Substrate working apparatus

Abstract

Provided is a substrate working apparatus including: a substrate conveyance device that includes a pair of conveyors arranged at an interval in the width direction of a substrate and that constitutes a conveyance path such that a conveyance width can be changed by using one conveyor of the pair of conveyors as a reference of the conveyance width and moving the other conveyor in the width direction; and a clamp device that includes a pair of contact members at least one of which can move in the width direction so as to follow the movement of the other conveyor and which can come into contact with both end sides of the substrate in the width direction from below, one plate member extending in the width direction and having an upper surface capable of coming into contact with the pair of contact members from below, and a lifting drive unit lifting and lowering one shaft-like member connected to a lower surface of the plate member, and that pushes up and clamps the substrate with the pair of contact members by lifting the plate member via the shaft-like member by the lifting drive unit. In the clamp device, the shaft-like member is provided at a position closer to the reference side of the conveyance width than the center of the plate member in the width direction is.

Description

Substrate-facing working device 【0001】 This specification discloses a substrate-facing working device. 【0002】 Conventionally, a substrate-facing working device has been proposed that performs operations such as component mounting on a substrate conveyed through a conveyance path formed by a pair of conveyors (see, for example, Patent Document 1). In this device, it includes a lifting plate with a plurality of pins standing on its upper surface and a lifting mechanism having three shaft-like members (ball screws) respectively connected to three locations on the lower surface of the lifting plate. By raising the lifting plate with the lifting mechanism, the substrate is pushed up and clamped by the plurality of pins. 【0003】 Japanese Patent Laid-Open No. 11-233998 【0004】 In a configuration where the lifting plate is lifted and lowered by three shaft-like members as in the above-described device, high precision is required for adjusting the horizontal position of the lifting plate, which not only requires a long time for the adjustment work but is also disadvantageous in terms of cost. On the other hand, if a configuration is adopted where one shaft-like member is connected to the center of the lifting plate and lifted and lowered, the adjustment can be made easier and the cost can be reduced. However, in a configuration where one conveyor is used as a reference and the other conveyor is moved to change the conveyance width, when the conveyance width becomes small, both conveyors may move closer to one side than the center of the lifting plate, so there is a possibility that the load acting on the lifting plate is greatly biased and the substrate cannot be properly clamped. 【0005】 The main object of the present disclosure is to more reliably clamp a substrate by raising a plate member with one shaft-like member. 【0006】 The present disclosure has taken the following means to achieve the above main object. 【0007】The present disclosure relates to a substrate handling device that performs work on a substrate being transported on a transport path, comprising: a substrate transport device comprising: a pair of conveyors arranged at a distance from each other in the width direction of the substrate, wherein the transport path is configured such that the transport width can be changed by using one of the pair of conveyors as a reference for the transport width and moving the other conveyor in the width direction; a pair of contact members comprising: at least one of which is movable in the width direction so as to follow the movement of the other conveyor and which can contact both ends of the substrate in the width direction from below; a plate member extending in the width direction and whose upper surface can contact the pair of contact members from below; and a lifting drive unit that raises and lowers a shaft-shaped member connected to the lower surface of the plate member, wherein the lifting drive unit raises the plate member via the shaft-shaped member, thereby pushing up the substrate with the pair of contact members and clamping it, wherein the clamping device is configured such that the shaft-shaped member is positioned closer to the reference side of the transport width than the center of the plate member in the width direction. 【0008】 The substrate handling apparatus of this disclosure comprises a substrate transport device and a clamping device. The substrate transport device configures a substrate transport path so that the transport width can be changed by using one of a pair of conveyors as a reference for the transport width and moving the other conveyor in the width direction. The clamping device raises one plate member via one shaft-shaped member using a lifting drive unit, thereby pushing up the substrate with a pair of contact members and clamping it. This makes it easy to adjust the horizontal position of the plate member. Furthermore, the clamping device is positioned so that the shaft-shaped member is closer to the reference transport width side than the center of the plate member in the width direction. Therefore, even when the transport width is changed to a relatively small size, it prevents both conveyors from shifting to one side from the center of the plate member, thus preventing the load acting on the plate member from being uneven and causing the plate member to tilt. Consequently, the plate member is appropriately raised by one shaft-shaped member and the substrate is reliably pushed up with a pair of contact members, so the substrate can be clamped more reliably. 