Thermal solutions for high frequency and high power transmission
The introduction of a thermal break with a fluidic channel and dielectric plug in high frequency plasma systems addresses heat-related damage, ensuring reliable operation by isolating and cooling electrical components.
WO2026128048A1PCT designated stage Publication Date: 2026-06-18APPLIED MATERIALS INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2025-09-23
- Publication Date
- 2026-06-18
AI Technical Summary
⚠Technical Problem
High frequency plasma systems suffer from heat-related damage to electrical components, particularly the high frequency plasma source and cables, due to thermal energy transfer from the plasma or heated chamber, which can cause melting of connections.
⚗Method used
A thermal break is introduced between the solid state high frequency power source and the applicator, incorporating a housing with a fluidic channel and dielectric plug to actively dissipate thermal energy, while maintaining electrical coupling and impedance matching.
🎯Benefits of technology
The thermal break effectively isolates the electrical components from thermal stress, preventing damage and ensuring efficient power transfer to the plasma, even in high power systems.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure US2025047522_18062026_PF_FP_ABST
Abstract
Embodiments described herein relate to an apparatus that includes a housing, and a core within the housing. In an embodiment, a channel is set into an outer surface of the core, and a first hole passes through the core. In an embodiment, the apparatus further includes an inlet through the housing, where the inlet is fluidly coupled to the channel, and an outlet through the housing, where the outlet is fluidly coupled to the channel. In an embodiment, the apparatus further includes a dielectric plug within the first hole, where a second hole passes through the dielectric plug.
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