X-ray generation apparatus having voltage control device

Abstract

This X-ray generation apparatus comprises: an emitter device generating an electron beam, and having an upper surface, a lower surface and a side surface; an anode terminal which is formed on the upper surface of the emitter device, and which accelerates the electron beam by means of an anode voltage so as to generate X-rays; and an electron generator module including a cathode terminal formed on the lower surface of the emitter device. The electron generator module includes: an insulating film disposed on one side and the other side of the cathode terminal; protection terminals arranged on the upper end of the insulating film; a protection resistor having one end connected to the protection terminals; and a protection grid connected to the other end of the protection resistor.

Description

X-ray generator having a voltage control device

[0001] The present disclosure relates to an X-ray generator having a voltage control device. More specifically, it relates to an X-ray generator having a voltage control device that controls an adjustable grid voltage.

[0002] An X-ray generator consists of an X-ray tube (X-ray source) that generates X-rays. The X-ray tube generates X-rays by accelerating electrons emitted from a cathode within a vacuum tube and striking the accelerated electrons against an anode electrode. A field emission X-ray tube, which is a type of X-ray tube, includes a cathode electrode placed within a vacuum tube, an emitter which is an electron emission source installed on the cathode electrode, a gate electrode installed adjacent to the electron emission source, and an anode electrode.

[0003] A field emission X-ray tube is configured to emit electrons by an electric field formed between a gate electrode and an electron emission source. As an electron beam emitted from the electron emission source travels through the gate hole of the gate electrode, the electrons are accelerated by the electric field formed between the anode electrode and the cathode electrode. X-rays are emitted when the accelerated electron beam strikes an X-ray target installed on the anode side.

[0004] In this regard, U.S. Patent Publication US 7,809,114 B2 relates to an electron source for multiple spot X-rays. The basic configuration includes an emitter that emits electrons, a gate and an extraction electrode that control the amount of electron emission, a focusing electrode that collects the electron beam, and an anode electrode that generates X-rays by colliding with electrons having high energy.

[0005] When electrons with high energy collide with a high-voltage anode, (+) ion gas is generated at the anode. Due to the ion gas, the vacuum level drops locally and the electric field becomes uneven, causing arc signals, which are anode discharges, to occur. To prevent the generation of arc signals, a protective shield can be placed at the anode terminal to block ions generated at the anode electrode from moving toward the emitter.

[0006] However, anode discharge occurs due to various factors, such as not only (+) ion gas generated at the anode terminal but also local vacuum degradation at the emitter terminal. Furthermore, there is no way to fundamentally prevent gas generation at the anode terminal, nor is there a method to prevent damage to the emitter device and surrounding driving circuit devices in the event of a high-voltage arc.

[0007] The purpose of this specification is to provide an X-ray generator having a voltage control device that controls an adjustable grid voltage.

[0008] The purpose of this specification is to fundamentally prevent gas generation at the anode terminal and to prevent damage to the emitter device and surrounding driving circuit devices when a high-voltage arc occurs.

[0009] The purpose of this specification is to prevent the arc from being sustained more strongly by increasing electron generation as the voltage momentarily rises when an arc occurs at the gate terminal.

[0010] The purpose of this specification is to prevent damage to the gate terminal and insulating film or emitter device, and to the control device controlling the X-ray tube from the outside, due to arc generation and persistence.

[0011] An X-ray generator having a voltage control device according to the present specification comprises: an emitter device configured to generate an electron beam and having an upper surface, a lower surface, and a side surface; an anode terminal formed on the upper surface of the emitter device and configured to accelerate the electron beam by an anode voltage to generate X-rays; and an electron generator module comprising a cathode terminal formed on the lower surface of the emitter device. The electron generator module comprises an insulating film disposed on one side and the other side of the cathode terminal; protection terminals disposed on the top of the insulating film; a protection resistor having one end connected to the protection terminals; and a protection grid connected to the other end of the protection resistor.

[0012] According to an embodiment, the electronic generator module may further include an emitter terminal disposed at the center of the cathode terminal corresponding to the region between the insulating films; a gate line formed to be connected to one side of the protection grid and to have a gate voltage applied; and a cathode line connected to the cathode terminal. The protection resistor may include a first protection resistor connected to one side of the protection grid and a second protection resistor connected to the other side of the protection grid.

[0013] According to an embodiment, the X-ray generator may further include a focus electrode terminal formed in a cylindrical shape with a hole formed therein so as to protrude inward from one side and the other side of the emitter device, and configured to focus an electron beam from the anode terminal to the protection grid. The X-ray generator may further include a control device connected to the focus terminal and the anode terminal, configured to control the anode voltage so as to prevent the generation of arc signals from the anode terminal to the protection terminals.

[0014] According to an embodiment, the protection grid may be arranged parallel to the cathode terminal with a second length longer than the length between the ends of the protection terminals so as to prevent the arc signals from flowing into the protection terminals.

[0015] According to an embodiment, the first terminal and the second terminal of the control device can apply a first voltage and a second voltage to the focusing terminal and the anode terminal, respectively. The X-ray generator may further include a circuit module disposed between the control device and the electronic generator module and connected to the third terminal and the fourth terminal of the control device.

[0016] According to an embodiment, the circuit module may include a first resistor arranged to connect the gate line connected to the third terminal and one side of the protection grid; and a second resistor arranged to connect the cathode line connected to the fourth terminal and the cathode terminal.

[0017] According to an embodiment, the circuit module may further include a first overvoltage protection device, one end of which is connected to the first resistor and the gate line and the other end of which is connected to ground; and a second overvoltage protection device, one end of which is connected to the second resistor and the cathode line and the other end of which is connected to ground.

[0018] According to an embodiment, the first protection resistor and the second protection resistor can prevent signals exceeding a threshold voltage from being applied to the control device by the arc signals. The first overvoltage protection device and the second overvoltage protection device may be configured to absorb signals exceeding a threshold voltage caused by the arc signals.

[0019] According to an embodiment, the protective grid may be formed in a circular plate shape or a square plate shape. The protective grid may include a passage area formed with a first length to allow the electron beam to pass through; and a peripheral area formed with a second length greater than the first length to surround the passage area and formed of a metal material or graphene material to allow electrical signals to be transmitted.

[0020] According to an embodiment, the passage region may be formed as a grid region having metal mesh grids made of a metal material or graphene material to allow the electron beam to pass through. In the grid region, the spacing between adjacent grids may be formed to be less than a predetermined spacing to allow the electron beam to pass through.

