Wearable device
The integration of a circuit and contact unit within wearable devices allows for non-invasive biological information measurement without altering their size or design, addressing the challenge of incorporating sensing modules for RF signal applications.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SONY SEMICON SOLUTIONS CORP
- Filing Date
- 2025-12-01
- Publication Date
- 2026-06-18
AI Technical Summary
Existing wearable devices face challenges in integrating non-invasive sensing modules for measuring biological information without affecting their size and design, particularly for applications like blood glucose level measurement using high-frequency electromagnetic waves.
A wearable device design that incorporates a circuit unit and contact unit within a housing, allowing for the application of RF signals to measure biological information without requiring additional electrodes, by utilizing a VNA chip and conductive/insulating parts to calculate S-parameters or EC values.
Enables the integration of non-invasive sensing modules on wearable devices like earphones and rings without altering their size or design, facilitating accurate measurement of biological information such as blood glucose levels and skin moisture content.
Smart Images
Figure JP2025041868_18062026_PF_FP_ABST
Abstract
Description
Wearable device 【0001】 This technology relates to a wearable device, and particularly to a wearable device that can preferably measure primary information used for calculating biological information. 【0002】 Conventionally, a non-invasive sensing module that applies high-frequency electromagnetic wave signals such as microwaves and millimeter waves, that is, RF (Radio Frequency) signals, to the human body to measure primary information used for calculating biological information such as blood glucose levels has been researched and commercialized (see, for example, Patent Document 1). 【0003】 Specification of Chinese Patent Application Publication No. 109350078 【0004】 It is required to mount a non-invasive sensing module on a general-purpose wearable device. In particular, there is a need for a mounting means for the sensing module that does not affect the size and design of the wearable device while ensuring the performance of the sensing module. 【0005】 This technology has been made in view of such a situation, and is intended to preferably measure primary information used for calculating biological information. 【0006】 A wearable device according to one aspect of this technology is a wearable device that can be worn on an ear or a finger that is a measurement target of primary information used for calculating biological information, and includes a circuit unit for measuring the primary information, a contact unit for applying an applied signal for measuring the primary information output from the circuit unit to the measurement target, and a housing in which the circuit unit is housed and the contact unit is provided at a portion that contacts the measurement target. 【0007】 In one aspect of this technology, a circuit unit for measuring the primary information is housed in a housing of a wearable device that can be worn on an ear or a finger that is a measurement target of primary information used for calculating biological information, and a contact unit for applying an applied signal for measuring the primary information output from the circuit unit to the measurement target is provided at a portion of the housing that contacts the measurement target. 【0008】 This figure shows an example of the configuration of an earphone to which this technology is applied. This figure shows another example of the configuration of an earphone to which this technology is applied. This figure shows an example of the configuration of an ear cuff type earphone to which this technology is applied. This figure shows the earphone in a state where it is worn on the user's ear. This figure shows an example of an earphone equipped with a sensing module. This figure shows an example of a ring-shaped device equipped with a sensing module. This figure shows an example of the internal configuration of a ring-shaped device. This figure shows another example of the internal configuration of a ring-shaped device. This figure shows yet another example of the internal configuration of a ring-shaped device. This figure shows an example of the internal configuration of an earphone according to the second embodiment. This figure shows a first example of the detailed configuration of an acoustic processing chip. This figure shows a second example of the detailed configuration of an acoustic processing chip. This figure shows a third example of the detailed configuration of an acoustic processing chip. This figure shows a fourth example of the detailed configuration of an acoustic processing chip. 【0009】 The following describes the embodiments for implementing this technology. The explanation will proceed in the following order: 1. First Embodiment 2. Second Embodiment 【0010】 <1. First Embodiment> This technology relates to a non-invasive sensing module for measuring biological information such as blood glucose levels, and a wearable device equipped with such a sensing module. 【0011】 Figure 1 shows an example of the configuration of earphones (in-ear headphones) to which this technology is applied. 【0012】 Figure 1A shows an example of the external configuration of a left earphone 1L and a right earphone 1R to which this technology is applied. 【0013】 The left earphone 1L and right earphone 1R shown in Figure 1A output sound (sound waves) corresponding to an acoustic signal wirelessly transmitted from a playback device such as a portable music player or smartphone. Wireless transmission communication standards include, but are not limited to, Bluetooth® and Wi-Fi (Local Area Network). The left earphone 1L and right earphone 1R may also output sound corresponding to an acoustic signal transmitted via a wired connection such as a cable. 【0014】 Furthermore, the left earphone 1L and the right earphone 1R also function as non-invasive wearable devices for measuring biometric information such as blood glucose levels. 【0015】 The housings of the left earphone 1L and the right earphone 1R are each composed of a main body 11 and an earpiece 12 that is inserted into the user's ear canal. Hereafter, unless there is a need to distinguish between the left earphone 1L and the right earphone 1R, they will simply be referred to as earphone 1. 【0016】 Figure 1B shows an example of the internal configuration of earphone 1. 【0017】 As shown in Figure 1B, the main body 11 of the earphone 1 is composed of, for example, a housing portion 11A having a substantially cylindrical shape and a sound conduit 11B protruding from a predetermined location on the housing portion 11A. 【0018】 The main body 11 is formed from a material such as synthetic resin. The housing 11A and the sound conduit 11B are formed integrally, but they may also be formed as separate components and joined together. An earpiece 12 is attached to the sound conduit 11B, and the sound conduit 11B is inserted into the user's ear canal together with the earpiece. 