Method for producing a laser diode module, production installation for producing a laser diode module, and laser diode module

Abstract

The invention relates to a method for producing a laser diode module (10), wherein the laser diode module (10) has a support (20) and a laser diode chip (18), the support (20) has a laser diode securing region (34), and the laser diode securing region (34) has a copper content of at least 80%. The method has the steps of: removing copper oxide (38) from the surface of the laser diode securing region (34) in order to form a copper oxide-free laser diode securing surface (40); and securing the laser diode chip (18) to the laser diode securing region (34) by producing a laser diode connection (44) between the laser diode securing region (34) and the laser diode chip (18). The laser diode connection (44) extends from the laser diode securing surface (40) to the laser diode chip (18).

Description

[0001]

[0002] Title: Method for manufacturing a laser diode module, manufacturing-

[0003] System for manufacturing a laser diode module and laser diode module

[0004] Description

[0005] The invention relates to a method for manufacturing a laser diode module, a manufacturing plant for manufacturing a laser diode module and a laser diode module.

[0006] A laser diode module can provide a laser beam, for example, for optical pumping of a laser-active medium in a solid-state laser. The solid-state laser can be configured as a disk laser or a fiber laser, for instance. Consequently, the laser beam provided by the laser diode module can be suitable for optical pumping, for example, of solid-state lasers.

[0007] Besides optical pumping, other applications for the laser beam of the laser diode module are possible, especially if the laser beam is supplied at a specific power. For example, the laser beam can be suitable for machining workpieces or for applications in medical technology. In such applications, the laser beam can serve as an optical pump source, as an unamplified machining laser beam, or as an unamplified treatment laser beam.

[0008] A typical laser diode module has at least one laser diode chip, which is attached directly to a substrate. This substrate can also be called a submount. This type of design is often referred to as chip-on-submount.

[0009] The laser diode chip is typically made of a semiconductor material and is designed to convert electrical power into optical power. In other words, when an electric current is applied, the laser diode chip can generate the laser beam. The heat generated during laser beam production is usually transferred to a substrate, which serves to distribute the heat evenly over a larger area. This allows the heat to be efficiently dissipated from the laser diode chip. The substrate can also be called a heat spreader.

[0010] The substrate is usually made of copper or coated with a copper layer. Copper has the advantage that electrical current can be supplied to the laser diode chip with low electrical resistance and heat can be dissipated from the laser diode chip with low thermal resistance. However, copper can react with oxygen in an oxygen-containing environment, which can lead to the formation of copper oxide.

[0011] The formation of copper oxide can be undesirable, as copper oxide has a higher electrical and thermal resistance than copper. To prevent copper oxide formation, the substrate is typically coated with a protective layer, often containing a high proportion of gold. The gold content of the protective layer ensures that electrical current continues to flow to the laser diode chip with low resistance and that heat is dissipated from the laser diode chip with low thermal resistance.

[0012] The laser diode chip is typically attached to the protective layer by means of a metallurgical bond, in particular a soldered connection. Consequently, the metallurgical bond typically extends from the protective layer to the laser diode chip.

[0013] The object of the present invention is to provide a method for manufacturing a laser diode module, a manufacturing plant for manufacturing a laser diode module and a laser diode module, each of which is cost-effective.

[0014] The invention solves this problem with a method having the features of claim 1, with a manufacturing system having the features of claim 9, and with a laser diode module having the features of claim 10. Advantageous embodiments and further developments of the invention are set forth in the dependent claims.

[0015] A method according to the invention serves to manufacture a laser diode module. The laser diode module comprises a carrier and a laser diode chip. The carrier has a laser diode mounting area. The laser diode mounting area has a copper content of at least 80%, in particular by weight. The method comprises: removing copper oxide from a surface of the laser diode mounting area, thereby forming a copper oxide-free laser diode mounting surface; and attaching the laser diode chip to the laser diode mounting area by establishing a laser diode connection between the laser diode mounting area and the laser diode chip. The laser diode connection extends at least from the laser diode mounting surface, which is formed in particular during the removal of copper oxide, to the laser diode chip.

