Probe pin for inspecting electrical characteristics, probe card, and manufacturing method therefor

Abstract

A probe pin (10) for inspecting electrical characteristics includes a pin body (12) that is composed of a copper alloy containing 6.0-30.0 mass% silver, the remainder being copper and unavoidable impurities. The pin body (12) is cut from a copper alloy foil (11) by laser processing.

Description

Probe Pin for Electrical Characteristic Inspection, Probe Card, and Method for Manufacturing the Same 【0001】 The present invention relates to a probe pin for electrical characteristic inspection, a probe card, and a method for manufacturing the same. 【0002】 A probe pin (probe pin for electrical characteristic inspection) used for energization inspection of a semiconductor device is formed into a pin shape by machining such as cutting, polishing, and pressing. In recent years, as a method for manufacturing a probe pin, a method has also been developed in which a probe pin is cut out by ultraviolet exposure and etching in a state where a photomask is disposed on a metal foil (see, for example, Patent Document 1). 【0003】 Patent Document 1 describes manufacturing a contact pin by performing an etching process on a copper-silver alloy plate. In the etching process for the copper-silver alloy plate, after exposing a copper-silver alloy plate coated with a photosensitive substance with a mask pattern having a pattern corresponding to the contact pin, the copper-silver alloy plate is impregnated with an etching solution to cut out the contact pin. The method for manufacturing a contact pin described in Patent Document 1 is considered effective for products that require high dimensional accuracy because precise machining can be performed. 【0004】 Japanese Patent Application Laid-Open No. 2022-50442 【0005】 However, the manufacturing method described in Patent Document 1 requires a pre-bake process of heating at a temperature in the range of about 100°C to 400°C for a predetermined time to solidify the photosensitive substance, and there is a problem that softening of the copper-silver alloy plate due to heating causes a decrease in the life when used as a probe pin. In addition, there is a problem that the copper-silver alloy plate is deformed due to relaxation of residual stress caused by heating. Further, the manufacturing method described in Patent Document 1 places a large burden on the environment, such as disposal of the etching solution used in the etching process of the copper-silver alloy plate. 【0006】The main object of the present invention is to provide a method for manufacturing probe pins for electrical property testing that suppresses the reduction in lifespan of probe pins due to softening and deformation due to heat, and has a low environmental impact, as well as probe pins for electrical property testing that can be manufactured by this method, and a probe card including probe pins for electrical property testing. 【0007】 To solve the above problems, according to one aspect of the present invention, there is a probe pin for electrical property testing, comprising a pin body made of a copper alloy containing 6.0 to 30.0% by mass of silver, with the remainder being copper and unavoidable impurities, wherein the cross-sectional shape in a direction perpendicular to the longitudinal direction of the probe pin is substantially trapezoidal, and the ratio of the length of the lower base to the length of the upper base in the trapezoidal shape is 60% or more and less than 100%. 【0008】 To solve the above problems, according to one aspect of the present invention, a probe card is provided that includes probe pins for electrical characteristic testing. 【0009】 To solve the above problems, according to one aspect of the present invention, there is a probe pin for electrical property testing that includes a pin body made of a copper alloy containing 6.0 to 30.0% by mass of silver, with the remainder being copper and unavoidable impurities, wherein the pin body is cut out from a foil of the copper alloy by laser processing. 【0010】 To solve the above problems, according to one aspect of the present invention, there is a method for manufacturing a probe pin for electrical property testing, which includes a pin body made of a copper alloy containing 6.0 to 30.00 mass% silver, with the remainder being copper and unavoidable impurities, comprising the steps of: preparing a foil of the copper alloy; and cutting out the pin body from the foil of the copper alloy by laser processing. 【0011】 According to the present invention, it is possible to provide probe pins and probe cards for electrical characteristic testing that suppress the reduction in probe pin life due to softening and deformation due to heat, and that have a low environmental impact. 