【0019】 The earpiece 12 has an umbrella shape made of an elastic material or the like, and when inserted into the user's ear canal, it adheres closely to the inner wall of the ear canal. The earpiece 12 is also made of a conductive material. As a result, the earpiece 12 functions as a contact point that applies (irradiates) microwave and millimeter-wave electromagnetic wave signals, i.e., RF (Radio Frequency) signals, to the inner wall of the ear canal, which is the target of biological information measurement, for the measurement of primary information used in calculating biological information. 【0020】 PEDOT-PSS, polypyrrole, polyacetylene, polyphenylenevinylene, polythiophene, polythiol, polyaniline, etc., can be used as the conductive material constituting the earpiece 12. In addition, at least one of the group consisting of these analogs can be used as the conductive material constituting the earpiece 12. 【0021】 The main unit 11 houses, for example, a main board 31 equipped with a VNA (Vector Network Analyzer) chip 32 and an acoustic processing chip 33, a driver unit 34, and a battery 35. 【0022】 The VNA chip (VNA integrated circuit) 32 is a processing circuit that measures S-parameters by applying an RF signal as an applied signal to the biological information object to be measured via a contact portion. In other words, the VNA chip 32 functions as a circuit unit for measuring S-parameters. 【0023】 The port of the VNA chip 32 is connected via a transmission line C1 to a contact portion (earpiece 12) that functions as an electrode, antenna, probe, etc. In the main body 11, the transmission line C1 is formed, for example, along the inner surface of the housing portion 11A and the sound conduit 11B, with a portion exposed to the outside of the sound conduit 11B, and is formed to cover the outer surface of the sound conduit 11B that comes into contact with the earpiece 12. 【0024】 The VNA chip 32 applies an applied signal to the inner wall of the external auditory canal to be measured via a predetermined port (hereinafter referred to as port P1), and receives the applied signal that has returned via port P1 as a reflected signal. 【0025】 The VNA chip 32 calculates S-parameters based on the applied signal and the reflected signal. S-parameters are parameters related to the magnitude (amplitude) and phase of the reflected signal, and are primary information used in calculating biological information. For example, if only port P1 is used for measurement, S11 is calculated as an S-parameter based on the applied signal and the reflected signal. S11 is information that represents the change in magnitude and phase of the reflected signal relative to the applied signal. 【0026】The VNA chip 32 calculates, for example, the blood glucose level (glucose concentration) of the subject to be measured based on S-parameters. However, the VNA chip 32 does not necessarily need to calculate the S-parameters of the subject to be measured; the subject's biological information may be calculated directly based on applied signals, reflected signals, etc. Alternatively, the subject's biological information may be calculated not by the VNA chip 32, but by a CPU mounted in the earphone 1 or by another device other than the earphone 1. 【0027】 The sound processing chip 33 receives an audio signal from the playback device via a communication unit and cables (not shown), and performs various signal processing on the audio signal. The sound processing chip 33 then supplies the processed audio signal to the driver unit 34. 【0028】 The driver unit 34 functions as a sound output unit that outputs (generates) sound in accordance with the acoustic signal supplied from the acoustic processing chip 33. The sound output from the driver unit 34 is delivered to the user's ears through the sound conduit 11B. 【0029】 The battery 35 supplies power to each component of the earphone 1. 【0030】 Figure 2 shows another example of an earphone configuration to which this technology is applied. In Figure 2, components identical to those in Figure 1 are denoted by the same reference numerals. Repetitive explanations are omitted where appropriate. 【0031】 The earphone 1 in Figure 2 differs from the earphone 1 in Figure 1 in that the earpiece 12 is composed of conductive parts 12C1 and 12c2 and an insulating part 12i. 【0032】 Figure 2A shows another example of the external configuration of earphone 1. 【0033】 As shown in Figure 2A, in the earpiece 12, the conductive portions 12c1 and 12c2 are formed with an insulating portion 12i in between, and are electrically isolated by the insulating portion 12i. The conductive portions 12c1 and 12c2 are formed using a conductive material, and the insulating portion 12i is formed using an insulating material. 【0034】 Figure 2B shows another example of the internal configuration of earphone 1. 【0035】 As shown in Figure 2B, the port P1 of the VNA chip 32 is connected to the conductive portion 12c1 of the earpiece 12 via a transmission line C2. In the main body 11, the transmission line C2 is formed, for example, along the inner surface of the housing portion 11A and the sound conduit 11B, with a portion exposed to the outside of the sound conduit 11B, and is formed to cover the surface of the outer surface of the sound conduit 11B that is in contact with the conductive portion 12c1. 【0036】 Furthermore, another port of the VNA chip 32, different from port P1 (hereinafter referred to as port P2), is connected to the conductive portion 12c2 of the earpiece 12 via a transmission line C3. In the main body 11, the transmission line C3 is formed, for example, along the inner surface of the housing portion 11A and the sound conduit 11B, with a portion exposed to the outside of the sound conduit 11B and formed to cover the surface of the outer surface of the sound conduit 11B that comes into contact with the conductive portion 12c2. 【0037】 The VNA chip 32 applies a signal to the inner wall of the ear canal under test from port P1 (conductive portion 12c1) and receives the applied signal that has returned via the conductive portion 12c1 as a reflected signal. The VNA chip 32 also applies a signal to the inner wall of the ear canal under test from port P2 (conductive portion 12c2) and receives the applied signal that has returned via the conductive portion 12c2 as a reflected signal. 【0038】 Furthermore, the VNA chip 32 receives the applied signal that has passed through the inner wall of the external auditory canal to be measured as a transmitted signal. In this case, for example, the applied signal is applied to the object to be measured via the conductive portion 12c1, and the transmitted signal corresponding to that applied signal is received via the conductive portion 12c2. 【0039】 The VNA chip 32 calculates S-parameters based on at least the applied signal and the reflected signal among the applied signal, reflected signal, and transmitted signal. For example, when ports P1 and P2 are used for measurement, S11 and S21 are calculated as S-parameters based on the applied signal, reflected signal, and transmitted signal. S21 is information representing the change in magnitude and phase of the transmitted signal relative to the applied signal. 