System for processing substrate surfaces

Abstract

A system (100) for processing substrate surfaces comprises a process line (101) having two successively arranged process chambers (102, 102') for the wet-chemical processing of the substrate surfaces and two blow-off devices (103, 103') for generating an air jet (108), which blows off the substrate surfaces in order to remove liquid residue from the wet-chemical processing. The blow-off device (103) is situated at the outlet (110) of the process chamber (102) or in a blow-off chamber connected downstream of the process chamber (102), and the blow-off device (103') is situated at the outlet (110') of the process chamber (102') or in a blow-off chamber connected downstream of the process chamber (102'). Each of the process chambers (102, 102') is provided with a dedicated air circuit (120, 120'). The air circuit (120) draws air from the process chamber (102) and / or the blow-off chamber connected downstream thereof and feeds it back to the chamber via the blow-off device (103), and the air circuit (120') draws air from the process chamber (102') and / or the blow-off chamber connected downstream thereof and feeds it back to the chamber via the blow-off device (103'). The invention relates to a system (100) and to a method for processing substrate surfaces using the system (100).

Description

[0001] O&P

[0002] P 70414 WO - 1 - 10.12.2025

[0003] System for processing substrate surfaces

[0004] BACKGROUND OF THE INVENTION

[0005] The invention described below relates to a system for processing substrate surfaces.

[0006] Description of the state of the art

[0007] Multilayer substrates with an integrated conductor structure find diverse applications in microelectronics. Well-known examples include printed circuit boards, chiplets, and interposers.

[0008] Printed circuit boards (PCBs) serve as a carrier for electronic components and ensure their electrical contact. Almost every electronic device today contains one or more PCBs.

[0009] Printed circuit boards (PCBs) consist of a flat substrate layer with a top and a bottom surface made of an electrically insulating material, as well as conductive traces on and / or within the substrate layer for electrically contacting electronic components. Examples of insulating materials used include fiber-reinforced plastics, plastic films, glass, or hard paper. The conductive traces themselves are typically made of a metal.

[0010] For simple circuits with limited space, often only one side of the substrate layer is equipped with conductive traces. More complex circuits, however, frequently require more than one layer of conductive traces. In these cases, both sides of a substrate layer can be equipped with conductive traces. The traces of the two layers are then usually electrically connected to each other via vias. For this purpose, holes can be drilled into the substrate layer and the hole walls metallized. Further dielectric layers with additional layers of conductive traces can be applied to both sides of the substrate layer, which are in turn connected to each other and / or to the conductive traces formed on the substrate layer via vias. A chiplet is a small, functional part of a larger microprocessor or system-on-a-chip (SoC).Instead of a large monolithic die (single chip) with a multitude of functions, a chiplet design divides different functional units into separate chips. These individual chips (chiplets) are then combined to form a multifunctional unit.

[0011] Interposers are substrates that physically and electrically connect different chips (such as chiplets). They are used as a kind of "adapter" between the chips and the actual substrate (e.g., a printed circuit board).

[0012] Chiplets and interposers also typically feature a multilayer structure with conductor structures in several layers. These conductor structures are separated by dielectric layers, and the dielectric layers are pierced by vias (vias) that electrically connect conductor structures in different layers. Like printed circuit boards, they generally comprise a flat substrate layer with a top and bottom surface made of an electrically insulating material, as well as conductive traces on and / or within the substrate layer for electrically contacting electronic components.

[0013] The production of the aforementioned multilayer substrates with the integrated conductor structure often involves a starting substrate which, in addition to the aforementioned carrier layer made of electrically insulating material, has an electrically conductive layer applied to it, from which the conductor tracks are formed. This is done, for example, in a multi-stage photolithography process using a photoresist, the solubility of which in a developer solution can be influenced by radiation, particularly UV radiation.

[0014] In a typical process for manufacturing the conductive traces, the electrically conductive layer of the starting substrate is covered with a layer of photoresist. The photoresist layer can, for example, be laminated onto the electrically conductive layer of the starting substrate. Subsequently, the photoresist layer is exposed to light in an O&P exposure step.

