Display substrate and display device

Abstract

A display substrate and a display device, the display substrate comprising a display area and a hole area, wherein the display area is arranged around the hole area; the hole area comprises a first sub-area and a second sub-area, which are arranged in sequence in a direction away from the display area; a plurality of isolation pillars are provided in any one of the first sub-area and the second sub-area; and at least one isolation pillar located in the second sub-area comprises at least two electrically conductive structures and at least one insulating structure, the at least one insulating structure being arranged between the at least two electrically conductive structures, and at least one side of at least one electrically conductive structure being groove-shaped.

Description

Display substrate and display device

[0001] This application claims priority to Chinese Patent Application No. 202411217802.8, filed on August 30, 2024, entitled “Display Substrate and Display Device”, the contents of which are to be understood as incorporated herein by reference. Technical Field

[0002] This article relates to the field of display technology, specifically to a display substrate and a display device. Background Technology

[0003] Organic light-emitting diodes (OLEDs) and quantum dot light-emitting diodes (QLEDs) are active-matrix display devices, possessing advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, flexibility, and low cost. With the continuous development of display technology, display devices using OLEDs as the light-emitting element and thin-film transistors (TFTs) for signal control have become the mainstream products in the display field. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This disclosure provides a display substrate and a display device.

[0006] In a first aspect, this disclosure provides a display substrate, including: a display area and an aperture area, the display area being disposed around the aperture area, the aperture area including: a first area and a second area being disposed sequentially away from the display area; and each of the first area and the second area being provided with a plurality of isolation pillars;

[0007] At least one isolation post located in the second region includes: at least two conductive structures and at least one insulating structure, wherein the at least one insulating structure is disposed between the at least two conductive structures, and at least one side of the at least one conductive structure is grooved.

[0008] In an exemplary embodiment, the display substrate includes: a substrate and a circuit structure layer disposed on the substrate, the circuit structure layer including: a plurality of gate metal layers and a plurality of source and drain metal layers, and at least one film layer of an organic insulating layer and an inorganic insulating layer is disposed between at least two metal layers.

[0009] At least one of the plurality of isolation pillars includes: a first conductive structure, a first insulating structure, and a second conductive structure;

[0010] At least one side of at least one of the first conductive structure and the second conductive structure is grooved, and at least a portion of the second conductive structure is projected onto the substrate within the range of the projected images of the first insulating structure and the first conductive structure onto the substrate.

[0011] The first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in another of the plurality of gate metal layers; or, the first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in one of the plurality of source / drain metal layers. The first insulating structure is disposed in at least one inorganic insulating layer located between the film layer containing the first conductive structure and the film layer containing the second conductive structure.

[0012] In an exemplary embodiment, at least one of the plurality of isolation pillars further includes: a third conductive structure located on the side of the second conductive structure away from the substrate;

[0013] At least one side of at least one of the first to third conductive structures is grooved, and at least a portion of the third conductive structure is projected onto the substrate within the range of the second conductive structure's projection onto the substrate.

[0014] The first conductive structure and the second conductive structure are located in one of the plurality of gate metal layers, the third conductive structure is located in one of the plurality of source and drain metal layers, and the first insulating structure is disposed in at least one inorganic insulating layer between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located.

[0015] In an exemplary embodiment, at least one of the plurality of isolation pillars further includes: a second insulating structure and a third conductive structure, wherein the second insulating structure is located on the side of the second conductive structure away from the substrate, and the third conductive structure is located on the side of the second insulating structure away from the substrate;

[0016] At least one side of at least one of the first to third conductive structures is grooved, and at least a portion of the third conductive structure is projected onto the substrate within the range of the orthogonal projection of the second insulating structure onto the substrate, and at least a portion of the third conductive structure is projected onto the substrate within the range of the orthogonal projection of the second conductive structure onto the substrate.

[0017] Any one of the first conductive structure, the second conductive structure, and the third conductive structure is disposed in one of the multiple gate metal layers; or, any one of the first conductive structure and the second conductive structure is located in one of the multiple gate metal layers, and the third conductive structure is located in one of the multiple source / drain metal layers. The first insulating structure is disposed in at least one inorganic insulating layer located between the film layer containing the first conductive structure and the film layer containing the second conductive structure, and the second insulating structure is disposed in at least one inorganic insulating layer located between the film layer containing the second conductive structure and the film layer containing the third conductive structure.

[0018] In an exemplary embodiment, an insulating filling structure is provided between at least two adjacent isolation pillars;

[0019] The insulating fill structure covers the side of the two adjacent isolation pillars closest to the insulating fill structure and the portion of the surface away from the substrate.

[0020] In an exemplary embodiment, the display substrate further includes a cover structure, which includes an organic structure and a cathode structure;

[0021] The covering structure is broken at the grooves of at least two conductive structures included in the isolation post;

[0022] The covering structure includes: a first covering structure disposed on the surface of the isolation column away from the substrate, wherein the first covering structures on at least two isolation columns having an insulating filling structure are interconnected, and their orthogonal projections on the substrate at least partially overlap with the orthogonal projections of the insulating filling structure on the substrate.

[0023] In an exemplary embodiment, at least one of the plurality of isolation pillars has an isolation insulation structure disposed on the surface of the isolation pillar away from the substrate, and at least one of the first conductive structure and the second conductive structure includes: a first sidewall and a second sidewall;

[0024] The insulating structure at least partially covers the surface and second sidewall of the second conductive structure away from the substrate, and the insulating structure is disposed in at least one inorganic insulating layer on the side of the second conductive structure away from the substrate;

[0025] The adjacent isolation columns have the same structure, or the structures of the adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

[0026] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation post along a centerline perpendicular to the substrate;

[0027] The insulating structure also covers the second sidewall of the first conductive structure and the second sidewall of the first insulating structure;

[0028] The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure;

[0029] The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

[0030] In an exemplary embodiment, the first insulating structure covers the second sidewall of the first conductive structure, and the insulating isolation structure portion is disposed on the surface of the first insulating structure away from the substrate;

[0031] The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure;

[0032] The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall of the insulating structure, as well as the second sidewall of the first insulating structure, and the first covering structure also extends between adjacent insulating posts.

[0033] In an exemplary embodiment, at least one of the first conductive structure and the second conductive structure includes: a first sidewall and a second sidewall;

[0034] At least a portion of the first sidewall of the first conductive structure is projected onto the substrate within the range of the first insulating structure's projection onto the substrate, and the first insulating structure covers the second sidewall of the first conductive structure.

[0035] The adjacent isolation columns have the same structure, or the structures of adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

[0036] In an exemplary embodiment, the display substrate further includes: a cover structure, the cover structure including an organic structure and a cathode structure, the cover structure being disconnected at the grooves of the first conductive structure and the second conductive structure;

[0037] The covering structure includes: a first covering structure disposed on the surface of the second conductive structure away from the substrate.

[0038] In an exemplary embodiment, when any one of the first conductive structure, the second conductive structure, and the third conductive structure is disposed in one of the multiple gate metal layers, at least one of the multiple isolation pillars has an isolation insulation structure disposed on the surface away from the substrate; at least one conductive structure from the first conductive structure to the third conductive structure includes: a first sidewall and a second sidewall.

[0039] At least a portion of the first sidewall of the first conductive structure is projected onto the substrate within the range of the orthogonal projection of the first insulating structure onto the substrate. At least a portion of the first sidewall of the second conductive structure is projected onto the substrate within the range of the orthogonal projection of the second insulating structure onto the substrate. The insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The insulating structure is disposed on at least one inorganic insulating layer on the side of the third conductive structure away from the substrate.

[0040] The adjacent isolation columns have the same structure, or the structures of adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

[0041] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation post along a centerline perpendicular to the substrate;

[0042] The orthographic projection of the second sidewall of the first conductive structure onto the substrate does not overlap with the orthographic projection of the first insulating structure onto the substrate, and the orthographic projection of the second sidewall of the second conductive structure onto the substrate does not overlap with the orthographic projection of the second insulating structure onto the substrate. The insulating structure also covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, the second sidewall of the second conductive structure, and the second sidewall of the second insulating structure.

[0043] The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure;

[0044] The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

[0045] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation post along a centerline perpendicular to the substrate;

[0046] The orthographic projections of the second sidewall of the insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure onto the substrate are located within the range of the orthographic projection of the first insulating structure onto the substrate. The first insulating structure covers the second sidewall of the first conductive structure, and the second insulating structure covers the second sidewall of the second conductive structure. The insulating structure is partially disposed on the surface of the second insulating structure away from the substrate.

[0047] The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure;

[0048] The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, the second sidewall of the first insulating structure and the second sidewall of the second insulating structure, and the first covering structure also extends between adjacent insulating posts.

[0049] In an exemplary embodiment, when any one of the first conductive structure and the second conductive structure is disposed in one of the multiple gate metal layers, and the third conductive structure is disposed in one of the multiple source and drain metal layers, at least one of the multiple isolation pillars has an isolation insulating structure disposed on the surface away from the substrate, and at least one conductive structure from the first conductive structure to the third conductive structure includes: a first sidewall and a second sidewall.

[0050] The second insulating structure covers the portion of the second conductive structure away from the substrate and the second sidewall, as well as the second sidewall of the first conductive structure and the second sidewall of the first insulating structure. A portion of the third conductive structure is connected to the portion of the second conductive structure away from the substrate. The third conductive structure is stepped. The isolation insulating structure covers the second sidewall of the third conductive structure and the second sidewall of the isolation insulating structure. The isolation insulating structure is disposed in at least one inorganic insulating layer located between multiple source and drain metal layers.

[0051] Adjacent isolation columns have the same structure, or adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

[0052] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation post along a centerline perpendicular to the substrate;

[0053] The orthographic projection of the second sidewall of the first conductive structure onto the substrate does not overlap with the orthographic projection of the first insulating structure onto the substrate;

[0054] The display substrate further includes a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the grooves of the first conductive structure, the second conductive structure and the third conductive structure;

[0055] The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

[0056] In an exemplary embodiment, at least one of the plurality of isolation pillars has an isolation insulation structure disposed on the surface of the isolation pillar away from the substrate, and at least one of the first to third conductive structures includes: a first sidewall and a second sidewall.

[0057] At least a portion of the first sidewall of the first conductive structure is projected onto the substrate within the range of the orthogonal projection of the first insulating structure onto the substrate, and at least a portion of the first sidewall of the second conductive structure is projected onto the substrate within the range of the orthogonal projection of the second insulating structure onto the substrate. The isolation insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The isolation insulating structure is disposed in at least one inorganic insulating layer located between a plurality of source and drain metal layers.

[0058] The adjacent isolation columns have the same structure, or the structures of adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

[0059] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation post along a centerline perpendicular to the substrate;

[0060] The orthographic projection of the second sidewall of the first conductive structure onto the substrate does not overlap with the orthographic projection of the first insulating structure onto the substrate, and the insulating structure further covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, and the second sidewall of the second conductive structure.

[0061] The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the grooves of the first conductive structure, the second conductive structure and the third conductive structure;

[0062] The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

[0063] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation post along a centerline perpendicular to the substrate;

[0064] The second sidewall of the insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure are projected onto the substrate within the range of the first insulating structure projected onto the substrate. The first insulating structure covers the second sidewall of the first conductive structure, and the insulating structure is partially disposed on the surface of the first insulating structure away from the substrate.

[0065] The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the grooves of the first conductive structure, the second conductive structure and the third conductive structure;

[0066] The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

[0067] In an exemplary embodiment, when the structures of adjacent isolation columns located in the second region are arranged symmetrically with respect to a straight line perpendicular to the base direction, the isolation insulation structures provided on the isolation columns and the isolation insulation structures provided on adjacent isolation columns are spaced apart or connected to each other.

[0068] In an exemplary embodiment, when the structures of adjacent isolation pillars located in the second region are arranged symmetrically with respect to a straight line perpendicular to the base direction, at least one insulating structure of the isolation pillar is spaced apart from at least one insulating structure of the adjacent isolation pillar, or is connected to each other.

[0069] In an exemplary embodiment, the hole region further includes a third region located between the first region and the second region. The display substrate further includes a substrate and a circuit structure layer disposed on the substrate. The circuit structure layer includes a plurality of gate metal layers and a plurality of source / drain metal layers. At least one film layer of organic insulating layer and inorganic insulating layer is disposed between at least two metal layers. At least one inorganic insulating layer disposed on the side of the plurality of gate metal layers near the substrate is called a first composite insulating layer. The plurality of inorganic insulating layers disposed between the plurality of gate metal layers and the plurality of source / drain metal layers are called a second composite insulating layer.

[0070] The first composite insulating layer extends from the display area to the second area, and the second composite insulating layer is located in the display area and does not extend to the first area, or extends from the display area to the third area;

[0071] When the second composite insulating layer is located in the display area and does not extend into the first area, the isolation pillars located in the first area and the isolation pillars located in the second area have the same shape.

[0072] In an exemplary embodiment, when the second composite insulating layer extends from the display area to the third area, the isolation pillar located in the first area includes: a first conductive structure, wherein the first conductive structure is located in one of the plurality of source / drain metal layers.

[0073] In an exemplary embodiment, the isolation pillar located in the first region further includes at least one of the second to the (K+1)th conductive structures, wherein the orthographic projection of at least one of the second to the (K+1)th isolation structures on the substrate overlaps with the orthographic projection of the first isolation structure.

[0074] The (k+1)th conductive structure is located in the kth gate metal layer, where 1 ≤ k ≤ K.

[0075] In an exemplary embodiment, when the isolation pillar located in the second region includes a first conductive structure, a first insulating structure, and a second conductive structure, the first conductive structure is located in one of the multiple gate metal layers closest to the substrate, the second conductive structure is located in one of the multiple source / drain metal layers on the side furthest from the substrate, and the thickness of the first insulating structure is in the range of 0.7 micrometers to 0.9 micrometers.

[0076] In an exemplary embodiment, the conductive structure of at least one film layer in a plurality of source and drain metal layers includes: a first isolation portion, a second isolation portion and a third isolation portion, wherein the first isolation portion is located on the side of the second isolation portion closer to the substrate, and the third isolation portion is located on the side of the second isolation portion away from the substrate;

[0077] The orthographic projection of the surface of the second isolation portion near the substrate onto the substrate is within the range of the orthographic projection of the surface of the first isolation portion away from the substrate onto the substrate, and the orthographic projection of the surface of the second isolation portion away from the substrate onto the substrate is within the range of the orthographic projection of the surface of the third isolation portion near the substrate onto the substrate.

[0078] In an exemplary embodiment, the angle between the surface of the insulating filling structure disposed on the surface of at least one of the plurality of isolation pillars away from the substrate and the surface of the isolation pillar away from the substrate is in the range of 30 degrees to 60 degrees.

[0079] Secondly, this disclosure also provides a display device, including: the aforementioned display substrate.

[0080] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the application. Other advantages of this application can be realized and obtained by means of the solutions described in the description and the accompanying drawings.

[0081] Overview of the attached figures

[0082] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0083] Figure 1 is a schematic diagram of a display substrate according to at least one embodiment of the present disclosure;

[0084] Figure 2 is a partial cross-sectional schematic diagram of the display area of ​​at least one embodiment of the present disclosure;

[0085] Figure 3 is a partial cross-sectional schematic diagram of the display area of ​​at least one embodiment of the present disclosure.

[0086] Figure 4 is a partial cross-sectional schematic diagram of the display area of ​​at least one embodiment of the present disclosure;

[0087] Figure 5 is a partial cross-sectional schematic diagram of the display area of ​​at least one embodiment of the present disclosure;

[0088] Figure 6 is a schematic diagram of the structure of the display substrate provided in an embodiment of this disclosure;

[0089] Figure 7 is a second schematic diagram of the structure of the display substrate provided in an embodiment of this disclosure;

[0090] Figure 8 is a partial cross-sectional schematic diagram of the conductive structure of at least one film layer among multiple source and drain metal layers;

[0091] Figure 9 is a schematic diagram of the covering structure;

[0092] Figure 10 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0093] Figure 11 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0094] Figure 12 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0095] Figure 13 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0096] Figure 14 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0097] Figure 15 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0098] Figure 16 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0099] Figure 17 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0100] Figure 18 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0101] Figure 19 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0102] Figure 20 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0103] Figure 21 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0104] Figure 22 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 13).

