Heat dissipation structure and electronic device including same

Abstract

An electronic device according to one embodiment of the present disclosure may comprise: a housing; a printed circuit board disposed in the housing; a processor disposed on the printed circuit board; a shield can disposed so as to surround the processor and having a first hole formed on the upper side thereof; a shielding layer disposed on the upper surface of the shield can and having a second hole corresponding to the first hole of the shield can; a metal sheet disposed on the upper surface of the shielding layer and having fine holes formed in a region corresponding to the first hole of the shield can; a heat dissipation material layer disposed so as to be in contact with the upper surface of the metal sheet and the upper surface of the processor; and a vapor chamber disposed on one surface of the heat dissipation material layer and disposed so as to be in contact with the housing. Various other embodiments may be possible.

Description

Heat dissipation structure and electronic device including the same

[0001] Embodiments of the present disclosure relate to a heat dissipation structure, a printed circuit board assembly (PBA) including the heat dissipation structure, and an electronic device including the heat dissipation structure.

[0002] An electronic device may refer to a device that performs a designated function according to an installed program, such as an electronic product, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop / laptop computer, or a vehicle navigation system. The electronic device may include a processor (e.g., application processor (AP), central processing unit (CPU)), memory (e.g., DRAM), and a printed circuit board (PCB) on which electronic components and peripheral circuits are arranged.

[0003] The electronic device may include shielding components (e.g., shielding members) for shielding noise (e.g., electromagnetic waves) generated in the processor, memory, and electronic components. The electronic device may include a heat dissipation structure for dissipating heat generated in the processor, memory, and electronic components. For example, the heat dissipation structure may include a heat dissipation material (e.g., thermal interface material (TIM)), a shielding film, and a heat diffusion sheet (e.g., a heat diffusion plate).

[0004] The contents described above are provided for the sake of background information to aid in understanding the embodiments of the present disclosure. It has not been determined, nor is any claim made, whether any of the above contents may be applied as prior art in relation to the present disclosure.

[0005] To shield noise (e.g., electromagnetic waves) generated from components of an electronic device, a metal frame (e.g., a metal plate) and a shield can surrounding the processor, memory, and electronic components may be applied. To dissipate heat generated from the processor, memory, and electronic components of the electronic device, a heat dissipation structure (e.g., a thermal interface material (TIM), a shielding film, and a heat diffusion sheet) may be included.

[0006] Electronic devices utilize processors, memory, and electronic components with high power consumption per unit area (e.g., power density). Since these high-power-consumption processors, memory, and electronic components are placed on a printed circuit board (PCB) with a limited surface area, heat can be generated within the electronic device. As the heat generated by the electronic device increases, the performance of the processor, memory, and electronic components may degrade, and their lifespan may be reduced. Furthermore, the elevated heat causes the temperature of the external surface of the electronic device to rise, which can cause discomfort to the user.

[0007] Generally, alumina (Al2O3), used as a material for heat dissipation structures, can be utilized as a non-conductive filler and as a thermal interface material (TIM) for processors (e.g., application processors). As the power generated by processors (e.g., application processors) continuously increases, a thermal interface material capable of efficient heat dissipation must be applied to effectively remove the high heat generated by the processor.

[0008] A heat dissipation structure applied for heat dissipation of a processor (e.g., application processor) may include a first heat dissipation material (TIM 1) in contact with the processor, a shielding film surrounding the periphery of the first heat dissipation material (TIM 1), a heat diffusion sheet (e.g., a copper sheet) disposed on top of the first heat dissipation material (TIM 1), and a second heat dissipation material (TIM 2) disposed on top of the heat diffusion sheet. The second heat dissipation material (TIM 2) may be disposed at the bottom of a vapor chamber.

[0009] In order to implement a heat dissipation structure for a processor (e.g., an application processor), electromagnetic shielding must also be considered, so an adhesive layer with electrical conductivity is required between the first heat dissipation material (TIM 1) and the thermal diffusion sheet (e.g., a copper sheet). As a result, a first interface thermal resistance occurs between the first heat dissipation material (TIM 1) and the adhesive layer, and a second interface thermal resistance may occur between the adhesive layer and the thermal diffusion sheet (e.g., a copper sheet). Additionally, a third interface thermal resistance may occur between the thermal diffusion sheet (e.g., a copper sheet) and the second heat dissipation material (TIM 2). Due to these interface thermal resistances, the heat dissipation efficiency of the heat generated by the processor (e.g., an application processor) may be reduced. Since the heat dissipation of the processor (e.g., an application processor) is not smooth, the performance of the electronic device may be degraded.

[0010] Embodiments of the present disclosure may provide a printed circuit board assembly comprising a heat dissipation structure capable of efficiently dissipating heat generated from a heat-generating component (e.g., processor, memory), and an electronic device comprising the printed circuit board assembly.

[0011] Embodiments of the present disclosure may provide a printed circuit board assembly comprising a heat dissipation structure capable of delaying the dynamic thermal management (DTM) point at which the performance limit of the electronic device is reached and lowering the temperature of the processor (application processor, GPU), and an electronic device comprising the printed circuit board assembly.

[0012] Embodiments of the present disclosure may provide a printed circuit board assembly comprising a structure capable of extending the high performance maintenance time of an electronic device, and an electronic device comprising the printed circuit board assembly.

[0013] The technical problems intended to be solved in this document are not limited to those mentioned above and may be extended in various ways without departing from the spirit and scope of this disclosure. Other technical problems not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0014] An electronic device according to one embodiment of the present disclosure may include a housing, a printed circuit board disposed within the housing, a processor disposed on the printed circuit board, a shield can disposed to surround the processor and having a first hole formed on its upper side, a shielding layer disposed on the upper surface of the shield can and having a second hole formed corresponding to the first hole of the shield can, a metal sheet disposed on the upper surface of the shielding layer and having micro-holes formed in an area corresponding to the first hole of the shield can, a heat dissipation material layer disposed to be in contact with the upper surface of the metal sheet and the upper surface of the processor, and a vapor chamber disposed on one surface of the heat dissipation material layer and disposed to be in contact with the housing.

[0015] A heat dissipation structure according to one embodiment of the present disclosure may include a metal sheet disposed on the upper surface of a shielding layer of an electronic device and having micro-holes formed in an area corresponding to a first hole of a shield can of the electronic device, and a heat dissipation material layer disposed to be in contact with the upper surface of the metal sheet and the upper surface of a processor of the electronic device.

[0016] A printed circuit board assembly including the heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can efficiently dissipate heat generated from heat-generating components (e.g., processor, memory).

[0017] A printed circuit board assembly including the heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly can delay the dynamic thermal management (DTM) point in time when the electronic device reaches the maximum temperature at which performance limitation is performed, and lower the temperature of the processor (application processor, GPU).

[0018] A heat dissipation structure according to an embodiment of the present disclosure can reduce internal interfacial thermal resistance.

[0019] A printed circuit board assembly including a heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can increase the high performance maintenance time of the electronic device.

[0020] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0021] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0022] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0023] FIGS. 2a and 2b are drawings of a first state (e.g., unfolded state, unfolded stage) of an electronic device according to one embodiment of the present disclosure, viewed from the front and rear.

[0024] FIGS. 2c and 2d are drawings of a second state (e.g., folded state) of an electronic device according to one embodiment of the present disclosure, viewed from the front and rear.

[0025] FIG. 3a is a perspective view of a first surface (e.g., front) of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 3b is a perspective view of a second side (e.g., rear) of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 4a is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure.

[0028] FIG. 4b is a drawing showing various embodiments of microholes formed in a metal sheet (e.g., a copper sheet).

[0029] Figure 5 is a diagram showing the formation of a heat dissipation structure using a phase change heat dissipation material.

[0030] Figure 6 is a diagram showing the formation of a heat dissipation structure using a liquid heat dissipation material.

[0031] Figure 7 is a drawing showing the formation of micro-holes in a metal sheet (e.g., a copper sheet).

[0032] Figure 8 is a drawing showing that micro-holes are evenly formed on the front surface of a metal sheet (e.g., a copper sheet).

