Electronic device including satellite antenna

Abstract

This electronic device comprises: a first housing comprising a first non-conductive portion and a second non-conductive portion, which are spaced apart from each other, and a first conductive portion; a second housing comprising a second conductive portion arranged through a third non-conductive portion and a fourth non-conductive portion; a hinge device; a wireless communication circuit; a first matching circuit; and a second matching circuit, wherein a first point and a third point are aligned in a folded state, and the wireless communication circuit may transmit and receive a wireless signal through the first conductive portion and the second conductive portion in the folded state.

Description

Electronic devices containing satellite antennas

[0001] Embodiments of the present disclosure relate to an electronic device including at least one satellite antenna.

[0002] Wireless communication systems can provide wireless connectivity to various electronic devices, enabling wireless communication between them. Wireless communication systems can provide wireless communication between electronic devices by allocating radio frequency resources to these devices through the control of ground-based base stations. Due to the physical limitations of ground-based base stations, wireless communication systems may struggle to provide wireless connectivity to electronic devices located at sea and / or above a certain altitude.

[0003] Wireless communication systems are evolving to include satellite and terrestrial networks to overcome the physical limitations of ground-based base stations and expand the global reach of wireless connectivity for electronic devices. By incorporating both terrestrial and satellite networks, wireless communication systems can provide wireless communication with electronic devices even in areas where terrestrial networks are difficult to establish or during disasters.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0005] An electronic device may include at least one antenna (e.g., a satellite antenna) for performing wireless communication using a satellite network. The electronic device may use a portion of a housing made of a conductive material (e.g., metal) as an antenna (or antenna radiator) for performing wireless communication (e.g., satellite communication). For example, the electronic device may use at least one conductive portion separated from a housing forming an exterior of the electronic device by at least one non-conductive portion (e.g., a segment or a slit) as an antenna.

[0006] Electronic devices require an antenna for wireless communication with a satellite device (e.g., a non-terrestrial radio communication device) located at a specified distance above the ground (e.g., approximately 160 km to approximately 30,000 km) to perform satellite communications. For example, the electronic device requires an antenna with high gain in a specified direction (e.g., toward the upper hemisphere) for wireless communication with the satellite device.

[0007] Embodiments of the present invention may disclose an electronic device capable of performing satellite communication using at least one antenna (e.g., a satellite antenna) having a high gain in a specified direction.

[0008] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0009] In one embodiment, an electronic device may include a first housing including a first conductive portion disposed through a first non-conductive portion and a second non-conductive portion, which are spaced apart from each other. In one embodiment, the electronic device may include a second housing including a second conductive portion disposed through a third non-conductive portion and a fourth non-conductive portion, which are spaced apart from each other. In one embodiment, the electronic device may include a hinge device rotatably connecting the first housing and the second housing with respect to each other. In one embodiment, the electronic device may include a wireless communication circuit electrically connected to a first point of the first conductive portion. In one embodiment, the electronic device may include a first matching circuit disposed in a first electrical path electrically connecting a second point between the first point and the first non-conductive portion and ground. In one embodiment, the electronic device may include a second matching circuit disposed in a second electrical path electrically connecting a third point between the third non-conductive portion and the fourth non-conductive portion and the ground. In one embodiment, the first point and the third point may be at least partially aligned when the electronic device is in a folded state. In one embodiment, the wireless communication circuit may transmit and / or receive a wireless signal in at least one frequency band through the first conductive portion and the second conductive portion when the electronic device is in a folded state.

[0010] According to one embodiment, the electronic device may include a first housing including a first conductive portion disposed through a first non-conductive portion and a second non-conductive portion that are spaced apart from each other. According to one embodiment, the electronic device may include a second housing including a second conductive portion disposed through a third non-conductive portion and a fourth non-conductive portion that are spaced apart from each other. According to one embodiment, the electronic device may include a third housing including a third conductive portion disposed through a fifth non-conductive portion and a sixth non-conductive portion that are spaced apart from each other. According to one embodiment, the electronic device may include a first hinge device rotatably connecting the first housing and the second housing with respect to each other. According to one embodiment, the electronic device may include a second hinge device rotatably connecting the second housing and the third housing with respect to each other. According to one embodiment, the electronic device may include a wireless communication circuit electrically connected to a first point of the first conductive portion. According to one embodiment, the electronic device may include a first matching circuit disposed in a first electrical path electrically connecting a second point between a first point and a second non-conductive portion and ground. According to one embodiment, the electronic device may include a second matching circuit disposed in a second electrical path electrically connecting a third point between a third non-conductive portion and a fourth non-conductive portion and ground. According to one embodiment, the electronic device may include a third matching circuit disposed in a third electrical path electrically connecting a fourth point between a fifth non-conductive portion and a sixth non-conductive portion and ground. According to one embodiment, the first point, the third point, and the fourth point may be at least partially aligned when the electronic device is in a folded state, and may include:According to one embodiment, the wireless communication circuit, in a folded state, is capable of transmitting and / or receiving a wireless signal in at least one frequency band via the first conductive portion, the second conductive portion, and the third conductive portion.

[0011] According to an embodiment of the present invention, an electronic device can increase the radiation efficiency of a satellite antenna in a specified direction (e.g., upper hemisphere direction) by using a pair of floating frames included in a first housing and a second housing that are rotatably connected to each other with respect to a hinge device as a satellite antenna.

[0012] According to one embodiment, an electronic device including a first housing and a second housing rotatably connected to each other with respect to a hinge device can reduce a decrease in radiation efficiency of a satellite antenna in an unfolded state in a designated direction (e.g., in the upper hemisphere direction) by resonating a second conductive portion of a second housing not including a power supply portion to correspond to a resonant frequency of a first conductive portion of the first housing including a power supply portion when the electronic device is switched from a folded state to an unfolded state by the first housing and the second housing.

[0013] The effects that can be obtained from various embodiments of the present invention are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by those skilled in the art to which various embodiments of the present invention belong from the description below.

[0014] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0015] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0016] FIG. 2A is a drawing illustrating the front of a foldable electronic device in an unfolded state according to one embodiment.

[0017] FIG. 2b is a drawing illustrating the rear side of a foldable electronic device in an unfolded state according to one embodiment.

[0018] FIG. 3A is a drawing illustrating a front side of a foldable electronic device in a folded state according to one embodiment.

[0019] FIG. 3b is a drawing illustrating the rear side of a foldable electronic device in a folded state according to one embodiment.

[0020] FIG. 4 is a schematic diagram illustrating an exploded perspective view of a foldable electronic device according to one embodiment.

[0021] FIG. 5 is a schematic diagram illustrating a configuration of a foldable electronic device including at least one non-conductive portion and at least one conductive portion according to one embodiment.

[0022] FIG. 6 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment.

[0023] FIG. 7 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment.

[0024] FIG. 8A is a diagram showing a change in an electric field by a first matching circuit of a first housing in a foldable electronic device according to one embodiment.

[0025] FIG. 8b is a diagram showing electric fields of a first housing and a second housing in a foldable electronic device in a folded state according to one embodiment.

[0026] FIGS. 9A and 9B are schematic diagrams showing antenna characteristics according to a change in the state of a second matching circuit of a second conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0027] FIG. 10A is a diagram schematically illustrating a radiation pattern when a satellite signal of a first frequency band is radiated using a first conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0028] FIG. 10b is a diagram schematically illustrating a radiation pattern when a satellite signal of a first frequency band is radiated using a first conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0029] FIG. 10c is a diagram schematically illustrating a radiation pattern when a satellite signal of a second frequency band is radiated using a first conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0030] FIG. 10d is a diagram schematically illustrating a radiation pattern when a satellite signal of a second frequency band is radiated using a first conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0031] FIG. 11A is a diagram schematically showing the current distribution of a foldable electronic device in an unfolded state according to one embodiment.

[0032] FIG. 11b is a diagram schematically illustrating antenna efficiency according to a state change of a second matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0033] FIG. 11c is a diagram schematically illustrating a change in a radiation pattern of a first conductive portion according to a change in the state of a second matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0034] FIG. 12A is a diagram schematically illustrating a radiation pattern when a satellite signal of a first frequency band is radiated using a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0035] FIG. 12b is a diagram schematically illustrating a radiation pattern when a satellite signal of a first frequency band is radiated using a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0036] FIG. 12c is a diagram schematically illustrating a radiation pattern when a satellite signal of a second frequency band is radiated using a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0037] FIG. 12d is a diagram schematically illustrating a radiation pattern when a satellite signal of a second frequency band is radiated using a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0038] FIG. 13 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment.

[0039] FIGS. 14a and 14b are schematic diagrams showing antenna characteristics according to state changes of a third matching circuit of a second conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0040] FIG. 15A is a diagram schematically showing the current distribution of a foldable electronic device in an unfolded state according to one embodiment.

[0041] FIG. 15b is a diagram schematically illustrating antenna efficiency according to a state change of a third matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0042] FIG. 15c is a diagram schematically illustrating a change in a radiation pattern of a first conductive portion according to a change in the state of a third matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0043] FIG. 16 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment.

[0044] FIGS. 17A and 17B are schematic diagrams showing antenna characteristics according to a change in the state of a first matching circuit of a first conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0045] FIGS. 18A and 18B are schematic diagrams showing antenna characteristics according to a change in the state of a first matching circuit of a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0046] FIGS. 19A and 19B are schematic diagrams showing antenna characteristics depending on whether a second matching circuit of a second conductive portion is used in a foldable electronic device in a folded state according to one embodiment.

[0047] FIG. 20A is a drawing illustrating a front side of a multi-foldable electronic device in an unfolded state according to one embodiment.

[0048] FIG. 20b is a drawing illustrating the rear side of a multi-foldable electronic device in an unfolded state according to one embodiment.

[0049] FIG. 20c is a drawing illustrating one side of a multi-foldable electronic device in a folded state according to one embodiment.

[0050] FIG. 21 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment.

[0051] FIG. 22 is a diagram schematically illustrating changes in a radiation pattern of a first conductive portion in a multi-foldable electronic device in an unfolded state according to one embodiment.

[0052] FIG. 23 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment.

[0053] FIG. 24 is a diagram schematically illustrating changes in a radiation pattern of a first conductive portion in a multi-foldable electronic device in an unfolded state according to one embodiment.

[0054] FIG. 25 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment.

[0055] FIG. 26 is a diagram schematically illustrating changes in a radiation pattern of a first conductive portion in a multi-foldable electronic device in an unfolded state according to one embodiment.

[0056] FIG. 27 is a diagram schematically illustrating antenna efficiency in a multi-foldable electronic device in a folded state according to one embodiment.

[0057] FIG. 28 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment.

[0058] FIG. 29 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment.

[0059] FIG. 30 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment.

[0060] The following various embodiments are described in detail with reference to the attached drawings.

[0061] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment.

[0062] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0063] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0064] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of, but is not limited to, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more thereof. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may also include a software structure.

[0065] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0066] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0067] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0068] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0069] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by a touch.

[0070] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0071] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0072] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0073] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0074] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0075] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0076] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0077] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0078] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

[0079] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data throughput. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.According to one embodiment, the subscriber identification module (196) may include multiple subscriber identification modules. For example, the multiple subscriber identification modules may store different subscriber information.

[0080] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0081] In one embodiment, the antenna module (197) may form a high-frequency (e.g., mmWave) antenna module. In one embodiment, the high-frequency (e.g., mmWave) antenna module may include a printed circuit board, an RFIC positioned on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band. For example, the plurality of antennas may include patch array antennas and / or dipole array antennas.

[0082] At least some of the components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).

[0083] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0084] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0085] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but rather to encompass various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0086] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0087] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0088] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0089] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0090] FIG. 2A is a diagram illustrating a front side of a foldable electronic device in an unfolded state according to one embodiment. FIG. 2B is a diagram illustrating a rear side of a foldable electronic device in an unfolded state according to one embodiment. FIG. 3A is a diagram illustrating a front side of a foldable electronic device in a folded state according to one embodiment. FIG. 3B is a diagram illustrating a rear side of a foldable electronic device in a folded state according to one embodiment. For example, the foldable electronic device (200) disclosed in FIGS. 2A and 3B may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0091] According to one embodiment referring to FIGS. 2A to 3B, the foldable electronic device (200) may include a first housing (210) (e.g., a first housing portion or a first housing structure) and a second housing (220) (e.g., a second housing portion or a second housing structure) that are rotatably (or foldably, rotatably) coupled about a folding axis (F) via a hinge device (e.g., a hinge device (320) of FIG. 4) (e.g., a hinge plate). For example, the first housing (210) and the second housing (220) may be configured as a housing (e.g., a housing structure, a foldable housing, or a foldable housing structure) of the electronic device (200). For example, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) that is accommodated in or supported by a first housing (210) and a second housing (220). For example, the electronic device (200) may include a second display (300) (e.g., a sub-display) that is arranged through a second housing (220).

[0092] According to one embodiment, the electronic device (200) may include a hinge housing (310) (e.g., a hinge cover) that is arranged to be invisible from the outside through the first housing (210) and the second housing (220) at least partially when in an unfolded state, and covers at least one hinge device (e.g., the hinge device (320) of FIG. 4) so ​​as to be invisible from the outside when in a folded state or while being folded. In this document, the surface on which the first display (230) is arranged may be defined as the front side (e.g., in the z-axis direction) of the foldable electronic device (200), and the opposite side of the front side may be defined as the back side (e.g., in the -z-axis direction) of the foldable electronic device (200). The surface surrounding the space between the front side and the back side of the foldable electronic device (200) may be defined as the side surface of the foldable electronic device (200).

[0093] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (F), have an overall symmetrical shape with respect to the folding axis (F), and can be folded to match each other. In some embodiments, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (F). For example, the angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0094] According to one embodiment, the first housing (210) may be rotatably connected to at least one hinge device (e.g., hinge device (320) of FIG. 4). For example, the first housing (210) may, in an unfolded state, include a first side member (213) arranged to face the front of the electronic device (200), a second side member (212) facing in an opposite direction of the first side member (211), and / or a first side member (213) enclosing at least a portion of a first space (2101) between the first side member (211) and the second side member (212).

[0095] According to one embodiment, the second housing (220) may be rotatably connected to at least one hinge device (e.g., hinge device (320) of FIG. 4). For example, the second housing (220) may, in an unfolded state, include a third side (221) arranged to face the front of the electronic device (200), a fourth side (222) facing in an opposite direction of the third side (221), and / or a second side member (223) surrounding at least a portion of a second space (2201) between the third side (221) and the fourth side (222).

[0096] In one embodiment, the first side (211) may face substantially the same direction as the third side (221) in the unfolded state, and may at least partially face the third side (221) so as to face the third side (221) in the folded state. For example, the electronic device (200) may include a recess (201) formed to accommodate the first display (230) through a structural connection of the first housing (210) and the second housing (220). For example, the recess (201) may have substantially the same size as the first display (230).

[0097] According to one embodiment, a hinge housing (310) (e.g., a hinge cover) may be disposed between a first housing (210) and a second housing (220). The hinge housing (310) (e.g., a hinge cover) may be disposed to cover a portion of a hinge device (e.g., a hinge device (320) of FIG. 4). The hinge housing (310) (e.g., a hinge cover) may be covered by portions of the first housing (210) and the second housing (220) or exposed to the outside depending on whether the foldable electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0098] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, at least a portion of the hinge housing (310) (e.g., hinge cover) may be substantially covered by the first housing (210) and the second housing (220) and not exposed. When the foldable electronic device (200) is in a folded state, at least a portion of the hinge housing (310) (e.g., hinge cover) may be exposed to the outside between the first housing (210) and the second housing (220). When the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge housing (310) may be at least partially exposed to the outside of the foldable electronic device (200) between the first housing (210) and the second housing (220). For example, the area of ​​the hinge housing (310) exposed to the outside may be less than when the foldable electronic device (200) is fully folded. For example, the hinge housing (310) may include an outer surface having a curved surface, a flat surface, or various shapes.

[0099] According to one embodiment, the electronic device (200) may include at least one of a display (230, 300), an input device (215), an audio output device (227, 228), a sensor module (217a, 217b, 226), a camera module (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In some embodiments, the electronic device (200) may additionally include at least one other component. In some embodiments, at least one of the above-described components may be omitted.

[0100] According to one embodiment, at least one display (230, 300) may include a first display (230) (e.g., a flexible display) that is arranged to be supported by a third side (221) of a second housing (220) from a first side (211) of a first housing (210), and a second display (300) that is arranged to be at least partially visible from the outside through a fourth side (222) in an interior space of the second housing (220). In some embodiments, the second display (300) may be arranged to be visible from the outside through the second side (212) in the first space (2101) of the first housing (210). For example, the first display (230) may be primarily used in an unfolded state of the electronic device (200), and the second display (300) may be primarily used in a folded state of the electronic device (200). For example, when the electronic device (200) is in an intermediate state, the first display (230) and / or the second display (300) can be controlled to be usable based on the folding angles of the first housing (210) and the second housing (220).

[0101] According to one embodiment, the first display (230) may be disposed in a receiving space formed by a pair of housings (210, 220). For example, the first display (230) may be disposed in a recess (201) formed by the pair of housings (210, 220), and may be disposed to occupy substantially most of the front surface of the electronic device (200) when unfolded. For example, the first display (230) may include a flexible display in which at least a portion of the display may be transformed into a flat or curved surface. For example, the first display (230) may include a first region (230a) corresponding to the first housing (210) and a second region (230b) corresponding to the second housing (220). For example, the first display (230) may include a folding area (230c) (e.g., a third area) that includes a portion of the first area (230a) and a portion of the second area (230b) with respect to the folding axis (F). For example, at least a portion of the folding area (230c) may include an area that at least partially corresponds to at least one hinge device (e.g., the hinge device (320) of FIG. 4). In one embodiment, the division of the regions of the first display (230) is merely an exemplary division by a pair of housings (210, 220) and at least one hinge device (e.g., the hinge device (320) of FIG. 4), and the first display (230) can be displayed as a seamless, full screen substantially through the pair of housings (210, 220) and at least one hinge device (e.g., the hinge device (320) of FIG. 4). For example, the first region (230a) and the second region (230b) may have an overall symmetrical shape or a partially asymmetrical shape with respect to the folding region (230c) and / or the folding axis (F).