[0105] Figure 23 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0106] Figure 24 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0107] Figure 25 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0108] Figure 26 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0109] Figure 27 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0110] Figure 28 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0111] Figure 29 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0112] Figure 30 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0113] Figure 31 is a partial cross-sectional schematic diagram of the display substrate located in the second region (22nd figure).

[0114] Figure 32 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0115] Figure 33 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0116] Figure 34 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0117] Figure 35 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0118] Figure 36 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0119] Figure 37 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0120] Figure 38 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 29).

[0121] Figure 39 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0122] Figure 40 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0123] Figure 41 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0124] Figure 42 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0125] Figure 43 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0126] Figure 44 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0127] Figure 45 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0128] Figure 46 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0129] Figure 47 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0130] Figure 48 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0131] Figure 49 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0132] Figure 50 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0133] Figure 51 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0134] Figure 52 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0135] Figure 53 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0136] Figure 54 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0137] Figure 55 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0138] Figure 56 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0139] Figure 57 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0140] Figure 58 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0141] Figure 59 is a partial cross-sectional schematic diagram of the display substrate located in the second region;

[0142] Figure 60 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0143] Figure 61 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0144] Figure 62 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0145] Figure 63 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0146] Figure 64 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0147] Figure 65 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0148] Figure 66 is a partial cross-sectional schematic diagram of the display substrate located in the second region.

[0149] Figures 67A to 67D are flowcharts of the preparation process shown in Figure 13;

[0150] Figures 68A to 68C are flowcharts of the preparation process shown in Figure 14;

[0151] Figures 69A to 69B are flowcharts of the preparation process shown in Figure 59;

[0152] Figures 70A to 70C are the preparation process flowcharts of Figure 31;

[0153] Figures 71A to 71D are flowcharts of the preparation process shown in Figure 55;

[0154] Figures 72A to 72C are flowcharts of the preparation process shown in Figure 63;

[0155] Figure 73 is a schematic diagram of a display device according to at least one embodiment of the present disclosure.

[0156] Detailed Explanation

[0157] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be transformed into other forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0158] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Therefore, this disclosure is not necessarily limited to these dimensions, and the shape and size of one or more parts in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0159] The ordinal numbers such as "first," "second," and "third" used in this specification are used to avoid confusion among the constituent elements, not to limit the quantity. The term "multiple" in this disclosure refers to two or more quantities.

[0160] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of the constituent elements being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0161] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or joint; a direct connection, an indirect connection via an intermediate component, or a connection within two components. "Joining" can include "electrical connection," which includes situations where constituent elements are connected together by a component having some electrical function. There are no particular limitations on the term "component having some electrical function," as long as it allows for the transmission of electrical signals between the connected constituent elements. Examples of "component having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other multifunctional components. Those skilled in the art will understand the meaning of the above terms in this disclosure as appropriate.

[0162] In this specification, a transistor is a device that includes at least three terminals: a gate (gate electrode), a drain, and a source. A transistor has a channel region between its drain (drain electrode terminal, drain region, or drain electrode) and its source (source electrode terminal, source region, or source electrode), and current can flow through the drain, the channel region, and the source. In this specification, the channel region refers to the region through which current primarily flows.

[0163] In this specification, the first terminal can be the drain and the second terminal can be the source, or vice versa. Additionally, the gate can also be called the control terminal. In cases where transistors with opposite polarities are used or where the current direction changes during circuit operation, the functions of the "source" and "drain" are sometimes interchanged. Therefore, in this specification, the "source" and "drain" can be interchanged.

[0164] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0165] In this specification, circles, ellipses, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined. They can be approximate circles, ellipses, triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, such as chamfers, curved edges, and other variations.

[0166] In this specification, "approximately" and "roughly" mean without strictly defined limits, allowing for errors in the process and measurement. In this disclosure, "roughly the same" means that the values ​​differ by no more than 10%.

[0167] In this specification, "A extends along direction B" means that A may include a main part and a secondary part connected to the main part. The main part is a line, line segment, or strip-shaped solid. The main part extends along direction B, and the length of the main part extending along direction B is greater than the length of the secondary part extending along other directions. In this specification, "A extends along direction B" refers to "the main part of A extends along direction B".

[0168] The phrase "A and B are of the same layer" in this specification means that A and B are formed simultaneously through the same drafting process. "Same layer" does not always mean that the layer thickness or layer height is the same in the partial cross-sectional schematic diagram. "The orthographic projection of A includes the orthographic projection of B" means that the orthographic projection of B falls within the orthographic projection area of ​​A, or the orthographic projection of A covers the orthographic projection of B.

[0169] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of those features.

[0170] In embodiments of this disclosure, the thickness of a component refers to the dimension of the component in a direction perpendicular to the substrate.

[0171] The display substrate includes a display area and a hole area. When the isolation pillars in the hole area are energized, they will undergo electrochemical corrosion, and there will be residual adhesive on the isolation pillars. When the display substrate is opened, moisture will enter the display area along the residual adhesive, which can cause black spots to appear on the display substrate and affect the display effect of the display substrate.

[0172] Figure 1 is a schematic diagram of a display substrate according to at least one embodiment of the present disclosure. In an exemplary embodiment, as shown in Figure 1, the shape of the display substrate can be a closed polygon including linear edges. The display substrate may include: a display area AA, a hole area VV at least partially surrounded by the display area AA, a bonding area BB located on one side of the display area AA, and a border area CC located on at least one side of the display area AA. For example, the display area AA may include: a first display edge (lower display edge) and a second display edge (upper display edge) disposed opposite to each other in a first direction D1, and a third display edge (left display edge) and a fourth display edge (right display edge) disposed opposite to each other in a second direction D2. The first display edge and the second display edge can be mutually parallel linear edges, and the third display edge and the fourth display edge can be mutually parallel linear edges. Adjacent linear edges can be connected by curved edges (e.g., arcuate edges).

[0173] In an exemplary embodiment, the hole region VV can be circular. The hole region VV can also adopt other suitable shapes, not limited to a circle. Furthermore, the location of the hole region VV is not limited to the center of the display area and can be set as needed.

[0174] In an exemplary embodiment, at least a portion of the structure within the hole region VV is removed. For example, all the structure within the hole region VV of the display substrate is removed. For example, after forming the encapsulation layer, a hole-punching process is performed to remove the portion of the display substrate located in the hole region VV.

[0175] In an exemplary embodiment, the display device may further include a sensor, which may be disposed within or entirely within the aperture region VV. Exemplarily, the sensor may include a camera.

[0176] In an exemplary embodiment, as shown in FIG1, the binding region BB can be connected to the first display edge.

[0177] In an exemplary embodiment, as shown in FIG1, the bezel region CC may include: the upper bezel region of the display substrate, the left bezel region of the display substrate, and the right bezel region of the display substrate. However, this embodiment is not limited thereto.

[0178] In an exemplary embodiment, as shown in FIG1, the binding area BB may include: a first sub-area B11, a bent area B12, and a second sub-area B13 arranged sequentially along the side away from the display area AA in a first direction D1. The first sub-area B11 may also be referred to as a first fan-out area. The first sub-area B11 may communicate with the left border area and the right border area and be connected to the display area AA. The bent area B12 may connect the first sub-area B11 and the second sub-area B13. The bent area B12 may be configured to bend the second sub-area B13 to the back side of the display area AA.

[0179] In an exemplary embodiment, the second sub-region B13 of the binding region BB may include: a second fan-out region, a circuit setting region, a third fan-out region, a first signal access region B134, and a second signal access region B135, which are sequentially arranged along the direction away from the bending region B12 in the first direction D1.

[0180] In an exemplary embodiment, as shown in FIG1, the display area AA of the display substrate may include at least: a plurality of sub-pixels PX, a plurality of gate lines GL, and a plurality of data lines DL. The plurality of gate lines GL may extend along a second direction D2 and be arranged along a first direction D1; the plurality of data lines DL may extend along the first direction D1 and be arranged along the second direction D2. The plurality of data lines DL may be electrically connected to the plurality of sub-pixels PX, and the plurality of data lines DL may be configured to provide data signals to the plurality of sub-pixels PX. The plurality of gate lines GL may be electrically connected to the plurality of sub-pixels PX, and the plurality of gate lines GL may be configured to provide pixel control signals to the plurality of sub-pixels PX. For example, the pixel control signals may include scan signals, or may include scan signals and light emission control signals, or may include scan signals, reset control signals, and light emission control signals.

[0181] In an exemplary embodiment, the second direction D2 may be the extension direction of the grid line GL within the display area AA (e.g., the row direction); the first direction D1 may be the extension direction of the data line within the display area AA (e.g., the column direction). The first direction D1 and the second direction D2 may intersect each other, for example, they may be perpendicular to each other.

[0182] In an exemplary embodiment, a pixel unit of the display area AA may include three sub-pixels, which may be a first sub-pixel emitting a first color light (e.g., red light), a second sub-pixel emitting a second color light (e.g., blue light), and a third sub-pixel emitting a third color light (e.g., green light). However, this embodiment is not limited thereto. In an exemplary embodiment, a pixel unit may include four sub-pixels, which may be a sub-pixel emitting red light, a sub-pixel emitting green light, a sub-pixel emitting blue light, and a sub-pixel emitting white light. For example, a pixel unit may include four sub-pixels, which may include one sub-pixel emitting red light, one sub-pixel emitting blue light, and two sub-pixels emitting green light.

[0183] In an exemplary embodiment, a sub-pixel may include a pixel driving circuit and a light-emitting element electrically connected to the pixel driving circuit. The pixel driving circuit may include multiple transistors and at least one capacitor. For example, the pixel driving circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, or 8T1C structure. In the above circuit structures, T refers to a thin-film transistor, C refers to a capacitor, the number before T represents the number of thin-film transistors in the circuit, and the number before C represents the number of capacitors in the circuit. In an exemplary embodiment, the multiple transistors in the pixel driving circuit may include P-type transistors and N-type transistors. In other examples, the multiple transistors in the pixel driving circuit may be either P-type transistors or N-type transistors. Using the same type of transistors in the pixel driving circuit can simplify the process flow, reduce the processing difficulty of the display substrate, and improve the product yield.

[0184] In an exemplary embodiment, the shape of the light-emitting element of a sub-pixel can be rectangular, rhomboid, pentagonal, or hexagonal. When a pixel unit includes three sub-pixels, the light-emitting elements of the three sub-pixels can be arranged horizontally side-by-side, vertically side-by-side, or in a triangular arrangement; when a pixel unit includes four sub-pixels, the light-emitting elements of the four sub-pixels can be arranged horizontally side-by-side, vertically side-by-side, or in a square arrangement. However, this embodiment is not limited in this respect.

[0185] In an exemplary embodiment, the light-emitting element can be any of the following: a light-emitting diode (LED), an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), or a micro-LED (including mini-LED or micro-LED). For example, the light-emitting element can be an OLED, which can emit red, green, blue, or white light under the drive of its corresponding pixel driving circuit. The color of the light emitted by the light-emitting element can be determined as needed. In an exemplary embodiment, the light-emitting element may include an anode, a cathode, and an organic light-emitting layer located between the anode and the cathode. The anode of the light-emitting element can be electrically connected to the corresponding pixel driving circuit. However, this embodiment is not limited in this respect.

[0186] The display substrate in this example can integrate a touch structure, such as an integrated mutual capacitance touch structure, to form an FMLOC structure.

[0187] In an exemplary embodiment, the display substrate may include a substrate and a circuit structure layer and a light-emitting structure layer sequentially disposed on the substrate. The circuit structure layer includes a pixel driving circuit located in the display area, and the light-emitting structure layer includes a light-emitting element located in the display area.

[0188] In an exemplary embodiment, the display substrate may further include at least one film layer of the encapsulation structure layer and the touch structure layer, without any limitation thereof.

[0189] Figure 2 is a partial cross-sectional schematic diagram of a display area according to at least one embodiment of the present disclosure. Figure 2 illustrates the structure of a sub-pixel of the display area as an example. In this example, the pixel driving circuit includes a low-temperature polysilicon thin-film transistor as an example for description.

[0190] In an exemplary embodiment, as shown in FIG2, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source / drain metal layer, and a second source / drain metal layer disposed on the substrate 10. A first insulating layer 101 (which may be called a buffer layer) may be disposed between the substrate and the semiconductor layer; a second insulating layer 102 (which may be called a first gate insulating layer) may be disposed between the semiconductor layer and the first gate metal layer; a third insulating layer 103 (which may be called a second gate insulating layer) may be disposed between the first gate metal layer and the second gate metal layer; a fifth insulating layer 105 (which may be called an interlayer insulating layer) may be disposed between the second gate metal layer and the first source / drain metal layer; a sixth insulating layer 106 (which may also be called a passivation layer) and a seventh insulating layer 107 (which may also be called a first planarization layer) may be disposed between the first source / drain metal layer and the second source / drain metal layer, wherein the seventh insulating layer 107 may be located on the side of the sixth insulating layer 106 away from the substrate 10; and an eighth insulating layer 108 (which may also be called a second planarization layer) may be disposed on the side of the second source / drain metal layer away from the substrate 10. In this embodiment, the first insulating layer 101, the second insulating layer 102, the third insulating layer 103, the fifth insulating layer 105, and the sixth insulating layer 106 can be inorganic insulating layers, while the seventh insulating layer 107 and the eighth insulating layer 108 can be organic insulating layers. This disclosure uses a display substrate comprising two gate metal layers and two source / drain metal layers as an example for illustration. However, this embodiment is not limited to this. In other examples, a bottom shielding metal layer (BSM) can be disposed on the side of the first insulating layer near the substrate. The bottom shielding metal layer can be configured to at least partially cover the active layer of the transistors in the pixel driving circuit to prevent external light from affecting the performance of the transistors. In other examples, only the sixth or seventh insulating layer can be disposed between the first and second source / drain metal layers.

[0191] In an exemplary embodiment, as shown in FIG2, the semiconductor layer may include at least a first active layer 210 of the transistor 21 located in the display area. The first active layer 210 of the transistor 21 may include a first region 2101, a second region 2102, and a channel region 2100 located between the first region 2101 and the second region 2102. The first gate metal layer may include at least a first gate 213 of the transistor 21 located in the display area and a first electrode 231 of the capacitor 23. The orthographic projection of the first gate 213 of the transistor 21 onto the substrate 10 may cover the orthographic projection of the channel region 2100 of the first active layer 210 onto the substrate 10. The second gate metal layer may include at least a second electrode 232 of the capacitor 23 located in the display area and a third gate 224 of the second type transistor 22. The orthographic projections of the second electrode 232 and the first electrode 231 of the capacitor 23 onto the substrate 10 may at least partially overlap, for example, they may coincide.

[0192] In an exemplary embodiment, as shown in FIG2, the first source-drain metal layer of the display area may include at least a first source 211 and a first drain 212 of the transistor 21 located in the display area. The fifth insulating layer 105 may have multiple pixel vias (e.g., including a first pixel via and a second pixel via) in the display area. The fifth insulating layer 105, the third insulating layer 103, the second insulating layer 102, and the first insulating layer 101 within the first pixel via can be removed, exposing at least a portion of the surface of the first region 2101 of the first active layer 210; the fifth insulating layer 105, the third insulating layer 103, the second insulating layer 102, and the first insulating layer 101 within the second pixel via can be removed, exposing at least a portion of the surface of the second region 2102 of the first active layer 210. The first source 211 of the transistor 21 can be electrically connected to the first region 2101 of the first active layer 210 through the first pixel via, and the first drain 212 can be electrically connected to the second region 2102 of the first active layer 210 through the second pixel via. The second source / drain metal layer may include at least a first transition electrode 241. The first transition electrode 241 can be electrically connected to the first drain 212 of the transistor 21 of the pixel driving circuit through a fifth pixel via formed by the sixth insulating layer 106 and the seventh insulating layer 107. In this example, the first transition electrode 241 can be used to achieve the electrical connection between the pixel driving circuit and the light-emitting element.

[0193] In an exemplary embodiment, the gate lines of the display area may be located, for example, in the first gate metal layer and the second gate metal layer; the data lines of the display area may be located, for example, in the second source-drain metal layer; and the first power lines of the display area may be located, for example, in the second source-drain metal layer. This embodiment is not limited in this respect.

