Fingerprint sensor module and IC card
The fingerprint sensor module design with a through-hole structure simplifies IC card manufacturing by allowing alignment-free integration, facilitating efficient mass production with reliable connections.
WO2026116043A1PCT designated stage Publication Date: 2026-06-04TOPPAN HOLDINGS INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TOPPAN HOLDINGS INC
- Filing Date
- 2025-11-06
- Publication Date
- 2026-06-04
Smart Images
Figure JP2025038926_04062026_PF_FP_ABST
Abstract
A fingerprint sensor module (10) comprises an insulating substrate (110), a sensing unit (120) provided above the substrate, and an IC chip (130) disposed below the substrate. The sensing unit includes: a sensor (121) that reads the fingerprint of a touched finger; a bezel unit (122) that is formed of a conductor, is disposed around the sensor, and acquires the reference potential of the finger; and a through-hole unit (123) that is at least partially provided within the range of the bezel unit in a plan view and includes a through-hole (123a) penetrating the substrate. The through-hole unit is in an electrically unconnected state with the bezel unit.
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