Thermosetting resin composition

Abstract

The present invention relates to a thermosetting resin composition and, more particularly, to a thermosetting resin composition including an acrylic resin, a thermal initiator, a thermosetting agent, and a solvent, wherein the thermosetting resin composition has the content of the thermosetting agent with respect to the content of the acrylic resin adjusted to be within a specific range and, at the same time, comprises a specific acrylic resin and a thermosetting agent, and thus has no surface stains, exhibits high adhesion and high transmittance characteristics, has excellent storage stability and flatness, and at the same time, is capable of forming an ultra-thin overcoat layer at the level of angstroms (Å).

Description

Thermosetting resin composition

[0001] The present invention relates to a thermosetting resin composition.

[0002]

[0003] As information technology (IT) advances, demands for the display field are being presented in various forms. For example, various flat panel display devices are being researched, such as Liquid Crystal Display (LCD) devices, Plasma Display Panel (PDP) devices, Electro-Luminescent Display (ELED) devices, and Organic Light-Emitting Diode (OLED) display devices, which feature thinness, lightness, and low power consumption.

[0004] Such flat panel display devices are composed of various components such as semiconductor elements, color filters, ITO, and metal electrode layers, and generally have a cured film, such as an overcoat layer, to protect them.

[0005] The overcoat film must withstand various treatments, such as organic solvents, acids, and alkaline solutions, during the manufacturing process of flat panel display devices. At the same time, various characteristics are required, including excellent adhesion to the substrate or underlying layer, superior smoothness and transparency, and the absence of any potential for deterioration such as discoloration, yellowing, or whitening over the long term.

[0006] Meanwhile, Korean Registered Patent Publication No. 10-1052766, etc., discloses a technology that can provide a protective film having excellent mechanical properties and heat resistance and not yellowing at high temperatures by using a thermosetting resin composition containing an acrylic resin component containing carboxyl groups or epoxy groups.

[0007] However, the above-mentioned conventional thermosetting resin composition requires a high temperature of 200°C or higher and a significant curing time during firing, and typically forms a cured film with a coating film thickness of 1 to 2 μm, which is unsuitable for use as an overcoat film of ultra-thin thickness of less than 1 μm, particularly at the level of tens or hundreds of angstroms (Å).

[0008]

[0009] The present invention aims to provide a thermosetting resin composition that exhibits high adhesion and high transmittance characteristics, has excellent storage stability, and is capable of forming an ultra-thin overcoat layer at the angstrom (Å) level.

[0010]

[0011] The present invention provides a thermosetting resin composition comprising an acrylic resin, a thermal initiator, a thermosetting agent, and a solvent, wherein the thermosetting agent is included in an amount of 1 to 30 weight% relative to the content of the acrylic resin, the acrylic resin comprises one or more selected from hydroxyl groups and glycidyl groups, and the thermosetting agent comprises one or more selected from amine-based curing agents and phenol-based curing agents.

[0012] The above acrylic resin may further include an alkyl group having 1 to 10 carbon atoms or a phenyl group.

[0013] The above solvent may be included in an amount of 90% by weight or more based on the total weight of the thermosetting resin composition.

[0014] The above thermosetting resin composition may be for forming an ultrathin film with a thickness of 70 to 130 Å.

[0015] The above thermal initiator may include one or more selected from the following chemical formulas 2 to 4.

[0016] [Chemical Formula 2]

[0017]

[0018] [Chemical Formula 3]

[0019]

[0020] [Chemical Formula 4]

[0021]

[0022] The above amine-based curing agent may be a compound derived from a glycoluryl structure.

[0023] The compound released from the above glycoluryl structure may be represented by the following chemical formula 5.

[0024] [Chemical Formula 5]

[0025]

[0026] In the above chemical formula 5, R 1 , R 2 , R 3 and R 4 Each is independently hydrogen, a C1 to C4 alkyl group, a C1 to C4 alkoxy group, a C2 to C4 alkylalkoxy group, or a thiol group, and R 5 and R 6 Each is independently hydrogen, an alkyl group having 1 to 4 carbon atoms, or an aryl group having 4 to 6 carbon atoms.