【0009】A schematic diagram of the mounting device 10. A block diagram showing the control configuration of the mounting device 10. A perspective view of the substrate transport device 20. A top view of the substrate transport device 20. A schematic diagram of the substrate transport device 20. An explanatory diagram showing an example of how the substrate transport device 20 operates. An explanatory diagram showing an example of the installation position of the second clamp drive unit 50. An explanatory diagram showing how the second clamp drive unit 50 is installed at each installation position. An explanatory diagram showing an example of how the substrate S is clamped in this embodiment. An explanatory diagram showing an example of how the substrate S is clamped in a comparative example. 【0010】 Embodiments of this disclosure will be described with reference to the drawings. Figure 1 is a schematic diagram of the mounting device 10. Figure 2 is a block diagram showing the configuration related to the control of the mounting device 10. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figure 1. 【0011】 The mounting device 10 picks up components and mounts them onto a substrate S, and comprises a base 11, a feeder 12, a mounting head 13, a moving device 15, a parts camera 16, a mark camera 17, a substrate transport device 20, and a control device 18 (see Figure 2). Multiple mounting devices 10 are arranged in a line in the substrate transport direction (X-axis direction) to form a mounting line. The mounting line, including the mounting devices 10, is managed by a control device (not shown). 【0012】 The feeder 12 is mounted on a feeder stand installed on the base 11 so as to be aligned in the left-right direction (X-axis direction). The feeder 12 has a reel around which a tape for containing components is wound. Multiple cavities for containing components are formed on the tape at equal intervals. Components in the cavities are exposed when the film covering the surface of the tape is peeled off in front of the component supply position, and are picked up (suctioned) by the mounting head 13. 【0013】The mounting head 13 is equipped with one or more nozzles 14 (suction members) that use negative pressure to pick up (suction) parts. The mounting head 13 is configured as a rotary head in which a plurality of nozzles 14 are mounted so as to be circumferentially rotatable, and a nozzle 14 at a predetermined rotational position can be raised and lowered in the Z-axis direction (vertical direction). The mounting head 13 picks up parts supplied to the supply position by the feeder 12 with the nozzles 14 and mounts them to the mounting position on the substrate S. The moving device 15 moves the mounting head 13 forward, backward, left and right (XY axis direction) along the XY plane (horizontal plane). 【0014】 The parts camera 16 is mounted on the base 11 and captures images of the parts and other objects to be imaged from below, and outputs the captured images to the control device 18. The mark camera 17 is located below the mounting head 13 and moves together with the mounting head 13 in the forward, backward, left, and right directions (XY axis directions) by the moving device 15. The mark camera 17 captures images of the marks and other objects to be imaged on the substrate S from above and outputs the captured images to the control device 18. 【0015】 The substrate transport device 20 is equipped with a pair of belt conveyors spaced apart in the Y-axis direction (front-to-back direction) as shown in Figure 1, and drives the belt conveyors to transport the substrate S in the X-axis direction (transport direction). Once transported to each transport path, the substrate S is clamped and components are mounted on it. The substrate transport device 20 is also configured with two pairs of belt conveyors, that is, two parallel transport paths formed by the pairs of belt conveyors, namely a first transport path and a second transport path, allowing for independent transport and clamping of the substrate S. Further details of the substrate transport device 20 will be described later. 【0016】The control device 18 is configured as a microprocessor centered around a CPU (not shown), and in addition to the CPU, it includes ROM, RAM, input / output interfaces, etc. The control device 18 outputs various control signals to the feeder 12, mounting head 13, moving device 15, parts camera 16, mark camera 17, and board transport device 20. The control device 18 also receives various signals from the feeder 12, mounting head 13, moving device 15, and board transport device 20, as well as images captured by the parts camera 16 and mark camera 17. The control device 18 is communicated with a management device (not shown). The control device 18 receives jobs from the management device and performs component mounting processing on the board S according to the received jobs. 【0017】 The details of the substrate transport device 20 are described below. The substrate transport device 20 comprises a first transport device 21, a second transport device 41, a first clamp drive unit 30, a second clamp drive unit 50, first guide shafts 61 and 62, and second guide shafts 63 and 64. These are provided on a flat base plate 11a attached to a base 11. The first transport device 21 constitutes the first transport path on the front side in the Y-axis direction. The second transport device 41 constitutes the second transport path on the rear side in the Y-axis direction. Figure 3 is a perspective view of the substrate transport device 20. Figure 4 is a top view of the substrate transport device 20. Figure 5 is a schematic configuration diagram of the substrate transport device 20, showing the configuration of the substrate transport device 20 as viewed from the right side in the X-axis direction, with some parts excluded. 【0018】The first conveying device 21 comprises a pair of belt conveyors 22, a pair of mounting plates 24, a width changing section 25, and a pair of clamp plates 28 (only one is shown in Figure 3). Each belt conveyor 22 comprises a plurality of pulleys, including a drive pulley 22a (only one is shown in Figure 3), and a belt stretched across the plurality of pulleys on which the widthwise end of the substrate S is placed. The first conveying device 21 includes a drive unit for driving each belt conveyor 22, which comprises a drive shaft 23 connected to each drive pulley 22a, and a drive motor 23m (see Figure 2) for rotating the drive shaft 23. The drive shaft 23 extends in the Y-axis direction across the first conveying device 21 and the second conveying device 41. Each belt conveyor 22 rotates each belt by rotating each drive pulley 22a via the drive shaft 23 driven by the drive motor 23m, thereby conveying the substrate S in the X-axis direction. 