Inspection device and inspection method

Abstract

An inspection device 1 comprises an X-ray source 2 that includes an electron gun 21 and a target 22, a control unit 3 that controls the incidence position of an electron beam EB between a first incidence position Y1 and a second incidence position Y2, an X-ray detection unit 4 that acquires an X-ray image of an object OJ, and an inspection unit 51 that inspects the object OJ on the basis of the X-ray image. The X-ray detection unit 4 acquires a first image as the X-ray image when the incidence position of the electron beam EB is the first incidence position Y1 and acquires a second image as the X-ray image when the incidence position of the electron beam EB is the second incidence position Y2, and the inspection unit 51 inspects the object OJ on the basis of at least one of the first image and the second image.

Description

Inspection Device and Inspection Method 【0001】 The present disclosure relates to an inspection device and an inspection method. 【0002】 Patent Document 1 describes an article inspection device including a first conveyor that conveys an article in a first direction, a second conveyor that conveys the article in a second direction opposite to the first direction, and inspection equipment that inspects the article. In this article inspection device, the article conveyed by the first conveyor is inspected by the inspection equipment, and if the inspection result is nonconforming, the article is moved to the second conveyor. Then, the article conveyed by the second conveyor is reinspected by the inspection equipment. 【0003】 Japanese Patent Application Laid-Open No. 2014-48178 【0004】 In the article inspection device described in Patent Document 1, when reinspection of the article is necessary, it takes time such as moving the article from the first conveyor to the second conveyor, so there is room for improvement from the perspective of facilitating the inspection of the article. 【0005】 An object of the present disclosure is to provide an inspection device and an inspection method capable of easily inspecting an object. 【0006】 The gist of the inspection device and inspection method according to one aspect of the present disclosure is as follows in [1] to

[13] below. 【0007】[1] An inspection device comprising: a radiation source for irradiating an object with radiation, the radiation source having a beam emission unit for emitting a beam and a radiation generating member for generating radiation when the beam is incident on it; a control unit for controlling the incident position of the beam in the radiation generating member between a first incident position and a second incident position; a radiation detection unit having a plurality of pixels for detecting the radiation that has passed through the object, and acquiring a radiation image of the object based on the radiation detection results by the plurality of pixels; and an inspection unit for inspecting the object based on the radiation image, wherein the radiation detection unit acquires a first image as the radiation image when the incident position of the beam is the first incident position, and acquires a second image as the radiation image when the incident position of the beam is the second incident position, and the inspection unit inspects the object based on at least one of the first image and the second image. 【0008】 The inspection device described in [1] above makes it possible to acquire a first image and a second image of an object without moving the object. This makes it possible to easily acquire multiple radiographic images as needed. For example, if the inspection result of the object based on the first image is unsatisfactory, a second image for reinspection can be easily acquired. Alternatively, when inspecting an object based on both the first and second images, both the first and second images can be easily acquired in advance. Therefore, the inspection device described in [1] above makes it possible to easily inspect an object. 【0009】 [2] The inspection apparatus according to [1], wherein the radiation detection unit acquires both the first image and the second image by controlling the incident position between the first incident position and the second incident position by the control unit, and the inspection unit inspects the object based on both the first image and the second image. In this case, the object can be inspected with high accuracy. 【0010】[3] The inspection unit is the inspection apparatus described in [2], which inspects the presence or absence of foreign matter in the object based on the brightness difference between the first image and the second image. In this case, the presence or absence of foreign matter in the object can be inspected with high accuracy. 【0011】 [4] The inspection unit is an inspection device according to [2] or [3] that acquires height information of foreign objects in the object based on the first image and the second image. In this case, the user of the inspection device can understand the location of the foreign object. 【0012】 [5] The inspection device described in [4], wherein the inspection unit inspects whether the location of the foreign object is on the surface of the object or inside the object, based on the height information. In this case, the user of the inspection device can determine the specific location of the foreign object. 【0013】 [6] An inspection device according to any one of [1] to [5], further comprising a determination unit, wherein the radiation detection unit acquires a first image when the incident position is controlled by the control unit to the first incident position, the inspection unit inspects the object based on the first image, the determination unit determines whether or not to perform an inspection of the object based on the second image using the inspection result of the object in the inspection unit, and the inspection unit inspects the object based on the second image according to the determination result of the determination unit. In this case, since the inspection of the object based on the second image is performed as needed, the inspection of the object can be made more efficient. 【0014】 [7] The inspection apparatus according to [6], wherein the control unit controls the incident position from the first incident position to the second incident position according to the determination result of the determination unit, so that the radiation detection unit acquires the second image. In this case, the second image used for inspecting the object can be easily acquired. 【0015】 [8] The inspection device according to any one of [1] to [7], wherein the inspection unit inspects for the presence or absence of foreign matter in the object based on the brightness difference between predetermined areas in at least one of the first image and the second image. In this case, the presence or absence of foreign matter in the object can be easily inspected. 【0016】 [9] The inspection apparatus according to any one of [1] to [8], wherein the radiation generating member extends along a predetermined direction intersecting the central axis of the radiation, and the plurality of pixels are arranged along the predetermined direction. In this case, the image of the object (or foreign object) can be suitably moved with respect to the plurality of pixels between the state in which the beam incident position is a first incident position and the state in which the beam incident position is a second incident position. This makes it easier to acquire a first image and a second image that are different from each other. 【0017】

[10] The inspection apparatus according to any one of [1] to [9], wherein the radiation source is an X-ray source that irradiates X-rays as radiation, the beam emission unit is an electron gun that emits an electron beam as the beam, and the radiation generating member is a target that generates X-rays when the electron beam is incident on it. In this case, the inspection of an object using X-rays can be easily performed. 【0018】

[11] A first step of emitting a beam toward a first incident position in a radiation generating member that generates radiation when a beam is incident on it, and irradiating an object with the radiation; a second step of detecting the radiation that has passed through the object while the incident position of the beam is the first incident position, and acquiring a first image which is a radiation image of the object based on the radiation detection result; a third step of inspecting the object based on the first image; and a decision of whether or not to perform an inspection of the object based on a second image which is a different radiation image from the first image, using the inspection result of the object in the third step. An inspection method comprising: a fourth step of determining; a fifth step of controlling the incident position from the first incident position to the second incident position in the radiation generating member if the determination result in the fourth step indicates that the object should be inspected based on the second image; a sixth step of emitting the beam toward the second incident position and irradiating the object with the radiation; a seventh step of detecting the radiation that has passed through the object while the incident position is the second incident position, and acquiring the second image based on the radiation detection result; and an eighth step of inspecting the object based on the second image. 【0019】 In the inspection method described in

