Management device, management method, and program

Abstract

A management device (100) comprises a first communication unit (108) and a processing unit (102). The first communication unit (108) acquires a first monitoring data sequence, which is a monitoring data sequence (Dx) indicating the situation when a mounting line (L) has mounted one or more components (P) on one or more substrates, in accordance with at least one mounting parameter (f) indicated by the component data (Dc) as a mounting condition for a component (P).

Description

Management device, management method, and program

[0001] The present disclosure relates to a management device for mounting components on a substrate and the like.

[0002] Conventionally, an electronic component mounting system for mounting a plurality of types of components on a substrate has been proposed (see, for example, Patent Document 1). In this electronic component mounting system, the frequency of occurrence of errors is displayed in an error display column for each “type” of the designated “component”. Therefore, the occurrence status of errors can be referred to for a desired type. Further, in the electronic component mounting system, when an event such as a change in component information occurs, the event at that time is displayed on the display screen together with the number of error occurrences. Thereby, the operator can infer the correlation between the occurred errors and events, and can select appropriate component information for reducing errors. Such display is performed by a host system corresponding to the management device. Further, component information is also called component data. In the management device of Patent Document 1 as described above, it is possible to assist in improving the efficiency of the component mounting operation for mounting components on a substrate.

[0003] Japanese Patent No. 5861038

[0004] However, in the management device of Patent Document 1, there is room for improvement in the assistance for improving the efficiency of the component mounting operation.

[0005] Therefore, the present disclosure provides a management device that can more appropriately assist in improving the efficiency of the component mounting operation.

[0006] A management device according to an aspect of the present disclosure includes an acquisition unit that acquires a first monitoring data sequence, which is a monitoring data sequence indicating a situation when a first mounting facility mounts one or more components on one or more substrates according to at least one mounting parameter indicated as a mounting condition of the component by component data, and a processing unit that calculates an index related to the production of a mounting substrate on which the component is mounted based on the first monitoring data sequence, and causes a display unit to display the calculated index related to the production and a reference index in a comparable manner.

[0007] These comprehensive or specific embodiments may be implemented as a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or as any combination of a system, method, integrated circuit, computer program, and recording medium. Furthermore, the recording medium may be a non-temporary recording medium.

[0008] The management device disclosed herein can more effectively support the efficiency of component mounting work.

[0009] Further advantages and effects of one aspect of this disclosure will be made apparent from the specification and drawings. Such advantages and / or effects are provided by several embodiments and configurations described in the specification and drawings, but not all configurations are necessarily required.

[0010] Figure 1 is a diagram showing an example of the configuration of the production system in Embodiment 1. Figure 2 is a diagram showing an example of the configuration of the component mounting device in Embodiment 1. Figure 3 is a diagram showing a partial example of the A-A cross section in Figure 2. Figure 4 is a block diagram showing an example of the functional configuration of the management device and the mounting line in Embodiment 1. Figure 5 is a diagram showing an example of the component library in Embodiment 1. Figure 6 is a diagram showing an example of how the component library is handled in Embodiment 1. Figure 7 is a diagram showing an example of data transmitted from the mounting line to the management device in Embodiment 1. Figure 8 is a diagram illustrating an example of processing operation by the processing unit of the management device in Embodiment 1. Figure 9 is a diagram showing an example of the screen displayed on the first display unit of the management device in Embodiment 1. Figure 10 is a diagram showing another example of the screen displayed on the first display unit of the management device in Embodiment 1. Figure 11 is a diagram illustrating the cumulative period indicated by the cumulative period information in Embodiment 1. Figure 12 is a flowchart showing an example of the processing operation of the management device in Embodiment 1. Figure 13 is a diagram showing an example of the production network system in Embodiment 2. Figure 14 is a diagram showing an example of the screen displayed on the first display unit of the management device in Embodiment 2. Figure 15 is a diagram illustrating the method for calculating the planned target value in Embodiment 2. Figure 16 is a diagram illustrating another example of the screen displayed on the first display unit of the management device in Embodiment 2. Figure 17 is a diagram illustrating an example of changing the planned target value in Embodiment 2. Figure 18 is a flowchart illustrating an example of the processing operation of the management device in Embodiment 2. Figure 19 is a diagram illustrating an example of the display of predicted comparison information in Embodiment 2. Figure 20 is a diagram illustrating another example of the display of predicted comparison information in Embodiment 2. Figure 21 is a diagram illustrating the processing operation of the management device in Embodiment 3. Figure 22 is a diagram illustrating an example of the display of the agreement rate in Embodiment 3. Figure 23 is a diagram illustrating another example of the display of the agreement rate in Embodiment 3. Figure 24 is a diagram illustrating yet another example of the display of the agreement rate in Embodiment 3. Figure 25 is a flowchart illustrating an example of the processing operation of the management device in Embodiment 3.

[0011] A management device according to a first aspect of this disclosure includes: an acquisition unit that acquires a first monitoring data sequence, which is a sequence of monitoring data indicating the situation when a first mounting equipment is mounting one or more components onto one or more substrates in accordance with at least one mounting parameter indicated by component data as a mounting condition for components; and a processing unit that calculates an index relating to the production of a mounted substrate, which is a substrate on which components are mounted, based on the first monitoring data sequence, and displays the calculated production index and a reference index in a comparable manner on a display unit.

[0012] As a result, production indicators and reference indicators are displayed on the display unit in a comparable manner, allowing the operator to objectively evaluate the quality of at least one mounting parameter used in production by comparing the production indicators with the reference indicators. Consequently, if the production indicators are poor, the component data can be changed, thereby more appropriately supporting the efficiency of component mounting work, which involves mounting components onto a circuit board. In other words, in the management device of Patent Document 1, the reference indicators to be compared with the production indicators are not displayed, so the judgment of the quality of at least one mounting parameter used in production is left to the operator. Therefore, the operator can only compare the current production indicators with past production indicators, and the judgment of whether or not to change the component data corresponding to the current production indicators is left to the operator. However, in the first aspect of this disclosure, production indicators and reference indicators are displayed on the display unit in a comparable manner, allowing the operator to objectively evaluate the quality of at least one mounting parameter used in production and objectively determine whether or not to change the component data.

[0013] Furthermore, in the management device according to the second embodiment, the reference indicator may be determined based on a second monitoring data sequence representing each of a plurality of second mounting equipment that satisfy the reference conditions, and which shows the situation when the second mounting equipment has mounted one or more components on one or more substrates according to the same mounting parameter as the at least one mounting parameter. Note that the second embodiment may be subordinate to the first embodiment.

[0014] This makes it possible to determine reference indicators corresponding to the production indicators of each of the multiple second mounting equipment. As a result, the operator can compare the production indicators of the first mounting equipment with the reference indicators of the multiple second mounting equipment, and evaluate the quality of at least one mounting parameter used in mounting parts by that first mounting equipment in a realistic and objective manner, rather than based on the operator's subjective opinion.

[0015] Furthermore, the management device according to the third embodiment may further include an input unit for receiving the standard conditions, and the processing unit may further determine the standard index according to the received standard conditions. The third embodiment may be subordinate to the second embodiment.

[0016] This allows the operator to change the reference conditions in response to input operations to the input unit, and to switch between multiple second mounting equipment that meet the reference conditions. As a result, the operator can objectively evaluate the quality of at least one mounting parameter used for mounting parts by the first mounting equipment from various perspectives by comparing production indicators with various reference indicators.

[0017] Furthermore, in the management device according to the fourth embodiment, the standard condition is the condition that each of the plurality of second mounting equipment has the same equipment attribute, and each of the plurality of second mounting equipment may indicate at least one of the following: the type of component mounting equipment including the second mounting equipment, the type of unit including the second mounting equipment, the mounting line including the second mounting equipment, the factory where the second mounting equipment is installed, the organization that produces or has mounted substrates produced by the second mounting equipment, the intended use of the mounted substrates produced by the second mounting equipment, and the number of mounted substrates produced by the second mounting equipment. Note that the fourth embodiment may be subordinate to the second or third embodiment. Also, the organization may be a manufacturer of mounted substrates, etc.

[0018] This allows the operator to easily switch between the number and range of multiple second-mount equipment units that meet the standard conditions.

[0019] Furthermore, in the management device according to the fifth embodiment, the reference condition is a condition that specifies the location of one or more of the plurality of second mounting equipment, and may indicate at least one of the following: the location of one or more mounting lines including the one or more second mounting equipment, the location of one or more stages provided on each of the one or more mounting lines, and the location of one or more component mounting devices provided on each of the one or more mounting lines. Note that the fifth embodiment may be dependent on any one of the second to fourth embodiments.

[0020] This allows the operator to compare the production indicators of the first mounting equipment with at least one of the following: the reference indicators for the mounting line specified by the reference conditions, the reference indicators for the component mounting equipment specified by the reference conditions, and the reference indicators for the stage specified by the reference conditions.

[0021] Furthermore, the management device according to the sixth embodiment further includes an input unit for receiving component attributes, and the processing unit further determines the reference index based on a second monitoring data sequence, which is a series of monitoring data for each of a plurality of second mounting equipment, and shows the situation when the second mounting equipment mounted one or more components having the component attributes on one or more substrates according to the same mounting parameters as the at least one mounting parameter, and the component attributes may indicate at least one of the component type, component shape, similar components, component variety, component supply form, and component vendor. Note that the sixth embodiment may be dependent on any one of the first to fifth embodiments.

[0022] This makes it possible to determine reference indicators according to the component attributes of multiple second mounting equipment. As a result, operators can compare the production indicators of the first mounting equipment with these reference indicators, and realistically and objectively evaluate the quality of at least one mounting parameter used for mounting components by the first mounting equipment from the perspective of component attributes.

[0023] Furthermore, in the management device according to the seventh embodiment, the actual number included in the first monitoring data column includes at least one of (1) the number of spoilages, the number of suction errors, and the number of recognition errors, and (2) the number of mounting errors, and the processing unit may calculate an index based on the actual number included in the first monitoring data column as an index related to production. Note that the seventh embodiment may be dependent on any one of the first to sixth embodiments.

[0024] This allows the operator to compare at least one of the indicators described in (1) and (2) above with a reference indicator.

[0025] Furthermore, in the management device according to the eighth embodiment, the processing unit may calculate an index indicating the productivity of the mounted substrate produced by the first mounting equipment mounting one or more components, as an index related to the production. Note that the eighth embodiment may be subordinate to any one of the first to seventh embodiments.

[0026] This allows operators to compare the productivity of the assembled circuit boards with a benchmark.

[0027] Furthermore, in the management device according to the ninth embodiment, the position information included in the first monitoring data sequence includes at least one of the suction position and the mounting position, and the processing unit may calculate an index based on the position information included in the first monitoring data sequence as an index related to production. Note that the ninth embodiment may be dependent on any one of the first to sixth embodiments.

[0028] This allows operators to compare location-based metrics with baseline metrics.

[0029] Furthermore, in the management device according to the tenth embodiment, the processing unit may sequentially calculate the production indicators based on the first monitoring data sequence and display the calculated production indicators in chronological order. Note that the tenth embodiment may be subordinate to any one of the first to ninth embodiments.

[0030] This allows production metrics to be displayed in a time-series format, enabling operators to compare these changing production metrics with baseline metrics.

[0031] A management method according to a first aspect of this disclosure is a management method performed by a computer, which acquires a first monitoring data sequence that shows the situation when a first mounting equipment is mounting one or more components on one or more substrates according to at least one mounting parameter indicated by component data as mounting conditions for components, calculates an index for the production of a mounted substrate, which is a substrate on which components are mounted, based on the first monitoring data sequence, and displays the calculated production index and a reference index on a display unit in a comparative manner.

[0032] This makes it possible to achieve the same effects and advantages as the control device according to the first embodiment.

[0033] The comprehensive or specific embodiments of the above-described management device may be implemented as a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or as any combination of the system, method, integrated circuit, computer program, or recording medium. Furthermore, the recording medium may be a non-temporary recording medium.

[0034] The embodiments will be described in detail below with reference to the drawings.

[0035] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, among the components in the following embodiments, those not described in the independent claim representing the highest-level concept will be described as optional components.

[0036] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same component is denoted by the same reference numeral in each figure.

[0037] (Embodiment 1) [Production System] Figure 1 is a diagram showing an example of the configuration of the production system in this embodiment.

[0038] In this embodiment, the production system 1 comprises three mounting lines L (i.e., mounting lines L1 to L3) and a control device 100. In the example shown in Figure 1, the production system 1 has three mounting lines L, but it is not limited to three; it may have one, two, or four or more.

[0039] Each of the mounting lines L1 to L3 is an example of mounting equipment for producing mounted circuit boards. Mounted circuit boards are produced by performing solder printing, component mounting, and reflow operations on circuit boards brought in from the upstream side, and the produced mounted circuit boards are then shipped to the downstream side.

[0040] The management device 100 calculates and displays, for example, indicators related to the production of each mounted board on mounting lines L1 to L3. The management device 100 communicates with these mounting lines L1 to L3 via wireless or wired connection. The wireless connection may be Wi-Fi®, Bluetooth®, ZigBee®, or low-power wireless technology.

[0041] The assembly line L1 includes a line management device 200, a substrate supply device M1, a substrate transfer device M2, a solder printing device M3, component mounting devices M4 and M5, an inspection machine M6, a reflow machine M7, and a substrate recovery device M8. The devices included in the assembly line L1, other than the line management device 200, are arranged in the following order and connected in series: substrate supply device M1, substrate transfer device M2, solder printing device M3, component mounting devices M4 and M5, inspection machine M6, reflow machine M7, and substrate recovery device M8. These devices other than the line management device 200 are hereinafter referred to as work machines. The assembly line L1 does not need to include all of the above work machines, as long as it includes the substrate supply device M1, at least one component mounting device, inspection machine M6, and substrate recovery device M8. Furthermore, the mounting line L1 may include, in addition to the above-mentioned work machines, a soldering device for applying solder to the substrate, a component insertion machine for mounting radial or axial components to the substrate, and so on. Also, the arrangement order of each work machine is not limited to the order described above. For example, the inspection machine M6 may be placed after the reflow machine M7 or the substrate recovery device M8. Alternatively, the functions of the inspection machine M6 may be provided by the component mounting device M4, component mounting device M5, reflow machine M7, or substrate recovery device M8.

[0042] The line management device 200 retrieves the component library generated by the management device 100 from the management device 100 and causes each work machine included in the mounting line L1 to produce mounted boards based on that component library. As described later, the component library contains data for multiple components, and the line management device 200 may modify the component library.

[0043] The substrate supply device M1 supplies substrates to be used for the mounted boards produced on the mounting line L1 to the solder printing device M3 via the substrate transfer device M2. The solder printing device M3 performs the solder printing operation described above. In other words, the solder printing device M3 screen prints solder onto the substrates it receives from the substrate transfer device M2.

[0044] Each of the component mounting devices M4 and M5 performs the above-described component mounting operation of mounting one or more components on one or more substrates. Note that the mounting line L1 includes two component mounting devices M4 and M5, but the number of such devices is not limited to two, and may be one, or three or more. It can also be said that the mounting substrates are substantially produced by the component mounting operations of these component mounting devices M4 and M5.

[0045] The inspection machine M6 inspects the components mounted on the substrate by the component mounting devices M4 and M5, and notifies the management device 100 of the inspection results via the line management device 200.

[0046] The reflow device M7 performs the above-described reflow operation. That is, the reflow device M7 heats the substrate on which components are mounted, which is carried in from the component mounting devices M4 and M5 via the inspection machine M6, cures the solder on the substrate, and joins the electrode portions of the substrate and the components. Specifically, the reflow device M7 melts and solidifies the solder for component joining by performing heating according to a predetermined heating profile. Thereby, the components are solder-joined to the substrate. The substrate recovery device M8 recovers the substrate on which the solder joining has been performed from the reflow device M7.

[0047] The mounting lines L2 and L3 also have the same configuration as the mounting line L1. In this embodiment, each of the mounting lines L1 to L3 has the same configuration, but they may have different configurations from each other. Also, in this embodiment, the mounting lines L1 to L3 include the line management device 200, but the line management device 200 may be provided independently of each of the mounting lines L1 to L3, or may be incorporated into each of the mounting lines L1 to L3.

