Neural probe and method for manufacturing same

Abstract

A neural probe according to the present invention comprises: a substrate unit; a wire unit formed on the upper surface of the substrate unit; an insulating layer covering the upper surface of the substrate unit and the upper surface of the wire unit; a wire opening pattern formed as a groove structure on the insulating layer so as to expose a portion of the wire unit to the outside; and an electrode unit having at least one portion formed inside the wire opening pattern.

Description

Nerve probe and method of manufacturing the same

[0001] The present invention relates to a neural probe for performing electrical stimulation on neural organs / tissues such as the brain or measuring physiological signals from them, and a method for manufacturing the same.

[0002] A nerve probe makes invasive or minimally invasive contact with nerve organs / tissues, such as the brain. Additionally, a contact electrode is formed at the insertion part of the nerve probe that makes direct contact with cells, etc. These contact electrodes perform electrical stimulation on the brain, etc., by applying an electric current. Furthermore, the contact electrodes measure various nerve signals from the brain, etc.

[0003] The aforementioned nerve probe can be utilized for various medical purposes, such as the treatment and examination of various brain lesions.

[0004] In addition, as an example of the neural probe described above, prior Korean Published Patent No. 10-2017-0127967 discloses a neural probe module for optical stimulation and a neural probe system equipped with the same. The aforementioned prior art discloses a neural probe for performing additional optical stimulation on a nerve cell, etc.

[0005] Meanwhile, the aforementioned contact electrode has an extremely small size, which causes a problem in that mass production of nerve probes is difficult.

[0006] As part of solving the aforementioned problem, the present invention aims to provide a mass-producible neural probe and a method for manufacturing the same.

[0007] A neural probe according to the present invention is characterized by comprising: a substrate portion; a wiring portion formed on the upper surface of the substrate portion; an insulating layer covering the upper surface of the substrate portion and the upper surface of the wiring portion; a wiring opening pattern formed in a groove structure in the insulating layer to expose a part of the wiring portion to the outside; and an electrode portion having at least a part formed inside the wiring opening pattern.

[0008] In addition, the electrode portion is characterized by protruding higher than the upper surface of the insulating layer.

[0009] In addition, the electrode portion is characterized by including tin.

[0010] In addition, the electrode portion is characterized by including a tin dioxide layer formed on the upper surface.

[0011] In addition, the nerve probe is characterized by including an electrode cover layer that covers the outer surface of the electrode portion and comprises at least one type selected from the group including gold, platinum, and PEDOT:PSS.

[0012] In addition, the insulating layer is characterized by including a side insulating portion that surrounds the circumferential direction of the wiring portion, a vertical extension portion that extends coaxially upward from the side insulating portion, and a horizontal extension portion that extends horizontally from the vertical extension portion and covers the upper surface edge of the wiring portion.

[0013] In addition, the insulating layer is characterized by including a cured product of PSR ink.

[0014] In addition, the manufacturing method according to the present invention is characterized by comprising: a wiring formation step in which a wiring portion is formed on the upper surface of a substrate portion; an insulation treatment step in which an insulating layer covering the upper surface of the substrate portion and the upper surface of the wiring portion is formed; a wiring exposure step in which a portion of the insulating layer is selectively removed to form a wiring opening pattern so that a portion of the wiring portion is exposed to the outside; and an electrode formation step in which an electrode portion is formed on the wiring opening pattern.

[0015] In addition, the electrode forming step is characterized by forming the electrode portion that protrudes higher than the upper surface of the insulating layer by electroplating tin.

[0016] In addition, the electrode forming step is characterized in that, after the electroplating, the upper surface of the electrode portion is oxidized to form a tin dioxide layer.

[0017] In addition, the above manufacturing method is characterized by including an electrode cover step in which an electrode cover layer is formed by providing at least one material selected from the group comprising gold, platinum, and PEDOT:PSS on the outer surface of the electrode portion.

[0018] In addition, the insulation treatment step is characterized by the formation of the insulation layer by applying PSR ink to the upper surface of the substrate portion and the upper surface of the wiring portion and then curing it.

[0019] In addition, the wiring exposure step is characterized in that the wiring opening pattern is formed to be located on the inner side of the upper surface of the wiring portion.

[0020] According to the present invention, an insulating layer can be easily formed through the coating and curing of an epoxy-based material such as PSR ink.