[0027] The above thermosetting resin composition can be fired at a temperature of 180°C or lower.

[0028] The present invention provides an overcoat film formed from the thermosetting resin composition.

[0029] The above overcoat film may have a film thickness of 70 to 130 Å.

[0030]

[0031] By using the thermosetting resin composition according to the present invention, an overcoat film (protective film) can be formed by firing within minutes at a temperature of 180°C or lower, and in particular, the overcoat film can be formed as an ultra-thin film at the angstrom level.

[0032] In addition, the thermosetting resin composition of the present invention has excellent stability even when stored at a high temperature of approximately 40°C and can form an overcoat film having high adhesion and high transmittance characteristics. Furthermore, the thermosetting resin composition of the present invention can form an overcoat film with excellent flatness and without stains such as discoloration, yellowing, or whitening on the surface.

[0033]

[0034] Figure 1 is a figure illustrating a method for measuring the number of peels of a pattern in an adhesion measurement experiment.

[0035] Figure 2 is a figure showing the adhesion measurement results for the embodiments.

[0036] Figure 3 is a figure showing the adhesion measurement results for comparative examples.

[0037]

[0038] The present invention relates to a thermosetting resin composition comprising an acrylic resin, a thermal initiator, a thermosetting agent, and a solvent, wherein by using a specific acrylic resin and a thermosetting agent while controlling the content of the thermosetting agent to a specific range, the composition exhibits characteristics of high adhesion and high transmittance without surface stains, excellent storage stability and flatness, and is capable of forming an ultra-thin overcoat layer at the angstrom (Å) level.

[0039]

[0040] The present invention will be described in more detail below. However, the terms used in this specification are for describing embodiments and are not intended to limit the invention.

[0041]

[0042] <Thermosetting resin composition>

[0043] The thermosetting resin composition according to the present invention comprises an acrylic resin, a thermal initiator, a thermosetting agent, and a solvent, and may further include additives as needed.

[0044]

[0045] (A) Acrylic resin

[0046] The above acrylic resin may be in the form of copolymerization of one or more monomers. The above acrylic resin may include one or more functional groups selected from glycidyl groups and hydroxyl groups in order to be desirable in terms of adhesion, and more preferably may include both glycidyl groups and hydroxyl groups.

[0047] In addition, the acrylic resin may further include functional groups, and said functional groups may be alkyl groups having 1 to 10 carbon atoms or phenyl groups. This allows for better hardness of the thin film, thereby ensuring excellent storage stability even when formed as a thin overcoat layer of an ultrathin film.

[0048] For example, the above acrylic resin may include a compound represented by the following chemical formula 1, but is not limited thereto.

[0049] [Chemical Formula 1]

[0050]

[0051] In the above chemical formula 1, l, m, and n are each independently integers from 1 to 100.

[0052] In the above chemical formula 1, l is particularly preferably 20 to 90, and more preferably 50 to 85.

[0053] In the above chemical formula 1, m is particularly preferably 1 to 50, and more preferably 1 to 30.

[0054] In the above chemical formula 1, n is particularly preferably 1 to 30, and more preferably 1 to 20.

[0055]

[0056] The above acrylic resin may have the form of a copolymer of one or more compounds having unsaturated bonds. That is, it may include an ethylenically unsaturated monomer having a carboxyl group.

[0057] Specific examples of the above-mentioned ethylenically unsaturated monomer having a carboxyl group include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid; anhydrides of the above-mentioned dicarboxylic acids; and mono(meth)acrylates of polymers having carboxyl and hydroxyl groups at both ends, such as ω-carboxypolycaprolactone mono(meth)acrylate, and acrylic acid and methacrylic acid are preferred.

[0058] Methods for imparting hydroxyl groups to acrylic resin include a method of preparing by copolymerizing an ethylene unsaturated monomer having a carboxyl group and an ethylene unsaturated monomer having a hydroxyl group, a method of preparing by further reacting a compound having a glycidyl group with a copolymer of an ethylene unsaturated monomer having a carboxyl group, and a method of preparing by further reacting a compound having a glycidyl group with a copolymer of an ethylene unsaturated monomer having a carboxyl group and an ethylene unsaturated monomer having a hydroxyl group.