【0012】Figure 1 is a flowchart of the manufacturing method for probe pins for electrical characteristic testing. Figures 2A and 2B are schematic diagrams illustrating the cutting process. Figures 3A and 3B show the configuration of probe pins for electrical characteristic testing. Figure 4 shows a probe unit for testing the electrical characteristics of an object under test and the lead wires connected thereto. Figure 5 shows a probe card for testing the electrical characteristics of an object under test and the lead wires connected thereto. 【0013】 The following describes a probe pin for electrical characteristic testing (hereinafter also simply referred to as "probe pin"), a probe card, and a method for manufacturing the same according to one embodiment of the present invention. However, the probe pin for electrical characteristic testing, the probe card, and the method for manufacturing the same according to the present invention are not limited to the embodiments shown below. In this specification, the "~" indicating a numerical range includes both an upper and lower limit. 【0014】 (Method for manufacturing probe pins for electrical characteristic testing) Figure 1 is a flowchart of the method for manufacturing probe pins for electrical characteristic testing. Figure 2A shows the process of irradiating a copper alloy foil with laser light, and Figure 2B shows the state after irradiation with laser light. 【0015】 As shown in Figures 1, 2A, and 2B, the method for manufacturing the probe pin 10 for electrical characteristic testing (Figure 3A) according to this embodiment includes a step of preparing copper alloy foil 11 (preparation step (S110)) and a step of cutting out the pin body 12 from the copper alloy foil 11 by laser processing (cutting step (S120)). The method for manufacturing the probe pin 10 for electrical characteristic testing according to this embodiment may also include a step of forming a plating layer 13 on the surface of the cut-out pin body 12 (plating step (S130)) and a step of covering the cut-out pin body 12, or a part of the surface of the pin body 12 having the plating layer 13, with an insulating film 14 (coating step (S140)). 【0016】In the preparation step (S110), a copper alloy foil 11 is prepared. The copper alloy contains silver, with the remainder being copper and unavoidable impurities. Examples of unavoidable impurities include tin, beryllium, zinc, nickel, magnesium, aluminum, titanium, zirconium, indium, silicon, and phosphorus. The unavoidable impurities may be one type or two or more types. The silver content is appropriately selected according to the desired properties of the probe pin (pin body), but is between 6.0 and 30.0 mass%, with 10.0 to 25.0 mass% being more preferable. If the silver content is less than 6.0 mass%, the hardness of the probe pin cannot be made within the desired range. On the other hand, if the silver content exceeds 30.0 mass%, the effect commensurate with the cost of adding silver cannot be obtained. The copper alloy foil 11 may be manufactured by any method, for example, by thinly rolling out any cast sheet material. The thickness of the copper alloy foil 11 is appropriately selected according to the thickness (thickness) of the probe pin (pin body), and is preferably in the range of 0.001 to 0.200 mm. 【0017】 As shown in Figures 2A and 2B, in the cutting process (S120), the prepared copper alloy foil 11 is irradiated with laser light 20 to cut out the pin body 12. Specifically, the pin body 12 is cut out from the copper alloy foil 11 by scanning the laser light 20 along the outer edge of the pin body 12 to be cut out. As shown in Figure 2B, the shape of the cross section (transverse plane) perpendicular to the longitudinal direction of the cut-out pin body 12 may be approximately trapezoidal due to the effect of laser processing. In this case, of the two main surfaces (front and back) of the copper alloy foil 11, the side corresponding to the surface irradiated with laser light 20 (the upper surface in Figure 2B) becomes longer (the upper base of the trapezoid), and the side corresponding to the opposite surface (the lower surface in Figure 2B) becomes shorter (the lower base of the trapezoid). 【0018】 The type of laser light 20 used in laser processing is not particularly limited. Examples of laser light 20 include continuous wave (CW) laser light, a continuously wave laser light modulated by CWM (continuous wave-modulated) laser light, and pulsed laser light. From the viewpoint of processing quality, pulsed laser light is preferred. 【0019】The wavelength of the laser light 20 is not particularly limited as long as the pin body 12 can be properly cut from the copper alloy foil 11. The wavelength of the laser light 20 is preferably in the range of 100 to 600 nm, and more preferably in the range of 250 to 550 nm. 【0020】 The pulse width, repetition frequency, and pulse energy of the laser beam 20 are not particularly limited as long as the pin body 12 can be properly cut from the copper alloy foil 11. From the viewpoint of improving processing quality, the pulse width of the laser beam 20 is preferably in the range of 100 femtoseconds to 500 picoseconds. 