[0021] In addition, the electrode portion is formed through a tin electroplating process. Accordingly, various benefits are provided, such as reduced material costs compared to other metals and improved production speed.

[0022] In addition, the electrode portion protrudes above the insulating layer. Accordingly, the electrode portion comes into more easy contact with human tissue.

[0023] In addition, a tin oxide layer is formed on the outer surface of the aforementioned tin electrode through a natural oxidation reaction. The tin oxide layer is harmless to the human body while providing excellent electrical properties.

[0024] In addition, electrical properties can be further enhanced by additionally laminating various metal / conductive polymer layers, such as platinum / PEDOT:PSS, onto the aforementioned tin / tin oxide layer.

[0025] FIG. 1 is a perspective view showing a neural probe according to the present invention.

[0026] FIG. 2 is a flowchart illustrating a method for manufacturing a neural probe according to the present invention.

[0027] FIGS. 3A and FIGS. 3B are cross-sectional views showing an example of the wiring formation step illustrated in FIGS. 2.

[0028] FIG. 4 is a cross-sectional view showing an example of the insulation processing step illustrated in FIG. 2.

[0029] FIG. 5 is a cross-sectional view showing an embodiment of the wiring exposure step illustrated in FIG. 2.

[0030] FIGS. 6a and FIGS. 6b are cross-sectional views showing an example of the electrode formation step illustrated in FIGS. 2.

[0031] Figure 7 is a scanning electron microscope image showing a neural probe according to an example and a comparative example.

[0032] Figure 8 is a graph showing the results of X-ray photoelectron spectroscopy analysis of a neural probe according to an embodiment.

[0033] Figure 9 is a graph showing the results of electrochemical impedance spectroscopic analysis of a neural probe according to an example.

[0034] Figure 10 is a graph showing the results of the biocompatibility evaluation of a neural probe according to an example.

[0035] Figure 11 is a graph showing the impedance measured in the neural probes according to the example and comparative example.

[0036] Figure 12 is a graph showing the results of biosignal measurement of a neural probe according to an example and a comparative example.

[0037] FIG. 13 is a cross-sectional view showing a neural probe according to another embodiment of the present invention.

[0038] FIG. 14 is a scanning electron microscope image showing a neural probe according to another embodiment.

[0039] Figure 15 is a graph showing the results of cyclic voltammetry analysis of neural probes according to annotated embodiments.

[0040] Prior to a detailed description of the present invention, specific details for implementing the invention are included in the embodiments and drawings described below. Additionally, identical reference numerals throughout the specification refer to identical components. Furthermore, singular expressions in this specification include plural forms unless specifically stated otherwise.

[0041] Hereinafter, a neural probe according to the present invention and a method for manufacturing the same will be described with reference to the drawings.

[0042] FIG. 1 is a perspective view showing a neural probe according to the present invention. FIG. 2 is a flowchart showing a method for manufacturing a neural probe according to the present invention.

[0043] Referring to FIGS. 1 and 2, the neural probe (1000) according to the present invention includes a substrate portion (100), a wiring portion (200), an insulating layer (300), and an electrode portion (400).

[0044] In addition, the nerve probe (1000) is substantially inserted into the inside of the human body. Also, one end of the nerve probe (1000) may be formed into a pointed structure.

[0045] Additionally, the terminal end of the neural probe (1000) can be combined with the board unit (10). The separate board unit (10) can mediate power supply / signal transmission and reception between the power supply / signal processing device and the neural probe (1000).

[0046] Here, the separate signal processing device may be selected from a laptop, desktop, tablet, smart device, PDA, and various other unmentioned computing means. Additionally, a chip / printed circuit board, etc. for implementing the above-mentioned function may be installed on the board portion (10).

[0047] In addition, the method for manufacturing the above-mentioned neural probe (1000) includes a wiring formation step (S100), an insulation treatment step (S200), a wiring exposure step (S300), and an electrode formation step (S400).

[0048] FIGS. 3A and FIGS. 3B are cross-sectional views showing an example of the wiring formation step illustrated in FIGS. 2.

[0049] Referring further to FIGS. 3a and 3b, the wiring portion (200) is installed on the upper surface of the substrate portion (100) through the wiring forming step (S100).

[0050] More specifically, the substrate portion (100) may be a polymer material having a certain degree of flexibility. For example, the substrate portion (100) may be selected from polyimide (PI), parylenes, silicones, polycarbonates, polystyrene, polyurethane, SU-8, poly(methyl methacrylate (PMMA), polydimethylsiloxane (PDMS), and various other materials.