[0194] In an exemplary embodiment, as shown in FIG2, the light-emitting structure layer 13 may include a pixel definition layer 134 and a plurality of light-emitting elements located in the display area. For example, each light-emitting element may include a first electrode 131, an organic light-emitting layer 132, and a second electrode 133 stacked thereon. The first electrode 131 of the light-emitting element may be an anode, and the first electrode 131 may be disposed on an eighth insulating layer 108 and electrically connected to a first transition electrode 241 through a sixth pixel via formed in the eighth insulating layer 108. The pixel definition layer 134 is disposed on the first electrode 131 and the eighth insulating layer 108, and the pixel definition layer 134 may have a plurality of pixel openings, one pixel opening exposing at least a portion of the surface of a corresponding first electrode 131. At least a portion of the organic light-emitting layer 132 may be disposed within a pixel opening and connected to the corresponding first electrode 131. The second electrode 133 may be disposed on the organic light-emitting layer 132 and connected to the organic light-emitting layer 132. The organic light-emitting layer 132 may emit light of a corresponding color under the drive of the first electrode 131 and the second electrode 133.

[0195] In an exemplary embodiment, the light-emitting structure layer may include: an anode layer, an organic material layer, and a cathode layer. The anode layer includes: a first electrode of at least one light-emitting element located in the display area. The organic material layer includes: an organic light-emitting layer of at least one light-emitting element located in the display area. The cathode layer includes: a second electrode of at least one light-emitting element located in the display area.

[0196] In an exemplary embodiment, the organic light-emitting layer 132 of the light-emitting element may include an emitting layer (EML) and at least one of the following film layers: a hole injection layer (HIL), a hole transport layer (HTL), a hole block layer (HBL), an electron block layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Under the voltage drive of the first electrode 131 and the second electrode 133, the light-emitting characteristics of the organic material can be utilized to emit light at the required grayscale.

[0197] In exemplary embodiments, the light-emitting layers of light-emitting elements of different colors can be different. For example, a red light-emitting element includes a red light-emitting layer, a green light-emitting element includes a green light-emitting layer, and a blue light-emitting element includes a blue light-emitting layer. To reduce process complexity and improve yield, the hole injection layer and hole transport layer on one side of the light-emitting layer can be common layers, and the electron injection layer and electron transport layer on the other side of the light-emitting layer can also be common layers. In exemplary embodiments, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer can be fabricated in a single process (single vapor deposition process or single inkjet printing process), and isolation can be achieved through surface steps of the formed film layers or through surface treatment. For example, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer corresponding to adjacent sub-pixels can be isolated. In exemplary embodiments, the organic light-emitting layer can be formed by vapor deposition using a fine metal mask (FMM) or an open mask, or by inkjet printing.

[0198] In an exemplary embodiment, as shown in FIG2, the encapsulation structure layer 14 may include a first encapsulation layer 141, a second encapsulation layer 142, and a third encapsulation layer 143 stacked together. The first encapsulation layer 141 and the third encapsulation layer 143 may be made of inorganic materials, such as silicon nitride, silicon oxide, or silicon oxynitride. Inorganic materials have high density and can prevent the intrusion of water, oxygen, etc. The second encapsulation layer 142 may be disposed between the first encapsulation layer 141 and the third encapsulation layer 143 to ensure that external moisture cannot enter the light-emitting element. The second encapsulation layer 142 may be made of organic materials, for example, it may be a polymer material containing a desiccant or a polymer material that can block moisture, or it may be a polymer resin to planarize the surface of the display substrate and relieve stress on the first encapsulation layer 141 and the third encapsulation layer 143. It may also include a desiccant or other water-absorbing material to absorb water, oxygen, and other substances that have intruded into the interior. However, this embodiment is not limited to this. For example, the encapsulation structure layer may adopt a five-layer stacked structure of inorganic / organic / inorganic / organic / inorganic.

[0199] In an exemplary embodiment, the touch structure layer of the display area may include: a plurality of first touch electrodes, a plurality of first connecting portions, a plurality of second touch electrodes, and a plurality of second connecting portions. The plurality of first touch electrodes may be disposed in the same layer, and adjacent first touch electrodes may be connected via the first connecting portions. The plurality of second touch electrodes may be disposed in the same layer, and adjacent second touch electrodes may be connected via the second connecting portions.

[0200] In an exemplary embodiment, as shown in FIG2, the touch structure layer 15 of the display area may include, in the direction perpendicular to the display substrate, a touch buffer layer (TBL) 150, a first touch conductive layer 151, a touch interlayer insulating layer (TLD) 153, a second touch conductive layer 152, and a touch protective layer (TOC) 154 sequentially disposed therefrom. The touch buffer layer 150 and the touch interlayer insulating layer 153 may be inorganic insulating layers, and the touch protective layer 154 may be an organic insulating layer. For example, the first touch conductive layer 151 may include a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of first connecting portions. The first touch electrodes and the first connecting portions may be an integral structure interconnected. The second touch conductive layer 152 may include a plurality of second connecting portions. The second connecting portions may be interconnected with adjacent second touch electrodes through vias formed in the touch interlayer insulating layer 153. However, this embodiment is not limited in this respect. In other examples, the first touch conductive layer may include: a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of second connecting portions, wherein the second touch electrodes and the second connecting portions may be an integral structure interconnected with each other; the second touch conductive layer may include a plurality of first connecting portions, which may be interconnected with adjacent first touch electrodes through vias formed in the interlayer insulating layer. In an exemplary embodiment, the first touch electrode may be a driving (Tx) electrode, and the second touch electrode may be a sensing (Rx) electrode. Alternatively, the first touch electrode may be a sensing (Rx) electrode, and the second touch electrode may be a driving (Tx) electrode. This embodiment is not limited in this respect.

[0201] In an exemplary embodiment, the first touch electrode and the second touch electrode may have a rhombus shape, such as a regular rhombus, a horizontally elongated rhombus, or a vertically elongated rhombus. In other examples, the first touch electrode and the second touch electrode may have any one or more of the following shapes: triangle, square, trapezoid, parallelogram, pentagon, hexagon, and other polygons, which are not limited to the embodiments disclosed herein.

[0202] In an exemplary embodiment, the first and second touch electrodes can be in the form of transparent conductive electrodes. In other examples, the first and second touch electrodes can be in the form of a metal mesh, which can be formed by interlacing multiple metal wires. The metal mesh can include multiple mesh patterns, and the mesh patterns can be polygons composed of multiple metal wires. The metal mesh-type first and second touch electrodes have advantages such as low resistance, small thickness, and fast response speed.

[0203] Figure 3 is a partial cross-sectional schematic diagram of the display area of ​​at least one embodiment of the present disclosure. In an exemplary embodiment, as shown in Figure 3, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a third gate metal layer, a first source / drain metal layer, and a second source / drain metal layer disposed on the substrate 10. A fourth insulating layer 104 (which may be referred to as the third gate insulating layer) may be disposed between the second gate metal layer and the third gate metal layer; a fifth insulating layer 105 (which may be referred to as the interlayer insulating layer) may be disposed between the third gate metal layer and the first source / drain metal layer. The fourth insulating layer 104 may be an inorganic insulating layer. This disclosure is illustrated using a display substrate comprising three gate metal layers and two source / drain metal layers as an example. However, this embodiment is not limited thereto. The remaining structure of the display area of ​​the display substrate of this example can be referred to the description of the embodiment shown in Figure 2, and will not be repeated here.

[0204] In an exemplary embodiment, the third gate metal layer may include a third electrode 233 of a capacitor located in the display area. The third electrode 233 is connected to the first electrode 231, and its orthographic projection on the substrate 10 at least partially overlaps with the orthographic projection of the second electrode 232 on the substrate 10, for example, they may coincide.

[0205] In an exemplary embodiment, the gate lines of the display area may be located in at least one of the first gate metal layer, the second gate metal layer, and the third gate metal layer; the data lines of the display area may be located in the second source-drain metal layer; and the first power lines of the display area may be located in the second source-drain metal layer. This embodiment is not limited in this respect.

[0206] Figure 4 is a partial cross-sectional schematic diagram of the display area of ​​at least one embodiment of the present disclosure. In an exemplary embodiment, as shown in Figure 4, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer disposed on the substrate 10. An eighth insulating layer 108 (which may also be referred to as a second planarization layer) may be disposed between the second and third source / drain metal layers, and a ninth insulating layer 109 (which may also be referred to as a third planarization layer) may be disposed on the side of the third source / drain metal layer away from the substrate 10. The present disclosure is illustrated using a display substrate comprising two gate metal layers and three source / drain metal layers as an example. In this example, the electrical connection between the pixel driving circuit and the light-emitting element can be achieved through the first transition electrode 241 and the second transition electrode 242. The remaining structure of the display area of ​​the display substrate in this example can be referred to the description of the embodiment shown in Figure 2, and will not be repeated here.

[0207] In an exemplary embodiment, the gate lines of the display area may be located, for example, in the first gate metal layer and the second gate metal layer; the data lines of the display area may be located, for example, in the second source-drain metal layer or the third source-drain metal layer; and the first power line of the display area may be located, for example, in the second source-drain metal layer or the third source-drain metal layer. This embodiment is not limited in this respect.

[0208] Figure 5 is a partial cross-sectional schematic diagram of the display area of ​​at least one embodiment of the present disclosure. In an exemplary embodiment, as shown in Figure 5, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a third gate metal layer, a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer disposed on the substrate 10. A fourth insulating layer 104 (which may be referred to as the third gate insulating layer) may be disposed between the second gate metal layer and the third gate metal layer, an eighth insulating layer 108 (which may also be referred to as the second planarization layer) may be disposed between the second source / drain metal layer and the third source / drain metal layer, and a ninth insulating layer 109 (which may also be referred to as the third planarization layer) may be disposed on the side of the third source / drain metal layer away from the substrate 10. The fourth insulating layer 104 may be an inorganic insulating layer, and the ninth insulating layer 109 may be an organic insulating layer. This disclosure is illustrated using a display substrate comprising three gate metal layers and three source / drain metal layers as an example. In this example, the electrical connection between the pixel circuit and the light-emitting element can be achieved through the first transition electrode 241 and the second transition electrode 242. The remaining structure of the display area of ​​the display substrate in this example can be referred to the description of the embodiments shown in Figures 2 and 3, and will not be repeated here.

[0209] In an exemplary embodiment, the gate lines of the display area may be located in at least one film layer of the first gate metal layer, the second gate metal layer, and the third gate metal layer; the data lines of the display area may be located in the second source-drain metal layer or the third source-drain metal layer; and the first power line of the display area may be located in the second source-drain metal layer or the third source-drain metal layer. This embodiment is not limited in this respect.

[0210] Figure 6 is a schematic diagram of the structure of the display substrate provided in this embodiment of the present disclosure, and Figure 7 is a schematic diagram of the structure of the display substrate provided in this embodiment of the present disclosure. As shown in Figures 6 and 7, the display substrate provided in this embodiment of the present disclosure has a display area and a hole area. The hole area includes: a first area R1 and a second area R2 arranged sequentially away from the display area. At least one area of ​​the first area R1 and the second area R2 is provided with a plurality of isolation pillars 300. At least one isolation pillar 300 located in at least one area of ​​the second area R2 and the first area R1 includes: at least two conductive structures and at least one insulating structure. The at least one insulating structure is disposed between the at least two conductive structures, and at least one side of the at least two conductive structures is grooved.

[0211] In this disclosure, at least one side of at least two conductive structures is grooved, which can form an undercut structure between the conductive structure and the adjacent insulating structure, thereby cutting off the conductive path disposed between the adjacent isolation pillars and the path of the isolation pillars perpendicular to the substrate.

[0212] In an exemplary embodiment, when at least one side of at least two conductive structures is grooved, the edge of the sidewall can be a smooth curve or a straight line, and this disclosure does not limit it in any way.

[0213] This disclosure provides that at least one side of at least one conductive structure of at least one of a plurality of isolation pillars located in at least one region of the second region and the first region is grooved, so that the display substrate can form a plurality of undercut structures, which can de-energize the hole area, thereby effectively solving the black spot problem of the display substrate and improving the display effect of the display substrate.

[0214] In an exemplary embodiment, as shown in Figures 6 and 7, the hole region further includes a third region R3, which is located between the first region R1 and the second region R2. The display substrate further includes a circuit structure layer disposed on the substrate 10. The circuit structure layer includes multiple gate metal layers and multiple source / drain metal layers. At least one film layer, either an organic insulating layer or an inorganic insulating layer, is disposed between at least two metal layers. At least one inorganic insulating layer disposed on the side of the multiple gate metal layers near the substrate 10 is called a first composite insulating layer 20. The multiple inorganic insulating layers disposed between the multiple gate metal layers and the multiple source / drain metal layers are called second composite insulating layers 30. The first composite insulating layer 20 extends from the display region AA to the second region R2. The second composite insulating layer 30 is located in the display region AA and does not extend to the first region R1, or it extends from the display region AA to the third region R3. Figure 6 illustrates the case where the second composite insulating layer 30 is located in the display region AA and does not extend to the first region R1. Figure 7 illustrates the case where the second composite insulating layer 30 extends from the display region AA to the third region R3.

[0215] In an exemplary embodiment, the first composite insulating layer 20 may include a first insulating layer, and the second composite insulating layer 30 may include a plurality of inorganic insulating layers located on the side of the plurality of source and drain metal layers near the substrate, such as a second insulating layer, a third insulating layer, a fourth insulating layer, and a fifth insulating layer.

[0216] In an exemplary embodiment, as shown in Figures 6 and 7, the third region R3 may also be provided with an isolation dam 500, which includes a plurality of dam bases stacked sequentially along the direction away from the substrate, at least one dam base being located in at least one flat layer, and at least one dam base being located in a pixel definition layer.

[0217] In an exemplary embodiment, as shown in FIG6, when the second composite insulating layer 30 is located in the display area AA and does not extend to the first area R1, the isolation pillar 300 located in the first area R1 has the same shape as the one located in the second area R2. At this time, at least one isolation dam covers the side of the second composite insulating layer near the third area.

[0218] Figure 8 is a partial cross-sectional schematic diagram of the conductive structure located in at least one film layer among multiple source / drain metal layers. As shown in Figure 8, in an exemplary embodiment, when at least one conductive structure in the isolation pillar is located in at least one film layer among multiple source / drain metal layers, the conductive structure located in at least one film layer among multiple source / drain metal layers includes: a first isolation portion 3011, a second isolation portion 3012, and a third isolation portion 3013. Specifically, the first isolation portion 3011 is located on the side of the second isolation portion 3012 closer to the substrate 10, and the third isolation portion 3013 is located on the side of the second isolation portion 3012 away from the substrate 10.

[0219] In an exemplary embodiment, the orthographic projection of the surface of the second isolation portion 3012 near the substrate 10 onto the substrate 10 is within the range of the orthographic projection of the surface of the first isolation portion 3011 away from the substrate 10 onto the substrate 10. The orthographic projection of the surface of the second isolation portion 3012 away from the substrate 10 onto the substrate 10 is within the range of the orthographic projection of the surface of the third isolation portion 3013 near the substrate 10 onto the substrate 10. The orthographic projection of the surface of the second isolation portion 3012 away from the substrate 10 onto the substrate 10 is within the range of the orthographic projection of the surface of the second isolation portion 3012 near the substrate 10 onto the substrate 10. The sidewall of the second isolation portion 3012 is set at an acute angle to the surface of the second isolation portion 3012 near the substrate 10. Exemplarily, the longitudinal section of the second isolation portion 3012 can be trapezoidal, and the longitudinal section of the first isolation structure 301 can be I-shaped.

[0220] In an exemplary embodiment, the conductivity of the second isolation portion 3012 is greater than that of at least one of the first isolation portion 3011 and the third isolation portion 3013. In an exemplary embodiment, the material used to prepare the second isolation portion 3012 may be aluminum (Al) or copper (Cu), and the materials used to prepare the first isolation portion 3011 and the third isolation portion 3013 may be inert metals, such as titanium (Ti) or molybdenum (Mo).

[0221] In an exemplary embodiment, the display substrate may further include a cover structure. Figure 9 is a schematic diagram of the cover structure. As shown in Figure 9, the cover structure includes an organic structure 4011 and a cathode structure 4012 sequentially stacked on the substrate 10, wherein the orthographic projection of the cathode structure 4012 on the substrate 10 coincides with the orthographic projection of the organic structure 4011 on the substrate 10. The cover structure is interrupted at the grooves of at least two conductive structures included in the isolation pillar.

[0222] In an exemplary embodiment, the organic structure is disposed in the organic light-emitting layer, and the cathode structure may be disposed in the cathode conductive layer.