[0059] Specific examples of compounds having the above-mentioned glycidyl group include butylglycidyl ether, glycidylpropyl ether, glycidylphenyl ether, 2-ethylhexylglycidyl ether, glycidyl butylate, glycidylmethyl ether, ethylglycidyl ether, glycidyl isopropyl ether, t-butylglycidyl ether, benzylglycidyl ether, glycidyl 4-t-butylbenzoate, glycidyl stearate, arylglycidyl ether, glycidyl methacrylic acid ester, etc., and butylglycidyl ether, arylglycidyl ether, and glycidyl methacrylic acid ester may be cited, and two or more of these may be used in combination.

[0060] The copolymerizable unsaturated monomers for the manufacture of the above acrylic resin are exemplified below, but are not necessarily limited thereto.

[0061] Specific examples of polymerizable monomers having unsaturated bonds capable of copolymerization include aromatic vinyl compounds such as styrene, vinyltoluene, α-methylstyrene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzylmethyl ether, m-vinylbenzylmethyl ether, p-vinylbenzylmethyl ether, o-vinylbenzylglycidyl ether, m-vinylbenzylglycidyl ether, and p-vinylbenzylglycidyl ether;

[0062] N-substituted maleimide compounds such as N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide, No-hydroxyphenylmaleimide, Nm-hydroxyphenylmaleimide, Np-hydroxyphenylmaleimide, No-methylphenylmaleimide, Nm-methylphenylmaleimide, Np-methylphenylmaleimide, No-methoxyphenylmaleimide, Nm-methoxyphenylmaleimide, Np-methoxyphenylmaleimide, etc.;

[0063] Alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, etc.; cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.0 2,6 ] Alicyclic (meth)acrylates such as decane-8-yl (meth)acrylate, 2-dicyclofentanyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, etc.;

[0064] Hydroxyethyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, and N-hydroxyethylacrylamide;

[0065] Aryl (meth)acrylates such as phenyl (meth)acrylate and benzyl (meth)acrylate;

[0066] There are unsaturated oxetane compounds such as 3-(methacryloyloxymethyl)oxetane, 3-(methacryloyloxymethyl)-3-ethyloxetane, 3-(methacryloyloxymethyl)-2-trifluoromethyloxetane, 3-(methacryloyloxymethyl)-2-phenyloxetane, 2-(methacryloyloxymethyl)oxetane, and 2-(methacryloyloxymethyl)-4-trifluoromethyloxetane.

[0067] The monomers exemplified above can each be used individually or in combination of two or more types.

[0068] The unsaturated double bonds included in the above (co)polymer can serve to impart photo / thermosetting properties to the above acrylic resin.

[0069] In the present invention, the acrylic resin preferably has a weight-average molecular weight equivalent to polystyrene in the range of 20,000 to 30,000, and more preferably in the range of 26,000 to 29,000. In addition, the molecular weight distribution [weight-average molecular weight (Mw) / number-average molecular weight (Mn)] of the acrylic resin (A) is preferably 1.0 to 6.0, and more preferably 1.3 to 4.0. If the weight-average molecular weight and molecular weight distribution of the acrylic resin are within the above ranges, the adhesion is excellent.

[0070] In addition, the acrylic resin is preferably included in an amount of 70 to 95 weight% based on the total weight of the solids in the thermosetting resin composition of the present invention, and is more preferably included in an amount of 80 to 95 weight%.

[0071] If the acrylic resin in the thermosetting resin composition of the present invention is included in an amount exceeding the above range, an ultrathin film is not formed, and if it is included in an amount below the above range, the adhesion is poor. Therefore, in the present invention, it is preferable to use the acrylic resin by adjusting it to the above-mentioned content range.

[0072]

[0073] (B) De-initiator

[0074] The thermosetting resin composition of the present invention contains a thermal initiator, so that sufficient curing is possible even by a low-temperature firing process of 180°C or lower, and the overcoat film (protective film) formed using this can exhibit excellent adhesion and transmittance.