[0021] According to an embodiment, the passing region may be formed into a hole structure to allow the electron beam to pass through.

[0022] According to an embodiment, the electron generator module may further include a metal structure formed at a first point on one side of the peripheral region and a second point on the other side; and an insulating film structure formed between the inner side of the metal structure and the outer side of the insulating film. A portion of the metal structure may correspond to the gate line.

[0023] According to an embodiment, the insulating film structure may be formed to a first height from the lower surface where the cathode terminal is positioned to the lower surface of the surrounding area so that ions generated at the anode terminal do not flow into the emitter terminal. The insulating film structure formed to the first height may be formed to surround the inner area of ​​the emitter device.

[0024] According to an embodiment, the first protective resistor may include a first portion of a bonding line formed at a third point on one side of the peripheral area; and a first portion of a resistive pad deposited with a resistive material having a predetermined resistance value, which is disposed on the upper part of the first protective terminal on one side of the emitter terminal and connected to the first portion of the bonding line. The second protective resistor may include a second portion of a bonding line formed at a fourth point on the other side of the peripheral area; and a second portion of a resistive pad deposited with a resistive material having a predetermined resistance value, which is disposed on the upper part of the second protective terminal on the other side of the emitter terminal and connected to the second portion of the bonding line.

[0025] According to an embodiment, the first protection resistor may include a first portion of a bonding line connected to a first protection terminal on one side of the emitter terminal; a first portion of a metal pad formed of a metal material connected to the first portion of the bonding line; and a first portion of a resistance pad deposited with a resistive material having a predetermined resistance value, disposed between the first portion of the metal pad and one side of the peripheral area. The second protection resistor may include a second portion of a bonding line connected to a second protection terminal on the other side of the emitter terminal; a second portion of a metal pad formed of a metal material connected to the second portion of the bonding line; and a second portion of a resistance pad deposited with a resistive material having a predetermined resistance value, disposed between the second portion of the metal pad and the other side of the peripheral area. The first portion of the resistance pad may be formed with a third length so as to be spaced apart from the gate line, and the second portion of the resistance pad may be formed with the third length. The first portion of the metal pad and the second portion of the metal pad can be formed with the third length.

[0026] According to an embodiment, the X-ray generator may further include a connection resistor disposed between the ends of the metal structure. The first protection resistor may include a first portion of a bonding line connected to a first protection terminal on one side of the emitter terminal; a first portion of a metal pad formed with a third length made of a metal material and connected to the first portion of the bonding line; and a first portion of an insulating layer disposed between the first portion of the metal pad and a side area of ​​the peripheral region. The second protection resistor may include a second portion of a bonding line connected to a second protection terminal on the other side of the emitter terminal; a second portion of a metal pad formed with a third length made of a metal material and connected to the second portion of the bonding line; and a second portion of an insulating layer disposed between the second portion of the metal pad and a side area of ​​the peripheral region. The first portion of the insulating layer may be formed with a fourth length longer than the third length so that the gate line can pass through. The second portion of the insulating layer may be formed with a fifth length that is longer than the third length and shorter than the fourth length.

[0027] According to an embodiment, the X-ray generator may further include a comparator in which one end and the other end of the first resistor are connected to a first input terminal and a second input terminal, and an output terminal is connected to the control device.

[0028] According to an embodiment, the control device may apply a first voltage to the gate line when the output signal output through the output terminal of the comparator is a low signal. The control device may prevent the occurrence of the arc signals by applying a second voltage lower than the first voltage to the gate line when the output signal output through the output terminal of the comparator due to the arc signals is a high signal.

[0029] The technical effects of an X-ray generator having a voltage control device according to the present specification can be summarized as follows, but are not limited thereto and may be modified depending on the application.

[0030] Existing devices are capable of reducing the number of arc signals generated. Therefore, they do not have the function to automatically stop the generation of arc signals when they occur, or to protect the control device from high voltage generated by the arc signals.

[0031] According to the present specification, by applying a voltage control device to an X-ray generator, the generation of arc signals can be prevented while reducing the number of arc signals generated.

[0032] According to the present specification, when arc signals occur, the factors causing the arc signals to occur can be automatically removed to stop the occurrence of arc signals.

[0033] According to the present specification, the high voltage and current caused by the arc signals are cut off at the moment the arc signals occur, thereby protecting both the emitter device that generates X-rays and the control device that drives the tube-structured X-ray generator.

[0034] FIG. 1 shows an X-ray generator having a voltage control device related to the present specification.

[0035] FIG. 2 shows the detailed structure of an X-ray generator having a voltage control device according to the present specification.

[0036] Figure 3 shows a structure in which the unit elements of the X-ray generator of Figure 2 are arranged on the XY plane.

[0037] Figure 4 shows the anode voltage, discharge current, and gate voltage when arc signals are generated in the device of Figure 2.

[0038] Figure 5 shows the anode voltage, discharge current, and gate voltage when arc signals are generated in the device of Figure 1.

[0039] FIG. 6 shows gate grids having a pass area and a peripheral area according to an embodiment.

[0040] Figure 7 shows an X-ray generator in which an insulating film structure is formed so that ions generated at the anode terminal do not flow into the emitter terminal.

[0041] An X-ray generator having protective resistance structures formed by combinations of bonding lines and resistance pads according to the embodiments of FIGS. 8 and 9 is shown.

[0042] FIG. 10 shows an X-ray generator having protective resistance structures formed of a bonding line, a metal pad, and an insulating layer.

[0043] Figure 11 shows an X-ray generator including a comparator connected to a control device.

[0044] It should be noted that technical terms used in this specification are used merely to describe specific embodiments and are not intended to limit the invention. Additionally, singular expressions used in this specification include plural expressions unless the context clearly indicates otherwise. The suffixes "module" and "part" for components used in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles.

[0045] In this specification, terms such as "composed of" or "comprising" should not be interpreted as necessarily including all of the various components or steps described in the specification, and should be interpreted as potentially excluding some of the components or steps, or including additional components or steps.

[0046] In addition, when describing the technology disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the technology disclosed in this specification, such detailed description is omitted.

[0047] In addition, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that they include all modifications, equivalents, and substitutions that fall within the concept and technical scope of the present invention. Furthermore, not only each of the embodiments described below, but also combinations of embodiments may fall within the concept and technical scope of the present invention as modifications, equivalents, and substitutions that fall within the concept and technical scope of the present invention.