[0051] Additionally, the substrate portion (100) may be provided by a film, liquid coating and curing, and various other means / methods.

[0052] And, the wiring unit (200) performs power supply, signal transmission and reception, etc., in the use of the neural probe (1000).

[0053] In addition, the wiring portion (200) may be manufactured from a conductive material to perform the electrical function described above. For example, the wiring portion (200) may be manufactured from copper (Cu) or various other conductive / metal materials. Additionally, the wiring portion (200) may be installed on the substrate portion (100) through plating, deposition, attachment, or various other means / methods.

[0054] Additionally, referring to Figures 3a and 3b, the wiring section (200) may be provided in multiple numbers.

[0055] For example, referring first to FIG. 3a, a wiring forming material (ML) can be laminated on the upper surface of the substrate portion (100).

[0056] Next, referring to FIG. 3b, a portion of the wiring forming material (ML) is selectively removed so that at least one wiring pattern is formed. The result of this removal / patterning process is defined as the wiring portion (200).

[0057] Here, the patterning / removal process described above can be performed by etching, laser / light irradiation, and various other means.

[0058] Additionally, the wiring forming material (ML) may be laminated onto the substrate (100) to have the shape of a pre-intended wiring portion (200). For example, a material having a wiring portion (200) pattern may be attached directly to the substrate (100). For example, the wiring forming material (ML) may be laminated while a mask is provided on the upper surface of the substrate (100) in a portion other than the wiring pattern.

[0059] Additionally, preferably, the periphery of the wiring portion (200) is spaced horizontally at a predetermined distance or more from the periphery edge of the substrate. That is, the wiring portion (200) is located on the inner side of the upper surface of the substrate portion (100).

[0060] FIG. 4 is a cross-sectional view showing an example of the insulation processing step illustrated in FIG. 2.

[0061] Referring further to FIG. 4, the insulating layer (300) is laminated on the upper surface of the substrate portion (100) and the upper surface of the wiring portion (200) through the insulating processing step (S200).

[0062] The insulating layer (300) insulates conductive components such as the wiring portion (200). Additionally, the insulating layer (300) may have adhesive properties to further secure the wiring portion (200) to the substrate portion (100).

[0063] For example, the insulating layer (300) may be selected from a polyfunctional monomer, an epoxy resin / epoxy curing accelerator, and various other insulating polymer materials. Here, examples of epoxy resins may include epoxy phenol novolak (EPN), bisphenol-A (BPA), etc., but are not limited thereto. In addition, the epoxy curing accelerator may include amines / acid anhydrides, etc., but is not limited thereto.

[0064] In addition, the insulating layer (300) may be a PSR (Photo Imagable Solder Resist) ink using the epoxy-based material described above and a cured product thereof.

[0065] Additionally, the insulating layer (300) can be provided by coating / spraying, deposition, attachment, and various other means / methods.

[0066] Meanwhile, various coating techniques such as spin coating are advantageous for controlling the thickness of the insulating layer (300) by controlling the spin rotation speed, coating flow rate / flow rate, etc. Additionally, the coated material can be cured by UV, light of various other wavelengths, heaters, etc.

[0067] FIG. 5 is a cross-sectional view showing an embodiment of the wiring exposure step illustrated in FIG. 2.

[0068] Referring further to FIG. 5, through the wiring exposure step (S300), a portion of the wiring portion (200) is exposed to the outside of the insulation layer (300).

[0069] More specifically, a wiring opening pattern (OP) is formed by selectively removing a portion of the part of the insulating layer (300) that faces a portion of the wiring portion (200). Additionally, the wiring opening pattern (OP) corresponds to the perimeter shape of the electrode portion (400) to be described later.

[0070] Here, the wiring opening pattern (OP) can be provided by etching, laser, cutting, or various other means / methods. Additionally, the shape of the wiring opening pattern (OP) can be selected in various ways, such as grooves / slits.

[0071] Additionally, at least a portion of the insulating layer (300) may cover the upper surface of the wiring portion (200). For example, the insulating layer (300) may include a side insulating portion (310), a vertical extension portion (320), and a horizontal extension portion (330).

[0072] The above-mentioned side insulation portion (310) is formed to wrap around the circumference of each wiring portion (200). The height / thickness of the side insulation portion (310) corresponds to the height / thickness of the wiring portion (200).

