Heat sink for cooling a processor unit

Abstract

The invention relates to a heat sink (10) for cooling a processor unit (4) and to a method for producing such a heat sink (10). The heat sink (10) comprises a main body (20) which can be placed on the processor unit (4) and which has an inlet (1) and an outlet (3) for a cooling medium (9) as well as a heat exchange volume (2) and is designed such that the cooling medium (9) enters the heat exchange volume (2) through the inlet (1) and leaves the main body (20) through the outlet (3), wherein a granulate block (8) coated with an electrically insulating material is provided in the heat exchange volume (2), which granulate block is designed to absorb the heat from the processor unit (4) and to conduct it away from the heat sink (10) by means of the cooling medium (9) flowing through the granulate block (8).

Description

[0001] Description

[0002] title

[0003] Heat sink for cooling a processor assembly

[0004] Technical field of the invention

[0005] The present invention relates to a heat sink for cooling a processor assembly with a cooling medium, in particular for direct-to-chip liquid cooling for data centers. The invention further relates to a method for manufacturing a heat sink for cooling a processor assembly.

[0006] Background of the invention

[0007] One of the key aspects of increasing the computing capacity / performance of a data center is the development of appropriate cooling technology to keep the temperature of processor components such as the CPU and GPU below a certain limit, thus preventing overheating of the electrical components and electronics involved. With the development of increasingly sophisticated and powerful systems, especially to meet the computing demands of artificial intelligence applications, more efficient cooling technologies must be developed.

[0008] With increasing computing power, especially at server densities in racks exceeding 30 kW, air cooling is no longer sufficient. Various technologies have been developed in recent years that utilize liquid cooling methods instead. One such technology is direct-to-chip liquid cooling, where a heat sink with an internal profile (for example, an internal structure of fluid channels) for fluid flow can be applied directly to a server component (e.g., a chip package). This enables a very compact design while simultaneously allowing for efficient heat dissipation from CPUs and GPUs.

[0009] Cooling efficiency must be combined with sustainability considerations. With conventional cooling technologies, a large portion of the waste heat from data centers is released unused into the air via air conditioning systems or water cooling towers.

[0010] For example, a current direct-to-chip cooling provider typically transfers 70 percent of the heat to the liquid. The remaining 30 percent traditionally has to be cooled using air conditioning.

[0011] AI computing has drastically increased electricity consumption in data centers, making it a challenge to reduce energy costs while considering sustainability aspects.

[0012] It is therefore important to develop and refine cooling technologies for data centers that can efficiently dissipate waste heat from server components and reduce the carbon footprint (CO2 footprint) of data centers.

[0013] Summary of the invention

[0014] It is therefore an object of the present invention to provide a heat sink in the field of direct-to-chip liquid cooling technology that enables more efficient cooling of server components, in particular CPUs and GPUs. A further object is to provide a method for manufacturing such a heat sink.

[0015] This problem is solved by the subject matter of the independent claims of the present invention.

[0016] According to a first aspect, a heat sink for cooling a processor assembly is provided, comprising: a base body which can be attached to (or: placed on) the processor assembly, and which has an inlet and an outlet for a cooling medium as well as a heat exchange volume and is designed such that the cooling medium enters the heat exchange volume through the inlet and leaves the base body (and the heat exchange volume) through the outlet, wherein a granulate block coated with an electrically insulating material is provided in the heat exchange volume, which is designed to absorb the heat from the processor assembly and to conduct it away from the heat sink (and thus from the processor assembly) by means of the cooling medium flowing through the granulate block.

[0017] A processor assembly may in particular include a central processing unit (CPU) and / or at least one graphics processing unit (GPU) and / or at least one tensor processing unit (TPU) and / or at least one data processing unit (DPU), or be configured as such.

[0018] In the context of the invention, a heat sink is understood to be a device with at least one contact surface that can be brought into contact with a processor unit and is designed such that heat can be dissipated or dissipated from the processor unit, thereby reducing its temperature. The contact surface is advantageously planar to allow for a virtually seamless fit or conformity with the processor unit.

