Liner and semiconductor processing chamber

Abstract

The present application provides a liner, comprising a liner body and at least one grounding structure provided on the liner body. The grounding structure comprises a grounding body, a connecting portion, and a grounding portion, wherein the grounding body is strip-shaped and is spaced apart from a lower end of the liner body. At least one end of the grounding body in the extension direction thereof is provided with the connecting portion, and the connecting portion is connected to the lower end of the liner body and is electrically conductive. The grounding portion and the connecting portion are spaced apart from one another along the extension direction of the grounding body. During use, the grounding portion is used for being fixedly connected to a grounding member and is electrically conductive. The present application further provides a semiconductor processing chamber.

Description

Liner and semiconductor processing chamber Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a liner and semiconductor processing chamber. Background Technology

[0002] With the development of semiconductor process technology, various semiconductor processing equipment are widely used in semiconductor manufacturing processes. Plasma etching or deposition, as a key step in semiconductor manufacturing, has seen plasma equipment deployed across major semiconductor production lines. The working principle of plasma etching or deposition involves introducing process gas into a vacuum chamber and then dissociating, exciting, and ionizing the process gas through electrical or optical excitation. The ionized free radicals or ions diffuse freely or are accelerated by a field to the wafer surface and interact with the wafer material, resulting in etching and deposition.

[0003] To achieve a stable airflow environment and protect the inner walls of the semiconductor processing chamber from direct plasma bombardment, a liner is typically installed on the side walls of the chamber. The liner effectively limits and shields the plasma distribution, which is crucial for process parameters. In particular, the grounding performance of the liner directly affects the stability of the radio frequency (RF) circuit, and the stability of the RF circuit plays a decisive role in the stability of the plasma.

[0004] Existing liners often suffer from problems such as poor contact at the lower end and discontinuity in the radio frequency circuit due to the use of a split liner. This not only causes instability and discontinuity in the radio frequency circuit, but also results in a higher maintenance frequency. Summary of the Invention

[0005] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a liner and semiconductor processing chamber, which can solve the problems of poor contact at the lower end of the liner and discontinuity of the radio frequency circuit due to the use of a split liner in the prior art.

[0006] To achieve the purpose of this application, an inner lining is provided, including an inner lining body and at least one grounding structure disposed on the inner lining body. The grounding structure includes a grounding body, a connecting portion, and a grounding part. The grounding body is strip-shaped and is spaced apart from the lower end of the inner lining body. The connecting portion is disposed at at least one end of the grounding body in its extending direction. The connecting portion is connected to the lower end of the inner lining body and is electrically conductive.

[0007] The grounding part and the connecting part are spaced apart along the extension direction of the grounding body; the grounding part is used to be fixedly connected to the grounding component during use and is electrically conductive.

[0008] In some embodiments, the grounding body is provided with the connecting portion at both ends in its extending direction; the grounding portion is located between the two ends of the grounding body.

[0009] In some embodiments, the grounding body is provided with the connecting portion at one end in its extending direction, and the grounding portion is provided at the other end in its extending direction.

[0010] In some embodiments, the connecting portion is integrally connected to or hinged to the lining body; and / or,

[0011] The connecting part is integrated with or hinged to the grounding body.

[0012] In some embodiments, the extension direction of the grounding body is parallel to the circumferential direction of the inner lining body.

[0013] In some embodiments, a flange base is provided at the lower end of the liner body. The flange base is annular and protrudes toward the axis of the liner body relative to the inner circumferential surface of the liner body.

[0014] The flange base has a boss formed on one side of its inner circumference. The grounding body is spaced apart from the lower surface of the boss and located inside the inner circumference of the flange base, and spaced apart from the inner circumference of the flange base. The connecting part is connected to the lower surface of the boss and is electrically conductive.

[0015] In some embodiments, the connecting portion is a first protrusion formed on the lower surface of the boss, and at least one end of the grounding body is integrally connected to the side of the first protrusion.

[0016] In some embodiments, the grounding portion is a second protrusion formed on the lower surface of the grounding body, and the lower surface of the second protrusion is used for electrical contact with the grounding element.

[0017] In some embodiments, the grounding body and the second protrusion are respectively provided with through holes that extend in the vertical direction;

[0018] The grounding structure also includes fasteners, which are used to pass through the through hole and fix the grounding body and the second protrusion to the grounding component.

[0019] In some embodiments, the liner further includes a conductive ring disposed below the liner body, which is used to be fixedly connected to the grounding member during use and is electrically conductive;

[0020] The conductive ring is used to support the second protrusion, and the upper surface of the conductive ring is provided with a threaded hole, which is corresponding to the through hole. The fastener is threadedly connected to the threaded hole.

