Optical package cover structure for a laser diode

Abstract

This utility model discloses an optical encapsulation cover structure for a laser diode, including an encapsulation cover body. A mounting hole is formed at the top of the encapsulation cover body, and a sealing mechanism is installed inside the mounting hole. Extension blocks are fixedly connected to all four sides of the surface of the encapsulation cover body, and a positioning mechanism is fixedly connected to the bottom of each extension block. The sealing mechanism includes a light-transmitting lens installed inside the mounting hole. In this optical encapsulation cover structure for a laser diode, the surface of the light-transmitting lens is covered with an annular fluororubber, and a support spring is installed inside the annular fluororubber. The elastic potential energy provided by the support spring firmly adheres the annular fluororubber to the external connection structure, thereby improving the sealing performance of the light-transmitting lens connection and preventing air leakage and water seepage at the connection between the light-transmitting lens and the encapsulation cover body due to poor sealing performance.

Description

Technical Field

[0001] This utility model relates to the field of laser diode packaging cover structure technology, specifically to an optical packaging cover structure for a laser diode. Background Technology

[0002] Laser diodes, as a highly efficient and miniaturized light source, are widely used in optical communication, laser display, and sensing applications. The packaging quality of a laser diode directly affects its operational stability and lifespan. The packaging cap, as a key component of the packaging structure, must simultaneously meet the dual requirements of sealing and protection while ensuring optical transmission. It must prevent external moisture, dust, and other impurities from entering the packaging cavity to avoid corrosion or contamination of the laser diode chip, while also ensuring efficient laser transmission and minimizing light loss.

[0003] Currently, common laser diode packaging cover structures have many shortcomings: although some packaging covers adopt a split structure, combining the light-transmitting lens with the metal cover, the sealing performance of the connection between the lens and the cover is not good, and air leakage and water seepage are prone to occur at the gaps. After external moisture enters, it will cause the chip electrode to oxidize, reducing the reliability of the laser diode. In addition, the connection between the existing packaging cover and the packaging base mostly relies on bolt fastening, lacking a precise positioning structure. During assembly, the cover is prone to misalignment, resulting in misalignment between the light-transmitting lens and the light-emitting end of the laser diode, further increasing light loss, and even causing stray light interference due to the laser directly hitting the edge of the cover. Utility Model Content

[0004] The technical problem to be solved by this utility model is as follows: to provide a laser diode optical packaging cover structure that is highly practical, easy to operate, and has a relatively simple structure. This solves the problems mentioned in the background art, where some packaging covers adopt a split structure, combining the light-transmitting lens with the metal cover, but the sealing performance of the connection between the lens and the cover is poor, and air leakage and water seepage are easy to occur at the gaps. Also, the connection between the packaging cover and the packaging base mostly relies on bolt fastening, lacking a precise positioning structure, which makes it easy for the cover to shift during assembly, resulting in misalignment between the light-transmitting lens and the light-emitting end of the laser diode, further increasing light loss, and even causing stray light interference due to the laser directly hitting the edge of the cover.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] An optical encapsulation cover structure for a laser diode includes an encapsulation cover body. A mounting hole is formed at the top of the encapsulation cover body, and a sealing mechanism is installed inside the mounting hole. Extension blocks are fixedly connected to all four sides of the surface of the encapsulation cover body, and a positioning mechanism is fixedly connected to the bottom of each extension block.

[0007] The sealing mechanism includes a light-transmitting lens installed inside the mounting hole, the surface of the light-transmitting lens is provided with an annular fluororubber, and a support spring is installed inside the annular fluororubber;

[0008] The positioning mechanism includes a positioning post fixedly connected to the bottom of the extension block, a positioning cylinder inserted into the bottom of the positioning post, threaded holes on the surfaces of the positioning post and the positioning cylinder, and a positioning bolt threaded into the interior of the threaded hole.

[0009] As a further embodiment of this utility model: a positioning nut is threadedly connected to one side of the positioning bolt, and the positioning nut overlaps the surface of the positioning cylinder, so that the positioning bolt can be easily fixed.

[0010] As a further embodiment of this utility model: an annular sealing ring is inserted into the lower surface of the main body of the encapsulation cover, and an installation groove is attached to one side of the annular sealing ring. The installation groove facilitates the installation of the annular sealing ring, so that the bottom of the main body of the encapsulation cover is tightly connected to the encapsulation base.

[0011] As a further embodiment of this utility model: a packaging base is provided on one side of the mounting groove, and the packaging base is fixedly connected to the bottom of the positioning cylinder, so that the packaging base can support the main body of the packaging cover.