[0048] [Component Mounting Device] Figure 2 is a diagram showing an example of the configuration of a component mounting device M4. In the present embodiment, the component mounting device M5 also has the same configuration as the component mounting device M4. In the present embodiment, the conveyance direction of the substrate B is referred to as the X-axis direction, and the direction perpendicular to the X-axis direction is referred to as the Y-axis direction. The X-axis direction and the Y-axis direction are directions along the horizontal plane. Further, the direction perpendicular to the X-axis direction and the Y-axis direction is referred to as the Z-axis direction. The plus side and the minus side in the X-axis direction are the downstream side and the upstream side, respectively, in the conveyance direction of the substrate B, and the plus side and the minus side in the Y-axis direction are the rear side (or the back side) and the front side (or the front side), respectively, in the front-rear direction. The plus side and the minus side in the Z-axis direction are the upper side and the lower side, respectively, in the vertical direction. In FIG. 2, the upper surface of the component mounting device M4 is shown.

[0049] The component mounting device M4 includes a base 4, a substrate conveyance mechanism 5, two component supply units 6, two X-axis beams 9, a Y-axis beam 8, two mounting heads 10, two component recognition cameras 11, and two substrate recognition cameras 12.

[0050] The substrate conveyance mechanism 5 includes two rails along the X-axis direction and is disposed at the center of the base 4. The substrate conveyance mechanism 5 conveys the substrate B carried in from the upstream side and positions and holds the substrate B at a position for performing the component mounting operation.

[0051] The two component supply units 6 are arranged so as to sandwich the substrate conveyance mechanism 5 in the Y-axis direction. A plurality of feeders 7 are arranged in parallel along the X-axis direction in each component supply unit 6. The feeder 7 supplies the component to a position (hereinafter referred to as the component pickup position) where the component is picked up by the mounting head 10 by pitch-feeding the component tape containing the component in the tape feeding direction.

[0052] Note that a tray feeder, a stick feeder, a bulk feeder, or the like may be arranged in the component supply unit 6. The tray feeder supplies the component from a tray containing the component. The stick feeder supplies the component from a stick case containing the component. The bulk feeder supplies the component from a bulk case containing the component.

[0053] The Y-axis beam 8 is positioned along the Y-axis direction at one end of the base 4 in the X-axis direction (the right side in Figure 2). Each of the two X-axis beams 9 is coupled to the Y-axis beam 8 so as to be movable in the Y-axis direction while remaining aligned with the X-axis direction.

[0054] The mounting head 10 is mounted on each of the two X-axis beams 9 so as to be movable in the X-axis direction. The mounting head 10 is equipped with a plurality of suction units 10a that can move up and down while suctioning and holding parts. A suction nozzle 10b is provided at the tip of each suction unit 10a (see Figure 3).

[0055] Each of the two mounting heads 10 moves in the X-axis and Y-axis directions by driving the Y-axis beam 8 and the X-axis beam 9. As a result, each of the two mounting heads 10 picks up components from the component pick-up position of the feeder 7 located in the component supply unit 6 corresponding to the mounting head 10 using the suction nozzle 10b, and mounts them on the mounting point (or planned mounting position) of the substrate B positioned by the substrate transport mechanism 5.

[0056] Each of the two component recognition cameras 11 is positioned between one of the two component supply units 6 and the substrate transport mechanism 5. The component recognition camera 11 captures an image of a component as the mounting head 10, which has taken a component from the component supply unit 6, moves above the component recognition camera 11. In other words, the component recognition camera 11 recognizes the holding position of a component by capturing an image of the component while it is held by the mounting head 10.

[0057] The substrate recognition camera 12 is attached to the plate 9a to which the mounting head 10 is mounted. Therefore, the substrate recognition camera 12 moves integrally with the mounting head 10. As the mounting head 10 moves, the substrate recognition camera 12 moves above the substrate B positioned by the substrate transport mechanism 5, and captures images of substrate marks (not shown) provided on the substrate B to recognize the position of the substrate B. When the mounting head 10 mounts components onto the substrate B, the operation of the component mounting work, in which components are mounted at the planned mounting position, is corrected based on the component recognition result by the component recognition camera 11 and the position recognition result of the substrate recognition camera 12.

[0058] Furthermore, it can be said that such a component mounting device M4 has two stages. Each of the two stages has a component supply unit 6, an X-axis beam 9, a mounting head 10, and a substrate recognition camera 12.

[0059] Figure 3 is a diagram that partially shows an example of the A-A cross-section in Figure 2. Component mounting devices M4 and M5 have the function of mounting components P onto the substrate B.

[0060] As shown in Figure 3, the parts supply unit 6 comprises a feeder base 13a, a plurality of feeders 7 mounted on the feeder base 13a, and a trolley 13 that supports the feeder base 13a.

[0061] The trolley 13 is configured to be detachably attached to the component mounting devices M4 and M5, and is further equipped with a cassette holder 15. The cassette holder 15 is configured to hold multiple component reels C. The component reels C store component tapes 14 in a wound state. Each of the multiple component reels C is held in the upper holding position Hu or the lower holding position Hd of the cassette holder 15. The component tapes 14 pulled out from the component reels C held by the cassette holder 15 are mounted on the feeder 7. The feeder 7 may be placed on a feeder base 13a provided on the base 4 without using the trolley 13. Alternatively, the trolley 13 may hold the component reels C instead of the cassette holder 15.

[0062] Each suction nozzle 10b attached to the mounting head 10 picks up and moves the component P supplied from the feeder 7 to the component picking position, thereby mounting the component P to the planned mounting position on the substrate B.

[0063] In this embodiment, as described above, the component mounting devices M4 and M5 have the same configuration, but they may have different configurations.

[0064] [Functional Configuration of Control Device and Assembly Line] Figure 4 is a block diagram showing examples of the functional configurations of the control device 100 and the assembly lines L1 to L3.

[0065] The management device 100 includes a management control unit 101, a processing unit 102, a first input unit 103, a first display unit 104, a first production storage unit 105, a monitoring data storage unit 106, and a first communication unit 108.

[0066] The processing unit 102 generates a component library containing multiple component data and stores it in the first production storage unit 105. Each of the multiple component data indicates the shape, mounting conditions, etc., of the component P to be mounted on the substrate B. The processing unit 102 also generates production data based on these component libraries and stores it in the first production storage unit 105. The production data indicates, for example, the mounting order of at least one component P to be mounted on the substrate B and the position where those components P will be mounted on the substrate B (i.e., the planned mounting position as described above).

[0067] Furthermore, the processing unit 102 calculates production indicators for each of the mounting boards on mounting lines L1 to L3 based on multiple monitoring data sequences stored in the monitoring data storage unit 106. These production indicators will also be referred to as production-related indicators below.

[0068] The first input unit 103 receives input operations from, for example, an operator of the production system 1, and outputs a signal corresponding to that input operation to at least one of the management control unit 101 and the processing unit 102. Such a first input unit 103 may include, for example, a keyboard, a touch sensor, a touchpad, or a mouse.

[0069] The first display unit 104 displays, for example, production-related indicators calculated by the processing unit 102. Specific examples of the first display unit 104 include, but are not limited to, liquid crystal displays, plasma displays, or organic EL (Electro-Luminescence) displays.

[0070] The first production storage unit 105 is a recording medium for storing a parts library and production data. The monitoring data storage unit 106 is a recording medium for storing monitoring data sequences showing the monitoring results for each of the mounting lines L1 to L3. For example, these recording media are hard disks, ROM (Read Only Memory), RAM (Random Access Memory), or semiconductor memory. Such recording media may be volatile or non-volatile.

[0071] The first communication unit 108 communicates with each of the mounting lines L1 to L3. For example, the first communication unit 108 transmits the component library and production data stored in the first production storage unit 105 to each of the mounting lines L1 to L3 in response to control by the management control unit 101. The first communication unit 108 also receives the aforementioned monitoring data sequence from each of the mounting lines L1 to L3 and stores it in the monitoring data storage unit 106. It can also be said that the first communication unit 108 is configured as an acquisition unit that acquires the monitoring data sequence.

[0072] The management control unit 101 controls the processing unit 102, the first display unit 104, the first production storage unit 105, the monitoring data storage unit 106, and the first communication unit 108.

[0073] The management device 100 may be configured as a single device or as multiple devices. For example, the management device 100 may consist of a first device including a first input unit 103 and a first display unit 104, and a second device including all components other than the first input unit 103 and the first display unit 104. In this case, the first device may be located in the same factory as the mounting lines L1 to L3, and the second device may be located on a cloud server outside that factory. Alternatively, the entire management device 100 may be provided on the cloud server or located in the aforementioned factory.

[0074] The mounting line L1 comprises a line control unit 201, a second input unit 203, a second display unit 204, a second communication unit 208, a second production storage unit 205, and a plurality of work machines 210. The plurality of work machines 210 are component mounting devices M4 and M5, etc. In addition, each component other than the plurality of work machines 210 included in the mounting line L1 may be provided in the line management device 200 or in any of the work machines 210.

[0075] The second input unit 203, like the first input unit 103 of the control device 100, receives input operations from, for example, an operator of the production system 1, and outputs an input signal corresponding to that input operation to the line control unit 201. Such a second input unit 203 may include, for example, a keyboard, a touch sensor, a touchpad, or a mouse.

[0076] The second display unit 204 displays information corresponding to the input signal, for example, in response to control by the line control unit 201. Specific examples of the second display unit 204 include, but are not limited to, liquid crystal displays, plasma displays, or organic EL displays.

[0077] The second communication unit 208 communicates with the management device 100. For example, when the second communication unit 208 receives a parts library and production data from the first communication unit 108 of the management device 100, it stores the parts library and production data in the second production storage unit 205. Also, when the second communication unit 208 acquires a series of monitoring data generated based on the monitoring results of multiple work machines 210, it transmits that series of monitoring data to the first communication unit 108 of the management device 100.

[0078] The second production storage unit 205 is a recording medium for storing a parts library and production data. The second production storage unit 205 may also store a series of monitoring data. For example, the recording medium may be a hard disk, ROM, RAM, or semiconductor memory. Such a recording medium may be volatile or non-volatile.

[0079] The multiple work machines 210 include a substrate supply device M1, a substrate transfer device M2, a solder printing device M3, component mounting devices M4 and M5, an inspection machine M6, a reflow device M7, and a substrate recovery device M8.

[0080] The line control unit 201 controls each component of the mounting line L1 other than the line control unit 201 itself. For example, the line control unit 201 controls each component based on operator input operations received by the second input unit 203. The line control unit 201 also causes multiple work machines 210 to perform the solder printing, component mounting, and reflow operations based on the component library and production data stored in the second production storage unit 205. The line control unit 201 also monitors the multiple work machines 210. As a result, the line control unit 201 generates a monitoring data sequence indicating the status when the mounting line L1 was mounting component P onto the substrate B, and transmits this monitoring data sequence from the second communication unit 208 to the management device 100. The line control unit 201 also modifies the component library stored in the second production storage unit 205 according to operator input operations received by the second input unit 203. When a component library is modified, the line control unit 201 causes the second communication unit 208 to send change notification data indicating the modification of the component library to the management device 100.

[0081] [Component Library] Figure 5 shows an example of a component library.

[0082] The component library Lb consists of multiple component data Dc. Each of the multiple component data Dc is data for one type of component P, and is associated with a component code that identifies the type of component P. Such component data Dc includes configuration information d regarding the configuration of component P, and mounting parameters f which are the mounting conditions of the component mounting device M4 or M5 for mounting component P onto the substrate B. In addition, the blank spaces in each item of the component data Dc shown in Figure 5 are filled with images, numbers, or terms.

[0083] The configuration information d includes, for example, a shape diagram d1 of part P, size data d2, and part parameters d3.

[0084] Shape diagram d1 illustrates the external shape of part P corresponding to its part data Dc. Size data d2 numerically indicates information about the size of part P, namely the external dimensions, number of leads, lead pitch, lead length, lead width, and part height.

[0085] The component parameter d3 is attribute information about the component P. Such a component parameter d3 includes component attributes d31, which are information about the component P itself, and tape information d32, which are information about the component tape 14 for supplying the component P by the feeder 7. The component attributes d31 indicate, for example, the polarity, polarity mark, mark position, component type, and shape type of the component P. The tape information d32 includes, for example, the tape material of the component tape 14, the tape width indicating the width dimension of the component tape 14, the feed interval indicating the tape feed pitch of the component tape 14 by the feeder 7, and information about the color and material of the component tape 14.

[0086] The mounting parameter f is the mounting condition for the component mounting device M4 or M5 to mount the component P onto the substrate B. This mounting parameter f can also be described as a machine parameter that defines the operating mode of the component mounting device M4 or M5. In this example, the mounting parameter f includes nozzle information f2 indicating the type of suction nozzle 10b used. Furthermore, the mounting parameter f includes speed parameter f3, recognition information f4, gap information f5, suction information f6, and mounting information f7. Each of these nozzle information f2, speed parameter f3, recognition information f4, gap information f5, suction information f6, and mounting information f7 can also be described as a mounting parameter f.

[0087] The speed parameter f3 includes the lifting speed when the component P is picked up by the suction nozzle 10b, the mounting speed when the component P is transported by the mounting head 10, and the tape feeding speed when the component tape 14 is fed by the feeder 7. The recognition information f4 is a parameter that defines the manner of component recognition. Specifically, the recognition information f4 includes the camera type indicating the type of component recognition camera 11 used, the illumination mode indicating the illumination form when imaging is performed by the component recognition camera 11, and the recognition speed indicating the speed of movement of the mounting head 10 during imaging. The gap information f5 includes the suction gap when the component P is picked up by the suction nozzle 10b and the mounting gap when the picked-up component P is mounted on the substrate B.

[0088] The adsorption information f6 includes the adsorption position offset, which indicates the amount of offset when the component P is adsorbed by the adsorption nozzle 10b, and the adsorption angle. The mounting information f7 indicates the pressing load when mounting the component P, which has been adsorbed by the adsorption nozzle 10b, onto the substrate B, as the mounting load.

[0089] Note that the configuration information d and implementation parameters f included in the component data Dc in Figure 5 are examples only, and may represent other information besides the information shown in Figure 5, may represent both the information shown in Figure 5 and other information, or may represent only a part of the information shown in Figure 5. Furthermore, the number of pieces of information included in each of the configuration information d and implementation parameters f may be one or multiple.

[0090] Figure 6 shows an example of how the component library Lb is handled.

[0091] First, the parts library Lb generated by the processing unit 102 is stored in the first production storage unit 105 of the management device 100 as the first parts library Lb1. This first parts library Lb1 is also called the master or master parts library.

[0092] Then, the control unit 101 of the management device 100 transmits the first component library Lb1 stored in its first production storage unit 105 to each of the mounting lines L1 to L3. As a result, the first component library Lb1 is stored as the second component library Lb2 in the second production storage unit 205 of each of the mounting lines L1 to L3.

[0093] The component mounting devices M4 and M5 of each mounting line L mount one or more components P onto one or more substrates B according to the second component library Lb2 stored in the second production storage unit 205 located in the mounting line L. Here, the line control unit 201 of each mounting line L modifies the second component library Lb2 in response to, for example, an input operation by an operator to the second input unit 203. For example, the mounting parameter f of the component data Dc included in the second component library Lb2 is changed. When such a change is made, the component mounting devices M4 and M5 of each mounting line L mount one or more components P onto one or more substrates B according to the modified and latest second component library Lb2.

[0094] As a result, when component mounting work begins on mounting lines L1 to L3, the first component library Lb1 and the second component libraries Lb2 of each mounting line L1 to L3 may be different from each other. Furthermore, the second component libraries Lb2 of each mounting line L1 to L3 may also be different from each other.

[0095] [Monitoring Data Column and Change Notification Data] Figure 7 shows an example of data transmitted from implementation lines L1 to L3 to the management device 100.