[0102] According to one embodiment, the electronic device (200) may include a first rear cover (240) disposed on a second side (212) of the first housing (210) and a second rear cover (250) disposed on a fourth side (222) of the second housing (220). In some embodiments, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In some embodiments, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223). For example, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. For example, the first rear cover (240) may be formed by an opaque plate, such as coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. For example, the second rear cover (250) may be formed by a substantially transparent plate, such as glass or polymer. Accordingly, the second display (300) may be arranged so as to be visible from the outside through the second rear cover (250) in the second space (2201) of the second housing (220).

[0103] In one embodiment, the input device (215) may include a microphone. In some embodiments, the input device (215) may include a plurality of microphones arranged to detect the direction of sound. For example, the audio output devices (227, 228) may include speakers. For example, the audio output devices (227, 228) may include a call receiver (227) arranged through the fourth side (222) of the second housing (220) and an external speaker (228) arranged through at least a portion of the second side member (223) of the second housing (220). In some embodiments, the input device (215), the audio output device (227, 228), and the connector (229) are disposed in spaces of the first housing (210) and / or the second housing (220) and can be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In some embodiments, the holes formed in the first housing (210) and / or the second housing (220) can be used in common for the input device (215) and the audio output device (227, 228). In some embodiments, the audio output device (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (210) and / or the second housing (220).

[0104] In one embodiment, the camera modules (216a, 216b, 225) may include a first camera module (216a) positioned to capture a subject through a first side (211) of the first housing (210), a second camera module (216b) positioned to be exposed through a second side (212) of the first housing (210), and / or a third camera module (225) positioned to capture a subject through a fourth side (222) of the second housing (220). In some embodiments, the second camera module (261b) may also be positioned to capture a subject through a third side (221) of the second housing (220). In one embodiment, the electronic device (200) may include a flash (218) positioned near the second camera module (216b). For example, the flash (218) may include a light emitting diode or a xenon lamp. For example, the camera modules (216a, 216b, 225) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one of the camera modules (216a, 216b, 225) may include two or more lenses (e.g., a wide-angle lens and a telephoto lens) and image sensors, which may be arranged together to capture a subject through either side of the first housing (210) and / or the second housing (220).

[0105] According to one embodiment, the sensor modules (217a, 217b, 226) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor modules (217a, 217b, 226) may include a first sensor module (217a) arranged to detect an external environment through a first surface (211) of the first housing (210), a second sensor module (217b) arranged to detect an external environment through a second surface (212) of the first housing (210), and / or a third sensor module (226) arranged to detect an external environment through a fourth surface (222) of the second housing (220). In some embodiments, the sensor module (217a, 217b, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor).

[0106] According to one embodiment, the electronic device (200) may further include at least one sensor module, not shown, such as a pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. For example, the fingerprint recognition sensor may be disposed through the first side (211) of the first housing (210) and / or the fourth side (222) of the second housing (220). For example, the fingerprint recognition sensor may also be disposed through at least one side member of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0107] In one embodiment, the key input device (219) may be positioned to be exposed externally through the first side member (213) of the first housing (210). In some embodiments, the key input device (219) may also be positioned to be exposed externally through the second side member (223) of the second housing (220). In some embodiments, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 300). For example, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 300).

[0108] According to one embodiment, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In some embodiments, the connector port (229) may also perform a function for transmitting and receiving audio signals with the external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals.

[0109] According to one embodiment, some of the camera modules (216a, 225), some of the sensor modules (217a, 226) and / or the indicator may be arranged to be visually exposed through at least one display (230, 300). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226) and / or the indicator may be arranged in an interior space of at least one housing (e.g., the first housing (210) and / or the second housing (220)), below an active area of ​​at least one display (230, 300), and may be arranged to be in contact with the external environment through an opening or transparent area perforated through a cover member (e.g., a window layer of the first display (230) and / or a second rear cover (250)). For example, an area where at least one display (230, 300) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of an area displaying content. For example, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. For example, the transparent area may include an area overlapping with an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by an image sensor to generate an image. For example, the transparent area of ​​at least one display (230, 300) may include an area where the pixel arrangement density is lower than that of the surrounding area. For example, the transparent area may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC). For example, some camera modules (216a, 225) or sensor modules (217a, 226) may be arranged to perform their functions without being visually exposed through the display.For example, the area facing the camera module (216a, 225) and / or sensor module (217a, 226) positioned under the display (230, 300) (e.g., display panel) may have an under display camera (UDC) structure, so that a perforated opening may not be necessary.

[0110] According to one embodiment, when the electronic device (200) is in an unfolded state (e.g., the state of FIGS. 2A and 2B), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may be arranged to be substantially on the same plane and facing the same direction (e.g., the z-axis direction). For example, when the electronic device (200) is in an unfolded state, the first housing (210) may be rotated about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) face each other and may be folded in the opposite direction (out folding method).

[0111] According to one embodiment, when the electronic device (200) is in a folded state (e.g., the state of FIGS. 3A and 3B), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may be arranged to face each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with respect to each other through the folding region (230c). For example, the folding region (230c) may be deformed into a curved shape having at least a certain curvature. For example, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the folded state and smaller than the unfolded state, and the curvature of the folding region (230c) may be smaller than the folded state and larger than the unfolded state. In some embodiments, the first housing (210) and the second housing (220) may form an angle that can stop at a designated folding angle between the folded state and the unfolded state through at least one hinge device (e.g., the hinge device (320) of FIG. 4) (free stop function). In some embodiments, the first housing (210) and the second housing (220) may be pressed to maintain the state (free stop) or to continuously operate in the unfolded direction or the folded direction based on the designated inflection angle through at least one hinge device (e.g., the hinge device (320) of FIG. 4).

[0112] FIG. 4 is a schematic diagram illustrating an exploded perspective view of a foldable electronic device according to one embodiment.

[0113] According to one embodiment referring to FIG. 4, the foldable electronic device (200) may include a first display (230) (e.g., a flexible display), a second display (300), a hinge device (320) (e.g., a hinge module), a pair of support members (e.g., a first support member (261), a second support member (262)), at least one substrate (270) (e.g., a printed circuit board (PCB)), at least one of a first housing (210), a second housing (220), a first rear cover (240), or a second rear cover (250).

[0114] According to one embodiment, the first display (230) may include a display panel (430) (e.g., a flexible display panel), a support plate (450) disposed on a lower portion (e.g., in the -z-axis direction) of the display panel (430), and a pair of metal plates (461, 462) disposed on a lower portion (e.g., in the -z-axis direction) of the support plate (450).

[0115] According to one embodiment, the display panel (430) may include a first panel area (430a) corresponding to a first area of ​​the first display (230) (e.g., the first area (230a) of FIG. 2A), a second panel area (430b) extending from the first panel area (430a) and corresponding to a second area of ​​the first display (230) (e.g., the second area (230b) of FIG. 2A), and a third panel area (430c) connecting the first panel area (430a) and the second panel area (430b) and corresponding to a folding area of ​​the first display (230) (e.g., the folding area (230c) of FIG. 2A).

[0116] In one embodiment, the support plate (450) is disposed between the display panel (430) and a pair of support members (261, 262), and may be formed with a material and shape to provide a planar support structure for the first panel area (430a) and the second panel area (430b) and a bendable structure to aid in bendability for the third panel area (430c). For example, the support plate (450) may be formed of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber reinforced plastics (FRP)). For example, a pair of metal plates (461, 462) may include a first metal plate (461) positioned to correspond to at least a portion of a first panel area (430a) and a third panel area (430c) and a second metal plate (462) positioned to correspond to at least a portion of a second panel area (430b) and a third panel area (430c) between a support plate (450) and a pair of support members (261, 262). For example, the pair of metal plates (461, 462) may be formed of a metal material (e.g., SUS), thereby helping to reinforce a ground connection structure and rigidity for the first display (230).

[0117] According to one embodiment, the second display (300) may be positioned in the space between the second housing (220) and the second rear cover (250). For example, the second display (300) may be positioned in the space between the second housing (220) and the second rear cover (250) so as to be visible from the outside through substantially the entire area of ​​the second rear cover (250).

[0118] According to one embodiment, at least a portion of the first support member (261) may be foldably coupled to the second support member (262) via a hinge device (320) (e.g., a hinge module). For example, the foldable electronic device (200) may include at least one wiring member (263) (e.g., a flexible printed circuit board (FPCB)) that extends from at least a portion of the first support member (261) across the hinge device (320) to a portion of the second support member (262). For example, the first support member (261) may be disposed in a manner that extends from the first side member (213) or is structurally coupled with the first side member (213). For example, the foldable electronic device (200) may include a first space (e.g., the first space (2101) of FIG. 2A) provided through a first support member (261) and a first rear cover (240).

[0119] According to one embodiment, the first housing (210) (e.g., the first housing structure) may be configured by combining a first side member (213), a first support member (261), and a first rear cover (240). For example, the second support member (262) may be arranged in a manner that extends from the second side member (223) or is structurally coupled with the second side member (223). For example, the foldable electronic device (200) may include a second space (e.g., the second space (2201) of FIG. 2A) provided through the second support member (262) and the second rear cover (250).

[0120] According to one embodiment, the second housing (220) (e.g., the second housing structure) may be configured by combining the second side member (223), the second support member (262), and the second rear cover (250). For example, at least one wiring member (263) and / or at least a portion of the hinge device (320) may be arranged to be supported by at least a portion of a pair of support members (261, 262). For example, at least one wiring member (263) may be arranged in a direction transverse to the first support member (261) and the second support member (262) (e.g., in the x-axis direction). For example, at least one wiring member (263) may be arranged in a direction substantially perpendicular to a folding axis (e.g., the y-axis or the folding axis (F) of FIG. 2A) (e.g., in the x-axis direction).

[0121] According to one embodiment, at least one substrate (270) may include a first substrate (271) (e.g., a first printed circuit board) disposed in a first space (2101) and a second substrate (272) (a second printed circuit board) disposed in a second space (2201). For example, the first substrate (271) and the second substrate (272) may include at least one electronic component disposed to implement various functions of the foldable electronic device (200). For example, the first substrate (271) and the second substrate (272) may be electrically connected through at least one wiring member (263). For example, a camera module (282) may be disposed on the first substrate (271).

[0122] According to one embodiment, the foldable electronic device (200) may include at least one battery (291, 292). For example, the at least one battery (291, 292) may include a first battery (291) disposed in a first space (2101) of a first housing (210) and electrically connected to a first substrate (271), and a second battery (292) disposed in a second space (2201) of a second housing (220) and electrically connected to a second substrate (272). For example, the first support member (261) and the second support member (262) may further include at least one swelling hole for the first battery (291) and the second battery (292).

[0123] In one embodiment, the first housing (210) may include a first rotation support surface (214). The second housing (220) may include a second rotation support surface (224). For example, the first rotation support surface (214) and the second rotation support surface (224) may include curved surfaces corresponding to the curved outer surface of the hinge housing (310). For example, the first rotation support surface (214) and the second rotation support surface (224) may cover the hinge housing (310) when the foldable electronic device (200) is in an unfolded state, thereby preventing or exposing the hinge housing (310) to the rear surface of the foldable electronic device (200). For example, the first rotation support surface (214) and the second rotation support surface (224) may rotate along the outer surface of the curve of the hinge housing (310) when the foldable electronic device (200) is in a folded state, thereby exposing at least a portion of the hinge housing (310) to the rear surface of the foldable electronic device (200).

[0124] According to one embodiment, the foldable electronic device (200) may include at least one antenna (276) disposed in the first space (2101). For example, the at least one antenna (276) may be disposed between the first battery (291) and the first rear cover (240) in the first space (2101). For example, the at least one antenna (276) may include at least one of a near field communication (NFC) antenna, a wireless charging antenna, or a magnetic secure transmission (MST) antenna. For example, the at least one antenna (276) may perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In some embodiments, the antenna structure may be formed by at least a portion of the first side member (213) or the second side member (223) and / or a portion of the first support member (261) and the second support member (262), or a combination thereof.

[0125] According to one embodiment, the foldable electronic device (200) may include at least one electronic component assembly (274, 275) and / or additional support members (263, 273) disposed in the first space (2101) and / or the second space (2201). For example, the at least one electronic component assembly (274, 275) may include an interface connector port assembly (274) or a speaker assembly (275).

[0126] According to one embodiment, the foldable electronic device (200) illustrated in FIGS. 2A to 4 is described with respect to a structure in which the first housing (210) and the second housing (220) can rotate in a horizontal direction (e.g., in the x-axis direction and the -x-axis direction), but is not limited thereto, and can be substantially equally applied to a foldable electronic device having a structure in which the first housing (210) and the second housing (220) can rotate in a vertical direction (e.g., in the y-axis direction and the -y-axis direction).

[0127] The following examples illustrate a foldable electronic device (200), but are not limited thereto, and can be substantially equally applied to electronic devices such as bar-type electronic devices, rollable types, sliding types, tablet PCs, and / or notebook PCs.

[0128] FIG. 5 is a schematic diagram illustrating a configuration of a foldable electronic device including at least one non-conductive portion and at least one conductive portion according to one embodiment. FIG. 6 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment. FIG. 8A is a diagram illustrating a change in an electric field by a first matching circuit of a first housing in a foldable electronic device according to one embodiment. FIG. 8B is a diagram illustrating electric fields of a first housing and a second housing in a foldable electronic device in a folded state according to one embodiment. For example, the foldable electronic device (200) of FIG. 5 and / or FIG. 6 may be at least partially similar to the electronic device (101) of FIG. 1 or the foldable electronic device (200) disclosed in FIGS. 2A to 4, or may include other embodiments of the electronic device. For example, FIG. 5 may be a schematic drawing of a portion of a hinge device (320), a first housing (210), and a second housing (220) included in a foldable electronic device (200) in an unfolded state as shown in FIG. 2b, viewed from the rear (e.g., in the -z-axis direction).

[0129] According to one embodiment referring to FIGS. 5, 6, 8a and 8b, a foldable electronic device (200) may include a hinge device (320), a first housing (210) and a second housing (220).

[0130] According to one embodiment, the first housing (210) and the second housing (220) can operate in an unfolded or folded state, as disclosed in FIGS. 2A to 3B, with respect to the hinge device (320). The hinge device (320) can rotatably couple the first housing (210) and the second housing (220).

[0131] According to one embodiment, the first housing (210) may be at least partially coupled with a first side (e.g., in the x-axis direction) of the hinge device (320). The second housing (220) may be at least partially coupled with a second side (e.g., in the -x-axis direction) of the hinge device (320). The first housing (210) may be configured to be unfoldable and foldable with the second housing (220) using the hinge device (320). The second housing (220) may be configured to be unfoldable and foldable with the first housing (210) using the hinge device (320).

[0132] According to one embodiment, the first housing (210) and the second housing (220) may include a printed circuit board (270). For example, the first housing (210) may include a first printed circuit board (271). For example, the second housing (220) may include a second printed circuit board (272). For example, at least one wireless communication module (192), at least one processor (120), and at least one ground (G) may be disposed on the printed circuit board (270).

[0133] According to one embodiment, at least one memory (130) may be arranged on the printed circuit board (270). For example, the memory (130) may perform a function of storing a program for processing and controlling the processor (120) (e.g., the program (140) of FIG. 1A), an operating system (e.g., the operating system (142) of FIG. 1A), various applications, and input / output data. The memory (130) may store a program for controlling the overall operation of the foldable electronic device (200). The memory (130) may store various setting information required for processing functions in the foldable electronic device (200). The memory (130) may store at least one executable instruction. For example, the memory (130) may store at least one instruction that, when executed by the processor (120), causes the foldable electronic device (200) to perform at least one operation. For example, at least one instruction may be stored on a computer-readable recording medium. The recording medium may be tangible and non-transitory. The memory (130) and / or the recording medium may store one or more programs including at least one instruction.

[0134] According to one embodiment, the first housing (210) may include at least one of a first non-conductive portion (501) (e.g., a first segment), a second non-conductive portion (502) (e.g., a second segment), a third non-conductive portion (503) (e.g., a third segment), a first conductive portion (530), a third conductive portion (510), or a fourth conductive portion (520). For example, at least one of the first non-conductive portion (501) (e.g., the first segment), the second non-conductive portion (502) (e.g., the second segment), the third non-conductive portion (503) (e.g., the third segment), the first conductive portion (530), the third conductive portion (510), or the fourth conductive portion (520) may be formed on the first side member (213) of the first housing (210). For example, the first non-conductive portion (501) and the second non-conductive portion (502) may be formed in an upper direction (e.g., in the y-axis direction) of the first side member (213). The third non-conductive portion (503) may be formed in the x-axis direction of the first side member (213). For example, the first non-conductive portion (501) may be formed closer to the hinge device (320) than the second non-conductive portion (502) and the third non-conductive portion (503). For example, the first non-conductive portion (501) may be positioned between the first conductive portion (530) and the third conductive portion (510). The second non-conductive portion (502) may be positioned between the first conductive portion (530) and the fourth conductive portion (520). For example, at least one of the first non-conductive portion (501), the second non-conductive portion (502), or the third non-conductive portion (503) may include a segment, a cap, or a slit.

[0135] According to one embodiment, the first conductive portion (530) can be disposed between the first non-conductive portion (501) and the second non-conductive portion (502). The first conductive portion (530) can be electrically connected to the wireless communication module (192) via the first feed point (F1) (e.g., the first point) and the first signal path (S1). The first conductive portion (530) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (530)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (530)) can operate as a satellite antenna.

[0136] According to one embodiment, the first conductive portion (530) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (531). For example, the first point (P1) may be located closer to the first non-conductive portion (501) than to the first power supply point (F1).

[0137] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (530) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (530) to control electrical characteristics of the first conductive portion (530). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (530) and the ground (G) using at least one switch and at least one passive component.

[0138] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (530) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (530) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (530) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0139] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (530)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, when the first matching circuit (M1) is set to a component value exceeding a designated first reference component value (e.g., about 2.7 pF) (810), as shown in FIG. 8A, the intensity of at least a portion of the electric field associated with the first feed point (F1) may be highest within the first conductive portion (530) (812). As shown in FIG. 8A, when the first matching circuit (M1) is set to an element value (e.g., about 1.8 pF) lower than a designated first reference element value (800), the intensity of at least a portion of the electric field associated with the first point (P1) can be highest within the first conductive portion (530) (802). Accordingly, the first matching circuit (M1) can be set to an element value (or ground value) lower than the designated first reference element value so that the first antenna (A1) (e.g., the first conductive portion (530)) is configured in the form of a floating frame.