[0016] Advantageously, this eliminates the need to coat the laser diode mounting area with a protective layer to prevent copper oxide formation, thus saving costs. Therefore, the process can enable cost-effective manufacturing of the laser diode module, making it a cost-effective method.

[0017] The carrier can be referred to as a submount, heat spreader, or thermal spreader.

[0018] The substrate can be made of a material with a copper content of at least 80%. Alternatively, the substrate can be coated with a copper layer containing at least 80% copper. The laser diode mounting area can be formed, at least partially, by the copper layer. The laser diode mounting area can be designed for attaching the laser diode chip to the substrate.

[0019] The laser diode mounting area can have a copper content of at least 90%, preferably 95% or 99%. The laser diode mounting area can have a copper content of at most 100%.

[0020] The laser diode chip can be called an emitter, in particular a single emitter. The laser diode chip can be made of a semiconductor material. The laser diode chip can be configured to generate a laser beam, in particular a single laser beam. The laser diode chip can be configured to convert electrical power directly into optical power by generating the laser beam.

[0021] Removing copper oxide from the surface of the laser diode mounting area and / or mounting the laser diode chip to the laser diode mounting area can be performed under a protective atmosphere to prevent the formation or development of copper oxide. The laser diode mounting surface can be a flat surface.

[0022] In particular, the procedure after removing copper oxide from the surface of the laser diode mounting area cannot include coating the copper oxide-free laser diode mounting surface with a protective layer to prevent the formation of copper oxide.

[0023] Preferably, after removing copper oxide from the surface of the laser diode mounting area, the laser diode chip can be attached to the laser diode mounting area by means of the laser diode connection without any further processing, in particular coating, of the laser diode mounting area.

[0024] Mounting the laser diode chip can be a processing step immediately following the removal of copper oxide from the surface of the laser diode mounting area, or a processing step of the substrate. No processing of the substrate can take place between the removal of the copper oxide and the mounting of the laser diode chip.

[0025] The laser diode module can have a chip-on-submount design. The chip-on-submount design allows for a compact and thermally efficient construction.

[0026] The laser diode connection can be arranged between the laser diode chip and the substrate, in particular the laser diode mounting area.

[0027] Another advantage of this process is that it eliminates the need for a protective layer, often containing gold, titanium, or palladium, to prevent copper oxide formation. This can eliminate manufacturing steps and / or reduce material costs. In particular, eliminating the need for the protective layer can shorten the manufacturing time, thereby lowering the overall cost of producing the laser diode module.

[0028] Another aspect of this method is that it allows the laser diode chip to be directly attached to the laser diode mounting area. This means there can be no protective layer between the laser diode chip and the laser diode mounting area to prevent the formation of copper oxide.

[0029] Another aspect of this process is its suitability for the mass production of laser diode modules. Furthermore, it enables the creation of a secure and reliable electrical and / or thermal connection between the substrate and the laser diode chip. Specifically, eliminating the protective layer prevents the electrical and / or thermal connection between the substrate and the laser diode chip from being compromised by impurities or defects in the protective layer. Therefore, this process can facilitate the production of laser diode modules with high quality, process reliability, and / or performance.

[0030] Another aspect of the process may be that it simplifies the manufacturing of the laser diode module, thereby reducing the risk of manufacturing defects.

[0031] In a further development of the process, the laser diode connection is a metallurgical bond. Advantageously, this metallurgical bond enables a compact design of the laser diode module and simultaneously a secure and reliable attachment of the laser diode chip to the laser diode mounting area.

[0032] In a further development of the method, the laser diode connection is a soldered joint, a sintered joint, or a welded joint. Such metallurgical connections can be particularly suitable for producing the laser diode connection. Preferably, the laser diode connection can be a soldered joint or a sintered joint.