[0073] And, the vertical extension (320) extends coaxially upward from the side insulation (310). That is, the vertical extension (320) is positioned higher than the wiring section (200).

[0074] And, the horizontal extension (330) extends horizontally from the vertical extension (320) to cover the upper edge side of the wiring section (200). Additionally, the wiring opening pattern (OP) is located inside the horizontal extension (330).

[0075] That is, by positioning the wiring opening pattern (OP) on the inner side of the upper surface of the wiring section (200), a stepped / level structure is formed on the insulating side in contact with the wiring section (200) by the side insulating section (310) and the horizontal extension section (330). In this case, the upper and lower surfaces of the wiring section (200) are firmly fixed by the substrate section (100) and the vertical / horizontal extension sections (320, 330).

[0076] FIGS. 6a and FIGS. 6b are cross-sectional views showing an example of the electrode formation step illustrated in FIGS. 2.

[0077] Referring further to FIGS. 6a and 6b, an electrode portion (400) is formed on the wiring opening pattern (OP) through the electrode forming step (S400).

[0078] The bottom surface of the electrode portion (400) contacts the upper surface of the wiring portion (200). Additionally, the electrode portion (400) receives power necessary for operation from the wiring portion (200). Furthermore, the electrode portion (400) is in close contact with the internal tissues of the human body. Additionally, the electrode portion (400) performs electrical stimulation on the human body. Furthermore, the electrode portion (400) measures and acquires electrical / physiological signals from the human body, which are transmitted and stored to various external devices through the wiring portion (200).

[0079] In addition, to implement the aforementioned electrical functions, the electrode portion (400) may be formed of a conductive material. For example, the electrode portion (400) may be formed of nickel (Ni), copper (Cu), gold (Au), platinum (Pt), tin (Sn), and various other metal materials. Additionally, the electrode portion (400) may be formed of other conductive materials (e.g., graphene) even if they are non-metals.

[0080] Additionally, preferably, the electrode portion (400) may protrude a predetermined height from the upper surface of the insulating layer (300). Such a protruding electrode can come into contact with the human body more easily than a buried electrode.

[0081] Meanwhile, metals other than tin, such as gold, platinum, and nickel, are difficult to form into water-soluble salts because it is difficult to ensure stability in the ionic state. Additionally, metals other than tin have relatively high reduction potentials, making it difficult for deposition / plating by electrolytic reduction to proceed smoothly under general aqueous-based conditions. For these reasons, metals other than tin must be plated using an electroless method. However, electroless plating has disadvantages, such as requiring a separate complex electrolyte (e.g., cyanide-based or chloride-based), making it difficult to set, control, and maintain various manufacturing conditions like pH, and resulting in a low production rate per unit time.

[0082] Therefore, preferably, the electrode portion (400) can be made of tin (Sn). In the case of tin, it is very easy to ensure stability in the ionic state and has a significantly low reduction potential, making it very advantageous for electroplating. In this respect, if tin is used, electrode portions (400) can be formed on all of the semi-finished products of a plurality of nerve probes (1000) simply by immersing them in a single electrolytic decomposition tank. In addition, the production efficiency of tin in electroplating is very high, so tin can be plated sufficiently thickly in a relatively short time, such as the protruding electrode portion (400) described above.

[0083] Additionally, referring to Figures 6a and 6b, the electrode portion (400) may include a main metal portion (410) and a metal oxide portion (420).

[0084] At least a portion of the lower side of the main metal part (410) is located inside the wiring opening pattern (OP). Additionally, the upper side of the main metal part (410) may protrude from the upper surface of the insulating layer (300).

[0085] And, the metal oxide portion (420) is formed by the oxidation of the upper surface of the main metal portion (410). For example, after the main metal portion (410) is formed through electroplating, the metal oxide portion (420) can be formed by the upper surface of the main metal portion (410) being naturally oxidized by oxygen in the atmosphere.

[0086] For example, if the main metal part (410) is a tin (Sn) layer, the metal oxide part (420) may be a tin dioxide (SnO2) layer. More specifically, in the electroplating process, the electrolyte contains divalent / tetravalent tin ions (Sn 2+ / Sn 4+A substance that supplies ) may be added. For example, the electrolyte may contain acidic bath components such as stannous chloride (SnCl2). In addition, if the process material is exposed to the atmosphere immediately after the completion of the electroplating process, the tetravalent tin ions remaining on the surface of the pure tin layer react with oxygen in the atmosphere to form a tin dioxide layer within a short period of time.