[0140] In one embodiment, the third conductive portion (510) can be positioned between the first non-conductive portion (501) and the hinge device (320). For example, the third conductive portion (510) can function as a radiator of the second antenna. The second antenna (e.g., the second conductive portion (510)) can operate in a third frequency band (e.g., a legacy frequency band). For example, the third frequency band can include a frequency band of about 650 MHz to 5 GHz. For example, the second antenna (e.g., the third conductive portion (510)) can operate as a legacy antenna.

[0141] In one embodiment, the fourth conductive portion (520) can be positioned between the second non-conductive portion (502) and the third non-conductive portion (503). For example, the second non-conductive portion (502) can be formed closer to the first non-conductive portion (501) or the hinge device (320) than the third non-conductive portion (503). For example, the fourth conductive portion (520) can function as a radiator of the third antenna. The third antenna (e.g., the fourth conductive portion (520)) can operate in a third frequency band (e.g., a legacy frequency band). For example, the third antenna (e.g., the fourth conductive portion (520)) can operate as a legacy antenna.

[0142] According to one embodiment, the processor (120) may control the wireless communication module (192) to transmit a feeding signal to the first feeding point (F1) of the first conductive portion (530). The processor (120) may control the first matching circuit (M1) to control the electrical length or path of the first conductive portion (530) (e.g., the first antenna (A1)). The processor (120) may control or adjust the element values ​​of the first matching circuit (M1).

[0143] According to one embodiment, the second housing (220) can include at least one of a fourth non-conductive portion (504) (e.g., the fourth segment), a fifth non-conductive portion (505) (e.g., the fifth segment), a sixth non-conductive portion (506) (e.g., the sixth segment), a second conductive portion (560), a fifth conductive portion (540), or a sixth conductive portion (550). For example, at least one of the fourth non-conductive portion (504), the fifth non-conductive portion (505), the sixth non-conductive portion (506), the second conductive portion (560), the fifth conductive portion (540), or the sixth conductive portion (550) can be formed on the second side member (223) of the second housing (220). For example, the fourth non-conductive portion (504) and the fifth non-conductive portion (505) may be formed in an upper direction (e.g., in the y-axis direction) of the second side member (223). The sixth non-conductive portion (506) may be formed in the -x-axis direction of the second side member (223). For example, the fourth non-conductive portion (504) may be formed closer to the hinge device (320) than the fifth non-conductive portion (505) and the sixth non-conductive portion (506). For example, the fourth non-conductive portion (504) may be positioned between the second conductive portion (560) and the fifth conductive portion (540). The fifth non-conductive portion (505) may be positioned between the second conductive portion (560) and the sixth conductive portion (550). For example, at least one of the fourth non-conductive portion (504), the fifth non-conductive portion (505), or the sixth non-conductive portion (506) may include a segment, a cap, or a slit.

[0144] In one embodiment, the second conductive portion (560) can be positioned between the fourth non-conductive portion (504) and the fifth non-conductive portion (505). The fifth conductive portion (540) can be positioned between the fourth non-conductive portion (504) and the hinge device (320). The sixth conductive portion (550) can be positioned between the fifth non-conductive portion (505) and the sixth non-conductive portion (506).

[0145] According to one embodiment, the second conductive portion (560) may be electrically connected to the second matching circuit (M2) via the second point (P2) (e.g., the third point). The second matching circuit (M2) may be electrically connected to the processor (120) via the second electrical path (553). For example, the second point (P2) (e.g., the third point) may be at least partially aligned with the first power supply point (F1) (e.g., the first point) of the first conductive portion (530) when the foldable electronic device (200) is in a folded state, as shown in FIG. 8B. For example, the second point (P2) (e.g., the third point) and the first power supply point (F1) (e.g., the first point) may be at least partially aligned when the electronic device (200) is viewed from above in a folded state. For example, the top may include a direction perpendicular to the horizontal plane on which the electronic device (200) is mounted (e.g., the direction of gravity).

[0146] According to one embodiment, the second matching circuit (M2) may be disposed between the second conductive portion (560) and the ground (G). The second matching circuit (M2) may be electrically connected to the second point (P2) of the second conductive portion (560) to control electrical characteristics of the second conductive portion (560). For example, the second matching circuit (M2) may be electrically connected to the ground (G). For example, the second matching circuit (M2) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the second matching circuit (M2) may change a component value (or ground value) for connecting the second conductive portion (560) and the ground (G) using at least one switch and at least one passive component.

[0147] According to one embodiment, when the foldable electronic device (200) is in an unfolded state and the second matching circuit (M2) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (530), matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (560) forms a resonance of the first frequency band (or the second frequency band). For example, when the foldable electronic device (200) is in an unfolded state and the first conductive portion (530) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the second matching circuit (M2) to suppress the current flowing in the second housing (220) (e.g., the second conductive portion (560)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (530).

[0148] According to one embodiment, the second conductive portion (560) may be configured in the form of a floating frame via a second matching circuit (M2) so that the first antenna (A1) (e.g., the first conductive portion (530)) can maintain a radiation pattern of the upper hemisphere. For example, the second matching circuit (M2) may be set to an element value (or ground value) lower than a second reference element value designated so that the second conductive portion (560) is configured in the form of a floating frame. When the second matching circuit (M2) is set to an element value lower than the designated second reference element value, the second conductive portion (560) may have an electric field intensity of at least a portion opposite to the second point (P2) that is the highest within the second conductive portion (560). In this case, the first conductive portion (530) and the second conductive portion (560) may coincide (or overlap) at least a portion of the electric field having the highest intensity when the foldable electronic device (200) is in a folded state, as shown in FIG. 8c. For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0149] In one embodiment, the first housing (210) and the second housing (220) can be positioned relative to the hinge device (320). For example, the first housing (210) can be at least partially coupled with a second side (e.g., in the -x-axis direction) of the hinge device (320). The second housing (220) can be at least partially coupled with a first side (e.g., in the x-axis direction) of the hinge device (320).

[0150] FIG. 7 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment. For example, the foldable electronic device (200) of FIG. 7 may be at least partially similar to the electronic device (101) of FIG. 1 or the foldable electronic device (200) disclosed in FIGS. 2A to 4 , or may include other embodiments of the electronic device. For example, FIG. 7 may be a schematic diagram of a portion of a hinge device (320), a first housing (210), and a second housing (220) included in the foldable electronic device (200) in an unfolded state illustrated in FIG. 2B , as viewed from the rear (e.g., in the -z-axis direction).

[0151] According to one embodiment referring to FIG. 7, the foldable electronic device (200) may include a hinge device (320), a first housing (210), and a second housing (220). For example, the first housing (210) and the second housing (220) may operate in an unfolded state or a folded state, as disclosed in FIGS. 2A to 3B, based on the hinge device (320).

[0152] According to one embodiment, the first housing (210) can include at least one of a first non-conductive portion (501) (e.g., a first segment), a second non-conductive portion (502) (e.g., a second segment), a first conductive portion (530), a third conductive portion (510), or a fourth conductive portion (520). For example, the first non-conductive portion (501) can be formed closer to the hinge device (320) than the second non-conductive portion (502).

[0153] According to one embodiment, the first conductive portion (530) can be disposed between the first non-conductive portion (501) and the second non-conductive portion (502). The first conductive portion (530) can be electrically connected to the wireless communication module (192) via the first feed point (F1) (e.g., the first point) and the first signal path (S1). The first conductive portion (530) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring).

[0154] According to one embodiment, the first conductive portion (530) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (531). For example, the first point (P1) may be located closer to the second non-conductive portion (502) than to the first power supply point (F1).

[0155] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (530) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (530) to control electrical characteristics of the first conductive portion (530). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive element (or lumped element) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change an element value (or ground value) for connecting the first conductive portion (530) and the ground (G) using at least one switch and at least one passive element.

[0156] According to one embodiment, the first matching circuit (M1) may be configured to have matching controlled (e.g., adjusted) under the control of the processor (120) to form a resonance in the first frequency band or the second frequency band when the first conductive portion (530) operates to radiate signals in the first frequency band or signals in the second frequency band.

[0157] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (530)) may be configured in the form of a floating frame via a first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first conductive portion (530) is configured in the form of a floating frame.

[0158] In one embodiment, the third conductive portion (510) may be disposed between the first non-conductive portion (501) and the hinge device (320). For example, the third conductive portion (510) may function as a radiator of the second antenna. In one embodiment, the fourth conductive portion (520) may be disposed between the second non-conductive portion (502) and the third non-conductive portion (503). For example, the fourth conductive portion (520) may function as a radiator of the third antenna.

[0159] According to one embodiment, the processor (120) may control the wireless communication module (192) to transmit a feeding signal to the first feeding point (F1) of the first conductive portion (530). The processor (120) may control the first matching circuit (M1) to control the electrical length or path of the first conductive portion (530) (e.g., the first antenna (A1)). The processor (120) may control or adjust the element values ​​of the first matching circuit (M1).

[0160] In one embodiment, the second housing (220) can include at least one of a fourth non-conductive portion (504) (e.g., a fourth segment), a fifth non-conductive portion (505) (e.g., a fifth segment), a second conductive portion (560), a fifth conductive portion (540), or a sixth conductive portion (550). For example, the fourth non-conductive portion (504) can be formed closer to the hinge device (320) than the fifth non-conductive portion (505). For example, at least one of the fourth non-conductive portion (504) or the fifth non-conductive portion (505) can include a segment, a cap, or a slit.

[0161] In one embodiment, the second conductive portion (560) can be positioned between the fourth non-conductive portion (504) and the fifth non-conductive portion (505). The fifth conductive portion (540) can be positioned between the fourth non-conductive portion (504) and the hinge device (320).

[0162] In one embodiment, the second conductive portion (560) may be electrically connected to the second matching circuit (M2) via a second point (P2) (e.g., a third point). The second matching circuit (M2) may be electrically connected to the processor (120) via a second electrical path (553). For example, the second point (P2) (e.g., the third point) may be at least partially aligned with the first power supply point (F1) (e.g., the first point) of the first conductive portion (530) when the foldable electronic device (200) is in a folded state.

[0163] According to one embodiment, the second matching circuit (M2) may be disposed between the second conductive portion (560) and the ground (G). The second matching circuit (M2) may be electrically connected to the second point (P2) of the second conductive portion (560) to control electrical characteristics of the second conductive portion (560). For example, the second matching circuit (M2) may change a component value (or ground value) for connecting the second conductive portion (560) and the ground (G) using at least one switch and at least one passive component.

[0164] According to one embodiment, when the foldable electronic device (200) is in an unfolded state and the second matching circuit (M2) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (530), matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (560) forms a resonance of the first frequency band (or the second frequency band). For example, when the foldable electronic device (200) is in an unfolded state and the first conductive portion (530) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the second matching circuit (M2) to suppress the current flowing in the second housing (220) (e.g., the second conductive portion (560)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (530).

[0165] According to one embodiment, the second conductive portion (560) may be configured in the form of a floating frame via a second matching circuit (M2) so that the first antenna (A1) (e.g., the first conductive portion (530)) can maintain a radiation pattern of the upper hemisphere. For example, the second matching circuit (M2) may be set to an element value (or ground value) lower than a second reference element value specified so that the second conductive portion (560) is configured in the form of a floating frame. For example, the first conductive portion (530) and the second conductive portion (560) may have at least a part where the electric field intensity is highest when the foldable electronic device (200) is folded. For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0166] FIGS. 9A and 9B are schematic diagrams showing antenna characteristics according to a change in the state of a second matching circuit of a second conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0167] According to one embodiment referring to FIGS. 9A and 9B, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) or the first conductive portion (530) and the second conductive portion (560) as a satellite antenna in a folded state.

[0168] According to one embodiment, the first conductive portion (530) may be configured in the form of a floating frame using a first matching circuit (M1) set to a component value lower than or equal to a specified first reference component value (e.g., about 1.2 pF or about 0.25 pF). The second conductive portion (560) may be configured in the form of a floating frame using a second matching circuit (M2) set to a component value lower than or equal to a specified second reference component value (e.g., about 2.7 pF, about 2.2 pF, or about 1.5 pF). For example, when the second conductive portion (560) uses a second matching circuit (M2) set to a component value lower than a designated second reference component value, when the foldable electronic device (200) is in a folded state, a portion of the second conductive portion (560) having the highest electric field intensity may coincide with (or overlap with) at least a portion of the first conductive portion (530) having the highest electric field intensity (e.g., at least a portion associated with the first point).

[0169] According to one embodiment, when the element value of the second matching circuit (M2) is less than or equal to a second reference element value (900, 910, or 920) when the first housing (210) and the second housing (220) are in a folded state as shown in FIG. 9a, the gain (e.g., radiation efficiency) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved compared to when the second conductive portion (560) and the ground (G) are electrically disconnected (open) (930) by the second matching circuit (M2).

[0170] According to one embodiment, when the element value of the second matching circuit (M2) is less than or equal to a second reference element value (940, 950, or 960) when the first housing (210) and the second housing (220) are in a folded state as shown in FIG. 9b, the reflection efficiency (e.g., radiation coefficient) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved compared to when the second conductive portion (560) and the ground (G) are electrically disconnected (open) (970) by the second matching circuit (M2).

[0171] FIGS. 10A and 10B are schematic diagrams illustrating a radiation pattern when a satellite signal of a first frequency band is radiated using a first conductive portion in a foldable electronic device in a folded state according to one embodiment. FIGS. 10C and 10D are schematic diagrams illustrating a radiation pattern when a satellite signal of a second frequency band is radiated using a first conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0172] According to one embodiment referring to FIGS. 10A, 10B, 10C and 10D, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) or the first conductive portion (530) and the second conductive portion (560) as a satellite antenna in a folded state.

[0173] According to one embodiment, the first conductive portion (530) may be configured in the form of a floating frame using a first matching circuit (M1) set to a component value lower than or equal to a specified first reference component value (e.g., about 1.2 pF or about 0.25 pF). The second conductive portion (560) may be configured in the form of a floating frame using a second matching circuit (M2) set to a component value lower than or equal to a specified second reference component value (e.g., about 2.7 pF, about 2.2 pF, or about 1.5 pF). For example, the first conductive portion (530) and the second conductive portion (560) may have at least a portion where the electric field intensity is highest when the foldable electronic device (200) is folded.

[0174] According to one embodiment, when a foldable electronic device (200) transmits a satellite signal of a first frequency band (e.g., N255 band) using a first conductive portion (530) and a second conductive portion (560) configured in the form of a floating frame, as shown in FIGS. 10A and 10B (1010), the satellite signal can form a radiation pattern in the upper hemisphere direction (1012) compared to a case where conductive portions of a form other than a floating frame are used (1000).

[0175] According to one embodiment, when the foldable electronic device (200) transmits a satellite signal of a second frequency band (e.g., N256 band) using the first conductive portion (530) and the second conductive portion (560) configured in the form of a floating frame, as shown in FIGS. 10c and 10d (1030), the satellite signal can form a radiation pattern in the upper hemisphere direction (1032) compared to the case where conductive portions of a form other than a floating frame are used (1020).

[0176] FIG. 11A is a diagram schematically illustrating a current distribution of a foldable electronic device in an unfolded state according to one embodiment. FIG. 11B is a diagram schematically illustrating antenna efficiency according to a change in the state of a second matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment. FIG. 11C is a diagram schematically illustrating a change in a radiation pattern of a first conductive portion according to a change in the state of a second matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0177] According to one embodiment referring to FIGS. 11A, 11B and 11C, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) as a satellite antenna in an unfolded state.

[0178] According to one embodiment, when the second matching circuit (M2) of the second conductive portion (560) operates to radiate signals of the second frequency band (or signals of the first frequency band) through the first conductive portion (530) in an unfolded state of the foldable electronic device (200), the element value may be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (560) forms a resonance of the second frequency band (or the first frequency band).

[0179] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, when the first conductive portion (530) operates in a second frequency band (or a first frequency band) (e.g., operates as a satellite antenna), the second conductive portion (560) resonates to correspond to the first frequency band (or the second frequency band), thereby suppressing current flowing in the second housing (220) (e.g., the second conductive portion (560)) (1100).

[0180] According to one embodiment, when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) in the unfolded state of the foldable electronic device (200) is suppressed, the efficiency of the satellite antenna in the second frequency band (e.g., the N256 band) can be improved (1110), as shown in FIG. 11b.

[0181] According to one embodiment, the foldable electronic device (200) can form (or maintain) a radiation pattern of satellite signals in the upper hemisphere direction, as shown in FIG. 11c, when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) is suppressed in the unfolded state.

[0182] FIGS. 12A and 12B are schematic diagrams illustrating a radiation pattern when a satellite signal of a first frequency band is radiated using a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment. FIGS. 12C and 12D are schematic diagrams illustrating a radiation pattern when a satellite signal of a second frequency band is radiated using a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0183] According to one embodiment referring to FIGS. 12a, 12b, 12c and 12d, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) as a satellite antenna in an unfolded state.

[0184] According to one embodiment, when the second matching circuit (M2) of the second conductive portion (560) operates to radiate signals of the second frequency band (or signals of the first frequency band) through the first conductive portion (530) in an unfolded state of the foldable electronic device (200), the element value may be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (560) forms a resonance of the second frequency band (or the first frequency band).

[0185] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, when the first conductive portion (530) operates in a first frequency band or a second frequency band (e.g., operates as a satellite antenna), the second conductive portion (560) resonates to correspond to the first frequency band or the second frequency band, thereby suppressing the current flowing in the second housing (220) (e.g., the second conductive portion (560)).

[0186] According to one embodiment, the foldable electronic device (200) may form a radiation pattern of a satellite signal of a first frequency band (e.g., N255 band) in the upper hemisphere direction (1212) when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) is suppressed (1210) in the unfolded state, as shown in FIGS. 12a and 12b, compared to when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) is not suppressed (1200).

[0187] According to one embodiment, the foldable electronic device (200) may form a radiation pattern of a satellite signal of a second frequency band (e.g., N256 band) in the upper hemisphere direction (1232) when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) is suppressed (1230) in the unfolded state, as shown in FIGS. 12c and 12d, compared to when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) is not suppressed (1220).