[0048] Hereinafter, an X-ray generator having a voltage control device according to the present specification will be described. FIG. 1 shows an X-ray generator having a voltage control device related to the present specification.

[0049] Referring to FIG. 1, the X-ray generator (1000a) may be configured with a triode structure of an anode terminal (300), a cathode terminal (104), and a gate terminal (101). The anode terminal (300) may be configured to generate X-rays. An emitter device (100) that generates electrons may be placed at the cathode terminal (104). The gate terminal (101) may be configured to control the amount of electron generation. Arc signals may be generated at the anode terminal (300).

[0050] When voltage is applied to the gate terminal (101), an electron beam (a) is generated in the emitter device (100). The electron beam (a) is accelerated by an anode voltage (50kV to 200kV) to generate X-rays. (+) ions are also generated by the accelerated collision, and these (+) ions come down to the electrically (-) emitter device (100) to degrade the emitter terminal (102) or locally degrade the vacuum state.

[0051] For this reason, an arc is generated from the high-voltage anode terminal (300) to the gate terminal (101), and an arc is generated up to the cathode terminal (104) when the device is destroyed. When an arc is generated at the gate terminal (101), the arc is sustained more strongly by positive feedback, which increases electron generation as the voltage rises instantaneously.

[0052] Accordingly, the insulating film (105) of the gate terminal (101) or the emitter device (100) may be directly damaged, and the control device (400) that controls the X-ray tube from the outside may also be damaged. The device according to the present specification is intended to solve the problem of the insulating film (105) of the gate terminal (101) or the emitter device (100) being directly damaged, and the control device (400) that controls the X-tube from the outside being damaged.

[0053] Accordingly, the purpose of this specification is to provide an X-ray generator having a voltage control device that controls an adjustable grid voltage. The purpose of this specification is to fundamentally prevent gas generation at the anode terminal and to prevent damage to the emitter device and surrounding driving circuit devices in the event of a high-voltage arc. The purpose of this specification is to prevent the arc from being sustained more strongly by increasing electron generation as the voltage momentarily rises when an arc occurs at the gate terminal. The purpose of this specification is to prevent damage to the gate terminal, insulating film, or emitter device, as well as damage to the control device that controls the X-ray tube from the outside, due to the generation and sustainment of the arc.

[0054] An X-ray generator having a voltage control device according to the present specification for achieving the aforementioned objectives will be described with reference to the drawings. In this regard, FIG. 2 shows the detailed structure of an X-ray generator having a voltage control device according to the present specification. With reference to FIG. 2, an X-ray generator having a voltage control device will be described.

[0055] An X-ray generator (1000) capable of protecting the emitter device (100) and the control device (400) from arc signals generated at a high-voltage anode terminal (300) is illustrated in FIG. 2. The present disclosure relates to an X-ray generator (100) having three terminals (anode terminal (300), cathode terminal (104), and gate terminal (101)). The X-ray generator (1000) includes an anode terminal (300) that generates X-rays and an emitter device (100) that generates an electron beam (aN). The emitter device (100) is positioned at the cathode terminal (104). The gate terminal (101) turns the electron beam on / off and controls the amount thereof. The gate terminal (101) may be included in the emitter device (100) or may be configured separately. Additionally, the X-ray generator (100) is composed of a focusing terminal (200) that focuses an electron beam to an anode terminal (300) and a control device (400) that controls voltage / current.

[0056] The X-ray generator (1000) is a device for protecting an emitter device (100) that generates electrons and a control device (400) connected to the X-ray generator (1000) that controls voltage from an anode arc signal generated during operation. The X-ray generator (1000) includes a protection resistor (520) and a gate grid (510) that protect the emitter device (100) which is electrically connected to the gate terminals (101).

[0057] The X-ray generator (1000) according to the present specification may be formed with a triode structure of an emitter, an anode, and a gate. However, the X-ray generator (1000) according to the present specification is not necessarily limited to a triode structure. Accordingly, the gate grid (510) of the X-ray generator (1000) according to the present specification may be referred to as a protection grid. Additionally, the gate terminals (101) of the X-ray generator (1000) according to the present specification may be referred to as protection terminals.

[0058] The gate grid (510), formed as a protection grid, can be positioned to cover the entire front surface of the emitter device (100). The gate grid (510) is electrically connected to a first overvoltage protection device (601), which is an overvoltage protection device, via a gate line (103). Additionally, the gate grid (510) is connected to the control device (400) through a first resistor (602) that protects the control device (400). The first resistor (601), which is an overvoltage protection device, serves to prevent the voltage of the gate grid (510) from rising above a specific voltage.

[0059] When an appropriate voltage is applied from the control device (400) to the gate terminal (101), an electron beam (aN) is generated in the emitter device (100). The electron beam (aN) is accelerated by the anode (300) voltage (50kV to 200kV) and collides to generate X-rays with that energy. At this time, additional (+) ions are also generated. The additionally generated (+) ions flow into the emitter device (100), which is electrically (-). Therefore, the additionally generated (+) ions degrade the emitter terminal (102) or locally degrade the vacuum level. Due to the degraded vacuum level, arcs may occur from the high-voltage anode terminal (300) to the gate terminal (101) and the cathode terminal (104).

[0060] For the reasons mentioned above, when an arc signal (bN) occurs, the arc current flows toward the gate grid (510) covering the front of the emitter device (100) and raises the gate grid voltage. Due to the protection resistor (520) protecting the emitter, the arc current is delayed or blocked from flowing to the gate terminal (101) and exits through the gate line (103). The exiting current raises the voltage of the front end due to the first resistor (602) protecting the control device (400) and is allowed to exit through the first resistor (601), which is an overvoltage protection device. As a result, the emitter device (100) and the control device (400) are protected from arc signals.

[0061] Meanwhile, the gate grid (510) voltage rises due to the arc signals. Because of this increased voltage, a significant amount of the current (aN) flowing to the anode flows into the gate grid (510), causing negative feedback that reduces the anode current (aN). As the anode current decreases, the (+) ions generated on the anode side also decrease, causing the arcs to disappear.

[0062] Additionally, in case the device is destroyed and high voltage may be applied to the cathode terminal with arcs, a second overvoltage protection device (603), which is an overvoltage protection device, and a second resistor (604) that protects the control device (400) may be placed between the cathode line (103b) and the control device (400).

[0063] As shown in FIG. 2, Zener diodes or TVS (Transient Voltage Suppressor) diodes may be used as the first and second overvoltage protection devices (601, 603), but are not limited thereto. For example, any device capable of sufficiently absorbing current above a certain voltage, such as a shunt regulator, may be included.

