display panel 10 is usually that the edges are upturned relative to the middle, the gradual decrease in the height of the second pads 121 in the same row can compensate for the height difference caused by the warping of the display panel 10 to the bonding interface of each second pad 121 in the first direction, which is beneficial to make the bonding interface of each second pad 121 basically at the same height.

[0101] In other embodiments, considering that the width of the second sub-bonding area 120 in the first direction is relatively small, the height difference caused by the warping of the display panel 10 to the bonding interface of each second pad 121 in the first direction can be basically ignored. Therefore, the height of the second pads 121 in the same row along the first direction can also be the same to reduce manufacturing difficulty.

[0102] Various implementation methods can be used to adjust the height of the second pad 121. For example, in a first implementation, the height of the second pad 121 can be adjusted by adjusting its thickness. As shown in Figure 8A, the thickness t of the second pad 121 refers to the distance between the surface of the second pad 121 furthest from the substrate 100 and the surface closest to the substrate 100 along a direction perpendicular to the substrate 100. Figure 8A only shows the thickness of the second pad 121 located in the middle.

[0103] In a second embodiment, the height of the second pad 121 can be reduced or increased by providing grooves or protrusions in the film layer stacked below the second pad 121. It should be noted that by providing grooves or protrusions in the film layer stacked below the second pad 121, the distance between the surface of the second pad 121 closest to the substrate 100 and the bottom surface of the substrate 100 facing it can be changed, thereby adjusting the height of the second pad 121.

[0104] The first and second embodiments described above can be used separately or in combination. The exemplary embodiments corresponding to Figures 8A, 8B, 8C, 10, and 11 are illustrated using the adjustment of the thickness t of the second pad 121 as an example. Therefore, for second pads 121 with different heights, in the direction perpendicular to the bottom surface of the substrate 100, one of the following three relationships can be satisfied: First, the distance between the surface of the second pad 121 closest to the substrate 100 and the bottom surface of the substrate 100 directly opposite is the same, and the thickness t of the second pad 121 is different; second, the distance between the surface of the second pad 121 closest to the substrate 100 and the bottom surface of the substrate 100 directly opposite is different, and the thickness t of the second pad 121 is the same; third, the distance between the surface of the second pad 121 closest to the substrate 100 and the bottom surface of the substrate 100 directly opposite is different, and the thickness t of the second pad 121 is different.

[0105] In some embodiments, the second pad 121 may be disposed co-layered with at least one metal layer in the display panel 10. When the height of the second pad 121 is adjusted by adjusting its thickness, second pads 121 of different thicknesses can be fabricated by adjusting the number of metal layers contained within the second pad 121. Of course, in other embodiments, a separate photomask can be provided to fabricate second pads 121 of different thicknesses separately; this disclosure does not limit this.

[0106] In some embodiments, when the height of the second pad 121 is adjusted by changing the distance between the surface of the second pad 121 on the side closest to the substrate 100 and the bottom surface of the substrate 100 facing it, a pad layer is provided on at least one insulating layer directly below at least one second pad 121, such that the surface of the display panel 10 in contact with the lower surface of the second pad 121 has a protrusion, thereby raising the height of the second pad 121. The lower surface of the second pad 121 refers to the surface closest to the substrate 100. For example, the orthographic projection of the second pad 121 on the substrate 100 may be located within the orthographic projection range of the protrusion on the substrate 100.

[0107] In some embodiments, a groove is provided on the surface of at least one insulating layer directly below at least one second pad 121, away from the silicon substrate, so that the surface of the display panel 10 in contact with the lower surface of the second pad 121 has a recess, thereby reducing the height of the second pad 121. For example, the orthographic projection of the second pad 121 on the substrate 100 may be located within the orthographic projection range of the recess on the substrate 100.

[0108] In some embodiments, to reduce manufacturing difficulty, the second pads 121 may be evenly spaced in the second direction. When the second sub-bonding region 120 includes multiple groups of second pads, the second pads 121 may also be evenly spaced in the first direction.

[0109] Referring to Figure 12, if the display panel 10 warps as shown in Figure 7, the display panel 10 will be bonded to the driver chip 20. The gaps between the second pads 121 may exhibit the following height distribution: the gap height H is relatively high in the area near the center, and relatively low in the area near the edge. Based on this, considering that the anisotropic conductive film (ACF) 40 filled in the bonding process has a fixed thickness, in order to facilitate the filling and bonding of ACF 40, in some embodiments, the second pads 121 can be set at unequal intervals, with the area where the gap height H is higher having a smaller distance between adjacent second pads 121.