【0019】 A pair of mounting plates 24 are provided in the Y-axis direction (front-to-back direction), and a belt conveyor 22 is attached to each. Each mounting plate 24 is formed in a gate-like shape having a portion extending in the X-axis direction and portions extending downward in the Z-axis direction from both ends in the X-axis direction, and is supported by two first guide shafts 61 and 62 in the portions extending downward in the Z-axis direction. Pulleys for each belt conveyor 22 and clamp plates 28 are attached to each mounting plate 24, mainly on the upper side. Of the pair of mounting plates 24, the front mounting plate in the Y-axis direction is called mounting plate 24F, and the rear mounting plate is called mounting plate 24R. The front mounting plate 24F is configured as a fixed plate that cannot be moved. The rear mounting plate 24R is configured as a movable plate that can move in the Y-axis direction. 【0020】The width changing section 25 changes the transport width of the first transport path (the distance between the pair of belt conveyors 22 in the Y-axis direction) by moving the mounting plate 24R. The width changing section 25 includes, for example, a ball screw 26 which is a drive shaft for moving the mounting plate 24R, a nut 26a screwed onto the ball screw 26, and a drive motor 26m (see Figure 2) that rotates the ball screw 26. The ball screw 26 extends in the Y-axis direction across the first transport device 21 and the second transport device 41. The mounting plate 24R is connected to the nut 26a and moves in the Y-axis direction as the ball screw 26 rotates due to the drive of the drive motor 26m. In the first transport device 21, the transport width of the first transport path is changed by moving the belt conveyor 22 attached to the mounting plate 24R in the Y-axis direction using the width changing section 25, with the belt conveyor 22 attached to the mounting plate 24F as the reference for the transport width. In the substrate transport device 20, the range (maximum value) that can be set as the transport width of the first transport path can be set to one of several stages via an operation panel (not shown). For example, it can be set to one of several stages, such as a first range where the minimum transport width is width W0 and the maximum is width W1, a second range where the minimum transport width is width W0 and the maximum is width W2 (<W1), and a third range where the minimum transport width is width W0 and the maximum is width W3 (<W2). 【0021】Each pair of clamp plates 28 is attached to the mounting surface (inner surface) of the belt conveyor 22 on the pair of mounting plates 24 via a pair of support portions 28a that are spaced apart in the X-axis direction so as to be able to move up and down in the Z-axis direction. The clamp plate 28 is a substantially rectangular plate member with its long side parallel to the X-axis direction, and in its initial state, its upper end (upper side) is slightly lower than the mounting surface (conveying surface) of the substrate S on the belt conveyor 22. The clamp plate 28 also includes a rod-shaped contact pin 28b that protrudes downward from the lower end approximately in the center in the X-axis direction, and a pair of springs 28c attached to the lower ends of both ends in the X-axis direction. The lower end of the contact pin 28b is arranged so as to be able to contact the upper surface of the backup plate 31 of the first clamp drive unit 30. The pair of springs 28c are spaced apart in the X-axis direction, with their upper ends supported by the clamp plate 28 and their lower ends supported by the mounting plate 24, biasing the clamp plate 28 downward. Furthermore, a retaining member 24a is attached to the upper end of each mounting plate 24F, 24R, extending along its entire length in the X-axis direction, so as to face the upper end of each clamp plate 28. 【0022】The first clamp drive unit 30 pushes up a pair of clamp plates 28 for clamping the substrate S via a single backup plate 31. In Figures 3 to 5, the backup plate 31 and the backup plate 51 of the second clamp drive unit 50 are shown in color. As shown in Figure 5, the first clamp drive unit 30 includes a backup plate 31, a mounting plate 32, a ball screw mechanism 33, a drive motor 35, and a pair of lifting guides 37. The backup plate 31 is a rectangular plate member whose long side is parallel to the Y-axis direction when viewed from above, and whose upper surface can contact the lower ends of each contact pin 28b (a pair of contact pins 28b) of the pair of clamp plates 28. The mounting plate 32 is a rectangular plate member whose length in the X-axis direction is approximately the same as that of the backup plate 31, and whose length in the Y-axis direction is shorter, and the backup plate 31 is detachably attached to its upper surface. In this embodiment, multiple types of backup plates 31 with different lengths in the Y-axis direction can be attached to the mounting plate 32, and details will be described later. The ball screw mechanism 33 includes a ball screw 34 whose upper end is connected to the lower surface of the backup plate 31 via a mounting plate 32, and a pulley 34a fixed to a nut screwed onto the ball screw 34. The drive motor 35 includes a pulley 35a fixed to a rotating shaft and transmits driving force to the ball screw mechanism 33 via a belt 36 stretched between the pulleys 35a and 34a, moving the ball screw 34 in the Z-axis direction to raise and lower the backup plate 31 (mounting plate 32). The pair of lifting guides 37 are configured such that a guide shaft 38, whose upper end is connected to the lower surface of the backup plate 31 via a mounting plate 32, can move back and forth in the Z-axis direction, and are provided as a pair in the Y-axis direction, sandwiching the ball screw mechanism 33 and the drive motor 35. The lifting guides 37 guide the raising and lowering of the ball screw 34 by the movement of the guide shafts 38 back and forth. 