Electronic circuit on a textile support, and production method

Abstract

An electronic circuit on a textile support comprises circuit lines having conductor tracks lying over the surface of the textile support and a contacting module having a socket integrally bonded to the textile support for mechanically detachably receiving an electronic module. The contacting module comprises electrically conductive contact surfaces and is designed to receive an electronic module, which is provided with electrical contacts, at a specified position relative to the socket such that a plurality of the electrical contacts of the electronic module are electrically connected to a plurality of contact surfaces of the contacting module. The socket has an inner socket base portion and the lower side thereof is integrally bonded face-to-face to a socket cover portion of a lower cover (2800), the integrally bonded face-to-face connection containing one or more intermediate layers, each of which is connected, on both sides, to adjacent surfaces face-to-face and in which electrically conductive conductor track portions are located. The conductor track portions are electrically connected to the contact surfaces of the contacting module through the inner socket base portion, or the sides of the conductor track portions facing the specified position serve as contact surfaces of the contacting module through openings in the inner socket base.

Description

[0001] -09-2025-43634401-Hauptpost-0013 10-Q3-2025-43634401 “H au t Pos t -0013 PCT / DE2025 / 000091

[0002] 1

[0003] Electronic circuitry on a textile substrate and manufacturing process

[0004] 5 INTRODUCTION AND STATE OF THE ART

[0005] The invention relates to an electronic circuit on a textile substrate, as well as a manufacturing method for such an electronic circuit.

[0006] Electronic circuits on textile substrates are used in various applications.

[0007] 10. Smart textiles are already known, for example in connection with textiles worn on the body or textiles with other functions, such as textile coverings for car or airplane seats. As "smart textiles," they are enjoying increasing popularity and use.

[0008] Electronic circuits on textile substrates often contain circuit elements.

[0009] 15 components that are directly attached to or integrated into the textile substrate and are intended to impair the textile feel of the substrate only minimally or not at all. Examples include, in particular, discrete circuit elements such as electrodes as sensors for detecting electrical voltages or as actuators for introducing electrical impulses, temperature sensors, sensors for chemical substances, or

[0010] 20 material modifications, or even antennas or heating elements. If textile carriers with such sensors are worn directly on the skin of a user, they can be used to detect the user's biofunctions. Textile carriers with actuators in direct skin contact can, for example, be used for therapeutic stimulation of the human body and / or movement control.

[0011] 25 can be used.

[0012] Electrically conductive circuit leads are often used to connect such circuit elements that lie directly on the textile support, with leads lying flat against the textile support and / or woven into the textile of the support. -09-2025-43634401-Hauptpost-0014 10-09- 2025- -43834401 ''“Hau P t Pos t-0014 PCT / DE2025 / 000091

[0013] - 2 -

[0014] Conductive traces are used to minimize any impairment of the textile feel, such as in normal clothing, and to meet further requirements such as washability. Many components of such circuits lie flat against the textile substrate, especially discrete circuit elements and...

[0015] Five conductor tracks can be manufactured using additive manufacturing processes such as printed electronics.

[0016] On the other hand, certain electronic functions, such as control, signal amplification, and data processing, cannot be additively manufactured and integrated into textile carriers using currently available manufacturing methods. Instead

[0017] 10. Such functions are mostly implemented partly with conventional silicon-based circuit elements on PCBs. Therefore, electronic circuits that lie flat on textile substrates regularly form hybrid systems in combination with electronic modules that include conventional electronic components such as microcontrollers, data storage devices, and communication electronics on PCBs, as well as

[0018] Includes 15 energy storage devices (batteries).

[0019] In such hybrid systems, the electronic modules are preferably mechanically and electrically detachable from the circuits on textile carriers, for example to change and / or wash and / or replace the textile carriers after use, or to supply the systems with freshly charged energy storage after use.

[0020] If only individual contacts are required, detachable connections are typically made via snap fasteners with sockets (female components) on the textile carrier, often together with loose cables. Detachable multiple connections are frequently made via plug connectors in contact modules that are permanently attached to the textile carrier and mechanically detachable the electronic modules at predetermined relative positions. Such contact modules contain electrically conductive contact surfaces for connecting the contacts of the mounted electronic modules to elements of the electronic circuits on the textile carrier. -09-2025-43634401 -Main post-0015 10“09-2025~43G34401“Main Post“0015 PCT / DE2025 / 000091

[0021] 3

[0022] In the prior art, such a contacting module typically comprises several parts for the fixed connection of the contacting module to the textile support, at least two of which enclose the textile from opposite sides and are connected to each other by tensile connections through the textile, usually screws, rivets, or other metal bolts. For electrical connection to such contacting modules, conductors lying flat against the textile support and conductors bonded to the textile are contacted via the metal bolts. Separately routed electrical conductors and woven-in electrically conductive strands can be detached from the textile support at their ends and connected to the conductive contact surfaces of the contacting module. Such contacting modules are described, for example, in WO 2016 / 054057A1 or WO 2020 / 0257933 Al.

[0023] In all the aforementioned solutions, the number of possible electrical connections is limited by the size of the contact module. Such contact modules cannot be miniaturized and, due to their complex structure, are also disadvantageous in terms of manufacturing effort. If the textile carrier with the electronic circuit is worn on the body and the electronic module is detached and connected by the user in everyday use, further limitations arise, including limitations on the number of detachable electrical connections. These connections must be mechanically and electrically robust on the one hand, and detachable without requiring significant force on the other. Connectors designed for this purpose typically have no more than 10 and at most about 25 contacts.Known connectors for a larger number of detachable electrical contacts (for example, for connecting PCBs in electronic devices or in special applications of measurement technology) are neither designed nor suitable for simple and robust disconnection and reconnection by a user in everyday use.

[0024] One object of the present invention is to overcome the aforementioned disadvantages and to create an electronic circuit on a textile substrate with the possibility of mechanically detachable contacting of an electronic module to 30, which results in lower manufacturing costs and a high spatial density -09-2025-43634401-Main Post-0016 10-09=2025=436344Oil-MainPost -i-0016 PCT / DE2025 / 000091

[0025] 4 electrical connections between the circuit on the textile substrate and the electronic module are enabled. A further object of the present invention is to provide an electronic circuit on a textile substrate with the possibility of mechanically detachable contact with an electronic module.

[0026] 5 create a simple yet robust disconnection and reconnection by a user, even when a large number of circuit elements directly attached to or integrated into the textile carrier need to be contacted. A further object of the present invention is to create an electronic circuit on a textile carrier and a detachable electrical component.

[0027] 10 nikmodul to be connected by a contacting module designed as compactly as possible and to impair the textile feel of the carrier as little or not at all.

[0028] A further object of the present invention is to overcome the aforementioned disadvantages and to provide a manufacturing method for an electronic circuit.

[0029] 15 on a textile substrate with the possibility of mechanically detachable contacting of an electronic module, which enables lower manufacturing costs and a high spatial density of electrical connections between the circuit on the textile substrate and the electronic module. A further object of the present invention is to provide a manufacturing method for the inventive-

[0030] to provide 20 standard electronic circuits.

[0031] In light of these tasks, the present invention provides the electronic circuits according to claims 1 and 2 and the manufacturing methods according to claims 19 and 20. The dependent claims relate to advantageous embodiments and further developments.

[0032] 25. Further features and advantages will become apparent from the following description and the accompanying figures. These, as well as the claims, disclose features of the invention in specific embodiments, exemplary embodiments, and combinations. However, the disclosed features can also be considered individually and combined into further combinations or sub-combinations -09-2025-43634401-Hauptpost-0017 10-09-2025-43634401 -H a UP t Po st -GO 17 PCT / DE2025 / 000091 in order to adapt the invention, as defined in the claims, to specific needs or areas of application.

[0033] BRIEF DESCRIPTION OF THE FIGURES

[0034] Figures 1A and 1B show, as a first embodiment, a schematic electronic circuit with two conductor strands on a textile substrate in top views of the substrate from both sides.

[0035] Figure 2 shows a section view of the contacting module and the contacted electronic module.

[0036] Figures 3A and 3B show details of the contacting in the contacting module for a second embodiment.

[0037] Figures 4A and 4B show a third embodiment of a contacting module with a socket extension along a connection direction.

[0038] Figures 5A to 5D show examples of other alternatively designed base designs.

[0039] Figures 6A and 6B show, as a fourth embodiment, a contacting module with three connection directions.

[0040] Figures 7A and 7B show, as a fifth embodiment of a contacting module, a further arrangement for connecting the contacting module to the 20 lines and circuit elements on the opposite side of the Texti 1s,

[0041] Figure 7C shows an alternative design variant.

[0042] Figures 8A and 8B show, as a sixth example, a contact module with a configuration for two connection directions and a reversal of the conductive layers when connecting to the rest of the circuit. -09-2025-43634401-Main-Post-0018 10=03-2025“ 43634401 “Main-Post-0018 PCT / DE2025 / 000091

[0043] - 6 -

[0044] Figures 9A, 9B and 9C show, as a seventh embodiment, a contacting module with several superimposed conductor tracks.

[0045] Figures 10A and 10B show, as an eighth embodiment, a contacting module with several superimposed conductor tracks and a selection

[0046] 5 switching device in the layer system between the inner base floor section and the lower cover.

[0047] Figures 11A to 11E show examples of different arrangements of a selection switching device in conjunction with several superimposed conductor tracks.

[0048] Figures 12A and 12B show, as a ninth embodiment, an arrangement for a side reversal of several superimposed conductor tracks when connecting the contacting module to several superimposed conductor tracks in the further circuit.

[0049] Figures 13A to 13G show, as a tenth embodiment, an arrangement for a side reversal of several superimposed conductor tracks of the contacting module when connecting to sections of the electronic circuit without superimposed conductor tracks.

[0050] Figures 14A and 14B show a variant of the tenth implementation example.

[0051] Figures 15A, 15B and 15C show circuits on a textile using

[0052] 20. Implementation of the arrangements in the tenth embodiment and its variant.

[0053] Figures 16A to 16H show, as the eleventh implementation example, a circuit with a two-dimensional field of M x N circuit elements.

[0054] Figures 17A to 17D show, as the twelfth example, a circuit with a two-dimensional field of M x N circuit elements, each with several

[0055] 25 lines are contacted. -09-2025-43634401-Main Post Office-0019 10-09”2025“43634401“Häy Pi Po si -0019 PCT / DE2025 / 000091

[0056] 7

[0057] Figures 18A and 18B show a flowchart and associated arrangement for a first exemplary manufacturing process.

[0058] Figures 19A and 19B show a flowchart and associated arrangement for a second exemplary manufacturing process.

[0059] Figures 20A and 20B show a flowchart and associated arrangement for a third exemplary manufacturing process.

[0060] Figures 21A to 21D show, as a thirteenth embodiment, a schematic combination of a printed film and a suitably designed base body for use in the manufacture of an exemplary base.

[0061] Figures 22A to 22E show, as a fourteenth embodiment, a combination of a further printed film and a suitably designed base body, further designed by way of example to accommodate a textile carrier for use in the manufacture of a base connected with the textile carrier.

[0062] Figures 23A to 23H show, as a fifteenth embodiment, a combination of several printed films and a suitably designed base body, designed for use as a base for a contacting module with several superimposed conductor tracks.

[0063] 20 DESCRIPTION OF THE INVENTION

[0064] In the following description of the invention, reference is made to figures as exemplary embodiments to illustrate features, aspects, and embodiments of the invention. If the same reference numerals are used in different figures, repetitive explanations are omitted.

[0065] Unless otherwise specified, the respective characteristics and aspects of repeatedly used reference symbols are to be understood based on previously given explanations. Unless otherwise stated in the description, -09-2025-43634401-Hau ptpost-0020 10-03-2025-43634401 -Ha U t Po § -0020 PCT / DE2025 / 000091

[0066] 8

[0067] Figures as schematic drawings and details in the graphic representation should not be understood as restrictive.

[0068] The electronic circuit according to the invention on a textile substrate comprises several circuit lines with one and / or multiple layers on the textile substrate.

[0069] 5 surface-mounted conductor tracks and a contact module with a base bonded to the textile substrate, designed for the mechanically detachable mounting of an electronic module without contact with the textile substrate.

[0070] The contact module comprises several electrically conductive contact surfaces and is

[0071] 10 designed to accommodate an electronic module provided with multiple electrical contacts at a predetermined position (P) relative to the base such that several, for example all, of its electrical contacts are electrically connected to several contact surfaces of the contacting module.

[0072] In a preferred embodiment, the textile carrier is designed to be worn on the

[0073] 15 human bodies are formed, and the circuit comprises several electrically conductive electrodes and / or sensors lying flat on the textile carrier, which are connected via several of the circuit lines to a conductive contact surface of the contacting module and are in contact with the skin when the textile carrier is worn.

[0074] Figure 1 schematically shows a first embodiment, presented here as an example of an electronic circuit worn on the human body on a textile carrier material. The textile carrier 1000 has the form of trousers, shown in Figure 1A in a flat front view from the outside, and in Figure 1B in a corresponding inside view, i.e., the inside facing the human body.

[0075] 25 On the front of the right leg, at mid-height, is the contact module 2000, shown on the left in the front view of Figure 1A and on the right in the interior view of Figure 1B. In the interior view, there are circuit lines 4000 with conductive traces lying flat against the textile carrier. They serve to contact circuit elements 4500, such as electrically conductive

[0076] 30 capable electrodes, which in the illustrated example are also mounted on the textile carrier on -09-2025-43634401 -Hau ptpost-0021 1009- 2025“ 43634401 -Hau P t Pos t “0021 PCT / DE2025 / 000091

[0077] 9 whose inner surface lies flat and faces the human body. The axes in the figures are each aligned relative to the textile support; directions x and y lie parallel to its main surface, and perpendicular to this, +z is the direction to the outside (+z) and -z is the direction to the inside (-z) of the

[0078] 5 textile carriers.

[0079] In general, switching elements worn on the human body on textile backing material are often discrete circuit elements, in particular sensors for measuring biological, environmental, or ambient variables, or actuators for stimulating bodily functions. Such body-worn sensors can provide information

[0080] The device can collect 10 information about the wearer or environmental data and – optionally – provide data or feedback loops for the actuators. The electronic circuit, worn on a textile backing material on the human body, can be used to measure body signals and activate specific parts of the body, for example, by measuring voltages and / or currents generated by the body.