[0110] It should be noted that the higher the gap height H, the more ACF material can be accommodated in the direction perpendicular to the substrate 100; conversely, the lower the gap height H, the less ACF material can be accommodated in the direction perpendicular to the substrate 100 (as shown by the Z-axis in Figure 12). Therefore, in areas with relatively high gap height H, setting the distance between adjacent second pads 121 to be relatively small can reduce the area of ​​the gap in the XY plane. In areas with relatively low gap height H, setting the distance between adjacent second pads 121 to be relatively large can increase the area of ​​the gap in the XY plane. This ensures that the amount of ACF material that can be accommodated in each gap is basically the same, facilitating the filling of the gap between the driver chip 20 and the display panel 10 by the ACF 40, and helping to ensure the flatness of the bonding.

[0111] In some embodiments, for the same second pad group, the pitch of adjacent second pads 121 may exhibit a decreasing-then-increasing trend along the second direction. When the dimensions of each second pad 121 are the same, the spacing between adjacent second pads 121 exhibits the same trend as the pitch of adjacent second pads 121, that is, the spacing between adjacent second pads 121 also exhibits a decreasing-then-increasing trend along the second direction.

[0112] For example, the heights of the second pads 121 in the same second pad group can be approximately the same, and the distance between two adjacent second pads 121 located in the middle region is smaller than the distance between two adjacent second pads 121 located in the edge region. As shown in Figure 13A, the spacing between two adjacent second pads 121 from left to right is represented as s1, s2, s3, s4, s5, s6, s7, and s8, respectively. s4 and s5, which are closer to the middle, are relatively smaller, while s1 and s8, which are closer to the edge, are relatively larger, showing an overall trend of first decreasing and then increasing. It should be noted that Figure 13A also illustrates the state of the display panel 10 before warping.

[0113] In some embodiments, for the same second pad group, the distance between adjacent second pads 121 can decrease stepwise first and then increase stepwise along the second direction.

[0114] In one alternative implementation, the distance between every two adjacent second pads 121 can be a distance variation step. As shown in Figure 13A, each spacing is a distance variation step, with the spacing gradually decreasing from s1 to s5 and gradually increasing from s5 to s8.

[0115] In another alternative implementation, three or more adjacent second pads 121 can correspond to a distance variation step. The distance between any two adjacent second pads 121 corresponding to the same distance variation step is approximately the same to reduce the complexity of the process. As shown in Figure 13B, three adjacent second pads 121 correspond to a distance variation step, where s1' and s2' are the same, s3' and s4' are the same, s5' and s6' are the same, and s7' and s8' are the same, and s1' > s3' > s5', s5' < s7', showing an overall trend of first decreasing stepwise and then increasing stepwise.

[0116] In another alternative implementation, a portion of the area may be configured with a distance variation step for every two adjacent second pads 121, while another portion of the area may be configured with a distance variation step for every three or more adjacent second pads 121.

[0117] In actual implementation, the distance arrangement of two adjacent second pads 121 in the same second pad group can be designed according to the needs of the actual application scenario.

[0118] Considering that the height of the second pad 121 is also related to the gap height H, the higher the height of the second pad 121, the higher the gap height H will be. Therefore, in some embodiments, when the heights of at least two second pads 121 in the second sub-bonding area 120 are different, the distance between two adjacent second pads 121 can be smaller in areas where the height of the second pad 121 is higher.

[0119] At this time, the distance variation trend between two adjacent second pads 121 can be related to the height variation trend of the second pads 121. In some embodiments, when the height of the second pads 121 in the same second pad group shows a trend of first increasing and then decreasing along the second direction, the distance between adjacent second pads 121 also shows a trend of first decreasing and then increasing along the second direction. Therefore, the spacing between adjacent second pads 121 also shows a trend of first decreasing and then increasing along the second direction. When the height of the second pads 121 in the middle region is greater than the height of the second pads 121 in the two edge regions, the distance between adjacent second pads 121 in the middle region is less than the distance between adjacent second pads 121 in the two edge regions. That is, the spacing between adjacent second pads 121 in the middle region is also less than the spacing between adjacent second pads 121 in the two edge regions.

[0120] Referring to Figure 13C, taking nine second pads 121 located in the same second pad group as an example, the height of the second pad 121 in the middle area is greater than the height of the second pads 121 in the two edge areas. The spacing between two adjacent second pads 121 is s1”, s2”, s3”, s4”, s5”, s6”, s7”, and s8”, respectively. Among them, s4” and s5” closer to the middle are relatively smaller, while s1” and s8” closer to the edge are relatively larger. It should be noted that Figure 13C illustrates the state of the display panel 10 before warping.