[0021] In some embodiments, at least one induction coil is disposed between the upper surface of the conductive ring and the lower surface of the second protrusion.

[0022] In some embodiments, there are multiple grounding structures, which are distributed at circumferential intervals along the inner lining body.

[0023] As another technical solution, this application also provides a semiconductor processing chamber, including a chamber body and a chuck disposed within the chamber body, the chuck being used to carry a wafer; it also includes the aforementioned inner liner provided in this application, the inner liner body being disposed around the inner side of the chamber body, and the upper end of the inner liner body being connected to the chamber body and electrically conductive;

[0024] The chuck is equipped with the grounding element.

[0025] This application has the following beneficial effects:

[0026] The liner provided in this application has an integral structure with no breaks in the middle, ensuring no potential difference between the upper and lower ends of the liner during use. This results in uniform voltage distribution across the liner, preventing discontinuities in the radio frequency circuit. Furthermore, at least one grounding structure is provided within the liner. This grounding structure consists of a strip-shaped grounding body spaced apart from the lower end of the liner. At least one end of the grounding body has a connecting portion that connects to the lower end of the liner. The grounding portion and the connecting portion are spaced apart along the extension direction of the grounding body. During use, the grounding portion is used for fixed connection with a grounding component and is electrically conductive. The liner can be electrically connected to the grounding component sequentially through the connecting portion, the grounding body, and the grounding portion, thereby achieving grounding of the liner. Furthermore, by making the grounding body strip-shaped, and with the grounding part and the connecting part spaced apart along the extension direction of the grounding body, when the inner lining body expands due to heat or contracts due to cold, the connecting part will expand and contract along the axial direction of the inner lining body, while the grounding part remains fixed due to its fixed connection with the grounding component. In this case, the strip-shaped grounding body can generate elastic deformation to release the deformation internal stress brought by the inner lining body, avoiding frequent deformation and damage. At the same time, it ensures that the connecting part remains connected to the inner lining body, and the grounding part remains connected to the grounding component. This ensures that the inner lining is always fully grounded during temperature alternation, improves connection reliability and safety, ensures the grounding performance of the inner lining, and has a longer service life. It is also less prone to poor contact, thereby reducing the maintenance frequency of the inner lining.

[0027] The semiconductor processing chamber provided in this application, by adopting the aforementioned liner, can not only avoid the problem of discontinuity in the radio frequency circuit, but also prevent it from being damaged by frequent deformation. At the same time, it ensures that the liner is always adequately grounded during temperature alternation, improves connection reliability and safety, ensures the grounding performance of the liner, and has a longer service life. It is less prone to poor contact, thereby reducing the maintenance frequency of the liner. Attached Figure Description

[0028] Figure 1 is a structural diagram of the inner lining of related technology one;

[0029] Figure 2 is a structural diagram of the flexible connector of related technology one;

[0030] Figure 3 is a partial structural diagram of the liner of related technology 2 installed in a semiconductor processing chamber;

[0031] Figure 4 is a cross-sectional schematic diagram of the semiconductor processing chamber provided in an embodiment of this application;

[0032] Figure 5 is a partial structural diagram of the lining provided in an embodiment of this application from one perspective;

[0033] Figure 6 is a partial cross-sectional view of the lining provided in an embodiment of this application;

[0034] Figure 7 is a partial structural diagram of the lining provided in an embodiment of this application from another perspective;

[0035] Figure 8 is a partial cross-sectional view of the lining at the grounding structure provided in the embodiment of this application;

[0036] Figure 9 is a schematic diagram of a grounding structure used in an embodiment of this application;

[0037] Figure 10 is a schematic diagram of another grounding structure used in the embodiments of this application;

[0038] Figure 11 is a structural diagram of the conductive ring used in the embodiment of this application;

[0039] Figure 12 is an enlarged view of region I in Figure 11. Detailed Implementation

[0040] To enable those skilled in the art to better understand the technical solution of this application, the liner and semiconductor processing chamber provided in this application will be described in detail below with reference to the accompanying drawings.