[0015] P 70414 WO - 3 - 10.12.2025 is exposed to the radiation mentioned, whereby parts of the layer are protected from radiation exposure by means of an exposure mask. Depending on the photoresist and developer solution used, after the exposure step either the exposed or the unexposed parts of the layer become soluble in the developer solution and can be removed in a subsequent step. In this subsequent step, the development step, parts of the electrically conductive layer of the starting material are exposed, which can be removed wet-chemically with an etching solution in a further subsequent step, an etching step. The remaining remnants of the electrically conductive layer form the desired conductor track structure. If necessary, this can be exposed and reinforced in a deposition step – for example, by electroplating a suitable metal.

[0016] After each chemical process step, the substrate is typically treated in a rinsing step with a rinsing medium, for example, highly purified, deionized water. If necessary, a drying step follows the rinsing step before the substrate is subjected to the next process step.

[0017] The multi-stage photolithographic processes, and in particular the etching, rinsing and deposition steps following the development step, can generally be carried out either as part of a batch process or as part of an inline process.

[0018] Inline processes ensure a more streamlined workflow. In these processes, the substrate to be processed is moved continuously along a process line. This process line typically comprises several individual process chambers in which the substrate undergoes different treatments. For example, the substrate can be etched in one process chamber and then rinsed in the immediately following one.

[0019] In many cases, the substrate is conveyed horizontally along a roller array in a conveyor-belt manner, where it is exposed to variable chemical and physical conditions in successive process chambers without having to leave the roller array. An example of such processing is shown in Fig. 2 of DE 10 2005 011 298 A1.

[0020] It is also possible to move substrates vertically along a process line and process them without contact. For this purpose, they can, for example, be fixed at their edges in a transport frame that is guided vertically through the individual process chambers of the process line. The vertical orientation ensures that the substrates can be processed on both sides.

[0021] Surface processing with process fluids such as etching, rinsing, and developer solutions is preferably carried out in the process chambers using nozzles. The solutions are sprayed onto the respective substrate surface via stationary or moving nozzles.

[0022] It is important that process fluids are not carried from one process chamber to the next. Conventional roller-type process lines often employ squeeze rollers for this purpose, which wipe the respective process fluid from the surface of the treated substrate after processing. However, this solution is difficult to implement in process lines with vertical substrate processing, partly because the advantage of the vertical orientation lies in the aforementioned non-contact processing.

[0023] In conventional wet-chemical inline systems, several process chambers (often also referred to as process modules) are directly connected, so that a substrate is transported from chamber to chamber along a continuous process line. Between the chambers, there are inevitably open transition areas or transport gaps through which process air or humid air can escape or penetrate into adjacent chambers.

[0024] In conventional wet-chemical inline systems, several process chambers or modules are directly connected, allowing a substrate to be transported along a continuous process line from chamber to chamber. Open transition areas or transport gaps inevitably exist between the chambers, through which process air (O&P) passes.

[0025] P 70414 WO - 5 - 10.12.2025 or humid air can escape or penetrate into adjacent chambers.

[0026] In conventional systems, the cross-flows between adjacent process chambers caused by such transitions are generally not specifically controlled. During steady-state operation, even slight pressure differences between the chambers can be sufficient to cause lateral air movement and thus a mixing of the process atmospheres. This can lead to undesirable variations in process conditions, such as temperature or humidity gradients, unstable drying conditions, or particle displacement between the modules.

[0027] To compensate for such pressure differences, flap or valve controls between the chambers have often been used. However, these require complex synchronization and are sensitive to dynamic conditions, such as during system start-up and stop-down cycles. During these phases, rapid and significant changes in flow rates occur, which can lead to pressure surges and unstable flow patterns.

[0028] Furthermore, known systems often incorporate central blowers that supply the entire plant with process air. Such central air ducts make precise control of local pressure conditions difficult and lead to mutual interference between the individual process chambers during operation.