[0121] Taking the display panel 10 shown in Figure 13C as an example, after the display panel 10 undergoes a warping deformation similar to that shown in Figure 7, it is then bonded to the driver chip 20, resulting in the bonding structure shown in Figure 14. In the bonding structure shown in Figure 14, on the one hand, by differentiating the height of the second pads 121, the height difference of the bonding interface caused by warping can be effectively compensated, making the bonding interfaces of each second pad 121 and the driver chip 20 approximately flush, which is beneficial to improving the support performance of the second sub-bonding area 120; on the other hand, by differentiating the distance between the second pads 121 in the middle area and the edge area, the amount of ACF material that can be accommodated in the gap between each second pad 121 can be basically the same, which facilitates the filling of the gap between the driver chip 20 and the display panel 10 by the ACF 40, and helps to ensure the flatness of the bonding.

[0122] In some embodiments, the second sub-binding area 120 is provided with a plurality of second pad groups, which are arranged sequentially at intervals along a first direction. From the end closer to the display area AA to the end farther away from the display area AA, the height of the second pads 121 in the same row gradually decreases. Therefore, the distance between adjacent second pads 121 can gradually increase. The specific principle is similar to the arrangement of the distance between the second pads 121 in the second direction, and will not be described in detail here.

[0123] In some embodiments, as shown in FIG2, the substrate 100 further includes a second bonding region 14 located on the side of the first bonding region 11 away from the display area AA. The second bonding region 14 is configured to bond the flexible circuit board 30. The second bonding region 14 is provided with at least one group of fourth pads 141, which includes a plurality of fourth pads 141 arranged at intervals along the second direction X. The fourth pads 141 are electrically connected to the third pads 131. For example, the fourth pads 141 and the third pads 131 can be electrically connected through traces arranged in the display panel 10 to transmit external input signals (such as voltage signals, display signals, etc.) to the driver chip 20 through the fourth pads 141 and the third pads 131.

[0124] In practice, the positional relationship between the second bonding area 14 and the first bonding area 11 in the second direction can be determined with the aim of facilitating cable routing and reducing cable impedance. For example, the center of the first bonding area 11 and the center of the second bonding area 14 can be aligned in the second direction. Alternatively, the left edge (or right edge) of the first bonding area 11 and the left edge (or right edge) of the second bonding area 14 can be aligned in the second direction.

[0125] In some embodiments, several dummy pads may be provided on both sides of the second bonding area 14 to ensure the mechanical properties of the flexible circuit board 30 bonding.

[0126] As shown in Figures 15 and 16, the display panel 10 further includes a pixel driving circuit (not shown), a first electrode 101, an organic light-emitting layer 102, a second electrode 103, an encapsulation layer, a color filter layer 105, and a cover plate 107 formed on the substrate 100. The first electrode 101, the organic light-emitting layer 102, and the second electrode 103 form a light-emitting device. The pixel driving circuit is electrically connected to the first electrode 101 of the light-emitting device and configured to drive the light-emitting device to emit light. The pixel driving circuit is fabricated on the substrate 100, for example, using a 180nm or 110nm semiconductor process.

[0127] The light-emitting device can be an electroluminescent device such as an OLED or a QLED. In some embodiments, the light-emitting device can be a white light-emitting device, which is matched with the color filter layer 105 to achieve color display. In other embodiments, the light-emitting device may include a red light-emitting device, a green light-emitting device, and a blue light-emitting device, which emit red, green, and blue primary colors of light respectively to achieve color display.

[0128] One of the first electrode 101 and the second electrode 103 serves as the anode of the light-emitting device, and the other serves as the cathode. The embodiments of this disclosure use the first electrode 101 as the anode and the second electrode 103 as the cathode as an example. For example, the first electrode 101 can be a single-layer metal thin film or a stacked structure of multiple metal thin films. The materials of the metal thin film can include: gold (Au), silver (Ag), nickel (Ni), platinum (Pt), magnesium (Mg), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), etc. As another example, the first electrode 101 can also include alloy materials of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), etc. As yet another example, the first electrode 101 can also be a stacked structure formed by the above metals and a transparent conductive material. The transparent conductive material can be, for example, any one of transparent conductive oxide thin film materials such as ITO (Indium tin oxide) and IZO (Indium zinc oxide). For example, it can be a composite structure formed by sequentially stacking transparent conductive oxide film / metal film / transparent conductive oxide film, such as ITO / Cu / ITO; or it can be a composite structure formed by sequentially stacking metal film / metal film / metal film / transparent conductive oxide film, such as Ti / Al / Ti / ITO.

