Display module and display device

Abstract

The present application relates to a display module and a display device. The display module comprises a display panel and a cover plate arranged on one side of the display panel, wherein the cover plate comprises an ultra-thin glass layer and a cover layer, the ultra-thin glass layer being located on one side of the display panel, and the cover layer at least covering the side of the ultra-thin glass layer away from the display panel. The cover layer contains a silicon-oxygen coupling agent, and a chemical bond is formed between part of the silicon-oxygen coupling agent and the ultra-thin glass layer.

Description

Display module and display device Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] Foldable display devices are a future technological trend, and folding has brought a new direction to the display industry. Currently, organic light-emitting diode (OLED) display devices are receiving more attention because they have unique bending and folding characteristics, which can be used to manufacture foldable display devices in various forms, making them easy to carry and store, and have attracted widespread attention in the market.

[0003] Currently, the outermost cover of foldable display modules is generally made of organic polymer film, which easily makes the surface of foldable display modules feel soft and flimsy, have a strong plastic feel, and have severe creases. Invention Overview

[0004] This application provides a display module and display device that can improve the surface hardness of the display module cover plate, improve the tactile feel and crease phenomenon, and improve the adhesion between the cover layer and the ultra-thin glass layer.

[0005] This application provides a display module, which includes:

[0006] Display panel;

[0007] A cover plate is disposed on one side of the display panel. The cover plate includes an ultra-thin glass layer and a cover layer. The ultra-thin glass layer is located on one side of the display panel, and the cover layer at least covers the side of the ultra-thin glass layer away from the display panel.

[0008] The capping layer contains a silicon-oxygen coupling agent, and a portion of the silicon-oxygen coupling agent forms chemical bonds with the ultrathin glass layer.

[0009] In accordance with the above-mentioned objectives of this application, embodiments of this application also provide a display device, the display device including a display module, the display module comprising:

[0010] Display panel;

[0011] A cover plate is disposed on one side of the display panel. The cover plate includes an ultra-thin glass layer and a cover layer. The ultra-thin glass layer is located on one side of the display panel, and the cover layer at least covers the side of the ultra-thin glass layer away from the display panel.

[0012] The capping layer contains a silicon-oxygen coupling agent, and a portion of the silicon-oxygen coupling agent forms chemical bonds with the ultrathin glass layer. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0015] Figure 1 is a schematic diagram of the structure of a display module provided in one embodiment;

[0016] Figure 2 is a schematic diagram of the first structure of the display module provided in an embodiment of this application;

[0017] Figure 3 is a schematic diagram of the connection interface structure between the ultrathin glass layer and the cover layer provided in the embodiment of this application;

[0018] Figure 4 is a schematic diagram of the first structure of the cover plate provided in the embodiment of this application;

[0019] Figure 5 is a schematic diagram of a second structure of the display module provided in an embodiment of this application;

[0020] Figure 6 is a schematic diagram of a second structure of the cover plate provided in an embodiment of this application;

[0021] Figure 7 is a schematic diagram of a third structure of the display module provided in an embodiment of this application;

[0022] Figure 8 is a schematic diagram of a third structure of the cover plate provided in an embodiment of this application;

[0023] Figure 9 is a schematic diagram of a fourth structure of the display module provided in an embodiment of this application;

[0024] Figure 10 is a schematic diagram of the fourth structure of the cover plate provided in the embodiment of this application;

[0025] Figure 11 is a schematic diagram of the fifth structure of the display module provided in the embodiment of this application;

[0026] Figure 12 is a schematic diagram of the fifth structure of the cover plate provided in the embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Panel; 2. Polarizing film (substrate); 3. First OCA adhesive layer; 4. First polymer layer; 5. Second OCA adhesive layer; 6. Second polymer layer;

[0029] 10. Display panel; 101. Bending area; 102. Non-bending area;

[0030] 20. Cover plate; 21. Ultra-thin glass layer; 22. Covering layer; 210. Groove; 211. First surface; 212. Second surface; 213. Side surface; Class I silicone coupling agent 221; Polyimide molecular chain 222;

[0031] 30. Hardened layer;

[0032] 40. Load-bearing layer;

[0033] 51. First adhesive layer; 52. Second adhesive layer;

[0034] 60. Functional layer. Embodiments of the present invention

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0036] Referring to Figure 1, the foldable display module includes a display panel 1, a polarizer (substrate) 2, a first OCA adhesive layer 3, a first polymer layer 4, a second OCA adhesive layer 5, and a second polymer layer 6 stacked sequentially. Currently, polymer films are often used as cover plates on the outermost side of the display module, such as the first polymer layer 4 and the second polymer layer 6. However, polymer layers are relatively soft and have poor support, resulting in a soft and flimsy feel and easy crease formation, which seriously affects the user experience.

[0037] Referring to Figure 2, this application embodiment provides a display module, which includes a display panel 10 and a cover plate 20. The cover plate 20 is disposed on one side of the display panel 10. The cover plate 20 includes an ultra-thin glass layer 21 and a cover layer 22. The ultra-thin glass layer 21 is located on one side of the display panel 10, and the cover layer 22 at least covers the side of the ultra-thin glass layer 21 away from the display panel 10.

[0038] The capping layer 22 contains a silicon-oxygen coupling agent, and a portion of the silicon-oxygen coupling agent forms chemical bonds with the ultrathin glass layer 21.