[0188] FIG. 13 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment. For example, the foldable electronic device (200) of FIG. 13 may be at least partially similar to the electronic device (101) of FIG. 1 or the foldable electronic device (200) disclosed in FIGS. 2A to 4, or may include other embodiments of the electronic device.

[0189] According to one embodiment referring to FIG. 13, a foldable electronic device (200) may include a hinge device (320), a first housing (210), and a second housing (220).

[0190] According to one embodiment, the first housing (210) and the second housing (220) can operate in an unfolded or folded state, as disclosed in FIGS. 2A to 3B, with respect to the hinge device (320). The hinge device (320) can rotatably couple the first housing (210) and the second housing (220).

[0191] According to one embodiment, the first housing (210) may be at least partially coupled with a first side (e.g., in the x-axis direction) of the hinge device (320). The second housing (220) may be at least partially coupled with a second side (e.g., in the -x-axis direction) of the hinge device (320). The first housing (210) may be configured to be unfoldable and foldable with the second housing (220) using the hinge device (320). The second housing (220) may be configured to be unfoldable and foldable with the first housing (210) using the hinge device (320).

[0192] According to one embodiment, the first housing (210) can include at least one of a first non-conductive portion (501) (e.g., a first segment), a second non-conductive portion (502) (e.g., a second segment), a first conductive portion (530), a third conductive portion (510), or a fourth conductive portion (520). For example, the first non-conductive portion (501) can be formed closer to the hinge device (320) than the second non-conductive portion (502). For example, the first non-conductive portion (501) can be positioned between the first conductive portion (530) and the third conductive portion (510). The second non-conductive portion (502) can be positioned between the first conductive portion (530) and the fourth conductive portion (520). For example, at least one of the first non-conductive portion (501) or the second non-conductive portion (502) may include a segment, a cap, or a slit.

[0193] According to one embodiment, the first conductive portion (530) can be disposed between the first non-conductive portion (501) and the second non-conductive portion (502). The first conductive portion (530) can be electrically connected to the wireless communication module (192) via the first feed point (F1) (e.g., the first point) and the first signal path (S1). The first conductive portion (530) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (530)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (530)) can operate as a satellite antenna.

[0194] According to one embodiment, the first conductive portion (530) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (531). For example, the first point (P1) may be located closer to the first non-conductive portion (501) than to the first power supply point (F1).

[0195] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (530) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (530) to control electrical characteristics of the first conductive portion (530). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (530) and the ground (G) using at least one switch and at least one passive component.

[0196] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (530) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (530) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (530) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0197] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (530)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first antenna (A1) (e.g., the first conductive portion (530)) is configured in the form of a floating frame.

[0198] In one embodiment, the third conductive portion (510) can be positioned between the first non-conductive portion (501) and the hinge device (320). For example, the third conductive portion (510) can function as a radiator of the second antenna. The second antenna (e.g., the second conductive portion (510)) can operate in a third frequency band (e.g., a legacy frequency band). For example, the third frequency band can include a frequency band of about 650 MHz to 5 GHz. For example, the second antenna (e.g., the third conductive portion (510)) can operate as a legacy antenna.

[0199] According to one embodiment, the fourth conductive portion (520) can be positioned between the second non-conductive portion (502) and the third non-conductive portion (503 in FIG. 5). For example, the second non-conductive portion (502) can be formed closer to the first non-conductive portion (501) or the hinge device (320) than the third non-conductive portion (503). For example, the fourth conductive portion (520) can function as a radiator of the third antenna. The third antenna (e.g., the fourth conductive portion (520)) can operate in a third frequency band (e.g., a legacy frequency band). For example, the third antenna (e.g., the fourth conductive portion (520)) can operate as a legacy antenna.

[0200] According to one embodiment, the processor (120) may control the wireless communication module (192) to transmit a feeding signal to the first feeding point (F1) of the first conductive portion (530). The processor (120) may control the first matching circuit (M1) to control the electrical length or path of the first conductive portion (530) (e.g., the first antenna (A1)). The processor (120) may control or adjust the element values ​​of the first matching circuit (M1).

[0201] According to one embodiment, the second housing (220) can include at least one of a fourth non-conductive portion (504) (e.g., the fourth segment), a fifth non-conductive portion (505) (e.g., the fifth segment), a second conductive portion (560), a fifth conductive portion (540), or a sixth conductive portion (550). For example, the fourth non-conductive portion (504) can be formed closer to the hinge device (320) than the fifth non-conductive portion (505). For example, the fourth non-conductive portion (504) can be positioned between the second conductive portion (560) and the fifth conductive portion (540). The fifth non-conductive portion (505) can be positioned between the second conductive portion (560) and the sixth conductive portion (550). For example, at least one of the fourth non-conductive portion (504) or the fifth non-conductive portion (505) may include a segment, a cap, or a slit.

[0202] In one embodiment, the second conductive portion (560) can be positioned between the fourth non-conductive portion (504) and the fifth non-conductive portion (505). The fifth conductive portion (540) can be positioned between the fourth non-conductive portion (504) and the hinge device (320).

[0203] In one embodiment, the second conductive portion (560) may be electrically connected to a third matching circuit (M3) via a third point (P3) (e.g., a fourth point). The third matching circuit (M3) may be electrically connected to the processor (120) via a third electrical path (555). For example, the third point (P3) (e.g., the fourth point) may be at least partially aligned with the first point (P1) (e.g., the second point) of the first conductive portion (530) when the foldable electronic device (200) is in a folded state.

[0204] According to one embodiment, a third matching circuit (M3) may be disposed between the second conductive portion (560) and the ground (G). The third matching circuit (M3) may be electrically connected to a third point (P3) of the second conductive portion (560) to control electrical characteristics of the second conductive portion (560). For example, the third matching circuit (M3) may be electrically connected to the ground (G). For example, the third matching circuit (M3) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the third matching circuit (M3) may change a component value (or ground value) for connecting the second conductive portion (560) and the ground (G) using at least one switch and at least one passive component.

[0205] According to one embodiment, when the foldable electronic device (200) is in an unfolded state and the third matching circuit (M3) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (530), matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (560) forms a resonance of the first frequency band (or the second frequency band). For example, when the foldable electronic device (200) is in an unfolded state and the first conductive portion (530) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the third matching circuit (M3) to suppress the current flowing in the second housing (220) (e.g., the second conductive portion (560)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (530).

[0206] According to one embodiment, the second conductive portion (560) may be configured in the form of a floating frame via a third matching circuit (M3) so that the first antenna (A1) (e.g., the first conductive portion (530)) can maintain a radiation pattern of the upper hemisphere. For example, the third matching circuit (M3) may be set to an element value (or ground value) lower than a second reference element value designated so that the second conductive portion (560) is configured in the form of a floating frame.

[0207] In one embodiment, the first housing (210) and the second housing (220) can be positioned relative to the hinge device (320). For example, the first housing (210) can be at least partially coupled with a second side (e.g., in the -x-axis direction) of the hinge device (320). The second housing (220) can be at least partially coupled with a first side (e.g., in the x-axis direction) of the hinge device (320).

[0208] FIGS. 14A and 14B are schematic diagrams showing antenna characteristics according to state changes of a third matching circuit of a second conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0209] According to one embodiment referring to FIGS. 14A and 14B, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) or the first conductive portion (530) and the second conductive portion (560) as a satellite antenna in a folded state.

[0210] According to one embodiment, the first conductive portion (530) may be configured in the form of a floating frame using a first matching circuit (M1) set to a component value lower than or equal to a specified first reference component value (e.g., about 1.2 pF or about 0.25 pF). The second conductive portion (560) may be configured in the form of a floating frame using a third matching circuit (M3) set to a component value lower than or equal to a specified second reference component value (e.g., about 2.7 pF, about 2.2 pF, or about 1.5 pF).

[0211] According to one embodiment, the foldable electronic device (200) may have a similar gain (e.g., radiation efficiency) of a satellite antenna in a first frequency band (e.g., N255 band) when the element value of the third matching circuit (M3) is less than or equal to a second reference element value (1400, 1410, or 1420) when the first housing (210) and the second housing (220) are in a folded state as shown in FIG. 12a, and when the second conductive portion (560) and the ground (G) are electrically disconnected (open) (1330) by the third matching circuit (M3).

[0212] According to one embodiment, when the element value of the third matching circuit (M3) is less than or equal to a second reference element value (1440, 1450, or 1460) when the first housing (210) and the second housing (220) are in a folded state as shown in FIG. 12b, the reflection efficiency (e.g., radiation coefficient) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved compared to when the second conductive portion (560) and the ground (G) are electrically disconnected (open) (1470) by the third matching circuit (M3).

[0213] FIG. 15A is a diagram schematically illustrating a current distribution of a foldable electronic device in an unfolded state according to one embodiment. FIG. 15B is a diagram schematically illustrating antenna efficiency according to a change in the state of a third matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment. FIG. 15C is a diagram schematically illustrating a change in a radiation pattern of a first conductive portion according to a change in the state of a third matching circuit of a second conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0214] According to one embodiment referring to FIGS. 15a, 15b and 15c, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) as a satellite antenna in an unfolded state.

[0215] According to one embodiment, when the foldable electronic device (200) is in an unfolded state and the third matching circuit (M3) of the second conductive portion (560) operates to radiate signals of the second frequency band (or signals of the first frequency band) through the first conductive portion (530), the element value may be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (560) forms a resonance of the second frequency band (or the first frequency band).

[0216] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, when the first conductive portion (530) operates in a second frequency band (or a first frequency band) (e.g., operates as a satellite antenna), the second conductive portion (560) resonates to correspond to the first frequency band (or the second frequency band), thereby suppressing current flowing in the second housing (220) (e.g., the second conductive portion (560)) (1500).

[0217] According to one embodiment, when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) in the unfolded state of the foldable electronic device (200) is suppressed, the efficiency of the satellite antenna in the second frequency band (e.g., the N256 band) can be relatively improved (1510), as shown in FIG. 15b.

[0218] According to one embodiment, the foldable electronic device (200) can form (or maintain) a radiation pattern of satellite signals in the upper hemisphere direction (1012), as shown in FIG. 15c, when the current flowing in the second housing (220) (e.g., the second conductive portion (560)) is suppressed in the unfolded state.

[0219] FIG. 16 is a schematic diagram illustrating a circuit configuration of a foldable electronic device including a satellite antenna according to one embodiment. For example, the foldable electronic device (200) of FIG. 16 may be at least partially similar to the electronic device (101) of FIG. 1 or the foldable electronic device (200) disclosed in FIGS. 2A to 4, or may include other embodiments of the electronic device.

[0220] According to one embodiment referring to FIG. 16, a foldable electronic device (200) may include a hinge device (320), a first housing (210), and a second housing (220).

[0221] According to one embodiment, the first housing (210) and the second housing (220) can operate in an unfolded or folded state, as disclosed in FIGS. 2A to 3B, with respect to the hinge device (320). The hinge device (320) can rotatably couple the first housing (210) and the second housing (220).

[0222] According to one embodiment, the first housing (210) may be at least partially coupled with a first side (e.g., in the x-axis direction) of the hinge device (320). The second housing (220) may be at least partially coupled with a second side (e.g., in the -x-axis direction) of the hinge device (320). The first housing (210) may be configured to be unfoldable and foldable with the second housing (220) using the hinge device (320). The second housing (220) may be configured to be unfoldable and foldable with the first housing (210) using the hinge device (320).

[0223] According to one embodiment, the first housing (210) can include at least one of a first non-conductive portion (501) (e.g., a first segment), a second non-conductive portion (502) (e.g., a second segment), a first conductive portion (530), a third conductive portion (510), or a fourth conductive portion (520). For example, the first non-conductive portion (501) can be formed closer to the hinge device (320) than the second non-conductive portion (502). For example, the first non-conductive portion (501) can be positioned between the first conductive portion (530) and the third conductive portion (510). The second non-conductive portion (502) can be positioned between the first conductive portion (530) and the fourth conductive portion (520). For example, at least one of the first non-conductive portion (501) or the second non-conductive portion (502) may include a segment, a cap, or a slit.

[0224] According to one embodiment, the first conductive portion (530) can be disposed between the first non-conductive portion (501) and the second non-conductive portion (502). The first conductive portion (530) can be electrically connected to the wireless communication module (192) via the first feed point (F1) (e.g., the first point) and the first signal path (S1). The first conductive portion (530) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (530)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (530)) can operate as a satellite antenna.

[0225] According to one embodiment, the first conductive portion (530) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (531). For example, the first point (P1) may be located closer to the first non-conductive portion (501) than to the first power supply point (F1).

[0226] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (530) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (530) to control electrical characteristics of the first conductive portion (530). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (530) and the ground (G) using at least one switch and at least one passive component.

[0227] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (530) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (530) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (530) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0228] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (530)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first antenna (A1) (e.g., the first conductive portion (530)) is configured in the form of a floating frame.

[0229] According to one embodiment, the third conductive portion (510) may be positioned between the first non-conductive portion (501) and the hinge device (320). For example, the third conductive portion (510) may function as a radiator of the second antenna.

[0230] According to one embodiment, the fourth conductive portion (520) may be positioned between the second non-conductive portion (502) and the third non-conductive portion (503 in FIG. 5). For example, the second non-conductive portion (502) may be formed closer to the first non-conductive portion (501) or the hinge device (320) than the third non-conductive portion (503). For example, the fourth conductive portion (520) may function as a radiator of the third antenna.

[0231] According to one embodiment, the processor (120) may control the wireless communication module (192) to transmit a feeding signal to the first feeding point (F1) of the first conductive portion (530). The processor (120) may control the first matching circuit (M1) to control the electrical length or path of the first conductive portion (530) (e.g., the first antenna (A1)). The processor (120) may control or adjust the element values ​​of the first matching circuit (M1).

[0232] According to one embodiment, the second housing (220) can include at least one of a fourth non-conductive portion (504) (e.g., the fourth segment), a fifth non-conductive portion (505) (e.g., the fifth segment), a second conductive portion (560), a fifth conductive portion (540), or a sixth conductive portion (550). For example, the fourth non-conductive portion (504) can be formed closer to the hinge device (320) than the fifth non-conductive portion (505). For example, the fourth non-conductive portion (504) can be positioned between the second conductive portion (560) and the fifth conductive portion (540). The fifth non-conductive portion (505) can be positioned between the second conductive portion (560) and the sixth conductive portion (550). For example, at least one of the fourth non-conductive portion (504) or the fifth non-conductive portion (505) may include a segment, a cap, or a slit.

[0233] In one embodiment, the second conductive portion (560) can be positioned between the fourth non-conductive portion (504) and the fifth non-conductive portion (505). The fifth conductive portion (540) can be positioned between the fourth non-conductive portion (504) and the hinge device (320).

[0234] In one embodiment, the first housing (210) and the second housing (220) can be positioned relative to the hinge device (320). For example, the first housing (210) can be at least partially coupled with a second side (e.g., in the -x-axis direction) of the hinge device (320). The second housing (220) can be at least partially coupled with a first side (e.g., in the x-axis direction) of the hinge device (320).

[0235] FIGS. 17A and 17B are schematic diagrams showing antenna characteristics according to a change in the state of a first matching circuit of a first conductive portion in a foldable electronic device in a folded state according to one embodiment.

[0236] According to one embodiment referring to FIGS. 17A and 17B, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) or the first conductive portion (530) and the second conductive portion (560) as a satellite antenna in a folded state.

[0237] According to one embodiment, the first conductive portion (530) may be configured in the form of a floating frame using a first matching circuit (M1) set to a component value less than or equal to a designated first reference component value (e.g., about 1.2 pF or about 0.25 pF).

[0238] According to one embodiment, when the element value of the first matching circuit (M1) is a first value (e.g., about 0.25 pF) that is lower than a first reference element value when the first housing (210) and the second housing (220) are folded in a folded state as shown in FIG. 17a (1700), the gain (e.g., radiation efficiency) of the satellite antenna in the second frequency band (e.g., N256 band) can be improved compared to when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1720).

[0239] According to one embodiment, when the element value of the first matching circuit (M1) is a second value (e.g., about 1.2 pF) that is lower than a first reference element value when the first housing (210) and the second housing (220) are folded in a folded state as shown in FIG. 17a, as compared to when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1720), the gain (e.g., radiation efficiency) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved.

[0240] According to one embodiment, when the element value of the first matching circuit (M1) is a first value (e.g., about 0.25 pF) that is lower than a first reference element value when the first housing (210) and the second housing (220) are folded in a folded state as shown in FIG. 17b, as compared to when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1750), the reflection efficiency (e.g., radiation coefficient) of the satellite antenna in the second frequency band (e.g., N256 band) can be improved.

[0241] According to one embodiment, when the element value of the first matching circuit (M1) is a second value (e.g., about 1.2 pF) that is lower than a first reference element value when the first housing (210) and the second housing (220) are folded in a folded state as shown in FIG. 17b, as compared to when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1750), the reflection efficiency (e.g., radiation coefficient) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved.

[0242] FIGS. 18A and 18B are schematic diagrams showing antenna characteristics according to a change in the state of a first matching circuit of a first conductive portion in a foldable electronic device in an unfolded state according to one embodiment.

[0243] According to one embodiment referring to FIGS. 18A and 18B, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) as a satellite antenna in an unfolded state.

[0244] According to one embodiment, the first conductive portion (530) may be configured in the form of a floating frame using a first matching circuit (M1) set to a component value less than or equal to a designated first reference component value (e.g., about 1.2 pF or about 0.25 pF).

[0245] According to one embodiment, the foldable electronic device (200) may have improved gain (e.g., radiation efficiency) of a satellite antenna in a second frequency band (e.g., N256 band) compared to a case where the element value of the first matching circuit (M1) is equal to or less than a first reference element value (e.g., about 0.25 pF) when the first housing (210) and the second housing (220) are in a folded state (1800) or the first conductive portion (530) and the ground (G) are electrically disconnected (open) (1820) by the first matching circuit (M1), when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1830).

[0246] According to one embodiment, when the element value of the first matching circuit (M1) is a second value (e.g., about 1.2 pF) that is lower than a first reference element value when the first housing (210) and the second housing (220) are folded in a folded state as shown in FIG. 18a, as compared to when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1830), the gain (e.g., radiation efficiency) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved.