[0096] Each of the mounting lines L1 to L3 monitors its own component mounting work while component mounting is being performed and transmits a monitoring data sequence Dx, which indicates the monitoring results, to the management device 100. This monitoring data sequence Dx consists of a sequence of multiple monitoring data Da. In other words, each of the mounting lines L1 to L3 repeatedly transmits the monitoring data Da to the management device 100, for example, periodically. Furthermore, each of the mounting lines L1 to L3 transmits change notification data Db to the management device 100 when the second component library Lb2 stored in its second production storage unit 205 is changed as described above. This change notification data Db is data indicating the content that has been changed in the second component library Lb2 (for example, the changed mounting parameter f). In this way, the monitoring data sequence Dx and the change notification data Db are transmitted from the second communication unit 208 to the first communication unit 108.

[0097] [Processing Operation of the Control Device] Figure 8 is a diagram illustrating an example of the processing operation performed by the processing unit 102 of the control device 100.

[0098] The processing unit 102 of the management device 100 acquires a monitoring data sequence Dx from each of the mounting lines L1 to L3 via the first communication unit 108. The monitoring data sequence Dx consists of a sequence of monitoring data Da that is repeatedly transmitted while the component mounting work is being performed, and indicates the content of the component mounting work. In a specific example, the monitoring data Da indicates, for each type of component P, the work time which is the time spent performing the component mounting work to mount that type of component P onto the substrate B, the actual number during that work time (i.e., the number of mounting operations, mounting points, discards, and defects for that type of component P), and position information (suction position, mounting position). The number of mounting operations is the number of times the suction nozzle 10b performed the operation to pick up that type of component P and mount it onto the substrate B. The number of mounting operations is also sometimes called the number of suction attempts, and is the sum of the number of times the picked-up component P was properly mounted, the number of times an suction error occurred when attempting to pick up the component P, the number of times the component P was picked up but a recognition error occurred, and the number of times the picked-up component P was mounted but an mounting error occurred. The number of mounted components is the number of times a component P of that type was picked up and properly mounted on the substrate B, or the sum of the number of times a picked-up component P was properly mounted and the number of times a picked-up component P was mounted but resulted in a mounting error, or the number of pick-ups as described above. The number of defective components is the sum of the number of pick-up errors in which the pick-up nozzle 10b failed to properly pick up a component P of that type, and the number of recognition errors in which the component recognition camera 11 failed to properly recognize a component P of that type. The number of defective components is the number of mounting errors in which a component P of that type was not correctly mounted at the intended mounting position on the substrate B. Pick-up errors include at least one of the following: an error in which the pick-up nozzle 10b failed to pick up a component P of that type, and an error in which the pick-up nozzle 10b picked up a component P of that type in an abnormal posture. Recognition errors include at least one of the following: an error in which the posture of a component P of that type held by the pick-up nozzle 10b could not be recognized, and an error in which the component P of that type that should be held by the pick-up nozzle 10b could not be recognized. The orientation of part P is at least one of the following: the center position of part P, the front and back sides, and the supply direction.A mounting error includes at least one of the following: an error in which the component P of that type is not present on the mounting board; an error in which the misalignment of the component P of that type exceeds the allowable value; and an error in which the suction nozzle 10b is unable to mount the component P of that type onto the board B and takes it back (hereinafter also called a take-back error). A take-back error is detected by measuring the flow rate of the air drawn into the suction nozzle 10b after component mounting using a flow rate sensor.

[0099] Each of the mounting lines L1 to L3, when component mounting work is performed, aggregates the actual number of component P of each type (number of mounting operations, number of mounted items, number of spoiled items, number of defects) for that type of component P over the working time. For example, the line control unit 201 aggregates the number of mounting operations, number of mounted items, and number of spoiled items by monitoring the component mounting devices M4 and M5. The line control unit 201 then aggregates the number of mounting errors, excluding the aforementioned take-back errors, by monitoring the inspection results of the mounted board by the inspection machine M6. The line control unit 201 also aggregates the number of the aforementioned take-back errors by monitoring the component mounting devices M4 and M5. For each working time during which component mounting work is performed, the line control unit 201 generates monitoring data Da indicating the aggregated actual number (number of mounting operations, number of mounted items, number of spoiled items, number of defects), position information (suction position, mounting position), and working time. Furthermore, each time the line control unit 201 generates monitoring data Da, it causes the second communication unit 208 to transmit the monitoring data Da to the management device 100.

[0100] In a specific example, as shown in Figure 8, monitoring data Da shows the actual number of parts Pa, which are part P of type a, at work time t (number of mounting operations, number of mounted points, number of spoiled parts, number of defective parts) as (Aa1, Ab1, Ac1, Ad1). Furthermore, as shown in Figure 8, monitoring data Da shows the position information (suction position, mounting position) of part Pa, which are part P of type a, at work time t as (Xa1, Ya1), (Xa2, Ya2), (Xb1, Yb1), and (Xb2, Yb2). Furthermore, monitoring data Da also shows the actual number of parts P of each of several other types at work time t, similar to part Pa, at work time t. As an example, work time t may be 1 minute or any other time. Alternatively, instead of working time t, the actual number of component Pa, which is component P of type a, may be aggregated using the production quantity, which is the number of mounted circuit boards produced.

[0101] When the processing unit 102 of the control device 100 acquires a monitoring data sequence Dx containing such monitoring data Da from its mounting line L, it calculates production-related indicators for each type of component P based on the monitoring data sequence Dx and cumulative period information De. Production-related indicators are indicators related to the production of mounted substrates, and include, for example, productivity, spoilage rate, defect rate, cumulative number of mounted points, suction position variation, and mounting position variation. Cumulative period information De indicates the period corresponding to the calculated production-related indicators. The period indicated by cumulative period information De is also called the cumulative period. For example, the period indicated by cumulative period information De is at least one of the four cumulative periods (first cumulative period Td1, second cumulative period Td2, third cumulative period Td3, and fourth cumulative period Td4) described later.

[0102] In a specific example, the calculation date in Figure 8 indicates the day on which the production-related indicators were calculated. For example, the production-related indicators in Figure 8 are calculated daily. The production-related indicators corresponding to each calculation date in Figure 8 are production-related indicators based on the actual number of component mounting operations in which component Pa was picked up by component mounting devices M4 and M5 during the cumulative period corresponding to the calculation date. Productivity is, for example, the number of mounting operations per unit time, and CPH (chips per hour) is used as one specific unit of productivity. The spoilage rate is, for example, the ratio of the number of spoiled parts of a particular type to the number of times the suction nozzle 10b attempted to pick up component P of that type (i.e., the number of mounting operations or number of pick-ups) for that type. ppm (parts per million) is used as one specific unit of the spoilage rate. The defect rate is, for example, the ratio of the number of defective parts of a particular type to the number of component P of that type that were mounted (i.e., the number of mounted points) for that type. Similar to the spoilage rate, ppm is used as one specific unit of the defect rate. The suction position is, for example, the position of the suction nozzle 10b when the suction nozzle 10b is able to properly pick up the component P. In other words, it is the relative position of the suction nozzle 10b with respect to the center position of the component P, and is the amount of deviation of the center position of the suction nozzle 10b from the center position of the component P. The mounting position is, for example, the position of the component P when the component P is properly mounted on the substrate B. In other words, it is the relative position of the component P with respect to the planned mounting position of the component P on the substrate B, and is the amount of deviation of the center position of the component P from the planned mounting position. The variation in suction position is, for example, an index showing the variation in suction position when component Pa is picked up by component mounting devices M4 and M5 using at least one identical mounting parameter f over a cumulative period. The variation in mounting position is, for example, an index showing the variation in mounting position when component Pa is mounted by component mounting devices M4 and M5 using at least one identical mounting parameter f over a cumulative period.

[0103] In other words, for each of the multiple varieties of component P, the processing unit 102 accumulates the actual number of component P of that variety (number of mounting operations, number of mounted units, number of spoiled units, number of defective units) shown in the monitoring data Da, over a cumulative period, at predetermined calculation points. Then, the processing unit 102 calculates production-related indicators (productivity, spoilage rate, defect rate, cumulative number of mounted units) for component P of that variety from the actual number accumulated over the cumulative period. The cumulative number of mounted units is the number of component Pa mounted on the substrate B during the cumulative period. For example, the processing unit 102 calculates (Ae1, Af1, Ag1, Ah1) as the (productivity, spoilage rate, defect rate, cumulative number of mounted units) for component Pa at the first calculation point T1 (for example, day 1). Furthermore, the processing unit 102 calculates (Ae2, Af2, Ag2, Ah2) as (productivity, spoilage rate, defect rate, cumulative number of mounted parts) for part Pa at the second calculation time T2 (for example, the second day). Furthermore, for each of the multiple varieties of part P, the processing unit 102 calculates an index (Ai1) indicating the variation in the suction position of part P of that variety and an index (Aj1) indicating the variation in the mounting position of part P of that variety, based on the position information (suction position, mounting position) of part P of that variety shown in the monitoring data Da, at each predetermined calculation time.

[0104] Furthermore, the production-related indicators (Ae1, Af1, Ag1, Ah1, Ai1, Aj1) corresponding to the first calculation time T1 (e.g., day 1) and the production-related indicators (Ae2, Af2, Ag2, Ah2, Ai2, Aj2) corresponding to the second calculation time T2 (e.g., day 2) may be production-related indicators when component Pa is mounted according to different component data Dc. For example, if at least one mounting parameter f included in the component data Dc is changed between the first calculation time T1 and the second calculation time T2, the production-related indicators (Ae1, Af1, Ag1, Ah1, Ai1, Aj1) are production-related indicators based on the actual number and location information of component mounting operations in which component Pa was picked up by component mounting devices M4 and M5 using at least one mounting parameter f before the change. On the other hand, production-related indicators (Ae2, Af2, Ag2, Ah2, Ai2, Aj2) are production-related indicators based on the actual number and location information of component mounting operations in which component Pa was picked up by component mounting devices M4 and M5 using at least one modified mounting parameter f. Thus, when at least one mounting parameter f indicating the mounting conditions for a predetermined type of component P (in this case, component Pa) is changed, the processing unit 102 calculates the production-related indicators for the predetermined type of component P before and after the change in the mounting parameter f, based on the actual number shown in the monitoring data Da when the predetermined type of component P was mounted according to that at least one mounting parameter f. The processing unit 102 accumulates the actual number shown in the monitoring data Da when the predetermined type of component P was mounted according to that at least one mounting parameter f, in units of mounting parameter f, and calculates the production-related indicators before and after the change based on the actual number in units of mounting parameter f.

[0105] Here, as a comparative example, Patent Document 1 displays the number of errors and productivity, respectively, and shows the timing of the information event in which the part information was changed. According to Patent Document 1, the number of errors and productivity are displayed before and after the information event, so for example, if errors occur consecutively in a short period of time after the information event, this can be confirmed on the screen as an increase in the number of errors after the information event.

[0106] However, in Patent Document 1, it is impossible to determine whether the modified at least one mounting parameter f is appropriate when the spoilage rate and defect rate of the specified type of component P are not very high, or when the productivity is not very low. For example, in a situation where one error occurs for every 10,000 mounting points, it was not possible to determine whether the modified at least one mounting parameter f is appropriate.

[0107] Therefore, in this embodiment, when at least one mounting parameter f indicating the mounting conditions for a predetermined type of component P is changed, the processing unit 102 calculates production-related indicators before and after the change based on the actual number of components P by type, which is the cumulative number of components f before the change and the number of components f after the change. This allows for an accurate comparison of production-related indicators before and after the change, and makes it possible to determine whether the at least one mounting parameter f after the change is appropriate or not. In other words, since the post-change monitoring data column does not include the data from the pre-change monitoring data column, it is possible to determine whether the at least one mounting parameter f after the change is appropriate or not based on the post-change indicators based on the post-change monitoring data column and the pre-change indicators based on the pre-change monitoring data column. The post-change monitoring data column described above is a monitoring data column Dx that shows the situation when mounting equipment such as component mounting devices M4 and M5 mounted one or more components P of a predetermined type onto one or more substrates B according to the at least one mounting parameter f before the change. Furthermore, the pre-change monitoring data sequence is a monitoring data sequence Dx that shows the situation when the mounting equipment mounted one or more components P of a predetermined type onto one or more substrates B according to at least one mounting parameter f after the change. The pre-change index is an index related to the production of mounted substrates calculated based on the pre-change monitoring data sequence, and the post-change index is an index related to the production of mounted substrates calculated based on the post-change monitoring data sequence.

[0108] Furthermore, if at least one mounting parameter f included in the component data Dc is not changed between the first calculation time T1 and the second calculation time T2, the production-related indicators (Ae1, Af1, Ag1, Ah1, Ai1, Aj1) and production-related indicators (Ae2, Af2, Ag2, Ah2, Ai2, Aj2) may both be production-related indicators based on the actual number and location information of component mounting operations in which component Pa was picked up by component mounting devices M4 and M5 using at least one identical mounting parameter f.

[0109] Figure 9 shows an example of a screen displayed on the first display unit 104 of the management device 100.

[0110] The processing unit 102 displays a graph on the first display unit 104 showing the production-related indicators calculated as described above for each type of component P: productivity, spoilage rate, defect rate, and cumulative number of mounted components. The horizontal axis of the graph represents time (month / day in the example of Figure 9), and the vertical axis represents productivity, spoilage rate, defect rate, and cumulative number of mounted components.

[0111] For example, the first input unit 103 acquires the period indicated by the cumulative period information De (i.e., the cumulative period) in response to an input operation by the operator. As a result, the processing unit 102 displays on the first display unit 104, for example as shown in Figure 9, a graph showing production-related indicators (productivity, spoilage rate, defect rate, cumulative number of mounted parts) for component Pa mounted on the mounting line L1 at each calculation point in time, October 1st, October 2nd, October 3rd, ... The processing unit 102 also displays on the first display unit 104 a graph showing production-related indicators (productivity, spoilage rate, defect rate, cumulative number of mounted parts) for component Pb of a different type than component Pa mounted on the mounting line L1 at each calculation point in time, October 1st, October 2nd, October 3rd, ... Component Pb is component P of type b. Such graphs for each type of component P may be displayed on the first display unit 104 in a scrolling format. Furthermore, as shown in Figure 9, productivity, spoilage rate, and defect rate may be shown by line graphs, and the cumulative number of mounted items may be shown by bar graphs. The types of graphs shown in Figure 9 are just examples, and the types of graphs showing each of the multiple production-related indicators can be changed as appropriate. In addition, the processing unit 102 also displays a graph corresponding to each of the mounting lines L2 and L3 on the first display unit 104. Note that the production-related indicators do not need to include productivity, spoilage rate, defect rate, and the cumulative number of mounted items. In other words, the production-related indicators may include at least one of productivity, spoilage rate, defect rate, and the cumulative number of mounted items, or they may include an indicator that can be calculated from the actual number shown in the monitoring data Da instead of productivity, spoilage rate, defect rate, and the cumulative number of mounted items. Specifically, the production-related indicators may be the cumulative number of at least one of the number of mounting operations, number of spoils, number of suction errors, number of recognition errors, and number of mounting errors over a cumulative period. In other words, the processing unit 102 may, at each calculation point, accumulate at least one of the following over the cumulative period: the number of mounting operations, the number of defective items, the number of suction errors, the number of recognition errors, and the number of mounting errors. The cumulative number of mounting operations and at least one of the cumulative number of errors may then be displayed on the first display unit 104 as production-related indicators.Furthermore, at least one of the following indicators, which can be calculated from the position information (adsorption position, mounting position) shown in the monitoring data Da, is displayed on the first display unit 104 as a production-related indicator: an indicator showing the variation in the adsorption position and an indicator showing the variation in the mounting position. In addition, an amount estimated from productivity, spoilage rate, and defect rate as production-related indicators is also displayed on the first display unit 104. The amount may be the amount of loss, or it may be the amount required to produce the mounted substrate.