[0087]

[0088] [Example 1]

[0089] Based on the above-described manufacturing method, a nerve probe (1000) according to the present embodiment was manufactured.

[0090] More specifically, first, the substrate portion (100) was made of polyimide with a thickness of 0.8 μm.

[0091] Next, in the wiring formation step (S100), a copper (Cu) film with a thickness of 12 μm was selected as the wiring forming material (ML). Additionally, a portion of the wiring forming material (ML) was removed so that two strands of wiring (200) are formed on the inner side of the upper surface of the substrate (100).

[0092] At this time, the two wire sections (200) are arranged along the long axis of the substrate section (100) and are positioned parallel to each other. In addition, the width of each wire section (200) is 125 μm, and the spacing between each wire section (200) is 100 μm.

[0093] Next, in the case of the insulation treatment step (S200), PSR ink was applied to the upper surface of the substrate portion (100) and the wiring portion (200). Next, the PSR ink was UV-cured, thereby forming an insulating layer (300) having a thickness of 20 μm based on the upper surface of the wiring portion (200).

[0094] Next, in the case of the wiring exposure step (S300), a portion of the insulating layer (300) was selectively removed through a photolithography process. Accordingly, a wiring opening pattern (OP) having a diameter of 30 μm was formed on the inner side of the upper surface of each wiring portion (200).

[0095] Next, an electrode portion (400) is formed by performing an electroplating process on the semi-finished product that has been processed up to the wiring exposure step (S300).

[0096] More specifically, the above-mentioned semi-finished product was immersed in a plating solution bath. Here, the plating solution is a mixture of stannous chloride (SnCl2) and methanesulfonic acid (MSA). The temperature of the plating solution was maintained at 30 to 40 ℃, and the pH of the plating solution was maintained at 1 to 2.

[0097] Also, a pure tin plate is used as the anode, and the cathode is the aforementioned semi-finished product.

[0098] And, 1 ~ 5 A / dm 2 The electroplating process was performed for 30 minutes at a current density.

[0099] Here, the finally formed electrode portion (400) has a thickness of 30 μm and protrudes above the insulating layer (300). Additionally, as the plated electrode portion (400) is exposed to the atmosphere, a tin dioxide layer, which is a metal oxide portion (420), is formed on its upper surface.

[0100]

[0101] [Example 2]

[0102] Example 2 was manufactured using the same process as Example 1 described above. However, O₂ plasma treatment (80W, 40 seconds) was additionally performed on the nerve probe (1000) according to Example 2.

[0103]

[0104] [Comparative Example 1]

[0105] Comparative Example 1 has a gold (Au) electrode portion (400) produced by an electroless method compared to Example 1 described above. Here, the thickness of the gold electrode portion (400) is 4 μm, and its upper surface is embedded inside the wiring opening pattern (OP).

[0106]

[0107] [Test Example 1]

[0108] Figure 7 is a scanning electron microscope image showing a neural probe according to an example and a comparative example.

[0109] Referring further to FIG. 7, when the neural probe (1000) according to Example 1 was photographed using a scanning electron microscope, the distinctive protruding tin electrode part (400) structure was clearly visible to the naked eye.

[0110] In addition, in the case of Comparative Example 1, the gold electrode portion (400) of the structure embedded below the insulating layer (300) was clearly visible to the naked eye.

[0111]

[0112] [Test Example 2]

[0113] Figure 8 is a graph showing the results of X-ray photoelectron spectroscopy analysis of a neural probe according to an embodiment.

[0114] Referring further to FIG. 8, the results of X-ray photoelectron spectroscopy analysis for Example 1 and Example 2, respectively, show that Sn in both examples 4+ The presence of is confirmed, which means that the surface of the electrode part (400) has been oxidized to tin dioxide.

[0115] In addition, examining the XPS analysis results in both embodiments, it was confirmed that not only the tin / oxygen peaks but also the entire measurement result was virtually identical.

[0116] In this regard, it was confirmed that the surface of the electroplated tin is oxidized to tin dioxide simply by exposing it to room temperature / air as in Example 1.