[0223] In an exemplary embodiment, at least one of the plurality of isolation pillars includes: a first conductive structure, a first insulating structure, and a second conductive structure. At least one side of the first and second conductive structures is grooved, and at least a portion of the second conductive structure is within the range of the orthogonal projection of the substrate onto the first insulating structure and the orthogonal projection of the first conductive structure onto the substrate. Exemplarily, the first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in another of the plurality of gate metal layers; or, the first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in one of the plurality of source / drain metal layers. The first insulating structure is disposed in at least one inorganic insulating layer located between the first and second conductive structures.

[0224] In an exemplary embodiment, at least one of the plurality of isolation pillars further includes: a first conductive structure, a first insulating structure, a second conductive structure, and a third conductive structure, wherein the third conductive structure is located on the side of the second conductive structure away from the substrate. At least one side of at least one of the first to third conductive structures is grooved, and at least a portion of the third conductive structure's orthographic projection onto the substrate falls within the range of the second conductive structure's orthographic projection onto the substrate. Exemplarily, either the first or second conductive structure is located in one of a plurality of gate metal layers, the third conductive structure is located in one of a plurality of source / drain metal layers, and the first insulating structure is disposed in at least one inorganic insulating layer located between the first and second conductive structures.

[0225] In an exemplary embodiment, at least one of the plurality of isolation pillars further includes: a first conductive structure, a first insulating structure, a second conductive structure, a second insulating structure, and a third conductive structure. At least one side of at least one of the first to third conductive structures is grooved, at least a portion of the third conductive structure's orthographic projection onto the substrate falls within the range of the second insulating structure's orthographic projection onto the substrate, and at least a portion of the third conductive structure's orthographic projection onto the substrate falls within the range of the second conductive structure's orthographic projection onto the substrate. Exemplarily, any one of the first, second, and third conductive structures is disposed in one of the plurality of gate metal layers; alternatively, any one of the first and second conductive structures is disposed in one of the plurality of gate metal layers, the third conductive structure is disposed in one of the plurality of source / drain metal layers, the first insulating structure is disposed in at least one inorganic insulating layer located between the first and second conductive structures, and the second insulating structure is disposed in at least one inorganic insulating layer located between the second and third conductive structures.

[0226] In an exemplary embodiment, at least one conductive structure of at least one isolation post includes a first sidewall and a second sidewall, and at least one insulating structure of at least one isolation post includes a first sidewall and a second sidewall. The first sidewall of the insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation post along a centerline perpendicular to the substrate.

[0227] In an exemplary embodiment, an insulating fill structure is provided between at least two adjacent isolation posts. The insulating fill structure covers the side of the two adjacent isolation posts closest to the insulating fill structure and the portion of the surface furthest from the substrate.

[0228] In an exemplary embodiment, at least one of the plurality of isolation pillars has an insulating structure on its surface away from the substrate. Exemplarily, when the structures of adjacent isolation pillars are symmetrically arranged with respect to a line perpendicular to the substrate, the insulating structures on the isolation pillars and the insulating structures on the adjacent isolation pillars are spaced apart or interconnected. When the structures of adjacent isolation pillars are symmetrically arranged with respect to a line perpendicular to the substrate, at least one insulating structure of one isolation pillar is spaced apart from at least one insulating structure of an adjacent isolation pillar or interconnected.

[0229] In an exemplary embodiment, the insulating structure includes a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the first sidewall of the conductive structure are located on a first side of the insulating post along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the second sidewall of the conductive structure are located on a second side of the insulating post along a centerline perpendicular to the substrate.

[0230] In an exemplary embodiment, FIG10 is a partial cross-sectional schematic diagram of the display substrate located in the second region, and FIG11 is a partial cross-sectional schematic diagram of the display substrate located in the second region. As shown in FIG10 and FIG11, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, and a second conductive structure 313 sequentially stacked on the substrate 10. An insulating filling structure 400 is provided between at least two adjacent isolation pillars 300, and the first sidewall and the second sidewall of at least one of the first conductive structures 311 and the second conductive structure 313 are groove-shaped.

[0231] In an exemplary embodiment, as shown in Figures 10 and 11, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, and the orthographic projection of the second conductive structure 313 on the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 on the substrate 10. The insulating filling structure 400 covers the sidewalls of the two adjacent isolation pillars 300 near the insulating filling structure 400 and the portion of the surface away from the substrate 10.

[0232] In an exemplary embodiment, the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure 313 is located in another of the multiple gate metal layers; alternatively, the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure is located in one of the multiple source / drain metal layers. A first insulating structure 312 is disposed in at least one inorganic insulating layer located between the layer containing the first conductive structure 311 and the layer containing the second conductive structure 313. FIG10 illustrates an example where the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure 313 is located in another of the multiple gate metal layers. FIG11 illustrates an example where the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure is located in one of the multiple source / drain metal layers.

[0233] In an exemplary embodiment, the first conductive structure 311 is located in one of the plurality of gate metal layers closest to the substrate 10, the second conductive structure 313 is located in one of the plurality of source / drain metal layers on the side furthest from the substrate 10, and the thickness of the first insulating structure 312 is in the range of 0.7 micrometers to 0.9 micrometers. Exemplarily, the thickness of the first insulating structure 312 may be 0.8 micrometers.

[0234] Figure 12 is a partial cross-sectional schematic diagram of the display substrate located in the second region. In an exemplary embodiment, as shown in Figure 12, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, and a third conductive structure 315 sequentially stacked on the substrate 10. An insulating filling structure 400 is provided between at least two adjacent isolation pillars 300, and the first and second sidewalls of at least one of the conductive structures 311 to 315 are grooved.

[0235] In an exemplary embodiment, as shown in FIG12, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, the orthographic projection of the third conductive structure 315 on the substrate 10 is within the range of the orthographic projection of the second conductive structure 313 on the substrate 10, and the insulating filling structure 400 covers the sidewalls of the two adjacent isolation pillars 300 near the insulating filling structure 400 and the portion of the surface away from the substrate 10.

[0236] In an exemplary embodiment, as shown in FIG12, any one of the first conductive structure 311 and the second conductive structure 313 is located in one of the multiple gate metal layers, the third conductive structure 315 is located in one of the multiple source and drain metal layers, and the first insulating structure 312 is disposed in at least one inorganic insulating layer located between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located.

[0237] In an exemplary embodiment, as shown in Figures 10 to 12, the surface of the first insulating structure 312 located in the second region R2 away from the substrate 10 includes a first surface, a second surface, and a third surface. The first surface and the third surface are respectively located on opposite sides of the second surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projections of the first surface and the third surface on the substrate 10 do not overlap with the second conductive structure 313. For at least two isolation pillars 300 with an insulating filling structure 400 disposed between them, the first surface is located on the side of the second surface away from the insulating filling structure 400, and the third surface is located on the side of the second surface close to the insulating filling structure 400. The covering structure includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603 spaced apart. The first covering structure 601 is disposed on the surface of the isolation pillar 300 away from the substrate 10. The first covering structures 601 on at least two isolation pillars 300 with insulating filling structures 400 are interconnected, and their orthogonal projections on the substrate 10 at least partially overlap with the orthogonal projections of the insulating filling structures 400 on the substrate 10. The second covering structure 602 is disposed on the first surface between at least two isolation pillars 300 with insulating filling structures 400 and on the first and third surfaces between which insulating filling structures 400 are not disposed. The third covering structure 603 is disposed between at least two isolation pillars 300 without insulating filling structures 400.

[0238] Figure 13 is a partial cross-sectional schematic diagram of the display substrate located in the second region. In an exemplary embodiment, as shown in Figure 13, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314 and a third conductive structure 315 sequentially stacked on the substrate 10, and an insulating filling structure 400 is provided between at least two adjacent isolation pillars 300.

[0239] As shown in Figure 13, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are within the range of the orthographic projection of the first insulating structure 312 on the substrate 10. The orthographic projections of the second conductive structure 313 and the third conductive structure 315 on the substrate 10 are within the range of the orthographic projection of the second insulating structure 314 on the substrate 10. The orthographic projection of the second conductive structure 313 on the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 on the substrate 10. The orthographic projection of the third conductive structure 315 on the substrate 10 is within the range of the orthographic projection of the second conductive structure 313 on the substrate 10. The insulating filling structure 400 covers the sidewalls of the two adjacent isolation pillars 300 near the insulating filling structure 400 and the part of the surface away from the substrate 10.

[0240] As shown in Figure 13, any one of the first conductive structure 311, the second conductive structure 313, and the third conductive structure 315 is disposed in one of the multiple gate metal layers. The first insulating structure 312 is disposed in at least one inorganic insulating layer located between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located. The second insulating structure 314 is disposed in at least one inorganic insulating layer located between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located.

[0241] Figure 14 is a partial cross-sectional schematic diagram of the display substrate located in the second region. In an exemplary embodiment, as shown in Figure 14, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, a third conductive structure 315, and a fourth conductive structure 317 sequentially stacked on the substrate 10, and an insulating filling structure 400 is provided between at least two adjacent isolation pillars 300.

[0242] As shown in Figure 14, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are within the range of the orthographic projection of the first insulating structure 312 on the substrate 10. The orthographic projections of the second conductive structure 313 and the third conductive structure 315 on the substrate 10 are within the range of the orthographic projection of the second insulating structure 314 on the substrate 10. The orthographic projection of the second conductive structure 313 on the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 on the substrate 10. The orthographic projection of the third conductive structure 315 on the substrate 10 is within the range of the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projection of the fourth conductive structure 317 on the substrate 10 is within the range of the orthographic projection of the third conductive structure 315 on the substrate 10. The insulating filling structure 400 covers the sidewalls of the two adjacent isolation pillars 300 near the insulating filling structure 400 and the part of the surface away from the substrate 10.

[0243] As shown in Figure 14, any one of the first conductive structures 311 to the third conductive structure 315 is disposed in one of the multiple gate metal layers, the fourth conductive structure 317 is located in one of the multiple source and drain metal layers, the first insulating structure 312 is disposed in at least one inorganic insulating layer located between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, and the second insulating structure 314 is disposed in at least one inorganic insulating layer located between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located.

[0244] In an exemplary embodiment, as shown in Figures 13 and 14, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface, a second surface, and a third surface. The first surface and the third surface are respectively located on opposite sides of the second surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projections of the first surface and the third surface on the substrate 10 do not overlap with the second conductive structure 313. For at least two isolation pillars 300 with an insulating filling structure 400 disposed between them, the first surface is located on the side of the second surface away from the insulating filling structure 400, and the third surface is located on the side of the second surface close to the insulating filling structure 400. The surface of the second insulating structure 314 away from the substrate 10 includes a fourth surface, a fifth surface, and a sixth surface. The fourth surface and the sixth surface are located on opposite sides of the fifth surface. The orthographic projection of the fifth surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projections of the fourth surface and the sixth surface on the substrate 10 do not overlap with the second conductive structure 313. For at least two isolation pillars 300 with an insulating filling structure 400 between them, the fourth surface is located on the side of the fifth surface away from the insulating filling structure 400, and the sixth surface is located on the side of the fifth surface closer to the insulating filling structure 400.

[0245] In an exemplary embodiment, as shown in Figures 13 and 14, the covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603, and a fourth covering structure 604. The first covering structure 601 is disposed on the surface of the isolation pillar 300 away from the substrate 10. The first covering structures 601 on at least two isolation pillars 300 with insulating filling structures 400 are interconnected, and their orthogonal projections on the substrate 10 at least partially overlap with the orthogonal projections of the insulating filling structures 400 on the substrate 10. The second covering structure 602 is disposed on the first surface between at least two isolation pillars 300 with insulating filling structures 400 and on the first and third surfaces between which insulating filling structures 400 are not disposed. The third covering structure 603 is disposed on the fourth surface between at least two isolation pillars 300 with insulating filling structures 400 and on the fourth and sixth surfaces between which insulating filling structures 400 are not disposed. The fourth covering structure 604 is disposed between at least two isolation pillars 300 without insulating filling structures 400.

[0246] In an exemplary embodiment, as shown in Figures 10 to 14, this disclosure can switch the conductive path between two adjacent isolation pillars by providing an insulating filling structure between at least two adjacent isolation pillars, thereby achieving power disconnection in the hole region along the direction parallel to the substrate.

[0247] Figure 15 is a partial cross-sectional schematic diagram six of the display substrate located in the second region; Figure 16 is a partial cross-sectional schematic diagram seven of the display substrate located in the second region; Figure 17 is a partial cross-sectional schematic diagram eight of the display substrate located in the second region; and Figure 18 is a partial cross-sectional schematic diagram nine of the display substrate located in the second region. In an exemplary embodiment, as shown in Figures 15 to 18, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, and a second conductive structure 313 sequentially stacked on the substrate 10. At least one isolation pillar 300 has an insulating structure 401 disposed on its surface away from the substrate 10. The first sidewall of any of the first conductive structures 311 and the second conductive structure 313 is grooved, and the second sidewall is sloped. At least a portion of the first sidewall of the first conductive structure 311 is projected onto the substrate 10 within the range of the projected first insulating structure 312 onto the substrate 10. At least a portion of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected first insulating structure 312 onto the substrate 10. At least a portion of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected first conductive structure 311 onto the substrate 10. The insulating structure 401 at least partially covers the surface of the second conductive structure 313 away from the substrate 10 and the second sidewall.

[0248] In an exemplary embodiment, the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure 313 is located in another of the multiple gate metal layers; alternatively, the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure 313 is located in one of the multiple source / drain metal layers. A first insulating structure 312 is disposed in at least one inorganic insulating layer between the layer containing the first conductive structure 311 and the layer containing the second conductive structure 313. An isolation insulating structure 401 is disposed in at least one inorganic insulating layer on the side of the second conductive structure 313 away from the substrate 10. Figures 15 to 18 illustrate an example where the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure 313 is located in another of the multiple gate metal layers.

[0249] In an exemplary embodiment, adjacent isolation pillars 300 have the same structure, or the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10. FIG15 is illustrated with the example of adjacent isolation pillars 300 having the same structure, and FIGS.16 to 18 are illustrated with the example of adjacent isolation pillars 300 having the structure symmetrically with respect to a straight line perpendicular to the base 10.

[0250] In an exemplary embodiment, as shown in Figures 16 to 18,

[0251] In an exemplary embodiment, as shown in Figures 16 to 18, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface and a second surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projection of the first surface on the substrate 10 and the second conductive structure 313 do not overlap. The first surface is located on the side of the second surface close to the first sidewall.

[0252] In an exemplary embodiment, as shown in Figures 15 to 18, the orthographic projection of the second sidewall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10, and the isolation insulating structure 401 also covers the second sidewall of the first conductive structure 311 and the second sidewall of the first insulating structure 312.

[0253] As shown in Figure 15, when the structures of adjacent isolation pillars 300 are the same, the display substrate further includes: a first covering structure 601 and a second covering structure 602. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, and the first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300.

[0254] As shown in Figures 16 to 18, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, two adjacent isolation pillars 300 are respectively the first adjacent isolation pillar 300 and the second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603, wherein... The first covering structure 601 covers the surface and second sidewall of the insulating structure 401 disposed on the isolation post 300 away from the substrate 10. The first covering structures 601 disposed on the isolation post 300 and the second adjacent isolation post 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation post 300. The third covering structure 603 is disposed between the isolation post 300 and the second adjacent isolation post 300. Figures 16 and 18 show the isolation post and the second adjacent isolation post, and Figure 17 shows the isolation post and the first adjacent isolation post.

[0255] In an exemplary embodiment, the insulating structure 401 disposed on the isolation column and the insulating structure 401 disposed on the second adjacent isolation column may be disposed at intervals or may be interconnected. Figures 16 and 17 illustrate the example of the insulating structure 401 disposed on the isolation column and the insulating structure 401 disposed on the second adjacent isolation column being disposed at intervals, while Figure 18 illustrates the example of the insulating structure 401 disposed on the isolation column and the insulating structure 401 disposed on the second adjacent isolation column being interconnected.

[0256] Figure 19 is a partial cross-sectional schematic diagram ten of the display substrate located in the second region, Figure 20 is a partial cross-sectional schematic diagram eleven of the display substrate located in the second region, Figure 21 is a partial cross-sectional schematic diagram twelfth of the display substrate located in the second region, and Figure 22 is a partial cross-sectional schematic diagram thirteenth of the display substrate located in the second region. In an exemplary embodiment, the display substrates provided in Figures 19 to 22 differ from those provided in Figures 15 to 18 in that the orthographic projections of the second sidewall of the isolation insulating structure 401 and the second sidewall of the first conductive structure 311 onto the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 onto the substrate 10. The first insulating structure 312 covers the second sidewall of the first conductive structure 311, and the isolation insulating structure 401 is partially disposed on the surface of the first insulating structure 312 away from the substrate 10.