[0033] Figure 9 is a diagram showing the heat generation performance according to the area of ​​microholes formed in a metal sheet (e.g., a copper sheet).

[0034] FIG. 10 is a diagram showing micro-holes arranged in an alternating pattern to prevent tearing of a metal sheet (e.g., a copper sheet).

[0035] FIG. 11 is a drawing showing a heat dissipation structure formed using heat dissipation materials having the same physical properties.

[0036] FIG. 12 is a drawing showing a heat dissipation structure formed using heat dissipation materials having different physical properties.

[0037] FIG. 13 is a diagram showing heat dissipation particles forming a heat transfer path of a heat dissipation structure.

[0038] It should be noted that throughout the drawings, the same reference number is used to describe the same or similar elements, features, and structures.

[0039] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0040] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to enable a clear and consistent understanding of this document. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only and is not intended to limit this document as defined by the appended claims and their equivalents.

[0041] The singular form should be understood to include plural referents unless the context clearly indicates otherwise. Thus, for example, a reference to "component surfaces" may include a reference to one or more of such surfaces.

[0042] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0043] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0044] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0045] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0046] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0047] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0048] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0049] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0050] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0051] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0052] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0053] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0054] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0056] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0057] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0058] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0060] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0061] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0062] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0063] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0064] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0065] An electronic device according to one embodiment disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0066] The embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0067] As used in one embodiment of the present disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0068] One embodiment of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0069] According to one embodiment, the method according to one embodiment disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0070] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0071] According to one embodiment, the display module (160) may include a flexible display configured to be foldable or unfoldable.

[0072] According to one embodiment, the display module (160) may include a flexible display that is positioned to be slidable in a first direction (e.g., in the x-axis direction) or slidable in a second direction (e.g., in the y-axis direction) to provide a screen (e.g., a display screen).

[0073] According to one embodiment, the display module (160) may be referred to as a variable display (e.g., a stretchable display), an expandable display, or a slide-in / out display.

[0074] According to one embodiment, the display module (160) may include a bar-type or plate-type display.

[0075] According to one embodiment, the processor (120), memory (130), and electronic components of the electronic device (101) of FIG. 1 may be placed on a printed circuit board (PCB) or a printed circuit board assembly (PBA).

[0076] According to one embodiment, the electronic device (101) of FIG. 1 may include a printed circuit board assembly (e.g., printed circuit board assembly (400) of FIG. 4a) having a heat dissipation structure (e.g., heat dissipation structure (401) of FIG. 4a) for dissipating heat generated from a processor (120), a memory (130), and electronic components.

[0077] FIGS. 2a and 2b are drawings of a first state (e.g., unfolded stage) of an electronic device according to one embodiment of the present disclosure, viewed from the front and rear. FIGS. 2c and 2d are drawings of a second state (e.g., folded state) of an electronic device according to one embodiment of the present disclosure, viewed from the front and rear.

[0078] Referring to FIGS. 2a through 2d, an electronic device (200) (e.g., electronic device (101) of FIG. 1) according to one embodiment of the present disclosure may include a pair of housings (210, 220) (e.g., foldable housing structure) that are rotatably coupled about a folding axis (F) through at least one hinge device (e.g., hinge module or hinge structure) so as to be foldable relative to each other, a first display (230) (e.g., flexible display, foldable display or main display) disposed through the pair of housings (210, 220), and / or a second display (235) (e.g., sub-display) disposed through the second housing (220).

[0079] According to one embodiment, at least a portion of at least one hinge device is positioned so as not to be seen from the outside through a first housing (210) and a second housing (220), and in a first state (e.g., unfolded state), it may be positioned so as not to be seen from the outside through a hinge housing (290) (e.g., hinge cover) that covers a foldable portion. In this document, the surface on which the first display (230) is positioned may be defined as the front of the electronic device (200). In this document, the opposite side of the front may be defined as the rear of the electronic device (200). Additionally, the surface surrounding the space between the front and the rear may be defined as the side of the electronic device (200).

[0080] According to one embodiment, a pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other through at least one hinge device.

[0081] According to one embodiment, a pair of housings (210, 220) are not limited to the shapes and combinations shown in FIGS. 2a to 2d and may be implemented by other shapes or combinations and / or combinations of parts.

[0082] According to one embodiment, the first housing (210) and the second housing (220) are positioned on both sides with respect to the folding axis (F), have a shape that is symmetrical overall with respect to the folding axis (F), and can be folded to match each other.

[0083] According to one embodiment, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (F).

[0084] According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may differ depending on whether the electronic device (200) is in a first state (e.g., unfolded stage), a second state (e.g., folded state), or a third state (e.g., intermediate state). For example, the electronic device (200) can sense whether it is in a first state (e.g., unfolded stage), a second state (e.g., folded state), or a third state (e.g., intermediate state) using a sensor module (e.g., sensor module (176) of FIG. 1). The electronic device (200) can sense the angle between the first housing (210) and the second housing (220) using a sensor module (e.g., sensor module (176) of FIG. 1).

[0085] According to one embodiment, the first housing (210) may be connected to at least one hinge device in a first state (e.g., unfolded state) of the electronic device (200). The first housing (210) may include a first surface (211) positioned to face the front of the electronic device (200), a second surface (212) facing in the opposite direction of the first surface (211), and / or a first side member (213) surrounding at least a portion of a first space (2101) between the first surface (211) and the second surface (212).

[0086] According to one embodiment, the second housing (220) may be connected to at least one hinge device in a first state (e.g., unfolded state) of the electronic device (200). The second housing (220) may include a third surface (221) positioned to face the front of the electronic device (200), a fourth surface (222) facing in the opposite direction of the third surface (221), and / or a second side member (223) surrounding at least a portion of a second space (2201) between the third surface (221) and the fourth surface (222).

[0087] According to one embodiment, the first surface (211) may face substantially the same direction as the third surface (221) in a first state (e.g., unfolded state) and may at least partially face the third surface (221) in a second state (e.g., folded state).

[0088] According to one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through the structural combination of a first housing (210) and a second housing (220).

[0089] According to one embodiment, the recess (201) may have substantially the same size as the first display (230).

[0090] According to one embodiment, the first housing (210) may be combined with a first side member (213) when the first display (230) is viewed from above. The first housing (210) may include a first protective frame (213a) (e.g., a first decorative member) that covers the edge of the first display (230) so that it is not visible from the outside by being positioned overlapping the edge of the first display (230).

[0091] According to one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).

[0092] According to one embodiment, the second housing (220) may be combined with a second side member (223) when the first display (230) is viewed from above. The second housing (220) may include a second protective frame (223a) that covers the edge of the first display (230) so that it is not visible from the outside by being positioned overlapping the edge of the first display (230).

[0093] According to one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). In one embodiment, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0094] According to one embodiment, a hinge housing (290) (e.g., a hinge cover) may be positioned between a first housing (210) and a second housing (220). The hinge housing (290) may be positioned to cover a part of at least one hinge device (e.g., at least one hinge module).

[0095] According to one embodiment, the hinge housing (290) may be covered by a portion of the first housing (210) and the second housing (220) or visually exposed to the outside, depending on the first state (e.g., unfolded state), the second state (e.g., folded state), or the third state (e.g., intermediate state) of the electronic device (200). For example, when the electronic device (200) is in the first state (e.g., unfolded state), at least a portion of the hinge housing (290) may be covered by the first housing (210) and the second housing (220) and positioned so that it is substantially not visible from the outside.

[0096] According to one embodiment, when the electronic device (200) is in a second state (folded state), at least a portion of the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so as to be visible from the outside.

[0097] According to one embodiment, when the first housing (210) and the second housing (220) are in a third state (intermediate state) that is folded with a certain angle, the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so that it is at least partially visible from the outside to the outside of the electronic device (200). For example, the area of ​​the hinge housing (290) exposed to the outside may be smaller than in a fully folded state. According to one embodiment, the hinge housing (290) may include a curved surface.