[11] above, when the determination result in the fourth step indicates that the object should be inspected based on the second image, it becomes possible to easily acquire the second image used for inspecting the object without moving the object. Therefore, the inspection method described in

[11] above makes it possible to easily inspect the object. 【0020】

[12] An inspection method comprising: a first step of emitting a beam toward a first incident position in a radiation generating member that generates radiation when a beam is incident on it, and irradiating an object with the radiation; a second step of detecting the radiation that has passed through the object while the incident position of the beam is at the first incident position, and acquiring a first image which is a radiation image of the object based on the radiation detection result; a third step of controlling the incident position from the first incident position to a second incident position in the radiation generating member; a fourth step of emitting the beam toward the second incident position, and irradiating the object with the radiation; a fifth step of detecting the radiation that has passed through the object while the incident position is at the second incident position, and acquiring a second image as a radiation image of the object based on the radiation detection result; and a sixth step of inspecting the object based on at least one of the first image and the second image. 【0021】 The inspection method described in

[12] above makes it possible to easily acquire the first and second images without moving the object. Therefore, the inspection method described in

[12] above makes it possible to easily inspect the object. 【0022】

[13] The inspection method according to

[12] , wherein the sixth step involves inspecting the object based on both the first image and the second image. In this case, the object can be inspected with high accuracy. 【0023】 According to this disclosure, the object can be easily inspected. 【0024】This is a schematic diagram showing the configuration of the inspection apparatus according to the embodiment. (a) to (c) are schematic diagrams showing the configuration of the X-ray source. (a) to (c) are schematic diagrams showing the configuration of the X-ray source. This is a flowchart for explaining the first example of the inspection method. (a) to (d) are schematic diagrams showing the irradiation of an object with X-rays in the first state. (a) to (d) are schematic diagrams showing the first image acquired in the first state shown in (a) to (d) of Figure 5. (a) to (c) are schematic diagrams showing the irradiation of an object with X-rays in the second state. (a) to (c) are schematic diagrams showing the second image acquired in the second state shown in (a) to (c) of Figure 7. (a) and (b) are schematic diagrams showing the irradiation of an object with X-rays when a structure exists inside the object. (a) and (b) are schematic diagrams showing the irradiation of an object with X-rays when a foreign object is present inside the object. (a) and (b) are schematic diagrams showing the irradiation of an object with X-rays when a foreign object is present on the surface of the object. This is a flowchart to explain a second example of the inspection method. (a) and (b) are schematic diagrams showing the brightness difference between pixels. (a) and (b) are schematic diagrams showing the movement of the image of a foreign object. (a) and (b) are schematic diagrams showing the movement of the image of a film-like object attached to the object. This is a flowchart to explain a third example of the inspection method. (a) to (c) are schematic diagrams showing the irradiation of an object with X-rays. 【0025】 Hereinafter, with reference to the drawings, preferred embodiments of the inspection apparatus and inspection method relating to one aspect of this disclosure will be described in detail. [Configuration of the inspection apparatus according to the embodiment] 【0026】 Figure 1 is a schematic diagram showing the configuration of an inspection apparatus according to an embodiment. Figures 2(a) to 2(c) and 3(a) to 3(c) are schematic diagrams showing the configuration of an X-ray source. The inspection apparatus 1 shown in Figure 1 is a device that acquires an X-ray image (radiation image) of an object OJ placed on an imaging table (not shown) and inspects the object OJ using the X-ray image. The inspection apparatus 1 is composed of an X-ray source 2 (radiation source), a control unit 3, an X-ray detection unit 4 (radiation detection unit), a processing unit 5, an X-ray source fixing jig 6, and a detection unit fixing jig 7. 【0027】 The inspection device 1 is, for example, a device used for X-ray non-destructive testing to magnify and observe an object OJ. In this case, the positional relationship (magnification) between the X-ray source 2, the object OJ (imaging stage), and the X-ray detection unit 4 can be adjusted in the inspection device 1 according to the purpose of observing the object OJ. 【0028】 The object OJ is positioned between the X-ray source 2 and the X-ray detection unit 4 in direction D1. In the following description, the direction perpendicular to direction D1 is referred to as direction D2 (a predetermined direction), and the direction perpendicular to both directions D1 and D2 is referred to as direction D3. Directions D2 and D3 are also directions that intersect the optical axis (central axis) of the X-ray. The X-ray source 2 is fixed to the X-ray source fixing jig 6, and the X-ray detection unit 4 is fixed to the detection unit fixing jig 7. As a result, the positions of the X-ray source 2 and the X-ray detection unit 4 are fixed. 【0029】 The X-ray source 2 emits X-rays along direction D1 and irradiates the target object OJ with these X-rays. The X-ray source 2 is a so-called transmission-type X-ray source. The X-ray source 2 includes an electron gun 21 (beam emitter), a target 22 (radiation generating member), a first deflection unit 23A, a second deflection unit 23B, a third deflection unit 23C, and a fourth deflection unit 23D. Note that in Figure 1, the target 22 and the deflection units 23A to 23D are not shown. The X-ray source 2 has, for example, a housing (not shown) that houses the electron gun 21 and the target 22, and the space inside the housing is a vacuumed space. The X-ray source 2 is communicated with the control unit 3, the X-ray detection unit 4, and the processing unit 5, respectively. 【0030】The electron gun 21 emits an electron beam EB toward the target 22 along direction D1. The electron gun 21 consists of a thermal cathode that emits thermionic electrons, and an electron lens that adjusts the focusing of the electron beam EB. The target 22 is a transmission-type target that generates X-rays when the electron beam EB is incident on it. Examples of materials that make up the target 22 include tungsten, molybdenum, cobalt, copper, silver, iron, or rhodium. The target 22 is formed in the shape of a plate extending along a plane perpendicular to direction D1. That is, the target 22 extends at least along direction D2. The target 22 may be formed on another support by methods such as deposition or sputtering, or it may be embedded in the support. For example, the support can be made of a material with high X-ray transparency such as beryllium, aluminum, diamond, carbon, silicon, or glass. 【0031】 Each of the first deflection section 23A, the second deflection section 23B, the third deflection section 23C, and the fourth deflection section 23D is composed of, for example, a deflection electrode. A positive or negative potential is applied to each of the deflection sections 23A to 23D by the control unit 3, which will be described later. In Figures 2(a) to (c), the deflection sections 23A and 23B are shown, while the deflection sections 23C and 23D are omitted. In Figures 3(a) to (c), the deflection sections 23C and 23D are shown, while the deflection sections 23A and 23B are omitted. 【0032】 The first deflection unit 23A and the second deflection unit 23B are arranged so as to straddle the trajectory of the electron beam EB in direction D2. Figure 2(a) shows the state in which the electron beam EB is not deflected (the state in which no potential is applied to the first deflection unit 23A and the second deflection unit 23B). Figure 2(b) shows the state in which the electron beam EB is deflected towards the second deflection unit 23B due to the electric field formed between the first deflection unit 23A and the second deflection unit 23B. Figure 2(c) shows the state in which the electron beam EB is deflected towards the first deflection unit 23A due to the electric field formed between the first deflection unit 23A and the second deflection unit 23B. 