[0075] The above thermal initiator is an initiator that decomposes into p-toluenesulfonic acid and cyclohexanol at 170°C, and the sulfonic acid generated by heat causes a curing reaction between the functional groups of the acrylic resin and the thermal curing agent. In addition, since it does not affect the transmittance of the overcoat composition while acting as a thermal initiator, it is possible to form an overcoat cured film having high transmittance.

[0076] For example, the above-mentioned thermal initiator may include a compound represented by any one of the following chemical formulas 2 to 4, either alone or in combination, but is not limited thereto.

[0077] [Chemical Formula 2]

[0078]

[0079] [Chemical Formula 3]

[0080]

[0081] [Chemical Formula 4]

[0082]

[0083]

[0084] It is preferable that the content of the above-mentioned thermal initiator be 0.0001 to 10% by weight relative to the total weight of the solids in the thermosetting resin composition, and more preferable that it be 0.001 to 5% by weight. When the above-mentioned thermal initiator is within the above range, solution uniformity with respect to the solvent is ensured, solubility is improved, and the thermosetting composition is made highly sensitive, allowing the overcoat film to be formed to have excellent flatness.

[0085]

[0086] (C) Thermosetting agent

[0087] One or more curing agents selected from amine-based curing agents and phenol-based curing agents may be used as the curing agent included in the thermosetting resin composition of the present invention.

[0088] In the present invention, an amine-based curing agent is preferred in terms of providing productivity and high adhesion characteristics.

[0089] The above amine-based curing agent may include a compound derived from a glycoluryl structure. The compound derived from a glycoluryl structure may be a compound represented by the following chemical formula 5.

[0090] [Chemical Formula 5]

[0091]

[0092] In the above chemical formula 5, R 1 , R 2 , R 3 and R 4 Each is independently hydrogen, a C1 to C4 alkyl group, a C1 to C4 alkoxy group, a C2 to C4 alkylalkoxy group, or a thiol group, and R 5 and R 6 Each is independently hydrogen, an alkyl group having 1 to 4 carbon atoms, or an aryl group having 4 to 6 carbon atoms.

[0093] For example, the above amine-based curing agent may use a compound represented by the following chemical formula 6 or 7, but is not limited thereto.

[0094] [Chemical Formula 6]

[0095]

[0096] [Chemical Formula 7]

[0097]

[0098] The above-mentioned thermosetting agent can improve stability by causing curing with the hydroxyl groups of the acrylic resin during the post-baking process.

[0099] In addition, since the thermosetting agent is placed between the spaces of the acrylic resin and then cures, the space between the acrylic resins can be maintained consistently, and since N reacts with acid, the occurrence of stains caused by acid can be suppressed, thereby improving transmittance.

[0100] The thermosetting agent included in the thermosetting resin composition of the present invention is not particularly limited in content within the range in which it can perform its function, but may be included in an amount of 1 to 30 weight% with respect to 100 weight% of acrylic resin, and preferably in an amount of 1 to 10 weight%. When the content of the thermosetting agent is included within the above content range, there is an advantage that the effect of improving transmittance is maximized and a cured film having excellent adhesion is formed.

[0101]

[0102] (D) Solvent

[0103] The above-mentioned solvent is capable of dissolving or dispersing the composition mentioned above, and various organic solvents may be used as long as they are known as solvents for thermosetting resin compositions in the art, without particular limitation.

[0104] Preferably, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, etc. may be used.

[0105] The above solvent may be included in an amount of 90% by weight or more with respect to the total weight of the thermosetting resin composition of the present invention, preferably 95% by weight or more, and more preferably 98% by weight or more.

[0106] If the content of the solvent in the thermosetting resin composition of the present invention is less than 90 weight%, the viscosity of the composition increases, workability decreases, it is difficult to form an ultra-thin film at the angstrom level, and problems may arise in that the thermosetting resin composition is not uniformly applied.

[0107]

[0108] (E) Additives

[0109] In addition to the aforementioned components, the thermosetting resin composition of the present invention may include additives known in the art to the extent that they do not impede the effects of the invention.