[0129] For example, if the first electrode 101 includes multiple stacked metal layers, the second pad 121 may be disposed in the same layer as at least one metal layer included in the first electrode 101.

[0130] The organic light-emitting layer 102 is typically made of organic materials. Utilizing the light-emitting properties of organic materials, holes and electrons are excited under the influence of voltage or current to form excitons, thus achieving light emission. The color of the emitted light is determined by the material of the organic light-emitting layer 102.

[0131] As shown in Figure 16, the second electrode 103 is disposed on the side of the organic light-emitting layer 102 near the substrate 100. The second electrode 103 can be a metal thin film with light-transmitting properties. The material of the second electrode 103 can be any one of aluminum (Al), silver (Ag) and magnesium (Mg), or any one of magnesium-silver alloy and aluminum-lithium alloy.

[0132] As shown in Figure 16, the encapsulation layer may include a first thin-film encapsulation layer 104 and a second thin-film encapsulation layer 106. The first thin-film encapsulation layer 104 is disposed on the side of the second electrode 103 away from the substrate 100, and the second thin-film encapsulation layer 106 is disposed on the side of the first thin-film encapsulation layer 104 away from the substrate 100. The second thin-film encapsulation layer 106 is used in conjunction with the first thin-film encapsulation layer 104 to achieve effective encapsulation of the light-emitting device, effectively blocking moisture and oxygen, thereby protecting the light-emitting device and extending its lifespan. The first thin-film encapsulation layer 104 and the second thin-film encapsulation layer 106 may be made of one or more organic and inorganic materials with good sealing properties. For example, silicon oxide and silicon nitride may be used.

[0133] As shown in Figure 16, the color filter layer 105 can be disposed between the first thin-film encapsulation layer 104 and the second thin-film encapsulation layer 106. The second thin-film encapsulation layer 106 and the cover plate 107 are disposed on top of the color filter layer 105, which can protect the color filter layer 105. For example, the color filter layer 105 may include multiple color filter units and a light-shielding layer disposed between adjacent color filter units, and the positions of the multiple color filter units match the positions of each light-emitting device. For example, the multiple color filter units may include a red filter unit, a green filter unit, and a blue filter unit.

[0134] The cover plate 107 is disposed on the side of the second thin-film encapsulation layer 106 away from the substrate 100. The cover plate 107 is made of a transparent material, for example, pure glass with high transmittance. For example, the cover plate 107 may be slightly larger than the size of the display area AA and slightly smaller than the size of the substrate 100, with a certain distance left on all four sides, so as to realize the positioning and fixation of the silicon-based display module.

[0135] In some embodiments of the display panel provided in this disclosure, by adding a second sub-bonding area, the contact area between the driver chip and the silicon-based display panel can be increased, the gap in the middle area between the two can be reduced, the problem of uneven stress when the driver chip is under pressure can be improved, the risk of cracking or splitting of the driver chip can be reduced, and the mechanical characteristics of the silicon-based display module can be improved. Furthermore, by adjusting the height of the second pads in the second sub-bonding area, so that at least two second pads have different heights, the height difference of the bonding interface of the second pads caused by warping of the display panel can be compensated to a certain extent, which helps to improve the support performance of the second sub-bonding area.

[0136] The above description does not provide detailed technical specifications regarding the layout of each layer of the product. However, those skilled in the art should understand that layers and regions of the desired shape can be formed using various technical means. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0137] It should be noted that the accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments of this disclosure; other structures can be referred to with conventional designs. Where there is no conflict, the embodiments of this disclosure and the features described therein can be combined with each other to obtain new embodiments.

[0138] Although some embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make further changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

Claims

1. A display panel, comprising: A substrate, the substrate including a display area and a first bonding area located on at least one side of the display area, the first bonding area being configured to bond a driver chip; The first binding area includes: a first sub-binding area, a second sub-binding area, and a third sub-binding area arranged sequentially along a first direction; The first sub-bonding area is provided with at least one first pad group, the first pad group including a plurality of first pads arranged at intervals along a second direction, the second direction intersecting the first direction, and the first pads configured to receive signals output by the driver chip; The second sub-bonding area is provided with at least one second pad group, the second pad group including a plurality of second pads spaced apart along a second direction, the second pads having no signal input or output, at least two second pads having different heights, the height being the distance between the surface of the second pad on the side away from the substrate and the opposite bottom surface of the substrate along a direction perpendicular to the bottom surface of the substrate; and The third sub-binding area is provided with at least one third pad group, the third pad group including a plurality of third pads spaced apart along the second direction, the third pads being configured to transmit external signals to the driver chip.