[0012] As a further embodiment of this utility model: a plurality of horizontal heat dissipation blocks are fixedly connected to the surface of the main body of the encapsulation cover, and a vertical heat dissipation block is fixedly connected to the surface of the horizontal heat dissipation block. The horizontal and vertical heat dissipation blocks facilitate heat dissipation and improve the heat dissipation performance of the equipment.

[0013] As a further embodiment of this utility model: an extension ring is fixedly connected to the bottom of the packaging base, and the surface of the extension ring is provided with a plurality of connection holes, which facilitate the installation of threaded rods.

[0014] As a further embodiment of this utility model: the connecting hole is provided with an internal thread, and a threaded rod is threadedly connected to the surface of the internal thread, which facilitates the fixing of the packaging base.

[0015] The beneficial effects of this utility model are:

[0016] 1. Through the setting of the sealing mechanism, when in use, the surface of the light-transmitting lens is provided with an annular fluororubber, and a support spring is also provided inside the annular fluororubber. The elastic potential energy provided by the support spring can firmly attach the annular fluororubber to the external connection structure, thereby improving the sealing performance of the light-transmitting lens connection and avoiding poor sealing performance at the connection between the light-transmitting lens and the main body of the encapsulation cover, which would lead to air leakage and water seepage at the gaps.

[0017] 2. By setting up a positioning mechanism, when installing the main body of the encapsulation cover and the encapsulation base, simply insert the positioning posts set around the main body of the encapsulation cover into the four corresponding positioning cylinders opened on the surface of the encapsulation base, and then use positioning bolts and positioning nuts to limit and fix the positioning posts. This achieves the effect of accurately positioning the connection position of the main body of the encapsulation cover, avoiding the cover body from shifting during assembly, which would cause misalignment between the light-transmitting lens and the light-emitting end of the laser diode, and increase light loss. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the overall disassembled structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the positioning mechanism of this utility model;

[0022] Figure 4 This is a schematic diagram of the sealing mechanism of this utility model.

[0023] In the diagram: 1. Encapsulation cover body; 2. Sealing mechanism; 201. Light-transmitting lens; 202. Annular fluororubber; 203. Support spring; 3. Extension block; 4. Positioning mechanism; 401. Positioning post; 402. Positioning cylinder; 403. Positioning bolt; 5. Positioning nut; 6. Annular sealing ring; 7. Encapsulation base; 8. Horizontal heat dissipation block; 9. Vertical heat dissipation block; 10. Extension ring; 11. Threaded rod. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0025] like Figure 1-4As shown, an optical encapsulation cover structure for a laser diode includes an encapsulation cover body 1. A mounting hole is formed at the top of the encapsulation cover body 1, and a sealing mechanism 2 is installed inside the mounting hole. Through the sealing mechanism 2, during use, an annular fluororubber 202 is provided on the surface of the light-transmitting lens 201, and a support spring 203 is also provided inside the annular fluororubber 202. The elastic potential energy provided by the support spring 203 can firmly adhere the annular fluororubber 202 to the external connection structure, thereby improving the sealing performance of the light-transmitting lens 201 connection and preventing leakage at gaps due to poor sealing performance at the connection between the light-transmitting lens 201 and the encapsulation cover body 1. To prevent air and water seepage, extension blocks 3 are fixedly connected to all four sides of the surface of the main body 1 of the encapsulation cover. A positioning mechanism 4 is fixedly connected to the bottom of the extension blocks 3. With the setting of the positioning mechanism 4, when installing the main body 1 of the encapsulation cover and the encapsulation base 7, it is only necessary to insert the positioning posts 401 set around the main body 1 of the encapsulation cover into the four corresponding positioning cylinders 402 opened on the surface of the encapsulation base 7, and then use the positioning bolts 403 and positioning nuts 5 to limit and fix the positioning posts 401. This can achieve the effect of precise positioning of the connection position of the main body 1 of the encapsulation cover, and avoid the cover body from shifting during assembly, which would cause the light-transmitting lens 201 to deviate from the light-emitting end of the laser diode and increase light loss.

[0026] The sealing mechanism 2 includes a light-transmitting lens 201 installed inside the mounting hole. The surface of the light-transmitting lens 201 is provided with an annular fluororubber 202, and a support spring 203 is installed inside the annular fluororubber 202.

[0027] The positioning mechanism 4 includes a positioning post 401 fixedly connected to the bottom of the extension block 3. A positioning cylinder 402 is inserted into the bottom of the positioning post 401. Threaded holes are opened on the surfaces of both the positioning post 401 and the positioning cylinder 402. A positioning bolt 403 is threadedly connected inside the threaded hole.