[0041] In related technology one, to achieve grounding of the lower end of the liner, as shown in Figure 1, multiple flexible connectors 02 are provided at the lower end of the liner 01. These flexible connectors 02 are evenly distributed circumferentially along the liner 01, as shown in Figure 2. Each flexible connector 02 includes an upper connecting portion 021, a lower connecting portion 022, and a curved structure 023 connecting the two. The upper contact surface 021a of the upper connecting portion 021 is connected to and electrically contacts the lower end of the liner; the side contact surface 022a of the lower connecting portion 022 is connected to and electrically contacts the side of the grounding component (e.g., the interface plate of a chuck). The upper connecting portion 021 and the lower connecting portion 022 are electrically connected through the curved structure 023, which includes two curved metal plates arranged opposite each other in a horizontal direction. The middle portion of each metal plate protrudes away from the other metal plate relative to its upper and lower edges. This flexible connector 02 enables a flexible connection between the liner 01 and the grounding component. However, the aforementioned bent structure 023 generates eddy currents due to bending when energized, thus producing an induced magnetic field and affecting the stability of the lower electrode circuit. Moreover, if the metal sheet is exposed to a high-temperature environment (e.g., around 120°C) for a long time, it is prone to aging and loss of elasticity, which not only affects the service life of the flexible connector 02 but also easily leads to poor contact, resulting in a higher frequency of maintenance for the inner liner and making the problem difficult to troubleshoot.

[0042] In related technology two, to achieve grounding at both the upper and lower ends of the liner, as shown in Figure 3, the liner 04 includes an upper liner 041 and a lower liner 042. The upper end 041a of the upper liner 041 is connected to the chamber wall 06 and is electrically conductive, while the lower end 042b of the lower liner 042 is connected to a grounding component (e.g., the interface plate 051 of the chuck 05) and is electrically conductive. An opening is formed between the lower end 041b of the upper liner 041 and the upper end 042a of the lower liner 042. Although grounding at both the upper and lower ends of the liner 04 is possible, related technology two uses a split liner, which leads to discontinuity in the radio frequency circuit, thus affecting the stability of the radio frequency circuit and consequently the plasma stability.

[0043] To address the issues in related technology 2 mentioned above, in this embodiment, the inner liner body adopts an integral structure with no breaks in the middle, thereby ensuring that there is no potential difference between the upper and lower ends of the inner liner body during use, thus ensuring uniform voltage distribution on the inner liner body and avoiding the problem of discontinuity in the radio frequency circuit.

[0044] To address the aforementioned issues in related technologies, please refer to Figure 4. This application provides an inner liner 200, which includes an inner liner body 210 and at least one grounding structure 220 disposed on the inner liner body 210. The grounding structure 220 is used to ground the lower end of the inner liner body 210. In some embodiments, to improve the voltage distribution uniformity of the inner liner body 210, multiple grounding structures 220 are provided and spaced apart circumferentially along the inner liner body 210.

[0045] Specifically, the inner liner body 210 is annular and is disposed inside the side wall of the chamber body 101 of the semiconductor processing chamber 100 during use. It serves to limit and shield the distribution of plasma, protecting the inner wall of the chamber body 101 from direct plasma bombardment. In this embodiment, the inner liner body 210 adopts an integral structure without any breaks in the middle. This ensures that there is no potential difference between the upper and lower ends of the inner liner body 210 during use, resulting in a uniform voltage distribution on the inner liner body 210 and thus avoiding the problem of discontinuity in the radio frequency circuit.

[0046] In some embodiments, to ensure that there is no potential difference between the upper and lower ends of the inner liner body 210, during use, the upper end of the inner liner body 210 is grounded, for example, through the sidewall of the chamber body 101 of the semiconductor processing chamber 100, while the lower end of the inner liner body 210 is grounded through at least one grounding structure 220. The upper end of the inner liner body 210 is connected to the sidewall of the chamber body 101 of the semiconductor processing chamber 100, and the electrical conduction is achieved, for example, by providing an annular flange 211 protruding relative to the outer peripheral surface of the inner liner body 210 at the upper end of the sidewall of the chamber body 101 during use, and the annular flange 211 is fixedly connected to the sidewall of the chamber body 101 by fasteners (not shown in the figure). The sidewall of the semiconductor processing chamber 100 is grounded, thereby achieving grounding of the upper end of the inner liner body 210. Furthermore, in some embodiments, a receiving groove (not shown) is provided on the lower surface of the annular flange 211 or the upper end face of the side wall of the chamber body 101. An induction coil (not shown) is installed in this receiving groove to enhance the electrical contact between the lower surface of the annular flange 211 and the upper end face of the side wall of the chamber body 101. The induction coil may include, for example, an elastic helical tube. Additionally, a sealing ring (not shown) is provided between the lower surface of the annular flange 211 and the upper end face of the side wall of the chamber body 101 to seal the gap between them, thereby achieving the airtightness of the semiconductor processing chamber 100. When the interior of the chamber body 101 switches between atmospheric and vacuum conditions, the sealing ring deforms. This deformation directly acts on the inner liner body 210 and is absorbed by the inner liner body 210.