[0098] According to one embodiment, when the electronic device (200) is in a first state (e.g., unfolded state), the first housing (210) and the second housing (220) are at an angle of about 180 degrees, and the first area (230a), the second area (230b), and the folding area (230c) of the first display (230) may be substantially in the same plane. The first area (230a), the second area (230b), and the folding area (230c) of the first display (230) may be arranged to face substantially the same direction (e.g., z-axis direction). In one embodiment, when the electronic device (200) is in a first state (e.g., unfolded state), the first housing (210) may be rotated at an angle of about 360 degrees relative to the second housing (220) and folded in the opposite direction so that the second surface (212) and the fourth surface (222) face each other (e.g., out-folding method).

[0099] According to one embodiment, when the electronic device (200) is in a second state (folded state), the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) may be positioned to face each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may be positioned to face each other through the folding region (230c), forming a narrow angle (e.g., a range of 0 degrees to about 10 degrees) from each other. According to one embodiment, the folding region (230c) may be deformed into a curved shape having at least a portion of a predetermined curvature.

[0100] According to one embodiment, when the electronic device (200) is in a third state (intermediate state), the first housing (210) and the second housing (220) may be positioned at a certain angle relative to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the second state (e.g., folded state) and smaller than the first state (e.g., unfolded state), and the curvature of the folding region (230c) may be smaller than in the second state (folded state) and larger than in the first state (e.g., unfolded state). In one embodiment, the first housing (210) and the second housing (220) may form an angle that can stop at a specified folding angle between the second state (e.g., folded state) and the third state (e.g., intermediate state) through at least one hinge device (e.g., free stop function). In one embodiment, the first housing (210) and the second housing (220) may be continuously operated while being pressed in an unfolding direction or a folding direction based on a specified inflection angle through at least one hinge device.

[0101] According to one embodiment, the electronic device (200) may include at least one display (230, 235), an input device (215), sound output devices (227, 228), sensor modules (217a, 217b, 226), camera modules (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In one embodiment, the electronic device (200) may omit at least one of the components or additionally include at least one other component.

[0102] According to one embodiment, at least one display (230, 235) may include a first display (230) (e.g., a flexible display) positioned to be supported by a third surface (221) of a second housing (220) through at least one hinge device from a first surface (211) of a first housing (210), and a second display (235) positioned to be visible from the outside at least partially through a fourth surface (222) in the internal space of the second housing (220).

[0103] In one embodiment, the second display (235) may be positioned so as to be visible from the outside through the second surface (212) in the internal space of the first housing (210).

[0104] According to one embodiment, the first display (230) may be primarily used in a first state (e.g., unfolded state) of the electronic device (200). The second display (235) may also be used in the first state (e.g., unfolded state) of the electronic device (200).

[0105] According to one embodiment, the second display (235) may be primarily used in a second state (e.g., a folded state) of the electronic device (200). The first display (230) may also be used in the second state (e.g., a folded state) of the electronic device (200).

[0106] According to one embodiment, the electronic device (200) can control the first display (230) and / or the second display (235) to be available based on the folding angle of the first housing (210) and the second housing (220) in the case of a third state (e.g., an intermediate state).

[0107] According to one embodiment, the first display (230) may be placed in a receiving space formed by a pair of housings (210, 220). For example, the first display (200) may be placed in a recess (201) formed by a pair of housings (210, 220) and may be placed to occupy substantially most of the front surface of the electronic device (200) in a first state (e.g., unfolded state). According to one embodiment, the first display (230) may include a flexible display in which at least some area can be deformed into a flat or curved surface.

[0108] According to one embodiment, the first display (230) may include a first area (230a) facing the first housing (210) and a second area (230b) facing the second housing (220). According to one embodiment, the first display (230) may include a folding area (230c) comprising a portion of the first area (230a) and a portion of the second area (230b) with respect to the folding axis (F).

[0109] According to one embodiment, at least a portion of the folding area (230c) may include an area corresponding to at least one hinge device.

[0110] According to one embodiment, the area division of the first display (230) is merely an exemplary physical division by a pair of housings (210, 220) and at least one hinge device, and substantially the first display (230) can be displayed as a single, seamless, full screen through the pair of housings (210, 220) and at least one hinge device.

[0111] According to one embodiment, the first region (230a) and the second region (230b) may have a shape that is symmetrical overall with respect to the folding region (230c) or a shape that is partially asymmetrical.

[0112] According to one embodiment, the electronic device (200) may include a first rear cover (240) disposed on a second side (212) of a first housing (210) and a second rear cover (250) disposed on a fourth side (222) of a second housing (220). In one embodiment, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In one embodiment, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223).

[0113] According to one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. According to one embodiment, the first rear cover (240) may be formed of an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials.

[0114] According to one embodiment, the second rear cover (250) may be formed through a substantially transparent plate, such as glass or a polymer, for example. Thus, the second display (235) may be positioned so as to be visible from the outside through the second rear cover (250) within the internal space of the second housing (220).

[0115] According to one embodiment, the input device (215) may include a microphone. In one embodiment, the input device (215) may include a plurality of microphones arranged to detect the direction of sound.

[0116] According to one embodiment, the acoustic output devices (227, 228) may include speakers. According to one embodiment, the acoustic output devices (227, 228) may include a call receiver (227) disposed through a fourth side (222) of the second housing (220) and an external speaker (228) disposed through at least a portion of a second side member (223) of the second housing (220).

[0117] In one embodiment, the input device (215), the acoustic output devices (227, 228), and the connector port (229) may be disposed in the spaces of the first housing (210) and / or the second housing (220). The input device (215), the acoustic output devices (227, 228), and the connector port (229) may be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In one embodiment, the holes formed in the first housing (210) and / or the second housing (220) may be used in common for the input device (215) and the acoustic output devices (227, 228). In one embodiment, the acoustic output devices (227, 228) may include a speaker (e.g., a piezo speaker) that is operated with the holes formed in the first housing (210) and / or the second housing (220) excluded.

[0118] According to one embodiment, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first surface (211) of a first housing (210), a second camera module (216b) disposed on a second surface (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth surface (222) of the second housing (220).

[0119] According to one embodiment, the electronic device (200) may include a flash (218) positioned near the second camera module (216b). According to one embodiment, the flash (218) may include, for example, a light-emitting diode or a xenon lamp.

[0120] According to one embodiment, camera modules (216a, 216b, 225) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, at least one camera module among the camera modules (216a, 216b, 225) may include two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be disposed together on either side of the first housing (210) and / or the second housing (220).

[0121] According to one embodiment, sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state.

[0122] According to one embodiment, sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) may include a first sensor module (217a) disposed on a first surface (211) of a first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220).

[0123] In one embodiment, sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) may include at least one of a gesture sensor, a gyroscope sensor, a grip sensor, a color sensor, an IR (infrared) sensor, an ambient light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a TOF (time of flight) sensor, a LiDAR (light detection and ranging) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an accelerometer, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor.

[0124] According to one embodiment, a processor of an electronic device (200) (e.g., processor (120) of FIG. 1) may operate sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) to sense the ambient light and / or IR intensity around the electronic device (200). The processor (120) may obtain information about the ambient light and information about the IR intensity around the electronic device (200).

[0125] According to one embodiment, the electronic device (200) may include at least one of an unillustrated gesture sensor, a gyroscope sensor, a grip sensor, a color sensor, an IR (infrared) sensor, an illuminance sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a TOF (time of flight) sensor, a LiDAR (light detection and ranging) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an accelerometer, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor.

[0126] In one embodiment, the fingerprint recognition sensor may be positioned through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0127] According to one embodiment, the key input device (219) may be positioned so as to be visually exposed to the outside through the first side member (213) of the first housing (210). In one embodiment, the key input device (219) may be positioned so as to be visually exposed to the outside through the second side member (223) of the second housing (220). In one embodiment, the electronic device (200) may not include some or all of the key input devices (219), and the key input device (219) that is not included may be implemented in another form, such as a soft key, on at least one display (230, 235). As one embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 235).

[0128] According to one embodiment, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In one embodiment, the connector port (229) may also perform the function of transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., an earphone jack hole) for performing the function of transmitting and receiving audio signals.