[0039] In the implementation process, this embodiment of the application effectively improves the hardness of the cover plate 20 and improves the tactile feel and crease phenomenon by setting the ultra-thin glass layer 21 in the cover plate 20. In addition, the cover layer 22 covering the ultra-thin glass layer 21 contains a silicon-oxygen coupling agent, and the silicon-oxygen coupling agent can form silicon-oxygen bonds with the glass, thereby improving the adhesion between the ultra-thin glass layer 21 and the cover layer 22, reducing the probability of peeling between the ultra-thin glass layer 21 and the cover layer 22, and improving the stability of the cover plate 20. Furthermore, the silicon-oxygen coupling agent can also be grafted onto the polymer in the cover layer 22 to improve the cross-linking degree of the polymer in the cover layer 22, thereby further improving the surface hardness of the cover plate 20 and improving the tactile feel and crease phenomenon of the display module.

[0040] In one embodiment of this application, the silicon-oxygen coupling agent includes a first type of silicon-oxygen coupling agent, which is attached to the surface of the ultrathin glass layer, and silicon-oxygen bonds are formed between the first type of silicon-oxygen coupling agent and the surface of the ultrathin glass layer.

[0041] In one embodiment of this application, the cover layer further contains a polymer, and the first type of silicone coupling agent is connected between the ultrathin glass layer and the polymer.

[0042] In one embodiment of this application, the polymer comprises a polyimide molecular chain, and the first type of siloxane coupling agent is connected between the ultrathin glass layer and the polyimide molecular chain.

[0043] In one embodiment of this application, the siloxane coupling agent further includes a second type of siloxane coupling agent, which is grafted onto the amino groups in the polyimide molecular chain.

[0044] In one embodiment of this application, the silicon-oxygen coupling agent further includes a third type of silicon-oxygen coupling agent, which is freely distributed in the capping layer.

[0045] In one embodiment of this application, the covering layer also contains fluorine-containing particles.

[0046] In one embodiment of this application, the display module includes a bent area and a non-bent area adjacent to the bent area;

[0047] When the thickness of the ultrathin glass layer in the non-bending region is less than 50 micrometers, the thickness of the ultrathin glass layer in the bending region is equal to the thickness of the ultrathin glass layer in the non-bending region.

[0048] When the thickness of the ultrathin glass layer in the non-bending region is greater than or equal to 50 micrometers, the thickness of the ultrathin glass layer in the bending region is less than the thickness of the ultrathin glass layer in the non-bending region, and the thickness of the ultrathin glass layer in the bending region is less than 50 micrometers.

[0049] In one embodiment of this application, the display module is outward-folding, and a groove is formed on the side of the ultra-thin glass layer away from the display panel. The groove is located within the bending area, and the cover layer at least covers the side of the ultra-thin glass layer away from the display panel and fills the groove.

[0050] In one embodiment of this application, the display module is an inwardly folded type, and a groove is formed on the side of the ultra-thin glass layer near the display panel. The groove is located in the bending area, and the cover layer covers the side of the ultra-thin glass layer near the display panel and fills the groove.

[0051] In one embodiment of this application, the display module further includes:

[0052] A hardened layer is disposed between the cover plate and the display panel, and the surface water droplet angle of the hardened layer is greater than or equal to 105°;

[0053] A first adhesive layer is disposed between the hardened layer and the cover plate, and the first adhesive layer is adhered to the side of the cover plate closest to the hardened layer.

[0054] In one embodiment of this application, the first adhesive layer is bonded to the side of the ultra-thin glass layer near the display panel. The display module further includes a carrier layer disposed between the first adhesive layer and the hardened layer, and a second adhesive layer disposed between the carrier layer and the hardened layer. The cover plate is bonded to the carrier layer through the first adhesive layer, and the carrier layer is bonded to the hardened layer through the second adhesive layer.

[0055] In one embodiment of this application, the cover layer further covers the side of the ultra-thin glass layer near the display panel, and the cover layer on the side of the ultra-thin glass layer near the display panel is bonded to the hardened layer through the first adhesive layer.

[0056] In one embodiment of this application, the ultrathin glass layer includes a first surface away from the display panel, a second surface close to the display panel, and a side surface connecting the first surface and the second surface, and the cover layer also covers the side surface of the ultrathin glass layer.

[0057] In one embodiment of this application, the orthographic projection boundary of the cover plate on the hardened layer coincides with the orthographic projection boundary of the first adhesive layer on the hardened layer. The orthographic projections of the cover plate on the hardened layer and the first adhesive layer on the hardened layer are located within the coverage area of ​​the hardened layer, and the orthographic projection boundary of the cover plate on the hardened layer is spaced apart from the boundary of the hardened layer, and the orthographic projection boundary of the first adhesive layer on the hardened layer is spaced apart from the boundary of the hardened layer.

[0058] It should be noted that the display panel 10 is an OLED display panel, and the display module can be a foldable display module.

[0059] In some embodiments, the display panel 10 may include a substrate and a thin-film transistor layer disposed on the substrate, the thin-film transistor layer being located on the side of the substrate closer to the cover plate 20. The substrate may be a rigid substrate, such as a glass substrate; or, the substrate may be a flexible substrate, such as a substrate formed of polyimide. When the substrate is a flexible substrate, it may be formed of multiple sub-substrates of the same material, such as polyimide, with adjacent sub-substrates bonded together by adhesive sub-layers.