[0117] Therefore, the aforementioned test results suggest that no separate process is required to form the tin dioxide surface and that manufacturing is easy. Furthermore, the aforementioned test results suggest that the finished product exhibits excellent durability and corrosion resistance, such as the fact that no further oxidation occurs even when the finished product is exposed to a significant oxidizing atmosphere.

[0118]

[0119] [Test Example 3]

[0120] Figure 9 is a graph showing the results of electrochemical impedance spectroscopic analysis of a neural probe according to an example.

[0121] Referring further to FIG. 9, electrochemical impedance spectroscopic analysis (EIS) was performed on the neural probes (1000) according to Example 1 and Example 2, respectively.

[0122] As a result, it was confirmed that there was no significant change in the impedance in both embodiments, regardless of whether a significant oxidizing atmosphere, such as oxygen plasma, was present. In this regard, it was confirmed that complete oxidation proceeds on the surface of the electrode portion (400) even without a separate oxidation treatment, as in the result of Test Example 2 described above.

[0123]

[0124] [Test Example 4]

[0125] Figure 10 is a graph showing the results of the biocompatibility evaluation of a neural probe according to an example.

[0126] Referring further to FIG. 9, an MTT analysis using HepG2 cells was performed on the electrode portion (400) of Example 1.

[0127] More specifically, a tin dioxide layer (metal oxide part (420)) extract solution having concentrations of 12.5%, 25%, 50%, 75%, and 100% (v / v) was introduced into a number of media. Next, HepG2 cells of the same amount and concentration were cultured in each of the media. Here, the culture conditions of the test subjects were set to 37°C, a 5% CO₂ incubator, and 72 hours.

[0128] As a result, even when the concentration of the tin dioxide layer (metal oxide part (420)) increased rapidly, no cytotoxic reaction was observed. In this regard, the surface of the tin dioxide layer of the electrode part (400) of Example 1 was confirmed to be harmless to the human body.

[0129]

[0130] [Test Example 5]

[0131] Figure 11 is a graph showing the impedance measured in the neural probes according to the example and comparative example.

[0132] Referring further to FIG. 11, Example 1 recorded a significantly higher average impedance compared to Comparative Example 1. In this regard, it was confirmed that the tin electrode is significantly more advantageous than the gold electrode for voltage transmission and various signal transmission.

[0133]

[0134] [Test Example 6]

[0135] Figure 12 is a graph showing the results of biosignal measurement of a neural probe according to an example and a comparative example.

[0136] Referring further to FIG. 12, neural probes (1000) according to Example 1 and Comparative Example 1, respectively, were inserted into the brain (hippocampus) of a living mouse. Here, the number of electrodes inserted into the mouse brain from each neural probe (1000) was set to 4. In addition, the 4 electrodes from each neural probe (1000) measured signals simultaneously.

[0137] As a result of the measurement, it was confirmed that the tin electrode of Example 1 could simultaneously measure various signals at various locations compared to the gold electrode of Comparative Example 1.

[0138]

[0139] FIG. 13 is a cross-sectional view showing a neural probe according to another embodiment of the present invention.

[0140] Referring further to FIG. 13, a neural probe (2000) and a method for manufacturing the same according to another embodiment of the present invention may include an electrode cover layer (500) and an electrode cover step compared to the previously described embodiment (1000).

[0141] More specifically, the electrode cover step may be additionally performed after the aforementioned electrode forming step (S400). Accordingly, the electrode cover layer (500) is additionally formed on the upper surface of the electrode portion (400).

[0142] Nickel (Ni), copper (Cu), gold (Au), platinum (Pt), and various other metal materials may be selected for the electrode cover layer (500). Additionally, PEDOT:PSS and various other conductive polymer materials may be selected for the electrode cover layer (500).

[0143] Additionally, the electrode cover layer (500) can be formed through deposition, coating, plating, and various other methods.

[0144] Here, the metal oxide portion (420) can be freely applied or not applied to the electrode portion (400).

[0145]

[0146] [Example 3]

[0147] The neural probe (2000) according to Example 3 further comprises an electrode cover layer (500) made of platinum black compared to the aforementioned Example 1. The platinum black electrode cover layer (500) was manufactured through electroplating. The average thickness of the electrode cover layer (500) was set to 5 μm.

[0148]

[0149] [Example 4]

[0150] The neural probe (2000) according to Example 4 further comprises an electrode cover layer (500) made of PEDOT:PSS compared to Example 1 described above. The PEDOT:PSS electrode cover layer (500) was electrochemically deposited.