【0023】The second conveying device 41 and the second clamp drive unit 50 have the same configuration as the first conveying device 21 and the first clamp drive unit 30, with some exceptions. For this reason, the reference numerals for the same components in the second conveying device 41 and the second clamp drive unit 50 as those in the first conveying device 21 and the first clamp drive unit 30 are changed from the 20s to the 40s and from the 30s to the 50s, respectively. 【0024】 The second conveying device 41 comprises a pair of belt conveyors 42, a pair of mounting plates 44 (44F, 44R), a width changing section 45, a pair of clamp plates 48, and a second clamp drive unit 50. The pair of belt conveyors 42 are driven by a drive motor 43m, which rotates each belt via a drive shaft 43, thereby conveying the substrate S in the X-axis direction. In the second conveying device 41, the front mounting plate 44F differs from the mounting plate 24F of the first conveying device 21 in that it is configured as a movable plate that can move in the Y-axis direction. However, after the mounting plate 44F moves to a position adjacent to the mounting plate 24R at the maximum conveying width (W1, W2, W3 mentioned above) that can be set in the first conveying device 21, its position is maintained as a reference for the conveying width of the second conveying path and it does not move frequently. In other words, the second conveying device 41 changes the conveying width of the second conveying path by moving the belt conveyor 42 attached to the mounting plate 44R in the Y-axis direction, using the belt conveyor 22 attached to the mounting plate 44F as the reference for the conveying width. 【0025】The width-changing section 45 includes a ball screw 46, a nut (not shown) screwed onto the ball screw 46, and a drive motor 46m (see Figure 2) for rotating the ball screw 46, in order to move the mounting plate 44F. The width-changing section 45 also includes a ball screw 47, a nut 47a screwed onto the ball screw 47, and a drive motor 47m (see Figure 2) for rotating the ball screw 47, in order to move the mounting plate 44R. The pair of clamp plates 48 are configured in the same way as the clamp plate 28. The second clamp drive unit 50 is a unit in which the same components as the first clamp drive unit 30 are arranged on a plate 50a (see Figure 5), and is fixed on the base plate 11a by attaching the plate 50a to one of the multiple installation positions provided on the base plate 11a. 【0026】 The first guide shafts 61 and 62 guide the movement of the mounting plate 24R of the first conveying device 21 and extend in the Y-axis direction across the first conveying device 21 and the second conveying device 41. The first guide shafts 61 and 62 are linear shafts to which linear bushings 61a and 62a, respectively, are attached, which are axially slidable. The linear bushings 61a and 62a are connected to one end (left end) and the other end (right end) of the mounting plate 24R in the X-axis direction, respectively. The second guide shafts 63 and 64 guide the movement of the mounting plates 44F and 44R of the second conveying device 41 and extend in the Y-axis direction across the first conveying device 21 and the second conveying device 41. The second guide shafts 63 and 64 are linear shafts to which linear bushings 63a, 63b, 64a, and 64b, respectively, are attached, which are axially slidable. Linear bushings 63a and 64a are connected to one end (left side) and the other end (right side) of the mounting plate 44F in the X-axis direction, respectively. Linear bushings 63b and 64b are connected to one end (left side) and the other end (right side) of the mounting plate 44R in the X-axis direction, respectively. 【0027】In this embodiment, the first guide shaft 61 and the second guide shaft 63 are arranged vertically at one end in the X-axis direction, with the first guide shaft 61 on top. The first guide shaft 62 and the second guide shaft 64 are arranged vertically at the other end in the X-axis direction, with the first guide shaft 62 on top. The substrate transport device 20 includes a pair of support blocks 65 and 66 fixed to the base plate 11a at one end in the X-axis direction, and a pair of support blocks 67 and 68 fixed to the base plate 11a at the other end in the X-axis direction. The first guide shaft 61 and the second guide shaft 63 are supported by support block 65 at the front end in the Y-axis direction, and by support block 66 at the rear end in the Y-axis direction. The first guide shaft 62 and the second guide shaft 64 are supported by support block 67 at the front end in the Y-axis direction, and by support block 68 at the rear end in the Y-axis direction. 【0028】In the substrate transport device 20 configured in this way, the substrate S is clamped as follows. Figure 6 is an explanatory diagram showing the operation of the substrate transport device 20. Figure 6 shows that both the substrate S transported by the first transport device 21 and the substrate S transported by the second transport device 41 are clamped. In the first transport device 21, the ball screw 34 is advanced upward in the Z-axis direction by the drive of the first clamp drive unit 30 (drive motor 35), raising the backup plate 31 (mounting plate 32). As a result, the substrate S is pushed up by the pair of clamp plates 28 via a pair of contact pins 28b that contact the upper surface of the backup plate 31, and is clamped between the pressing member 24a, thereby clamping the substrate S (upper surface height) at the clamp height H. Similarly, in the second transport device 41, the ball screw 54 is advanced upward in the Z-axis direction by the drive of the second clamp drive unit 50 (drive motor 55), raising the backup plate 51 (mounting plate 52). As a result, the substrate S is pushed up by the pair of clamp plates 48 via a pair of contact pins 48b that contact the upper surface of the backup plate 51, and clamped at the clamp height H by being held between the clamping member 44a. It should be noted that there may be states in which the first transport device 21 clamps the substrate S while the second transport device 41 does not clamp the substrate S, or states in which the second transport device 41 clamps the substrate S while the first transport device 21 does not clamp the substrate S. 