[0047] It should be noted that, in practical applications, depending on specific needs, the upper end of the inner liner body 210 may not be provided with a structure for connecting to the side wall of the chamber body 101 of the semiconductor processing chamber 100. That is, the upper end of the inner liner body 210 may be grounded through other components or not grounded during use. This application embodiment does not limit this.

[0048] Please refer to Figures 5 to 8. The grounding structure 220 includes a grounding body 221, a connecting portion 222, and a grounding portion 223. The grounding body 221 is strip-shaped and spaced apart from the lower end of the inner liner body 210. In some embodiments, the strip-shaped grounding body 221 may extend along a straight line, such as parallel to the tangent direction of the circumference of the inner liner body 210; or, as shown in Figures 5 to 8, it may extend along an arc, such as parallel to the circumferential direction of the inner liner body 210. The aforementioned straight and arc directions may be parallel to the horizontal plane or form a certain angle with the horizontal plane.

[0049] It should be noted that the strip-shaped grounding body 221 refers to a grounding body 221 whose dimension in the extending direction is significantly larger than its cross-sectional dimension perpendicular to the extending direction. In some embodiments, the cross-sectional shape of the grounding body 221 perpendicular to its extending direction includes a rectangle or a square, and the dimension of the strip-shaped grounding body 221 in the extending direction is significantly larger than the side length of the rectangle or square. Alternatively, the cross-sectional shape of the grounding body 221 perpendicular to its extending direction may also include a circle or an ellipse, and the dimension of the strip-shaped grounding body 221 in the extending direction is significantly larger than the diameter of the circle or the major and minor axes of the ellipse. In a specific example, the cross-sectional shape of the grounding body 221 perpendicular to its extending direction is rectangular, and the width direction of the rectangle is parallel to the axial direction of the inner liner body 210. This facilitates the grounding body 221 to more easily undergo elastic deformation in the axial direction of the inner liner body 210.

[0050] The grounding body 221 has a connecting portion 222 at at least one end in its extending direction. The connecting portion 222 is connected to the lower end of the inner liner body 210 and is electrically conductive. In embodiments where multiple grounding structures 220 are provided, as shown in Figures 5 and 6, adjacent ends of two adjacent grounding structures 220 can share a connecting portion 222. In other words, the connecting portions 222 provided at adjacent ends of two adjacent grounding structures 220 are connected as one unit.

[0051] The grounding portion 223 and the connecting portion 222 are spaced apart along the extending direction of the grounding body 221. The grounding portion 223 is used to be fixedly connected to the grounding member 102 (e.g., the grounding plate of the chuck shown in FIG. 4) during use and is electrically conductive. In this way, the inner liner body 210 can be electrically connected to the grounding member 102 through the connecting portion 222, the grounding body 221 and the grounding portion 223 in sequence, thereby realizing the grounding of the inner liner body 210. Furthermore, by making the grounding body 221 strip-shaped, and the grounding part 223 and the connecting part 222 spaced apart along the extension direction of the grounding body 221, when the inner lining body 210 expands due to heat or contracts due to cold, the connecting part 222 will expand and contract along the axial direction of the inner lining body 210, while the grounding part 223 remains fixed due to its fixed connection with the grounding member 102. In this case, the strip-shaped grounding body 221 can undergo elastic deformation to release the deformation internal stress brought by the inner lining body 210, avoid its frequent deformation and damage, and at the same time ensure that the connecting part 222 remains connected to the inner lining body 210, and the grounding part 223 remains connected to the grounding member 102, thereby ensuring that the inner lining 200 is always fully grounded during temperature alternation, improving connection reliability and safety, and ensuring the grounding performance of the inner lining 200.

[0052] Compared to related technology one, the grounding body 221 used in this application embodiment is strip-shaped, which does not generate eddy currents when energized, thus not affecting the stability of the lower electrode circuit. Moreover, while ensuring elastic deformation, the strip-shaped grounding body 221 is thicker than a metal sheet, and is less prone to aging in high-temperature environments, resulting in a longer service life and less likelihood of poor contact, thereby reducing the maintenance frequency of the inner liner 200.

[0053] The liner 200 provided in this embodiment adopts an integral structure without any breaks in the middle. This ensures that there is no potential difference between the upper and lower ends of the liner body 210 during use, resulting in a uniform voltage distribution on the liner body 210 and avoiding the problem of discontinuity in the radio frequency circuit. Furthermore, it ensures that the liner 200 is always adequately grounded during temperature alternation, improving connection reliability and safety, guaranteeing the grounding performance of the liner 200, and extending its service life. It is also less prone to poor contact, thereby reducing the maintenance frequency of the liner 200.