【0033】The third deflection section 23C and the fourth deflection section 23D are positioned to straddle the trajectory of the electron beam EB in direction D3. Figure 3(a) shows the state in which the electron beam EB is not deflected (the state in which no potential is applied to the third deflection section 23C and the fourth deflection section 23D). Figure 3(b) shows the state in which the electron beam EB is deflected towards the fourth deflection section 23D due to the electric field formed between the third deflection section 23C and the fourth deflection section 23D. Figure 3(c) shows the state in which the electron beam EB is deflected towards the third deflection section 23C due to the electric field formed between the third deflection section 23C and the fourth deflection section 23D. 【0034】 Each deflection section 23A to 23D only needs to be able to deflect the electron beam EB, and may be composed of deflection coils. Furthermore, the number and arrangement positions of the deflection sections are not particularly limited and may be determined as appropriate. 【0035】 The control unit 3 is communicatively connected to the X-ray source 2 and the processing unit 5, and is composed of a computer including, for example, a processor (CPU), and recording media such as RAM and ROM. The control unit 3 also includes, for example, a potential application unit for applying potential to the deflection units 23A to 23D. The control unit 3 controls the potential applied to the deflection units 23A to 23D, thereby deflecting the electron beam EB using the deflection units 23A to 23D. When the electron beam EB is deflected, the incident position of the electron beam EB on the target 22 changes. In other words, in the inspection device 1, the control unit 3 controls the incident position of the electron beam EB by deflecting the electron beam EB using the deflection units 23A to 23D. 【0036】As an example, as shown in Figure 2(b), the control unit 3 controls the incident position of the electron beam EB to the first incident position Y1 (an incident position located on the second deflection unit 23B side relative to the incident position Y0 when the electron beam EB is not deflected). Also, as shown in Figure 2(c), the control unit 3 controls the incident position of the electron beam EB to the second incident position Y2 (an incident position located on the first deflection unit 23A side relative to the incident position Y0). As shown in Figure 3(b), the control unit 3 controls the incident position of the electron beam EB to the third incident position Y3 (an incident position located on the fourth deflection unit 23D side relative to the incident position Y0). As shown in Figure 3(c), the control unit 3 controls the incident position of the electron beam EB to the fourth incident position Y4 (an incident position located on the third deflection unit 23C side relative to the incident position Y0). 【0037】 As a result, the control unit 3 controls the incident position of the electron beam EB between incident positions Y1 to Y4. The incident position of the electron beam EB is the focal position of the electron beam EB in the target 22, or in other words, the X-ray generation position (X-ray focal position) in the target 22. In other words, it can be said that the control unit 3 controls the X-ray focal position. 【0038】 As described above, the inspection device 1 can irradiate the object OJ with X-rays generated when the electron beam EB is incident at each of the incident positions Y1 to Y4. The X-rays that pass through the object OJ are incident on the X-ray detection unit 4. In the following description, the state in which the incident position of the electron beam EB is the first incident position Y1 is referred to as the "first state", the state in which the incident position of the electron beam EB is the second incident position Y2 is referred to as the "second state", the state in which the incident position of the electron beam EB is the third incident position Y3 is referred to as the "third state", and the state in which the incident position of the electron beam EB is the fourth incident position Y4 is referred to as the "fourth state". The control unit 3 can also be said to be switching the detection state between the first to fourth states. 【0039】In Figures 2(a) to 2(c) and 3(a) to 2(c), the incident position of the electron beam EB moved along direction D2 or direction D3. However, the control unit 3 may move the incident position of the electron beam EB along a direction inclined with respect to both direction D2 and direction D3 (for example, a direction inclined by 45 degrees with respect to each of direction D2 and direction D3) by controlling the potential applied to the deflection units 23A to 23D. In other words, the incident positions Y1 to Y4 in the first to fourth states are not limited to the positions shown in Figures 2(a) to 2(c) and 3(a) to 2(c). As shown in Figures 14(a) to 2(c) described later, the incident positions Y1 to Y3 may be aligned in direction D2. 【0040】 The X-ray detection unit 4 detects X-rays that have passed through the object OJ and acquires an X-ray image of the object OJ based on the detection result. The X-ray detection unit 4 is communicated with the X-ray source 2 and the processing unit 5, respectively. The X-ray detection unit 4 has a plurality of pixels 41 (see Figure 5(a) to (d), etc., described later) for detecting X-rays that have passed through the object OJ. The plurality of pixels 41 are arranged at least along direction D2. The X-ray detection unit 4 is, for example, an area sensor in which the plurality of pixels 41 are arranged in two dimensions. The X-ray detection unit 4 may also be a line sensor in which the plurality of pixels 41 are arranged in one dimension. In the following description, the X-ray image acquired by the X-ray detection unit 4 in the first state will be referred to as the "first image", the X-ray image acquired by the X-ray detection unit 4 in the second state will be referred to as the "second image", the X-ray image acquired by the X-ray detection unit 4 in the third state will be referred to as the "third image", and the X-ray image acquired by the X-ray detection unit 4 in the fourth state will be referred to as the "fourth image". The X-ray detection unit 4 acquires first to fourth images, each composed of the same number of pixels as the plurality of pixels 41. 【0041】 The processing unit 5 is connected to the X-ray source 2, the control unit 3, and the X-ray detection unit 4 in a communication manner, and is composed of a computer including, for example, a processor (CPU), and recording media such as RAM and ROM. The processing unit 5 has an inspection unit 51 and a determination unit 52. 【0042】The inspection unit 51 inspects the object OJ based on the X-ray image acquired by the X-ray detection unit 4. As an example, the inspection unit 51 inspects whether there is a foreign object in the object OJ. As an example, the inspection unit 51 inspects whether there is a foreign object in the object OJ based on the luminance difference between predetermined regions in the X-ray image. The predetermined region is a region composed of one or more pixels. When a plurality of pixels are included in the predetermined region, the luminance of the predetermined region may be the average value of the luminances of each pixel included in the predetermined region, or may be the maximum value, minimum value, or median value of the luminance. The inspection unit 51 may use the luminance difference between adjacent predetermined regions (for example, the luminance difference between adjacent pixels). When the luminance difference between the predetermined regions is greater than or equal to the threshold value, the inspection unit 51 outputs a detection result indicating that there is a foreign object in the object OJ. When the luminance difference between the predetermined regions is less than the threshold value, the inspection unit 51 outputs a detection result indicating that there is no foreign object in the object OJ. The threshold value may be a preset value. The threshold value may be a fixed value, or may be a variable value that is variable, for example, by user input. 