[0064] As described above, the X-ray generator (1000) may be configured to include an emitter device (100), an anode terminal (300), and an electron generator module (500). An anode terminal (300) may be formed on the upper surface of the emitter device (100). The anode terminal (300) may be configured to generate X-rays by accelerating an electron beam by an anode voltage. The electron generator module (500) may include a cathode terminal (104) formed on the lower surface of the emitter device (100).

[0065] The electron generator module (500) may be implemented as a semiconductor device, but is not limited thereto. The electron generator module (500) can be applied to all X-ray generators using three-terminal devices, such as nanotubes, as well as semiconductor devices. The electron generator module (500) may include an insulating film (105), gate terminals (101), a protection resistor (520), and a gate grid (510). An insulating film (105) may be disposed on one side and the other side of the cathode terminal (104). An insulating film (105) may be formed to surround the emitter terminal (102).

[0066] Gate terminals (101) may be disposed on the top of the insulating film (105). One end of the protection resistor (520) may be connected to the gate terminals (101). The other end of the protection resistor (520) may be connected to the gate grid (510). The other end of the protection resistor (520) may be connected to a first point and a second point of the gate grid (510).

[0067] In this regard, the structure of FIG. 2 may be a cross-sectional view in the XZ plane. Meanwhile, FIG. 3 shows a structure in which the unit elements of the X-ray generator of FIG. 2 are arranged in the XY plane. The unit elements and array structure of the X-ray generator will be described with reference to FIG. 2 and FIG. 3.

[0068] The X-ray generator (1000) may be configured to include a plurality of electron generator modules (500). The plurality of electron generator modules (500) may be formed by M electron generator modules spaced apart on the X-axis. The plurality of electron generator modules (500) may be formed by N electron generator modules spaced apart on the Y-axis. The plurality of electron generator modules (500) may be implemented as an M x N array structure on the XY plane.

[0069] The emitter terminal (102) may be formed in a circular or elliptical shape. The gate terminals (101) may be formed to surround the emitter terminal (102). The gate terminals (101) may be formed in a circular or elliptical ring shape. The gate terminals (101) may be provided in multiple numbers on a two-dimensional plane.

[0070] The gate terminals (101) can be implemented as M terminals spaced apart on the X-axis. The gate terminals (101) can be implemented as N terminals spaced apart on the Y-axis. The gate terminals (101) can be implemented as an M x N array structure on the XY plane. The emitter terminal (102) disposed inside the gate terminals (101) can be implemented as an M x N array structure on the XY plane.

[0071] Meanwhile, the gate grid (510) may be formed in a circular shape as shown in FIG. 6, but is not limited thereto. The gate grid (510) may also be formed in an elliptical structure. The gate grid (510) may be provided in multiple numbers on a two-dimensional plane. The gate grid (510) may be implemented as an M x N array structure on an XY plane.

[0072] Meanwhile, the electronic generator module (500) may further include an emitter terminal (102), a gate line (103a), and a cathode line (103b). The emitter terminal (102) may be positioned at the center of the cathode terminal (104) corresponding to the area between the insulating films (105). The gate line (103a) may be formed to be connected to one side of the gate grid (510) and to have a gate voltage applied. The cathode line (103b) may be connected to the cathode terminal (104).

[0073] The protection resistor (520) may be composed of a plurality of elements. The protection resistor (520) may be configured to include a first protection resistor (521) and a second protection resistor (522). The second protection resistor (522) may be connected to the other side of the gate grid (510).

[0074] The X-ray generator (1000) may be configured to include a plurality of focus electrode terminals and a control device (400). Unlike the plurality of electron generator modules (500), the control device (400) and the circuit module (600) may each be implemented as a single device and module. The control device (400) and the circuit module (600) can control each of the plurality of electron generator modules (500) in common by applying the same input / voltage to each of the plurality of electron generator modules (500).

[0075] Meanwhile, the X-ray generator (1000) may be configured to further include a focusing terminal (200) and a control device (400).

[0076] A focusing terminal (200) may be formed to protrude inward from one side and the other side of the emitter device (100). The focusing terminal (200) may be formed in a cylindrical shape with a hole formed inside. The focusing terminal (200) may be configured so that the electron beam is focused from the anode terminal (300) to the gate grid (510). The diameter of the hole inside the focusing terminal (200) may be formed larger than the diameter of the anode terminal (300). The diameter of the hole inside the focusing terminal (200) may be formed larger than the diameter of the gate grid (510). Two or more focusing terminals (200) may be spaced apart in the height direction so that the electron beam is further focused to the gate grid (510).

[0077] The control device (400) can be connected to the collecting terminal (200) and the anode terminal (300). The control device (400) can be configured to control the anode voltage so as to prevent the generation of arc signals from the anode terminal (300) to the gate terminals (101).

[0078] The gate grid (510) is connected to the gate terminal (101) via the gate line (103a) and uses the same power. Additionally, the gate grid (510) is connected to the gate terminal (101) via the control device (400) and uses the same power, and can be controlled via the same control device (400). Furthermore, the gate grid (510) is connected to the gate terminal (101) via a protection resistor (520). Thus, the gate grid (510) may be configured to be included in the gate terminal (101).

[0079] The gate grid (510) may be formed with a second length longer than the length between the ends of the gate terminals (101) so as to prevent arc signals from flowing into the gate terminals (101). The gate grid (510) may be arranged parallel to the gate terminal (101) and the cathode terminal (104).

[0080] Meanwhile, if an arc occurs at the anode terminal (300), the voltage of the gate terminals (101) may momentarily rise, allowing the arc to be transmitted. However, the protection resistor (520) can be configured so that the voltage is not momentarily transmitted to the gate terminals (101). Accordingly, even if arcs occur from the anode terminal (300) to the gate grid (510), the arc is not transmitted to the gate terminals (101).

[0081] Accordingly, the emitter device (100) is protected, and the voltage rise of the gate terminals (101) and the gate grid (510) caused by arcs can be reduced by absorbing electrons, which are the source of the arcs. Therefore, the protection resistor (520) is a key component that generates negative feedback by causing the voltages of the gate terminals (101) and the gate grid (510) to be separated at the moment of arc generation.

[0082] The first terminal and the second terminal of the control device (400) may be configured to apply a first voltage and a second voltage to the focusing terminal (200) and the anode terminal (300), respectively. The X-ray generator (1000) may further include a circuit module (600) disposed between the control device (400) and the electronic generator module (500). The circuit module (600) may be connected to the third terminal and the fourth terminal of the control device (400).