[0247] According to one embodiment, the foldable electronic device (200) may have improved reflection efficiency (e.g., radiation coefficient) of a satellite antenna in a second frequency band (e.g., N256 band) compared to a case where the element value of the first matching circuit (M1) is a first value (e.g., about 0.25 pF) that is lower than a first reference element value when the first housing (210) and the second housing (220) are folded as shown in FIG. 18b (1840) or the first conductive portion (530) and the ground (G) are electrically disconnected (open) (1860) by the first matching circuit (M1), when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1870).

[0248] According to one embodiment, when the element value of the first matching circuit (M1) is a second value (e.g., about 1.2 pF) that is lower than a first reference element value when the first housing (210) and the second housing (220) are folded in a folded state as shown in FIG. 18b, as compared to when the third conductive portion (510) or the fourth conductive portion (520) is used as a satellite antenna (1870), the reflection efficiency (e.g., radiation coefficient) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved.

[0249] FIGS. 19A and 19B are schematic diagrams showing antenna characteristics depending on whether a second matching circuit of a second conductive portion is used in a foldable electronic device in a folded state according to one embodiment.

[0250] According to one embodiment referring to FIGS. 19A and 19B, the foldable electronic device (200) can use the first conductive portion (530) (e.g., the first antenna (A1)) or the first conductive portion (530) and the second conductive portion (560) as a satellite antenna in a folded state.

[0251] According to one embodiment, the first conductive portion (530) may be configured in the form of a floating frame using a first matching circuit (M1) set to a component value lower than or equal to a specified first reference component value (e.g., about 1.2 pF or about 0.25 pF). The second conductive portion (560) may be configured in the form of a floating frame using a second matching circuit (M2) set to a component value lower than or equal to a specified second reference component value (e.g., about 2.7 pF, about 2.2 pF, or about 1.5 pF).

[0252] According to one embodiment, when the element value of the second matching circuit (M2) is less than or equal to a second reference element value (1900) when the first housing (210) and the second housing (220) are folded in a folded state, as shown in FIG. 19a, the gain (e.g., radiation efficiency) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved compared to when the second conductive portion (560) does not include the second matching circuit (1902), as shown in FIG. 13.

[0253] According to one embodiment, the foldable electronic device (200) may have a similar gain (e.g., radiation efficiency) of a satellite antenna in a second frequency band (e.g., N256 band) when the element value of the second matching circuit (M2) is less than or equal to a second reference element value (1910) when the first housing (210) and the second housing (220) are folded as in FIG. 19a, and when the second conductive portion (560) does not include the second matching circuit (1912), as in FIG. 13.

[0254] According to one embodiment, when the element value of the second matching circuit (M2) is less than or equal to a second reference element value (1920) when the first housing (210) and the second housing (220) are folded as in FIG. 19b, the reflection efficiency (e.g., radiation coefficient) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved compared to when the second conductive portion (560) does not include the second matching circuit (1922), as in FIG. 13.

[0255] According to one embodiment, the foldable electronic device (200) may have a similar reflection efficiency (e.g., radiation coefficient) of a satellite antenna in a second frequency band (e.g., N256 band) when the element value of the second matching circuit (M2) is less than or equal to a second reference element value (1930) when the first housing (210) and the second housing (220) are in a folded state, as shown in FIG. 19b, and when the second conductive portion (560) does not include the second matching circuit (1932), as shown in FIG. 13.

[0256] According to one embodiment, an electronic device (e.g., an electronic device (100) of FIG. 1 or an electronic device (200) of FIGS. 2A to 7, 13, or 16) can include a first housing (e.g., a first housing (210) of FIGS. 2A to 7, 13, or 16) comprising a first conductive portion (e.g., a first conductive portion (530) of FIG. 5, 6, 7, 13, or 16) disposed through a first non-conductive portion (e.g., a first non-conductive portion (501) of FIG. 5, 6, 7, 13, or 16) and a second non-conductive portion (e.g., a second non-conductive portion (502) of FIG. 5, 6, 7, 13, or 16) that are spaced apart from each other. According to one embodiment, the electronic device may include a second housing (e.g., the second housing (220) of FIGS. 2A-7, 13, or 16) including a second conductive portion (e.g., the second conductive portion (560) of FIG. 5, 6, 7, 13, or 16) disposed through a spaced third non-conductive portion (e.g., the third non-conductive portion (504) of FIG. 5, 6, 7, 13, or 16) and a fourth non-conductive portion (e.g., the fourth non-conductive portion (505) of FIG. 5, 6, 7, 13, or 16). In one embodiment, the electronic device may include a hinge device (e.g., hinge device (320) of FIGS. 2A to 7, 13, or 16) that rotatably connects the first housing and the second housing with respect to each other. In one embodiment, the electronic device may include a wireless communication circuit electrically connected to a first point of the first conductive portion. In one embodiment, the electronic device may include a first matching circuit disposed in a first electrical path that electrically connects a second point between the first point and the first non-conductive portion and ground.In one embodiment, the electronic device may include a second matching circuit disposed in a second electrical path electrically connecting a third point between the third non-conductive portion and the fourth non-conductive portion and the ground. In one embodiment, the first point and the third point may be at least partially aligned when the electronic device is in a folded state. In one embodiment, the wireless communication circuit may transmit and / or receive a wireless signal in at least one frequency band through the first conductive portion and the second conductive portion when the electronic device is in a folded state.

[0257] In one embodiment, the first non-conductive portion and the third non-conductive portion can be aligned when the electronic device is in a folded state. In one embodiment, the second non-conductive portion and the fourth non-conductive portion can be aligned when the electronic device is in a folded state.

[0258] According to one embodiment, the hinge device may include a third conductive portion opposite the first conductive portion with respect to the first non-conductive portion and electromagnetically connected to the hinge device.

[0259] According to one embodiment, the hinge device may include a fourth conductive portion opposite the first conductive portion with respect to the second non-conductive portion and electromagnetically connected to the hinge device.

[0260] According to one embodiment, the first matching circuit and / or the second matching circuit may include a switching circuit and a plurality of passive elements electrically connected to the switching circuit and having different element values.

[0261] According to one embodiment, the second point (P1) can be connected to ground via at least one passive element among a plurality of passive elements switched via the switching circuit.

[0262] According to one embodiment, the second point (P1) can be connected to ground through at least one passive element having an element value lower than a designated first reference element value among a plurality of passive elements switched through the switching circuit in the folded state of the electronic device (200).

[0263] According to one embodiment, the third point (P2) can be connected to ground through at least one passive element among a plurality of passive elements switched through the switching circuit, the passive element having a voltage lower than a designated second reference element value, in the folded state of the electronic device.

[0264] According to one embodiment, the third point (P2) can be connected to ground through at least one passive element having a component value corresponding to a frequency band of the first conductive portion among the plurality of passive elements switched through the switching circuit in the unfolded state of the electronic device.

[0265] FIG. 20A is a diagram illustrating a front side of a multi-foldable electronic device in an unfolded state according to one embodiment. FIG. 20B is a diagram illustrating a rear side of a multi-foldable electronic device in an unfolded state according to one embodiment. FIG. 20C is a diagram illustrating one side of a multi-foldable electronic device in a folded state according to one embodiment. For example, the multi-foldable electronic device (2000) disclosed in FIGS. 20A to 20C may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0266] According to one embodiment referring to FIGS. 20A to 20C, a multi-foldable electronic device (2000) (e.g., a portable communication device or an electronic device) may include a second housing (2020), a first housing (2010) rotatably connected to the second housing (2020) in a direction (e.g., left) of one side (e.g., left-side) of the second housing (2020) about a first folding axis (F1) via a first hinge device (208a), and a third housing (2030) (e.g., third housing portion) rotatably connected to the second housing (2020) in a direction (e.g., right-side) of the second housing (2020) about a second folding axis (F2) via a second hinge device (208b). For example, the multi-foldable electronic device (2000) may include a flexible display (2040) (e.g., the flexible display (230) of FIG. 2A) (e.g., the first display) arranged to be supported by the first housing (2010), the second housing (2020), and the third housing (2030). For example, the multi-foldable electronic device (2000) may include a sub-display (2050) (e.g., the second display) arranged through the first housing (2010).

[0267] According to one embodiment, the first housing (2010) may include a first side (2011), a second side (2012) facing opposite the first side (2011), and a first side member (2013) surrounding a first space between the second side (2011) and the second side (2012). For example, at least a portion of the first side member (2013) may form at least a portion of a side of the multi-foldable electronic device (2000). For example, the first side member (2013) may include a first side (20131), a second side (20132) extending in a direction perpendicular to the first side (20131), and a third side (20133) extending from the second side (20132) and being parallel to the first side (20131). For example, the first space can be formed by a first rear cover (2014) coupled with a first side member (2013) on a second side (2012) of the first housing (2010).

[0268] According to one embodiment, the second housing (2020) may include a third side (2021), a fourth side (2022) facing opposite to the third side (2021), and a second side member (2023) surrounding a second space between the third side (2021) and the fourth side (2022). For example, at least a portion of the second side member (2023) may form at least a portion of a side of the multi-foldable electronic device (2000). For example, the second side member (2023) may include a fourth side (20231) and a fifth side (20232) positioned opposite to the fourth side (20231). For example, the second housing (2020) may include a second rear cover (2024) coupled with the second side member (2023). For example, the second space can be formed through a second rear cover (2024) coupled with a second side member (2023) on the fourth side (2022) of the second housing (2020).

[0269] According to one embodiment, the third housing (2030) can include a fifth side (2031), a sixth side (2032) facing opposite to the fifth side (2031), and a third side member (2033) surrounding a third space between the fifth side (2031) and the sixth side (2032). For example, at least a portion of the third side member (2033) can form at least a portion of a side of the multi-foldable electronic device (2000). For example, the third side member (2033) can include a sixth side member (20331), a seventh side member (20332) extending perpendicularly from the sixth side member (20331), and an eighth side member (20333) extending from the seventh side member (20332) and being parallel to the sixth side member (20331). For example, the third housing (2030) may include a third rear cover (2034) coupled with a third side member (2033). For example, the second space may be formed at the sixth surface (2032) through the third rear cover (2034) coupled with the third side member (2033).

[0270] According to one embodiment, the multi-foldable electronic device (2000) may be configured such that, in an unfolded state (e.g., a first state), the first housing (2010), the second housing (2020), and the third housing (2030) are positioned side by side so that the first side (2011), the third side (2021), and the fifth side (2031) face the same direction. For example, the multi-foldable electronic device (2000) may be configured such that, in a folded state (e.g., a second state), the first housing (2010), the second housing (2020), and the third housing (2030) are positioned in a sequentially stacked manner so that the third side (2021) and the fifth side (2031) face each other, and the sixth side (2032) and the first side (2011) face each other. In such a case, the fourth side (2022) and the second side (2012) may be visible from the outside, and the fifth side (2031) and the sixth side (2032) may be positioned so as not to be visible from the outside through the first housing (2010) and the second housing (2020). For example, the sub-display (2050) may be positioned so as to be visible from the outside through at least a portion of the second side (2012) in the unfolded and / or folded states.

[0271] According to one embodiment, the multi-foldable electronic device (2000) may include at least one electronic component disposed in at least one of the first housing (2010), the second housing (2020), and / or the third housing (2030). For example, at least one electronic component may include a flexible display (2040) (e.g., a first display) disposed through the first housing (2010), the second housing (2020), and the third housing (2030), a sub-display (2050) (e.g., a second display) disposed in the first housing (2010), at least one microphone (2091a) (e.g., an input module or input device), at least one speaker (2092a, 2092c) (e.g., an audio output module or audio output device), at least one camera (2093a, 2093b, 2093c) (e.g., a camera module or camera device), at least one sensor (2094a, 2094b, 2094c) (e.g., a sensor module), at least one key button (2095) (e.g., an input device or a physical key), a connector port (2096) or a socket device (2097). In some embodiments, the electronic device (2000) may additionally include at least one other component. In some embodiments, at least one of the above-described components may be omitted.

[0272] According to one embodiment, the flexible display (2040) may be placed in a receiving space formed by the housings (2010, 2020, 2030). For example, the flexible display (2040) may be placed in a recess formed by the housings (2010, 2020, 2030) and, when unfolded, may be placed to occupy substantially most of the front surface of the electronic device (2000). For example, the sub-display (2050) may be placed in the first housing (2010) so as to be visible from the outside through the first rear cover (2014).

[0273] In one embodiment, at least one microphone (2091a) may include a first microphone (2091a) positioned through a fourth side (20231) of the second housing (2020) and a second microphone (not shown) positioned through a fifth side (20232) of the second housing (2020). In some embodiments, at least one microphone (2091a) may be positioned on a sixth side (20331) and / or an eighth side (20333) of the third housing (2030). In some embodiments, at least one microphone (2091a) may be positioned on a first side (20131) and / or a third side (20133) of the first housing (2010).

[0274] In one embodiment, at least one speaker (2092a, 2092c) may include a first speaker (2092a) positioned to emit sound through the eighth side (20333) of the third housing (2030) and a second speaker (2092c) positioned to emit sound through the third side (20131) of the first housing (2010). For example, the at least one speaker (2092a, 2092c) may be symmetrically positioned to implement stereophonic sound (e.g., three-dimensional sound) in an unfolded or folded state of the multi-foldable electronic device (200).

[0275] According to one embodiment, at least one camera (2093a, 2093b, 2093c) may be disposed in a first space of the first housing (2010) and may include a first camera (2093a) disposed through a first side (2011) of the first housing (2010), a second camera (2093b) disposed through a fourth side (2022) of the second housing (2020), and / or a third camera (2093c) disposed through a second side (2012) of the first housing (2010). In one embodiment, the at least one camera (2093a, 2093b, 2093c) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one camera (2093a, 2093b, 2093c) includes two or more lenses (e.g., wide-angle and / or telephoto lenses) and image sensors, and may be arranged together on one side of any one of the first housing (2010), the second housing (2020), or the third housing (2030).

[0276] According to one embodiment, at least one sensor (20974a, 20974b, 20974c) may generate an electrical signal or data value corresponding to an internal operating state of the multi-foldable electronic device (2000) or an external environmental state. For example, at least one sensor (2094a, 2094b, 2094c) may include a first sensor (2094a) disposed on a first side (2011) of the first housing (2010), a second sensor (2094b) disposed on a fourth side (2022) of the second housing (2020), and / or a third sensor (2094c) disposed on a second side (2012) of the first housing (2010). In some embodiments, at least one sensor (2094a, 2094b, 2094c) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, an iris recognition sensor, and a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor).

[0277] According to one embodiment, at least one key button (2095) may be positioned on the second side (20132) of the first housing (2010). This may help improve usability when the multi-foldable electronic device (2000) is in a folded state, as the second side (2012) faces upward for using the sub-display (2050) and the at least one key button (2095) is positioned on the right side. In some embodiments, at least one key button (2095) may be positioned on at least one of the fourth side (20231) or the fifth side (20232) of the second housing (2020), the sixth side (203031) or the eighth side (20333) of the third housing (2030), and / or the first side (20131) or the third side (20133) of the first housing (2010), which may be used when the multi-foldable electronic device (2000) is in an unfolded state and / or a folded state.

[0278] According to one embodiment, the connector port (2096) may be positioned through the fourth side (20231) of the second housing (2020). For example, the connector port (2096) may include a connector (e.g., a USB connector or an interface connector port module (IF module)) structure for transmitting and receiving power and / or data to and from an external electronic device. In some embodiments, the connector port (2096) may be located on at least one of the fifth side (20232) of the second housing (2020), the sixth side (20331), the seventh side (20332) or the eighth side (20333) of the third housing (2030) and / or the first side (20131), the second side (20132) or the third side (20133) of the first housing (2010), which may be used in the unfolded and / or folded states of the multi-foldable electronic device (2000).

[0279] In one embodiment, the socket device (2097) may be positioned on the second side (20132) of the first housing (2010) so that the multi-foldable electronic device (2000) can be used even when folded. For example, the socket device (2097) may include a tray retractably coupled from the second side (20132) to accommodate a SIM card or an external memory card.

[0280] According to one embodiment, at least one microphone (2091a), at least one speaker (2092a, 2092c), at least one key button (2095), connector port (2096) or socket device (2097) may be exposed to the external environment through at least one hole (e.g., a through hole) formed in the first housing (2010), the second housing (2020) and / or the third housing (2030).

[0281] According to one embodiment, the first housing (2010) can include at least one of a first non-conductive portion (2051) (e.g., the first segment), a second non-conductive portion (2052) (e.g., the second segment), or a first conductive portion (2050). For example, at least one of the first non-conductive portion (2051) (e.g., the first segment), the second non-conductive portion (2052) (e.g., the second segment), or the first conductive portion (2050) can be formed on a first side member (2013) of the first housing (2010). For example, the first non-conductive portion (2051) and the second non-conductive portion (2052) can be formed on a third side member (2013) of the first side member (2013). For example, the second non-conductive portion (2052) may be formed closer to the first hinge device (2080a) than the first non-conductive portion (2051). For example, the first conductive portion (2050) may be positioned between the first non-conductive portion (2051) and the second non-conductive portion (2052).

[0282] In one embodiment, the second housing (2020) can include at least one of a third non-conductive portion (2061) (e.g., a third segment), a fourth non-conductive portion (2062) (e.g., a fourth segment), or a second conductive portion (2060). For example, at least one of the third non-conductive portion (2061), the fourth non-conductive portion (2062), or the second conductive portion (2060) can be formed on a second side member (2023) of the second housing (2020). For example, the third non-conductive portion (2061) and the fourth non-conductive portion (2062) can be formed on a fifth side member (20232) of the second side member (2023). For example, the third non-conductive portion (2061) may be formed closer to the first hinge device (2080a) than the fourth non-conductive portion (2062). The fourth non-conductive portion (2062) may be formed closer to the second hinge device (2080b) than the third non-conductive portion (2061). For example, the second conductive portion (2060) may be positioned between the third non-conductive portion (2061) and the fourth non-conductive portion (2062).

[0283] In one embodiment, the third housing (2030) can include at least one of a fifth non-conductive portion (2071) (e.g., a fifth segment), a sixth non-conductive portion (2072) (e.g., a sixth segment), or a third conductive portion (2070). For example, at least one of the fifth non-conductive portion (2071), the sixth non-conductive portion (2072), or the third conductive portion (2070) can be formed on a third side member (2033) of the third housing (2030). For example, the fifth non-conductive portion (2071) and the sixth non-conductive portion (2072) can be formed on an eighth side member (2033) of the third side member (2033). For example, the fifth non-conductive portion (2071) may be formed closer to the second hinge device (2080b) than the sixth non-conductive portion (2072). For example, the third conductive portion (2070) may be positioned between the fifth non-conductive portion (2071) and the sixth non-conductive portion (2072).