2. The display panel according to claim 1, wherein, Along the second direction, the height of each second pad in the same second pad group changes in the following trend: first increasing and then decreasing.

3. The display panel according to claim 2, wherein, In the same second pad group, the height of the second pad first increases in a stepwise manner along the second direction, and then decreases in a stepwise manner; wherein, the height of each second pad is a height change step, the heights of two adjacent second pads are different, or, every two or more adjacent second pads correspond to a height change step, and the heights of the second pads corresponding to the same height change step are approximately the same.

4. The display panel according to claim 1, wherein, The second sub-bonding area is provided with a plurality of second pad groups, which are arranged sequentially at intervals along the first direction; Along the first direction, the height of the second pads in the same row is the same, or the height of the second pads in the same row gradually decreases from the end closer to the display area to the end farther away from the display area.

5. The display panel according to any one of claims 1-4, wherein, For the second pads with different heights, in the direction perpendicular to the bottom surface of the substrate... The distance between the surface of the second pad closest to the substrate and the bottom surface of the substrate opposite it is the same, and the thickness of the second pad is different. or, The distance between the surface of the second pad closest to the substrate and the bottom surface of the substrate opposite it is different, and the thickness of the second pad is the same; or, The distance between the surface of the second pad closest to the substrate and the bottom surface of the substrate opposite it is different, and the thickness of the second pad is different.

6. The display panel according to claim 1, wherein, In the second sub-bonding area, the higher the height of the second pad, the smaller the distance between two adjacent second pads.

7. The display panel according to claim 6, wherein, For the same second pad group, the height of the second pad changes from first increasing to decreasing along the second direction, and the distance between adjacent second pads changes from first decreasing to increasing along the second direction.

8. The display panel according to claim 6, wherein, The second sub-bonding area is provided with a plurality of second pad groups, which are arranged sequentially at intervals along the first direction; From the end closest to the display area to the end furthest from the display area, the height of the second pads in the same row gradually decreases, while the distance between adjacent second pads gradually increases.

9. The display panel according to claim 1, wherein, Within the same second pad group, the distance between adjacent second pads along the second direction first decreases and then increases.

10. The display panel according to claim 9, wherein, In the same second pad group, the distance between adjacent second pads decreases stepwise along the second direction and then increases stepwise; wherein, the distance between each pair of adjacent second pads is a distance change step, or, three or more adjacent second pads correspond to a distance change step, and the distance between each pair of adjacent second pads corresponding to the same distance change step is approximately the same.

11. The display panel according to claim 1, wherein, Along the same direction, the spacing between two adjacent second pads is greater than the spacing between two adjacent first pads.

12. The display panel according to claim 1, wherein, Along the first direction, the spacing between the second sub-binding area and the first and third sub-binding areas is less than 20% of the width of the first binding area.

13. The display panel according to claim 1, wherein, Along the second direction, the distance between two adjacent first pads is the first distance, and the distance between two adjacent second pads is the second distance. The ratio between the second distance and the first distance is 1.6 to 4.

14. The display panel according to claim 13, wherein, The second distance is 140–340 μm.

15. The display panel according to claim 1, wherein, The first sub-bonding area is provided with a plurality of first pad groups arranged at intervals along the first direction, and the second sub-bonding area is provided with a plurality of second pad groups arranged at intervals along the first direction. Along the first direction, the distance between two adjacent first pads is the third distance, and the distance between two adjacent second pads is the fourth distance. The ratio between the fourth distance and the third distance is 1.9 to 3.

4.

16. The display panel according to claim 15, wherein, The fourth distance is 140–240 μm.

17. The display panel according to claim 1, wherein, The substrate further includes: a second bonding region located on the side of the first bonding region away from the display area, configured to bond a flexible circuit board, the second bonding region having at least one fourth pad group, the fourth pad group including a plurality of fourth pads spaced apart along the second direction, the fourth pads being electrically connected to the third pad.

18. A display device, comprising: The display panel according to any one of claims 1 to 17; as well as A driver chip is bonded to the first bonding area of ​​the display panel.

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