[0033] In a further development of the process, the removal of the copper oxide is achieved through chemical and / or mechanical removal. For example, mechanical removal of the copper oxide can be accomplished by milling the laser diode mounting area. This milling can be performed using a diamond milling cutter. Chemical removal of the copper oxide can be achieved, for example, by cleaning, in particular by deoxidizing, the laser diode mounting area. Additionally or alternatively, ion-based cleaning can be performed.

[0034] In a further development of the process, the procedure involves transporting the substrate, after copper oxide removal, in a protective atmosphere to a workstation for attaching the laser diode chip to the laser diode mounting area. Advantageously, the workstation can be specialized for copper oxide removal, thus achieving high efficiency and quality in this process. Another advantage is that this enables assembly line production of laser diode modules. The substrate can be transported using an assembly line. Transporting the substrate does not constitute a processing step within the substrate processing itself.

[0035] The removal of the copper oxide and the attachment of the laser diode chip can be performed from different workstations.

[0036] The protective atmosphere can be designed to prevent the formation of copper oxide. In particular, the protective atmosphere can be free of gases that would allow the formation of copper oxide. Specifically, the protective atmosphere can be oxygen-free. Preferably, the protective atmosphere can consist entirely of nitrogen.

[0037] In a further development of the method, the process involves: placing a mixture of binder and oxide removal material between the substrate and the laser diode chip. Attaching the laser diode chip to the laser diode mounting area includes heating the mixture. During heating, the binder at least partially melts, and the oxide removal material removes the copper oxide from the surface of the laser diode mounting area. Advantageously, this allows the removal of the copper oxide and the attachment of the laser diode chip to the laser diode mounting area to be carried out in a single step.

[0038] In particular, during heating, the oxide removal material can remove the copper oxide in such a way that the partially molten bonding material makes contact with the laser diode chip and the copper oxide-free laser diode mounting surface. After heating, the bonding material can be cooled, causing the molten bonding material to solidify and form the laser diode connection.

[0039] The mixture can be described as a sintering material. Heating the mixture can be part of a sintering process. In particular, heating the mixture can create a sintered bond between the laser diode mounting area and the laser diode chip. The oxide removal material can be described as an oxide breaker.

[0040] Oxide removal material may contain acid.

[0041] In a further development of the process, the laser diode module has a heat sink.

[0042] The carrier has a heat sink mounting area. The heat sink-

[0043] The mounting area has a copper content of at least 80%. The procedure involves: removing copper oxide from a surface of the heat sink.

[0044] Mounting area forming a copper oxide-free heat sink

[0045] Mounting surface; and attaching the heat sink to the heat sink-

[0046] Mounting area by creating a heat sink connection between the

[0047] The heatsink mounting area and the heatsink. The heatsink connection extends from the heatsink mounting surface to the heatsink.

[0048] Advantageously, the heat sink allows for better dissipation of heat generated in the laser diode chip during laser beam generation, resulting in a particularly stable laser beam. In particular, the heat sink reduces or completely eliminates the influence of thermally induced stresses on the laser diode chip, ensuring that the laser beam maintains the desired beam parameters even at higher power levels.

[0049] The previously given description of the laser diode connection can apply accordingly to the heat sink connection. In particular, the laser diode connection and the heat sink connection can be designed identically.

[0050] The previously given description of the laser diode mounting area can apply accordingly to the heat sink mounting area. In particular, the laser diode mounting area and the heat sink mounting area can be designed identically.

[0051] The heat sink can be designed to allow a cooling medium, such as cooling water, to flow through it for the purpose of cooling the laser diode chip.

[0052] The heat generated in the laser diode chip during laser beam production can be transferred via the substrate to the heat sink. The heat sink can be designed to dissipate the heat to the surrounding environment or to the cooling medium. The laser diode module can contain multiple laser diode chips and multiple substrates. Each laser diode chip can be attached to a substrate via a laser diode interconnect. Each substrate can be attached to the heat sink via a heat sink interconnect.

[0053] The heat sink can be designed as a base plate for the laser diode module. The heat sink can be made of aluminum, copper, or brass.