[0257] As shown in Figure 19, when the structures of adjacent isolation pillars 300 are the same, the display substrate further includes: a first covering structure 601 and a second covering structure 602. The first covering structure 601 covers the surface of the isolation insulating structure 401 away from the substrate 10 and the second sidewall, as well as the second sidewall of the first insulating structure 312. The first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation pillar 300.

[0258] As shown in Figures 20 to 22, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, the two adjacent isolation pillars 300 are the first adjacent isolation pillar 300 and the second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure also includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface of the covering insulating structure 401 on the isolation pillar 300 away from the base 10 and the second sidewall of the first insulating structure 312. The first covering structures 601 on the isolation pillar 300 and the second adjacent isolation pillar 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation pillar 300. The third covering structure 603 is disposed between the isolation pillar 300 and the second adjacent isolation pillar 300.

[0259] In an exemplary embodiment, the insulating structure 401 disposed on the isolation column and the insulating structure 401 disposed on the second adjacent isolation column can be spaced apart, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart. Alternatively, the insulating structure 401 disposed on the isolation column and the insulating structure 401 disposed on the second adjacent isolation column can be interconnected, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected. Figures 20 and 21 illustrate the example where the insulating structure 401 disposed on the isolation column and the insulating structure 401 disposed on the second adjacent isolation column can be spaced apart, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart. Figure 22 illustrates the example where the insulating structure 401 disposed on the isolation column and the insulating structure 401 disposed on the second adjacent isolation column can be interconnected, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected.

[0260] Figure 23 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 23 and the display substrate provided in Figure 15 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0261] Figure 24 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 24 and the display substrate provided in Figure 16 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0262] Figure 25 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 25 and the display substrate provided in Figure 17 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0263] Figure 26 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 26 and the display substrate provided in Figure 18 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0264] Figure 27 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 27 and the display substrate provided in Figure 19 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0265] Figure 28 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 28 and the display substrate provided in Figure 20 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0266] Figure 29 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 29 and the display substrate provided in Figure 21 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0267] Figure 30 is a partial cross-sectional schematic diagram of the display substrate located in the second region. The difference between the display substrate provided in Figure 30 and the display substrate provided in Figure 22 is that the second conductive structure is located in one of the multiple source and drain metal layers.

[0268] Figures 15 to 30 show that at least one isolation pillar has an insulating structure on its surface away from the substrate, cutting off the conductive path between adjacent isolation pillars.

[0269] Figure 31 is a partial cross-sectional schematic diagram twenty-two of the display substrate located in the second region; Figure 32 is a partial cross-sectional schematic diagram twenty-three of the display substrate located in the second region; Figure 33 is a partial cross-sectional schematic diagram twenty-four of the display substrate located in the second region; and Figure 34 is a partial cross-sectional schematic diagram twenty-five of the display substrate located in the second region. In an exemplary embodiment, as shown in Figures 31 to 34, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, and a second conductive structure 313 sequentially stacked on the substrate 10.

[0270] In an exemplary embodiment, as shown in Figures 31 to 34, at least a portion of the first sidewall of the first conductive structure 311 is projected onto the substrate 10 within the range of the projected first insulating structure 312 onto the substrate 10. At least a portion of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected first insulating structure 312 onto the substrate 10. At least a portion of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected first conductive structure 311 onto the substrate 10. The first insulating structure 312 covers the second sidewall of the first conductive structure 311.

[0271] In an exemplary embodiment, as shown in Figures 31 to 34, a first conductive structure 311 is located in one of the multiple gate metal layers, a second conductive structure 313 is disposed in one of the multiple source / drain metal layers, and a first insulating structure 312 is disposed in at least one inorganic insulating layer located between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located.

[0272] In an exemplary embodiment, as shown in Figures 31 to 34, adjacent isolation pillars 300 have the same structure, or the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10. Figure 31 illustrates an example where adjacent isolation pillars 300 have the same structure, and Figures 32 to 34 illustrate an example where the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10.

[0273] In an exemplary embodiment, as shown in Figures 31 to 34, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface, a second surface, and a third surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projections of the first surface and the third surface on the substrate 10 do not overlap with the second conductive structure 313. The first surface is located on the side of the second surface near the first sidewall, and the third surface is located on the side of the second surface near the second sidewall.

[0274] In an exemplary embodiment, as shown in FIG31, when the structures of adjacent isolation pillars 300 are the same, the display substrate further includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603 disposed at intervals. The first covering structure 601 is disposed on the surface of the second conductive structure 313 away from the substrate 10. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation pillar 300. The third covering structure 603 is disposed on the second surface of the first insulating structure 312 and covers the second sidewall of the first insulating structure 312. The third covering structure 603 also extends between adjacent isolation pillars 300.

[0275] In an exemplary embodiment, as shown in Figures 32 to 34, when the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10, two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The display substrate further includes: a first cover structure 601, a second cover structure 602, a third cover structure 603, and a fourth cover structure 604 spaced apart. The first cover structure 601 is disposed on the surface of the second conductive structure 313 away from the substrate 10. The second cover structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation pillar 300. The third cover structure 603 is disposed on the second surface of the first insulating structure 312 of the isolation pillar 300 and covers the second sidewall of the first insulating structure 312. The third cover structure 603 disposed on the isolation pillar 300 is interconnected with the third cover structure 603 disposed on the second adjacent isolation pillar 300. The fourth cover structure 604 is disposed between the isolation pillar 300 and the second adjacent isolation pillar 300.

[0276] In an exemplary embodiment, the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart or interconnected. Figures 32 and 33 illustrate the example where the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart, while Figure 34 illustrates the example where the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected.

[0277] Figure 35 is a partial cross-sectional schematic diagram twenty-six of the display substrate located in the second region; Figure 36 is a partial cross-sectional schematic diagram twenty-seven of the display substrate located in the second region; Figure 37 is a partial cross-sectional schematic diagram twenty-eight of the display substrate located in the second region; and Figure 38 is a partial cross-sectional schematic diagram twenty-nine of the display substrate located in the second region. In an exemplary embodiment, as shown in Figures 35 to 38, the isolation pillar 300 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, and a third conductive structure 315 sequentially stacked on the substrate 10. At least one isolation pillar 300 has an insulating isolation structure 401 disposed on the side away from the substrate 10.

[0278] In an exemplary embodiment, as shown in Figures 35 to 38, at least a portion of the first sidewall of the first conductive structure 311 is projected onto the substrate 10 within the range of the projected first insulating structure 312 onto the substrate 10; at least a portion of the first sidewall of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected second insulating structure 314 onto the substrate 10; at least a portion of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected first conductive structure 311 onto the substrate 10; at least a portion of the third conductive structure 315 is projected onto the substrate 10 within the range of the projected second conductive structure 313 onto the substrate 10; and the insulating structure 401 at least partially covers the surface of the third conductive structure 315 away from the substrate 10 and the second sidewall.

[0279] In an exemplary embodiment, as shown in Figures 35 to 38, any one of the first conductive structures 311 to the third conductive structure 315 is disposed in one of the multiple gate metal layers, the first insulating structure 312 is disposed in at least one insulating layer located between the first conductive structure 311 and the second conductive structure 313, and the second insulating structure 314 is disposed in at least one insulating layer located between the second conductive structure 313 and the third conductive structure 315.

[0280] In an exemplary embodiment, adjacent isolation pillars 300 have the same structure, or the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a line perpendicular to the base 10. FIG35 illustrates an example where adjacent isolation pillars 300 have the same structure. FIG36 to FIG38 illustrate adjacent isolation pillars 300 with respect to a line perpendicular to the base 10.

[0281] In an exemplary embodiment, as shown in Figures 35 to 38, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface and a second surface. The orthographic projection of the second surface onto the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 onto the substrate 10. The orthographic projection of the first surface onto the substrate 10 and the second conductive structure 313 do not overlap. The first surface is located on the side of the second surface closer to the first sidewall. The surface of the second insulating structure 314 away from the substrate 10 includes a third surface and a fourth surface. The orthographic projection of the fourth surface onto the substrate 10 overlaps with the orthographic projection of the third conductive structure 315 onto the substrate 10. The orthographic projection of the third surface onto the substrate 10 and the third conductive structure 315 do not overlap. The third surface is located on the side of the fourth surface closer to the first sidewall.

[0282] In an exemplary embodiment, as shown in Figures 35 to 38, the orthographic projection of the second sidewall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10, and the orthographic projection of the second sidewall of the second conductive structure 313 on the substrate 10 does not overlap with the orthographic projection of the second insulating structure 314 on the substrate 10. The insulating structure 401 also covers the second sidewall of the first conductive structure 311, the second sidewall of the first insulating structure 312, the second sidewall of the second conductive structure 313, and the second sidewall of the second insulating structure 314.

[0283] In an exemplary embodiment, as shown in FIG35, when the structures of adjacent isolation pillars 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, and the first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300, and the third covering structure 603 is disposed on the third surface of the second insulation structure 314 of the isolation pillar 300.

[0284] In an exemplary embodiment, as shown in Figures 36 to 38, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is disposed opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is disposed opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface of the insulating structure 401 disposed on the isolation post 300 away from the substrate 10 and the second sidewall. The first covering structures 601 disposed on the isolation post 300 and the second adjacent isolation post 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation post 300. The third covering structure 603 is disposed on the second surface of the second insulating structure 314 of the isolation post 300. The fourth covering structure 604 is disposed between the isolation post 300 and the second adjacent isolation post 300.

[0285] In an exemplary embodiment, the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart or interconnected. Figures 36 and 37 illustrate the example where the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart, while Figure 38 illustrates the example where the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected.

[0286] Figure 39 is a partial cross-sectional schematic diagram of the display substrate located in the second region, Figure 40 is a partial cross-sectional schematic diagram of the display substrate located in the second region, Figure 41 is a partial cross-sectional schematic diagram of the display substrate located in the second region, and Figure 42 is a partial cross-sectional schematic diagram of the display substrate located in the second region. In an exemplary embodiment, the display substrates provided in Figures 39 to 42 differ from those provided in Figures 35 to 38 in that the orthographic projections of the second sidewall of the insulating structure 401, the second sidewall of the first conductive structure 311, and the second sidewall of the second conductive structure 313 onto the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 onto the substrate 10. The first insulating structure 312 covers the second sidewall of the first conductive structure 311, the second insulating structure 314 covers the second sidewall of the second conductive structure 313, and the insulating structure 401 is partially disposed on the surface of the second insulating structure 314 away from the substrate 10.

[0287] In an exemplary embodiment, as shown in FIG39, when adjacent isolation pillars 300 have the same structure, the covering structure includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, the second sidewall of the first insulation structure 312, and the second sidewall of the second insulation structure 314. The first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300, and the third covering structure 603 is disposed on the third surface of the second insulation structure 314 of the isolation pillar 300.

[0288] In an exemplary embodiment, as shown in Figures 40 to 42, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603, and a fourth covering structure 604, wherein the first covering structure 601... The cover structure 601 covers the surface of the cover insulating structure 401 away from the substrate 10 and the second sidewall, the second sidewall of the first insulating structure 312 and the second sidewall of the second insulating structure 314 disposed on the isolation post 300. The first cover structure 601 disposed on the isolation post 300 and the second adjacent isolation post 300 are interconnected. The second cover structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation post 300. The third cover structure 603 is disposed on the third surface of the second insulating structure 314 of the isolation post 300. The fourth cover structure 604 is disposed between the isolation post 300 and the second adjacent isolation post 300.

[0289] In an exemplary embodiment, the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart, the second insulating structure of the isolation column and the second insulating structure of the second adjacent isolation column can be spaced apart, and the insulating structure disposed on the isolation column and the insulating structure disposed on the second adjacent isolation column can be spaced apart. Alternatively, the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected, and the second insulating structure of the isolation column and the second insulating structure of the second adjacent isolation column can be interconnected. Figures 40 and 41 illustrate examples where the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart, and the insulating structure disposed on the isolation column and the insulating structure disposed on the second adjacent isolation column can be spaced apart. Figure 42 illustrates examples where the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected, and the second insulating structure of the isolation column and the second insulating structure of the second adjacent isolation column can be interconnected.

[0290] Figure 43 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 34), Figure 44 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 35), Figure 45 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 36), and Figure 46 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 37). In an exemplary embodiment, as shown in Figures 43 to 46, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, and a third conductive structure 315 sequentially stacked on the substrate 10. At least one of the isolation pillars 300 has an insulating isolation structure 401 disposed on its surface away from the substrate 10.

[0291] In an exemplary embodiment, as shown in Figures 43 to 46, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, and the orthographic projection of the third conductive structure 315 on the substrate 10 is within the range of the orthographic projection of the second conductive structure 313 on the substrate 10; the second insulating structure 314 covers the portion of the second conductive structure 313 away from the substrate 10 and the second sidewall, as well as the second sidewalls of the first conductive structure 311 and the first insulating structure 312; a portion of the third conductive structure 315 is connected to the portion of the second conductive structure 313 away from the substrate 10; the third conductive structure 315 is stepped; and the insulating isolation structure 401 covers the second sidewall of the third conductive structure 315 and the second sidewall of the insulating isolation structure 401.

[0292] In an exemplary embodiment, as shown in Figures 43 to 46, a first conductive structure 311 is located in one of the multiple gate metal layers, a second conductive structure 313 is located in another of the multiple gate metal layers, a third conductive structure 315 is located in one of the multiple source / drain metal layers near the substrate 10, a first insulating structure 312 is disposed in at least one inorganic insulating layer located between the first conductive structure 311 and the second conductive structure 313, a second insulating structure 314 is disposed in at least one inorganic insulating layer located between the second conductive structure 313 and the third conductive structure 315, and an isolation insulating structure 401 is disposed in at least one inorganic insulating layer located among the multiple source / drain metal layers.

[0293] In an exemplary embodiment, adjacent isolation pillars 300 have the same structure, or adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10. FIG43 is illustrated with the example of adjacent isolation pillars 300 having the same structure, and FIGS44 to 46 are illustrated with the example of adjacent isolation pillars 300 being arranged symmetrically with respect to a straight line perpendicular to the base 10.

[0294] In an exemplary embodiment, as shown in Figures 43 to 46, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface and a second surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projection of the first surface on the substrate 10 and the second conductive structure 313 do not overlap. The first surface is located on the side of the second surface close to the first sidewall.

[0295] In an exemplary embodiment, as shown in Figures 43 to 46, the orthographic projection of the second sidewall of the first conductive structure 311 onto the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 onto the substrate 10.

[0296] In an exemplary embodiment, as shown in FIG43, when the structures of adjacent isolation pillars 300 are the same, the covering structure includes: a first covering structure 601 and a second covering structure 602. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, and the first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300.

[0297] In an exemplary embodiment, as shown in Figures 44 to 46, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface of the insulating structure 401 on the isolation pillar 300 away from the base 10 and the second sidewall. The first covering structure 601 on the isolation pillar 300 and the second adjacent isolation pillar 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation pillar 300. The third covering structure 603 is disposed between the isolation pillar 300 and the second adjacent isolation pillar 300.

[0298] In an exemplary embodiment, the second insulating structure of the isolation column is spaced apart from the second insulating structure of the second adjacent isolation column, and the isolation insulating structure disposed on the isolation column is spaced apart from the isolation insulating structure disposed on the second adjacent isolation column; or, the second insulating structure of the isolation column is interconnected with the second insulating structure of the second adjacent isolation column, and the isolation insulating structure disposed on the isolation column is interconnected with the isolation insulating structure disposed on the second adjacent isolation column.

[0299] Figure 47 is a partial cross-sectional schematic diagram thirty-eight of the display substrate located in the second region, Figure 48 is a partial cross-sectional schematic diagram thirty-nine of the display substrate located in the second region, Figure 49 is a partial cross-sectional schematic diagram forty of the display substrate located in the second region, and Figure 50 is a partial cross-sectional schematic diagram forty-one of the display substrate located in the second region. In an exemplary embodiment, as shown in Figures 47 to 50, the isolation pillar 300 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, and a third conductive structure 315 sequentially stacked on the substrate 10. At least one isolation pillar 300 has an insulating structure 401 disposed on its surface away from the substrate 10. The first sidewall of at least one of the first conductive structures 311 and the second conductive structure 313 is grooved, and the second sidewall is sloped. The first sidewall of the third conductive structure 315 is grooved, and the second sidewall is sloped.