【0040】As described above, when mounting the sensing module including the VNA chip 32 on the earphone 1, by forming at least a part of the earpiece 12 using a conductive material, it becomes unnecessary to newly provide electrodes or the like for applying the RF signal to the measurement target on the earphone 1. Therefore, it becomes possible to mount the sensing module for measuring blood glucose levels on the earphone 1 without affecting the size and design of the earphone 1. 【0041】 FIG. 3 is a diagram showing a configuration example of an ear cuff type earphone to which the present technology is applied. 【0042】 In FIG. 3A, a configuration example of the appearance of the ear cuff type earphone 51 to which the present technology is applied is shown. 【0043】 Similar to the earphone 1 described with reference to FIG. 1, the earphone 51 shown in FIG. 3A outputs sound corresponding to an acoustic signal wirelessly transmitted from a playback device such as a portable music player or a smartphone. Further, the earphone 51 also functions as a non-invasive wearable device for measuring biological information such as blood glucose levels. 【0044】 The housing of the earphone 51 is configured by, for example, a main body portion 61 having a substantially cylindrical shape and a mounting portion 62 having a shape curved in an L shape or a U shape. The main body portion 61 and the mounting portion 62 are integrally formed, but may be formed as separate members and joined together. 【0045】 A contact portion 63 for applying an RF signal for measuring primary information to the measurement target is provided on the main body portion 61, and a contact portion 64 for applying an RF signal for measuring primary information to the measurement target is provided on the mounting portion 62. 【0046】 FIG. 4 is a diagram showing a state in which the earphone 51 is mounted on a user's ear. 【0047】 When the earphone 51 is mounted on the user's ear, as shown in FIG. 4, the user's auricle is sandwiched by the tip portions of the main body portion 61 and the mounting portion 62. At this time, the contact portion 64 of the mounting portion 62 contacts near the concha, and the contact portion 63 of the main body portion 61 contacts the back side of the auricle. 【0048】As a result, the VNA chip provided in the earphone 51 can calculate the S11 of the user's auricle by applying a signal to the auricle to be measured via the contact portion 63 and receiving a reflected signal via the contact portion 63. In addition, the VNA chip can calculate the S11 of the user's auricle by applying a signal to the auricle to be measured via the contact portion 64 and receiving a reflected signal via the contact portion 64. 【0049】 Furthermore, the VNA chip can calculate the S21 of the user's auricle by receiving the transmitted signal that has passed through the auricle being measured. In this case, for example, an applied signal is applied to the user's auricle via the contact part 63, and a transmitted signal corresponding to that applied signal is received via the contact part 64. 【0050】 Figure 3B shows an example of the internal configuration of the earphone 51. 【0051】 As shown in Figure 3B, the housing of the earphone 51 incorporates, for example, a main circuit board 81, a flexible circuit board 82, a battery 83, and a driver unit (not shown). For example, the main circuit board 81 and the battery 83 are housed in the main body 61, a portion of the flexible circuit board 82 is housed in the main body 61, and the other portion of the flexible circuit board 82 is housed in the mounting portion 62. The driver unit may be housed in the main body 61 or in the mounting portion 62. 【0052】 A flexible circuit board 82 is connected to the main circuit board 81. The main circuit board 81 is also provided with, for example, a VNA chip (not shown), an acoustic processing chip (not shown), and a contact portion 63. The VNA chip and acoustic processing chip provided on the main circuit board 81 correspond to the VNA chip 32 and acoustic processing chip 33 described with reference to Figures 1 and 2. 【0053】 Port P1 of the VNA chip is connected to contact portion 63 via a transmission line formed on the main board 81, for example. Port P2 of the VNA chip is connected to contact portion 64 via a transmission line formed on the main board 81 and a transmission line formed on the flexible board 82, for example. 【0054】The flexible substrate 82 is provided with, for example, contact portions 64. For example, if a driver unit is housed within the mounting portion 62, a transmission line for the acoustic processing chip to transmit acoustic signals to the driver unit may be formed on the flexible substrate 82. 【0055】 The battery 83 supplies power to each component of the earphone 51. 【0056】 As described above, by using a flexible substrate 82 on which contact parts and transmission lines are provided, it becomes possible to realize an earphone 51 in which an L-shaped or U-shaped curved mounting part 62 is provided with a contact part for applying an RF signal to the object to be measured. 【0057】 In this technology, a non-invasive sensing module (including a VNA chip and contact parts) that measures biological information can be incorporated into various wearable devices worn on the user's ear or finger. 【0058】 Figure 5 shows an example of an earphone equipped with a sensing module. 【0059】 For example, a VNA chip and contact parts can be provided in a neckband-type earphone 101 as shown in Figure 5A. The contact parts that apply the RF signal to the object under measurement are provided, for example, in the parts of the left housing 111L and the right housing 111R that come into contact with the user's ears. In addition, contact parts are provided, for example, in the parts of the neckband 112 that come into contact with the area behind the user's auricle and the area around the neck. 【0060】 For example, a VNA chip and contact parts can be provided in an open-ear type earphone 131 as shown in Figure 5B. The contact parts that apply an RF signal to the object under measurement are provided, for example, in the part of the ring-shaped mounting part 141 that comes into contact with the vicinity of the user's ear canal. Alternatively, contact parts can be provided, for example, in the part of the main body 142 that comes into contact with the vicinity of the user's concha. 【0061】For example, a VNA chip and contact parts can be provided in an ear-hook type earphone 161 as shown in Figure 5C. The contact parts that apply an RF signal to the object under measurement are provided, for example, in the part of the earphone 161 that comes into contact with the user's ear. 【0062】 In addition to the examples mentioned above, wearable devices that have both biometric information measurement and sound output functions can also include headphones and earring-type earphones. Earring-type earphones are worn by clamping them onto the earlobe with a housing (for example, a main body housing a VNA chip and a curved contact part). The number of contact parts provided on a wearable device is arbitrary. 