[0060] In some embodiments, the thin-film transistor layer includes a thin-film transistor, which includes a semiconductor located on a substrate. The semiconductor may be formed of polycrystalline silicon or a metal oxide (such as indium gallium zinc oxide). The semiconductor is divided into a channel region and source and drain regions formed on either side of the channel region. The thin-film transistor layer also includes a first gate insulating layer covering the semiconductor. The thin-film transistor also includes a first gate formed on the first gate insulating layer, overlapping the channel region. The first gate may be formed as multiple layers or a single layer comprising a low-resistance material such as Al, Ti, Mo, Cu, Ni, or alloys thereof, or a material with high corrosion resistance. The thin-film transistor layer also includes a second gate insulating layer covering the first gate. The thin-film transistor also includes a second gate located on the second gate insulating layer, overlapping the first gate. The second gate may be formed as multiple layers or a single layer comprising a low-resistance material such as Al, Ti, Mo, Cu, Ni, or alloys thereof, or a material with high corrosion resistance. The thin-film transistor layer also includes a first interlayer insulating layer formed on the second gate. The first interlayer insulating layer, the first gate insulating layer, and the second gate insulating layer include source contact holes and drain contact holes, and the source region and the drain region are exposed through the source contact holes and drain contact holes, respectively.

[0061] The thin-film transistor also includes a source and a drain disposed on the same layer, both formed on the first interlayer insulating layer. The source is connected to the source region through a source contact hole, and the drain is connected to the drain region through a drain contact hole. The source and drain can be multiple layers or a single layer formed of low-resistance materials such as Al, Ti, Mo, Cu, Ni, or their alloys, or materials with high corrosion resistance. For example, the source and drain can be a triple layer of Ti / Cu / Ti, Ti / Ag / Ti, Ti / Al / Ti, or Mo / Al / Mo, or other single-layer or multi-layer structures.

[0062] In some embodiments, the display panel 10 further includes a planarization layer located between the thin-film transistor layer and the light-emitting layer, the planarization layer covering the source and drain.

[0063] In some embodiments, the display panel 10 further includes an anode layer located on the side of the planarization layer away from the thin-film transistor layer. The anode layer includes a plurality of anodes, each anode corresponding to a pixel unit. Each anode is electrically connected to a thin-film transistor. The planarization layer includes anode contact holes through which the anodes contact the source or drain of the thin-film transistor.

[0064] In some embodiments, the display panel 10 further includes a pixel definition layer disposed on the side of the planarization layer away from the thin-film transistor layer. The pixel definition layer includes pixel definition portions and openings located between the pixel definition portions. The display panel 10 also includes a light-emitting layer comprising a plurality of pixel units. The pixel units are located within the openings. The openings expose a portion of the anode and cover the edge of the anode. The pixel units may include red pixel units, green pixel units, and blue pixel units.

[0065] In some embodiments, the display panel 10 further includes a cathode layer covering the light-emitting layer. In the direction from the anode to the cathode layer, the light-emitting layer includes a hole-injecting organic layer, a light-emitting material layer, and an electronic organic layer stacked sequentially. The hole-injecting organic layer may include a hole injection layer and a hole transport layer, with the hole injection layer in direct contact with the anode and the hole transport layer located between the hole injection layer and the light-emitting material layer. The hole-injecting organic layer may also include an electron blocking layer located between the hole transport layer and the light-emitting material layer. The electronic organic layer may include an electron injection layer and an electron transport layer, with the electron injection layer in direct contact with the cathode layer and the electron transport layer located between the electron injection layer and the light-emitting material layer. The electronic organic layer may also include a hole blocking layer located between the electron transport layer and the light-emitting layer.

[0066] In some embodiments, the display panel 10 further includes an encapsulation layer located on the side of the cathode layer away from the light-emitting layer. The encapsulation layer is formed by alternating stacking of multiple inorganic and organic film layers. For example, along the direction from the substrate to the thin-film transistor layer, the encapsulation layer includes a first inorganic encapsulation sublayer, a first organic encapsulation sublayer, and a second inorganic encapsulation sublayer.

[0067] In some embodiments, the display panel 10 further includes a touch layer located on the side of the encapsulation layer away from the light-emitting layer. The touch layer can implement touch functionality in a self-capacitive or mutual-capacitive manner. When the touch layer implements touch functionality in a self-capacitive manner, the touch layer may have only one touch metal layer.

[0068] When the touch layer implements touch functionality using capacitive touch, the touch layer includes a first touch metal layer, a touch insulating layer, and a second touch metal layer. The touch insulating layer is located on the side of the first touch metal layer furthest from the encapsulation layer, and the second touch metal layer is also located on the side of the touch insulating layer furthest from the encapsulation layer. The first touch metal layer can be directly disposed on the encapsulation layer, or a spacer layer can be disposed between the first touch layer and the encapsulation layer. The spacer layer can include an inorganic spacer layer and / or an organic spacer layer. The first touch metal layer includes a first touch electrode, a second touch electrode, and a first bridging wire; the second touch metal layer includes a second bridging wire. Both the first and second touch electrodes are metal networks. Alternatively, the second touch metal layer includes a first touch electrode, a second touch electrode, and a first bridging wire, and the first touch metal layer includes a second bridging wire.

[0069] In some embodiments, the display module further includes a hardening layer 30 disposed between the display panel 10 and the cover plate 20, a functional layer 60 disposed between the hardening layer 30 and the cover plate 20, and a first adhesive layer 51 disposed between the hardening layer 30 and the cover plate 20.

