Integrated system and maintenance method

Abstract

An integrated system according to the present disclosure includes a substrate processing system, a maintenance device, and at least one control circuit. The substrate processing system includes a vacuum transfer module and a plurality of process modules. The vacuum transfer module includes a vacuum transfer chamber. Each of the plurality of process modules includes a processing chamber connected to the vacuum transfer chamber. The maintenance device has a transfer robot and is configured to detachably connect to the vacuum transfer chamber for maintenance of the substrate processing system. The at least one control circuit is configured to control the maintenance device so as to transport a magnetic-levitation-type mobile device between the vacuum transport chamber and the maintenance device using the transfer robot.

Description

Integrated System and Maintenance Method

[0001] Exemplary embodiments of the present disclosure relate to an integrated system, a maintenance device, and a maintenance method.

[0002] A substrate processing apparatus that disposes a substrate in a processing chamber under reduced pressure and performs various substrate processes is known. The following Patent Document 1 discloses a technique for performing maintenance in a substrate processing apparatus without opening a process chamber to atmospheric pressure from the viewpoint of reducing downtime.

[0003] International Publication No. 2022 / 138847

[0004] The present disclosure provides a technique that enables maintenance of a substrate processing system.

[0005] In one exemplary embodiment, an integrated system is provided. The integrated system includes a substrate processing system, a maintenance device, and at least one control circuit. The substrate processing system includes a vacuum transfer module and a plurality of process modules. The vacuum transfer module includes a vacuum transfer chamber. Each of the plurality of process modules includes a processing chamber connected to the vacuum transfer chamber and is configured to perform substrate processing on a substrate transferred from the vacuum transfer chamber in the processing chamber. The maintenance device has a transfer robot and is configured to be detachably connected to the vacuum transfer chamber for maintenance of the substrate processing system. The at least one control circuit is configured to control the maintenance device to transfer a magnetic levitation type moving device between the vacuum transfer chamber and the maintenance device using the transfer robot.

[0006] According to one exemplary embodiment of the present disclosure, a technique that enables maintenance of a substrate processing system is provided.

[0007] This is a diagram showing the system configuration of an example integrated system according to one exemplary embodiment. This is a schematic plan view showing the configuration of a substrate processing system according to one exemplary embodiment. This is a diagram showing the configuration of a substrate processing system according to one exemplary embodiment. This is a diagram showing a schematic mobile device that may be used in a substrate processing system according to one exemplary embodiment. This is a perspective view showing a planar motor and mobile device that may be used in a substrate processing system according to one exemplary embodiment. This is a schematic perspective view showing a mobile device of an example of an opening / closing unit in a substrate processing system according to one exemplary embodiment. This is a schematic cross-sectional view showing the configuration of a maintenance device according to one exemplary embodiment. This is a schematic plan view showing the configuration inside the housing chamber of a maintenance device according to one exemplary embodiment. This is a diagram showing an example of an end effector. This is a diagram showing an example of an end effector. This is a diagram showing an example of an end effector. This is a diagram showing a maintenance device and transport module according to one exemplary embodiment. This is a diagram showing a maintenance device and transport module according to one exemplary embodiment. This is an enlarged view of the connection part between the maintenance device and the substrate processing system according to one exemplary embodiment. This is a diagram showing an example of the power supply configuration in a maintenance device according to one exemplary embodiment. This is a diagram showing an example of the power supply configuration in a maintenance device according to one exemplary embodiment. This is a diagram showing an example of the power supply configuration in a maintenance device according to one exemplary embodiment. This is a diagram showing an example of the power supply configuration in a maintenance device according to one exemplary embodiment. This is a diagram showing an example of the power supply configuration in a maintenance device according to one exemplary embodiment. This is a diagram showing the flow of movement of the maintenance device by a mobile mechanism that mounts the main body of the maintenance device in an integrated system according to one exemplary embodiment. This is a flowchart showing a maintenance method according to one exemplary embodiment. This is a cross-sectional view showing the connection state between a substrate processing system and a maintenance device according to one exemplary embodiment. This is a diagram showing the connection state between a substrate processing system and a maintenance device according to one exemplary embodiment. This is a cross-sectional view showing a maintenance device according to another exemplary embodiment.This is a plan view showing a maintenance device according to another exemplary embodiment. This is a cross-sectional view showing a mobile storage device that can be used in an integrated system according to one exemplary embodiment. This is a cross-sectional view showing the connection between the maintenance device and the mobile storage device according to one exemplary embodiment. This is a diagram showing another example of a mobile device. This is a diagram showing another example of a mobile device. This is a diagram showing another example of a mobile device. This is a front cross-sectional view showing an example of a storage module that can be used as a maintenance device according to one exemplary embodiment. This is a side cross-sectional view showing an example of a storage module that can be used as a maintenance device according to one exemplary embodiment. This is a diagram showing an example of a post-processing module that can be used in an integrated system according to one exemplary embodiment. This is a block diagram of a computer (a type of circuit) capable of realizing the various control modes described herein. This is a cross-sectional view showing a maintenance device according to yet another exemplary embodiment. This is a plan view showing a maintenance device according to yet another exemplary embodiment.

[0008] Various exemplary embodiments will be described in detail below with reference to the drawings. In each drawing, the same or corresponding parts will be denoted by the same reference numerals.

[0009] Figure 1 shows the system configuration of an example of an integrated system according to one exemplary embodiment. The integrated system 1 (or maintenance system) includes at least one substrate processing system 2, at least one maintenance device 3, and at least one control circuit. As shown in Figure 1, in one embodiment, the integrated system 1 may include a plurality of substrate processing systems 2 and a plurality of maintenance devices 3. Also, in one embodiment, at least one control circuit may include a central control device 4. Furthermore, the integrated system 1 may further include at least one moving mechanism 120. In one embodiment, the integrated system 1 may include a plurality of moving mechanisms 120.

[0010] The integrated control unit 4 (i.e., integrated control circuit) processes computer-executable instructions that cause the substrate processing system 2, the maintenance device 3, and the mobile mechanism 120 to perform the various processes described herein. The integrated control unit 4 may be configured to control each unit of the substrate processing system 2, the maintenance device 3, and the mobile mechanism 120 to perform the various processes described herein. In one embodiment, part or all of the integrated control unit 4 may be included in at least one of the substrate processing system 2, the maintenance device 3, or the mobile mechanism 120. The integrated control unit 4 may include a processing unit 4a1, a storage unit 4a2, and a communication interface 4a3. The integrated control unit 4 is implemented, for example, by a computer 4a. The processing unit 4a1 may be configured to perform various control operations by reading a program from the storage unit 4a2 and executing the read program. This program may be stored in the storage unit 4a2 in advance, or it may be obtained via a medium when needed. The obtained program is stored in the storage unit 4a2 and read from the storage unit 4a2 and executed by the processing unit 4a1. The medium may be various storage media readable by the computer 4a, or it may be a communication line connected to the communication interface 4a3. The processing unit 4a1 may be a CPU (Central Processing Unit). The storage unit 4a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 4a3 may communicate with the board processing system 2, the maintenance device 3, and the mobile mechanism 120 via a communication line such as a LAN (Local Area Network). The communication that the integrated control unit 4 makes with the board processing system 2, the maintenance device 3, and the mobile mechanism 120 may be wireless communication.

[0011] Figure 2 is a schematic plan view showing the configuration of a substrate processing system according to one exemplary embodiment. Each of the multiple substrate processing systems 2 may have the configuration shown in Figure 2. Figure 3 is a schematic diagram showing the configuration of a substrate processing system according to one exemplary embodiment. As shown in Figure 3, each of the multiple substrate processing systems 2 may include each unit of the substrate processing system 2 shown in Figure 2, at least one maintenance device 3, and a control device 44 (i.e., a control circuit). At least one control circuit of the integrated system 1 may include a control device 44.

[0012] The control device 44 can process computer-executable instructions that cause the substrate processing system 2 and the maintenance device 3 to perform the various processes described herein. The control device 44 may be configured to control each unit of the substrate processing system 2 and the maintenance device 3 to perform the various processes described herein. In one embodiment, part or all of the control device 44 may be included in at least one of the units of the substrate processing system 2 or the maintenance device 3. The control device 44 may include a processing unit 4a11, a storage unit 4a22, and a communication interface 4a33. The control device 44 is implemented, for example, by a computer 4aa. The processing unit 4a11 may be configured to perform various control operations by reading a program from the storage unit 4a22 and executing the read program. This program may be stored in the storage unit 4a22 in advance, or it may be obtained via a medium when needed. The obtained program is stored in the storage unit 4a22 and read from the storage unit 4a22 and executed by the processing unit 4a11. The medium may be various storage media readable by the computer 4aa, or it may be a communication line connected to the communication interface 4a33. The processing unit 4a11 may be a CPU (Central Processing Unit). The storage unit 4a22 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 4a33 may communicate with each unit of the board processing system 2 and the maintenance device 3 via a communication line such as a LAN (Local Area Network). The communication that the control device 44 makes with each unit of the board processing system 2 and the maintenance device 3 may be wireless communication.

[0013] The substrate processing system 2 may include an atmospheric section 10 and a depressurization section 11, as shown in Figure 2. The substrate processing system 2 has a configuration in which the atmospheric section 10 and the depressurization section 11 are integrally connected via load lock chambers 20 and 21. The atmospheric section 10 includes an atmospheric module that performs a desired processing on the substrate W under atmospheric pressure. The depressurization section 11 includes a depressurization module that performs a desired processing on the substrate W under reduced pressure.

[0014] The atmospheric section 10 includes an atmospheric transport module 30 and a load port 32. The atmospheric transport module 30 includes an atmospheric transport chamber and a substrate transport mechanism 50. The load port 32 is configured to support a container 31, such as a FOUP, which is placed on it. The container 31 is configured to store a plurality of substrates W within it. The atmospheric section 10 may further include an orienter module and a storage module. The orienter module and / or storage module may be provided adjacent to the atmospheric transport chamber. The orienter module is configured to adjust the horizontal orientation of the substrates W. The storage module is configured to store a plurality of substrates W within it.

[0015] The internal space of the atmospheric transport chamber may have a substantially rectangular parallelepiped shape. The atmosphere inside the atmospheric transport chamber is maintained at atmospheric pressure. Multiple (e.g., five) load ports 32 are arranged in parallel along one side that constitutes the long side of the atmospheric transport chamber. Load lock chambers 20, 21 are arranged in parallel along the other side that constitutes the long side of the housing of the atmospheric transport chamber.