[0054] In some embodiments, the grounding body 221 is provided with connecting portions 222 at both ends in its extending direction; the grounding portion 223 is located between the two ends of the grounding body 221. In this way, the strip-shaped grounding body 221 and the connecting portions 222 at both ends constitute a suspended bridge structure as a whole. In use, as shown in FIG9, when the inner liner body 210 is in the initial state, the two ends of the grounding body 221 that are respectively connected to the two connecting portions 222 and the position (e.g., the middle position) connected to the grounding portion 223 are located at the same height position in the horizontal direction, that is, all positions of the grounding body 221 in its extending direction are located at the same height position in the horizontal direction.

[0055] When the inner liner body 210 is heated and expands (i.e., is in a state of thermal expansion), as shown in Figure 9, since the upper end of the inner liner body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the inner liner body 210 will expand and deform downward, causing the connecting parts 222 at both ends of the grounding body 221 to move downward. At the same time, the grounding part 223 is fixed and does not move because it is fixedly connected to the grounding component 102. The position where the grounding body 221 is connected to the grounding part 223 remains unchanged. At this time, the two ends of the grounding body 221 move downward relative to the position where it is connected to the grounding part 223. As a result, the grounding body 221 will undergo an upward bending elastic deformation relative to the two ends at the position where it is connected to the grounding part 223, so as to release the deformation internal stress brought by the inner liner body 210.

[0056] When the inner liner body 210 is cooled and contracts (i.e., is in a state of cooling and contraction), as shown in Figure 9, since the upper end of the inner liner body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the inner liner body 210 will contract and deform upward, causing the connecting portions 222 at both ends of the grounding body 221 to move upward. At the same time, the grounding portion 223 is fixed in place because it is fixedly connected to the grounding component 102. The position where the grounding body 221 is connected to the grounding portion 223 remains unchanged. At this time, the two ends of the grounding body 221 move upward relative to the position where it is connected to the grounding portion 223. As a result, the grounding body 221 will undergo an elastic deformation of bending downward relative to the two ends at the position where it is connected to the grounding portion 223, so as to release the deformation internal stress brought by the inner liner body 210.

[0057] Furthermore, in some embodiments, the grounding part 223 is located at the middle position between the two ends of the grounding body 221, that is, the distance between the grounding part 223 and the two ends of the grounding body 221 is the same. This can make the grounding body 221 form a symmetrical structure, ensure that the grounding body 221 is subjected to uniform force, and thus further improve the service life of the grounding body 221.

[0058] In some embodiments, the grounding body 221 has a connecting portion 222 at one end in its extending direction and a grounding portion 223 at the other end in its extending direction. Thus, the end of the grounding body 221 connected to the grounding portion 223 is a stationary end, while the other end connected to the connecting portion 222 is a movable end. In use, as shown in FIG10, when the inner liner body 210 is in its initial state, the movable end of the grounding body 221 connected to the connecting portion 222 and the stationary end connected to the grounding portion 223 are, for example, located at the same height in the horizontal direction; that is, all positions of the grounding body 221 in its extending direction are located at the same height in the horizontal direction.

[0059] When the inner liner body 210 is heated and expands (i.e., is in a state of thermal expansion), as shown in Figure 10, since the upper end of the inner liner body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the inner liner body 210 will expand and deform downward, causing the connecting part 222 to move downward. At the same time, the grounding part 223 is fixed because it is fixedly connected to the grounding member 102. The moving end of the grounding body 221 connected to the connecting part 222 moves downward, while the stationary end of the grounding body 221 connected to the grounding part 223 remains unchanged in its original position. Thus, the stationary end of the grounding body 221 connected to the grounding part 223 will undergo an upward bending elastic deformation relative to the moving end to release the deformation internal stress brought by the inner liner body 210.

[0060] When the inner liner body 210 is cooled and contracts (i.e., is in a state of cooling and contraction), as shown in Figure 10, since the upper end of the inner liner body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the inner liner body 210 will contract and deform upward, causing the connecting part 222 to move upward. At the same time, the grounding part 223 is fixed in place because it is fixedly connected to the grounding member 102. The moving end of the grounding body 221 connected to the connecting part 222 moves upward, while the stationary end of the grounding body 221 connected to the grounding part 223 remains in its original position. Thus, the stationary end of the grounding body 221 connected to the grounding part 223 will undergo an elastic deformation of bending downward relative to the moving end, so as to release the deformation internal stress brought by the inner liner body 210.