【0029】As described above, the second clamp drive unit 50 is unitized on the plate 50a and fixed to one of a plurality of installation positions provided on the base plate 11a. The base plate 11a is provided with an opening 11b formed to accommodate the plate 50a at any of the installation positions, and fastening holes corresponding to each installation position are also formed therein. In the first transport device 21, the maximum transport width of the first transport path is set to one of the transport widths W1, W2, or W3. Furthermore, in the first transport device 21, the backup plate 31 of the first clamp drive unit 30 can be replaced with one of three backup plates 31L, 31M, or 31S (see Figure 7). The details of these will be explained below. Figure 7 is an explanatory diagram showing an example of the installation position of the second clamp drive unit 50. Figure 8 is an explanatory diagram showing how the second clamp drive unit 50 is installed at each installation position. In Figure 7, support blocks 65 to 68 are shown, but they are not shown in Figure 8. The first conveying device 21 and the second conveying device 41 are installed at predetermined positions on the base plate 11a via support blocks 65 to 68. The first clamp drive unit 30 is installed with a ball screw mechanism 33, a drive motor 35, and a pair of lifting guides 37, each fixed to predetermined positions on the base plate 11a. 【0030】As shown in the figures, in this embodiment, as an example, three installation positions P1, P2, and P3 with different positions in the Y-axis direction are provided. Figures 7 and 8A show the second clamp drive unit 50 installed at the rearmost installation position P1 in the Y-axis direction. When the second clamp drive unit 50 is installed at installation position P1, the transport width W1 is set to the maximum value of the first transport path. In addition, the first clamp drive unit 30 is fitted with a backup plate 31L that has the maximum length in the Y-axis direction to match the transport width W1. Figure 8B shows the second clamp drive unit 50 installed at installation position P2, which is further forward than installation position P1. When the second clamp drive unit 50 is installed at installation position P2, the transport width W2 is set to the maximum value of the first transport path, and the transport width W1 cannot be set. In addition, the first clamp drive unit 30 is fitted with a backup plate 31M that has a length in the Y-axis direction shorter than the backup plate 31L to match the transport width W2. Figure 8C shows the second clamp drive unit 50 installed at the foremost installation position P3. When the second clamp drive unit 50 is installed at installation position P3, the transport width W3 is set to the maximum value of the first transport path, and the transport widths W1 and W2 cannot be set. In addition, the first clamp drive unit 30 has the backup plate 31S with the shortest length in the Y-axis direction attached to match the transport width W3. The operator fixes the second clamp drive unit 50 by aligning the position of the plate 50a of the second clamp drive unit 50 with one of the installation positions P1, P2, or P3, and fastening the plate 50a to the fastening hole of the base plate 11a with fastening members such as bolts. The operator also attaches one of the three backup plates 31L, 31M, or 31S to the mounting plate 32 with fastening members such as bolts, matching the installation position of the second clamp drive unit 50 (maximum width of the first transport path). 【0031】Thus, in this embodiment, the first clamp drive unit 30 is fixed in a constant position, while the second clamp drive unit 50 is fixed to the base plate 11a at one of the three installation positions P1, P2, or P3. That is, the second clamp drive unit 50 is installed at a position closer to or further away from the installation position of the first clamp drive unit 30. The second clamp drive unit 50 is configured such that, regardless of the installation position, the positional relationship (distance) in the Y-axis direction between the position of the ball screw 54 and the position of the belt conveyor 22 on the mounting plate 44F side, which is the reference for the second transport path, remains constant. Furthermore, in the first transport device 21, the maximum transport width of the first transport path is set according to the installation position of the second clamp drive unit 50. The smaller the maximum transport width of the first transport path, the closer the second transport path can be to the feeder 12, thereby shortening the travel distance of the mounting head 13 to the substrate S on the second transport path and increasing the mounting efficiency. 【0032】 Figure 9 is an explanatory diagram showing an example of how the substrate S is clamped in this embodiment. Figure 10 is an explanatory diagram showing an example of how the substrate S is clamped in a comparative example. Figures 9 and 10 show how the substrate S transported by the first transport device 21 is clamped, but the same applies when the substrate S transported by the second transport device 41 is clamped. Also, in Figures 9 and 10, the illustration of components that are not necessary for the explanation is omitted, and the clamped state is shown with a dotted line. 【0033】As shown in Figure 9A, when the transport width of the first transport path is relatively wide (for example, transport width W1), the load on the upper surface of the backup plate 31 when it comes into contact with the pair of clamp plates 28 (contact pins 28b) acts substantially equally on both sides in the Y-axis direction (width direction). Therefore, the backup plate 31 rises without its upper surface tilting, and can push up and clamp the substrate S with both of the pair of clamp plates 28. Here, in this embodiment, the first clamp drive unit 30 is configured such that the center 34c of the ball screw 34 is located closer to the reference side of the transport width (forward side in the Y-axis direction) than the center 31c of the backup plate 31 in the Y-axis direction (width direction). Therefore, as shown in Figure 9B, even when the transport width of the first transport path is relatively narrow (for example, transport width W0), the load on the upper surface of the backup plate 31 when it comes into contact with the pair of clamp plates 28 acts without a large bias in the Y-axis direction. Therefore, the backup plate 31 rises without its upper surface tilting, and can push up and clamp the substrate S with both of the pair of clamp plates 28. Furthermore, the first clamp drive unit 30 is configured to be positioned closer to the reference side of the transport width than the center 31c of the backup plate 31, regardless of the length of the backup plate 31. Therefore, the first clamp drive unit 30 can reliably push up and clamp the substrate S even when the shortest backup plate 31S is attached. 