[0016] The substrate transport mechanism 50 may be located inside an atmospheric transport chamber. The substrate transport mechanism 50 includes a transport arm 51, a turntable 52, and a rotating mounting table 53. The transport arm 51 is configured to hold and move the substrate W. The turntable 52 is configured to rotatably support the transport arm 51. The rotating mounting table 53 mounts the turntable 52. Guide rails 54 are also provided in the internal space of the atmospheric transport chamber. The guide rails 54 extend along the longitudinal direction of the atmospheric transport chamber. The rotating mounting table 53 is mounted on the guide rails 54. The substrate transport mechanism 50 is configured to be movable along the guide rails 54.

[0017] Each of the load lock chambers 20 and 21 is configured to temporarily hold the substrate W in its internal space. Furthermore, each of the load lock chambers 20 and 21 is configured to allow switching the atmosphere in its internal space between atmospheric pressure and a reduced pressure atmosphere (vacuum atmosphere). Each of the load lock chambers 20 and 21 is provided to connect the atmospheric transport chamber and the vacuum transport chamber 40c of the vacuum transport module 40 of the reduced pressure section 11 (described later) via gate valves 22 and 23.

[0018] The depressurization unit 11 includes a vacuum transport module 40 and a plurality of process modules 60. The vacuum transport module 40 includes a vacuum transport chamber 40c. The vacuum transport module 40 is configured to maintain a vacuum atmosphere in the internal space (vacuum transport space) of the vacuum transport chamber 40c. The vacuum transport chamber 40c is connected to load lock chambers 20 and 21. The vacuum transport chamber 40c is also connected to the processing chambers 60c of the plurality of process modules 60. The vacuum transport module 40 is configured to transport the substrate W between the internal space of the vacuum transport chamber 40c and the processing chamber 60c of a selected process module from the plurality of process modules 60, under a vacuum atmosphere. In one embodiment, the vacuum transport module 40 may transport the substrate W loaded into the load lock chamber 20 to the processing chamber 60c of a selected process module from the plurality of process modules 60, and then transport the substrate W, after the desired processing has been performed in the selected process module, to the load lock chamber 21.

[0019] In one embodiment, the vacuum transfer chamber 40c may have a plurality of first openings 41. Each of the plurality of first openings 41 connects the internal space of the vacuum transfer chamber 40c to the internal space of the processing chambers 60c of the plurality of process modules 60. Furthermore, the vacuum transfer chamber 40c may have a second opening 42. The second opening 42 is provided to connect the internal space of the vacuum transfer chamber 40c to the outside of the substrate processing system 2.

[0020] Each of the multiple process modules 60 includes a processing chamber 60c. Each processing chamber 60c of the multiple process modules 60 is located adjacent to the vacuum transfer chamber 40c and connected to the vacuum transfer chamber 40c. Each of the multiple process modules 60 is configured to perform processes such as film deposition and etching on the substrate W under a vacuum atmosphere inside the processing chamber 60c. In the example shown in Figure 2, the substrate processing system 2 includes six process modules 60, but the number of process modules 60 in the substrate processing system 2 may be less than six or more than six.

[0021] In one embodiment, the substrate processing system 2 may include a transport unit 70, an opening / closing unit 80, and a valve unit 90. The transport unit 70 is configured to support and transport the substrate W. The opening / closing unit 80 is configured to open and close a first opening 41. The valve unit 90 is configured to open and close a second opening 42. Each of the transport unit 70, the opening / closing unit 80, and the valve unit 90 may be a magnetically levitated unit, and may be configured to move a magnetically levitated mobile device.

[0022] At least one moving device may be arranged inside the vacuum transfer chamber 40c. At least one moving device is a magnetic levitation type moving device. In one embodiment, at least one moving device may include a moving device 72 and a moving device 81. The moving device 72, together with the planar motor 71, constitutes a transfer unit 70. The moving device 81, together with the planar motor 71, constitutes an opening / closing unit 80. Alternatively, a moving device similar to the moving device 81, together with the planar motor 71, may constitute a valve unit 90.

[0023] Hereinafter, Figures 4 to 6 will be referenced along with Figure 2. Figure 4 is a schematic diagram showing a movable device that may be used in a substrate processing system according to one exemplary embodiment. Figure 5 is a perspective view showing a planar motor and movable device that may be used in a substrate processing system according to one exemplary embodiment. Figure 6 is a schematic perspective view showing a movable device of an example of an opening / closing unit in a substrate processing system according to one exemplary embodiment.

[0024] To move a magnetically levitated mobile device within a vacuum transfer chamber 40c, the substrate processing system 2 may include a planar motor 71. The planar motor 71 is provided, for example, on the bottom surface of the vacuum transfer chamber 40c. As shown in Figure 5, the planar motor 71 includes a plurality of coils 71a. The plurality of coils 71a may be arranged two-dimensionally along the bottom surface of the vacuum transfer chamber 40c.

[0025] In one example, the mobile device 72 may include an end effector 72a, two links 72b, and two bases 72c, as shown in Figure 4. The end effector 72a is configured to hold the substrate W. Each link 72b connects the end effector 72a to the base 72c. One end of each link 72b is rotatably connected to the end effector 72a about a vertical rotation axis 72d. The other end of each link 72b is rotatably connected to the corresponding base 72c about a vertical rotation axis 72e. The mobile device 72 can extend or retract the two links 72b while maintaining the orientation of the end effector 72a by changing the distance D between the two rotation axes 72e (or the two bases 72c).

[0026] As shown in Figure 5, the moving device 72 includes a plurality of permanent magnets 72f. The plurality of permanent magnets 72f are arranged in a base 72c. The base 72c, and thus the moving device 72, moves on the planar motor 71 by the magnetic field generated by the plurality of coils 71a of the planar motor 71.

[0027] Each of the multiple coils 71a is supplied with current individually from the drive unit. The current from the drive unit to each of the multiple coils 71a is controlled by the control device 44. The control device 44 can move or rotate the moving device 72 by controlling the energization of each coil 71a of the planar motor 71 (i.e., the current supply from the drive unit to each coil 71a, for example, the current value) so that the position of the base 72c is at a desired position. The control device 44 can move the substrate W held by the end effector 72a of the moving device 72 by controlling the energization of each coil 71a of the planar motor 71 (i.e., the current supply from the drive unit to each coil 71a, for example, the current value). Under the control of the control device 44, the moving device 72 receives the substrate W in the load lock chamber 20 into the end effector 72a in the vacuum transport chamber 40c and transports it to the designated processing chamber 60c. Furthermore, under the control of the control device 44, the moving device 72 holds the substrate W, which has undergone the specified processing in the processing chamber 60c, with the end effector 72a and transports it to the load lock chamber 21.

[0028] As shown in Figure 6, the moving device 81 has a valve body 81a and a base 81b. The valve body 81a is a member that closes the first opening 41 and is formed to be larger than the first opening 41 and smaller than the second opening 42. The valve body 81a is provided with a sealing member 81c to hermetically seal the first opening 41 with the valve body 81a. The sealing member 81c is, for example, an O-ring. The valve body 81a is connected to the base 81b. The base 81b is configured similarly to the base 72c and includes a plurality of permanent magnets (not shown) arranged therein. The base 81b, and by extension the moving device 81, moves on the planar motor 71 by the magnetic field generated by the plurality of coils 71a of the planar motor 71.

[0029] The control device 44 can control the position, orientation, and levitation amount of the base 81b by controlling the energization of each coil 71a of the planar motor 71 (i.e., the current supply from the drive unit to each coil 71a, for example, the current value). The control device 44 can also move or rotate the moving device 81 by controlling the energization of each coil 71a of the planar motor 71 (i.e., the current supply from the drive unit to each coil 71a) to set the position of the base 81b to a specified position. The control device 44 can open and close the first opening 41 with the valve body 81a of the moving device 81 by controlling the energization of each coil 71a of the planar motor 71.

[0030] The valve unit 90 includes a movable device having a valve body (gate valve) similar to the valve body 81a that can close the second opening 42, and a base similar to the base 81b. The movable device of the valve unit 90 can open and close the second opening 42 with the valve body by controlling the energization of each coil 71a of the planar motor 71 by the control device 44 (i.e., the supply of current from the drive unit to each coil 71a, for example, the current value).

[0031] The maintenance device 3 is configured to be detachably connected to each substrate processing system 2 for maintenance of each substrate processing system 2. In one embodiment, the maintenance device 3 may be used to replace magnetic levitation type moving devices such as the moving device 72 of the transport unit 70, the moving device 81 of the opening / closing unit 80, and the moving device of the valve unit 90. The maintenance device 3 may be configured as a transport device for magnetic levitation type moving devices. Alternatively, the maintenance device 3 may be configured as a housing device for magnetic levitation type moving devices. The maintenance device 3 will be described below using the case in which the moving device 72 is replaced as an example.

[0032] The maintenance device 3 moves to the location of the substrate processing system 2 having the mobile device 72 that needs to be replaced, under the control of at least one control circuit of the integrated system 1, for example, the central control device 4, and connects to the vacuum transport chamber 40c of the substrate processing system 2. The substrate processing system 2 can move the mobile device 72 that needs to be replaced to a position in front of the second opening 42 within the vacuum transport chamber 40c of the substrate processing system 2 by controlling the energization of the planar motor 71, under the control of at least one control circuit of the integrated system 1, for example, the control device 44. Once the replacement of the mobile device 72 by the maintenance device 3 is complete, the connection between the maintenance device 3 and the substrate processing system 2 is released under the control of at least one control circuit of the integrated system 1, for example, the control device 44. The maintenance device 3 may also house one or more unused mobile devices 72 in the storage chamber described later.

[0033] The configuration of the maintenance device 3 for replacing mobile devices will be described below with reference to Figures 7 to 9. Figure 7 is a schematic cross-sectional view showing the configuration of a maintenance device according to one exemplary embodiment. Figures 8 and 9 are schematic plan views showing the configuration inside the housing chamber of the maintenance device according to one exemplary embodiment.

[0034] In one embodiment, the maintenance device 3 may include a main body 3M, as shown in Figure 7. The main body 3M may include a storage chamber 100, an equipment chamber 110, and a transport robot RT1. The storage chamber 100 includes an opening 102 for connecting the storage chamber 100 and the vacuum transport chamber 40c to each other, and a gate valve 103 for opening and closing the opening 102.

