Electronic assembly
By isolating the temperature sensor on a separate measurement circuit board, the method addresses inaccuracies in junction temperature measurement by providing a direct thermal path from the semiconductor, ensuring accurate and cost-effective protection against overheating.
Patent Information
- Application Number
- PCT/EP2025/079586
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-11
- Filing Date
- 2025-10-14
- Publication Date
- 2026-05-15
AI Technical Summary
Existing methods for measuring junction temperature of power semiconductors in electronic circuits are inaccurate due to complex thermal paths and external influences from current-carrying conductors and other components on the circuit board, leading to distorted temperature measurements.
A separate measurement circuit board is used to thermally isolate the temperature sensor from the main circuit board, allowing for a direct and reproducible thermal path from the semiconductor device to the sensor, using a fastening device to ensure effective heat conduction and minimize external influences.
This approach provides a highly accurate and cost-effective method for determining junction temperature by decoupling the temperature measurement from external thermal influences, enabling reliable protection of power semiconductors and simplifying manufacturing.