【0063】 Figure 6 shows an example of a ring-shaped device on which a sensing module is mounted. 【0064】 The ring-shaped device 201 in Figure 6 is configured as a so-called smart ring, possessing various functions such as the ability to measure biometric information. The ring-shaped device 201 is worn on the user's finger. The shape of the ring-shaped device 201 may be a ring that closes in a loop, or it may be a C-shaped ring with a part that is open and does not close in a loop. By making the shape of the ring-shaped device 201 not a ring that closes in a loop, it is possible to accommodate slight differences in finger size. To accommodate finger size, a deformable part may be provided in a part of the ring-shaped device 201. 【0065】 A contact portion 211 for applying an RF signal to the finger to be measured is provided on the back side of the housing of the ring-shaped device 201. 【0066】 Figure 7 shows an example of the internal configuration of the ring-shaped device 201. 【0067】 As shown in Figure 7A, the flexible substrate 205 is housed inside the housing of the ring-shaped device 201 in a curved state that conforms to the shape of the housing of the ring-shaped device 201. 【0068】In the example shown in Figure 7, two contact points 211-1 and 211-2 and one VNA chip 212 are provided on the flexible substrate 205. Port P1 of the VNA chip 212 is connected to contact point 211-1 via a transmission line C11 formed on the flexible substrate 205, and port P2 is connected to contact point 211-2 via a transmission line C12 formed on the flexible substrate 205. The number of contact points 211 provided on the flexible substrate 205 is arbitrary. 【0069】 The VNA chip 212 calculates the S11 of the user's finger by applying an applied signal to the finger to be measured via the contact portion 211-1 and receiving a reflected signal via the contact portion 211-1. In addition, the VNA chip 212 calculates the S11 of the user's finger by applying an applied signal to the finger to be measured via the contact portion 211-2 and receiving a reflected signal via the contact portion 211-2. 【0070】 Furthermore, the VNA chip 212 calculates the S21 of the user's finger by receiving the transmitted signal that has passed through the finger being measured. In this case, for example, an applied signal is applied to the finger via the contact part 211-1, and a transmitted signal corresponding to that applied signal is received via the contact part 211-2. 【0071】 In the following, the side of the flexible substrate 205 facing the user's finger, that is, the side facing the inside of the ring-shaped device 201, will be referred to as the back surface, and the side of the flexible substrate 205 opposite to the back surface, that is, the side facing the outside of the ring-shaped device 201, will be referred to as the front surface. 【0072】 The upper section of Figure 7B shows a plan view of the flexible substrate 205 in its uncurved state, as seen from the front side. The middle section shows a plan view of the flexible substrate 205 in its uncurved state, as seen from the back side. The lower section of Figure 7B shows a cross-sectional view of the flexible substrate 205 in its uncurved state, as seen from the side. 【0073】The flexible substrate 205 has, for example, a rectangular thin plate shape. As shown in Figure 7B, the VNA chip 212 is provided, for example, at approximately the center of the surface side of the flexible substrate 205. The contact portion 211-1 is provided, for example, at a position away from the VNA chip 212 in the long side direction of the flexible substrate 205, and penetrates the flexible substrate 205 in the thickness direction. The contact portion 211-2 is provided, for example, at a position opposite to the contact portion 211-1 with the VNA chip 212 in between, and penetrates the flexible substrate 205 in the thickness direction. 【0074】 The transmission line C11 connecting the VNA chip 212 (port P1) and the contact portion 211-1, and the transmission line C11 connecting the VNA chip 212 (port P2) and the contact portion 211-2 are formed, for example, on the surface side of the flexible substrate 205. 【0075】 Figure 8 shows another example of the internal configuration of the ring-shaped device 201. 【0076】 In the example shown in Figure 8, one contact portion 211-3 and one VNA chip 212 are provided on a flexible substrate 205 housed in the casing of the ring-shaped device 201. As shown in Figure 8A, the VNA chip 212 (port P1) is directly connected to the contact portion 211-3. 【0077】 The VNA chip 212 applies an applied signal to the finger to be measured via the contact portion 211-3 and receives a reflected signal via the contact portion 211-1 to calculate the S11 of the user's finger. 【0078】 The upper section of Figure 8B shows a plan view of the flexible substrate 205 in its uncurved state, as seen from the front side. The middle section shows a plan view of the flexible substrate 205 in its uncurved state, as seen from the back side. The lower section of Figure 8B shows a cross-sectional view of the flexible substrate 205 in its uncurved state, as seen from the side. 【0079】As shown in Figure 8B, the VNA chip 212 is provided, for example, at approximately the center of the surface side of the flexible substrate 205. The contact portion 211-3 is provided, for example, in the vicinity of the VNA chip 212, penetrating the flexible substrate 205 in the thickness direction. 【0080】 Figure 9 shows yet another example of the internal configuration of the ring-shaped device 201. 【0081】 In the example shown in Figure 9, three contact points 211-1 to 211-3 and three VNA chips 212-1 to 212-3 are provided on a flexible substrate 205 housed in the casing of the ring-shaped device 201. 【0082】 As shown in Figure 9A, contacts 211-1 to 211-3 are directly connected to the corresponding VNA chip 212 on a one-to-one basis. Specifically, VNA chip 212-1 (port P1) is directly connected to contact 211-1, VNA chip 212-2 (port P1) is directly connected to contact 211-2, and VNA chip 212-3 (port P1) is directly connected to contact 211-3. 【0083】 VNA chip 212-1 calculates the S11 of the user's finger by applying an applied signal to the finger to be measured via contact portion 211-1 and receiving a reflected signal via contact portion 211-1. VNA chip 212-2 calculates the S11 of the user's finger by applying an applied signal to the finger to be measured via contact portion 211-2 and receiving a reflected signal via contact portion 211-2. VNA chip 212-3 calculates the S11 of the user's finger by applying an applied signal to the finger to be measured via contact portion 211-1 and receiving a reflected signal via contact portion 211-3. 【0084】 Furthermore, for example, VNA chips 212-2 and 212-3 calculate S21 of the user's finger by receiving transmitted signals that have passed through the finger being measured. In this case, for example, an applied signal is applied to the user's finger via contact part 211-1, and a transmitted signal corresponding to that applied signal is received via contact parts 211-2 and 211-3. 