[0112] Here, as described above, the first communication unit 108 obtains change notification data Db from the mounting line L1 when the second component library Lb2 is changed on the mounting line L1. Based on this change notification data Db, the processing unit 102 understands, for example, that the mounting parameter f has been changed from the previous day on October 3rd, October 5th, October 6th, and October 7th. In other words, the processing unit 102 calculates production-related indicators on October 1st and October 2nd based on the actual figures for the cumulative period from the first day of October (with October 1st as the starting day) to the calculation point, and calculates production-related indicators on October 3rd and October 4th based on the actual figures for the cumulative period from the first day of October (with October 3rd as the starting day) to the calculation point. The production-related indicators calculated on October 5th are calculated with October 5th as the starting day and the cumulative period as 1 day, because the mounting parameter f has been changed from the previous day and also changed on October 6th. The production-related indicators calculated on October 6th and October 7th are calculated in the same way as the production-related indicators calculated on October 5th. Therefore, the processing unit 102 makes the bar colors in the bar graph that represent the cumulative number of implemented points for October 1st and October 2nd different from the bar colors in the bar graph that represent the cumulative number of implemented points for October 3rd and October 4th after the implementation parameter f has been changed. Similarly, the processing unit 102 makes the bar colors in the bar graph that represent the cumulative number of implemented points for October 3rd and October 4th different from the bar colors in the bar graph that represent the cumulative number of implemented points for October 5th after the implementation parameter f has been further changed. In Figure 9, the colors of each bar in the bar graph are distinguished by hatching or the like. In other words, the processing unit 102 uses a graph showing the cumulative number of installed parts to display the cumulative number of installed parts resulting from component installation work using the original installation parameter f included in the graph, and the cumulative number of installed parts resulting from component installation work using the modified installation parameter f, in different display modes.

[0113] This clearly shows in the graph when the implementation parameter f was changed. Furthermore, the first display unit 104 displays the productivity, spoilage rate, and defect rate for component mounting work using the implementation parameter f before the change, and the productivity, spoilage rate, and defect rate for component mounting work using the implementation parameter f after the change, along with the cumulative number of implemented parts. Therefore, the operator can easily understand when the implementation parameter f was changed and how the cumulative number of implemented parts, productivity, spoilage rate, and defect rate have changed as a result of that change. Note that using a graph showing the cumulative number of implemented parts to distinguish between production-related indicators before and after the change is just one example; it is not necessary to use a graph showing the cumulative number of implemented parts. For example, the processing unit 102 may display a graph showing at least one of productivity, spoilage rate, and defect rate on the first display unit 104, and display the production-related indicators before the change (at least one of productivity, spoilage rate, and defect rate) and the production-related indicators after the change (at least one of productivity, spoilage rate, and defect rate) included in the graph in different display modes. Alternatively, the processing unit 102 may display a graph showing at least one of productivity, spoilage rate, and defect rate on the first display unit 104, and display a string indicating that the component data Dc was changed at the time the implementation parameter f included in the graph was changed. Furthermore, the processing unit 102 may display a graph showing productivity, spoilage rate, and defect rate, along with a graph showing the cumulative number of implementation tasks, on the first display unit 104, and display the cumulative number of implementation tasks before the change and the cumulative number of implementation tasks after the change in different display modes, so that it is possible to distinguish how at least one of productivity, spoilage rate, and defect rate included in the graph has changed before and after the change.

[0114] Furthermore, although the processing unit 102 displays graphs of component Pa and component Pb on the first display unit 104 in Figure 9, it may also select the type of component P corresponding to the displayed graph. In other words, the processing unit 102 may filter the type of component P or the displayed graph. For example, the first input unit 103 accepts at least one parameter in response to an input operation by the operator. The processing unit 102 identifies a plurality of component data Dc contained in the second component library Lb2 that contain the accepted at least one parameter. In other words, the processing unit 102 identifies a plurality of component data Dc that each contains at least one identical parameter. The processing unit 102 then displays a graph corresponding to each of the identified plurality of component data Dc on the first display unit 104. The identical parameter may be a speed parameter f3 included in the implementation parameter f, or it may be recognition information f4. Alternatively, the identical parameter may be a shape diagram d1 included in the configuration information d, or it may be size data d2.

[0115] Figure 10 shows another example of a screen displayed on the first display unit 104 of the management device 100.

[0116] As shown in Figure 10, the processing unit 102 displays a pointer 21 at a position corresponding to the operator's input operation to the first input unit 103. For example, the pointer 21 is positioned at the point in time when the implementation parameter f in the graph is changed (hereinafter also referred to as the change point). The change point is the point in time between two adjacent bars with different colors in the bar graph. At this time, when the processing unit 102 receives a decision instruction in response to the operator's input operation to the first input unit 103, it displays the comparison information 22 at that change point on the first display unit 104, as shown in Figure 10. If the first input unit 103 has a mouse as a hardware device, the above decision instruction is received by clicking the mouse.

[0117] The comparison information 22 includes two lists. One of these lists, the first list 22a, shows the implementation parameter f before the change and production-related indicators (productivity, spoilage rate, defect rate) based on the part data Dc that includes the implementation parameter f. The other of these lists, the second list 22b, shows the implementation parameter f after the change and production-related indicators (productivity, spoilage rate, defect rate) based on the part data Dc that includes the implementation parameter f after the change.

[0118] Specifically, the first list 22a shows "Nozzle: 235" as the nozzle information f2 before the change among the implementation parameters f, and "Productivity: 25,000 CPH, Spoilage rate: 1,500 ppm, Defect rate: 50 ppm" as production-related indicators. The second list 22b shows "Nozzle: 226" as the nozzle information f2 after the change among the implementation parameters f, and "Productivity: 3,000 CPH, Spoilage rate: 500 ppm, Defect rate: 300 ppm" as production-related indicators. The nozzle information f2 before the change is shown, for example, in the first parts library Lb1, or in the monitoring data column Dx acquired before the change, or in the change notification data Db. Therefore, the processing unit 102 includes the nozzle information f2 before the change in the first list 22a by referring to the first parts library Lb1, the monitoring data column Dx, or the change notification data Db. Furthermore, since the modified nozzle information f2 is shown in, for example, the change notification data Db acquired at the time of the change, the processing unit 102 includes the modified nozzle information f2 in the second list 22b by referring to the change notification data Db.

[0119] In other words, the comparison information 22 indicates that the nozzle information f2 in the component data Dc of component Pa included in the second component library Lb2 of the mounting line L1 has been changed from "nozzle: 235" to "nozzle: 226". To put it another way, the comparison information 22 indicates that the type of suction nozzle 10b has been changed from "235" to "226". Furthermore, the comparison information 22 indicates that as a result of this change, productivity has decreased from 25,000 CPH to 3,000 CPH, the spoilage rate has decreased from 1,500 ppm to 500 ppm, and the defect rate has increased from 50 ppm to 300 ppm.

[0120] In the examples shown in Figures 9 and 10, graphs of productivity, spoilage rate, and defect rate are displayed, but the processing unit 102 may switch between displaying one or two of these in response to input operations to the first input unit 103. Furthermore, the processing unit 102 may calculate and display one other indicator as a production-related indicator based on at least two of productivity, spoilage rate, and defect rate. For example, the processing unit 102 may multiply productivity, spoilage rate, and defect rate together and normalize the product to a value between 1 and 100. Productivity may be the number of mounted boards produced per unit time, or it may be expressed as a ratio (e.g., a percentage) to a standard value for the number of mounting operations. The spoilage rate is the ratio obtained by dividing the number of spoils (i.e., the sum of the number of adsorption errors and the number of recognition errors) by the number of mounting operations, but it may also be the ratio calculated by dividing the number of errors by the number of mounting operations for each type of error. Similarly, the defect rate is the ratio of the number of mounting errors in which component P was not correctly mounted at the intended mounting position on substrate B (i.e., the sum of the number of errors in which component P of that type was not present on the mounting substrate and the number of errors in which the misalignment of component P of that type exceeded the allowable value). However, it may also be a ratio calculated by dividing the number of errors for each type of mounting error by the number of mounting operations. In addition, in the examples of Figures 9 and 10, the first list 22a and the second list 22b of the comparison information 22 include nozzle information f2 as one mounting parameter f before and after the change. However, it is sufficient to include at least one of nozzle information f2, speed parameter f3, recognition information f4, gap information f5, adsorption information f6, and mounting information f7, and it may also include multiple mounting parameters f before and after the change.

[0121] Figure 11 is a diagram illustrating the cumulative period indicated by the cumulative period information De. Specifically, Figure 11(a) is a graph showing the spoilage rate calculated for each of four different cumulative periods. Figure 11(b) is a magnified view of a portion of the graph in Figure 11(a) (the spoilage rate range of 0 to 1000 ppm). The horizontal axis of the graph represents time (specifically, day), and the vertical axis represents the spoilage rate.

[0122] Of the four cumulative periods described above, the first cumulative period Td1 is the period from the first day of component mounting work to the calculation date (the calculation date in the example of Figure 11). Therefore, the later the calculation date, the longer the first cumulative period Td1 at that calculation date. Here, the first day of component mounting work is the day on which component Pa is picked up by component mounting devices M4 and M5 using a single component data Dc for the first time, or the day on which component Pa is picked up by component mounting devices M4 and M5 using the modified component data Dc after changing component data Dc. When the cumulative period information De indicates the first cumulative period Td1, the processing unit 102 calculates a production-related indicator based on the cumulative number of actual units for the period from the first day of component mounting work to that calculation date, as the production-related indicator at that calculation date. In other words, the processing unit 102 calculates production-related indicators based on the cumulative number of actual component mounting operations performed using the same component data Dc, where component Pa was picked up by component mounting devices M4 and M5, until the component data Dc is changed.

[0123] The second cumulative period Td2 of the four cumulative periods is the period from the first day to the last day of the component mounting work (i.e., the entire period). Here, the first day of the component mounting work is the day when a single component data Dc is used for the first time and component Pa is picked up by component mounting devices M4 and M5. When the cumulative period information De indicates the second cumulative period Td2, the processing unit 102 calculates production-related indicators based on the cumulative number of actual items over the entire period as production-related indicators for each calculation point in time. In other words, the processing unit 102 calculates production-related indicators based on the cumulative number of actual items over the entire period for component mounting work in which component Pa was picked up by component mounting devices M4 and M5 using the same component data Dc.

[0124] Of the four cumulative periods, the third cumulative period Td3 is 7 days long. When the cumulative period information De indicates the third cumulative period Td3, the processing unit 102 calculates production-related indicators based on the cumulative number of actual items collected during the period from that calculation point up to 7 days prior, as production-related indicators for that calculation point. In other words, for component mounting operations in which component Pa is picked up by component mounting devices M4 and M5 using the same component data Dc, the processing unit 102 calculates production-related indicators based on the cumulative number of actual items collected during the most recent past 7 days, starting from the calculation point.

[0125] The fourth cumulative period Td4, one of the four cumulative periods, is one day long. When the cumulative period information De indicates the fourth cumulative period Td4, the processing unit 102 calculates production-related indicators based on the actual numbers accumulated during that one-day period at each calculation point, as production-related indicators at that calculation point. The fourth cumulative period Td4 is shorter than the third cumulative period Td3. Therefore, the total number of actual parts Pa generated in the fourth cumulative period Td4 (e.g., number of adsorptions) is less than the total number of actual parts Pa generated in the third cumulative period Td3 (e.g., number of adsorptions). In this respect, the fourth cumulative period Td4 differs from the third cumulative period Td3. However, the method for calculating production-related indicators in the fourth cumulative period Td4 is the same as the method for calculating production-related indicators in the third cumulative period Td3.

[0126] In Figure 11, the spoilage rate is shown as a production-related indicator. As shown in Figure 11, the spoilage rate calculated using the fourth cumulative period Td4 fluctuates significantly. The fluctuation in the spoilage rate calculated using the third cumulative period Td3 is smaller than that of the fourth cumulative period Td4. The fluctuation in the spoilage rate calculated using the first cumulative period Td1 is kept smaller as the calculation time progresses. The spoilage rate calculated using the second cumulative period Td2 remains constant and does not fluctuate.

[0127] Therefore, the operator can appropriately change the cumulative period by inputting data to the first input unit 103, and can check the changes over time in production-related indicators such as the spoilage rate over a cumulative period that suits the purpose.

[0128] The cumulative period may be one day, one week, one second, one minute, one hour, one month, one year, etc., as described above. In this embodiment, production-related indicators are calculated according to the cumulative period, but production-related indicators may also be calculated according to the cumulative number of mounted parts. For example, if the cumulative number is 1000, the processing unit 102 may calculate the production-related indicator for part P based on the monitoring data column Dx which includes the actual number of parts mounted using the same part data Dc, when the total number of times parts P is picked up by the part mounting devices M4 and M5 using the same part data Dc reaches 1000.

[0129] Figure 12 is a flowchart showing an example of the processing operation of the management device 100 in this embodiment.

[0130] First, the first communication unit 108 of the control device 100 acquires monitoring data sequence Dx from each of the implementation lines L1 to L3 (step S10). Then, the processing unit 102 calculates production-related indicators (productivity, spoilage rate, defect rate) at each calculation point based on the acquired monitoring data sequence Dx and cumulative period information De corresponding to the operator's input operations (step S11).

[0131] Next, the processing unit 102 determines whether the first communication unit 108 has acquired change notification data Db from each of the implementation lines L1 to L3, that is, whether or not there has been a change in the implementation parameter f in each of the implementation lines L1 to L3 (step S12). In other words, the processing unit 102 determines whether or not there has been a change in the component data Dc or the second component library Lb2.

[0132] If the processing unit 102 determines that there has been a change in the implementation parameter f (Yes in step S12), it displays a graph on the first display unit 104 in which, for example, bars showing the cumulative number of implementations are color-coded before and after the change in the implementation parameter f (step S13). In other words, the graph shown in Figure 9 is displayed as an example. On the other hand, if the processing unit 102 determines that there has been no change in the implementation parameter f (No in step S12), it displays a graph on the first display unit 104 in which, for example, bars showing the cumulative number of implementations are not color-coded (step S14). In this case, a graph different from the graph shown in Figure 9, for example, a graph containing multiple bars showing the cumulative number of implementations, all colored the same, is displayed on the first display unit 104.

[0133] Next, after the processing in step S13, the processing unit 102 determines whether or not it has received an instruction to determine the change time, such as by clicking the mouse as described above (step S15). In other words, the processing unit 102 determines whether or not a change time has been specified. If the processing unit 102 determines that it has received an instruction to determine the change time (Yes in step S15), it displays the comparison information 22 at that change time on the first display unit 104 (step S16).

[0134] After the processing unit 102 determines that it has not received a decision instruction for the change time (No in step S15), or after processing in step S14 or S16, it determines whether or not it has received an instruction from the first input unit 103 to terminate the processing operation (step S17). If the processing unit 102 determines that it has not received the termination instruction (No in step S17), it repeats the processing from step S15. On the other hand, if the processing unit 102 determines that it has received the termination instruction (Yes in step S17), it terminates the processing operation related to production-related indicators.

[0135] In step S12, if it is determined that the implementation parameter f has been changed, the monitoring data column Dx acquired in step S10 includes both the monitoring data column Dx before the change and the monitoring data column Dx after the change. In other words, in step S10, the first communication unit 108 acquires the monitoring data column before the change and the monitoring data column after the change. Then, in step S13, the processing unit 102 calculates the production-related indicators before the change based on the monitoring data column before the change, calculates the production-related indicators after the change based on the monitoring data column after the change, and displays these production-related indicators before and after the change on the first display unit 104.

[0136] Therefore, the management device 100 in this embodiment comprises a first communication unit 108, which is an acquisition unit, and a processing unit 102. The first communication unit 108 acquires a pre-change monitoring data sequence Dx, which is a monitoring data sequence Dx indicating the situation when the mounting equipment was mounting one or more parts P of a predetermined type onto one or more substrates B according to at least one mounting parameter f indicated by the part data Dc as the mounting conditions for a predetermined type of part P, and a post-change monitoring data sequence Dx, which is a monitoring data sequence Dx indicating the situation when the mounting equipment was mounting one or more parts P of a predetermined type onto one or more substrates B according to the changed at least one mounting parameter f when the at least one mounting parameter f is changed. The processing unit 102 calculates an index related to the production of the mounting substrate, which is the substrate B on which the predetermined type of part P is mounted, as a pre-change index based on the pre-change monitoring data sequence, and calculates an index related to that production as a post-change index based on the post-change monitoring data sequence, and displays the pre-change index and post-change index on the first display unit 104. Here, the post-change monitoring data column does not include the data included in the pre-change monitoring data column. Note that the production indicators, pre-change indicators, and post-change indicators correspond to the production-related indicators, pre-change production-related indicators, and post-change production-related indicators mentioned above, respectively. In addition, the mounting equipment is mounting line L in the above example, but it may also be component mounting equipment M4 or M5, or a collection of three mounting lines L1 to L3.