[0083] The circuit module (600) may be configured to include a plurality of elements. The circuit module (600) may be configured to include a first resistor (602) and a second resistor (604). The circuit module (600) may be configured to include a first overvoltage protection device (601) and a second overvoltage protection device (603). The first overvoltage protection device (601) and the second overvoltage protection device (603) may each be implemented as a first and a second Zener diode.

[0084] A first resistor (602) may be positioned to connect the third terminal of the control device (400) to the gate line (103a). The gate line (103a) may be connected to one side of the gate grid (510). A second resistor (604) may be positioned to connect the fourth terminal of the control device (400) to the cathode line (103b). The cathode line (103b) may be connected to the cathode terminal (104).

[0085] One end of the first overvoltage protection device (601) and one end of the second overvoltage protection device (603) may be connected to other components. The other end of the first overvoltage protection device (601) and the other end of the second overvoltage protection device (603) may be connected to ground. The first overvoltage protection device (601) may be arranged so that one end is connected to the first resistor (601) and the gate line (103a) and the other end is connected to ground. The second overvoltage protection device (603) may be arranged so that one end is connected to the second resistor (602) and the cathode line (103b) and the other end is connected to ground.

[0086] The first protection resistor (521) and the second protection resistor (522) can prevent signals above a threshold voltage from being applied to the control device (400) by arc signals. The first overvoltage protection device (601) and the second overvoltage protection device (603) can be configured to absorb signals above a threshold voltage caused by arc signals.

[0087] Figure 4 shows the anode voltage, emission current, and gate voltage when arc signals are generated in the device of Figure 2. Figure 5 shows the anode voltage, emission current, and gate voltage when arc signals are generated in the device of Figure 1.

[0088] FIG. 4(a) shows the measured value of the anode voltage at a high voltage (approx. 110 kV) measured at the anode terminal (300) of FIG. 2 according to the generation (α) and extinction (β) of the arc signal. FIG. 4(b) shows the measured value of the emission current of the electron beam of FIG. 2 according to the generation and extinction of the arc signal. As the arc signal is generated, the first electron beam (α-2) decreases below a reference value. As the arc signal is extinct, the second electron beam (β-2) increases above a reference value. The second electron beam (β-2) is the value recovered to the normal electron beam value prior to the generation of the arc signal.

[0089] FIG. 4(c) shows the measured values ​​of gate voltage and gate current measured at the gate terminal (101) of FIG. 2 according to the generation and extinction of an arc signal. As the arc signal is generated, a first gate current (α-1) is formed that increases above a reference value. As the arc signal is extinguished, a second gate current (β-1) is formed that decreases below a reference value. The second gate current (β-1) is a value that has recovered to the normal current value prior to the generation of the arc signal.

[0090] Referring to FIGS. 2, FIGS. 4(b) and FIGS. 4(c), an arc signal is generated at the anode terminal (300). Due to the arc signal, the electron beam is not formed at the anode terminal (300) but is formed at the gate grid (510), increasing the current at the gate terminal (101). When the emission current of the electron beam decreases, the arc signal is extinguished, and it can be confirmed that the current at the electron beam and the gate terminal (101) is restored to a normal level.

[0091] Referring to FIGS. 1 and FIGS. 5(a), an arc signal (α) is generated, which can reduce the anode voltage to a high voltage (approx. 110 kV). Referring to FIGS. 1 and FIGS. 5(b), the emitter device is damaged by the arc signal, and the electron beam is no longer generated. Referring to FIGS. 1 and FIGS. 5(c), gate leakage occurs due to a gate short circuit caused by the arc signal. Additionally, gate current may continue to be generated without the gate leakage being recovered.

[0092] Meanwhile, the gate grid of the X-ray generator (1000) according to the present disclosure may be divided into a plurality of regions depending on whether electrons pass through. In this regard, FIG. 6 shows gate grids having a passing region and a peripheral region according to an embodiment.

[0093] Referring to FIG. 6(a), the gate grid (510) may include a grid region (511a) and a surrounding region (512). Referring to FIG. 6(b), the gate grid (510) may include a hole region (511b) and a surrounding region (512).

[0094] FIG. 6 illustrates embodiments of one form of the gate grid (510) of FIG. 2. The gate grid (510) can be formed to a size that can cover the entire emitter device (100). The gate grid (510) consists of a grid region (511a) through which electrons pass and a peripheral region (512) through which electrical signals can be connected. The shape of the grid region (511a) through which electrons pass can be formed in various shapes, including a square shape as shown in the example, as well as a rectangle, a circle, etc.

[0095] Additionally, the pass-through region (511) of the gate grid (510) can be formed in the form of a hole without a grid structure, such as the hole region (511b). Also, the constituent material of the gate grid (510) is not limited to a metal material. The gate grid (510) can be comprehensively applied to materials such as (e.g., graphene) that can block (+) ions while allowing electrons to pass through.

[0096] Referring to FIGS. 2, FIGS. 6(a) and FIGS. 6(b), the grid region (511a) and hole region (511b) of the gate grid (510) can form a pass region (511). Accordingly, the gate grid (510) can be configured to include a pass region (511) and a peripheral region (512).

[0097] Referring to FIGS. 2 and FIGS. 6, the gate grid (510) may be formed in a circular plate shape or a square plate shape. The gate grid (510) may be configured to include a pass-through area (511) and a peripheral area (512).

[0098] The pass-through region (511) may be formed with a first length (L1) to allow the electron beam to pass through. The surrounding region (512) may be formed with a second length (L2) greater than the first length (L1) to surround the pass-through region (511). The surrounding region (512) may be formed of a metal material or a graphene material to allow electrical signals to be transmitted.

[0099] The passage area (511) may be formed as a grid area (511a) equipped with metal mesh grids made of metal or graphene material to allow the electron beam to pass through. In the grid area (511a), the spacing between adjacent grids may be formed to be less than a predetermined spacing to allow the electron beam to pass through. Meanwhile, the passage area (511) may be formed as a hole structure (511b) to allow the electron beam to pass through.

[0100] Meanwhile, the X-ray generator (1000) according to the present disclosure may have an insulating film structure formed so that ions generated at the anode terminal do not flow into the emitter terminal. In this regard, FIG. 7 shows an X-ray generator in which an insulating film structure is formed so that ions generated at the anode terminal do not flow into the emitter terminal.