【0034】On the other hand, in the comparative example, the first clamp drive unit 30B is configured such that the center 34c of the ball screw 34 coincides with the center 31c of the backup plate 31. In the comparative example as well, as shown in Figure 10A, when the transport width of the first transport path is relatively wide, the load on the upper surface of the backup plate 31 when it comes into contact with the pair of clamp plates 28 acts almost equally on both sides in the Y-axis direction. As a result, the backup plate 31 rises without its upper surface tilting, and can push up and clamp the substrate S with both of the pair of clamp plates 28. However, as shown in Figure 10B, when the transport width of the first transport path is relatively narrow, the position of the clamp plate 28 on the rear side in the Y-axis direction is forward in the Y-axis direction compared to the ball screw 34. That is, both of the pair of clamp plates 28 are forward in the Y-axis direction compared to the ball screw 34. As a result, the load on the upper surface of the backup plate 31 when it comes into contact with the pair of clamp plates 28 acts with a large bias towards the forward side in the Y-axis direction. As a result, the backup plate 31 rises with its upper surface tilted, preventing it from properly pushing up the pair of clamp plates 28, and clamping the substrate S at an angle. That is, since the substrate S is not clamped horizontally at the clamping height H, there is a risk of misalignment or vibration occurring in the clamped substrate S. In contrast, in this embodiment, even when the transport width is relatively narrow, the upper surface of the backup plate 31 rises without tilting to clamp the substrate S, thus preventing the substrate S from being clamped at an angle as in the comparative example. Therefore, it is possible to prevent a decrease in the mounting position accuracy of components due to misalignment or vibration of the substrate S. 【0035】 Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The first transport device 21 and the second transport device 41 of this embodiment correspond to the substrate transport device of the present disclosure, and the clamp plate 28 and the first clamp drive unit 30 and the clamp plate 48 and the second clamp drive unit 50 correspond to the clamp device. The first transport device 21 corresponds to the first transport device, the second transport device 41 corresponds to the second transport device, the clamp plate 28 and the first clamp drive unit 30 correspond to the first clamp device, and the clamp plate 48 and the second clamp drive unit 50 correspond to the second clamp device. 【0036】 In the mounting apparatus 10 of the embodiment described above, the first conveying device 21 uses the belt conveyor 22 on the Y-axis forward side (one side) of the pair of belt conveyors 22 (conveyors) as the reference for the conveying width, and moves the belt conveyor 22 on the Y-axis rear side (the other side) in the Y-axis direction (width direction) to configure a first conveying path that allows the conveying width to be changed. Furthermore, the ball screw mechanism 33 and drive motor 35 (lifting drive unit) of the first clamp drive unit 30 raise one backup plate 31 (plate member) via one ball screw 34 (shaft-shaped member), thereby pushing up the substrate S with the pair of clamp plates 28 (contact members) and clamping it. Since the backup plate 31 is raised and lowered by one ball screw 34, the horizontal adjustment of the upper surface of the plate can be easily performed and costs can be reduced. In addition, the ball screw 34 of the first clamp drive unit 30 is located closer to the reference side of the conveying width (Y-axis forward side) than the center 31c of the backup plate 31. Therefore, even when the transport width is changed to a relatively small size, the shift of both belt conveyors 22 to one side relative to the center 31c is suppressed, thus preventing the load acting on the backup plate 31 from becoming uneven and causing the backup plate 31 to tilt. Consequently, the backup plate 31 is appropriately raised by a single ball screw 34, and the substrate S is reliably pushed up by the pair of clamp plates 28, thereby enabling more reliable clamping of the substrate S. The second transport device 41 and the second clamp drive unit 50 are configured similarly and therefore produce the same effect. 【0037】 Furthermore, in the first clamp drive unit 30, when the first transport path is changed to the minimum transport width W0, a ball screw 34 is provided at a position on the reference side of the mounting plate 24F relative to the position of the clamp plate 28 (contact pin 28b) that follows the belt conveyor 22 of the mounting plate 24R. Therefore, even when the first transport path is in the minimum transport width W0 state, it is possible to reliably suppress uneven distribution of the load acting on the backup plate 31. The second clamp drive unit 50 also achieves a similar effect. 