【0021】 The output of the laser beam 20 is not particularly limited as long as it can properly cut the pin body 12 from the copper alloy foil 11. From the viewpoint of increasing the processing speed, the output of the laser beam 20 is preferably 1 mW or more, and more preferably 25 mW or more. 【0022】 The number of scans of the laser beam 20 is not particularly limited as long as the pin body 12 can be cut out. The laser beam 20 may scan multiple times along the outer edge of the pin body 12, or it may scan only once. From the viewpoint of not causing thermal deformation of the cut-out pin body 12, it is preferable that the laser beam 20 scans over multiple turns. The scanning direction of the laser beam 20 is also not particularly limited. The scanning direction of the laser beam 20 may be clockwise or counterclockwise. However, from the viewpoint of reducing the effect of heat generated during laser processing, it is not preferable to repeat the scanning direction of the laser beam 20 in a clockwise and counterclockwise sequence. 【0023】 It is not necessary to continuously scan the outer edge of one pin body 12 with the laser beam 20. For example, after scanning the outer edge of the first pin body 12 once, the laser beam 20 may be scanned the outer edge of the second pin body 12 once, and then the laser beam 20 may be scanned the outer edge of the first pin body 12 once again. Alternatively, after scanning a part of the outer edge of the first pin body 12, the laser beam 20 may be scanned a part of the outer edge of the second pin body 12, and then the laser beam 20 may be scanned again on another part of the outer edge of the first pin body 12. These methods reduce the effects of heat generated during laser processing. 【0024】 In the optional plating process (S130), a plating layer 13 (Figure 3B) is formed on the surface of the cut-out pin body 12 by plating, if necessary. The type of plating process is not particularly limited. Examples of plating processes include electroplating and hot-dip plating. The metals used for plating are, for example, gold, nickel, rhodium, palladium, etc., and the thickness of the plating layer 13 is, for example, in the range of 0.5 to 5.0 μm. 【0025】 In the optional coating step (S140), if necessary, the cut-out pin body 12, or a portion of the surface of the pin body 12 having the plating layer 13, is coated with an insulating film 14 (Figure 3B). The insulating film 14 is a resin coating, similar to insulating films for general wires. Examples of resins that can be used for the insulating film 14 are not particularly limited as long as they have insulating properties. Examples of resins include parylene resin, acrylic resin, polyurethane resin, nylon resin, polyester resin, epoxy resin, polyesterimide resin, polyamide resin, polyamideimide resin, and paraxylene resin. The thickness of the insulating film 14 is also appropriately selected depending on the application. The thickness of the insulating film 14 is, for example, in the range of 0.5 to 10.0 μm. 【0026】 (Configuration of the probe pin for electrical characteristic testing) The probe pin 10 for electrical characteristic testing in this embodiment includes a pin body 12 made of a copper alloy. The composition of the copper alloy is as described above. 【0027】Figure 3A is a schematic plan view of the probe pin 10 for electrical characteristic testing, and Figure 3B is a schematic cross view perpendicular to the longitudinal direction. As described above, the shape of the cross section (transverse plane) perpendicular to the longitudinal direction of the pin body 12 cut by laser processing may be approximately trapezoidal due to the effects of laser processing. In the examples shown in Figures 2B and 3B, the shape of the cross section of the pin body 12 is approximately trapezoidal. Here, approximately trapezoidal may be a true trapezoid or a slightly distorted trapezoid. The thickness of the pin body 12 is preferably in the range of 0.001 to 0.2 mm. The thickness of the pin body 12 corresponds to the thickness of the copper alloy foil 11. When the shape of the cross section of the pin body 12 is approximately trapezoidal, the thickness of the pin body 12 corresponds to the height h of the trapezoid. The width of the pin body 12 is also preferably in the range of 0.001 to 0.200 mm. When the cross-sectional shape of the pin body 12 is approximately trapezoidal, the width of the pin body 12 refers to the average value of the length of the upper base a and the length of the lower base b. Here, the longer side of the two bases of the trapezoid is called the "upper base a," and the shorter side is called the "lower base b." As mentioned above, the upper base a corresponds to the surface of the copper alloy foil 11 to which the laser light 20 is irradiated (the upper surface in Figure 2B), and the lower base b corresponds to the opposite surface (the lower surface in Figure 2B). If the length of the sides in the cross-section of the pin body 12 is within this range, the probe pins 10 for electrical characteristic testing can be arranged at a narrow pitch. Also, as mentioned above, due to the effect of laser processing, the length of the lower base b in the trapezoid is 60% or more and less than 100% of the length of the upper base a. 