[0054] Removing copper oxide from the surface of the laser diode mounting area and removing copper oxide from the surface of the heat sink mounting area can be done immediately one after the other or simultaneously. Attaching the laser diode chip to the laser diode mounting area and attaching the heat sink to the heat sink mounting area can be done immediately one after the other or simultaneously.

[0055] For example, a workstation can be configured to remove copper oxide from the surface of the laser diode mounting area and copper oxide from the surface of the heat sink mounting area. The carrier can then be transported to another workstation configured to attach the laser diode chip to the laser diode mounting area and the heat sink to the heat sink mounting area.

[0056] In a further development of the process, the removal of copper oxide from the surface of the laser diode mounting area and the removal of copper oxide from the surface of the heat sink mounting area are performed simultaneously. Advantageously, this reduces the manufacturing time for the laser diode module. In particular, the removal of copper oxide from the surface of the laser diode mounting area and the removal of copper oxide from the surface of the heat sink mounting area can be carried out using a single workstation.

[0057] A manufacturing system according to the invention is configured to carry out a previously described method. The manufacturing system comprises a first workstation and a second workstation. The first workstation is configured to remove copper oxide from the surface of the laser diode mounting area. The second workstation is configured to attach the laser diode chip to the laser diode mounting area. The manufacturing system can perform automatic, and in particular fully automatic, production of the laser diode module.

[0058] A laser diode module according to the invention is manufactured using a previously described method. In particular, the laser diode connection can extend from the laser diode mounting surface to the laser diode chip.

[0059] Further advantages and advantageous embodiments of the invention can be seen from the figures, their description, and the claims. All features disclosed in the figures, their description, and the claims can be essential to the invention, both individually and in any combination. The figures show:

[0060] Fig. 1 shows a schematic oblique view of a laser diode module,

[0061] Fig. 2 shows a schematic top view of a laser diode chip and a carrier of the

[0062] laser diode module,

[0063] Fig. 3 shows a schematic representation of a section of a manufacturing plant for producing the laser diode module,

[0064] Figures 4 to 6 each show a schematic view of a cross-section of the carrier during the manufacture of the laser diode module to illustrate the manufacturing process, and

[0065] Figs. 7 and 8 each show a schematic view of a cross-section of another support to illustrate a further embodiment of a manufacturing process.

[0066] Fig. 1 shows a laser diode module 10. The laser diode module 10 is configured to provide an output laser beam 12 at an output 14 of the laser diode module 10. The output laser beam 12 is formed from a plurality of laser beams 16.

[0067] The laser diode module 10 has a plurality of laser diode chips 18, a plurality of carriers 20, and a heat sink 22. The number of laser diode chips 18 corresponds to the number of carriers 20. Each carrier 20 is assigned one laser diode chip 18. Each laser diode chip 18 is attached to a carrier 20. Such a design can be described as chip-on-submount.

[0068] Each support 20 is attached to the heat sink 22. The heat sink 22 thus acts as a base plate. The heat sink 22 has a flat surface section 24. The flat surface section 24 is a continuous and uninterrupted surface section. The flat surface section 24 forms a plane of the heat sink 22. The flat surface section 24 is a surface section of the heat sink 22.

[0069] Each support 20 is arranged on the flat surface section 24. In particular, each support 20 is arranged on the flat surface section 24 such that the supports 20 are aligned parallel to each other.

[0070] Fig. 2 shows a top view of a laser diode chip 18 of the laser diode module 10 from Fig. 1. Each laser diode chip 18 is made of a semiconductor material and is designed to convert electrical power into optical power. In doing so, the laser diode chip 18 generates the laser beam 16. Each laser diode chip 18 generates a single laser beam 16.

[0071] During the generation of the laser beam 16, heat is produced, which is transferred via the carrier 20 to the heat sink 22. The carrier 20 serves to distribute the heat from the laser diode chip 18 over a larger area, thus enabling stable generation of the laser beam 16. Therefore, the carrier 20 can also be referred to as a heat spreader. The heat sink 22 distributes the heat from the laser diode chip 18 evenly and dissipates it into the surrounding environment.