[0110] For example, surfactants may be used to improve wettability, applicability, and leveling properties. The above surfactants include silicone-based and fluorine-based surfactants, and in the present invention, commercially available fluorine-based products as described below may be used.

[0111] Examples include Sumitomo Moss Reem Co., Ltd., manufactured with product names Florinate FC430 and Florinate FC431; Dainippon Ink & Chemical Co., Ltd., manufactured with product names Megapac F142D, Megapac F171, Megapac F172, Megapac F173, Megapac F177, Megapac, F183, Megapac R30, Megapac R08, Megapac R09, Megapac BL20, Megapac 475, Megapac 489, Megapac 544 and Megapac F443; DIC Co., Ltd., manufactured with product names F-430, F 510, F-554, F-563, R-40, R-41, R-43, etc.

[0112] The above surfactant may be included in an amount of 0.001 to 5.0 weight% based on the total weight of the thermosetting resin solid composition of the present invention, and preferably in an amount of 0.01 to 5 weight%.

[0113]

[0114] The composition solution prepared as described above can be used after being filtered using a filter with a pore size of 0.1 to 5 μm.

[0115] The present invention can obtain a desired overcoat film (protective film) by applying the above-described thermosetting resin composition to a substrate and treating it on a hot plate at a temperature of 180°C or lower, preferably 100°C to 180°C, for several minutes (approximately within 3 minutes).

[0116]

[0117] The present invention will be explained in more detail below through examples.

[0118] However, the following examples are intended to further illustrate the invention and do not limit the scope of the invention. The following examples may be appropriately modified or changed by those skilled in the art within the scope of the invention.

[0119] Additionally, "%" and "parts" indicating content below are based on weight unless otherwise specified.

[0120]

[0121] Synthesis Example 1: Preparation of acrylic resin (A-1)

[0122] A nitrogen atmosphere was established by flowing nitrogen at a rate of 0.02 L / min into a 1 L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, and 250 g of propylene glycol monomethyl ether acetate was introduced and the temperature was raised to 100°C. Subsequently, a solution containing 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) added to a mixture comprising 60.07 g (0.60 mol) of methyl methacrylate, 39.04 g (0.30 mol) of hydroxyethyl methacrylate, 14.21 g (0.10 mol) of glycidyl methacrylate, and 150 g of propylene glycol monomethyl ether acetate was added dropwise from the dropping lot to the flask over a period of 2 hours. Stirring was continued at 100°C for 5 more hours to obtain acrylic resin A-1 with a solid content of 30%. The weight-average molecular weight of polystyrene measured by GPC was 23,000, and the molecular weight distribution (Mw / Mn) was 2.35.

[0123]

[0124] Synthesis Example 2: Preparation of acrylic resin (A-2)

[0125] A nitrogen atmosphere was established by flowing nitrogen at a rate of 0.02 L / min into a 1 L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, and 250 g of propylene glycol monomethyl ether acetate was introduced and the temperature was raised to 100°C. Subsequently, a solution containing 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) added to a mixture comprising 190.62 g (0.80 mol) of biphenyl methacrylate, 14.41 g (0.20 mol) of acrylic acid, and 150 g of propylene glycol monomethyl ether acetate was added dropwise from the dropping lot to the flask over a period of 2 hours. Stirring was continued at 100°C for 5 more hours to obtain acrylic resin A-2 with a solid content of 32%. The weight-average molecular weight of polystyrene measured by GPC was 23,500, and the molecular weight distribution (Mw / Mn) was 2.31.

[0126]

[0127] Examples and Comparative Examples: Preparation of Thermosetting Resin Compositions

[0128] A thermosetting resin composition was prepared by mixing the components and compositions listed in Tables 1 and 2 below, and then filtering through a millipore filter with a pore size of 0.1 μm (Unit: weight%).