[0061] As can be seen from the above, when the inner lining body 210 expands due to heat or contracts due to cold, the strip-shaped grounding body 221 can undergo elastic deformation to release the deformation internal stress brought by the inner lining body 210, avoid frequent deformation and damage, and at the same time ensure that the connecting part 222 remains connected to the inner lining body 210, and the grounding part 223 remains connected to the grounding component 102, thereby ensuring that the inner lining 200 is always fully grounded during temperature alternation, improving connection reliability and safety, and ensuring the grounding performance of the inner lining 200.

[0062] There are various ways in which the connecting part 222 can be connected to the inner lining body 210. In some embodiments, the connecting part 222 and the inner lining body 210 are integrated, that is, the connecting part 222 is a part of the inner lining body 210. This not only improves the stability and reliability of the connection between the connecting part 222 and the inner lining body 210, but also makes processing easier. In other embodiments, the connecting part 222 and the inner lining body 210 are hinged. In this way, when the inner lining body 210 expands due to heat or contracts due to cold, the connecting part 222 can rotate relative to the inner lining body 210 while moving with it, thereby further improving the stability and reliability of the connection between the connecting part 222 and the inner lining body 210.

[0063] There are various ways to connect the connecting part 222 to the grounding body 221. In some embodiments, the connecting part 222 and the grounding body 221 are integrated, which not only improves the stability and reliability of the connection between the connecting part 222 and the grounding body 221, but also makes processing easier. Preferably, the connecting part 222 and the grounding body 221 are integrated, and the connecting part 222 is also integrated with the inner lining body 210. In this way, both the connecting part 222 and the grounding body 221 are part of the inner lining body 210, making processing easier. In other embodiments, the connecting part 222 and the grounding body 221 are hinged. In this way, when the inner lining body 210 expands due to heat or contracts due to cold, the connecting part 222 can rotate relative to the grounding body 221 while moving with the inner lining body 210, thereby further improving the stability and reliability of the connection between the connecting part 222 and the inner lining body 210.

[0064] In some embodiments, to further improve the connection stability and reliability between the grounding structure 220 and the inner liner body 210, a flange base 230 is provided at the lower end of the inner liner body 210. The flange base 230 is annular and protrudes towards the axis of the inner liner body 210 relative to the inner circumferential surface of the inner liner body 210. A boss 231 is formed on one side of the inner circumferential surface of the flange base 230. The grounding body 221 is spaced apart from the lower surface of the boss 231 and is located inside the inner circumferential surface of the flange base 230. As shown in Figures 6 to 8, there is a first gap A between the grounding body 221 and the boss 231, and a second gap B between the grounding body 221 and the inner circumferential surface of the flange base 230. The first gap A and the second gap B are used to provide space for the elastic deformation of the grounding body 221, and at the same time, the grounding body 221 is in an independent suspended bridge state to avoid other components from hindering the elastic deformation of the grounding body 221.

[0065] The connecting portion 222 is connected to the lower surface of the boss 231 and is electrically conductive. The flange base 230 provides a mounting base for at least one grounding structure 220. The boss 231 is used to connect with the connecting portion 222. The boss 231 increases the radial dimension of the lower end of the liner body 210, thereby facilitating the processing and installation of the grounding structure 220, and increasing the strength of the lower end of the liner body 210, further improving the stability and reliability of the connection between the liner body 210 and the grounding structure 220. Furthermore, in some embodiments, the flange base 230, the boss 231, and the liner body 210 are all integrally formed.

[0066] In some embodiments, the connecting portion 222 is a first protrusion formed on the lower surface of the boss 231, and at least one end of the grounding body 221 along its extending direction is integrally connected to the side of the first protrusion. That is, the connecting portion 222 and the boss 231 are integrally formed, and the grounding body 221 and the first protrusion are integrally formed. This not only improves the stability and reliability of the connection between the connecting portion 222 and the grounding body 221, but also makes processing easier, thereby simplifying the structure and reducing costs.

[0067] In some embodiments, the grounding portion 223 is a second protrusion formed on the lower surface of the grounding body 221, and the lower surface of the second protrusion is used for electrical contact with the grounding member 102. That is, the grounding portion 223 is integrally formed with the grounding body 221. This not only improves the stability and reliability of the connection between the grounding portion 223 and the grounding body 221, but also makes processing easier, thereby simplifying the structure and reducing costs. Furthermore, in some embodiments, the lower surface of the second protrusion is nickel-plated to form a conductive layer that enhances conductivity.