【0028】 The shape of the tip of the probe pin 10 for electrical characteristic testing is not particularly limited. The tip of the probe pin 10 for electrical characteristic testing may be semi-circular, pointed, or angular. The tip shape of the probe pin 10 for electrical characteristic testing is set appropriately according to the intended use. 【0029】The probe pin 10 for electrical characteristic testing may have a plating layer 13 formed on the surface of the pin body 12. The metal constituting the plating layer 13 is not particularly limited as long as it is electrically conductive. Examples of metals constituting the plating layer 13 include metals such as gold, nickel, rhodium, and palladium, and alloys such as gold alloys. The plating layer 13 may be a single layer or multiple layers. The plating layer 13 may be placed only on the ends of the pin body 12 or on the entire pin body 12. The thickness of the plating layer 13 is not particularly limited. For example, the thickness of the plating layer 13 is in the range of 0.5 to 5.0 μm. 【0030】 A pin body 12 or a pin body 12 having a plating layer 13 may have an insulating coating 14 placed around it (insulated wire). The insulating coating 14 is a coating made of resin or a resin composition, similar to insulating coatings for general conductors. The type of resin that can be used for the insulating coating 14 is not particularly limited as long as it has insulating properties. Examples of resins are as described above. The thickness of the insulating coating 14 is also appropriately selected depending on the application. The thickness of the insulating coating is, for example, in the range of 0.5 to 10.0 μm. 【0031】 Here, we will describe the case in which the probe pin 10 for electrical characteristic testing is used with the probe unit 30. Figure 4 shows the probe unit 30 for testing the electrical characteristics of the object under test 40, and the lead wires 51 connected thereto. 【0032】As shown in Figure 4, the probe unit 30 includes a first support plate 31 positioned on the side of the object under test 40, a second support plate 32 positioned on the side of the testing device, and an electrical characteristic test probe pin 10 including a pin body 12 and an insulating coating 14. The first support plate 31 has a plurality of first guide holes 33, and the second support plate 32 has a plurality of second guide holes 34. The electrical characteristic test probe pin 10 is mounted in the first guide holes 33 and the second guide holes 34. The end of the insulating coating 14 of the electrical characteristic test probe pin 10 is placed against the periphery of the first guide hole 33 of the first support plate 31 on the side of the object under test 40, and a load is applied to bend the electrical characteristic test probe pin 10, thereby bringing one end of the electrical characteristic test probe pin 10 into contact with the electrode 41 of the object under test 40 to measure the electrical characteristics. The other end of the electrical characteristic test probe pin 10 contacts a lead wire 51 held by the holding plate 50. 【0033】 Here, we will describe the case in which the probe pins 10 for electrical characteristic testing are used with the probe card 60. Figure 5 shows a probe card 60 for testing the electrical characteristics of an object to be tested 70, and lead wires 51 connected to it. As shown in Figure 5, the probe card 60 has a probe card body 62 and lead wires 51. Figure 5 shows how the electrical characteristics of the object to be tested 70 are being tested by bringing one end of the probe pins 10 for electrical characteristic testing of the probe card body 62 into contact with the area 72 to be tested on the object to be tested (for example, an integrated circuit). 【0034】 The probe card body (probe unit) 62 has a plurality of probe pins 10 for electrical characteristic testing, a first guide plate 66, and a second guide plate 68. 【0035】The probe pin 10 for electrical characteristic testing is a rod-shaped member in which one end (the lower end in Figure 5) and the other end (the upper end in Figure 5) are electrically connected. By moving at least one of the probe card body 62 and the object to be tested 70, one end of the probe pin 10 for electrical characteristic testing is brought into contact with the inspection target location 72 of the object to be tested 70. The other end of the probe pin 10 for electrical characteristic testing is connected to an inspection device (not shown) via a lead wire 51. The configuration of the probe pin 10 for electrical characteristic testing is not particularly limited as long as it can electrically connect the inspection target location 72 and the inspection device. The probe pin 10 for electrical characteristic testing may consist only of a pin body 12, or it may be composed of a combination of a pin body 12 and an insulator. Of the surface of the probe pin 10 for electrical characteristic testing, areas other than the area in contact with the inspection target location 72 and the area connected to the lead wire 51 may be covered with an insulating coating 14 or the like. Furthermore, since the probe pin 10 for electrical characteristic testing is pressed against the area 72 to be tested, it is preferable that the probe pin 10 for electrical characteristic testing has elasticity. For example, the probe pin 10 for electrical characteristic testing may be made of a material with high elasticity, or it may have an elastic structure including a spring or the like. 