[0072] To ensure good heat transfer from the laser diode chip 18 to the carrier 20 and from the carrier 20 to the heat sink 22, the laser diode chip 18 is attached to the carrier 20 by means of a laser diode connection, and the carrier 20 is attached to the heat sink 22 by means of a heat sink connection. The laser diode connection and the heat sink connection are both metallurgical bonds.

[0073] Fig. 3 schematically shows a manufacturing system 500 for producing the laser diode module 10. The production of the laser diode module 10 includes making the laser diode connection and the heat sink connection. The manufacturing system 500 produces the laser diode module 10 automatically, in particular fully automatically. The manufacturing system 500 has a first workstation 502 and a second workstation 504. The first workstation 502 is configured to prepare the carrier 20 for making the laser diode connection and the heat sink connection. The second workstation 504 is configured to make the laser diode connection and the heat sink connection, thereby attaching the laser diode chip 18 to the carrier 20 and the carrier 20 to the heat sink 22.

[0074] The manufacturing system 500 has additional workstations 506, which are designed to perform the remaining manufacturing steps for the production of the laser diode module 10. For example, the remaining manufacturing steps may include attaching optical components 26 to the heat sink 22. The optical components 26 may be, for example, deflecting mirrors or lenses.

[0075] Workstations 502, 504, and 506 are arranged on a conveyor system 508 of the production plant 500. When a workstation 502, 504, or 506 has completed its manufacturing step, the assembly produced up to that point is transported by means of a workpiece carrier 510 of the production plant 500 and by means of the conveyor system 508 to a subsequent workstation 502, 504, or 506 until the laser diode module 10 has been manufactured.

[0076] Figures 4 to 6 schematically show a cross-section of a carrier 20 during the manufacture of the laser diode module 10 to illustrate the manufacturing process.

[0077] Fig. 4 shows the carrier 20 in a state in which it is supplied to the workstation 502 for preparation. The carrier 20 has a substrate 28. The substrate 28 is coated with a first copper layer 30 and a second copper layer 32 of the carrier 20. The first copper layer 30 and the second copper layer 32 are arranged on opposite sides of the carrier 20, in particular the substrate 28. The two copper layers 30, 32 serve to conduct the heat from the laser diode chip 18 particularly quickly into the heat sink 22 and to conduct current with low electrical resistance.

[0078] The first copper coating 30 forms a sectional laser diode mounting area 34, to which the laser diode chip 18 is to be attached. The second copper coating 32 forms a sectional heat sink mounting area 36, ​​to which the heat sink 22 is to be attached. Each copper coating 30, 32 has a copper content in the range of 95 wt. percent to 100 wt. However, copper oxide 38 has formed on the surface of the substrate 20, particularly on the coatings 30, 32. The copper oxide 38 reduces the thermal conductivity of the substrate 20 and increases its resistance to conducting electric current.

[0079] The first workstation 502 is designed to remove the copper oxide 38 from the surface of the laser diode mounting area 34 and from the surface of the heat sink mounting area 36 as part of the preparation of the carrier 20.

[0080] In the illustrated embodiment, the first workstation 502 is configured to mechanically remove copper oxide 38 using a diamond milling cutter. The removal of the copper oxide 38 from the surface of the laser diode mounting area 34 and the removal of the copper oxide 38 from the surface of the heat sink mounting area 36 are carried out immediately one after the other.

[0081] The removal of copper oxide 38 takes place under a protective atmosphere. This protective atmosphere prevents the reformation of copper oxide after its removal. The protective atmosphere is oxygen-free.