[0129]

[0130] Classification Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 (A-1) Acrylic resin 1.5 1.5 1.5 1.5 1.5 1.5 (B) Thermal initiator 0.00 5 0.05 0.00 5 0.00 5 0.05 0.00 5 (C-1) Thermal curing agent 0.03 0.03 0.1 ---(C-2) Thermal curing agent --- 0.03 0.03 0.1 (D) Solvent remaining amount remaining amount remaining amount remaining amount remaining amount remaining amount (E) Additive 0.05 0.05 0.05 0.05 0.05 0.05 5

[0131]

[0132] Classification Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 (A-1) Acrylic Resin 1.5 1.5 - 1.5 1.5 (A-2) Acrylic Resin -- 1.5 -- (B) Thermal Initiator 0.05 0.05 0.05 0.05 0.05 (C-1) Thermosetting Agent - 1.0 0.03 -- (C-3) Thermosetting Agent -- 0.03 -- (C-4) Thermosetting Agent ---- 0.03 (D) Solvent Remaining Remaining Remaining Remaining Remaining (E) Additive 0.05 0.05 0.05 0.05 0.05

[0133]

[0134] (A-1) Acrylic resin: Resin prepared in Synthesis Example 1

[0135] (A-2) Acrylic resin: Resin prepared in Synthesis Example 2

[0136] (B) Thermal initiator: Structure of Chemical Formula 2

[0137] (C-1) Thermosetting agent: Structure of Chemical Formula 7

[0138] (C-2) Thermosetting agent: Structure of Chemical Formula 6

[0139] (C-3) Thermosetting agent: MHHPA (Hexahydro-4-methylphthalic anhydride, acid anhydride-based curing agent)

[0140] (C-4) Thermosetting agent: HHPA (Hexahydrophthalic anhydride, acid anhydride-based curing agent)

[0141] (D) Solvent: Propylene glycol methyl ether acetate

[0142] (E) Additives: Surfactant, F-554 (DIC), 10% diluted solution

[0143]

[0144] <Manufacturing of Coating Film (Overcoat)>

[0145] Using the thermosetting resin compositions of Examples 1 to 6 and Comparative Examples 1 to 5 above, 1 to 2 ml of the composition was applied onto a silicon wafer to form a coating film. During spin coating, the RPM was set to 1800, and firing was completed on a hot plate under conditions of 180°C and 180 seconds for each.

[0146]

[0147] Experimental Example: Measurement of Physical Properties of Coating Film

[0148] Film thickness, flatness, transmittance, coating surface stains, adhesion, and storage stability were evaluated for each coating film prepared using the thermosetting resin compositions of Examples 1 to 6 and Comparative Examples 1 to 5, and the results are shown in Tables 3 and 4 below.

[0149]

[0150] Film thickness evaluation

[0151] Three points were measured based on a 6-inch silicon wafer, the average was calculated, and the value was used as the film thickness. A VM-1210 (DAINIPPON) film thickness gauge was used.

[0152]

[0153] Flatness evaluation

[0154] Based on a 6-inch silicon wafer, 25 points of film thickness were measured to determine the film thickness deviation relative to the average value, and ○ was indicated if the average deviation was within 10% of the film thickness, and × was indicated if it was 10% or more.

[0155]

[0156] Transmittance evaluation

[0157] After forming a coating film of each of the above examples and comparative examples on a glass substrate under the same conditions as Experimental Example 1, the transmittance for wavelengths from 400 nm to 800 nm was measured using a transmittance measuring instrument (Spectrophotometer, Beckman DU800).

[0158]

[0159] stains on the coated surface

[0160] After firing each of the compositions of the above examples and comparative examples onto a silicon wafer, surface stains were observed using the naked eye and an optical microscope. ○ was marked if no stains were observed, and × was marked if they were observed.

[0161]

[0162] Adhesion measurement

[0163] Each of the compositions of the above examples and comparative examples was fired onto a silicon wafer, and then a color PR was coated thereon to a thickness of 5500 Å. After exposure using a dot pattern mask, the process was carried out to develop to form a total of 10,000 patterns. The size of each dot pattern was 1 μm in width and height, and the number of peeled patterns was indicated as ○ for 0 to 5 and × for 6 or more.

[0164] Specifically, using an electron microscope, the number of peeled patterns in a region of 200 µm in width and height was measured as exemplified in FIG. 1. Specifically, the size of the dot pattern was 1 µm in width and height, and the spacing was also 1 µm. The number of patterns was 100 in width and height, totaling 10,000, and the total size was 200 µm in width and height. The results are shown in Tables 3 and 4 and FIGS. 2 and 3 below.