[0070] In some embodiments, the functional layer 60 may be a polarizer; or when the display panel 10 adopts a depolarizer architecture, a color filter layer is added to the display panel 10 to achieve the functions of anti-reflection and depolarizer. In this case, the functional layer 60 may be a substrate layer, and the material may include polyethylene terephthalate.

[0071] In some embodiments, the surface water droplet angle of the hard coating (HC) 30 is greater than or equal to 105°; this facilitates the separation between the cover plate 20 and the hard coating 30; during the use of the display module, the cover plate 20 can be replaced, improving the service life and convenience of the display module.

[0072] In some embodiments, the first adhesive layer 51 is adhered to the side of the cover plate 20 near the hardened layer 30, and the cover plate 20 is attached to the side of the hardened layer 30 away from the display panel 10 via the first adhesive layer 51. It can be understood that the cover plate 20 can be directly attached to the side of the hardened layer 30 away from the display panel 10 via the first adhesive layer 51, or there are some functional film layers between the hardened layer 30 and the cover plate 20, in which case the cover plate 20 is attached to the side of the functional film layers away from the hardened layer 30 via the first adhesive layer 51.

[0073] In this embodiment, the cover plate 20 includes an ultra-thin glass layer 21 and a cover layer 22. The cover layer 22 covers at least the side of the ultra-thin glass layer 21 away from the display panel 10. The ultra-thin glass layer 21 has a higher hardness than the polymer layer shown in FIG1, which can effectively improve the hardness of the cover plate 20, so that the elastic modulus of the cover plate 20 can reach about 50 Gpa, thereby improving the tactile feel of the display module and reducing creases.

[0074] Furthermore, the cover layer 22 contains a silicone coupling agent, which can form chemical bonds with the ultrathin glass layer 21 to improve the adhesion between the cover layer 22 and the ultrathin glass layer 21 and reduce the probability of peeling between them. On the other hand, the silicone coupling agent can also be grafted onto polymer molecules in the cover layer 22 to improve the crosslinking degree of the polymer in the cover layer 22, thereby further improving the hardness of the cover plate 20, improving the tactile feel of the display module, and reducing crease phenomena.

[0075] Referring to Figures 2 and 3, the silicon-oxygen coupling agent is distributed in the capping layer 22, and the silicon-oxygen coupling agent may include a first type of silicon-oxygen coupling agent 221, a second type of silicon-oxygen coupling agent, and a third type of silicon-oxygen coupling agent depending on the distribution location.

[0076] In some embodiments, the first type of silicon-oxygen coupling agent 221 is located at the interface between the capping layer 22 and the ultrathin glass layer 21, and the first type of silicon-oxygen coupling agent 221 is connected to the surface of the ultrathin glass layer 21, and a silicon-oxygen bond is formed between the first type of silicon-oxygen coupling agent 221 and the surface of the ultrathin glass layer 21; for example, the Si in the first type of silicon-oxygen coupling agent 221 can be connected to the O on the surface of the ultrathin glass layer 21 to form a silicon-oxygen bond.

[0077] In some embodiments, the capping layer 22 further includes a polymer, and the first siloxane coupling agent 221 may be connected between the polymer and the ultrathin glass layer 21.

[0078] In some embodiments, the polymer may include polyimide molecular chains 222, that is, the polymer in the capping layer 22 is polyimide. It is understood that if the capping layer 22 does not contain the siloxane coupling agent, the capping layer 22 and the ultrathin glass layer 21 will be connected by hydrogen bonding. Since hydrogen bonding is less than siloxane bonding, the present application embodiment can effectively improve the adhesion between the capping layer 22 and the ultrathin glass layer 21 by adding a siloxane coupling agent to the capping layer 22.

[0079] In other embodiments of this application, the polymer in the cover layer 22 may also include polyethylene terephthalate (PET), thermoplastic polyurethane rubber (TPU), or polymethyl methacrylate (PMMA).

[0080] In some embodiments, the first type of siloxane coupling agent 221 is connected between the ultrathin glass layer 21 and the polyimide molecular chain 222; further, the first type of siloxane coupling agent 221 may be connected to the amino groups in the ultrathin glass layer 21 and the polyimide molecular chain 222.

[0081] It is understood that the connection structure shown in Figure 3 is only used to illustrate the connection between the first type of siloxane coupling agent 221 and the ultrathin glass layer 21 and the polyimide molecular chain 222, that is, the Si in the siloxane coupling agent is connected to the O on the surface of the ultrathin glass layer 21, and the alkyl in the siloxane coupling agent is connected to the amino in the polyimide molecular chain 222; however, the specific structure is not limited to this and may change depending on the selection of the siloxane coupling agent and the polyimide.

[0082] It is understandable that, depending on the choice of the silicon-oxygen coupling agent, alkyl groups can also be attached to the O on the left and right sides of Si in Figure 3, that is, R can be an alkyl group.

[0083] Furthermore, this application provides comparative examples and Example 1 to verify the improved adhesion between the ultrathin glass layer 21 and the cover layer 22 in this application embodiment, and obtains the results shown in Table 1 below. In the comparative example, the material of the cover layer 22 is polyimide, while the material of the cover layer 22 in Example 1 includes polyimide and the silicone coupling agent.