[0284] FIG. 21 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment. For example, the multi-foldable electronic device (2000) of FIG. 21 may be at least partially similar to the electronic device (101) of FIG. 1 or the multi-foldable electronic device (2000) disclosed in FIGS. 20A to 20C, or may include other embodiments of the electronic device.

[0285] According to one embodiment referring to FIG. 21, a multi-foldable electronic device (2000) may include a first hinge device (2080a), a second hinge device (2080b), a first housing (2010), a second housing (2020), and a third housing (2030).

[0286] According to one embodiment, the first housing (2010), the second housing (2020), and the third housing (2030) can operate in an unfolded or folded state, as disclosed in FIGS. 20A to 20C, based on the first hinge device (2080a) and the second hinge device (2080b). The first hinge device (2080a) can rotatably couple the first housing (2010) and the second housing (2020). The second hinge device (2080b) can rotatably couple the second housing (2020) and the third housing (2030).

[0287] According to one embodiment, a first conductive portion (2050) of a first housing (2010) can be disposed between a first non-conductive portion (2051) and a second non-conductive portion (2052). The first conductive portion (2050) can be electrically connected to a wireless communication module (192) via a first feed point (F1) (e.g., a first point) and a first signal path (S1). The first conductive portion (2050) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (2050)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (2050)) can operate as a satellite antenna.

[0288] According to one embodiment, the first conductive portion (2050) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (2110). For example, the first point (P1) may be positioned closer to the second non-conductive portion (2052) than to the first power supply point (F1).

[0289] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (2050) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (2050) to control electrical characteristics of the first conductive portion (2050). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (2050) and the ground (G) using at least one switch and at least one passive component.

[0290] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (2050) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (2050) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (2050) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0291] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (2050)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first conductive portion (2050) is configured in the form of a floating frame.

[0292] According to one embodiment, the processor (120) may control the wireless communication module (192) to transmit a feeding signal to the first feeding point (F1) of the first conductive portion (2050). The processor (120) may control the first matching circuit (M1) to control the electrical length or path of the first conductive portion (2050) (e.g., the first antenna (A1)). The processor (120) may control or adjust the element values ​​of the first matching circuit (M1).

[0293] According to one embodiment, the second conductive portion (2060) of the second housing (2020) can be disposed between the third non-conductive portion (2061) (e.g., the third segment) and the fourth non-conductive portion (2062) (the fourth segment). The second conductive portion (2060) can be electrically connected to the second matching circuit (M2) via the second point (P2) (e.g., the third point). The second matching circuit (M2) can be electrically connected to the processor (120) via the second electrical path (2112). For example, the second point (P2) (e.g., the third point) can be at least partially aligned with the first power supply point (F1) (e.g., the first point) of the first conductive portion (2050) when the multi-foldable electronic device (2000) is in a folded state.

[0294] According to one embodiment, the second matching circuit (M2) can be disposed between the second conductive portion (2060) and the ground (G). The second matching circuit (M2) can be electrically connected to the second point (P2) of the second conductive portion (2060) to control electrical characteristics of the second conductive portion (2060). For example, the second matching circuit (M2) can be electrically connected to the ground (G). For example, the second matching circuit (M2) can include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the second matching circuit (M2) can change a component value (or ground value) for connecting the second conductive portion (2060) and the ground (G) using at least one switch and at least one passive component.

[0295] According to one embodiment, when the second matching circuit (M2) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (2060) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the second matching circuit (M2) to suppress the current flowing in the second housing (2020) (e.g., the second conductive portion (2060)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (2050).

[0296] According to one embodiment, the second conductive portion (2060) may be configured in the form of a floating frame via a second matching circuit (M2) so that the first antenna (A1) (e.g., the first conductive portion (2050)) can maintain a radiation pattern of the upper hemisphere. For example, the second matching circuit (M2) may be set to an element value (or ground value) lower than or equal to a second reference element value specified so that the second conductive portion (2060) is configured in the form of a floating frame. When the second matching circuit (M2) is set to an element value lower than or equal to the second reference element value specified, the second conductive portion (2060) may have an electric field intensity of at least a portion opposite to the second point (P2) that is the highest within the second conductive portion (2060). For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0297] According to one embodiment, a third conductive portion (2070) of a third housing (2030) may be disposed between a fifth non-conductive portion (2071) (e.g., a fifth segment) and a sixth non-conductive portion (2072) (a sixth segment). The third conductive portion (2070) may be electrically connected to a fourth matching circuit (M4) via a fourth point (P4) (e.g., a fifth point). The fourth matching circuit (M4) may be electrically connected to the processor (120) via a third electrical path (2114). For example, the fourth point (P4) (e.g., the fifth point) may be at least partially aligned with the first feeding point (F1) (e.g., the first point) of the first conductive portion (2050) and the second point (P2) (e.g., the third point) of the second conductive portion (2060) when the multi-foldable electronic device (2000) is in a folded state.

[0298] According to one embodiment, the fourth matching circuit (M4) may be disposed between the third conductive portion (2070) and the ground (G). The fourth matching circuit (M4) may be electrically connected to the fourth point (P4) of the third conductive portion (2070) to control electrical characteristics of the third conductive portion (2070). For example, the fourth matching circuit (M4) may be electrically connected to the ground (G). For example, the fourth matching circuit (M4) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the fourth matching circuit (M4) may change a component value (or ground value) for connecting the third conductive portion (2070) and the ground (G) using at least one switch and at least one passive component.

[0299] According to one embodiment, when the fourth matching circuit (M4) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the third conductive portion (2070) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the fourth matching circuit (M4) to suppress the current flowing in the third housing (2030) (e.g., the third conductive portion (2070)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (2050).

[0300] According to one embodiment, the third conductive portion (2070) may be configured in the form of a floating frame via the fourth matching circuit (M4) so ​​that the first antenna (A1) (e.g., the first conductive portion (2050)) can maintain a radiation pattern of the upper hemisphere. For example, the fourth matching circuit (M4) may be set to an element value (or ground value) lower than a second reference element value specified so that the third conductive portion (2070) is configured in the form of a floating frame. When the fourth matching circuit (M4) is set to an element value lower than the specified second reference element value, the third conductive portion (2070) may have an electric field intensity of at least a portion opposite to the fourth point (P4) that is the highest within the third conductive portion (2070). In this case, the first conductive portion (2050), the second conductive portion (2060), and the third conductive portion (2070) may be at least partially coincident (or overlapped) with the highest electric field intensity when the multi-foldable electronic device (2000) is in a folded state.

[0301] FIG. 22 is a diagram schematically illustrating changes in a radiation pattern of a first conductive portion in a multi-foldable electronic device in an unfolded state according to one embodiment.

[0302] According to one embodiment referring to FIG. 22, the second matching circuit (M2) of the second conductive portion (2060) of the second housing (2020) and the fourth matching circuit (M4) of the third conductive portion (2070) of the third housing (2030) operate to radiate signals of the first frequency band (or the second frequency band) through the first conductive portion (2050) when the multi-foldable electronic device (2000) is in an unfolded state, and the element values ​​of the second conductive portion (2060) and the third conductive portion (2070) may be controlled (e.g., adjusted) under the control of the processor (120) so as to form a resonance of the first frequency band (or the second frequency band).

[0303] According to one embodiment, when the multi-foldable electronic device (2000) is in an unfolded state, when the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the second conductive portion (2060) and the third conductive portion (2070) resonate to correspond to the first frequency band (or the second frequency band), thereby suppressing current flowing in the second housing (2020) (e.g., the second conductive portion (2060)) and the third housing (2030) (e.g., the third conductive portion (2070)).

[0304] According to one embodiment, the multi-foldable electronic device (200) can form (or maintain) a radiation pattern of satellite signals in the upper hemisphere direction when current flowing in the second housing (2020) (e.g., the second conductive portion (2060)) and the third housing (2030) (e.g., the third conductive portion (2070)) is suppressed in the unfolded state.

[0305] FIG. 23 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment. For example, the multi-foldable electronic device (2000) of FIG. 23 may be at least partially similar to the electronic device (101) of FIG. 1 or the multi-foldable electronic device (2000) disclosed in FIGS. 20A to 20C , or may include other embodiments of the electronic device. For example, FIG. 23 may include a configuration in which the fourth matching circuit (M4) is omitted from the circuit configuration of the multi-foldable electronic device (2000) of FIG. 21 .

[0306] According to one embodiment referring to FIG. 23, a multi-foldable electronic device (2000) may include a first hinge device (2080a), a second hinge device (2080b), a first housing (2010), a second housing (2020), and a third housing (2030).

[0307] According to one embodiment, a first conductive portion (2050) of a first housing (2010) can be disposed between a first non-conductive portion (2051) and a second non-conductive portion (2052). The first conductive portion (2050) can be electrically connected to a wireless communication module (192) via a first feed point (F1) (e.g., a first point) and a first signal path (S1). The first conductive portion (2050) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (2050)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (2050)) can operate as a satellite antenna.

[0308] According to one embodiment, the first conductive portion (2050) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (2110). For example, the first point (P1) may be positioned closer to the second non-conductive portion (2052) than to the first power supply point (F1).

[0309] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (2050) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (2050) to control electrical characteristics of the first conductive portion (2050). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (2050) and the ground (G) using at least one switch and at least one passive component.

[0310] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (2050) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (2050) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (2050) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0311] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (2050)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first conductive portion (2050) is configured in the form of a floating frame.

[0312] According to one embodiment, the processor (120) may control the wireless communication module (192) to transmit a feeding signal to the first feeding point (F1) of the first conductive portion (2050). The processor (120) may control the first matching circuit (M1) to control the electrical length or path of the first conductive portion (2050) (e.g., the first antenna (A1)). The processor (120) may control or adjust the element values ​​of the first matching circuit (M1).

[0313] According to one embodiment, the second conductive portion (2060) of the second housing (2020) can be disposed between the third non-conductive portion (2061) (e.g., the third segment) and the fourth non-conductive portion (2062) (the fourth segment). The second conductive portion (2060) can be electrically connected to the second matching circuit (M2) via the second point (P2) (e.g., the third point). The second matching circuit (M2) can be electrically connected to the processor (120) via the second electrical path (2112). For example, the second point (P2) (e.g., the third point) can be at least partially aligned with the first power supply point (F1) (e.g., the first point) of the first conductive portion (2050) when the multi-foldable electronic device (2000) is in a folded state.

[0314] According to one embodiment, the second matching circuit (M2) can be disposed between the second conductive portion (2060) and the ground (G). The second matching circuit (M2) can be electrically connected to the second point (P2) of the second conductive portion (2060) to control electrical characteristics of the second conductive portion (2060). For example, the second matching circuit (M2) can be electrically connected to the ground (G). For example, the second matching circuit (M2) can include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the second matching circuit (M2) can change a component value (or ground value) for connecting the second conductive portion (2060) and the ground (G) using at least one switch and at least one passive component.

[0315] According to one embodiment, when the second matching circuit (M2) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (2060) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the second matching circuit (M2) to suppress the current flowing in the second housing (2020) (e.g., the second conductive portion (2060)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (2050).

[0316] According to one embodiment, the second conductive portion (2060) may be configured in the form of a floating frame via a second matching circuit (M2) so that the first antenna (A1) (e.g., the first conductive portion (2050)) can maintain a radiation pattern of the upper hemisphere. For example, the second matching circuit (M2) may be set to an element value (or ground value) lower than a second reference element value specified so that the second conductive portion (2060) is configured in the form of a floating frame. When the second matching circuit (M2) is set to an element value lower than the specified second reference element value, the second conductive portion (2060) may have an electric field intensity of at least a portion opposite to the second point (P2) that is the highest within the second conductive portion (2060). In this case, the first conductive portion (2050) and the second conductive portion (2060) may coincide (or overlap) at least a portion of the electric field having the highest intensity when the multi-foldable electronic device (2000) is in a folded state. For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0317] According to one embodiment, the third conductive portion (2070) of the third housing (2030) can be positioned between the fifth non-conductive portion (2071) (e.g., the fifth segment) and the sixth non-conductive portion (2072) (the sixth segment).

[0318] FIG. 24 is a diagram schematically illustrating changes in a radiation pattern of a first conductive portion in a multi-foldable electronic device in an unfolded state according to one embodiment.

[0319] According to one embodiment referring to FIG. 24, when the second matching circuit (M2) of the second conductive portion (2060) of the second housing (2020) operates to radiate signals of the first frequency band (or the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the element value can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (2060) forms a resonance of the first frequency band (or the second frequency band).

[0320] According to one embodiment, the multi-foldable electronic device (2000) can be configured such that when the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the current flowing in the second housing (2020) (e.g., the second conductive portion (2060)) is suppressed by resonating in response to the second conductive portion (2060).

[0321] According to one embodiment, the multi-foldable electronic device (200) can form (or maintain) a radiation pattern of satellite signals in the upper hemisphere direction when the current flowing in the second housing (2020) (e.g., the second conductive portion (2060)) is suppressed in the unfolded state.

[0322] FIG. 25 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment. For example, the multi-foldable electronic device (2000) of FIG. 25 may be at least partially similar to the electronic device (101) of FIG. 1 or the multi-foldable electronic device (2000) disclosed in FIGS. 20A to 20C , or may include other embodiments of the electronic device. For example, FIG. 25 may include a configuration in which the second matching circuit (M2) is omitted from the circuit configuration of the multi-foldable electronic device (2000) of FIG. 21 .

[0323] According to one embodiment referring to FIG. 25, a multi-foldable electronic device (2000) may include a first hinge device (2080a), a second hinge device (2080b), a first housing (2010), a second housing (2020), and a third housing (2030).

[0324] According to one embodiment, a first conductive portion (2050) of a first housing (2010) can be disposed between a first non-conductive portion (2051) and a second non-conductive portion (2052). The first conductive portion (2050) can be electrically connected to a wireless communication module (192) via a first feed point (F1) (e.g., a first point) and a first signal path (S1). The first conductive portion (2050) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (2050)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (2050)) can operate as a satellite antenna.

[0325] According to one embodiment, the first conductive portion (2050) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (2110). For example, the first point (P1) may be positioned closer to the second non-conductive portion (2052) than to the first power supply point (F1).

[0326] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (2050) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (2050) to control electrical characteristics of the first conductive portion (2050). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (2050) and the ground (G) using at least one switch and at least one passive component.

[0327] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (2050) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (2050) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (2050) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0328] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (2050)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first conductive portion (2050) is configured in the form of a floating frame.

[0329] According to one embodiment, the processor (120) may control the wireless communication module (192) to transmit a feeding signal to the first feeding point (F1) of the first conductive portion (2050). The processor (120) may control the first matching circuit (M1) to control the electrical length or path of the first conductive portion (2050) (e.g., the first antenna (A1)). The processor (120) may control or adjust the element values ​​of the first matching circuit (M1).

[0330] According to one embodiment, the second conductive portion (2060) of the second housing (2020) can be positioned between a third non-conductive portion (2061) (e.g., a third segment) and a fourth non-conductive portion (2062) (a fourth segment).

[0331] According to one embodiment, a third conductive portion (2070) of a third housing (2030) may be disposed between a fifth non-conductive portion (2071) (e.g., a fifth segment) and a sixth non-conductive portion (2072) (a sixth segment). The third conductive portion (2070) may be electrically connected to a fourth matching circuit (M4) via a fourth point (P4) (e.g., a fifth point). The fourth matching circuit (M4) may be electrically connected to the processor (120) via a third electrical path (2114). For example, the fourth point (P4) (e.g., the fifth point) may be at least partially aligned with the first feeding point (F1) (e.g., the first point) of the first conductive portion (2050) and the second point (P2) (e.g., the third point) of the second conductive portion (2060) when the multi-foldable electronic device (2000) is in a folded state.

[0332] According to one embodiment, the fourth matching circuit (M4) may be disposed between the third conductive portion (2070) and the ground (G). The fourth matching circuit (M4) may be electrically connected to the fourth point (P4) of the third conductive portion (2070) to control electrical characteristics of the third conductive portion (2070). For example, the fourth matching circuit (M4) may be electrically connected to the ground (G). For example, the fourth matching circuit (M4) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the fourth matching circuit (M4) may change a component value (or ground value) for connecting the third conductive portion (2070) and the ground (G) using at least one switch and at least one passive component.

[0333] According to one embodiment, when the fourth matching circuit (M4) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the third conductive portion (2070) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the fourth matching circuit (M4) to suppress the current flowing in the third housing (2030) (e.g., the third conductive portion (2070)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (2050).

[0334] According to one embodiment, the third conductive portion (2070) may be configured in the form of a floating frame via the fourth matching circuit (M4) so ​​that the first antenna (A1) (e.g., the first conductive portion (2050)) can maintain a radiation pattern of the upper hemisphere. For example, the fourth matching circuit (M4) may be set to an element value (or ground value) lower than a second reference element value specified so that the third conductive portion (2070) is configured in the form of a floating frame. When the fourth matching circuit (M4) is set to an element value lower than the specified second reference element value, the third conductive portion (2070) may have an electric field intensity of at least a portion opposite to the fourth point (P4) that is the highest within the third conductive portion (2070). In this case, the first conductive portion (2050) and the third conductive portion (2070) may coincide with (or overlap) at least a portion of the electric field having the highest intensity when the multi-foldable electronic device (2000) is in a folded state. For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0335] FIG. 26 is a diagram schematically illustrating changes in a radiation pattern of a first conductive portion in a multi-foldable electronic device in an unfolded state according to one embodiment.

[0336] According to one embodiment referring to FIG. 26, when the multi-foldable electronic device (2000) is in an unfolded state and operates to radiate signals of a first frequency band (or a second frequency band) through the first conductive portion (2050), the element value may be controlled (e.g., adjusted) under the control of the processor (120) so that the third conductive portion (2070) forms a resonance of the first frequency band (or the second frequency band).

[0337] According to one embodiment, when the multi-foldable electronic device (2000) is in an unfolded state, when the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the third conductive portion (2070) resonates to correspond to the first frequency band (or the second frequency band), thereby suppressing the current flowing in the third housing (2030) (e.g., the third conductive portion (2070)).