[0165]

[0166] Conservation stability evaluation

[0167] After storing each of the above examples and comparative examples at 40°C, viscosity, adhesion, and contact angle were measured every week, and ○ was indicated if there was no change in characteristics for 4 weeks or more, and × was indicated if it was less than 4 weeks.

[0168]

[0169] Classification Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Film Thickness (Å) 98 9 2 10 2 99 1 12 10 8 Flatness OOOOOO Transmittance (%) 99.8 99.8 99.7 99.6 99.0 99.1 Coating Surface Stain OOOOOO Adhesion OOOOOO Preservation Safety OOOOOO

[0170]

[0171] Classification Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Film Thickness (Å) 1 10 1 3 5 10 6 1 1 2 1 2 5 Flatness OOOOO Transmittance (%) 98.8 99.1 97.6 97.0 97.3 Coating Surface Stain OXXOO Adhesion XXXXX Preservation Safety OOOXX

[0172]

[0173] Referring to the results in Tables 3 and 4 above, it was confirmed that using the thermosetting resin compositions of Examples 1 to 6 resulted in excellent properties of high transmittance and high adhesion, as well as flatness and storage safety. In particular, in the case of the examples, it was confirmed that the number of pattern peels was zero, forming an ultrathin film of approximately 100 Å while maintaining high adhesion to the upper color PR.

[0174] On the other hand, as in Comparative Example 1, when the content of the thermosetting agent was 0 wt%, the adhesion characteristics were poor, and in Comparative Example 2, when the content of the thermosetting agent exceeded 30% of the resin content, stains occurred on the coating surface or the flatness characteristics were poor due to aggregation of the residual curing agent, and adhesion was reduced. In addition, when the resin was replaced with A-2 in Comparative Example 3, the surface adhesion characteristics were reduced, and in the case of Comparative Examples 4 and 5, as a result of using an anhydride-based curing agent, poor adhesion and poor characteristics over time were observed.

Claims

1. Includes acrylic resin, a thermal initiator, a thermosetting agent, and a solvent, The above thermosetting agent is included in an amount of 1 to 30 weight percent relative to the content of the acrylic resin, and The above acrylic resin comprises one or more selected from hydroxyl groups and glycidyl groups, and The thermosetting agent comprises one or more selected from amine-based curing agents and phenol-based curing agents, forming a thermosetting resin composition.

2. In Claim 1, The above acrylic resin is a thermosetting resin composition further comprising an alkyl group having 1 to 10 carbon atoms or a phenyl group.

3. In Claim 1, A thermosetting resin composition in which the above solvent is included in an amount of 90% by weight or more based on the total weight of the thermosetting resin composition.

4. In Claim 1, The above thermosetting resin composition is a thermosetting resin composition for forming an ultrathin film having a thickness of 70 to 130 Å.

5. In Claim 1, A thermosetting resin composition comprising one or more selected from the following chemical formulas 2 to 4 as a thermal initiator. [Chemical Formula 2] [Chemical Formula 3] [Chemical Formula 4] 6. In Claim 1, The above amine-based curing agent is a compound derived from a glycoluryl structure, a thermosetting resin composition.

7. In Claim 6, A thermosetting resin composition wherein the compound released from the above glycoluryl structure is represented by the following chemical formula 5: [Chemical Formula 5] In the above chemical formula 5, R 1 , R 2 , R 3 and R 4 Each is independently hydrogen, a C1 to C4 alkyl group, a C1 to C4 alkoxy group, a C2 to C4 alkylalkoxy group, or a thiol group, and R 5 and R 6 Each is independently hydrogen, an alkyl group having 1 to 4 carbon atoms, or an aryl group having 4 to 6 carbon atoms.

8. In Claim 1, A thermosetting resin composition that is fired at a temperature of 180°C or lower.

9. An overcoat film formed from a thermosetting resin composition of any one of claims 1 to 8.

10. In Claim 9, An overcoat film having a film thickness of 70 to 130 Å.

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