[0084] Table 1

[0085] Comparative Example 1: Adhesion force (N / cm): 0.017 - 0.45

[0086] As can be seen from Table 1, after adding the silicon-oxygen coupling agent to the cover layer 22, the adhesion between the ultrathin glass layer 21 and the cover layer 22 is more than 26 times that of the comparative example. This indicates that by adding the silicon-oxygen coupling agent to the cover layer 22, the adhesion between the cover layer 22 and the ultrathin glass layer 21 can be effectively improved, and the probability of peeling between the cover layer 22 and the ultrathin glass layer 21 can be reduced.

[0087] In some embodiments, the siloxane coupling agent further includes a second type of siloxane coupling agent grafted onto the amino groups in the polyimide molecular chain 222; thereby, the crosslinking density of the cover layer 22 can be increased to a greater extent, so that the cover plate 20 forms a high-hardness surface, further improving the support of the cover plate 20, and effectively improving the feel and crease phenomenon.

[0088] In some embodiments, the siloxane coupling agent further includes a third type of siloxane coupling agent, which is freely distributed in the capping layer 22, i.e., the third type of siloxane coupling agent is the unreacted siloxane coupling agent.

[0089] Continuing from the above, in some embodiments, the chemical structural formula of the first type of silicon-oxygen coupling agent can be: .

[0090] R1 includes at least one of an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 1 to 15 carbon atoms, and an alkoxy group having 1 to 15 carbon atoms, and both R2 and R3 may include an alkyl group having 1 to 10 carbon atoms.

[0091] In some embodiments, the chemical structural formula of the second type of siloxane coupling agent can be: .

[0092] R1 includes at least one of an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 1 to 15 carbon atoms, and an alkoxy group having 1 to 15 carbon atoms; R2 and R3 can each include an alkyl group having 1 to 10 carbon atoms; and R4 includes at least one of an alkyl group having 1 to 10 carbon atoms and an alkenyl group having 1 to 10 carbon atoms.

[0093] In some embodiments, the siloxane coupling agent may include propyltrimethoxysilane, A151 (vinyltriethoxysilane), A171 (vinyltrimethoxysilane), A172 (vinyltri(β-methoxyethoxy)silane), 3-glycidyloxypropyltrimethoxysilane, 3-(2,3-epoxypropoxy)propyltrimethoxysilane, trimethoxy[2-(7-oxadicyclo[4.1.0]hept-3-yl)ethyl]silane, 3-glycidyl etheroxypropylmethyldiethoxysilane, 3-glycidyl etheroxypropyltriethoxysilane, or 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, etc.

[0094] For example, when the siloxane coupling agent is propyltrimethoxysilane, then the first type of siloxane coupling agent is... The second type of silicon-oxygen coupling agent is The third type of siloxane coupling agent is propyltrimethoxysilane.

[0095] In some embodiments, the cover layer 22 further contains fluorine particles to give the surface of the cover layer 22 and the cover plate 20 fingerprint-resistant, oil-resistant and water-resistant properties.

[0096] In some embodiments, the elastic modulus of the cover layer 22 is greater than or equal to 3 GPa and less than or equal to 7 GPa, and the elongation at break of the cover layer 22 is greater than 5%.

[0097] Furthermore, in some embodiments, the display module includes a bending area 101 and a non-bending area 102 disposed adjacent to the bending area 101, and the portion of the display module located within the bending area 101 can be bent, so that the display module can be applied to a foldable display device.

[0098] Wherein, the thickness of the ultra-thin glass layer 21 in the bending region 101 is less than or equal to the thickness of the ultra-thin glass layer 21 in the non-bending region 102. That is, in this embodiment of the application, the bending performance of the cover plate 20 can be improved by reducing the thickness of the ultra-thin glass layer 21 in the bending region 101.

[0099] In one embodiment of this application, referring to Figures 2 and 4, the ultrathin glass layer 21 includes a first surface 211 and a second surface 212 disposed opposite to each other, and a side surface 213 connecting the first surface 211 and the second surface 212. The first surface 211 is located on the side of the ultrathin glass layer 21 away from the display panel 10, and the second surface 212 is located on the side of the ultrathin glass layer 21 close to the display panel 10.

[0100] The cover layer 22 covers the first surface 211 and the side surface 213, and the first adhesive layer 51 is bonded to the second surface 212, that is, the first adhesive layer 51 is bonded to the side of the ultra-thin glass layer 21 that is close to the display panel 10.

[0101] In some embodiments, the display module further includes a carrier layer 40 disposed between the first adhesive layer 51 and the hardened layer 30, and a second adhesive layer 52 disposed between the carrier layer 40 and the hardened layer 30. The cover plate 20 is bonded to the carrier layer 40 through the first adhesive layer 51, and the carrier layer 40 is bonded to the hardened layer 30 through the second adhesive layer 52.

[0102] It should be noted that, since the cover layer 22 does not cover the second surface 212, in order to avoid the phenomenon of the ultra-thin glass layer 21 cracking and remaining due to stress during the replacement of the cover plate 20, in this embodiment of the application, a bearing layer 40 is formed on the side of the ultra-thin glass layer 21 close to the display panel 10 to cover the second surface 212, so that the ultra-thin glass layer 21 can be completely removed during the replacement process, thereby improving the replacement yield and convenience of the cover plate 20.

[0103] In some embodiments, the orthographic projection boundary of the cover plate 20 on the hardened layer 30, the orthographic projection boundary of the first adhesive layer 51 on the hardened layer 30, the orthographic projection boundary of the support layer 40 on the hardened layer 30, and the orthographic projection boundary of the second adhesive layer 52 on the hardened layer 30 all coincide, that is, the sides of the cover plate 20, the first adhesive layer 51, the support layer 40, and the second adhesive layer 52 are flush.