[0035] The transport robot RT1 is housed in a housing chamber 100. As shown in Figures 8 and 9, the transport robot RT1 has an end effector EE. In one example, the transport robot RT1 may be an articulated transport robot, as shown in Figures 7 and 8. In another example, the transport robot RT1 may be a sliding transport robot, as shown in Figure 9. In the sliding transport robot RT1, the end effector EE is configured to be movable along a rail R. In the sliding transport robot RT1, the rail R may be configured to be extendable and retractable. Note that the transport robot RT1 may be a transport robot of a type other than articulated or sliding.

[0036] Figures 10 to 12 each show an example of an end effector. The end effector EE of the transport robot RT1 is configured to support or hold a mobile device 72. As shown in Figure 10, the end effector EE may include two arms EEa. Each of the two arms EEa includes side walls EEs and a bottom wall EEb. The side walls EEs of the two arms EEa extend substantially parallel to each other. The bottom walls EEb of the two arms EEa extend from the side walls EEs of the two arms EEa to provide an opening that is narrower than the distance between the side walls EEs of the two arms EEa. In the example of Figure 10, the mobile device 72 is supported between the side walls EEs of the two arms EEa and on the bottom walls EEb of the two arms EEa.

[0037] In the example of Figure 11, each of the two arm portions EEa includes only a side wall similar to the side wall EEs in the example of Figure 10. The opening between the two arm portions EEa is closed by the bottom wall EEb. In the example of Figure 12, the end effector EE includes an actuator EEd. The actuator EEd makes it possible to adjust the distance between the two arm portions EEa. In the example of Figure 12, the end effector EE can hold the moving device 72 by adjusting the width of the two arm portions EEa with the actuator EEd and clamping the moving device 72 with the two arm portions EEa.

[0038] Refer again to Figure 7. As described above, the maintenance device 3 includes an equipment chamber 110. The maintenance device 3 further includes an exhaust mechanism 111, a gas supply mechanism 112, a drive mechanism 113, a battery 114, and a control unit 115. The exhaust mechanism 111, gas supply mechanism 112, drive mechanism 113, battery 114, and control unit 115 are located within the equipment chamber 110. The exhaust mechanism 111, gas supply mechanism 112, drive mechanism 113, and battery 114 are controlled by the control unit 115. At least one control circuit of the integrated system 1 may include the control unit 115.

[0039] The exhaust mechanism 111 is connected to the internal space of the containment chamber 100 and exhausts the internal space of the containment chamber 100. The exhaust mechanism 111 includes, for example, a pressure regulating valve (not shown) and a vacuum pump (not shown). The vacuum pump may include a turbomolecular pump, a roughing pump, or a combination thereof. The exhaust mechanism 111 can reduce the pressure in the internal space of the containment chamber 100 to a predetermined vacuum level.

[0040] Furthermore, the exhaust mechanism 111 may be connected to the opening 102. In this case, the exhaust mechanism 111 is connected via an exhaust passage to a connection space formed by the communication between the opening 102 and the second opening 42 when the maintenance device 3 and the vacuum transfer chamber 40c are connected. The exhaust mechanism 111 can evacuate the connection space so as to reduce the pressure in the connection space to a predetermined vacuum level before the opening 102 is opened by the gate valve 103.

[0041] In one embodiment, the exhaust mechanism 111 does not have to be located inside the equipment chamber 110. When the maintenance device 3 is not connected to the vacuum transport chamber 40c, the pressure in the internal space of the containment chamber 100 can be reduced to a predetermined vacuum level by an exhaust mechanism (not shown) via a passage (not shown) that communicates with the internal space of the containment chamber 100 through the wall of the containment chamber 100.

[0042] Figures 13 and 14 show a maintenance device and a transport module according to one exemplary embodiment. In one embodiment, as shown in Figure 13, when the maintenance device 3 is connected to the vacuum transport chamber 40c, the exhaust mechanism 118 may be connected to the internal space of the containment chamber 100 via two interconnected passages 116 and 117. The passage 116 is formed in the wall of the containment chamber 100 and extends between the wall surface of the containment chamber 100 and the internal space of the containment chamber 100, which forms the connection surface A between the containment chamber 100 and the vacuum transport chamber 40c. The passage 117 is formed in the wall of the vacuum transport chamber 40c and extends from the wall surface of the vacuum transport chamber 40c, which forms the connection surface A, and joins a pipe connecting the exhaust mechanism 118 to the internal space of the vacuum transport chamber 40c. In the example of Figure 13, the pressure in the internal space of the containment chamber 100 can be reduced to a predetermined vacuum level by the exhaust mechanism 118. Furthermore, the internal space of the containment chamber 100 may be evacuated by a separate exhaust mechanism from the exhaust mechanism 118 of the vacuum transfer chamber 40c.

[0043] Furthermore, as shown in Figure 14, the exhaust mechanism 118 may be connected via a passage 119 to the aforementioned connection space formed by the connection between the maintenance device 3 and the vacuum transfer chamber 40c. The passage 119 is formed in the wall of the vacuum transfer chamber 40c, extends from the portion forming the connection space at the second opening 42, and joins a pipe connecting the exhaust mechanism 118 to the internal space of the vacuum transfer chamber 40c. The pressure in the connection space can be reduced to a predetermined vacuum level via the passage 119 by the exhaust mechanism 118 before the opening 102 is opened by the gate valve 103. Note that the exhaust of the connection space may be performed by an exhaust mechanism separate from the exhaust mechanism 118 of the vacuum transfer chamber 40c.

[0044] FIG. 15 is an enlarged view of the connection part between a maintenance device and a substrate processing system according to one exemplary embodiment. A positioning protrusion P may be provided on one of the side surfaces of the vacuum transfer chamber 40c connected to the maintenance device 3 and the side surface of the maintenance device 3 connected to the vacuum transfer chamber 40c, and a recess for fitting the protrusion P may be provided on the other side. In the example of FIG. 15, a protrusion P is formed on the side surface of the vacuum transfer chamber 40c connected to the maintenance device 3, and a recess for fitting the protrusion P is formed on the side surface of the maintenance device 3 connected to the vacuum transfer chamber 40c.

[0045] Further, a seal member Q may be provided on either one of the side surfaces of the vacuum transfer chamber 40c connected to the maintenance device 3 and the side surface of the maintenance device 3 connected to the vacuum transfer chamber 40c. The seal member Q can enhance the airtightness of the above-mentioned connection space.

[0046] Referring to FIG. 7 again. The gas supply mechanism 112 is connected to the internal space of the housing chamber 100 and is configured to supply an inert gas such as nitrogen gas to the internal space of the housing chamber 100. The gas supply mechanism 112 includes, for example, an on-off valve (not shown) and a flow rate adjustment valve (not shown). Note that the gas supply mechanism 112 may not be provided in the equipment chamber 110. The gas supply mechanism 112 may be configured to supply air into the housing chamber 100 by controlling a leak valve (not shown) provided near a passage (not shown) that communicates the internal space of the housing chamber 100 with the outside of the housing chamber 100. Alternatively or in addition to this, the maintenance device 3 may be connected to the gas supply mechanism of the substrate processing system 2, and gas may be supplied from the gas supply mechanism to the maintenance device 3. For example, the air used for opening and closing the gate valve 103 may be supplied from the gas supply mechanism of the substrate processing system 2 to the maintenance device 3.

[0047] The drive mechanism 113 is a drive source of the transfer robot RT1 and is controlled by the control unit 115. The control unit 115 includes a communication interface for communicating between the maintenance device 3 and an external device. The control unit 115, for example, communicates with a device external to the maintenance device 3 wirelessly or wiredly to control each unit of the maintenance device 3.

[0048] The maintenance device 3 may be configured to receive power for the operation of the maintenance device 3 from the substrate processing system 2 in a state where the maintenance device 3 is connected to the vacuum transfer chamber 40c. That is, the maintenance device 3 may be configured to receive power for the operation of each unit of the maintenance device 3, such as the evacuation mechanism 111, the gas supply mechanism 112, the drive mechanism 113, and the control unit 115, from the substrate processing system 2.

[0049] Each unit of the maintenance device 3, such as the evacuation mechanism 111, the gas supply mechanism 112, the drive mechanism 113, and the control unit 115, may operate using or partially using the power stored in the battery 114. When the maintenance device 3 is not connected to the vacuum transfer chamber 40c, the battery 114 may be connected to a power source (not shown) external to the maintenance device 3 to store electricity. Also, when the maintenance device 3 is connected to the vacuum transfer chamber 40c, power may be stored in the battery 114 from the substrate processing system 2 having this vacuum transfer chamber 40c via the electrical connector 100c.

[0050] Note that the maintenance device 3 may not have the battery 114. In this case, when the maintenance device 3 is connected to the vacuum transfer chamber 40c, the power for driving each unit of the maintenance device 3 is supplied to each unit from the substrate processing system 2 having this vacuum transfer chamber 40c via the electrical connector 100c. For example, the power for driving the transfer robot RT1 of the maintenance device 3 is supplied from the substrate processing system 2 to the drive mechanism 113.

[0051] Figures 16 to 20 are diagrams showing examples of power supply configurations in a maintenance device according to one exemplary embodiment. In the example shown in Figure 16, the substrate processing system 2 includes a power box 40P, and the vacuum transport module 40 includes an electrical connector 40ec (first electrical connector). The power box 40P is configured to distribute AC power and is electrically connected to the electrical connector 40ec. When the maintenance device 3 is connected to the vacuum transport chamber 40c, the electrical connector 40ec of the vacuum transport module 40 and the electrical connector 100c (second electrical connector) of the maintenance device 3 are connected to each other. The electrical connector 40ec may be provided on the wall surface of the vacuum transport chamber 40c that forms the connection surface A between the housing chamber 100 and the vacuum transport chamber 40c, and the electrical connector 100c may be provided on the wall surface of the housing chamber 100 that forms the connection surface A. Alternatively, the electrical connector 40ec and the electrical connector 100c may be provided on other parts of the substrate processing system 2 and other parts of the maintenance device 3, respectively. The electrical connector 100c is electrically connected to each unit of the maintenance device 3 (for example, the drive mechanism 113). In the example shown in Figure 16, each unit of the maintenance device 3 operates using AC power supplied from the substrate processing system 2 via the electrical connectors 40ec and 100c.