[0019] The heat sink comprises a base body (also called a housing) through which a cooling medium (or coolant, or cooling fluid, in particular a cooling liquid) can flow. The base body contains a (liquid) inlet and a (liquid) outlet. The inlet and outlet can direct the cooling medium into and out of the heat sink (for example, by means of appropriate liquid supply and discharge lines that can be attached to the inlet and outlet).

[0020] The base body preferably consists of two pluggable housing parts or pieces that can be assembled and disassembled. These parts preferably have a surface whose size is adapted to the processor unit to be cooled. The base body is provided, at least on the side that comes into contact with (or is designed to come into contact with) the processor unit, with a contact surface made of a highly thermally conductive material or with a surface coated with a highly thermally conductive material.

[0021] The base body is designed to include a cavity containing a heat exchange volume (also called a chamber). The inlet, outlet, and heat exchange volume are connected by a fluid path. The base body is sealed when the parts are assembled, meaning the cooling medium can only enter or exit the heat sink through the inlet and outlet, respectively.

[0022] A granule block consists of one or more layers of thermally conductive granules (made of metal, ceramic, or carbon nanotubes) arranged close together within the heat exchange volume. The granule block is not necessarily a structured arrangement (such as a 3D grid) of granules, but rather a stochastic distribution. The spacing between the granules in the granule block defines (micro)paths through which the cooling medium can flow from the inlet to the outlet. These paths or channels are created by the distribution of the granules. Unlike most conventional heat sinks, there is no need to create intricate, meandering fluid paths; these arise spontaneously from the granules themselves. For the invention, granules that form a plurality of microchannels are particularly preferred.A grain size (ssize) can, for example, be between 2mm and 4mm, depending on the cooling requirements.

[0023] The granule block is coated with an electrically insulating material. This coating is preferably applied homogeneously over the entire volume of the granule block, so that the electrically insulating material is applied to as many granules as possible. Alternatively or additionally, the granules are first coated individually and then pressed together to form the granule block.

[0024] A fundamental idea of ​​the present invention is to provide a heat sink through which the cooling medium must flow as far as possible through the volume of the heat sink in order to absorb and dissipate as much heat as possible from an adjacent processor unit. This is achieved by a structure of metallic granules in whose interstitial spaces a network of microchannels is formed.

[0025] In this way, the cooling medium remains in the heat sink much longer than with conventional, pre-formed channels, contributing to a higher temperature of the cooling medium upon exiting the heat sink compared to conventional liquid cooling methods. This increase in the active surface area for heat transfer ensures greater heat recovery, which could be used for other applications via pipes. For example, the cooling medium could be connected to or be part of a heating system.

[0026] Accordingly, the invention also provides a heating system with a cooling element according to the invention, wherein the cooling element is connected in particular at its inlet to a coolant supply line and at its outlet to a coolant discharge.

[0027] A further advantage of the present invention is that the heat sink with the aluminum granules according to the invention does not require a costly manufacturing process and is therefore suitable for mass production. This makes manufacturing extremely simple and inexpensive.

[0028] Further advantages of the invention are explained below with reference to the subject matter of the dependent claims and, in particular, with reference to the description of the figures. According to some preferred embodiments, variants, or refinements of embodiments, the base body is made of metal and / or plastic and / or ceramic. It is also conceivable that the base body is made of a combination of materials. For example, the base body can be made of plastic on the front and of metal or coated metal on the back (i.e., on the side that comes into contact with the processor unit), for example, aluminum or an aluminum alloy, copper or nickel-plated copper, or of

[0029] Carbon nanotubes. Preferably, metals with high thermal conductivity are used for the back side, for example, with a thermal conductivity of 200 W / (m*K) or higher. Alternatively or additionally, the back side can be coated or impregnated with a thermal paste.