[0028] like Figure 3 As shown, a positioning nut 5 is threadedly connected to one side of the positioning bolt 403. The positioning nut 5 overlaps the surface of the positioning cylinder 402, and the positioning nut 5 facilitates the fixing of the positioning bolt 403.

[0029] like Figure 2 As shown, an annular sealing ring 6 is inserted into the lower surface of the encapsulation cover body 1. An installation groove overlaps one side of the annular sealing ring 6. The installation groove facilitates the installation of the annular sealing ring 6, so that the bottom of the encapsulation cover body 1 is tightly connected to the encapsulation base 7.

[0030] like Figure 2 As shown, a packaging base 7 is provided on one side of the mounting groove. The packaging base 7 is fixedly connected to the bottom of the positioning cylinder 402. The packaging base 7 facilitates support of the packaging cover body 1.

[0031] like Figure 1As shown, several horizontal heat dissipation blocks 8 are fixedly connected to the surface of the main body 1 of the encapsulation cover, and vertical heat dissipation blocks 9 are fixedly connected to the surface of the horizontal heat dissipation blocks 8. The horizontal heat dissipation blocks 8 and the vertical heat dissipation blocks 9 facilitate heat dissipation and improve the heat dissipation performance of the equipment.

[0032] like Figure 2 As shown, an extension ring 10 is fixedly connected to the bottom of the encapsulation base 7. Several connection holes are opened on the surface of the extension ring 10, which facilitates the installation of the threaded rod 11.

[0033] like Figure 2 As shown, the connecting hole has an internal thread, and the surface of the internal thread is threaded with a threaded rod 11, which facilitates the fixing of the encapsulation base 7.

[0034] The working principle of this utility model is as follows: When in use, the surface of the light-transmitting lens 201 is provided with an annular fluororubber 202, and a support spring 203 is also provided inside the annular fluororubber 202. The elastic potential energy provided by the support spring 203 can firmly attach the annular fluororubber 202 to the external connection structure, thereby improving the sealing performance of the connection of the light-transmitting lens 201.

[0035] When installing the encapsulation cover body 1 and the encapsulation base 7, simply insert the positioning posts 401 set around the encapsulation cover body 1 into the four corresponding positioning cylinders 402 opened on the surface of the encapsulation base 7, and then use the positioning bolts 403 and positioning nuts 5 to limit and fix the positioning posts 401, so as to achieve precise positioning of the connection position of the encapsulation cover body 1.

[0036] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. An optical packaging cover structure for a laser diode, comprising a packaging cover body (1), characterized in that: The top of the encapsulation cover body (1) is provided with an installation hole, and a sealing mechanism (2) is installed inside the installation hole. Extension blocks (3) are fixedly connected to all four sides of the surface of the encapsulation cover body (1), and a positioning mechanism (4) is fixedly connected to the bottom of the extension blocks (3). The sealing mechanism (2) includes a light-transmitting lens (201) installed inside the mounting hole. The surface of the light-transmitting lens (201) is provided with an annular fluororubber (202), and a support spring (203) is installed inside the annular fluororubber (202). The positioning mechanism (4) includes a positioning post (401) fixedly connected to the bottom of the extension block (3). A positioning cylinder (402) is inserted into the bottom of the positioning post (401). Threaded holes are opened on the surfaces of the positioning post (401) and the positioning cylinder (402). A positioning bolt (403) is threaded inside the threaded hole.

2. The optical packaging cover structure for a laser diode according to claim 1, characterized in that, The positioning bolt (403) has a positioning nut (5) threadedly connected to one side, and the positioning nut (5) overlaps the surface of the positioning cylinder (402).

3. The optical packaging cover structure for a laser diode according to claim 1, characterized in that, An annular sealing ring (6) is inserted into the lower surface of the main body (1) of the encapsulation cover, and an installation groove is attached to one side of the annular sealing ring (6).

4. The optical packaging cover structure for a laser diode according to claim 3, characterized in that, A packaging base (7) is provided on one side of the mounting groove, and the packaging base (7) is fixedly connected to the bottom of the positioning cylinder (402).

5. The optical packaging cover structure for a laser diode according to claim 1, characterized in that, A plurality of horizontal heat sinks (8) are fixedly connected to the surface of the main body (1) of the encapsulation cover, and a vertical heat sink (9) is fixedly connected to the surface of the horizontal heat sinks (8).

6. The optical packaging cover structure for a laser diode according to claim 4, characterized in that, An extension ring (10) is fixedly connected to the bottom of the packaging base (7), and the surface of the extension ring (10) has several connection holes.

7. The optical packaging cover structure for a laser diode according to claim 6, characterized in that, The connecting hole is provided with an internal thread, and the surface of the internal thread is threaded to a threaded rod (11).

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