[0052] In the example shown in Figure 17, the maintenance device 3 further includes an AC / DC converter 100AD and a DC / AC inverter 100DA. The AC / DC converter 100AD includes a rectifier. The input of the AC / DC converter 100AD is connected to an electrical connector 100c. The output of the AC / DC converter 100AD may be connected to a battery 114. In this case, the battery 114 is charged with DC power generated from AC power supplied from the vacuum transport module 40 via electrical connectors 40ec and 100c. The output of the AC / DC converter 100AD and the battery 114 are also connected to the input of the DC / AC inverter 100DA. The output of the DC / AC inverter 100DA is electrically connected to each unit of the maintenance device 3 (e.g., the drive mechanism 113). The DC / AC inverter 100DA generates AC power from the input DC power and supplies the generated AC power to each unit of the maintenance device 3. In the example shown in Figure 17, each unit of the maintenance device 3 operates using AC power supplied from the vacuum transport module 40 via electrical connectors 40ec and 100c, which is then generated by the AC / DC converter 100AD and DC / AC inverter 100DA without passing through the battery 114, as well as AC power supplied from the vacuum transport module 40 via electrical connectors 40ec and 100c, which is then generated by the AC / DC converter 100AD, battery 114, and DC / AC inverter 100DA.

[0053] In the example shown in Figure 18, the electrical connector 100c is connected to the input of the AC / DC converter 100AD and to the power input of each unit of the maintenance device 3. The battery 114 is charged with DC power generated by the AC / DC converter 100AD from AC power supplied from the vacuum transport module 40 via electrical connectors 40ec and 100c. The battery 114 is also connected to the input of the DC / AC inverter 100DA. The output of the DC / AC inverter 100DA is electrically connected to each unit of the maintenance device 3 (for example, the drive mechanism 113). In the example shown in Figure 18, each unit of the maintenance device 3 operates using AC power supplied from the vacuum transport module 40 via electrical connectors 40ec and 100c, and AC power generated by the AC / DC converter 100AD, the battery 114, and the DC / AC inverter 100DA from AC power supplied from the vacuum transport module 40 via electrical connectors 40ec and 100c.

[0054] In the example shown in Figure 19, each unit of the maintenance device 3 (for example, the drive mechanism 113) operates using alternating current power generated by the DC / AC inverter 100DA from the DC power supplied from the mobile mechanism 120. In the example shown in Figure 20, the battery 114 is charged by the DC power supplied from the mobile mechanism 120. Each unit of the maintenance device 3 (for example, the drive mechanism 113) operates using alternating current power generated by the DC / AC inverter 100DA from the DC power supplied from the battery 114.

[0055] Hereinafter, Figure 21 will be referred to in conjunction with Figure 7. Figure 21 is a diagram illustrating the flow of movement of a maintenance device by a mobile mechanism that mounts the main body of the maintenance device in an integrated system according to one exemplary embodiment. The maintenance device 3 may include a mobile mechanism 120 in addition to the main body 3M. The mobile mechanism 120 may be integrated with the main body 3M. In this case, the mobile mechanism 120 may operate using power from the battery 114. Alternatively, the mobile mechanism 120 may be detachable from the main body 3M. Hereinafter, an example in which the mobile mechanism 120 is detachable from the main body 3M will be described.

[0056] The maintenance device 3 is moved to the connection position by the moving mechanism 120 for connection with the vacuum transfer chamber 40c. The moving mechanism 120 may include a main body 121 and wheels 122. The main body 121 contains a power source such as a battery, a steering mechanism, and a control unit 129 that controls them. The wheels 122 are rotated by the power source in the main body 121, and the steering mechanism in the main body 121 moves the maintenance device 3 in a direction controlled by the steering mechanism in the main body 121. At least one control circuit of the integrated system 1 may include the control unit 129.

[0057] As shown in Figure 21, four support parts 104 extend downward from the bottom of the main body 3M of the maintenance device 3. The main body 3M is supported by the four support parts 104. The moving mechanism 120 receives commands from the central control device 4 and operates under the control of the control unit 129. First, the moving mechanism 120 moves into the space below the main body 3M, which is mounted on the four support parts 104. Next, the moving mechanism 120 raises the lift mechanism 123 from the top surface of the moving mechanism 120 to lift the main body 3M. This creates a state in which the maintenance device 3, including the main body 3M and the moving mechanism 120, is movable. In this state, the moving mechanism 120 moves together with the main body 3M to move the maintenance device 3 to the connection position.

[0058] The control by at least one control circuit described above in the integrated system 1 and the maintenance method in the integrated system 1 will be explained below with reference to Figures 22 to 24. Figure 22 is a flowchart showing a maintenance method according to one exemplary embodiment. Figure 23 is a cross-sectional view showing the connection state between the substrate processing system and the maintenance device according to one exemplary embodiment. Figure 24 is a diagram showing the connection state between the substrate processing system and the maintenance device according to one exemplary embodiment. Hereinafter, as an example of maintenance on the substrate processing system 2, the maintenance method shown in Figure 22 (hereinafter referred to as "Method MT") will be explained using the case where the maintenance device 3 replaces the movable device 72 of the substrate processing system 2 as an example. Note that the maintenance performed by the maintenance device 3 on the substrate processing system 2 is not limited to the replacement of the movable device 72.

[0059] In method MT, maintenance of the substrate processing system 2 may be initiated when the control device 44 of the substrate processing system 2 detects that maintenance is required. For example, the replacement of the moving device 72 may be initiated when the control device 44 detects an abnormality in the moving device 72 in the vacuum transfer chamber 40c. Alternatively, maintenance of the substrate processing system 2, such as the replacement of the moving device 72, may be performed periodically.

[0060] When maintenance of the substrate processing system 2, such as the replacement of the movable device 72, is triggered, in process STa, the central control device 4 issues a command to connect the maintenance device 3 to one of the multiple substrate processing systems 2 that requires maintenance, such as the replacement of the movable device 72 (hereinafter referred to as "maintenance target system 2").

[0061] Next, process STb is performed. In process STb, the maintenance device 3, having received a command from the central control unit 4, moves to the system to be maintained 2 and connects the maintenance device 3 to the vacuum transport chamber 40c of the system to be maintained 2. For example, the central control unit 4 communicates with the control unit 115 of the maintenance device 3 and identifies the main body 3M of the maintenance device 3, which is in a standby state. The central control unit 4 then issues a command to move the moving mechanism 120 to the position where the main body 3M of the maintenance device 3 is in standby state. Upon receiving the command, the moving mechanism 120 moves to the position of the main body 3M of the maintenance device 3 under the control of the control unit 129.

[0062] Next, the moving mechanism 120 supports the main body 3M of the maintenance device 3 so that it can move together with the main body 3M of the maintenance device 3 under the control of the control unit 129. For example, the main body 3M of the maintenance device 3 is placed on the moving mechanism 120. Next, the moving mechanism 120 autonomously moves the maintenance device 3 (main body 3M) to the position of the system 2 to be maintained under the control of the control unit 129. As a result, as shown in Figures 23 and 24, the maintenance device 3 is connected to the system 2 to be maintained (for example, the side of the vacuum transport chamber 40c). Note that the maintenance device 3 may also be moved by an operator and connected to the system 2 to be maintained.

[0063] Once the maintenance device 3 is connected to the system 2 to be maintained, process STc may be performed. In process STc, the maintenance device 3 receives power for its operation from the system 2 to be maintained, as described above. This power may be stored in the battery 114, as described above.

[0064] As described above, the power from the battery 114 may be used to drive each unit of the maintenance device 3 (see Figures 17 and 18). The power from the system under maintenance 2 may also be directly used to drive each unit of the maintenance device 3, as described above (see Figure 18). Alternatively, as described above, power obtained by converting the power from the system under maintenance 2 may be used to drive each unit of the maintenance device 3 (see Figure 17). Furthermore, the power received from the system under maintenance 2 may be directly used to drive each unit of the maintenance device 3, along with the power from the battery 114 (see Figure 18). Alternatively, the power obtained by converting the power from the system under maintenance 2 may be used to drive each unit of the maintenance device 3, along with the power from the battery 114 (see Figure 17). If the maintenance device 3 is not equipped with a battery 114, the maintenance device 3 may directly use power received from the system under maintenance 2 to drive each unit of the maintenance device 3 (see Figure 16). The power supplied to the maintenance device 3 may be either AC power or DC power.

[0065] Furthermore, after the maintenance device 3 is connected to the system to be maintained 2, the control device 44 of the system to be maintained 2 may issue a command to control the maintenance device 3. In one embodiment, once the state in which the maintenance device 3 is connected to the system to be maintained 2 is established, step STd may be performed. In step STd, the control device 44 of the system to be maintained 2 controls the exhaust mechanism 118 (including a valve not shown) to exhaust the aforementioned connection space formed by the connection between the second opening 42 and the opening 102, i.e., the space K3 closed by the valve body of the valve unit 90 and the gate valve 103, thereby setting the atmosphere of space K3 to a vacuum atmosphere. Also, if the atmosphere of the internal space of the containment chamber 100 is not a vacuum atmosphere, as shown in Figure 13, the control device 44 may control the exhaust mechanism 118 (including a valve not shown) to set the atmosphere of the internal space of the containment chamber 100 to a vacuum atmosphere. Furthermore, if the maintenance device 3 has an exhaust mechanism 111, the control unit 115 may, in response to a command from the control device 44, control the exhaust mechanism 111 (including a valve not shown) to create a vacuum atmosphere in the internal space of the containment chamber 100 and in space K3.

[0066] Subsequently, the control device 44 causes the valve unit 90 to open the second opening 42, and also issues a command to the control unit 115 to cause the gate valve 103 to open the opening 102 under the control of the control unit 115. This creates a state in which the internal space of the vacuum transport chamber 40c in a vacuum atmosphere and the internal space of the containment chamber 100 are in communication via the second opening 42 and the opening 102. Alternatively, the internal space of the vacuum transport chamber 40c in an atmospheric pressure atmosphere and the internal space of the containment chamber 100 may also be in communication via the second opening 42 and the opening 102.

[0067] Next, the mobile device 72 is replaced. In one embodiment, steps STe and STf are performed. In step STe, as shown in Figures 23 and 24, in response to a command from the control device 44, the control unit 115 controls the transport robot RT1 to move the mobile device 72, which is not yet in use, from the storage chamber 100 of the maintenance device 3 to the internal space of the vacuum transport chamber 40c through the opening 102 and the second opening 42. Next, the control device 44 controls the drive unit of the planar motor 71 to magnetically levitate the mobile device 72. After that, in response to a command from the control device 44, the control unit 115 retracts the transport robot RT1 into the internal space of the storage chamber 100. As a result, the mobile device 72 is placed inside the vacuum transport chamber 40c.