[0104] In some embodiments, the orthographic projections of the cover plate 20, the first adhesive layer 51, the support layer 40, and the second adhesive layer 52 on the hardened layer 30 are all located within the coverage area of ​​the hardened layer. Furthermore, the boundary of the orthographic projection of the cover plate 20 on the hardened layer 30 is spaced from the boundary of the hardened layer 30; the boundary of the orthographic projection of the first adhesive layer 51 on the hardened layer 30 is spaced from the boundary of the hardened layer 30; the boundary of the orthographic projection of the support layer 40 on the hardened layer 30 is spaced from the boundary of the hardened layer 30; and the boundary of the orthographic projection of the second adhesive layer 52 on the hardened layer 30 is spaced from the boundary of the hardened layer 30.

[0105] In some embodiments, the material of the carrier layer 40 may include polyethylene terephthalate, and both the first adhesive layer 51 and the second adhesive layer 52 may be OCA optical adhesive.

[0106] In this embodiment, the thickness of the ultra-thin glass layer 21 in the non-bending region 102 is less than 50 micrometers. At this time, the thickness of the ultra-thin glass layer 21 is small, and it has good bending performance. Therefore, the thickness of the ultra-thin glass layer 21 in the bending region 101 is equal to the thickness of the ultra-thin glass layer 21 in the non-bending region 102. Thus, while ensuring that the cover plate 20 has good bending performance, the cover plate 20 can also have high hardness and support.

[0107] In another embodiment of this application, referring to Figures 5 and 6, the difference between this embodiment and the embodiment shown in Figure 2 is that the thickness of the ultra-thin glass layer 21 in the non-bending area 102 is greater than or equal to 50 micrometers, so as to further improve the hardness and support of the cover plate 20 and improve the tactile feel of the display module.

[0108] In this embodiment, the thickness of the ultra-thin glass layer 21 in the bending region 101 is less than the thickness of the ultra-thin glass layer 21 in the non-bending region 102. That is, in this embodiment, the ultra-thin glass layer 21 located in the bending region 101 is thinned to improve the bending performance of the ultra-thin glass layer 21 in the bending region 101. Therefore, this embodiment can improve the hardness and support of the cover plate 20 and improve the tactile feel of the display module, while also ensuring the bending performance of the cover plate 20 in the bending region 101.

[0109] In some embodiments, the thickness of the ultrathin glass layer 21 within the bending region 101 is less than 50 micrometers.

[0110] Specifically, the ultra-thin glass layer 21 includes a groove 210 formed in the bending area 101, and the groove 210 is located on the side of the ultra-thin glass layer 21 away from the display panel 10, that is, the groove 210 is located at the first surface 211; the cover layer 22 covers the first surface 211 and the side surface 213, and fills the groove 210.

[0111] In some embodiments, the side of the cover layer 22 away from the display panel 10 is a plane, so that the outer surface of the display module is a plane, thereby improving the touch effect of the display module.

[0112] In another embodiment of this application, referring to Figures 7 and 8, the difference between this embodiment and the embodiment shown in Figure 2 is that the cover layer 22 also covers the side of the ultra-thin glass layer 21 near the display panel 10, and the cover layer 22 covering the side of the ultra-thin glass layer 21 near the display panel 10 is bonded to the hardened layer 30 through the first adhesive layer 51.

[0113] In this embodiment, the cover layer 22 covers the ultra-thin glass layer 21, that is, the cover layer 22 covers the first surface 211, the second surface 212 and the side surface 213. Therefore, in this embodiment, when the cover plate 20 is replaced, since the ultra-thin glass layer 21 is covered by the cover layer 22, the phenomenon of the ultra-thin glass layer 21 cracking due to stress can be avoided, so that the ultra-thin glass layer 21 can be completely removed during the replacement process, thereby improving the replacement yield and convenience of the cover plate 20.

[0114] Furthermore, compared to the embodiment shown in FIG2, this embodiment does not require the provision of a carrier layer 40. Therefore, the cover plate 20 is directly bonded to the hardened layer 30 through the first adhesive layer 51. This embodiment can save the preparation of the carrier layer 40, save process steps, reduce process costs, and also reduce the thickness of the display module.

[0115] In some embodiments, the orthographic projection boundary of the cover plate 20 on the hardened layer 30 and the orthographic projection boundary of the first adhesive layer 51 on the hardened layer 30 coincide, that is, the side surfaces of the cover plate 20 and the first adhesive layer 51 are flush.

[0116] In some embodiments, the orthographic projection of the cover plate 20 on the hardened layer 30 and the orthographic projection of the first adhesive layer 51 on the hardened layer 30 are both located within the coverage area of ​​the hardened layer, and the boundary of the orthographic projection of the cover plate 20 on the hardened layer 30 is spaced apart from the boundary of the hardened layer 30, and the boundary of the orthographic projection of the first adhesive layer 51 on the hardened layer 30 is spaced apart from the boundary of the hardened layer 30.

[0117] In another embodiment of this application, referring to Figures 9 and 10, the difference between this embodiment and the embodiment shown in Figure 7 is that the thickness of the ultra-thin glass layer 21 in the non-bending area 102 is greater than 50 micrometers, so as to further improve the hardness and support of the cover plate 20 and improve the tactile feel of the display module.