【0043】 The inspection unit 51 may inspect whether there is a foreign object in the object OJ based on the luminance difference between two X-ray images. In other words, the inspection unit 51 may inspect whether there is a foreign object in the object OJ based on the difference between two X-ray images. As an example, when the luminance difference between a certain pixel in the first image and the pixel in the second image corresponding to the certain pixel is less than the threshold value, the inspection unit 51 outputs a detection result indicating that there is no foreign object in the object OJ. 【0044】 The inspection unit 51 may acquire height information of a foreign object in the object OJ based on two X-ray images. Details of the method for acquiring the height information will be described later. The inspection unit 51 may inspect whether the position of the foreign object is on the surface of the object OJ or inside the object OJ based on the height information. 【0045】The determination unit 52 determines whether to perform an inspection of the object OJ based on an X-ray image (for example, the second image) different from the X-ray image (for example, the first image) used in the inspection by the inspection unit 51, using the inspection result of the object OJ by the inspection unit 51. As an example, when the inspection result indicates that there is a foreign object in the object OJ, the determination unit 52 outputs a determination result indicating that an inspection of the object OJ based on another X-ray image is to be performed. In other words, the determination unit 52 determines whether a re-inspection using another X-ray image is necessary. [First example of inspection method] 【0046】 While referring to FIG. 4, a first example of an inspection method using the inspection apparatus 1 will be described. FIG. 4 is a flowchart for explaining the first example of the inspection method. 【0047】 In step S11, the electron gun 21 irradiates the object OJ with X-rays by emitting an electron beam EB toward the first incident position on the target 22 (first step). 【0048】 In step S12, the X-ray detection unit 4 detects the X-rays that have passed through the object OJ in the first state, and acquires a first image, which is an X-ray image of the object OJ, based on the detection result of the X-rays (second step). 【0049】 In step S13, the inspection unit 51 inspects the object OJ based on the first image (third step). The inspection unit 51 inspects the presence or absence of a foreign object in the object OJ based on, for example, the luminance difference between predetermined regions in the first image (for example, the luminance difference between adjacent pixels). The inspection unit 51 outputs an inspection result indicating that there is a foreign object in the object OJ, or an inspection result indicating that there is no foreign object in the object OJ. 【0050】In step S14, the determination unit 52 uses the inspection result of the object OJ in step S13 to determine whether or not to perform an inspection of the object OJ based on the second image. If the inspection result indicates that a foreign object is present in the object OJ, the determination unit 52 determines to perform an inspection of the object OJ based on the second image. If the inspection result indicates that there is no foreign object in the object OJ, the determination unit 52 determines that a re-inspection is unnecessary. If the determination result of the determination unit 52 indicates that an inspection of the object OJ based on the second image should be performed (step S14: YES), the process proceeds to step S15. If the determination result of the determination unit 52 indicates that a re-inspection is unnecessary (step S14: NO), the process ends without performing a re-inspection. 【0051】 In step S15, the control unit 3 controls the incident position of the electron beam EB from the first incident position to the second incident position according to the determination result by the determination unit 52 (fifth step). In other words, the control unit 3 switches the detection state from the first state to the second state. 【0052】 In step S16, the electron gun 21 emits an electron beam EB toward the second incident position on the target 22, thereby irradiating the object OJ with X-rays (sixth step). 【0053】 In step S17, the X-ray detection unit 4 detects the X-rays that have passed through the object OJ in the second state, and acquires a second image, which is an X-ray image of the object OJ, based on the X-ray detection result (step 7). 【0054】 In step S18, the inspection unit 51 inspects the object OJ based on the second image (step 8). The inspection unit 51 checks for the presence or absence of foreign matter in the object OJ based on, for example, the brightness difference between predetermined areas in the second image (for example, the brightness difference between adjacent pixels in the second image). The inspection unit 51 outputs an inspection result indicating that foreign matter is present in the object OJ, or an inspection result indicating that foreign matter is not present in the object OJ. 【0055】 If the inspection result indicates that foreign matter is present in the object OJ (Step S18: YES), proceed to Step S19. If the inspection result indicates that there is no foreign matter in the object OJ (Step S18: NO), the process ends. 【0056】 In step S19, the inspection unit 51 acquires height information of the foreign object in the object OJ based on the first and second images. Based on this height information, the inspection unit 51 may also inspect whether the foreign object is located on the surface of the object OJ or inside the object OJ. [Operation and Effects] 【0057】 As described above, in the first example of the inspection device 1 and inspection method, it is possible to acquire a first image and a second image of the object OJ without moving the object OJ. This makes it possible to easily acquire multiple X-ray images as needed. For example, if the inspection result of the object OJ based on the first image is unsatisfactory, a second image for reinspection can be easily acquired. Therefore, according to the first example of the inspection device 1 and inspection method, the inspection of the object OJ can be easily performed. 【0058】 Normally, if an inspection fails and a re-inspection is required, the object to be inspected must be put back into the inspection line, which is time-consuming and requires space. With inspection device 1, multiple inspections can be performed while the object to be inspected remains stationary, reducing the time and space required for re-inspections. 【0059】 Inspection device 1 is used, for example, in the food industry to inspect for foreign matter contamination in target products. In the food industry, it is desirable to prevent foreign matter contamination by performing multiple inspections of raw materials. With inspection device 1, by shifting the position of the X-ray focal point (the incident position of the electron beam EB), different locations in the raw material can be inspected more reliably. Furthermore, because the amount of X-ray focal point shift is highly reproducible, multiple inspections can be performed effectively. 【0060】 The inspection device 1 is used, for example, in the industrial product manufacturing field and the industrial material manufacturing field to inspect for foreign matter contamination in objects. In these fields, for example, in the manufacturing site of batteries such as lithium-ion batteries, it is desirable to prevent the contamination of battery raw materials with metal fragments. With the inspection device 1, the probability of detecting metal fragments can be increased by performing multiple inspections while shifting the position of the X-ray focal point (incident position of the electron beam EB). 【0061】In the inspection device 1, the inspection unit 51 inspects the object OJ based on both the first image and the second image. In the example in Figure 4, if the answer in step S14 is YES, in addition to the inspection using the first image, a re-inspection using the second image is performed. In this case, the object OJ can be inspected with high accuracy. 【0062】 In the inspection device 1, the inspection unit 51 acquires height information of foreign objects in the object OJ based on the first and second images. In this case, the user can understand the location of the foreign object. 【0063】 In the inspection device 1, the inspection unit 51 may inspect, based on height information, whether the foreign object is on the surface of the object OJ or inside the object OJ. In this case, the user can determine the specific location of the foreign object. 