[0081] 15 and the activation of muscles by applying tension and / or currents. The actuators can also be operated independently of the sensory elements.

[0082] Figure 2 shows a section of the first embodiment example with the contacting module 2000 and the contacted electronic module 3000 in a sectional view.

[0083] 20. View in an xz plane. In this sectional view, the inside of the textile carrier 1000 is directed downwards, and the conductor tracks 4100, which lie flat against the textile carrier, extend in the x-direction (connection direction) to both sides.

[0084] The contacting module 2000 comprises the material-bonded connection to the textile carrier.

[0085] 25 connected base bodies 2100 and mechanically detaches the electronic module without contact with the textile carrier at a predetermined position (P) relative to the base.

[0086] In the example shown, the contact module has a cover 2200 on the side facing away from the body, which together with the socket body 2100 forms a -09-2025-43634401 -Hau ptpost-0022 10-09- 2025=43634401 -HauPt Pc st -0022 PCT / DE2025 / 000091

[0087] 10

[0088] Cavity H is formed. Generally, for circuits worn on the human body on textile backing material, it is preferred to house the electronic module in a dustproof and water-jet resistant cavity (protection class IP65). Electronic module 3000 and cover 2200 can be – as in the illustrated embodiment –

[0089] 5 - can be designed separately from each other or as a single piece, i.e., firmly connected to each other. Furthermore, in the embodiment example, the base body projects in the z-direction up to the total height of the contact module in front of the side of the textile facing away from the body and encloses the cover laterally, without the latter protruding from the printed base body. Alternatively, the cover can be designed in the z-direction-

[0090] 10. The bases project beyond the base body and, for example, have a depth adapted to the space requirements of the electronic module. This has the advantage for the electronic circuit according to the invention that textile carriers with similar bases can be used to contact electronic modules with different space requirements.

[0091] 15 Other elements of the illustrated embodiment not mentioned above are described below.

[0092] Figure 3 shows details of the electrical contacting in the contacting module for a second embodiment, namely Figure 3A as a sectional view in an xy-plane at the level of S2S2' in Figure 3B, and Figure 3B as a sectional view in a

[0093] 20 ner xz-plane at S1S1' in Figure 3A. For the purpose of graphical representation, the electronic module 3000 has been moved upwards from contact position P in this figure, so that its electrical contacts 3101, 3102, 3103 are clearly visible separately from the electrically conductive contact surfaces 2101, 2102, 2103 of the socket. Functionally, the electronic module is positioned at position P relative to the

[0094] 25 sockets are mounted such that several of its electrical contacts (shown here: all contacts 3101, 3102, 3103) are electrically connected to several contact surfaces (shown here: all contact surfaces 2101, 2102, 2103) of the contacting module, as is functionally shown in Figure 2 for the first embodiment.

[0095] 30 ***** -09-2025-43634401 -Hau ptpost-0023 10-08-2025-43634401 -Hau P iPo st -0023 PCT / DE2025 / 000091

[0096] 11

[0097] In a first aspect of the invention, the base body has an inner base bottom section and, on the side of the base facing away from the predetermined position P (hereinafter referred to as the underside), a lower cover. The lower cover has a section (hereinafter referred to as the base cover section)

[0098] 5), which is bonded to the underside of the inner base section in a planar and material manner. This planar and material connection between the inner base section and the base cover section contains one or more intermediate layers, each bonded to adjacent surfaces on both sides, in which conductor track sections are located. These conductor track sections

[0099] Ten components serve as the electrical connection between the circuit traces with the conductor tracks lying flat against the textile carrier and the electronic module in the predetermined position in the contact module. For this purpose, the conductor track sections are electrically connected at their ends furthest from the predetermined position to the circuit traces outside the socket. At their ends, which are pre-

[0100] At the ends of the 15-positioned conductor track sections in the inner base section and / or through the inner base section, the conductor track sections are electrically connected to contact surfaces of the contacting module, or their sides facing the predetermined position serve as contact surfaces (2101, 2102, 2103) of the contacting module through openings (2161, 2162, 2163) in the inner base section.

[0101] 20 contacting modules. This arrangement according to the invention enables a detachable mechanical and electrical connection between the electronic circuit on a textile carrier and the electronic module detachably mounted at the predetermined position in the contacting module.

[0102] The contact module is firmly attached to the textile carrier via its base.

[0103] 25 bound. This mechanical connection is material-bonded and can be achieved by gluing and / or fusing, the base preferably being formed with one or more electrically non-conductive thermoplastic elastomers. The mechanical connection between the underside of the inner base bottom section and the base cover section is also planar and material-bonded and

[0104] 30 holds one or more intermediate layers, each connected on both sides to adjacent surfaces, in which the conductor track sections are located for electrical -09-2025-43634401 -Hau ptpost-0024 10-09= 2025-43634401 -HauP Wos t- 0024 PCT / DE2025 / 000091

[0105] 12

[0106] The connection to the circuit leads of the electronic circuit is located on the textile substrate. It is advantageous if the lower cover is also formed with an electrically non-conductive thermoplastic elastomer, preferably TPU, and if the conductor track sections are connected directly and / or via electrically insulated

[0107] 5. Adhesive intermediate layers are bonded to the thermoplastic elastomer in a planar manner. Preferably, but not necessarily according to the invention, the aforementioned non-conductive thermoplastic elastomers are elastic, so that when the electronic circuit is worn on the human body, the base, together with the textile carrier, can adapt to the shape of the body.

[0108] 10 For example, the electronic circuit on the textile carrier is worn on a thigh or forearm and the base is located on an outwardly curved outer side of the thigh or forearm and can adapt to the curved shape of the body together with the textile carrier.

[0109] 15 The one or more intermediate layers with the conductor track sections can be manufactured in the desired layout and using known additive manufacturing processes, in particular printing processes of printed electronics. Printing inks are used which, in the solidified state after post-treatment involving the application of heat and / or pressure, exhibit the desired electrical properties.

[0110] exhibit 20 properties (e.g., electrically conductive, electrically insulating, semiconducting).

[0111] These printing processes allow for a high spatial density of electrical connections, in which conductor track sections per layer plane are placed at grid spacings (track width + adjacent spacing) in the range of a few hundred micrometers (preferably between about 50 pm and 500 pm) or more and at layer spacings (height

[0112] 25 conductor track section + height of insulating layer) can be arranged perpendicular to the underside of the inner socket base section on the order of a few tens of micrometers (approximately between 5 pm and 200 pm, preferably between 10 pm and 40 pm) or more. Printed conductor tracks can be equipped with an electrically conductive layer of a thickness in the range of 10 pm to 200 pm, preferably between 10 pm and 40 pm.

[0113] 30 platoons in the range of 4pm to 60pm, and with -09-2025-43634401 -Hau ptpost-0025 10“09“2025“43634401 -Hau? tpos t -0025 PCT / DE2025 / 000091

[0114] - 13 -

[0115] Cross-sectional widths in the range of 100 mm to 30 mm, preferably in the range of 300 mm to 3 mm.

[0116] The associated manufacturing costs are primarily determined by the process steps of the respective printing methods and are largely independent of the

[0117] 5. The respective printing patterns, such as the number of parallel connections to be made between the contact surfaces of the contacting module and the circuit lines to be contacted on the textile substrate outside the base. Therefore, printing processes for "printed electronics" are also advantageous from a cost perspective, especially when a larger number of circuit lines need to be contacted on the textile substrate.

[0118] The conductive traces, which are laid flat on the textile substrate in one or more layers, can also be produced using known additive manufacturing processes, in particular printing processes of "printed electronics". They are electrically insulated all around over a length of at least 20 mm, preferably 100 mm, using a printing process, and the interior of each circumferential insulation is provided with an electrically conductive layer in the dimensions specified above.

[0119] According to the invention, connections between the contact surfaces in the contacting module and the circuit lines on the textile carrier outside the 20 base can be designed as direct connections with an unchanging 1 : 1 relationship or can be made variably selectable via a selection switching element.

[0120] In a second aspect of the invention, the electronic circuit in a section rigidly connected to the textile carrier comprises a selection switching device 25, by means of which one of several circuit lines outside the base can be selected for one or more contact surfaces of the contacting module and electrically connected to the respective contact surface. Such a selection switching element 2600, for example a multiplex switching element, makes it possible to select the contact surfaces of the contacting module i0-09-2025-4363440i-Hauptpost-0026 10“03“2025“43634401-HauPt P during operation of the circuit Osi“0026 PCT / DE2025 / 000091

[0121] 14 and the circuit lines outside the socket can be variably selected and thus connected in a larger number overall.

[0122] This is of practical importance, because the electronic circuit will be on

[0123] 5. If the device is worn on the body via a textile carrier, the electronic module's mounting within the contact module must be mechanically and electrically robust, yet also capable of being manually disconnected by the user. Connectors typically designed for no more than 25 to 50 contacts are suitable for this purpose. In specific cases, connectors for up to 200 contacts are also used.

[0124] 10 contacts are used, but these are not suitable for manual disconnection and robust connection by a user in everyday use.

[0125] *****

[0126] Below, both aspects of the invention described above will be explained using several exemplary embodiments with reference to the accompanying figures.

[0127] 15 tert.

[0128] As shown in Figure 3B, the base body 2100 has an inner base bottom section 2150 and on its underside 2150U a lower cover 2800 with base cover section 2850. Viewed perpendicularly to the underside, the lower cover and the rest of the base can be identical or different.

[0129] 20 deviating outer contours; in particular, the lower cover can completely or only partially cover the underside of the remaining base. For example, in Figure 3A, the lower cover 2800 covers the underside of the remaining base 2100 only with its base cover section 2850. On the other hand, the lower cover can have one or more deviating outer contours of the remaining base.

[0130] 25 projecting section(s), as shown for example in Figure 2.

[0131] The base cover section 2850 is bonded to the underside 2150U of the inner base bottom section 2150 in a planar and material manner. In the embodiment shown in Figure 3B, this planar and material bond between the inner base bottom section and the base cover section according to the invention is shown in the -09-2025-43634401 -Hau ptpost-0027 lÖ-Ö3"2025-43634401-HauPtPos t-0027 PCT / DE2025 / 000091

[0132] 15. In the part of the base shown on the left, the connection is direct; in the middle and right parts of the base, the planar and material connection is made via intermediate layers 2510, which are connected planarly to adjacent surfaces on both sides (i.e. upwards and downwards in Figure 3B).

[0133] 5 In these intermediate layers 2510 are the conductor track sections 2511, 2512, 2513 for the electrical connection between the circuit lines 4000 outside the socket and the electronic module 3000 in the predetermined position in the contacting module. For this purpose, the conductor track sections are connected at their ends closest to the predetermined position via through-holes 2550 through the in¬

[0134] 10 through the inner base section 2150 upwards to the contact surfaces 2101, 2102, 2103 of the contacting module, and at their ends furthest from the predetermined position to circuit leads 4000 of the electronic circuit on the textile substrate. These leads can be permanently attached to the material or detachable.

[0135] 15 The base, which is bonded to the textile support in a form-fitting and material-locking manner, has a stiffening effect on the latter. As schematically illustrated in the figures for the implementation examples, it is advantageous if the thickness of the base decreases upwards (in the z-direction) and outwards (in the x and y directions, adapted to the circuit leads) and its elasticity increases. This outward increase

[0136] 20. Elasticity can be promoted by suitably shaped cavities and outwardly tapered (in the x and y directions) ribs inside the base and / or by using different base materials with outwardly increasing elasticity (in the x and y directions) (not shown in the figures). Outwardly increasing elasticity is advantageous to accommodate different base stiffnesses.

[0137] 25 and the textile support should transition into each other as smoothly as possible, and a buckling of the textile support and especially of the circuit lines lying flat against it at the edge of the base should be avoided.

[0138] In the implementation example shown in Figure 2, the surface and material connection between the inner base floor section and the base cover section is achieved.

[0139] 30 in the middle and left part of the base drawn on both sides (i.e. -09-2025-43634401 -Hau ptpost-0028 10-09-2G25-43634401 -Hau t Pos -0Ö28 PCT / DE2025 / 000091

[0140] 16 upwards and downwards) are connected to adjacent surfaces by intermediate layers 2510, and the conductor track sections contained therein are electrically connected to circuit lines 4000 shown on the left of the drawing outside the socket. In the right part of the socket, in the area between

[0141] 5. Between the inner base floor section and the base cover section, the selection switching device 2600 is provided, with which one of the circuit lines shown on the right can be selected and electrically connected outside the base for the contact surface(s) of the contacting module shown on the right.

[0142] 10 The selection switching device 2600 can, for example, be designed as an analog or digital multiplex circuit and implemented using a silicon-based component. In such a case, the arrangement in the base of the contacting module, for example between the inner base bottom section and the base cover section, allows for a compact design of the component.

[0143] 15 timing modules, without otherwise noticeably impairing the textile feel of the carrier. In such an arrangement, the planar and material connection between the inner base floor section and the base cover section is interrupted by the silicon-based building block via intermediate layers that are planarly connected to adjacent surfaces on both sides, and only in

[0144] 20 a region excluding – and preferably enclosing – this is possible. With this in mind, in the embodiment shown in Figure 2, the lower cover 2800 is chosen to be sufficiently large.

[0145] Figures 4A and 4B show, as a third embodiment, a contacting module in which the base is located above the textile carrier 1000 along an angle.

[0146] 25 The connection direction x of the contacted conductor tracks is extended by an upper connection section 2900 – preferably single-sided. This is positively and materially bonded to the textile substrate and has a stiffening effect on it. Preferably, its thickness decreases upwards (z-direction) along the connection direction outwards and its elasticity increases. On the upper connection

[0147] 30 end section 2900 opposite lower side of the textile carrier 1000 -09-2025-43634401 -Main ptpost-0029 10-09- 2025-43634401-Main tPos t-0029 PCT / DE2025 / 000091

[0148] 17 The lower cover 2800 is also extended along the connection direction. A selection switching device 2600, for example in the form of a silicon-based component, is arranged between the lower cover and the textile carrier in the area of ​​the base extended along the connection direction.

[0149] 5 Such an extension of the base along the connection direction with outwardly increasing elasticity is also advantageous, independent of the space gained for arranging the selection switching device, in order to ensure that the different stiffnesses of the base and the textile support transition into one another as smoothly as possible along the connection direction and to prevent kinking of the circuit leads at the edge of the base.