[0118] In this embodiment, the thickness of the ultra-thin glass layer 21 in the bending region 101 is less than the thickness of the ultra-thin glass layer 21 in the non-bending region 102. That is, in this embodiment, the ultra-thin glass layer 21 located in the bending region 101 is thinned to improve the bending performance of the ultra-thin glass layer 21 in the bending region 101. Therefore, this embodiment can improve the hardness and support of the cover plate 20 and improve the tactile feel of the display module, while also ensuring the bending performance of the cover plate 20 in the bending region 101.

[0119] In some embodiments, the thickness of the ultrathin glass layer 21 within the bending region 101 is less than 50 micrometers.

[0120] Specifically, the ultra-thin glass layer 21 includes a groove 210 formed in the bending area 101, and the groove 210 is located on the side of the ultra-thin glass layer 21 away from the display panel 10, that is, the groove 210 is located at the first surface 211; the cover layer 22 covers the first surface 211 and the side surface 213, and fills the groove 210.

[0121] In some embodiments, the side of the cover layer 22 away from the display panel 10 is a plane, so that the outer surface of the display module is a plane, thereby improving the touch effect of the display module.

[0122] In another embodiment of this application, referring to Figures 11 and 12, the difference between this embodiment and the embodiment shown in Figure 9 is that: the ultra-thin glass layer 21 includes a groove 210 formed in the bending area 101, and the groove 210 is located on the side of the ultra-thin glass layer 21 close to the display panel 10, that is, the groove 210 is located at the second surface 212; the cover layer 22 covers the second surface 212 and the side surface 213, and fills the groove 210.

[0123] In some embodiments, the side of the cover layer 22 near the display panel 10 and the side away from the display panel 10 are both planar, so that the outer surface of the display module is planar, thereby improving the touch effect of the display module.

[0124] It should be noted that, in this embodiment, the groove 210 can be disposed on the side of the ultra-thin glass layer 21 away from the display panel 10 and / or on the side of the ultra-thin glass layer 21 close to the display panel. The groove 210 is located within the bending area 101, and the cover layer 22 can cover and fill the side of the ultra-thin glass layer 21 where the groove 210 is located. When the groove 210 is disposed on the side of the ultra-thin glass layer 21 away from the display panel 10, the display module can be an outward-folding display module; when the groove 210 is disposed on the side of the ultra-thin glass layer 21 close to the display panel 10, the display module can be an inward-folding display module; the groove 210 is located on the outer side of the bend when the display module is bent.

[0125] Continuing from the above, this embodiment of the application effectively improves the hardness of the cover plate 20 and reduces tactile feedback and creases by providing the ultra-thin glass layer 21 in the cover plate 20. Furthermore, the cover layer 22 covering the ultra-thin glass layer 21 contains a silicone-oxygen coupling agent, and the silicone-oxygen coupling agent can form silicone-oxygen bonds with the glass, thereby increasing the adhesion between the ultra-thin glass layer 21 and the cover layer 22, reducing the probability of peeling between them, and improving the stability of the cover plate 20. Moreover, the silicone-oxygen coupling agent can also be grafted onto the polymer in the cover layer 22 to increase the degree of cross-linking of the polymer in the cover layer 22, further improving the surface hardness of the cover plate 20 and reducing tactile feedback and creases in the display module.

[0126] Furthermore, embodiments 2 to 4 are provided in this application to perform strain tests on the cover plate 20 shown in Figures 4 and 8.

[0127] In Example 2, the cover plate 20 structure shown in Figure 4 is used, and the thickness of the cover layer 22 is 15 micrometers.

[0128] In Example 3, the cover plate 20 structure shown in Figure 4 is used, and the thickness of the cover layer 22 is 35 micrometers.

[0129] In Example 4, the cover plate 20 structure shown in Figure 8 is used, and the thickness of the cover layer 22 on one side is 15 micrometers.

[0130] The results obtained after verification are shown in Table 2 below.

[0131] Table 2

[0132] Example 2 Example 3 Example 4 Material safety values ​​Cover layer strain value 0.1% 0.2% 1.3% 8.0% Ultra-thin glass layer strain value 0.7% 0.8% 0.6% 1.95%

[0133] As can be seen from Table 2, the cover plate 20 provided in this application embodiment can fully meet the safety values ​​of the materials used, that is, the cover plate 20 provided in this application embodiment has good stability.

[0134] In addition, this application embodiment also provides a display device, which includes the display module described in the above embodiments.

[0135] In summary, this embodiment of the application effectively improves the hardness of the cover plate 20 and reduces tactile feedback and creases by providing the ultra-thin glass layer 21 in the cover plate 20. Furthermore, the cover layer 22 covering the ultra-thin glass layer 21 contains a silicone-oxygen coupling agent, and the silicone-oxygen coupling agent can form silicone-oxygen bonds with the glass, thereby increasing the adhesion between the ultra-thin glass layer 21 and the cover layer 22, reducing the probability of peeling between them, and improving the stability of the cover plate 20. Moreover, the silicone-oxygen coupling agent can also be grafted onto the polymer in the cover layer 22 to increase the degree of cross-linking of the polymer in the cover layer 22, further improving the surface hardness of the cover plate 20 and reducing tactile feedback and creases in the display device.