【0064】 In the inspection device 1, the determination unit 52 uses the inspection results of the object OJ in the inspection unit 51 to determine whether or not to perform an inspection of the object OJ based on the second image, and the inspection unit 51 inspects the object OJ based on the second image according to the determination result by the determination unit 52. In this case, since the inspection of the object OJ based on the second image is performed as needed, the inspection of the object OJ can be made more efficient. 【0065】 In the inspection device 1, the control unit 3 controls the incident position of the electron beam EB from the first incident position Y1 to the second incident position Y2 according to the determination result of the determination unit 52, so that the X-ray detection unit 4 acquires a second image. In this case, a second image used for inspecting the object OJ can be easily acquired. 【0066】 In the inspection device 1, the inspection unit 51 inspects for the presence or absence of foreign matter in the object OJ based on the brightness difference between predetermined areas in at least one of the first image and the second image. In this case, the presence or absence of foreign matter in the object OJ can be easily inspected. 【0067】In the inspection device 1, the target 22 extends along direction D2, and a plurality of pixels 41 are arranged along direction D2. In this case, the image of the object OJ (or foreign object) can be suitably moved relative to the plurality of pixels 41 between the first state and the second state. This makes it easier to acquire a first image and a second image that are different from each other. [Specific example of inspection method] 【0068】 Referring to Figures 5 to 11, a specific example of the inspection method shown in Figure 4 will be explained. 【0069】 Figures 5(a) to 5(d) are schematic diagrams showing the irradiation of the object OJ with X-rays in the first state. In Figure 5(a), there is no foreign matter on the object OJ; in Figure 5(b), foreign matter F is present on the surface Su of the object OJ; in Figure 5(c), foreign matter F is present inside the object OJ; and in Figure 5(d), foreign matter F is present on both the surface Su and inside the object OJ. In Figure 5(d), two foreign matter F of different sizes are overlapping. The surface Su is the side facing the X-ray source 2 (X-ray focal point). In Figures 5(a) to 5(d), the inspection area IP is shown as a dotted line. 【0070】 The inspection unit 51 inspects the object OJ based on the first image acquired in the first state shown in Figures 5(a) to 5(d) (step S13). Figures 6(a) to 6(d) are schematic diagrams showing the first image acquired in the first state shown in Figures 5(a) to 6(d). The inspection unit 51 outputs an inspection result indicating that there is no foreign matter F in the object OJ shown in Figure 5(a) based on the X-ray image shown in Figure 6(a). In this case, the process ends without performing a reinspection (step S14: NO). 【0071】 The inspection unit 51 outputs an inspection result indicating the presence of a foreign object F in the object OJ shown in Figures 5(b) to 5(d), based on the X-ray images shown in Figures 6(b) to 6(d). In this case, the process proceeds to step S15 (inspection of the object OJ based on the second image). Note that in Figures 5(b) to 5(d), X-rays are irradiated from the first incident position Y1, which is located directly above the foreign object F, so similar first images are acquired between Figures 6(b) and 6(d). 【0072】 Figures 7(a) to 7(c) are schematic diagrams showing the irradiation of the object OJ with X-rays in the second state. The position of the foreign object F in each of Figures 7(a) to 7(c) is the same as the position of the foreign object F in each of Figures 5(b) to 7(d). The inspection unit 51 inspects the object OJ based on the second image acquired in the second state shown in Figures 7(a) to 7(c) (step S18). Figures 8(a) to 8(c) are schematic diagrams showing the second image acquired in the second state shown in Figures 7(a) to 7(c). In each of Figures 8(a) to 8(c), the image of the foreign object F shown in Figures 6(b) to 7(d) is shown as a dotted line. As shown in Figures 8(a) to 8(c), the position of the foreign object F shown in the second image differs depending on the position of the foreign object F. In this way, by performing a re-examination in a second state with a shifted X-ray focal point, it is possible to distinguish whether the foreign substance F is present on the surface Su of the object OJ, whether the foreign substance F is present inside the object OJ, or whether two foreign substances F are present on the surface Su and inside the object OJ and overlapping. 【0073】 Figures 9(a) and 9(b) are schematic diagrams showing the irradiation of an object OJ with X-rays when two structures ST are present inside the object OJ. In the examples of Figures 9(a) and 9(b), the presence or absence of foreign matter inside the object OJ is inspected. The two structures ST overlap in direction D1. Note that structures ST are not foreign matter. 【0074】 The inspection unit 51 inspects the object OJ based on the first image acquired in the first state shown in Figure 9(a) (step S13). Here, the first incident position Y1 (X-ray focal position) overlaps with the two structures ST when viewed from direction D1. The overlapping of the images of the two structures ST results in, for example, a relatively small brightness in pixel 41. In this case, the inspection unit 51 identifies the structures ST as foreign objects and outputs an inspection result indicating the presence of foreign objects in the object OJ. 【0075】The inspection unit 51 inspects the object OJ based on the second image acquired in the second state shown in Figure 9(b) (step S18). In the second state, the X-ray focal position is shifted from the X-ray focal position in the first state, and as a result, the images of the two structures ST can be separated from each other. If the images of the two structures ST that overlapped in the first image are separated in the second image, the inspection unit 51 does not consider the structures ST to be foreign objects, and outputs an inspection result indicating that there are no foreign objects in the object OJ. Thus, even if the structures ST cannot be distinguished from foreign objects because they overlap in the first image, the overlap of the two structures ST can be grasped in the second image, and as a result, it can be determined that the structures ST are not foreign objects (there are no foreign objects in the object OJ). In this way, the inspection unit 51 may inspect for the presence or absence of foreign objects in the object OJ based on the separation of images between the first image and the second image. 【0076】 The inspection method described above is effective, for example, in the food industry. In this field, as shown in Figure 9(a), non-foreign objects may overlap and be mistakenly identified as foreign objects. In this case, good products may be mistakenly identified as foreign objects, potentially leading to a decrease in yield. However, as shown in Figure 9(b), by shifting the position of the X-ray focal point (the incident position of the electron beam EB) and performing a re-inspection, it is possible to identify the overlap of non-foreign objects and avoid false detections. 【0077】 Referring to Figures 10 and 11, the method for obtaining height information of the foreign object in step S19 will be explained. Figures 10(a) and 10(b) are schematic diagrams showing the irradiation of an object OJ with X-rays when a foreign object F is present inside the object OJ. Figure 10(a) shows the irradiation of X-rays in the first state, and Figure 10(b) shows the irradiation of X-rays in the second state. Here, the distance between the first incident position Y1 and the second incident position Y2 (the amount of movement of the X-ray focal point between the first state and the second state) is denoted as distance D, and the amount of movement of the image of the foreign object F between the first state and the second state is denoted as movement amount P1. 【0078】Figures 11(a) and 11(b) are schematic diagrams showing the irradiation of an object OJ with X-rays when a foreign object F is present on the surface Su of the object OJ. The surface Su is the surface on the side of the X-ray source 2 (X-ray focal point). Figure 11(a) shows the irradiation of X-rays in the first state, and Figure 11(b) shows the irradiation of X-rays in the second state. Here, the distance between the first incident position Y1 and the second incident position Y2 is denoted as distance D, and the amount of movement of the image of the foreign object F between the first state and the second state is denoted as movement amount P2. The amount of movement of the X-ray focal point is the same in Figures 10 and 11. 