[0129] According to one embodiment, at least one camera module (216a, 225) among the camera modules (216a, 216b, 225), at least one sensor module (217a, 226) among the sensor modules (217a, 217b, 226), and / or an indicator may be positioned to be visually exposed through at least one display (230, 235). For example, at least one camera module (216a, 225), at least one sensor module (217a, 226), and / or an indicator may be positioned in the internal space of at least one housing (210, 220), below the display area of ​​at least one display (230, 235). At least one camera module (216a, 225), at least one sensor module (217a, 226) and / or an indicator may be positioned to come into contact with the external environment through an opening or transparent area perforated up to a cover member (e.g., a window layer (not shown) of the first display (230) and / or a second rear cover (250)).

[0130] According to one embodiment, the area where at least one display (230, 235) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of the area for displaying content.

[0131] According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area that overlaps with the effective area (e.g., field of view area) of at least one camera module (216a, 225) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (230, 235) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC). As one embodiment, some camera modules or sensor modules (217a, 226) may be positioned to perform their functions without being visually exposed through the display. For example, the area facing the camera module (216a, 225) and / or sensor module (217a, 226) placed below the display (230, 235) (e.g., display panel) may be an under-display camera (UDC) structure, and a perforated opening may not be necessary.

[0132] According to one embodiment, the processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and electronic components of the electronic device (200) of FIG. 2a and 2b may be placed on a printed circuit board (PCB) or a printed circuit board assembly (PBA) (e.g., printed circuit board assembly (400) of FIG. 4a).

[0133] According to one embodiment, the electronic device (200) of FIG. 2a and FIG. 2b may include a printed circuit board assembly (e.g., printed circuit board assembly (400) of FIG. 4a) having a heat dissipation structure (e.g., heat dissipation structure (401) of FIG. 4a) for dissipating heat generated from a processor (120), a memory (130), and electronic components.

[0134] FIG. 3a is a perspective view of a first surface (e.g., front) of an electronic device according to one embodiment of the present disclosure. FIG. 3b is a perspective view of a second surface (e.g., rear) of an electronic device according to one embodiment of the present disclosure.

[0135] Referring to FIGS. 3a and 3b, an electronic device (300) according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1) may include a first surface (or front) (310A), a second surface (or rear) (310B), and a housing (310). An electronic device (300) according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1) may include a display (301).

[0136] According to one embodiment, the display (301) may be supported by a housing (310). For example, the display (310) may include an LCD (liquid crystal display), an OLED (organic light emitting diodes) display, or a micro LED display.

[0137] According to one embodiment, the housing (310) may include a side (310C) that surrounds the space between the first surface (310A) and the second surface (310B). According to one embodiment, the housing (310) may refer to a structure that forms some of the first surface (310A), the second surface (310B), and the side (310C).

[0138] According to one embodiment, the first surface (310A) may be formed by a front plate (302) (e.g., a glass plate including various coating layers, or a polymer plate) in which at least a portion is substantially transparent.

[0139] According to one embodiment, the second surface (310B) may be formed by a substantially opaque back plate (311). The back plate (311) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. However, not limited thereto, the back plate (311) may be formed by transparent glass.

[0140] According to one embodiment, the side (310C) may be formed by a side bezel structure (318) (or "side member") comprising a metal and / or polymer, which is combined with the front plate (302) and the rear plate (311). According to one embodiment, the rear plate (311) and the side bezel structure (318) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0141] According to one embodiment, the front plate (302) may include two first regions (310D) that are curved and seamlessly extended from the first surface (310A) toward the rear plate (311). The two first regions (310D) may be positioned at both ends of the long edge of the front plate (302).

[0142] According to one embodiment, the rear plate (311) may include two second regions (310E) that are curved and seamlessly extended from the second surface (310B) toward the front plate (302).

[0143] According to one embodiment, the front plate (302) (or the rear plate (311)) may include only one of the first regions (310D) (or the second regions (310E)). According to one embodiment, some of the first regions (310D) or the second regions (310E) may not be included.

[0144] In embodiments, the side bezel structure (318) when viewed from the side of the electronic device (300) may have a first thickness (or width) on the side that does not include the first regions (310D) or the second regions (310E) as described above. In embodiments, the side bezel structure (318) when viewed from the side of the electronic device (300) may have a second thickness (or width) that is thinner than the first thickness on the side that includes the first regions (310D) or the second regions (310E).

[0145] According to one embodiment, the electronic device (300) may include at least one of a display (301), an audio input device (303) (e.g., input module (150) of FIG. 1, microphone), an audio output device (307, 314) (e.g., audio output module (155) of FIG. 1, speaker) (e.g., audio module), sensor modules (304, 319) (e.g., sensor module (176) of FIG. 1), camera module (305, 312) (e.g., camera module (180) of FIG. 1), a flash (313), a key input device (317), an indicator (not shown), and connectors (308, 309). According to one embodiment, the electronic device (300) may omit at least one of the components (e.g., key input device (317)) or additionally include other components.

[0146] According to one embodiment, the display (301) can be visually seen through the upper portion of the front plate (302).

[0147] According to one embodiment, at least a portion of the display (301) can be seen through a front plate (302) forming a first surface (310A) and a first region (310D) of a side (310C).

[0148] According to one embodiment, at least a portion of the sensor modules (304, 319) and / or at least a portion of the key input device (317) may be placed in the first area (310D) and / or the second area (310E).

[0149] According to one embodiment, at least one of a first sensor module (304), camera modules (305, 312) (e.g., image sensor), an audio output device (314) (e.g., audio module), and a fingerprint sensor may be included on the back surface of the screen display area of ​​the display (301).

[0150] According to one embodiment, at least a portion of the sensor modules (304, 319) and / or at least a portion of the key input device (317) may be placed in the first regions (310D) and / or the second regions (310E).

[0151] According to one embodiment, the acoustic input device (303) may include a microphone. According to one embodiment, the input device (303) may include a plurality of microphones arranged to detect the direction of sound.

[0152] According to one embodiment, the sound output device (307, 314) may include a sound output device (307) that operates as an external speaker and a sound output device (314) that operates as a receiver for calls.

[0153] In some embodiments, an acoustic input device (303) (e.g., a microphone), an acoustic output device (307, 314), and connectors (308, 309) may be placed in the internal space of the electronic device (300). The acoustic input device (303) (e.g., a microphone), the acoustic output device (307, 314), and the connectors (308, 309) may be exposed to the external environment through at least one hole formed in the housing (310). In some embodiments, the hole formed in the housing (310) may be used in common for the acoustic input device (303) (e.g., a microphone) and the acoustic output device (307, 314). In some embodiments, the acoustic output device (307, 314) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (310) excluded.

[0154] According to one embodiment, sensor modules (304, 319) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor modules (304, 319) may include a first sensor module (304) (e.g., proximity sensor) disposed on a first surface (310A) of the housing (310) and / or a second sensor module (319) (e.g., heart rate monitor (HRM) sensor) disposed on a second surface (310B) of the housing (310) and / or a third sensor module (not shown) (e.g., fingerprint sensor). For example, the fingerprint sensor may be disposed on the first surface (310A) (e.g., display (301)) and / or the second surface (310B) of the housing (310).

[0155] The electronic device (300) may further include at least one of an unillustrated gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0156] According to one embodiment, camera modules (305, 312) may include a first camera module (305) disposed on a first surface (310A) of the electronic device (300) and a second camera module (312) disposed on a second surface (310B). A flash (313) may be disposed around the camera modules (305, 312). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light-emitting diode or a xenon lamp.

[0157] According to one embodiment, the first camera module (305) may be placed on the lower part of the display panel of the display (301) in an under-display camera (UDC) manner. According to one embodiment, two or more lenses (wide-angle and telephoto lenses) and image sensors may be placed on one side of the electronic device (300). According to one embodiment, a plurality of first camera modules (305) may be placed in an under-display camera (UDC) manner on the first side of the electronic device (300) (e.g., the side where the screen is displayed).