[0101] FIG. 7 is a structure that prevents ions generated at the anode terminal (300) from flowing into the emitter terminal (102) as another embodiment of FIG. 2. An insulating film (700) that completely surrounds the emitter device (100) can be placed around the gate grid (510).

[0102] Referring to FIGS. 6 and 7, the electron generator module (500) may further include a metal structure (103) and an insulating film structure (700). A metal structure (103) may be formed at a first point on one side and a second point on the other side of the peripheral region (512) of the gate grid (510). An insulating film structure (700) may be formed between the inner side of the metal structure (103) and the outer side of the insulating film (105). A portion of the metal structure (103) may correspond to a gate line (103a).

[0103] The insulating film structure (700) can be formed to a first height (h1) from the lower surface where the cathode terminal (104) is positioned to the lower surface of the surrounding area (512) so that ions generated from the anode terminal (300) do not flow into the emitter terminal (102). The insulating film structure (700) formed to the first height (h1) can be formed to surround the inner area of ​​the emitter device (100).

[0104] Meanwhile, the protective resistor of the X-ray generator (1000) according to the present disclosure may be formed in various structures. In this regard, an X-ray generator having protective resistor structures formed by combinations of bonding lines and resistance pads according to the embodiments of FIGS. 8 and 9 is shown.

[0105] Referring to FIGS. 2 and FIGS. 8, the lines connecting the gate grid (510) and the first and second gate terminals (101a, 101b) may be made of a material having appropriate resistance and may have appropriately adjusted shapes. For example, the protection resistor (520) may be formed to have a line having appropriate resistance and a predetermined length.

[0106] FIG. 8 is an example of forming a resistive element of the protective resistor (520) of FIG. 2. Referring to FIG. 2 and FIG. 8, one or more resistive pads (521b, 522b) may be formed on the upper portions of the first and second gate terminals (101a, 101b) of the emitter device (100). One or more resistive pads (521b, 522b) may be formed by depositing or bonding a resistive material. One or more resistive pads (521b, 522b) may be deposited or bonded through a high-resistance poly silicon, a-silicon, or silicon layer. One or more resistive pads (521b, 522b) may be electrically connected to the gate grid (510) through one or more bonding lines (521a, 522a).

[0107] Referring to FIGS. 2, 6 and 8, the first protective resistor (521) may be configured to include a first portion (521a) of a bonding line and a first portion (521b) of a resistance pad. The second protective resistor (522) may be configured to include a second portion (522a) of a bonding line and a second portion (522b) of a resistance pad. The first and second portions (521a, 522a) of the bonding line may correspond to the first and second portions of a cylinder having a hole formed inside. The first and second portions (521b, 522b) of the resistance pad may correspond to the first and second portions of a cylinder having a hole formed inside.

[0108] A first portion (521a) of the bonding line may be formed at a third point on one side of the surrounding area (512). A first portion (521b) of the resistance pad may be placed on the upper part of the first gate terminal (101a) on one side of the emitter terminal (102). The first portion (521b) of the resistance pad may be connected to the first portion (521a) of the bonding line and may be deposited with a resistive material having a predetermined resistance value.

[0109] A second portion (522a) of the bonding line may be formed at a fourth point on the other side of the surrounding area (512). A second portion (522b) of the resistance pad may be placed on the upper part of the second gate terminal (101b) on the other side of the emitter terminal (102). The second portion (522b) of the resistance pad may be connected to the second portion (522a) of the bonding line and may be deposited with a resistive material having a predetermined resistance value.

[0110] FIG. 9 is another example of forming a protective resistor (520) in the X-ray generator (1000) of FIG. 2. Referring to FIG. 2 and FIG. 9, first and second portions (521b, 522b) of the resistor pads may be disposed as a sheet layer having resistance on the lower part of the gate grid (510).

[0111] Referring to FIGS. 2, 6 and 9, the first protective resistor (521) may be configured to include a first portion (521a) of a bonding line, a first portion (521c) of a metal pad, and a first portion (521b) of a resistance pad. The second protective resistor (522) may be configured to include a second portion (522a) of a bonding line, a second portion (522c) of a metal pad, and a second portion (522b) of a resistance pad.

[0112] A first gate terminal (101a) on one side of an emitter terminal (102) and a first portion (521a) of a bonding line may be connected. A first portion (521c) of a metal pad formed of a metal material may be connected to the first portion (521a) of the bonding line. A first portion (521b) of a resistance pad may be disposed between the first portion (521c) of the metal pad and one side of the peripheral region (512). The first portion (521b) of the resistance pad may be deposited with a resistive material having a predetermined resistance value.

[0113] The second gate terminal (101b) on the other side of the emitter terminal (102) and the first part (522a) of the bonding line may be connected. The second part (522c) of the metal pad formed of a metal material may be connected to the second part (522a) of the bonding line. The second part (522b) of the resistance pad may be disposed between the second part (522c) of the metal pad and the other side of the surrounding area (512). The second part (522b) of the resistance pad may be deposited with a resistive material having a predetermined resistance value. The first and second parts (521c, 522c) of the metal pad may correspond to the first and second parts of a cylinder having a hole formed inside.

[0114] The first portion (521b) of the resistance pad may be formed with a third length so as to be spaced apart from the gate line (103a). The second portion (522b) of the resistance pad may be formed with the same third length as the first portion (521b) of the resistance pad. The first portion (521c) of the metal pad and the second portion (522c) of the metal pad may each be formed with the same length as the first portion (521b) of the resistance pad and the second portion (522b) of the resistance pad. The first portion (521c) of the metal pad and the second portion (522c) of the metal pad may be formed with the same third length as the first portion (521b) of the resistance pad and the second portion (522b) of the resistance pad.

[0115] Meanwhile, FIG. 10 shows an X-ray generator having protective resistor structures formed of a bonding line, a metal pad, and an insulating layer. FIG. 10 is an example of forming a protective resistor (520) in the X-ray generator (1000) of group 2. Referring to FIG. 2 and FIG. 10, the X-ray generator (1000) may be configured to insulate the gate grid (510) and the first and second gate terminals (101a, 101b) by the first and second parts (521d, 522d) of the insulation layer.

[0116] The terminals of the first connection line and the second connection line (103c) of the gate line (103a) can be formed to be exposed to the outside of the tube structure of the X-ray generator (1000). The terminals of the first connection line and the second connection line (103c) can be connected through a connection resistor (520c). A structure having a connection resistor (520c) formed outside the tube structure has the advantage of being easy to manufacture because the connection resistor (520c) can be connected regardless of the manufacturing process of the tube structure.