[0300] In an exemplary embodiment, as shown in Figures 47 to 50, at least a portion of the first sidewall of the first conductive structure 311 is projected onto the substrate 10 within the range of the projected first insulating structure 312 onto the substrate 10; at least a portion of the first sidewall of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected second insulating structure 314 onto the substrate 10; at least a portion of the second conductive structure 313 is projected onto the substrate 10 within the range of the projected first conductive structure 311 onto the substrate 10; at least a portion of the third conductive structure 315 is projected onto the substrate 10 within the range of the projected second conductive structure 313 onto the substrate 10; and the insulating structure 401 at least partially covers the surface of the third conductive structure 315 away from the substrate 10 and the second sidewall.

[0301] In an exemplary embodiment, as shown in Figures 47 to 50, a first conductive structure 311 is disposed in one of the multiple gate metal layers, a second conductive structure 313 is disposed in another of the multiple gate metal layers, a third conductive structure 315 is disposed in one of the multiple source / drain metal layers, a first insulating structure 312 is disposed in at least one insulating layer located between the film layer containing the first conductive structure 311 and the film layer containing the second conductive structure 313, a second insulating structure 314 is disposed in at least one insulating layer located between the film layer containing the second conductive structure 313 and the film layer containing the third conductive structure 315, and an isolation insulating layer is disposed in at least one inorganic insulating layer located between the multiple source / drain metal layers.

[0302] In an exemplary embodiment, adjacent isolation pillars 300 have the same structure, or the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10. FIG47 illustrates an example of adjacent isolation pillars 300 having the same structure, while FIGS48 to 50 illustrate an example of adjacent isolation pillars 300 having the same structure with respect to a straight line perpendicular to the base 10.

[0303] In an exemplary embodiment, as shown in Figures 47 to 50, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface and a second surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projection of the first surface on the substrate 10 does not overlap with the second conductive structure 313. The first surface is located on the side of the second surface close to the first sidewall.

[0304] In an exemplary embodiment, as shown in Figures 47 to 50, the orthographic projection of the second sidewall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10, and the isolation insulating structure 401 also covers the second sidewall of the first conductive structure 311, the second sidewall of the first insulating structure 312, and the second sidewall of the second conductive structure 313.

[0305] In an exemplary embodiment, as shown in FIG47, when the structures of adjacent isolation pillars 300 are the same, the covering structure includes: a first covering structure 601 and a second covering structure 602. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, and the first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300.

[0306] In an exemplary embodiment, as shown in Figures 48 to 50, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, the two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface of the insulating structure 401 on the isolation pillar 300 away from the base 10 and the second sidewall. The first covering structure 601 on the isolation pillar 300 and the second adjacent isolation pillar 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation pillar 300. The third covering structure 603 is disposed between the isolation pillar 300 and the second adjacent isolation pillar 300.

[0307] In an exemplary embodiment, the insulating structure disposed on the isolation column is spaced apart from the insulating structure disposed on the second adjacent isolation column, or they are interconnected. Figures 48 and 49 illustrate an example where the insulating structure disposed on the isolation column is spaced apart from the insulating structure disposed on the second adjacent isolation column. Figure 50 illustrates an example where the insulating structure disposed on the isolation column is interconnected with the insulating structure disposed on the second adjacent isolation column.

[0308] Figure 51 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 42), Figure 52 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 43), Figure 53 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 44), and Figure 54 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 45). In an exemplary embodiment, the display substrates provided in Figures 51 to 54 differ from those provided in Figures 47 to 50 in that the orthographic projections of the second sidewall of the insulating structure 401, the second sidewall of the first conductive structure 311, and the second sidewall of the second conductive structure 313 onto the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 onto the substrate 10. The first insulating structure 312 covers the second sidewall of the first conductive structure 311, and the insulating structure 401 is partially disposed on the surface of the first insulating structure 312 away from the substrate 10.

[0309] As shown in Figure 51, when the structures of adjacent isolation pillars 300 are the same, the display substrate further includes: a first covering structure 601 and a second covering structure 602. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, and the first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300.

[0310] As shown in Figures 52 to 54, when the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10, the two adjacent isolation pillars 300 are the first adjacent isolation pillar 300 and the second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface of the insulating structure 401 on the isolation pillar 300 away from the base 10 and the second sidewall. The first covering structure 601 on the isolation pillar 300 and the second adjacent isolation pillar 300 are interconnected. The second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation pillar 300. The third covering structure 603 is arranged between the isolation pillar 300 and the second adjacent isolation pillar 300.

[0311] In an exemplary embodiment, the first insulating structure of the isolation column is spaced apart from the first adjacent structure of the second adjacent isolation column, and the insulating structure disposed on the isolation column is spaced apart from the insulating structure disposed on the second adjacent isolation column; alternatively, the first insulating structure of the isolation column is interconnected with the first adjacent structure of the second adjacent isolation column, and the insulating structure disposed on the isolation column is interconnected with the insulating structure disposed on the second adjacent isolation column. Figures 52 and 53 illustrate the example of the first insulating structure of the isolation column being spaced apart from the first adjacent structure of the second adjacent isolation column, and the insulating structure disposed on the isolation column being spaced apart from the insulating structure disposed on the second adjacent isolation column. Figure 54 illustrates the example of the first insulating structure of the isolation column being interconnected with the first adjacent structure of the second adjacent isolation column, and the insulating structure disposed on the isolation column being interconnected with the insulating structure disposed on the second adjacent isolation column.

[0312] Figure 55 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 46), Figure 56 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 47), Figure 57 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 48), and Figure 58 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 49). In an exemplary embodiment, as shown in Figures 55 to 58, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, a third conductive structure 315, a third insulating structure 316, and a fourth conductive structure 317 sequentially stacked on the substrate 10. At least one isolation pillar 300 has an isolation insulating structure 401 disposed on its surface away from the substrate 10. The first sidewall of at least one of the first conductive structures 311, the second conductive structure 313, and the third conductive structure 315 is grooved, and the second sidewall is sloped. The first sidewall of the fourth conductive structure 317 is grooved, and the second sidewall of the fourth conductive structure 317 is sloped.

[0313] In an exemplary embodiment, as shown in Figures 55 to 58, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 onto the substrate 10 are within the range of the orthographic projection of the first insulating structure 312 onto the substrate 10. The orthographic projections of the second conductive structure 313 and the third conductive structure 315 onto the substrate 10 are within the range of the orthographic projection of the second insulating structure 314 onto the substrate 10. The orthographic projection of the second conductive structure 313 onto the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 onto the substrate 10. The orthographic projection of the third conductive structure 315 onto the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 onto the substrate 10. Within the range of the orthographic projection of the second conductive structure 313 onto the substrate 10, the orthographic projection of the fourth conductive structure 317 onto the substrate 10 lies within the range of the orthographic projection of the third conductive structure 315 onto the substrate 10. The third insulating structure 316 covers the portion of the surface and second sidewall of the third conductive structure 315 away from the substrate 10. A portion of the fourth conductive structure 317 is connected to the portion of the surface of the third conductive structure 315 away from the substrate 10. The fourth conductive structure 317 is stepped. The isolation insulating structure 401 covers the second sidewall of the fourth conductive structure 317 and the second sidewall of the isolation insulating structure 401.

[0314] In an exemplary embodiment, as shown in Figures 55 to 58, any one of the first conductive structures 311 to the third conductive structure 315 is disposed in one of the multiple gate metal layers. The first insulating structure 312 is disposed in at least one inorganic insulating layer located between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located. The second insulating structure 314 is disposed in at least one inorganic insulating layer located between the second conductive structure 313 and the third conductive structure 315. The third insulating structure 316 is disposed in at least one inorganic insulating layer located between the third conductive structure 315 and the fourth conductive structure 317. The isolation insulating structure 401 is disposed in at least one inorganic insulating layer located among the multiple source and drain metal layers.

[0315] In an exemplary embodiment, adjacent isolation pillars 300 have the same structure, or adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10. FIG55 is illustrated with the example of adjacent isolation pillars 300 having the same structure, and FIG56 to FIG58 are illustrated with the example of adjacent isolation pillars 300 being arranged symmetrically with respect to a straight line perpendicular to the base 10.

[0316] In an exemplary embodiment, as shown in Figures 55 to 58, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface and a second surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projection of the first surface on the substrate 10 and the second conductive structure 313 do not overlap. The first surface is located on the side of the second surface close to the first sidewall.

[0317] In an exemplary embodiment, as shown in Figures 55 to 58, the surface of the second insulating structure 314 away from the substrate 10 includes a third surface and a fourth surface. The orthographic projection of the fourth surface on the substrate 10 overlaps with the orthographic projection of the third conductive structure 315 on the substrate 10. The orthographic projection of the third surface on the substrate 10 and the third conductive structure 315 do not overlap. The third surface is located on the side of the fourth surface near the first sidewall.

[0318] In an exemplary embodiment, as shown in Figures 55 to 58, the orthographic projection of the second sidewall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10, and the orthographic projection of the second sidewall of the second conductive structure 313 on the substrate 10 does not overlap with the orthographic projection of the second insulating structure 314 on the substrate 10.

[0319] In an exemplary embodiment, as shown in FIG55, when the structures of adjacent isolation pillars 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, and the first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300, and the third covering structure 603 is disposed on the third surface of the second insulation structure 314 of the isolation pillar 300.

[0320] In an exemplary embodiment, as shown in Figures 56 to 58, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603, and... The fourth covering structure 604 includes a first covering structure 601 covering the surface of the insulating structure 401 disposed on the isolation post 300 away from the substrate 10 and the second sidewall. The first covering structures 601 disposed on the isolation post 300 and the second adjacent isolation post 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation post 300. The third covering structure 603 is disposed on the third surface of the second insulating structure 314 of the isolation post 300. The fourth covering structure 604 is disposed between the isolation post 300 and the second adjacent isolation post 300.

[0321] In an exemplary embodiment, the third insulating structure of the isolation column is spaced apart from the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure disposed on the isolation column is spaced apart from the third insulating structure disposed on the second adjacent insulating structure; alternatively, the third insulating structure of the isolation column is interconnected with the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure disposed on the isolation column is interconnected with the third insulating structure disposed on the second adjacent insulating structure. Figures 56 and 57 illustrate examples where the third insulating structure of the isolation column is spaced apart from the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure disposed on the isolation column is spaced apart from the third insulating structure disposed on the second adjacent insulating structure. Figure 58 illustrates examples where the third insulating structure of the isolation column is interconnected with the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure disposed on the isolation column is interconnected with the third insulating structure disposed on the second adjacent insulating structure.

[0322] Figure 59 is a partial cross-sectional schematic diagram of the display substrate located in the second region, Figure 60 is a partial cross-sectional schematic diagram of the display substrate located in the second region, Figure 61 is a partial cross-sectional schematic diagram of the display substrate located in the second region, and Figure 62 is a partial cross-sectional schematic diagram of the display substrate located in the second region. In an exemplary embodiment, as shown in Figures 59 to 62, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, a third conductive structure 315, and a fourth conductive structure 317 sequentially stacked on the substrate 10. At least one isolation pillar 300 has an insulating structure 401 disposed on its surface away from the substrate 10. The first sidewall of at least one of the first conductive structures 311 to the third conductive structure 315 is grooved, and the second sidewall is sloped. The first sidewall of the fourth conductive structure 317 is grooved, and the second sidewall is sloped.

[0323] In an exemplary embodiment, as shown in Figures 59 to 62, at least a portion of the orthographic projection of the first sidewall of the first conductive structure 311 onto the substrate 10 lies within the range of the orthographic projection of the first insulating structure 312 onto the substrate 10; at least a portion of the orthographic projection of the first sidewall of the second conductive structure 313 onto the substrate 10 lies within the range of the orthographic projection of the second insulating structure 314 onto the substrate 10; the orthographic projection of the second conductive structure 313 onto the substrate 10 lies within the range of the orthographic projection of the first conductive structure 311 onto the substrate 10; the orthographic projection of the third conductive structure 315 onto the substrate 10 lies within the range of the orthographic projection of the second conductive structure 313 onto the substrate 10; the orthographic projection of the fourth conductive structure 317 onto the substrate 10 lies within the range of the orthographic projection of the third conductive structure 315 onto the substrate 10; and the insulating structure 401 at least partially covers the surface of the fourth conductive structure 317 away from the substrate 10 and the second sidewall.

[0324] In an exemplary embodiment, as shown in Figures 59 to 62, any one of the first conductive structures 311 to the third conductive structure 315 is disposed in one of the multiple gate metal layers, the fourth conductive structure 317 is located in one of the multiple source / drain metal layers, the first insulating structure 312 is disposed in at least one insulating layer located between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, the second insulating structure 314 is disposed in at least one insulating layer located between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located, and the isolation insulating layer is located in at least one inorganic insulating layer between the multiple source / drain metal layers.

[0325] In an exemplary embodiment, adjacent isolation pillars 300 have the same structure, or the structures of adjacent isolation pillars 300 are arranged symmetrically with respect to a straight line perpendicular to the base 10. FIG59 is illustrated with the example of adjacent isolation pillars 300 having the same structure, and FIGS60 to 62 are illustrated with the example of adjacent isolation pillars 300 having the structure symmetrically with respect to a straight line perpendicular to the base 10.

[0326] In an exemplary embodiment, as shown in Figures 59 to 62, the surface of the first insulating structure 312 away from the substrate 10 includes a first surface and a second surface. The orthographic projection of the second surface onto the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 onto the substrate 10. The orthographic projection of the first surface onto the substrate 10 does not overlap with the orthographic projection of the second conductive structure 313. The first surface is located on the side of the second surface near the first sidewall. The surface of the second insulating structure 314 away from the substrate 10 includes a third surface and a fourth surface. The orthographic projection of the fourth surface onto the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 onto the substrate 10. The orthographic projection of the third surface onto the substrate 10 does not overlap with the orthographic projection of the second conductive structure 313. The third surface is located on the side of the fourth surface near the first sidewall.

[0327] In an exemplary embodiment, as shown in Figures 59 to 62, the orthographic projection of the second sidewall of the first conductive structure 311 onto the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 onto the substrate 10, and the orthographic projection of the second partition wall of the second conductive structure 313 onto the substrate 10 does not overlap with the orthographic projection of the second insulating structure 314 onto the substrate 10. The isolation insulating structure 401 also covers the second sidewall of the first conductive structure 311, the second sidewall of the first insulating structure 312, the second sidewall of the second conductive structure 313, the second sidewall of the second insulating structure 314, and the second sidewall of the third conductive structure 315.

[0328] In an exemplary embodiment, as shown in FIG59, when the structures of adjacent isolation pillars 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, and the first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300, and the third covering structure 603 is disposed on the second surface of the second insulation structure 314 of the isolation pillar 300.

[0329] In an exemplary embodiment, as shown in Figures 60 to 62, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the base 10, two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of the isolation pillar 300 is arranged opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of the isolation pillar 300 is arranged opposite to the second sidewall of the second adjacent isolation pillar 300. The covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603, and... The fourth covering structure 604 includes a first covering structure 601 covering the surface of the insulating structure 401 disposed on the isolation post 300 away from the substrate 10 and the second sidewall. The first covering structures 601 disposed on the isolation post 300 and the second adjacent isolation post 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation post 300. The third covering structure 603 is disposed on the third surface of the second insulating structure 314 of the isolation post 300. The fourth covering structure 604 is disposed between the isolation post 300 and the second adjacent isolation post 300.

[0330] In an exemplary embodiment, the insulating structure disposed on the insulating post is spaced apart from the insulating structure disposed on the second adjacent insulating post, or they are interconnected. Figures 60 and 61 illustrate the example of the insulating structure disposed on the insulating post being spaced apart from the insulating structure disposed on the second adjacent insulating post, while Figure 62 illustrates the example of the insulating structure disposed on the insulating post being interconnected with the insulating structure disposed on the second adjacent insulating post.