[0158] According to one embodiment, a key input device (317) may be placed on the side (310C) of the housing (310). According to one embodiment, the electronic device (300) may not include some or all of the aforementioned key input devices (317), and the key input devices (317) that are not included may be implemented in other forms, such as soft keys, on the display (301). According to one embodiment, the key input device (317) may be implemented using a pressure sensor included in the display (301).

[0159] According to one embodiment, the connectors (308, 309) may include a first connector hole (308) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (309, or an earphone jack) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device. The first connector hole (308) may include a USB (universal serial bus) type A, USB type B, or USB type C port. If the first connector hole (308) supports USB type C, the electronic device (300, e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2a) may support USB PD (power delivery) charging.

[0160] According to one embodiment, some of the camera modules (305, 312), including the first camera module (305) and / or the first sensor module (304) among the sensor modules (304, 319), may be positioned to be visually visible through a display (301).

[0161] According to one embodiment, when the first camera module (305) is positioned in an under-display camera (UDC) manner, the first camera module (305) may not be visually visible to the outside.

[0162] According to one embodiment, the first camera module (305) may be positioned overlapping with the display area, and may also display a screen in the display area corresponding to the first camera module (305). The first sensor module (304) may be positioned to perform its function without being visually exposed through the front plate (302) in the internal space of the electronic device (300).

[0163] According to one embodiment, the processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and electronic components of the electronic device (300) of FIG. 3 may be placed on a printed circuit board (PCB) or a printed circuit board assembly (PBA) (e.g., printed circuit board assembly (400) of FIG. 4a).

[0164] According to one embodiment, the electronic device (300) of FIG. 3a and FIG. 3b may include a printed circuit board assembly (e.g., printed circuit board assembly (400) of FIG. 4a) having a heat dissipation structure (e.g., heat dissipation structure (401) of FIG. 4a) for dissipating heat generated from a processor (120), a memory (130), and electronic components.

[0165] FIG. 4a is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure.

[0166] Referring to FIG. 4a, an electronic device according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2a to 2d, and the electronic device (300) of FIG. 3a and 3b)

[0167] It may include a display (e.g., a display module (160) of FIG. 1, a first display (230, flexible display) of FIG. 2a, a display (301) of FIG. 3a), a support plate (e.g., a metal front) supporting the display, and a printed circuit board assembly (400).

[0168] According to one embodiment, the printed circuit board assembly (400) may include a heat dissipation structure (401) for dissipating heat generated from a processor (120), a memory (e.g., the memory (130) of FIG. 1), and electronic components.

[0169] According to one embodiment, a printed circuit board assembly (400) may include a printed circuit board (410, PCB), a processor (420) (e.g., an application processor), a shield can (430), an adhesive layer (440) (e.g., an adhesive film, an adhesive sheet), a heat dissipation structure (401), and a vapor chamber (480).

[0170] For example, a processor (420) may be placed on a printed circuit board (410, PCB). Not limited thereto, the printed circuit board (410, PCB) may have memory (e.g., memory (130) of FIG. 1) and electronic components placed on it. Memory and electronic components may be placed around the processor (420).

[0171] For example, a printed circuit board (410, PCB) and a processor (420) can be electrically connected through solder bumps (415). The printed circuit board (410, PCB) and memory and electronic components can be electrically connected through solder bumps (415).

[0172] For example, the memory (130) may include one or more of HBM (high bandwidth memory), DRAM (dynamic random access memory), SRAM (static random access memory), PRAM (phase-change random access memory), MRAM (magnetic random access memory), RRAM (resistive random access memory), flash memory, and / or EEPROM (electrically erasable programmable read-only memory).

[0173] For example, the processor (420) may include one or more of a main processor (e.g., the main processor of FIG. 1 (121, central processing unit or application processor), an auxiliary processor (e.g., the auxiliary processor of FIG. 1 (123, graphics processing unit, neural processing unit (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor), and / or a GPU (graphics processing unit).

[0174] According to one embodiment, the heat dissipation structure (401) can dissipate heat generated in the processor (120), memory, and electronic components.

[0175] For example, the heat dissipation structure (401) may be positioned to cover at least a portion of the upper part of the processor (420) to dissipate heat generated in the processor (420).

[0176] For example, the heat dissipation structure (401) may be positioned to cover at least a portion of the upper part of the shield can (430).

[0177] For example, the shield can (430) may include a first hole (432).

[0178] For example, the shielding layer (460) may include a second hole (462).

[0179] For example, at least a portion of the heat dissipation structure (401) may be positioned so that the lower part of the heat dissipation structure (401) comes into contact with the upper surface of the processor (420), by penetrating the first hole (432) formed in the shield can (430) and the second hole (462) formed in the shielding layer (460).

[0180] According to one embodiment, the heat dissipation structure (401) may include a heat dissipation material layer (450) and a metal sheet (470) (e.g., a copper sheet).

[0181] For example, the thermal interface material layer (450) may include a first thermal interface material layer (451) located relatively lower with respect to the metal sheet (470) and a second thermal interface material layer (452) located relatively higher.

[0182] For example, the metal sheet (470) may include a plurality of micro-holes (475). The first heat dissipation material layer (451) and the second heat dissipation material layer (452) may be connected to each other through the micro-holes (475) formed in the metal sheet (470).

[0183] For example, the first heat dissipation material layer (451) can be formed to overlap with the portion where the micro-holes (475) formed in the metal sheet (470) are formed.

[0184] For example, the first heat dissipation material layer (451) may be positioned to be in contact with the upper surface of the processor (420). The first heat dissipation material layer (451) may be positioned to cover at least a portion of the upper surface of the processor (420).

[0185] For example, the second heat dissipation material layer (452) may be formed to overlap the entire upper surface of the metal sheet (470). The second heat dissipation material layer (452) may be positioned to be in contact with the vapor chamber (480).

[0186] For example, the first heat dissipation material layer (451) and the second heat dissipation material layer (452) are connected to each other through micro-holes (475) formed in the metal sheet (470), so that when viewed from the outside, the heat dissipation material layer (450) can be seen as a single structure.

[0187] According to one embodiment, the lower surface of the shielding layer (460) can be adhered (e.g., attached) to the upper surface of the shield can (430) by the adhesive layer (440).

[0188] For example, the adhesive layer (440) may include a porous conductive adhesive material.

[0189] For example, the upper surface of the shielding layer (460) can be positioned to be in contact with the lower surface of the metal sheet (470).

[0190] For example, the shielding layer (460) may comprise a material (e.g., metal) or alloy (e.g., CuSi) with high electrical and thermal conductivity. For example, the shielding layer (460) may comprise a material with high thermal conductivity such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding layer (460) may comprise a composite material including a thermally conductive filler or a polymer.

[0191] FIG. 4b is a drawing showing various embodiments of microholes formed in a metal sheet (e.g., a copper sheet).

[0192] Referring to FIGS. 4a and 4b, as shown in (a), an area (471) in which microholes (475) can be formed can be set within the entire area of ​​the metal sheet (470).

[0193] For example, as illustrated in (b), the microholes (475) can be formed uniformly (472) over the entire surface of the region (471). For example, 108 microholes (475) can be formed in the metal sheet (470).

[0194] For example, as shown in (c), microholes (475) can be formed (473) in the central part of the region (471). For example, 20 microholes (475) can be formed in the metal sheet (470).

[0195] For example, as shown in (d), microholes (475) can be uniformly formed (474) in the region (471) excluding the corner portions. For example, 60 microholes (475) can be formed in the metal sheet (470).

[0196] According to one embodiment, the size of the micro-holes (475) formed in the metal sheet (470) can be made to have a diameter of λ (wavelength) / 50 or less, taking into account the shielding performance considering the wavelength by frequency.

[0197] For example, based on a frequency of 5 GHz, a diameter of about 1.2 mm or less is maintained for a maximum wavelength (λ) of 60 mm, which is 60 / 50, and a diameter of about 0.8 mm or more can be secured by considering the mass production of micro-holes (475).

[0198] For example, the microholes (475) can be formed by performing etching or punching. For example, the diameter of the microholes (475) can be about 0.8 mm to 1.2 mm. For example, the spacing between adjacent microholes (475) can be about 0.4 mm.