[0117] Referring to FIG. 2 and FIG. 10, the X-ray generator (1000) may further include a connecting resistor (520c) disposed between the ends of the metal structure (103).

[0118] Meanwhile, the first protection resistor (521) may be configured to include a first part (521a) of the bonding line, a first part (521c) of the metal pad, and a first part (521d) of the insulating layer. The second protection resistor (522) may be configured to include a second part (522a) of the bonding line, a second part (522c) of the metal pad, and a second part (522d) of the insulating layer. The first and second parts (521d, 522d) of the insulating layer may correspond to the first and second parts of a cylinder having a hole formed inside.

[0119] A first gate terminal (101a) on one side of the emitter terminal (102) and a first portion (521a) of the bonding line may be connected. A first portion (521c) of the metal pad may be connected to the first portion (521a) of the bonding line. The first portion (521c) of the metal pad may be formed with a third length of metal material. A first portion (521d) of the insulating layer may be disposed between the first portion (521c) of the metal pad and one side of the surrounding area (512).

[0120] The second gate terminal (101b) on the other side of the emitter terminal (102) and the second part (522a) of the bonding line may be connected. The second part (522c) of the metal pad may be connected to the second part (522a) of the bonding line. The second part (522c) of the metal pad may be formed with a third length of metal material. A second part (522d) of the insulating layer may be disposed between the second part (522c) of the metal pad and the other side of the surrounding area (512).

[0121] The first portion (521d) of the insulating layer may be formed with a fourth length longer than the third length to allow the gate line (103a) to pass through. The second portion (522d) of the insulating layer may be formed with a fifth length longer than the third length and shorter than the fourth length of the first portion (521d) of the insulating layer. The gate line (103a) may be composed of a first connection line connected to the first terminal of the connection resistor (520c). The metal structure (103) may include a second connection line (103c) connected to the gate line (103a) and the second terminal of the connection resistor (520c).

[0122] The second connecting line (103c) can be connected to a point adjacent to the end of the second part (522d) of the insulating layer without passing through the second part (522d) of the insulating layer. Accordingly, the second part (522d) of the insulating layer can be formed with a fifth length that is longer than the third length and shorter than the fourth length of the first part (521d) of the insulating layer.

[0123] Meanwhile, the X-ray generator (1000) according to the present disclosure may be configured to further include a comparator connected to a control device. In this regard, FIG. 11 shows an X-ray generator including a comparator connected to a control device. FIG. 11 is a structure in which the control device (400) of the X-ray generator (1000) of FIG. 2 is implemented as a control device (400a) connected to a comparator (401a).

[0124] Referring to FIG. 11, a structure for preventing arc signals is additionally formed in the control device (400a). When the emitter device (100) operates by applying voltage to the first and second gate terminals (101a, 101b) in a normal state, the current flowing through the first resistor (602) protecting the control device (400a) is formed in the A => B direction. Accordingly, due to the current formed in the A => B direction, the A voltage of node A appears higher than the B voltage of node B. As a result, the comparator (401a) outputs a low signal.

[0125] However, when arc signals occur, the voltage of the gate grid (510) rises due to the arc signals, causing the B voltage to become higher than the A voltage. Accordingly, the comparator (401a) outputs a high signal, so that the timing of the occurrence of arc signals can be detected. Therefore, when arc signals are detected and the comparator (401a) outputs a high signal, the control device (400a) includes a device that appropriately lowers the voltage of the first and second gate terminals (101a, 101b), thereby stopping the occurrence of arc signals.

[0126] Referring to FIGS. 2, 6 through 11, the comparator (401a) may be configured such that one end and the other end of the first resistor (602) are connected to the first input terminal (402a) and the second input terminal (402b). The comparator (401a) may be configured such that its output terminal is connected to the control device (400a).

[0127] The control device (400a) can apply a first voltage to the gate line (103a) if the output signal output through the output terminal of the comparator (401a) is a low signal. If the output signal output through the output terminal of the comparator (401a) due to arc signals is a high signal, the control device (400a) can apply a second voltage. If the output signal is a high signal, the control device (400a) can prevent the occurrence of arc signals by applying a second voltage lower than the first voltage to the gate line (103a).

[0128] The above describes an X-ray generator having a voltage control device according to the present specification. The technical effects of the X-ray generator having a voltage control device according to the present specification can be summarized as follows, but are not limited thereto and may be modified depending on the application.

[0129] Existing devices are capable of reducing the number of arc signals generated. Therefore, they do not have the function to automatically stop the generation of arc signals when they occur, or to protect the control device from high voltage generated by the arc signals.

[0130] According to the present specification, by applying a voltage control device to an X-ray generator, the generation of arc signals can be prevented while reducing the number of arc signals generated.

[0131] According to the present specification, when arc signals occur, the factors causing the arc signals to occur can be automatically removed to stop the occurrence of arc signals.

[0132] According to the present specification, the high voltage and current caused by the arc signals are cut off at the moment the arc signals occur, thereby protecting both the emitter device that generates X-rays and the control device that drives the tube-structured X-ray generator.

[0133] The above-described disclosure can be implemented as computer-readable code on a medium on which a program is recorded. A computer-readable medium includes all types of recording devices in which data that can be read by a computer system is stored. Examples of computer-readable media include HDD (Hard Disk Drive), SSD (Solid State Disk), SSD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc., and also include implementation in the form of a carrier wave (e.g., transmission over the Internet).

[0134] Accordingly, the above detailed description should not be interpreted restrictively in all respects but should be considered exemplary. The scope of the invention shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the invention are included within the scope of the invention.

Claims

1. In an X-ray generator having a voltage control device, An emitter device configured to generate an electron beam and having an upper surface, a lower surface, and a side surface; An anode terminal formed on the upper surface of the emitter device and configured to accelerate the electron beam by an anode voltage to generate X-rays; and The electronic generator module includes a cathode terminal formed on the lower surface of the emitter device, and The above electronic generator module is, Insulating films disposed on one side and the other side of the above cathode terminal; Protection terminals positioned on the top of the insulating film; A protection resistor having one end connected to the above protection terminals; and X-ray generator comprising a protective grid connected to the other end of the above-mentioned protective resistor.