[0150] To avoid 10 ckels.

[0151] Alternatively, and independent of the base design, the selection switching device itself can be designed – wholly or partially – as a circuit lying flat against the textile substrate; in particular, for example, transistors of the selection switching device can be designed as printed electronics and under

[0152] 15. The use of suitable printing inks, including those which exhibit electrically semiconducting properties after printing and / or heat treatment, is permitted. In such a case, the selection switching device can be designed as a printed layer system with intermediate layers that are bonded to adjacent surfaces on both sides, and it can be manufactured without significant impairment.

[0153] 20. Impairment of the textile haptics of the carrier, both inside and outside the base of the contacting module.

[0154] From these considerations it becomes clear that both aspects of the present invention mentioned at the outset can be realized both together and separately, and that the aforementioned problems of the present invention can be achieved.

[0155] 25. The problem can be solved by both aspects of the present invention.

[0156] Numerous other features shown in the drawings of the three embodiments described above are optional and can be configured alternatively. For example, in the first three embodiments, plug connectors are provided for the electrical connection between contacts 3101, 3102, and 3103 of the -09-2025-43634401-Hauptpost-0030 10“09”2Ö25“43634401~HauP t Pos t~0030 PCT / DE2025 / 000091

[0157] - 18 -

[0158] The electronic module and the contact surfaces 2101, 2102, 2103 of the contacting module are provided, in which the contacts of the electronic module are designed as male elements of a connector, i.e., as protruding pins, and the contact surfaces of the contacting module are designed as female elements of a connector for receiving such pins. Alternatively, the contact surfaces of the contacting module can be designed as protruding pins to be connected to corresponding contacts of the electronic module via plug connectors (not shown). Frictional forces between protruding pins and contact surfaces designed as female elements for receiving the pins contribute significantly to the mechanical cohesion of the electrical connections.

[0159] According to a third aspect of the present invention, instead of plug connections, electrical pressure connections are used, in which the contact surfaces of the contacting module and the contacts of the electronic module are pressed against each other using elastic material and thereby brought into electrical contact with each other. The mutual pressure between the contact surfaces of the contacting module and the contacts of the electronic module is substantially perpendicular, i.e., the mutual pressure forces are directed at least 50%, preferably at least 90%, in a direction perpendicular to the mutual contact surface.For example, a sol- 20 rather pressure can be produced by the fact that the cover 2200 is in contact or integral connection with the electronic module 3000 in the z-direction above the electronic module 3000 and is elastically designed and the electronic module 3000 presses with its contacts against the contact surfaces of the contacting module.

[0160] 25 Unlike plug connections, such electrical pressure connections do not contribute to the mechanical cohesion of the connection between the contact module and the electronic module and can be disconnected and reconnected without friction, because the mechanical cohesion of the connection is separate from the electrical connection. Such a separation is particularly advantageous 30 when a large number of electrical connections are made by a user -09-2025-43634401 -Hau ptpost-0031 10-03-2025-43634401 -HauP t Po s -0031 PCT / DE2025 / 000091

[0161] 19 connections should be easy and robust to disconnect and reconnect. This allows the user to be provided with a mechanical connection suitable for easy and robust disconnection and reconnection, the functionality of which (including wear) is independent of the number of connections.

[0162] It has 5 electrical connections.

[0163] Plug connectors can also be used in combination with pressure connectors, for example with plug connectors at the outer corners or edges of a field of pressure connectors, in order to combine the advantages of plug connectors.

[0164] To combine 10 connections (simple and robust positioning of the modules to be connected, as well as a connection supported and stabilized by friction forces) with the advantages of pressure connections (ease of use when disconnecting and reconnecting, regardless of the number of electrical connections). When combining plug connections with pressure connections, the requirements can be met.

[0165] 15 changes to the elastic properties of the elastic material used can be reduced.

[0166] In principle, the elastic material can be used in the contacting module and / or in the electronic module to be contacted, preferably on both sides of the contact connection, as explained below with examples.

[0167] Figures 5A, 5B and 5D show examples of some base configurations designed for electrical pressure connections with electrically conductive contact surfaces 2101, 2102, 2103 facing the predetermined position of the electronic module, which can be essentially flat, convex or concave. These contact surfaces 2101, 2102, 2103 can be equipped with an electrically conductive and

[0168] 25 equally elastic material and / or formed with an outer layer of electrically conductive and simultaneously flexible material and backed with an elastic material. And regardless of their elastic properties, they can be made using elastic

[0169] 30 table-acting pressure contacts, for example in the form of metallic conductive spring contacts (pogo pins) with pressure in the direction -z (of the predetermined -09-2025-43634401 -Hau ptpost-0032 10-09- 2025-43634401 -HauP Pos -0032 PCT / DE2025 / 000091

[0170] 20

[0171] Position of the electronic module (away direction) in electrical pressure connections with the electronic module (not shown).

[0172] Figures 5A to D show exemplary arrangements. In each figure, the base body 2100 with its inner base floor section 2150 is separated from the lower part of the

[0173] 5 contacting module with the lower cover 2800 and the intermediate layers 2510 with the electrically conductive conductor track sections 2511, 2512, 2513 are shown separated for illustrative purposes, whereas according to the first aspect of the invention, the inner base bottom section is connected on its underside in a planar and material-bonded manner to a section of the lower cover and this connection

[0174] 10 bonding which contains one or more intermediate layers that are connected to neighboring surfaces on both sides.

[0175] Figure 5A shows an example of a base design with through openings 2161, 2162, 2163 in the inner base base section 2150, through which conductor track sections in the intermediate layers 2510 between the inner base base section and

[0176] 15 the base cover section on whose sides facing the predetermined position are accessible and serve there as contact surfaces 2101, 2102, 2103 of the contacting module.

[0177] This base design with open passageways is characterized by the simplicity of its construction and the required manufacturing steps. White

[0178] 20. Furthermore, the lower cover can be made of an elastically deformable material, which is not only advantageous for the elastic backing of the conductor track sections serving as contact surfaces for the electrical pressure connections with the electronic module, but also enables the aforementioned advantages when wearing the electronic circuit on the human body, if

[0179] 25 the base together with the textile support can adapt to the shape of the body.

[0180] Figure 5B shows an example of a different base design, namely with electrically conductive sections 2151, 2152, 2153 in the inner base bottom section, which are connected on their underside facing away from the predetermined position with the -09-2025-43634401 -Hau ptpost-0033 10=09= 2025-43634401 -Ha UP tp os =0033 PCT / DE2025 / 000091

[0181] 21

[0182] conductor track sections are connected between the inner base bottom section and the base cover section, and their upper surfaces facing the predetermined position serve as contact surfaces 2101, 2102, 2103 of the contacting module.

[0183] 5 Such conductive sections in an inner base bottom section can be produced, for example, by using for the inner base bottom section a material such as common 3D printing materials whose electrical conductivity in an initial state corresponds to that of an electrical insulator, but at the locations of the electrically conductive sections 2151, 2152, 2153

[0184] 10 can be increased by additive treatment with conductive particles. Preferably, the electrically conductive sections can consist of silicone or polymers and be made conductive by adding silver, PEDOT, or "carbon black". In such a case, both the shape and the elastic properties of the contact surfaces of the contacting module correspond to those

[0185] 15. The material of the inner base section is added after the addition of silver flakes or silver wires. For example, the electrically conductive sections can be produced by a direct printing process and can be in the form of a 3D filament or a viscous liquid. In the case of non-flexible pins, materials such as PLA or ABS can also be used.

[0186] 20

[0187] Different shapes and / or elastic properties of the contact surfaces of the contacting module can be achieved, for example, by providing open passage openings in an inner base section made of electrically non-conductive material as shown in Figure 5A and fully or partially encasing them.

[0188] 25 are filled with an electrically conductive material (possibly after post-treatment) so that electrically conductive sections 2151, 2152, 2153 are formed with the conductor track sections between the inner base bottom section and the base cover section. The material used for the formation of these conductive sections can be applied to the contact surfaces of the contacting

[0189] 30 modules give a different, preferably higher elasticity than those of the material of the inner base floor section. 10-09-2025-43634401 -Hau ptpost-0034 10-09- 2025-43634401 -HauP t Pos t -0034 PCT / DE2025 / 000091

[0190] - 22 -

[0191] The shape of the contact surfaces 2101, 2102, 2103 on the upper surface of the electrically conductive sections 2151, 2152, 2153 facing the predetermined position can also differ from the shape of the surrounding upper surface of the inner base bottom section. For example, the contact surfaces can be convex and project beyond the surrounding upper surface of the inner base bottom section towards the predetermined position in order to make contact with flat contacts of the electronic module, or the contact surfaces can be recessed behind the surrounding upper surface of the inner base bottom section so that, when the electronic module is inserted into the contacting module, the inner walls of the partially filled openings can serve as lateral guides for the contacts of the electronic module.

[0192] In one embodiment, a foam-forming material can be used to create the conductive sections, which, in its solidified foam form 15, exhibits higher elasticity than the corresponding bubble-free material. As illustrated by way of example and schematically in Figure 5C, when producing such electrically conductive sections in foam form, a foam-forming material SBM in a pre-foaming state can be brought into contact with the conductor track sections in the intermediate layers 2150 between the inner base bottom section 20 and the base cover section.An inner base plate provided with open passage openings 2161, 2162, 2163 and brought into a suitable position can then be used to shape the foam during foam formation, so that the foam formation is directed towards the interior of the passage openings and in this way electrically conductive sections 2151, 2152, 2153 are formed in the inner base plate section.

[0193] And if, as shown by way of example and schematically in Figure 5D, the volume of such electrically conductive sections 2151, 2152, 2153 formed with foam is greater than the volume of the through-openings 2161, 2162, 2163, then this larger volume protrudes in a convex form at the ends 30 of the through-openings facing the predetermined position in front of the top surface of the surrounding inner base section 2150. In this way, the shape of the -09-2025-43634401 -Main post-0035 10-09-2025-43634401 -Main post -0035 PCT / DE2025 / 000091

[0194] 23

[0195] Contact surfaces 2101, 2102, 2103 on the upper side of the electrically conductive sections 2151, 2152, 2153 facing the predetermined position protrude above the upper side of the inner base floor section 2150 surrounding them.

[0196] Finally, figures 5A and 5B also show, with regard to the material-bonded connection-

[0197] 5. Connection between the textile support and the base; alternatively designed base configurations. In the embodiment shown in Figure 5B, the textile support 1000 rests against a substantially smooth underside of the inner base, and the shapes of the lower cover and the conductor-carrying intermediate layers follow the resulting stepped height profile in the z-direction.

[0198] 10 Such an arrangement offers greater freedom in the xy-plane when joining the base and textile support during the manufacture of the circuit according to the invention. In the embodiment of Figure 5A, however, the inner base has a circumferential recess 2200 in an edge region of its underside for receiving the textile support, so that the inner base and the tex-

[0199] 15 tile carriers form an essentially smooth common underside, which allows for a correspondingly smoother height profile of the lower cover, lower requirements for the thickness and stability of the conductor-carrying intermediate layers, and a higher density of electrical connections through the inner base floor section.

[0200] Figures 6A and 6B schematically show a fourth embodiment of a contact module with three connection directions. A contact module with multiple connection directions may be dictated by the geometry of the electronic circuit as a whole. For example, if, in the embodiment shown in Figure 1B, the position of the contact module is predetermined at the midpoint of a trouser leg,

[0201] 25. Thus, two connection directions (+x and -x) of the contacting module enable short connection paths to the circuit elements 4500.

[0202] Furthermore, multiple connection directions are advantageous when the area density of adjacent conductor tracks limits the number of connections that can be made. For example, if an arrangement of

[0203] 30 connections through the base plate with adjacent conductor tracks in -09-2025-43634401 -Hau ptpost-0036 10-09-2025-43634401 “Hau P Pos t=0036 PCT / DE2025 / 000091

[0204] - 24 - If conductors of the same plane and with the same connection direction are connected, the total width of the adjacent conductor tracks and their grid spacing limits the number of connections that can be made through the base plate from this connection direction. If the grid spacing of the adjacent conductor tracks is, for example, 1 mm, then a maximum of 20 connections can be made through the base plate from one connection direction over a total width of 2 cm. If a larger number of connections are to be made, connections via conductor tracks from more than one direction and / or in multiple planes are required.

[0205] 10 In all illustrated embodiments, the predetermined position P of the electronic module 3000 and the circuit lines 4000 with the conductor tracks 4100 lying flat against the textile carrier are located on opposite sides of the textile carrier, and the electrically connecting change of the electronic circuit from one side to the other of the textile carrier is effected by an opening-

[0206] 15. Installation of the textile support in the area between the inner base floor 2150 and the base cover section 2850.

[0207] Figures 7A and 7B show an alternative arrangement as a fifth embodiment of a contacting module. Here, the inner base bottom section 2150, the base cover section 2850, and the intermediate layers 2510 and 20 with the electrically conductive conductor track sections 2511 are located on the same (upper)

[0208] The side of the textile carrier 1000 corresponds to the predetermined position of the electronic module with the contact surfaces 2101, 2102, 2103 of the contacting module and is bonded to one another. On this upper side of the textile carrier, the base is extended along the connection direction x by an upper connection section 2900 – preferably in one piece. Furthermore, the lower cover 2800 extends along the connection direction x over the base cover section.

[0209] 2850 is extended by a lower connection section 2880, and adjacent to the lower cover 2800 are the intermediate layers 2510 with the electrically conductive conductor track sections 2511 along the connection direction

[0210] 30 through a (first) connecting section (2580) with electrically conductive -09-2025-43634401 -Hau ptpost-0037 10-09“2025“43S34401“HauP tPos t-0037 PCT / DE2025 / 000091

[0211] 25

[0212] Layers 2581 extended. The electrically connecting change of the electronic circuit from the upper to the lower side of the textile carrier is effected through an opening in the textile carrier in an area below the upper connection section 2900. Preferably, the lower connection section and the base cover are

[0213] 5. The ing section is formed in one piece.