【0085】The upper section of Figure 9B shows a plan view of the flexible substrate 205 in its uncurved state, as seen from the front side. The middle section shows a plan view of the flexible substrate 205 in its uncurved state, as seen from the back side. The lower section of Figure 9B shows a cross-sectional view of the flexible substrate 205 in its uncurved state, as seen from the side. 【0086】 As shown in Figure 9B, the VNA chip 212-2 is provided, for example, at approximately the center of the surface side of the flexible substrate 205. The contact portion 211-2 is provided, for example, in the vicinity of the VNA chip 212-2, penetrating the flexible substrate 205 in the thickness direction. 【0087】 The VNA chip 212-1 is provided, for example, on the surface side of the flexible substrate 205, at a position away from the VNA chip 212 in the direction of the long side of the flexible substrate 205. The contact portion 211-1 is provided, for example, in the vicinity of the VNA chip 212-1, penetrating the flexible substrate 205 in the thickness direction. The VNA chip 212-3 is provided, for example, on the surface side of the flexible substrate 205, on the opposite side of the VNA chip 212-1 with the VNA chip 212-2 in between. The contact portion 211-3 is provided, for example, in the vicinity of the VNA chip 212-3, penetrating the flexible substrate 205 in the thickness direction. 【0088】 As described above, by using a flexible substrate 205 equipped with a VNA chip, contacts, and transmission lines, it becomes possible to realize a ring-shaped device 201 capable of measuring biological information using RF signals. 【0089】 <2. Second Embodiment> In the first embodiment, a sensing module for measuring S-parameters was mounted on the wearable device, but in the second embodiment, a sensing module for measuring EC (Electric Conductivity) values is mounted on the wearable device. The EC value is information about conductivity and is primary information used in calculating biological information. 【0090】Figure 10 shows an example of the internal configuration of the earphone 1 according to the second embodiment. In Figure 10, components identical to those in Figure 2 are denoted by the same reference numerals. Repetitive explanations are omitted as appropriate. 【0091】 The earphone 1 in Figure 10 differs from the earphone 1 in Figure 2 in that it is equipped with an acoustic processing chip 251 instead of the VNA chip 32 and acoustic processing chip 33. 【0092】 Earphone 1 functions as a non-invasive wearable device that measures biological information such as skin moisture content. 【0093】 The acoustic processing chip (integrated circuit) 251 receives an acoustic signal from the playback device via a communication unit and cables (not shown), and performs various signal processing on the acoustic signal. The acoustic processing chip 251 supplies the processed acoustic signal to the driver unit 34. 【0094】 Furthermore, the acoustic processing chip 251 measures the EC value by applying an application signal for measuring the EC value to the object under measurement via contact portions that function as electrodes. In other words, the acoustic processing chip 251 also functions as a circuit for measuring the EC value. Here, the application signal applied to the object under measurement is an amplified signal of the acoustic signal supplied to the driver unit 34, and is an electrical signal of approximately 20 Hz to 20 kHz. 【0095】 The acoustic processing chip 251 is connected to the conductive portion 12c1 of the earpiece 12, which serves as a contact point, via a transmission line C51. In the main body 11, the transmission line C51 is formed, for example, along the inner surface of the housing portion 11A and the sound conduit 11B, with a portion exposed to the outside of the sound conduit 11B, and is formed to cover the surface of the outer surface of the sound conduit 11B that comes into contact with the conductive portion 12c1. 【0096】Furthermore, the sound processing chip 251 is connected to the conductive portion 12c2 of the earpiece 12, which serves as a contact point, via a transmission line C52. In the main body 11, the transmission line C52 is formed, for example, along the inner surface of the housing portion 11A and the sound conduit 11B, with a portion exposed to the outside of the sound conduit 11B, and is formed to cover the surface of the outer surface of the sound conduit 11B that comes into contact with the conductive portion 12c2. 【0097】 The acoustic processing chip 251 calculates, for example, the moisture content of the skin being measured based on the EC value. For example, if another sensing module that measures other biological information besides skin moisture content is mounted on the earphone 1, the skin moisture content calculated by the acoustic processing chip 251 is used to correct the measurement results of the other biological information. 【0098】 Furthermore, the acoustic processing chip 251 does not necessarily need to calculate the skin's moisture content; the EC value measured by the acoustic processing chip 251 may be directly used to correct other biological information. Alternatively, the skin's moisture content may be calculated not by the acoustic processing chip 251, but by a CPU mounted in the earphone 1 or by another device other than the earphone 1. 【0099】 Figure 11 shows a first example of the detailed configuration of the sound processing chip 251. 【0100】 As shown in Figure 11, the sound processing chip 251 includes a DAC (Digital to Analog Converter) 271, a driver amplifier 272, an output amplifier 273, a reference resistor 274, an input amplifier 275, an ADC (Analog to Digital Converter) 276, and a calculation unit 277. 【0101】 The DAC 271 converts, for example, a digital audio signal transmitted from a playback device into an analog audio signal and outputs it to the driver amplifier 272. 【0102】 The driver amplifier 272 amplifies the audio signal input from the DAC 271 and outputs it to the driver unit 34 and the output amplifier 273. 【0103】The driver unit 34 outputs sound corresponding to the acoustic signal input from the driver amplifier 272. 【0104】 The output amplifier 273 functions as an output unit that amplifies the acoustic signal input from the driver amplifier 272 and outputs it as an applied signal to the subsequent stage. The applied signal output from the output amplifier 273 is applied to the path of the reference resistor 274, conductive part 12c1, the object under measurement, and conductive part 12c2. In the acoustic processing chip 251, the conductive part 12c2 is connected to ground (earthed). 【0105】 The input terminal of the input amplifier 275 is connected to the connection point between the reference resistor 274 and the object under test (conductive portion 12c1). The applied signal (voltage at the connection point between the reference resistor 274 and the object under test), which is voltage divided by the reference resistor 274 and the object under test, is input to the input amplifier 275 as the measurement signal. If the resistance value of the reference resistor 274 (reference resistance value) is Rref and the resistance value of the object under test is Rdut, the measurement signal is given by, for example, the following equation (1): Measurement signal = Applied signal × Rdut / (Rdut + Rref) ... (1) 【0106】 The input amplifier 275 amplifies the input measurement signal and outputs it to the ADC 276. 