[0082] Fig. 5 shows the support 20 after the removal of the copper oxide 38. The removal of the copper oxide 38 from the surface of the laser diode mounting area 34 resulted in a copper oxide-free laser diode mounting surface 40. The removal of the copper oxide 38 from the surface of the heat sink mounting area 36 resulted in a copper oxide-free heat sink mounting surface 42. The terms "copper oxide-free laser diode mounting surface 40" and "copper oxide-free heat sink mounting surface 42" mean that no copper oxide 38 is present on and / or within the laser diode mounting surface 40 and on and / or within the heat sink mounting surface 42.

[0083] The laser diode mounting surface 40 and the heat sink mounting surface 42 are each a flat surface. The laser diode mounting surface 40 serves to mount the laser diode chip 18, and the heat sink mounting surface 42 serves to mount the heat sink 22. After the copper oxide 38 has been removed, the carrier 20 is transported to the second workstation 504. Transport of the carrier 20 to the second workstation 504 takes place in a protective atmosphere.

[0084] The second workstation 504 attaches the laser diode chip 18 to the laser diode mounting area 34 by establishing the laser diode connection 44 between the laser diode mounting area 34 and the laser diode chip 18. The second workstation 504 attaches the heat sink 22 to the heat sink mounting area 36 by establishing the heat sink connection 46 between the heat sink mounting area 36 and the heat sink 22.

[0085] Fig. 6 shows the carrier 20 after the laser diode chip 18 has been attached to the laser diode mounting area 34 and after the heat sink 22 has been attached to the heat sink mounting area 36.

[0086] The second workstation 504 is designed to attach all carriers 20 of the laser diode module 10 to the heat sink 22 simultaneously.

[0087] The laser diode connection 44 and the heat sink connection 46 are each soldered connections. A solder material 48 of the laser diode connection 44 is positioned between the laser diode chip 18 and the laser diode mounting surface 40. The solder material 48 of the laser diode connection 44 directly contacts the laser diode mounting surface 40 and the laser diode chip 18. Thus, the laser diode connection 44 extends from the laser diode mounting surface 40 to the laser diode chip 18.

[0088] Between the heat sink 22 and the heat sink mounting surface 42, solder material 50 of the heat sink connection 46 is arranged. The solder material 50 of the heat sink connection 46 directly contacts the heat sink mounting surface 42 and the heat sink 22. Thus, the heat sink connection 46 extends from the heat sink mounting surface 42 to the heat sink 22.

[0089] In other words, the laser diode connection 44 is made directly on the first copper layer 30, and the heat sink connection 46 is made directly on the second copper layer 32. Specifically, the substrate 20 lacks a protective layer, particularly a protective coating, to prevent copper oxide formation. In other words, there is no protective layer between the laser diode connection 44 and the first copper layer 30 to prevent copper oxide formation. Similarly, there is no protective layer between the heat sink connection 46 and the second copper layer 32 to prevent copper oxide formation.

[0090] This eliminates the need to coat the support 20 with a protective layer after the removal of the copper oxide to prevent the formation of copper oxide, thus saving costs.

[0091] Figures 7 and 8 schematically show a cross-section of another support 20 to illustrate a further embodiment of a manufacturing process, wherein identical and functionally equivalent elements are represented by the same reference numerals and in this respect reference can be made to the above explanations of the embodiment of Figures 1 to 6, so that essentially only the existing differences are discussed.

[0092] In the embodiment shown in Figures 7 and 8, the manufacturing system 500 has a workstation for producing sintered connections. The laser diode connection 44 and the heat sink connection 46 are each sintered connections.

[0093] The carrier 20 is fed to the workstation for producing the sintered joints in the state shown in Fig. 4. The carrier 20 has the copper coatings 30, 32, and copper oxide 38 is present on the surface of the carrier 20, in particular on the coatings 30, 32.

[0094] The workstation for producing the sintered joints applies a mixture 52 to the laser diode mounting area 34 and places the laser diode chip 18 on the mixture 52, see Fig. 7. The workstation for producing the sintered joints applies the mixture 52 to the heat sink mounting area 36 and places the carrier 20 on the heat sink 22.