[0068] In a specific example, the flange base 230, the boss 231, the inner liner body 210, the first protrusion (i.e., the connecting part 222) and the second protrusion (i.e., the grounding part 223) are all integrally formed. In this way, the grounding structure 220 and the inner liner body 210 are an integral component, and the lower end of the inner liner 200 can be grounded without the need for other components, thereby improving the grounding stability and reliability of the inner liner 200. Moreover, the processing is convenient. For example, the specific processing method is as follows: Before processing, the flange base 230 is a ring protruding from the inner circumferential surface of the inner lining body 210. A cutting inlet 231b is provided on the upper surface of the ring. The depth of the cutting inlet 231b in the vertical direction is less than the thickness of the flange base 230 in the vertical direction (for example, about 10 mm). One end of the cutting inlet 231b in the radial direction is located on the inner circumferential surface of the flange base 230. The depth of the cutting inlet 231b in the radial direction of the flange base 230 is less than the width of the flange base 230 in the radial direction. Then, a tool with a rectangular cross section of 2 mm × 5 mm is used to cut off the flange base 230 by rotating 20° around the circumference of the flange base 230 through the cutting inlet 231b. The groove formed after the cut-off constitutes the first interval A and the second interval B mentioned above. Then, using a milling cutter with a preset profile, a preset thickness (e.g., 4 mm) is removed from the lower surface of the flange base 230. The portion of the lower surface of the flange base 230 that is not removed forms a second protrusion (i.e., grounding portion 223). The portion of the flange base 230 located below the first interval A and inside the second interval B is the grounding body 221. The portion of the flange base 230 located above the first interval A and the second interval B is the boss 231. The portion of the flange base 230 located between two adjacent first intervals A is the connecting portion 222.

[0069] In some embodiments, as shown in FIG6, the grounding body 221 and the second protrusion (i.e., the grounding portion 223) are respectively provided with a through hole 223a extending in the vertical direction; as shown in FIGS. 7 and 8, the grounding structure 220 further includes a fastener 240, which is used to pass through the through hole 223a and fix the grounding body 221 and the second protrusion (i.e., the grounding portion 223) to the grounding member 102. The fastener 240 can fix the grounding body 221, the second protrusion (i.e., the grounding portion 223) and the grounding member 102 together, and the fastener 240 is, for example, a fastening screw.

[0070] Furthermore, in some embodiments, as shown in Figures 7 and 8, in order to facilitate the connection between the grounding structure 220 and the grounding component 102, the liner 200 also includes a conductive ring 250, which is disposed below the liner body 210. In embodiments where a flange base 230 is provided, in order to accommodate the deformation of the grounding body 221, the lower surface of the flange base 230 (i.e., the lower surface of the connecting portion 222) and the upper surface of the conductive ring 250 are spaced apart, for example, by about 4 mm.

[0071] The conductive ring 250 is used to be fixedly connected to the grounding member 102 and is electrically conductive. The grounding member 102 is, for example, a chuck used to carry wafers in a semiconductor processing chamber 100. As shown in Figures 11 and 12, the conductive ring 250 supports the second protrusion (i.e., the grounding portion 223), and the upper surface of the conductive ring 250 is provided with a threaded hole 252, which corresponds to the through hole 223a. The fastener 240 is threadedly connected to the threaded hole 252. The fastener 240 can fix the grounding body 221, the second protrusion (i.e., the grounding portion 223), and the conductive ring 250 together. Since the conductive ring 250 is fixed to the grounding member 102, the grounding body 221 and the second protrusion (i.e., the grounding portion 223) can be fixedly connected to the grounding member 102 through the conductive ring 250. The grounding member 102 is, for example, the interface plate of the chuck. In this case, the conductive ring 250 is provided in the edge region of the upper surface of the interface plate. However, the embodiments of this application are not limited to this. In practical applications, the conductive ring 250 can also be applied to other components in which the grounding member 102 is disposed in the semiconductor processing chamber 100, or the conductive ring 250 can be omitted and the second protrusion (i.e., the grounding part 223) can be directly electrically contacted with the grounding member 102.

[0072] In some embodiments, to enhance the contact effect between the upper surface of the conductive ring 250 and the lower surface of the second protrusion (i.e., the grounding portion 223), as shown in Figures 11 and 12, at least one induction coil 251 is provided between the upper surface of the conductive ring 250 and the lower surface of the second protrusion (i.e., the grounding portion 223). Specifically, for example, at least one induction coil 251 is provided on the upper surface of the conductive ring 250.