【0107】 The ADC 276 converts the analog measurement signal input from the input amplifier 275 into a digital measurement signal and outputs it to the calculation unit 277. 【0108】 The calculation unit 277 analyzes the measurement signal input from the ADC 276 to calculate the resistance value Rdut (bioimpedance) of the object being measured as an EC value. 【0109】As described above, when a sensing module including an acoustic processing chip 251 is mounted on the earphone 1, by forming at least a portion of the earpiece 12 using a conductive material, it becomes unnecessary to newly provide electrodes on the earphone 1 for applying the applied signal to the object to be measured. Furthermore, since the EC value is measured using an applied signal which is an amplified acoustic signal supplied to the driver unit 34, it becomes unnecessary to provide a configuration in the earphone 1 for generating the applied signal. Therefore, it becomes possible to mount a sensing module that measures the EC value on the earphone 1 without affecting the size or design of the earphone 1. 【0110】 In addition to the earphone 1 with the earpiece 12 described above, other wearable devices with EC value measurement and sound output functions can include neckband-type earphones, open-ear type earphones, over-ear type earphones, earring-type earphones, headphones, etc. 【0111】 Figure 12 shows a second example of the detailed configuration of the sound processing chip 251. In Figure 12, components identical to those in Figure 11 are denoted by the same reference numerals. Repetitive explanations are omitted as appropriate. 【0112】 The acoustic processing chip 251 in Figure 12 differs from the acoustic processing chip 251 in Figure 12 in that it is provided with N-1 switches 301-1 to 301-(N-1). In the example in Figure 12, the earpiece 12 has N conductive parts 12c1 to 12cN that are electrically separated by an insulating part 12i. Hereafter, when there is no need to distinguish between switches 301-1 to 301-(N-1), they will simply be referred to as switch 301. 【0113】In the sound processing chip 251, conductive portions 12c1 to 12c(N-1) are each connected to a reference resistor 274 via switches 301, with one-to-one correspondence between them. For example, conductive portion 12c1 is connected to the reference resistor 274 via switch 301-1, conductive portion 12c2 is connected to the reference resistor 274 via switch 301-2, and conductive portion 12c(N-1) is connected to the reference resistor 274 via switch 301-(N-1). In the sound processing chip 251, conductive portion 12cN is connected to ground (earthed). 【0114】 The input terminal of the input amplifier 275 is connected to the connection point between the reference resistor 274 and the object under test (each switch 301). 【0115】 If, for example, only switch 301-1 is turned on among switches 301-1 to 301-(N-1), the applied signal output from the output amplifier 273 is applied to the path of the reference resistor 274, the conductive part 12c1, the object under test, and the conductive part 12cN. In this case, the input amplifier 275 receives the applied signal, which has been voltage-divided between the reference resistor 274 and the part of the object under test that is in contact with the conductive part 12c1, as the measurement signal, and the calculation unit 277 calculates the resistance value Rdut1 of that part of the object under test as the EC value. 【0116】 If, for example, only switch 301-2 is turned on among switches 301-1 to 301-(N-1), the applied signal output from the output amplifier 273 is applied to the path of the reference resistor 274, the conductive part 12c2, the object under test, and the conductive part 12cN. In this case, the input amplifier 275 receives the applied signal, which has been voltage-divided between the reference resistor 274 and the part of the object under test that is in contact with the conductive part 12c2, as the measurement signal, and the calculation unit 277 calculates the resistance value Rdut2 of that part of the object under test as the EC value. 【0117】If, for example, only switch 301-(N-1) is turned on among switches 301-1 to 301-(N-1), the applied signal output from the output amplifier 273 is applied to the path of the reference resistor 274, the conductive portion 12c(N-1), the object under test, and the conductive portion 12cN. In this case, the input amplifier 275 receives the applied signal, which is voltage-divided between the reference resistor 274 and the portion of the object under test that is in contact with the conductive portion 12c(N-1), as the measurement signal, and the calculation unit 277 calculates the resistance value Rdut of that portion of the object under test. N-1 This is calculated as the EC value. 【0118】 As described above, by providing a switch 301 between each of the conductive parts 12c1 to 12c(N-1) and the reference resistor 274 and input amplifier 275, it is possible to switch the conductive part to which the applied signal is applied to the object under test. By measuring the EC value while switching the conductive part to which the applied signal is applied to the object under test, the EC values of multiple parts of the object under test can be obtained. 【0119】 Figure 13 shows a third example of the detailed configuration of the sound processing chip 251. In Figure 13, components identical to those in Figure 11 are denoted by the same reference numerals. Repetitive explanations are omitted as appropriate. 【0120】 The acoustic processing chip 251 in Figure 13 differs from the acoustic processing chip 251 in Figure 12 in that it does not have a reference resistor 274, an input amplifier 275, an ADC 276, and a calculation unit 277. Furthermore, the acoustic processing chip 251 in Figure 13 differs from the acoustic processing chip 251 in Figure 12 in that the operational amplifier 321, a reference resistor 322, an ADC 323, and a calculation unit 324 are provided after the conductive portion 12c2. 【0121】In the example shown in Figure 13, the applied signal output from the output amplifier 273 is applied to the path through the conductive part 12c1, the object under test, and the conductive part 12c2. The applied signal that has propagated to the conductive part 12c2 is input to an amplification unit, which is configured by connecting the output terminal of the operational amplifier 321 to the input terminal of the operational amplifier 321 via a reference resistor 323. The amplification unit amplifies the input applied signal with an amplification factor based on the resistance value Rdut of the object under test and the resistance value Rref of the reference resistor 323, and outputs it to the ADC 276 as a measurement signal. 【0122】 The ADC 276 converts the analog measurement signal input from the amplification unit into a digital measurement signal, and the calculation unit 277 analyzes the digital measurement signal to calculate the resistance value Rdut of the object under measurement as the EC value. 