Deep-part temperature measurement probe and deep-part thermometer

The dual heat flow method with latent heat cooling enables accurate deep body temperature measurement in high ambient temperatures, addressing the challenges of bulkiness and power requirements in existing devices, resulting in a compact and convenient wearable solution.

WO2026126845A1PCT designated stage Publication Date: 2026-06-18SUWA UNIV OF SCI

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SUWA UNIV OF SCI
Filing Date
2025-12-01
Publication Date
2026-06-18

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Abstract

A deep-part temperature measurement probe 1 is used when measuring a deep-part temperature TB of a subject 9 through a heat flow method. The deep-part temperature measurement probe 1 comprises: heat insulation bodies (a first heat insulation body 115, a second heat insulation body 125); a pair of temperature sensors disposed to face each other with the heat insulation bodies (the first heat insulation body 115, the second heat insulation body 125) interposed therebetween and composed of internal temperature sensors 21, 23 disposed on the side of the subject 9 and external temperature sensors 22, 24 disposed on an environmental side 8 opposite to the side of the subject 9; and a cooler 70 for cooling an object without using electric power. The cooler 70 is configured to cool the external temperature sensors 22, 24 from the surfaces 22a, 24a of the external temperature sensors 22, 24 on the environmental side. Consequently, the deep-part temperature measurement probe can measure a deep-part temperature even when the external air temperature becomes high while being a power-saving (energy‑saving) probe suitable for wearable use.
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