[0137] As a result, the indicators before and after the change are displayed on the first display unit 104, allowing the operator to easily grasp the changes in production-related indicators due to a change in at least one implementation parameter f of the component data Dc. In other words, the correlation between production-related indicators and changes in component data Dc can be easily grasped. As a result, the at least one implementation parameter f can be set appropriately, and the efficiency of component mounting work, in which component P is mounted on the circuit board B, can be more effectively supported. Furthermore, since the data included in the pre-change monitoring data column is not included in the post-change monitoring data column, the change in production-related indicators caused by a change in at least one implementation parameter f of component data Dc can be confirmed by using the pre-change indicators based on the pre-change monitoring data column and the post-change indicators based on the post-change monitoring data column.

[0138] Furthermore, in this embodiment, the processing unit 102 displays the pre-change indicators and post-change indicators on the first display unit 104 in such a way that they can be distinguished by display objects having multiple different display modes. That is, as shown in Figures 9 and 10, for example, the processing unit 102 uses the cumulative number of installed items as a display object and displays the cumulative number of installed items before the change and the cumulative number of installed items after the change in the graph in different display modes, thereby distinguishing between the production-related indicators before the change and the production-related indicators after the change. In the example of Figure 10, the production-related indicators before the change are, for example, the productivity, spoilage rate, and defect rate for October 1st and 2nd, respectively, and the production-related indicators after the change are, for example, the productivity, spoilage rate, and defect rate for October 3rd and 4th, respectively. Note that the cumulative number of installed items may also be production-related indicators, not just productivity, spoilage rate, and defect rate. The display mode may be color, or other modes.

[0139] As a result, the pre-change and post-change indicators are distinguished by indicators having multiple different display modes, allowing operators to easily and visually grasp the changes in production-related indicators resulting from a change in at least one implementation parameter f of the part data Dc. Consequently, the efficiency of part implementation work can be supported more effectively. The indicators may be production-related indicators such as the pre-change and post-change indicators, or other indicators.

[0140] In this embodiment, the processing unit 102 displays a plurality of pre-change indicators and a plurality of post-change indicators on the first display unit 104, respectively. That is, the processing unit 102 displays the comparison information 22 on the first display unit 104, for example, as shown in Figure 10.

[0141] This allows for the display of multiple pre-change and post-change indicators, enabling operators to easily and accurately understand the changes in multiple production-related indicators resulting from a change in at least one implementation parameter f of the part data Dc. As a result, it can more effectively support the efficiency of part implementation work.

[0142] Furthermore, in this embodiment, when the processing unit 102 displays the indicator before the change on the first display unit 104, it also displays at least one implementation parameter f before the change on the first display unit 104. Also, when the processing unit 102 displays the indicator after the change on the first display unit 104, it also displays at least one implementation parameter f after the change on the first display unit 104. In other words, as described above, the processing unit 102 displays the comparison information 22 on the first display unit 104, for example, as shown in Figure 10.

[0143] This also displays at least one implementation parameter f before and after the change, allowing operators to more easily understand the correlation between changes to at least one implementation parameter f in the part data Dc and changes in production metrics. As a result, it can more effectively support the efficiency of part assembly work.

[0144] Furthermore, in this embodiment, the actual numbers included in the monitoring data column Dx include at least one of (1) the number of spoilages, the number of adsorption errors, and the number of recognition errors, and at least one of (2) the number of mounting errors. The processing unit 102 calculates an index based on the actual numbers included in the monitoring data column Dx as an index related to production. In the example above, index (1) is the spoilage rate, and index (2) is the defect rate.

[0145] This allows the operator to easily grasp the correlation between changes in at least one of the indicators described in (1) and (2) above, and changes in the part data Dc.

[0146] Furthermore, in this embodiment, the processing unit 102 calculates an index indicating the productivity of a mounted substrate produced by mounting one or more components P of a predetermined type using mounting equipment, as an index related to production. In the example described above, the index indicating productivity is productivity expressed in CPH.

[0147] This allows operators to easily understand the correlation between changes in the productivity of the mounted board and changes in component data Dc.

[0148] Furthermore, in this embodiment, the position information included in the monitoring data sequence Dx includes at least one of the adsorption position and the mounting position, and the processing unit 102 calculates an index based on the position information included in the monitoring data sequence Dx as an index related to production. For example, such an index may be the variation in adsorption position, the variation in mounting position, etc.

[0149] This allows operators to easily understand the correlation between changes in location-based indicators and changes in part data Dc.

[0150] Furthermore, the aforementioned predetermined varieties include multiple varieties. The acquisition unit, which is the first communication unit 108, acquires a pre-change monitoring data sequence and a post-change monitoring data sequence for each of the multiple varieties. In this embodiment, the multiple varieties are, for example, varieties a and b. The processing unit 102 calculates a pre-change index for each of the multiple varieties based on the pre-change monitoring data sequence of that variety, calculates a post-change index based on the post-change monitoring data sequence of that variety, and displays the pre-change index and post-change index of that variety on the first display unit 104. Each of the multiple varieties' component data Dc includes at least one identical parameter. In other words, filtering is performed for the varieties of component P corresponding to the displayed pre-change index and post-change index.

[0151] As a result, for each of the multiple parts P varieties that are similar to each other in terms of parameters, the pre-change indicator and the post-change indicator are displayed on the first display unit 104. Therefore, the operator can easily grasp the changes in production indicators due to a change in at least one implementation parameter f of the part data Dc for each of the multiple parts P varieties that are similar to each other.

[0152] Furthermore, in this embodiment, the management device 100 includes a first input unit 103 that receives the cumulative period. The processing unit 102 calculates the pre-change indicator and the post-change indicator based on the status of the cumulative period shown by the pre-change monitoring data column, and calculates the post-change indicator based on the status of the cumulative period shown by the post-change monitoring data column.

[0153] As a result, the pre-change indicator and post-change indicator are calculated based on the cumulative period received by the first input unit 103. Therefore, the operator can adjust the cumulative period to a period appropriate for the purpose, thereby confirming the appropriate pre-change indicator and post-change indicator for understanding the correlation described above.

[0154] Furthermore, in this embodiment, the processing unit 102 sequentially calculates production-related indicators based on at least one of the pre-change monitoring data column and the post-change monitoring data column, and displays the calculated production-related indicators on the first display unit 104 in chronological order. In other words, as shown in Figures 9 and 10, for example, the processing unit 102 uses a graph having a horizontal axis indicating time to display the production-related indicators calculated at each calculation point on the first display unit 104.

[0155] This allows production indicators to be displayed in a time-series format, making it easy for operators to grasp the trends in how those production indicators change over time.

[0156] In this embodiment, the functions of the management device 100 may also be provided in the line management devices 200 for each of the implementation lines L1 to L3. In this case, the second input unit 203, line control unit 201, second display unit 204, and second communication unit 208 provided in the line management device 200 function as the first input unit 103, processing unit 102, first display unit 104, and first communication unit 108 of the management device 100, respectively.

[0157] (Embodiment 2) In this embodiment, the control device 100 displays the reference indicator in a way that allows comparison with production-related indicators. In this embodiment, the differences from Embodiment 1 will be described in detail, while the common points will not be described in detail. Also, among the components in this embodiment, components that are the same as those in Embodiment 1 will be denoted by the same reference numerals as in Embodiment 1, and their detailed descriptions will be omitted.

[0158] Figure 13 shows an example of a production network system in this embodiment.

[0159] The production network system 1000 in this embodiment includes a plurality of production systems 1 connected to each other via a communication network E. For example, a production system 1 is located in factories R11 and R12 owned by manufacturing company Q1, and a production system 1 is located in factories R21 and R22 owned by manufacturing company Q2. Similarly, a production system 1 is located in factories R31 and R32 owned by manufacturing company Q3, and a production system 1 is located in factories R41 and R42 owned by manufacturing company Q4. Each of manufacturing companies Q1 to Q4 is a company that produces mounted circuit boards.

[0160] In this embodiment, the control device 100 of each production system 1 also acquires monitoring data sequences Dx from each of the other one or more production systems 1. The processing unit 102 of the control device 100 then determines a reference index from these monitoring data sequences Dx. This reference index is an index that is compared or contrasted with a production-related index as a standard or level for that production-related index.

[0161] In other words, the processing unit 102 of the control device 100 calculates production-related indicators for each of the mounting lines L1 to L3 provided in the production system 1 (hereinafter also called the self-production system) that includes the control device 100, grouping together multiple parts P that are mounted according to at least one identical mounting parameter f into a unit of parts. Furthermore, the processing unit 102 displays the calculated production-related indicators and the reference indicators on the first display unit 104 so that they can be compared. Here, multiple parts P mounted according to at least one identical mounting parameter f are any of the following: (a) all parts regardless of part type that have the same mounting parameter f indicated as a mounting condition by the part data Dc of the part P; (b) multiple parts P regardless of part type that have the same component parameter d3 indicated as information of the part P by the part data Dc of the part P; or (c) multiple parts P regardless of part type that have the same size data d2 indicated as information of the part P by the part data Dc of the part P.

[0162] Figure 14 shows an example of a screen displayed on the first display unit 104 of the management device 100.

[0163] For example, the processing unit 102 acquires multiple monitoring data columns Dx from all manufacturers Q1 to Q4, and for each of the multiple component P varieties, calculates the average value of the production-related indicators for that variety across all manufacturers Q1 to Q4 as the reference indicator 31. Then, as shown in Figure 14, for example, the processing unit 102 displays a graph of the spoilage rate, which is a production-related indicator, and its reference indicator 31 on the first display unit 104 for comparison. In the example shown in Figure 14, a graph of the spoilage rate of component Pa, which is a chip capacitor, and the reference indicator 31, which is the average value of the production-related indicators for that chip capacitor, are displayed. In the example in Figure 14, the horizontal axis of the graph represents the day, and the vertical axis of the graph represents the spoilage rate.

[0164] Furthermore, the processing unit 102 of the control device 100 selects multiple monitoring data sequences Dx obtained from all the factories of the manufacturing company that owns the control device 100, from among the multiple monitoring data sequences Dx obtained from all the manufacturing companies Q1 to Q4 mentioned above. Then, based on the selected multiple monitoring data sequences Dx, the processing unit 102 calculates the average value of the production-related indicators for each of the multiple component P varieties at all factories as the reference indicator 32. Then, as shown in Figure 14, for example, the processing unit 102 displays a graph of the spoilage rate, which is a production-related indicator, and its reference indicator 32 on the first display unit 104 so that they can be compared. Also, the average value can be the average value of the production-related indicators at multiple factories, and it is not necessary for it to be all factories.

[0165] Alternatively, the processing unit 102 of the control device 100 calculates a representative value of the production-related indicator for that product type in all of its factories as a reference indicator 33. If the production-related indicator is the spoilage rate or defect rate, the representative value may be, for example, the minimum or maximum spoilage rate among the spoilage rates of all factories, or the minimum or maximum defect rate among the defect rates of all factories. If the production-related indicator is productivity, the representative value may be, for example, the maximum or minimum productivity among the productivity of all factories. Such minimum or maximum values ​​may be called TOP values. There may also be multiple representative values; for example, they may be the top N values ​​counting from the minimum or maximum spoilage rate among the spoilage rates of all factories. The processing unit 102 then displays a graph of the spoilage rate, which is a production-related indicator, and its reference indicator 33 on the first display unit 104 so that they can be compared. The above-mentioned representative values ​​may be the average of the smallest value up to the nth smallest value (where n is any integer greater than or equal to 2), or the average of the largest value up to the nth largest value.

[0166] Furthermore, if the processing unit 102 of the control device 100 can compare the production-related indicators with the reference indicators, it is not essential for the processing unit 102 to display the reference indicators. For example, the processing unit 102 of the control device 100 may calculate a deviation score that shows whether the production-related indicators are good or bad relative to the reference indicators when the component P is mounted on the substrate B according to at least one mounting parameter f, and display the deviation score on the first display unit 104 instead of the reference indicators.

[0167] The selection of monitoring data sequence Dx used to calculate these reference indicators 31 to 33 can also be described as the selection of multiple mounting equipment that meet the reference conditions. Note that mounting equipment is, for example, a mounting line L. For the calculation of reference indicator 31, the processing unit 102 selects multiple mounting equipment that meet the reference condition of being located in one of all manufacturing companies Q1 to Q4. Then, the processing unit 102 calculates reference indicator 31 based on the monitoring data sequence Dx of each of these selected mounting equipment. Furthermore, for the calculation of reference indicator 32 or reference indicator 33, the processing unit 102 selects mounting equipment that meets the reference condition of being located in one manufacturing company (i.e., all factories owned by that manufacturing company). Then, the processing unit 102 calculates reference indicator 32 or reference indicator 33 based on the monitoring data sequence Dx of each of these selected mounting equipment.

[0168] For example, the first input unit 103 accepts the above-mentioned standard conditions in response to an input operation by an operator. The processing unit 102 calculates a standard index according to those standard conditions. In other words, a standard index corresponding to the granularity of a group of mounting equipment consisting of one or more mounting equipment is determined. The granularity of this group of mounting equipment may be all manufacturers Q1 to Q4, all factories owned by one manufacturer, all production systems located in one factory, all mounting lines L included in one production system, all component mounting equipment of the same model name, all tape feeders of the same type (e.g., feeder 7), all heads of the same type (e.g., mounting head 10), or all nozzles of the same type (e.g., suction nozzle 10b). Furthermore, the granularity of the mounting equipment group may be all component mounting devices included in one mounting line L, all stages included in one component mounting device, all feeders (e.g., feeder 7) included in one component mounting device, all heads (e.g., mounting head 10) included in one component mounting device, or all nozzles (e.g., suction nozzle 10b) included in one component mounting device.

[0169] In the example shown in Figure 14, only the graph for component Pa is displayed, but, as in Embodiment 1, graphs for each type of component P may be scrolled and displayed on the first display unit 104. Furthermore, the displayed graphs (or the types of component P corresponding to those graphs) may be filtered. Also, the reference indices 31 to 33 may be the average or representative values ​​of production-related indices when multiple components P of multiple similar types are mounted. Note that multiple components P of similar types are components in which at least one of the component attribute d31 of the component P is identical (including falling within a predetermined range) (i.e., within a predetermined range). Here, terminals include not only leads but also balls, and terminal information may be the number of leads and lead pitch indicated by size data d2. Also, dimensions include not only the planar direction but also the height direction, and dimension information may be the external dimensions and component height indicated by size data d2. The reference indices may also be determined for component units (hereinafter referred to as similar components) that group multiple components P of multiple similar types. For example, multiple varieties of multiple components P can be distinguished by their component names.

[0170] Here, the processing unit 102 may determine the planned target value as a reference indicator and display it on the first display unit 104.

[0171] Figure 15 is a diagram illustrating the method for calculating the planned target values.

[0172] For example, the production quantity of mounted circuit boards is planned to be 1,000 units. In this case, the number of mounted points will be, for example, 1,000,000 points. The target upper limit spoilage rate is set to 500 ppm. The target upper limit spoilage rate is the upper limit of the target spoilage rate. Therefore, the processing unit 102 calculates the target upper limit number of spoilages as 500 based on the number of mounted points and the target upper limit spoilage rate. This target upper limit number of spoilages is the upper limit of the target number of spoilages, for example, the upper limit of the number of mis-applied parts.