[0331] Figure 63 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 54), Figure 64 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 55), Figure 65 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 56), and Figure 66 is a partial cross-sectional schematic diagram of the display substrate located in the second region (Figure 57). In an exemplary embodiment, the display substrates provided in Figures 63 to 66 differ from those provided in Figures 59 to 62 in that, in the display substrates provided in Figures 63 to 66, the orthographic projections of the second sidewalls of the insulating structure 401, the second sidewalls of the first conductive structure 311, the second sidewalls of the second conductive structure 313, the second sidewalls of the third conductive structure 315, and the second sidewalls of the fourth conductive structure 317 onto the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 onto the substrate 10. The first insulating structure 312 covers the second sidewall of the first conductive structure 311, the second insulating structure 314 covers the second sidewall of the second conductive structure 313, and the insulating structure 401 is partially disposed on the surface of the second insulating structure 314 away from the substrate 10.

[0332] As shown in Figure 63, when adjacent isolation pillars 300 have the same structure, the covering structure includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface of the isolation insulation structure 401 away from the substrate 10 and the second sidewall, the second sidewall of the second insulation structure 314, and the second sidewall of the first insulation structure 312. The first covering structure 601 also extends between adjacent isolation pillars 300. The second covering structure 602 is disposed on the first surface of the first insulation structure 312 of the isolation pillar 300, and the third covering structure 603 is disposed on the third surface of the second insulation structure 314 of the isolation pillar 300.

[0333] As shown in Figures 64 to 66, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the substrate 10, two adjacent isolation pillars 300 are designated as first adjacent isolation pillars 300 and second adjacent isolation pillars 300. The first sidewall of an isolation pillar 300 is disposed opposite to the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of an isolation pillar 300 is disposed opposite to the second sidewall of the second adjacent isolation pillar 300. The display substrate further includes: a first covering structure 601, a second covering structure 602, a third covering structure 603, and a fourth covering structure 604, wherein the first covering structure 601... 01 The insulating structure 401 disposed on the isolation post 300 covers the surface away from the substrate 10 and the second sidewall, the second sidewall of the second insulating structure 314 and the second sidewall of the first insulating structure 312. The first covering structure 601 disposed on the isolation post 300 and the second adjacent isolation post 300 is interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation post 300. The third covering structure 603 is disposed on the third surface of the second insulating structure 314 of the isolation post 300. The fourth covering structure 604 is disposed between the isolation post 300 and the second adjacent isolation post 300.

[0334] In an exemplary embodiment, the first insulating structure 312 of the isolation column is spaced apart from the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is spaced apart from the second insulating structure 314 of the second adjacent isolation column 300, and the isolation insulating structure 401 disposed on the isolation column 300 is spaced apart from the isolation insulating structure 401 disposed on the second adjacent isolation column 300. Alternatively, the first insulating structure 312 of the isolation column is interconnected with the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is interconnected with the second insulating structure 314 of the second adjacent isolation column 300, and the isolation insulating structure 401 disposed on the isolation column 300 is interconnected with the isolation insulating structure 401 disposed on the second adjacent isolation column 300. Figures 64 and 65 illustrate an example where the first insulating structure 312 of the isolation column is spaced apart from the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is spaced apart from the second insulating structure 314 of the second adjacent isolation column 300, and the insulating structure 401 on the isolation column 300 is spaced apart from the insulating structure 401 on the second adjacent isolation column 300. Figure 66 illustrates an example where the first insulating structure 312 of the isolation column is interconnected with the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is interconnected with the second insulating structure 314 of the second adjacent isolation column 300, and the insulating structure 401 on the isolation column 300 is interconnected with the insulating structure 401 on the second adjacent isolation column 300.

[0335] In an exemplary embodiment, the angle between the surface of the insulating filling structure 400 disposed on the surface of the isolation post 300 away from the substrate 10 and the surface of the isolation post 300 away from the substrate 10 is in the range of 30 degrees to 60 degrees.

[0336] In an exemplary embodiment, at least one insulating structure is disposed in at least one inorganic insulating layer. When at least one insulating structure is disposed in an inorganic insulating layer, the insulating structure is a single-layer structure. When at least one insulating structure is disposed in L inorganic insulating layers, the insulating structure includes: L sub-insulating structures stacked on a substrate, wherein the l-th sub-insulating structure is disposed in the l-th inorganic insulating layer disposed in the at least one insulating structure.

[0337] The following description uses the fabrication process of a display substrate as an example. The "patterning process" described in this disclosure includes, for metallic, inorganic, or transparent conductive materials, processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping; for organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; etching can be performed using any one or more of dry etching and wet etching. This disclosure does not limit the methods used. A "thin film" refers to a thin film prepared on a substrate using deposition, coating, or other processes. If the "thin film" does not require a patterning process during the entire fabrication process, it can also be called a "layer." If the "thin film" requires a patterning process during the entire fabrication process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern." The phrase "A and B are arranged in the same layer" in this disclosure means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer is the dimension of the film layer in the direction perpendicular to the display substrate. In the exemplary embodiments of this disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0338] Figures 10 to 14 all demonstrate how power is cut off in the hole area by setting an insulating filling structure. The only difference is the film layer included in the isolation pillar. This disclosure further illustrates the display substrate provided in the embodiments of this disclosure through the preparation process of the display substrate shown in Figure 14. The preparation process of the display substrates shown in Figures 10 to 13 is similar to that in Figure 14, and will not be described again here.

[0339] The preparation process of Figures 10 and 11 is similar to that of Figure 13. The following description of the preparation process of Figure 13 further illustrates the display substrate provided in the embodiments of this disclosure.

[0340] (1) Forming the original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal thin film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating thin film 3120 on the first original conductive structure, depositing a second metal thin film on the first insulating thin film, forming a second original conductive structure 3130 by a patterning process, depositing a second insulating thin film 3140 on the second original conductive structure, depositing a third metal thin film on the second insulating thin film, and forming a third original conductive structure 3150 by a patterning process, as shown in FIG67A, FIG67A being a fabrication flowchart of FIG13.

[0341] In an exemplary embodiment, the first composite insulating layer 20 covers the substrate and is located in the display area and at least part of the hole area.

[0342] (2) Forming an insulating structure. In an exemplary embodiment, forming an insulating structure includes: patterning a first insulating film and a second insulating film through a patterning process to form a first insulating structure 312 and a second insulating structure 314, as shown in FIG67B, FIG67B being a second flowchart of the preparation process in FIG13.

[0343] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0344] (3) Forming multiple conductive structures. In an exemplary embodiment, forming multiple conductive structures includes: etching the sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form the first conductive structure 311, the second conductive structure 313, the third conductive structure 315, and the fourth conductive structure 317, as shown in FIG67C, FIG67C being a third flowchart of the fabrication process in FIG13.

[0345] In an exemplary embodiment, at least one conductive structure forms an undercut structure between two adjacent film layers.

[0346] (4) Forming an insulating fill structure and a covering structure. In an exemplary embodiment, forming an insulating fill structure and a covering structure includes: forming a fill structure 400 between at least two adjacent isolation pillars, and providing a covering structure on the surface of the isolation pillars away from the substrate, as shown in FIG67D, FIG67D being a flowchart of the preparation process in FIG13.

[0347] As shown in Figure 67D, the coverage structure includes: a first coverage structure 601 to a fourth coverage structure 604 arranged at intervals.

[0348] The fabrication process shown in Figure 12 is similar to that in Figure 14. The fabrication process of the display substrate shown in Figure 14 will be used to further illustrate the display substrate provided in the embodiments of this disclosure.

[0349] (1) Forming the original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal thin film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating thin film 3120 on the first original conductive structure, depositing a second metal thin film on the first insulating thin film, forming a second original conductive structure 3130 by a patterning process, depositing a second insulating thin film 3140 on the second original conductive structure, depositing a third metal thin film on the second insulating thin film, and forming a third original conductive structure 3150 by a patterning process. The first fabrication flowchart in FIG14 is the same as the first fabrication flowchart in FIG13.

[0350] In an exemplary embodiment, the first composite insulating layer 20 covers the substrate.

[0351] (2) Forming an insulating structure. In an exemplary embodiment, forming an insulating structure includes: patterning a first insulating film and a second insulating film through a patterning process to form a first insulating structure 312 and a second insulating structure 314. The second preparation flowchart in FIG14 is the same as the second preparation flowchart in FIG13.

[0352] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0353] (3) Forming a fourth primary conductive structure. In an exemplary embodiment, forming a third primary conductive structure includes: depositing a fourth primary conductive structure 3170 on the third primary conductive structure, as shown in FIG68A, FIG68A being a third flowchart of the fabrication process in FIG14.

[0354] (4) Forming multiple conductive structures. In an exemplary embodiment, forming multiple conductive structures includes: etching the sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form the first conductive structure 311, the second conductive structure 313, the third conductive structure 315, and the fourth conductive structure 317, as shown in FIG68B, FIG68B being a fourth flowchart of the fabrication process in FIG14.

[0355] In an exemplary embodiment, at least one conductive structure forms an undercut structure between two adjacent film layers.

[0356] (5) Forming an insulating fill structure and a covering structure. In an exemplary embodiment, forming an insulating fill structure and a covering structure includes: forming a fill structure 400 between at least two adjacent isolation pillars, and providing a covering structure on the surface of the isolation pillars away from the substrate, as shown in FIG68C, FIG68C being a flowchart of the fabrication process in FIG14.

[0357] As shown in Figure 68C, the coverage structure includes: a first coverage structure 601 to a fourth coverage structure 604 arranged at intervals.

[0358] In the display substrates provided in Figures 15 to 18, 23 to 26, 35 to 38, 47 to 50, and 59 to 62, at least one insulating structure does not cover the sidewall of the conductive structure located below the insulating structure, and the isolation insulating structure covers the sidewall of the entire isolation pillar. The preparation methods are similar.

[0359] This disclosure further illustrates the display substrate provided in the embodiments of this disclosure using the display substrate shown in FIG59 as an example.

[0360] (1) Forming the original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal thin film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating thin film 3120 on the first original conductive structure, depositing a second metal thin film on the first insulating thin film, forming a second original conductive structure 3130 by a patterning process, depositing a second insulating thin film 3140 on the second original conductive structure, depositing a third metal thin film on the second insulating thin film, and forming a third original conductive structure 3150 by a patterning process. The first fabrication flowchart in FIG59 is the same as the first fabrication flowchart in FIG14.

[0361] In an exemplary embodiment, the first composite insulating layer 20 covers the substrate.

[0362] (2) Forming an insulating structure. In an exemplary embodiment, forming an insulating structure includes: patterning a first insulating film and a second insulating film through a patterning process to form a first insulating structure 312 and a second insulating structure 314, as shown in FIG68. The second preparation flowchart in FIG59 is the same as the second preparation flowchart in FIG14.

[0363] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0364] (3) Forming a fourth primary conductive structure. In an exemplary embodiment, forming a fourth primary conductive structure includes depositing a fourth primary conductive structure 3170 on a third primary conductive structure. The fabrication flowchart 3 in FIG59 is the same as the fabrication flowchart 3 in FIG14.

[0365] (4) Forming an isolation insulation structure. In an exemplary embodiment, an isolation insulation film is deposited on the surface of the isolation pillar away from the substrate, and the isolation insulation film is patterned by a patterning process to form an isolation insulation structure 401, as shown in FIG69A. FIG69A is a flowchart of the preparation process of FIG59.

[0366] (5) Forming multiple conductive structures and a covering structure. In an exemplary embodiment, forming multiple conductive structures includes: etching the first sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form the first conductive structure 311, the second conductive structure 313, the third conductive structure 315, and the fourth conductive structure 317, and setting a covering structure on the surface of the isolation pillar away from the substrate, as shown in FIG69B, FIG69B being the fifth fabrication flowchart of FIG59.

[0367] In an exemplary embodiment, an undercut structure is formed between the first sidewall of at least one conductive structure and two adjacent film layers.

[0368] As shown in Figure 59, the covering structure includes a first covering structure 601 to a fourth covering structure 604 arranged at intervals.

[0369] The following describes the fabrication process of the display substrate provided in the embodiments of this disclosure through Figures 31 to 34.

[0370] (1) Forming the original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal thin film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating thin film 3120 on the first original conductive structure, and patterning the first insulating thin film 3120 by a patterning process to form a first insulating structure 312, as shown in FIG70A, FIG70A being a flowchart of the preparation process of FIG31.

[0371] The first insulating structure 312 covers the second sidewall of the first original conductive structure.

[0372] In an exemplary embodiment, the first composite insulating layer 20 covers the substrate.

[0373] (2) Forming a second original conductive structure. In an exemplary embodiment, forming a second original conductive structure includes depositing a second original conductive structure 3130 on a first insulating film, as shown in FIG70B, FIG70B being a second flowchart of the fabrication process in FIG31.

[0374] (3) Forming multiple conductive structures and a covering structure. In an exemplary embodiment, forming multiple conductive structures includes: etching the first sidewall of the first original conductive structure and the first sidewall of the second, third, and fourth original conductive structures through a patterning process to form the first conductive structure 311 and the second conductive structure 313, and setting a covering structure on the surface of the isolation pillar away from the substrate, as shown in FIG70C, FIG70C is a third flowchart of the fabrication process of FIG31.

[0375] In an exemplary embodiment, an undercut structure is formed between the first sidewall of at least one conductive structure and two adjacent film layers.

[0376] As shown in Figure 70C, the covering structure includes a first covering structure 601 to a fourth covering structure 604 arranged at intervals.

[0377] The display substrates shown in Figures 43 to 46 and 55 to 58 have similar structures, but differ in the number of conductive structures in the isolation pillars, while the manufacturing process is the same.

[0378] This disclosure further illustrates the display substrate provided in the embodiments of this disclosure through the fabrication process of the display substrate shown in FIG55.

[0379] (1) Forming the original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal thin film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating thin film 3120 on the first original conductive structure, depositing a second metal thin film on the first insulating thin film, forming a second original conductive structure 3130 by a patterning process, depositing a second insulating thin film 3140 on the second original conductive structure, depositing a third metal thin film on the second insulating thin film, and forming a third original conductive structure 3150 by a patterning process. The first fabrication flowchart in FIG55 is the same as the first fabrication flowchart in FIG14.

[0380] In an exemplary embodiment, the first composite insulating layer 20 covers the substrate.

[0381] (2) Forming a first insulating structure and a second insulating structure. In an exemplary embodiment, forming the first insulating structure and the second insulating structure includes: patterning the first insulating film and the second insulating film through a patterning process to form a first insulating structure 312 and a second insulating structure 314. The second fabrication flowchart in FIG55 is the same as the second fabrication flowchart in FIG14.

[0382] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0383] (3) Forming a third insulating structure. In an exemplary embodiment, a third insulating film is deposited on the surface of the third original conductive structure away from the substrate, and the third insulating film is patterned by a patterning process to form a third insulating structure 316, as shown in FIG71A. FIG71A is a third flowchart of the preparation process of FIG55.

[0384] (4) Forming a fourth primary conductive structure. In an exemplary embodiment, forming a fourth primary conductive structure includes depositing a fourth primary conductive structure 3170 on a third insulating structure 316, as shown in FIG71B, FIG71B being a fourth fabrication flowchart of FIG55.

[0385] (5) Forming an isolation insulation structure. In an exemplary embodiment, an isolation insulation film is deposited on the surface of the isolation pillar away from the substrate, and the isolation insulation film is patterned by a patterning process to form an isolation insulation structure 401, as shown in FIG71C. FIG71C is a flowchart of the preparation process of FIG55.

[0386] (6) Forming multiple conductive structures and a covering structure. In an exemplary embodiment, forming multiple conductive structures includes: etching the first sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form the first conductive structure 311, the second conductive structure 313, the third conductive structure 315, and the fourth conductive structure 317, and setting a covering structure on the surface of the isolation pillar away from the substrate, as shown in FIG71D, FIG71D being a fabrication flowchart of FIG55.

[0387] In the display substrates provided in Figures 19 to 22, 27 to 30, 39 to 42, 51 to 54, and 63 to 66, at least one insulating structure covers the sidewall of the conductive structure located below the insulating structure, and the insulating structure only covers part of the sidewall of the conductive pillar. The preparation method is similar to that in Figure 63.

[0388] This disclosure further illustrates the display substrate provided in the embodiments of this disclosure through the fabrication process of the display substrate shown in FIG63.

[0389] (1) Forming the original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal thin film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating film on the first original conductive structure, patterning the first insulating film by a patterning process to form a first insulating structure 312, depositing a second metal thin film on the first insulating structure 312, forming a second original conductive structure 3120 by a patterning process, depositing a second insulating film on the second original conductive structure, patterning the second insulating film by a patterning process to form a second insulating structure 314, sequentially depositing a third metal thin film and a fourth metal thin film on the second insulating structure, and patterning the third metal thin film and the fourth metal thin film by a patterning process to form a third original conductive structure 3150 and a fourth original conductive structure 3170, as shown in FIG72A, FIG72A being a flowchart of the preparation process of FIG63.