[0029] SUMMARY OF THE INVENTION

[0030] The invention was based on the objective of providing an optimized system for processing substrate surfaces that avoids or reduces the aforementioned problems.

[0031] To solve this problem, the invention proposes the system with the features specified in claim 1 and the method with the features specified in claim 7. Further developments of the invention are the subject of dependent claims.

[0032] A system according to the invention is particularly suitable for carrying out wet chemical pro- O&P processes.

[0033] P 70414 WO - 6 - 10.12.2025 processes in the context of the manufacture of printed circuit boards, chiplets, interposers and similar products, in particular as described above. For example, the surface of a substrate (hereinafter referred to as the substrate surface), which has a carrier layer of an electrically insulating material and an electrically conductive metal layer applied thereto, can be subjected to processing with an etching solution. Such substrates can, for example, have a length and width of up to 600 mm each and a thickness of up to a few mm, for example up to 3 mm.

[0034] The facility is characterized by the following features:

[0035] (a) It comprises a process line with at least one first and one second process chamber, i.e. at least two process chambers, for the wet chemical processing of the substrate surfaces, through which the substrates to be processed are transported.

[0036] (b) The plant or process line shall include at least one first and one second blow-off device, i.e. at least two blow-off devices, for generating an air jet which blows off the substrate surfaces for the purpose of removing liquid residues from wet chemical processing.

[0037] (c) The first blow-off device is located at the outlet of the first process chamber or in a blow-off chamber downstream of the first process chamber.

[0038] (d) The second blow-off device is located at the outlet of the second process chamber or in a blow-off chamber downstream of the second process chamber.

[0039] (e) The first and second process chambers are each equipped with their own air circuit, a first and a second air circuit.

[0040] (f) The first air circuit draws air from the first process chamber and / or the downstream blow-off chamber and returns it to this process chamber and / or this blow-off chamber via the first blow-off device.

[0041] (g) The second air circuit draws air from the second process chamber and / or the downstream blow-off chamber and returns it to this process chamber and / or this blow-off chamber via the second blow-off device.

[0042] According to the invention, the air circuits mentioned in features (e) to (g) are designed such that the pressure conditions prevailing in the individual process chambers can be actively controlled. By appropriately adjusting the respective supply and exhaust air volume flows, a pressure equilibrium between adjacent process chambers can be achieved. This prevents cross-flows across the transition areas between the chambers due to local pressure differences. The modularly controlled air circuits thus decouple the chambers from each other in terms of pressure and flow.

[0043] Another advantage of this modular airflow system is that it eliminates the need for separate damper or valve controls between the process chambers. Previous systems required complex synchronization of such control elements to limit crossflow, particularly during start-up and stop-down processes. The newly implemented local pressure control completely eliminates this effort, simplifying the system design and increasing process stability.

[0044] The use of blow-off devices eliminates the need for squeeze rollers and is particularly suitable for process lines with the aforementioned vertical substrate processing. Accordingly, it is preferred within the scope of the invention that the substrate surfaces of vertically oriented substrates are wet-chemically processed. For this purpose, nozzles can be arranged in the process chambers for the wet-chemical processing of the substrate surfaces to spray one or both substrate surfaces of a vertically arranged substrate with a process fluid, for example, an etching solution.

[0045] The process line preferably comprises more than two process chambers, through which the substrates to be treated pass sequentially. This makes it possible to subject the substrates to a sequence of chemical or physical processes.

[0046] In principle, it is possible for a further process chamber to follow directly after the process chambers for the wet chemical processing of the substrate surfaces, in which a subsequent process is carried out. In this case, the blow-off device is preferably located at the outlet of the O&P.

[0047] P 70414 WO - 8 - 10.12.2025

[0048] Process chambers are arranged. Blown-off liquid residues from the wet chemical processing can then be collected directly in the process chambers and reused. However, it is also conceivable that the blow-off takes place in the aforementioned blow-off chambers between two process chambers.

[0049] A setup according to the above features (e) to (g) offers significant advantages. Very large quantities of air are required for blowing off the substrate surfaces. Drawing air from the process chambers and / or the blow-off chambers and recirculating it constitutes a closed-loop air system.