[0068] If there is a mobile device 72 to be recovered in the vacuum transport chamber 40c, in step STf, the control device 44 controls the drive unit of the planar motor 71 to magnetically levitate the mobile device 72 to be recovered. The mobile device 72 may be moved to the vicinity of the second opening 42 under the control of the control device 44. Then, in response to a command from the control device 44, the control unit 115 extends the transport robot RT1 so that the end effector EE is positioned under the mobile device 72. The control device 44 then controls the drive unit of the planar motor 71 to place the mobile device 72 on the end effector EE of the transport robot RT1. After that, in response to a command from the control device 44, the control unit 115 controls the transport robot RT1 with the mobile device 72 placed on the end effector EE of the transport robot RT1 to retract the transport robot RT1 and transport the mobile device 72 into the internal space of the containment chamber 100.

[0069] Next, process STg is performed. In process STg, the connection between the system to be maintained 2 and the maintenance device 3 is disconnected. For example, the control device 44 controls the valve unit 90 to close the second opening 42. Also, in response to a command from the control device 44, the control unit 115 controls the gate valve 103 to close the opening 102. Then, under the control of the control device 44, a gas such as air is introduced into the space K3 from a pipe (not shown) that communicates with the aforementioned space K3, and the pressure in space K3 is returned to atmospheric pressure.

[0070] Next, the central control unit 4 issues a command to the control unit 129 of the mobile mechanism 120. Upon receiving the command, the control unit 129 controls the mobile mechanism 120 to separate the maintenance device 3, which has housed the used mobile device 72 in the storage chamber 100, from the system to be maintained 2, and return the maintenance device 3 (main body 3M) to the standby position. Subsequently, in the reverse order of the sequence shown in Figure 21, the control unit 129 controls the mobile mechanism 120 to separate the mobile mechanism 120 from the main body 3M of the maintenance device 3.

[0071] In step STb, a maintenance device 3 that does not contain the mobile device 72 may be moved and connected to the system 2 to be maintained. In this case, step STf may be performed without performing step STe. Alternatively, after step STf, another maintenance device 3 containing the mobile device 72 may be connected to the system 2 to be maintained, and step STe may be performed. The multiple maintenance devices 3 of the integrated system 1 may be divided into a first maintenance device that loads the mobile device 72 into the vacuum transport chamber 40c and a second maintenance device that unloads the mobile device 72 from the vacuum transport chamber 40c. In this case, it is possible to suppress the adhesion of particles attached to the mobile device 72 unloaded from the vacuum transport chamber 40c to the mobile device 72 loaded into the vacuum transport chamber 40c.

[0072] As described above, the integrated system 1 allows a magnetic levitation mobile device to be transported into the vacuum transport chamber 40c and unloaded from the vacuum transport chamber 40c without exposing the vacuum transport chamber 40c to the atmosphere. Furthermore, the integrated system 1 makes it possible to perform maintenance on multiple substrate processing systems 2 using a common maintenance device.

[0073] Hereinafter, a maintenance device according to another exemplary embodiment will be described with reference to Figures 25 and 26. Figure 25 is a cross-sectional view showing a maintenance device according to another exemplary embodiment. Figure 26 is a plan view showing a maintenance device according to another exemplary embodiment.Hereinafter, the maintenance device 3A shown in Figures 25 and 26 will be described in terms of differences from the configuration of the maintenance device 3 shown in Figure 7.The maintenance device 3A can be used as the maintenance device 3 in the integrated system 1.As shown in Figure 26, in the maintenance device 3A, the housing chamber 100 has a partition wall 101 in the internal space of the housing chamber 100.The partition wall 101 defines space K1 and space K2 in the internal space of the housing chamber 100, separating space K1 and space K2 from each other.In the maintenance device 3A, for example, the mobile device 72 before use may be housed in space K1, and the mobile device 72 after use may be housed in space K2.Other configurations of the maintenance device 3A may be the same as the corresponding configuration of the maintenance device 3 shown in Figure 7. For example, the various configurations described above, such as the configuration of the transport robot RT1 and end effector EE of the maintenance device 3, the configuration for exhausting the internal space of the housing chamber 100 and the aforementioned connection space of the maintenance device 3, and the supply of power for the operation of the maintenance device 3 from the substrate processing system 2, can also be adopted in the maintenance device 3A.

[0074] Refer to Figure 27 below. Figure 27 is a cross-sectional view showing a mobile device storage device that can be used in an integrated system according to one exemplary embodiment. In order to place the mobile device 72 into the maintenance device 3 before it is connected to the substrate processing system 2, the maintenance device 3 may be connected to a mobile device storage device 600, and the mobile device 72 stored in the mobile device storage device 600 may be acquired into the maintenance device 3 by a transport robot RT1.

[0075] As shown in Figure 27, the mobile device storage device 600 includes an upper chamber 610, a lower chamber 611, and a moving mechanism 606. The upper chamber 610 is provided with an opening 612 and a gate valve 613 for opening and closing the opening 612. A stage 603 and a drive unit 604 are provided inside the upper chamber 610. A cassette 602 is placed on the stage 603. The cassette 602 contains a plurality of mobile devices 72 before use. The plurality of mobile devices 72 are arranged vertically within the cassette 602. Space is provided inside the cassette 602 to accommodate at least one used mobile device 72. Multiple types of mobile devices may be contained inside the cassette 602.

[0076] The stage 603 is raised and lowered by the drive unit 604. This allows the transport robot RT1 of the maintenance device 3, which is connected to the mobile device storage device 600, to move the mobile device 72 before use from the cassette 602 through the opening 612 into the internal space of the storage chamber 100. When all the mobile devices 72 in the cassette 602 have become used mobile devices 72, the cassette 602 is replaced with the cassette 602 containing the mobile devices 72 before use.

[0077] The lower chamber 611 is equipped with an exhaust device 652, a gas supply device 654, a communication unit 655, a control unit 656, and a storage unit 657. The communication unit 655 is, for example, a wireless communication circuit and communicates wirelessly with the overall control device 4, the maintenance device 3 (for example, the control unit 115 and the control unit 129), and the substrate processing system 2 (for example, the control unit 44). A sensor 650 is provided on the outer wall of the mobile object storage device 600. The sensor 650 senses the surroundings of the mobile object storage device 600 and outputs the sensing results to the control unit 656. The sensor 650 is, for example, an image sensor and outputs an image of the surroundings of the mobile object storage device 600 to the control unit 656.

[0078] The exhaust device 652 is connected to the space inside the upper chamber 610 via a valve 651. The exhaust device 652 draws gas from inside the upper chamber 610 via the valve 651 and discharges the drawn gas to the outside of the mobile storage device 600. This reduces the pressure inside the space inside the upper chamber 610 to a predetermined vacuum level.

[0079] The gas supply device 654 is connected to the upper chamber 610 via a valve 653. The gas supply device 654 supplies an inert gas, such as nitrogen gas, into the upper chamber 610 via the valve 653.

[0080] The opening and closing of valves 651 and 653 are controlled by the control unit 656. The storage unit 657 is a ROM, HDD, or SSD, and stores data and programs used by the control unit 656. The control unit 656 is a processor such as a CPU or DSP, and controls each part of the mobile storage device 600 by reading and executing programs in the storage unit 657.

[0081] The control unit 656 moves the mobile storage device 600 to the location of the maintenance device 3 connected to the substrate processing system 2, as instructed by the central control unit 4, by controlling the moving mechanism 606 using, for example, the sensing results from the sensor 650. The moving mechanism 606 has a main body 660 and wheels 661. The main body 660 is equipped with a power source such as a battery, a power source, and a steering mechanism. The wheels 661 rotate using the power source in the main body 660 and move the mobile storage device 600 in a direction controlled by the steering mechanism in the main body 660. The moving mechanism 606 may also move the mobile storage device 600 by means other than the wheels 661, such as a walking type, as long as it can move the mobile storage device 600. Furthermore, the moving mechanism 606 may be configured to be separable from the mobile body storage device 600. Similar to the moving mechanism 120 in Figure 21, the moving mechanism 606 may be moved to the designated location of the mobile body storage device 600 by a command from the central control device 4, and the moving mechanism 606 may move the mobile body storage device 600 to the designated location of the maintenance device 3.

[0082] Figure 28 is a cross-sectional view showing the connection state between a maintenance device and a mobile storage device according to one exemplary embodiment. After the mobile storage device 600 moves to the position of the maintenance device 3, the mobile storage device 600 is connected to the maintenance device 3. As shown in Figure 28, the connection surface between the mobile storage device 600 and the maintenance device 3 may be different from the connection surface A described above. The wall of the upper chamber 610 that forms the connection surface between the mobile storage device 600 and the maintenance device 3 is provided with the aforementioned opening 612 and gate valve 613. In addition, the wall of the storage chamber 100 of the maintenance device 3 that forms the connection surface between the mobile storage device 600 and the maintenance device 3 is provided with an opening that connects to the opening 612 and a gate valve that opens and closes this opening.

[0083] When moving the mobile device 72 from the mobile storage device 600 to the maintenance device 3, the connection space formed by the connection between the opening 612 and the opening in the wall of the storage chamber 100 is exhausted. This exhaust of the connection space may be performed by an exhaust device 652 via a passage (not shown) provided in the side wall of the upper chamber 610. Alternatively, this exhaust of the connection space may be performed by an exhaust mechanism 111 via a passage (not shown) provided in the side wall of the storage chamber 100. Alternatively, if a passage (not shown) connecting this connection space to an exhaust mechanism 118 for the vacuum transport chamber 40c is provided in the walls of the storage chamber 100 and the vacuum transport chamber 40c, the exhaust of the connection space may be performed from this passage. Next, the opening 612 and the opening in the wall of the storage chamber 100 are opened by the gate valve 613 and the gate valve of the storage chamber 100. This creates a state in which the internal space of the storage chamber 100 and the internal space of the upper chamber 610 are in communication. In this state, the control device 44 and / or the control unit 115 may control the transport robot RT1 to acquire the mobile device 72 in the mobile storage device 600 into the storage chamber 100. The acquisition of the mobile device 72 may be carried out in an atmospheric environment or in a reduced-pressure environment. Furthermore, the acquisition of the mobile device 72 from the mobile storage device 600 to the storage chamber 100 by the transport robot RT1 may be carried out before the maintenance device 3 is connected to the substrate processing system 2. In that case, either the maintenance device 3 or the mobile storage device 600 moves to the position of the other, and the maintenance device 3 and the mobile storage device 600 are connected to each other.