[0136] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0137] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0138] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0139] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display module, comprising: Display panel; A cover plate is disposed on one side of the display panel. The cover plate includes an ultra-thin glass layer and a cover layer. The ultra-thin glass layer is located on one side of the display panel, and the cover layer at least covers the side of the ultra-thin glass layer away from the display panel. The capping layer contains a silicon-oxygen coupling agent, and a portion of the silicon-oxygen coupling agent forms chemical bonds with the ultrathin glass layer.

2. The display module according to claim 1, wherein, The silicon-oxygen coupling agent includes a first type of silicon-oxygen coupling agent, which is attached to the surface of the ultrathin glass layer, and silicon-oxygen bonds are formed between the first type of silicon-oxygen coupling agent and the surface of the ultrathin glass layer.

3. The display module according to claim 2, wherein, The capping layer also contains a polymer, and the first type of siloxane coupling agent is connected between the ultrathin glass layer and the polymer.

4. The display module according to claim 3, wherein, The polymer comprises polyimide molecular chains, and the first type of siloxane coupling agent is connected between the ultrathin glass layer and the polyimide molecular chains.

5. The display module according to claim 4, wherein, The siloxane coupling agent also includes a second type of siloxane coupling agent, which is grafted onto the amino groups in the polyimide molecular chain.

6. The display module according to claim 2, wherein, The silicon-oxygen coupling agent also includes a third type of silicon-oxygen coupling agent, which is freely distributed in the capping layer.

7. The display module according to claim 1, wherein, The coating layer also contains fluorine-containing particles.

8. The display module according to claim 1, wherein, The display module includes a bent area and a non-bent area adjacent to the bent area; When the thickness of the ultrathin glass layer in the non-bending region is less than 50 micrometers, the thickness of the ultrathin glass layer in the bending region is equal to the thickness of the ultrathin glass layer in the non-bending region. When the thickness of the ultrathin glass layer in the non-bending region is greater than or equal to 50 micrometers, the thickness of the ultrathin glass layer in the bending region is less than the thickness of the ultrathin glass layer in the non-bending region, and the thickness of the ultrathin glass layer in the bending region is less than 50 micrometers.

9. The display module according to claim 8, wherein, The display module is outward-folding, and a groove is formed on the side of the ultra-thin glass layer away from the display panel. The groove is located in the bending area, and the cover layer at least covers the side of the ultra-thin glass layer away from the display panel and fills the groove.

10. The display module according to claim 8, wherein, The display module is an inward-folding type. The ultra-thin glass layer has a groove on the side near the display panel. The groove is located in the bending area. The cover layer covers the side of the ultra-thin glass layer near the display panel and fills the groove.

11. The display module according to claim 1, wherein, The display module also includes: A hardened layer is disposed between the cover plate and the display panel, and the surface water droplet angle of the hardened layer is greater than or equal to 105°; A first adhesive layer is disposed between the hardened layer and the cover plate, and the first adhesive layer is adhered to the side of the cover plate closest to the hardened layer.

12. The display module according to claim 11, wherein, The first adhesive layer is bonded to the side of the ultra-thin glass layer near the display panel. The display module also includes a carrier layer disposed between the first adhesive layer and the hardened layer, and a second adhesive layer disposed between the carrier layer and the hardened layer. The cover plate is bonded to the carrier layer through the first adhesive layer, and the carrier layer is bonded to the hardened layer through the second adhesive layer.

13. The display module according to claim 11, wherein, The cover layer also covers the side of the ultra-thin glass layer near the display panel, and the cover layer on the side of the ultra-thin glass layer near the display panel is bonded to the hardened layer through the first adhesive layer.

14. The display module according to claim 11, wherein, The ultrathin glass layer includes a first surface away from the display panel, a second surface close to the display panel, and a side surface connecting the first surface and the second surface. The cover layer also covers the side surface of the ultrathin glass layer.

15. The display module according to claim 11, wherein, The orthographic projection boundary of the cover plate on the hardened layer coincides with the orthographic projection boundary of the first adhesive layer on the hardened layer. The orthographic projections of the cover plate and the first adhesive layer on the hardened layer are located within the coverage area of ​​the hardened layer, and the orthographic projection boundary of the cover plate on the hardened layer is spaced apart from the boundary of the hardened layer, and the orthographic projection boundary of the first adhesive layer on the hardened layer is spaced apart from the boundary of the hardened layer.

16. A display device, the display device comprising a display module, the display module comprising: Display panel; A cover plate is disposed on one side of the display panel. The cover plate includes an ultra-thin glass layer and a cover layer. The ultra-thin glass layer is located on one side of the display panel, and the cover layer at least covers the side of the ultra-thin glass layer away from the display panel. The capping layer contains a silicon-oxygen coupling agent, and a portion of the silicon-oxygen coupling agent forms chemical bonds with the ultrathin glass layer.

17. The display device according to claim 16, wherein, The silicon-oxygen coupling agent includes a first type of silicon-oxygen coupling agent, which is attached to the surface of the ultrathin glass layer, and silicon-oxygen bonds are formed between the first type of silicon-oxygen coupling agent and the surface of the ultrathin glass layer.

18. The display device according to claim 17, wherein, The capping layer also contains a polymer, and the first type of siloxane coupling agent is connected between the ultrathin glass layer and the polymer.

19. The display device according to claim 18, wherein, The polymer comprises polyimide molecular chains, and the first type of siloxane coupling agent is connected between the ultrathin glass layer and the polyimide molecular chains.

20. The display device according to claim 19, wherein, The siloxane coupling agent also includes a second type of siloxane coupling agent, which is grafted onto the amino groups in the polyimide molecular chain.

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