[0151]

[0152] [Test Example 7]

[0153] FIG. 14 is a scanning electron microscope image showing a neural probe according to another embodiment.

[0154] Referring further to FIG. 14, the neural probes (2000) according to Examples 3 and 4 were photographed using a scanning electron microscope. As a result of the imaging, two types of electrode cover layers (500) to which platinum black and PEDOT:PSS were applied, respectively, were clearly visible to the naked eye.

[0155]

[0156] [Test Example 8]

[0157] Figure 15 is a graph showing the results of cyclic voltammetry analysis of neural probes according to annotated embodiments.

[0158] Referring further to FIG. 15, cyclic voltammetry tests were performed on the neural probes (1000, 2000) according to Examples 1, 3 and 4.

[0159] As a result of the test, compared to Example 1, to which only tin was applied, a wider current-voltage curve area was confirmed in Examples 3 and 4, to which platinum black and PEDOT:PSS, etc. were additionally applied, respectively. In addition, in the case of Example 4, a significantly larger current-voltage curve area was confirmed than in Example 3.

[0160] In this regard, it was confirmed that the electrical performance of the neural probe, such as charge storage capacity, is further enhanced by the addition of the electrode cover layer (500).

[0161] As described above, the main technical concept of the present invention relates to a neural probe and a method for manufacturing the same. Furthermore, the embodiments described above with reference to the drawings are merely partial embodiments, and the scope of the present invention should be determined based on the patent claims. In addition, the scope of the present invention extends to various equivalent embodiments that can be derived.

Claims

1. Substrate section; A wiring portion formed on the upper surface of the above substrate portion; An insulating layer covering the upper surface of the substrate portion and the upper surface of the wiring portion; A wiring opening pattern formed in the insulating layer to expose a portion of the wiring portion to the outside; and A neural probe characterized by including an electrode portion, at least a portion of which is formed on the inner side of the above-mentioned wiring opening pattern.

2. In Paragraph 1, The above electrode part is, A nerve probe characterized by protruding higher than the upper surface of the insulating layer.

3. In Paragraph 2, The above electrode part is, A neural probe characterized by including an annotation.

4. In Paragraph 3, The above electrode part is, A neural probe characterized by including a tin dioxide layer formed on the upper surface.

5. In Paragraph 3, A neural probe characterized by including an electrode cover layer that covers the outer surface of the electrode portion and comprises at least one type selected from the group including gold, platinum, and PEDOT:PSS.

6. In Paragraph 2, The above insulating layer is, Side insulation portions surrounding the circumferential direction of the above wiring portion; A vertical extension portion extending coaxially upward from the above-mentioned side insulation portion; and A neural probe characterized by including a horizontal extension that extends horizontally from the vertical extension and covers the upper surface edge side of the wiring portion.

7. In Paragraph 6, The above insulating layer is, A nerve probe characterized by including a cured product of PSR ink.

8. A wiring formation step in which a wiring portion is formed on the upper surface of the substrate portion; An insulation treatment step in which an insulating layer is formed to cover the upper surface of the substrate portion and the upper surface of the wiring portion; A wiring exposure step in which a portion of the insulating layer is selectively removed to form a wiring opening pattern so that a portion of the wiring portion is exposed to the outside; and A method for manufacturing a neural probe characterized by including an electrode forming step in which an electrode portion is formed in the above-mentioned wiring opening pattern.

9. In Paragraph 8, The above electrode formation step is, A method for manufacturing a nerve probe characterized by forming the electrode portion protruding higher than the upper surface of the insulating layer by electroplating of tin.

10. In Paragraph 9, The above electrode formation step is, A method for manufacturing a neural probe characterized by the upper surface of the electrode portion being oxidized to form a tin dioxide layer after the above-mentioned electroplating.

11. In Paragraph 9, A method for manufacturing a neural probe, characterized by including an electrode cover step in which an electrode cover layer is formed by providing at least one type selected from the group comprising gold, platinum, and PEDOT:PSS on the outer surface of the electrode portion.

12. In Paragraph 8, The above insulation treatment step is, A neural probe characterized by the formation of an insulating layer by applying PSR ink to the upper surface of the substrate portion and the upper surface of the wiring portion and then curing it.

13. In Paragraph 12, The above wiring exposure step is, A neural probe characterized in that the above wiring opening pattern is formed to be located on the inner side of the upper surface of the wiring portion.

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