[0030] According to some preferred embodiments, variants, or refinements of embodiments, the inlet and outlet are arranged on opposite sides of the heat sink. This arrangement allows for easy flow of the coolant along the entire length of the heat sink, particularly when the heat sink is positioned vertically, i.e., with the inlet at the top and the outlet at the bottom. This arrangement makes it possible to place a plurality of heat sinks parallel to one another, where the coolant can be routed through one line to the various inlets and routed away through another line from the various outlets.

[0031] According to some preferred embodiments, variants, or refinements of embodiments, the electrically insulating material is a polymer, in particular comprising a reactive resin. The coating of the granule block serves to ensure galvanic isolation, which provides protection against galvanic corrosion. Furthermore, the electrically insulating material can retain the shape of the granules so that they do not enter the cooling medium. Various polymers are suitable for this purpose, in particular polymers comprising a reactive resin base. Such a coating can also protect the granules from mechanical abrasion.

[0032] According to some preferred embodiments, variants, or refinements of embodiments, the granulate block consists (entirely or at least largely or to more than 75%) of aluminum, ceramic, or graphite. The granulate block preferably consists of a material that possesses good thermal conductivity and corrosion resistance. In some embodiments of the invention, it is conceivable to use aluminum alloys, for example, an aluminum-copper alloy. The granulate block may also contain copper or nickel-plated copper, for example, consisting entirely of copper or nickel-plated copper.

[0033] According to some preferred embodiments, variants, or refinements of embodiments, the base body comprises a thermally conductive insert that is in direct contact with the granulate block and with which the base body can be attached to or mounted on the processor assembly. To save costs, it is conceivable to manufacture the base body from plastic and to use an insert with higher thermal conductivity (for example, made of aluminum, copper, nickel-plated copper, ceramic, or graphite) only at the contact points with the processor assembly. The thermally conductive insert can be integrated into a housing part of the base body or seamlessly integrated with a housing part of the base body. P60012-WO 02.12.2025

[0034] -9-

[0035] According to some preferred embodiments, variants or refinements of embodiments, the thermally conductive insert is a metal membrane, for example made of aluminum or an aluminum alloy, or consists of ceramic or carbon nanotubes (CNTs).

[0036] According to some preferred embodiments, variants, or refinements of embodiments, the thermally conductive insert has one or more deflection structures that serve to optimally distribute the cooling medium through the granule block and / or block the direct path from the inlet to the outlet for the cooling medium. These additional structures thus force the flow of the cooling medium to undergo one or more changes of direction within the heat exchange volume. The coolant therefore remains in the granule block for a longer period, and heat dissipation is increased. The deflection structures can be formed or arranged as a groove or depression on the base body (before the granule block is applied) or on the granule block itself. The deflection structures can be manufactured with various shapes, e.g., shapes that have a concavity (e.g., horseshoe shapes), particularly with the opening facing the inlet, or with a meandering shape.

[0037] According to some preferred embodiments, variants, or refinements of embodiments, the cooling medium is a liquid with high thermal conductivity, for example, a mixture of water and a dialcohol, preferably glycol. Furthermore, such a coolant provides corrosion protection.

[0038] According to a second aspect, the present invention provides a method for manufacturing a heat sink for cooling a processor assembly, such as the heat sink of the first aspect of the invention. The method comprises at least the following steps: coating a metallic granulate with an electrically insulating material; pressing the coated metallic granulate into a granulate block with a predetermined geometry; producing (in particular by milling) a base body of the heat sink, wherein an inlet and an outlet for a cooling medium and a heat exchange volume are formed such that the pressed-in granulate block can be inserted into the heat exchange volume; and

[0039] Introducing the coated granulate block into the heat exchange volume.

[0040] Further advantageous variants, options, embodiments, and modifications will become apparent from the following figures, the detailed description, and the claims. It is understood, however, that while the detailed description and specific examples represent preferred embodiments of the invention, they are provided for illustrative purposes only, as various changes and modifications within the scope of the invention are obvious to the person skilled in the art.