[0214] This arrangement can be produced, for example, by forming the lower cover 2800 as a film, for example TPU film, and placing the intermediate layers 2510 with the electrically conductive conductor sections 2511 and the connecting section 2580 with electrically conductive layers 2581 on it under Ver-

[0215] 10. The application of additive manufacturing processes, in particular printing processes of “Printed Electronics”, is carried out, wherein the layer structure and the manufacturing steps required for this, including post-treatment with the application of heat and / or pressure, for the (first) interconnection section 2580 with the electrically conductive layers 2581 and for the intermediate layers 2510 with the

[0216] The 15 electrically conductive conductor track sections 2511 can be the same. If the inner base section 2150 and the upper connection section 2900 are made of a suitable thermoplastic material, they can also be bonded in the same post-treatment step to the film used as the lower cover 2800 and the layers 2510 and 2580 printed on it.

[0217] 20 will be. One advantage of this arrangement and the associated manufacturing process is that essential components of the base 2100 of the contacting module 2000 can be manufactured and assembled separately from the textile carrier.

[0218] Furthermore, and regardless of the previously described characteristics, regarding electrical

[0219] Figures 7A and 7B show a fourth aspect of the present invention: 25 connecting changes of the electronic circuit from the upper to the lower side of the textile carrier:

[0220] If the conductor track sections 2511 between the base cover section (2850) and the inner base bottom section 2150 are applied to the foil, for example

[0221] 30 TPU films, formed bottom cover printed 2800, so they are located on -09-2025-43634401 -Hau ptpost-0038 10-03-2025-43634401 -HauP t Pos t -0038 PCT / DE2025 / 000091

[0222] 26 the side facing the predetermined position, i.e. in the arrangement of the first embodiment shown in Figures 1 and 2 on the side facing away from the body in the direction +z.

[0223] Is the electronic circuit on the tex¬ - as in the first example?

[0224] 5. The textile carrier is designed to be worn on the human body, and essential parts of the circuit are located on the inside of the textile carrier facing the human body. Underneath these essential parts are conductor tracks 4100 lying flat against the textile carrier and associated circuit elements 4500 also lying flat against the textile carrier, such as those for the human body.

[0225] 10 electrically conductive electrodes are used; therefore, in the interest of stable circuit operation, it is advantageous to provide an insulating layer between the textile support and the adjacent conductor tracks 4100 and circuit elements 4500. In particular, an electrically insulating thermoplastic film, for example TPU film, can serve as such an insulating layer.

[0226] 15 conductive traces 4100 and circuit elements 4500 are printed, post-treated by applying heat and / or pressure, and in this – or a separate – step are bonded to the textile substrate. In such a case, the conductive traces are located on the side facing the body in the direction -z.

[0227] 20 As a result, the conductor track sections of the contacting module printed on the lower cover 2800 and the conductor tracks of the circuit lines printed on the insulating layer are located outside the contacting module on opposite sides of a printed film and are electrically connected according to the fourth aspect of the present invention as shown by way of example in Figure 7.

[0228] 25 connected:

[0229] The electrical connection of the conductor track section 2511 between the base cover section 2850 and the inner base bottom section 2150 with a conductor track 4101 outside the base comprises (at least) the aforementioned first connection lying flat against the lower connection section 2880.

[0230] 30 section 2580 with the electrically conductive layer also mentioned above -09-2025-43634401 -Hau ptpost-0039 10-08-202E-43634401 -HauP* Pos -0038 PCT / DE2025 / 000091

[0231] 27

[0232] 2581, and the circuit line 4000 with the conductor track 4101 outside the base comprises (at least) a second connecting section 4200 lying flat against the textile support with an electrically conductive material 4201.

[0233] The vertical projections (in the z-direction, P2 in Figure 9B) of the electrically conductive

[0234] The 5-layer 2581 of the first connection section and the electrically conductive material 4201 of the second connection section overlap in an overlap area R on the side of the textile carrier 1000 facing them; furthermore, the electrically conductive layer 2581 of the first connection section and the electrically conductive material 4201 of the second connection section are

[0235] 10 sections are electrically connected to each other via a contact connection K, and the perpendicular projection of the contact connection onto the side of the textile carrier facing it is contained in the overlap area.

[0236] In this overlap and contact area R and K, there is a change of printed sides between the side of the lower cover facing away from the body and

[0237] 15 of the body-facing side of the insulating layer.

[0238] The fourth aspect of the present invention described above is not limited to the arrangement of the fifth embodiment shown in Figures 7A and 7B. Figure 7C shows an alternative arrangement. For example, if the printed lower cover 2800 is a lower connecting section 2880

[0239] If a 20-marked, defonable film is used, a change of the printed sides between the body-away side of the lower cover and the body-facing side of the insulating layer can also be effected by the lower connection section 2880 of the printed film being laterally offset in the connection direction (x) to the penetrations through the inner base floor

[0240] 25. An opening is made in the textile carrier and folded over in the opposite direction on the side opposite the base. Compared to the arrangement in Figure 7B, this arrangement is particularly advantageous if circuit elements facing the body are to be arranged and contacted under or near the base. -09-2025-43634401 -Main post-0040 10-09- 2025-43634401 -Main post -0040 PCT / DE2025 / 000091

[0241] 28

[0242] As a further development of the fifth embodiment, Figures 8A and 8B show, as a sixth embodiment, a contacting module with two connection directions and a reversal of the conductive layers when connecting to the further circuit.

[0243] 5 The electrical connection of the conductor track section 2511 between the base cover section 2850 and the inner base bottom section 2150 with a conductor track 4101 outside the base comprises here – on the left and right sides respectively – the first connection section 2580, which lies flat against the lower connection section 2880, with the electrically conductive layer 2581, and the

[0244] 10. Circuit line 4000 with conductor track 4101 outside the base comprises – on both the left and right sides – the second connection section 4200, which lies flat against the textile carrier and contains the electrically conductive material 4201. In this embodiment as well, the vertical projections P2 of the electrically conductive layer 2581 of the first connection section overlap.

[0245] 15 and the electrically conductive material 4201 of the second connection section onto the side of the textile carrier 1000 facing them in an overlap area R. In addition, on the left and right sides, the electrically conductive layer 2581 of the first connection section and the electrically conductive material 4201 of the second connection section are connected via a contact connection K.

[0246] 20 electrically connected, and the perpendicular projection of the contact connection onto the side of the textile carrier facing it is included in the overlap area.

[0247] Figures 9A, 9B and 9C show, by way of example, a seventh embodiment, a fifth aspect of the present invention, namely a contact device

[0248] 25 rung module with several superimposed conductor tracks in its base.

[0249] According to this aspect of the invention, (in the example shown, three) conductor track sections 2511, 2512, 2513 are arranged in several stacked intermediate layers such that their vertical projections (PI in figure

[0250] 30 9A) overlap the underside 2150U of the inner base floor section 2150 10-09-2025-43634401 -Hau ptpost-0041 10-08-2025-43634401 -HauP -t Po s -00 1 PCT / DE2025 / 000091 and they are electrically isolated from each other in overlap areas by non-conductive intermediate layers (2516, 2517). In a preferred arrangement, a perpendicular projection onto the underside 2150U of the inner base floor section (at least) of a conductor track section 2511, 2512 in an intermediate layer 5 further away from the inner base floor section overlaps with an electrical connection 2153 running through the inner base floor section between a contact surface 2103 of the contacting module and a conductor track section 2513 in an intermediate layer closer to the inner base floor section.

[0251] 10. The arrangement with conductor track sections in several stacked intermediate layers is advantageous when a larger number of circuit lines are to be contacted. As can be seen conversely from the fourth embodiment explained in Figures 6A and 6B, it is advantageous if a larger number of circuit lines can be contacted in several stacked intermediate layers without being limited by the area density of 15 conductor tracks arranged side by side in one plane, and the number of connection directions can be freely selected.

[0252] Furthermore, it is advantageous if, similar to the embodiments shown in Figures 4 and 7, the base above the textile carrier 1000 is extended along a connection direction x of the contacted conductor tracks 4101, 4102, 4103 by an upper connection section 2900 – preferably in one piece – and this in turn is positively and materially connected to the textile carrier and has a stiffening effect on it. Preferably, the thickness of the connection section 2900 (in the z-direction) increases outwards along the connection direction 25 and its elasticity increases. On the lower side of the textile carrier 1000, the lower cover 2800 is also extended along the connection direction beyond the base cover section 2850 by a lower connection section 2880, and the intermediate layers 2510 with the electrically conductive conductor track sections are adjacent to the lower cover 2800.

[0253] 30 2511 to 2513 along the connection direction by a (first) -09-2025-43634401 -Hau ptpost-0042 10-09-2025- 43634401 -Hau P i P osi -0042 PCT / DE2025 / 000091

[0254] 30

[0255] The connecting section (2580) is extended with electrically conductive layers 2581 to 2583. Preferably, the lower connection section 2880 and the base cover section 2850 are formed in one piece.

[0256] The advantages of such an extension of the base along the connection line

[0257] 5. Stiffening with outwardly increasing elasticity has already been discussed elsewhere. In this case, stiffening along the connection direction is particularly advantageous, since multi-layered circuit lines are especially sensitive to kinking at the edge of the socket.

[0258] Figures 10A and 10B show, as the eighth implementation example, a contacting

[0259] 10 modules with several superimposed conductor tracks and a selection switching device in the layer system between the inner base bottom section and the lower cover. Similar to the embodiment shown in Figures 4a and 4B, the base is connected along a connection direction x above the textile carrier 1000 by an upper connection section 2900 - again before

[0260] 15 pulls in one piece - extended, and below the textile support 1000, the lower cover 2800 is also extended beyond the base cover section 2850 by a lower connection section 2880 to gain space for the arrangement of the selection switching device 2600. At the same time, not all connections of the selection switching device 2600 are necessarily subject to the example shown.

[0261] 20 bypasses the selection switching device by connecting conductors 2511 and 2581. To avoid repetition, please refer to the explanations in the description above.

[0262] Figures 11A to 11E show examples of further arrangements of a selection switching device in conjunction with several superimposed conductors.

[0263] 25 lanes. As can be seen directly from the figures, the selection switching device 2600 can, for example, be arranged in the following locations in the base:

[0264] Figure 11A: between the predetermined position (P) for receiving the electronic module (3000) and the inner base bottom section (2150), and / or -09-2025-43634401 -Hau ptpost-0043 10-09-2025-43634401 -Haukes i-0043 PCT / DE2025 / 000091

[0265] 31

[0266] Figure 11B+C: on the underside of the inner base floor section (2150) with openings or conductive sections in the inner base floor facing upwards for connection with the cavity H for receiving the electronic module, and / or

[0267] Figure 5 HD: in place of the inner base floor section (2150) below the cavity H to accommodate the electronics module.

[0268] Furthermore, the selection switching device 2600 can be used for connections in one or more connection directions (Figure HE: two connection directions).

[0269] Figures 12A and 12B show, as a ninth embodiment, an arrangement for a side reversal of several superimposed conductor tracks when connecting the contacting module to several superimposed conductor tracks in the further circuit.

[0270] For clarification, reference is made to the description of the fourth aspect of the present

[0271] 15. The invention is related to Figure 7 and the fifth embodiment. Unlike there, the base of the ninth embodiment is not extended above the textile support 1000 along the connection direction x. However, the lower cover 2800 extends in one piece along the connection direction x beyond the base cover section 2850 around the lower connection section.

[0272] 20 cut 2880 prolonged, resulting in a stiffening effect.

[0273] Figures 13A to 13G show, as a tenth embodiment, an arrangement for a side reversal of several superimposed conductor tracks of the contacting module when connecting to sections of the electronic circuit without superimposed conductor tracks.

[0274] Figure 13A shows a view of this arrangement from its underside. Visible are the base cover section 2850 and the lower connection section 2880 as components of the lower cover 2800 of the contacting module, as well as elements of the circuit lines 4000, connected to the lower -09-2025-43634401 -Hau ptpost-0044 10“09“2025-"43634401“Hau-P t Pos t-0044 PCT / DE2025 / 000091

[0275] 32

[0276] Connection section 2880 the second connection section 4200 with electrically conductive materials 4201, 4202 and 4203, which form downward-oriented conductor tracks, and subsequently downward-oriented conductor tracks 4101, 4102 and 4103.

[0277] Figure 13B shows a sectional view in an xz plane, with the conductor track sections 2511 to 2513 between the inner base base and the base cover section 2850 of the contacting module on the left half of the figure and the overlap and contact areas RI to R3 between the stacked electrically conductive layers 2581 to 2583 of the contacting module.

[0278] 10 and the electrically conductive materials 4201 to 4203 of the connecting section 4200, each separated from the textile support only by an insulating layer. As can be seen from this, the conductive layers 2583 and 4203, which are closest to the textile support in the x-direction and closest in the z-direction, overlap and contact each other in an overlap region R3 and

[0279] 15 end there. The two layers 2582 and 2581, arranged further away in the z-direction, extend in the x-direction over the overlap area R3. The conductive layer 2582, which is located closest to the textile substrate after the already contacted layer 2583 has been removed, overlaps / contacts in the nearest overlap area R2 with the nearest uncontacted conductive layer.

[0280] 20 gen layer 4202. The layer 2581, located furthest away in the z-direction, also extends across the overlap region R2 in the x-direction and overlaps / contacts as the only remaining layer of the contacting module with the furthest and only remaining conductive layer 4201 of the connection section 4200 in the overlap region RI. All layers of the con-

[0281] 25 timing modules are covered from below by the connection section 2880 and the socket cover section 2850.

[0282] Figures 13C to 13E are sectional views in yz planes through the electrically conductive materials 4201 to 4203 and show that in the present embodiment these are considered conductive layers, i.e. apart from the insulating layer(s),

[0283] 30 are arranged continuously at the closest point to the textile carrier. -09-2025-43634401 -Hau ptpost-0045 10-08=2025-4363440i"HauPi Pos i-G045 PCT / DE2025 / 000091

[0284] 33

[0285] Figures 13F and 13G show, in sectional views in xz planes and a top view in the -z direction of the lower cover, how this comparatively complex contacting arrangement of Figures 13A to 13E consists of a correspondingly printed lower cover, the remaining base and conductive materials.

[0286] 5 materials 4201 to 4203 printed foils of the connecting section 4200 can be produced, largely using the additive processes described.

[0287] Figures 13F and 13G illustrate a sixth aspect of the present invention, which has already been depicted in other figures but is not shown there.