【0038】The mounting apparatus 10 includes a first transport device 21 that constitutes a first transport path, a second transport device 41 that constitutes a second transport path parallel to the first transport path, a first clamp drive unit 30 that clamps the substrate S on the first transport path, and a second clamp drive unit 50 that clamps the substrate S on the second transport path. In the first transport device 21, the belt conveyor 22 on the front side in the Y-axis direction is fixed so as to be immovable, while the belt conveyor 22 on the rear side in the Y-axis direction is movable. In the second transport device 41, the belt conveyor 42 on the front side in the Y-axis direction is held as a reference position when it has moved so as to be adjacent to the first transport device 21, while the belt conveyor 42 on the rear side in the Y-axis direction is movable. In such a mounting apparatus 10, when the transport width is changed to a relatively small size, both belt conveyors 22 (42) tend to move to one side (the reference side) from the center of the backup plate 31 (51), so applying this disclosure to suppress tilting of the backup plate 31 (51) is highly significant. 【0039】 The first conveying device 21, the second conveying device 41, and the first clamp drive unit 30 are each installed at predetermined installation positions on the base plate 11a (installation section). The second clamp drive unit 50 is configured to be movable as a whole and is installed at one of a plurality of selectable installation positions provided on the base plate 11a. The second clamp drive unit 50 is installed at an installation position closer to the first conveying device 21 (forward in the Y-axis direction) when the maximum conveying width within the range set as the changeable conveying width in the first conveying path is small. When the second clamp drive unit 50 is fixed at an installation position forward in the Y-axis direction, the first conveying device 21 is used with a relatively small conveying width. Therefore, in the first clamp drive unit 30, the widthwise centers of the pair of clamp plates 28 tend to be closer to the reference side than the widthwise center 31c of the backup plate 31, so applying this disclosure to suppress tilting of the backup plate 31 is highly significant. 【0040】The first clamp driving unit 30 is configured to be replaced with a backup plate 31 having a shorter length in the Y-axis direction (width direction) as the maximum conveyance width of the first conveyance path is smaller. Further, even in a state where the backup plate 31 is replaced with the backup plate 31S having the shortest length in the Y-axis direction, a ball screw 34 is provided so as to be positioned closer to the reference side of the conveyance width than the center 31c thereof. For this reason, regardless of the length of the backup plate 31, the backup plate 31 can be appropriately lifted to securely clamp the substrate S. 【0041】 The second clamp driving unit 50 is configured such that, regardless of the installation position among a plurality of installation positions, the positional relationship in the Y-axis direction between the position of the ball screw 54 and the position of the belt conveyor 22 on the mounting plate 44F side, which is used as a reference in the second conveying device 41, is substantially constant. For this reason, regardless of the installation position of the second clamp driving unit 50, it is possible to suppress the load acting on the backup plate 51 from being biased, and thus the backup plate 51 can be appropriately lifted to securely clamp the substrate S. 【0042】 Note that the present disclosure is not limited to the above-described embodiments, and it is needless to say that the present disclosure can be implemented in various modes as long as it belongs to the technical scope of the present disclosure. 【0043】 In the embodiment, the second clamp driving unit 50 is configured such that, regardless of the installation position, the positional relationship between the position of the ball screw 54 and the position of the belt conveyor 22 on the mounting plate 44F side is constant. However, the present disclosure is not limited to this, and the positional relationship may change. 【0044】 In the embodiment, the first clamp driving unit 30 is provided with the ball screw 34 so as to be positioned closer to the reference side of the conveyance width than the center 31c even in a state where the backup plate 31 having a shorter length in the Y-axis direction is replaced. However, the present disclosure is not limited to this. For example, in a state where the backup plate 31 is replaced with the backup plate 31S, the center 31c and the center of the ball screw 34 may be provided to coincide with each other. 【0045】In the embodiment, the first clamp driving unit 30 is immovable while the second clamp driving unit 50 is movable, but the present invention is not limited to this. Both the first clamp driving unit 30 and the second clamp driving unit 50 may be movable. Alternatively, both the first clamp driving unit 30 and the second clamp driving unit 50 may be immovable. 【0046】 In the embodiment, the substrate transfer device 20 has two transfer paths, but the present invention is not limited to this. That is, the substrate transfer device 20 may have only one transfer path. That is, although the substrate transfer device 20 includes the first transfer device 21 and the first clamp driving unit 30, it may not include the second transfer device 41 and the second clamp driving unit 50. 【0047】 In the embodiment, the first clamp driving unit 30 is provided with the ball screw 34 at the position on the mounting plate 24F side serving as the reference of the transfer width rather than the position of the clamp plate 28 on the mounting plate 24R side in a state where the first transfer path has the minimum transfer width W0, but the present invention is not limited to this. That is, the first clamp driving unit 30 may be provided with the ball screw 34 at any position as long as both of the pair of clamp plates 28 can abut against the lower surface of the substrate S without a gap and push up the substrate S when the backup plate 31 is lifted in a state of the minimum transfer width W0. That is, the position where both of the pair of clamp plates 28 can abut against the lower surface of the substrate S without a gap and push up the substrate S when the backup plate 31 is lifted may be obtained by experiments, calculations, etc., and the ball screw 34 (ball screw mechanism 33) may be provided. Even in this way, the first clamp driving unit 30 can more reliably push up and clamp the substrate S with both of the pair of clamp plates 28. The same applies to the second clamp driving unit 50. 