【0036】The first guide plate 66 positions one end of the plurality of electrical characteristic test probe pins 10. The first guide plate 66 is provided with a plurality of through holes, into which the electrical characteristic test probe pins 10 are inserted. The second guide plate 68 positions the other end of the plurality of electrical characteristic test probe pins 10. The second guide plate 68 is also provided with a plurality of through holes, into which the electrical characteristic test probe pins 10 are inserted. Preferably, the first guide plate 66 and the second guide plate 68 are made of an insulator having the necessary strength. Note that the first guide plate 66 and the second guide plate 68 may be an integrated unit rather than separate components. Also, there may be no space between the first guide plate 66 and the second guide plate 68. That is, a single thick guide plate may be provided with a plurality of through holes, and by inserting the electrical characteristic test probe pins 10 into each of these through holes, one end and the other end of the plurality of electrical characteristic test probe pins 10 may be positioned simultaneously. 【0037】 Multiple lead wires 51 are connected to multiple electrical characteristic test probe pins 10 on the probe card body 62. On the other hand, multiple lead wires 51 are also connected to a test device (not shown). In other words, multiple lead wires 51 connect the multiple electrical characteristic test probe pins 10 on the probe card body 62 to the test device. Preferably, multiple lead wires 51 are fixed to their respective electrical characteristic test probe pins 10. In the example shown in Figure 5, the lead wires 51 are fixed to the electrical characteristic test probe pins 10 by soldering. 【0038】 The object to be inspected 70 is not particularly limited. Examples of the object to be inspected 70 include electronic components such as integrated circuits, semiconductor chips, and connectors, and wiring boards such as printed circuit boards, flexible circuit boards, multilayer circuit boards, and semiconductor package circuit boards. 【0039】(Effects) As described above, according to the present invention, since the pin body is cut out by laser processing, the reduction in the lifespan of the probe pin due to softening is suppressed, and probe pins for electrical characteristic testing can be manufactured with less burden on the environment. 【0040】 In the above description of the manufacturing method for the probe pin for electrical characteristic testing, the shape of the cross-section of the pin body 12 cut out by laser processing was described as being approximately trapezoidal. However, by adjusting the laser processing conditions, the shape of the cross-section of the cut-out pin body 12 may be other than approximately trapezoidal. For example, by adjusting the laser processing conditions, such as tilting the optical axis of the laser beam 20 with respect to the copper alloy foil 11, the shape of the cross-section of the cut-out pin body 12 can be made rectangular, square, or rhombus. 【0041】 The present invention will be described in more detail below with reference to examples. However, the scope of the present invention is not limited in any way by these examples, and the embodiments can be modified without departing from the spirit of the invention. 【0042】 1. Manufacturing of probe pins for electrical characteristic testing Copper alloy foils containing 3.0, 6.0, 10.0, 15.0, or 25.0% by mass of silver, with the remainder being copper and unavoidable impurities, and having a thickness of 0.02 mm or 0.05 mm were prepared. Then, using a commercially available laser processing device, needle-shaped pin bodies were cut out from each copper alloy foil by scanning with laser light multiple times to achieve a width of 0.02 mm or 0.05 mm. The laser processing conditions were as follows. The cross-sectional shape of the cut-out pin bodies was generally trapezoidal, with the ratio of the length of the lower base to the length of the upper base being 60% or more and less than 100%. In this embodiment, the pin bodies were manufactured as probe pins for electrical characteristic testing without plating or insulating coating treatment. Laser processing conditions: Wavelength: 343 nm, Pulse width: 