[0288] As mentioned in Figure 10, this involves the formation of electrically conductive connections in the z-direction through several stacked layers in the area between the lower base section 2150 and the lower base cover section of the lower cover 2800. In this area (left area of ​​the layer structure on the lower cover 2800 in Figure 13F) electrically conductive connections are present.

[0289] 15 conductive connections through several stacked layers in the z-direction occur at high spatial density, and it is advantageous in this region if the number and thickness of the stacked layers do not vary or vary only slightly in order to avoid height differences in the z-direction of the layers as much as possible. Therefore, it is preferred if electrically conductive connections in this area are

[0290] 20 are richly formed by electrically conductive sections in stacked insulating layer environments. In the fabrication of such preferred layer structures using printed electronics methods, for example, through holes produced layer by layer in printed insulating layers are printed layer by layer.

[0291] 25 layers filled with (after post-treatment) electrically conductive material.

[0292] If, on the other hand, conductor tracks in different stacked layers are connected in the z-direction at a comparatively lower spatial density (right area of ​​the layer structure on the lower cover 2800 in Figure 13F), it is advantageous to use stacked electrically conductive and differently

[0293] 30 interconnected insulated layers in a stepped arrangement, in which the conductor tracks are in - -09-2025-43634401 -Main post-0046 iO“09-202E“436344oil“Main t PO S t— 0046 PCT / DE2025 / 000091

[0294] 34 to contact conductors of other layers at larger distances corresponding to the lower spatial density, whereby the overlap areas can be formed with larger extents and height changes in the z-direction due to the lower spatial density.

[0295] Figures 14A and 14B show a variant of the tenth embodiment, which differs in that the connecting section 4200 is formed from a continuous film printed with the conductive materials 4201 to 4203 side by side.

[0296] Figures 15A, 15B and 15C show schematic representations of circuits.

[0297] 10 on a textile carrier using the arrangements in the tenth embodiment and its variant, namely in Figure 15A in an external view and Figures 15B and 15C in corresponding internal views, i.e., the sides of the textile facing the body. In the present embodiments, the textile carrier is in each case designed as a flat textile 1000, which is equipped with fastening straps-

[0298] 15 is provided with 1100 and 1101 and can be kept in contact with the human body at certain body parts (for example, forearm or thigh) using fastening mechanisms such as Velcro fasteners 1150, 1151, 1160, 1161.

[0299] Figure 16 shows, as the eleventh implementation example, a circuit with a two-dimensional

[0300] 20 sional field (, array) of M x N circuit elements. Similar to the tenth embodiment, the textile carrier 1000 is a flat textile provided with fastening straps and closure mechanisms, shown in a schematic drawing. Figure 16A is an inside view, i.e., the side of the textile facing the body, looking towards the outside (+z). The lower electronic circuit is shown.

[0301] 25 Cover of the contacting module with base cover section 2850 and lower connection section 2880 in the connection direction (here in the -x direction, downwards in the figure), as well as the array of circuit elements 4500 with associated conductor tracks 4100 lying flat against the textile carrier, which are drawn as simple lines in this representation. The present is the

[0302] 30 Array a rectangular field of MxN circuit elements 4500 with M columns -09-2025-43634401 -Hau ptpost-0047 10-09-2025-43634401 -Hau? PQ s -0047 PCT / DE2025 / 000091

[0303] 35

[0304] (parallel to the connection direction, numbered with running index m from 1 to M) and N rows (numbered perpendicular to the connection direction with running index n from 1 to N), shown as an example as 30 circuit elements in M=5 columns and N=6 rows.

[0305] Figure 16B shows, from the same viewing angle, a projection into the xy-plane of the electrical connections from the circuit elements (shown here as dotted lines) via conductor tracks 4100 lying flat against the textile substrate and electrically conductive layers of the connection section 2580 to the through-holes 2550 through the inner base section in the +z direction to the contact surfaces for connecting the electronic module at the predetermined position. The conductor tracks are distributed over several layers stacked in the z direction and are electrically insulated from each other and from the circuit elements they overlap. Reference drawings 11 and M1 exemplify the conductor tracks to the circuit elements (m=l, n=l; in the upper left of the field).

[0306] 15 and (m=M, n=l ; in the field at the top right).

[0307] Figure 16C shows, from the same viewing angle, an enlarged view of the through-wires 2550 through the inner base section. In the present embodiment, each circuit element is connected to exactly one circuit wire; the number of through-wires therefore corresponds to that of the circuit.

[0308] 20 elements. Furthermore, the MxN through-lines 2550 are also arranged in an array, here a rectangular field with M columns (numbered with running index m from 1 to M) and N rows (numbered with running index n from 1 to N). The arrangements of the through-lines 2550 and the circuit lines 4100 connected to them are oriented oppositely to each other; for example, the circuit element 4500 in the upper left (m=l, n=l) is connected to the through-line 2550 in the lower right, and the circuit element in the upper right of the field (m=M, n=l) is connected to the through-line in the lower left (m=M, n=l).

[0309] The opposing orientation of the leads to the circuit elements results from the path of the electrical connections. This is shown in the diagram.

[0310] Figure 16D shows a sectional view of the embodiment in an xz-plane through -09-2025-43634401 -Hau ptpost-0048 10-0S“2025“43634401“HauPtPos t -0048 PCT / DE2025 / 000091

[0311] 36 the markings S 1ST in Figure 16B and by the connections with m=l in Figure 16C. In this view, the connection located at the top in the z-direction and furthest to the left in the x-direction is assigned the row index n=l and labeled 11. It leads to the connection with m=l and n=l. Connections with m>l

[0312] 5 (to the left of S 1 S 1' in Figure 16B and to the left of m=l in Figure 16C) are located in the z-direction in the same plane as n=l, i.e. in the viewing direction of Figure 16D behind the connection labelled 11, i.e. below the image plane.

[0313] The path of the connections in the xy-plane is shown in Figure 16E. In the array of MxN switching elements, there are row-wise (i.e., for M switching elements with

[0314] 10 (each with the same row index n) each have a group of M adjacent conductor tracks 4100 running transversely to the connection direction, which are connected to M lines of the connection section 2580 along the connection direction and are arranged in different planes (one above the other in the z-direction) for different rows (different n). In each plane / row, the longest connection is the one-

[0315] 15. The shortest connection is for the switching element with column index m=l, the shortest connection being the one for m=M. This explains the oppositely oriented arrangement of the leads to the circuit elements with respect to column index m.

[0316] The arrangement of the lines of connection section 2580 in various

[0317] The 20 levels for different rows (different n) are also visible in Figure 16D. The row with row index n=l has the shortest connections, the row with row index n=N has the longest connections. This explains the oppositely oriented arrangement of the through-lines 2550 to the circuit elements 4500 with respect to the row index n.

[0318] Figure 16F shows a sectional view of the embodiment in a yz-plane through the markings S2S2' in Figure 16B through the connection 11 to the switching element n=l and m=l. Similar to Figure 16D, connections with m>l (above S2S2' in Figure 16B and to the left of m=l in Figure 16C) are located in the z-direction in the same plane as n=l, i.e., in the viewing direction of Fi-

[0319] 30 gur 16D behind the connection marked 11. -09-2025-43634401 -Hau ptpost-0049 10-09-2025-43634401 -H a uf - >ost -0048 PCT / DE2025 / 000091

[0320] 37

[0321] This figure shows, as an example of the connecting line of the circuit element 1 designated “11”, the electrically conductive connection between the conductor track 4100 lying flat against the textile perpendicular to the connection direction and the electrically conductive layer of the connecting section 2580 along the connection line.

[0322] 5. Direction of closure. In this embodiment, the conductor track 4100 adjacent to the textile and the electrically conductive layer of the connecting section 2580 are not arranged in the same layer plane, but overlap in a region R when viewed in the z-direction (perpendicular to the inside of the textile facing the human body, projection direction P in Figure 16F) and are in contact.

[0323] 10 contact and electrically conductive contact K arranged. Such a contact and electrically conductive contact in an overlap area has already been shown and explained by way of example in Figure 13E.

[0324] Figures 16G and 16H show, for the present embodiment, a construction of the lower cover 2800 with the base cover section 2850 in the

[0325] 15 upper image area and the connection section 2880 extending in the connection direction, i.e. downwards in the figure, with the electrically conductive layers of the connection section 2580, which are stacked in multiple layers. In order to enable overlapping contact with the conductor tracks 4100 in contact with the textile, the electrically conductive layers of the

[0326] 20 connection sections layer by layer at the ends to be contacted by overlapping the stacked arrangement in a lateral direction different from the connection direction (in Figure 16G to the left, in -y direction) towards the conductor tracks 4100 to be contacted on the textile.

[0327] Such a comparatively complex structure can be created using additive manufacturing processes.

[0328] 25 “Printed Electronics” are manufactured, for example, by first printing the electrically conductive layers of the interconnection section distributed across a plurality of films and then connecting them to each other and optionally to the lower cover 2800 in a stacked arrangement. Figure 16H schematically shows a plurality of such components for the eleventh embodiment, each with

[0329] 30 conductive layers of printed foils side by side. -09-2025-43634401 -Hau ptpost-0050 10-G9-2G25-43634401 -Hau Ptöos -t-0050 PCT / DE2025 / 000091

[0330] 38

[0331] Regardless of the details of the eleventh embodiment, when manufacturing multiply stacked layer structures using additive manufacturing processes of "printed electronics", it is advantageous if the electrically conductive layers of the interconnection section are first printed on several films and then

[0332] 5. The printed films are stacked and joined together. If the "Printed Electronics" process uses printing inks that require post-treatment with heat and / or pressure to achieve the desired electrical properties, suitable thermoplastic properties can be selected for the films to be printed.

[0333] 10. By applying heat and / or pressure in the same step, both the post-treatment of the printing inks and the material bonding of the printed and stacked films to each other and, optionally, to adjacent surfaces can be achieved. Furthermore, suitable mechanical, in particular elastic, and electrical properties can be selected for the films to be printed.

[0334] 15 For example, TPU films are simultaneously thermoplastic, elastic, and electrically insulating, with harder materials tending to exhibit higher electrical resistances. If electrically conductive layers stacked on top of each other in several levels are to be electromagnetically shielded, the films to be printed can also be designed with a corresponding shielding function, at

[0335] 20 may be provided with electrically conductive shielding layers.

[0336] Similar to the eleventh embodiment, Figure 17A shows a twelfth embodiment with a circuit with a two-dimensional field (, rray”) of M x N circuit elements 4500 with M columns (parallel to the connection direction (-

[0337] 25 x) and numbered with running index m from 1 to M) and N rows (perpendicular to the connection direction (-x) and numbered with running index n from 1 to N), shown by way of example as 30 circuit elements in M=5 columns and N=6 rows, of which the circuit element Ml is located at the top right and the circuit element IN at the bottom left. In contrast to the eleventh embodiment, however,

[0338] 30 Each circuit element is contacted with multiple lines, as shown in an enlarged example in Figure 17B for circuit element IN. In this -09-2025-43634401 -Hau ptpost-0051 10-09- 2025-43634401 -Haup POS -0G51 PCT / DE2025 / 000091

[0339] 39

[0340] In an exemplary embodiment, each circuit element is contacted with C (with running index c from 1 to C, drawn for C=3) conductors, of which the conductor tracks 4100 lying against the textile run parallel next to each other in the xy plane transversely to the connection direction and the electrically conductive layers of the connection section

[0341] 5 2580 run parallel to each other in the z-direction in the connection direction (downwards in the illustration).

[0342] Figure 17C shows, from the same viewing direction (perpendicular to the surface of the textile support in the direction of viewing from its inside to the outside), the passages 2550 through the inner base floor section for the twelfth embodiment.

[0343] 10 In this example, each circuit element is connected with C circuit lines, as shown for circuit element M1 (in Figure 17A in the array at the top right, in Figure 17C in the array at the bottom left). The total number of connections is therefore M x N x C, arranged in a rectangular array with M columns (numbered with running index m from 1 to M) and N x C rows (groups of M columns).

[0344] 15 row groups numbered with running index n from 1 to N, each consisting of rows numbered with running index c from 1 to C).

[0345] Similar to the eleventh embodiment and as explained there, the through-wires and circuit elements are oriented in opposite directions to each other. Furthermore, for each circuit element with a running index c from 1 to C, the arrangements of the through-wires are...

[0346] 20 gen 2550 and the arrangements of the circuit lines 4100 connected to them are oriented in opposite directions to each other, for example, in each circuit element the through-lines with running index c=l are arranged at the top in Figure 17C and the circuit line 4100 lying against the textile with running index c=l is arranged at the bottom in Figure 17B.

[0347] 25 This oppositely oriented arrangement of the through-wires results from the path of the electrical connections. Figure 17D shows a sectional view of this embodiment in an xz plane through the markings S1S1' in Figures 17A and 17C. In this view, the connection located at the top in the z-direction and furthest to the left in the x-direction is assigned the running index c=C and the -09-2025-43634401 -Hau ptpost-0052 10-Ö9-2Q25-43634401-HauP i P Q st -0Ö52 PCT / DE2025 / 000091

[0348] 40

[0349] The row index n=l is assigned and leads to the routing with m=l, n=l and c=C in the lower right of the field in Figure 17C.

[0350] Figure 17D further shows the layer structure of the electrically conductive layers of the connection section 2580, in this case comprising a group each

[0351] Five C electrically conductive layers (numbered with running index c from 1 to C) for each of the N circuit elements (numbered with running index n from 1 to N). For different circuit elements, the respective groups of C electrically conductive layers are separated from each other by intermediate layers "TS". These intermediate layers correspond to a process of "Printed

[0352] 10 Electronics” printed and stacked foils structure producible as explained in principle in connection with Figures 16G and 16H. In particular, these intermediate layers TS can possess the electrical properties explained therein; for example, electrically conductive layers of the connection section to various circuits can be created by these intermediate layers.

[0353] The 15 tungs elements must not only be electrically isolated from each other, but also electromagnetically shielded.

[0354] As can also be seen from Figure 17D, the electrically conductive layers of the connection section terminate at different positions in the connection direction (-x).

[0355] 20 contacts per circuit element (n from 1 to N) and per conductor (c from 1 to C) per circuit element at various positions, which enables contact of the conductor tracks 4100 lying against the textile with the parallel course shown in Figures 17A and 17B in the xy plane transverse to the connection direction. Details of an exemplary arrangement suitable for this purpose were described in connection with

[0356] 25 the tenth embodiment explained with reference to Figures 13 and 14.