[0173] The processing unit 102 distributes the target upper limit of spoilage to each component type attribute based on the monitoring data column Dx. The component type attribute is an attribute based on the shape type indicated by the component attribute d31, such as chip components, BGA (Ball Grid Array) components, and SOP (Small Outline Package) components. The monitoring data column Dx shows the actual number (e.g., spoilage) for each type of component P. Therefore, the processing unit 102 calculates, for example, the total number of spoilages for each type belonging to chip components as the first spoilage count, the total number of spoilages for each type belonging to BGA components as the second spoilage count, and the total number of spoilages for each type belonging to SOP components as the third spoilage count. Then, the processing unit 102 distributes the target upper limit of spoilage (i.e., 500 times) to the chip components, BGA components, and SOP components according to the ratio of the first spoilage count, the second spoilage count, and the third spoilage count. As a result, for example, 350 cycles are calculated as the target value for chip components, 50 cycles as the target value for BGA components, and 100 cycles as the target value for SOP components.

[0174] In the example above, the target values ​​for each component form attribute are calculated as counts, but the target values ​​may also be calculated as rates (specifically, spoilage rates). In this case, the processing unit 102 distributes the target upper limit spoilage rate (i.e., 500 ppm) to the chip components, BGA components, and SOP components according to the ratio of the first spoilage count, the second spoilage count, and the third spoilage count. As a result, for example, 350 ppm is calculated as the target value for chip components, 50 ppm as the target value for BGA components, and 100 ppm as the target value for SOP components.

[0175] Furthermore, the operator may set the target values ​​for the planned target values. In other words, in response to the operator's input, the system may accept the target values ​​for production-related indicators at the line level (i.e., production-related indicators when a specific mounting line L mounts component P onto circuit board B) as the reference conditions described above, calculate the target values ​​for production-related indicators at the component level from the accepted target values ​​according to the method for calculating the planned target values ​​described above, and determine the target values ​​for the production-related indicators at the component level as the reference indicators.

[0176] Figure 16 shows another example of a screen displayed on the first display unit 104 of the management device 100.

[0177] The processing unit 102 displays, for example as shown in Figure 16, a graph of the spoilage rate of part Pa and the planned target value 34 of the part form attribute to which part Pa belongs, on the first display unit 104 in a comparable manner. In the example of Figure 16, the horizontal axis of the graph represents the days, and the vertical axis of the graph represents the spoilage rate.

[0178] Furthermore, the processing unit 102 may change its planned target value as the component mounting work progresses.

[0179] Figure 17 is a diagram illustrating an example of changing the planned target value.

[0180] For example, on January 1st, before component mounting work has started, the number of components Pa to be mounted on board B (i.e., the remaining number of mounting points) is set to 1,000,000, similar to the example shown in Figure 15, and the target upper limit for spoilage is set to 500 times. At this time, the planned target value is calculated as 500 ppm.

[0181] Then, on January 15th, after the component mounting work has started, the processing unit 102 acquires the monitoring data column Dx and identifies the number of mounted parts as "400,000" and the number of defective parts as "150". As a result, the processing unit 102 updates the remaining number of mounted parts to 600,000 (= 1,000,000 - 400,000) and updates the target upper limit of defective parts to 350 (= 500 - 150). As a result, the processing unit 102 treats the updated remaining number of mounted parts as the number of times parts are attached and updates the planned target value to 583 ppm (≒ 350 / 600,000 × 1,000,000).

[0182] Furthermore, on January 30, when component mounting work continued, the processing unit 102 acquired the subsequent monitoring data column Dx, identifying the number of mounted parts as "900,000" and the number of defective parts as "300". As a result, the processing unit 102 updated the remaining number of mounted parts to 100,000 (= 1,000,000 - 900,000) and updated the target upper limit for defective parts to 200 (= 500 - 300). Consequently, the processing unit 102 treated the updated remaining number of mounted parts as the number of attachments and updated the planned target value to 2,000 ppm (= 200 / 100,000 × 1,000,000).

[0183] As a result, appropriate planned target values ​​are displayed at each stage of the component assembly process, based on the actual performance at each point in time. Therefore, operators can compare production-related indicators such as the spoilage rate with appropriate planned target values ​​at each stage, and effectively evaluate the spoilage rate.

[0184] Figure 18 is a flowchart showing an example of the processing operation of the management device 100 in this embodiment.

[0185] First, the processing unit 102 of the management device 100 acquires monitoring data sequences Dx for each of the mounting lines L1 to L3 provided in each production system 1 included in the production network system 1000 (step S20). For example, the processing unit 102 is provided in the management device 100 of production system 1 located in factory R11 of manufacturing company Q1 as shown in Figure 13. In this case, the processing unit 102 acquires monitoring data sequences Dx from each of the mounting lines L1 to L3 provided in the production system, i.e., mounting lines L1 to L3 in factory R11. Furthermore, the processing unit 102 also acquires monitoring data sequences Dx from each of the mounting lines L1 to L3 in factory R12. In addition, the processing unit 102 also acquires monitoring data sequences Dx for each of the mounting lines L1 to L3 provided in production systems 1 located in factories R21 and R22 of manufacturing company Q2 via the communication network E. For manufacturing companies Q3 and Q4, the processing unit 102 also acquires the respective monitoring data columns Dx for all implementation lines L1 to L3 owned by those manufacturing companies via the communication network E.

[0186] Then, the processing unit 102 calculates production-related indicators (productivity, spoilage rate, defect rate) at each calculation point based on the first monitoring data column, which is the monitoring data column Dx acquired in the self-production system, and the cumulative period information De (step S21).

[0187] Next, the first input unit 103 accepts the criteria conditions in response to the operator's input (step S22). Then, the processing unit 102 selects one or more mounting lines L that satisfy the criteria conditions. Furthermore, the processing unit 102 extracts the monitoring data sequence Dx for each of the selected one or more mounting lines L from the multiple monitoring data sequences Dx acquired in step S20 as the second monitoring data sequence. Note that each of the one or more mounting lines L that satisfy the criteria conditions is a mounting line L included in the aforementioned group of mounting equipment.

[0188] Then, the processing unit 102 calculates production-related indicators for each of the selected one or more implementation lines L using the extracted second monitoring data columns. In calculating these production-related indicators, a predetermined cumulative period may be used, or the cumulative period indicated by the cumulative period information De may be used. Then, the processing unit 102 determines a reference indicator from all the production-related indicators calculated using the one or more second monitoring data columns (step S23).

[0189] Next, the processing unit 102 displays the production-related indicators calculated in step S21 and the reference indicators determined in step S23 in a graph on the first display unit 104 so that they can be compared (step S24).

[0190] Then, the processing unit 102 determines whether or not it has received an instruction from the first input unit 103 to terminate the processing operation (step S25). If the processing unit 102 determines that it has not received the termination instruction (No in step S25), it repeats the processing from step S22. On the other hand, if the processing unit 102 determines that it has received the termination instruction (Yes in step S25), it terminates the processing operation related to production-related indicators.

[0191] As described above, the management device 100 in this embodiment comprises a first communication unit 108, which is an acquisition unit, and a processing unit 102. The first communication unit 108 acquires a first monitoring data sequence Dx, which is a monitoring data sequence Dx indicating the situation when the first mounting equipment has mounted one or more components P onto one or more substrates B, according to at least one mounting parameter f indicated by component data Dc as a mounting condition for components. In the above example, the first mounting equipment is at least one of the mounting lines L1 to L3 provided in the production system 1 (i.e., the self-production system) including the management device 100. However, the first mounting equipment is not limited to mounting line L, and may be a component mounting device M4 or M5, or a collection of the three mounting lines L1 to L3. Based on the first monitoring data sequence, the processing unit 102 calculates an index related to the production of the mounted substrate, which is the substrate B on which the components P are mounted, and displays the calculated production index and a reference index in the first display unit 104 so that they can be compared.

[0192] As a result, the production indicators and the reference indicators are displayed in the first display unit 104 in a comparable manner, allowing the operator to objectively evaluate the quality of at least one mounting parameter f used in production by comparing the production indicators with the reference indicators. Consequently, if the production indicators are poor, the component data Dc can be changed, thereby more appropriately supporting the efficiency of the component mounting work in which components P are mounted on the circuit board B.

[0193] Here, the reference indicator is determined based on the monitoring data sequence Dx of each of the multiple second mounting equipment that satisfy the reference conditions, and which shows the situation when the second mounting equipment has mounted one or more components P onto one or more substrates B according to the same mounting parameter f as the above-mentioned at least one mounting parameter f. In the above example, the second mounting equipment is one of the mounting lines L1 to L3, but it may also be a component mounting device M4 or M5, or a set of the three mounting lines L1 to L3. Note that the multiple second mounting equipment may or may not include the first mounting equipment.

[0194] This makes it possible to determine reference indicators corresponding to the production indicators of each of the multiple second mounting equipment. As a result, the operator can compare the production indicators of the first mounting equipment with the reference indicators of the multiple second mounting equipment, and evaluate the quality of at least one mounting parameter f used in mounting component P by the first mounting equipment in a realistic and objective manner, rather than subjectively.

[0195] In this embodiment, the management device 100 includes a first input unit 103 that receives standard conditions, and the processing unit 102 determines a standard index according to the received standard conditions.

[0196] This allows the operator to change the reference conditions in response to input operations to the first input unit 103, and to switch between multiple second mounting equipment that meet the reference conditions. As a result, the operator can objectively evaluate the quality of at least one mounting parameter f used for mounting component P by the first mounting equipment from various perspectives by comparing production indicators with various reference indicators.

[0197] Furthermore, in this embodiment, the reference condition is that each of the multiple second mounting equipment has the same equipment attribute, and the equipment attribute of each of the multiple second mounting equipment indicates at least one of the following: the type of component mounting equipment including the second mounting equipment, the type of unit including the second mounting equipment, the mounting line L including the second mounting equipment, the factory where the second mounting equipment is installed, the organization that produces or has mounted substrates produced by the second mounting equipment, the application of the mounted substrates produced by the second mounting equipment, and the number of mounted substrates produced by the second mounting equipment. For example, the application of the mounted substrate may be for automotive, PC, or smartphone. For example, the number of substrates produced may be either the upper limit and lower limit of the number of mounted points per month, or both. For example, the type of component mounting equipment may be the model name of the component mounting equipment. For example, the type of unit may be any of the following: the type of tape feeder (e.g., feeder 7), the type of head (e.g., mounting head 10), or the type of nozzle (e.g., suction nozzle 10b).

[0198] If the equipment attribute indicates, for example, a mounting line L, then component mounting devices M4 and M5, each included as a second mounting facility in that mounting line L, have the same equipment attribute (i.e., mounting line L). Similarly, if the equipment attribute indicates, for example, a factory, then all mounting lines L installed as second mounting facilities in that factory have the same equipment attribute (i.e., factory). Likewise, if the equipment attribute indicates, for example, an organization (one specific example being a manufacturing company, an EMS (Electronics Manufacturing Services), or a company that outsources manufacturing to an EMS), then all mounting lines L owned by that organization as second mounting facilities have the same equipment attribute (i.e., organization or manufacturing company). If the equipment attribute indicates, for example, a type of tape feeder (e.g., feeder 7), then multiple tape feeders included as multiple second mounting facilities in multiple mounting lines L, and of the same type as the equipment attribute, have the same equipment attribute. If the equipment attribute indicates, for example, the model name of a component mounting device, then multiple component mounting devices included as multiple second mounting equipment in multiple mounting lines L, and having the same model name as the equipment attribute, have the same equipment attribute. Multiple second mounting equipment having such identical equipment attributes satisfy the criteria. Note that the criterion index 31 shown in Figure 14 is determined based on the respective monitoring data column Dx of all mounting lines L owned as second mounting equipment by the entire organization when the equipment attribute indicates the entire organization. Note that the equipment attribute only needs to indicate one or more manufacturers, and as shown in Figure 14, the equipment attribute may be "all manufacturers". Also, the criterion index 32 or 33 shown in Figure 14 is determined based on the respective monitoring data column Dx of all mounting lines L installed as second mounting equipment in one or more factories of an organization (i.e., one or both of factory R11 and factory R12 of manufacturer Q1) when the equipment attribute indicates an organization (for example, manufacturer Q1 shown in Figure 13). For example, as shown in Figure 14, the equipment attribute may be "all factories". Furthermore, the equipment attribute may be "all implementation lines".

[0199] Furthermore, the equipment attributes related to the mounting line L, the equipment attributes related to the factory, the equipment attributes related to the organization, the equipment attributes related to the application of the mounted circuit board, and the equipment attributes related to the number of mounted circuit boards produced can be used in combination.

[0200] This allows the operator to easily switch the number and range of multiple second-stage mounting equipment units that meet the standard conditions. In other words, the granularity of the aforementioned group of mounting equipment units can be switched.

[0201] Furthermore, the reference condition may specify the location of one or more of the multiple second mounting equipment. For example, the reference condition may indicate at least one of the following: the location of one or more mounting lines L that include the one or more second mounting equipment; the location of one or more stages provided in each of the one or more mounting lines L; and the location of one or more component mounting devices provided in each of the one or more mounting lines L. Alternatively, the reference condition may be that each of the multiple second mounting equipment is located at the same position within the mounting line L that includes the second mounting equipment. More specifically, the second mounting equipment is a component mounting device, and the reference condition is a condition indicating the location (line number) of each of the multiple mounting lines L that include the multiple component mounting devices. Alternatively, the reference condition may be that one of the multiple component mounting devices is located at the leading position among the multiple component mounting devices arranged in the mounting line L that includes that one component mounting device. Alternatively, the reference condition may be that one of the stages provided in one of the multiple component mounting devices is located at the front or rear position within the component mounting equipment that includes that one stage. The second implementation equipment may be the stage described above.

[0202] This allows the operator to compare the production indicators of the first mounting equipment with at least one of the following: the reference indicators of the mounting line L specified by the reference conditions, the reference indicators of the component mounting equipment specified by the reference conditions, and the reference indicators of the stage specified by the reference conditions. The reference conditions can be a combination of equipment attributes and the location of the second mounting equipment, and the reference indicators may be determined based on this combination.

[0203] Furthermore, the reference index is determined based on a second monitoring data sequence that shows the situation when the second mounting equipment has mounted one or more components P onto one or more substrates B, as described above. Here, the one or more components P may be components P having component attributes received by an operator's input operation to the first input unit 103. In other words, filtering of components P based on component attributes may be performed.

[0204] In other words, in this embodiment, the first input unit 103 receives component attributes. The processing unit 102 then determines a reference index based on the second monitoring data sequence, which is the monitoring data sequence Dx for each of the multiple second mounting equipment units. The second monitoring data sequence indicates the situation when the second mounting equipment mounted one or more components P having those component attributes onto one or more substrates B according to the same mounting parameter f as the at least one mounting parameter f described above. The component attributes of the one or more components P indicate at least one of the following: the type of component P, the shape of component P, the variety of component P, the supply form of component P, and the vendor of component P. The supply form of component P may be a taping component (including a reel-less component) that houses component P in a carrier tape with pockets for storing component P, a tray component that places component P on a tray, a stick component that houses component P aligned and held on a hollow stick, or a bulk component that houses component P in a loose state. Furthermore, the supply method for component P may be the type of supply device that supplies component P, such as a feeder 7, tray feeder, stick feeder, or bulk feeder located in the component supply unit 6. Component attributes may also be similar components.

[0205] This makes it possible to determine a standard index corresponding to the component attributes of multiple second mounting equipment. As a result, the operator can compare the production index of the first mounting equipment with its standard index, and realistically and objectively evaluate the quality of at least one mounting parameter f used for mounting component P by the first mounting equipment from the perspective of component attributes. Note that the component attribute may be the type of component P, "chip capacitor," as shown in Figure 14. Also, if the type of component P shown in Figure 5 includes a specific string indicating the vendor of component P, the component attribute may be that specific string. Also, if the type of component P shown in Figure 5 includes lot information for component P (e.g., manufacturing date, destination, etc.), the component attribute may be the lot information. Also, if the component type of component P shown in Figure 5 includes "resistor," "capacitor," "transistor," etc., the component attribute may be the component type of component P. The component type of component P is just one example of a component type. Furthermore, if the shape types of component P shown in Figure 5 include SOP components with multiple leads protruding in two directions, BGA components with bumps formed on one surface of the component body, and chip components, the component attribute may be the shape type of component P. The shape type of component P is an example of the shape of component P.