[0390] In an exemplary embodiment, the first composite insulating layer 20 covers the substrate.

[0391] (2) Forming an isolation insulation structure. In an exemplary embodiment, an isolation insulation film is deposited on the surface of the isolation pillar away from the substrate, and the isolation insulation film is patterned by a patterning process to form an isolation insulation structure 401, as shown in FIG72B. FIG72B is a second flowchart of the preparation process of FIG63.

[0392] (3) Forming multiple conductive structures and a covering structure. In an exemplary embodiment, forming multiple conductive structures includes: etching the first sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form the first conductive structure 311, the second conductive structure 313, the third conductive structure 315, and the fourth conductive structure 317, and setting a covering structure on the surface of the isolation pillar away from the substrate, as shown in FIG72C, FIG72C being a third flowchart of the fabrication process in FIG63.

[0393] In an exemplary embodiment, the first and second sidewalls of the original conductive structure are sloped.

[0394] In an exemplary embodiment, etching of at least one sidewall of the conductive structure may occur after the formation of multiple source / drain metal layers. Exemplarily, etching of at least one sidewall of the conductive structure may occur after the formation of the anode of the light-emitting device and before the formation of the overlay structure.

[0395] In an exemplary embodiment, when the isolation pillar includes a first conductive structure, a second conductive structure, a third conductive structure, and a fourth conductive structure, the length of the first conductive structure along the direction parallel to the substrate is in the range of 7 micrometers to 8 micrometers, the length of the second conductive structure along the direction parallel to the substrate is in the range of 6 micrometers to 7 micrometers, the length of the third conductive structure along the direction parallel to the substrate is in the range of 5 micrometers to 6 micrometers, and the length of the fourth conductive structure along the direction parallel to the substrate is in the range of 4 micrometers to 5 micrometers.

[0396] Figure 73 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. As shown in Figure 73, this embodiment provides a display device 91, including the display substrate 910 provided in any of the foregoing embodiments.

[0397] In an exemplary embodiment, the display substrate 910 can be an OLED display substrate, such as an OLED display substrate with an integrated touch structure. The display device 91 can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator, or it can be a product or component with both touch and display functions. In an exemplary embodiment, the display device 91 can be a wearable display device, such as one that can be worn on the human body in some way. For example, the display device 91 can be a smartwatch, smart bracelet, etc. However, this embodiment is not limited to this.

[0398] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0399] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A display substrate, comprising: A display area and a hole area, the display area being arranged around the hole area, the hole area comprising: a first area and a second area arranged sequentially away from the display area; each of the first area and the second area being provided with a plurality of isolation pillars; At least one of the plurality of isolation pillars located in at least one region of the second region and the first region includes: at least two conductive structures and at least one insulating structure, wherein the at least one insulating structure is disposed between the at least two conductive structures, and at least one side of the at least one conductive structure is grooved.

2. The display substrate according to claim 1, wherein, The display substrate includes: a substrate and a circuit structure layer disposed on the substrate, the circuit structure layer including: a plurality of gate metal layers and a plurality of source and drain metal layers, and at least one film layer of organic insulating layer and inorganic insulating layer is disposed between at least two metal layers. At least one of the plurality of isolation pillars includes: a first conductive structure, a first insulating structure, and a second conductive structure; At least one side of at least one of the first conductive structure and the second conductive structure is grooved, and at least a portion of the second conductive structure is projected onto the substrate within the range of the projected images of the first insulating structure and the first conductive structure onto the substrate. The first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in another of the plurality of gate metal layers; or, the first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in one of the plurality of source / drain metal layers. The first insulating structure is disposed in at least one inorganic insulating layer located between the film layer containing the first conductive structure and the film layer containing the second conductive structure.

3. The display substrate according to claim 2, wherein, At least one of the plurality of isolation pillars further includes: a third conductive structure, the third conductive structure being located on the side of the second conductive structure away from the substrate; At least one side of at least one of the first to third conductive structures is grooved, and at least a portion of the third conductive structure is projected onto the substrate within the range of the second conductive structure's projection onto the substrate. The first conductive structure and the second conductive structure are located in one of the multiple gate metal layers, the third conductive structure is located in one of the multiple source and drain metal layers, and the first insulating structure is disposed in at least one inorganic insulating layer between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located.

4. The display substrate according to claim 2, wherein, At least one of the plurality of isolation pillars further includes: a second insulating structure and a third conductive structure, wherein the second insulating structure is located on the side of the second conductive structure away from the substrate, and the third conductive structure is located on the side of the second insulating structure away from the substrate; At least one side of at least one of the first to third conductive structures is grooved, and at least a portion of the third conductive structure is projected onto the substrate within the range of the orthogonal projection of the second insulating structure onto the substrate, and at least a portion of the third conductive structure is projected onto the substrate within the range of the orthogonal projection of the second conductive structure onto the substrate. Any one of the first conductive structure, the second conductive structure, and the third conductive structure is disposed in one of the multiple gate metal layers; or, any one of the first conductive structure and the second conductive structure is located in one of the multiple gate metal layers, and the third conductive structure is located in one of the multiple source / drain metal layers. The first insulating structure is disposed in at least one inorganic insulating layer located between the film layer containing the first conductive structure and the film layer containing the second conductive structure, and the second insulating structure is disposed in at least one inorganic insulating layer located between the film layer containing the second conductive structure and the film layer containing the third conductive structure.

5. The display substrate according to any one of claims 2 to 4, wherein, An insulating filling structure is provided between at least two adjacent isolation columns; The insulating fill structure covers the side of the two adjacent isolation pillars closest to the insulating fill structure and the portion of the surface away from the substrate.

6. The display substrate according to claim 5, wherein, The display substrate further includes a cover structure, which includes an organic structure and a cathode structure; The covering structure is broken at the grooves of at least two conductive structures included in the isolation post; The covering structure includes: a first covering structure disposed on the surface of the isolation column away from the substrate, wherein the first covering structures on at least two isolation columns having an insulating filling structure are interconnected, and their orthogonal projections on the substrate at least partially overlap with the orthogonal projections of the insulating filling structure on the substrate.

7. The display substrate according to claim 2, wherein, At least one of the plurality of isolation pillars has an isolation insulation structure on its surface away from the substrate, and at least one of the first conductive structure and the second conductive structure includes: a first sidewall and a second sidewall; The insulating structure at least partially covers the surface and second sidewall of the second conductive structure away from the substrate, and the insulating structure is disposed in at least one inorganic insulating layer on the side of the second conductive structure away from the substrate; The adjacent isolation columns have the same structure, or the structures of the adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

8. The display substrate according to claim 7, wherein, The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on the first side of the isolation column along the centerline perpendicular to the base, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on the second side of the isolation column along the centerline perpendicular to the base; The insulating structure also covers the second sidewall of the first conductive structure and the second sidewall of the first insulating structure; The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure; The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

9. The display substrate according to claim 7, wherein, The first insulating structure covers the second sidewall of the first conductive structure, and the insulating isolation structure portion is disposed on the surface of the first insulating structure away from the substrate; The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure; The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall of the insulating structure, as well as the second sidewall of the first insulating structure, and the first covering structure also extends between adjacent insulating posts.

10. The display substrate according to claim 2, wherein, At least one of the first conductive structure and the second conductive structure includes: a first sidewall and a second sidewall; At least a portion of the first sidewall of the first conductive structure is projected onto the substrate within the range of the first insulating structure's projection onto the substrate, and the first insulating structure covers the second sidewall of the first conductive structure. The adjacent isolation columns have the same structure, or the structures of adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

11. The display substrate according to claim 10, wherein, The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure; The covering structure includes: a first covering structure disposed on the surface of the second conductive structure away from the substrate.

12. The display substrate according to claim 4, wherein, When any one of the first conductive structure, the second conductive structure, and the third conductive structure is disposed in one of the multiple gate metal layers, at least one of the multiple isolation pillars has an isolation insulating structure disposed on the surface of the isolation pillar away from the substrate; at least one conductive structure among the first conductive structure to the third conductive structure includes: a first sidewall and a second sidewall. At least a portion of the first sidewall of the first conductive structure is projected onto the substrate within the range of the orthogonal projection of the first insulating structure onto the substrate. At least a portion of the first sidewall of the second conductive structure is projected onto the substrate within the range of the orthogonal projection of the second insulating structure onto the substrate. The insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The insulating structure is disposed on at least one inorganic insulating layer on the side of the third conductive structure away from the substrate. The adjacent isolation columns have the same structure, or the structures of adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

13. The display substrate according to claim 12, wherein, The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on the first side of the isolation column along the centerline perpendicular to the base, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on the second side of the isolation column along the centerline perpendicular to the base; The orthographic projection of the second sidewall of the first conductive structure onto the substrate does not overlap with the orthographic projection of the first insulating structure onto the substrate, and the orthographic projection of the second sidewall of the second conductive structure onto the substrate does not overlap with the orthographic projection of the second insulating structure onto the substrate. The insulating structure also covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, the second sidewall of the second conductive structure, and the second sidewall of the second insulating structure. The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure; The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

14. The display substrate according to claim 12, wherein, The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on the first side of the isolation column along the centerline perpendicular to the base, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on the second side of the isolation column along the centerline perpendicular to the base; The orthographic projections of the second sidewall of the insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure onto the substrate are located within the range of the orthographic projection of the first insulating structure onto the substrate. The first insulating structure covers the second sidewall of the first conductive structure, and the second insulating structure covers the second sidewall of the second conductive structure. The insulating structure is partially disposed on the surface of the second insulating structure away from the substrate. The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the groove of the first conductive structure and the second conductive structure; The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, the second sidewall of the first insulating structure and the second sidewall of the second insulating structure, and the first covering structure also extends between adjacent insulating posts.

15. The display substrate according to claim 4, wherein, When any one of the first conductive structure and the second conductive structure is disposed in one of the multiple gate metal layers, and the third conductive structure is disposed in one of the multiple source and drain metal layers, at least one of the multiple isolation pillars has an isolation insulating structure disposed on the surface away from the substrate, and at least one conductive structure from the first conductive structure to the third conductive structure includes: a first sidewall and a second sidewall. The second insulating structure covers the portion of the second conductive structure away from the substrate and the second sidewall, as well as the second sidewall of the first conductive structure and the second sidewall of the first insulating structure. A portion of the third conductive structure is connected to the portion of the second conductive structure away from the substrate. The third conductive structure is stepped. The isolation insulating structure covers the second sidewall of the third conductive structure and the second sidewall of the isolation insulating structure. The isolation insulating structure is disposed in at least one inorganic insulating layer located between multiple source and drain metal layers. Adjacent isolation columns have the same structure, or adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

16. The display substrate according to claim 15, wherein, The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on the first side of the isolation column along the centerline perpendicular to the base, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on the second side of the isolation column along the centerline perpendicular to the base; The orthographic projection of the second sidewall of the first conductive structure onto the substrate does not overlap with the orthographic projection of the first insulating structure onto the substrate; The display substrate further includes a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the grooves of the first conductive structure, the second conductive structure and the third conductive structure; The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

17. The display substrate according to claim 3, wherein, At least one of the plurality of isolation pillars has an isolation insulation structure on its surface away from the substrate, and at least one of the first to third conductive structures includes: a first sidewall and a second sidewall. At least a portion of the first sidewall of the first conductive structure is projected onto the substrate within the range of the orthogonal projection of the first insulating structure onto the substrate, and at least a portion of the first sidewall of the second conductive structure is projected onto the substrate within the range of the orthogonal projection of the second insulating structure onto the substrate. The isolation insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The isolation insulating structure is disposed in at least one inorganic insulating layer located between a plurality of source and drain metal layers. The adjacent isolation columns have the same structure, or the structures of adjacent isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base.

18. The display substrate according to claim 17, wherein, The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on the first side of the isolation column along the centerline perpendicular to the base, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on the second side of the isolation column along the centerline perpendicular to the base; The orthographic projection of the second sidewall of the first conductive structure onto the substrate does not overlap with the orthographic projection of the first insulating structure onto the substrate, and the insulating structure further covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, and the second sidewall of the second conductive structure. The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the grooves of the first conductive structure, the second conductive structure and the third conductive structure; The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

19. The display substrate according to claim 17, wherein, The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, wherein the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on the first side of the isolation column along the centerline perpendicular to the base, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on the second side of the isolation column along the centerline perpendicular to the base; The second sidewall of the insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure are projected onto the substrate within the range of the first insulating structure projected onto the substrate. The first insulating structure covers the second sidewall of the first conductive structure, and the insulating structure is partially disposed on the surface of the first insulating structure away from the substrate. The display substrate further includes: a cover structure, which includes an organic structure and a cathode structure, wherein the cover structure is broken at the grooves of the first conductive structure, the second conductive structure and the third conductive structure; The covering structure includes: a first covering structure that covers the surface of the insulating structure away from the substrate and the second sidewall, and the first covering structure also extends between adjacent insulating posts.

20. The display substrate according to any one of claims 7, 12, 15 and 17, wherein, When the structures of adjacent isolation columns among the plurality of isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base direction, the isolation insulation structures provided on the isolation columns and the isolation insulation structures provided on adjacent isolation columns are spaced apart or connected to each other.

21. The display substrate according to any one of claims 7 to 19, wherein, When the structures of adjacent isolation columns among the plurality of isolation columns are arranged symmetrically with respect to a straight line perpendicular to the base, at least one insulating structure of an isolation column is spaced apart from at least one insulating structure of an adjacent isolation column, or is connected to each other.

22. The display substrate according to claim 1, wherein, The hole region further includes a third region located between the first region and the second region. The display substrate further includes a substrate and a circuit structure layer disposed on the substrate. The circuit structure layer includes a plurality of gate metal layers and a plurality of source drain metal layers. At least one film layer of organic insulating layer and inorganic insulating layer is disposed between at least two metal layers. At least one inorganic insulating layer disposed on the side of the plurality of gate metal layers near the substrate is called a first composite insulating layer. The plurality of inorganic insulating layers disposed between the plurality of gate metal layers and the plurality of source drain metal layers are called a second composite insulating layer. The first composite insulating layer extends from the display area to the second area, and the second composite insulating layer is located in the display area and does not extend to the first area, or extends from the display area to the third area; When the second composite insulating layer is located in the display area and does not extend into the first area, the isolation pillars located in the first area and the isolation pillars located in the second area have the same shape.

23. The display substrate according to claim 22, wherein, When the second composite insulating layer extends from the display area to the third area, the isolation pillar located in the first area includes: a first conductive structure, wherein the first conductive structure is located in one of the plurality of source and drain metal layers.

24. The display substrate according to claim 22, wherein, The isolation pillar located in the first region further includes at least one of the second to the (K+1)th conductive structures, wherein the orthographic projection of at least one of the second to the (K+1)th isolation structures on the substrate overlaps with the orthographic projection of the first isolation structure. The (k+1)th conductive structure is located in the kth gate metal layer, where 1 ≤ k ≤ K.

25. The display substrate according to claim 2, wherein, When the isolation pillar located in the second region includes a first conductive structure, a first insulating structure and a second conductive structure, the first conductive structure is located in one of the multiple gate metal layers closest to the substrate, the second conductive structure is located in one of the multiple source / drain metal layers on the side furthest from the substrate, and the thickness of the first insulating structure is in the range of 0.7 micrometers to 0.9 micrometers.

26. The display substrate according to claim 2, wherein, A conductive structure located in at least one of a plurality of source and drain metal layers includes: a first isolation portion, a second isolation portion and a third isolation portion, wherein the first isolation portion is located on the side of the second isolation portion closer to the substrate, and the third isolation portion is located on the side of the second isolation portion away from the substrate; The orthographic projection of the surface of the second isolation portion near the substrate onto the substrate is within the range of the orthographic projection of the surface of the first isolation portion away from the substrate onto the substrate, and the orthographic projection of the surface of the second isolation portion away from the substrate onto the substrate is within the range of the orthographic projection of the surface of the third isolation portion near the substrate onto the substrate.

27. The display substrate according to claim 5, wherein, The angle between the surface of the insulating filling structure disposed on the surface of at least one of the plurality of isolation pillars away from the substrate and the surface of the isolation pillar away from the substrate is in the range of 30 degrees to 60 degrees.

28. A display device, comprising: The display substrate as described in any one of claims 1 to 27.

Images