【0123】 Figure 14 shows a fourth example of the detailed configuration of the sound processing chip 251. In Figure 14, components identical to those in Figure 11 are denoted by the same reference numerals. Repetitive explanations are omitted as appropriate. 【0124】 The sound processing chip 251 in Figure 14 differs from the sound processing chip 251 in Figure 12 in that it is equipped with an output amplifier 341, an input amplifier 342, and an ADC 343. 【0125】 The same audio signal that is input to the output amplifier 273 is input to the output amplifier 341. The output amplifier 341 amplifies the audio signal input from the driver amplifier 272, for example, in the same way as the output amplifier 273, and outputs it to the input amplifier 342 as a reference signal. 【0126】 The input amplifier 342 amplifies the reference signal input from the output amplifier 341, for example, in the same way as the input amplifier 276, and outputs it to the ADC 343. 【0127】 The ADC 343 converts the analog reference signal input from the input amplifier 342 into a digital reference signal and outputs it to the calculation unit 277. 【0128】The calculation unit 277 analyzes the measurement signal input from the ADC 276 to calculate the resistance value Rdut of the object under test as an EC value. Specifically, the calculation unit 277 calculates the resistance value Rdut of the object under test based on the ratio of the measurement signal input from the ADC 276 to the reference signal input from the ADC 343, and the reference resistance value Rref. 【0129】 The acoustic processing chip 251 calculates the resistance value Rdut of the object under measurement based on the ratio of the measurement signal to the reference signal, thereby enabling the acquisition of a more accurate resistance value Rdut. 【0130】 It should be noted that the embodiments of this technology are not limited to those described above, and various modifications are possible without departing from the spirit of this technology. 【0131】 For example, this technology allows for the combination of the first and second embodiments described above. 【0132】 For example, this technology can be configured as cloud computing, where a single function is shared and processed collaboratively by multiple devices via a network. 【0133】 The effects described herein are illustrative and not limited to those described herein, and other effects may also occur. 【0134】 <Examples of configuration combinations> This technology can also be configured as follows: 【0135】(1) A wearable device that can be attached to an ear or finger that is to be measured for primary information used in calculating biological information, comprising: a circuit section for measuring the primary information; a contact section for applying an application signal for measuring the primary information output from the circuit section to the object to be measured; and a housing that houses the circuit section and has the contact section provided in the part that contacts the object to be measured. (2) The wearable device according to (1), wherein the housing further houses a sound output section that outputs sound corresponding to an acoustic signal. (3) The wearable device according to (2), wherein the housing comprises a main body section that houses the circuit section and the sound output section and has a sound conduit for delivering sound output from the sound output section to the ear; and an earpiece attached to the sound conduit, wherein the earpiece has the contact section formed using a conductive material. (4) The wearable device according to (3), wherein the circuit portion and the contact portion are connected via a transmission line for transmitting the applied signal, and a portion of the transmission line is formed to cover the outer surface of the sound conduit that contacts the contact portion. (5) The wearable device according to (4), wherein a portion of the transmission line is formed along the inner surface of the housing. (6) The wearable device according to any one of (3) to (5), wherein the earpiece has a plurality of electrically separated contact portions. (7) The wearable device according to (2), wherein the housing has a main body portion in which the circuit portion is housed and a curved attachment portion, and is attached so as to sandwich the auricle between at least a portion of the attachment portion and at least a portion of the main body portion, and the housing is provided with a plurality of contact portions, including a first contact portion provided on the portion of the main body portion that contacts the auricle, and a second contact portion provided on the portion of the attachment portion that contacts the auricle. (8) The wearable device according to (7), wherein the circuit portion and the first contact portion are connected via a transmission line for transmitting the applied signal, and the mounting portion houses at least a portion of a flexible substrate on which the second contact portion and at least a portion of the transmission line are provided.(9) The wearable device according to any one of (1) to (8), wherein the circuit unit is a VNA integrated circuit that measures S parameters as primary information. (10) The wearable device according to any one of (2) to (6), wherein the circuit unit is an integrated circuit that measures conductivity information as primary information. (11) The wearable device according to (10), wherein the circuit unit outputs a signal amplified from the acoustic signal as the applied signal. (12) The wearable device according to (11), wherein the circuit unit has an output unit that outputs the applied signal, a reference resistor provided between the output unit and the contact unit, and a calculation unit that calculates conductivity information based on the applied signal which is voltage divided between the reference resistor and the object to be measured. (13) The wearable device according to (12), wherein the housing is provided with a plurality of contact units, and each of the plurality of contact units is connected to the reference resistor via a switch that corresponds to it one-to-one. (14) The wearable device according to (12) or (13), wherein the calculation unit calculates information relating to conductivity based on the ratio of a reference signal amplified from the acoustic signal and the applied signal divided by the reference resistance and the object under test. (15) The wearable device according to (11), wherein the housing is provided with a first contact portion for applying the applied signal to the object under test and a second contact portion for receiving the applied signal propagated through the object under test, and the circuit portion has an output portion for outputting the applied signal to the first contact portion, an amplification portion for amplifying the applied signal received by the second contact portion with an amplification factor based on the resistance value of the reference resistance and the resistance value of the object under test, and a calculation unit for calculating information relating to conductivity based on the applied signal amplified by the amplification portion. (16) The wearable device according to (1), wherein the housing has a ring shape. (17) The wearable device according to (16), wherein the housing houses a flexible substrate having the contact portion and the circuit portion, in a curved state conforming to the shape of the housing. (18) The wearable device according to (17), wherein the flexible substrate has a plurality of contact portions.