[0206] Furthermore, the reference conditions may also be conditions that indicate the mounting parameters f used by each of the multiple second mounting equipment for mounting component P. For example, the reference conditions may be at least one of the speed parameter f3, recognition information f4, gap information f5, adsorption information f6, and mounting information f7 indicated by the mounting parameter f.

[0207] Furthermore, in this embodiment, the actual numbers included in the first monitoring data column include at least one of (1) the number of spoilages, the number of adsorption errors, and the number of recognition errors, and at least one of (2) the number of mounting errors. The processing unit 102 then calculates an index based on the actual numbers included in the first monitoring data column as an index related to production. In the example above, index (1) is the spoilage rate, and index (2) is the defect rate.

[0208] This allows the operator to compare at least one of the indicators described in (1) and (2) above with a reference indicator.

[0209] Furthermore, in this embodiment, the processing unit 102 calculates an index indicating the productivity of the mounted substrate produced by the first mounting equipment mounting one or more components P, as an index related to production. In the example described above, the index indicating productivity is productivity expressed in CPH.

[0210] This allows operators to compare the productivity of the assembled circuit boards with a benchmark.

[0211] Furthermore, in this embodiment, the position information included in the first monitoring data sequence includes at least one of the adsorption position and the mounting position. The processing unit 102 then calculates an index based on the position information included in the first monitoring data sequence as an index related to production.

[0212] This allows operators to compare location-based metrics with baseline metrics.

[0213] Furthermore, in this embodiment, the processing unit 102 sequentially calculates production indicators based on the first monitoring data sequence and displays the calculated production indicators on the first display unit 104 in chronological order. In other words, as shown in Figures 14 and 16, for example, the processing unit 102 displays the spoilage rate calculated at each calculation point on the first display unit 104 using a graph with a horizontal axis indicating time.

[0214] This allows production metrics to be displayed in a time-series format, enabling operators to compare these changing production metrics with baseline metrics.

[0215] In the example described above, the benchmark indicator is determined based on the second monitoring data sequence of each of the multiple second implementation devices, but it may also be determined based on the second monitoring data sequence of a single implementation device.

[0216] Furthermore, the processing unit 102 in this embodiment may predict comparison information. That is, when the implementation parameter f of the component data Dc is changed, the processing unit 102 may predict comparison information as in Embodiment 1 as predicted comparison information and display it on the first display unit 104 before the component implementation work based on the changed implementation parameter f is started. For example, when the processing unit 102 receives an inquiry about a change in the implementation parameter f from any of the implementation lines L1 to L3 via the first communication unit 108, it predicts comparison information based on the changed implementation parameter f.

[0217] Figure 19 shows an example of how prediction comparison information is displayed.

[0218] The processing unit 102 displays the predicted comparison information 23 on the first display unit 104, for example, as shown in Figure 19. The predicted comparison information 23 includes two lists. One of these lists, the third list 23a, shows the current implementation parameters f before the change and the current production-related indicators (productivity, spoilage rate, defect rate) based on the component data Dc that includes the implementation parameters f, similar to the first list 22a described above. The other of these lists, the fourth list 23b, shows the implementation parameters f after the change and the predicted production-related indicators (productivity, spoilage rate, defect rate) based on the component data Dc that includes the implementation parameters f after the change. Specifically, the third list 23a shows "Nozzle: 235" as the nozzle information f2 among the current implementation parameters f, and shows "Productivity: 25,000 CPH, Spoilage rate: 1,500 ppm, Defect rate: 50 ppm" as the current production-related indicators. List 4, item 23b, shows "Nozzle: 226" as the modified nozzle information f2 among the implementation parameters f, and predicts "Productivity: 3,000 CPH, Spoilage Rate: 500 ppm, Defect Rate: 300 ppm" as the production-related indicators. The production-related indicators shown in List 4, item 23b are indicators predicted based on past monitoring data column Dx, which shows the situation when component P was implemented according to the implementation parameter f, "Nozzle: 226". The production-related indicators are at least one of the following: (a) an indicator predicted based on the monitoring data column Dx of one or more parts P of the same type or similar parts of part P of the same type implemented on the implementation line L; (b) an indicator predicted based on the monitoring data column Dx of one or more parts P of the same type or similar parts of part P of the same type implemented on other implementation lines L; (c) an indicator predicted based on the average or representative value of production-related indicators when one or more parts P of the same type or similar parts of part P of the same type are implemented on any of the entire manufacturing company, entire factory, or entire implementation line L; and (d) an indicator predicted based on the monitoring data column Dx of all parts implemented on the implementation line L, regardless of the type of part P.

[0219] For example, the processing unit 102 extracts multiple monitoring data sequences Dx from multiple monitoring data sequences Dx obtained from multiple mounting lines L that satisfy the above-described criteria. Each of the extracted monitoring data sequences Dx is a monitoring data sequence Dx obtained when the mounting line L performs component mounting work based on component data Dc that indicates "nozzle: 226" as the modified nozzle information f2. The above-described criteria can be arbitrarily set by an operator's input operation to the first input unit 103. Furthermore, among the multiple component data Dc corresponding to the extracted monitoring data sequences Dx, not only the nozzle information f2 "nozzle: 226" but all other parameters and information may be the same, or only some parameters and information may be the same. In other words, monitoring data sequences Dx obtained by component mounting work based on multiple component data Dc that are similar to each other and include nozzle information f2 "nozzle: 226" are extracted.

[0220] The processing unit 102 calculates production-related indicators (productivity, spoilage rate, defect rate) based on the extracted multiple monitoring data columns Dx. In other words, the processing unit 102 predicts the production-related indicators for the component mounting work based on past performance before the component mounting work based on the modified component data Dc is started by the mounting lines L1 to L3 provided in the self-production system. In the example above, the modified component data Dc is component data Dc that shows "Nozzle: 226" as nozzle information f2. The processing unit 102 then includes the predicted production-related indicators in the fourth list 23b.

[0221] This predictive comparison information 23 indicates that the nozzle information f2 in the component data Dc of component Pa included in the second component library Lb2 of the mounting line L will be changed from the current "nozzle: 235" to "nozzle: 226". In other words, the predictive comparison information 23 indicates that the type of suction nozzle 10b will be changed from "235" to "226". Furthermore, the predictive comparison information 23 indicates that this change is likely to decrease productivity from 25,000 CPH to 3,000 CPH, decrease the spoilage rate from 1,500 ppm to 500 ppm, and increase the defect rate from 50 ppm to 300 ppm.

[0222] Furthermore, the processing unit 102 displays the message "Do you want to change the nozzle?" and the change button 24 and cancel button 25 on the first display unit 104. Then, the processing unit 102 determines whether the change button 24 or the cancel button 25 has been selected, in response to the operator's input operation to the first input unit 103. If the processing unit 102 determines that the change button 24 has been selected, it instructs the mounting line L, which is provided in the self-production system, to perform the component mounting work based on the changed component data Dc, via the first communication unit 108. Note that this mounting line L is, for example, the mounting line that inquired about changing the mounting parameter f as described above. On the other hand, if the processing unit 102 determines that the cancel button 25 has been selected, it terminates the process of changing the component data Dc without instructing the mounting line L to perform the component mounting work based on the changed component data Dc.

[0223] Furthermore, when determining at least one implementation parameter f that indicates the implementation conditions for a "new part" that has never been implemented on the implementation line L before, the processing unit 102 may predict comparative information. When the processing unit 102 determines the implementation parameter f for the "new part", it may not display the third list 23a and may only display the fourth list 23b. For example, the fourth list 23b may show production-related indicators based on monitoring data column Dx that shows the situation when one or more types of parts P, which are similar parts to the "new part", were being implemented according to the changed implementation parameter f. This allows for confirmation of what production-related indicators can be predicted based on similar parts that have been produced conventionally, and enables judgment on the quality of the implementation parameter f as an implementation condition for implementing the "new part".

[0224] Furthermore, the processing unit 102 may predict comparative information for a component P that has been mounted on at least one mounting line L among all mounting lines L installed in all factories of all manufacturing companies Q1 to Q4, but has not been mounted on a particular mounting line L, before starting mounting on that particular mounting line L. For example, the processing unit 102 may calculate production-related indicators based on a monitoring data column Dx that shows the situation when the component P was mounted on at least one mounting line L among all mounting lines L, according to the modified mounting parameters f, and show this in the fourth list 23b. This makes it possible to check what kind of production-related indicators can be predicted based on the same component P that has been produced conventionally, and to judge whether the mounting parameters f as mounting conditions for mounting component P are good or bad.

[0225] The processing unit 102 may also display a fifth list for comparison with the third list 23a. The fifth list shows the average or representative values ​​of production-related indicators (productivity, spoilage rate, defect rate) when one or more parts P are mounted in any of the manufacturing companies, factories, or mounting lines L, according to the same mounting parameters f as the current mounting parameters f before the change, and the part data Dc that includes those mounting parameters f.

[0226] Figure 20 shows another example of the display of the predicted comparison information 23.

[0227] In the example in Figure 19, the predicted comparison information 23 shows the current implementation parameter f (specifically, nozzle information f2) before the change and the implementation parameter f after the change. However, as shown in Figure 20, the predicted comparison information 23 may also show the current production-related indicators and the predicted production-related indicators in a radar chart format without showing those implementation parameters f. The predicted production-related indicators are production-related indicators based on component data Dc, which includes the implementation parameter f after the change. Furthermore, the processing unit 102 may also display the message "Do you want to change the nozzle?" and a change button 24 and a cancel button 25 on the first display unit 104, similar to the example in Figure 19.

[0228] The predicted comparison information 23, change button 24, and cancel button 25 shown in Figures 19 and 20 may also be displayed on the second display unit 204 of the implementation line L.

[0229] As described above, when the management device 100 of this embodiment receives an inquiry about changing the implementation parameter f, it displays predicted comparison information 23 based on the changed implementation parameter f. Therefore, the operator can check production-related indicators based on the changed implementation parameter f before the component implementation work based on the changed implementation parameter f is actually performed. In other words, conventionally, the operator cannot check production-related indicators such as the frequency of errors until a predetermined number of components P are implemented based on the implementation parameter f. Therefore, when the operator changes the implementation parameter f, they cannot determine whether the changed implementation parameter f is appropriate until a predetermined number of components P are implemented based on the changed implementation parameter f. However, in this embodiment, when the implementation parameter f is changed, the predicted production-related indicators based on the changed implementation parameter f are displayed as predicted comparison information 23 before a predetermined number of components P are implemented. Therefore, the operator can determine in advance whether the changed implementation parameter f is appropriate.

[0230] (Embodiment 3) In this embodiment, the management device 100 displays the matching rate between two component libraries Lb. In this embodiment, the differences from Embodiment 1 or 2 will be described in detail, while the common points will not be described in detail. Also, among the components in this embodiment, components that are the same as those in Embodiment 1 or 2 will be denoted by the same reference numerals as in Embodiment 1 or 2, and their detailed descriptions will be omitted.

[0231] Figure 21 is a diagram illustrating the processing operation of the management device 100 in this embodiment.

[0232] The first communication unit 108 of the management device 100 acquires the second component library Lb2 used in each of the mounting lines L1 to L3. The processing unit 102 of the management device 100 then calculates the agreement rate between two component libraries Lb, one of the second component library Lb2 and the other of the first component library Lb1, and displays an image showing the agreement rate on the first display unit 104.

[0233] Figure 22 shows an example of how the agreement rate is displayed.

[0234] The processing unit 102 displays the matching rate of each combination in a table format on the first display unit 104, for example, as shown in Figure 22. The combination is a combination of the first component library Lb1 and two component libraries Lb from among the multiple second component libraries Lb2. The first component library Lb1 is also called the master or master component library, as described above.

[0235] For example, the processing unit 102 calculates a matching rate of "95%" between the first component library Lb1 and the second component library Lb2 of the mounting line L1. The processing unit 102 also calculates a matching rate of "78%" between the second component library Lb2 of the mounting line L1 and the second component library Lb2 of the mounting line L2. After calculating the matching rate for each combination in this way, the processing unit 102 displays these matching rates in a table format on the first display unit 104.

[0236] Specifically, the processing unit 102 calculates the matching rate between the two component libraries Lb as the ratio of the number of identical component data Dc contained in each of the two component libraries Lb to the total number of component data Dc contained in each of the two component libraries Lb. For example, if each of the two component libraries Lb contains 100 component data Dc, and 95 of those 100 component data Dc are identical between the two component libraries Lb, then a matching rate of 95% is calculated between the two component libraries Lb.

[0237] Figure 23 shows another example of how to display the agreement rate.

[0238] The processing unit 102 may display the matching rate of each combination in an Euler diagram on the first display unit 104, for example, as shown in Figure 23. In Figure 23, each component library Lb is represented by a circle. The size of the overlapping portion of two circles indicates the matching rate between the two component libraries Lb corresponding to those circles. The processing unit 102 may also display the matching rate between the master first component library Lb1 and the second component libraries Lb2 of each of the mounting lines L1 to L3 as a specific numerical value on the first display unit 104. In a specific example, as shown in Figure 23, the matching rate of the second component library Lb2 of mounting line L1 is displayed as "30%", the matching rate of the second component library Lb2 of mounting line L2 is displayed as "64%", and the matching rate of the second component library Lb2 of mounting line L3 is displayed as "25%".

[0239] Furthermore, the processing unit 102 may display production-related indicators for each of the mounting lines L1 to L3. These production-related indicators may be indicators for each type of component P, as in Embodiment 1 or 2, or they may be production-related indicators for all types of component P mounted on the mounting line L. Alternatively, the production-related indicators may be indicators derived from the production-related indicators of each of multiple types of component P having the same component attributes (for example, the average value of each production-related indicator). Such component attributes may be received by the first input unit 103. In addition, the production-related indicators may be normalized to a numerical value between 1 and 100.

[0240] Here, the processing unit 102 may, for example, display a data change screen on the first display unit 104 that accepts an operation to change the part data Dc included in the second part library Lb2 corresponding to the production-related indicator if the displayed production-related indicator is smaller or larger than a threshold. Alternatively, the processing unit 102 may display the data change screen on the first display unit 104 if the difference between multiple displayed production-related indicators is larger than a threshold. After the data change screen is displayed, the processing unit 102, upon receiving an input operation from the operator to the first input unit 103, may change the part data Dc included in the second part library Lb2 other than the best second part library Lb2 to the part data Dc included in the best second part library Lb2. The best second part library Lb2 is the second part library Lb2 corresponding to the smallest production-related indicator (specifically, the smallest spoilage rate or defect rate) or the largest production-related indicator (specifically, the largest productivity). In this modification, at least one implementation parameter f of the component data Dc included in the other second component library Lb2 is changed to match at least one implementation parameter f of the component data Dc included in the best second component library Lb2. The processing unit 102 may perform the above-mentioned modification of the other second component library Lb2 automatically, without accepting input operations from the operator. Furthermore, the processing unit 102 may modify the first component library Lb1 in the same way as the other second component library Lb2. Even if the other second component library Lb2 is changed to the best second component library Lb2, i.e., unified, the specific component data Dc included in the other second component library Lb2 does not have to be changed to the component data Dc of the best second component library Lb2. Such specific component data Dc may be set by an input operation to the first input unit 103.

[0241] Furthermore, the processing unit 102 may display on the first display unit 104 the number of mismatched parts, which is the number of part data Dc in the second part library Lb2 that differs from the master part data Dc. For example, as shown in Figure 23, the processing unit 102 displays "150," the number of part data Dc in the second part library Lb2 of the mounting line L1 that differs from the master part data Dc, as the number of mismatched parts. Alternatively, the processing unit 102 may display on the first display unit 104 the number of mismatched parts, which is the number of part data Dc in the second part library Lb2 that differs from the part data Dc in other second part libraries Lb2.

[0242] Figure 24 shows yet another example of how the agreement rate is displayed.