[0084] Other examples of mobile devices will be described below with reference to Figures 29 to 31. Each of Figures 29 to 31 is a diagram showing another example of a mobile device. In addition to mobile device 72 and mobile device 81, the mobile devices used in the substrate processing system 2 may also be mobile devices 1000, 1100, and 1200 shown in Figures 29 to 31, respectively. Each of the mobile devices 1000, 1100, and 1200 may be a magnetic levitation type mobile device, similar to mobile device 72.

[0085] The mobile device 1000 shown in Figure 29 is a cleaning device used for cleaning the inside of a vacuum transport chamber 40c. The mobile device 1000 has a base 1011 containing multiple permanent magnets, a link 1012, and a cleaning brush 1013 connected to the base 1011 via the link 1012 and movable in the vertical direction. The mobile device 1100 shown in Figure 30 is a retrieval device for retrieving other magnetic levitation devices. The mobile device 1100 is configured to support other mobile devices with support parts 1112 extending from both sides of a base 1111 containing multiple permanent magnets. The mobile device 1200 shown in Figure 31 is an observation device with a sensor. The mobile device 1200 has a base 1211 containing multiple permanent magnets, a support part 1212 connected to the base 1211, and a sensor 1213 (e.g., a camera sensor, an optical sensor, etc.) supported by the support part 1212. The support part 1212 may be configured to be extendable or retractable. The connection point of the support portion 1212 to the base 1211 (in the figure, the block at the base end of the support portion 1212 on the base 1211) may be configured to rotate horizontally. The support portion 1212 may be configured to move vertically from this connection point. In the illustrated example, the sensor 1213 is located below the block supported by the support portion 1212, but it may also be located above the block supported by the support portion 1212 or to the side of the block (front, side, or rear).

[0086] Each of the mobile devices 1000, 1100, and 1200 may also be transported from the internal space of the storage chamber 100 of the maintenance device 3 to the internal space of the vacuum transport chamber 40c, similar to mobile devices 72 and 81. Furthermore, each of the mobile devices 1000, 1100, and 1200 may also be transported from the internal space of the vacuum transport chamber 40c to the internal space of the storage chamber 100 of the maintenance device 3, similar to mobile devices 72 and 81. Additionally, each of the mobile devices 1000, 1100, and 1200 may also be stored in the mobile body storage device 600, similar to mobile devices 72 and 81.

[0087] The following describes another maintenance device that can be used as the maintenance device 3 in the integrated system 1. Figure 32 is a front cross-sectional view showing an example of a storage module that can be used as a maintenance device according to one exemplary embodiment. Figure 33 is a side cross-sectional view showing an example of a storage module that can be used as a maintenance device according to one exemplary embodiment. In one embodiment, the maintenance device 3 may be configured as a storage module capable of storing components (for example, consumables) in the substrate processing system 2, as shown in the storage module 722 in Figures 32 and 33.

[0088] The storage module 722 has a storage section for storing consumable parts, and a stage (mounting platform) and a rotating section for aligning the consumable parts. The storage section houses consumable parts such as edge rings, coverings, and upper electrodes. The edge rings, coverings, and upper electrodes are consumable parts of a plasma processing apparatus used as a process module 60. The storage module 722 allows the consumable parts to be moved from the storage section to the stage by the end effector 72a of the moving device 72. The aligned consumable parts are transported into the vacuum transport chamber 40c by the moving device 72. The storage module 722 includes an opening interposed between the vacuum transport chamber 40c and the storage module 722, and a gate valve 723 that can open and close the opening.

[0089] As shown in Figure 32, the storage module 722 includes a chamber 730 and an equipment chamber 740. Chamber 730 is mounted on a frame 724, and the equipment chamber 740 is located above chamber 730. Chamber 730 is capable of switching the pressure of its internal space between vacuum and atmospheric pressure. In addition, the internal space of chamber 730 is supplied with a purge gas, for example, N2. ２ An inert gas, such as a gas, is supplied, and the pressure inside the chamber 730 is adjustable. The atmosphere inside the equipment chamber 740 is atmospheric pressure.

[0090] The storage module 722 further includes a storage unit 739. The storage unit 739 is installed inside the chamber 730. The storage unit 739 has a stage 731 and a basket 734 provided below the stage 731. The storage unit 739 is movable up and down by a ball screw 736. Inside the equipment chamber 740 are a line sensor 732 for detecting the orientation of consumable parts and a motor 738 for driving the ball screw 736. A control unit 725, which constitutes the control unit of the maintenance device, may also be provided inside the equipment chamber 740. At least one control circuit of the integrated system 1 may include the control unit 725. Between the chamber 730 and the equipment chamber 740, a window 741 made of quartz or the like is provided so that the line sensor 732 can receive light from the light-emitting unit 733, which will be described later.

[0091] The stage 731 supports the consumable member placed on it. The stage 731 also has a light-emitting section 733 facing the line sensor 732. The stage 731 is rotatable in the θ direction by a rotating section built into the surface directly below the mounting surface, and rotates the consumable member, such as the edge ring 750, placed on the mounting surface of the stage 731 to a predetermined orientation. That is, the stage 731 performs alignment (positioning) of the edge ring 750 under the control unit 725. The stage 731 is an example of a mounting base and a rotating section. The following describes an example in which the edge ring 750 is used as the consumable member.

[0092] The line sensor 732 detects the amount of light emitted from the light-emitting unit 733 and outputs the detected amount of light to the control unit 725. The control unit 725 detects the orientation flat of the edge ring 750 by utilizing the fact that the detected amount of light changes depending on whether or not there is an orientation flat on the edge ring 750. Based on the detected orientation flat, the control unit 725 detects the orientation of the edge ring 750. The line sensor 732 is, for example, a line sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor). The control unit 725 aligns the edge ring 750 according to the detected orientation of the edge ring 750.

[0093] A cassette 735 is placed inside the basket 734. The cassette 735 is removable from the basket 734 and houses the edge ring 750 inside. The cassette 735 is open to the front and rear sides of the storage module 722. The basket 734 and cassette 735 are examples of storage compartments.

[0094] The storage unit 739 has a guide 737 on its side that is supported by a ball screw 736. The ball screw 736 connects the upper and lower surfaces of the chamber 730, passes through the upper surface of the chamber 730, and is connected to a motor 738 in the equipment chamber 740. The portion of the ball screw 736 that passes through the chamber 730 is sealed so that the ball screw 736 can rotate. As the ball screw 736 rotates due to the motor 738, the storage unit 739 can move vertically (in the Z-axis direction). Note that the ball screw 736 and motor 738 are an example of a lifting mechanism.

[0095] As shown in Figure 33, the storage module 722 is connected to the vacuum transport chamber 40c via a gate valve 723. When the aforementioned opening is opened by the gate valve 723, the end effector 72a can be inserted into the chamber 730. The moving device 72 can insert the end effector 72a into the chamber 730 to load and unload the edge ring 750 from the cassette 735, and to place and retrieve the edge ring 750 onto the stage 731. The chamber 730 is also provided with a door 742. The door 742 is opened and closed when removing or installing the cassette 735 inside the chamber 730.

[0096] The storage module 722 is moved by the moving mechanism 120, similar to the maintenance device 3 described above, and connected to the vacuum transport chamber 40c. Once the storage module 722 is connected to the vacuum transport chamber 40c, it is possible to transport consumable parts such as the edge ring 750 between the internal space of the vacuum transport chamber 40c and the internal space of the chamber 730 of the storage module 722 using the moving device 72, for example, under a vacuum atmosphere.

[0097] Refer to Figure 34 below. Figure 34 shows an example of a post-processing module that can be used in an integrated system according to one exemplary embodiment. In one embodiment, a post-processing module such as the post-processing module 900 shown in Figure 34 may be connected to the substrate processing system 2 (e.g., a vacuum transport chamber 40c), similar to the maintenance device 3, and used for post-processing of substrates processed in the process module 60 of the substrate processing system 2. The post-processing module 900 is configured, for example, as a heat treatment module.

[0098] The post-processing module 900 includes a processing chamber 910 and an equipment chamber 920. The processing chamber 910 is configured to allow for pressure reduction in its internal space. The internal space of the processing chamber 910 can be depressurized using an exhaust mechanism 118 while the post-processing module 900 is connected to the substrate processing system 2 (for example, a vacuum transfer chamber 40c).

[0099] The post-processing module 900 further includes a substrate support 911, a heater 912, and a control unit 921. The substrate support 911 is located within the processing chamber 910. The heater 912 is located within the substrate support 911. The control unit 921 is located within the equipment chamber 920. At least one control circuit of the integrated system 1 may include the control unit 921. The heater 912, under the control of the control unit 921, heats the substrate on the substrate support 911, thereby performing heat treatment on the substrate within the processing chamber 910 under reduced pressure. The temperature of the heat treatment is, for example, in the range of 200°C to 800°C, but is not limited to this range.

[0100] The post-processing module 900, like the maintenance device 3 described above, is moved by the moving mechanism 120 and connected to the vacuum transport chamber 40c. Once the post-processing module 900 is connected to the vacuum transport chamber 40c, the substrate can be transported between the internal space of the vacuum transport chamber 40c and the internal space of the processing chamber 910 using the moving device 72, for example, under a vacuum atmosphere. As described above, the post-processing module 900 can perform heat treatment on the substrate placed on the substrate support portion 911 under reduced pressure conditions.

[0101] The following describes examples of circuits (control circuits) that can constitute at least one control circuit of the integrated system 1, such as each of the control unit 4, control unit 44, control unit 115, control unit 129, control unit 656, control unit 725, and control unit 921, or at least one of these.

[0102] Figure 35 illustrates a block diagram of a computer (a type of circuit) capable of implementing the various control modes described herein. Furthermore, the control modes of this disclosure can be implemented as a system, method, and / or computer program product. The computer program product may include a computer-readable storage medium on which computer-readable program instructions causing one or more processing units to execute the modes of this embodiment are recorded.

[0103] A computer-readable storage medium may be a tangible device capable of storing instructions used by an instruction execution device (processor). A computer-readable storage medium may, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. More specific examples of computer-readable storage media include, but are not exhaustive, flexible disks, hard disks, solid-state drives (SSDs), random-access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash), static random-access memory (SRAM), compact disks (CDs or CD-ROMs), digital multipurpose disks (DVDs), memory cards or memory sticks (and suitable combinations thereof). In this disclosure, a computer-readable storage medium should not be interpreted as a transient signal itself, such as, for example, radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., optical pulses passing through optical fiber cables), or electrical signals transmitted via wires.