[0041] Brief description of the characters

[0042] Individual embodiments of the present disclosure will be explained in detail with reference to the following figures. The components in the drawings are not necessarily to scale, but serve to illustrate the principles of the present invention. Parts in the various figures that correspond to the same elements or process steps have been provided with the same reference numerals in the figures. The numbering of process steps initially serves only to distinguish them and does not necessarily imply a corresponding sequence; however, it is one option to carry out the steps in the order of their numbering. Several steps can also be carried out overlapping or simultaneously. The figures show:

[0043] Fig. 1 shows a schematic representation of a heat sink according to an embodiment of the first aspect of the present invention;

[0044] Fig. 2 is a side view of the inside of the base body of a heat sink according to an embodiment of the first aspect of the present invention; Fig. 3 is a schematic longitudinal section of the heat exchange volume of the base body according to an embodiment of the first aspect of the present invention; Fig. 4 is a schematic longitudinal section of the heat exchange volume with a granulate block and deflection structures according to an embodiment of the first aspect of the present invention;

[0045] Fig. 5 shows a schematic representation of a base body according to two embodiments of the first aspect of the present invention;

[0046] Fig. 6 is a schematic flowchart illustrating a method for manufacturing a heat sink according to an embodiment of the second aspect of the present invention. Detailed description of the figures

[0047] Fig. 1 shows a schematic representation of a heat sink 10 for cooling a processor unit 4 according to an embodiment of the first aspect of the present invention. Fig. 1 shows an external view of a heat sink 10 according to the invention. The heat sink 10 comprises a base body 20, which is formed from two pluggable housing parts 5a and 5b that can be assembled and disassembled.

[0048] In Fig. 1, the housing parts 5a and 5b are made of a metal (for example, aluminum or an aluminum alloy) and are, for example, screwed together. The housing part 5b facing (or to be facing) the processor unit 4 is designed such that it offers the largest possible contact area with the processor unit 4 to be cooled. In other embodiments of the invention, the housing parts 5a and 5b can be made of a ceramic or a plastic, or of a composite material of ceramic and / or plastic and / or metal.

[0049] The housing parts 5a and 5b can be made of different materials or even partially of different materials. In some embodiments of the invention, the housing part 5b comprises a thermally conductive insert 5c (see Figure 5) consisting of a metal membrane, or a thermally conductive insert 5c is seamlessly integrated or built into the housing part 5b. Preferably, the thermally conductive insert 5c is arranged directly opposite the processor unit 4 to be cooled in order to ensure optimal heat transfer. It can be particularly advantageous if the housing parts 5a and 5b of the base body 20 are made of a material with less good thermal conductivity than the thermally conductive insert 5c. For example, the housing parts 5a and 5b can be made of a plastic. The thermally conductive insert 5c can, for example, be made of copper or nickel-plated copper.

[0050] To dissipate heat from the processor unit 4, a cooling medium 9 (see Fig. 4) flows through the heat sink 10. In the configuration shown in Fig. 1

[0051] In this embodiment of the invention, the cooling medium 9 is supplied via a liquid supply line 6, introduced into the cooling element 10 through an inlet 1 of the base body 20, and discharged from the cooling element through an outlet 3. A liquid drain 7 carries the cooling medium 9 away. The cooling element 10 is designed such that, apart from the inlet 1 and the outlet 3, it is fluid-tight in the assembled (here: screwed together) state, at least for the cooling medium used.

[0052] The liquid inlet 6 and the liquid outlet 7 can be part of a closed liquid circuit. In this case, the cooling medium 9 is cooled (i.e., the cooling medium 9 is brought into contact with other bodies that have a lower temperature) and returned to the heat sink via the liquid inlet 6. To achieve better cooling of the cooling medium 9, the cooling medium 9 is a cooling fluid with high thermal conductivity, for example, consisting of water mixed with a glycol content of at least 20%, preferably 30%.