[0050] The system according to the invention is particularly preferably characterized by at least one of the following features:

[0051] (a) It includes a cleanroom in which the process line is located.

[0052] (b) The first and second process chambers for wet chemical processing of the substrate surfaces and / or the blow-off chambers downstream of the first and second process chambers are isolated from the cleanroom.

[0053] A cleanroom is a room in which the concentration of particles and other contaminants in the air is reduced to a very low level to prevent the impairment of sensitive processes or products. Humidity is also often regulated to a specific level in cleanrooms. Cleanrooms are frequently used in industries that require the highest levels of cleanliness and precision, such as the electronics, semiconductor, pharmaceutical, medical, and food industries.

[0054] The aforementioned isolation from the cleanroom means that no significant air exchange takes place between the room air in the cleanroom and the process atmosphere in the process chambers and / or the blow-off chambers.

[0055] If air for the air jet is taken from the cleanroom, this air must be replaced. Individual blow-off devices, for example, can require up to 200 m³ of air. 3 / hour. The same amount of air must be extracted after blow-off and O&P.

[0056] P 70414 WO - 9 - 10.12.2025 must be removed. Furthermore, significant pressure fluctuations in the cleanroom must be compensated for when starting and stopping the blow-off process. The associated effort is considerable and can be eliminated by the aforementioned recirculation system.

[0057] Another problem: Side-channel blowers used to draw in cleanroom air often heat up considerably. The resulting waste heat must also be dissipated. In some cases, separate cooling of the process air is even necessary to compensate for the heating. With the recirculation system according to the invention, this is unnecessary.

[0058] In further preferred embodiments, the system according to the invention is characterized by at least one of the following features:

[0059] (a) The first blow-off device is or includes at least one air blade and / or the second blow-off device is or includes at least one air blade.

[0060] (b) The first blow-off device has a compressor upstream or the first blow-off device includes a compressor and / or the second blow-off device has a compressor upstream or the second blow-off device includes a compressor.

[0061] (c) The first blow-off device includes a radial fan and / or the second blow-off device includes a radial fan.

[0062] An air blade (also known as an air knife, air sword, air brush, or air scraper) is typically designed as a nozzle with a slit-shaped cross-section from which a high-speed jet of air emerges. This jet of air can be used to blow off the substrate surfaces. The air jet resembles the shape of a blade. It can, for example, have a height of approximately 0.3 cm and a width of 10 to 150 cm. The exact dimensions are determined by the size of the slit-shaped cross-section.

[0063] It is preferred that in an air blade, the nozzle cross-section decreases towards the outlet. According to Bernoulli's equation, this results in a high flow velocity at the outlet. There are also compressed air-operated air blades in which a high inlet pressure exits through a very narrow gap and draws in air from the surroundings.

[0064] P 70414 WO - 10 - 10.12.2025 which increases the airflow.

[0065] The compressed air in question can be generated by means of the compressor mentioned in feature (b). This could be, for example, a side channel compressor or a piston compressor.

[0066] In this case, high-speed radial fans are particularly suitable for generating the fast air jet.

[0067] The system according to the invention is particularly preferably characterized by at least one of the following features:

[0068] (a) The drive for the first blow-off device is located outside the first process chamber and / or the blow-off chamber downstream of the first process chamber and / or the drive for the second blow-off device is located outside the second process chamber and / or the blow-off chamber downstream of the second process chamber.

[0069] (b) The drive for the first blow-off device is coupled to the first blow-off device via a magnetic coupling and / or the drive for the second blow-off device is coupled to the second blow-off device via a magnetic coupling.

[0070] Positioning the drives outside the blow-off chambers has the advantage that heating of the drive does not affect the process atmosphere inside the process chambers. The magnetic coupling ensures contactless power transmission.

[0071] In further preferred embodiments, the system according to the invention is characterized by at least one of the following features:

[0072] (a) It includes a transport system for transporting substrates along the process line.