【0079】 In the case of Figure 10, the ratio of the amount of movement P1 to the distance D (P1 / D) is smaller than the ratio of the amount of movement P2 to the distance D (P2 / D) in the case of Figure 11. This is because the foreign object F located inside the object OJ is located closer to the X-ray detection unit 4 than the foreign object F located on the surface Su of the object OJ. In other words, the ratio of the amount of movement of the image of the foreign object F to the amount of movement of the X-ray focal point changes depending on the distance from the X-ray detection unit 4 to the foreign object F. Using this point, in step S19, the inspection unit 51 calculates the magnification of the foreign object F based on the distance between the first incident position Y1 and the second incident position Y2 (amount of movement of the X-ray focal point) and the amount of movement of the image of the foreign object F between the first state and the second state. Based on the magnification, the X-ray detection unit 4 acquires height information of the foreign object F (for example, the distance from the X-ray detection unit 4 to the foreign object F). 【0080】 In step S19, the inspection unit 51 inspects whether the location of the foreign object F is on the surface Su of the target object OJ or inside the target object OJ, based on the height information of the foreign object F. [Second example of inspection method] 【0081】 Referring to Figure 12, a second example of the inspection method using the inspection device 1 will be described. Figure 12 is a flowchart illustrating the second example of the inspection method. In the second example, unlike the first example shown in Figure 4, both the first and second images are acquired before inspecting the object OJ. 【0082】In step S21, the electron gun 21 emits an electron beam EB toward the first incident position on the target 22, thereby irradiating the object OJ with X-rays (first step). In step S22, the X-ray detection unit 4 acquires a first image (second step). 【0083】 In step S23, the control unit 3 controls the incident position of the electron beam EB from the first incident position to the second incident position (third step). 【0084】 In step S24, the electron gun 21 emits an electron beam EB toward the second incident position on the target 22, thereby irradiating the object OJ with X-rays (fourth step). In step S25, the X-ray detection unit 4 acquires a second image (fifth step). 【0085】 In step S26, the inspection unit 51 inspects the object OJ based on both the first and second images (sixth step). 【0086】 According to the second example of the inspection method described above, both the first and second images can be easily acquired before inspecting the object based on both images. Therefore, the inspection of the object OJ can be easily performed. 【0087】 Referring to Figures 13 to 15, a specific example of the examination using both the first and second images in step S26 will be explained. 【0088】 Figures 13(a) and 13(b) are schematic diagrams showing the brightness difference between pixels 41. Figures 13(a) and 13(b) show the brightness of each pixel 41 when the area without foreign matter is set to 100%. Figure 13(a) shows the brightness B1 in the first image acquired in the first state and the brightness B2 that should have been acquired. Figure 13(b) shows the brightness B3 in the second image acquired in the second state and the brightness B4 that should have been acquired. 【0089】In Figure 13(a), the brightness B1 in the first image is less affected by the foreign object's image crossing the boundary between pixels 41, resulting in a smaller drop (change) in brightness and making it less likely to be detected as a foreign object. For example, if a foreign object is determined to be present when the brightness difference between predetermined areas (e.g., the brightness difference between adjacent pixels 41) is 20% or more, then although the original brightness difference is 25% (100% - 75%), and therefore a foreign object should be determined to be present, the actual brightness difference in the first image is 12% (100% - 88%), so it is determined that there is no foreign object. 【0090】 On the other hand, in Figure 13(b), the shift in the X-ray focal position prevents the image of the foreign object from being aligned at the boundary between pixels 41, and as a result, the brightness B3 in the second image closely matches the brightness B4 that should have been acquired. Since the brightness difference in the second image is 25% (100% - 75%), it is determined that a foreign object is present. In this way, by using both the first and second images for inspection, the presence or absence of foreign objects in the object OJ can be inspected with high accuracy. 【0091】 Figures 14(a) and 14(b) are schematic diagrams illustrating the movement of the image of a foreign object. Figure 14(a) shows the image Z1 of the foreign object formed on the pixel 41 in the first state, and Figure 14(b) shows the image Z2 of the foreign object formed on the pixel 41 in the second state. 【0092】 In Figure 14(a), the image Z1 of the foreign object is formed so as to span across four pixels 41. As a result, the contrast of each of the four pixels 41 is reduced due to the foreign object, and insufficient contrast (brightness difference) may not be obtained. In other words, there are cases where the presence of a foreign object should be detected, but it is incorrectly determined that there is no foreign object. 【0093】 On the other hand, in Figure 14(b), the shift in the X-ray focal position causes the image Z2 of the foreign object to be formed in a single pixel 41. This provides sufficient contrast (difference in brightness), allowing the presence of a foreign object to be determined. In this way, by using both the first and second images for inspection, the presence or absence of foreign objects in the object OJ can be inspected with high accuracy. 【0094】Figures 15(a) and 15(b) are schematic diagrams showing the movement of an image of a film-like object placed on an object OJ. Figure 15(a) shows the image Z3 of the film-like object formed on the pixel 41 in the first state, and Figure 15(b) shows the image Z4 of the film-like object formed on the pixel 41 in the second state. The film-like object is, for example, a film covering the surface of the object OJ, and is not a foreign object. 【0095】 In Figure 15(a), the image Z3 of the film-like object is formed to cover four pixels 41, resulting in a decrease in brightness at each of the four pixels 41. In Figure 15(b), the image Z4 of the film-like object moves as the X-ray focal position shifts, but because the area of ​​the film-like object is large, the image Z4 of the film-like object is formed to cover four pixels 41. That is, the brightness of each of the four pixels 41 does not change between the first state and the second state. Utilizing this point, the inspection unit 51 outputs a detection result indicating that there is no foreign matter in the object OJ (the decrease in brightness is due to the film-like object) if the brightness difference between a certain pixel in the first image and the corresponding pixel in the second image is less than a threshold. Using this method, when performing an inspection where film-like objects (soft materials) are accepted and foreign matter (hard materials) are rejected, it is possible to determine that the film-like object is not a foreign matter. In other words, the presence or absence of foreign matter in the object OJ can be inspected with high accuracy. Note that the film-like object is not limited to a film; it may also be a membrane or a layer. [Third example of testing method] 【0096】A third example of an inspection method using the inspection device 1 will be described with reference to Figures 16 and 17. Figure 16 is a flowchart for explaining the third example of the inspection method. Figures 17(a) to (c) are schematic diagrams showing the irradiation of an object with X-rays. In the third example, when inspecting each of the inspection points IP1, IP2, and IP3 on the object OJ, the incident position of the electron beam EB (the focal position of the X-rays) is controlled. The inspection points IP1, IP2, and IP3 are, for example, through-holes provided in a substrate. When performing dimensional inspection of through-holes, it is desirable to inspect the geometric positional relationship between the X-ray generation position and the position of the through-hole in order to reduce the effect of oblique X-ray entry. 