[0053] Fig. 2 shows a side view of the inside of the base body 20 of the heat sink 10 according to an embodiment of the first aspect of the present invention, for example according to Fig. 1.

[0054] Figure 2 shows the inlet 1 and the outlet 3, which are designed to guide the cooling medium 9 into and out of the base body 20. Figure 2 also shows a heat exchange volume 2. The heat exchange volume 2 is to be understood as a cavity or chamber within the base body 20. Preferably, at least one of the housing parts 5a, 5b has a recess. The base body 20 is designed such that the inlet 1, the outlet 3, and the heat exchange volume 2 are fluidly connected to one another. Figure 2 shows the inlet 1 and the outlet 3 only schematically. In some embodiments of the invention, the inlet 1 and / or the outlet 3 extend into the heat exchange volume 2.

[0055] Fig. 2 shows a possible geometry of the base body 20, in which the base body 20 tapers in the vertical direction. Such a geometry can achieve optimal pressure of the cooling medium 9 in the base body 20 and / or increased deceleration of the cooling medium 9 in the base body 20. Other shapes of the base body 20 are also conceivable.

[0056] Fig. 3 shows a schematic longitudinal section of the heat exchange volume of the base body 20 according to a

[0057] Embodiment of the first aspect of the present invention. Figure 3 shows the heat exchange volume 2, which is surrounded (or sandwiched between) the housing parts 5a and 5b. As already explained above with reference to Figure 1, the housing part 5b can, in particular, be made of metal or at least of a metal membrane, for example of aluminum or an aluminum alloy. Additionally, the housing part 5b can be coated or impregnated on its outer surface with a thermal paste 11.

[0058] The heat exchange volume 2 defines a receiving volume filled with a granule block 8, as shown in Fig. 3. This granule block 8 consists of metallic granules (e.g., aluminum granules, in particular fine-grained round aluminum granules, or copper granules, or carbon nanogranules) that are densely packed in the heat exchange volume 2. The granules can be arranged with a predetermined structure or stochastically dispersed. In preferred embodiments of the invention, the granule block 8 is coated or mixed with an electrically insulating material. This coating is preferably applied homogeneously over the entire volume of the granule block 8, so that the electrically insulating material is applied to as many granules as possible. In some preferred embodiments of the invention, the granules are first mixed with the electrically insulating material and then pressed into the granule block 8.The coating of the granule block 8 serves to ensure galvanic isolation, which provides protection against galvanic corrosion.

[0059] The electrically insulating material is preferably a polymer containing a reactive resin. The electrically insulating material also serves to maintain the shape of the granule block 8, preventing the granules from being washed away by the cooling medium 9, and / or as abrasion protection.

[0060] According to the invention, the granulate block 8 provides interstitial spaces between the metallic granules, forming a network of microchannels. The cooling medium 9 can flow through these microchannels. The paths or channels are created by the distribution of the granules; that is, no intricate, meandering fluid paths need to be created, but rather these arise spontaneously from the granulate block 8.

[0061] The heat sink 10 according to the invention thus has an internal structure through which the cooling medium 9 can meander optimally in order to absorb and dissipate as much heat as possible from the adjacent processor unit 4 (when using the heat sink 10).

[0062] In this way, the cooling medium 9 will remain in the cooling body 10 for a significantly longer time than with conventional, pre-formed channels, which contributes to an increase in the surface area active for heat transfer and to higher heat recovery compared to the state of the art.

[0063] Fig. 4 shows a schematic longitudinal section of the heat exchange volume 2 with a granulate block 8 and a deflection structure 12 according to an embodiment of the first aspect of the present invention.