[0357] *****

[0358] According to a seventh aspect of the present invention, the electronic circuit according to the invention on a textile substrate can further be designed to prevent incorrect insertion of the electronic module or confusion.

[0359] 30 to avoid when inserting an electronic module. -09-2025-43634401 -Hau ptpost-0053 I 0-GS-2025-43634401 -Hau® st -0053 PCT / DE2025 / 000091

[0360] 41

[0361] According to an initial development in this area, the circuit can contain a storage element permanently attached to the textile carrier, in which information that individually characterizes and preferably identifies the circuit is stored. Such a storage element can, for example, be an RFID module.

[0362] 5. be designed and read via wireless connection and / or be equipped as an electronic component with functional elements for bidirectional communication such as near-field communication (NFC). Such a storage element designed for wireless readout, such as an RFID module, can be equipped with features to facilitate its localization and wireless connection to the

[0363] 10 and / or be located in the base of the contact module, for example in its lower cover, or alternatively, the position of the storage element can be indicated by a visible marking on the textile carrier. Such individually typifying and preferably identifying information can, for example, be read and checked during commissioning of the circuit in order to verify

[0364] 15. To avoid changes when inserting the electronic module, for example when several electronic circuits according to the invention are in use on textile carriers with similar contact modules.

[0365] According to a second related development, two or more contact surfaces of the contacting module are located on the side of the circuit on the textile.

[0366] 20 carriers are electrically connected. By checking the electrical connection when commissioning the electronic module circuit, it can be determined whether the electronic module to be contacted is positioned in the predetermined location within the contacting module and whether correct electrical contact has been established.

[0367] According to a third related training course, two or more are required for

[0368] 25 Several circuits according to the invention are electrically connected to differently selected contact surfaces of the contacting module on the side of the respective circuit on the textile carrier in order to encode and store information that characterizes or identifies the electronic circuit by means of the different selection of the interconnected contact surfaces. By checking the respective

[0369] 30 ligen electrical connection during commissioning of the circuit can not only -09-2025-43634401 -Main Post Office-0054 10-09-2025-43634401 -H auP t P O S i -0054 PCT / DE2025 / 000091

[0370] - 42 - not only can it be recognized whether correct electrical contact of the electronic module has been made in the contacting module, but it can also prevent mix-ups when inserting an electronic module, for example when several identical electronic modules and / or several electronic modules according to the invention are used.

[0371] 5 circuits on textile substrates with similar contact modules are in use.

[0372] *****

[0373] In addition to the above explanations of manufacturing processes according to the invention, these are further illustrated by means of three exemplary manufacturing processes.

[0374] The process is described in section 10. In the production of material compounds, pressure and / or heat are preferably applied to the components to be joined.

[0375] Figures 18A and 18B show a flowchart and associated arrangement for a first exemplary manufacturing process.

[0376] As schematically shown in Figure 18A, in one step a) this is done at

[0377] In step 15, a textile with an opening (through hole) is provided using a playful manufacturing process. The opening is located at a point intended for the base of the contact module and has a shape designed for a planar connection of the upper and lower parts of the base through the opening. In step 1b), a printed circuit with printed electrodes and printed conductor tracks, produced using printed electronics methods on a carrier film (in the example, TPU film), is provided. In a step designated "Mating 1", the printed circuit provided in step 1b) and the textile provided in step 1a) are aligned relative to each other and bonded together planarly and materially, for example, by incorporating

[0378] 25 Pressure and / or heat.

[0379] In step 2a) of this exemplary manufacturing process, a lower cover printed with a circuit is provided, which, in particular on its side facing the electronic module to be contacted, is prepared by means of the process -09-2025-43634401 -Hau ptpost-0055 10=ö9-2025“43G34401 “Hau® tPos t-OOS5 PCT / DE2025 / 000091

[0380] 43 printed electronics with conductive traces are printed and, as a result, are formed, for example, as a printed TPU film. In a step called "Mating 2", the printed circuit provided in step 2b) on the lower cover and the circuit bonded to the textile in step "Mating 1" are bonded over the entire surface.

[0381] 5. Printed circuit 1 is aligned in a way that overlaps relative to each other, and the lower cover and the textile are connected to each other over a surface, preferably with material, and in particular electrically, for example by applying pressure and / or heat. The overlapping connection creates a printed circuit facing the electronic module to be contacted within the contacting module.

[0382] 10 a printed circuit facing away from the electronic module to be contacted, with conductor tracks lying flat on the textile, and thus two parts of the circuit that can be produced using printed electronics methods are electrically connected to each other on opposite sides of the respective carriers.

[0383] In step 3a) of this exemplary manufacturing process, a So¬

[0384] 15 ckelelement with through holes or conductive sections in the base is provided as an inner base, which – as explained for Figure 5A – has a circumferential recess on its outer lower edge that matches the opening in the textile and its thickness. In a step designated as “Mating 3”, the printed circuit on the lower cover, which is already coated with the

[0385] 20. The textile and the associated printed circuit are connected, with the holes or conductive sections of the base aligned relative to each other, then the lower cover is connected to the inner base through the opening in the textile, as well as an area surrounding the opening in the textile, to the base on a surface connection with the textile.

[0386] 25 formed base surface, preferably bordering the inner base floor, in a flat, preferably form-fitting, and materially connected, again for example by the introduction of pressure and / or heat.

[0387] The steps labelled "Mating" each include a) a mutual

[0388] 30. Align and b) surface and material joining, preferably form-fitting (for example, by applying pressure and / or heat) of the to -09-2025-43634401 -Hau ptpost-0056 10=09- 2025-43634401 -Hau ipes t-0056 PCT / DE2025 / 000091

[0389] 44 connecting elements. Mutual alignment and planar and material joining can occur sequentially, and it is also possible to align the elements to be joined relative to each other during the joining process, as long as they are movable relative to each other, i.e., before their mutual connection is completed.

[0390] 5 is consolidated.

[0391] Figure 18B shows a corresponding arrangement in which the areas to be aligned and connected in steps 1, 2, and 3 are schematically represented. The inner base and the lower cover are located on opposite sides of the textile support.

[0392] 10. The planar connection is achieved through the opening in the textile in step Mating 3. The required accuracy of the mutual alignment between the inner base and the printed lower cover in step Mating 3 is particularly high, since the printed electronic structures in the base of the contacting module are located under the components to be aligned with each other.

[0393] exhibiting 15 highest spatial density and finest detail.

[0394] Figures 19A and 19B show a flowchart and associated arrangement for a second exemplary manufacturing process.

[0395] Here, as schematically shown in Figure 19A, the elements to be joined according to this procedure are first provided in steps 1a, 1b, 2a and 2b,

[0396] 20 in detail, a base element (in the example with a perforated base, step 1a), a contact-side printed underside cover (step 1b), a textile with an opening (step 2a), and a circuit with electrodes printed on a carrier film (in the example TPU, step 2b). The contact-side printed underside cover includes a base cover section to be connected to the base element.

[0397] 25 and a lower connection section extending beyond the connection with the base element, as described by way of example in Figures 7A and 7B.

[0398] In a step designated as "Mating 1", the base element provided in step 1a) with its inner base floor and the components provided in step 1b) -09-2025-43634401 -Hau ptpost-0057 10"09"2025"43634401 = Main position is “0057 PCT / DE2025 / 000091

[0399] 45 covers, provided and printed with conductive traces and optional insulating layers, are aligned relative to each other in their base cover section and bonded together over their entire surface, for example by applying pressure and / or heat. In contrast to the first exemplary method.

[0400] 5. The connection between the inner base and the printed base cover section of the underside cover is made without the presence of the textile, which facilitates the accuracy of mutual alignment and connection required for the production of electrical connections.

[0401] In a step called “Mating 2”, the data prepared in step 2b) are used.

[0402] 10. The printed circuit on a carrier film (in the example TPU) and the textile provided in step 2a) were aligned relative to each other and connected to each other both in terms of surface area and material as well as electrically.

[0403] In a step called "Mating 3", the two printed circuits, i.e., the printed circuit connected to the textile in step "Mating 2", are joined.

[0404] 15 with the conductor tracks lying flat against the textile and the circuit printed on the lower cover and connected to the inner base in step “Mating 1” in the area of ​​the base cover section are aligned relative to each other and are connected flatly, preferably materially and especially also electrically, in an area of ​​the connection section of the lower cover.

[0405] 20 den. Similar to step “Mating 2” of the first exemplary manufacturing process, the circuits to be joined, each printed on a substrate, are aligned and connected overlapping and facing each other, thus resulting in a change of sides of the circuits on the respective printed substrates (e.g. TPU films) from the side facing the electronic module to the side facing the electrical module.

[0406] 25 nikmodul is implemented on the opposite side.

[0407] Furthermore, after step “Mating 3”, the connection section of the lower cover is located on the side of the textile facing away from the predetermined position for the electronic module to be accommodated, thus also resulting in a change of sides of the circuits with respect to the textile from the side facing the electronic module.

[0408] 30. The side facing away from the electronics module is implemented. 10-09-2025-43634401 -Hau ptpost-0058 10-03-2025-43634401-HauP t Pos -t -0058 PCT / DE2025 / 000091

[0409] 46

[0410] In a step called “Mating 4”, the base, which until then had only been indirectly connected via the base cover section and the lower connection section of the lower cover, is finally aligned and connected directly to the textile.

[0411] 5. Regardless of the details of the preceding steps, directly connecting the base to the textile after prior indirect connection via the lower cover has the advantage that, firstly, not only the planar and material connections, but especially the electrical connections can be made with high accuracy of the respective orientations, for example by aligning the

[0412] 10. The circuit printed on the connection section of the lower cover can be connected to the circuit with the conductor tracks lying flat against the textile without restriction by a direct connection between the base and the textile. This is particularly important for the manufacturability of the electrical connections with good accuracy when – as in preferred embodiments-

[0413] 15 of the present invention - the circuits to be electrically connected in the contacting module and on the textile carrier are each applied to flexible carriers and these can be plastically deformed in the context of pressure and heat treatment to produce planar and material connections.

[0414] Figure 19B shows a corresponding arrangement in which the elements to be aligned and connected in steps 1 to 4 are schematically represented. In the example shown, the inner base and the lower base cover section are located on the same side of the textile support; the change to the opposite side of the textile support is described in Figure 19B.

[0415] 25 follows – similarly to the embodiment in Figures 7A and 7B – through an opening in the textile that is laterally offset relative to the center of the base and the direction of connection, through which the connection section of the lower base cover is guided. Alternatively (not shown), it is possible to connect a section of the circuit lines with conductors lying flat against the textile carrier in one and / or multiple layers.

[0416] 30 terbahnen through an opening in the textile offset laterally relative to the center of the base -09-2025-43634401 -Hau ptpost-0059 10-03= 2025=43634401 -Hau? i Pos t -0053 PCT / DE2025 / 000091

[0417] 47 to guide to the side of the textile with the inner base and the lower base cover section and to carry out the planar, material and electrical connection to be made in step “Mating 3” on this side of the textile carrier.

[0418] Figures 20A and 20B show a flowchart and associated setup for a third exemplary manufacturing process. Figure 20A illustrates the steps of this process, and Figure 20B shows the associated setup. The process includes providing a textile 1000 with an opening (step 1a), providing a printed circuit on a carrier film 2590 (step 1b, in the

[0419] 10 Example TPU), providing a base element (step 2a, in the example with a perforated base and recess matching the opening in the textile), providing the lower cover 2800 (step 3a). In the area of ​​the base, the printed circuit on the carrier film forms the intermediate layers 2510 between the inner base base, which are bonded to adjacent layers on both sides in a planar and material manner.

[0420] 15 2150 and the lower cover 2800. In an area outside the base, the printed circuit on the carrier film forms the electronic circuit 4000 with, among other things, the conductor tracks lying flat on the textile carrier in one and / or multiple layers, as well as - shown in the example - an electrode 4500 on the side of the textile opposite the base.

[0421] 20 In step “Mating 1”, the printed circuit provided in step 1b) on the carrier film and the textile provided in step 1a) are aligned relative to each other and bonded together in a surface and material bond. In step “Mating 2”, the circuit printed on the carrier film and bonded to the textile is connected through the opening in the textile to the material provided in step 2a).

[0422] 25. The inner base (in the example shown, with the holes in the base) is aligned and bonded over its entire surface, preferably by applying pressure and / or heat. In this step, the base is also bonded over its entire surface and materially to the part of the textile surrounding the opening in the textile at its edge area. In a step “Mating 3”, the elements formed in step 3a) are

[0423] 30 lower cover 2800 with the base, in particular with the inner -09-2025-43634401 -Hau ptpost-0060 1O-ÖS- 2025-43634401 -Hau t Pos t -0060 PCT / DE2025 / 000091

[0424] 48

[0425] The base plate 2150 and the associated printed circuit on the carrier film, which form the intermediate layers 2510 between the inner base plate 2150 and the lower cover 2800, are aligned and bonded over their entire surface and materially, for example by applying pressure and / or heat. The output

[0426] The 5 straightening and surface bonding steps Mating 1, Mating 2 and Mating 3 can also be carried out completely or partially together, so that, for example, the application of pressure and / or heat only occurs once or only twice.

[0427] Should part of the printed circuit on the carrier film 2590 be exposed in an area outside the base towards the side of the textile opposite the base?

[0428] 10 gen and, for example, electrode 4500 directed towards this side, the exposed part of the circuit can be formed by removing a corresponding section 2591 of the carrier film 2590.

[0429] This third exemplary manufacturing process is characterized by the fact that, compared to the other two manufacturing processes, it requires fewer process components.

[0430] The process comprises 15 steps and, in particular, allows all elements to be joined in a single step, for example by applying pressure and / or heat, to be bonded over a surface and preferably materially. Furthermore, it is also characterized by the fact that, compared to the two other manufacturing processes, fewer components are required to produce a circuit according to the invention.

[0431] 20 may be required. For example, an overlapping connection of different conductive layers in different parts of the circuit, as explained in connection with Figures 7A and 7B and Figures 8A and 8B, is not required. Rather, the same conductive layers can be used for electrical connection with the contact surfaces.