[0199] According to one embodiment, as the number of micro-holes (475) formed in the metal sheet (470) increases to 20, 60, and 108, the shielding performance of the heat dissipation structure (401) can be changed to levels of 34dB, 30dB, and 29dB.

[0200] Figure 5 is a diagram showing the formation of a heat dissipation structure using a phase change heat dissipation material.

[0201] Referring to FIG. 4a and FIG. 5, according to one embodiment, a heat dissipation material layer (450) can be formed using a phase change material (PCB) that can undergo a phase change (e.g., change from a solid state to a rubbery state) at a temperature above a certain level.

[0202] For example, a metal sheet (470) having micro-holes (475) formed therein can be prepared, and a first phase change material (520) can be applied to the upper surface of the metal sheet (470).

[0203] Afterwards, when heat and pressure are applied to the first phase change material (520), the first phase change material (520) changes from a solid state to a rubbery state and can fill the micro-holes (475).

[0204] Through this, a first heat dissipation material layer (451) can be formed on the upper surface of the metal sheet (470) and on the micro-holes (475).

[0205] Subsequently, a second phase change material (530) can be applied to the lower part of the metal sheet (470). Subsequently, heat and pressure can be applied to the second phase change material (530) to form a second heat dissipation material layer (452). As the first phase change material (520) changes from a solid state to a rubbery state due to the heat and pressure, the first heat dissipation material layer (451) and the second heat dissipation material layer (452) become connected to each other, thereby forming a heat dissipation material layer (450).

[0206] Through this, a heat dissipation structure (401) including a metal sheet (470) and a heat dissipation material layer (450) can be formed.

[0207] Figure 6 is a diagram showing the formation of a heat dissipation structure using a liquid heat dissipation material.

[0208] Referring to FIG. 4a and FIG. 6, according to one embodiment, a thermal interface material layer (450) can be formed using a liquid thermal interface material that can be cured at a specific temperature or higher.

[0209] For example, a metal sheet (470) having micro-holes (475) formed therein can be prepared, and a first liquid heat dissipation material (620) can be applied to the upper surface of the metal sheet (470).

[0210] Afterwards, the first liquid heat dissipation material (620) can gradually flow down and fill the micro-holes (475).

[0211] Afterwards, heat can be applied to cure the first liquid heat dissipation material (620).

[0212] Through this, a first heat dissipation material layer (451) can be formed on the upper surface of the metal sheet (470) and on the micro-holes (475).

[0213] Afterwards, a second liquid heat dissipation material (630) can be applied to the lower part of the metal sheet (470). Afterwards, heat can be applied to the second liquid heat dissipation material (630) to form a second heat dissipation material layer (452). Due to the applied heat, the first heat dissipation material layer (451) and the second heat dissipation material layer (452) are connected to each other, so that a heat dissipation material layer (450) can be formed.

[0214] Through this, a heat dissipation structure (401) including a metal sheet (470) and a heat dissipation material layer (450) can be formed.

[0215] Figure 7 is a drawing showing the formation of micro-holes in a metal sheet (e.g., a copper sheet).

[0216] Referring to FIG. 7, a plurality of regions (730) can be formed to form individual metal sheets on a metal film (700).

[0217] Afterwards, etching or punching can be performed on each of the multiple regions (730) to form micro-holes (740) (e.g., micro-holes (475) of FIG. 4a).

[0218] Afterwards, multiple regions (730) can be cut to form individual metal sheets (750) (e.g., the metal sheet (470) of FIG. 4a).

[0219] A heat dissipation material (TIM) can be coated on the upper and lower surfaces of such a metal sheet (750) (e.g., the metal sheet (470) of FIG. 4a) so that the micro-holes (740) (e.g., the micro-holes (475) of FIG. 4a) are filled with the heat dissipation material (TIM) to form a heat dissipation material layer (450).

[0220] Through this, a heat dissipation structure (401) including a metal sheet (470) and a heat dissipation material layer (450) can be formed.

[0221] Item DT20 DT60 DT108 Front [℃] 40.1 40 40 Rear [℃] 40.5 40.2 49.9 AP Junction Temperature [℃] 67.3 66.7 966

[0222] As shown in Table 1, as the number (DT) of microholes (475) formed in the metal sheet (470) increases, the junction temperature [°C] of the processor (e.g., processor (420) of FIG. 4a) can be lowered.

[0223] For example, when about 20 micro-holes (475) are formed (DT20) in the metal sheet (470), the front temperature of the processor (420) becomes about 40.1 [℃], the rear temperature becomes about 40.5 [℃], and the junction temperature can become 67.36 [℃].

[0224] For example, when about 60 micro-holes (475) are formed (DT60) in a metal sheet (470), the front temperature of the processor (420) becomes about 40[°C], the rear temperature becomes about 40.2[°C], and the junction temperature can become 66.79[°C].

[0225] For example, when about 108 micro-holes (475) are formed (DT108) in the metal sheet (470), the front temperature of the processor (420) becomes about 40[℃], the rear temperature becomes about 39.9[℃], and the junction temperature can become 66[℃].

[0226] For example, a heat dissipation structure (401) and a vapor chamber (480) are arranged in the front direction of the processor (420) so that heat dissipation in the front direction of the processor (420) can be efficiently achieved. Additionally, by arranging the heat dissipation structure (401), which includes a metal sheet (470) and a heat dissipation material layer (450), to be in contact with the processor (420), it can be seen that the temperature of the rear side of the processor (420) is also dissipated.

[0227] Figure 8 is a drawing showing that micro-holes are evenly formed on the front surface of a metal sheet (e.g., a copper sheet).

[0228] Figure 9 is a diagram showing the heat generation performance according to the area of ​​microholes formed in a metal sheet (e.g., a copper sheet).

[0229] Referring to FIGS. 8 and 9, micro-holes (820) of a metal sheet (810) can be formed in a rectangular shape, and micro-holes (820) can be formed in an area of ​​50% or more of the total area of ​​the metal sheet (810). For example, the area of ​​the micro-holes (820) of the metal sheet (810) can be adjusted relative to the area of ​​a processor (e.g., the processor (420) of FIG. 4a). At this time, the area of ​​the micro-holes (820) can be set so that the shielding performance is at the 15dB level.

[0230] In the case of the heat dissipation structure of the comparative example (910), the junction temperature of the processor (420) becomes 52.2[℃] and the surface temperature becomes 37.3[℃], so the difference between the junction temperature and the surface temperature of the processor (420) can be 14.9[℃].

[0231] When the thickness of the metal sheet (e.g., the metal sheet (470) of FIG. 4a) of the heat dissipation structure (401) of the present disclosure is 12 µm (920), the junction temperature of the processor (420) becomes 49.3 [°C] and the surface temperature becomes 38.5 [°C], so that the difference between the junction temperature and the surface temperature of the processor (420) can be 10.8 [°C]. Compared to the comparative example, the difference between the junction temperature and the surface temperature of the processor (420) can be improved by -4.1 [°C].

[0232] When the thickness of the metal sheet (e.g., the metal sheet (470) of FIG. 4a) of the heat dissipation structure (401) of the present disclosure is 18 μm (930), the junction temperature of the processor (420) becomes 48.3°C and the surface temperature becomes 38.2°C, so that the difference between the junction temperature and the surface temperature of the processor (420) can be 10.1°C. Compared to the comparative example, the difference between the junction temperature and the surface temperature of the processor (420) can be improved by -4.8°C.

[0233] FIG. 10 is a diagram showing micro-holes arranged in an alternating pattern to prevent tearing of a metal sheet (e.g., a copper sheet).

[0234] Referring to FIG. 10, according to one embodiment, microholes (1010, 1025, 1030, 1035) formed in at least a portion area (1010) of a metal sheet (470) may have a circular or square shape when viewed from above. Not limited thereto, microholes formed in at least a portion area (1010) of the metal sheet (470) may have an elliptical, triangular, pentagonal, hexagonal, or octagonal shape when viewed from above.