[0064] The deflection structure 12 serves to improve the distribution of the cooling medium 9 through the metallic granule block 8. The deflection structure 12 is designed to force the flow of the cooling medium 9 to make additional turns. This results in the coolant remaining in the granule block 8 for a longer period and thus increases heat dissipation. The deflection structure 12 can be formed on the base body 10 (before the granule block 8 is applied, e.g., on the inside of at least one of the housing parts 5a, 5b) or in the granule block 8 as a groove or recess. P60012-WO 02.12.2025

[0065] -17-

[0066] The deflection structure 12 preferably has concave shapes, such as a horseshoe or a parabola (as in Fig.

[0067] 4 illustrated embodiment), with the opening oriented towards the inlet 1.

[0068] Fig. 5 shows a schematic representation of a base body 20 according to two embodiments of the first aspect of the present invention.

[0069] A first embodiment (top drawing in Fig. 5) shows a base body 20 in which the granulate block 8 lies directly on a processor assembly 4 (for example, a chip package). This variant of the invention offers optimal heat transfer to the cooling medium 9. In this variant, various seals 14 are provided to prevent leakage of the cooling medium 9 in the area of ​​the chip.

[0070] In another embodiment of the invention (lower drawing in Fig. 5), the granule block 8 is in contact with a thermally conductive insert 5c, which consists of a material with high thermal conductivity (for example, a metal membrane or a metal element made of aluminum, copper, or nickel-plated copper). The thermally conductive insert 5c is integrated into the housing part 5b or seamlessly connected to the housing part 5b. Preferably, the thermally conductive insert 5c is arranged directly opposite the processor unit 4 to be cooled in order to ensure optimal heat transfer.

[0071] Housing parts 5a and 5b can be made of temperature- and pressure-resistant materials. In some cases

[0072] In embodiments of the first variant, the housing parts 5a and 5b are made of a heat-insulating material. This reduces manufacturing costs and simultaneously minimizes heat loss to the environment. In the second variant, the housing material must be a highly conductive material, at least in the area of ​​the chip (usually aluminum for cost reasons, but copper, nickel-plated copper, and ceramic are also conceivable).

[0073] The two variants shown in Fig. 5 feature an expansion block 13, which can be made of an elastomeric material. The expansion block 13 is designed to hold the granule block 8 on the heat-transferring surface (on the processor unit 4 – on the chip package – or on the thermally conductive insert 5c). This is advantageous because thermal expansion can generate forces that could push the granule block 8 away from the heat-transferring surface. The expansion block 13 can also seal the granule block 8, preventing any fluid from bypassing the heat sink and forcing it to flow through the microchannels of the granule block 8.

[0074] Fig. 6 shows a schematic flowchart illustrating a method according to an embodiment of the second aspect of the present invention, namely a method for manufacturing a heat sink for cooling a processor assembly. The method according to Fig. 5 is particularly feasible with respect to the heat sink 10 of the first aspect of the invention (as explained in Figs. 1 to 5) and can therefore be adapted according to all the options or variants described with respect to the heat sink 10 according to the invention, and vice versa.

[0075] In step S1, a metallic granulate is coated or mixed with an electrically insulating material (such as a polymer), as explained above with reference to Fig. 3. The coating is preferably carried out such that the granulate particles are impregnated with the electrically insulating material as much as possible.

[0076] In step S2, the coated metallic granules are pressed into a granule block 8 with a predetermined geometry.

[0077] The granulate block 8 is therefore usually manufactured in advance using pressing tools. For this purpose, a fine-grained metallic granulate (e.g., round aluminum granulate) is mixed or blended with a polymer binder (usually reactive resins) and pressed into shape. After curing, a porous, liquid-permeable granulate block 8 is formed.

[0078] In step S3, a base body of the cooling element is produced (for example, milled in one or more parts), whereby an inlet and an outlet for a cooling medium 9 as well as a heat exchange volume 2 are formed in the base body 10 in such a way that the pressed-in granulate block 8 can be inserted into the heat exchange volume 2.

[0079] In an optional step S35, one or more deflection structures 12 are formed on the base body 20 or on the granule block 8 as a groove or a depression, as explained above with reference to Fig. 4.