340 fs, Output: 80 mW 【0043】2. Evaluation (Evaluation of Thermal Deformation) Separate from the production of the probe pins for electrical property inspection, for each copper alloy foil used in the production of the probe pins for electrical property inspection, the presence or absence of thermal deformation due to laser processing was examined. It is considered that the same thermal deformation occurs during the production of the probe pins for electrical property inspection. For each of the above copper alloy foils, laser processing was performed under the above conditions along two linear cutting lines set at predetermined intervals to form two linear slits (through holes). The length of the two slits was 10 mm, and between the two slits, a strip piece with a length of 10 mm whose both ends were connected to the copper alloy foil was formed. The interval between the two cutting lines was set so that the thickness was the same as the width of the strip piece. Each strip piece corresponded to the pin body, and the cross-sectional shape of each strip piece was a substantially trapezoid in which the ratio of the length of the lower base to the length of the upper base was 60% or more and less than 100%. For each copper alloy foil, the degree of thermal deformation of the strip piece was measured. Specifically, the distance in the thickness direction of the copper alloy foil between the portion of the strip piece farthest from the surrounding copper alloy foil and the surrounding copper alloy foil was measured. Thermal deformation was evaluated according to the following criteria. ○: None △: The distance in the thickness direction was less than the thickness. ×: The distance in the thickness direction was equal to or greater than the thickness. 【0044】 (Evaluation of Vickers Hardness) The Vickers hardness of the copper alloy foil (before laser processing) and the obtained probe pins for electrical property inspection (after laser processing) was measured with a Vickers hardness tester in accordance with JIS Z 2244:2009. The holding time of the test force was measured as 15 seconds. The Vickers hardness was judged according to the following criteria. Also, the hardness may be measured by the nanoindentation method. There is a known relationship between the nanoindentation hardness and the Vickers hardness, which is a general index of hardness, for example, Vickers hardness = (76.2 × nanoindentation hardness) + 6.3 (Non-Patent Document 1: Metals, Vol. 78 (2008) No. 9, p. 47). ○: Over 300 HV △: Over 250 HV and 300 HV or less ×: 250 HV or less 【0045】(Comprehensive Evaluation) The comprehensive evaluation was conducted based on the following criteria. ○: Both the evaluation result of Vickers hardness and the evaluation result of thermal deformation were "○". △: One of the evaluation result of Vickers hardness and the evaluation result of thermal deformation was "○" or "△", and the other was "△". ×: Either the evaluation result of Vickers hardness or the evaluation result of thermal deformation was "×". 【0046】 Table 1 shows the silver concentration in the copper alloy foil, the thickness of the copper alloy foil, and the evaluation results. 【0047】 【0048】 As shown in Table 1, for each probe pin for electrical property inspection of Examples 1 to 16 in which the pin body was cut out by laser processing from a copper alloy foil with a silver concentration in the range of 6.0 to 30.0% by mass, the evaluation results of Vickers hardness and thermal deformation were good. In particular, for each probe pin for electrical property inspection of Examples 5 to 16 in which the pin body was cut out by laser processing from a copper alloy foil with a silver concentration in the range of 10.0 to 25.0% by mass, the evaluation results of Vickers hardness and thermal deformation were even better. On the other hand, for the probe pins for electrical property inspection of Comparative Examples 1 to 4 in which the pin body was cut out by laser processing from a copper alloy foil with a silver concentration of 3.0% by mass, the evaluation results of Vickers hardness and thermal deformation were poor. This is considered to be because, due to the low silver concentration, it is easy for the processing strain to be released due to heat generation during laser processing, resulting in a decrease in hardness. Also, it is considered that thermal deformation occurred due to the release of the processing strain. 【0049】 The probe pin for electrical property inspection of the present invention can be used for contact probes and electrical property inspection devices. 【0050】10 Probe pin for electrical characteristic testing 11 Copper alloy foil 12 Pin body 13 Plating layer 14 Insulating coating 20 Laser light 30 Probe unit 31 First support plate 32 Second support plate 33 First guide hole 34 Second guide hole 40 Object under test 41 Electrode 50 Holding plate 51 Lead wire 60 Probe card 62 Probe card body 66 First guide plate 68 Second guide plate 70 Object to be tested 72 Area to be tested