[0073] (b) The transport system is designed to transport the substrates in a vertical orientation along the process line.

[0074] As mentioned above, the system according to the invention is particularly suitable for O&P.

[0075] P 70414 WO - 11 - 10.12.2025

[0076] Process lines for vertical substrate processing. Substrates can be fixed in frames that are guided vertically along the process line through the process chambers.

[0077] In further preferred embodiments, the system according to the invention is characterized by at least one of the following features:

[0078] (a) The first process chamber and the second process chamber are designed to equalize pressure differences between them and any other adjacent process chambers and to prevent cross-flows between them and any other adjacent process chambers.

[0079] (b) The first air circuit and the second air circuit each comprise means for individually adjusting supply and exhaust air volume flows and thus for adjusting an individual pressure in the first and second process chambers.

[0080] Any method for processing substrate surfaces that can be carried out in the above-described system is encompassed by the present invention.

[0081] In particular, the inventive method for processing substrate surfaces is characterized by the following features:

[0082] (a) The substrates to be treated are moved along the process line through the process chambers, in particular through the first and the second process chamber.

[0083] (b) In the process chambers, in particular in the first and second process chambers, the supply and exhaust air volume flows of the respective air circuit, in particular of the first and second air circuits, are regulated in such a way that the pressures prevailing in the process chambers, in particular in the first and second process chambers, are equalized and no cross-flows occur between the process chambers.

[0084] The control of the supply and exhaust air volume flows described in (b) leads to a steady-state pressure equilibrium between the individual process chambers. As a result, cross-flows via transport gaps or openings are completely suppressed without the need for mechanical separating devices (flaps and flap controls). The O&P

[0085] P 70414 WO - 12 - 10.12.2025

[0086] This ensures that the process atmosphere of each chamber remains stable, which significantly improves the reproducibility of chemical and thermal process conditions.

[0087] In further preferred embodiments, the method according to the invention is characterized by the following feature:

[0088] (a) Pressure and flow-side decoupling of the first and second process chambers from each other and, if applicable, from other adjacent process chambers is achieved exclusively by controlling the supply and exhaust air volume flows of the first and second air circuits.

[0089] The damper or valve controls previously used in conventional systems between adjacent process chambers can be completely replaced by the control system according to the invention. Pressure and flow decoupling is actively achieved through the modular fan guidance. This either eliminates the need for damper controls or allows them to be retained as purely passive separation elements to support maintenance or cleaning cycles. This measure reduces the complexity of the system control and avoids the synchronization problems that occurred in the past when starting up and shutting down the system.

[0090] In a further preferred embodiment, the method according to the invention is characterized by the following feature:

[0091] (a) When starting or stopping the plant, the first and second air circuits are activated or deactivated stepwise or simultaneously to avoid pressure transients and short-term cross-flows between the process chambers.

[0092] The modular air control is particularly advantageous when starting or stopping the system. By activating the blowers sequentially or in stages, the pressure balance between the process chambers can be continuously maintained during system startup or deceleration. This prevents abrupt pressure transients, and the airflow remains unidirectional in all chambers. This results in stable blow-off, prevents backflow, and improves process reliability during frequent operation and maintenance (O&P).

[0093] P 70414 WO - 13 - 10.12.2025

[0094] Start / stop cycles.

[0095] The combination of modular air circuits with the described pressure control enables a particularly energy-efficient, process-stable, and cleanroom-friendly system design. The elimination of central blowers, the reduced cleanroom air requirement, and the automatic pressure compensation between adjacent process chambers result in uniform airflow and thus improved process quality.

[0096] Further features, details and advantages of the invention will become apparent from the claims and the summary, the wording of which is made part of the description by reference, the following description of preferred embodiments of the invention and the drawing.

