Loudspeaker

By attaching electrodes to the substrate layer of the speaker, a direct electrical connection between the piezoelectric structure and the external circuit is achieved, solving the problem of complex wire connections, simplifying the structure, reducing the size, and improving wearing comfort and portability.

WO2026123239A1 Publication Date: 2026-06-18SHENZHEN SHOKZ CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SHENZHEN SHOKZ CO LTD
Filing Date
2024-12-11
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing loudspeaker wiring methods are complex, resulting in complex structures, increased size, and high production costs, especially for small loudspeakers.

⚗Method used

By attaching electrodes to the substrate layer, the piezoelectric structure is electrically connected to the substrate layer, and then connected to the external circuit through the electrodes, which simplifies the structure and reduces the size.

🎯Benefits of technology

The speaker structure has been simplified, reducing design and assembly difficulty, decreasing speaker size, and improving wearing comfort and portability.

✦ Generated by Eureka AI based on patent content.

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Abstract

A loudspeaker, comprising: a base; a circuit assembly fixed to the base, the circuit assembly comprising a substrate layer made of an insulating material and a plurality of electrodes attached to the substrate layer, and the substrate layer being fixedly connected to the base; and a piezoelectric structure disposed on the circuit assembly. In a vibration direction of the circuit assembly, the piezoelectric structure comprises a first piezoelectric stacked structure located on one side of the circuit assembly, the first piezoelectric stacked structure comprising at least one first piezoelectric layer. In the vibration direction, two sides of any first piezoelectric layer are respectively provided with one first electrode layer, each first electrode layer being separately electrically connected to one of the electrodes on the substrate layer, and the electrode being configured to transmit an electrical signal to the corresponding first electrode layer so as to drive the piezoelectric structure to vibrate, thereby driving the circuit assembly to vibrate to generate sound.
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