[0243] The processing unit 102 displays the matching rate of each combination in an Euler diagram on the first display unit 104, as shown in Figure 24, similar to the example in Figure 23. In the example in Figure 24, the processing unit 102 fills in the circle corresponding to each second part library Lb2. The processing unit 102 also determines the intensity or color of the circle's fill according to the production-related indicator of the second part library Lb2 corresponding to that circle. For example, the processing unit 102 makes the circle's fill darker the larger the production-related indicator. Alternatively, the processing unit 102 makes the circle's fill color redder the larger the production-related indicator, and bluer the circle's fill color the smaller the production-related indicator.

[0244] The processing unit 102 may calculate the agreement rate between the component data Dc corresponding to the component type P contained in one of the two component libraries Lb and the component data Dc corresponding to the component type P contained in the other. More specifically, the processing unit 102 may calculate the agreement rate between the implementation parameter f shown in one of the two component data Dc and the implementation parameter f shown in the other. For example, the implementation parameter f contains k pieces of information (where k is an integer of 1 or more). In this case, if j pieces of information (where j is an integer less than or equal to k) out of the k pieces of information contained in the implementation parameter f are the same between the two component data Dc, the processing unit 102 calculates the agreement rate between the two component data Dc as j / k × 100 (%). Then, the processing unit 102 calculates, for example, the average value of the agreement rates calculated for each component type P as the agreement rate between the two component libraries Lb.

[0245] When the matching rate between two parts libraries Lb is calculated in this way, the part data Dc corresponding to the same type of part P, contained in each of the two parts libraries Lb, is used to calculate the matching rate. In other words, if one of the two parts libraries Lb contains part data Dc corresponding to part Pa, but the other does not, then the part data Dc corresponding to part Pa will not be used to calculate the matching rate. Therefore, as long as each of the two parts libraries Lb contains part data Dc corresponding to at least one part P of the same type, the matching rate between the two parts libraries Lb can be calculated appropriately. To put it another way, even if one of the two parts libraries Lb contains part data Dc corresponding to a certain type of part P, but the other does not contain part data Dc corresponding to the same type of part P, the matching rate between the two parts libraries Lb can still be calculated appropriately. The processing unit 102 may also display on the first display unit 104 the number of component data Dc corresponding to the type of component P that is included in only one of the two component libraries Lb and not in the other.

[0246] Figure 25 is a flowchart showing an example of the processing operation of the management device 100 in this embodiment.

[0247] First, the processing unit 102 of the management device 100 acquires the master first component library Lb1 from the first production storage unit 105 (step S30). Furthermore, the processing unit 102 acquires the second component library Lb2 from each of the mounting lines L1 to L3 via the first communication unit 108 (step S31).

[0248] Next, the processing unit 102 calculates the matching rate between the two component libraries Lb for each combination of the two component libraries Lb (step S32). Then, the processing unit 102 displays an image showing the calculated matching rate for each combination on the first display unit 104 (step S33).

[0249] As described above, the management device 100 in this embodiment comprises a first production storage unit 105, an acquisition unit which is a first communication unit 108, and a processing unit 102. The first production storage unit 105 stores a component library Lb containing a plurality of component data Dc as a first component library Lb1. The first communication unit 108 acquires a component library Lb containing a plurality of component data Dc, generated based on the first component library Lb1, from each of at least one mounting line L as a second component library Lb2. For each of the one or more combinations, the processing unit 102 calculates the agreement rate between the two component libraries Lb included in the combination and displays an image showing the agreement rate on the first display unit 104. Each of the one or more combinations includes two component libraries Lb from the first component library Lb1 stored in the first production storage unit 105 and at least one second component library Lb2 acquired by the first communication unit 108.

[0250] As a result, for each combination, an image showing the degree of similarity between the two component libraries Lb included in that combination is displayed on the first display unit 104, allowing the operator to easily understand how similar the two component libraries Lb are for each combination. Consequently, if the two component libraries Lb are significantly different, the operator can, for example, change one of the two component libraries Lb so that it matches the other. Therefore, it is possible to more effectively support the efficiency of component mounting work, in which component P is mounted on the substrate B.

[0251] In this embodiment, the processing unit 102 displays a data change screen that accepts changes to at least one implementation parameter f, which is indicated by the component data Dc included in the first component library Lb1 or the second component library Lb2.

[0252] This displays a data modification screen, allowing you to easily modify one of the two component libraries Lb so that it matches the other.

[0253] Furthermore, in this embodiment, each of the multiple component data Dc contained in the first component library Lb1 represents at least one standard mounting parameter f for mounting a component P of the type corresponding to that component data Dc onto the substrate B. On the other hand, each of the multiple component data Dc contained in the second component library Lb2 represents at least one mounting parameter f for mounting a component P of the type corresponding to that component data Dc onto the substrate B by the mounting line L having the second component library Lb2.

[0254] This allows the operator to easily understand how much each second component library Lb2 deviates from the standard first component library Lb1 as a result of being modified by the mounting line L.

[0255] Furthermore, in this embodiment, the processing unit 102 calculates the matching rate for each component data Dc contained in one of the two component libraries Lb, and for each component data Dc contained in one of the two component libraries Lb, the matching rate between that component data Dc and the component data Dc corresponding to a component P of the same type as that component data Dc, contained in the other component library Lb. In other words, for each type of component P, the processing unit 102 calculates the matching rate between the component data Dc corresponding to that type contained in one of the two component libraries Lb and the component data Dc corresponding to that type contained in the other component library Lb.

[0256] As a result, the matching rate is calculated for each common product type between the two product libraries Lb. Therefore, even if the product data Dc corresponding to a certain product type of product P exists only in one of the two product libraries Lb, the matching rate between the two product libraries Lb can be calculated appropriately.

[0257] Furthermore, in this embodiment, when displaying an image showing the matching rate, the processing unit 102 further displays on the first display unit 104 an index related to the production of the mounted board produced by the mounting line L according to the second component library Lb2 used to calculate the matching rate. This production index is a production-related index.

[0258] This further displays production metrics for each second component library Lb2. Therefore, the operator can modify either the first component library Lb1 or the second component library Lb2 to match the second component library Lb2 displaying the best metrics, based on these metrics. As a result, the efficiency of the component mounting operation—mounting component P onto the substrate B—can be better supported.

[0259] Furthermore, in this embodiment, the processing unit 102 changes the component data Dc contained in one of the two component libraries Lb to the component data Dc contained in the other component library Lb, based on the displayed production indicators.

[0260] This allows the system to automatically match the other component libraries Lb to the second component library Lb2, which displays good metrics, thereby unifying multiple component libraries Lb.

[0261] In this embodiment, the processing unit 102 calculates at least one of the following as production-related indicators: (1) an indicator based on the number of defects, the number of suction errors, the number of recognition errors, and at least one of the suction positions; and (2) an indicator based on at least the number of mounting errors. In the example above, indicator (1) is the defect rate, and indicator (2) is the defect rate.

[0262] This allows the operator to modify the first component library Lb1 or the second component library Lb2 based on at least one of the indicators described in (1) and (2) above.

[0263] Furthermore, in this embodiment, the processing unit 102 calculates an index indicating the productivity of a mounted substrate produced by mounting one or more components P according to the component library Lb, as an index related to production. In the example above, the index indicating productivity is productivity expressed in CPH.

[0264] This allows the operator to change between the first component library Lb1 or the second component library Lb2 based on the productivity of the mounted board.

[0265] Furthermore, in this embodiment, the processing unit 102 calculates an index based on at least one of the adsorption position and the mounting position as an index related to production. For example, the index may be the variation in adsorption position, the variation in mounting position, etc.

[0266] This allows the operator to change the first or second component library based on an index that is based on at least one of the adsorption position and the mounting position.

[0267] Although a control device 100 and a control method relating to one or more embodiments have been described above based on each embodiment, this disclosure is not limited to these embodiments. Various modifications of the above embodiments that a person skilled in the art can conceive of may also be included in this disclosure, as long as they do not depart from the spirit of this disclosure, and forms combining several embodiments may also be included in this disclosure.

[0268] For example, the mounting equipment in each of the above embodiments may be a mounting line L, a work machine 210, or any other equipment unit. Also, the type of part P may be the model number or part number of part P, the name of part P, or other attributes. Furthermore, the type of part P may be a type defined by the operator.

[0269] In each of the above embodiments, one or more components included in the management device 100 and the implementation line L may be implemented by dedicated hardware or by executing a software program suitable for those components. One or more components may be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the management device 100 and the like in each of the above embodiments causes a computer to execute each step of the flowchart shown in Figures 12, 18, and 25.

[0270] The following cases are also included in this disclosure.

[0271] (1) The one or more components described above may specifically be a computer system consisting of a microprocessor, ROM (Read Only Memory), RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The microprocessor operates according to the computer program, thereby enabling one or more components to perform their functions. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to the computer in order to achieve a predetermined function.

[0272] (2) The one or more components described above may be comprised of a single system LSI (Large Scale Integration). The system LSI is a highly functional LSI manufactured by integrating multiple components onto a single chip, and specifically, it is a computer system comprising a microprocessor, ROM, RAM, etc. The RAM stores a computer program. The system LSI achieves its function by operating the microprocessor in accordance with the computer program.

[0273] (3) The above one or more components may consist of a detachable IC card or a standalone module. The IC card or module is a computer system consisting of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned multi-functional LSI. The IC card or module achieves its function by the operation of the microprocessor according to the computer program. The IC card or module may be tamper-resistant.

[0274] (4) The disclosure may also be the methods described above. Alternatively, it may be a computer program that implements these methods using a computer, or a digital signal consisting of a computer program.

[0275] Furthermore, this disclosure may also refer to a computer program or digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD (Compact Disc)-ROM, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray® Disc), semiconductor memory, etc. Alternatively, it may refer to a digital signal recorded on such a recording medium.

[0276] Furthermore, this disclosure may also include the transmission of computer programs or digital signals via telecommunications lines, wireless or wired communication lines, networks such as the Internet, data broadcasting, etc.

[0277] Alternatively, the program or digital signal may be carried out by another independent computer system by recording and transferring it on a recording medium, or by transferring the program or digital signal via a network or the like.

[0278] This disclosure can be used, for example, in a management device for mounting components onto a substrate.

[0279] 1 Production System 4 Base 5 Substrate Transport Mechanism 6 Component Supply Unit 7 Feeder 8 Y-axis Beam 9 X-axis Beam 9a Plate 10 Mounting Head 10a Suction Unit 10b Suction Nozzle 11 Component Recognition Camera 12 Substrate Recognition Camera 13 Cart 13a Feeder Base 14 Component Tape 15 Cassette Holder 21 Pointer 22 Comparison Information 22a First List 22b Second List 23 Predictive Comparison Information 23a Third List 23b Fourth List 24 Change Button 25 Cancel Button 31, 32, 33 Reference Indicators 34 Planned Target Values ​​100 Management Device 101 Management Control Unit 102 Processing Unit 103 First Input Unit (Input Unit) 104 First Display Unit (Display Unit) 105 First Production Storage Unit 106 Monitoring Data Storage Unit 108 First communication unit (acquisition unit) 200 Line management device 201 Line control unit 203 Second input unit 204 Second display unit 205 Second production storage unit 208 Second communication unit 210 Work machine 1000 Production network system a, b Product type B Substrate C Parts reel d Configuration information d1 Shape diagram d2 Size data d3 Parts parameters Da Monitoring data Db Change notification data Dc Parts data De Cumulative period information Dx Monitoring data column E Communication network f Mounting parameters f2 Nozzle information f3 Speed ​​parameters f4 Recognition information f5 Gap information f6 Suction information f7 Mounting information Hu Upper holding position Hd Lower holding position L Mounting line L1, L2, L3 Mounting line Lb Parts library Lb1 First parts library Lb2 Second component library M1 PCB supply device M2 PCB transfer device M3 Solder printing device M4, M5 Component mounting device M6 Inspection machine M7 Reflow device M8 PCB recovery device P, Pa, Pb Components Q1, Q2, Q3, Q4 ManufacturerR11, R12, R21, R22, R31, R32, R41, R42 Factory T1, T2 Calculation point Td1 1st cumulative period Td2 2nd cumulative period Td3 3rd cumulative period Td4 4th cumulative period

Claims

1. A management device comprising: an acquisition unit that acquires a first monitoring data sequence, which is a sequence of monitoring data indicating the situation when a first mounting equipment is mounting one or more components onto one or more substrates according to at least one mounting parameter indicated as a mounting condition for components by component data; and a processing unit that calculates an index relating to the production of a mounted substrate, which is a substrate on which components are mounted, based on the first monitoring data sequence, and displays the calculated production index and a reference index on a display unit in a comparative manner.

2. The management device according to claim 1, wherein the reference indicator is determined based on a second monitoring data sequence representing each of a plurality of second mounting equipment that satisfy the reference conditions, and which shows the situation when the second mounting equipment was mounting one or more components onto one or more substrates according to the same mounting parameter as the at least one mounting parameter.

3. The management device according to claim 2, further comprising an input unit for receiving the standard conditions, and the processing unit further determining the standard index according to the received standard conditions.

4. The control device according to claim 2, wherein the standard condition is that each of the plurality of second mounting equipment has the same equipment attribute, and each of the plurality of second mounting equipment's equipment attribute indicates at least one of the following: the type of component mounting equipment including the second mounting equipment, the type of unit including the second mounting equipment, the mounting line including the second mounting equipment, the factory where the second mounting equipment is installed, the organization that produces or has mounted substrates produced by the second mounting equipment, the intended use of the mounted substrates produced by the second mounting equipment, and the number of mounted substrates produced by the second mounting equipment.

5. The control device according to claim 2, wherein the reference condition is a condition that specifies the location of one or more of the plurality of second mounting equipment, and indicates at least one of the locations of one or more mounting lines including the one or more second mounting equipment, one or more stages provided on each of the one or more mounting lines, and one or more component mounting devices provided on each of the one or more mounting lines.

6. The management device further comprises an input unit for receiving component attributes, and the processing unit further comprises a monitoring data sequence for each of a plurality of second mounting equipment, which determines the reference index based on a second monitoring data sequence indicating the situation when the second mounting equipment mounted one or more components having the component attributes on one or more substrates according to the same mounting parameters as the at least one mounting parameter, and the component attributes indicate at least one of the component type, component shape, similar components, component variety, component supply form, and component vendor, according to claim 1.

7. The management device according to claim 1, wherein the actual number included in the first monitoring data column includes at least one of (1) the number of spoilages, the number of adsorption errors, and the number of recognition errors, and (2) at least one of the number of mounting errors, and the processing unit calculates an index based on the actual number included in the first monitoring data column as an index related to production.

8. The control device according to claim 1 or 7, wherein the processing unit calculates an index indicating the productivity of the mounted substrate produced by the first mounting equipment mounting one or more components, as an index related to the production.

9. The control device according to claim 1, wherein the position information included in the first monitoring data sequence includes at least one of the adsorption position and the mounting position, and the processing unit calculates an index based on the position information included in the first monitoring data sequence as an index related to production.

10. The control device according to claim 1, wherein the processing unit sequentially calculates production indicators based on the first monitoring data sequence and displays the calculated production indicators in chronological order.

11. A management method performed by a computer, comprising: acquiring a first monitoring data sequence, which is a sequence of monitoring data indicating the situation when a first mounting equipment has mounted one or more components on one or more substrates according to at least one mounting parameter indicated by component data as mounting conditions for components; calculating an index relating to the production of a mounted substrate, which is a substrate on which components are mounted, based on the first monitoring data sequence; and displaying the calculated production index and a reference index in a comparative manner on a display unit.

12. A program that causes a computer to perform the following actions: acquire a first monitoring data sequence, which is a sequence of monitoring data indicating the situation when a first mounting equipment is mounting one or more components onto one or more substrates according to at least one mounting parameter indicated as a mounting condition for components by component data; calculate an index relating to the production of a mounted substrate, which is a substrate on which components are mounted, based on the first monitoring data sequence; and display the calculated production index and a reference index on a display unit in a comparative manner.

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