2. In Paragraph 1, The above electronic generator module is, An emitter terminal disposed at the center of the cathode terminal corresponding to the region between the insulating films; A gate line connected to one side of the above protection grid and formed to apply a gate voltage; and It further includes a cathode line connected to the above cathode terminal, and X-ray generator, wherein the above protection resistor includes a first protection resistor connected to one side of the protection grid and a second protection resistor connected to the other side of the protection grid.

3. In Paragraph 2, A focus terminal formed in a cylindrical shape with an internal hole protruding inward from one side and the other side of the emitter device, configured to focus an electron beam from the anode terminal to the protection grid; and An X-ray generator further comprising a control device connected to the focusing terminal and the anode terminal, configured to control the anode voltage so as to prevent the generation of arc signals from the anode terminal to the protection terminals.

4. In Paragraph 3, X-ray generator, wherein the above-mentioned protection grid is arranged parallel to the cathode terminal with a second length longer than the length between the ends of the protection terminals so as to prevent the arc signals from flowing into the protection terminals.

5. In Paragraph 3, The first terminal and the second terminal of the above control device each apply a first voltage and a second voltage to the collecting terminal and the anode terminal, respectively, and It further includes a circuit module disposed between the control device and the electronic generator module and connected to the third and fourth terminals of the control device, The above circuit module is, A first resistor arranged to connect the gate line connected to the third terminal and one side of the protection grid; and An X-ray generator comprising a second resistor arranged to connect the cathode line connected to the fourth terminal and the cathode terminal.

6. In Paragraph 5, The above circuit module is, A first overvoltage protection device having one end connected to the first resistor and the gate line and the other end connected to ground; and An X-ray generator further comprising a second overvoltage protection device, one end of which is connected to the second resistor and the cathode line and the other end of which is connected to the ground.

7. In Paragraph 6, The first protection resistor and the second protection resistor prevent signals exceeding a threshold voltage from being applied to the control device by the arc signals, and An X-ray generator, wherein the first overvoltage protection device and the second overvoltage protection device are configured to absorb signals exceeding a threshold voltage caused by the arc signals.

8. In Paragraph 6, The above protective grid is formed in a circular plate shape or a square plate shape, and The above protection grid is, A passage region formed with a first length to allow the electron beam to pass through; and An X-ray generator comprising a second length greater than the first length formed to surround the above-mentioned passage area, and a surrounding area formed of a metal material or graphene material to transmit electrical signals.

9. In Paragraph 8, The above passage area is It is formed into a grid region having metal mesh grids of a metal material or graphene material to allow the electron beam to pass through, and An X-ray generating device in which the spacing between adjacent grids in the above grid region is formed to be less than a predetermined spacing so that the electron beam can pass through.

10. In Paragraph 8, X-ray generator, wherein the above-mentioned passage region is formed as a hole structure to allow the electron beam to pass through.

11. In Paragraph 8, The above electronic generator module is, A metal structure formed at a first point on one side of the above-mentioned peripheral area and a second point on the other side; and It further includes an insulating film structure formed between the inner side of the metal structure and the outer side of the insulating film, and Some of the above metal structures correspond to the gate line, X-ray generator.

12. In Paragraph 11, The insulating film structure is formed to a first height from the lower surface where the cathode terminal is positioned to the lower surface of the surrounding area so as not to allow ions generated at the anode terminal to flow into the emitter terminal, and An X-ray generator, wherein the insulating film structure formed at the first height is formed to surround the inner region of the emitter device.

13. In Paragraph 11, The above first protection resistor is, A first portion of a bonding line formed at a third point on one side of the aforementioned surrounding area; and It comprises a first portion of a resistive pad disposed on the upper part of a first protective terminal on one side of the emitter terminal, connected to a first portion of the bonding line, and deposited with a resistive material having a predetermined resistance value. The above second protection resistor is, A second portion of a bonding line formed at a fourth point on the other side of the aforementioned surrounding area; and An X-ray generator comprising a second portion of a resistive pad deposited with a resistive material having a predetermined resistance value, which is disposed on the upper part of a second protective terminal on the other side of the emitter terminal and connected to a second portion of the bonding line.

14. In Paragraph 11, The above first protection resistor is, A first portion of a bonding line connected to a first protection terminal on one side of the emitter terminal; A first portion of a metal pad formed of a metal material and connected to the first portion of the bonding line above; and It includes a first portion of a resistive pad disposed between a first portion of the metal pad and one side portion of the peripheral region and deposited with a resistive material having a predetermined resistance value, The above second protection resistor is, A second portion of a bonding line connected to a second protection terminal on the other side of the above emitter terminal; A second part of a metal pad formed of a metal material and connected to the second part of the bonding line above; and An X-ray generator comprising a second portion of a resistive pad disposed between a second portion of the metal pad and another portion of the surrounding area, and a second portion of a resistive pad deposited with a resistive material having a predetermined resistance value.

15. In Paragraph 14, The first portion of the resistance pad is formed with a third length so as to be spaced apart from the gate line, and the second portion of the resistance pad is formed with the third length, X-ray generator, wherein the first portion of the metal pad and the second portion of the metal pad are formed to the third length.

16. In Paragraph 11, X-ray generator further comprising a connecting resistor disposed between the ends of the metal structure.

17. In Paragraph 16, The above first protection resistor is, A first portion of a bonding line connected to a first protection terminal on one side of the emitter terminal; A first portion of a metal pad formed with a third length of a metal material and connected to the first portion of the bonding line above; and It includes a first portion of an insulating layer disposed between a first portion of the metal pad and one side portion of the surrounding area, and The above second protection resistor is, A second portion of a bonding line connected to a second protection terminal on the other side of the above emitter terminal; A second portion of a metal pad formed with a third length of a metal material and connected to the second portion of the bonding line above; and X-ray generator comprising a second portion of an insulating layer disposed between a second portion of the metal pad and another portion of the surrounding area.

18. In Paragraph 17, An X-ray generator, wherein the first portion of the insulating layer is formed with a fourth length longer than the third length so that the gate line passes through, and the second portion of the insulating layer is formed with a fifth length longer than the third length and shorter than the fourth length.

19. In Paragraph 11, An X-ray generator further comprising a comparator in which one end and the other end of the first resistor are connected to a first input terminal and a second input terminal, and an output terminal is connected to the control device.

20. In Paragraph 19, The above control device is, If the output signal output through the output terminal of the comparator is a low signal, a first voltage is applied to the gate line, and An X-ray generator that prevents the generation of arc signals by applying a second voltage lower than the first voltage to the gate line when the output signal output through the output terminal of the comparator by the arc signals is a high signal.

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