[0235] For example, according to one embodiment, if micro-holes (1020) are arranged in a straight line on a metal sheet (470), the metal sheet (470) may be torn or cracked. To prevent the metal sheet (470) from being torn or cracked, micro-holes (1025, 1035) may be formed in an alternating arrangement.

[0236] FIG. 11 is a drawing showing a heat dissipation structure formed using heat dissipation materials having the same physical properties.

[0237] Referring to FIG. 11, a heat dissipation structure (1100) (e.g., a heat dissipation structure (401) of FIG. 4a) may include a metal sheet (1110) (e.g., a metal sheet (470) of FIG. 4a) and a heat dissipation material layer (1120) (e.g., a heat dissipation material layer (450) of FIG. 4a).

[0238] For example, the heat dissipation material layer (1120) may include a first heat dissipation material layer (1121) located relatively lower with respect to the metal sheet (1110) (e.g., the first heat dissipation material layer (451) of FIG. 4a), and a second heat dissipation material layer (1122) located relatively higher (e.g., the second heat dissipation material layer (452) of FIG. 4a).

[0239] For example, the first heat dissipation material layer (1121) and the second heat dissipation material layer (1122) can be formed from a heat dissipation material (TIM) with the same physical properties.

[0240] For example, the first heat dissipation material layer (1121) and the second heat dissipation material layer (1122) can be formed from a phase change material (PCM) capable of undergoing a phase change (e.g., Solid → rubbery state) at a specific temperature.

[0241] For example, the first heat dissipation material layer (1121) and the second heat dissipation material layer (1122) are connected through thermal compression to form a single heat dissipation material layer (1120), thereby eliminating or reducing heat transfer loss due to the thermal resistance at the interface between the first heat dissipation material layer (1121) and the second heat dissipation material layer (1122).

[0242] For example, the first heat dissipation material layer (1121) and the second heat dissipation material layer (1122) can be formed from a liquid heat dissipation material. Since the first heat dissipation material layer (1121) and the second heat dissipation material layer (1122) are connected to each other to form a single heat dissipation material layer (1120), heat transfer loss due to the interfacial thermal resistance between the first heat dissipation material layer (1121) and the second heat dissipation material layer (1122) can be eliminated or reduced.

[0243] Not limited thereto, the first heat dissipation material layer (1121) may be formed of a phase change material (PCM), and the second heat dissipation material layer (1122) may be formed of a liquid heat dissipation material.

[0244] Not limited thereto, the first heat dissipation material layer (1121) may be formed of a liquid heat dissipation material, and the second heat dissipation material layer (1122) may be formed of a phase change material (PCM).

[0245] FIG. 12 is a drawing showing a heat dissipation structure formed using heat dissipation materials having different physical properties.

[0246] Referring to FIG. 12, a heat dissipation structure (1200) (e.g., a heat dissipation structure (401) of FIG. 4a) may include a metal sheet (1210) (e.g., a metal sheet (470) of FIG. 4a) and a heat dissipation material layer (1220) (e.g., a heat dissipation material layer (450) of FIG. 4a).

[0247] For example, the heat dissipation material layer (1220) may include a second heat dissipation material layer (1221) located relatively lower with respect to the metal sheet (1210) (e.g., the first heat dissipation material layer (451) of FIG. 4a), and a second heat dissipation material layer (1222) located relatively higher (e.g., the second heat dissipation material layer (452) of FIG. 4a).

[0248] For example, the first heat dissipation material layer (1221) and the second heat dissipation material layer (1122) may be formed of heat dissipation materials (TIMs) with different physical properties.

[0249] For example, the first heat dissipation material layer (1221) can be formed from a heat dissipation material (e.g., liquid heat dissipation material) having a thermal conductivity of 7 W / mK or more and a room temperature compressibility of 20% @ 1 kgf or more.

[0250] For example, the second heat dissipation material layer (1222) can be formed from a heat dissipation material having a thermal conductivity of less than 7 W / mK (e.g., a solid-type heat dissipation material).

[0251] FIG. 13 is a diagram showing heat dissipation particles forming a heat transfer path of a heat dissipation structure.

[0252] Referring to FIG. 13, a heat dissipation structure (3200) (e.g., a heat dissipation structure (401) of FIG. 4a) may include a metal sheet (1310) (e.g., a metal sheet (470) of FIG. 4a) and a heat dissipation material layer (1320) (e.g., a heat dissipation material layer (450) of FIG. 4a).

[0253] For example, the heat dissipation material layer (1320) may include a first heat dissipation material layer (1321) located relatively lower with respect to the metal sheet (1310) (e.g., the first heat dissipation material layer (451) of FIG. 4a), and a second heat dissipation material layer (1322) located relatively higher (e.g., the second heat dissipation material layer (452) of FIG. 4a).

[0254] According to one embodiment, as the power generated by the processor (e.g., the processor (420) of FIG. 4a)) continuously increases, a thermal insulation material (TIM) having a higher thermal conductivity must be applied to effectively remove the high heat generated by the processor (e.g., the application processor). Since excellent electrical conductivity leads to excellent thermal conductivity, a thermal insulation material (TIM) with high electrical conductivity may be used.

[0255] According to one embodiment, the heat dissipation material layer (1320) may include first heat dissipation particles (1331) for heat conduction in the vertical direction (1301), second heat dissipation particles (1332) for heat conduction in the vertical and horizontal directions, and third heat dissipation particles (1333) for heat conduction in the horizontal direction.

[0256] For example, the first heat dissipation particles (1331) may have a rod or bar shape.

[0257] For example, the second heat dissipation particles (1332) may have a circular or elliptical shape.

[0258] For example, the third heat dissipation particles (1333) may have a rod or bar shape.

[0259] For example, the first heat dissipation material layer (1321) is positioned to be in contact with the upper surface of a processor (e.g., processor (420) of FIG. 4a) and can dissipate heat generated from the processor (420) in a vertical direction. To dissipate heat generated from the processor (420), the first heat dissipation material layer (1321) may include first heat dissipation particles (1331) for heat conduction in a vertical direction (1301) and second heat dissipation particles (1332) for heat conduction in vertical and horizontal directions.

[0260] For example, the second heat dissipation material layer (1322) may include second heat dissipation particles (1332) for heat conduction in the vertical and horizontal directions and third heat dissipation particles (1333) for heat conduction in the horizontal direction to dissipate heat generated in the processor (420).

[0261] Not limited thereto, the first heat dissipation material layer (1321) may include all of the first heat dissipation particles (1331), the second heat dissipation particles (1332) for heat conduction in the vertical and horizontal directions, and the third heat dissipation particles (1333) for heat conduction in the horizontal direction, so that heat conduction occurs in the vertical direction (1301). In this case, the proportion of the first heat dissipation particles (1331) may be the largest and the proportion of the third heat dissipation particles (1333) may be the smallest so that the heat conduction efficiency in the vertical direction (1301) is increased.

[0262] Not limited thereto, the second heat dissipation material layer (1322) may include all of the first heat dissipation particles (1331), the second heat dissipation particles (1332) for heat conduction in the vertical and horizontal directions, and the third heat dissipation particles (1333) for heat conduction in the horizontal direction, so that heat conduction in the horizontal direction (1302) is achieved. In this case, the proportion of the third heat dissipation particles (1333) may be the largest and the proportion of the first heat dissipation particles (1331) may be the smallest so that the heat conduction efficiency in the horizontal direction (1302) is increased.