【0097】 In step S31, the electron gun 21 emits an electron beam EB toward the first incident position Y1 on the target 22, thereby irradiating the object OJ with X-rays (Figure 17(a)). In the example in Figure 17(a), the first incident position Y1 overlaps with the inspection point IP1 when viewed from direction D1. In step S32, the X-ray detection unit 4 acquires a first image. In step S33, the inspection unit 51 inspects the object OJ based on the first image. This inspects the inspection point IP1. 【0098】 In step S34, the control unit 3 controls the incident position of the electron beam EB to the second incident position Y2. 【0099】 In step S35, the electron gun 21 emits an electron beam EB toward the second incidence position Y2 on the target 22, thereby irradiating the object OJ with X-rays (Figure 17(b)). In the example in Figure 17(b), the second incidence position Y2 overlaps with the inspection point IP2 when viewed from direction D2. In step S36, the X-ray detection unit 4 acquires a second image. In step S37, the inspection unit 51 inspects the object OJ based on the second image. This inspects the inspection point IP2. 【0100】 In step S38, the control unit 3 controls the incident position of the electron beam EB to the third incident position Y3. 【0101】In step S39, the electron gun 21 emits an electron beam EB toward the third incidence position Y3 on the target 22, thereby irradiating the object OJ with X-rays (Figure 17(c)). In the example in Figure 17(c), the third incidence position Y3 overlaps with the inspection point IP3 when viewed from direction D2. In step S40, the X-ray detection unit 4 acquires a third image. In step S41, the inspection unit 51 inspects the object OJ based on the third image. This inspects the inspection point IP3. 【0102】 The third example of the inspection method described above yields the following advantages. If the electron beam EB's incident position (X-ray focal position) is not controlled, when inspecting multiple inspection points, it is necessary to move the object OJ to effectively irradiate each inspection point with X-rays, which is time-consuming due to the movement and stopping of the object OJ. In contrast, the third example of the inspection method described above eliminates the need to move and stop the object OJ. This reduces inspection time. [Modification] 【0103】 This disclosure is not limited to the embodiments described above. For example, the materials and shapes of each component are not limited to those described above, but can be made from a variety of materials and shapes. 【0104】 In the second example of the inspection method shown in Figure 12, both the first and second images were used for inspection in step S26, but in step S26, only one of the first or second images may be used for inspection. Also, although the first and second images were acquired in steps S21 to S25, the number of X-ray images acquired is not limited, and three or more X-ray images may be acquired. In this case, in step S26, all three or more X-ray images may be used for inspection, or at least one of the three or more X-ray images may be used for inspection. 【0105】 In the inspection device 1, the X-ray source 2 was a so-called transmission-type X-ray source, but the X-ray source 2 may also be a so-called reflection-type X-ray source. 【0106】The inspection device 1 may be an inspection device capable of acquiring a radiographic image of an object using radiation other than X-rays (for example, electron beams, beta rays, or gamma rays). In this case, the X-ray source 2 may be a radiation source that generates radiation other than X-rays (for example, electron beams, beta rays, or gamma rays). These radiation sources do not need to have a radiation generating component; for example, in the case of electron beams, the electron beam generated from the electron gun is directly irradiated onto the object. The X-ray detection unit 4 may be a radiation detection unit that detects radiation other than X-rays and acquires a radiographic image of the object based on the detection result. 【0107】 In the inspection device 1, the control unit 3 controls the X-ray generation position (X-ray focal position) by controlling the incident position of the electron beam EB. However, as described above, if the radiation generating member is omitted from the radiation source, the control unit 3 may directly control the focal position of the radiation emitted from the radiation source between the first focal position and the second focal position. The inspection unit 51 may inspect the object OJ based on at least one of the first image acquired as a radiation image in the first state where the focal position is the first focal position, and the radiation image in the second state where the focal position is the second focal position. 【0108】 In the first example of the inspection method shown in Figure 4, if the determination unit 52 determines in step S14 that re-inspection is unnecessary, the process is terminated without performing a re-inspection. However, even if the determination unit 52 determines that re-inspection is unnecessary (i.e., the first image is acceptable), a second image may be acquired and an inspection based on the second image may be performed. 【0109】The inspection device 1 may use a line sensor type X-ray detection unit 4. The operation when a typical line sensor type X-ray detection unit 4 is used will be described below. Assume that the magnification is 2x and the object is being transported at 24 m / min. At this time, the X-ray image projected onto the pixels of the line sensor will move at a speed equivalent to 48 m / min, depending on the magnification. If the pixel pitch of the line sensor is 0.4 mm, imaging (scanning) will be performed every 0.4 mm movement of the X-ray image, resulting in imaging at 2000 scans / second. That is, imaging will be performed once every 0.5 milliseconds. When controlling the electron beam EB to a first incident position Y1 and a second incident position Y2, the electron beam EB will be switched at intervals of 0.25 milliseconds. The X-ray detection unit 4 will be configured to take an image once every 0.25 milliseconds in conjunction with the switching of the electron beam EB. The switching of the electron beam EB and the scanning of the X-ray detection unit 4 must be timed together. At this time, the line sensor will take an image at 4000 scans / second. If the lines when the electron beam EB is incident at the first incident position Y1 are considered even lines, then the lines when the electron beam EB is incident at the second incident position Y2 are considered odd lines. By creating an image using only the signals from the even lines, an X-ray image of the X-ray incident at the first incident position Y1 can be created, and by creating an image using only the signals from the odd lines, an X-ray image of the X-ray incident at the second incident position Y2 can be created. By imaging in this way, even when using a line sensor type X-ray detection unit 4, multiple images can be generated, enabling inspection using multiple images. 【0110】The method described above is an imaging method for maintaining the aspect ratio (width-to-height ratio) of the X-ray image of the object. In X-ray inspections, it is not uncommon for the aspect ratio to be not maintained (a square object may be transformed into a rectangular X-ray image), in which case imaging may be performed at a different time than that described above. Specifically, when controlling the electron beam EB to the first incidence position Y1 and the second incidence position Y2, the electron beam EB may be switched at 0.5 millisecond intervals, and the X-ray detection unit 4 may be imaged at 2000 scans / second, i.e., imaged once every 0.5 milliseconds. Here, the case of switching the electron beam EB at two points has been described, but it may also be switched at three or more points. When switching at three points, inspection from three X-ray images can be achieved by generating X-ray images corresponding to each incidence position. 【0111】 1...Inspection device, 2...X-ray source (radiation source), 3...Control unit, 4...X-ray detection unit (radiation detection unit), 21...Electron gun (beam emission unit), 22...Target (radiation generating member), 41...Pixel, 51...Inspection unit, 52...Determination unit, D2...Direction (predetermined direction), EB...Electron beam, F...Foreign object, OJ...Target object, Su...Surface, Y1...First incident position, Y2...Second incident position.