[0097] BRIEF DESCRIPTION OF THE DRAWING

[0098] An embodiment of the invention will now be explained in more detail with reference to the drawings. These show:

[0099] Figure 1: Schematic view of a preferred embodiment of a system according to the invention with two process chambers arranged one after the other, each of which is provided with its own air circuits;

[0100] Figure 2: Schematic sectional view of a preferred spray device for double-sided wet chemical processing of vertically guided substrates with process fluid (section along the section line S1-S2);

[0101] Figure 3: Schematic sectional view of a preferred blow-off device with two air blades.

[0102] DESCRIPTION OF PREFERRED EXAMPLES

[0103] Fig. 1 shows a schematic side view of a preferred embodiment of a system 100 according to the invention for the wet-chemical processing of substrate surfaces. The system O&P

[0104] P 70414 WO - 14 - 10.12.2025

[0105] 100 comprises a process line 101 with two process chambers arranged in series, a first process chamber 102 and a second process chamber 102'. Each of the process chambers is designed to receive substrates 105, which are held in a vertical orientation in a support frame 106 and guided through the system along a transport axis.

[0106] The two process chambers 102 and 102' each have two spray devices 111, 112 and 111', 112', respectively, through which a process fluid is applied to the substrates to be treated. The process fluid can be, for example, a cleaning, rinsing, or etching solution. Blow-off devices 103 and 103' are arranged at the outlet of the first and second process chambers. These blow a directed jet of air 108 onto the substrate surfaces to remove liquid residues from the processing. A drive 104 for the blow-off device 103 is arranged outside the process chamber 102. A drive 104' for the blow-off device 103' is arranged outside the process chamber 102'. The drives 104 and 104' are each coupled to the blow-off devices 103 and 103' via a magnetic coupling.

[0107] Each process chamber 102, 102' has its own air circuit (120, 120'). Each of these air circuits preferably includes a discharge and a return channel, as well as optionally a control valve and a pressure sensor. The air can be extracted via a separate blower or, for example, via radial fans integrated into the blow-off devices. These fans can draw air from the respective process chamber 102 or 102', compress it, and return it to the respective blow-off device 103 or 103' via the return channel. The supply and exhaust air volume flows can be adjusted independently of each other via corresponding control valves, so that a defined chamber pressure (pressure p1 in process chamber 102 and pressure p2 in process chamber 102') prevails in each process chamber.

[0108] Between the two process chambers (102, 102') is an open transport gap through which the substrate (105) is conveyed. No flap or separating device is provided. Cross-flows between the chambers are prevented not by mechanical separation, but by pressure equalization. Pressure sensors detect the static chamber pressure, and a control unit regulates the blowers or valves so that the pressure differential is maintained.

[0109] P 70414 WO - 15 - 10.12.2025 The airflow between the chambers is minimized. This control ensures that the flow pattern within each chamber remains stable and uniform, even under different operating conditions of the modules. Simultaneously, it prevents process air or humid air from passing from one chamber to an adjacent one. In this way, the process atmosphere of each chamber remains independent and reproducible.

[0110] An additional advantage of this design is that central fans or complex damper controls are no longer required. Each process chamber operates with locally recycled air, which significantly reduces the consumption of pre-cleaned cleanroom air and lowers the energy demand for cleanroom supply.

[0111] As shown in Fig. 2, the spray devices (spray device 111 is shown as an example, whereby spray devices 111', 112 and 112' can be of identical construction) are designed to spray substrates fixed in the frame 106 on both sides with a process fluid, for example an etching solution. The spray nozzles are designated 107.

[0112] As shown in Fig. 3, the system comprises two air blades 109, one for each side of the substrate 105, as a blow-off device 103. A high-speed radial fan is used in these blades to generate the air jet 108. The drive 104 for the radial fan is located outside the process chamber 102 and is coupled to the radial fan via a magnetic coupling. The blow-off device 103 can be of identical design.

[0113] The system 100 is designed for vertical substrate processing. The substrates 105 to be processed are fixed in frames 106 and guided vertically along the process line through the process chamber 102. It includes a suitable transport system for this purpose.

