Slurry, multi-component slurry, polishing method, method for producing component, and method for producing semiconductor component

Abstract

Provided is a slurry comprising: abrasive grains containing cerium-based particles; and an organic amine compound. Also provided is a multi-component slurry in which the constituents of the aforementioned slurry are stored separately in at least a first liquid and a second liquid, the first liquid containing the abrasive grains and the second liquid containing the organic amine compound. Also provided is a polishing method comprising a step for polishing a member to be polished using the slurry. Further provided is a method for producing a component, comprising a step for obtaining a component using a member to be polished that has been polished according to the polishing method. Further provided is a method for producing a semiconductor component, comprising a step for obtaining a semiconductor component using the member to be polished that has been polished according to the polishing method.

Claims

1. A slurry containing abrasive grains containing cerium-based particles and an organic amine compound.

2. The slurry according to claim 1, wherein the organic amine compound comprises at least one selected from the group consisting of primary amine compounds and secondary amine compounds.

3. The slurry according to claim 1, wherein the organic amine compound comprises an amino alcohol.

4. The slurry according to claim 3, wherein the amino alcohol comprises propanolamine.

5. The slurry according to claim 3, wherein the amino alcohol comprises aminopropanediol.

6. The slurry according to claim 1, wherein the organic amine compound includes an alkyl monoamine that does not have a hydroxyl group.

7. The slurry according to claim 1, wherein the organic amine compound includes an alkyldiamine that does not have a hydroxyl group.

8. The slurry according to claim 1, wherein the organic amine compound comprises a saturated heterocyclic amine.

9. The slurry according to claim 1, wherein the pH is 7.0 to 12.

5.

10. A multi-liquid slurry in which the components of the slurry according to any one of claims 1 to 9 are stored separately in at least a first liquid and a second liquid, the first liquid containing the abrasive grains and the second liquid containing the organic amine compound.

11. A polishing method comprising the step of polishing a member to be polished using a slurry described in any one of claims 1 to 9.

12. The polishing method according to claim 11, wherein the member to be polished contains polysilicon.

13. A method for manufacturing a part, comprising the step of obtaining a part using a member to be polished by the polishing method described in claim 11.

14. A method for manufacturing a semiconductor component, comprising the step of obtaining a semiconductor component using a member to be polished by the polishing method described in claim 11.

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