Claims

1. An inspection device comprising: a radiation source for irradiating an object with radiation, the radiation source having a beam emission unit for emitting a beam and a radiation generating member for generating radiation when the beam is incident on it; a control unit for controlling the incident position of the beam in the radiation generating member between a first incident position and a second incident position; a radiation detection unit having a plurality of pixels for detecting the radiation that has passed through the object, and acquiring a radiation image of the object based on the radiation detection results by the plurality of pixels; and an inspection unit for inspecting the object based on the radiation image, wherein the radiation detection unit acquires a first image as the radiation image when the incident position of the beam is the first incident position, and acquires a second image as the radiation image when the incident position of the beam is the second incident position, and the inspection unit inspects the object based on at least one of the first image and the second image.

2. The inspection apparatus according to claim 1, wherein the radiation detection unit acquires both the first image and the second image by controlling the incident position between the first incident position and the second incident position by the control unit, and the inspection unit inspects the object based on both the first image and the second image.

3. The inspection device according to claim 2, wherein the inspection unit inspects for the presence or absence of foreign matter in the object based on the brightness difference between the first image and the second image.

4. The inspection device according to claim 2, wherein the inspection unit acquires height information of foreign matter in the object based on the first image and the second image.

5. The inspection device according to claim 4, wherein the inspection unit inspects whether the position of the foreign object is on the surface of the object or inside the object, based on the height information.

6. The inspection apparatus according to claim 1, further comprising a determination unit, wherein the radiation detection unit acquires a first image when the incident position is controlled by the control unit to the first incident position, the inspection unit inspects the object based on the first image, the determination unit determines whether or not to perform an inspection of the object based on the second image using the inspection result of the object in the inspection unit, and the inspection unit inspects the object based on the second image according to the determination result of the determination unit.

7. The inspection apparatus according to claim 6, wherein the control unit controls the incident position from the first incident position to the second incident position according to the determination result of the determination unit, so that the radiation detection unit acquires the second image.

8. The inspection device according to claim 1, wherein the inspection unit inspects for the presence or absence of foreign matter in the object based on the brightness difference between predetermined areas in at least one of the first image and the second image.

9. The inspection apparatus according to claim 1, wherein the radiation generating member extends along a predetermined direction intersecting the central axis of the radiation, and the plurality of pixels are arranged along the predetermined direction.

10. The inspection apparatus according to claim 1, wherein the radiation source is an X-ray source that irradiates X-rays as radiation, the beam emission unit is an electron gun that emits an electron beam as the beam, and the radiation generating member is a target that generates X-rays when the electron beam is incident on it.

11. A first step of emitting a beam toward a first incidence position in a radiation generating member that generates radiation when a beam is incident on it, and irradiating the object with the radiation; a second step of detecting the radiation that has passed through the object while the incident position of the beam is the first incidence position, and acquiring a first image which is a radiation image of the object based on the radiation detection result; a third step of inspecting the object based on the first image; a fourth step of determining whether or not to perform an inspection of the object based on a second image which is a different radiation image from the first image, using the inspection result of the object in the third step; a fifth step of controlling the incident position from the first incidence position to the second incidence position in the radiation generating member if the determination result in the fourth step indicates that the inspection of the object based on the second image should be performed; a sixth step of emitting the beam toward the second incidence position, and irradiating the object with the radiation; a seventh step of detecting the radiation that has passed through the object while the incident position is the second incidence position, and acquiring a second image based on the radiation detection result; An inspection method comprising: an eighth step of inspecting the object based on the second image.

12. An inspection method comprising: a first step of emitting a beam toward a first incidence position in a radiation generating member that generates radiation when a beam is incident on it, and irradiating an object with the radiation; a second step of detecting the radiation that has passed through the object while the incident position of the beam is at the first incidence position, and acquiring a first image which is a radiation image of the object based on the radiation detection result; a third step of controlling the incident position from the first incidence position to a second incidence position in the radiation generating member; a fourth step of emitting the beam toward the second incidence position, and irradiating the object with the radiation; a fifth step of detecting the radiation that has passed through the object while the incident position is at the second incidence position, and acquiring a second image as a radiation image of the object based on the radiation detection result; and a sixth step of inspecting the object based on at least one of the first image and the second image.

13. The inspection method according to claim 12, wherein the sixth step involves inspecting the object based on both the first image and the second image.

Images