[0432] 25 of the contacting module and for electrical connection with electrodes on the side of the textile opposite the base of the contacting module.

[0433] All of the aforementioned exemplary manufacturing processes use additive manufacturing techniques in printed electronics to form the electronic structures, as well as the application of pressure and / or heat for post-treatment of printing inks and

[0434] 30 for the surface and - preferably - material joining of various -09-2025-43634401 -Hau ptpost-0061 10-09- 2025-43634401 -HauP t Pos t -0061 PCT / DE2025 / 000091

[0435] - 49 -

[0436] Components. This allows for low manufacturing costs and enables a high spatial density of electrical connections between the circuit on the textile substrate and the electronic module.

[0437] These processes can be modified by introducing pressure.

[0438] 5 and / or heat for the post-treatment of printing inks and for the surface and material bonding of various components in just a few steps, for example, only one or two steps of aligning and surface bonding of elements to be aligned and connected to each other. Simultaneously, i.e., without additional process steps, the application of pressure and / or

[0439] 10. Heat is also used for the post-treatment of printing inks. Such treatments with heat and / or pressure are typically carried out at temperatures in the range of 50°C to 180°C and pressures in the range of 1 bar to 8 bar.

[0440] In general, when selecting thermoplastic materials, attention must be paid to choosing suitable and coordinated softening temperatures.

[0441] 15. If, for example, joining steps are carried out at different temperatures, attention must be paid to the corresponding temperature tolerance of all materials involved and all joints already made. In particular, shape-giving and functionally dimensionally stable elements such as carrier films or the base element with the inner base plate should be able to withstand higher softening temperatures.

[0442] 20 exhibit properties that differ from those of layers or other elements produced using printed electronics methods in their function of forming planar and material connections while adapting to their own shape. For example, if, as shown and explained in the example of Figure 5B, the textile carrier 1000 is to rest against a substantially smooth underside of the inner base and the shape of the lower cover follows a resulting stepped height profile, then the lower cover will have a lower softening temperature than the inner base.

[0443] To form form-fitting and preferably material connections, in addition to the elements to be joined, connecting materials with low

[0444] 30 gen softening temperatures, for example in the form of thin films or fine -09-2025-43634401 -Hau ptpost-0062 1Ö-09- 2025-43634401 -Hau t Po st -0062 PCT / DE2025 / 000091

[0445] 50

[0446] Particles made of low-melting-point material are used. Shape-defining and functionally dimensionally stable elements, such as carrier films to be printed, can be provided with higher-melting-point carrier layers and low-melting-point bonding layers on the surfaces to be joined.

[0447] 5. For recycling the material of the circuit according to the invention, it is also advantageous if the elements of the electronic circuit can be separated from the textile carrier in a straightforward manner and in as few parts as possible. For this purpose, the materials can be used to form material bonds between the electronic circuit and the textile carrier (“bonding material”).

[0448] 10 materials with a lower softening temperature (“recycling temperature”) than other materials used. Since a firm connection between the base and the textile support is required due to the necessary mechanical strength, it is also advantageous for the recyclability of the circuit if the base – for example, on one side opposite the connection direction –

[0449] 15 den Side, a receiving device for mechanical tensile forces, for example in the form of a handle or a loop - made of tensile-resistant material with a high softening temperature. During recycling, the circuit according to the invention can then be heated to the recycling temperature and, after softening the connecting materials, separated from the carrier, whereby the circuit is then attached to the front

[0450] 20 imagined a lifting device for mechanical tensile forces could be grasped and pulled off the textile carrier.

[0451] *****

[0452] When manufacturing the circuit according to the invention, the base element with the inner base base and the intermediate layers lying flat against it are

[0453] 25. If the conductor track sections are manufactured in separate components and then joined together over a surface, preferably materially and electrically, care must be taken to ensure precise mutual alignment of the components relative to each other, especially if a high area and / or spatial density of electrical connections in the area of ​​the base is required.

[0454] 30 sision in manufacturing requires. To facilitate this, it corresponds to a -09-2025-43634401 -Hau ptpost-0063 10-08-2025-43634401 -HauP - Pest -0063 PCT / DE2025 / 000091

[0455] 51. Eighth aspect of the present invention, that the inner base bottom section has, on its underside facing away from the predetermined position for receiving the electronic module, an inhomogeneous height structure (raised areas and / or depressions in the z-direction) on the surface of this underside, and when the

[0456] 5 Components to be aligned relative to the inner base section, with the intermediate layers including conductor track sections, have a corresponding outer shape on the surface of this underside that facilitates the mutual alignment of the components by using the inhomogeneous height structure as a mechanical stop or several mechanical stops

[0457] 10 can be used for the component with the intermediate layers.

[0458] Figures 21A to 21D schematically show, as a thirteenth embodiment, a combination of a printed film and a suitably designed base body for use in the manufacture of an exemplary base with a lower cover extended as a lower connecting piece. Viewed from the side transversely to the

[0459] 15 Connection direction, i.e. seen in the y-direction, Figure 21A shows a base body as the first component to be connected in cross-section with hatched electrically conductive sections through the inner base base and with a recess 2700, flat in the z-direction, for receiving the printed film as the second component to be connected, which in the present embodiment

[0460] Figure 20 serves as the lower cover with printed intermediate layers and conductor track sections. Viewed from the same angle, Figure 2 ID shows the correctly aligned combination of the two components to be connected: the base body and the lower cover (extended in the x-direction as the connection direction). The height of the recess in the z-direction corresponds to the thickness.

[0461] 25 of the foil, which is advantageous for forming a smooth common underside of the base, but is not necessary solely for the mutual alignment of the components to be joined. Figures 21B and 2IC each show top views of the surfaces to be joined in the z-direction, with electrically conductive sections through the inner base bottom shown hatched in Figure 21B and 2IC.

[0462] 30 with - also hatched - correspondingly arranged connection areas on the side surfaces of the conductor track sections on the lower cover -09-2025-43634401 -Main post-0064 10-09-2025-43634401 -Main PO st -0064 PCT / DE2025 / 000091

[0463] - 52 - in Figure 21C. The outer outline of the recess in the base body corresponds in three directions of the xy-plane to the outer outline of the film to be received and serves as a mechanical stop in three directions. This arrangement enables a precise and at the same time robust alignment of the two components to be joined.

[0464] 5th to each other, as is particularly necessary for a high area density of electrical connections in the area of ​​the base.

[0465] The complementary shapes of the recess in the base and the film to be received form a smooth, common underside, allowing the base to lie flat against the textile support. In this case, the

[0466] 10. The extension of the lower cover as a connecting piece for the electrical connection of the base to the opposite side of the textile support is guided through an opening in the textile support laterally next to the base body, as for example in the arrangement shown in Figure 19B.

[0467] Figures 22A to 22E show a further embodiment as a fourteenth embodiment.

[0468] 15 Combination of a printed film and a correspondingly designed base body, which are designed for precise mutual alignment similar to the thirteenth embodiment, but in contrast to the thirteenth embodiment, the base body has a circumferential recess 2200 in an edge region of its underside for the

[0469] 20. The base has a section of the textile carrier 1000, which in turn has an opening shaped to fit the inner base 2150, through which the base can be electrically connected to the opposite side of the textile carrier. In the present fourteenth embodiment, the printed film serves as the entirety of the intermediate layers 2510 with da-

[0470] 25 conductor track sections contained between the lower base and a separately formed lower cover 2800.

[0471] Similar to Figure 21A for the thirteenth embodiment, Figure 21A shows a base body in cross-section with hatched electrically conductive sections through the inner base floor and with a surface planar in the z-direction.

[0472] 30 Recess 2700 for receiving a section of the printed foil 2150. -09-2025-43634401 -Hau ptpost-0065 10-09-2025-43634401 -Hau t#os i-0065 PCT / DE2025 / 000091

[0473] 53

[0474] Similar to Figure 21D for the thirteenth embodiment, Figure 22D shows, from the same viewing direction, the correctly aligned combination of the base body, the textile carrier 1000, and the printed film. The height of the recess 2700 in the z-direction corresponds to the thickness of the printed film.

[0475] 5. Slide 2150, which is advantageous for forming a smooth common underside, but is not necessary solely for the mutual alignment of the components to be joined. Furthermore, the fourteenth embodiment, as shown in Figure 22E, includes a lower cover 2800 that covers the entire lower side of the base in the area of ​​the base body, including the component received therein.

[0476] 10 sections of the textile carrier and the section of printed film contained therein.

[0477] Figures 22B and 22C, similar to Figures 21B and 22C for the thirteenth embodiment, are top views of the surfaces to be joined in the z-direction, with electrically conductive sections shown hatched through the

[0478] 15 inner base plate in Figure 22B and correspondingly arranged connection areas on the side surfaces of the conductor track sections on the printed foil in Figure 22C. For further explanation, reference is made to the description of Figure 21 to avoid repetition.

[0479] Figures 23A to 23H show, as a fifteenth embodiment, a combination of several (three in the illustrated example) printed films and a suitably shaped base body, designed for precise mutual alignment during the manufacture of a base for a contact module with superimposed conductor tracks on several (three in the illustrated example) over-

[0480] 25 layers of foil.

[0481] Figures 23A to 23E show the base body with hatched drawings of electrically conductive sections through the inner base floor, namely Figure 23A in a lower plan view of the lower base floor in the z-direction and Figures 23B to 23E as sectional views through the sections labeled S1S1 ' or S2S2' or S3S3'.

[0482] 30 and / or S4S4' designated cutting planes. -09-2025-43634401 -Hau ptpost-0066 10-03- 2025-43634401 -HauP tPos t-0066 PCT / DE2025 / 000091

[0483] 54

[0484] Figure 23F shows top views of the printed upper surfaces of the printed foils, which, in the drawn top views, are to be connected section by section to the lower base shown in Figure 23A and otherwise to adjacent foils on both sides. In these surface connections, the hatched areas are to be joined.

[0485] 5. Connection areas were drawn on the side surfaces of the conductor track sections on the printed foils to electrically connect the electrically conductive sections shown hatched in Figure 23A through the inner base. To enable these electrical connections for the conductor track sections on all printed foils, these have, in the example shown, a connection in An¬

[0486] 10. The printed sheets are of different lengths in the x-direction and have (hatched) connection areas on the side surfaces of the printed conductor sections at their respective ends. The printed sheets are stacked in such a way that for each stacked sheet, the respective end section with the connection areas on the side surfaces of the conductors is visible.

[0487] Fifteen track sections remain free for contact with the inner baseboard and for electrical connection with the electrically conductive sections contained therein. In the illustrated example, the respective ends of the stacked foils are arranged offset from one another in the direction opposite to the connection direction (-x- direction).

[0488] 20 A corresponding arrangement, in which the stacked foils are connected to the base, is shown schematically in Figure 23G, Figure 23H shows the same arrangement, supplemented by a lower cover (shown in dotted lines) to compensate for the stepped course of the stacked foils.

[0489] To facilitate the mutual alignment of this complex arrangement,

[0490] 25 In the example shown, the printed films to be stacked on top of each other have different widths in a width direction (y-direction) perpendicular to the connection direction, and the base body is provided on its underside with a flat recess whose width decreases section by section in the width direction along the direction opposite to the connection direction (-x-direction).

[0491] 30 sections suitable for the different widths of the -09-2025-43634401 -Hau ptpost-0067 10-03" 2025" 43834401 -H on i PQ S t -0067 PCT / DE2025 / 000091

[0492] 55 printed foils to be stacked on top of each other and with the positions of the width reductions at intervals suitable for the sizes of the respective end sections to be kept clear with the connection areas on the side surfaces of the conductor track sections.

[0493] 5 In this way, the printed film with the greatest width is only picked up by the widest section of the recess and guided laterally by it, reaching its stop in the direction opposite to the connection direction (-x direction) at the first narrowing in that direction. The printed film with the second greatest width is picked up by the widest and the second-widest sections of the

[0494] The 10th recess is picked up and guided laterally by it, and its stop is in the direction opposite to the connection direction (-x direction) at the next narrowing in this direction. And so on. Finally, the printed film with the smallest width is the only one picked up by the narrowest and last section of the recess and guided laterally by it, and its

[0495] 15 Stop in the direction opposite to the connection direction (-x direction) at the end of the recess.

[0496] If the printed films are inserted into the recess starting with the film of the greatest width and in order of decreasing width, this arrangement results in a precise and at the same time stable arrangement of all printed films.

[0497] 20 with the respective connection areas on the side surfaces of the conductor track sections relative to the base plate with the electrically conductive sections contained therein. This arrangement enables a precise and at the same time robust alignment of a larger number of components to be connected relative to each other, as is necessary for a high area density and high volume density of electrical connections.

[0498] 25 dungen in the area of ​​the base is required.

[0499] The example shown is not limited to three printed sheets stacked on top of each other and aligned relative to the base and to each other, and can also be used for a larger number of sheets according to the diagram shown. Further details of the example shown are also available.

[0500] 30 not important, for example the inner baseboard can have a -09-2025-43634401 -Hau ptpost-0068 10-09“2025~4363440 l=HawP tfl on its underside OS t-0068 PCT / DE2025 / 000091 or have several protrusions, and the printed foils can have one or more holes and / or lateral recesses matching the protrusions at individually different positions in order to enable, in their respective interaction with the protrusions, individually different and at the same time precise and robust orientations relative to the base body for several printed foils.

[0501] For precise and robust alignment of a larger number of printed films relative to a base body, it is important that the inner base bottom section, on its underside facing away from the predetermined position for receiving the electronic module, has an inhomogeneous surface on this underside.

[0502] height structure (raised and / or recessed in the z-direction) which is suitable, in conjunction with differently shaped foil outlines (including possibly holes) of several printed foils to be stacked, to enable different and at the same time precise and robust orientations relative to the 15 base body.