【0048】 In the embodiment, the mounting device 10 that performs the component mounting work on the substrate S is exemplified as the substrate working device, but the present invention is not limited to this. For example, any substrate working device that performs work on the substrate S conveyed on two transfer paths, such as a printing device that performs printing work such as soldering on the substrate S or an inspection device that performs inspection work on the substrate S, may be applied. 【0049】 The present disclosure can be used for a substrate working device that performs work on a substrate conveyed on a transfer path. 【0050】 10 Mounting device, 11 Base, 11a Base plate, 11b Opening, 12 Feeder, 13 Mounting head, 14 Nozzle, 15 Moving device, 16 Parts camera, 17 Mark camera, 18 Control device, 20 Substrate transport device, 21 First transport device, 22, 42 Belt conveyor, 22a, 42a Drive pulley, 23, 43 Drive shaft, 23m, 43m Drive motor, 24, 24F, 24R, 44, 44F, 44R Mounting plate, 24a, 44a Pressing member, 25, 45 Width changing part, 26, 46, 47 Ball screw, 26a, 47a Nut, 26m, 46m, 47m Drive motor, 28, 48 Clamp plate, 28a, 48a Support part, 28b, 48b Contact pin, 28c, 48c Springs, 30, 30B; First clamp drive unit, 31, 51; Backup plate, 31c, 34c; Center, 32, 52; Mounting plate, 33, 53; Ball screw mechanism, 34, 54; Ball screw, 34a, 54a; Pulley, 35, 55; Drive motor, 35b, 55b; Pulley, 36, 56; Belt, 37, 57; Lifting guide, 38, 58; Guide shaft, 41; Second conveying device, 50; Second clamp drive unit, 61, 62; First guide shaft, 63, 64; Second guide shaft, 65, 66, 67, 68; Support block, S; Substrate.

Claims

1. A substrate handling device for performing work on a substrate being transported on a transport path, comprising: a substrate transport device comprising: a pair of conveyors arranged at a distance from each other in the width direction of the substrate, wherein the transport path is configured such that the transport width can be changed by using one of the pair of conveyors as a reference for the transport width and moving the other conveyor in the width direction; a pair of contact members, at least one of which is movable in the width direction so as to follow the movement of the other conveyor and which can contact both ends of the substrate in the width direction from below; a plate member extending in the width direction and whose upper surface can contact the pair of contact members from below; and a lifting drive unit for raising and lowering a shaft-shaped member connected to the lower surface of the plate member, wherein the lifting drive unit raises the plate member via the shaft-shaped member, thereby pushing up the substrate with the pair of contact members and clamping it, wherein the clamping device is provided such that the shaft-shaped member is located closer to the reference side of the transport width than the center of the plate member in the width direction.

2. The substrate handling apparatus according to claim 1, wherein the clamping device is positioned such that, even when the transport path is changed to the smallest transport width among the changeable transport widths, the axial member is positioned such that when the plate member is raised by the lifting drive unit via the axial member, both of the pair of contact members contact the lower surface of the substrate without any gaps, thereby enabling the substrate to be pushed up.

3. The substrate handling apparatus according to claim 1 or 2, wherein the clamping device is provided with the shaft-shaped member at substantially the same position in the width direction as the contact member following the other conveyor, or at a position on the reference side of the conveying width, when the conveying path is changed to the smallest of the changeable conveying widths.

4. The substrate handling apparatus according to claim 1, comprising: a first transport device in which one conveyor is fixed so as to be immovable and the other conveyor is movable to constitute a first transport path; and a second transport device in which the position of the one conveyor moved to be adjacent to the first transport device is held as the reference and the other conveyor is movable to constitute a second transport path parallel to the first transport path, wherein the clamping device comprises: a first clamping device for clamping the substrate on the first transport path; and a second clamping device for clamping the substrate on the second transport path.

5. The substrate handling apparatus according to claim 4, wherein the first transport device, the second transport device, and the first clamping device are each provided at predetermined installation positions in an installation section provided within the substrate handling apparatus, and the second clamping device is configured to be movable as a whole, and is provided at an installation position closer to the first transport device when the maximum transport width within the range set as the transport width that can be changed in the first transport path is small, among a plurality of selectable installation positions provided in the installation section.

6. The first clamping device is configured such that the plate member has a shorter length in the width direction as the maximum transport width within the range set as a changeable transport width in the first transport path becomes smaller, and even when the plate member has been replaced with the one with the shortest length in the width direction, the axial member is provided such that it is located closer to the reference side of the transport width than the center of the plate member in the width direction. The substrate handling device according to claim 5.

7. The substrate handling apparatus according to claim 5 or 6, wherein the second clamping device is configured such that the positional relationship in the width direction between the position of the axial member and the position of the one conveyor which is the reference in the second conveying device remains substantially constant, regardless of which of the plurality of installation positions the second clamping device is installed at.

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