Claims

O&P P 70414 WO - 16 - 10.12.2025 PATENT CLAIMS 1. Plant (100) for processing substrate surfaces, comprising a process line (101) (a) with two process chambers (102, 102') arranged in series for wet chemical processing of the substrate surfaces, and (b) two blow-off devices (103, 103') for generating an air jet (108) which blows off the substrate surfaces for the purpose of removing liquid residues from wet chemical processing, wherein (c) the blow-off device (103) is arranged at the outlet (110) of the process chamber (102) or in a blow-off chamber downstream of the process chamber (102), and (d) the blow-off device (103') is arranged at the outlet (110') of the process chambers (102') or in a blow-off chamber downstream of the process chamber (102') and (e) the process chambers (102, 102') are each equipped with their own air circuit (120, 120'), and (f) the air circuit (120) draws in air from the process chamber (102) and / or the blow-off chamber downstream of it and returns it to the process chamber (102) and / or the blow-off chamber via the blow-off device (103), and (g) the air circuit (120') draws in air from the process chamber (102') and / or the blow-off chamber downstream of it and returns it to the process chamber (102') and / or the blow-off chamber via the blow-off device (103'). O&P P 70414 WO - 17 - 10.12.2025 2. System according to claim 1, characterized by at least one of the following features: (a) It includes a cleanroom in which the process line (101) is located. (b) The process chambers (102, 102') for wet chemical processing of the substrate surfaces and / or the blow-off chambers are isolated from the cleanroom.

3. Plant according to one of the preceding claims, characterized by at least one of the following features: (a) The blow-off device (103) is or comprises at least one air blade (109) and / or the blow-off device (103') is or comprises at least one air blade (109'). (b) A compressor is connected upstream of the blow-off device (103) or the blow-off device (103) includes a compressor and / or a compressor is connected upstream of the blow-off device (103') or the blow-off device (103') includes a compressor. (c) The blow-off device (103) comprises a radial fan and / or the blow-off device (103') comprises a radial fan.

4. Plant according to one of the preceding claims, characterized by at least one of the following features: (a) A drive (104) for the blow-off device (103) is arranged outside the process chamber (102) and / or the blow-off chamber and / or a drive (104') for the blow-off device (103') is arranged outside the process chamber (102') and / or the blow-off chamber. (b) The drive (104) for the blow-off device (103) is connected to the blow-off device (103) coupled via a magnetic coupling and / or the drive (104') for the O&P P 70414 WO - 18 - 10.12.2025 The blow-off device (103') is coupled to the blow-off device (103') via a magnetic coupling.

5. Plant according to one of the preceding claims, characterized by at least one of the following features: (a) It includes a transport system for transporting substrates (105) along the process line (101). (b) The transport system is designed to transport the substrates in a vertical orientation along the process line (101).

6. Plant according to one of the preceding claims, characterized by at least one of the following features: (a) The process chambers (102, 102') are designed to equalize pressure differences between them and any other adjacent process chambers and to prevent cross-flows between them and any other adjacent process chambers. (b) The air circuit (120) and the air circuit (120') each comprise means for individually adjusting supply and exhaust air volume flows and thus for adjusting an individual pressure in the process chambers (102, 102').

7. Method for processing substrate surfaces using a system according to any one of claims 1 to 6, wherein (a) the substrates (105) are moved along the process line (101) through the process chambers (102, 102'), and (b) in the process chambers (102, 102') the supply and exhaust air volume flows of the respective air circuit (120, 120') are regulated in such a way that the pressures prevailing in the process chambers (102, 102') are equalized and no cross-flows occur between the process chambers (102, 102'). O&P P 70414 WO - 19 - 10.12.2025 8. Method according to claim 7, characterized in that (a) pressure and flow-side decoupling of the process chambers (102, 102') from each other and, if applicable, from other adjacent process chambers is achieved exclusively by controlling the supply and exhaust air volume flows of the air circuits (120, 120').

9. Method according to one of claims 7 or 8, characterized in that (a) when starting or stopping the plant, the air circuits (120, 120') are activated or deactivated stepwise or simultaneously to avoid pressure transients and short-term cross-flows between the process chambers (102, 102').

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