Claims

1. A probe pin for electrical property testing, comprising a pin body made of a copper alloy containing 6.0 to 30.0 mass% silver, with the remainder being copper and unavoidable impurities, wherein the cross-sectional shape of the pin body in a direction perpendicular to the longitudinal direction is substantially trapezoidal, and the ratio of the length of the lower base to the length of the upper base in the trapezoidal shape is 60% or more and less than 100%.

2. A probe pin for electrical property testing, comprising a pin body made of a copper alloy containing 6.0 to 30.0 mass% silver, with the remainder being copper and unavoidable impurities, wherein the pin body is cut from a foil of the copper alloy by laser processing.

3. A probe pin for electrical property testing according to claim 1 or claim 2, characterized in that the silver content in the copper alloy is in the range of 10.0 to 25.0% by mass.

4. A probe pin for electrical characteristic testing according to claim 1 or claim 2, further comprising a plating layer disposed on the surface of the pin body.

5. An electrical characteristic test probe pin according to claim 1 or claim 2, further comprising an insulating coating covering at least a portion of the pin body.

6. A probe card characterized by comprising the probe pin for electrical characteristic testing described in claim 1 or claim 2.

7. A method for manufacturing a probe pin for electrical property testing, comprising a pin body made of a copper alloy containing 6.0 to 30.0 mass% silver, with the remainder being copper and unavoidable impurities, the method comprising: a step of preparing a foil of the copper alloy; and a step of cutting out the pin body from the foil of the copper alloy by laser processing.

8. A method for manufacturing a probe pin for electrical property testing according to claim 7, characterized in that the silver content in the copper alloy is in the range of 10.0 to 25.0% by mass.

9. A method for manufacturing an electrical characteristic test probe pin according to claim 7 or claim 8, further comprising the step of forming a plating layer on the surface of the pin body.

10. A method for manufacturing a probe pin for electrical characteristic testing according to claim 7 or claim 8, further comprising the step of covering at least a portion of the pin body with an insulating coating.

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