[0263] An electronic device according to one embodiment of the present disclosure (e.g., electronic device (200) of FIG. 2a, electronic device (300) of FIG. 3a) comprises: a housing; a printed circuit board disposed within the housing (e.g., printed circuit board (410) of FIG. 4a); a processor disposed on the printed circuit board (410) (e.g., processor (420) of FIG. 4a); a shield can disposed to surround the processor (420) and having a first hole (e.g., first hole (432) of FIG. 4a) formed on its upper side (e.g., shield can (430) of FIG. 4a); a shielding layer disposed on the upper surface of the shield can (430) and having a second hole (e.g., second hole (462) of FIG. 4a) formed corresponding to the first hole (432) of the shield can (430) (e.g., shielding layer (460) of FIG. 4a); and the It may include a metal sheet (e.g., the metal sheet (470) of FIG. 4a) disposed on the upper surface of the shielding layer (460) and having micro-holes (e.g., micro-holes (475) of FIG. 4a) formed in an area corresponding to the first hole (432) of the shield can (430), a heat dissipation material layer (e.g., the heat dissipation material layer (450) of FIG. 4a) disposed to be in contact with the upper surface of the metal sheet (470) and the upper surface of the processor (420), and a vapor chamber (e.g., the vapor chamber (480) of FIG. 4a) disposed on one surface of the heat dissipation material layer (450) and disposed to be in contact with the housing.

[0264] According to one embodiment, the heat dissipation material layer (450) may be formed to penetrate the first hole (432), the second hole, and the micro-holes (475) of the metal sheet (470).

[0265] According to one embodiment, the diameter of the microholes (475) of the metal sheet (470) may be 0.8 mm or more. The spacing between adjacent microholes (475) may be 0.4 mm or more.

[0266] According to one embodiment, the metal sheet (470) may include a copper sheet (Cu Sheet).

[0267] According to one embodiment, the heat dissipation material layer (450) can be formed by heat-pressing a phase change heat dissipation material.

[0268] According to one embodiment, the heat dissipation material layer (450) can be formed by curing a liquid heat dissipation material.

[0269] According to one embodiment, the heat dissipation material layer (450) may be formed by attaching a first heat dissipation material and a second heat dissipation material having the same physical properties.

[0270] According to one embodiment, the heat dissipation material layer (450) may be formed by attaching a first heat dissipation material and a second heat dissipation material having different physical properties.

[0271] According to one embodiment, the heat dissipation material layer (450) may include a phase change material.

[0272] According to one embodiment, the microholes (475) may be formed in a circular, elliptical, or angular shape when viewed from above.

[0273] A heat dissipation structure of an electronic device according to one embodiment of the present disclosure (e.g., a heat dissipation structure (401) of FIG. 4a) may include a metal sheet (470) disposed on the upper surface of a shielding layer (460) of the electronic device and having micro-holes (475) formed in an area corresponding to a first hole (432) of a shield can (430) of the electronic device. The heat dissipation structure (401) may include a heat dissipation material layer (450) disposed to be in contact with the upper surface of the metal sheet (470) and the upper surface of the processor (420).

[0274] According to one embodiment, the heat dissipation material layer (450) may be formed to fill the micro-holes (475) of the metal sheet (470).

[0275] According to one embodiment, the diameter of the microholes (475) of the metal sheet (470) may be 0.8 mm or more. The spacing between adjacent microholes (475) may be 0.4 mm or more.

[0276] According to one embodiment, the metal sheet (470) may include a copper sheet (Cu Sheet).

[0277] According to one embodiment, the heat dissipation material layer (450) can be formed by heat-pressing a phase change heat dissipation material.

[0278] According to one embodiment, the heat dissipation material layer (450) can be formed by curing a liquid heat dissipation material.

[0279] According to one embodiment, the heat dissipation material layer (450) may be formed by attaching a first heat dissipation material and a second heat dissipation material having the same physical properties.

[0280] According to one embodiment, the heat dissipation material layer (450) may be formed by attaching a first heat dissipation material and a second heat dissipation material having different physical properties.

[0281] According to one embodiment, the heat dissipation material layer (450) may include a phase change material.

[0282] According to one embodiment, the microholes (475) may be formed in a circular, elliptical, or angular shape when viewed from above.

[0283] A printed circuit board assembly including the heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can efficiently dissipate heat generated from heat-generating components (e.g., processor, memory).

[0284] A printed circuit board assembly including the heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly can delay the dynamic thermal management (DTM) point in time when the electronic device reaches the maximum temperature at which performance limitation is performed, and lower the temperature of the processor (application processor, GPU).

[0285] A heat dissipation structure according to an embodiment of the present disclosure can reduce internal interfacial thermal resistance.

[0286] A printed circuit board assembly including a heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can increase the high performance maintenance time of the electronic device.

[0287] Embodiments of the present disclosure may provide a printed circuit board assembly comprising a structure capable of extending the high performance maintenance time of an electronic device, and an electronic device comprising the printed circuit board assembly.

[0288] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

Claims

1. In an electronic device (200, 300), Housing; A printed circuit board (410) disposed within the above housing; A processor (420) placed on the printed circuit board (410); A shield can (430) positioned to surround the processor (420) and having a first hole (432) formed on the upper side; A shielding layer (460) disposed on the upper surface of the shield can (430) and having a second hole (462) formed therein corresponding to the first hole (432) of the shield can (430); A metal sheet (470) disposed on the upper surface of the shielding layer (460) and having micro-holes (475) formed in an area corresponding to the first hole (432) of the shield can (430); A heat dissipation material layer (450) positioned to be in contact with the upper surface of the metal sheet (470) and the upper surface of the processor (420); and A vapor chamber (480) disposed on one surface of the heat dissipation material layer (450) and disposed to be in contact with the housing; comprising Electronic device (200, 300).

2. In Paragraph 1, The heat dissipation material layer (450) is formed to penetrate the first hole (432), the second hole, and the micro-holes (475) of the metal sheet (470). Electronic device (200, 300).

3. In Paragraph 1, The diameter of the micro-holes (475) of the metal sheet (470) is 0.8 mm or more, and The spacing between adjacent microholes (475) is 0.4 mm or more, Electronic device (200, 300).

4. In Paragraph 1, The above heat dissipation material layer (450) is formed by heat-pressing a phase change heat dissipation material, Electronic device (200, 300).

5. In Paragraph 1, The above heat dissipation material layer (450) is formed by curing a liquid heat dissipation material, Electronic device (200, 300).

6. In Paragraph 1, The above heat dissipation material layer (450) is formed by attaching a first heat dissipation material and a second heat dissipation material having the same physical properties. Electronic device (200, 300).

7. In Paragraph 1, The above heat dissipation material layer (450) is formed by attaching a first heat dissipation material and a second heat dissipation material having different physical properties. Electronic device (200, 300).

8. In Paragraph 6 or 7, The above heat dissipation material layer (450) includes a phase change material. Electronic device (200, 300).

9. In the heat dissipation structure (401), The electronic device (200, 300) comprises a housing, a printed circuit board (410) disposed within the housing, a processor (420) disposed on the printed circuit board (410), a shield can (430) disposed to surround the processor (420) and having a first hole (432) formed on its upper side, a shielding layer (460) disposed on the upper surface of the shield can (430) and having a second hole (462) formed corresponding to the first hole (432) of the shield can (430), and a vapor chamber (480) disposed on the upper surface of the heat dissipation structure and disposed to be in contact with the housing. The above heat dissipation structure (401) is, A metal sheet (470) disposed on the upper surface of the shielding layer (460) and having micro-holes (475) formed in an area corresponding to the first hole (432) of the shield can (430); and A heat dissipation material layer (450) positioned to be in contact with the upper surface of the metal sheet (470) and the upper surface of the processor (420); comprising Heat dissipation structure (401).

10. In Paragraph 9, The heat dissipation material layer (450) is formed to fill the micro-holes (475) of the metal sheet (470). Heat dissipation structure (401).

11. In Paragraph 9, The above heat dissipation material layer (450) is formed by heat-pressing a phase change heat dissipation material, Heat dissipation structure (401).

12. In Paragraph 9, The above heat dissipation material layer (450) is formed by curing a liquid heat dissipation material, Heat dissipation structure (401).

13. In Paragraph 9, The above heat dissipation material layer (450) is formed by attaching a first heat dissipation material and a second heat dissipation material having the same physical properties. Heat dissipation structure (401).

14. In Paragraph 9, The above heat dissipation material layer (450) is formed by attaching a first heat dissipation material and a second heat dissipation material having different physical properties. Heat dissipation structure (401).

15. In Paragraph 13 or 14, The above heat dissipation material layer (450) includes a phase change material. Heat dissipation structure (401).

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