[0104] The computer-readable program instructions described in this disclosure can be downloaded from a computer-readable storage medium to a suitable computing device or processing device, or they can be downloaded to an external computer or external storage device via a global network (i.e., the Internet), a local area network, a wide area network, and / or a wireless network. Networks include transmission copper wires, optical fiber, wireless communications, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface of each computing device or processing device can receive computer-readable program instructions from the network, transfer those computer-readable program instructions, and store them in a computer-readable storage medium within the computing device or processing device.

[0105] Computer-readable program instructions for performing the operations of the Disclosure may include machine language instructions and / or microcode. These instructions can be compiled or interpreted from source code written in any combination of one or more programming languages, including assembly language, Basic, Fortran, Java®, Python, R, C, C++, C#, etc. Computer-readable program instructions can be fully executed on a user's personal computer, notebook computer, tablet, or smartphone, or may be fully executed on a remote computer or computer server, or on any combination of these computing devices. The remote computer or computer server may be connected to one or more of the user's devices via a computer network, including a local area network, a wide area network, or a global network (i.e., the Internet). Alternatively, electronic circuits, including, for example, programmable logic circuits, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), may be configured or customized to execute computer-readable program instructions using information from the computer-readable program instructions and implement embodiments of the Disclosure.

[0106] This specification will describe aspects of the present disclosure with reference to flowcharts and block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. Those skilled in the art will understand that each block in the flowcharts and block diagrams, as well as combinations of blocks in the flowcharts and block diagrams, can be implemented by computer-readable program instructions.

[0107] Computer-readable program instructions capable of implementing the systems and methods described in this disclosure may be supplied to one or more processors (and / or one or more cores within a processor) of a general-purpose computer, a dedicated computer, or other programmable device. This makes it possible to generate a machine that constructs a system for implementing the functions specifically shown in the flowcharts and block diagrams of this disclosure, through instructions executed via the processors of the computer or other programmable device. These computer-readable program instructions may also be stored in a computer-readable storage medium that can instruct the computer, programmable device, and / or other device to function in a particular manner. The computer-readable storage medium storing the instructions is a product containing instructions that implement the embodiments of the functions specifically shown in the flowcharts and block diagrams of this disclosure.

[0108] Furthermore, computer-readable program instructions can be loaded into a computer, another programmable device, or other device, and a series of operations can be executed on that computer, other programmable device, or other device to realize a computer implementation process. Therefore, the functions specifically shown in the flowcharts and block diagrams of this disclosure can be realized by instructions executed on a computer, another programmable device, or other device.

[0109] Figure 35 is a functional block diagram showing a network system 800 in which one or more computers and servers are connected to a network. In one embodiment, the hardware and software environments illustrated in Figure 35 may serve as an exemplary platform for implementing the software and / or methods relating to the present disclosure.

[0110] Referring to Figure 35, the network system 800 may include, but is not limited to, a computer 805, a network 810, a remote computer 815, a web server 820, a cloud storage server 825, and a computer server 830. In some embodiments, one or more examples of the functional blocks illustrated in Figure 35 may be used.

[0111] Further details of computer 805 are shown in Figure 35. The functional blocks illustrated within computer 805 are merely illustrative examples for constructing exemplary functions and do not encompass all of its functions. Details of the remote computer 815, web server 820, cloud storage server 825, and computer server 830 are not shown, but these computers and devices may also include functions similar to those shown for computer 805.

[0112] Computer 805 may be a personal computer (PC), desktop computer, laptop computer, tablet computer, netbook computer, personal data device (PDA), smartphone, or other programmable electronic device capable of communicating with other devices on the network 810.

[0113] The computer 805 may include a processing unit 835, a bus 837, a memory 840, a non-volatile storage device 845, a network interface 850, a peripheral device interface 855, and a display device interface 865. In some embodiments, these functions may be implemented as individual electronic subsystems (integrated circuit chips or combinations of chips and associated devices), while in other embodiments, some of the combinations of functions may be implemented on a single chip (also known as a system-on-a-chip or SoC).

[0114] The processing unit 835 may be one or more single-chip or multi-chip microprocessors designed and / or manufactured by Intel Corporation, Advanced Micro Devices, Inc. (AMD), Arm Holdings, Apple Computer, etc. Examples of microprocessors include Intel Corporation's Celeron, Pentium®, Core i3, Core i5, Core i7; AMD's Opteron, Phenom, Athlon, Turion, Ryzen; and Arm's Cortex-A, Cortex-R, Cortex-M, etc.

[0115] Bus 837 may be a proprietary or industry-standard high-speed parallel or serial peripheral interconnect bus such as ISA, PCI, PCI Express (PCI-e), or AGP.

[0116] The memory 840 and the non-volatile storage device 845 may be computer-readable storage media. The memory 840 may include any suitable volatile storage device such as dynamic random access memory (DRAM) and static random access memory (SRAM). The non-volatile storage device 845 may include one or more of the following: flexible disk, hard disk, solid-state drive (SSD), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash), compact disc (CD or CD-ROM), digital multipurpose disc (DVD), memory card, or memory stick.

[0117] The program 848 may be a collection of machine-readable instructions and / or machine-readable data stored in at least one memory, such as a non-volatile storage device 845, and used to create, manage, and control specific software functions as described in detail and illustrated in the drawings of this disclosure. In some embodiments, memory 840 may be much faster than the non-volatile storage device 845. In that case, the program 848 may be transferred from the non-volatile storage device 845 to memory 840 and then executed by the processing unit 835. The program 848 includes computer program code. In one implementation, at least one memory storing the computer program code comprises at least one processing unit (such as a processing circuit described later) for carrying out the control process and claimed advanced embodiments of this disclosure.

[0118] Computer 805 may communicate and interact with other computers via network 810 using network interface 850. Network 810 may be, for example, a local area network (LAN), a wide area network (WAN) such as the Internet, or a combination thereof, and may include wired, wireless, or fiber optic connections. In general, network 810 can be any combination of connections and protocols that support communication between two or more computers and associated devices.

[0119] The peripheral interface 855 may enable data input and output via other devices that can be locally connected to the computer 805. For example, the peripheral interface 855 may enable connection to an external device 860. The external device 860 may include devices such as a keyboard, mouse, keypad, touchscreen, and / or other suitable input devices. The external device 860 may also include portable computer-readable storage media such as a thumb drive, portable optical or magnetic disk, and memory card. Software and data used to implement embodiments of the present disclosure (e.g., program 848) may be stored on such portable computer-readable storage media. In this case, the software may be loaded into the non-volatile storage device 845, or directly into memory 840 via the peripheral interface 855. The peripheral interface 855 may use industry-standard connections such as RS-232 or Universal Serial Bus (USB) to connect to the external device 860.

[0120] The computer 805 may be connected to the display device 870 via the display device interface 865. In one embodiment, the display device 870 may be used to present a command line or a graphical user interface to the user of the computer 805. The display device interface 865 may be connected to the display device 870 using one or more proprietary or industry standard connections such as VGA, DVI, DisplayPort, HDMI®, etc.

[0121] As described above, the network interface 850 enables communication with other computing systems or storage systems or computing devices or storage devices outside of the computer 805. The software programs and data described herein may be downloaded to the non-volatile storage device 845 via the network interface 850 and network 810 from, for example, a remote computer 815, a web server 820, a cloud storage server 825, or a computer server 830. Furthermore, the systems and methods described herein may be implemented by one or more computers connected to the computer 805 via the network interface 850 and network 810. For example, in one embodiment, the systems and methods described herein may be implemented by a combination of a remote computer 815, a computer server 830, or computers interconnected on network 810.

[0122] The data, datasets, and / or databases used in the embodiments of the systems and methods described herein may be stored in or downloaded from a remote computer 815, a web server 820, a cloud storage server 825, or a computer server 830.

[0123] The circuits used in this application can be defined as one or more of the following: electronic components (such as semiconductor devices), a plurality of electronic components directly connected to each other or interconnected via electronic communication, a computer, a network of computer devices, a remote computer, a web server, a cloud storage server, or a computer server. For example, each of the one or more of the computer, remote computer, web server, cloud storage server, and computer server may be included as a component of the circuit, or may include the circuit. In some embodiments, one or more examples of these components may be used, and each of the one or more examples of these components may also be included in the circuit, or may include the circuit. In some embodiments, a circuit represented by a network system may include a serverless computing system that corresponds to virtualized hardware resources. A circuit represented by a computer may be a personal computer (PC), a desktop computer, a laptop computer, a tablet computer, a netbook computer, a personal data device (PDA), a smartphone, or other programmable electronic device that can communicate with other devices on a network. The circuit may be a general-purpose computer, a dedicated computer, or other programmable device described herein that includes one or more processing units. Each processing unit may be one or more single-chip microprocessors or multi-chip microprocessors. One or more processing units are considered processing circuits or circuits because they incorporate transistors and other circuits. The circuits can implement the systems and methods described in this disclosure based on computer-readable program instructions. These program instructions are supplied to one or more processing units (and / or one or more cores within processing units) of one or more general-purpose computers, dedicated computers, or other programmable devices described herein. This makes it possible to generate a machine that constructs a system for implementing the functions specifically shown in the flowcharts and block diagrams of this disclosure, through instructions contained within the circuits or executed via one or more processing units of a programmable device containing the circuits.Alternatively, a circuit may be a pre-programmed structure, such as a programmable logic device or an application-specific integrated circuit. A circuit is considered a circuit whether it is used alone or in combination with other programmable circuits or other pre-programmed circuits.

[0124] In light of the above teachings, it is clear that numerous modifications and variations of the present invention are possible. Therefore, it should be understood that, within the scope of the appended claims, the present invention can be implemented in forms other than those specifically described herein.

[0125] Although various exemplary embodiments have been described above, the invention is not limited to the exemplary embodiments described above, and various additions, omissions, substitutions, and modifications may be made. Furthermore, it is possible to combine elements from different embodiments to form other embodiments.

[0126] For example, in the integrated system 1, the maintenance device 3B shown in Figures 36 and 37 may be used as the maintenance device 3. Figure 36 is a cross-sectional view showing a maintenance device according to yet another exemplary embodiment. Figure 37 is a plan view showing a maintenance device according to yet another exemplary embodiment. Hereinafter, the maintenance device 3B will be described in terms of the differences in configuration from the maintenance device 3A shown in Figures 25 and 26.