[0080] In step S4, the coated granulate block 8 is introduced into the heat exchange volume 2.

[0081] The foregoing description of the disclosed

[0082] The embodiments described herein contain only examples of possible implementations, which are provided to enable a person skilled in the art to manufacture or use the present invention. Various variations and modifications of these embodiments are readily apparent to a person skilled in the art, having knowledge of the present invention, and the general principles defined herein can be applied to other embodiments without departing from the scope of this disclosure.

[0083] Therefore, the present invention is not to be limited to the specific embodiments shown herein, but is to be granted the broadest scope that is compatible with the principles and features disclosed herein.

[0084] matches. Reference numeral list

[0085] 1 entrance

[0086] 2 Heat exchange volume

[0087] 3 Outlets

[0088] 4 Processor unit

[0089] 5a Housing part

[0090] 5b Housing part

[0091] 5c Thermally conductive insert 6 Liquid supply

[0092] 7. Fluid drainage

[0093] 8 granule blocks

[0094] 9 Cooling medium

[0095] 10 heat sinks

[0096] 11 Thermal paste

[0097] 12 distraction structures

[0098] 13 Expansion block

[0099] 14 seals

[0100] 20 basic shapes

[0101] S1... S35

[0102] Procedural steps

Claims

Patent claims 1. Heat sink ( 10 ) for cooling a processor assembly ( 4 ), comprising: a base body ( 20 ) which can be attached to the processor assembly (4 ), which has an inlet (1) and an outlet (2) for a cooling medium (9) as well as a heat exchange volume (2 ) and which is designed such that the cooling medium (9) enters the heat exchange volume (2) through the inlet (1) and leaves the base body (20) through the outlet (3 ), wherein in the heat exchange volume ( 2 ) a granule block (8) coated with an electrically insulating material is provided, which is designed to absorb the heat from the processor unit (4) and to conduct it away from the heat sink ( 10) by means of the cooling medium ( 9) flowing through the granule block ( 8 ).

2. Heat sink ( 10 ) according to claim 1, wherein the base body ( 20 ) consists of metal and / or plastic and / or ceramic.

3. Heat sink ( 10 ) according to one of claims 1 or 2, wherein the inlet s ( 1 ) and the outlet s ( 3 ) are arranged on opposite sides of the heat sink ( 10 ).

4. Heat sink ( 10 ) according to one of claims 1 to 3, wherein the electrically insulating material is a polymer, in particular comprising a reactive resin.

5. Cooling element ( 10 ) according to one of claims 1 to 4, wherein the granulate block ( 8 ) is made of aluminium.

6. Heat sink ( 10 ) according to one of claims 1 to 5, wherein the base body (20) comprises a thermally conductive insert (5c) which is in direct contact with the granulate block (8) and with which the base body (10) can be attached to the processor assembly (4).

7. Heat sink ( 10 ) according to claim 6, wherein the thermally conductive insert (5c) is a metal membrane or consists of ceramic or carbon nanotubes.

8. Cooling element ( 10 ) according to one of claims 6 or 7, wherein the thermally conductive insert (5c) has one or more deflection structures (12) which serve to optimally distribute the cooling medium (9) through the granule block (8).

9. Cooling element ( 10 ) according to any one of claims 1 to 8, wherein the cooling medium (9) is a liquid with high thermal conductivity.

10. Method for manufacturing a heat sink ( 10 ) for cooling a processor assembly (4), comprising at least the steps: Coating (S1) a granulate with an electrically insulating material; Pressing (S2) the coated granules into a granule block (8) with a predetermined geometry; Producing (S3) a base body (20) of the cooling body (10), wherein an inlet (1) and an outlet (2) for a cooling medium (9) and a heat exchange volume (2) are formed such that the pressed-in granulate block (8) can be introduced into the heat exchange volume (2); and Insertion (S4) of the coated granulate block (8) into the heat exchange volume (2).

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