[0073] In some embodiments, to improve the voltage distribution uniformity of the inner liner body 210, there are multiple grounding structures 220, which are spaced apart circumferentially along the inner liner body 210. In embodiments where the inner liner 200 includes a conductive ring 250, the conductive ring 250 is used to support the second protrusion (i.e., grounding portion 223) in the multiple grounding structures 220, thereby facilitating the connection of the multiple grounding structures 220 to the grounding member 102.

[0074] As another technical solution, as shown in FIG1, this application embodiment also provides a semiconductor processing chamber 100, including a chamber body 101 and a chuck (not shown in the figure) disposed in the chamber body 101, the chuck being used to carry a wafer; it also includes the liner 200 provided in this application embodiment, the liner body 210 being disposed around the inner side of the chamber body 101, and the upper end of the liner body 210 being connected to the chamber body 101 and electrically conductive; the chuck is provided with a grounding member 102.

[0075] The grounding component 102 is, for example, the interface plate of a chuck.

[0076] The semiconductor processing chamber 100 provided in this application embodiment, by adopting the liner 200 provided in this application embodiment, can not only avoid the problem of discontinuity of the radio frequency circuit, but also avoid its frequent deformation and damage. At the same time, it ensures that the liner 200 is always fully grounded during temperature alternation, improves connection reliability and safety, ensures the grounding performance of the liner 200, and has a longer service life. It is less prone to poor contact, thereby reducing the maintenance frequency of the liner 200.

[0077] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. A liner, characterized in that, The device includes an inner lining body and at least one grounding structure disposed on the inner lining body. The grounding structure includes a grounding body, a connecting part, and a grounding portion. The grounding body is strip-shaped and is spaced apart from the lower end of the inner lining body. The connecting part is disposed at at least one end of the grounding body in its extending direction. The connecting part is connected to the lower end of the inner lining body and is electrically conductive. The grounding part and the connecting part are spaced apart along the extension direction of the grounding body; the grounding part is used to be fixedly connected to the grounding component during use and is electrically conductive.

2. The lining according to claim 1, characterized in that, The grounding body has connecting portions at both ends in its extending direction; the grounding portions are located between the two ends of the grounding body.

3. The lining according to claim 1, characterized in that, The grounding body has the connecting part at one end in its extending direction, and the grounding part is provided at the other end in its extending direction.

4. The lining according to claim 1, characterized in that, The connecting part is integrally connected to the inner lining body or hinged; and / or The connecting part is integrated with or hinged to the grounding body.

5. The lining according to claim 1, characterized in that, The extension direction of the grounding body is parallel to the circumferential direction of the inner lining body.

6. The lining according to any one of claims 1-5, characterized in that, The lower end of the inner lining body is provided with a flange base, which is annular and protrudes toward the axis of the inner lining body relative to the inner circumferential surface of the inner lining body. The flange base has a boss formed on one side of its inner circumference. The grounding body is spaced apart from the lower surface of the boss and located inside the inner circumference of the flange base, and spaced apart from the inner circumference of the flange base. The connecting part is connected to the lower surface of the boss and is electrically conductive.

7. The liner according to claim 6, characterized in that, The connecting portion is a first protrusion formed on the lower surface of the boss, and at least one end of the grounding body is integrally connected to the side of the first protrusion.

8. The lining according to claim 1, characterized in that, The grounding portion is a second protrusion formed on the lower surface of the grounding body, and the lower surface of the second protrusion is used for electrical contact with the grounding component.

9. The liner according to claim 8, characterized in that, The grounding body and the second protrusion are respectively provided with through holes that extend in the vertical direction; The grounding structure also includes fasteners, which are used to pass through the through hole and fix the grounding body and the second protrusion to the grounding component.

10. The liner according to claim 9, characterized in that, The liner also includes a conductive ring, which is disposed below the liner body and is used to be fixedly connected to the grounding component during use, and is electrically conductive; The conductive ring is used to support the second protrusion, and the upper surface of the conductive ring is provided with a threaded hole, which is corresponding to the through hole. The fastener is threadedly connected to the threaded hole.

11. The liner according to claim 10, characterized in that, At least one induction coil is provided between the upper surface of the conductive ring and the lower surface of the second protrusion.

12. The lining according to any one of claims 1-5, characterized in that, The grounding structures are multiple and are distributed at intervals along the circumference of the inner lining body.

13. A semiconductor processing chamber, comprising a chamber body and a chuck disposed within the chamber body, the chuck being used to carry a wafer; characterized in that, It also includes the liner as described in any one of claims 1-12, wherein the liner body is disposed around the inner side of the chamber body, and the upper end of the liner body is connected to the chamber body and is electrically conductive; The chuck is equipped with the grounding element.

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