[0338] According to one embodiment, the multi-foldable electronic device (200) can form (or maintain) a radiation pattern of satellite signals in the upper hemisphere direction when the current flowing in the third housing (2030) (e.g., the third conductive portion (2070)) is suppressed in the unfolded state.

[0339] FIG. 27 is a diagram schematically illustrating antenna efficiency in a multi-foldable electronic device in a folded state according to one embodiment.

[0340] According to one embodiment referring to FIG. 27, the multi-foldable electronic device (2000) can use the first conductive portion (2050) (e.g., the first antenna (A1)), the second conductive portion (2060) and / or the third conductive portion (2070) as a satellite antenna in a folded state.

[0341] According to one embodiment, the first conductive portion (2050) may be configured in the form of a floating frame using a first matching circuit (M1) set to a component value lower than or equal to a specified first reference component value (e.g., about 1.2 pF or about 0.25 pF). The second conductive portion (2060) may be configured in the form of a floating frame using a second matching circuit (M2) set to a component value lower than or equal to a specified second reference component value (e.g., about 2.7 pF, about 2.2 pF, or about 1.5 pF). The third conductive portion (2070) may be configured in the form of a floating frame using a fourth matching circuit (M4) set to a component value lower than or equal to a specified second reference component value (e.g., about 2.7 pF, about 2.2 pF, or about 1.5 pF).

[0342] According to one embodiment, when the multi-foldable electronic device (200) is arranged such that the first housing (2010), the second housing (2020), and the third housing (2030) are at least partially aligned with the first feeding point (F1) (e.g., the first point) of the first conductive portion (2050) and the second point (P2) (e.g., the third point) of the second conductive portion (2060) in the folded state, as shown in FIG. 23 (2700), the gain (e.g., radiation efficiency) of the satellite antenna in the first frequency band (e.g., N255 band) can be improved compared to when at least some of the highest electric field intensities in the conductive portions (2050, 2060, and / or 2070) do not coincide (or overlap).

[0343] According to one embodiment, the multi-foldable electronic device (200) has a first frequency band (e.g., when the first housing (2010), the second housing (2020), and the third housing (2030) are at least partially aligned (2710) with the first feeding point (F1) (e.g., the first point) of the first conductive portion (2050), the second point (P2) (e.g., the third point) of the second conductive portion (2060), and the fourth point (P4) (e.g., the fifth point) of the third conductive portion (2070), as shown in FIG. 21, compared to when the first feeding point (F1) (e.g., the first point) of the first conductive portion (2050) and the second point (P2) (e.g., the third point) of the second conductive portion (2060) are at least partially aligned (2700). The gain (e.g. radiation efficiency) of satellite antennas in the N255 band can be improved.

[0344] FIG. 28 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment. For example, the multi-foldable electronic device (2000) of FIG. 28 may be at least partially similar to the electronic device (101) of FIG. 1 or the multi-foldable electronic device (2000) disclosed in FIGS. 20A to 20C, or may include other embodiments of the electronic device.

[0345] According to one embodiment referring to FIG. 28, a multi-foldable electronic device (2000) may include a first hinge device (2080a), a second hinge device (2080b), a first housing (2010), a second housing (2020), and a third housing (2030).

[0346] According to one embodiment, a first conductive portion (2050) of a first housing (2010) can be disposed between a first non-conductive portion (2051) and a second non-conductive portion (2052). The first conductive portion (2050) can be electrically connected to a wireless communication module (192) via a first feed point (F1) (e.g., a first point) and a first signal path (S1). The first conductive portion (2050) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (2050)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (2050)) can operate as a satellite antenna.

[0347] According to one embodiment, the first conductive portion (2050) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (2810). For example, the first point (P1) may be positioned closer to the first non-conductive portion (2051) than to the first power supply point (F1).

[0348] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (2050) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (2050) to control electrical characteristics of the first conductive portion (2050). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (2050) and the ground (G) using at least one switch and at least one passive component.

[0349] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (2050) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (2050) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (2050) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0350] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (2050)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first conductive portion (2050) is configured in the form of a floating frame.

[0351] According to one embodiment, the second conductive portion (2060) of the second housing (2020) can be disposed between the third non-conductive portion (2061) (e.g., the third segment) and the fourth non-conductive portion (2062) (the fourth segment). The second conductive portion (2060) can be electrically connected to the second matching circuit (M2) via the second point (P2) (e.g., the third point). The second matching circuit (M2) can be electrically connected to the processor (120) via the second electrical path (2812). For example, the second point (P2) (e.g., the third point) can be at least partially aligned with the first power supply point (F1) (e.g., the first point) of the first conductive portion (2050) when the multi-foldable electronic device (2000) is in a folded state.

[0352] According to one embodiment, the second matching circuit (M2) can be disposed between the second conductive portion (2060) and the ground (G). The second matching circuit (M2) can be electrically connected to the second point (P2) of the second conductive portion (2060) to control electrical characteristics of the second conductive portion (2060). For example, the second matching circuit (M2) can be electrically connected to the ground (G). For example, the second matching circuit (M2) can include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the second matching circuit (M2) can change a component value (or ground value) for connecting the second conductive portion (2060) and the ground (G) using at least one switch and at least one passive component.

[0353] According to one embodiment, when the second matching circuit (M2) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (2060) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the second matching circuit (M2) to suppress the current flowing in the second housing (2020) (e.g., the second conductive portion (2060)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (2050).

[0354] According to one embodiment, the second conductive portion (2060) may be configured in the form of a floating frame via a second matching circuit (M2) so that the first antenna (A1) (e.g., the first conductive portion (2050)) can maintain a radiation pattern of the upper hemisphere. For example, the second matching circuit (M2) may be set to an element value (or ground value) lower than or equal to a second reference element value specified so that the second conductive portion (2060) is configured in the form of a floating frame. When the second matching circuit (M2) is set to an element value lower than or equal to the second reference element value specified, the second conductive portion (2060) may have an electric field intensity of at least a portion opposite to the second point (P2) that is the highest within the second conductive portion (2060). For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0355] According to one embodiment, a third conductive portion (2070) of a third housing (2030) may be disposed between a fifth non-conductive portion (2071) (e.g., a fifth segment) and a sixth non-conductive portion (2072) (a sixth segment). The third conductive portion (2070) may be electrically connected to a fourth matching circuit (M4) via a fourth point (P4) (e.g., a fifth point). The fourth matching circuit (M4) may be electrically connected to the processor (120) via a third electrical path (2814). For example, the fourth point (P4) (e.g., the fifth point) may be at least partially aligned with the first feeding point (F1) (e.g., the first point) of the first conductive portion (2050) and the second point (P2) (e.g., the third point) of the second conductive portion (2060) when the multi-foldable electronic device (2000) is in a folded state.

[0356] According to one embodiment, the fourth matching circuit (M4) may be disposed between the third conductive portion (2070) and the ground (G). The fourth matching circuit (M4) may be electrically connected to the fourth point (P4) of the third conductive portion (2070) to control electrical characteristics of the third conductive portion (2070). For example, the fourth matching circuit (M4) may be electrically connected to the ground (G). For example, the fourth matching circuit (M4) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the fourth matching circuit (M4) may change a component value (or ground value) for connecting the third conductive portion (2070) and the ground (G) using at least one switch and at least one passive component.

[0357] According to one embodiment, when the fourth matching circuit (M4) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the third conductive portion (2070) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the fourth matching circuit (M4) to suppress the current flowing in the third housing (2030) (e.g., the third conductive portion (2070)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (2050).

[0358] According to one embodiment, the third conductive portion (2070) may be configured in the form of a floating frame via the fourth matching circuit (M4) so ​​that the first antenna (A1) (e.g., the first conductive portion (2050)) can maintain a radiation pattern of the upper hemisphere. For example, the fourth matching circuit (M4) may be set to an element value (or ground value) lower than a second reference element value specified so that the third conductive portion (2070) is configured in the form of a floating frame. When the fourth matching circuit (M4) is set to an element value lower than the specified second reference element value, the third conductive portion (2070) may have an electric field intensity of at least a portion opposite to the fourth point (P4) that is the highest within the third conductive portion (2070). In this case, the first conductive portion (2050), the second conductive portion (2060), and the third conductive portion (2070) may have at least a portion where the electric field intensity is highest when the multi-foldable electronic device (2000) is in a folded state. For example, the first point (F1) of the first conductive portion (2050), the third point (P2) of the second conductive portion (2060), and the fifth point (P4) of the third conductive portion (2070) may be at least partially aligned when the multi-foldable electronic device (2000) is in a folded state.

[0359] FIG. 29 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment. For example, the multi-foldable electronic device (2000) of FIG. 29 may be at least partially similar to the electronic device (101) of FIG. 1 or the multi-foldable electronic device (2000) disclosed in FIGS. 20A to 20C, or may include other embodiments of the electronic device.

[0360] According to one embodiment referring to FIG. 29, a multi-foldable electronic device (2000) may include a first hinge device (2080a), a second hinge device (2080b), a first housing (2010), a second housing (2020), and a third housing (2030).

[0361] According to one embodiment, the second conductive portion (2060) of the second housing (2020) can be disposed between the third non-conductive portion (2061) and the fourth non-conductive portion (2062). The second conductive portion (2060) can be electrically connected to the wireless communication module (192) via the first feed point (F1) (e.g., the first point) and the first signal path (S1). The second conductive portion (2060) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the second conductive portion (2060)) can operate in at least one of a first frequency band (e.g., the first satellite frequency band) or a second frequency band (e.g., the second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., the N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., the N256 band). The first antenna (A1) (e.g., the second conductive portion (2060)) can operate as a satellite antenna.

[0362] In one embodiment, the second conductive portion (2060) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., the second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (2911). For example, the first point (P1) may be positioned closer to the fourth non-conductive portion (2062) than to the first power supply point (F1).

[0363] According to one embodiment, a first matching circuit (M1) may be disposed between a second conductive portion (2060) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the second conductive portion (2060) to control electrical characteristics of the second conductive portion (2060). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the second conductive portion (2060) and the ground (G) using at least one switch and at least one passive component.

[0364] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the second conductive portion (2060) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the second conductive portion (2060) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the second conductive portion (2060) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0365] According to one embodiment, the first antenna (A1) (e.g., the second conductive portion (2060)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the second conductive portion (2060) is configured in the form of a floating frame.

[0366] According to one embodiment, a first conductive portion (2050) of a first housing (2010) can be disposed between a first non-conductive portion (2051) (e.g., a first segment) and a second non-conductive portion (2052) (a second segment). The first conductive portion (2050) can be electrically connected to a second matching circuit (M2) via a second point (P2) (e.g., a third point). The second matching circuit (M2) can be electrically connected to the processor (120) via a second electrical path (2912). For example, the second point (P2) (e.g., the third point) can be at least partially aligned with a first power supply point (F1) (e.g., the first point) of the second conductive portion (2060) when the multi-foldable electronic device (2000) is in a folded state.

[0367] According to one embodiment, the second matching circuit (M2) can be disposed between the first conductive portion (2050) and the ground (G). The second matching circuit (M2) can be electrically connected to the second point (P2) of the first conductive portion (2050) to control electrical characteristics of the first conductive portion (2050). For example, the second matching circuit (M2) can be electrically connected to the ground (G). For example, the second matching circuit (M2) can include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the second matching circuit (M2) can change a component value (or ground value) for connecting the first conductive portion (2050) and the ground (G) using at least one switch and at least one passive component.

[0368] According to one embodiment, when the second matching circuit (M2) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the second conductive portion (2060) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the first conductive portion (2050) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the second conductive portion (2060) operates (e.g., operates as a satellite antenna) in the first frequency band (or the second frequency band), the processor (120) can control (e.g., adjust) the element value of the second matching circuit (M2) to suppress the current flowing in the first housing (2010) (e.g., the first conductive portion (2050)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the second conductive portion (2060).

[0369] According to one embodiment, the first conductive portion (2050) may be configured in the form of a floating frame via a second matching circuit (M2) so that the first antenna (A1) (e.g., the second conductive portion (2060)) can maintain a radiation pattern of the upper hemisphere. For example, the second matching circuit (M2) may be set to an element value (or ground value) lower than or equal to a second reference element value specified so that the first conductive portion (2050) is configured in the form of a floating frame. When the second matching circuit (M2) is set to an element value lower than or equal to the second reference element value specified, the first conductive portion (2050) may have an electric field intensity of at least a portion opposite to the second point (P2) that is the highest within the first conductive portion (2050). For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0370] According to one embodiment, a third conductive portion (2070) of a third housing (2030) may be disposed between a fifth non-conductive portion (2071) (e.g., a fifth segment) and a sixth non-conductive portion (2072) (a sixth segment). The third conductive portion (2070) may be electrically connected to a fourth matching circuit (M4) via a fourth point (P4) (e.g., a fifth point). The fourth matching circuit (M4) may be electrically connected to the processor (120) via a third electrical path (2913). For example, the fourth point (P4) (e.g., the fifth point) may be at least partially aligned with the first feeding point (F1) (e.g., the first point) of the first conductive portion (2050) and the second point (P2) (e.g., the third point) of the second conductive portion (2060) when the multi-foldable electronic device (2000) is in a folded state.

[0371] According to one embodiment, the fourth matching circuit (M4) may be disposed between the third conductive portion (2070) and the ground (G). The fourth matching circuit (M4) may be electrically connected to the fourth point (P4) of the third conductive portion (2070) to control electrical characteristics of the third conductive portion (2070). For example, the fourth matching circuit (M4) may be electrically connected to the ground (G). For example, the fourth matching circuit (M4) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the fourth matching circuit (M4) may change a component value (or ground value) for connecting the third conductive portion (2070) and the ground (G) using at least one switch and at least one passive component.

[0372] According to one embodiment, when the fourth matching circuit (M4) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (2050) in the unfolded state of the multi-foldable electronic device (2000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the third conductive portion (2070) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (2000) is in an unfolded state and the first conductive portion (2050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the fourth matching circuit (M4) to suppress the current flowing in the third housing (2030) (e.g., the third conductive portion (2070)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (2050).

[0373] According to one embodiment, the third conductive portion (2070) may be configured in the form of a floating frame via the fourth matching circuit (M4) so ​​that the first antenna (A1) (e.g., the first conductive portion (2050)) can maintain a radiation pattern of the upper hemisphere. For example, the fourth matching circuit (M4) may be set to an element value (or ground value) lower than a second reference element value specified so that the third conductive portion (2070) is configured in the form of a floating frame. When the fourth matching circuit (M4) is set to an element value lower than the specified second reference element value, the third conductive portion (2070) may have an electric field intensity of at least a portion opposite to the fourth point (P4) that is the highest within the third conductive portion (2070). In this case, the first conductive portion (2050), the second conductive portion (2060), and the third conductive portion (2070) may have at least a portion where the electric field intensity is highest when the multi-foldable electronic device (2000) is in a folded state. For example, the first point (F1) of the first conductive portion (2050), the third point (P2) of the second conductive portion (2060), and the fifth point (P4) of the third conductive portion (2070) may be at least partially aligned when the multi-foldable electronic device (2000) is in a folded state.

[0374] FIG. 30 is a schematic diagram illustrating a circuit configuration of a multi-foldable electronic device including a satellite antenna according to one embodiment. For example, the multi-foldable electronic device (3000) of FIG. 30 may be at least partially similar to the electronic device (101) of FIG. 1 or the multi-foldable electronic device (2000) disclosed in FIGS. 20A to 20C, or may include other embodiments of the electronic device.

[0375] According to one embodiment referring to FIG. 30, a multi-foldable electronic device (3000) may include a first hinge device (3090a), a second hinge device (3090b), a first housing (3010), a second housing (3020), and a third housing (3030).

[0376] According to one embodiment, a first conductive portion (3050) of a first housing (3010) can be disposed between a first non-conductive portion (3052) and a second non-conductive portion (3054). The first conductive portion (3050) can be electrically connected to a wireless communication module (192) via a first feed point (F1) (e.g., a first point) and a first signal path (S1). The first conductive portion (3050) can function as a radiator of the first antenna (A1). For example, the wireless communication module (192) can be electrically connected to the first feed point (F1) using a conductive member (e.g., a contact pad, a coupling member, a C-clip, or a conductive foam spring). For example, the first antenna (A1) (e.g., the first conductive portion (3050)) can operate in at least one of a first frequency band (e.g., a first satellite frequency band) or a second frequency band (e.g., a second satellite frequency band). For example, the first frequency band can include a frequency band of about 1.5 GHz to 1.7 GHz (e.g., an N255 band). For example, the second frequency band can include a frequency band of about 1.9 GHz to about 2.2 GHz (e.g., an N256 band). The first antenna (A1) (e.g., the first conductive portion (3050)) can operate as a satellite antenna.

[0377] According to one embodiment, the first conductive portion (3050) may be electrically connected to the first matching circuit (M1) via a first point (P1) (e.g., a second point). The first matching circuit (M1) may be electrically connected to the processor (120) via a first electrical path (3055). For example, the first point (P1) may be located closer to the second non-conductive portion (3054) than to the first power supply point (F1).

[0378] According to one embodiment, a first matching circuit (M1) may be disposed between a first conductive portion (3050) and a ground (G). The first matching circuit (M1) may be electrically connected to a first point (P1) of the first conductive portion (3050) to control electrical characteristics of the first conductive portion (3050). For example, the first matching circuit (M1) may be electrically connected to the ground (G). For example, the first matching circuit (M1) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the first matching circuit (M1) may change a component value (or ground value) for connecting the first conductive portion (3050) and the ground (G) using at least one switch and at least one passive component.

[0379] According to one embodiment, the first matching circuit (M1) may be controlled (e.g., adjusted) under the control of the processor (120) to form a resonance of the first frequency band or the second frequency band when the first conductive portion (3050) operates to radiate signals of the first frequency band or signals of the second frequency band. For example, the first matching circuit (M1) may control (e.g., adjust) an impedance of the first antenna (A1) including the first conductive portion (530) based on the control of the processor (120) and / or instructions stored in the memory (130). For example, the first matching circuit (M1) may improve the radiation performance, directivity, and / or upper hemisphere radiation pattern of the first antenna (A1) when the first conductive portion (3050) (e.g., the first antenna (A1)) operates as a satellite antenna.