Claims

1. -09-2025-43634401 -Hau ptpost-0070 iu— tpos t-OuZU PCT / DE2025 / 000091 57 PATENT CLAIMS:

1. Electronic circuit on a textile substrate (1000), comprising several circuit lines (4000) with single and / or multi-layered 5 conductive traces (4100) lying flat against the textile support, and a contacting module (2000) with a base (2100) bonded to the textile support for mechanically detachable mounting of an electronic module (3000) without contact with the textile support; wherein the contacting module comprises several electrically conductive contact surfaces (2101, 2102, 2103) and is configured to receive an electronic module provided with several electrical contacts (3101, 3102, 3103) at a predetermined position (P) relative to the base such that several of its electrical contacts (3101, 3102, 3103) are connected to 15 several contact surfaces (2101, 2102, 2103) of the contacting module are electrically connected, characterized in that the base has an inner base bottom section (2150) and on its underside facing away from the predetermined position (P) 20 (2150U) is connected in a planar and material-bonded manner to a base cover section (2850) of a lower cover (2800), and that the planar and material-bonded connection between the inner base bottom section and the base cover section includes one or more intermediate layers (2510) which are connected on both sides in a planar manner to adjacent surfaces, in which electrically conductive conductor track sections (2511, 2512, 2513) are located, which are electrically connected at their ends furthest from the predetermined position to the circuit lines (4000) outside the base and which are connected at their ends closer to the predetermined position in the inner base bottom section and / or by 30 electrically connected through the inner base floor section to contact surfaces (2101, 2102, 2103) of the contacting module or whose sides facing the predetermined position are connected by openings (2161, -09-2025-43634401 -Hau ptpost-0071 10-09-2025-43634401 -H auP o S t -0071 PCT / DE2025 / 000091 58 2162, 2163) through the inner base plate serve as contact surfaces (2101, 2102, 2103) of the contacting module.

2. Electronic circuit on a textile substrate (1000), comprising 5 multiple circuit lines (4000) with conductor tracks (4100) lying flat against the textile substrate in one and / or multiple layers, and a contacting module (2000) with a base (2100) bonded to the textile substrate for mechanically detachable mounting of an electronic module (3000) without contact with the textile 10 Carriers; wherein the contacting module comprises several electrically conductive contact surfaces (2101, 2102, 2103) and is configured to receive an electronic module provided with several electrical contacts (3101, 3102, 3103) at a predetermined position (P) relative to the base. 15 men, that several of its electrical contacts (3101, 3102, 3103) are electrically connected to several contact surfaces (2101, 2102, 2103) of the contacting module, characterized in that the electronic circuit in a section firmly connected to the textile carrier includes a selection switch- 20 direction (2600) includes, via which for one or more contact surfaces (2101, 2102, 2103) of the contacting module one of several circuit lines outside the socket can be selected and electrically connected to the respective contact surface. 25 3. Electronic circuit according to claim 2, wherein the selection switching device is arranged in the base (2100) of the contacting module (2000) and the latter has an inner base bottom section (2150) and on its underside (2150U) facing away from the predetermined position (P) a base cover section (2850) of a 30 lower cover (2800) and one or more intermediate layers (2510) between the inner base floor section and the -09-2025-43634401 -Hau ptpost-0072 10-Ö9-2025-43S34401 -HauP t Post -0072 PCT / DE2025 / 000091 59 base cover section having conductor track sections (2511, 2512, 2513) which are selectable directly or via the selection switching device (2600) through the inner base base section with contact surfaces at their ends closer to the predetermined position 5 (2101, 2102, 2103) of the contacting module and at their ends further away from the predetermined position are electrically connected to circuit lines (4000) outside the socket.

4. Electronic circuit according to claim 3, wherein the selection switching device 10 tung is arranged - between the predetermined position (P) for receiving the electronics module (3000) and the inner base floor section (2150), and / or - inside the inner base floor section (2150), and / or 15 - on its underside and / or top side, and / or - between the inner base floor section and the base cover section of the lower cover, and / or in a perpendicular view of the textile support next to the inner base floor, between a lower connection section (2880) 20 of the lower cover (2800) and the textile carrier, and / or - inside the lower cover.

5. Electronic circuit according to one of the preceding claims, wherein the conductor track sections between the underside of the inner base plate 25 sections and the base cover section of the lower cover each with an electrically conductive layer of a layer thickness perpendicular to the underside of the inner base bottom section of up to 200 pm and a cross-sectional width parallel to the underside of the inner base bottom section in the range of 100 pm to 8 mm, preferably in the range of 30 300pm to 3mm, are provided. -09-2025-43634401-Main Post Office-0073 10-08-2025-43634401 -Main Post Office t~0073 PCT / DE2025 / 000091 - 60 - 6. Electronic circuit according to claim 1, wherein the electrical connections between the contact surfaces of the contacting module and the conductor track sections in one or more intermediate layers are provided by electrically conductive sections (2151, 2152, 2153) and / or openings. 5 (2161, 2162, 2163) run in the inner baseboard as well as through the sides of the conductor track sections facing the inner baseboard.

7. Electronic circuit according to one of the preceding claims, wherein the conductor track sections (2511, 2512, 2513) are arranged in several stacked intermediate layers such that their perpendicular projections onto the underside of the inner base floor section overlap and they are electrically isolated from each other in overlap areas by non-conductive intermediate layers (2516, 2517). 15 8. Electronic circuit according to claim 7, wherein a perpendicular projection onto the underside (2150U) of the inner base floor section of a conductor track section (2511) in an intermediate layer further away from the inner base floor section overlaps with an electrical connection (2153) passing through the inner base floor section between a contact surface (2103) of the contacting module and a conductor track section (2513) in an intermediate layer closer to the inner base floor section.

9. Electronic circuit according to one of the preceding claims, wherein the So¬ 25 ckel is formed with an electrically non-conductive thermoplastic elastomer.

10. Electronic circuit according to one of the preceding claims, wherein the lower cover is made of an electrically non-conductive thermoplastic material. 30 Elastomer, preferably TPU, is formed and the conductor track sections are directly and / or via electrically insulating intermediate layers. -09-2025-43634401 -Hau ptpost-0074 10-09-2025-43634401 -Hau P Po s -0074 PCT / DE2025 / 000091 61 are bonded to the thermoplastic elastomer.

11. Electronic circuit according to one of the preceding claims, wherein the lower cover (2800) further comprises at least one lower terminal 5. The end section (2880) comprises a section arranged on the same side of the textile carrier (1000) as the base cover section (2850) and is connected to the textile carrier in a planar and material manner via one or more connection section intermediate layers (2580) which are connected to adjacent surfaces on both sides, and 10 the connection section intermediate layers (2580) contain electrical connections (2581, 2582, 2583) of conductor tracks (4101, 4102, 4103) outside the socket with conductor track sections (2511, 2512, 2513) inside the socket between the socket cover section (2850) and the inner socket bottom section (2150). 15 12. Electronic circuit according to claim 8, wherein an electrical connection of a conductor track section (2511) between the base cover section (2850) and the inner base bottom section (2150) with a conductor track (4101) outside the base 20 comprising at least one first connection section (2580) with an electrically conductive layer (2581) lying flat against the lower connection section (2880); wherein the circuit line (4000) with the conductor track (4101) outside the base has at least one lying flat against the textile support 25 second connection section (4200) comprising an electrically conductive material (4201); wherein the perpendicular projections of the electrically conductive layer (2581) of the first connection section and of the electrically conductive material (4201) of the second connection section onto the surface facing them 30. The sides of the textile carrier overlap in an overlap area (R); and -09-2025-43634401 -Hau ptpost-0075 10-08-2G25“436344ül~Haupi PÖS t -0075 PCT / DE2025 / 000091 62 wherein the electrically conductive layer (2581) of the first connection section and the electrically conductive material (4201) of the second connection section are electrically connected to each other via a contact connection (K) and the perpendicular projection of the contact connection onto 5 the side of the textile carrier facing it is contained in the overlap area.

13. Electronic circuit according to claim 9 and with the features of claim 4, wherein the at least one first connection section (2580) lying flat against the lower connection section (2880) comprises as an electrically conductive layer a first (2581) and at least one further (2582, 2583) in stacked connection section intermediate layers and electrically insulated from each other by non-conductive intermediate layers. 15 connecting conductor tracks are electrically connected to a first (2511) and at least one further (2512, 2513) conductor track sections contained within the socket in stacked connection section intermediate layers, wherein the perpendicular projections of the first connecting conductor track 20 (2581) and the electrically conductive material (4201) of the second connection section overlap in a first overlap area (RI) on the side of the textile support facing them, and the perpendicular projection of the contact connection between the first connecting conductor track and the electrically conductive material of the second connection section onto said side of the textile support is contained in the first overlap area, wherein the circuit further comprises at least one additional connection section with an electrically conductive material (4202, 4203) lying flat against the textile support, as well as at least one further contact 30 bond between the at least one further connecting conductor track (2582, 2583) and the electrically conductive material of the at least one -09-2025-43634401 -Main Post Office-0076 1 Ö-09- 2025- 43634401 -HauP * Po si “0076 PCT / DE2025 / 000091 63 further connection section comprising, wherein the vertical projections of the at least one further connection conductor track and the electrically conductive material of the at least one further connection section onto said side of the textile carrier 5 overlap in at least one further overlap area (R2, R3) different from the first overlap area (RI) and the perpendicular projection of the at least one further contact connection onto said side of the textile carrier in which at least one further overlap area is contained. 10 14. Electronic circuit according to claim 9 or 10, wherein the connection section is arranged on one side of the textile carrier opposite the predetermined position and the first connection section is flat and fabric-covered on both the connection section and the textile carrier.

15. The first connecting section is attached and the second connecting section is located in an overlap area between the first connecting section and the textile carrier.

15. Electronic circuit according to one of claims 9 to 12, wherein the 20 second connecting section (4200) is formed as part of a conductor track (4100) of a circuit line which lies flat against the textile carrier.

16. Electronic circuit according to one of claims 8 to 13, wherein the un¬ The 25th connection section is formed in one piece with the base cover section.

17. Electronic circuit according to one of the preceding claims, wherein the conductor tracks are laid flat on the textile substrate in one or more layers. 30 are each electrically insulated around a length of at least 20 mm, preferably 100 mm, and each is located inside the -09-2025-43634401-Main Post Office-0077 10-09- 2025-43634401-Main Post Office t Post Office t-0077 PCT / DE2025 / 000091 - 64 - circumferential insulation with an electrically conductive layer of a cross-sectional width in the range of 100 pm to 10 mm, preferably in the range of 300 pm to 5 mm, and a layer thickness of up to 200 pm, preferably a layer thickness in the range of 4 mm to 60 pm. 5 18. Electronic circuit according to one of the preceding claims, wherein the textile carrier is designed for wearing on the human body and the circuit comprises several electrically conductive electrodes and / or sensors lying flat on the textile carrier, which are connected via 10 several of the circuit lines are connected to a conductive contact surface of the contacting module and are in contact with the skin when wearing the textile carrier.

19. Manufacturing process for an electronic circuit according to one of the claims- 15 before 1 to 17, encompassing: Providing the base with the inner base bottom section, which is designed for making electrical connections from the contact surfaces of the contacting module through the base bottom section to predetermined areas on the underside of the base bottom section 20; Providing the bottom cover with the base cover section to which one or more layers produced using a printing process are adhered, in which the conductor track sections are located, 25 Aligning the bottom cover and the base bottom section relative to each other, such that the one or more layers adhering to the base cover section are located as one or more intermediate layers between the base cover section and the underside of the base bottom section, and conductor track sections located in the one or more layers 30 are connected to the predetermined areas at the The underside of the base floor section must be brought into contact; and -09-2025-43634401 -Hau ptpost-0078 10-09-2025-43634401 -HauPt Pos t -0078 PCT / DE2025 / 000091 65 Creating a continuous material bond between the base cover section of the lower cover and the base floor section, so that the one or more intermediate layer(s) bond completely and materially with adjacent surfaces on both sides. 5 den.

20. Manufacturing method for an electronic circuit according to any one of claims 1 to 17, comprising: Providing the base with the inner base floor section, which 10 is designed for the production of electrical connections from the contact surfaces of the contacting module through the base bottom section to predetermined areas on the underside of the base bottom section; Providing an interim carrier to which one or more entities are subject to contract. 15 layers produced using a printing process, in which the conductor track sections are located, Aligning the interim support and the base floor section relative to each other, so that the one or more layers adhering to the interim support form one or more intermediate layers between the intermediate layer and the base floor section. 20 rim carrier and the underside of the base floor section are located and conductor track sections located in one or more layers are brought into contact with the predetermined areas on the underside of the base floor section; Creating a surface-wide and material bond between the 25 Base floor section and the one or more intermediate layer(s) adhering to the interim support, so that the base floor section connects with the intermediate layer directly adjacent to it in a planar and material manner, and several intermediate layers connect with each adjacent intermediate layer in a planar and material manner; 30 Removal of the interim support from one or more surfaces and materials connected to the base floor section -09-2025-43634401 -Main Post Office-0079 10-09-2G25-436344G 1 -Main Post Office- 0079 PCT / DE2025 / 000091 66 Intermediate layer(s); and Providing the lower cover and establishing a planar and material connection between the lower cover and the planar and material connection with one or more planar and material connections. 5 intermediate layer(s) connected to the base floor section.

21. Manufacturing method according to one of the preceding claims, wherein the bringing about the planar material bond between the base floor section and the base cover section of the lower Ab- 10. covering and / or and the one or more intermediate layer(s) adhering to the interim carrier by introducing heat and / or pressure, preferably by heating the underside of the base floor section as well as the lower covering and / or the interim carrier to a temperature in the range of 50°C to 180°C at a pressure in the range 15 from 1 bar to 8 bar.

22. Manufacturing method according to one of the preceding claims, wherein, during the application of heat and / or pressure, the areas in contact with the predetermined areas on the underside of the base floor section are brought into contact.

20. Conductor track sections form an electrically conductive connection with an electrically conductive material in the predetermined areas of the base floor section.

23. Manufacturing process according to any of the preceding claims, further comprising 25 a planar material bonding of the textile carrier with the lower cover and / or the base floor section by applying heat and / or pressure, preferably by heating the underside of the base floor section as well as the lower cover and / or the interim carrier to a temperature in the range of 50°C to 180°C at a pressure in 30 range from 1 bar to 8 bar. -09-2025-43634401 -Hau ptpost-0080 10=09-2025=43834401 -Hau P irö st -0080 PCT / DE2025 / 000091 - 67 - 24. Manufacturing method according to one of the preceding claims, wherein the base and the lower cover or the interim support are located on opposite sides of the textile support when aligned with each other, and the creation of the planar material bond 5 between the underside of the base floor section and the base cover section of the lower cover and / or the one or more intermediate layer(s) adhering to the interim carrier through an opening in the textile carrier.

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