[0095] The mixture 52 consists of a binder and an oxide removal material. The oxide removal material is designed to chemically remove copper oxide 38. The oxide removal material is an acid. The binder is designed to produce the sintered compounds.

[0096] The workstation for producing the sintered joints heats the arrangement shown in Fig. 7. During heating, the bonding material melts at least partially, and the oxide removal material removes the copper oxide 38 from the surface of the laser diode mounting area 34, forming the copper oxide-free laser diode mounting surface 40, and from the surface of the heat sink mounting area 36, ​​forming the copper oxide-free heat sink mounting surface 42.

[0097] After heating, the laser diode module 10 cools down, whereby the bonding material solidifies and the sintered connection 44 between the laser diode chip 18 and the carrier 20 and the sintered connection 46 between the carrier 20 and the heat sink 22 are formed, see Fig. 8.

[0098] Figures 7 and 8 show that the removal of the copper oxide 38, the attachment of the laser diode chip 18 to the carrier 20 and the attachment of the carrier 20 to the heat sink 22 are carried out in one step.

Claims

Patent claims 1. A method for manufacturing a laser diode module (10), wherein the laser diode module (10) comprises a carrier (20) and a laser diode chip (18), wherein the carrier (20) comprises a laser diode mounting area (34), wherein the laser diode mounting area (34) has a copper content of at least 80%, wherein the method comprises: Removal of copper oxide (38) from a surface of the laser diode mounting area (34) to form a copper oxide-free laser diode mounting surface (40), and Attaching the laser diode chip (18) to the laser diode mounting area (34) by establishing a laser diode connection (44) between the laser diode mounting area (34) and the laser diode chip (18), wherein the laser diode connection (44) extends from the laser diode mounting area (40) to the laser diode chip (18).

2. The method of claim 1, wherein the laser diode connection (44) is a metallurgical connection.

3. Method according to any of the preceding claims, wherein the laser diode connection (44) is a soldered connection, a sintered connection or a welded connection.

4. Method according to any of the preceding claims, wherein the removal of the copper oxide (38) from the surface of the laser diode mounting area (34) is a chemical removal and / or a mechanical removal.

5. A method according to any one of the preceding claims, wherein the method comprises: Transporting the carrier (20) after removal of the copper oxide (38) in a protective atmosphere to a workstation (502, 504, 506) for attaching the laser diode chip (18) to the laser diode mounting area (34).

6. A method according to any one of the preceding claims, wherein the method comprises: Arranging a mixture (52) of binder material and oxide removal material between the support (20) and the laser diode chip (18), wherein attaching the laser diode chip (18) to the laser diode mounting area (34) comprises heating the mixture (52), wherein during the heating of the mixture (52) the binder material melts at least partially and the oxide removal material removes the copper oxide (38) from the surface of the laser diode mounting area (34).

7. A method according to any of the preceding claims, wherein the laser diode module (10) has a heat sink (22), wherein the carrier (20) has a heat sink mounting area (36), wherein the heat sink mounting area (36) has a copper content of at least 80%, wherein the method comprises: Removal of copper oxide (38) from a surface of the heat sink mounting area (36) to form a copper oxide-free heat sink mounting surface (42), and Attaching the heat sink (22) to the heat sink mounting area (36) by establishing a heat sink connection (46) between the heat sink mounting area (36) and the heat sink (22), wherein the heat sink connection (46) extends from the heat sink mounting surface (42) to the heat sink (22).

8. Method according to claim 7, wherein the removal of copper oxide (38) from the surface of the laser diode mounting area (34) and the removal of copper oxide (38) from the surface of the heat sink mounting area (36) are carried out simultaneously.

9. Manufacturing plant (500) configured to carry out a method according to one of the preceding claims, wherein the manufacturing plant (500) comprises: a first work station (502) configured to remove copper oxide (38) from the surface of the laser diode mounting area (34), and a second work station (504) configured to attach the laser diode chip (18) to the laser diode mounting area (34). 18 10. Laser diode module (10) manufactured by a method according to any one of claims 1 to 8 above.

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