[0380] According to one embodiment, the first antenna (A1) (e.g., the first conductive portion (3050)) may be configured in the form of a floating frame via the first matching circuit (M1) to form a radiation pattern of the upper hemisphere. For example, the first matching circuit (M1) may be set to an element value (or ground value) lower than a first reference element value designated so that the first conductive portion (3050) is configured in the form of a floating frame.

[0381] According to one embodiment, the second conductive portion (3060) of the second housing (3020) can be disposed between the third non-conductive portion (3062) (e.g., the third segment) and the fourth non-conductive portion (3064) (the fourth segment). The second conductive portion (3060) can be electrically connected to the second matching circuit (M2) via the second point (P2) (e.g., the third point). The second matching circuit (M2) can be electrically connected to the processor (120) via the second electrical path (3065). For example, the second point (P2) (e.g., the third point) can be at least partially aligned with the first power supply point (F1) (e.g., the first point) of the first conductive portion (3050) when the multi-foldable electronic device (3000) is in a folded state.

[0382] According to one embodiment, the second matching circuit (M2) can be disposed between the second conductive portion (3060) and the ground (G). The second matching circuit (M2) can be electrically connected to the second point (P2) of the second conductive portion (3060) to control electrical characteristics of the second conductive portion (3060). For example, the second matching circuit (M2) can be electrically connected to the ground (G). For example, the second matching circuit (M2) can include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the second matching circuit (M2) can change a component value (or ground value) for connecting the second conductive portion (3060) and the ground (G) using at least one switch and at least one passive component.

[0383] According to one embodiment, when the second matching circuit (M2) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (3050) in the unfolded state of the multi-foldable electronic device (3000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the second conductive portion (3060) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (3000) is in an unfolded state and the first conductive portion (3050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the second matching circuit (M2) to suppress the current flowing in the second housing (3020) (e.g., the second conductive portion (3060)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (3050).

[0384] According to one embodiment, the second conductive portion (3060) may be configured in the form of a floating frame via a second matching circuit (M2) so that the first antenna (A1) (e.g., the first conductive portion (3050)) can maintain a radiation pattern of the upper hemisphere. For example, the second matching circuit (M2) may be set to an element value (or ground value) lower than or equal to a second reference element value specified so that the second conductive portion (3060) is configured in the form of a floating frame. When the second matching circuit (M2) is set to an element value lower than or equal to the second reference element value specified, the second conductive portion (3060) may have the highest electric field intensity at least a portion opposite to the second point (P2) within the second conductive portion (3060). For example, the specified second reference element value may be equal to, higher than, or lower than the specified first reference element value.

[0385] According to one embodiment, a third conductive portion (3070) of a third housing (3030) can be disposed between a fifth non-conductive portion (3072) (e.g., a fifth segment) and a sixth non-conductive portion (3074) (a sixth segment). The third conductive portion (3070) can be electrically connected to a fourth matching circuit (M4) via a fourth point (P4) (e.g., a fifth point). The fourth matching circuit (M4) can be electrically connected to the processor (120) via a third electrical path (3075). For example, the fourth point (P4) (e.g., the fifth point) may be at least partially aligned with the first feeding point (F1) (e.g., the first point) of the first conductive portion (3050) and the second point (P2) (e.g., the third point) of the second conductive portion (3060) when the multi-foldable electronic device (3000) is in a folded state.

[0386] According to one embodiment, the fourth matching circuit (M4) may be disposed between the third conductive portion (3070) and the ground (G). The fourth matching circuit (M4) may be electrically connected to the fourth point (P4) of the third conductive portion (3070) to control electrical characteristics of the third conductive portion (3070). For example, the fourth matching circuit (M4) may be electrically connected to the ground (G). For example, the fourth matching circuit (M4) may include at least one switch and / or at least one passive component (or lumped component) (e.g., a capacitor and / or an inductor). For example, the fourth matching circuit (M4) may change a component value (or ground value) for connecting the third conductive portion (3070) and the ground (G) using at least one switch and at least one passive component.

[0387] According to one embodiment, when the fourth matching circuit (M4) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (3050) in the unfolded state of the multi-foldable electronic device (3000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the third conductive portion (3070) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (3000) is in an unfolded state and the first conductive portion (3050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the fourth matching circuit (M4) to suppress the current flowing in the third housing (3030) (e.g., the third conductive portion (3070)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (3050).

[0388] According to one embodiment, the third conductive portion (3070) may be configured in the form of a floating frame via the fourth matching circuit (M4) so ​​that the first antenna (A1) (e.g., the first conductive portion (3050)) can maintain a radiation pattern of the upper hemisphere. For example, the fourth matching circuit (M4) may be set to an element value (or ground value) lower than a second reference element value specified so that the third conductive portion (3070) is configured in the form of a floating frame. When the fourth matching circuit (M4) is set to an element value lower than the specified second reference element value, the third conductive portion (3070) may have an electric field intensity of at least a portion opposite to the fourth point (P4) that is the highest within the third conductive portion (3070). In this case, the first conductive portion (3050), the second conductive portion (3060), and the third conductive portion (3070) may have at least a portion where the electric field intensity is highest when the multi-foldable electronic device (3000) is in a folded state. For example, the first point (F1) of the first conductive portion (3050), the third point (P2) of the second conductive portion (3060), and the fifth point (P4) of the third conductive portion (3070) may be at least partially aligned when the multi-foldable electronic device (3000) is in a folded state.

[0389] According to one embodiment, the fourth conductive portion (3080) of the fourth housing (3040) can be positioned between the seventh non-conductive portion (3082) (e.g., the seventh segment) and the eighth non-conductive portion (3084) (eighth segment). The fourth conductive portion (3080) can be electrically connected to the sixth matching circuit (M6) via the sixth point (P6) (e.g., the seventh point). The sixth matching circuit (M6) can be electrically connected to the processor (120) via the fourth electrical path (3085). For example, the sixth point (P6) (e.g., the seventh point) may be at least partially aligned with the first feeding point (F1) (e.g., the first point) of the first conductive portion (3050), the second point (P2) (e.g., the third point) of the second conductive portion (3060), and the fourth point (P4) of the third conductive portion (3070) when the multi-foldable electronic device (3000) is in a folded state.

[0390] According to one embodiment, the sixth matching circuit (M6) may be disposed between the fourth conductive portion (3080) and the ground (G). The sixth matching circuit (M6) may be electrically connected to the sixth point (P6) of the fourth conductive portion (3080) to control electrical characteristics of the fourth conductive portion (3080). For example, the sixth matching circuit (M6) may be electrically connected to the ground (G). For example, the sixth matching circuit (M6) may include at least one switch and / or at least one passive element (or lumped element) (e.g., a capacitor and / or an inductor). For example, the sixth matching circuit (M6) may change an element value (or ground value) for connecting the fourth conductive portion (3080) and the ground (G) using at least one switch and at least one passive element.

[0391] According to one embodiment, when the sixth matching circuit (M6) operates to radiate signals of the first frequency band (or signals of the second frequency band) through the first conductive portion (3050) in the unfolded state of the multi-foldable electronic device (3000), the matching can be controlled (e.g., adjusted) under the control of the processor (120) so that the fourth conductive portion (3080) forms a resonance of the first frequency band (or the second frequency band). For example, when the multi-foldable electronic device (3000) is in an unfolded state and the first conductive portion (3050) operates in a first frequency band (or a second frequency band) (e.g., operates as a satellite antenna), the processor (120) can control (e.g., adjust) the element value of the sixth matching circuit (M6) to suppress the current flowing in the fourth housing (3040) (e.g., the fourth conductive portion (3080)), thereby reducing the deterioration of the radiation performance of the first antenna (A1) including the first conductive portion (3050).

[0392] According to one embodiment, the fourth conductive portion (3080) may be configured in the form of a floating frame via the sixth matching circuit (M6) so that the first antenna (A1) (e.g., the first conductive portion (3050)) can maintain a radiation pattern of the upper hemisphere. For example, the sixth matching circuit (M6) may be set to an element value (or ground value) lower than or equal to a second reference element value specified so that the fourth conductive portion (3080) is configured in the form of a floating frame. When the sixth matching circuit (M6) is set to an element value lower than or equal to the specified second reference element value, the fourth conductive portion (3080) may have an electric field intensity of at least a portion opposite to the sixth point (P6) that is the highest within the fourth conductive portion (3080). In this case, the first conductive portion (3050), the second conductive portion (3060), the third conductive portion (3070), and the fourth conductive portion (3080) may have at least a portion of the highest electric field strength coincident with (or overlap with) the first point (F1) of the first conductive portion (3050), the third point (P2) of the second conductive portion (3060), the fifth point (P4) of the third conductive portion (3070), and the seventh point (P6) of the fourth conductive portion (3080) may be at least partially aligned with the second point (P2) of the third conductive portion (3070) when the multi-foldable electronic device (3000) is in a folded state.

[0393] According to one embodiment, an electronic device (e.g., an electronic device (2000) of FIGS. 20A to 21, 23, 25, 28 to 29) includes a first housing (e.g., a first conductive portion (2050) of FIGS. 20A to 21, 23, 25, 28 to 29) disposed through a first non-conductive portion (e.g., a first non-conductive portion (2051) of FIGS. 20A to 21, 23, 25, 28 to 29) and a second non-conductive portion (e.g., a second non-conductive portion (2052) of FIGS. 20A to 21, 23, 25, 28 to 29) that is spaced apart from each other. 21, 23, 25, 28 to 29 may include the first housing (2010). According to one embodiment, the electronic device may include a second housing (e.g., a second housing (2020) of FIGS. 20A-21, 23, 25, 28-29) comprising a second conductive portion (e.g., a second conductive portion (2060) of FIGS. 20A-21, 23, 25, 28-29) disposed through a spaced third non-conductive portion (e.g., a third non-conductive portion (2061) of FIGS. 20A-21, 23, 25, 28-29) and a fourth non-conductive portion (e.g., a fourth non-conductive portion (2052) of FIGS. 20A-21, 23, 25, 28-29).According to one embodiment, the electronic device may include a third housing (e.g., the third housing (2030) of FIGS. 20A-21, 23, 25, 28-29) including a third conductive portion (e.g., the third conductive portion (2070) of FIGS. 20A-21, 23, 25, 28-29) disposed through a fifth non-conductive portion (e.g., the fifth non-conductive portion (2071) of FIGS. 20A-21, 23, 25, 28-29) and a sixth non-conductive portion (e.g., the sixth non-conductive portion (2072) of FIGS. 20A-21, 23, 25, 28-29). According to one embodiment, the electronic device may include a first hinge device (e.g., the first hinge device 2080a of FIGS. 20A to 21, 23, 25, and 28 to 29) rotatably connecting the first housing and the second housing with respect to each other. According to one embodiment, the electronic device may include a second hinge device (e.g., the second hinge device 2080b of FIGS. 20A to 21, 23, 25, and 28 to 29) rotatably connecting the second housing and the third housing with respect to each other. According to one embodiment, the electronic device may include a wireless communication circuit electrically connected to a first point of the first conductive portion. According to one embodiment, the electronic device may include a first matching circuit disposed in a first electrical path electrically connecting a second point between the first point and the second non-conductive portion and ground. According to one embodiment, the electronic device may include a second matching circuit disposed along a second electrical path electrically connecting a third point between the third non-conductive portion and the fourth non-conductive portion to ground.In one embodiment, the electronic device may include a third matching circuit disposed in a third electrical path electrically connecting a fourth point between the fifth non-conductive portion and the sixth non-conductive portion and ground. In one embodiment, the first point, the third point, and the fourth point may be at least partially aligned when the electronic device is in a folded state, and may include. In one embodiment, the wireless communication circuit may transmit and / or receive a wireless signal in at least one frequency band through the first conductive portion, the second conductive portion, and the third conductive portion, when in a folded state.

[0394] In one embodiment, the second non-conductive portion, the third non-conductive portion, and the sixth non-conductive portion can be aligned when the electronic device is in a folded state. In one embodiment, the first non-conductive portion, the fourth non-conductive portion, and the fifth conductive portion can be aligned when the electronic device is in a folded state.

[0395] According to one embodiment, the second non-conductive portion may be opposed to the first conductive portion and may include a third conductive portion electromagnetically connected to the first hinge device.

[0396] According to one embodiment, the first non-conductive portion may be opposed to the first conductive portion and may include a fourth conductive portion electromagnetically connected to the first hinge device.

[0397] According to one embodiment, the first matching circuit (M1), the second matching circuit (M2) and / or the third matching circuit (M4) may include a switching circuit and a plurality of passive elements electrically connected to the switching circuit and having different element values.

[0398] According to one embodiment, the third point (P2) and / or the fourth point (P4) may be connected to ground through at least one passive element of the plurality of passive elements switched through the switching circuit, the value of which is less than or equal to a designated second reference element value, in the folded state of the electronic device.

[0399] According to one embodiment, the third point (P2) and / or the fourth point (P4) may be connected to ground through at least one passive element having a component value corresponding to a frequency band of the first conductive portion among the plurality of passive elements switched through the switching circuit, in the unfolded state of the electronic device.

[0400] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples presented to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of one embodiment of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical idea of ​​one embodiment of the present disclosure, in addition to the embodiments disclosed herein, within the scope of one embodiment of the present disclosure.

Claims

1. In electronic devices (200 or 2000), A first housing (210 or 2010) comprising a first conductive portion (530 or 2050) disposed through a first non-conductive portion (501 or 2051) and a second non-conductive portion (502 or 2052); A second housing (220 or 2020) comprising a second conductive portion (560 or 2060) disposed through a third non-conductive portion (504 or 2061) and a fourth non-conductive portion (505 or 2062); A first hinge device (320 or 2080a) that rotatably connects the first housing (210 or 2010) and the second housing (220 or 2020) with respect to each other; A wireless communication circuit (192) electrically connected to the first point (F1) of the first conductive portion (530 or 2050); A first matching circuit (M1) disposed among a first electrical path (531 or 2110) electrically connecting a second point (P1) between the first point (F1) and the first non-conductive portion (501 or 2052) and the ground; and A second matching circuit (M2) is disposed between a third point (P2) between the third non-conductive portion (504 or 2061) and the fourth non-conductive portion (505 or 2062) and a second electrical path (553 or 2112) electrically connecting the ground, The first point (F1) and the third point (P2) are at least partially aligned when the electronic device (200) is in a folded state, The wireless communication circuit (192) is an electronic device configured to transmit and / or receive a wireless signal in at least one frequency band through the first conductive portion (530 or 2050) and the second conductive portion (560 or 2060) in the folded state.

2. In paragraph 1, The first non-conductive portion (501) and the third non-conductive portion (504) are aligned when the electronic device (200) is in a folded state, The second non-conductive portion (502) and the fourth non-conductive portion (505) are an electronic device in which the electronic device (200) is aligned in a folded state.

3. In paragraph 1 or 2, An electronic device further comprising a third conductive portion (510) facing the first conductive portion (530) with respect to the first non-conductive portion (501) and electromagnetically connected to the first hinge device (320).

4. In paragraph 1 or 2, An electronic device further comprising a fourth conductive portion facing the first conductive portion (530) with respect to the second non-conductive portion and electromagnetically connected to the first hinge device (320).

5. In any one of paragraphs 1 to 4, An electronic device in which the first matching circuit (M1) and / or the second matching circuit (M2) includes a switching circuit and a plurality of passive elements electrically connected to the switching circuit and having different element values.

6. In paragraph 5, The second point (P1) is an electronic device connected to the ground through at least one of the plurality of passive elements switched through the switching circuit.

7. In paragraph 6, The second point (P1) is an electronic device connected to the ground through at least one passive element having an element value lower than a designated first reference element value among the plurality of passive elements switched through the switching circuit in the folded state of the electronic device (200).

8. In paragraph 5, The third point (P2) is an electronic device that is connected to the ground through at least one passive element having a value lower than a specified second reference element value among the plurality of passive elements switched through the switching circuit in the folded state of the electronic device (200).

9. In paragraph 8, The third point (P2) is an electronic device connected to the ground through at least one passive element having an element value corresponding to the frequency band of the first conductive portion among the plurality of passive elements switched through the switching circuit in the unfolded state of the electronic device (200).

10. In paragraph 1, The wireless communication circuit (192) is an electronic device configured to transmit and / or receive a wireless signal in the at least one frequency band through the first conductive portion in the unfolded state of the electronic device (200).

11. In paragraph 1, A third housing (2030) comprising a third conductive portion (2070) disposed through a fifth non-conductive portion (2071) and a sixth non-conductive portion (2072); A second hinge device (2080b) that rotatably connects the second housing (2020) and the third housing (2030) with respect to each other; and Further comprising a third matching circuit (M4) disposed among the third electrical path (2114) electrically connecting the fourth point (P4) between the fifth non-conductive portion (2071) and the sixth non-conductive portion (2072) and the ground, The first point (F1), the third point (P2) and the fourth point (P4) are at least partially aligned when the electronic device (2000) is in a folded state, The wireless communication circuit (192) is an electronic device configured to transmit and / or receive a wireless signal in at least one frequency band through the first conductive portion (2050), the second conductive portion (2060), and the third conductive portion (2070) in the folded state.

12. In paragraph 11, The second non-conductive portion (2052), the third non-conductive portion (2061) and the sixth non-conductive portion (2072) are aligned when the electronic device (2000) is in a folded state, The first non-conductive portion (2051), the fourth non-conductive portion (2062) and the fifth conductive portion (2071) are an electronic device in which the electronic device (2000) is aligned in a folded state.

13. In paragraph 11 or 12, A third conductive portion facing the first conductive portion (2050) with respect to the second non-conductive portion (2052) and electromagnetically connected to the first hinge device (2080a), and An electronic device further comprising a fourth conductive portion (2050) facing the first conductive portion with respect to the first non-conductive portion and electromagnetically connected to the first hinge device (2080a).

14. In any one of the clauses 11 to 13, An electronic device in which the first matching circuit (M1), the second matching circuit (M2) and / or the third matching circuit (M4) include a switching circuit and a plurality of passive elements electrically connected to the switching circuit and having different element values.

15. In paragraph 14, The third point (P2) and / or the fourth point (P4) are connected to the ground through at least one passive element having a value lower than a specified second reference element among the plurality of passive elements switched through the switching circuit in the folded state of the electronic device (2000), An electronic device in which the third point (P2) and / or the fourth point (P4) are connected to the ground through at least one passive element having an element value corresponding to the frequency band of the first conductive portion among the plurality of passive elements switched through the switching circuit in the unfolded state of the electronic device (2000).

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