(19) The wearable device according to (18), wherein the flexible substrate is provided with one of the circuit sections connected to each of the plurality of contact sections via a transmission line for transmitting the applied signal. (20) The wearable device according to (18), wherein the flexible substrate is provided with a plurality of circuit sections corresponding one-to-one to each of the plurality of contact sections. 【0136】 1 Earphone, 11 Main body, 11A Housing, 11B Sound conduit, 12 Eartip, 12c1 to 12cN Conductive part, 12i Insulating part, 31 Main board, 32 VNA chip, 33 Acoustic processing chip, 34 Driver unit, 35 Battery, 51 Earphone, 61 Main body, 62 Fitting part, 63, 64 Contact parts, 201 Ring-shaped device, 205 Flexible board, 211 Contact part, 212 VNA chip, 251 Acoustic processing chip, 271 DAC, 272 Driver amplifier, 273 Output amplifier, 274 Reference resistor, 275 Input amplifier, 276 ADC, 277 Calculation unit, 301-1 to 301-(N-1) Switch, 321 Operational amplifier, 322 Reference resistor, 323 ADC, 324 Calculation unit, 341 Output amplifier, 342 Input amplifier, 343 ADC
Claims
1. A wearable device that can be attached to the ear or finger, which is the target of measurement for primary information used in calculating biological information, comprising: a circuit section for measuring the primary information; a contact section for applying an application signal for measuring the primary information output from the circuit section to the target of measurement; and a housing in which the circuit section is housed and the contact section is provided in the part that comes into contact with the target of measurement.
2. The wearable device according to claim 1, wherein the housing further houses a sound output unit that outputs sound corresponding to an acoustic signal.
3. The wearable device according to claim 2, wherein the housing comprises a main body that houses the circuit unit and the sound output unit and has a sound conduit that delivers sound output from the sound output unit to the ear, and an earpiece attached to the sound conduit, the earpiece having the contact portion formed using a conductive material.
4. The wearable device according to claim 3, wherein the circuit portion and the contact portion are connected via a transmission line for transmitting the applied signal, and a portion of the transmission line is formed to cover the outer surface of the sound conduit that comes into contact with the contact portion.
5. The wearable device according to claim 4, wherein a portion of the transmission line is formed along the inner surface of the housing.
6. The wearable device according to claim 3, wherein the earpiece has a plurality of electrically isolated contact portions.
7. The wearable device according to claim 2, wherein the housing comprises a main body portion in which the circuit portion is housed and a curved attachment portion, and is attached so as to sandwich the auricle between at least a portion of the attachment portion and at least a portion of the main body portion, and the housing is provided with a plurality of contact portions, including a first contact portion provided on the portion of the main body portion that contacts the auricle, and a second contact portion provided on the portion of the attachment portion that contacts the auricle.
8. The wearable device according to claim 7, wherein the circuit portion and the first contact portion are connected via a transmission line for transmitting the applied signal, and the mounting portion houses at least a portion of a flexible substrate on which the second contact portion and at least a portion of the transmission line are provided.
9. The wearable device according to claim 1, wherein the circuit section is a VNA integrated circuit that measures the S-parameters as primary information.
10. The wearable device according to claim 2, wherein the circuit section is an integrated circuit that measures information relating to conductivity as primary information.
11. The wearable device according to claim 10, wherein the circuit unit outputs a signal amplified from the acoustic signal as the applied signal.
12. The wearable device according to claim 11, wherein the circuit unit comprises an output unit that outputs the applied signal, a reference resistor provided between the output unit and the contact unit, and a calculation unit that calculates information regarding conductivity based on the applied signal which has been voltage-divided by the reference resistor and the object under measurement.
13. The wearable device according to claim 12, wherein the housing is provided with a plurality of contact portions, and each of the plurality of contact portions is connected to the reference resistor via a switch that corresponds to it on a one-to-one basis.
14. The wearable device according to claim 12, wherein the calculation unit calculates information regarding conductivity based on the ratio of a reference signal amplified from the acoustic signal to the applied signal divided by the reference resistance and the object under measurement.
15. The wearable device according to claim 11, wherein the housing is provided with a first contact portion for applying the applied signal to the object to be measured, and a second contact portion for receiving the applied signal propagated through the object to be measured, and the circuit portion comprises an output portion for outputting the applied signal to the first contact portion, an amplification portion for amplifying the applied signal received by the second contact portion with an amplification factor based on the resistance value of a reference resistor and the resistance value of the object to be measured, and a calculation portion for calculating information relating to conductivity based on the applied signal amplified by the amplification portion.
16. The wearable device according to claim 1, wherein the housing has a ring-shaped form.
17. The wearable device according to claim 16, wherein a flexible circuit board, on which the contact portion and the circuit portion are provided, is housed in the housing in a curved state that conforms to the shape of the housing.
18. The wearable device according to claim 17, wherein the flexible substrate is provided with a plurality of contact portions.
19. The wearable device according to claim 18, wherein the flexible substrate is provided with one circuit section connected to each of the plurality of contact sections via a transmission line for transmitting the applied signal.
20. The wearable device according to claim 18, wherein the flexible substrate is provided with a plurality of circuit portions that correspond one-to-one with each of the plurality of contact portions.