[0127] As shown in Figures 36 and 37, the maintenance device 3B does not include the transport robot RT1. The housing chamber 100 of the maintenance device 3B is provided with a planar motor 105. The planar motor 105 is positioned along the bottom surface of the housing chamber 100 and is configured to move a magnetically levitating mobile device such as the mobile device 72. The planar motor 105 includes a plurality of coils (not shown) arranged similarly to the plurality of coils 71a of the planar motor 71 described above. The current to each of the plurality of coils of the planar motor 105 is controlled by the overall control device 4, the control device 44, or the control unit 115. By controlling the energization of each coil of the planar motor 105, i.e., the current supply to each coil, the mobile device can be moved within the housing chamber 100. In the maintenance device 3B, the mobile device 72 before use may be housed in space K1, and the mobile device 72 after use may be housed in space K2.

[0128] Furthermore, other configurations of the maintenance device 3B may be the same as the corresponding configuration of the maintenance device 3 shown in Figure 7. For example, the various configurations described above, such as the exhaust configurations for the internal space of the housing chamber 100 and the aforementioned connection space of the maintenance device 3, and the supply of power for the operation of the maintenance device 3 from the substrate processing system 2, can also be adopted in the maintenance device 3B.

[0129] Furthermore, each of the maintenance devices 3, 3A, and 3B described above may be positioned along at least one of the pair of side walls of the vacuum transfer chamber 40c. As shown in Figure 2, the multiple process modules 60 are arranged to form a row along the pair of side walls of the vacuum transfer chamber 40c. Therefore, each of the maintenance devices 3, 3A, and 3B described above may be positioned along at least one of the pair of side walls of the vacuum transfer chamber 40c to form a row with the process modules 60. Also, each of the maintenance devices 3, 3A, and 3B may be connected to and fixed to at least one of the pair of side walls of the vacuum transfer chamber 40c or to the wall of the vacuum transfer chamber 40c having the second opening 42.

[0130] Herein, various exemplary embodiments included in this disclosure are described in [E1] to [E15] below.

[0131] [E1] A substrate processing system comprising: a vacuum transport module including a vacuum transport chamber; a plurality of process modules, each including a processing chamber connected to the vacuum transport chamber, and configured to perform substrate processing on substrates transported from the vacuum transport chamber within the processing chamber; a maintenance device having a transport robot and configured to be detachably connected to the vacuum transport chamber for maintenance of the substrate processing system; and at least one control circuit, wherein the at least one control circuit is configured to control the maintenance device to transport a magnetic levitation mobile device between the vacuum transport chamber and the maintenance device using the transport robot.

[0132] [E2] The integrated system according to E1, wherein at least one control circuit is configured to generate a command to connect the maintenance device to the vacuum transport chamber in order to transport a magnetically levitating mobile device between the vacuum transport chamber and the maintenance device.

[0133] [E3] The integrated system according to E2, wherein the maintenance device is configured to receive power for the operation of the maintenance device from the substrate processing system while the maintenance device is connected to the vacuum transfer chamber.

[0134] [E4] The integrated system according to E3, wherein the maintenance device further includes a battery and is configured to operate at least a portion of the maintenance device using the power of the battery.

[0135] [E5] The integrated system according to E4, wherein the vacuum transport module includes a first electrical connector, and the maintenance device further includes a second electrical connector connected to the first electrical connector in connection with the maintenance device's connection to the vacuum transport chamber.

[0136] [E6] The integrated system according to E5, wherein the maintenance device is configured to charge the battery with the power received from the substrate processing system.

[0137] [E7] The integrated system according to E6, wherein the maintenance device further includes an AC / DC converter connected between the second electrical connector and the battery.

[0138] [E8] The integrated system according to any one of E4 to E7, wherein the maintenance device further includes a moving mechanism for moving the maintenance device, and the maintenance device is configured to move the maintenance device to the vacuum transport chamber using the moving mechanism in response to a command.

[0139] [E9] The integrated system according to E8, wherein the moving mechanism is configured to operate using power from the battery.

[0140] [E10] The maintenance device is an integrated system according to any one of E2 to E7, comprising: a main body including the transport robot; and a movable mechanism detachable from the main body, configured to move to the main body in response to a command and to move together with the main body to the vacuum transport chamber.

[0141] [E11] The integrated system according to any one of E1 to E10, wherein the magnetically levitated mobile device includes at least one of a cleaning device, a retrieval device for retrieving other magnetically levitated mobile devices, and an observation device having a sensor.

[0142] [E12] The integrated system according to any one of E1 to E11, wherein the maintenance device includes a housing chamber for housing the transport robot, the housing chamber being configured to be detachably connected to the vacuum transport chamber for the maintenance of the substrate processing system, and the transport robot being configured to transport a magnetic levitation mobile device between the vacuum transport chamber and the housing chamber.

[0143] [E13] The integrated system according to E12, wherein the housing chamber includes an internal space for housing the transport robot and a first opening communicating with the internal space, the maintenance device includes a first gate valve provided to open and close the first opening, the vacuum transport chamber includes a vacuum transport space and a second opening communicating with the vacuum transport space, the vacuum transport module includes a second gate valve provided to open and close the second opening, and further comprises at least one exhaust mechanism provided to communicate with the vacuum transport space, the internal space of the housing chamber, and the connecting space formed by the connection of the first opening and the second opening.

[0144] [E14] The integrated system according to E13, wherein the at least one control circuit is configured to control the at least one exhaust mechanism to set the vacuum transport space, the internal space of the containment chamber, and the connection space to a vacuum state when the containment chamber is connected to the vacuum transport chamber and the first gate valve and the second gate valve are closing the first opening and the second opening, and to control the first gate valve and the second gate valve, respectively, to open the first opening and the second opening when the connection space is set to a vacuum state.

[0145] [E15] A maintenance method comprising the steps of: connecting the maintenance device to the vacuum transport chamber in the integrated system described in any one of E1 to E14; and transporting a magnetic levitation type mobile device between the vacuum transport chamber and the maintenance device using the transport robot of the maintenance device.

[0146] From the above description, it will be understood that the various embodiments of this disclosure are described herein for illustrative purposes and can be modified in various ways without departing from the scope and spirit of this disclosure. Accordingly, the various embodiments disclosed herein are not intended to limit the scope and spirit, and the true scope and spirit are shown by the appended claims.

[0147] 1...Integrated system, 4...Central control unit, 2...Substrate processing system, 40...Vacuum transport module, 40c...Vacuum transport chamber, 44...Control unit, 60...Process module, 60c...Processing chamber, 3...Maintenance equipment, 72...Mobile device.

Claims

1. A substrate processing system comprising: a vacuum transport module including a vacuum transport chamber; a plurality of process modules, each including a processing chamber connected to the vacuum transport chamber, and configured to perform substrate processing on substrates transported from the vacuum transport chamber within the processing chamber; a maintenance device having a transport robot and configured to be detachably connected to the vacuum transport chamber for maintenance of the substrate processing system; and at least one control circuit, wherein the at least one control circuit is configured to control the maintenance device to transport a magnetic levitation mobile device between the vacuum transport chamber and the maintenance device using the transport robot.

2. The integrated system according to claim 1, wherein at least one control circuit is configured to generate a command to connect the maintenance device to the vacuum transport chamber in order to transport a magnetically levitating mobile device between the vacuum transport chamber and the maintenance device.

3. The integrated system according to claim 2, wherein the maintenance device is configured to receive power for the operation of the maintenance device from the substrate processing system while the maintenance device is connected to the vacuum transfer chamber.

4. The integrated system according to claim 3, wherein the maintenance device further includes a battery and is configured to operate at least a portion of the maintenance device using the power of the battery.

5. The integrated system according to claim 4, wherein the vacuum transport module includes a first electrical connector, and the maintenance device further includes a second electrical connector connected to the first electrical connector in connection with the connection of the maintenance device to the vacuum transport chamber.

6. The integrated system according to claim 5, wherein the maintenance device is configured to charge the battery with the power received from the substrate processing system.

7. The integrated system according to claim 6, wherein the maintenance device further includes an AC / DC converter connected between the second electrical connector and the battery.

8. The integrated system according to any one of claims 4 to 7, wherein the maintenance device further includes a moving mechanism for moving the maintenance device, and the maintenance device is configured to move the maintenance device to the vacuum transport chamber using the moving mechanism in response to a command.

9. The integrated system according to claim 8, wherein the moving mechanism is configured to operate using power from the battery.

10. The maintenance device comprises a main body including the transport robot, and a movable mechanism detachable from the main body, configured to move to the main body in response to a command and then move together with the main body to the vacuum transport chamber, according to any one of claims 2 to 7.

11. The integrated system according to any one of claims 1 to 7, wherein the magnetic levitation mobile device comprises at least one of a cleaning device, a retrieval device for retrieving other magnetic levitation mobile devices, and an observation device having a sensor.

12. The integrated system according to any one of claims 1 to 7, wherein the maintenance device includes a housing chamber for housing the transport robot, the housing chamber being configured to be detachably connected to the vacuum transport chamber for the maintenance of the substrate processing system, and the transport robot being configured to transport a magnetic levitation mobile device between the vacuum transport chamber and the housing chamber.

13. The integrated system according to claim 12, wherein the housing chamber includes an internal space for housing the transport robot and a first opening communicating with the internal space, the maintenance device includes a first gate valve provided to open and close the first opening, the vacuum transport chamber includes a vacuum transport space and a second opening communicating with the vacuum transport space, the vacuum transport module includes a second gate valve provided to open and close the second opening, and further comprises at least one exhaust mechanism provided to communicate with the vacuum transport space, the internal space of the housing chamber, and the connecting space formed by the connection of the first opening and the second opening.

14. The integrated system according to claim 13, wherein the at least one control circuit is configured to control the at least one exhaust mechanism to set the vacuum transport space, the internal space of the containment chamber, and the connection space to a vacuum state when the containment chamber is connected to the vacuum transport chamber and the first gate valve and the second gate valve are closing the first opening and the second opening, and to control the first gate valve and the second gate valve, respectively, to open the first opening and the second opening when the connection space is set to a vacuum state.

15. A maintenance method comprising the steps of: connecting the maintenance device to the vacuum transport chamber in the integrated system according to any one of claims 1 to 7; and transporting a magnetic levitation type mobile device between the vacuum transport chamber and the maintenance device using the transport robot of the maintenance device.

Images